JP2012038874A - Liquid crystal exposure apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of an exposure apparatus that in a method of supporting a substrate to come in contact with a chuck, "reverse side transfer" occurs to copy the substrate holding shape due to dust adhering to the substrate, or the substrate is creased due to the order of contact of the substrate and the chuck and thereby flatness is impaired thus causing poor exposure.SOLUTION: When a means for floating the substrate above the chuck by utilizing air force is provided and the substrate is held in non-contact, impairment of flatness and creasing of the substrate, which may occur due to contact conditions, are prevented and thereby the substrate can be exposed with high accuracy by using an exposure pattern. When a thermostatic(constant temperature) means is provided, temperature variation (rise) of a floated substrate can be prevented, and floating exposure of the substrate causes no interiority.

Description

  The present invention relates to an exposure apparatus. For example, the present invention relates to an apparatus for manufacturing a liquid crystal display panel, and more particularly to a liquid crystal exposure apparatus that exposes a pattern drawn on a mask onto a glass substrate.

  The manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is performed by photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. In general, an exposure apparatus includes a chuck that holds a substrate by vacuum suction, and performs exposure by irradiating the surface of the substrate held by the chuck with light transmitted through a photomask.

  Conventionally, there are chucks having a flat substrate holding surface and those having a plurality of pin-shaped convex portions on the substrate holding surface. In the latter, the substrate is supported at a plurality of points by pin-shaped convex portions, and the space between the portion other than the pin-shaped convex portions and the substrate is evacuated to hold the substrate by vacuum suction. In such a chuck, in order to vacuum-suck a large substrate evenly, the space between the substrate and the portion other than the pin-shaped convex portion and the substrate is divided into a plurality of vacuum compartments for evacuation. For this reason, a bank (line) for forming a plurality of vacuum compartments is provided on the substrate holding surface.

  In a substrate that transmits light, such as a glass substrate, the light transmitted through the substrate during exposure is reflected by the chuck, passes through the substrate again, and reaches the surface of the substrate. The phenomenon of burning may occur. This phenomenon is called “backside transfer”.

  In a conventional chuck with a flat substrate holding surface, dirt on the back surface of the substrate accumulates on the chuck, and back surface transfer occurs due to this dirt. On the other hand, in the chuck in which the pin-shaped convex portion is provided on the substrate holding surface, the back surface transfer due to the accumulation of dirt is small.

  However, if the suction force of the vacuum compartment is too strong, it will follow the shape of the substrate holding surface and the phenomenon of “backside transfer” will occur, so it has been proposed that the suction force can be switched between two levels. ing. Specifically, first, the substrate is quickly held by the chuck with a strong adsorption force, and then the substrate is held with a weak adsorption force to reduce the deformation of the substrate in order to avoid “backside transfer”, and exposure is performed. Was supposed to do. Here, switching the suction force to two stages is realized by switching the vacuum force provided in the vacuum compartment to the suction hole between high vacuum and low vacuum.

  The substrate is normally mounted on the chuck through a plurality of push-up pins provided on the chuck. The push-up pin rises from the surface of the chuck, receives the substrate from a handling arm such as a robot, and then descends again to place the substrate on the surface of the chuck.

  The exposure apparatus is required to reduce the tact time in order to improve the mass production performance as well as to reduce the exposure failure. In order to shorten the tact time, it is effective to increase the lowering and raising speed of the push-up pins, to quickly place the substrate on the chuck, and to remove it quickly after exposure.

  However, when the pin descending speed is increased and the substrate is brought closer to the chuck, the air between the substrate and the chuck does not escape completely, the air remains in the central portion of the substrate and the chuck, and the central portion of the substrate swells, The problem that flatness is impaired occurs.

  As the speed is increased, the problem that air is trapped and the central portion swells becomes more obvious. For this reason, in order to reduce the tact time of the exposure apparatus, it is necessary to effectively exhaust the air trapped between the substrate and the chuck when the substrate is mounted on the chuck. For this reason, in the non-vacuum section of the chuck surface, a groove that connects from the center of the chuck to the left, right, upper and lower ends is provided, and an air hole that extends from the chuck surface side (substrate mounting side) to the back surface (back surface) is provided in this groove. Thus, there has been proposed a chuck structure in which air trapped in the substrate and the chuck is quickly (effectively) discharged to the side surface and the back surface of the chuck through the groove and the air hole. Here, the air hole is specified to have a diameter of 4 mm or less so as not to cause “back surface transfer”.

