JPH08181054A - Stage apparatus and controlling method therefor - Google Patents

Abstract

PURPOSE: To provide a stage apparatus in which the own weight deflection of a plate can be alleviated. CONSTITUTION: The stage apparatus comprises a support pin for sucking to support a board P on a board stage, and a conveying arm 14 to support the board P to receive and deliver it from and to a board stage support pin. The pins are substantially concentrically disposed at a plurality of groups 4a, 4b, and an elevating motion and board sucking and releasing motions can be independently controlled at each group. Thus, since the supporting height and the sucking and releasing timings of the plate P can be altered at each of the groups 4a, 4b, the own weight deflection and intrinsic warpage of the plate P can be suppressed to the minimum limit while suppressing a stress to be given to the plate P.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus for an exposure apparatus, and more particularly to a stage apparatus used for an exposure apparatus that exposes a large glass substrate when manufacturing a liquid crystal substrate.

[0002]

2. Description of the Related Art In recent years, as the demand for flat panel type display devices such as liquid crystal display devices has increased, various exposure apparatuses for processing substrates such as large glass substrates have been developed. For example, when manufacturing a large-area liquid crystal display device or the like on a glass substrate by a lithography process, a plurality of small-area exposure regions are exposed on the substrate by connecting their ends to each other (joint exposure), A step-and-repeat type projection exposure apparatus for forming a large-area element is used.

FIG. 12 shows a conventional exposure apparatus 100 for liquid crystal substrates.
Is schematically shown. As shown in the figure, a substrate stage 102 is placed on a base 101, and a substrate P such as a large glass plate (hereinafter referred to as plate P) is held as a photosensitive substrate on the substrate stage 102. Has been done. A projection optical system PL housed in a lens barrel (not shown) is installed above the plate P. Above the projection optical system PL, a photomask or reticle R (hereinafter referred to as reticle R) on which a transfer pattern is formed is held on a reticle stage (not shown). The pattern on the reticle R is the illumination optical system 10.
The pattern image on the reticle R is projected and exposed on the plate P via the projection optical system PL by being illuminated with the exposure light IL emitted from the image forming apparatus 6.

The substrate stage 102 is a plate holder 10 having a positioning stage 103 and a support pin group 104.
And 5. The positioning stage 103 is
It is composed of an X stage 103X, a Y stage 103Y, and a Z stage 103Z, and the optical axis of the projection optical system PL (Z direction).
With respect to X direction, Y direction, θ (rotation) direction, Z
The plate P can be positioned in any direction. Further, as shown in FIG. 13, the plate holder 105 includes four outer support pin groups 10 each of which is arranged in a substantially concentric shape.
4a and the inner support pin group 104b are arranged. These inner and outer support pin groups 104a and 104b are installed on a common lift plate 107 as shown in FIG. 14, and are driven up and down by a drive device 108 at the same time. In addition, in the vicinity of the substrate stage 102, the pneumatic control unit 1
09 is provided, and the plate P can be simultaneously vacuum-sucked via the suction portion 110 at the tip of each support pin 104.

Further, a slide type transfer arm 112 is installed on the transfer section base 111 near the substrate stage 102. The transfer arm 112 is a vacuum suction pad 11.
2a is provided, and the plate P can be supported by suction. Then, the transfer arm 112 can carry in the unprocessed plate P onto the substrate stage 102 and carry out the processed plate P from the substrate stage 102. A control unit 113 controls the behavior of the transfer arm 112 and the substrate stage 102.

[0006]

By the way, when a large-area plate such as a large and thin glass substrate is carried in and out by a carrier arm, and is supported by a group of support pins of the substrate stage at the time of delivery to and from the substrate stage. In addition, the plate is distorted due to its own weight, and the deflection may cause the plate to interfere with the transfer arm or the support pin. Further, there is a similar problem due to the warpage of the plate that has been processed.

In this respect, theoretically, the total length is 2L.
It is known that when the supported body is supported at two points, the deflection by its own weight can be minimized by supporting it at a point where the distance a from the center to the fulcrum satisfies a / L = 0.5536. . However, it is practically difficult to constantly support the plate P at the point a where the deflection by its own weight is minimized by both the support portion 112a of the transfer arm 112 and the support pin group 104 of the substrate stage 102. Therefore, in practice, the plate P must be supported by the support pin group 104 at a point deviating from the optimum point on the substrate stage 102, and as a result, deflection due to its own weight becomes large, which is a problem. This problem was more remarkable as the plate P had a larger area.

