JP2003188246A - Method and apparatus for sucking substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for sucking a substrate capable of sucking the substrate, such that the substrate is easily and surely sucked to a sucking part provided on a holder surface and brought in a flat state, even if the substrate is deflected and placed on supporting members, in a circumstance where the substrate such as a silicon wafer or a glass plate is sucked to the holder. <P>SOLUTION: In this method for sucking the substrate, one surface of the substrate is sucked to the sucking part provided on the holder surface. This method comprises the steps of supporting the peripheral part of the substrate by a plurality of supporting members so that the peripheral part of the one surface of the substrate is held at a predetermined spacing from the holder surface, sucking the substrate toward the holder surface side, and moving the supporting members in the direction that makes the one surface of the substrate and the holder surface nearer. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate suction method and a substrate suction device for sucking a substrate such as a silicon wafer or a glass plate on a holder.

[0002]

2. Description of the Related Art Conventionally, for example, in an exposure apparatus for transferring a fine pattern to a silicon wafer, an apparatus for inspecting the silicon wafer, or the like, an intake hole formed in a holder in order to secure the flatness of the substrate. The substrate is sucked onto the holder surface by sucking the air on the holder surface through.

18 and 19 simply show a conventional substrate suction device. In this substrate suction device,
The disc-shaped holder 101 is provided with a plurality of ring-shaped protrusions 101b on the holder surface 101a at concentric intervals. And between the ring-shaped protrusions 101b,
A ring-shaped groove 101c is formed. The bottom surface of the ring-shaped groove 101c has an intake hole 1 formed in the holder 101.
It is connected to 01d. The intake holes 101d are provided at predetermined positions at intervals of 180 degrees in the circumferential direction of the ring-shaped groove 101c.

A disc-shaped support member 103 is provided at the center of the disc-shaped holder 101. At the lower end of each of the intake holes 101d, as shown in FIG.
Is connected to one end of the small tube 105, and the other end of the small tube 105 is
It is connected to the upper surface of the relay connector 107. And
A plurality of small tubes 10 are provided on the lower surface of the relay connector 107.
A large tube 109 that connects the five flow paths into one is connected.

FIG. 20 shows the holder surface 101a of the substrate 111.
20A and 20B, the substrate 111 whose center is bent concavely with respect to the holder surface 1a is placed on the support member 103, as shown in FIG. . Then, as shown in FIG. 20 (b), the vicinity of the center of the substrate 111 is brought close to the holder surface 101a while being attracted to the holder surface 101a side, and then, as shown in FIG. The bending is moderated. Then, finally, as shown in FIG. 20D, the substrate 111 is flattened.

[0006]

However, in the above-described substrate suction method and substrate suction device, for example,
As shown in FIG. 21, when the substrate 111 whose center is bent in a convex shape with respect to the holder surface 101a is placed on the support member 103, the substrate 111 becomes flat when adsorbed on the holder surface 101a. There was a problem of not becoming.

The reason why such a substrate 111 is not flat is explained as follows with reference to the drawing of the adsorption process shown in FIG. The substrate 111 is first placed on the support member 103 as shown in FIG. 21A, and then the outer peripheral portion thereof is brought into contact with the holder surface 101a as shown in FIG. 21B. And the holder surface 10
A hermetically sealed state is formed on the outer peripheral portions of 1a and the substrate 111, and the outer peripheral portions are restrained. Next, as shown in FIG. 21 (c), air is taken in through the air intake hole 101d, and the vicinity of the center where the strength is weak is recessed, and a bulge portion is formed between the vicinity of the center and the vicinity of the periphery. Finally, if the outer peripheral portion is fixed, as shown in FIG.
As shown in (d), since the length of the substrate 111 does not change, it stabilizes in the state shown in FIG. 21 (d).

The present invention has been made in order to solve such a conventional problem, and irrespective of the bending state of the substrate, the substrate can be easily and surely attracted to the adsorption portion provided on the holder surface in a flat state. An object of the present invention is to provide a substrate suction method and a substrate suction device that can perform such a suction.