  As described above, a vacuum compartment and a non-vacuum compartment are provided by the bank on the chuck surface, and the non-vacuum compartment has a groove and an air hole for quickly discharging the air generated when the substrate is brought close to the chuck. It was provided. In addition, the vacuum compartment is provided with pin-shaped protrusions and suction holes, and when the substrate is mounted on the chuck, the substrate is held with a strong suction force by switching the vacuum degree of the suction hole between high vacuum and low vacuum. The air can be quickly discharged to shorten the tact time and increase the speed, and at the time of exposure, it can be held with a weak suction force to reduce the contact deformation due to contact with the bank and the convex part, thereby transferring the back surface. There has been proposed an exposure apparatus with a small amount of defects, that is, with few occurrences of defects.

JP 2007-180125 A

  In the known example of Document 1, a vacuum section partitioned by a bank is provided on the entire surface of the chuck, and in order to prevent “back surface transfer” in this vacuum section, a large number of pins are used to bring the substrate into point (micro area) contact. It is necessary to provide a convex portion, and in the non-vacuum section, it is necessary to provide a large number of grooves and air holes with a small diameter, which causes a problem that machining of the chuck surface is very complicated and productivity is low. .

  Also, the suction force of the vacuum section can be switched between high vacuum and low vacuum, and at the time of exposure, the suction force is reduced to reduce the deformation of the contact portion with the substrate, thereby ensuring the flatness of the substrate. However, as long as the substrate is supported by the bank and is in suction contact, deformation at the contact portion occurs, and it is difficult to ensure the flatness of the substrate completely. For this reason, the possibility of “back surface transfer” follows the shape of the substrate holding surface.

  In addition, as the size of the substrate has increased, the chuck surface has also increased in size. For this reason, since the number of vacuum compartments has increased, it is difficult to make the heights of the banks that make up the vacuum compartments the same. There is a possibility that a difference in airtightness may occur due to a difference in contact state between the substrate and the substrate. Specifically, in the vacuum compartment where the substrate and the bank are not completely in contact due to the height variation of the bank, the dust being caught, etc., and there is a partial gap, air flows from the surroundings into the vacuum compartment. Even if air is drawn with the same vacuum force (pump), the vacuum degree of all the vacuum sections cannot be made the same. For this reason, there is a possibility that a difference is generated in the suction force of each vacuum section, thereby causing deformation of the substrate, flatness is impaired, and the mask pattern cannot be exposed with high accuracy. Further, “back surface transfer” may occur following the shape of the substrate holding surface.

  Also, with a large substrate, it is difficult to contact the chuck sequentially from the center of the substrate toward the outside. If the chuck first contacts the chuck from the outside of the substrate, then the inside contacts Even if the air remaining on the chuck and the substrate is removed by the air holes and the vacuum compartment, the wrinkles of the substrate do not extend and become parallel due to the contact friction between the outside of the substrate and the chuck. This can be easily understood because, for example, when a large carpet is laid, once the bulge is formed at the center for some reason, the carpet does not become flat due to contact friction between the carpet and the floor.

  In other words, in the method in which a vacuum section composed of convex portions and banks is provided on the entire surface of the chuck to support (hold) the substrate, as shown in FIG. Tends to remain. This becomes more prominent as the descending speed to the substrate increases. When the substrate is placed on the chuck in a shape in which the central portion is swollen by air or the like, even if both airs are exhausted by the vacuum force 200 by the vacuum compartment, contact friction between the peripheral portion of the substrate and the vacuum compartment Since the substrate does not become flat, the ridge 201 may remain on the substrate as shown in FIG.

An object of the present invention is to achieve at least one of the following matters. The following items may be achieved independently, or a plurality may be achieved simultaneously.
(1) To prevent “back surface transfer”.
(2) To shorten the takt time by shortening the chuck mounting time of the substrate.
(3) By holding the substrate flat on the chuck, the exposure pattern (shape) of the mask can be accurately exposed, that is, high-precision exposure without distortion (deformation) can be realized.
(4) It is possible to provide an exposure apparatus in which manufacture of the chuck is simple.

  In order to achieve the above object, the present invention has the following features. In addition, this invention may be provided with the following characteristics each independently, and may be provided with several characteristics simultaneously.

  The first feature of the present invention resides in providing a floating means for floating the substrate on the chuck with an air film (bearing). Specifically, a discharge port for discharging compressed air is provided on the surface of the chuck, and the substrate is floated on the chuck surface by high-pressure air from the discharge hole to hold the substrate in a non-contact manner.

