JP6516664B2 - Substrate holding apparatus, coating apparatus, substrate holding method - Google Patents

Description

  The present invention relates to precision electronic devices such as glass substrates for liquid crystal display devices, semiconductor wafers, glass substrates for PDPs, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, and substrates for electronic paper. The present invention relates to a technology for holding a substrate (hereinafter simply referred to as a "substrate").

  Conventionally, in a substrate processing apparatus that performs processing such as application of a coating liquid on a substrate, processing on the substrate is performed in a state where the substrate is held by a mounting table such as a stage. Further, in the coating apparatus of Patent Document 1, when holding the substrate on the stage, the position of the substrate on the stage is adjusted. Specifically, the position adjustment of the substrate is performed by moving the contact member from a position retracted from the edge of the substrate to a position in contact with the edge of the substrate. Subsequently, the substrate is attracted to the stage and held on the stage. Incidentally, if the substrate is warped, suction of the substrate may not be properly performed. Therefore, in Patent Document 1, if it is determined that a suction failure occurs after the start of suction of the substrate, the peripheral portion of the substrate is pressed by the pressing member, and the suction failure of the substrate can be resolved.

JP, 2013-175622, A

  By the way, when the curvature of a board | substrate is large, the curvature of a board | substrate might affect the position adjustment of the board | substrate on a mounting base. On the other hand, in the technique of Patent Document 1, although the warp of the substrate can be corrected by pressing the substrate by the pressing member after the position adjustment of the substrate is performed, the warp of the substrate at the time of performing the position adjustment of the substrate Was not always effective.

  This invention is made in view of the said subject, and an object of this invention is to provide the technique which enables suppression of the influence of the curvature of the board | substrate with respect to position adjustment of the board | substrate on a mounting base.

  The first aspect of the present invention is movable between a mounting table on which the substrate is mounted on the mounting surface, and an abutting position abutted against the peripheral edge of the substrate on the mounting surface and a separated position separating the substrate A position adjustment mechanism that executes a position adjustment process that adjusts the position of the substrate on the placement surface by moving the position adjustment member from the separated position to the contact position in a state where the substrate is placed on the placement surface; A main pressing position for making the shape of the substrate conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and a substrate on the mounting surface further from the mounting surface than the main pressing position A pressing mechanism for selectively positioning the pressing member at the temporary pressing position opposite to the position of the position adjusting member, and moving the pressing member toward the substrate on the placement surface while positioning the position adjusting member at the separation position After that, the position adjustment mechanism is made to execute the position adjustment processing, and after the completion of the position adjustment processing, the pressing member is fully pressed. It is characterized in that a control unit for moving the.

  A second aspect of the present invention is characterized by comprising the substrate holding device according to the above first aspect, and a nozzle for discharging the coating liquid toward the substrate held by the substrate holding device.

  According to a third aspect of the present invention, a position adjusting member movable between an abutting position abutted against the peripheral edge of the substrate placed on the mounting surface of the mounting table and a separated position is placed at the separated position Step of positioning, pressing the substrate on the mounting surface against the mounting surface, a main pressing position for making the shape of the substrate conform to the shape of the mounting surface, and mounting away from the mounting surface than the main pressing position Moving the pressing member selectively located at the temporary pressing position facing the substrate on the surface toward the substrate on the loading surface to position the pressing member at the temporary pressing position; The method includes the steps of performing position adjustment processing for adjusting the position of the substrate on the placement surface by moving to the contact position, and moving the pressing member to the main pressing position after completion of the position adjustment processing. And

  As described above, in the pressing member of the present invention, by pressing the substrate on the mounting surface of the mounting table against the mounting surface, the main pressing position which makes the shape of the substrate conform to the shape of the mounting surface, and Also, it can be selectively located at a temporary pressing position facing the substrate on the mounting surface apart from the mounting surface. And the position adjustment process which adjusts the position of the board | substrate on a mounting surface by making a position adjustment member contact | abut is performed in the state to which the press member was located in the temporary press position. Therefore, even when the warp of the substrate placed on the placement surface is large, the warp of the substrate can be corrected to some extent by the pressing member positioned at the temporary pressing position when the position adjustment processing is performed. . As a result, it is possible to suppress the influence of the warp of the substrate on the adjustment of the position of the substrate on the mounting table.

It is a top view showing the substrate holding device concerning a 1st embodiment of the present invention. It is a block diagram which shows the electric constitution with which the substrate holding | maintenance apparatus of FIG. 1 is provided. It is a perspective view which shows the position adjustment means which the substrate holding | maintenance apparatus of FIG. 1 uses for position adjustment of a board | substrate. It is a perspective view which shows the press means which the board | substrate holding | maintenance apparatus of FIG. 1 presses for a board | substrate, and its periphery. It is a side view which shows the press means which the board | substrate holding | maintenance apparatus of FIG. 1 presses for a board | substrate, and its periphery. It is a flowchart which shows an example of the board | substrate fixed which the board | substrate holding apparatus of FIG. 1 performs. It is a flowchart which shows the procedure of the temporary press of the board | substrate which the board | substrate holding | maintenance apparatus of FIG. 1 performs by board | substrate fixed. FIG. 8 is an operation explanatory view showing an operation performed by the flowcharts of FIG. 6 and FIG. 7; FIG. 8 is an operation explanatory view showing an operation performed by the flowcharts of FIG. 6 and FIG. 7; It is a side view showing a substrate holding device concerning a 2nd embodiment of the present invention. It is a front view which shows the substrate holding | maintenance apparatus of FIG. It is a block diagram which shows the electric constitution with which the substrate holding | maintenance apparatus of FIG. 10 is provided. It is a flowchart which shows the procedure of the temporary press of the board | substrate which the board | substrate holding | maintenance apparatus of FIG. 10 performs by board | substrate fixed. It is a perspective view showing an example of a coating device concerning the present invention.

  FIG. 1 is a plan view showing a substrate holding apparatus according to a first embodiment of the present invention. FIG. 2 is a block diagram showing an electrical configuration of the substrate holding apparatus of FIG. In order to clarify the directional relationship in FIG. 1 and the subsequent drawings, an XYZ orthogonal coordinate system in which the Z direction is a vertical direction and the XY plane is a horizontal plane is appropriately attached. Further, for the purpose of easy understanding, the dimensions and the number of each part are drawn in an exaggerated or simplified manner as necessary. Incidentally, in the state of FIG. 1, most of the ends of the substrate S held by the substrate holding device 1 do not appear, but the end of the substrate S is shown by a broken line in FIG. The portion is shown through the substrate S.