In the conventional device as described above, the support pin group 10 is used when the plate is transferred to the transfer arm.
4 is fixed on a common lifting plate 107 and is controlled to move up and down at the same time, and a common pneumatic system 109 simultaneously sucks and releases the plate P. For this reason, in the case of a large plate, the plate P is likely to be distorted due to its own weight deflection and its own warp. Therefore, when the transport arm 112 is inserted into the space below the plate P supported by the support pins 104, the plate P
It is necessary to set the approach height a of the transfer arm 112 with a tolerance b considering the warp of the transfer arm 112 and the height of the suction pad 112a of the transfer arm 112.

Particularly, in the case of the exposure apparatus, unlike the other semiconductor manufacturing apparatus, the substrate stage 102 and the projection optical system P are used.
The space formed between L and L is limited in terms of optical design (that is, the space is narrow). However, in processing, the plate P must be transferred between the transfer arm 112 and the support pin group 104 within the limited space. Therefore, when the deflection of the plate P due to its own weight and the inherent warp that occurs during the process are taken into consideration, the approach height a of the transfer arm 112 that allows the plate P to enter the limited space is limited, and the plate P that can be processed is extended. There was a problem that the size of itself was limited.

The present invention has been made in view of the above-mentioned problems of the conventional stage apparatus, and it is possible to alleviate the deflection of the plate by its own weight and correct the warp peculiar to the plate, and further, to convey the plate. The restrictions on the arm entry height are relaxed, and the plate size is also relaxed, and a larger plate can be loaded even if the space between the projection optical system PL and the stage device is the same as the conventional one. It is an object of the present invention to provide a new and improved stage apparatus and a control method thereof that can be delivered or delivered.

[0011]

In order to solve the above problems, according to the present invention, a support pin (4) for adsorbing and supporting a substrate (P) on a substrate stage (2) and a support pin (P) for supporting the substrate (P). In a stage device having a transfer arm (14) that moves and moves to a support pin (4) of the substrate stage (2), a plurality of support pins (4a, 4b) are arranged in a substantially concentric pattern, and Support pins (4a, 4
In b), each group is configured to be able to independently control the lifting movement and the substrate suction / release movement. It is preferable that the suction surface of each support pin can follow the displacement of the suction surface of the substrate.

According to the present invention, the stage device configured as described above can be controlled as follows. First, when the substrate (P) is transferred above the substrate stage (2) by the transfer arm (14) and transferred to the support pins (4), the suction surfaces of the support pins (4a, 4b) of all the groups are removed. While holding them on substantially the same plane, the support pins (4a, 4
The suction surface of b) and the suction surface of the substrate (P) are brought into contact with each other.

When the substrate (P) is supported by the support pins (4), the substrate (P) is attracted by the support pins (4b (4a)) of a part of the group and the part of the group is supported. The attraction surface of the pin is supported relatively lower than the attraction surface of the support pins (4a (4b)) of the other group inside or outside the group. Then, the substrate (P) is supported by the support pins (4).
When passing from the transfer arm onto the transfer arm, the support pins (4b (4a)) of a part of the groups that are in the lowered state are raised, and the suction surfaces of the support pins (4a, 4b) of all the groups are substantially flush with each other. Release adsorption by holding on top.

According to the present invention, the stage device configured as described above can be controlled as described below when the deflection of the plate is large. First, when the substrate (P) is transferred to the upper side of the substrate stage (2) by the transfer arm (14) and transferred to the support pins (4), the support pins (4b (4a)) of some groups are sucked. A support pin (4a (4a (4a)
The suction surface of the support pin (4b (4a)) of the part of the group that has been raised is brought into contact with the suction surface of the substrate.

When the substrate (P) is supported by the support pins (4), the support pins (4b (4)
a)) The substrate (P) is adsorbed by the support pin (4b (4a)) of a part of the group and the support pin (4a (4b)) of another group are relatively moved, and the part of the part is raised. The substrate (P) is supported by lowering the attraction surface of the support pins (4b (4a)) of the group (4) relative to the attraction surface of the support pins (4a (4b)) of the other group.