  The second feature of the present invention resides in providing a suction holding means for sucking and holding the substrate. When the substrate is levitated, the contact resistance between the substrate and the chuck disappears, and the substrate moves freely in the plane direction. This is prevented, and the substrate position (rotation angle and orientation) is fixed with respect to the chuck. It is for holding.

  One of the suction holding means is (a) a push-up pin with a suction hole in which a suction hole is provided at the tip of the push-up pin. With this push-up pin with a suction hole, the position (rotation angle / posture) of the substrate relative to the chuck at the time of carry-in is held until it is discharged from the exposure (for this reason, before the position (posture) of the substrate is carried by the robot. If this is measured, the data can be used as chuck position (posture) control data.)

  As another example of the suction holding means, (b) the chuck is provided with a vacuum compartment formed by a suction hole and a bank. The height of the bank is set to be substantially the same as the flying height of the substrate at the time of exposure. And these adsorption | suction holding means hold | maintain the chuck | zipper opposing surface side (opposite side of a mask opposing surface) of a board | substrate. As a result, the mask can be brought close to the substrate, and so-called proximity (proximity) exposure can be performed.

  The third feature of the present invention is to provide a thermostatic means for keeping the temperature of the substrate constant (to make the temperature constant). As the constant temperature means, for example, a device in which a constant temperature device is installed in the chuck, or the air between the substrate and the chuck is changed to a gas excellent in the cooling performance of the substrate.

  In addition, the present invention has the following features as other features.

  According to a fourth aspect of the present invention, there is provided a first mounting portion for mounting the substrate, and the first mounting portion is a first substrate floating portion for floating the substrate with respect to the first mounting portion. It is in having.

  A fifth feature of the present invention is that the first substrate floating portion has a supply unit for supplying a medium to the substrate.

  According to a sixth aspect of the present invention, the supply unit supplies a first medium and a medium having a pressure lower than that of the first medium to the substrate, the supply amount of the first medium, and the first medium 2 is to control the supply amount of the medium.

  The seventh feature of the present invention resides in that the first mounting portion has a first vertical movement portion on which the substrate is placed.

  An eighth feature of the present invention is the exposure apparatus, wherein the first vertical movement mechanism has a substrate suction portion that sucks the substrate.

  According to a ninth feature of the present invention, the first mounting portion has a second vertical movement portion on which the substrate is placed, and the first vertical movement portion and the second vertical movement portion are synchronized with each other. To move.

  A tenth feature of the present invention is that the first mounting portion has a low-pressure section that is lower than the atmospheric pressure on the first mounting portion.

  The eleventh feature of the present invention resides in that the low-pressure section has a bank that encloses a part of the space on the first mounting part, and an exhaust part disposed in the bank.

  According to a twelfth feature of the present invention, in the exposure apparatus according to the claims, the low-pressure section is at a corner of the first mounting portion.

  A thirteenth feature of the present invention is that the first mounting portion has an air intake portion that sucks air between the substrate and the first mounting portion.

  According to a fourteenth feature of the present invention, the supply part has a discharge hole, the intake part has an intake hole, and the discharge hole and the intake hole are alternately arranged on the first mounting part. It is in being arranged in.

  A fifteenth feature of the present invention is that the mounting unit includes a temperature control unit that controls a temperature between the substrate and the first mounting unit.

  A sixteenth feature of the present invention is that the apparatus has a flying height measuring unit that measures the flying height of the substrate, and the flying height controls the flying height based on a measurement result of the flying height measuring unit.

  According to a seventeenth feature of the present invention, the second mounting unit includes a transport unit that transports the substrate to the first mounting unit, and the second mounting unit. A second substrate floating portion that floats relative to the substrate.

  The present invention has the following effects. Note that the following effects may be played independently, or multiple may be played simultaneously.

  (1) By providing a means for floating the substrate on the chuck surface, the substrate and the chuck are not in contact with each other, and it is possible to reduce the “backside transfer” defect that occurs when the substrate and the chuck are in contact with each other. It becomes possible.

  Since the flatness of the substrate can be secured, high exposure accuracy without distortion (deformation) can be realized.

  (2) The tact time can be shortened.

  (3) Since the substrate can be levitated on the chuck by providing the levitating means, dust that adheres to the substrate, or the strong adsorption force of the vacuum compartment, may follow the shape of the substrate holding surface. Backside transfer "can be prevented.