  The substrate holding apparatus 1 includes a controller 10 which is a computer configured of a central processing unit (CPU) and a random access memory (RAM), and holds the substrate S received from a robot or the like by controlling each part of the apparatus by the controller 10 Device. There are various types of substrates S to be held by the substrate holding device 1. In particular, the substrate holding device 1 is suitable for holding the substrate S having a multi-layer structure including a layer of metal such as copper, for example, since it has a mechanism for correcting the warp of the substrate S as described later. That is, while the multilayer substrate S is easily warped due to the difference in thermal expansion coefficient of each layer, the substrate holding device 1 can hold the substrate S while correcting the warp. In addition, although the shape of the substrate S to be held is various, here, a configuration for holding the substrate S having a rectangular shape in a plan view will be described.

  The substrate holding device 1 includes a cube-shaped stage 11 on which the substrate S is mounted. At the upper part of the stage 11, a mounting surface 110 having a square shape in plan view is provided to face upward. The mounting surface 110 is a horizontal plane, and the substrate S is horizontally supported by the mounting surface 110 with the surface thereof facing upward. A large number of air vents (not shown) are opened in the mounting surface 110, and the substrate holding device 1 supplies the air to the air vents 112, and air which sucks air from the air vents. And a suction unit 113. Then, the controller 10 blows air from the vent to the substrate S on the mounting surface 110 by supplying air to the vent by the air supply unit 112, or sucks air from the vent by the air suction unit 113. Thus, the substrate S can be adsorbed onto the mounting surface 110.

  The substrate holding apparatus 1 includes a plurality of lift pins 12 for mounting the substrate S received from the robot on the mounting surface 110. That is, the stage 11 is provided with a plurality of pin storage holes 114 which extend parallel to the Z direction and open in the mounting surface 110, and the lift pins 12 are stored in the respective pin storage holes 114. Each lift pin 12 has a pin shape extending in parallel in the Z direction, and the lift pin 12 moves up and down with respect to the pin storage hole 114 when the controller 10 raises and lowers the lift pin 12 by the lift pin actuator A112. Then, when the robot transports the substrate S above the mounting surface 110, the plurality of lift pins 12 lifted by the drive of the lift pin actuator A 112 project from the pin storage holes 114 above the mounting surface 110 and their respective upper ends To receive the substrate S. Subsequently, the plurality of lift pins 12 are lowered by the drive of the lift pin actuator A 112 to be contained in the pin storage holes 114, whereby the substrate S is mounted on the mounting surface 110 from the upper ends of the plurality of lift pins 12.

  The substrate holding apparatus 1 further includes a position adjustment mechanism 2 that adjusts the position of the substrate S placed on the placement surface 110 on the placement surface 110. The position adjusting mechanism 2 has a total of eight position adjusting means 20 disposed two on each side of the mounting surface 110, and each position adjusting means 20 is a pin extending in parallel in the Z direction. It has an alignment pin 21 of a shape. That is, on each side surface of the stage 11, two notches 115 which are cut vertically to the side surface and extended in the horizontal direction are provided, and the alignment pin 21 is provided in each of the notches 115. It is arranged. The upper end of the alignment pin 21 protrudes above the mounting surface 110 from the notch 115, and the position adjustment means 20 drives the alignment pin 21 horizontally along the notch 115 by the position adjustment actuator A21. Thus, the portion of the alignment pin 21 above the mounting surface 110 can be brought into contact with the peripheral edge of the substrate S.

  FIG. 3 is a perspective view showing position adjustment means used by the substrate holding device of FIG. 1 for adjusting the position of the substrate. The position adjustment means 20 has a position adjustment actuator A 21 that drives the alignment pin 21 in the horizontal direction while supporting the lower end portion of the alignment pin 21, and a base member 22 that fixes the position adjustment actuator A 21 to the stage 11. Then, the position adjustment actuator A21 advances and retracts the alignment pin 21 along the notch 115 to place the contact position P1 (FIG. 9) in contact with the peripheral edge of the substrate S on the mounting surface 110, and The alignment pin 21 moves in the horizontal direction between a separation position P2 (FIG. 9) which is separated from the peripheral edge of the substrate S on the surface 110. In addition, various things, such as an air cylinder, a solenoid, etc., can be used as position adjustment actuator A21.

  As shown in FIG. 1, the plurality of alignment pins 21 are arranged to surround the substrate S on the mounting surface 110 from four directions. The controller 10 then mounts the substrate S on the mounting surface 110 from the robot by the lift pins 12 with the alignment pins 21 retracted to the separation position P2 outside the mounting region of the substrate S on the mounting surface 110. Place. Subsequently, the controller 10 moves each alignment pin 21 to a contact position P1 closer to the mounting area of the substrate S than the separation position P2. In this manner, the plurality of (two) alignment pins 21 abut on each side of the substrate S, whereby the position of the substrate S mounted with being shifted or inclined with respect to the mounting surface 110 is in the horizontal plane. Adjusted properly. That is, the controller 10 adjusts the position of the substrate S on the mounting surface 110 by moving the alignment pin 21 from the separation position P2 to the contact position P1 in a state where the substrate S is mounted on the mounting surface 110. Execute “Position adjustment process”.

  Furthermore, the substrate holding device 1 includes a pressing mechanism 3 that presses the substrate S on the placement surface 110 against the placement surface 110. The pressing mechanism 3 has a total of four pressing means 30 disposed one by one on each side of the mounting surface 110, and each pressing means 30 extends along the corresponding side of the mounting surface 110. The pressing member 31 is provided. Then, the pressing unit 30 presses the substrate S onto the mounting surface 110 by lowering the pressing member 31 moved immediately above the peripheral portion of the substrate S on the mounting surface 110 by the pressing actuators A311 to A313. . Incidentally, the pressing member 31 is provided with notches 32 cut out in the advancing and retreating direction of the alignment pin 21 provided on the corresponding side of the mounting surface 110, and the alignment pin is provided in each notch 32. 21 are arranged. The pressing member 31 can press the peripheral portion of the substrate S against the mounting surface 110 from above while projecting horizontally toward the substrate S on the mounting surface 110 beyond the alignment pin 21 at the contact position P1. It has become.

  FIG. 4 is a perspective view showing pressing means used by the substrate holding device of FIG. 1 for pressing the substrate and the periphery thereof. FIG. 5 is a side view showing pressing means used by the substrate holding device of FIG. 1 for pressing the substrate and the periphery thereof. The pressing member 31 of each pressing means 30 has a frame 33 and a contact flat plate 34 attached to the lower surface of the frame 33. The contact flat plate 34 is provided on the lower surface of the tip of the frame 33 extending in the horizontal direction along the corresponding side of the mounting surface 110 with the notch 32 removed, and placed at the contact plane 35 at the lower part thereof. Contact the surface of the substrate S on the surface 110.