[0009]

According to a first aspect of the present invention, there is provided a substrate suction method in which one surface of a substrate is sucked by a suction portion provided on a holder surface, and a plurality of peripheral portions of the substrate are provided. A supporting step of supporting the peripheral surface of one surface of the substrate and the holder surface with a predetermined distance, and a suction step of sucking the substrate to the holder surface side.
A moving step of moving the supporting member in a direction in which one surface of the substrate and the holder surface approach each other.

A substrate suction method according to a second aspect is the substrate suction method according to the first aspect, wherein the suction step and the moving step are performed in parallel. The suction device according to claim 3 supports a holder having a holder surface provided with a suction portion for sucking one surface of a substrate, and a peripheral portion of the substrate in a state of being separated from the holder surface for a predetermined period. A plurality of possible supporting members, a moving unit that moves the plurality of supporting members in a direction in which one surface of the substrate and the holder surface approach each other, and one surface of the substrate is sucked by the suction unit. And a suction means.

According to a fourth aspect of the present invention, there is provided the substrate suction apparatus according to the third aspect, wherein the suction means has an intake hole formed in the holder for sucking air near the holder surface. . According to a fifth aspect of the present invention, in the suction device of the substrate according to the third or fourth aspect,
It is characterized in that three supporting members are arranged and support three portions of the peripheral portion of the substrate.

[0012]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to the drawings. (First Embodiment) FIGS. 1 to 4 show a first embodiment of a substrate suction device of the present invention. 1 is a top view of the substrate suction device, and FIG. 2 is a sectional view taken along line II-II of FIG.

The substrate suction device according to the first embodiment is
It has a holder 1, a pin 3 as a support member, and a suction device 4. A holder surface 1 a is formed on the holder 1. On the holder surface 1a, a plurality of ring-shaped protrusions 1b, which are suction parts, are concentrically provided. A ring-shaped groove 1c is formed between the ring-shaped protrusions 1b. On each bottom surface of the ring-shaped groove 1c, two intake holes 1d formed in the holder 1 and provided at predetermined positions at 180 ° intervals are opened.

On the outside of the outermost ring-shaped protrusion 1b, three pin holes 1e are formed concentrically with the ring-shaped protrusion 1b at intervals of 120 degrees. The pins 3 that are support members are inserted into the pin holes 1e. The suction device 4 has a small tube 5 connected to each lower end of the intake holes 1d and a relay connector 7 connected to the other end of the small tube 5. Further, the suction device 4 has a large tube 9 which is connected to the lower surface of the relay connector 7 and combines a plurality of flow paths of the small tube 5 into one.

FIG. 3 is a view showing a moving means 10 for the pin 3 arranged below the holder 1, and FIG. 4 is a III-I of FIG.
It is a II sectional view. A square tube 14 is brazed to the lower surface of the holder 1 by melting a brazing metal 12 made of metal. Further, the pin 3 has a diameter portion 3a fitted into the pin hole 1e and a corner portion 3b fitted into the square tube 10 having a female screw 3c formed therein, which are integrally formed. The upper end side of the male screw 11 is screwed into the female screw 3c, and the pulse motor 13 is provided on the lower end side.

When moving the pin 3,
When the pulse motor 13 rotates, depending on the rotation amount,
The male screw 11 moves in the axial direction, and the pin 3 moves up and down. 5 to 7 show a first method of adsorbing a substrate according to the present invention.
2 shows an embodiment of the present invention. Specifically, the process of adsorbing the substrate 15A to the ring-shaped protrusion 1b provided on the holder surface 1a is shown.

FIG. 5 shows a process in which the substrate 15A bent in a concave shape with respect to the holder surface 1a is placed on the pin 3 and sucked toward the holder surface 1a. As shown in FIG. 5A, the substrate 15A bent in a concave shape with respect to the holder surface 1a.
However, the peripheral portion 15b is supported by the three pins 3, and the peripheral portion 15b of the substrate lower surface 15c and the holder surface 1a are arranged at a predetermined distance L. Then, as shown in FIG.
The three pins 3 move in a direction in which the substrate lower surface 15c and the holder surface 1a approach each other. That is, the three pins 3 simultaneously descend at a constant speed. Then, in parallel with this lowering operation, the suction device 4 is activated, air in the vicinity of the holder surface 1a is sucked, and the substrate 15A is sucked to the holder surface 1a side.
In this case, as shown in FIG. 5 (b), first, the central portion 15a of the substrate 15A is sucked toward the holder 1a side, and then, as shown in FIG.
As shown in (c), the entire substrate 15A is sucked and becomes flat, and the tip side of the pin 3 is housed in the pin hole 1e.

