KR101682261B1 - Coating apparatus - Google Patents

Abstract

[PROBLEMS] To efficiently perform nozzle cleaning work.
A liquid droplet ejecting apparatus comprising: a coating section having a nozzle having a slit opening for discharging a liquid body with respect to a substrate; a driving section for driving at least one of the substrate and the nozzle so that the substrate and the nozzle move relatively; A cleaning member inserted into the slit opening and a cleaning member driving unit for moving the cleaning member in the longitudinal direction of the slit opening.

Description

COATING APPARATUS

The present invention relates to a coating apparatus.

On a glass substrate constituting a display panel such as a liquid crystal display, fine patterns such as wiring patterns and electrode patterns are formed. Generally, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of exposing the resist film to a pattern, and a step of developing the resist film are performed respectively.

There is provided an apparatus for applying a resist film on a surface of a substrate by applying a resist to the glass substrate by moving the slit nozzle and the glass substrate relative to each other at a position where the glass substrate and the discharge region of the slit nozzle overlap each other, The device is known.

In such a coating apparatus, droplets of the resist are adhered to the slit nozzle by ejecting the resist onto a plurality of glass substrates, which may affect the film thickness of the discharged resist. Therefore, the slit nozzle is cleaned. As a cleaning operation of the slit nozzle, for example, a configuration is known in which the nozzle tip portion is cleaned automatically using a cleaning device.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-270841

However, as for the cleaning of the slit opening, the operation of piercing the plate-like cleaning member into the slit opening and scanning in the longitudinal direction of the slit opening is manually performed. For this reason, it is necessary to stop the apparatus when the nozzle cleaning operation is carried out, and improvement in efficiency has been required.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide a coating apparatus capable of efficiently performing a nozzle cleaning operation.

A coating apparatus according to a first aspect of the present invention includes a coating unit having a nozzle having a slit opening for discharging a liquid body with respect to a substrate, the nozzle having a slit opening formed at a tip end thereof; and at least one of the substrate and the nozzle And a cleaning member driving unit for moving the cleaning member in the longitudinal direction of the slit opening.

In this case, the slit opening can be cleaned by moving the cleaning member insertably formed in the slit opening in the longitudinal direction of the slit opening. Thereby, the slit opening can be automatically cleaned without depending on manual operation, so that the nozzle cleaning operation can be efficiently performed.

In the above-described coating device, it is preferable to further include a management unit for managing the state of the tip of the nozzle, and the cleaning member is provided in the management unit.

In this case, since the cleaning member is provided in the maintenance section that manages the state of the tip end portion of the nozzle, the slit opening can be cleaned when the state of the tip end portion of the nozzle is managed. This makes it possible to efficiently manage the state of the distal end portion.

In the above applicator, the control unit may include a nozzle cleaning unit that cleans the tip of the nozzle, and the cleaning member is provided in the nozzle cleaning unit.

In this case, since the maintenance section has the nozzle cleaning section for cleaning the front end of the nozzle, and the cleaning member is provided for the nozzle cleaning section, the slit opening can be cleaned when cleaning the front end of the nozzle. As a result, the cleaning operation of the tip end of the nozzle can be performed efficiently.

In the above application device, the management section has a nozzle cleaning section driving mechanism for driving the nozzle cleaning section, and the nozzle cleaning section driving mechanism also serves as the cleaning section driving section.

In this case, the maintenance section has a nozzle cleaning section driving mechanism for driving the nozzle cleaning section, and the nozzle cleaning section driving mechanism also serves as the cleaning section driving section, so that the nozzle cleaning section and the cleaning member can be moved integrally. As a result, the cleaning of the tip of the nozzle and the cleaning of the slit opening can be performed at the same timing, thereby improving the efficiency of the operation.

The above-described applicator further includes a housing portion capable of accommodating the cleaning member, and an access mechanism for allowing the cleaning member to move in and out of the housing portion.

In this case, it is possible to prevent foreign matter such as dust from adhering to the cleaning member by providing the accommodating portion capable of accommodating the cleaning member and the inserting / removing mechanism for inserting / removing the cleaning member into / from the accommodating portion. As a result, the cleaning member can be kept clean.

In the above applicator, the cleaning member is provided so as to be able to move integrally with the accommodating portion.

In this case, since the cleaning member is provided so as to be able to move integrally with the accommodating portion, it is possible to efficiently perform the entry and exit of the cleaning member in a short time.

In the above applicator, the cleaning member is formed in a film shape.

In this case, since the cleaning member is formed in a film shape, it can be surely inserted into the slit opening.

In the above applicator, the cleaning member is formed to be thinner toward the tip.

In this case, since the cleaning member is formed so as to become thinner toward the front end, it can be smoothly inserted into the slit opening.

The above-described applicator further includes an elevating mechanism for elevating and lowering the cleaning member with respect to the nozzle.

In this case, the cleaning member can be brought closer to the nozzle by further including an elevating mechanism for elevating the cleaning member with respect to the nozzle. As a result, the slit opening can be cleaned even when the nozzle is not actuated, so that an efficient operation can be performed.

The above-described applicator further comprises a position adjusting mechanism for adjusting the position of the cleaning member with respect to the slit opening.

In this case, by further including the position adjusting mechanism for adjusting the position of the cleaning member with respect to the slit opening, positioning of the cleaning member and the slit opening can be performed with high accuracy.

The above-described applicator further comprises a cleaning mechanism for cleaning the cleaning member.

In this case, the cleaning member is further provided with a cleaning mechanism for cleaning the cleaning member, so that the cleaning member can be maintained in a clean state.

According to the present invention, the nozzle cleaning operation can be performed efficiently.

1 is a perspective view showing a configuration of a coating device according to the present embodiment.
Fig. 2 is a front view showing a configuration of a coating device according to the embodiment; Fig.
3 is a plan view showing a configuration of a coating device according to the present embodiment.
4 is a side view showing a configuration of a coating device according to the embodiment;
5 is a view showing a configuration of a transport mechanism of the coating device according to the embodiment;
6 is a view showing a configuration of a nozzle cleaning apparatus of a coating apparatus according to the embodiment.
7 is a perspective view showing a configuration of a nozzle, a nozzle cleaning apparatus, and a cleaning apparatus according to the present embodiment.
8 is a perspective view showing a configuration of a cleaning apparatus according to the present embodiment.
Fig. 9 is a perspective view showing a configuration of a cleaning device according to the embodiment; Fig.
10 is a side view showing a configuration of a cleaning device according to the present embodiment.
11 is a view showing the operation of the application device according to the present embodiment.
12 is a view showing the operation of the coating device according to the present embodiment.
13 is a view showing the operation of the coating device according to the embodiment;
14 is a view showing the operation of the coating device according to the present embodiment.
15 is a view showing the operation of the coating device according to the embodiment;
16 is a view showing the operation of the application device according to the embodiment;
17 is a view showing the operation of the coating device according to the present embodiment.
18 is a view showing the operation of the application device according to the present embodiment.
19 is a view showing the operation of the coating device according to the present embodiment.
20 is a view showing another configuration of a coating device according to the present invention;
21 is a view showing another configuration of the cleaning device according to the present invention;
22 is a view showing another configuration of the cleaning device according to the present invention;
23 is a view showing another configuration of the cleaning apparatus according to the present invention.
24 is a view showing another configuration of the cleaning apparatus according to the present invention;

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a perspective view of a coating device 1 according to the present embodiment.