  (4) In the conventional method, when wrinkles occur in the substrate due to the order of contact between the substrate and the vacuum compartment, the wrinkles of the substrate are not released due to the contact friction between the two, as in the present invention. Since the contact portion can be eliminated by allowing the air to float, the flatness of the substrate can be easily secured without causing wrinkles.

  (5) Since the substrate floats on the chuck, air remains between the substrate and the chuck, which has been a problem in the conventional contact method, and this does not deteriorate the flatness.

  (6) In the conventional system, a vacuum compartment and an air hole are provided in order to remove air remaining between the substrate and the chuck. However, in the present invention, since the substrate is levitated, an air passage (flow path) is always formed between the two, so that air remains, so that the flatness of the substrate does not deteriorate.

  (7) In the present invention, by providing suction holding means together with the substrate floating means, the substrate can be fixedly positioned (held) on the chuck even if the substrate is floated on the chuck. For this reason, the substrate can be positioned with high precision relative to the mask by moving the chuck under the mask on the precision stage and performing high precision positioning. For this reason, even when the mask is smaller than the substrate or when the substrate is larger than the mask, the entire surface of the substrate can be exposed by changing the position of the substrate.

  (8) This method of exposing the mask close to the substrate and then moving the mask away from the substrate and changing the position for exposure is generally called step exposure.

  Here, the suction holding means may be provided with a vacuum section formed of a vacuum hole and a bank on the tip of the conventional push-up pin or on the chuck surface. In addition, the suction holding means holds the chuck facing surface of the substrate, so that the mask facing surface of the substrate remains flat. For this reason, proximity exposure is possible in which the mask is exposed close to the surface of the glass substrate up to several hundred μm, and the mask pattern can be exposed to the substrate with high accuracy.

  (9) In the present invention, since the elongation of the substrate due to thermal expansion during exposure can be suppressed to a small level, exposure with high accuracy can be achieved with few defects. More specifically, the temperature of the substrate is controlled at 23 ± 0.2 ° C. in order to prevent exposure errors due to thermal expansion because it is heated by the light during exposure and by the mask. Yes. In the conventional method of supporting the substrate in contact with the chuck, even if the substrate is heated, the substrate is kept constant by the chuck due to contact conduction with the chuck. However, when the substrate is levitated and held as in the present invention, the substrate is held via the air layer, and thus the substrate may be difficult to be cooled (constant temperature) by the chuck. For this reason, by providing a constant temperature means for the substrate, it is possible to prevent exposure accuracy from deteriorating due to temperature rise and realize high-speed and high-precision exposure.

The figure which shows schematic structure of the exposure apparatus by the form of one Example of this invention. The top view of the chuck | zipper of the exposure apparatus by the form of one Example of this invention. AA sectional drawing of FIG. BB sectional drawing of FIG. CC sectional drawing of FIG. DD sectional drawing of FIG. Explanatory drawing of the board | substrate conveyance and holding means by the form of one Example of this invention. Explanatory drawing of the thermostat structure by the form of 2nd Example of this invention. The effect explanatory view of the form of the 2nd example of the present invention. Explanatory drawing of the board | substrate holding means by the form of 3rd Example of this invention. Explanatory drawing of the board | substrate holding | maintenance mechanism by the form of 3rd Example of this invention. Explanatory drawing of the board | substrate holding means by the form of 4th Example of this invention. Explanatory drawing of the board | substrate holding mechanism by the form of 4th Example of this invention. Explanatory drawing of the board | substrate conveyance mechanism by the form of 5th Example of this invention. Explanatory drawing of a prior art subject.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the illustrated examples.

  A first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity type exposure apparatus that provides a minute gap (proximity gap) between a mask and a substrate and transfers the mask pattern to the substrate. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a Z-tilt mechanism 9, a chuck 10, and a mask holder 20. In addition to these, the exposure apparatus includes an exposure light source, a supply unit for supplying the substrate 1 to the chuck 10, a recovery unit for recovering the substrate 1 from the chuck 10, a temperature control unit for managing the temperature in the apparatus, and the like. ing.

  In FIG. 1, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is supplied to the chuck 10 by a supply unit (not shown), and the substrate 1 is recovered from the chuck 10 by a recovery unit (not shown). The substrate 1 is mounted on the chuck 10 via a plurality of push-up pins provided on the chuck 10. The push-up pin rises from the surface of the chuck 10, receives the substrate 1 from the handling arm of the supply unit, and then descends again to place the substrate 1 on the substrate holding surface of the chuck 10. A mask 2 is held by a mask holder 20 above the exposure position where the substrate 1 is exposed. The mask holder 20 is supported by the Z-tilt mechanism 9.

