CN113365741A - Coating device - Google Patents
Coating device Download PDFInfo
- Publication number
- CN113365741A CN113365741A CN201980090462.8A CN201980090462A CN113365741A CN 113365741 A CN113365741 A CN 113365741A CN 201980090462 A CN201980090462 A CN 201980090462A CN 113365741 A CN113365741 A CN 113365741A
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- Prior art keywords
- substrate
- coating
- unit
- floating
- suction
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Provided is a coating device capable of suppressing substrate electrification. The coating device comprises: a table unit for holding a substrate; and a coating unit that applies a coating liquid to the substrate on the stage unit and discharges the coating liquid from the coating unit while relatively moving the coating unit and the substrate held by the stage unit, thereby forming a coating film on the substrate, wherein the stage unit includes a floating stage section that floats the substrate and a suction holding section that suctions and holds the substrate, and the floating stage section and the suction holding section integrally move to a substrate replacement position where the substrate is carried in and out and a coating position where the coating liquid is applied to the substrate with respect to the coating unit in a state where the substrate floated on the floating stage section is held by the suction holding section.
Description
Technical Field
The present invention relates to a coating apparatus that forms a coating film on a substrate by relatively moving a coating unit that discharges a coating liquid and the substrate.
Background
A coating apparatus having a slit nozzle is used for manufacturing a substrate uniformly coated with a resist solution used for a flat panel display, and a coating apparatus having an inkjet nozzle is used for manufacturing a wiring pattern in a wiring board such as a printed circuit board or a package substrate, or an insulating film pattern of a power semiconductor.
As shown in fig. 7, these coating apparatuses include a table 100 on which a substrate W is placed and a coating unit 101 that discharges a coating liquid, and form a coating film on the substrate W by relatively moving the substrate W and the coating unit 101 while discharging the coating liquid from a coater 102 of the coating unit 101 (see, for example, patent document 1 below).
Usually, the table 100 is provided with lift pins 104 capable of receiving the substrate W conveyed by a robot hand 103 (see fig. 7 (b)) from a previous step. When the substrate W is placed on the tip end portions of the lift pins 104, the lift pins 104 are accommodated in the table 100, and the substrate W is placed on the table 100. Suction holes are formed in the table 100, and when a substrate W is placed on the table 100, suction force is generated from the suction holes arranged on the entire surface of the table 100, and the substrate W is sucked and held on the table 100. In this state, the coating liquid is discharged from the coater 102 while relatively moving the table 100 and the coating unit 101, and a coating film is formed on the substrate W. Thereafter, when the suction force of the suction holes is released and the substrate W is lifted up to a predetermined position from the surface of the table 100 by the lift pins 104, the robot hand 103 enters the lower side of the substrate W to receive the substrate W, and the substrate W is conveyed to the next step.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-144376
Disclosure of Invention
Problems to be solved by the invention
However, in the above coating apparatus, the substrate W is charged, and the charging amount is large, so that there is a problem that the substrate W is easily broken. That is, in the above coating apparatus, the substrate W is attracted to the entire surface of the table 100 by the attraction force generated in the attraction holes, and then the substrate W is lifted up from the table 100 by the lift pins 104, whereby large static electricity is generated in the substrate W by contact electrification and peeling electrification. The generation of static electricity causes a spark when the robot hand 103 approaches, and thus may damage a device provided on the substrate W or damage the substrate W itself.
Further, there is a problem that the generation of static electricity causes particles to easily adhere to the coating film, and the accuracy of forming the coating film may be lowered.
The present invention has been made in view of the above problems, and an object thereof is to provide a coating apparatus capable of suppressing charging of a substrate.
Means for solving the problems
In order to solve the above problem, the coating apparatus of the present invention includes: a table unit for holding a substrate; and a coating unit that applies a coating liquid to the substrate on the stage unit and discharges the coating liquid from the coating unit while relatively moving the coating unit and the substrate held by the stage unit, thereby forming a coating film on the substrate, wherein the stage unit includes a floating stage section that floats the substrate and a suction holding section that suctions and holds the substrate, and the floating stage section and the suction holding section are moved relative to the coating unit to a substrate replacement position where the substrate is carried in and out and a coating position where the coating liquid is applied to the substrate in a state where the substrate floated on the floating stage section is held by the suction holding section.