When the substrate (P) is transferred from the support pin (4) onto the transfer arm (14), the support pins (4b (4a)) of a part of the group in the lowered state are raised, The suction surfaces of the support pins (4a, 4b) of all the groups are held substantially on the same plane, or the suction surfaces of some of the support pins (4b (4a)) in the descending state are changed to other groups. The suction is released in a state of being relatively raised from the suction surface of the support pin (4a (4b)).

In controlling the stage device by the above method, the support pins (4b (4a)) of the groups that are relatively raised or lowered are the support pins (4) of all the groups.
It is preferably selected according to the bending state of the substrate when the substrate (P) is supported with the suction surfaces a, 4b) held substantially on the same plane.

[0018]

In the above structure, the support pins (4) arranged in a plurality of substantially concentric circles are connected to the respective support pin groups (4a,
It is possible to change the support height of the plate (P) and the suction release timing for each 4b).
It is possible to minimize the deflection of the plate (P) due to its own weight and the inherent warp while suppressing the stress applied to the plate.

Further, as shown in FIG. 3, the support pins (4b (4a)) of some groups are replaced with the support pins (4a (4a) of other groups).
b)) relative lower by a distance c, plate (P)
Since it supports, the deflection of the outer peripheral portion of the plate (P) can be reduced as compared with the case of the conventional stage device shown in FIGS. As a result, the height of the suction pad (15) of the transfer arm (14) and the plate (P)
The entry height (a ') of the transfer arm (14), which is determined in consideration of the flexure, can be made wider than that of the conventional device (a' (FIG. 3)> a (FIG. 14)). That is, the stationary height of the support pin (4) when transferring the plate and the load / load
Entry height (a ') of transfer arm (14) during unloading
Can be brought closer to each other, so that even in a limited space between the substrate stage (2) and the projection optical system (PL), even a large-area plate can be easily transferred, and the degree of freedom in design and control can be increased. You can

The suction surface (6) of each support pin (4) is
As shown in FIG. 5, since it is possible to follow the displacement of the attracted surface of the plate (P), even if the support height of the support pin group (4a, 4b) is changed, the attraction by the support pin It does not cause stress on the plate P. Next, the operation of the first control method of the stage device configured as described above will be described.

First, when the plate (P) is loaded, the transfer arm (14) supporting the plate (P) is advanced above the substrate stage (2). Next, the suction surfaces of the support pins (4a, 4b) of all the groups are raised while being held on substantially the same plane, and the suction surfaces of the support pins (4a, 4b) of all the groups and the suction target of the plate (P) are attracted. Contact the surface and adsorb the plate (P). In this way, the plate (P) is sucked and supported by the support pins (4a, 4b), then the suction by the transfer arm is released, and the transfer arm (14) is retracted.

Further, the suction surface of a part of the group, for example, the inner support pin (4b), is relatively relative to the suction surface of another group inside or outside the group, for example, the outer support pin (4a). Lower it. At that time, which group of support pins (4a,
The degree to which 4b) is lowered is selected so as to reduce the self-deflection of the plate (P) and correct the inherent warp. Therefore, even a large-area plate (P) can be supported with a minimum stress. Further, since the plate (P) has a small deflection, the support height of the lower support pin (4b) and the approach height (a ') of the transfer arm (14) can be made closer to each other.

Then, the plate (P) is attached to the substrate stage 2
A predetermined exposure process is carried out after it is placed on the top and finally aligned. After the exposure process is completed, the plate P is raised by the support pins 4 and the transfer arm (14) is advanced below the processed plate (P). And
The inner support pins (4b) in the lowered state are raised to hold the suction surfaces of the support pins (4a, 4b) of all the groups on substantially the same plane, and then the plate (P) is moved by the transfer arm (14). Adsorb. Thereafter, the suction of the support pin (4) is released, and the transfer arm (14) is retracted together with the plate (P), whereby the unloading operation is completed.

Thus, according to the invention, from the support pin (2) to the transfer arm (14) in a very limited space between the substrate stage (2) and the projection optical system (PL). Substrates can be delivered and received. Next, the operation of the second control method of the stage device configured as described above will be described.

First, when the plate (P) is loaded, the transfer arm (14) supporting the plate (P) is advanced above the substrate stage (2). At this time, if the plate (P) is largely deflected and the support pin groups (4a, 4b) holding the suction surfaces on substantially the same plane do not come into contact with the plate (P), a part of the group, For example, the suction surface of the inner support pin (4b) is raised relatively to the suction surface of another group inside or outside the group, for example, the outer support pin (4a). Then, the suction surface of the support pins (4b) of the raised group and the suction surface of the plate (P) are brought into contact with each other for suction.

