JP2008147292A - Substrate supporting apparatus, substrate supporting method, substrate working apparatus, substrate working method, and manufacturing method of display device component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate working apparatus, a substrate supporting apparatus, and the like capable of securing the rotary angle and working precision of a substrate. <P>SOLUTION: A suction disk 4a forms the entire region of an arrangeable region 51 in the form of a suction disk. The width of the suction disk 4a in both of X and Y directions becomes narrower away from the center of a rotary axis. The suction disk 4a can be rotated up to a maximum rotary angle 53a. While the rotary angle of the suction disk 4a is being secured, the gap to an air floating device 11 can be reduced, thus preventing the deflection of a substrate at the gap between the suction disk 4a and the air floating device 11, maintaining the precision of working treatment to the substrate, and securing the rotary angle and working precision of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that processes a substrate such as a glass substrate, and a substrate support apparatus that supports the substrate.

Conventionally, a substrate processing apparatus places a thin plate-like substrate (work) such as a glass substrate on a stage, performs positioning through the stage, and performs precision patterning on the substrate. When pattern formation is performed on a substrate, considerable accuracy is required, and it is required to accurately place the substrate to be processed at a predetermined position on the surface plate.
In recent years, in the field of displays such as liquid crystal color filters, the G6 generation (1500 mm × 1800 mm), the G7 generation (1870 mm × 2200 mm), etc., tend to increase the size of the glass substrate and increase the device weight, device cost, etc. is there.
In order to reduce the weight of the apparatus and reduce the cost, an air slider type thin plate conveying apparatus has been proposed (see, for example, [Patent Document 1]).

JP 2004-238133 A

However, the conventional substrate processing apparatus has a problem that the equipment cost due to the increase in the size of the apparatus increases.
A stage is required for transporting and processing the substrate, and the moving surface plate of the stone stage is larger than the size of the substrate. In addition, the moving surface plate, the slider and slide rail for running the moving surface plate, and the base that supports these are designed to maintain appropriate rigidity.
Therefore, the size of the device, the weight of the device, the load capacity of the installation location, the device transport cost, etc. increase, and the cost burden required for surface grinding of the large moving surface plate and the accuracy increasing processing by hand lap increases. There is a problem.
In addition, the thin plate conveying device disclosed in [Patent Document 1] does not include an alignment device, and there is a problem that it is difficult to use for precise patterning of a color filter or the like.

Further, for the reasons shown in the following (1) to (3), it is necessary to maintain the relative positional accuracy in the Z direction between the processing apparatus and the substrate.
The Z axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Y axis indicates the machining width direction, the X axis indicates the machining direction, and the Z axis, the Y axis, and the X axis are perpendicular to each other.
(1) When the processing apparatus is an inkjet head unit, when the substrate moves relative to the inkjet head in the X direction or the Y direction, if the substrate flutters in the Z direction, the gap between the inkjet head and the substrate Fluctuates and the landing position in the X direction or Y direction shifts.
(2) When the processing apparatus is a die head unit, when the substrate moves relative to the die head in the X direction or the Y direction, the gap between the die head and the substrate varies when the substrate flutters in the Z direction. As a result, the coating film thickness also varies.
(3) When the processing apparatus is a laser irradiation head unit, when the substrate moves relative to the laser irradiation head in the X direction or the Y direction, if the substrate flutters in the Z direction, the laser irradiation head and the substrate When the gap between them changes, the focal length changes and the drawing state changes.

In addition, when performing the alignment process by rotating the surface plate that supports the substrate, it is necessary to secure a sufficient space for the surface plate rotation. However, if a space for rotating the surface plate is secured by making the surface plate small, there is a problem that the substrate is not supported in the space and the substrate is bent to affect the processing.
In addition, the smaller the maximum rotation angle of the suction plate, the smaller the distance between the suction plate and the air levitation device. However, it is necessary to increase the placement accuracy when the substrate is loaded. Therefore, if the distance between the suction plate and the air levitation device is too small, there is a problem that the device weight and the device manufacturing cost increase in devices other than the suction plate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus, a substrate support apparatus, and the like that can ensure the rotation angle and processing accuracy of the substrate.