According to the above coating apparatus, since the substrate is floated by the floating table section and is sucked and held only by the suction holding section, only the region in contact with the substrate can be made to be the suction holding section in a state where the substrate is held. Therefore, compared to the conventional case where the substrate is held in contact with the entire surface of the substrate, the amount of charge of contact charging and peeling charging can be suppressed, and the problem that the device on the substrate or the substrate itself is damaged by static electricity generated in the substrate can be avoided.
The suction holding portion may be configured to suction-hold the exclusion area of the substrate.
According to this configuration, since the removal area not used as a product is sucked and held, the area held by the suction holding portion can be suppressed as much as possible, and the amount of contact charging and peeling charging generated on the substrate can be suppressed.
Further, the floating table section and the suction holding section may be configured to rotate about the center of the floating table section as a rotation center.
According to this configuration, when the coating unit is constituted by the ink jet unit, the substrate is inclined with respect to the coating unit, so that coating can be performed even at a pitch smaller than the nozzle pitch of the ink jet unit, and a pattern with high accuracy can be handled.
Effects of the invention
According to the coating apparatus of the present invention, the substrate can be inhibited from being charged.
Drawings
Fig. 1 is a plan view schematically showing a coating apparatus of the present invention.
Fig. 2 is a side view of the coating apparatus.
Fig. 3 is an enlarged front view of the table unit.
Fig. 4 is a diagram showing the arrangement of nozzles of the ink jet head.
Fig. 5 is a side view of the suction holding portion.
Fig. 6 is a diagram showing a positional relationship between the stage unit and the coating unit, where (a) is a diagram showing a state where the stage unit moves in a normal state, and (b) is a diagram showing a state where the stage unit moves by tilting the substrate with respect to the coating unit by the rotation mechanism.
Fig. 7 is a diagram showing a conventional coating apparatus, where (a) is a diagram showing a state where a substrate is placed on a table, and (b) is a diagram showing a state where the substrate is lifted by lift pins.
Detailed Description
An embodiment of the coating apparatus of the present invention will be described with reference to the drawings. In the present embodiment, a case where the coating unit 2 is an ink jet unit is described, but a slit nozzle may be used, and the present invention is not limited to the coating method.
Fig. 1 is a plan view showing one embodiment of a coating apparatus, and fig. 2 is a side view of the coating apparatus.
As shown in fig. 1 and 2, the coating apparatus includes a table unit 1 on which a substrate W is placed and a coating unit 2 that coats ink (coating material) on the substrate W, and forms a coating film (including a coating pattern) on the substrate W by relatively moving the coating unit 2 and the substrate W placed on the table unit 1 and discharging the ink onto a predetermined landing position on the substrate W.
In the following description, the direction in which the table unit 1 moves is referred to as the X-axis direction (main scanning direction), the direction perpendicular to the horizontal plane is referred to as the Y-axis direction (sub-scanning direction), and the directions perpendicular to both the X-axis direction and the Y-axis direction are referred to as the Z-axis direction.
The coating device has a base 3, and a table unit 1 and a coating unit 2 are provided on the base 3. Specifically, the base 3 is provided with a 1 st rail portion 31 on which the table unit 1 travels and a 2 nd rail portion 32 on which the coating unit 2 travels, and in the present embodiment, the 1 st rail portion 31 is disposed inside the 2 nd rail portion 32. The 1 st rail portion 31 and the 2 nd rail portion 32 are formed to extend in the X axis direction, and the table unit 1 and the coating unit 2 are formed to be movable in the X axis direction along the 1 st rail portion 31 and the 2 nd rail portion 32, respectively. In the present embodiment, the table unit 1 is movable to the substrate replacement position and the coating position, and the coating unit 2 is movable to the coating position and the maintenance position.
The coating unit 2 is a member for applying ink as a coating material by landing the ink on the substrate W, and includes an ink jet head 21 for ejecting the coating material and a gantry 22 for supporting the ink jet head 21.