Further, the raised inner support pin (4
The suction surface of b) is lowered relative to the suction surface of another group inside or outside the group, for example, the outer support pin (4a). Then, the plate (P) is also sucked by the outer support pins (4a), so that the plate (P) is sucked by all the support pins (4a, 4b).
At that time, which group of support pins is lowered and to what extent is selected so as to reduce the deflection of the substrate by its own weight and correct the inherent warp. Therefore, even a large-area plate (P) can be supported with a minimum stress. Further, since the plate (P) has a small deflection, the support height of the lower support pin (4b) and the transfer arm (14) are reduced.
The approach height (a ') can be closer.

After the plate (P) is thus attracted and fixed by the inner and outer support pins (4a, 4b), the attraction by the transport arm (14) is released and the transport arm (14) is retracted. Then, after the plate (P) is placed on the substrate stage and finally aligned, a predetermined exposure process is performed.

After the exposure process is completed, the plate P is raised by the support pins 4 and the transfer arm (14) is advanced below the processed plate (P). Then, the inner support pins (4b) in the lowered state are raised, and the suction surfaces of the support pins (4a, 4b) of all the groups are held on substantially the same plane, or as in the case of loading, The inner support pin (4b) is raised relative to the outer support pin (4a), and then the plate (P) is sucked by the transfer arm (14). Thereafter, the suction of the support pin (4) is released, and the transfer arm (14) is retracted together with the plate (P), whereby the unloading operation is completed.

Thus, according to the present invention, from the support pin (2) to the transfer arm (14) in a very limited space between the substrate stage (2) and the projection optical system (PL). Substrates can be delivered and received.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an exposure apparatus for a liquid crystal display device to which the present invention can be applied will be described in detail below with reference to the accompanying drawings. Note that FIG. 1 shows a schematic configuration of a projection exposure apparatus to which the present invention can be applied. 2 is a schematic sketch of a stage device portion of the exposure apparatus, and FIG. 3 is a schematic sectional view thereof. 4 and 5 are schematic cross-sectional views showing the structure of the suction portion at the tip of the support pin of the stage device.

In the projection exposure apparatus shown in FIG. 1, a substrate stage 2 is placed on a base 1, and a large-area substrate (plate P) such as a glass plate is placed on the substrate stage 2 as a photosensitive substrate. Is held. A projection optical system PL housed in a lens barrel (not shown) is provided above the plate P.
Is installed. Above the projection optical system PL, a photomask or reticle R on which a transfer pattern is formed is held on a reticle stage (not shown).

The substrate stage 2 is composed of a positioning stage 3 and a plate holder 5 having a support pin group 4. The positioning stage 3 includes an X stage 3X, a Y stage 3Y, and a Z stage 3Z, and a projection optical system P
With respect to the optical axis of L (Z direction), X direction, Y direction,
The plate P can be positioned in the θ (rotation) direction and the Z direction.

Further, as shown in FIG. 2, the plate holder 5 is provided with four groups of outer support pins 4a and four groups of inner support pins 4b arranged in a substantially concentric manner.
As shown in FIG. 3, the four outer support pin groups 4a are installed on the outer elevating plate 7a. Similarly, the four inner support pin groups 4b are installed on the inner elevating plate 7b which is formed separately from the outer elevating plate 7a. And these inner and outer lifting plates 7
The a and 7b are configured so that they can be controlled to move up and down independently by an inner drive device 8b and an outer drive device 8a.

As shown in FIG. 4, each support pin 4 has a hollow cylindrical shape and is made of a metal material such as aluminum or stainless steel. A vacuum suction pad 6 made of resin is fitted to the tip of each support pin 4.
The central portion of the vacuum suction pad 6 has a substantially spherical shape, and the outer peripheral portion 6 ′ of the spherical portion in the horizontal direction S is always engaged with the inner surface 4 ′ of the hollow portion of the support pin. Therefore, the vacuum suction pad 6 can be freely moved around the center point C of the central spherical portion within a predetermined allowable range within the hollow portion of the support pin 4, and as shown in FIG.
Even if the suction surface of the plate P sucked by the vacuum suction pad 6 is bent or the like, the displacement can be freely followed.

