CN101428264B - Coating device and method - Google Patents
Coating device and method Download PDFInfo
- Publication number
- CN101428264B CN101428264B CN2008101745641A CN200810174564A CN101428264B CN 101428264 B CN101428264 B CN 101428264B CN 2008101745641 A CN2008101745641 A CN 2008101745641A CN 200810174564 A CN200810174564 A CN 200810174564A CN 101428264 B CN101428264 B CN 101428264B
- Authority
- CN
- China
- Prior art keywords
- substrate
- adsorption section
- initial
- workbench
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Coating Apparatus (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a coating device and a coating method for inhibiting the long-term of a coating device whole operation period even the time is consumed when a substrate is fixed on a worktable. The coating method of the coating device comprises a substrate loading working procedure for loading the substrate on the worktable surface, an initial film forming working procedure for forming the initial film on the substrate of the worktable surface and a coating film forming working procedure for spraying coating liquid from the a spray unit and forming coating films on substrate. The substrate loading working procedure comprises an adsorption working procedure for adsorbing substrates on surface of the worktable. The adsorption working procedure comprises an initial adsorption working procedure for adsorbing a substrate initial film forming region including a coating the initial position and a main adsorption working procedure for adsorbing a substrate coating film forming region besides the initial film forming region, and the initial film forming working procedure is started after the initial adsorption working procedure is over and before the main adsorption working procedure is over.
Description
Technical field
The present invention relates to applying device and the coating method of coating liquid coating on the substrate.
Background technology
What the flat-panel monitor such as liquid crystal display and plasma display used is the structure (being called coated substrate) that applies anti-corrosion liquid on glass substrate.The applying device that this coated substrate utilization evenly applies anti-corrosion liquid forms.
This applying device has the workbench of mounting substrate and the coating element of ejection anti-corrosion liquid, and one side sprays the mobile coating element of anti-corrosion liquid one side from coating element, thereby forms the liquid film against corrosion of uniform thickness at substrate.
Specifically as described in the following patent documentation 1, if on the workbench supplying substrate, thereby then by making adsorption hole on the workbench produce negative pressure substrate adsorption is remained on the workbench.At this moment, be clipped between substrate and the workbench with bubble form for fear of air layer, when the mounting substrate, partly begin to be positioned on the workbench from this substrate center with deflection substrate center state partly.Then, behind workbench mounting absorption substrate, coating element is moved, the ejection coating liquid forms coated film at substrate.
Patent documentation 1: 2006-No. 281091 communiques of JP
, in the above-mentioned patent documentation 1 described applying device, be mobile coating element after substrate integral body is absorbed and fixed on the workbench, thereby the problem that exists is that the duty cycle of applying device is elongated.That is, along with the substrate maximization etc., the fine setting difficult of positioning baseplate, thus with large substrate Global High Accuracy ground mounting, be fixed on and need spended time on the workbench, have long-term tendency the duty cycle of coating device whole.
Summary of the invention
The present invention namely puts in view of the above problems and produces, even its purpose is to provide elongated applying device and coating method duty cycle that also can suppress coating device whole in a kind of situation that fixedly needs the time at substrate toward the workbench of applying device.
In order to solve above-mentioned problem, applying device of the present invention possesses: the workbench of mounting substrate; And coating element, ejection coating liquid when its substrate that loads on the surface with respect to described workbench relatively moves, thereby form coated film at substrate, described applying device is characterised in that, described workbench is provided with the substrate absorption device that absorption keeps substrate, described substrate absorption device has initial adsorption section and main adsorption section, the initial film of the substrate of the initial film of described initial adsorption section when forming the coating beginning forms the zone adsorbs, and described main adsorption section forms the zone and adsorbs form coated film the zone except this initial film.
According to above-mentioned applying device, the described substrate absorption device of absorption substrate has initial adsorption section and main adsorption section, thereby, can be after a substrate part have been adsorbed in initial adsorption section, mobile coating element begins coating to the substrate portion corresponding with initial adsorption section.Namely, can be after having begun substrate adsorption, at once move coating element to the substrate portion corresponding with described initial adsorption section, thereby compare with the existing situation that after absorption fixing base integral body, begins like that to apply action, can shorten the duty cycle of coating device whole.
In addition, can adopt following formation, the initial adsorption section of described substrate absorption device and main adsorption section are formed with respectively the attraction hole that forms at the surface opening of workbench, and described substrate absorption device possesses in described attraction hole the suction device that produces attraction and optionally produces switching device shifter from the attraction of this suction device with respect to described initial adsorption section and main adsorption section.
Thereby can only produce attraction in described initial adsorption section by the operation switching device shifter according to this formation, a substrate part is adsorbed onto initial adsorption section after, also produce attraction in main adsorption section, the absorption fixing base is whole.Thereby, need not suction device be set respectively to initial adsorption section and main adsorption section both sides.
In addition, can also adopt following formation, the initial adsorption section of described substrate absorption device and main adsorption section are formed with respectively the attraction hole that forms at the surface opening of workbench, and described substrate absorption device is provided with respectively the suction device that produces attraction in the suction device that produces attraction in the attraction mouth of described initial adsorption section and the attraction mouth in described main adsorption section independently with respect to initial adsorption section and main adsorption section.