The gantry portion 22 is formed in a substantially circular shape, and includes leg portions 22a disposed on both outer sides of the 1 st rail portion 31 in the Y axis direction, and a beam member 22b connecting the leg portions 22a and extending in the Y axis direction. The inkjet head 21 is attached to the beam member 22b, and the gantry 22 is attached to be movable in the X-axis direction in a state of crossing the 1 st rail portion 31 in the Y-axis direction. Specifically, the leg portion 22a is slidably attached to the 2 nd rail portion 32, and the gantry portion 22 moves in the X-axis direction and can be stopped at an arbitrary position by driving and controlling a linear motor provided to the leg portion 22 a. In the present embodiment, the coating operation can be stopped at the coating position where the coating operation is performed and at the maintenance position where the maintenance operation is performed. In the coating operation, the gantry 22 is fixed at the coating position.
The beam member 22b is a columnar member connecting the legs 22 a. The beam member 22b is provided with an ink jet head 21. Specifically, the ink jet head 21 is attached to the beam member 22b at the center position in the X axis direction, and the nozzles 23b and 24b (see fig. 4) provided in the ink jet head 21 are attached in a posture facing the 1 st rail portion 31. That is, the table unit 1 moves on the 1 st rail portion 31 in a state where the gantry portion 22 is located at the coating position, and when the substrate W placed on the table unit 1 is located directly below the ink jet head 21, ink as a coating material is ejected to form a coating film on the substrate W.
The ink jet head 21 is formed by integrating a plurality of nozzles 23b and 24 b. In the present embodiment, the ink jet head 21 includes: a 1 st nozzle unit 23 having a plurality of nozzles 23 b; and a 2 nd nozzle unit 24 having a plurality of nozzles 24b, the 1 st nozzle unit 23 and the 2 nd nozzle unit 24 being fixed in a state of being disposed adjacent to each other in the X-axis direction. In the present embodiment, the same nozzle is used for the nozzle 23b and the nozzle 24b, and the same particle size can be ejected, but the nozzle 23b and the nozzle 24b may be configured to eject ink having different particle sizes using nozzles having different shapes.
The inkjet head 21 is integrally formed with a 1 st nozzle unit 23 and a 2 nd nozzle unit 24 in the Y axis direction along a beam member 22 b. The beam portion 22b is provided with a rail (not shown) extending in the Y-axis direction, and the inkjet head 21 is slidably attached to the rail. Further, the linear motor can be moved and stopped at an arbitrary position by driving and controlling the linear motor. That is, the ink jet head 21 can slightly move in the Y axis direction, and the ink as the coating material can be landed on the substrate W at a predetermined position in the Y axis direction with high accuracy. Accordingly, in a state where the gantry unit 22 is stopped at the application position, the table unit 1 is moved in the X-axis direction, and the ink jet head 21 is moved in the Y-axis direction, whereby the ink jet head 21 and the table unit 1 are relatively moved, and ink is ejected from the nozzles 23b and 24b of the ink jet head 21, whereby ink can be landed on a predetermined position of the substrate W on the table unit 1 with high accuracy.
As shown in fig. 4, the 1 st nozzle unit 23 has a plurality of head modules 23a, and the head modules 23a have nozzles 23 b. In the present embodiment, the plurality of head modules 23a are arranged along the Y-axis direction and arranged in a direction perpendicular to the coating direction. The head module 23a has a plurality of nozzles 23b, and is provided in a state where the nozzles 23b are arranged at a predetermined arrangement pitch in one direction. When a driving voltage is applied to the head block 23a, a common driving voltage is applied to the nozzles 23b, and a predetermined amount of ink is ejected from the nozzles 23 b.
The head modules 23a are arranged in a staggered manner so as to have overlapping portions. In the example of fig. 4, the adjacent head modules 23a are alternately arranged in a staggered manner in the X-axis direction. That is, since the head modules 23a are different in size in the arrangement interval of the nozzles 23b and in the both end portions of the head module 23a, they are shifted in the X-axis direction and arranged in the Y-axis direction so as to be able to offset the amount of size of the both end portions. That is, the normal nozzles 23b of the 1 st nozzle unit 23 are arranged at equal intervals in the Y axis direction when viewed in the X axis direction, and all the normal nozzles 23b are arranged at a constant arrangement pitch in the Y axis direction when viewed in the X axis direction as the entire 1 st nozzle unit 23, and are arranged at equal intervals in the Y axis direction when viewed in the X axis direction.
The configuration of the 2 nd nozzle unit 24 is the same as that of the 1 st nozzle unit 23, and therefore, the description thereof is omitted.