Further, a through hole 9 is formed inside the vacuum suction pad 6, and its lower end is connected to a vacuum tube 10. The vacuum tube 10 is connected to a pneumatic control unit 11 installed near the substrate stage 2. Therefore, the air pressure control unit 11 is configured to evacuate the inside of the vacuum tube 10 so that the plate P can be vacuum-sucked to the tip of the vacuum suction pad 6.

In this embodiment, as shown in FIG.
The vacuum tubes 10a and 10b are provided in two systems,
Each is connected to the inner support pin group 4b and the outer support pin group 4a. Therefore, the inner and outer support pin groups 4a,
4b can individually and independently control the suction and release operation of the plate P. As described above, in the stage apparatus according to the present embodiment, the support height of the plate P and the suction release timing of the inner and outer support pin groups 4a and 4b arranged substantially concentrically are independently changed. Therefore, it is possible to minimize the deflection of the plate P due to its own weight and the inherent warp while suppressing the stress applied to the plate P. Further, since the stationary height of the support pin at the time of transferring the plate and the approach height of the transfer arm at the time of loading / unloading can be brought close to each other,
In a limited space between the substrate stage and the projection optical system, even a large-area plate can be easily transferred, and the degree of freedom in design and control can be increased.

As shown in FIG. 1, the substrate stage 2
In the vicinity of, there is provided a carrying section 12 for carrying in an unprocessed plate onto the substrate stage 2 and carrying out a processed plate from the substrate stage 2. The transfer unit 12 is composed of a transfer unit base 13 and a transfer arm 14 that is installed on the transfer unit base 13 so as to be horizontally slidable. The transfer arm 14 has a two-pronged fork shape,
A pair of suction pads 15a and 15b are installed on the upper surfaces of the forks 14a and 14b, respectively. These suction pads 15a and 15b are connected to the pneumatic control unit 11 by a vacuum tube 10c (FIG. 2), and the plate P
It is possible to vacuum-adsorb the plate P when carrying in and out. A control unit 16 controls the behaviors of the transfer arm 14 and the substrate stage 2 as described later.

Next, the illumination optical system for irradiating the reticle R with the exposure light IL will be briefly described. The exposure illumination light from the mercury lamp 50 is focused on the second focus by the elliptical mirror 51. A rotary shutter 53 that switches between blocking and transmitting illumination light by a motor 52 is provided at the second focus.
Is arranged. The illumination light flux that has passed through the shutter 53 is reflected by the mirror 54 and enters the fly-eye lens system 56 via the input lens 55. Fly eye lens system 5
A large number of secondary light source images are formed on the exit side of 6, and the illumination light from each secondary light source image enters a lens system (condenser lens) 58 via a beam splitter 57. The movable blade BL of the reticle blind mechanism 59 is arranged on the rear focal plane of the lens system 58. Movable blade BL
Is composed of a plurality of blades, and the shape of the opening AP is defined by the edge of each blade BL. At the position of the blind mechanism 59, the illumination light has a uniform illuminance distribution,
Illumination light IL that has passed through the opening AP of the blind mechanism 59
Illuminates the reticle R via the lens system 60, the mirror 61, and the main condenser lens 62. Then, the pattern image on the reticle R is projected and exposed on the plate P via the projection optical system PL.

FIG. 6 shows the operation of loading / unloading the plate P into / from the projection exposure apparatus of the present embodiment configured as described above.
The operation will be described with reference to the operation explanatory diagram of the substrate stage 2 shown in FIG. 9 and the flowcharts shown in FIGS. According to this embodiment, it is possible to operate in several modes as described below, depending on the size of the plate P and the positional relationship of the support pins 4. (1) A mode When a large amount of self-weight deflection occurs at the outer peripheral portion of the plate P when the support pin group 4 in which all suction surfaces are held on substantially the same plane is supported, all the support pin groups 4a and 4b
After receiving the plate P once, the inner support pin group 4b can be lowered from the outer support pin group 4a to support the plate P, and the plate can be operated in the A mode. 1-1 At the time of loading (FIGS. 6A to 6D, FIG. 10) At the time of loading in the A mode, first, at step S141, as shown in FIG. 6A, the transport arm 14 supporting the plate P is It is inserted into a space formed between the substrate stage 2 and the projection optical system PL. When the transfer arm 14 is inserted, all the support pin groups 4a and 4b are on standby at the lowermost position (the suction surface of the support pin is on the same surface as or below the mounting surface of the plate holder 5). .