  In order to achieve the above-mentioned object, a first invention is a substrate support device for supporting a substrate, and is provided at a lower part of the suction plate for sucking the substrate, and rotates the suction plate. A rotating device, at least a single-axis moving device provided in a lower part of the rotating device and movable in a predetermined direction, and at least a part of a region other than the region sucked by the suction plate are supported in a non-contact manner by air levitation. An air levitation device, wherein a width of the suction plate in a direction perpendicular to the predetermined direction is smaller than a width of the substrate, and at least a part of the width of the suction plate is a rotation of the rotation device. A substrate support device characterized in that the substrate support device is smaller as it is farther from the axial center.

  A substrate support device according to a first aspect of the present invention includes a suction plate, a rotating device, a moving device, and an air floating device. The suction disk sucks a part of the substrate instead of the entire surface. The air levitation device supports an area other than the area adsorbed by the adsorption board by air levitation. The rotating device performs alignment processing of the substrate by rotating the suction disk. The moving device moves the substrate in a predetermined direction.

The width of the suction disk in the direction perpendicular to the predetermined direction is smaller than the width of the substrate. Further, the width of at least a part of the suction disk becomes smaller and narrower as the distance from the rotation axis center of the rotating device increases. The direction perpendicular to the predetermined direction (movement direction) is a direction perpendicular to both the predetermined direction (movement direction) and the vertical direction, and indicates the width direction of the substrate or the suction disk.
The shape of the suction plate is preferably a shape that fits inside the dispositionable region having a boundary between an arc of a circle whose diameter is the distance between the air levitation devices on both sides of the suction plate and a straight line in contact with the circle.
Moreover, it is desirable to determine the center angle of the arc of the circle constituting the boundary line of the arrangeable region based on the maximum rotation angle by the rotating device.

  In the substrate processing apparatus according to the first aspect of the present invention, the distance between the suction plate and the air levitation device is increased while the rotation angle of the suction plate is secured by narrowing the width of at least a part of the suction plate as the distance from the rotation axis center increases. Can be small. Thereby, the board | substrate bending in the clearance gap between an adsorption | suction board and an air levitation apparatus can be prevented, and the precision of the process processing with respect to a board | substrate can be maintained. The rotation angle and processing accuracy of the substrate can be ensured.

  A second invention is a substrate support method for supporting a substrate, wherein a movement step for moving the substrate in a predetermined direction, a rotation step for rotating the substrate, and a width in a direction perpendicular to the predetermined direction. An adsorption step for adsorbing the substrate and at least a part of the area other than the adsorption area in the adsorption area, which is smaller than the width of the substrate, and further, at least a part of the width is smaller as it is away from the rotation axis center in the rotation step. And an air levitation step for supporting the substrate in a non-contact manner by air levitation.

  The second invention relates to a substrate support method for supporting a substrate.

  A third aspect of the invention is a substrate processing apparatus for processing a substrate, the suction plate for sucking the substrate, a rotating device provided at a lower portion of the suction plate, for rotating the suction plate, and the rotation device. A moving device of at least one axis provided at a lower portion and movable in a predetermined direction, and an air levitation device that supports at least a part of a region other than the region adsorbed by the suction plate by air levitation in a non-contact manner. The width of the suction plate in the direction perpendicular to the predetermined direction is smaller than the width of the substrate, and further, the width of at least a part of the suction plate is smaller as the distance from the rotational axis center of the rotating device is smaller. The substrate processing apparatus is characterized.