1, a coating apparatus 1 according to the present embodiment is a coating apparatus for coating a resist on a glass substrate used for a liquid crystal panel or the like, and includes a substrate carrying section 2, a coating section 3 ), A management unit 4, and a control unit CONT as main components.

The coating device 1 is configured such that a resist is coated on the substrate by a coating part (coating system) 3 while the substrate is lifted and conveyed by a substrate carrying part (substrate carrying system) 4 to control the state of the application unit 3. [ The control section CONT controls each section of the application device 1 in a general manner. 1, a cleaning device 50, which is one of the characteristic components of the present embodiment, is provided in the first vent portion 48 of the management portion 4. [

Fig. 2 is a front view of the coating device 1, Fig. 3 is a plan view of the coating device 1, and Fig. 4 is a side view of the coating device 1. Fig. With reference to these drawings, the detailed configuration of the application device 1 will be described.

(Substrate carrying section)

First, the configuration of the substrate transfer section 2 will be described.

The substrate carrying section 2 has a substrate carry-in area 20, a coating area 21, a substrate carry-out area 22, a carrying mechanism 23 and a frame part 24 for supporting them. In the substrate transfer section 2, the substrate S is transferred in order by the transfer mechanism 23 to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carrying-in area 20, the coating processing area 21 and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each portion of the substrate carry-in region 20, the coating region 21, and the substrate carry-out region 22.

Hereinafter, in describing the configuration of the application device 1, the direction in the drawing will be described using an XYZ coordinate system for simplicity of notation. And the conveying direction of the substrate is denoted as the X direction as the longitudinal direction of the substrate conveying section 2. [ The direction orthogonal to the X direction (substrate transport direction) as viewed from the plane is denoted as Y direction. The direction perpendicular to the plane including the X-directional axis and the Y-directional axis is denoted by the Z-direction. It is also assumed that the direction of the arrow in the figure is the + direction and the direction opposite to the direction of the arrow is the -direction in the X direction, the Y direction and the Z direction.

The substrate carry-in region 20 is a portion for carrying the substrate S carried from the outside of the apparatus and has a carry-in stage 25 and a lift mechanism 26. [

The carry-on stage 25 is provided on the upper portion of the frame portion 24 and is a rectangular plate-like member viewed from a plane formed of, for example, SUS. The carry-side stage 25 has a longer length in the X direction. The take-out side stage 25 is provided with a plurality of air spouting openings 25a and a plurality of lift-pin emerging holes 25b. The air jetting port 25a and the elevating pin protruding and retracting hole 25b are provided so as to pass through the carrying-in stage 25. [

The air jetting port 25a is a hole for jetting air onto the stage surface (conveying surface) 25c of the receiving-side stage 25. For example, in the region of the carrying-side stage 25 through which the substrate S passes They are arranged in a matrix in plan view. An air supply source (not shown) is connected to the air jet port 25a. In this carry-in stage 25, the substrate S can be lifted in the + Z direction by the air ejected from the air ejection port 25a.

The lift pin protruding and retracting hole 25b is provided in a region of the carrying-in side stage 25 where the substrate S is carried. The lift pin projecting / retracting hole 25b is configured such that the air supplied to the stage surface 25c is not leaked.

One alignment device 25d is provided at both ends of the carrying-in side stage 25 in the Y direction. The alignment apparatus 25d is a device for aligning the position of the substrate S carried in the carry- Each of the alignment devices 25d has an elongated hole and an aligning member provided in the elongated hole so as to mechanically sandwich the substrate carried on the carry-in side stage 25 from both sides.

The lift mechanism 26 is provided on the back side of the substrate carry-in position of the carry-in side stage 25. The lift mechanism 26 has a lift member 26a and a plurality of lift pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of lift pins 26b are raised from the upper surface of the elevation member 26a toward the carry-in side stage 25. Each of the lift pins 26b is disposed at a position overlapping with the lift pin projecting / recessing hole 25b in a plan view. As the elevating member 26a moves in the Z direction, each of the elevating pins 26b is caused to move up and down on the stage surface 25c from the elevating pin projecting and recessing hole 25b. The + Z direction end portions of the lift pins 26b are arranged so as to be aligned in the Z direction, and the substrate S carried from the outside of the apparatus can be held in a horizontal state.

The application region 21 is a region for applying a resist, and is provided with a processing stage 27 for floating the substrate S thereon. The processing stage 27 is a rectangular plate-shaped member viewed from a plane covered with a light absorbing material whose main component is hard alumite, for example, and the stage surface (conveying surface) 27c is a plate- In the + X direction.

Reflection of light such as laser light is suppressed in the portion of the processing stage 27 covered with the light absorbing material. The processing stage 27 has a longer length in the Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the carrying-in side stage 25 in the Y direction. The treatment stage 27 is provided with a plurality of air spouting ports 27a for spraying air on the stage surface 27c and a plurality of air suction ports 27b for sucking air on the stage surface 27c. The air blowing port 27a and the air suction port 27b are provided so as to penetrate through the processing stage 27. A plurality of grooves (not shown) are provided in the processing stage 27 to resist the pressure of the gas passing through the air ejection port 27a and the air suction port 27b. The plurality of grooves are connected to the air ejection port 27a and the air suction port 27b in the stage.

In the processing stage 27, the pitch of the air spouting port 27a is narrower than the pitch of the air spouting port 25a provided in the receiving-side stage 25, and the air spouting port 27a is denser than the receiving- have. In the treatment stage 27, an air suction port 27b is densely provided together with an air jet port 27a. As a result, the floating amount of the substrate can be controlled with high precision in the processing stage 27 as compared with other stages, so that the floating amount of the substrate is controlled to be, for example, 100 m or less, preferably 50 m or less It is possible. The processing stage 27 is provided with a detection section MS capable of detecting the distance between the stage surface 27c and the substrate S. [

The substrate carry-out region 22 is a portion for carrying the substrate S coated with the resist to the outside of the apparatus, and has a carry-out side stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the process stage 27 and is made of almost the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in area 20. The carry-out side stage 28 is provided with an air jet port 28a and a lift pin emergence hole 28b in the same manner as the carry side stage 25. [ The lift mechanism 29 is provided on the back side of the substrate carry-out position of the carry-out side stage 28, and is supported by, for example, the frame portion 24. The lift member 29a and the lift pins 29b of the lift mechanism 29 have the same configuration as the respective portions of the lift mechanism 26 provided in the substrate carry- The lift mechanism 29 can lift the substrate S by the lift pins 29b for lifting the substrate S when the substrate S on the carry-out side stage 28 is taken out to an external apparatus Respectively.