The table unit 1 holds the substrate W. Here, fig. 3 is an enlarged front view of the table unit 1. The table unit 1 includes: a base part 50 attached to the 1 st rail part 31; a floating table part 11 disposed on the base part 50; and a suction holding portion 12. That is, the table unit 1 can transport the substrate W in the X-axis direction while the substrate W is held by suction by the suction holding portion 12 and the base portion 50 moves along the 1 st rail portion 31 while the substrate W is held by suction.
The floating table 11 floats the substrate W, and in the present embodiment, includes an air floating mechanism. The floating table portion 11 is provided on the base portion 50 and formed in a shape of 1 rectangular flat plate. The floating table portion 11 has a smooth substrate floating surface 11a (see fig. 3), and the entire substrate floating surface 11a is set to a predetermined height position. The floating table portion 11 can float the substrate W to a predetermined height position by forming an air layer between the substrate floating surface 11a and the substrate W to be conveyed. Specifically, a fine discharge port (not shown) and a suction port (not shown) that open to the substrate floating surface 11a are formed in the floating table portion 11, the discharge port and the compressor are connected by a pipe, and the suction port and the vacuum pump are connected by a pipe. The substrate W can be lifted from the substrate lifting surface 11a to a predetermined height in a horizontal posture by balancing the air ejected from the ejection port and the suction force generated at the suction port. This makes it possible to hold the substrate W while maintaining the planar posture (referred to as flatness) of the substrate W with high accuracy.
The floating table portion 11 is formed so that the dimension in the Y axis direction thereof is smaller than the dimension in the Y axis direction of the substrate W to be conveyed, and when the substrate W is placed on the substrate floating surface 11a, the end portion in the Y axis direction of the substrate W is exposed from the substrate floating surface 11 a. The exposed portion (exposed region T) is held by a suction holding unit 12 described later, whereby the substrate W can be conveyed. The dimension of the floating table portion 11 in the Y axis direction is set to a minimum dimension necessary for the exposure region T to be held by the suction holding portion 1230. In the present embodiment, the exclusion area is set as the exclusion area of the substrate W.
The base portion 50 supports the floating table portion 11 and is attached so as to be able to travel along the 1 st rail portion 31. The base portion 50 is provided so as to cover the upper surface of the 1 st rail portion 31. An air cushion 51 is attached to a lower surface (a surface facing the 1 st rail portion 31) of the base portion 50, and the base portion 50 travels along the 1 st rail portion 31 while floating on the 1 st rail portion 31 by driving a linear motor (not shown). That is, by driving and controlling the linear motor, the base portion 50 can smoothly travel on the 1 st rail portion 31 and can be stopped at a predetermined position. In the present embodiment, the substrate can be moved to the substrate replacement position and the coating position and can be stopped at each position. That is, the floating table section 11 and the suction holding section 12 are integrated, and configured to be movable to the substrate replacement position and the application position and to be able to stop at each position.
The floating table 11 is provided with a substrate lifting mechanism for lifting and lowering the substrate W. That is, a plurality of pin holes 13 are formed in the substrate floating surface 11a, and lift pins 14 (see fig. 2) capable of moving up and down in the Z-axis direction are embedded in the pin holes 13. This enables the substrate W to be carried in and out. That is, at the substrate replacement position, the lift pins 14 stand by in a state of protruding from the substrate floating surface 11a when the substrate W is carried in, and when the substrate W is carried in by the robot hand F or the like, the substrate W is placed on the lift pins 14 by the tip portions of the lift pins 14 in the protruding state, and the substrate W is held by the lift pins 14. Then, the lift pins 14 are lowered from this state and accommodated in the pin holes 13, whereby the substrate W can be placed on the substrate floating surface 11 a. When the substrate W is carried out, the lift pins 14 are projected at the substrate replacement position, whereby the substrate W floating on the substrate floating surface 11a is held at a predetermined height position. Then, the substrate W is held by the robot hand F or the like from below, and can be transferred from the lift pins 14 to the robot hand F.
The suction holding portion 12 sucks and holds the substrate W, and is attached to the base portion 50. The suction holding portion 12 includes a flat plate-like frame portion 12a extending in the X-axis direction and a suction portion 12b attached to the frame portion 12 a. The suction unit 12b is provided to perform an elevating operation, and the suction unit 12b performs an elevating operation, thereby allowing contact and separation with respect to the back surface of the substrate W floating on the floating table 11. In the present embodiment, as shown in fig. 5, the frame portion 12a is provided with a lifting mechanism 12c, and the frame portion 12a and the suction portion 12b are lifted and lowered together by the lifting and lowering operation of the lifting mechanism 12 c.