  A third invention relates to a substrate processing apparatus that supports a substrate by the substrate support apparatus of the first invention and performs processing on the substrate by the processing apparatus. The substrate processing apparatus is an apparatus that performs processing on a substrate by a processing apparatus such as an inkjet head, a die coat, or a laser irradiation head. The substrate processing apparatus is, for example, a coater, an ink jet apparatus, a laser drawing apparatus, or the like.

  A fourth invention is a substrate processing method for processing a substrate, wherein a movement step for moving the substrate in a predetermined direction, a rotation step for rotating the substrate, and a width in a direction perpendicular to the predetermined direction. An adsorption step for adsorbing the substrate and at least a part of the area other than the adsorption area in the adsorption area, which is smaller than the width of the substrate, and further, at least a part of the width is smaller as it is away from the rotation axis center in the rotation step. An air levitation step for supporting the substrate in a non-contact manner by air levitation and a processing step for processing the substrate.

  The fourth invention relates to a substrate processing method for processing a substrate.

  5th invention is a manufacturing method of the display apparatus structural member which manufactures the structural member of a display apparatus using the board | substrate processing method of 4th invention. The display device constituent member is, for example, an organic EL (Organic ElectroLuminescence) element or a color filter.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate processing apparatus which can ensure the rotation angle and processing precision of a board | substrate, a board | substrate support apparatus, etc. can be provided.

  Hereinafter, preferred embodiments of a substrate processing apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

(1. Configuration of the substrate processing apparatus 1)
First, the configuration of the substrate processing apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a schematic perspective view of the substrate processing apparatus 1.
FIG. 2 is a YZ plane sectional view of the substrate processing apparatus 1.
Note that the X direction indicates the conveyance direction of the substrate 3, the Y direction indicates the movement direction of the processing device 17 and the width direction of the substrate 3 or the suction plate 4, the Z direction indicates a vertical rotation axis, and the θ direction indicates its rotation. Indicates direction. The X axis, the Y axis, and the Z axis are perpendicular to each other.

  The substrate processing apparatus 1 includes an X direction moving device 5, a θ direction rotating device 7, an air levitation device 11, a processing device 17, a Y direction moving device 19, an alignment camera 21, a gantry 23, a base 24, and the like.

The substrate processing apparatus 1 is an apparatus that forms a fine-pitch pattern such as a color filter or an electronic circuit by processing the substrate 3 with a processing apparatus 17.
The substrate 3 is an object to be processed, and is, for example, a substrate such as a glass substrate, a silicon wafer, or a printed substrate.

  The X-direction moving device 5 is installed at the center of the base 24 in the X direction. The X-direction moving device 5 is a device that supports the substrate 3 and moves it in the X direction and performs positioning in the X direction. The X-direction moving device 5 includes a guide mechanism 27 and a moving actuator 29. The guide mechanism 27 is, for example, a slider, a slide rail, or an air slide. The moving actuator 29 is, for example, a step motor, a servo motor, or a linear motor.

  The θ-direction rotating device 7 is provided above the X-direction moving device 5 and can move in the X direction. On the upper part of the θ-direction rotating device 7, the suction disk 4 is provided. The θ-direction rotating device 7 performs alignment processing by rotating the substrate 3 adsorbed on the adsorbing board 4 in the θ direction. The θ direction rotating device 7 is, for example, a direct drive motor.

  The suction disk 4 is a device that sucks and supports the substrate 3. The adsorption of the substrate 3 is performed by reducing the pressure or vacuum of the air between the adsorption plate 4 and the substrate 3 (vacuum, intake air). The suction board 4 is provided with a small hole (not shown) for sucking air.

  The air levitation device 11 is an air float, and is a device that supports the substrate 3 in a non-contact manner by pushing up or sucking the substrate 3 with air pressure. The air levitation device 11 can be composed of a plurality of air float units, a porous plate, and the like. The air levitation device 11 achieves predetermined Z-direction accuracy (relative distance accuracy between the substrate 3 and the processing device 17).

