JP6641209B2 - Protective member forming device - Google Patents

Protective member forming device Download PDF

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JP6641209B2
JP6641209B2 JP2016056711A JP2016056711A JP6641209B2 JP 6641209 B2 JP6641209 B2 JP 6641209B2 JP 2016056711 A JP2016056711 A JP 2016056711A JP 2016056711 A JP2016056711 A JP 2016056711A JP 6641209 B2 JP6641209 B2 JP 6641209B2
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film
wafer
liquid resin
stage
holding
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JP2017174883A (en
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徹雄 久保
徹雄 久保
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は、ウエーハの一方の面の全面に保護部材を形成する保護部材形成装置に関する。   The present invention relates to a protection member forming apparatus for forming a protection member on one entire surface of a wafer.

ウエーハなどの製造工程においては、円柱状のインゴットをワイヤーソーによってスライスして円形板状のウエーハを形成するときに、ウエーハに反りやうねりが形成されることがある。反りやうねりを除去するために、例えば、ウエーハの一方の面に樹脂層からなる保護部材を形成して、ウエーハの他方の面を研削してウエーハの反りやうねりを除去している。   In a manufacturing process of a wafer or the like, when a cylindrical ingot is sliced by a wire saw to form a circular plate-shaped wafer, the wafer may be warped or undulated. In order to remove warpage and undulation, for example, a protection member made of a resin layer is formed on one surface of the wafer, and the other surface of the wafer is ground to remove the warp and undulation of the wafer.

ウエーハの一方の面に保護部材を形成するためには、例えば、ステージ上に載置されたフィルムの上に液状樹脂を滴下し、ステージの上方で保持手段に保持されたウエーハを、その一方の面側から透明のフィルムに対して上方から押し付けてウエーハの中心から外周側に向けて液状樹脂を拡張させ該一方の面の全域に液状樹脂をいきわたらせた後、この液状樹脂に紫外線を照射することにより液状樹脂を硬化させる方法がある（例えば、下記の特許文献１を参照）。   In order to form a protective member on one surface of the wafer, for example, a liquid resin is dropped on a film placed on a stage, and the wafer held by holding means above the stage is placed on one side of the wafer. After pressing the transparent film from above against the transparent film from the surface side to expand the liquid resin from the center of the wafer to the outer peripheral side and let the liquid resin spread over the entire area of the one surface, the liquid resin is irradiated with ultraviolet rays. Thus, there is a method of curing a liquid resin (for example, see Patent Document 1 below).

特開２０１２−１４６８７２号公報JP 2012-146872 A

ここで、保護部材を形成しようとするウエーハのサイズが大きくなると、フィルムも大きな面積が必要になり、フィルムとステージとの間に空気が混入する。空気が混入した状態で、ウエーハの一方の面で液状樹脂を押し拡げると、フィルムとステージとの間から空気が逃げず、空気が残った部分において気泡が発生してフィルムが持ち上がってしまい、保護部材が薄く形成されてしまう。そのため、フィルムとステージとの間の空気を除去してから、液状樹脂を押し拡げる必要がある。   Here, when the size of the wafer on which the protection member is to be formed increases, the film also requires a large area, and air enters between the film and the stage. If liquid resin is pushed and spread on one side of the wafer with air mixed in, air will not escape from the space between the film and the stage, bubbles will be generated in the area where air remains, and the film will lift up, protecting The member is formed thin. Therefore, it is necessary to push out the liquid resin after removing the air between the film and the stage.

例えば、ポーラス部材でステージを構成すれば、ウエーハの一方の面で液状樹脂を押し拡げると同時に空気を排出できると考えられるが、ポーラス部材では、液状樹脂を押し拡げる押力に耐えられる強度を確保する必要があるため、ステージを厚く形成したり、補強材をステージに備えたりする必要がある。ステージを厚く形成したり、補強材をステージに備えたりすると、ウエーハの一方の面において押し拡げられた液状樹脂に紫外線を照射しても液状樹脂が硬化するのに時間がかかるという問題がある。そのため、ステージの強度を弱めずに、かつ液状樹脂の硬化を妨げないようにするためには、例えば、石英ガラスでステージを構成する必要があるが、かかるステージを用いても、フィルムとステージとの間から空気をすばやく除去することが困難となっている。   For example, if the stage is composed of a porous member, it is considered that the liquid resin can be pushed and spread on one side of the wafer and the air can be exhausted at the same time. Therefore, it is necessary to form the stage thickly or to provide a reinforcing material to the stage. If the stage is formed thick or a reinforcing material is provided on the stage, there is a problem that it takes a long time for the liquid resin to cure even if the liquid resin pushed and spread on one surface of the wafer is irradiated with ultraviolet rays. Therefore, in order not to weaken the strength of the stage and not to hinder the curing of the liquid resin, it is necessary to configure the stage with, for example, quartz glass. It is difficult to quickly remove the air from between.

本発明は、上記の事情に鑑みてなされたもので、フィルムとステージとの間に介在する空気をすばやく除去できるようにすることを目的としている。   The present invention has been made in view of the above circumstances, and has as its object to quickly remove air interposed between a film and a stage.