The transport mechanism 23 includes a first transport mechanism 60 and a second transport mechanism 61 as shown in Fig. 3, the first transport mechanism 60 holds the substrate S, and the second transport mechanism 61 disposed below the first transport mechanism 60 is not shown .

The first conveying mechanism 60 includes a conveying unit (holding unit) 60a, a vacuum pad (suction unit) 60b, a rail 60c, and a conveying unit 60a, And a moving mechanism (advancing / retracting mechanism) 63 for moving the parallel plane. The second transport mechanism 61 is capable of lifting (vertically moving) the transport device (holding portion) 61a, the vacuum pad (suction portion) 61b, the rail 61c and the transport device 61a (Advance / retreat mechanism) The rails 60c and 61c extend over the respective stages on the side of the carry side stage 25, the process stage 27 and the carry side stage 28. [

Each of the conveyers 60a and 61a is provided with a linear motor for example and the linear motors are driven to move the conveyers 60a and 61a on the rails 60c and 61c, So that it can be moved. That is, the conveyers 60a and 61a are provided with a function as a holding portion for holding the substrate S and a function as a driving portion for driving the holding portion. The conveyors 60a and 61a are configured so that the predetermined portions 60d and 61d overlap the -Y direction end portion of the substrate S when viewed in plan. The portions 60d and 61d overlapping the substrate S are arranged at positions lower than the height position of the back surface of the substrate when the substrate S floats.

The second transport mechanism 61 is disposed at the lower end of the stepped portion 24a of the frame portion 24 as compared with the first transport mechanism 60 as shown in Fig. In a plan view, the second transport mechanism 61 is disposed on the stage side with respect to the first transport mechanism 60.

As shown in Fig. 4, the second transport mechanism 61 is capable of accessing (advancing and retracting) the substrate S by raising the transport device 61a by the elevating mechanism 62. [ On the other hand, the first transporting mechanism 60 is capable of accessing (advancing and retracting) the substrate S by horizontally moving the transporting machine 60a on the plane parallel to the transporting surface of the substrate S by the moving mechanism 63, . The conveyor 60a of the first conveying mechanism 60 and the conveyor 61a of the second conveying mechanism 61 are independently movable.

For example, when the first transport mechanism 60 holds the substrate S, the transport machine 61a of the second transport mechanism 61, which does not hold the substrate S, 62 are lowered to stand downward and retreat from the conveying path of the first conveying mechanism 60 (conveyor 60a). When the second conveying mechanism 61 holds the substrate S, the conveying machine 60a of the first conveying mechanism 60, which does not hold the substrate S, is moved by the moving mechanism 63 -Y direction, and is retracted from the conveying path of the second conveying mechanism 61 (conveyor 61a).

3, a plurality of (three in this embodiment) vacuum pads 60b are provided in a portion 60d of the conveyor 60a overlapping with the substrate S along the conveying direction of the substrate S, Respectively. The vacuum pad 60b has an adsorption surface for vacuum adsorption of the substrate S, and the adsorption surface is arranged so as to face upward. The vacuum pad 60b is capable of holding the substrate S by adsorbing the back end of the substrate S by the adsorption surface. It is preferable that these vacuum pads 60b are held within 250 mm from the end on the front side in the carrying direction of the substrate S, and it is preferable that they are within 80 mm. Specifically, in the present embodiment, the conveyor 60a holds the substrate S such that the distance W from the end of the substrate S in the conveying direction to the vacuum pad 60b is within 80 mm. Thereby, the substrate S is uniformly held by the conveyor 60a, the substrate end is prevented from being slackened downward, and the substrate S can be conveyed in a state in which the substrate S is floated uniformly. Therefore, unevenness is prevented from occurring in the film which is dried and solidified on the resist coated on the substrate S.

The structure of the conveyor 61a in the second conveying mechanism 61 is not shown in Fig. 3, but has the same configuration as that of the conveyor 60a. In other words, three vacuum pads 61b in the conveyor 61a are disposed at positions overlapping the substrate S along the conveying direction of the substrate S.

Here, the configuration of the main parts of the conveyors 60a and 61a will be described. Since the conveyors 60a and 61a have the same configuration as described above, the present invention will be described with reference to Fig. 5, taking the conveyor 60a as an example. 5A is a plan view showing the main part of the conveyor 60a, and FIG. 5B is a view showing a sectional configuration of the main part of the conveyor 60a.

As shown in Fig. 5A, the vacuum pad 60b provided in the conveyor 60a has a substantially elliptical shape in plan view when viewed in contact with the substrate S. An evacuation hole 65 connected to a vacuum pump or the like (not shown) is provided inside the vacuum pad 60b. The vacuum pad 60b can evacuate the substrate S by evacuating a sealed space generated between the vacuum pad 60b and the substrate S through the exhaust hole 65. [

5 (b), a stopper member (position regulating member) 66 (FIG. 5 (b)) for regulating the position of the substrate S during conveyance is provided on the side of the vacuum pad 60b provided on the conveyor 60a. . The stopper member 66 has a convex portion 66a opposed to the side surface S1 of the substrate S and opposed to the lower surface side of the substrate S. [ The convex portion 66a functions as a stopper that restricts the bending of the substrate S downward. As shown in Fig. 5A, the convex portion 66a is provided so as to surround the periphery of the vacuum pad 60b in a frame shape. The upper surface of the convex portion 66a is preferably set in the range of -30 to + 30 占 퐉 with respect to the upper surface of the carry-in side stage 25, and it is preferable to set it in the vicinity of -20 占 퐉. The positional relationship between the convex portion 66a and the vacuum pad 60b is preferably set to about 0 to 1 mm above the vacuum pad 60b.

It is also possible to arrange the convex portions 66a between the adjacent vacuum pads 60b, that is, the convex portions 66a may surround the four sides of the respective vacuum pads 60b.

The vacuum pad 60b according to the present embodiment is displaceable with respect to the substrate S. In this specific embodiment, the vacuum pad 60b has a bellows portion 67 having a bellows structure. As a result, even when the substrate S deforms in height due to, for example, warping at the end of the substrate S, the vacuum pad 60b follows the movement of the substrate S, ) Can be reliably maintained. The vacuum pad 60b can displace the bellows portion 67 to suck the substrate S well even when the floating amount of the substrate S on the stage is changed.

(Coated portion)

Next, the configuration of the application unit 3 will be described.

The application portion 3 is a portion for applying a resist on the substrate S and has a door frame 31 and a nozzle 32. [

The door frame 31 has a support member 31a and a crosslinking member 31b and is provided so as to extend in the Y direction. One of the strut members 31a is provided on the Y direction side of the processing stage 27 and each strut member 31a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each of the support members 31a is provided such that the height position of the upper end thereof is aligned. The bridge member 31b is bridged between the upper end portions of the respective strut members 31a and is capable of being raised and lowered with respect to the strut member 31a.