The air levitation amount 13 is a difference between the height of the air supply surface of the air levitation device 11 and the height of the suction surface of the suction disk 31. As the air flying height 13 is smaller, the accuracy in the Z direction can be improved. However, as the air flying height 13 is decreased, the vertical straightness of the X-direction moving device 5 needs to be improved.
The interval 15 is an interval between the air levitation device 11 and the suction disk 4. The interval 15 is preferably an interval at which the suction plate 4 can rotate during the alignment process of the substrate 3.

  The processing device 17 is a device that performs processing on the substrate 3, and is, for example, an inkjet head unit, a die coat unit, a laser irradiation head unit, or the like. The processing device 17 is provided in the gantry 23 via the Y-direction moving device 19. The Y-direction moving device 19 performs positioning by moving the processing device 17 in the Y direction.

  The alignment camera 21 images a predetermined portion (an alignment mark, a pattern, or the like formed on the substrate) of the substrate 3 in order to detect the θ-direction angle and XY coordinates of the substrate 3 attracted and fixed to the θ-direction rotating device 7. Camera. The alignment camera 21 is fixedly supported on the frame 20 of the substrate processing apparatus 1. A plurality of alignment cameras 21 may be provided, or alignment cameras 21 having different fields of view (for example, for high accuracy and coarse accuracy) may be provided.

(2. Process control)
Next, process control of the substrate processing apparatus 1 will be described with reference to FIG.
FIG. 3 is a diagram showing a flow of process control of the substrate processing apparatus 1.
A captured image of the alignment camera 21 is input to the image processing device 37. The image processing device 37 performs a process of extracting the θ direction angle and XY coordinates of the substrate 3 based on the captured image. The stage controller 39 compares the extracted data with predetermined data to calculate their deviation, and calculates the control amount so as to reduce the deviation.

The servo amplifier θ41 sends a control signal to the θ-direction rotating device 7 based on the θ-direction control amount sent from the stage controller 39. The θ direction rotating device 7 performs alignment of the substrate 3 in the θ direction.
The servo amplifier X43 sends a control signal to the X-direction moving device 5 based on the X-direction control amount sent from the stage controller 39. The X direction moving device 5 moves the substrate 3 in the X direction.
The servo amplifier Y45 sends a control signal to the Y-direction moving device 19 based on the Y-direction control amount sent from the stage controller 39. The Y direction moving device 19 moves the processing device 17 in the Y direction.
The process system 47 adjusts the processing timing of the processing apparatus 17 based on the control amount sent from the stage controller 39.

(3. Operation of substrate processing apparatus 1)
Next, the operation of the substrate processing apparatus 1 will be described with reference to FIG.

FIG. 4 is a flowchart showing the operation of the substrate processing apparatus 1.
The substrate processing apparatus 1 sequentially performs each process of a conveyance process (step 101), a correction amount calculation process (step 102), an alignment process (step 103), and a processing process (step 104).

(3-1. Conveyance process: Step 101)
The substrate processing apparatus 1 sucks and fixes a part of the substrate 3 by the suction disk 4 and floats the other part of the substrate 3 by the air levitation device 11 to support it in a non-contact manner. The substrate processing apparatus 1 moves the θ-direction rotating device 7 and the substrate 3 in the X direction by the X-direction moving device 5 and conveys them below the processing apparatus 17.

(3-2. Correction amount calculation process: Step 102)
The substrate processing apparatus 1 images the alignment mark attached to the substrate 3 by the alignment camera 21, and calculates the correction amount in the θ direction, the X direction deviation amount, and the Y direction deviation amount based on the XY coordinates of the alignment mark.

(3-3. Alignment process: Step 103)
The substrate processing apparatus 1 performs alignment processing by rotating the substrate 3 in the θ direction by the θ direction rotating device 7 based on the θ direction correction amount calculated by the processing in step 102.

(3-4. Processing: Step 104)
The substrate processing apparatus 1 positions the processing apparatus 17 in the Y direction based on the Y direction deviation amount, adjusts the start timing and stop timing of the processing process based on the X direction deviation amount, and the processing apparatus 17 applies the substrate 3 to the substrate 3. Process.