Consist of according to this, can be equivalent to suitable timing produce independently respectively separately attraction with respect to initial adsorption section and the main adsorption section of described substrate absorption device.
In addition, also can adopt following formation, described initial adsorption section and main adsorption section are formed with the surface sorption groove of substrate adsorption at described workbench, this adsorption tank is communicated with described attraction hole, and form at the surface opening of workbench, the adsorption tank of the adsorption tank of this initial adsorption section and main adsorption section forms respectively independently by the partitions that prevents from mutually linking.
According to this formation, if in attracting the hole, produce attraction, then with adsorption tank that this attraction hole is communicated with in also produce attraction, thereby attracted to the adsorption tank side with substrate portion integral body that adsorption tank is faced.And, even also can utilize adsorption tank to attract bubble in the alveolate situation being mingled with between substrate and the workbench, thereby avoid bubble to remain in problem between substrate and the workbench.In addition, because the adsorption tank of the adsorption tank of initial adsorption section and main adsorption section forms respectively independently, thereby can prevent in the situation that initial adsorption section produces attraction to should be by the substrate portion effect attraction of main adsorption section absorption.
In addition, also can adopt following formation, the initial adsorption section of described substrate absorption device and main adsorption section possess the pin member that keeps substrate, this pin member is housed in respectively in the workbench, and can arrange highlightedly from the surface of workbench, the pin member of described initial adsorption section is housed in the workbench first than the pin member of described main adsorption section.
According to this formation, with substrate-placing when on the workbench, can at first a substrate part be positioned in initial adsorption section.Thereby the substrate adsorption that can make initial adsorption section begins first than the substrate adsorption of main adsorption section.In addition, because substrate begins mounting from initial adsorption section, next load main adsorption section, thereby the air layer that is present between substrate and the initial adsorption section is run away to main adsorption section side.Thereby can suppress air layer is present between substrate and the workbench (initial adsorption section) with bubble form.
In addition, also can adopt following formation, the pin member of described main adsorption section is housed in the workbench successively from described initial adsorption section side.
Consist of according to this, be positioned in the substrate portion of main adsorption section from the unidirectional successively mounting of the initial adsorption section main adsorption section of side direction side, thereby the air layer that is present between substrate and the workbench is not run away successively to loading side.Thereby, can suppress air layer and be present between substrate and the workbench with bubble form.
In addition, in order to solve above-mentioned problem, coating method of the present invention is the coating method of applying device, comprising: the substrate-placing operation, at the surface of workbench mounting substrate; Initial film forms operation, and the substrate that loads at described workbench under the state that the coating element that makes the ejection coating liquid stops to form initial film; Coated film forms operation, after forming described initial film, in the time of from coating element ejection coating liquid this coating element is relatively moved with respect to substrate, thereby form coated film at substrate, described coating method is characterised in that, described substrate-placing operation has the surface sorption operation of substrate adsorption at workbench, and this absorption process comprises: the initial film to the substrate that forms described initial film forms the initial adsorption operation of adsorbing in the zone; The coated film of substrate that forms except this initial film the zone is formed the main absorption process that adsorb in the zone, after finishing described initial adsorption operation, finish described main absorption process before, begin described initial film formation operation.
According to this formation, be after finishing described initial adsorption operation, finish described main absorption process before, the initial film that begins to utilize coating element to carry out forms operation, thereby compare with the existing coating method that after finishing described substrate-placing operation, begins like that coated film formation operation, can shorten the duty cycle of coating device whole.
The invention effect
According to applying device of the present invention and coating method, even it is long-term also can to suppress the duty cycle of coating device whole when fixing base needs spended time on the workbench of applying device.
Description of drawings
Fig. 1 is the top view of the applying device of expression embodiment of the present invention.
Fig. 2 is the side view of above-mentioned applying device.
Fig. 3 is the figure that is illustrated in the state of a mounting substrate part on the above-mentioned applying device.
Fig. 4 is the figure of the workbench of the above-mentioned applying device of expression, (a) is the figure of expression workbench integral body, (b) is the enlarged drawing of its surface portion of expression.
Fig. 5 is the figure of the shank details of coating element in the above-mentioned applying device of expression.
Fig. 6 is the block diagram of the control system of the above-mentioned applying device of expression.
Fig. 7 is the flow chart of the action of the above-mentioned applying device of expression.
Fig. 8 is the flow chart of the coating action of the above-mentioned applying device of expression.
Fig. 9 is the figure of position relationship of the coating element in the action of the above-mentioned applying device of expression.
Figure 10 is the vavuum pump of applying device of other embodiments of expression and the skeleton diagram of pipe-line system.
Among the figure, 10-substrate, 11-initial film forms the zone, and 12-coated film forms the zone, 21-workbench, 30-coating element, 34-tube head, 40-substrate absorption device, 41-initial adsorption section, 42-main adsorption section, 90-control device.
The specific embodiment
Utilize the description of drawings embodiments of the present invention.