The door frame 31 is connected to the moving mechanism 31c and is movable in the X direction. And the door frame 31 can be moved between the door frame 31 and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the door frame 31 is movable with respect to the management unit 4. [ Further, the door frame 31 is movable in the Z direction by a moving mechanism (not shown).

The nozzle 32 is formed in a long shape having a long length in one direction and is provided on the surface of the cross member 31b of the door frame 31 on the -Z direction side. A slit-shaped opening (slit opening) 32a is provided at the tip of the nozzle 32 in the -Z direction along its longitudinal direction, and the resist is discharged from the opening 32a. The nozzle 32 is arranged such that the longitudinal direction of the opening portion 32a is parallel to the Y direction and the opening portion 32a is opposed to the processing stage 27. [ The dimension in the longitudinal direction of the opening portion 32a is smaller than the dimension in the Y direction of the substrate S to be transported and the resist is not applied to the peripheral region of the substrate S. [ In the nozzle 32, a flow path (not shown) for passing the resist through the opening 32a is provided, and a resist supply source (not shown) is connected to the flow path. This resist supply source has, for example, a pump (not shown), and the resist is discharged from the opening portion 32a by extruding the resist into the opening portion 32a by the pump. A moving mechanism (not shown) is provided on the strut member 31a, and the nozzle 32 held by the crosslinking member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the cross member 31b. The opening 32a of the nozzle 32, that is, the distance in the Z direction between the tip of the nozzle 32 and the opposing surface facing the tip of the nozzle is formed on the lower surface of the bridge member 31b of the door- And a sensor 33 for measuring the temperature of the liquid.

(Management)

The configuration of the management unit 4 will be described.

The management section 4 is a section for managing the nozzles 32 so that the discharge amount of the resist (liquid body) discharged to the substrate S becomes constant, (On the upstream side in the substrate transport direction). The management section 4 includes a preliminary ejection mechanism 41, a dip tank 42, a nozzle cleaning device 43, a containing section 44 for containing the preliminary ejecting mechanism 41, a dip tank 42, And a holding member 45. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a.

The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order on the -X direction side. The dimension in the Y direction of each of the preliminary ejecting mechanism 41, the dip tank 42 and the nozzle cleaning device 43 is smaller than the distance between the supporting members 31a of the door frame 31, So that the frame 31 can be accessed across each part.

The preliminary ejection mechanism 41 is a part for preliminarily ejecting the resist. The preliminary ejection mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which a solvent such as a thinner or a coating liquid is stored. The nozzle cleaning device 43 is a device for rinsing the vicinity of the opening 32a of the nozzle 32 and has a cleaning mechanism (not shown) moving in the Y direction and a moving mechanism (not shown) for moving the cleaning mechanism . This moving mechanism is provided on the -X direction side of the cleaning mechanism. Since the nozzle cleaning device 43 is provided with the moving mechanism, the dimension in the X direction is larger than that of the preliminary ejection mechanism 41 and the dip tank 42. [ The arrangement of the preliminary ejecting mechanism 41, the dip tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and may be other arrangements.

Fig. 6 is a view showing a configuration of the nozzle cleaning device 43. Fig. 6 (a) shows a front view of the nozzle cleaning device 43, and FIG. 6 (b) shows a top view of the nozzle cleaning device 43, respectively.

6A and 6B, the nozzle cleaning device 43 includes a base 43a, a pad supporting member 43b, a pad 43c, an air knife air outlet 43d, a suction hole 43e, a cleaning liquid spray hole 43g, an air knife air outlet 43h, a support member 43i and a nozzle cleaning drive mechanism AC have.

The pad supporting member 43b is provided on the upper surface of the base body 43a and is arranged in pairs on the + X direction side and the -X direction side with respect to the center portion in the X direction of the base body 43a. The pair of pad supporting members 43b has a supporting surface 43s for supporting the pad 43c. The supporting surface 43s is formed in accordance with the shape of the tip of the nozzle 32. [ For example, in the drawing, a portion in which the height from the upper surface of the base body 43a is gradually lowered from the short sides of the base 43a in the + X direction to the center in the X direction in the pad supporting member 43b is formed And the portion where the height is gradually lowered is the support surface 43s.

The pad 43c is a member that is brought into contact with the nozzle tip 32c and its peripheral area 32d, and is made of, for example, a resin material. On each of the support surfaces 43s, pads 43c are arranged in a row, for example, in the Y direction. The upper surface 43f of the pad 43c has a shape corresponding to the nozzle tip 32c and its peripheral area 32d and the upper surface 43f of the pad 43c is connected to the nozzle tip 32c and the peripheral area 32d ), It comes into contact with a clearance. The pad 43c is provided in a position close to the air knife ejection port 43h in the X direction.

The air knife ejection port 43d is disposed at the end of the support surface 43s, and a pair of the air knife ejection port 43d is provided with a suction hole 43e therebetween. The air knife ejection port 43d is provided so as to face the peripheral region 32d such that the air knife is ejected to the peripheral region 32d of the nozzle tip 32c.

The suction hole 43e is a rectangular hole provided between the two pad supporting members 43b. The suction hole 43e is provided so as to pass through a region in the center of the base 43a in the X direction and is connected to a suction mechanism such as a pump 43p. The suction hole 43e has a rectangular shape in the Y direction, and overlaps with a part of the pad 43c in a plan view.

The cleaning liquid spouting hole 43g is a hole for spraying the cleaning liquid for cleaning the nozzle 32, and is provided in a slit shape along the X direction. The cleaning liquid spouting hole 43g corresponds to the pad 43c at the end on the + Y direction side and the second pad 43c from the end on the + Y direction side of the support surface 43s of the pad support member 43b And is provided on the + Y direction side of the pad 43c provided on each pad supporting member 43b. The respective cleaning liquid spray holes 43g are connected to a cleaning liquid supply source (not shown).

The air knife ejection port 43h is a portion for ejecting the air knife toward the nozzle 32 like the air knife ejection port 43d and has a slit shape along the Y direction on the support surface 43s of the pad support member 43b Respectively. The air knife ejection port 43h is disposed on the side of the pad 43c with respect to the sliding direction (Y direction) of the pad 43c in each of the support surfaces 43s.

The nozzle cleaning device 43 is not necessarily limited to the above configuration. For example, only the pad corresponding to the shape of the nozzle tip 32c may be provided. In addition, as long as it is possible to remove the liquid body attached to the nozzle tip 32c, the present invention is not limited to the above configuration and may have other configurations.