  The chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 moves in the X direction (the horizontal direction in the drawing) along the X guide 4 provided on the base 3. As the X stage 5 moves in the X direction, the chuck 10 moves between the delivery position and the exposure position. In addition, although a linear motor etc. are used as a drive means, illustration is abbreviate | omitted. The Y stage 7 moves in the Y direction (the drawing depth direction) along the Y guide 6 provided on the X stage 5. The θ stage 8 rotates the chuck 10 in the θ direction (around the longitudinal axis in the drawing). The Z-tilt mechanism 9 moves and tilts the mask holder in the Z direction (vertical direction in the drawing).

  At the exposure position, the substrate 1 is positioned during exposure by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap control between the mask 2 and the substrate 1 is performed by the movement and tilt of the Z-tilt mechanism 9 in the Z direction.

  All mechanisms such as the θ stage 8 provided under the chuck 10 may be attached to the mask holder 20. Conversely, the Z-tilt mechanism 9 may be provided under the chuck 10.

  FIG. 2 shows the substrate mounting surface of the chuck. The chuck receives a substrate sent from a substrate transfer robot (not shown), holds it by suction, and pushes it up with an intake hole 11 that moves in the vertical direction (drawing and depth direction of the chuck surface) of the chuck surface. Similar to the holed pin, the push-up pin 12 that receives and holds the substrate sent from the substrate transfer robot (not shown) and moves in the vertical direction (drawing / depth direction) of the chuck surface, and high-pressure air A discharge hole 13 for discharging, and a vacuum compartment formed by the intake hole 14 and the bank 15 are provided.

  Plural push pins 12 are provided on the entire surface of the chuck. The push pins 12 receive the substrate conveyed from the robot, and all the push pins move up and down at the same time as the push pins 11 with the suction holes. Keep the whole parallel (flat) and move the substrate up and down relative to the chuck surface.

  A plurality of discharge holes 13 are provided on the entire surface of the substrate, and the compressed air discharged from the discharge holes 13 floats the substrate so as to have a uniform height without contact with the chuck surface.

  In this embodiment, two vacuum compartments are provided at the corners of the chuck on both sides of the push-up pins with suction holes. The vacuum section 16 is formed from the intake hole 14 and a bank 15 surrounding it, and the inside of the vacuum section 16 is kept in a vacuum. The height and shape of the bank 15 and the diameter of the intake hole 14 in the two vacuum sections are the same. These vacuum compartments are used to hold and position the substrate on the chuck 10 together with the push-up pins with suction holes when the substrate is lifted. Also, when the entire substrate is exposed by multiple exposures while the substrate becomes larger and the mask (not shown) changes its position on the substrate, the mask and the substrate are moved when the mask approaches the substrate. The positive pressure (pressing force due to pressure increase) generated between the substrate prevents the substrate from approaching (contacting) the chuck surface, and the negative pressure (pressure drop) generated between the two when the mask leaves the substrate It has a function to prevent the substrate from being separated from the chuck surface by the adsorption force of

  FIG. 3 shows an AA cross section of FIG. The push-up pin 11 with the suction hole includes a suction pad portion 50 having a cylindrical outer peripheral portion and a bottom portion having a suction hole 51 at one end thereof, a cylinder portion 52 joined to the suction pad portion 50, and a pipe joint 54 joined thereto. The vertical drive motor 56 is configured. The cylinder portion 52 is provided with an air flow path 53 that is joined to the suction hole 51, and is connected to a vacuum pipe 55 via a pipe joint 54. A vacuum source such as a vacuum pump is connected to the tip of the vacuum pipe, which is not shown.

  The push-up pin 11 with the suction hole is installed in a push-up pin hole 58 with a suction hole that penetrates the front and back surfaces of the chuck 10. This is moved in the pushing pin moving direction 57 with a suction hole which is perpendicular to the surface of When the suction pad portion 50 is lowered, the suction pad portion 50 enters the push-up pin hole 58 with an intake hole and can move to a position lower than the chuck surface (position close to the back surface).