FIG. 6 shows a process in which the substrate 15A bent in a convex shape with respect to the holder surface 1a is placed on the pin 3 and sucked toward the holder surface 1a. As shown in FIG. 6A, the substrate 15A bent in a convex shape with respect to the holder surface 1a.
However, the peripheral portion 15b is supported by the three pins 3, and the peripheral portion 15b of the substrate lower surface 15c and the holder surface 1a are arranged at a predetermined distance L. Next, in FIGS. 6B and 6C, the pin 3 moves in the same manner as in FIGS. 5B and 5C, and the suction device 4 is activated in parallel with the movement of the pin 3 to move the substrate. 15A is attracted to the holder surface 1a side. In this case,
As shown in (b), first, the central portion 15a of the substrate 15A.
Is sucked toward the holder 1a, and then the entire substrate 15A is sucked into a flat shape as shown in FIG.
The tip end side of is stored in the pin hole 1e.

FIG. 7 shows a process in which the substrate 15B in which the central portion 15a is bent concavely with respect to the holder surface 1a and the peripheral portion 15b is hung down is placed on the pin 3 and sucked toward the holder surface 1a. Is shown. As shown in FIG. 7A, the central portion 15a bends in a concave shape with respect to the holder surface 1a,
Further, the substrate 15B having the peripheral portion 15b hanging down is supported by the three pins 3 on the peripheral portion 15b, and the substrate lower surface 1
The peripheral portion 15b of 5c and the holder surface 1a have a predetermined distance L.
To be Next, in FIGS. 7B and 7C, the pin 3 is moved in the same manner as in FIGS. 5B and 5C, and the suction device 4 is activated in parallel with the movement of the pin 3 to move the substrate. 15A
Are attracted to the holder surface 1a side. In this case, first,
As shown in (b), the substrate 15B has a peripheral portion 15
It is made almost flat except for b. Then, as shown in FIG. 7C, the pin 3 is further lowered, the peripheral portion 15b of the substrate 15B is not bent and becomes flat, and the tip end side of the pin 3 is housed in the pin hole 1e. .

In the substrate suction device according to the first embodiment, the pin 3 serves to attach the peripheral portions 15b of the substrates 15A and 15B.
Is supported, and the substrates 15A and 15B can be gradually adsorbed from the central portion 15a to the peripheral portion 15b. Therefore, the substrates 15A and 15B can be easily and reliably flattened on the ring-shaped protrusion 1b provided on the holder surface 1a. It can be adsorbed in the state.

By adjusting the suction strength of the air by the suction device 4, the substrate 15A,
15B can be adsorbed, and it is not necessary to hold the substrates 15A and 15B with a relatively strong force as in the case of directly pressing and holding the substrates 15A and 15B.
It is possible to prevent the B from being plastically deformed such as a scratch.

Further, in the substrate suction device according to the first embodiment, the three pins 3 are brought into contact with the peripheral portions 15b of the substrates 15A and 15B, and the center angles thereof are concentric with the ring-shaped protrusion 1b. Since they are provided 120 degrees apart, the substrates 15A and 15B can be supported in a stable state by the minimum number of pins 3 required. That is, for example, pin 3 is 4
If more than one pin 3 is provided, the pins 3 that do not contact the substrates 15A and 15B will appear unless the protrusion lengths of the pins 3 from the holder surface 1a are all equal. Can be prevented.

In the substrate suction method according to the first embodiment, after the peripheral portions 15b of the substrates 15A and 15B are supported by the three pins 3 arranged at an angle of 120 degrees on the same circumference, The substrates 15A and 15B are sucked toward the holder surface 1a, and the three pins 3 are moved in a direction in which the substrate lower surface 15c and the holder surface 1a approach each other.
5B is gradually adsorbed from the central portion 15a to the peripheral portion 15b, so that the tip ends of the three pins 3 are pin holes 1.
When stored in e, the substrates 15A and 15B can be attracted to the ring-shaped protrusion 1b on the holder surface 1a in a flat state.