  In addition, in order to improve the relative distance accuracy (Z direction accuracy) between the substrate 3 and the processing device 17, a sensor for measuring the position of the substrate 3 is provided on the processing device 17 side, and feedback is performed in real time. 11 air pressure may be controlled.

  Through the above process, the substrate processing apparatus 1 sucks and fixes a part of the substrate 3 by the suction disk 4 and floats the other part of the substrate 3 by the air levitation device 11 to support it in a non-contact manner and moves in the X direction. The substrate 3 is transported in the X direction by the device 5, the θ direction rotating device 7 positions the substrate 3 in the θ direction, and the air levitation device 11 processes the substrate 3 while maintaining the Z direction accuracy.

(4. Form of suction cup 4)
Next, the form (size and shape) of the suction cup 4 will be described with reference to FIGS.

(4-1. Arrangeable area 51 of suction cup 4)
FIG. 5 is a diagram showing the area 51 in which the suction disk 4 can be arranged.
The arrangement possible area 51 is an area where the suction disk 4 can be arranged at a rotation angle of 0 °. The arrangeable area 51 indicates an arrangeable area when the suction disk 4 is rotated about the rotation axis center 52 at the maximum rotation angle 53. An arc 54 and a straight line 57 indicate the boundary line of the arrangeable area 51.

  The arc 54 is an arc of a circle 56 having the rotation axis center 52 as a center and a distance 55 of the air levitation device 11 as a diameter. The center angle of the arc 54 is preferably determined based on the maximum rotation angle 53. The straight line 57 is a straight line extending from the end point of the arc 54. The straight line 57 is a tangent line that touches the circle 56 at the end point of the arc 54.

  When the suction disk 4 is in the arrangementable area 51 at the rotation angle of 0 °, the suction disk 4 can be rotated to the maximum rotation angle 53 without colliding with the air levitation device 11. On the other hand, when the suction disk 4 does not fit inside the arrangementable region 51 at the rotation angle of 0 °, the suction disk 4 collides with the air levitation device 11 and cannot be rotated up to the maximum rotation angle 53.

(4-2. When the entire area of the dispositionable area 51 is in the form of the suction cup 4)
FIG. 6 is a diagram showing a suction disk 4 a that is one mode of the suction disk 4.
FIG. 7 is a diagram illustrating a state in which the suction disk 4a is rotated.
The suction disk 4a is configured such that the entire area of the placeable area 51 is in the form of a suction disk. Regarding the width of the suction disk 4a, the width becomes narrower in both the X direction and the Y direction as the distance from the rotation axis center increases. The suction disk 4a can be rotated up to a maximum rotation angle 53a.

(4-3. When a partial area of the dispositionable area 51 is in the form of the suction cup 4)
FIG. 8 is a diagram illustrating a suction disk 4 b that is one mode of the suction disk 4.
FIG. 9 is a diagram illustrating a state in which the suction disk 4b is rotated.
In FIG. 6, the entire area of the arrangeable area 51 is in the form of the suction cup 4, but is not limited thereto. As shown in FIG. 8, a part of the dispositionable region 51 may be in the form of the suction cup 4 according to the form of the substrate 3 to be supported.

  The suction disk 4b is a part of the dispositionable area 51 in the form of a suction disk. The X-direction length 58 of the suction disk 4 b is shorter than the X-direction length 59 of the arrangementable area 51. As for the width of the suction disk 4b, the width in the Y direction becomes narrower as the distance from the rotation axis center increases, and the X direction width is constant within a predetermined distance from the rotation axis center, but outside the predetermined distance from the rotation axis center. The width becomes narrower. The suction disk 4b can be rotated up to the maximum rotation angle 53b.