The frame portion 12a is disposed on the base portion 50 while supporting the suction portion 12 b. That is, the floating table section 11 is disposed so as to sandwich the floating table section 11 from both sides in the Y-axis direction (see fig. 3), and is disposed along the X-axis direction of the floating table section 11. A plurality of suction portions 12b are attached to the frame portion 12a, and in the present embodiment, the frame portion 12a is disposed at equal intervals in the longitudinal direction (see fig. 5).
The suction portion 12b sucks and holds the substrate W, and is formed in a rectangular parallelepiped block shape. The suction portions 12b are arranged along the X-axis direction in the longitudinal direction, and the plurality of suction portions 12b are attached to the frame portion 12a in a row. The suction portions 12b are set such that the upper surface portions 12bs are formed flat, and the upper surface portions 12bs of all the suction portions 12b are at the same height position. That is, when the suction units 12b are moved up and down to the lower end position and the upper end position, the upper surface portions 12bs of all the suction units 12b are at the same height position at the lower end position and the upper end position. An opening is formed in the upper surface portion 12bs, and a suction force is generated in the opening. Therefore, by generating the suction force at the opening portion in a state where the lower surface of the substrate W is in contact with the upper surface portion 12bs of the suction portion 12b, the substrate W is sucked by the upper surface portion 12bs of the suction portion 12b, and is sucked and held at the height position of the upper surface portion 12bs set by the suction portion 12 b.
The table unit 1 is formed to be rotatable about the Z axis. In the present embodiment, the base portion 50 is provided with a rotation mechanism 53 that rotates about the Z axis, and is configured to be able to rotate the floating table portion 11 about the Z axis. Specifically, a rotation mechanism 53 is provided for rotating the flat plate portion 52 of the base portion 50 on which the floating table portion 11 is placed about the Z axis with respect to the lower portion coupled to the 1 st rail portion 31, and by rotating the flat plate portion 52 by the rotation of the rotation mechanism 53, the floating table portion 11 and the suction holding portion 12 coupled to the flat plate portion 52 can rotate about the common Z axis. That is, normally, as shown in fig. 6 (a), the substrate W is moved to the coating unit 2 side in a state where the substrate W is sucked and held by the stage unit 1 to form a coating film on the substrate W, but as shown in fig. 6 (b), the substrate W can be rotated around the central axis of the floating stage part 11 in a state where the substrate W is sucked and held by the stage unit 1. Further, the substrate W can be moved to the coating unit 2 side with a predetermined angle with respect to the ink jet head 21, and a coating film can be formed on the substrate W. This makes it possible to land ink at a pitch smaller than the array pitch of the nozzles 23b and 24b of the ink jet head 21, and to form a coating film with high precision.
A maintenance unit 6 is provided on the opposite side of the table unit 1 in the X axis direction. The maintenance unit 6 performs maintenance work on the nozzles 23b and 24b of the ink jet head 21. The maintenance unit 6 is provided with a cleaning device, a wiping device, and a drain pan, and maintenance work is performed using these devices periodically. Specifically, during the maintenance operation, the gantry unit 22 is moved from the application position to the maintenance position on the 2 nd rail unit 32, and the nozzle surface of the ink jet head 21 is cleaned by the cleaning device. After the cleaning liquid and the like adhering to the nozzle surface are wiped by the wiping device, the bleeding operation and the flushing operation are performed on the liquid discharge tray, and the nozzles 23b and 24b of the ink jet head 21 are recovered. When the series of maintenance operations is completed, the gantry unit 22 moves to the coating position to prepare for the next coating process.
According to the coating apparatus of the above embodiment, since the substrate W is floated by the floating table 11 and is sucked and held only by the suction and holding portion 12, only the area in contact with the substrate W can be made to be the suction and holding portion 12 in a state where the substrate W is held. Therefore, compared to the conventional case where the substrate W is held in contact with the entire surface of the substrate W, the amount of charge of contact charging and peeling charging can be suppressed, and the problem that the devices on the substrate W and the substrate W themselves are damaged by static electricity generated in the substrate W can be avoided.