Fig. 1 is the top view that summary represents the applying device of an embodiment of the present invention, and Fig. 2 is its side view, and Fig. 3 is the figure that is illustrated in the state of a mounting substrate part on the applying device.
Such as Fig. 1～shown in Figure 3, applying device is the device that forms the coated film of the liquid material (hereinafter referred to as coating liquid) such as liquids and anti-corrosion liquid at substrate 10, possesses base 2, is used for loading the workbench 21 of substrate 10 and the coating element 30 that can consist of movably along specific direction (being left and right directions among Fig. 1) with respect to this workbench 21.
Also have, in the following description, the direction that moves take coating element 30 is as X-direction, take with it on horizontal plane the direction of quadrature as Y direction, to describe as Z-direction with the direction of X-axis and Y direction both sides quadrature.
Described base 2 is partial configuration workbench 21 in the central.This workbench 21 loads and remains on its surface with the substrate 10 of moving into.And, at this workbench 21 substrate absorption device 40 is set, utilize this substrate absorption device 40 substrate 10 absorption can be remained on the surface of workbench 21.Specifically, form a plurality of attractions hole 41a, the 42a (with reference to Fig. 4) that is opened on its surface at this workbench 21, these attract hole 41a, 42a to be connected ( vavuum pump 81a, 81b) with vavuum pump by pipeline 84 connections.And, loaded on workbench 21 surfaces and made vavuum pump 81 actions under the state of substrate 10, thereby in attracting hole 41a, 42a, produced attraction, substrate 10 is attracted to adsorb maintenance to the face side of workbench 21.In the present embodiment, as shown in Figure 3, initial adsorption section 41 described later and vavuum pump 81a link, and main adsorption section 42 described later links with vacuum 81b, with respect to initial adsorption section 41 and main adsorption section 42 vavuum pump 81 ( vavuum pump 81a, 81b) is set independently respectively.
In addition, described substrate absorption device 40 is made of initial adsorption section 41 and main adsorption section 42 as shown in Figure 4.At this, Fig. 4 is the figure of expression workbench 21, and Fig. 4 (a) is the overall perspective view of expression workbench 21, and Fig. 4 (b) is the enlarged drawing of its surface portion of expression.This initial adsorption section 41 forms initial film at substrate 10 when the coating that utilizes coating element 30 to carry out begins, the surface portion (initial film shown in Figure 3 forms zone 11) that forms the substrate 10 of this initial film is adsorbed on the workbench 21.Also have, the initial film of utilizing coating element 30 to form is the wire shape, thereby it can be the wire shape that forms initial film that initial film forms zone 11, but also can be the regulation zone that comprises this wire shape.That is, can be to have the part that the zone that forms this degree of initial film is stablized in the coating of can not producing irregularly, in the present embodiment, expression comprises the situation of the certain area of this wire shape.
This initial adsorption section 41 forms attraction hole 41a and adsorption tank 41b shown in Fig. 4 (b), to allow to the action by vavuum pump 81a, produce attraction in attracting hole 41a and adsorption tank 41b.Specifically, adsorption tank 41b connection attracts hole 41a to form latticed on workbench 21 surfaces.And, if at initial adsorption section 41 mounting substrates 10 (initial film forms zone 11), then become the state that is covered attraction hole 41a and adsorption tank 41b by this substrate 10.Under this state, make vavuum pump 81a action, thereby to attracting hole 41a and adsorption tank 41b effect attraction, be attracted in the initial adsorption section 41 so that the initial film of substrate 10 forms zone 11.And, even when between the initial film of substrate 10 forms the initial adsorption section 41 of zone 11 and workbench 21, having bubble, also since bubble attracted among whole of the substrate 10 upper adsorption tank 41b that forms, thereby can avoid initial film at substrate 10 to form residual bubble between the initial adsorption section 41 of zone 11 and workbench 21.Thereby, need not be for fear of being mingled with of bubble and begin mounting from the middle body of substrate 10, can form from the initial film as substrate 10 ends zone 11 and begin mounting.
In addition, described main adsorption section 42 is adsorbed on the surface (coated film shown in Figure 3 forms zone 12) of the substrate 10 except the part that forms initial film on the workbench 21.This main adsorption section 42 has the formation same with above-mentioned initial adsorption section 41, forms to attract hole 42a and be communicated with this attraction hole 42a to form latticed adsorption tank 42b.And, by the action of vavuum pump 81b, be attracted on the main adsorption section 42 thereby make the coated film of substrate 10 form zone 12.In addition, even when between the coated film of substrate 10 forms the main adsorption section 42 of zone 12 and workbench 21, having bubble, also since bubble attracted among the adsorption tank 42b, thereby can avoid coated film at substrate 10 to form residual bubble between the main adsorption section 42 of zone 12 and workbench 21.
In addition, shown in Fig. 4 (b), between the adsorption tank 42b of the adsorption tank 41b of this initial adsorption section 41 and main adsorption section 42, form partitions 43, adsorption tank 41b and adsorption tank 42b connections that be not interconnected, but respectively independently formation.Thereby, even during the vavuum pump 81a (vavuum pump 81b) of initial adsorption section 41 sides (or main adsorption section 42 sides) action, can not make among adsorption tank 41b, the 42b of main adsorption section 42 (or initial adsorption section 41 sides) yet and produce attraction.