Next, in step S142, all the support pin groups 4a and 4b are lifted while keeping their suction surfaces substantially in the same plane to contact the suction surface of the plate P supported by the transfer arm 14. Let all support pin groups 4
The support plate P is adsorbed by a and 4b. Further, the suction by the suction pad 15 of the transfer arm 14 is released, and all the support pin groups 4a and 4b are further raised as shown in FIG. 6B, whereby the plate P is moved from the transfer arm 14 to the support pin group. It is delivered to 4a and 4b.

Then, the process proceeds to step S143, and FIG.
As shown in (c), only the inner support pin group 4b is lowered to support the plate P at a position lower than the outer support pin group 4a. As a result, the deflection of the plate P due to its own weight at the outer peripheral portion can be alleviated and the warp peculiar to the plate P can be corrected. Therefore, in step S144, as shown in FIG. The transfer arm 14 can be retracted without interfering with the plate.

After the transfer arm 14 is retracted, step S
Proceeding to 145, the support pin groups 4a and 4b descend to the lowermost position, and the plate P is placed on the plate holder 5.
Then, the substrate stage 2 is moved in the X direction, the Y direction, and θ (rotation).
The plate P is positioned by driving in the Z direction and the Z direction respectively, and the process proceeds to step S146 to start the exposure process. 1-2 During unloading (FIGS. 7A to 7D, FIG. 11) When unloading in the A mode, first, in step S151, when predetermined exposure processing is completed, the process proceeds to step S152, and the vacuum of the plate holder is turned off. Fig. 7
As shown in (a), the support pin groups 4 a and 4 b move up to receive the plate from the plate holder 5.

Then, in step S153, the plate carrying-out carrying arm 14 moves the supporting pin groups 4a and 4b.
Is inserted below the plate P supported by. The plate P is supported in a state where the inner support pin group 4b is lowered relative to the outer support pin group 4a. Next, in Step S154, as shown in FIG. 7B, the inner support pin group 4b at the lower position is raised,
The attraction surfaces of all the support pin groups 4a and 4b are made to be substantially the same plane.

Next, in step S155, all the support pin groups 4a and 4b are simultaneously lowered, and the attracted surface of the plate P is brought into contact with the attracting pad 15 of the transport arm 14 to attract them. Then, all support pin groups 4a, 4b
7 is released, and all the support pin groups 4a and 4b are set to the position shown in FIG.
It is lowered to the lowest position shown in (c). Next, the process proceeds to step S156, and as shown in FIG. 7D, the transfer arm 14 on which the plate P is placed is retracted, whereby the transfer of the processed plate P is completed.

In the A mode, the support pin group 4
Although the case where all of a and 4b are raised to the same height to support the plate P by suction has been described, when the support pin group 4b does not come into contact with the plate P due to the large deflection of the plate P, the support pin group 4b is supported. The plate P may be lifted to a position higher than the pin group 4a to support the plate P by suction. (2) B mode Unlike in the A mode, when a large deflection of its own weight occurs in the central portion of the plate P having a large area when supported by the support pin group 4 in which all suction surfaces are held on substantially the same plane. After once receiving the plate P by all the support pin groups 4a and 4b, the outer support pin group 4a is moved to the inner support pin group 4b.
It is possible to operate in the B mode in which the plate P is supported by lowering it relative to the above. 2-1 At the time of carrying in (FIGS. 8A to 8B, FIG. 10) At the time of carrying in the B mode, first, at step S141, as shown in FIG. Is inserted into the space formed between the substrate stage 2 and the projection optical system PL. When the transfer arm 14 is inserted, all the support pin groups 4a and 4b are on standby at the lowermost position.

Next, in step S142, all the support pin groups 4a and 4b are raised while keeping their suction surfaces substantially in the same plane, and brought into contact with the suction surface of the plate P supported by the transfer arm 14. , All support pin groups 4a,
The support plate P is adsorbed by 4b. Further, the suction by the suction pad 15 of the transfer arm 14 is released, and all the support pin groups 4a and 4b are further raised as shown in FIG.
To the support pin groups 4a and 4b.

Then, the process proceeds to step S143, and FIG.
As shown in (c), only the inner support pin group 4b is raised to support the plate P at a position relatively higher than the outer support pin group 4a. As a result, the deflection of its own weight at the center of the plate P is alleviated and the plate P is
Since the unique warp can be corrected, step S1
At 44, as shown in FIG. 8D, the transfer arm P can be retracted with a margin.