  Further, each pressing means 30 has first and second pressing actuators A311 and A312, the rod of the first pressing actuator A311 is attached to the frame 33 of the pressing member 31 via the L-shaped plate 361, and the second pressing is performed. The rod of the actuator A 312 is attached to the first pressing actuator A 311 via the L-shaped plate 362. Then, the first pressing actuator A311 raises and lowers the pressing member 31, and the second pressing actuator A312 raises and lowers the first pressing actuator A311.

  In FIG. 4 and FIG. 5, the rods of the pressing actuators A311 and A312 are positioned at the lowermost end of the respective lifting and lowering ranges, and the pressing member 31 is the final pressing height H1 (FIG. 9) which is the lowermost end of the lifting and lowering ranges. Located in The distance between the contact plane 35 of the pressing member 31 located at the main pressing height H1 and the placement surface 110 corresponds to the thickness of the substrate S, and the pressing member 31 located at the main pressing height H1 is the contact flat 35 By pressing the substrate S against the mounting surface 110, the shape of the substrate S is made to conform to the shape (planar shape) of the mounting surface 110.

  When the rod of the first pressing actuator A 311 is positioned at the uppermost end of the lifting range while the rod of the second pressing actuator A 312 is positioned at the lowermost end of the lifting range, the pressing member 31 is in the middle of the lifting range The contact plane 35 of the pressing member 31 is located between the upper end of the alignment pin 21 and the placement surface 110, and is located at the temporary pressing height H2 (FIG. 9) which is higher than the main pressing height H1. When the peripheral edge of the substrate S is warped by a certain degree or more, the peripheral surface of the substrate S is pressed by the contact plane 35 of the pressing member 31 positioned at the temporary pressing height H2, and the substrate S is warped. Can be corrected to some extent. The distance between the contact plane 35 of the pressing member 31 positioned at the temporary pressing height H2 and the placement surface 110 is wider than the thickness of the substrate S. Therefore, in a state where the substrate S on the mounting surface 110 is pressed by the contact plane 35 of the pressing member 31 positioned at the temporary pressing height H2, the substrate S can slide in the horizontal direction with respect to the mounting surface 110. It can be moved in the horizontal direction according to the position adjustment processing by the position adjustment means 20.

  Further, when the rods of the pressing actuators A311 and A312 are positioned at the uppermost end of the respective lifting and lowering ranges, the pressing member 31 is the uppermost end of the lifting and lowering range and a withdrawal height H3 higher than the temporary pressing height H2 (FIG. 9) Located in). As described above, the distance between the contact plane 35 of the pressing member 31 positioned at the withdrawal height H3 and the placement surface 110 is set wider than the maximum value of the warpage amount of the substrate S assumed. Therefore, the contact plane 35 of the pressing member 31 located at the withdrawal height H3 separates from the substrate S on the placement surface 110.

  Further, each pressing means 30 fixes the moving plate 371 supporting the second pressing actuator A 312, the rail 372 supporting the moving plate 371 so as to be able to advance and retract horizontally with respect to the stage 11, and the rail 372 to the stage 11. And a base member 373. Furthermore, the pressing means 30 has a third pressing actuator A 313 (FIG. 2) for driving the moving plate 371. Then, when the third pressing actuator A 313 advances the moving plate 371 toward the stage 11, the second pressing actuator A 312 advances with the first pressing actuator A 311 and the pressing member 31, and the pressing member 31 is placed on the mounting surface 110. At a position L1 (FIG. 9) immediately above the mounting area of the substrate S. In FIGS. 4 and 5, the pressing member 31 is located at the advanced position L1. On the other hand, when the third pressing actuator A313 retracts the moving plate 371 from the stage 11, the second pressing actuator A312 retracts with the first pressing actuator A311 and the pressing member 31, and the pressing member 31 moves from the advancing position L1 to the substrate S. It is located at the retracted position L2 (FIG. 8) which is out of the mounting range of the above.

  Incidentally, as these first to third pressing actuators A311 to A313, for example, various types of actuators such as an air cylinder and a solenoid can be used.

  The pressing mechanism 3 having the above-described configuration causes the four pressing members 31 provided corresponding to different sides of the square substrate S to press the range along the corresponding side of the substrate S. . The total length of the contact planes 35 of the pressing members 31 along the sides of the substrate S is at least two thirds of the circumferential length of the substrate S. Therefore, by positioning all four pressing members 31 at the full pressing height H1 or the temporary pressing height H2, the peripheral portion of the substrate S is pressed in a range of two thirds or more of the circumferential length of the substrate S be able to.

  FIG. 6 is a flowchart showing an example of substrate fixing performed by the substrate holding device of FIG. FIG. 7 is a flow chart showing a procedure of temporary pressing of the substrate performed by the substrate holding apparatus of FIG. 1 in substrate fixing. FIG. 8 and FIG. 9 are operation explanatory diagrams showing the operation executed by the flowcharts of FIG. 6 and FIG. 8 and 9, the advanced position L1 and the retracted position L2 of the pressing member 31 are shown at the position of the tip of the contact plate 34, and the heights H1 to H3 of the pressing member 31 are the heights of the contact plane 35. It is shown.

  In step S101, the pressing members 31 provided on each of the four sides of the mounting surface 110 are retracted to the retraction position L2 while being positioned at the retraction height H3, and in step S102, the alignment pins 21 are positioned at the separation position P2. . As a result, it will be in the state shown in the column of "S101-S102" of FIG. At this time, as shown in the same column, the upper end of the lift pin 12 is accommodated in the pin storage hole 114. When the robot R transports the substrate S to the upper side of the mounting surface 110, each lift pin 12 ascends from the pin storage hole 114, and the upper end of each lift pin 12 abuts against the substrate S (step S103). Receives the substrate S from the robot R (step S104). Then, when each lift pin 12 is lowered and the upper end of each lift pin 12 is accommodated in the pin storage hole 114, the substrate S is mounted on the mounting surface 110 from the upper end of each lift pin 12 (step S105). As shown in the column of "S105" in FIG. 8, in the example shown here, the peripheral portion of the substrate S is bowed and the peripheral edge of the substrate S is separated from the mounting surface 110.