In the above embodiment, the example in which the floating table section 11 and the suction holding section 12 are rotated integrally has been described, but in the case where the coating unit 2 is a slit nozzle or the like, it is not necessary to rotate the substrate W with respect to the coating unit 2, and therefore the rotating mechanism 53 may be omitted.
Further, in the above-described embodiment, the example in which the application unit 2 is moved to the maintenance unit 6 side (maintenance position) at the time of the maintenance operation has been described, but the application unit 2 may be fixed and the maintenance unit 6 may be moved to the application unit 2 to perform the maintenance operation.
Further, in the above-described embodiment, the case of air levitation as a means for levitating the substrate W has been described, but the substrate W may be levitated by ultrasonically vibrating the levitation table section 11.
Further, in the above-described embodiment, the example in which the floating table section 11 and the suction holding section 12 are integrally moved relative to the application unit 2 has been described, but the driving section of the floating table section 11 and the driving section of the suction holding section 12 may be separately configured, and the floating table section 11 and the suction holding section 12 may be moved in synchronization with each other.
Further, in the above-described embodiment, the example in which the floating table section 11 and the suction holding section 12 are moved integrally and synchronously was described, but the floating table section 11 and the suction holding section 12 may be relatively displaced to such an extent that the state in which the substrate W is floating on the floating table section 11 is maintained.
Description of the reference symbols
1: a table unit; 2: a coating unit; 11: a floating table section; 12: a suction holding part; 50: a base part; 53: a rotation mechanism; w: a substrate.
Claims (3)
1. A coating apparatus, comprising:
a table unit for holding a substrate; and
a coating unit that coats the coating liquid on the substrate on the stage unit,
forming a coating film on a substrate by discharging a coating liquid from the coating unit while relatively moving the coating unit and the substrate held by the stage unit,
it is characterized in that the preparation method is characterized in that,
the stage unit includes a floating stage unit that floats the substrate and a suction holding unit that suctions and holds the substrate, and the floating stage unit and the suction holding unit move relative to the coating unit to a substrate replacement position where the substrate is carried in and out and a coating position where the coating liquid is applied to the substrate in a state where the substrate floated on the floating stage unit is held by the suction holding unit.
2. Coating device according to claim 1,
the suction holding portion performs suction holding on the exclusion area of the substrate.
3. A coating device is characterized in that a coating device is provided,
the floating table section and the suction holding section rotate about the center of the floating table section as a rotation center.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/006947 WO2020174513A1 (en) | 2019-02-25 | 2019-02-25 | Coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113365741A true CN113365741A (en) | 2021-09-07 |
Family
ID=72238707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980090462.8A Pending CN113365741A (en) | 2019-02-25 | 2019-02-25 | Coating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113365741A (en) |
| WO (1) | WO2020174513A1 (en) |
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| WO2013031222A1 (en) * | 2011-08-30 | 2013-03-07 | 株式会社ニコン | Object transportation device, object processing device, exposure device, method for producing flat panel display, method for producing device, method for transporting object, and method for exchanging object |
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- 2019-02-25 CN CN201980090462.8A patent/CN113365741A/en active Pending
- 2019-02-25 WO PCT/JP2019/006947 patent/WO2020174513A1/en active Application Filing
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| JP2008147292A (en) * | 2006-12-07 | 2008-06-26 | Dainippon Printing Co Ltd | Substrate supporting apparatus, substrate supporting method, substrate working apparatus, substrate working method, and manufacturing method of display device component |
| WO2008143259A1 (en) * | 2007-05-22 | 2008-11-27 | Kabushiki Kaisha Watanabe Shoko | Slit coater |
| JP2009147240A (en) * | 2007-12-18 | 2009-07-02 | Dainippon Printing Co Ltd | Substrate supporting apparatus, substrate supporting method, substrate processing apparatus, substrate processing method, and method of manufacturing display apparatus constitutional member |
| CN102057477A (en) * | 2008-06-03 | 2011-05-11 | 株式会社爱发科 | Stage with alignment function, treatment device equipped with stage with the alignment function, and substrate alignment method |
| CN106927258A (en) * | 2017-01-26 | 2017-07-07 | 江苏东旭亿泰智能装备有限公司 | A kind of conveyer and its transfer approach for glass substrate |
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| WO2020174513A1 (en) | 2020-09-03 |
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