(4-4. Comparison between the suction cup 4 and the rectangular suction cup 61 of the embodiment of the present invention)
FIG. 10 is a diagram showing a rectangular suction disk 61a.
FIG. 11 is a diagram showing a rectangular suction disk 61b.

The suction disk 61a of FIG. 10 is a rectangular suction disk in place of the suction disk 4a of FIG. The suction disk 61a can rotate up to the maximum rotation angle 53a, like the suction disk 4a.
Since the shape of the suction disk 61a is a rectangle, the suction disk 61a requires a space 63a between the air suspension device 11 and the suction disk 61a.
On the other hand, in the suction disk 4a, the space | interval 15a with the air levitation apparatus 11 can be made small compared with the suction disk 61a.

The suction disk 61b in FIG. 11 is a rectangular suction disk in place of the suction disk 4b in FIG. The suction disk 61b can rotate up to the maximum rotation angle 53b, like the suction disk 4b.
Since the shape of the suction board 61b is a rectangle, the suction board 61b requires an interval 63b between the suction board 61b and the air levitation device 11.
On the other hand, in the suction board 4b, the space | interval 15b with the air levitation apparatus 11 can be made small compared with the suction board 61b.

FIG. 12 is a view showing the substrate 3 supported by the suction disk 4.
FIG. 13 is a diagram illustrating the substrate 3 supported by the suction disk 61.

The suction disk 4 of FIG. 12 is a suction disk according to an embodiment of the present invention, and corresponds to the suction disk 4a of FIG. 6 and the suction disk 4b of FIG. The space | interval 15 is a space | interval of the suction direction 4 and the air levitation apparatus 11, and corresponds to the space | interval 15a of FIG. 10, and the space | interval 15b of FIG.
13 is a rectangular suction disk and corresponds to the suction disk 61a of FIG. 10 and the suction disk 61b of FIG. The interval 63 is an interval in the Y direction between the suction plate 61 and the air levitation device 11, and corresponds to the interval 63a in FIG. 10 and the interval 63b in FIG.

As shown in FIG. 12, the distance 15 between the suction plate 4 and the air levitation device 11 is smaller than the distance 63 between the suction plate 61 and the air levitation device 11. The substrate 3 is not bent.
On the other hand, as shown in FIG. 13, the interval 63 between the suction plate 61 and the air levitation device 11 is larger than the interval 15 between the suction plate 4 and the air levitation device 11. In FIG. 5, the substrate 3 is deformed to cause a bend 65.

(5. Air float configuration and control)
Next, the configuration and control of the air float unit will be described with reference to FIGS. 14 and 15.
FIG. 14 is a diagram illustrating an aspect of the arrangement of the air float units.
FIG. 15 is a diagram illustrating an aspect of air float block control.
The configuration and control of the air levitation device 11 can take various forms.

As shown in FIG. 14, the air levitation device 11 may be configured by arranging a plurality of air float units 91.
It is desirable to arrange the air float unit 91 according to the required accuracy.

  As shown in FIG. 15, when an integrated air float is used, an air flow path (air system) may be provided for each of the plurality of blocks 93 to control the air region range, air flow rate, and air pressure. .

  Thus, the Z direction accuracy of the substrate 3 can be adjusted by controlling the air flow rate and air pressure of the air float. For example, even when unevenness or inclination exists on the surface of the substrate supported by the air float, the accuracy can be improved by controlling the air flow rate and air pressure in the vicinity of the region. In the case of a stone surface plate, it is difficult to improve the position accuracy after installation.

(6. Effect)
As described above, in the substrate processing apparatus 1 according to the embodiment of the present invention, the suction angle is secured while the rotation angle of the suction plate is secured by narrowing the width of at least a part of the suction plate as the distance from the rotation axis center increases. The interval between the board and the air levitation device can be reduced. Thereby, the board | substrate bending in the clearance gap between an adsorption | suction board and an air levitation apparatus can be prevented, and the precision of the process processing with respect to a board | substrate can be maintained. The rotation angle and processing accuracy of the substrate can be ensured.
In addition, since the substrate processing apparatus 1 supports a part of the substrate by the suction plate and the other part of the substrate by the air levitation device, the size of the suction plate can be reduced, and the weight of the device and the device manufacturing can be reduced. Costs can be reduced.