After the transfer arm 14 is retracted, step S
Proceeding to 145, the support pin groups 4a and 4b descend to the lowermost position, and the plate P is placed on the plate holder 5.
Then, the substrate stage 2 is moved in the X direction, the Y direction, and θ (rotation).
The plate P is positioned by driving in the Z direction and the Z direction respectively, and the process proceeds to step S146 to start the exposure process. 2-2 During unloading (FIGS. 9A to 9D, FIG. 11) When unloading in the B mode, first, in step S151, when a predetermined exposure process is completed, the process proceeds to step S152, and the vacuum of the plate holder is turned off. Figure 9
As shown in (a), the support pin groups 4 a and 4 b move up to receive the plate from the plate holder 5.

Then, in step S153, the plate carrying-out carrying arm 14 moves the supporting pin groups 4a and 4b.
Is inserted below the plate P supported by. The plate P is supported in a state where the inner support pin group 4b is raised relative to the outer support pin group 4a. Next, in step S154, as shown in FIG. 9B, the support pin group 4b on the inner side, which is at a relatively high position, is lowered, and the suction surfaces of all the support pin groups 4a and 4b become substantially coplanar. To do so.

Next, in step S155, all the support pin groups 4a and 4b are simultaneously lowered, and the attracted surface of the plate P is brought into contact with the attracting pad 15 of the transport arm 14 to attract them. Then, all support pin groups 4a, 4b
9 to release all the support pin groups 4a and 4b.
It is lowered to the lowest position shown in (c). Next, the process proceeds to step S156, and as shown in FIG. 9D, the transfer arm 14 on which the plate P is placed is retracted to complete the transfer of the processed plate P.

In the B mode, the support pin group 4
Although the case where all of a and 4b are raised to the same height to support the plate P by suction has been described, when the plate P has a large deflection and the support pin group 4a does not contact the plate P, the support pin group 4a is supported. The plate P may be lifted to a position higher than the pin group 4b to support the plate P by suction.

Although the preferred embodiment of the present invention has been described above with respect to the projection exposure apparatus for a liquid crystal substrate, the present invention is not limited to this embodiment, and various semiconductor manufacturing apparatuses handling flat panels such as a liquid crystal substrate, for example, It can be applied as a substrate supporting device such as a spin coater or a film forming device. Further, in the above-described embodiment, the description has been made regarding the configuration including the inner and outer two groups, each group having four support pins, but the number of groups and the number of support pins included in each group are described. However, it goes without saying that the present invention is not limited to the above example. By choosing any number of groups and support pins depending on the area of the plate to be treated, it is possible to mitigate the plate's own weight deflection and correct the inherent warp.

Further, according to the present invention, by adjusting the support height of each support pin group and the entrance timing of the transfer arm,
The purpose is to reduce the deflection of the plate due to its own weight and to correct the warp peculiar to the plate.According to the size and shape of the plate to be transferred, the size and shape of the transfer arm, the size and shape of the substrate stage, the pitch of the support pins, etc. Without being limited to the above-mentioned embodiment, it is possible to select the optimum support height of each support pin group and the transfer arm entry timing according to the application.

With respect to the transfer arm, the present invention has been described with reference to an embodiment of the transfer arm that is slidable only in the horizontal direction. However, the present invention is not limited to such an embodiment, and the transfer arm can be used in the vertical direction. However, by using the adjustable transfer arm, it is possible to transfer a plate having a larger size in a limited space between the substrate stage and the projection optical system, and it is possible to increase the degree of freedom in design.

[0055]

As described above, in the stage device according to the present invention, it is possible to reduce the difference between the thrust height of the support pin which is moved up and down and the entrance height of the transfer arm, and therefore it is necessary for the plate transfer. Space saving can be achieved. Also, when it is necessary to widen the width of the transfer arm due to the increase in the size of the plate, or when the plate becomes thin and the deflection due to its own weight increases, the support height and suction release of each support pin group By changing the timing of, it is possible to minimize the deflection of the plate P due to its own weight and the inherent warp while suppressing the stress applied to the plate P.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an embodiment of a projection exposure apparatus to which a stage device according to the present invention is applied.