本発明は、ウエーハの一方の面の全面に液状樹脂を押し拡げて硬化させ保護部材を形成する保護部材形成装置であって、フィルムを吸引保持するフィルム保持面にウエーハの直径より僅かに大きい直径のリング状の吸引部を有するステージと、該ステージが吸引保持するフィルムの上に液状樹脂を供給する液状樹脂供給手段と、該フィルム保持面に対面しウエーハを保持するウエーハ保持面を有する保持手段と、該保持手段と該ステージとを相対的に接近する方向に移動させ該フィルムの上に供給された液状樹脂を押し拡げる拡張手段と、該拡張手段によりウエーハの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段と、を備え、さらに、該フィルムの上に液状樹脂を供給する前に該フィルム保持面と該フィルムとの間の空気を除去する空気除去手段を備え、該空気除去手段は、該フィルム保持面に保持されたフィルムの上に該フィルム保持面全面を覆うことができる面積のゴム板を載置するゴム板載置手段と、該ウエーハの直径以上の長さで延在するローラと、該ステージに吸引保持された該フィルムの上に載置された該ゴム板の上を該フィルム保持面に向けて押し付けながら該ローラを転動させる移動部と、を備える。 The present invention is a protective member forming apparatus for forming a protective member by pressing and spreading a liquid resin over the entire surface of one surface of a wafer, and forming a protective member on a film holding surface for sucking and holding a film. A stage having a ring-shaped suction part, a liquid resin supply means for supplying a liquid resin onto a film sucked and held by the stage, and a holding means having a wafer holding surface facing the film holding surface and holding a wafer Expanding means for moving the holding means and the stage in a direction of relatively approaching to spread the liquid resin supplied on the film; and expanding the liquid resin supplied on the film over the entire surface of one surface of the wafer. Curing means for curing the liquid resin thus obtained, and further comprising: An air removing means for removing, air removal means includes a rubber plate mounting means for mounting a rubber plate area which can be on top of the film held by the holding surface film covering the film holding surface entire A roller extending at least as long as the diameter of the wafer , and pressing the rubber plate placed on the film sucked and held on the stage against the film holding surface while pressing the rubber plate against the film holding surface. A moving unit for rolling.

本発明にかかる保護部材形成装置は、フィルムを吸引保持するフィルム保持面にウエーハの直径より大きい直径のリング状の吸引部を有するステージと、ステージが吸引保持するフィルムの上に液状樹脂を供給する液状樹脂供給手段と、フィルム保持面に対面しウエーハを保持するウエーハ保持面を有する保持手段と、保持手段とステージとを相対的に接近する方向に移動させフィルムの上に供給された液状樹脂を押し拡げる拡張手段と、拡張手段によりウエーハの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段と、を備え、さらに、フィルムの上に液状樹脂を供給する前にフィルム保持面とフィルムとの間の空気を除去する空気除去手段を備え、空気除去手段は、ウエーハの直径以上の長さで延在するローラと、ステージに吸引保持されたフィルムをフィルム保持面に向けて押し付けながらローラを転動させる移動部とを備えたため、ローラの押圧力によりフィルム保持面とフィルムとの間に介在する空気をすばやく除去することができる。
したがって、ステージの強度を弱めることなく、液状樹脂の硬化時間を長くせずに、均一な厚みの保護部材をウエーハの一方の面に形成することが可能となる。 A protection member forming apparatus according to the present invention supplies a stage having a ring-shaped suction portion having a diameter larger than the diameter of a wafer on a film holding surface for sucking and holding a film, and supplies a liquid resin onto the film held by the stage. Liquid resin supply means, holding means having a wafer holding surface facing the film holding surface and holding the wafer, and moving the holding means and the stage in a direction of relatively approaching each other to supply the liquid resin supplied on the film. Expanding means for expanding, and a curing means for curing the liquid resin which has been spread over the entire surface of one side of the wafer by the expanding means, further comprising a film holding surface before supplying the liquid resin onto the film. Air removing means for removing air between the film and the film, the air removing means comprising a roller extending at least equal to the diameter of the wafer, and a stage. Since a moving portion that rolls the roller while pressing the film held by suction toward the film holding surface is provided, the air interposed between the film holding surface and the film can be quickly removed by the pressing force of the roller. .
Therefore, it is possible to form a protective member having a uniform thickness on one surface of the wafer without reducing the strength of the stage and without increasing the curing time of the liquid resin.

保護部材形成装置の構成を示す斜視図である。It is a perspective view showing composition of a protection member formation device. 空気除去手段及びゴム板載置手段の構成を示す断面図である。It is sectional drawing which shows the structure of an air removal means and a rubber plate mounting means. ゴム板載置手段により、ステージに吸引保持されたフィルムの上面にゴム板が載置された状態を示す断面図である。FIG. 4 is a cross-sectional view showing a state in which a rubber plate is placed on an upper surface of a film sucked and held on a stage by a rubber plate placing means. 空気除去手段により、ステージに向けてフィルムを押圧してフィルムとステージとの間の空気を除去する状態を示す断面図である。FIG. 4 is a cross-sectional view illustrating a state in which the film is pressed toward a stage to remove air between the film and the stage by an air removing unit.