  In step S106, temporary pressing of the substrate S is performed. That is, the four pressing members 31 horizontally move to the advanced position L1 while maintaining the retraction height H3, and are positioned immediately above the corresponding side of the substrate S (step S201). Subsequently, the four pressing members 31 are lowered from the withdrawal height H3 to the temporary pressing height H2 (step S202). As shown in the column "S202" of FIG. 9, the pressing member 31 positioned at the temporary pressing height H2 presses the peripheral portion of the warped substrate S toward the mounting surface 110, whereby the substrate S is obtained. Warpage is corrected to some extent. As a result, the height of the peripheral edge of the substrate S is suppressed to the temporary pressing height H2 or less and is lower than the upper end of the alignment pin 21.

  When the temporary pressing of the substrate S is completed, the air supply unit 112 starts air blowing from the vent holes of the stage 11 to the lower surface of the substrate S on the mounting surface 110 (step S107). As a result, the lower surface of the substrate S is slightly separated from the mounting surface 110, and the reduction of the frictional force between the lower surface of the substrate S and the mounting surface 110 is achieved. In step S108, each alignment pin 21 is moved to the contact position P1, and the position of the substrate S on the mounting surface 110 is adjusted (position adjustment processing). Then, when the position adjustment processing is completed, the four pressing members 31 are lowered to the main pressing height H1 (step S109). As shown in the column of “S109” in FIG. 9, the substrate S is pressed against the mounting surface 110 by the pressing member 31 positioned at the main pressing height H1 in this way, so that the shape of the substrate S is the shape of the mounting surface 110 It is corrected to be along.

  When the lowering of the pressing member 31 to the main pressing height H1 is completed, the air supply unit 112 stops the air blowing to the substrate S (step S110). Then, the air suction unit 113 sucks the air from the air holes to suck the substrate S on the mounting surface 110 (step S111). By this, the substrate S is fixed to the mounting surface 110, and the flowchart of FIG. 6 ends.

  As described above, in the first embodiment, the pressing member 31 presses the substrate S on the placement surface 110 of the stage 11 against the placement surface 110 to make the shape of the substrate S the shape of the placement surface 110. It can be selectively positioned at a final pressing height H1 along which the pressure is applied and a temporary pressing height H2 which is farther from the placement surface 110 than the full pressing height H1 and which faces the substrate S on the placement surface 110. And the position adjustment process which adjusts the position of the board | substrate S on the mounting surface 110 by making the alignment pin 21 contact | abut is performed in the state to which the press member 31 was located in temporary press height H2. Therefore, even when the warpage of the substrate S mounted on the mounting surface 110 is large, the warpage of the substrate S is performed by the pressing member 31 positioned at the temporary pressing height H2 when the position adjustment processing is performed. It can be corrected to some extent. As a result, it is possible to suppress the influence of the warpage of the substrate S on the positional adjustment of the substrate S on the stage 11.

  At this time, the position adjustment process is performed in a state where air is blown to the lower surface of the substrate S. By this, the frictional force generated between the substrate S and the mounting surface 110 can be suppressed, and the position adjustment of the substrate S in the position adjustment process can be smoothly performed.

  Further, the position adjustment mechanism 2 moves the plurality of alignment pins 21 arranged to surround the substrate S on the mounting surface 110 from the separated position P2 provided for each alignment pin 21 to the contact position P1. Execute position adjustment processing with. By performing the position adjustment process with the plurality of alignment pins 21 surrounding the substrate S as described above, the position of the substrate S on the mounting surface 110 can be more accurately adjusted.

  Further, the suction of the substrate S onto the placement surface 110 is performed after the pressing member 31 is moved to the main pressing height H1. By this, it is possible to reliably perform the suction of the substrate S on the mounting surface 110 in a state where the peripheral portion of the substrate S is in close contact with the mounting surface 110.

  Particularly in this embodiment, by performing the position adjustment of the substrate S while suppressing the influence of the warp of the substrate S, the positional deviation between the substrate S on the stage 11 and each pressing member 31 can be effectively suppressed. There is. As a result, in the pressure correction of the substrate S performed after the position adjustment process (step S109), each pressing member 31 is properly brought into contact with the peripheral portion of the corresponding substrate S, and the shape of the substrate S is formed on the mounting surface 110. You can follow the shape firmly. Furthermore, since the suction of the substrate S (step S111) can be performed in a state in which the substrate S is in close contact with the mounting surface 110, the substrate S is securely held to firmly fix the substrate S to the stage 11. be able to.

  Further, the pressing mechanism 3 presses the peripheral portion of the substrate S by the pressing member 31 positioned at the main pressing height H1 within a range of two thirds or more of the circumferential length of the substrate S. Thereby, the shape of the substrate S can be made to conform to the shape of the mounting surface 110 firmly, and the shape of the substrate S can be corrected more reliably.

  The pressing member 31 also contacts the substrate S on the mounting surface 110 at the contact plane 35. The temporary pressing height H2 is set so that the contact plane 35 of the pressing member 31 located at the temporary pressing height H2 is positioned between the upper end of the alignment pin 21 and the placement surface 110. Therefore, in the position adjustment process performed in a state where the substrate S is temporarily pressed, the peripheral edge of the substrate S is suppressed lower than the upper end of the alignment pin 21 and the alignment pin 21 is reliably abutted on the peripheral edge of the substrate S be able to. As a result, it is possible to more reliably suppress the influence of the warpage of the substrate S on the positional adjustment of the substrate S on the stage 11.

  Further, the pressing mechanism 3 presses different ranges (ranges along the sides) of the surface of the substrate S by the plurality of pressing members 31. By this, it is possible to correct the warp of the substrate S relatively uniformly.

  FIG. 10 is a side view showing a substrate holding apparatus according to a second embodiment of the present invention. FIG. 11 is a front view showing the substrate holding device of FIG. FIG. 12 is a block diagram showing an electrical configuration of the substrate holding apparatus of FIG. The second embodiment differs from the first embodiment in that the order in which the pressing members 31 are lowered to the temporary pressing height H2 is determined based on the result of acquiring the amount of warpage of the substrate S. Therefore, in the following description, differences from the first embodiment will be mainly described, and the common parts will be denoted by the corresponding reference numerals, and the description will be omitted. However, it goes without saying that the same effect can be achieved in the second embodiment by providing the configuration common to the first embodiment.

  The substrate holding device 1 according to the second embodiment has a configuration in which a notification unit 119 for giving notification to an operator and a warpage detection mechanism 4 for detecting warpage of the substrate S are added to the substrate holding device 1 according to the first embodiment. Prepare. The notification unit 119 is configured of, for example, a display device such as a liquid crystal display, and performs notification to the operator by displaying predetermined characters and images on the screen of the display device. The specific configuration of the notification unit 119 is not limited to this example, and the notification unit 119 can also be configured to notify an operator by sound or light.