The support member 43i is provided to support the lower surface of the base 43a. The nozzle cleaning mechanism AC is connected to the support member 43i and is a drive unit for moving the support member 43i in the Y direction. As the nozzle cleaning mechanism AC is moved in the Y direction, the base body 43a is moved in the Y direction through the support member 43i. The nozzle cleaning device 43 is provided with the nozzle cleaning mechanism drive mechanism AC so that the dimension in the X direction is larger than that of the preliminary ejection mechanism 41 and the dip tank 42. [ Of course, the arrangement of the preliminary ejecting mechanism 41, the dip tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and may be other arrangements.

Fig. 7 is a perspective view showing the configuration of a part of the nozzle 32 and the management unit 4. Fig.

As shown in Fig. 7, the management unit 4 is provided with a first air starter 48 and a second air starter 49. The first base portion 48 is a portion located on the -Y side end portion of the accommodating portion 44. [ The second base portion 49 is a portion located on the + Y side end of the accommodating portion 44. The first and second base portions 48 and 49 are provided outside the moving path of the nozzle cleaning device 43, respectively. The first base portion 48 is a position where the base body 43a of the nozzle cleaning device 43 waits before the cleaning operation. The second base 49 is a position where the base 43a waits after the cleaning operation. A cleaning device 50 is provided in the first base portion 48. The cleaning device 50 cleans the opening 32a of the nozzle 32. [ The cleaning device 50 is disposed at a position on the -Y side with respect to the base 43a of the nozzle cleaning device 43. [

8 and 9 are perspective views showing the configuration of the cleaning device 50. As shown in Fig. 10 is a side view showing a configuration of the cleaning device 50. Fig.

8 to 10, the cleaning device 50 has a cleaning member 51, a container 52, and a cleaning member driving unit 53. As shown in Fig.

The cleaning member 51 is inserted into the opening 32a of the nozzle 32 and used. The cleaning member 51 is formed in a film shape. The cleaning member 51 is a structure in which resin is coated on the surface of the thin metal plate. In addition to the above-described metals, materials such as SUS, resin, and rubber may be used as the material of the thin plate constituting the cleaning member 51. [ The dimension of the cleaning member 51 in the longitudinal direction is, for example, about 40 mm, and the dimension of the cleaning member 51 in the short-length direction is about 10 mm, for example.

As shown in Fig. 10, the cleaning member 51 is formed such that the thickness (dimension in the X direction) gradually decreases from the end on the -Z side toward the end on the + Z side. The thickness t1 at the end on the -Z side of the cleaning member 51 is smaller than the dimension in the X direction of the cutting portion 32s and the opening 32a. The cleaning member 51 may have a uniform thickness (the thickness t1 and the thickness t2 may be the same), and the cleaning member 51 may have a configuration in which the thickness changes stepwise from the end on the -Z side to the end on the + Z side .

The container 52 has a concave portion 52a and a shaft portion 52b. The concave portion 52a is formed on the surface of the container 52 on the + Z side. The recess 52a is formed to have a larger size than the outer shape of the cleaning member 51, and the cleaning member 51 can be accommodated. The shaft portion 52b is provided inside the concave portion 52a to rotatably support the cleaning member 51. [ The cleaning member 51 is housed in the concave portion 52a as shown in Fig. 9 by rotating the cleaning member 51 in the X direction about the shaft portion 52b from the state shown in Fig.

8 shows a state in which the longitudinal direction of the cleaning member 51 is arranged to be parallel to the Z direction. In this state, the length of the cleaning member 51 exposed from the container 52 is the longest. Even if a configuration for fixing the posture of the cleaning member 51 such as a stopper mechanism not shown in the container 52 is provided in order to keep the longitudinal direction of the cleaning member 51 parallel to the Z direction, none. The shaft portion 52b may be rotatable by a motor mechanism or the like (not shown). In this case, the shaft portion 52b is rotated by the control by the control unit CONT, so that the cleaning member 51 can be moved in and out.

The cleaning member driving unit 53 moves the cleaning member 51 for each container 52. The container 52 is mounted on the guide member 53a. The guide member 53a is a rod-like member extending parallel to the Y direction. One end of the guide member 53a is disposed in the first air bearing portion 48 and the other end is disposed in the second air bearing portion 49. [ The cleaning member driving unit 53 moves the cleaning member 51 between the first standby portion 48 and the second standby portion 49 along the guide member 53a. As the cleaning member driving unit 53, for example, an actuator such as an air cylinder mechanism or a motor mechanism can be used.

Next, the operation of the coating device 1 configured as described above will be described.

Figs. 11 to 13 are plan views showing the operation process of the application device 1. Fig. The operation of applying a resist to the substrate S will be described with reference to the respective drawings. In this operation, the substrate S is carried into the substrate carry-in area 20, the resist S is applied in the coating area 21 while the substrate S is lifted and transported, and the substrate S coated with the resist S Out from the substrate carry-out area 22. 11 to 13, only the outline of the door frame 31 and the management section 4 is shown by a broken line, so that the configuration of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, the detailed operation in each part will be described.

Before the substrate is brought into the substrate carry-in area 20, the coating apparatus 1 is put in standby. More specifically, the conveyor 60a of the first conveying mechanism 60 is disposed on the -Y direction side of the substrate carry-in position of the carry-on stage 25, and the height position of the vacuum pad 60b is set to the floating height of the substrate The air suction port 27a of the processing stage 27 and the air suction port 27b and the air outlet port 28a of the carry-out side stage 28, ) So that air is supplied to such a degree that the substrate floats on the surface of each stage.

When the substrate S is transported from the outside to the substrate carry-in position shown in Fig. 3 by a transporting arm (not shown) or the like in this state, the lift member 26a is moved in the + Z direction, Is protruded from the lift pin projecting hole 25b to the stage surface 25c. Then, the substrate S is picked up by the lift pins 26b, and the substrate S is picked up. Further, the aligning member is projected from the long hole of the alignment device 25d to the stage surface 25c.

After the substrate S is received, the elevating member 26a is lowered to accommodate the elevating pin 26b in the elevating pin protruding and retracting hole 25b. At this time, since a layer of air is formed on the stage surface 25c, the substrate S is held floating with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment of the substrate S is performed by the alignment member of the alignment device 25d, and the first transport mechanism The vacuum pad 60b of the conveyor 60a can be vacuum-adsorbed to the -Y direction side end portion of the substrate S by the moving mechanism 63 of the transfer mechanism 60 (Fig. 3). After the -Y direction side end portion of the substrate S is sucked by the vacuum pad 60b, the conveyor 60a is moved along the rail 60c. The substrate S moves smoothly along the rail 60c even if the driving force of the conveyor 60a is relatively small because the substrate S is floating.

When the leading end of the substrate S in the carrying direction reaches the processing stage 27, the control section CONT uses the detection section MS to determine the distance between the -Z side surface of the substrate S and the stage surface 27c (Floating amount). 11, when the leading end of the substrate S in the carrying direction reaches the position of the opening 32a of the nozzle 32, the resist 32 is moved from the opening 32a of the nozzle 32 toward the substrate S, . The resist is ejected while the position of the nozzle 32 is fixed and the substrate S is conveyed by the conveyor 60a.