図１に示す保護部材形成装置１は、ウエーハＷの一方の面に液状樹脂を押し拡げて硬化させ保護部材を形成する装置の一例であり、装置ベース１００と、装置ベース１００において立設されたコラム１０１と、装置ベース１００に隣接して配設された支持ベース１０２と、上下方向に２段の収容スペース２ａ，２ｂを有するカセット収容本体１０３とを備える。上段の収容スペース２ａには、保護部材が形成される前のウエーハＷが複数収容されたカセット３ａが配設され、下段の収容スペース２ｂには、保護部材が形成されたウエーハＷが複数収容されるカセット３ｂが配設されている。   The protective member forming apparatus 1 shown in FIG. 1 is an example of an apparatus for forming a protective member by pressing and spreading a liquid resin on one surface of a wafer W to form a protective member. The apparatus includes a column 101, a support base 102 disposed adjacent to the apparatus base 100, and a cassette housing body 103 having two vertically arranged housing spaces 2 a and 2 b. A cassette 3a in which a plurality of wafers W before the protection member is formed is disposed in the upper storage space 2a, and a plurality of wafers W in which the protection member is formed are stored in the lower storage space 2b. Cassette 3b is provided.

コラム１０１のＹ軸方向後方には、第１支持台６ａと、第１支持台６ａの下方側に位置する第２支持台６ｂとが連結されている。第１支持台６ａには、保護部材が形成される前のウエーハＷの中心位置及び向きを検出するウエーハ検出部７が配設されている。第２支持台６ｂには、ウエーハＷに形成された保護部材をウエーハＷの外形に沿って切断するフィルムカッター８が配設されている。   A first support 6a and a second support 6b located below the first support 6a are connected to the rear of the column 101 in the Y-axis direction. The first support 6a is provided with a wafer detector 7 for detecting the center position and orientation of the wafer W before the protection member is formed. A film cutter 8 that cuts a protection member formed on the wafer W along the outer shape of the wafer W is provided on the second support 6b.

カセット収容本体１０３とウエーハ検出部７及びフィルムカッター８との間には、カセット３ａ,３ｂに対してウエーハＷの搬出及び搬入を行う第１ウエーハ搬送手段４が配設されている。第１ウエーハ搬送手段４は、保護部材が形成される前のウエーハＷをカセット３ａから搬出して第１支持台６ａに搬入するとともに、保護部材形成済みのウエーハＷを第２支持台６ｂから搬出してカセット３ｂに搬入することができる。   Between the cassette housing body 103, the wafer detection unit 7 and the film cutter 8, a first wafer transport unit 4 for carrying out and carrying in the wafer W to and from the cassettes 3a and 3b is provided. The first wafer transport means 4 carries out the wafer W before the protection member is formed from the cassette 3a and carries it into the first support 6a, and unloads the wafer W on which the protection member is formed from the second support 6b. Then, it can be carried into the cassette 3b.

装置ベース１００には、上面に樹脂が滴下されるフィルム１２がロール状に巻かれたロール部１１を有するフィルム供給手段１０と、フィルム１２を吸引保持するフィルム保持面２１を有するステージ２０とを備える。フィルム保持面２１の外周にはウエーハＷの直径より僅かに大きい直径のリング状の凸部からなる吸引部２２を有している。この吸引部２２の内側の領域（凹面）に液状樹脂を溜めて、吸引部２２の外側に液状樹脂が飛散するのを防止する構成となっている。フィルム保持面２１は、例えば石英ガラスによって形成されている。図２に示すように、吸引部２２は、吸引源２３に接続され、フィルム保持面２１に載置されたフィルム１２を下方から吸引保持する構成となっている。   The apparatus base 100 includes a film supply means 10 having a roll portion 11 on which a film 12 on which a resin is dropped is wound in a roll shape, and a stage 20 having a film holding surface 21 for sucking and holding the film 12. . On the outer periphery of the film holding surface 21, there is provided a suction part 22 formed of a ring-shaped convex part having a diameter slightly larger than the diameter of the wafer W. The liquid resin is stored in a region (concave surface) inside the suction unit 22 so as to prevent the liquid resin from scattering outside the suction unit 22. The film holding surface 21 is formed of, for example, quartz glass. As shown in FIG. 2, the suction unit 22 is connected to a suction source 23, and is configured to suction-hold the film 12 placed on the film holding surface 21 from below.

図１に示す支持ベース１０２には、フィルム載置手段３０が配設されている。フィルム載置手段３０は、±Ｙ軸方向と交差する水平方向（±Ｘ軸方向）に延在するアーム部３１と、アーム部３１の側面に取り付けられたクランプ部３２とを備える。そして、クランプ部３２は、ロール部１１に巻かれたフィルム１２をクランプして＋Ｙ軸方向に引っ張り、ステージ２０に載置することができる。   The film mounting means 30 is provided on the support base 102 shown in FIG. The film mounting means 30 includes an arm section 31 extending in a horizontal direction (± X axis direction) intersecting with the ± Y axis direction, and a clamp section 32 attached to a side surface of the arm section 31. Then, the clamp unit 32 can clamp the film 12 wound around the roll unit 11, pull the film 12 in the + Y-axis direction, and mount the film 12 on the stage 20.