  The warpage detection mechanism 4 has a plurality of distance sensors 41 aligned in the Y direction, and a sensor support portion 45 having a bridge structure for supporting the distance sensors 41 above the mounting surface 110. The distance sensor 41 is, for example, a laser displacement meter, and faces the surface of the substrate S mounted on the mounting surface 110 from above. The sensor support portion 45 includes two pillar members 451 erecting upward from the mounting surface 110 on both sides in the Y direction of the mounting range of the substrate S on the mounting surface 110, and these columns above the mounting surface 110. And a beam member 452 bridged between the members 451. The beam members 452 extend parallel to the Y direction, and the plurality of distance sensors 41 are attached to the beam members 452 at different positions in the Y direction.

  The plurality of distance sensors 41 supported by the sensor support 45 in this manner set positions in the substrate S that are different from each other in the Y direction as measurement target positions. In particular, in the example shown here, of the three distance sensors 41, the distance sensors 41 at both ends set the peripheral portion of the substrate S in the Y direction as the measurement target position, and the central distance sensor 41 is the center of the substrate S in the Y direction. Set as the measurement target position.

  Furthermore, the warpage detection mechanism 4 has a scan drive unit 47 that moves the sensor support unit 45 in the X direction with respect to the stage 11 along with each distance sensor 41. The scan drive unit 47 is formed of, for example, a linear motor, and moves the sensor support unit 45 in the X direction according to a command from the controller 10, whereby each distance to the surface of the substrate S on the mounting surface 110 The measurement target position of the sensor 41 is scanned in the X direction.

  Then, the controller 10 calculates the amount of warpage of each side of the substrate S based on the measurement results of the distance sensors 41. Specifically, the height of the mounting surface 110 is measured in advance as a reference height by each distance sensor 41 and stored in the controller 10. Then, the controller 10 causes the scan drive unit 47 to move each distance sensor 41 in the X direction and acquire the measurement result of each distance sensor 41 in association with the position coordinate (XY coordinate) of each distance sensor 41, The heights of different positions on the surface of the substrate S are measured. At this time, the measurement target position of each distance sensor 41 scans the surface of the substrate S across the entire area in the X direction. Subsequently, the controller 10 calculates the difference between the height of the surface of the substrate S and the reference height for each of the different positions on the surface of the substrate S, whereby the surface shape of the substrate S, in other words, the state of warpage of the substrate S Estimate Then, based on the estimation result of the state of warpage of the substrate S, the controller 10 calculates the height from the mounting surface 110 of each of the four sides of the substrate S as a value indicating the degree of warpage of each side, that is, the warpage amount Do.

  Then, also in the second embodiment, the substrate S is fixed to the stage 11 by executing the flowchart of FIG. 6. In particular, in the second embodiment, as shown next, the order in which the pressing members 31 are lowered to the temporary pressing height H2 in step S106 of FIG. 6 is determined based on the result of detecting the amount of warpage of the substrate S.

  FIG. 13 is a flow chart showing a procedure of temporary pressing of the substrate performed by the substrate holding apparatus of FIG. 10 in substrate fixing. In step S301, the amount of warpage of each side of the substrate S is detected as described above. Then, in step S302, it is determined whether the amount of warpage of each side of the substrate S is equal to or less than the allowable value. When there is a side where the amount of warping is larger than the allowable value among the four sides of the substrate S (in the case of “NO” in step S302), the content that the warping state of the substrate S is defective is the screen of the notification unit 119 (Step S303), and the flowchart of FIG. 6 ends.

  Here, various specific values of the allowable value can be considered. For example, the maximum value of the amount of warpage required for the non-defective substrate S may be used as the allowable value. Alternatively, the allowable value may be set for the retraction height H3 of the pressing member 31. In other words, a value smaller than a value at which interference between the contact plane 35 of the pressing member 31 located at the withdrawal height H3 and the substrate S occurs is taken as an allowable value. Thus, when the pressing member 31 is moved from the retracted position L2 to the advanced position L1, interference between the pressing member 31 and the substrate S can be suppressed because the warp of the substrate S is large.

  On the other hand, if the warpage amount is less than the allowable value for all four sides of the substrate S (in the case of “YES” in step S302), the pressing member 31 moves from the withdrawal height H3 to the substrate S on the mounting surface 110. The order of causing the pressing members 31 to perform the temporary pressing operation of moving them toward the temporary pressing height H2 is determined based on the amount of warpage of the sides of the substrate S (step S304). Specifically, a specific side with the largest amount of warpage is specified among the four sides of the substrate S, and it is determined that the temporary pressing operation is to be performed first on the pressing member 31 corresponding to the specific side. In addition, it is determined that the temporary pressing operation is to be performed second on the pressing member 31 corresponding to the opposite side of the specific side. Subsequently, of the other two sides different from the specific side and the opposite side, the third pressing operation is performed on the pressing member 31 corresponding to the side with the larger amount of warpage, and the side with the smaller amount of warpage It is determined that the temporary pressing operation is to be performed fourth on the corresponding pressing member 31.

  Thus, when the temporary pressing order is determined, the four pressing members 31 move horizontally to the advanced position L1 while maintaining the retraction height H3 and are positioned immediately above the corresponding side of the substrate S (step S305). Subsequently, the four pressing members 31 sequentially descend to the temporary pressing height H2 in accordance with the temporary pressing order determined in step S304, and the temporary pressing operation is performed (step S306). Thus, when the temporary pressing operation is performed on all four sides of the substrate S, the flowchart of FIG. 13 is ended, and the process returns to the flowchart of FIG.

  As described above, in the second embodiment, the warpage amount (index value) indicating a value corresponding to the distance between the surface of the substrate S mounted on the mounting surface 110 and the mounting surface 110 has different portions on the surface of the substrate S It is acquired about. The temporary pressing order for causing each pressing member 31 to perform the temporary pressing operation of moving the pressing member 31 toward the substrate S on the placement surface 110 and positioning the pressing member 31 at the temporary pressing height H2 is based on the amount of warpage of the substrate S Each pressing member 31 executes the temporary pressing operation in accordance with the temporary pressing order. As a result, the pressing members 31 can be positioned at the temporary pressing height H2 in the order according to the warping direction of the substrate S, and the warping of the substrate S can be corrected relatively uniformly. As a result, the influence of the warp of the substrate S on the adjustment of the position of the substrate S on the mounting surface 110 can be suppressed more reliably.