The control unit CONT may adjust the floating amount of the substrate S based on the detection result of the detection unit MS. In this case, for example, the control unit CONT can adjust the floating amount of the substrate S by adjusting the air ejection amount from the air ejection port 27a and the suction amount of the air suction port 27b.

The control unit CONT controls the substrate S to be transferred from the outside to the other substrate S by a transfer arm or the like (not shown) while the resist S is being applied to the substrate S carried by the first transfer mechanism 60 &Quot;). The control unit CONT receives the substrate S 'and then moves down the elevating member 26a so that the elevating pin 26b is accommodated in the elevating pin projecting and recessing hole 25b so that the substrate S' And is kept floating with respect to the surface 25c.

When the substrate S 'reaches the surface of the air layer, the controller CONT causes the alignment of the substrate S by the alignment member of the alignment device 25d. Thereafter, the control section CONT raises the conveyor 61a by the elevating mechanism 62 of the second conveying mechanism 61 disposed on the -Z direction side of the substrate carry-in position, (S) in the -Y direction. The control unit CONT appropriately detects the floating amount of the substrate S 'in the same manner as the substrate S described above.

The conveyor 60a of the first conveying mechanism 60 and the conveyor 61a of the second conveying mechanism 61 can move independently of each other. The other substrate S 'can be transported onto the stage by the second transport mechanism 61 before the resist coating process on the substrate S transported by the transport mechanism 61 is completed. Therefore, the resist can be satisfactorily coated on the substrates S and S ', which are successively transferred in the stationery state, and a high yield can be obtained in the resist coating process.

On the other hand, with the movement of the substrate S, the resist film R is coated on the substrate S as shown in Fig. The resist film R is formed in a predetermined region of the substrate S by passing the substrate S under the opening portion 32a through which the resist is discharged. The control unit CONT controls the conveyor 61a of the second conveying mechanism 61 to move the substrate S 'below the opening 32a.

The substrate S on which the resist film R is formed is conveyed to the carry-out side stage 28 by the conveyor 60a. In the carry-out side stage 28, the substrate S is transported to the substrate carry-out position shown in Fig. 13 while being lifted up against the stage surface 28c. Another substrate S 'conveyed by the conveyor 61a passes under the opening portion 32a to form a resist film R on a predetermined region of another substrate S'.

After the substrate S reaches the substrate carry-out position, the control portion CONT releases the attraction of the vacuum pad 60b and moves the elevation member 29a of the lift mechanism 29 in the + Z direction. The lift pin 29b protrudes from the lift pin protruding and retracting hole 28b to the back surface of the substrate S and the substrate S is lifted by the lift pins 29b. In this state, the control unit CONT accesses an external transfer arm provided on the + X direction side of the carry-out side stage 28, for example, to the carry-out side stage 28 to receive the substrate S. After the substrate S is transferred to the transfer arm, the control section CONT controls the first transfer mechanism 60 to retract the transfer device 60a (vacuum pad 60b) from the lower side of the substrate S, And retracts the substrate S 'from the conveying path (moving path) of the second conveying mechanism 61 that is conveying the substrate S'.

In this state, the control unit CONT causes the first transport mechanism 60 to return to the substrate carry-in position of the carry-side stage 25 again, and waits until the next substrate is transported. 13, the resist is applied to the substrate S 'conveyed to the second conveying mechanism 61. However, as described above, the first conveying mechanism 60 is configured to apply the resist to the second conveying mechanism 61, it is not brought into contact with the second transport mechanism 61 and is ended. Therefore, the first transport mechanism 60 can return to the substrate carry-in position of the carry-in side stage 25 without disturbing the transport of the other substrate S '.

After the substrate S 'conveyed by the second conveying mechanism 61 reaches the substrate carry-out position, the control unit CONT controls the substrate S S '). After the substrate S 'is carried out by the external transfer arm, the control section CONT causes the second transfer mechanism 61 to return to the substrate carry-in position of the carry-in side stage 25 again, Wait until it becomes.

As described above, the substrate is transported to the application unit 3 at a time interval. For this reason, the control unit CONT causes the coating unit 3 to perform a maintenance operation for maintaining or improving the discharge state of the nozzles 32 by using a period during which the substrate is not transported. The management unit 4 is used for the management operation.

The control unit CONT moves the door frame 31 to the position of the management unit 4 in the -X direction by the moving mechanism 31c as shown in Fig. The door frame 31 is moved to the position of the management unit 4 and then the position of the door frame 31 is adjusted first to allow the tip of the nozzle 32 to access the nozzle cleaning apparatus 43, The nozzle tip 32c is cleaned by the cleaning device 43. [

In the cleaning operation by the nozzle cleaning device 43, the cleaning liquid is jetted toward the peripheral area 32d of the opening 32a at the tip of the nozzle 32, and the nozzle cleaning device 43 Scan in + Y direction. At this time, as shown in Fig. 15, the control unit CONT causes the upper surface 43f of the pad 43c to abut the nozzle tip 32c and the peripheral area 32d. Since the upper surface 43f corresponds to the shape of the nozzle tip 32c and the peripheral area 32d, the upper surface 43f abuts against the nozzle 32 so that there is no gap between the upper surface 43f and the nozzle 32. [ Further, as shown in Fig. 15, the control unit CONT sucks the surrounding atmosphere in the suction hole 43e.

In this state, as shown in Fig. 16, the cleaning liquid is ejected from the cleaning liquid ejection hole 43g of the nozzle cleaning device 43, and the air knife is ejected from the air knife ejection port 43d and the air knife ejection port 43h And the nozzle cleaning device 43 is scanned. With this scanning, the pad 43c scans the nozzle tip 32c and the peripheral area 32d of the nozzle 32 together with the cleaning liquid to scrape off the cleaning liquid. The nozzle tip 32c and the peripheral area 32d are dried.

The air knife ejected from the air knife ejection port 43d and the air knife ejection port 43h is blown into the peripheral region 32d of the nozzle 32 to dry the peripheral region 32d. Since the air knife jetting port 43d is provided at the rear end in the sliding direction, it is dried after sliding by the pad 43c. In addition, the cleaning liquid and the removed deposit are sucked into the suction holes 43e by the air blowing and the suction in the suction holes 43e. Thus, the nozzle tip 32c is cleaned.

After cleaning the nozzle tip 32c, the control unit CONT causes the cleaning unit 50 to perform a cleaning operation on the opening 32a of the nozzle 32 after cleaning. As shown in Fig. 17, even after cleaning the nozzle tip 32c, the adherend 99 may remain inside the opening 32a. Since the adherend 99 may affect the discharge characteristics of the liquid body, the adherend 99 is removed by a cleaning operation.