In addition, be provided with the substrate elevating mechanism that makes substrate 10 lifting actions at workbench 21.Specifically, on workbench 21 surfaces, be that initial adsorption section 41 and main adsorption section 42 forms a plurality of pin-and-holes, imbed in this pin-and-hole that be provided with can be along the lifter pin 51 (pin member of the present invention) of Z-direction lifting action.Namely, if under the state of the outstanding lifter pin 51 in workbench 21 surfaces, moving into substrate 10, the fore-end butt substrate 10 of lifter pin 51 then, can keep substrate 10, decline lifter pin 51 is housed in it in pin-and-hole, thereby substrate 10 is positioned in workbench 21 surfaces (initial adsorption section 41 and main adsorption section 42) (with reference to Fig. 3).
In addition, under the state of workbench 21 surface mounting substrates 10, rising lifter pin 51, thereby the fore-end butt substrate 10 of lifter pin 51, the fore-end of the enough a plurality of lifter pins 51 of energy remains on substrate 10 height and position of regulation.Thereby, can suppress as much as possible and the contact portion of maintenance and substrate 10 the not smooth and easy replacing in wounded substrate 10 ground.
At this, during mounting substrate 10, the lifter pin 51 in the initial adsorption section 41 is to be housed in the pin-and-hole than the lifter pin 51 Zao timings on the main adsorption section 42, and the substrate 10 that is kept by lifter pin 51 loads first from initial adsorption section 41, then is positioned in main adsorption section 42.Thereby the air layer that is present between substrate 10 and the initial adsorption section 41 is run away to main adsorption section 42 sides, is mixed between substrate 10 and the workbench 21 with bubble form thereby can suppress air layer.
In addition, also be to be housed in successively (with reference to Fig. 3) the pin-and-hole from the side that initial adsorption section 41 side direction are left initial adsorption section 41 about the lifter pin 51 of main adsorption section 42.Thereby the coated film of substrate 10 forms zone 12 and does not load the unidirectional successively mounting of side (being the right side Fig. 3) from initial adsorption section 41 side direction.Thereby the air layer that is present between substrate 10 and the workbench 21 is not run away to loading side successively, is present between substrate 10 and the workbench 21 with bubble form thereby can suppress air layer.
And the formation of formation is the detent mechanism (not diagram) that substrate 10 is set at workbench 21, with substrate 10 location that allow to be positioned in the initial adsorption section 41.That is, if substrate 10 its a part of substrates 10 (initial film forms zone 11) that kept by lifter pin 51 are positioned in the initial adsorption section 41, then utilize detent mechanism to locate this part.And, form zone 11 in the initial film of substrate 10 and be positioned under the state of initial adsorption section 41, make vavuum pump 81a action, this initial film is formed zone 11 absorption remain in the initial adsorption section 41., make vavuum pump 81b action, thereby substrate 10 absorption are remained on the main adsorption section 42 thereafter.Thereby the absorption of substrate 10 Global High Accuracy ground is remained on the workbench 21.
In addition, coating element 30 coating liquid coating on the substrate 10.This coating element 30 has the shank 31 that links with base 2 and the tube head 34 that extends along Y direction, as shown in Figure 5 can install movably along X-direction across the state on base 2 along Y direction.Specifically, in the Y direction two end portions of base 2 track 22 that extends along X-direction is set respectively, shank 31 is installed sliding freely along this track 22.And, at shank 31 linear motors 33 are installed, by driving control linear motor 33, thereby coating element 30 is moved along X-direction, stop at an arbitrary position.
Specifically, this coating element 30 stops at the position that breaks away from workbench 21, is retreating position (the position A of Fig. 9) under original state.And, when beginning the coating action, move to the initial film that forms initial film and form position (the position C of Fig. 9), can make it stop at this position.
The tube head 34 of coating liquid coating is installed at the shank 31 of coating element 30.Specifically, be provided with along the track 37 of Z-direction extension and the slide block 35 that slides along this track 37 at this shank 31, these slide blocks 35 and tube head 34 are linked.And, the ball screw mechanism that is driven by servo motor 36 (with reference to Fig. 6) is installed at slide block 35, by driving this servo motor 36 of control, thereby slide block 35 is moved along Z-direction, stop at simultaneously the optional position.That is, tube head 34 supports with respect to the substrate 10 that remains on the workbench 21 with can contacting disengaging.
Tube head 34 coating liquid coatings also form coated film at substrate 10.This tube head 34 is the cylindrical components with shape of unidirectional extension, with the almost orthogonally setting of moving direction of coating element 30.Form the gap nozzle 34a of longitudinal extension at this tube head 34, the coating liquid of supplying with to tube head 34 traverses vertically evenly ejection from gap nozzle 34a.Thereby, coating element 30 is moved along X-direction with the state from this gap nozzle 34a ejection coating liquid, thus traverse gap nozzle 34a vertically form certain thickness coated film at substrate 10.