ステージ２０の近傍には、ステージ２０が吸引保持するフィルム１２の上に所定量の液状樹脂を供給する液状樹脂供給手段４０を備える。液状樹脂供給手段４０は、ステージ２０のフィルム保持面２１に向けて液状樹脂を供給する供給口４１ａを有する樹脂供給ノズル４１を備える。樹脂供給ノズル４１には、図示しない液状樹脂供給源が接続されている。そして、樹脂供給ノズル４１は、旋回可能となっており、供給口４１ａをステージ２０の上方側に位置づけることができる。   In the vicinity of the stage 20, a liquid resin supply means 40 for supplying a predetermined amount of liquid resin onto the film 12 suction-held by the stage 20 is provided. The liquid resin supply means 40 includes a resin supply nozzle 41 having a supply port 41a for supplying the liquid resin toward the film holding surface 21 of the stage 20. A liquid resin supply source (not shown) is connected to the resin supply nozzle 41. The resin supply nozzle 41 is pivotable, so that the supply port 41 a can be positioned above the stage 20.

コラム１０１の−Ｙ軸方向側には、ステージ２０のフィルム保持面２１に対面しウエーハＷの他方の面を吸引保持する保持手段７０と、保持手段７０とステージ２０とを相対的に接近する方向に移動させフィルム１２の上に供給された液状樹脂を押し拡げる拡張手段８０と、拡張手段８０によりウエーハＷの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段９０とを備える。硬化手段９０は、例えば紫外線を照射するＵＶランプを有している。   On the −Y axis direction side of the column 101, a holding unit 70 that faces the film holding surface 21 of the stage 20 and suction-holds the other surface of the wafer W, and a direction in which the holding unit 70 and the stage 20 are relatively approached. And a curing means 90 for curing the liquid resin that has been spread over one surface of the wafer W by the extending means 80. The curing unit 90 has, for example, a UV lamp that irradiates ultraviolet rays.

保持手段７０は、円板状のホイール７１を備え、ホイール７１の内側に保持部を備える。この保持部の下面がウエーハＷを吸引保持するウエーハ保持面７２となっている。保持部は、例えば、ポーラス部材により形成されている。ウエーハ保持面７２には、図示しない吸引源が接続されており、ウエーハ保持面７２でウエーハＷを吸引保持することができる。   The holding unit 70 includes a disk-shaped wheel 71 and a holding unit inside the wheel 71. The lower surface of the holding portion serves as a wafer holding surface 72 for holding the wafer W by suction. The holding unit is formed of, for example, a porous member. A suction source (not shown) is connected to the wafer holding surface 72, and the wafer W can be suction-held on the wafer holding surface 72.

拡張手段８０は、±Ｚ軸方向に延在するボールネジ８１と、ボールネジ８１の一端に接続されたモータ８２と、ボールネジ８１と平行に延在する一対のガイドレール８３と、一方の面に保持手段７０が連結された昇降板８４とを備える。一対のガイドレール８３には、昇降板８４の他方の面が摺接し、昇降板８４の他方の面側に形成されたナットにはボールネジ８１が螺合している。拡張手段８０は、モータ８２によって駆動されてボールネジ８１が回動すると、一対のガイドレール８３に沿って昇降板８４を±Ｚ軸方向に移動させることにより、ステージ２０のフィルム保持面２１に対して垂直方向に保持手段７０を昇降させることができる。   The expansion means 80 includes a ball screw 81 extending in the ± Z-axis direction, a motor 82 connected to one end of the ball screw 81, a pair of guide rails 83 extending parallel to the ball screw 81, and a holding means on one surface. 70 is provided with an elevating plate 84 connected thereto. The other surface of the elevating plate 84 is in sliding contact with the pair of guide rails 83, and a ball screw 81 is screwed into a nut formed on the other surface of the elevating plate 84. When the ball screw 81 rotates by being driven by the motor 82, the extending means 80 moves the elevating plate 84 in the ± Z-axis direction along the pair of guide rails 83, thereby moving the elevating plate 84 relative to the film holding surface 21 of the stage 20. The holding means 70 can be raised and lowered in the vertical direction.

さらに、保護部材形成装置１は、ステージ２０のフィルム保持面２１に吸引保持されたフィルム１２の上に液状樹脂を供給する前にフィルム保持面２１とフィルム１２との間の空気を除去する空気除去手段５０と、フィルム保持面２１に吸引保持されたフィルム１２の上にゴム板９を載置するゴム板載置手段６０とを備える。本実施形態では、装置ベース１００において、ステージ２０を挟むように空気除去手段５０とゴム板載置手段６０とが対向して配設されている。   Further, the protective member forming apparatus 1 removes air between the film holding surface 21 and the film 12 before supplying the liquid resin onto the film 12 sucked and held on the film holding surface 21 of the stage 20. There is provided a means 50 and a rubber plate mounting means 60 for mounting the rubber plate 9 on the film 12 sucked and held on the film holding surface 21. In the present embodiment, in the device base 100, the air removing unit 50 and the rubber plate placing unit 60 are arranged to face each other with the stage 20 therebetween.