(7. Others)
In addition, regarding the form of the suction disk 4, as long as the interval 15 with the air levitation device 11 is sufficiently small and fits in the arrangementable region 51 of FIG. 5, the form is limited to the form shown in FIGS. Absent. For example, the suction plate 4 may have a shape in which a rectangular corner is cut out. Further, it is desirable to determine the form of the suction cup 4 by comparing and considering the maximum rotation angle 53, the interval 15 between the suction cup 4 and the air levitation device 11, the work burden and the cost burden related to the production of the suction cup 4. .

  Further, the number of axes of the X-direction moving device 5 is not particularly limited. Regarding the number of axes, at least one axis may be provided according to the size, shape, and weight of the substrate 3. The installation position is preferably a position that supports the central portion of the substrate 3, but may be a position that supports a portion other than the central portion of the substrate 3. When the number of axes of the X-direction moving device 5 is plural, it is desirable to provide the suction disk 4 and the θ-direction rotating device 7 for each axis.

  Moreover, although the above-mentioned embodiment demonstrated the board | substrate processing apparatus which processes a board | substrate, it can also apply to the inspection apparatus which test | inspects inspection objects, such as a board | substrate and printed matter.

  The preferred embodiments of the substrate processing apparatus according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of substrate processing apparatus 1 YZ plane sectional view of substrate processing apparatus 1 The figure which shows the flow of the process control of the substrate processing apparatus 1 Flow chart showing the operation of the substrate processing apparatus 1 The figure which shows the arrangement | positioning area | region 51 of the suction disk 4 The figure which shows the suction disk 4a which is one aspect | mode of the suction disk 4 The figure which shows the state which rotated the suction disk 4a The figure which shows the suction disk 4b which is one aspect | mode of the suction disk 4 The figure which shows the state which rotated the suction disk 4b The figure which shows the rectangular suction disk 61a The figure which shows the rectangular suction disk 61b The figure which shows the board | substrate 3 supported by the suction disk 4 The figure which shows the board | substrate 3 supported by the suction disk 61. The figure which shows the one aspect | mode of arrangement | positioning of an air float unit The figure which shows the one aspect | mode of block control of an air float

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Substrate processing device 3 ......... Substrate 4, 4a, 4b ......... Suction board 5 ......... X direction moving device 7 ......... θ direction rotating device 11 ......... Air levitation device 13 ......... Air Floating amount 15, 15a, 15b ......... Distance between suction plate 4 and air levitation device 11 ......... Processing device 19 ......... Y direction moving device 20 ......... Frame 21 ......... Alignment camera 23 ......... Gantry 24 ......... Base 27 ......... Guide mechanism 29 ......... Moving actuator 37 ......... Image processing device 39 ......... Stage controller 41 ......... Servo amplifier θ
43 ......... Servo Amplifier X
45 ......... Servo amplifier Y
47 ......... Process system 51 ......... Placeable area 52 ......... Rotational axis center 53 ......... Maximum rotation angle 54 ......... Arc 55 ......... Air floating area spacing on both sides of the suction plate 56 ......... Yen 57... Straight 58, 59... X-direction length 61, 61 a, 61 b ...... Rectangular suction plate 63, 63 a, 63 b ...... Interval between suction plate 61 and air levitation device 65 65. 91 ……… Air float unit 93 ……… Block

Claims (14)