  The operation of the push-up pin 11 with the air intake hole is to carry the substrate 1 delivered from the substrate transfer robot (not shown) together with the normal push-up pin 12 (having no suction hole), and in addition to its function. Thus, the push-up pin with the suction hole has a function of keeping the position and posture of the substrate 1 constant. Specifically, since the substrate 1 is vacuum-sucked by the suction pad portion 50 through the suction hole 51, the object holding the substrate 1 can be held only by the contact friction force due to the weight of the substrate 1 like the push-up pin 12. In comparison, the position and posture of the substrate 1 can be held more strongly. The operation and function of each push-up pin will be described in detail with reference to the explanatory diagram of the substrate transfer / holding means of the first embodiment shown in FIG.

  Further, the chuck 10 is provided with a plurality of discharge holes 13, and a pipe joint 30 is provided at the other end of the discharge holes 13, and is connected to a pipe 31 through this pipe 31. Is connected to a supply source of high compressed air and low compressed air, and switching between high compressed air and low compressed air is performed by electromagnetic valves 32 and 33. That is, when low compressed air is required, the low compressed air solenoid valve 33 is opened and the high compressed air solenoid valve 32 is closed. Conversely, when high compressed air is required, the high compressed air solenoid valve 32 is opened and the low compressed air solenoid valve 33 is closed.

  When it is desired to float the substrate high from the surface of the chuck 10, high compressed air is used, and when it is desired to float low, low compressed air is jetted from the discharge holes 13 to adjust the flying height of the substrate 1.

  Further, the chuck 10 is provided with a vacuum section 16, which is constituted by a bank 15 and an intake hole 14. A pipe joint 40 is provided at the other end of the intake hole 14, and is joined to a pipe 41 connected to a vacuum source (for example, a vacuum pump) via the pipe joint 40. The vacuum section 16 holds the position and flying height of the substrate held by the push-up pin 11 with the suction hole together with the push-up pin 11 with the suction hole. Here, the height of the bank 15 is set (manufactured) to the flying height when the substrate is exposed, so that the substrate is chucked by the pressure generated when the mask approaches or leaves the substrate. The flying height from the chuck 10 can be kept constant without being pushed close to the surface or pulled away. As a result, the distance between the mask and the substrate can be kept constant, and stable and narrow gap exposure is possible. Further, since the substrate does not come into contact with the surface of the chuck 10, dust accumulated on the surface of the chuck does not adhere (contact) to the substrate, and back surface transfer hardly occurs.

  FIG. 4 shows a BB cross section of FIG. This figure shows a cross section of the discharge hole 13 of FIG. Here, since the discharge hole 13 has the same shape, it has the same configuration as the discharge hole 13 in the AA cross section of FIG. For this reason, although it repeats, the pipe joint 30 is provided in the other end of the discharge hole 13, and it connects with the piping 31 via this, This piping is supply of high compressed air and low compressed air The solenoid valves 32 and 33 switch between high compressed air and low compressed air. When these electromagnetic valves are used and the substrate is to be lifted high from the surface of the chuck 10, high compressed air is used. When the substrate is to be floated low, low compressed air is jetted from the discharge holes 13 to increase the flying height. adjust.

  FIG. 5 shows a CC cross section of FIG. The other end of the push-up pin 12 is attached with a motor 60 that drives the push-up pin 12 with respect to the surface of the chuck 10 in the push-up pin moving direction 61 (vertical, vertical direction). The push-up pin 12 is accommodated in a through hole 59 provided in the chuck 10. In this embodiment, each of the push-up pins 12 is provided with a motor 60. However, the end of the push-up pin 12 on the side of the motor 60 is connected, and the push-up pin is moved once (simultaneously) with one motor. Alternatively, a mechanism for moving up and down may be used. If a single motor 60 is provided on one push-up pin 12 as in this embodiment, even if one motor fails due to some reason, the push-up pin 12 is moved up and down by the remaining motor. Therefore, the reliability of the apparatus can be improved. On the other hand, the method of moving all the push-up pins up and down with one motor is excellent in price because the number of motors 60 used can be reduced.

  The tip of the push pin 12 is set so that the height from the surface of the chuck 10 is the same, and the substrate can be held flat and can be moved up and down in parallel to the surface of the chuck 10. Further, these push-up pins 12 can be moved up and down at the same height and speed in synchronization with the push-up pins 11 with the intake holes. These operations will be described with reference to FIG.

  FIG. 6 shows a DD cross section of FIG. The difference from FIG. 3 is that the push-up pin 11 with the suction hole is not provided and the position of the vacuum section 16 is different. The configuration and function of the vacuum compartment 16 and the discharge hole 13 are as described above. For this reason, description is abbreviate | omitted here.