空気除去手段５０は、ウエーハＷの直径以上の長さで水平方向（±Ｘ軸方向）に延在するローラ５１と、フィルム１２をフィルム保持面２１に向けて押し付けながらローラ５１を転動させる移動部５３とを備える。例えば、カセット３ａに収容されているウエーハＷが、３００ｍｍの場合は、ローラ５１の水平方向の長さは、少なくとも３００ｍｍ以上に形成される。また、ローラ５１は、例えばシリコンゴムにより形成されている。   The air removing unit 50 includes a roller 51 having a length equal to or longer than the diameter of the wafer W and extending in the horizontal direction (± X axis direction), and a movement for rolling the roller 51 while pressing the film 12 toward the film holding surface 21. And a unit 53. For example, when the wafer W accommodated in the cassette 3a is 300 mm, the horizontal length of the roller 51 is formed to be at least 300 mm or more. The roller 51 is made of, for example, silicon rubber.

図２に示すように、ローラ５１は、支持部５２によって、Ｘ軸方向の軸心を有する軸部５１０を中心として回転可能に支持されている。また、ローラ５１は、移動部５３において支持部５２とともに±Ｚ軸方向に昇降可能となっている。装置ベース１００の側面には、±Ｙ軸方向に延在するガイド５４が形成されており、ガイド５４に沿って移動部５３が±Ｙ軸方向に走行可能となっている。   As shown in FIG. 2, the roller 51 is rotatably supported by a support portion 52 about a shaft portion 510 having an axis in the X-axis direction. Further, the roller 51 can be moved up and down in the ± Z-axis direction together with the support part 52 in the moving part 53. A guide 54 extending in the ± Y-axis direction is formed on a side surface of the device base 100, and the moving unit 53 can run in the ± Y-axis direction along the guide 54.

ゴム板載置手段６０は、ゴム板９を水平に支持するゴム板支持部６１と、ゴム板支持部６１を±Ｙ軸方向に移動させるゴム板移動部６２とを備える。ゴム板９は、ステージ２０のフィルム保持面２１の凹凸面の形状に合わせて形成されている。すなわち、ゴム板９の中央部分には、吸引部２２の内側の領域（凹面）に嵌め込むための円形凸部９ａが形成されている。ゴム板９は、ゴム板支持部６１によって水平に支持された状態で、ゴム板移動部６２において±Ｚ軸方向に昇降可能となっている。装置ベース１００の側面には、ガイド５４と平行して±Ｙ軸方向に延在するガイド６３が形成され、ガイド６３に沿ってゴム板移動部６２が±Ｙ軸方向に走行可能となっている。なお、ゴム板９の大きさは、特に限定されず、ステージ２０のフィルム保持面２１の全面を覆うことができる大きさを有していればよい。また、ゴム板９の種類は、特に限られない。   The rubber plate mounting means 60 includes a rubber plate supporting portion 61 for horizontally supporting the rubber plate 9 and a rubber plate moving portion 62 for moving the rubber plate supporting portion 61 in the ± Y-axis directions. The rubber plate 9 is formed according to the shape of the uneven surface of the film holding surface 21 of the stage 20. That is, in the center of the rubber plate 9, a circular convex portion 9 a to be fitted into a region (concave surface) inside the suction portion 22 is formed. The rubber plate 9 can be moved up and down in the ± Z-axis direction at the rubber plate moving portion 62 in a state where the rubber plate 9 is horizontally supported by the rubber plate support portion 61. A guide 63 extending in the ± Y-axis direction parallel to the guide 54 is formed on a side surface of the device base 100, and the rubber plate moving unit 62 can travel in the ± Y-axis direction along the guide 63. . The size of the rubber plate 9 is not particularly limited as long as the rubber plate 9 has a size that can cover the entire surface of the film holding surface 21 of the stage 20. The type of the rubber plate 9 is not particularly limited.

次に、保護部材形成装置１の動作例について説明する。本実施形態に示すウエーハＷは、円形板状の被加工物の一例であって、例えば、３００ｍｍのシリコンウエーハである。まず、図１に示した第１ウエーハ搬送手段４により、カセット３ａから保護部材が形成される前のウエーハＷを１枚取り出して、第１支持台６ａに搬送する。ウエーハ検出部７がウエーハＷの中心位置及び向きを検出したら、第２ウエーハ搬送手段５が第１支持台６ａからウエーハＷを搬出して保持手段７０に受け渡す。保持手段７０は、ウエーハ保持面７２でウエーハＷの他方の面を吸引保持する。   Next, an operation example of the protection member forming apparatus 1 will be described. The wafer W shown in the present embodiment is an example of a circular plate-shaped workpiece, and is, for example, a 300 mm silicon wafer. First, one wafer W before the protection member is formed is taken out of the cassette 3a and transported to the first support 6a by the first wafer transporting means 4 shown in FIG. When the wafer detection unit 7 detects the center position and the orientation of the wafer W, the second wafer transport unit 5 carries out the wafer W from the first support 6a and transfers it to the holding unit 70. The holding means 70 suction-holds the other surface of the wafer W on the wafer holding surface 72.