In addition, setting height(from bottom) position-detection sensor 32 (with reference to Fig. 2) on shank 31.This height and position detecting sensor 32 is measured the height and position of the substrate 10 on the Z-direction.Specifically, to the downward Output of laser of Z direction, accept the laser by substrate 10 reflections, thereby can be measured to the Z direction distance of substrate 10.Then, according to the relation to the height and position of the gap nozzle 34a of the mensuration distance of this substrate 10 and tube head 34, can calculate the height and position of substrate 10.Thereby can keep the distance of gap nozzle 34a of substrate 10 and tube head 34 for applying definitely action.
In addition, at the height and position that keeps substrate 10 foreign object detection sensor 39 is installed on the shank 31.This foreign object detection sensor 39 is used for detecting whether have foreign matter on the substrate 10.Specifically, the foreign matter sensor sends the illuminating part of laser by the shank 31 in Y direction one side and the light accepting part of the laser accepting at the shank 31 of its Y direction opposite side to send from described illuminating part consists of, and is installed in than slightly high position, substrate 10 surfaces.And, if having foreign matter on the substrate 10, then cover the laser of being accepted by light accepting part, thereby can detect foreign matter.Thereby, can prevent owing at gap nozzle 34a and 10 foreign matters of nipping of substrate gap nozzle 34a or substrate 10 being sustained damage.
Next, utilize block diagram shown in Figure 6 to describe about the formation of the control system of above-mentioned applying device.
Fig. 6 is the block diagram of the control system of the set control system 90 of this applying device of expression.As shown in Figure 6, this applying device is provided with the control device 90 of the driving of the above-mentioned various unit of control.This control device 90 has control body 91, drive control part 92, input/output unit control part 93 and external device (ED) control part 94.
The ROM of everybody CPU of knowing that control body 91 comprises the actuating logic computing, the various programs of pre-stored this CPU of control etc., in the device action process interim store various kinds of data RAM, the various programs of storage and OS, also have the HDD of the various data such as production routine etc.And control body 91 has master control part 91a, computing detection unit 91b and storage part 91c.
Computing detection unit 91b carries out computing and judgement according to the measurement structure of each sensor.In the present embodiment, according to the height and position data of utilizing height and position detecting sensor 32 to measure, the height and position of the gap nozzle 34a of computing from substrate 10 surfaces to tube head 34.And relatively this operation result and the height and position data that are stored among the aftermentioned storage part 91c are controlled so that the height and position of the gap nozzle 34a of tube head 34 reaches the height and position of regulation by master control part 91a.
In addition, judge on the substrate 10 whether have foreign matter according to the measurement result from foreign object detection sensor 39.That is, mobile coating element 30 one sides of one side judge whether to exist foreign matter according to the signal from foreign object detection sensor 39 outputs.Specifically, if the light that sends from illuminating part is blocked by foreign matter, then the signal in the illuminating part changes, thereby has foreign matter on the judgement substrate 10.And, in this case, do not begin the movement of coating element 30, end the coating action, thereby meanwhile showing to produce at touch panel 82 informs the operator unusually.
Drive control part 92 drives control linear motor 33 and servo motor 36 etc. according to the control signal from master control part 91a.Specifically, thus drive the movement of control coating elements 30 and the lifting action of tube head 34 etc. by control linear motor 33 and servo motor 36.
Each input/output unit such as input/output unit control part 93 control foreign object detection sensors 39, keyboard 83, touch panel 82.Specifically, if change at the signal of light accepting part owing to having foreign matter on the substrate 10, then input and output control part 93 to 91 outputs of control body with from signal corresponding to the signal of foreign object detection sensor 39.And, when there is foreign matter in judgement in control body 91, carry out urging the warning of warning to show to the operator at touch panel 82 by input/output unit control part 93.In addition, can apply condition setting of action etc. from keyboard 83 and touch panel 82.
External device (ED) control part 94 carries out the driving control of external device (ED) according to the control signal from master control part 91a.Be connected with vavuum pump 81 (81a, 81b) in the present embodiment, by driving this vavuum pump 81, thereby carry out absorption maintenance of substrate 10 etc. in initial adsorption section 41 and main adsorption section 42.
Next, with reference to the skeleton diagram of the position relationship of the flow chart shown in Fig. 7,8 and expression coating element 30 shown in Figure 9, describe about the action of this applying device.Also have, represent to be positioned at the coating element 30 of retreating position (position A) among Fig. 9 with solid line, represent to be positioned at the coating element 30 that height and position is measured starting position (position B) and initial film formation position (position C) with two chain-dotted lines.
At first, in step S1, carry out moving into of substrate 10.Specifically, with the state standby from the outstanding a plurality of lifter pins 51 in workbench 21 surfaces, utilizing does not have illustrated mechanical hand at the fore-end mounting substrate 10 of lifter pin 51.