Until the cleaning operation is performed, the control unit CONT causes the first cleaning unit 48 to wait the cleaning device 50. Since the first vent hole 48 is provided at a position deviated from the movement path of the nozzle cleaning device 43, the first vent hole 48 is provided in the nozzle cleaning device 43 The cleaning operation is not interrupted.

The control unit CONT moves the cleaning member 51 to the -Z side of the opening 32a of the nozzle 32. In this case, In the present embodiment, first, the control portion CONT is arranged on the -Z side of the -Y side end portion of the opening portion 32a. In this state, the control unit CONT projects the cleaning member 51 from the recess 52a of the container 52 as shown in Fig. With this operation, the + Z side end portion of the cleaning member 51 is inserted into the opening portion 32a.

After the end on the + Z side of the cleaning member 51 is inserted into the opening 32a, the control unit CONT moves the cleaning member 51 to the -Y side for each container 52 by the cleaning member driving unit 53 , The cleaning member 51 reaches the -Y side of the opening 32a. After the cleaning member 51 reaches the -Y side end portion of the opening portion 32a, the control portion CONT moves the cleaning member 51 in the + Y direction for each container 52 by the cleaning member driving portion 53 .

18 is a view showing a state in which the nozzle 32 is cut into a plane parallel to the XZ plane. 18, since the thickness (t2: see Fig. 10) of the tip portion on the + Z side in the cleaning member 51 is smaller than the dimension in the X direction of the opening portion 32a, the cleaning member 51 has the opening 32a ) To the + Y side.

When the cleaning member 51 moves the opening 32a toward the + Y side, the adherend 99 remaining in the opening 32a is peeled off to the cleaning member 51. Therefore, the deposit 99 is removed from the opening 32a. The control unit CONT moves the cleaning member 51 to the + Y side end portion of the opening portion 32a and accommodates the cleaning member 51 in the recessed portion 52a of the container 52. Then, Thereafter, the control unit CONT moves the cleaning member 51 to the second standby portion 49, and waits for the cleaning member 51 at the second standby portion 49.

After performing the cleaning operation on the opening portion 32a, the nozzle 32 is accessed to the preliminary ejection mechanism 41. Then, The opening 32a at the tip of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary ejection surface in the preliminary ejecting mechanism 41, The resist is preliminarily ejected from the opening 32a while moving in the -X direction.

After the preliminary ejecting operation is performed, the door frame 31 is returned to its original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in Fig. After returning the door frame 31 to its original position, the control unit CONT returns the cleaning member 51 and the container 52 to the first air bag 48. [ As described above, by repeating the coating operation of applying the resist film R to the substrate S and the preliminary discharging operation, a high quality resist film R is formed on the substrate S.

Further, the nozzle 32 may be accessed in the dip tank 42 whenever necessary, for example, every predetermined number of times of access to the management section 4. In the dip tank 42, the opening 32a of the nozzle 32 is exposed to the vapor atmosphere of the solvent (thinner) stored in the dip tank 42, thereby preventing the nozzle 32 from drying.

As described above, according to the present embodiment, the opening portion 32a can be cleaned by moving the cleaning member 51 inserted in the opening portion 32a in the longitudinal direction of the opening portion 32a. Thereby, the opening 32a can be automatically cleaned without depending on manual operation, so that the cleaning work for the nozzle 32 can be efficiently performed.

The technical scope of the present invention is not limited to the above embodiment, and can be appropriately changed within the scope of the present invention.

For example, in the above-described embodiment, the first conveying mechanism 60 and the second conveying mechanism 61 each include the conveyers 60a and 61a, respectively. However, the present invention is not limited thereto It does not.

As shown in Fig. 20, three rails 60a may be provided on the rail 60c as the first transporting mechanism 60. In Fig. Although not shown in Fig. 20, the second conveying mechanism 61 can also be provided with three conveyers 61a. Although the present invention is described with respect to the configuration in which three conveyers 60a and 61a are provided, the present invention is not limited to this configuration. The present invention is also applicable to a case in which two or more conveyers 60a and 61a are provided It is also applicable to the configuration.

20, the first conveyor 161, the second conveyor 162, and the third conveyor 163 are indicated in order from the upstream side of the substrate S in the conveying direction. When these are collectively referred to, they are denoted by conveyors 161, 162, and 163.

These conveyors 161, 162, and 163 move on the rails 60c in synchronism with each other when the substrate S is conveyed. The conveyors 161, 162, and 163 are independently movable on the rails 60c when the substrate S is not conveyed. According to this configuration, the holding position of the substrate S in each of the conveyers 161, 162, and 163 can be arbitrarily set according to the length of the substrate S to be conveyed.

The vacuum pad 60b of the conveyor 161 is preferably held within 250 mm from the end on the front side in the conveying direction of the substrate S and is preferably set within 80 mm. More specifically, the conveyor 161 holds the substrate S such that the distance W1 from the end of the substrate S in the conveying direction to the vacuum pad 60b is within 80 mm.

It is preferable that the vacuum pad 60b of the conveyor 163 is kept within 250 mm from the end of the substrate S on the rear side in the conveying direction, and is preferably set within 80 mm. More specifically, the conveyor 163 holds the substrate S such that the distance W2 from the end of the substrate S in the conveying direction rearward to the vacuum pad 60b is within 80 mm.

The substrates S are uniformly held by these conveyors 161, 162 and 163 and the substrate end portion is prevented from being stretched and the large substrate S can be conveyed in a state in which the substrates S are floated uniformly. Therefore, it is possible to prevent the occurrence of unevenness in the film which is dried and solidified on the resist coated on the large-sized substrate S.

In the above embodiment, the cleaning device 50 and the nozzle cleaning device 43 are separately provided. However, the present invention is not limited to this. For example, the cleaning device 50 may be provided in the nozzle cleaning device 43 as shown in Fig. In the configuration shown in Fig. 21, the cleaning device 50 is provided integrally with the nozzle cleaning device 43. Fig. More specifically, the container 52 of the cleaning device 50 is fixed to the base 43a of the nozzle cleaning device 43. As shown in Fig.

In this configuration, the cleaning device 50 moves integrally with the base 43a by moving the base 43a of the nozzle cleaning device 43 using the nozzle cleaning mechanism AC. Therefore, the nozzle cleaning driving mechanism AC also serves as a driving unit for driving the cleaning device 50. [ Therefore, it is not necessary to separately provide a driving unit for moving each device, and space saving and control system can be simplified.

21, as a cleaning method and a cleaning method in a configuration in which the nozzle cleaning device 43 is disposed on the + Y side and the cleaning device 50 is disposed on the -Y side, . First, in the case where solidified liquid or solid body adheres to the opening portion 32a of the nozzle 32, the cleaning liquid is infiltrated into the opening portion 32a by using the nozzle cleaning device 43. [ Thereafter, the opening 32a is cleaned by using the cleaning member 51, and finally the nozzle tip 32c is cleaned by using the nozzle cleaning device 43 to finish.