ウエーハＷの保持手段７０への搬送と並行して、フィルム載置手段３０のクランプ部３２がフィルム１２をクランプして例えば＋Ｙ軸方向に移動してフィルム１２をロール部１１から引き出し、ステージ２０のフィルム保持面２１に載置する。フィルム１２は、図２に示すように、吸引源２３の作用を受けた吸引部２２によって吸引され、フィルム保持面２１でフィルム１２の下面１２ｂが吸引保持される。こうしてステージ２０で吸引保持されたフィルム１２は、フィルム保持面２１の凹凸面にならって、凹凸状に形成される。   In parallel with the transfer of the wafer W to the holding unit 70, the clamp unit 32 of the film mounting unit 30 clamps the film 12 and moves, for example, in the + Y-axis direction, pulls out the film 12 from the roll unit 11, It is placed on the film holding surface 21. As shown in FIG. 2, the film 12 is sucked by the suction unit 22 under the action of the suction source 23, and the lower surface 12 b of the film 12 is held by the film holding surface 21. Thus, the film 12 sucked and held by the stage 20 is formed in an uneven shape following the uneven surface of the film holding surface 21.

ここで、ステージ２０に吸引保持されたフィルム１２の上に液状樹脂を供給する前に、空気除去手段５０及びゴム板載置手段６０を用いて、ステージ２０のフィルム保持面２１とフィルム１２との間に介在する空気を除去する。図３に示すように、ゴム板支持部６１がゴム板９を水平に支持した状態で、ゴム板移動部６２がガイド６３に沿って例えば＋Ｙ軸方向に走行することにより、ゴム板９をステージ２０の上方側に移動させる。そして、ゴム板移動部６２においてゴム板支持部６１をフィルム保持面２１に接近する−Ｚ軸方向に下降させ、ゴム板９の円形凸部９ａを吸引部２２の内側の凹面に嵌め込んで、フィルム保持面２１に吸引保持されているフィルム１２の上面１２ａにゴム板９を当接させる。   Here, before the liquid resin is supplied onto the film 12 sucked and held by the stage 20, the air holding means 50 and the rubber plate placing means 60 are used to separate the film holding surface 21 of the stage 20 from the film 12. The air interposed between them is removed. As shown in FIG. 3, in a state where the rubber plate supporting portion 61 horizontally supports the rubber plate 9, the rubber plate moving portion 62 travels along the guide 63 in, for example, the + Y-axis direction, thereby moving the rubber plate 9 to the stage. 20 to the upper side. Then, the rubber plate supporting portion 61 is lowered in the −Z-axis direction to approach the film holding surface 21 in the rubber plate moving portion 62, and the circular convex portion 9a of the rubber plate 9 is fitted into the concave surface inside the suction portion 22, The rubber plate 9 is brought into contact with the upper surface 12a of the film 12 suction-held on the film holding surface 21.

次に、空気除去手段５０によって、支持部５２とともにローラ５１を−Ｚ軸方向に下降させ、ローラ５１の外周面５１ａをゴム板９の上面に接触させる。続いて、図４に示すように、ローラ５１を例えば矢印Ａ方向に回転させながらゴム板９の上面を下方に押圧するとともに、移動部５３によって例えば−Ｙ軸方向にローラ５１をゴム板９の一端側から他端側へ転動させる。転動するローラ５１の押圧にともない、ゴム板９を介してフィルム１２をステージ２０のフィルム保持面２１に向けて押し付けることにより、フィルム保持面２１とフィルム１２の下面１２ｂとの間の空気が除去される。このとき、吸引部２２からも空気が吸引されて逃げていくため、フィルム保持面２１とフィルム１２の下面１２ｂとの間に空気が残存して気泡が発生するのを防止することができる。こうして、フィルム１２がフィルム保持面２１において盛り上がることなく吸引保持される。なお、ローラ５１を±Ｙ軸方向に転動させる回数は限られず、ローラ５１を±Ｙ軸方向に複数回転動させてゴム板９を押圧してもよい。   Next, the roller 51 is lowered in the −Z-axis direction together with the support portion 52 by the air removing means 50, and the outer peripheral surface 51 a of the roller 51 is brought into contact with the upper surface of the rubber plate 9. Subsequently, as shown in FIG. 4, the upper surface of the rubber plate 9 is pressed downward while rotating the roller 51 in, for example, the direction of arrow A, and the roller 51 is moved by the moving unit 53 in, for example, the −Y-axis direction. Roll from one end to the other. The air between the film holding surface 21 and the lower surface 12b of the film 12 is removed by pressing the film 12 toward the film holding surface 21 of the stage 20 via the rubber plate 9 with the pressing of the rolling roller 51. Is done. At this time, since the air is also sucked from the suction part 22 and escapes, it is possible to prevent air from remaining between the film holding surface 21 and the lower surface 12b of the film 12 to generate air bubbles. Thus, the film 12 is sucked and held on the film holding surface 21 without rising. The number of times the roller 51 is rolled in the ± Y-axis direction is not limited, and the rubber plate 9 may be pressed by rotating the roller 51 a plurality of times in the ± Y-axis direction.

このようにして、ステージ２０のフィルム保持面２１とフィルム１２の下面１２ｂとの間に介在する空気を除去した後、図１に示す液状樹脂供給手段４０は、樹脂供給ノズル４１を旋回させることにより、供給口４１ａをステージ２０の上方側に位置づける。続いて、図示しない液状樹脂供給源から樹脂供給ノズル４１に液状樹脂を送出して、供給口４１ａからステージ２０に吸引保持されているフィルム１２に向けて液状樹脂を滴下する。液状樹脂としては、例えば、紫外線硬化樹脂を使用する。そして、所定量の液状樹脂がフィルム１２上に堆積したら、液状樹脂供給手段４０はフィルム１２への液状樹脂の供給を停止する。   After removing the air interposed between the film holding surface 21 of the stage 20 and the lower surface 12b of the film 12 in this manner, the liquid resin supply means 40 shown in FIG. , The supply port 41 a is positioned above the stage 20. Subsequently, the liquid resin is sent from a liquid resin supply source (not shown) to the resin supply nozzle 41, and the liquid resin is dropped from the supply port 41 a toward the film 12 suction-held by the stage 20. As the liquid resin, for example, an ultraviolet curable resin is used. When a predetermined amount of the liquid resin is deposited on the film 12, the liquid resin supply means 40 stops supplying the liquid resin to the film 12.