  Further, among the four sides (portions) of the surface of the substrate S for which the amount of warpage has been acquired, a specific side (specific part) at which the amount of warpage is largest is specified, and the closest side to the specific side of the four pressing members 31 A part of the pressing member 31 including the pressing member 31 pressing the range of 1 performs the temporary pressing operation earlier than the other pressing members 31 different from the part of the pressing member 31. As a result, since the correction is given priority from the side with the largest warpage among the four sides of the substrate S, the warpage of the board S can be relatively uniformly corrected.

  Incidentally, the specific mode of determining the temporary pressing order in step S304 is not limited to the above-described example. For example, after temporary pressing operation is simultaneously performed on two pressing members 31 corresponding to a specific side and the opposite side, temporary pressing is performed on the two pressing members 31 corresponding to the other side and the other two sides different from the opposite side. It may be decided to execute the operation simultaneously. Alternatively, it may be determined that the temporary pressing operation is performed in order from the pressing member 31 in which the amount of warpage of the corresponding side is large.

  By the way, the above-mentioned substrate holding device 1 is applicable to various substrate processing devices which perform processing on a substrate S. For example, as described below, the substrate holding apparatus 1 can also be equipped in a coating apparatus that performs a coating process for coating the coating liquid on the substrate S.

  FIG. 14 is a perspective view showing an example of a coating apparatus according to the present invention. The coating device 5 is a coating device called a slit coater that applies a coating liquid to the surface of the substrate S using the slit nozzle 6. As the coating solution, various solutions can be used such as a resist solution, a solution for color filter, polyimide, silicon, nano metal ink, and a slurry containing a conductive material. The coating device 5 applies a coating process to the base 50, the substrate holding device 1 disposed on the base 50, and the substrate S held by the stage 11 of the substrate holding device 1 using the slit nozzle 6. An application processing unit 7 and a controller 8 for controlling these units are provided. The substrate holding device 1 provided in the coating device 5 has the same configuration as the substrate holding device 1 of the second embodiment, and the function of the controller 10 described above is incorporated in the controller 8.

  The slit nozzle 6 has a discharge port which is a long opening extending in the Y direction, and can discharge the coating liquid from the discharge port toward the surface of the substrate S held by the stage 11. In the coating device 5, a moving mechanism for moving the slit nozzle 6 in the X direction is provided in the coating processing unit 7, and the slit nozzle 6 can be reciprocated in the X direction above the mounting surface 110 of the stage 11. . Then, the coating liquid discharged from the slit nozzle 6 moving in the X direction above the placement surface 110 is applied to the surface of the substrate S on the placement surface 110.

  The moving mechanism of the coating processing unit 7 includes a nozzle support 71 having a bridge structure that crosses the upper side of the stage 11 in the Y direction and supports the slit nozzle 6 and a slit nozzle moving unit 72 that moves the nozzle support 71 horizontally in the X direction. And. Therefore, the slit nozzle 6 supported by the nozzle support 71 can be horizontally moved in the X direction by the slit nozzle moving unit 72.

  The nozzle support 71 includes a fixing member 71a to which the slit nozzle 6 is fixed, and two elevating mechanisms 71b for supporting the fixing member 71a and raising and lowering. The fixing member 71a is a rod-like member having a rectangular cross section whose longitudinal direction is the Y direction, and is made of carbon fiber reinforced resin or the like. The two lifting mechanisms 71b are connected to both end portions in the longitudinal direction of the fixing member 71a, and each have an AC servomotor, a ball screw, and the like. The fixing member 71a and the slit nozzle 6 are integrally raised and lowered in the vertical direction (Z direction) by the elevating mechanism 71b, and the distance between the discharge port of the slit nozzle 6 and the substrate S, ie, the surface of the substrate S The relative heights of the outlets are adjusted.

  The slit nozzle moving unit 72 detects the positions of the discharge ports of the slit nozzle 6, the two guide rails 73 guiding the movement of the slit nozzle 6 in the X direction, the two linear motors 74 as drive sources, and the like. And two linear encoders 75.

  The two guide rails 73 are arranged at both ends of the base 50 in the Y direction so as to sandwich the mounting range of the substrate S in the Y direction, and extend in the X direction so as to include the mounting range of the substrate S It is done. The lower end portions of the two lifting mechanisms 71b are guided along the two guide rails 73, whereby the slit nozzle 6 moves in the X direction above the substrate S held on the stage 11.

  Each of the two linear motors 74 is an AC coreless linear motor having a stator 74a and a mover 74b. The stator 74 a is provided along the X direction on both side surfaces of the base 50 in the Y direction. On the other hand, the mover 74b is fixed to the outside of the lifting mechanism 71b. The linear motor 74 functions as a drive source of the slit nozzle moving unit 72 by the magnetic force generated between the stator 74 a and the mover 74 b.

  Each of the two linear encoders 75 has a scale unit 75a and a detection unit 75b. The scale portion 75 a is provided in the lower part of the stator 74 a of the linear motor 74 fixed to the base 50 along the X direction. On the other hand, the detection unit 75b is fixed to the outside of the mover 74b of the linear motor 74 fixed to the elevating mechanism 71b, and is disposed to face the scale unit 75a. The linear encoder 75 detects the position of the discharge port of the slit nozzle 6 in the X direction based on the relative positional relationship between the scale unit 75 a and the detection unit 75 b.

  That is, the coating processing unit 7 moves the slit nozzle 6 relative to the substrate S in the X direction relative to the substrate S by the slit nozzle moving unit 72 while adjusting the distance between the slit nozzle 6 and the substrate S in the Z direction by the lift mechanism 71b. be able to. Then, the coating liquid can be applied to the surface of the substrate S by discharging the coating liquid from the slit nozzle 6 moving in the X direction.

  Then, three distance sensors 41 are attached side by side in the Y direction to the fixing member 71 a of the nozzle support 71 constituting the drive mechanism of the coating processing unit 7, and the nozzle support 71 is the above-described sensor support 45 The linear motor 74 plays the role of the above-described scan drive unit 47. Accordingly, the controller 8 can fix the substrate S to the stage 11 by executing the flowcharts of FIGS. 6 and 13 in the same manner as described above.

  Incidentally, although the case where the substrate holding device 1 of the second embodiment is equipped with the coating device 5 is illustrated here, the substrate holding device 1 of the first embodiment can also be equipped with the coating device 5. In this case, each distance sensor 41 can be omitted from the coating device 5 of FIG.