21, the nozzle cleaning device 43 is disposed on the + Y side and the cleaning device 50 is disposed on the -Y side. However, the present invention is not limited to this, and the cleaning device 50 may be disposed on the + Y side, and the nozzle cleaning device 43 may be disposed on the -Y side. In this case, since the nozzle tip 32c can be cleaned by using the nozzle cleaning device 43 after cleaning the opening 32a by the cleaning member 51, the nozzle tip 32c is made in a normal state , It can be moved to the coating operation immediately.

In the above embodiment, the cleaning member 51 is inserted into the opening 32a and then the cleaning member 51 is moved to the -Y side to reach the -Y side end of the opening 32a as an example But the present invention is not limited to this. For example, when the cleaning member 51 is inserted into the opening portion 32a, the cleaning member 51 is moved in the + Y direction to reach the + Y side end portion of the opening portion 32a, 51 may be moved in the -Y direction to reach the -Y side end of the opening portion 32a. In this case, the cleaning member 51 may be moved in the -Y direction immediately after reaching the + Y side end portion of the opening portion 32a, and once the cleaning member 51 is moved from the + Y side end portion of the opening portion 32a It may be left to stand by.

22, the elevating mechanism 54 for elevating and lowering the cleaning member 51 with respect to the nozzle 32 may be provided in addition to the configuration of the above embodiment. 22 shows a state in which the nozzle 32 is cut off in a plane parallel to the XZ plane. The elevating mechanism 54 has an elevating guide member 54a and a moving mechanism 54b. The elevation guide member 54a is provided in parallel in the Z direction. The elevation guide member 54a is provided movably in unison with the guide member 53a.

The moving mechanism 54b is fixed to the container 52. [ The moving mechanism 54b has, for example, an actuator (not shown) such as a motor mechanism. The moving mechanism 54b is provided so as to be movable along the extending direction of the elevation guide member 54a by the actuator. As the moving mechanism 54b moves, the container 52 and the cleaning member 51 move up and down in the Z direction. As described above, since the cleaning member 51 is moved up and down in the Z direction, the opening 32a can be cleaned without moving the nozzle 32, thereby enabling efficient operation.

In addition to the configuration of the above-described embodiment, a cleaning mechanism 55 for cleaning the cleaning member 51 may be provided as shown in Fig. The cleaning mechanism 55 has a cleaning liquid supply portion 55a and a cleaning liquid discharge opening 55b. The cleaning mechanism 55 may be disposed, for example, in the first or second base portion 48 or 49. [

The cleaning mechanism 55 discharges the cleaning liquid supplied from the cleaning liquid supply portion 55a to the cleaning member 51 from the cleaning liquid discharge opening 55b. With this configuration, it is possible to clean the cleaning member 51 with the cleaning liquid, and keep the cleaning member 51 in a clean state. The structure for cleaning the cleaning member 51 is not limited to the structure for discharging the cleaning liquid, and the cleaning member 51 may be cleaned by using an air knife or may be cleaned by a dipping method.

24, a position adjusting mechanism 56 for adjusting the position of the cleaning member 51 with respect to the opening 32a of the nozzle 32 may be provided in addition to the configuration of the above embodiment . 24 shows a state in which the nozzle 32 is cut off in a plane parallel to the XZ plane. 24 shows a configuration in which an image pickup device 56a is provided as an example of the position adjusting mechanism 56. [ The imaging device 56a images the end on the + Z side of the cleaning member 51 and the opening 32a of the nozzle 32. [

The imaging result of the imaging device 56a is transmitted to, for example, the control unit CONT. In the control unit CONT, the positional relationship between the end on the + Z side of the cleaning member 51 and the opening 32a is calculated, and when the position is deviated, the position is adjusted using the cleaning member driving unit 53 . The image pickup device for picking up the cleaning member 51 and the image pickup device for picking up the opening 32a may be separately provided. With such a configuration, positioning between the opening 32a and the cleaning member 51 can be performed with high accuracy.

In the above-described embodiment, the structure in which the container 52 accommodating the cleaning member 51 is provided is described as an example, but the present invention is not limited to this. For example, the container 52 may not be provided. In this case, the cleaning member 51 is always exposed.

In the above embodiment, the cleaning member 51 is exposed or accommodated in the container 52 by rotating about the shaft portion 52b of the container 52. However, the present invention is not limited to this. For example, the cleaning member 51 may be configured to move in parallel in the Z direction so as to expose and accommodate the container 52.

The above-described constituent elements are not limited to the form provided independently, but can be suitably combined and used as required.

CONT ... Control unit AC ... The nozzle cleaning mechanism driving mechanism
S ... Substrate 4 ... Management
43 ... The nozzle cleaning device 43a ... gas
50 ... Cleaning device 51 ... Cleaning member
52 ... The container 52a ... Concave portion
52b ... Shaft 53 ... The cleaning member driver
53a ... The guide member 54 ... Elevator
54a ... The elevation guide member 54b ... Mobile mechanism
55 ... The cleaning mechanism 55a ... The cleaning liquid supply portion
55b ... Cleaning liquid discharge port 56 ... Position adjusting mechanism
56a ... The image pickup device

Claims (11)

A coating portion having a nozzle provided with a slit opening for discharging the liquid body with respect to the substrate,
A driving unit for driving at least one of the substrate and the nozzle so that the substrate and the nozzle move relatively;
A cleaning member insertable into the slit opening,
A cleaning member driving unit for moving the cleaning member in the longitudinal direction of the slit opening,
A receiving portion capable of receiving the cleaning member,
And an inserting / removing mechanism for inserting / ejecting the cleaning member into / from the accommodating portion. The method according to claim 1,
Further comprising a management unit for managing the state of the tip of the nozzle,
Wherein the cleaning member is provided in the management unit. The method of claim 2,
Wherein the management section has a nozzle cleaning section for cleaning the front end of the nozzle,
Wherein the cleaning member is provided in the nozzle cleaning unit. The method of claim 3,
Wherein the control unit has a nozzle cleaning driving mechanism for driving the nozzle cleaning unit,
Wherein the nozzle cleaning mechanism driving mechanism also serves as the cleaning member driving unit. 5. The method according to any one of claims 1 to 4,
Wherein the cleaning member is provided movably in unison with the accommodating portion. 5. The method according to any one of claims 1 to 4,
Wherein the cleaning member is formed in a film shape. The method of claim 6,
Wherein the cleaning member is formed to be thinner toward the front end. 5. The method according to any one of claims 1 to 4,
And an elevating mechanism for elevating and lowering the cleaning member with respect to the nozzle. 5. The method according to any one of claims 1 to 4,
And a position adjusting mechanism for adjusting a position of the cleaning member with respect to the slit opening. 5. The method according to any one of claims 1 to 4,
And a cleaning mechanism for cleaning the cleaning member. delete

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