次いで、保持手段７０のウエーハ保持面７２でウエーハＷの他方の面を吸引保持した状態で、拡張手段８０は、モータ８２の駆動によりボールネジ８１を回動させ、保持手段７０を下降させる。保持手段７０に吸引保持されたウエーハＷの一方の面が液状樹脂に接触し、さらに保持手段７０が下降すると、ウエーハＷの一方の面によって下方に押圧された液状樹脂は、ウエーハＷの径方向に拡張される。その後、硬化手段９０が、所定の厚みに拡張された液状樹脂に向けて紫外光を照射する。その結果、液状樹脂は、硬化するとともに所望の厚みの保護部材としてウエーハＷの一方の面に形成される。このとき、図４に示したステージ２０のフィルム保持面２１とフィルム１２の下面１２ｂとの間には、空気が除去されていることから、均一の厚みの保護部材を形成することができる。   Next, in a state where the other surface of the wafer W is suction-held by the wafer holding surface 72 of the holding means 70, the expanding means 80 rotates the ball screw 81 by driving the motor 82 to lower the holding means 70. When one surface of the wafer W sucked and held by the holding means 70 comes into contact with the liquid resin and the holding means 70 is further lowered, the liquid resin pressed downward by the one surface of the wafer W is moved in the radial direction of the wafer W. Is extended to After that, the curing unit 90 irradiates the liquid resin expanded to a predetermined thickness with ultraviolet light. As a result, the liquid resin is cured and formed on one surface of the wafer W as a protective member having a desired thickness. At this time, since air is removed between the film holding surface 21 of the stage 20 and the lower surface 12b of the film 12 shown in FIG. 4, a protective member having a uniform thickness can be formed.

保護部材が形成されたウエーハＷは、第２ウエーハ搬送手段５によって、第２支持台６ｂに搬送され、フィルムカッター８でウエーハＷの外形に沿って余分なフィルム１２が切断され、第１ウエーハ搬送手段４によりカセット３ｂに収容される。   The wafer W on which the protection member is formed is transported by the second wafer transporting means 5 to the second support 6b, and an excess film 12 is cut along the outer shape of the wafer W by the film cutter 8, and the first wafer is transported. It is stored in the cassette 3b by the means 4.

以上のとおり、本発明にかかる保護部材形成装置１は、フィルム１２を吸引保持するフィルム保持面２１にウエーハＷの直径より大きい直径のリング状の吸引部２２を有するステージ２０と、ステージ２０が吸引保持するフィルム１２の上に液状樹脂を供給する液状樹脂供給手段４０と、フィルム保持面２１に対面しウエーハＷを保持するウエーハ保持面７２を有する保持手段７０と、保持手段７０とステージ２０とを相対的に接近する方向に移動させフィルム１２の上に供給された液状樹脂を押し拡げる拡張手段８０と、拡張手段８０によりウエーハＷの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段９０と、を備え、さらに、フィルム１２の上面１２ａに液状樹脂を供給する前にフィルム保持面２１とフィルム１２の下面１２ｂとの間の空気を除去する空気除去手段５０と、フィルム保持面２１に吸引保持されたフィルム１２の上面１２ａにゴム板９を載置するゴム板載置手段６０とを備え、空気除去手段５０は、ウエーハＷの直径以上の長さで延在するローラ５１と、ステージ２０に吸引保持されたフィルム１２をフィルム保持面２１に向けて押し付けながらローラ５１を転動させる移動部５３とを備えたため、フィルム保持面２１とフィルム１２の下面１２ｂとの間に介在する空気をすばやく除去してから、ウエーハＷの一方の面に対する保護部材の形成を効率よく行うことができる。
したがって、ステージ２０の強度を弱めることなく、液状樹脂の硬化時間を長くせずに、均一な厚みの保護部材をウエーハＷの一方の面に形成することができる。 As described above, the protection member forming apparatus 1 according to the present invention includes the stage 20 having the ring-shaped suction portion 22 having a diameter larger than the diameter of the wafer W on the film holding surface 21 for holding the film 12 by suction. A liquid resin supply unit 40 for supplying a liquid resin onto the film 12 to be held; a holding unit 70 having a wafer holding surface 72 facing the film holding surface 21 and holding the wafer W; Extension means 80 for moving the liquid resin supplied onto the film 12 by moving in a relatively approaching direction, and curing for curing the liquid resin pushed and extended on one entire surface of the wafer W by the extension means 80. Means 90, and before the liquid resin is supplied to the upper surface 12a of the film 12, Air removing means 50 for removing air between the air holding means 12b and the rubber plate mounting means 60 for mounting the rubber plate 9 on the upper surface 12a of the film 12 sucked and held on the film holding surface 21; 50 includes a roller 51 extending with a length equal to or greater than the diameter of the wafer W, and a moving unit 53 that rolls the roller 51 while pressing the film 12 sucked and held on the stage 20 toward the film holding surface 21. Therefore, after the air interposed between the film holding surface 21 and the lower surface 12b of the film 12 is quickly removed, the protection member can be efficiently formed on one surface of the wafer W.
Therefore, a protective member having a uniform thickness can be formed on one surface of the wafer W without reducing the strength of the stage 20 and without increasing the curing time of the liquid resin.