Next, in step S2～S3, at workbench 21 mounting substrates 10 (substrate-placing operation).Specifically, in step S2, remain on state on the lifter pin 51 from substrate 10, accommodating the lifter pin 51 of initial adsorption section 41 than earlier timing of the lifter pin 51 of main adsorption section 42 (degree that does not fall with the substrate 10 of mounting), thereby the initial film of substrate 10 forms the initial adsorption section 41 (with reference to Fig. 3) that zone 11 is positioned in workbench 21.Thereby, because the air layer that is present between substrate 10 and the initial adsorption section 41 runs away to main adsorption section 42 sides, thereby effectively suppress air layer and be clipped between substrate 10 and the initial adsorption section 41 with bubble form.Then, be positioned in the initial adsorption section 41 if initial film forms zone 11, then detent mechanism action forms zone 11 thereby locate accurately initial film.Thereafter, make vavuum pump 81a action, in the attraction hole 41a of initial adsorption section 41 and adsorption tank 41b, produce attraction, thereby the bubble that is mixed between substrate 10 and the initial adsorption section 41 attracted to attraction hole 41a and adsorption tank 41b, simultaneously, the initial film of substrate 10 forms zone 11 and is adsorbed the initial adsorption section 41 that remains on (initial adsorption operation).Form zone 11 states with hi-Fix as the initial film of the end of this substrate 10 and be fixed, thereby carry out accurately the location of substrate 10 integral body.
Next, in step S3, carry out the absorption (main absorption process) of 10 whole of substrates, walk abreast with it simultaneously and in S4, apply action.Namely, because the initial film of substrate 10 forms the zone and 11 is attracted to the initial adsorption section 41 of workbench 21 in step S2, thereby the surface (coated film forms zone 12) of the substrate 10 corresponding with main adsorption section 42 that will also not be adsorbed is adsorbed on the main adsorption section 42 of workbench 21.Specifically, the beginning that is positioned at initial adsorption section 41 sides from the lifter pin 51 of main adsorption section 42 is housed in workbench 21 successively, is positioned in successively on the main adsorption section 42 from initial adsorption section 41 sides thereby the coated film of substrate 10 forms zone 12.Run away to successively and do not load side thereby be present in air layer between substrate 10 and the workbench 21, therefore effectively suppress air layer and be present between substrate 10 and the workbench 21 with bubble form.And, as mentioned above hi-Fix the initial film of substrate 10 form zone 11, thereby from this vavuum pump of this state action 81b, be adsorbed on the main adsorption section 42 thereby the coated film of substrate 10 is formed zone 12, substrate 10 integral body are absorbed and fixed on the workbench 21.At this moment, the bubble that is mixed in 42 of substrate 10 and main adsorption sections attracted to and attracts among hole 42a and the adsorption tank 42b.
And parallel flow chart according to Fig. 8 almost begins the coating action when the initial film that finishes substrate 10 forms the absorption in zone 11 with it.
At first, in step S41, carry out the movement of coating element 30.That is, almost when finishing substrate 10 surface sorptions corresponding with initial adsorption section 41, begin the movement of coating element 30.Specifically, coating element 30 is moved to the position (initial film forms the position C position, Fig. 9) that forms initial film at substrate 10 from retreating position (position A).
In mobile way, the height and position of beginning substrate 10 is measured among the step S42.Specifically, as shown in Figure 9, measure starting position (position B) if coating element 30 arrives height and position, the height and position that then begins substrate 10 is measured.That is, when the initial film of substrate 10 form zone 11 be positioned at height and position detecting sensor 32 under when the height and position of beginning substrate 10 measure.Then, along with the movement of coating element 30, measure continuously the height of substrate 10, according to the height and position of this measured value adjustable pipe head 34 so that the distance on the gap nozzle 34a of tube head 34 and substrate 10 surfaces is certain.
In addition, walk abreast with it in step S43, utilize foreign object detection sensor 39 beginning foreign matters to detect.That is, after the beginning height and position is measured, detect on the substrate 10 whether have foreign matter.Then, when the movement that when substrate 10 detects foreign matter, stops coating element 30, move to initial film when not detecting foreign matter and form the position.So, coating element 30 one side in initial adsorption section 41 carry out that height and position detects and foreign matter to detect one side mobile.
Next, in step S44, form initial film.Specifically, form position (C) if coating element 30 arrives initial film, then coating element 30 stops at this position.Then, the coating liquid of ejection regulation trace under the state that coating element 30 is stopped at initial film formation position, thus based on the coating liquid from gap nozzle 34a ejection, gap nozzle 34a and substrate 10 become connecting state.Namely, between gap nozzle 34a and substrate 10, utilize coating liquid to form initial film.So, the vertical initial film that forms at gap nozzle 34a forms operation thereby finish initial film.
Next, in step S45, the main coating of beginning (coated film formation operation).That is, form position movement coating element 30 from initial film again, and the ejection coating liquid, thereby form coated film on substrate 10 surfaces corresponding with main adsorption section 42.Also have, when this mainly applied the action beginning, 10 whole absorption of the substrate of step S3 finished.