A substrate support device for supporting a substrate,
An adsorber for adsorbing the substrate;
A rotating device provided at a lower portion of the suction plate and configured to rotate the suction plate;
A moving device provided at a lower portion of the rotating device and movable in a predetermined direction;
An air levitation device that supports at least a part of the area other than the area adsorbed by the adsorption board in a non-contact manner by air levitation,
The width of the suction plate in the direction perpendicular to the predetermined direction is smaller than the width of the substrate, and the width of at least a part of the suction plate is smaller as the distance from the rotation axis center of the rotation device is smaller. A substrate support apparatus.   The shape of the suction plate is a shape that fits inside a dispositionable region having a boundary between an arc of a circle whose diameter is the distance between the air levitation devices on both sides of the suction plate and a straight line that contacts the circle. The substrate support apparatus according to claim 1, wherein the apparatus is a substrate support apparatus.   The substrate support apparatus according to claim 2, wherein a central angle of the arc of the circle constituting the boundary line of the arrangementable region is determined based on a maximum rotation angle by the rotation apparatus. A substrate support method for supporting a substrate,
A moving step for moving the substrate in a predetermined direction;
A rotating step of rotating the substrate;
An adsorption step for adsorbing the substrate in an adsorption region, wherein a width in a direction perpendicular to the predetermined direction is smaller than a width of the substrate, and at least a part of the width is smaller as the distance from the rotation axis center in the rotation step is smaller; ,
An air levitation step of supporting at least a part of the region other than the adsorption region in a non-contact manner by air levitation;
A substrate support method comprising the steps of:   The shape of the suction region is a shape that fits inside a dispositionable region having a boundary between an arc of a circle whose diameter is an interval between air floating regions on both sides of the suction region and a straight line that contacts the circle. The substrate supporting method according to claim 4.   The substrate support method according to claim 5, wherein a central angle of the arc of the circle constituting the boundary line of the arrangementable region is determined based on a maximum rotation angle by the rotation step. A substrate processing apparatus for processing a substrate,
An adsorber for adsorbing the substrate;
A rotating device provided at a lower portion of the suction plate and configured to rotate the suction plate;
A moving device provided at a lower portion of the rotating device and movable in a predetermined direction;
An air levitation device that supports at least a part of the area other than the area adsorbed by the adsorption board in a non-contact manner by air levitation,
The width of the suction plate in the direction perpendicular to the predetermined direction is smaller than the width of the substrate, and the width of at least a part of the suction plate is smaller as the distance from the rotation axis center of the rotation device is smaller. Substrate processing equipment.   The shape of the suction plate is a shape that fits inside a dispositionable region having a boundary between an arc of a circle whose diameter is the distance between the air levitation devices on both sides of the suction plate and a straight line that contacts the circle. The substrate processing apparatus according to claim 7, wherein the apparatus is a substrate processing apparatus.   The substrate processing apparatus according to claim 8, wherein a central angle of the arc of the circle constituting the boundary line of the arrangementable region is determined based on a maximum rotation angle by the rotation device. A substrate processing method for processing a substrate,
A moving step for moving the substrate in a predetermined direction;
A rotating step of rotating the substrate;
An adsorption step for adsorbing the substrate in an adsorption region, wherein a width in a direction perpendicular to the predetermined direction is smaller than a width of the substrate, and at least a part of the width is smaller as the distance from the rotation axis center in the rotation step is smaller; ,
An air levitation step of supporting at least a part of the region other than the adsorption region in a non-contact manner by air levitation;
A processing step for processing the substrate;
A substrate processing method comprising:   The shape of the suction region is a shape that fits inside a dispositionable region having a boundary between an arc of a circle whose diameter is an interval between air floating regions on both sides of the suction region and a straight line that contacts the circle. The substrate processing method according to claim 10.   The substrate processing method according to claim 11, wherein a central angle of the arc of the circle constituting the boundary line of the arrangeable region is determined based on a maximum rotation angle by the rotation step.   The substrate processing apparatus according to claim 7, wherein the processing process performed by the processing apparatus includes a coating process or a laser drawing process.   The manufacturing method of the display apparatus structural member which manufactures the structural member of a display apparatus using the board | substrate processing method of Claim 10-12.

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