In the first embodiment, the example in which the male screw 11 is used as the moving means 10 of the pin 3 has been described, but it is sufficient if the male screw 11 can be moved linearly. For example, a hydraulic pressure using a cylinder and a piston. A mechanism may be used. (Second Embodiment) FIGS. 8 and 9 show a second embodiment of the substrate suction device of the present invention.

In the second embodiment, the first
The same members as those in the above embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. 8 is a top view of the substrate suction device, and FIG. 9 is a sectional view taken along line IV-IV of FIG. In the substrate suction device of the second embodiment, three claw-shaped members 17 are used as support members. The claw-shaped member 17 is provided concentrically with the ring-shaped protrusion 1b with a central angle of 120 degrees.

Further, due to the provision of the claw-shaped member 17, the holder 1 is provided with the notch 1f.
The notch 1f is formed on the outer circumference of the holder 1 with a central angle of 120 degrees. 10 and 11 schematically show a carrier device for holding and carrying the substrate 15A by the claw-shaped member 17.

In this carrying device 19, the substrate 15A is connected to the substrate 1
5A, a displacement mechanism 21 for moving in the horizontal direction, and a rotatable arm 23 connected to the tip end side of the displacement mechanism 21.
R and 23L. A rotation mechanism 25 is provided on the base end side of the displacement mechanism 21. This rotation mechanism 2
A vertical movement mechanism 27 that moves the substrate 15A in the vertical direction is connected to the unit 5.

Each of the arms 23R and 23L is provided with one claw-shaped member 17. In addition, the displacement mechanism 2
One claw-shaped member 17 is also provided at the tip of 1. Then, in this transfer device 19, when the substrate 15A is transferred to the holder 1, first, as shown in FIGS. 10 and 11, the substrate 15A is placed on the claw-shaped member 17 and is linearly moved by the displacement mechanism 21. The movement in the direction and the movement in the rotation direction by the rotation mechanism 25 move the substrate 15A onto the holder surface 1a. Then, by the vertical movement mechanism 27,
As shown in FIG. 12A described later, the substrate 15A is brought close to the holder surface 1a. Next, the substrate 15A is sucked toward the holder surface 1a side, and while the suction is performed, the vertical movement mechanism 27 further brings the substrate 15A and the holder surface 1a close to each other. Then, the vertical movement mechanism 27 is operated until the substrate 15A is attracted to the ring-shaped protrusion 1b on the holder surface 1a and the claw-shaped member 17 is separated from the substrate 15A for a predetermined period. Next, the arcuate arms 23R and 23L are rotated in opposite directions to separate the three claw-shaped members 17 from the substrate 15A. Then, when the claw-shaped member 17 and the substrate 15A are sufficiently separated, the vertical movement mechanism 27 moves the claw-shaped member 17 above the substrate 15A. Finally, the claw-shaped member 1
7 to a position where it is separated from the substrate 15A for a predetermined time,
The displacement mechanism 21 retracts the claw-shaped member 17.

FIG. 12 shows a claw-shaped member 17 in the process of sucking the substrate 15A bent in a convex shape with respect to the holder surface 1a.
Shows the movement of. First, as shown in FIG. 12A, the substrate 15A bent in a convex shape with respect to the holder surface 1a is
The peripheral portion 15b is supported by the three claw-shaped members 17, and the peripheral portion 15b of the substrate lower surface 15c and the holder surface 1a are arranged at a predetermined distance L. Next, as shown in FIG. 12B, the three claw-shaped members 17 are moved in a direction in which the substrate lower surface 15c and the holder surface 1a approach each other, and the central portion 15a of the substrate 15A is sucked toward the holder surface 1a side. While approaching the holder surface 1a. Then, as shown in FIG. 12C, the substrate 15A is flattened. Finally, FIG.
As shown in (d), the claw-shaped member 17 spreads in the radial direction,
It is separated from the substrate 15A.