Next, in step S5, carry out the taking-up of substrate 10.That is, through after mainly being coated in substrate 10 surface and finishing coated film and form of S45, the lifter pin 51 of initial adsorption section 41 and main adsorption section 42 is risen, thereby keep substrate 10 with the fore-end of lifter pin 51.Then, do not having illustrated mechanical hand to carry out the handing-over of substrate 10, discharging substrate 10 from workbench 21 surfaces.
According to such applying device and coating method, the described substrate absorption device 40 of absorption substrate has initial adsorption section 41 and main adsorption section 42, thereby, can be after the part of substrate 10 have been adsorbed in initial adsorption section 41, mobile coating element 30 begins coating to substrate 10 surfaces corresponding with initial adsorption section 41.Namely, can be after having begun substrate adsorption, at once to the substrate 10 surperficial mobile coating elements 30 corresponding with described initial adsorption section 41, thereby compare with the existing situation that after absorption fixing base 10 integral body, begins like that to apply action, can shorten the duty cycle of coating device whole.
In addition, in the above-mentioned embodiment, be illustrated about the vavuum pump 81a that is respectively equipped with generation attraction in the 41a of the attraction hole of initial adsorption section 41 and the example that in the attraction hole 42a of main adsorption section 42, produces the vavuum pump 81b of attraction, but also can as shown in figure 10, make attraction hole 41a, the 42a of initial adsorption section 41 and main adsorption section 42 produce attraction with a vavuum pump 81.Specifically, can transfer valve 44 be installed at the pipeline 84 of the attraction hole 41a, the 42a that link vavuum pump 81 and initial adsorption section 41 and main adsorption section 42, utilize control device this transfer valve 44 that can automatically switch, thereby in the attraction hole 42a of the attraction hole of initial adsorption section 41 41a and main adsorption section 42, optionally produce attraction.Owing to sharing like this vavuum pump 81, thereby can form more cheap applying device.
In addition, in the above-mentioned embodiment, about being illustrated with the example of accommodating the lifter pin 51 of initial adsorption section 41 than lifter pin 51 timing earlier of main adsorption section 42, but, also can accommodate whole lifter pins 51 with identical timing.Thereby the substrate 10 that can prevent from remaining on lifter pin 51 fore-ends falls from lifter pin 51 sides of the initial adsorption section 41 of early regularly accommodating.
Claims (7)
1. applying device possesses:
The workbench of mounting substrate; With
Coating element, ejection coating liquid when its substrate that loads on the surface with respect to described workbench relatively moves, thus form coated film at substrate,
Described applying device is characterised in that,
Described workbench is provided with the substrate absorption device that absorption keeps substrate,
Described substrate absorption device has initial adsorption section and the main adsorption section that can adsorb independently respectively action, the initial film of the substrate of the initial film of described initial adsorption section when forming the coating beginning forms the zone and adsorbs, described main adsorption section forms the zone and adsorbs the coated film that forms except this initial film the zone
After the absorption that finishes the substrate surface corresponding with described initial adsorption section, before the absorption that finishes described main adsorption section moves, described coating element begins the formation of initial film.
2. applying device according to claim 1 is characterized in that,
The initial adsorption section of described substrate absorption device and main adsorption section are formed with respectively the attraction hole that forms at the surface opening of workbench, and described substrate absorption device possesses in described attraction hole the suction device that produces attraction and optionally produces switching device shifter from the attraction of this suction device with respect to described initial adsorption section and main adsorption section.
3. applying device according to claim 1 is characterized in that,
The initial adsorption section of described substrate absorption device and main adsorption section are formed with respectively the attraction hole that forms at the surface opening of workbench, and described substrate absorption device is provided with respectively the suction device that produces attraction in the suction device that produces attraction in the attraction hole of described initial adsorption section and the attraction hole in described main adsorption section independently with respect to initial adsorption section and main adsorption section.
4. according to claim 2 or 3 described applying devices, it is characterized in that,
Described initial adsorption section and main adsorption section are formed with the surface sorption groove of substrate adsorption at described workbench, this adsorption tank is communicated with described attraction hole, and form at the surface opening of workbench, the adsorption tank of the adsorption tank of this initial adsorption section and main adsorption section distinguish independently formation by preventing the partitions that mutually links.
5. the described applying device of any one is characterized in that according to claim 1～3,
The initial adsorption section of described substrate absorption device and main adsorption section possess the pin member that keeps substrate, this pin member is housed in respectively in the workbench, and can arrange highlightedly from the surface of workbench, the pin member of described initial adsorption section is housed in the workbench first than the pin member of described main adsorption section.
6. applying device according to claim 5 is characterized in that,
The pin member of described main adsorption section is housed in the workbench successively from described initial adsorption section side.