  With reference to FIG. 7, the substrate 1 is transferred from the arm 70 of the transfer robot to the chuck 10 via the push-up pin 11 with the suction hole and the push-up pin 12 until the substrate 1 is mounted on the chuck 10. The movement and the movement (function) of each of the push-up pins 11 and 12, the discharge hole 13, and the vacuum section 16 will be described.

  FIG. 7A shows a state where the substrate 1 mounted on the arm 70 of the substrate transport robot is inserted into the upper portion of the chuck 10. When the arm 70 is inserted, the push-up pin 11 with the suction hole and the push-up pin 12 stand by under the substrate 1 in a non-contact state. Further, the vacuum compartment 16 provided in the chuck 10 and the substrate 1 are not in contact with each other, and the gap is the gap G90.

  When the substrate 1 is inserted, as shown in FIG. 7 (2), the push-up pin 11 with the suction hole and the push-up pin 12 are raised to support the substrate 1 in contact. In particular, the push-up pin 11 with the suction hole sucks and holds the substrate 1 by the suction pad portion 50 provided at the tip, and holds the substrate 1 so as not to move. A plurality of push-up pins 12 are arranged on the entire surface of the substrate 1 to support the substrate 1. When these push-up pins 11 and 12 hold (support) the substrate 1, the arm 70 moves down (in the direction approaching the surface of the chuck 10) and retreats out of the chuck 10.

  Next, as shown in FIG. 7 (3), the push-up pin 11 with the intake hole and the push-up pin 12 that have received the substrate 1 hold the substrate 1, that is, when the substrate 1 is received from the arm 70. While maintaining the position and orientation, the substrate 1 is brought close to a height H1 at which the substrate is held with a high levitation force by the high compressed air 80 ejected from the discharge hole 13 (not shown). Here, H <b> 1 is a distance (distance) between the substrate 1 and the surface of the chuck 10. In this state, since the highly compressed air 80 from the discharge hole 13 almost supports the weight of the substrate 1, the contact force between the substrate 1 and the push-up pin 12 becomes small, and the substrate 1 is easy to move. The substrate 1 is sucked and held by the push-up pins 11 with the suction holes, so that the substrate 1 does not move in parallel with the chuck surface. The gap G90 between the substrate 1 and the negative pressure section is smaller than that in FIG. 7A, but at this point, the substrate 1 and the vacuum section are not yet in contact with each other.

  Next, as shown in FIG. 7 (4), the push-up pins 12 are separated from the substrate 1 and stored in the chuck 10. Even if the push-up pin 12 is separated from the substrate 1, since the high compressed air 80 supports the substrate 1 at the height H1, the flying height H1 and the size of the gap G at this time are as shown in FIG. The same.

  Here, since the substrate 1 is levitated by air, there is no contact resistance with the chuck, and the substrate 1 freely expands and contracts in a direction parallel to the surface of the chuck 10, so that the substrate 1 is free from wrinkles and deformation, so that it is highly flat. The degree can be realized. More specifically, when the substrate is transferred from the arm 70, the substrate 1 is allowed to float in the air even when the substrate 1 is wrinkled or deformed due to the difference in the contact state with the substrate 1 due to the plurality of push-up pins 12. Thus, contact (contact force) is eliminated, wrinkles and deformations generated thereby are eliminated (released), and high flatness of the substrate 1 can be realized. Further, since the substrate 1 is held by the push-up pins 11 with the suction holes, the substrate 1 does not move freely in the direction parallel to the surface of the chuck 10, and the position (rotation) of the substrate 1 transported by the arm 70. Corner) is retained.

  Next, as shown in FIG. 7 (5), the push-up pin 11 with the suction hole is lowered to a predetermined height at the time of exposure, and the substrate 1 is held by the compressed air 81 from the discharge hole 13. Further, the end portion of the substrate 1 comes into contact with the vacuum compartment 16 and is held in the vacuum compartment 16 by the vacuum force from the suction hole 14 (not shown) provided in the vacuum compartment 16. For this reason, the gap G becomes zero (it disappears) here. Since the flatness of the substrate 1 is ensured in the stage of FIG. 7 (4) and is held in the vacuum section 16, both ends of the substrate 1 are held in a state where the flatness is ensured.