１：保護部材形成装置 １００：装置ベース １０１：コラム
１０２：支持ベース １０３：カセット収容本体
２ａ,２ｂ：収容スペース ３ａ,３ｂ：カセット ４：第１ウエーハ搬送手段
５：第２ウエーハ搬送手段 ６ａ：第１支持台 ６ｂ：第２支持台
７：ウエーハ検出部 ８：フィルムカッター ９：ゴム板 ９ａ：円形凸部
１０：フィルム供給手段 １１：ロール部 １２：フィルム
２０：ステージ ２１：フィルム保持面 ２２：吸引部 ２３：吸引源
３０：フィルム載置手段 ３１：アーム部 ３２：クランプ部
４０：液状樹脂供給手段 ４１：樹脂供給ノズル ４１ａ：供給口
５０：空気除去手段 ５１：ローラ ５１ａ：外周面 ５１０：軸部 ５２：支持部
５３：移動部 ５４：ガイド
６０：ゴム板載置手段 ６１：ゴム板支持部 ６２：ゴム板移動部 ６３：ガイド
７０：保持手段 ７１：ホイール ７２：ウエーハ保持面
８０：拡張手段 ８１：ボールネジ ８２：モータ ８３：ガイドレール
８４：昇降板
９０：硬化手段 1: Protective member forming device 100: device base 101: column 102: support base 103: cassette housing main bodies 2a, 2b: housing space 3a, 3b: cassette 4: first wafer transport means 5: second wafer transport means 6a: first 1 support 6b: second support 7: wafer detector 8: film cutter 9: rubber plate 9a: circular projection 10: film supply means 11: roll 12: film 20: stage 21: film holding surface 22: suction Unit 23: Suction source 30: Film mounting unit 31: Arm unit 32: Clamp unit 40: Liquid resin supply unit 41: Resin supply nozzle 41a: Supply port 50: Air removal unit 51: Roller 51a: Outer peripheral surface 510: Shaft portion 52: Supporting part 53: Moving part 54: Guide 60: Rubber plate mounting means 61: Rubber plate supporting part 62: Rubber plate moving part 63: Id 70: holding means 71: wheel 72: a wafer holding surface 80: expanding means 81: ball screw 82: motor 83: Guide rail 84: elevating plate 90: curing means

Claims (1)

ウエーハの一方の面の全面に液状樹脂を押し拡げて硬化させ保護部材を形成する保護部材形成装置であって、
フィルムを吸引保持するフィルム保持面にウエーハの直径より大きい直径のリング状の吸引部を有するステージと、
該ステージが吸引保持するフィルムの上に液状樹脂を供給する液状樹脂供給手段と、
該フィルム保持面に対面しウエーハを保持するウエーハ保持面を有する保持手段と、
該保持手段と該ステージとを相対的に接近する方向に移動させ該フィルムの上に供給された液状樹脂を押し拡げる拡張手段と、
該拡張手段によりウエーハの一方の面の全面に押し拡げられた液状樹脂を硬化させる硬化手段と、を備え、
さらに、該フィルムの上に液状樹脂を供給する前に該フィルム保持面と該フィルムとの間の空気を除去する空気除去手段を備え、
該空気除去手段は、
該フィルム保持面に保持されたフィルムの上に該フィルム保持面全面を覆うことができる面積のゴム板を載置するゴム板載置手段と、
該ウエーハの直径以上の長さで延在するローラと、
該ステージに吸引保持された該フィルムの上に載置された該ゴム板の上を該フィルム保持面に向けて押し付けながら該ローラを転動させる移動部と、を備える保護部材形成装置。 A protective member forming apparatus for forming a protective member by pressing and spreading a liquid resin over an entire surface of one surface of a wafer, and forming a protective member.
A stage having a ring-shaped suction unit having a diameter larger than the diameter of the wafer on a film holding surface that holds the film by suction,
Liquid resin supply means for supplying liquid resin onto the film that the stage sucks and holds,
Holding means having a wafer holding surface for holding the wafer facing the film holding surface,
Expansion means for moving the holding means and the stage in a direction of relatively approaching to push and spread the liquid resin supplied on the film;
Curing means for curing the liquid resin spread over the entire surface of one surface of the wafer by the expansion means,
Furthermore, before the liquid resin is supplied on the film, air removing means for removing air between the film holding surface and the film,
The air removing means includes:
Rubber plate mounting means for mounting a rubber plate having an area capable of covering the entire film holding surface on the film held on the film holding surface,
A roller extending at least as long as the diameter of the wafer;
A moving unit that rolls the roller while pressing the rubber plate placed on the film sucked and held by the stage toward the film holding surface.
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