FIG. 2 is a schematic perspective view of a stage device of the projection exposure apparatus shown in FIG.

FIG. 3 is a schematic cross-sectional view of the stage device shown in FIG.

FIG. 4 is a schematic cross-sectional view showing an embodiment of a vacuum suction pad applicable to the stage device according to the present invention.

5 is an explanatory diagram showing an operating state of the vacuum suction pad shown in FIG. 4. FIG.

FIG. 6 is an explanatory diagram showing an operation of the stage apparatus according to the present invention when carrying in an A mode.

FIG. 7 is an explanatory diagram showing an operation of the stage apparatus according to the present invention when carrying out in A mode.

FIG. 8 is an explanatory diagram showing an operation of the stage apparatus according to the present invention when carrying in a B mode.

FIG. 9 is an explanatory diagram showing an operation when the stage apparatus according to the present invention is carried out in the B mode.

FIG. 10: A mode and B of the stage apparatus according to the present invention
It is a flow chart which shows operation at the time of carrying in mode.

FIG. 11 is a flowchart showing the operation of the stage apparatus according to the present invention when carrying out in A, B, C and D modes.

FIG. 12 is a schematic configuration diagram of a conventional projection exposure apparatus.

FIG. 13 is a schematic perspective view of a stage device applied to a conventional projection exposure apparatus.

FIG. 14 is a schematic sectional view of a conventional stage device.

[Explanation of symbols]

 1 Base 2 Substrate Stage 3 Positioning Stage 4 Support Pin Group 4a Outer Support Pin Group 4b Inner Support Pin Group 5 Plate Holder 6 Vacuum Suction Pad 7 Elevating Plate 8 Drive Device 9 Through Hole 10 Vacuum Tube 11 Pneumatic Controller 12 Controller

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location G12B 5/00 T 6947-2F H01L 21/30 516 Z

Claims (5)

[Claims] 1. A stage apparatus comprising: a support pin that sucks and supports a substrate on a substrate stage; and a transfer arm that supports and moves the substrate and transfers the substrate to the support pin of the substrate stage. A stage apparatus, wherein a plurality of groups are arranged in a substantially concentric shape, and the support pins can independently control a lifting movement and a suction release movement of the substrate for each group. 2. The stage device according to claim 1, wherein the suction surface of the support pin can follow the displacement of the suction surface of the substrate. 3. The method of controlling a stage apparatus according to claim 1, wherein when the substrate is transferred to the upper side of the substrate stage by the transfer arm and is transferred to the support pin, all groups are transferred. While holding the attraction surface of the support pin of substantially on the same plane,
The attraction surface of the support pin and the attracted surface of the substrate are brought into contact with each other, and when the substrate is supported by the support pin, the substrate is attracted by the support pin of a group and The support pins of the group are supported by lowering the attraction surface of the support pins relative to the attraction surfaces of the support pins of the other groups inside or outside the group, and receiving the substrate from the support pins on the transfer arm. When passing, the support pins of the part of the groups that are in the lowered state are raised, and the suction is released while the suction surfaces of the support pins of all the groups are held on substantially the same plane. A method for controlling a stage device. 4. The method of controlling a stage apparatus according to claim 1, wherein when the substrate is transferred above the substrate stage by the transfer arm and is transferred to the support pin, a part of the substrate is transferred. Raising the attraction surface of the support pin of the group relative to the attraction surface of the support pin of the other group inside or outside the group,
When the suction surface of the raised support pins of the group and the attracted surface of the substrate are brought into contact with each other and the substrate is supported by the support pins, the support pins of the raised group of The support pins of the partial group and the support pins of the other group that have moved upward while adsorbing the substrate are moved relatively to each other, and the suction surface of the support pins of the partial group that has moved upward is sucked by the support pin of the other group. The substrate is supported by lowering it relative to the surface, and when the substrate is transferred from the support pins onto the transfer arm, the support pins of the part of the groups in the lowered state are raised, In the state where the suction surface of the support pin of the group is held substantially on the same plane, or the suction surface of the support pin of the partial group in the descending state is relative to the suction surface of the support pin of the other group. Release the adsorption while Wherein the method of controlling a stage apparatus. 5. The bending of the substrate when the substrate is supported in a state where the support pins of the groups to be raised or lowered relatively hold the suction surfaces of the support pins of all the groups on substantially the same plane. The stage device control method according to claim 3, wherein the stage device is selected according to a state.