The substrate suction device according to the second embodiment as described above also has the same effect as that of the first embodiment. In the substrate suction device according to the second embodiment, the substrates 15A and 15B can be moved three-dimensionally by the transfer device 19. Therefore, the displacement mechanism 21, the rotation mechanism 25, and the vertical mechanism can be vertically moved by a pulse motor or the like. By driving the moving mechanism 27, the substrates 15A and 15B can be moved accurately.

In the second embodiment, the displacement mechanism 21, the rotation mechanism 25, and the vertical movement mechanism 27 are driven to form a cylindrical coordinate system for the claw-shaped member 17. However, 3 has been described. It suffices that the claw-shaped member 17 can be moved dimensionally, and for example, an orthogonal coordinate system having three axes orthogonal to each other may be configured. (Third Embodiment) FIGS. 13 to 15 show a third embodiment of the substrate suction device of the present invention. FIG. 13 is a top view of the substrate suction device of the third embodiment.
4 is a sectional view taken along line VI-VI in FIG. This substrate suction device is different from the substrate suction device of the first embodiment (FIG. 1) in that, instead of supporting the substrate by the ring-shaped protrusion 1b, a large number of small pin-shaped members are formed on the holder surface 31a. The protrusion 31p has a structure of supporting the substrate.

The holder 31 has intake holes 31d arranged at a plurality of places, which are connected to the suction device 4 similar to that shown in FIG. The pin 3, the small tube 5, the relay connector 7, the large tube 9, and the suction device 4 are the same members as those shown in FIG. 1 or FIG. FIG. 15 shows a process in which the substrate 15A is placed on the pins 3 and sucked toward the holder surface 1a.

As shown in FIG. 15A, the substrate 15A
However, the peripheral portion 15b is supported by the three pins 3, and the peripheral portion 15b of the substrate lower surface 15c and the holder surface 31a are arranged at a predetermined distance L. Next, as shown in FIG. 15B, the three pins 3 descend in the direction in which the substrate lower surface 15c and the holder surface 31a approach each other. Then, in parallel with this lowering operation, the suction device 4 is activated, the air in the vicinity of the holder surface 1a is sucked from the suction hole 31d, and the substrate 15A is sucked to the holder surface 31a side. Here, if only the pin-shaped protrusion 31p is used, a closed space cannot be obtained even if air is sucked in through the intake hole 31d, and leakage occurs. Therefore, one ring-shaped protrusion 31r is formed only in the peripheral portion of the holder 31. ing.

On the outside of the ring-shaped protrusion 31r, three pin holes 31e are formed concentrically with the ring-shaped protrusion 31r at intervals of 120 degrees, and the pin 3 is inserted into each of them. As shown in FIG. 15B, the pins 3 descend and the substrate 15A becomes flat, and the tip ends of the pins 3 are housed in the pin holes 31e. The substrate suction device according to the third embodiment as described above also has the same effects as the substrate suction device according to the first embodiment.

(Fourth Embodiment) FIGS. 16 and 17
Shows a fourth embodiment of the substrate suction device of the present invention. In addition, in this 4th Embodiment, the same code | symbol is attached | subjected to the member same as 3rd Embodiment, and detailed description is abbreviate | omitted. FIG. 16 is a top view of the substrate suction device,
FIG. 17 is a sectional view taken along line VII-VII of FIG. In the substrate suction device of the fourth embodiment, three claw-shaped members 17 are used as support members, and the holder 31 is provided with a cutout 31f. Since these configurations are similar to the claw-shaped member 17 and the cutout portion 1f in the second embodiment, the description thereof will be omitted.

The carrying device for holding and carrying the substrate 15A by the claw-shaped member 17 is also similar to the carrying device 19 shown in FIGS. 10 and 11 in the second embodiment, and therefore its explanation is omitted. Regarding the operation of the substrate suction device of the fourth embodiment, in the state of FIG. 17, the substrate is supported at its peripheral portion by the three claw-shaped members 17, and the three claw-shaped members 17 descend. The suction device 4 is activated and the substrate is sucked toward the holder surface 31a. This operation is the same as the description with reference to FIG. 12 in the second embodiment, so detailed description will be omitted.

The substrate suction device according to the fourth embodiment as described above also has the same effect as the substrate suction device according to the second embodiment. In the first to fourth embodiments described above, the substrate 15A,
15B is a ring-shaped protrusion 1 on the holder surfaces 1a and 31a.
Although the example of adsorption to b and 31r has been described, electrostatic attraction or magnetic attraction may be used (for example, JP-A-11-06).
7885 gazette).

[0038]

As described above, in the substrate suction method of the present invention, after the peripheral portion of the substrate is supported by the plurality of supporting members, the substrate is sucked toward the holder surface side and the one surface of the substrate and the holder are supported. Since the support member is moved in the direction of approaching the surface, the substrate is gradually adsorbed from the central portion to the peripheral portion, so that the adsorption portion provided on the holder surface can easily and reliably flatten the substrate. It can be adsorbed in the state.

[Brief description of drawings]

FIG. 1 is a top view showing a substrate suction device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

3 is a sectional view taken along the line II-II of FIG. 1 including a pin moving mechanism.

FIG. 4 is a sectional view taken along line III-III in FIG.

FIG. 5 is an explanatory diagram showing a suction process of the substrate according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram showing a suction process of the substrate according to the first embodiment of the present invention.

FIG. 7 is an explanatory diagram showing a suction process of the substrate according to the first embodiment of the present invention.

FIG. 8 is a top view showing a substrate suction device according to a second embodiment of the present invention.

9 is a sectional view taken along line IV-IV in FIG.

FIG. 10 is a top view showing a substrate transfer device according to a second embodiment of the present invention.

FIG. 11 is a side view showing a substrate transfer device according to a second embodiment of the present invention.

FIG. 12 is an explanatory diagram showing a suction process of a substrate according to the second embodiment of the present invention.

FIG. 13 is a top view showing a substrate suction device according to a third embodiment of the present invention.

14 is a sectional view taken along line VI-VI of FIG.

FIG. 15 is an explanatory diagram showing a suction process of a substrate according to the third embodiment of the present invention.

FIG. 16 is a top view showing a substrate suction device according to a fourth embodiment of the present invention.

17 is a sectional view taken along line VII-VII of FIG.

FIG. 18 is a top view showing a conventional substrate suction device.

19 is a sectional view taken along line VV of FIG.

FIG. 20 is an explanatory diagram showing a conventional substrate suction process.

FIG. 21 is an explanatory diagram showing a conventional substrate suction process.

[Explanation of symbols]

1,31 holder 1a, 31a Holder surface 1b Ring-shaped protrusion 1d, 31d intake hole 3 pin 4 aspirator 15A, 15B substrate 15b peripheral part 15c Bottom surface of substrate 17 Claw-shaped member 31p Pin-shaped protrusion 31r Ring-shaped protrusion

Claims (5)

[Claims] 1. A method of adsorbing a substrate in which one surface of the substrate is adsorbed to an adsorption portion provided on a holder surface, wherein a peripheral portion of the substrate is supported by a plurality of supporting members, and one surface of the substrate is provided. A step of supporting the peripheral portion and the holder surface with a predetermined distance, a suction step of sucking the substrate toward the holder surface, and the support member, one surface of the substrate and the holder surface. And a moving step of moving the substrate in an approaching direction. 2. The substrate suction method according to claim 1, wherein the suction step and the moving step are performed in parallel. 3. A holder having a holder surface provided with an adsorption portion for adsorbing one surface of a substrate, and a plurality of holders capable of supporting a peripheral portion of the substrate in a state of being separated from the holder surface for a predetermined period. A supporting member, a moving unit that moves the plurality of supporting members in a direction in which one surface of the substrate and the holder surface approach, and a suction unit that suctions one surface of the substrate to the suction unit. An apparatus for adsorbing a substrate, comprising: 4. The substrate suction device according to claim 3, wherein the suction means has an intake hole formed in the holder for sucking air in the vicinity of the holder surface. 5. The substrate suction device according to claim 3 or 4, wherein three support members are arranged, and support three positions of a peripheral portion of the substrate. .