  As described above, in the above embodiment, the substrate holding device 1 corresponds to an example of the “substrate holding device” of the present invention, and the stage 11 corresponds to an example of the “mounting table” of the present invention. The surface 110 corresponds to an example of the "mounting surface" of the present invention, the position adjustment mechanism 2 corresponds to an example of the "position adjustment mechanism" of the present invention, and the alignment pin 21 is an example of the "position adjustment member" of the present invention. The contact position P1 corresponds to an example of the “contact position” of the present invention, the separated position P2 corresponds to an example of the “separation position” of the present invention, and the pressing mechanism 3 is the “pressing mechanism of the present invention The pressing member 31 corresponds to an example of the "pressing member" of the present invention, the contact plane 35 corresponds to an example of the "contacting surface" of the present invention, and the pressing height H1 of the present invention It corresponds to an example of "the main pressing position", and the temporary pressing height H2 corresponds to an example of the "temporary pressing position" in the present invention. The air supply unit 112 corresponds to an example of the "gas blow mechanism" of the present invention, the air suction unit 113 corresponds to an example of the "adsorption mechanism" of the present invention, and the air holes are "blow holes" and "adsorption" of the present invention. The coating device 5 corresponds to an example of the “hole”, the coating device 5 corresponds to an example of the “coating device” of the present invention, the slit nozzle 6 corresponds to an example of the “nozzle” of the present invention, and the substrate S is the “substrate” of the present invention Corresponds to one example.

  The present invention is not limited to the above-described embodiment, and various modifications can be made other than the above without departing from the scope of the invention. For example, the specific detection method of the amount of warpage of the substrate S is not limited to the above-described content, and various modifications are possible. Specifically, by using the fact that the central portion of the substrate S is not warped or the amount of warping is small, the height of the center of the substrate S is measured by the distance sensor 41 as the reference height. Also good. In this case, the difference between the height of the surface of the substrate S and the reference height is calculated at different positions on the surface of the substrate S as the amount of warpage (index value) indicating the degree of warpage of the substrate S. You can estimate the state.

  In addition, the amount of warpage of the substrate S is obtained by measuring using the distance sensor 41. However, for example, when data indicating the warpage amount (index value) of the substrate S is prepared in advance, the controller 10 may acquire the warpage amount of the substrate S by reading the data.

  Further, the specific value of the above-described temporary pressing height H2 can be appropriately adjusted. Therefore, the optimum value of the temporary pressing height H2 may be experimentally obtained in advance. That is, as a result of experimentally performing the position adjustment process while changing the temporary press height H2, the temporary press height H2 may be set to a value that can be determined to be most suitable for the position adjustment process.

  Further, the pressing means 30 is configured by combining two actuators A311 and A312. However, the pressing means 30 may be configured by a single solenoid or the like.

  Moreover, in the said embodiment, each pressing member 31 had a long shape in the direction parallel to the corresponding side. However, the shape of the pressing member 31 is not limited to this. For example, the substrate S may be pressed from above onto the mounting surface 110 by the pressing member 31 having a pin shape.

  In particular, in forming the substrate holding device 1 of the first embodiment, it is not necessary to separately provide the pressing member 31 for each side of the substrate S, and the pressing member 31 is integrally formed by a hollow quadruple frame. You may configure it.

  Further, the shape of the substrate S to be held by the substrate holding device 1 is not limited to the above quadrangle, and the above-described technique can be applied to hold the substrate S having another shape. For example, the above-described technique is used to hold a square-shaped substrate S provided with an orientation flat in which some corners are notched, or a circular substrate S provided with an orientation flat in which a part of the peripheral edge is notched. It is good.

  Further, the description has been made using the coating device 5 that applies the coating liquid by the slit nozzle 6. However, the nozzles are not limited to the slit type, and different types of conventionally known nozzles can be used.

  The coating device 5 moves the slit nozzle 6 relative to the substrate S by moving the slit nozzle 6. However, by driving the substrate holding device 1 in a predetermined direction, the above-described configuration of the substrate holding device 1 can also be equipped to an apparatus that moves the slit nozzle 6 relative to the substrate S.

  As described above, the present invention can be configured, for example, as follows as exemplified and described in the specific embodiments.

  That is, the control unit further includes a gas blow mechanism for blowing gas from the blow holes opened at the placement surface to the substrate on the placement surface, and the control unit causes the position adjustment mechanism to perform position adjustment processing while causing the gas blow mechanism to blow gas to the substrate. The substrate holding device may be configured to perform. By this, the frictional force generated between the substrate and the mounting surface can be suppressed, and the position adjustment of the substrate in the position adjustment process can be smoothly performed.

  In addition, the position adjustment mechanism moves the position adjustment process by moving the plurality of position adjustment members arranged to surround the substrate on the mounting surface from the separated position provided for each position adjustment member to the abutting position. The substrate holding device may be configured to perform. By performing the position adjustment process using the plurality of position adjustment members that surround the substrate as described above, the position of the substrate on the mounting surface can be more accurately adjusted.

  Further, the apparatus further comprises an adsorption mechanism for adsorbing the substrate on the mounting surface to the mounting surface by suctioning gas from the suction holes opened in the mounting surface, and the control unit moves the pressing member to the main pressing position. The substrate holding device may be configured to cause the suction mechanism to suction the substrate later. In this way, it is possible to reliably perform the suction of the substrate onto the mounting surface in a state where the substrate is in close contact with the mounting surface.

  At this time, the suction holes can also be used as blow holes. Specifically, the suction of the gas and the blow of the gas may be switched to the adsorption holes and executed.

  Further, the pressing mechanism may configure the substrate holding device such that the peripheral portion of the substrate is pressed by the pressing member within a range of two thirds or more of the circumferential length of the substrate. By this, the shape of the substrate can be made to conform to the shape of the mounting surface firmly, and the shape of the substrate can be corrected more reliably.

  Further, the pressing member is in contact with the substrate on the mounting surface at the contact surface, and the position adjusting member is provided so as to project from the mounting surface, and the tip and the mounting protruding from the mounting surface of the position adjusting member The substrate holding device may be configured such that the contact surface of the pressing member located at the temporary pressing position is located between the surface and the surface. This makes it possible to more reliably suppress the influence of the warp of the substrate on the adjustment of the position of the substrate on the mounting table.

  Further, the pressing mechanism may configure the substrate holding device so as to press different ranges of the surface of the substrate by a plurality of pressing members. Thereby, the warp of the substrate can be relatively uniformly corrected.

  The control unit further includes an acquisition unit for acquiring, for different portions of the surface of the substrate, an index value indicating a value according to the distance between the surface of the substrate and the surface of the substrate mounted on the mounting surface, and the control unit Is determined based on the index value in the order in which each pressing member is caused to perform the temporary pressing operation in which the pressing member is moved toward the substrate on the mounting surface and positioned at the temporary pressing position. The substrate holding device may be configured to perform. By this, the pressing members can be positioned at the temporary pressing positions in the order according to the warping of the substrate, and the warping of the substrate can be corrected relatively uniformly. As a result, the influence of the warp of the substrate on the adjustment of the position of the substrate on the mounting table can be suppressed more reliably.