7. a coating method is the coating method of applying device, comprising:
The substrate-placing operation is at the surface of workbench mounting substrate;
Initial film forms operation, and the substrate that loads at described workbench under the state that the coating element that makes the ejection coating liquid stops to form initial film;
Coated film forms operation, and after forming described initial film, in the time of from coating element ejection coating liquid this coating element is relatively moved with respect to substrate, thereby form coated film at substrate,
Described coating method is characterised in that,
Described substrate-placing operation has the surface sorption operation of substrate adsorption at workbench,
This absorption process comprises: the initial film to the substrate that forms described initial film forms the initial adsorption operation of adsorbing in the zone; The coated film of substrate that forms except this initial film the zone is formed the main absorption process that adsorb in the zone,
After finishing described initial adsorption operation, finish described main absorption process before, begin described initial film and form operation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007291111 | 2007-11-08 | ||
| JP2007-291111 | 2007-11-08 | ||
| JP2007291111A JP5148248B2 (en) | 2007-11-08 | 2007-11-08 | Coating apparatus and coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101428264A CN101428264A (en) | 2009-05-13 |
| CN101428264B true CN101428264B (en) | 2013-03-06 |
Family
ID=40644025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101745641A Active CN101428264B (en) | 2007-11-08 | 2008-11-10 | Coating device and method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5148248B2 (en) |
| KR (1) | KR101513016B1 (en) |
| CN (1) | CN101428264B (en) |
| TW (1) | TWI458565B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9707584B2 (en) | 2014-07-09 | 2017-07-18 | Nordson Corporation | Dual applicator fluid dispensing methods and systems |
| CN109669286B (en) * | 2019-02-19 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Polarizing plate attaching device |
| DE102020113109B4 (en) * | 2020-05-14 | 2023-07-06 | Schmoll Maschinen Gmbh | Processing station and method for checking or identifying plate-shaped workpieces |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1754629A (en) * | 2004-08-31 | 2006-04-05 | 东京応化工业株式会社 | Base board platform and base board adsorption and peel off method |
| CN1840241A (en) * | 2005-03-31 | 2006-10-04 | 东丽工程株式会社 | Applicator device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01165166U (en) * | 1988-04-29 | 1989-11-17 | ||
| JPH1086085A (en) * | 1996-09-19 | 1998-04-07 | Dainippon Screen Mfg Co Ltd | Substrate adsorption device and method |
| JPH11125811A (en) * | 1997-10-24 | 1999-05-11 | Sharp Corp | Production of liquid crystal display element and apparatus for producing liquid crystal display element |
| JP2006289162A (en) * | 2005-04-06 | 2006-10-26 | Hitachi Plant Technologies Ltd | Coater |
| JP4673180B2 (en) * | 2005-10-13 | 2011-04-20 | 東京エレクトロン株式会社 | Coating apparatus and coating method |
-
2007
- 2007-11-08 JP JP2007291111A patent/JP5148248B2/en active Active
-
2008
- 2008-10-09 TW TW097138873A patent/TWI458565B/en active
- 2008-11-05 KR KR1020080109439A patent/KR101513016B1/en active IP Right Grant
- 2008-11-10 CN CN2008101745641A patent/CN101428264B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1754629A (en) * | 2004-08-31 | 2006-04-05 | 东京応化工业株式会社 | Base board platform and base board adsorption and peel off method |
| CN1840241A (en) * | 2005-03-31 | 2006-10-04 | 东丽工程株式会社 | Applicator device |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2000-126668A 2000.05.09 |
| JP特开平9-253566A 1997.09.30 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101428264A (en) | 2009-05-13 |
| KR20090048330A (en) | 2009-05-13 |
| KR101513016B1 (en) | 2015-04-17 |
| TWI458565B (en) | 2014-11-01 |
| TW200922695A (en) | 2009-06-01 |
| JP5148248B2 (en) | 2013-02-20 |
| JP2009112985A (en) | 2009-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101274313A (en) | Coating device and coating method | |
| US9144818B2 (en) | Method and apparatus for dispensing a viscous material on a substrate | |
| CN102271919B (en) | Solder feeder, printer, and print method | |
| CN101428264B (en) | Coating device and method | |
| CN101713924B (en) | A device for treating substrate and a method of cardinal plate loading | |
| CN101846884B (en) | Coating device | |
| CN1757439B (en) | Substrate processing device and method | |
| CN103301998A (en) | Coating device | |
| CN101712023A (en) | Lift pin | |
| CN100400180C (en) | Thin seam nozzle and substrate treating device | |
| CN101439329B (en) | Coating device and substrate keeping method thereof | |
| CN107812628A (en) | Substrate board treatment and substrate processing method using same | |
| CN101518769B (en) | Coating device | |
| CN215141614U (en) | Slit extrusion type high-precision flat plate coating machine | |
| JP4982292B2 (en) | Coating apparatus and coating method | |
| CN113210205A (en) | Slit extrusion type high-precision flat plate coating machine and coating method | |
| CN103128034A (en) | Coating device | |
| JP2009043829A (en) | Coater and coating method | |
| CN104069981B (en) | The manufacture method of gap nozzle, substrate board treatment and gap nozzle | |
| KR20120079982A (en) | Apparatus for transferring the substarate vertically | |
| KR100966089B1 (en) | Thin film coating apparatus | |
| WO2013121814A1 (en) | Coating device | |
| CN103662694A (en) | Substrate floating device and substrate floating quantity measuring method | |
| TWI549758B (en) | Method of supplying liquid crystal to liquid-crystal dispenser | |
| JP2011005465A (en) | Coating apparatus and coating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |