JPH05304071A - Stage of light exposure device - Google Patents
Stage of light exposure deviceInfo
- Publication number
- JPH05304071A JPH05304071A JP10720892A JP10720892A JPH05304071A JP H05304071 A JPH05304071 A JP H05304071A JP 10720892 A JP10720892 A JP 10720892A JP 10720892 A JP10720892 A JP 10720892A JP H05304071 A JPH05304071 A JP H05304071A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- stage
- semiconductor substrate
- segments
- exposure device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は露光装置における半導体
基板であるウェーハを保持する露光装置のステージに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage of an exposure apparatus which holds a wafer which is a semiconductor substrate in the exposure apparatus.
【0002】[0002]
【従来の技術】図3は従来の露光装置のステージの一例
を示す部分図である。従来、この種の露光装置のステー
ジ(以下単にステージと呼び)は、図3に示すように、
ベース6に対してX及びY方向に移動するX方向駆動部
4及びY方向駆動部5と、X方向駆動部4に搭載されて
いるとともにZ方向(上下方向)に移動するZ方向駆動
部3と、このZ方向駆動部に搭載されているとともに表
面に吸着穴7が放射状の位置に形成されるステージ本体
1aとを有している。2. Description of the Related Art FIG. 3 is a partial view showing an example of a stage of a conventional exposure apparatus. Conventionally, a stage of an exposure apparatus of this type (hereinafter simply referred to as a stage) is as shown in FIG.
An X-direction drive unit 4 and a Y-direction drive unit 5 that move in the X and Y directions with respect to the base 6, and a Z-direction drive unit 3 that is mounted on the X-direction drive unit 4 and that moves in the Z direction (vertical direction). And a stage main body 1a mounted on the Z-direction drive section and having suction holes 7 formed in radial positions on the surface.
【0003】この露光装置でウェーハ面にパターンを転
写する場合は、このステージにウェーハ確実に保持する
とともに転写ぼけがないように、ウェーハはその平坦度
を精度良く保つ必要があった。このステージにおけるウ
ェーハの保持方法は、ステージ本体1aの吸着穴7から
真空排気し、ウェーハ8をステージ本体1aの面に密着
させることで行っていた。When the pattern is transferred to the wafer surface by this exposure apparatus, it is necessary to hold the wafer securely on this stage and to keep the flatness of the wafer with high precision so that there is no transfer blur. The method of holding the wafer on this stage has been performed by evacuating the wafer through the suction holes 7 of the stage body 1a and bringing the wafer 8 into close contact with the surface of the stage body 1a.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上述し
た従来のステージでは、ステージのウェーハをステージ
本体面に吸着させて保持しているので、ウェーハが湾曲
していると、保持されなかったり、保持されても、湾曲
したまま保持されているためパターン位置のずれや、焦
点ばけによるパターン形状不良を起すという問題があっ
た。However, in the above-described conventional stage, since the wafer of the stage is held by being attracted to the surface of the stage body, when the wafer is curved, it is not held or is held. However, since it is kept curved, there is a problem in that the pattern position shifts and the pattern shape defect due to defocus occurs.
【0005】本発明の目的は、かかる問題を解消すべ
く、ウェーハの湾曲を矯正し、平坦に保ち保持するステ
ージを提供することである。An object of the present invention is to provide a stage that corrects the curvature of the wafer and keeps it flat in order to solve such problems.
【0006】[0006]
【課題を解決するための手段】本発明の露光装置のステ
ージは、半導体基板を載置する円板状のステージ本体を
備え、このステージ本体を複数の同心円状の円筒部材に
分割し、これら同心円状の円筒部材が上下方向に互いに
摺動し得るとともに各円筒部材に前記半導体基板と接触
して吸着する吸着穴を有し、前記各円筒部材が前記半導
体基板に対応する部分を吸着保持して移動することによ
って前記半導体基板の湾曲を平坦に矯正することを特徴
としている。A stage of an exposure apparatus according to the present invention comprises a disc-shaped stage body on which a semiconductor substrate is mounted, and the stage body is divided into a plurality of concentric circular cylindrical members. -Shaped cylindrical members are capable of sliding in the vertical direction, and each cylindrical member has a suction hole for contacting and adsorbing the semiconductor substrate, and each cylindrical member adsorbs and holds a portion corresponding to the semiconductor substrate. It is characterized in that the curvature of the semiconductor substrate is corrected to be flat by moving the semiconductor substrate.
【0007】[0007]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【0008】図1は本発明の露光装置のステージの一実
施例を示す部分断面図、図2は図1のステージの動作を
説明するためのステージ本体の断面図である。このステ
ージは、図1に示すように、ステージ本体1を円筒状の
セグメント9a,9b,9c,9d,9eに分割し、そ
れぞれのセグメントが独立して高さ方向に移動調整出来
るようにしたことである。FIG. 1 is a partial sectional view showing an embodiment of the stage of the exposure apparatus of the present invention, and FIG. 2 is a sectional view of the stage body for explaining the operation of the stage of FIG. In this stage, as shown in FIG. 1, the stage main body 1 is divided into cylindrical segments 9a, 9b, 9c, 9d, 9e, and each segment can be independently moved and adjusted in the height direction. Is.
【0009】次に、このステージの動作について説明す
る。ここで、図2(a)に示すように、ウェーハ8が下
側に凸に湾曲しているものと仮定する。まず、湾曲めに
接触するように、各セグメント9a〜9eは上昇し、各
セグメント9a〜9eの先端部がウェーハ8と接触す
る。次に、各セグメント9a〜9eに設けられた吸着穴
7より真空排気する。このことにより、各セグメント9
a〜9eはウェーハ8を湾曲した状態で吸着保持する。
次に、各セグメント9a〜9eは下降し、その先端部を
同一面内に揃うようにする。このことにより、図2
(b)に示すように、ウェーハ8は湾曲が矯正され、表
面は所望の平坦度を保ち保持される。Next, the operation of this stage will be described. Here, it is assumed that the wafer 8 is convexly curved downward as shown in FIG. First, each of the segments 9a to 9e rises so that the segments 9a to 9e contact with the wafer 8 so as to make a curved contact. Next, vacuum suction is performed through the suction holes 7 provided in each of the segments 9a to 9e. As a result, each segment 9
a to 9e adsorb and hold the wafer 8 in a curved state.
Next, each of the segments 9a to 9e descends so that the tips thereof are aligned in the same plane. As a result, FIG.
As shown in (b), the wafer 8 is straightened, and the surface is maintained at a desired flatness.
【0010】[0010]
【発明の効果】以上説明したように、本発明は、ウェー
ハを載置する円板状のステージ本体を複数の同心円筒状
のセグメントに分割し、ウェーハの湾曲に応じて各セグ
メントの先端部の高さを調整し、その先端部をウェーハ
の各部と接触させ吸着保持し、各セグメントの位置を戻
すことによりウェーハの湾曲を平坦になるように矯正す
ることによって、転写するパターンの位置ずれやパター
ン形状のぼけを無くすことのできるという効果がある。As described above, according to the present invention, the disc-shaped stage main body on which the wafer is placed is divided into a plurality of concentric cylindrical segments, and the tip portion of each segment is divided according to the curvature of the wafer. Adjusting the height, adsorbing and holding the tip part with each part of the wafer by suction, and returning the position of each segment to correct the curvature of the wafer so that it becomes flat. This has the effect of eliminating the blurring of the shape.
【図1】本発明の露光装置のステージの一実施例を示す
部分断面図である。FIG. 1 is a partial sectional view showing an embodiment of a stage of an exposure apparatus of the present invention.
【図2】図1のステージの動作を説明するためのステー
ジ本体の断面図である。FIG. 2 is a cross-sectional view of a stage body for explaining the operation of the stage of FIG.
【図3】従来の露光装置のステージの一例を示す部分図
である。FIG. 3 is a partial view showing an example of a stage of a conventional exposure apparatus.
1,1a ステージ本体 3 Z方向駆動部 4 X方向駆動部 5 Y方向駆動部 6 ベース 7 吸着穴 8 ウェーハ 9a〜9e セグメント 1, 1a Stage body 3 Z-direction drive unit 4 X-direction drive unit 5 Y-direction drive unit 6 Base 7 Adsorption hole 8 Wafer 9a to 9e Segment
Claims (1)
本体を備え、このステージ本体を複数の同心円状の円筒
部材に分割し、これら同心円状の円筒部材が上下方向に
互いに摺動し得るとともに各円筒部材に前記半導体基板
と接触して吸着する吸着穴を有し、前記各円筒部材が前
記半導体基板に対応する部分を吸着保持して移動するこ
とによって前記半導体基板の湾曲を平坦に矯正すること
を特徴とする露光装置のステージ。1. A disk-shaped stage main body for mounting a semiconductor substrate is provided, the stage main body is divided into a plurality of concentric circular cylindrical members, and the concentric circular cylindrical members can slide vertically. Along with each of the cylindrical members, there is a suction hole that comes into contact with the semiconductor substrate to suck the semiconductor substrate, and the cylindrical member is sucked and held at a portion corresponding to the semiconductor substrate to move to flatten the curvature of the semiconductor substrate. A stage of an exposure apparatus characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10720892A JPH05304071A (en) | 1992-04-27 | 1992-04-27 | Stage of light exposure device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10720892A JPH05304071A (en) | 1992-04-27 | 1992-04-27 | Stage of light exposure device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05304071A true JPH05304071A (en) | 1993-11-16 |
Family
ID=14453227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10720892A Pending JPH05304071A (en) | 1992-04-27 | 1992-04-27 | Stage of light exposure device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05304071A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181054A (en) * | 1994-12-26 | 1996-07-12 | Nikon Corp | Stage apparatus and controlling method therefor |
JP2007311374A (en) * | 2006-05-16 | 2007-11-29 | Nikon Corp | Substrate holder, exposure apparatus and manufacturing method of device |
KR20070118782A (en) * | 2006-06-13 | 2007-12-18 | 주식회사 아이피에스 | Waferblock |
JP2012253136A (en) * | 2011-06-01 | 2012-12-20 | Seiko Epson Corp | Liquid droplet discharging device, material removing method, and material feeding/removing method |
JP2013243172A (en) * | 2012-05-17 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | Peeling device and peeling method |
JP2017112343A (en) * | 2015-12-18 | 2017-06-22 | 日本特殊陶業株式会社 | Substrate holding device and substrate holding method |
CN107272351A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电技术有限公司 | Bogey and the exposure sources with the bogey |
JP2020136477A (en) * | 2019-02-19 | 2020-08-31 | 日本特殊陶業株式会社 | Substrate holding device and substrate holding method |
-
1992
- 1992-04-27 JP JP10720892A patent/JPH05304071A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181054A (en) * | 1994-12-26 | 1996-07-12 | Nikon Corp | Stage apparatus and controlling method therefor |
JP2007311374A (en) * | 2006-05-16 | 2007-11-29 | Nikon Corp | Substrate holder, exposure apparatus and manufacturing method of device |
KR20070118782A (en) * | 2006-06-13 | 2007-12-18 | 주식회사 아이피에스 | Waferblock |
JP2012253136A (en) * | 2011-06-01 | 2012-12-20 | Seiko Epson Corp | Liquid droplet discharging device, material removing method, and material feeding/removing method |
JP2013243172A (en) * | 2012-05-17 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | Peeling device and peeling method |
JP2017112343A (en) * | 2015-12-18 | 2017-06-22 | 日本特殊陶業株式会社 | Substrate holding device and substrate holding method |
CN107272351A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电技术有限公司 | Bogey and the exposure sources with the bogey |
JP2020136477A (en) * | 2019-02-19 | 2020-08-31 | 日本特殊陶業株式会社 | Substrate holding device and substrate holding method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19981027 |