  In addition, the control unit identifies a specific portion where the index value is maximum among the portions of the surface of the substrate for which the index value is acquired, and presses the range closest to the specific portion among the plurality of pressing members. The substrate holding device may be configured to determine that the partial pressing member including the member is to perform the temporary pressing operation earlier than the other pressing member different from the partial pressing member. As a result, since the correction is given priority from the portion of the substrate with the largest warpage, the warpage of the substrate can be relatively uniformly corrected.

  Specifically, the shape of the substrate is a square, and the pressing mechanism causes the four pressing members provided corresponding to different sides of the substrate to press a range along the corresponding side of the substrate. The control unit specifies a specific side having the largest index value among the four sides of the substrate as a specific part, and of the four pressing members, the two pressing members corresponding to the specific side and the opposite side of the specific side. The substrate holding device may be configured to determine that the temporary pressing operation is to be performed earlier than another pressing member different from the two pressing members. As a result, since the correction is given priority from the side of the substrate having the largest warpage, the warpage of the substrate can be relatively uniformly corrected.

  The present invention can be applied generally to substrate holding techniques for holding a substrate on a mounting table, and in particular, can be suitably applied to a coating apparatus for holding a substrate on a mounting table in order to apply a coating liquid to the substrate.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate holding apparatus 11 ... Stage 110 ... Mounting surface 2 ... Position adjustment mechanism 21 ... Alignment pin P1 ... Contact position P2 ... Separation position 3 ... Press mechanism 31 ... Press member 32 ... Notch part 33 ... Frame 34 ... Contact Flat plate 35: Contact plane H1: Main pressing height H2: Temporary pressing height L1: Advance position L2: Retraction position 112: Air supply unit 113: Air suction unit 5: Coating device 6: Slit nozzle S: Substrate

Claims (12)

A mounting table on which the substrate is mounted on the mounting surface;
A position adjusting member movable between an abutting position abutted against the peripheral edge of the substrate on the mounting surface and a separated position separated from the substrate in a state where the substrate is mounted on the mounting surface; A position adjustment mechanism that executes a position adjustment process of adjusting the position of the substrate on the mounting surface by moving from the separation position to the contact position;
The main pressing position, which causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and the main pressing position is further from the mounting surface than the main pressing position A pressing mechanism for selectively positioning a pressing member at a temporary pressing position facing the substrate on the mounting surface;
The position adjustment process is performed on the position adjustment mechanism after the pressure adjustment member is moved to the substrate on the placement surface while the position adjustment member is positioned at the separated position to be positioned at the temporary press position. A control unit for moving the pressing member to the main pressing position after completion of the position adjustment process. The substrate holding device according to claim 1, wherein
The apparatus further comprises a gas blowing mechanism for blowing a gas from the blow holes opened at the mounting surface to the substrate on the mounting surface,
The control unit causes the position adjustment mechanism to execute the position adjustment process while causing the gas blow mechanism to blow the gas to the substrate. The substrate holding device according to claim 1 or 2, wherein
The position adjusting mechanism moves a plurality of the position adjusting members arranged to surround the substrate on the mounting surface from the spaced position provided for each of the position adjusting members to the contact position. A substrate holding device for executing the position adjustment process. The substrate holding device according to any one of claims 1 to 3, wherein
The apparatus further comprises an adsorption mechanism for adsorbing the substrate on the mounting surface to the mounting surface by sucking a gas from adsorption holes opened to the mounting surface,
The said control part is a substrate holding apparatus which makes the said adsorption | suction mechanism adsorb | suck the said board | substrate, after moving the said press member to the said main press position. The substrate holding device according to any one of claims 1 to 4, wherein
The said holding | pressing mechanism is a board | substrate holding apparatus which presses the peripheral part of the said board | substrate by the said pressing member in 2/3 or more of the circumferential length of the said board | substrate. The substrate holding device according to any one of claims 1 to 5, wherein
The pressing member contacts the substrate on the mounting surface at the contact surface,
The position adjusting member is provided to project from the mounting surface,
A substrate holding device, wherein a contact surface of the pressing member positioned at the temporary pressing position is located between a tip of the position adjustment member protruding from the placement surface and the placement surface. The substrate holding device according to any one of claims 1 to 6, wherein
The substrate holding device, wherein the pressing mechanism presses different ranges of the surface of the substrate by a plurality of the pressing members. The substrate holding device according to claim 7, wherein
An acquisition unit is further provided for acquiring, for different portions of the surface of the substrate, an index value indicating a value according to the distance between the front surface of the substrate and the front surface of the substrate mounted on the mounting surface,
The control unit determines, based on the index value, the order in which the pressing members are caused to move the pressing members toward the substrate on the placement surface to position the temporary pressing position on the temporary pressing position. And the substrate holding device which causes the pressing members to perform the temporary pressing operation in the order. The substrate holding device according to claim 8,
The control unit specifies a specific portion where the index value is maximum among the portions of the surface of the substrate from which the index value is acquired, and a range closest to the specific portion of the plurality of pressing members A substrate holding device that determines that a part of pressing members including a pressing member that presses the temporary pressing operation is performed earlier than another pressing member different from the part of the pressing members. The substrate holding device according to claim 9, wherein
The shape of the substrate is square,
The pressing mechanism causes each of the four pressing members provided corresponding to different sides of the substrate to press a range along the corresponding side of the substrate.
The control unit identifies a specific side having the largest index value among the four sides of the substrate as the specific part, and corresponds to the opposite side of the specific side and the specific side among the four pressing members. A substrate holding device that determines that the temporary pressing operation is to be performed on two pressing members prior to another pressing member different from the two pressing members. A substrate holding device according to any one of claims 1 to 10.
And a nozzle for discharging a coating liquid toward the substrate held by the substrate holding device. Positioning a position adjusting member movable between an abutting position abutted against the peripheral edge of the substrate placed on the mounting surface of the mounting table and a separated position away from the separated position;
The main pressing position, which causes the shape of the substrate to conform to the shape of the mounting surface by pressing the substrate on the mounting surface against the mounting surface, and the main pressing position is further from the mounting surface than the main pressing position Moving a pressing member selectively located at the temporary pressing position facing the substrate on the loading surface toward the substrate on the loading surface to position the pressing member at the temporary pressing position;
Performing a position adjustment process of adjusting the position of the substrate on the mounting surface by moving the position adjustment member from the separated position to the contact position;
Moving the pressing member to the main pressing position after completion of the position adjustment process.

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