  Further, the substrate 1 is held on the chuck 10 with a flying height of H2, which is the same as the height 15 of the bank of the vacuum section 16. As shown in FIG. 7 (5), the substrate 1 is held flat on the chuck 10 by the lift-up pin 11 with the suction holes and the two vacuum compartments 16 with the flying height of H 2.

  That is, since the substrate 1 is not in contact with the surface of the chuck 10, the substrate 1 is generated by dust adhering (contacted) to the surface of the chuck, which has been a problem in the conventional apparatus. It is possible to prevent “back surface transfer” that occurs following the shape of the holding surface. In addition, by floating the substrate 1 in the air, in the conventional contact support method, the order and state of contact between the substrate and the chuck, and there is a possibility that the substrate 1 is generated due to air accumulated between the substrate and the contact surface. It is possible to eliminate wrinkles and deformation. Further, even if wrinkles occur for some reason, the wrinkles and deformation are eliminated (released) by floating from the chuck 10, and the flatness of the substrate 1 is ensured. The Thereby, exposure with high accuracy (close to the pattern shape of the mask) can be performed.

  Further, in detail, in the method of providing a large number of vacuum sections composed of convex portions, intake holes and banks, the degree of vacuum differs for each vacuum section due to the unevenness of the height of the bank, and as a result, The strength (state) of contact between the bank and the substrate changes, and there is a possibility that “back surface transfer” following the shape of the substrate holding surface may occur. Further, when the substrate 1 is placed on the chuck 10 at a high speed, the periphery of the substrate 1 is in a state where the center of the substrate is swollen (higher) for some reason, such as air is not completely discharged. In the case of contact with the vacuum compartment 16 first from the part, even if the remaining air is exhausted by the vacuum compartment and the air hole, the substrate 1 is caused to contact the surface of the chuck 10 by the contact friction between the peripheral portion of the substrate 1 and the chuck 10. There was no possibility that the wrinkles (deformation) were released by slipping, and the flatness of the substrate could be lost.

  However, in the present method of floating the substrate, since there is no contact between the substrate and the chuck, “back surface transfer” due to contact (following the shape of the substrate holding surface) does not occur. Further, even when the substrate is deformed (for example) when it is supported by a push-up pin from the robot arm, the substrate 1 is once levitated and held on the chuck 10 (FIG. 7). (4)) At that time, the deformation (habit) is released (has disappeared), and high flatness is realized.

  Further, even if the substrate is lowered to the chuck at a high speed in order to float the air, there is no bulge in the central portion of the substrate because there is a flow path for air to flow out.

  In addition, it is not necessary to provide a large number of minute protrusions that support the substrate, and air holes for removing air generated when the substrate is placed on the chuck, which is essential in the prior art, and it is easy to manufacture. Things will be possible.

  Further, since one end face of the substrate 1 is held by the push-up pin 11 with the suction hole and the two end faces are held by the vacuum compartment 16, when the mask is close to the substrate, the compression (between them) ( Even when the substrate is pressed against the chuck by high pressure) air, or when the substrate is about to be peeled off from the chuck by the vacuum pressure generated when the mask is separated from the substrate, the position of the substrate 1 is changed to the chuck 10. There's nothing wrong with it.

  Further, the height of the push-up pin 11 with the suction hole from the chuck 10 surface and the height of the bank of the vacuum section 16 are set to the same height as the flying height H2 at this time, so a uniform flying height is realized. I can do it.

  In the method of holding the substrate 1 by mechanical, electrical, or adsorption force as a holding means of the substrate 1, in the proximity exposure in which the mask 2 is exposed close to the substrate 1, the mask 2 contacts the holding means. For this reason, it becomes impossible to approach the substrate. For this purpose, in this embodiment, the push-up pin 11 with the suction hole is structured to suck and support the surface of the substrate 1 facing the chuck 10 so that the mask 2 is exposed to the substrate 1 for exposure by several hundred μm. It is possible to be close to the distance.

  As described above, according to the present invention, since the substrate 1 is floated and held with respect to the chuck 10, it is possible to hold the substrate 1 flat without contact, there is no “backside transfer”, and the mask pattern is accurately set. In addition, it can be exposed (baked) on the substrate (with high accuracy). Further, since the substrate 1 is sucked and held by a push-up pin with a suction hole and a vacuum section, the position of the substrate with respect to the chuck does not change during exposure, and once the substrate is positioned, the exposure position of the substrate can be changed. In the case of exposure, it is not necessary to perform positioning again, and the time required for positioning can be shortened.

  Moreover, if the position (such as the state of the rotation angle) of the substrate before being mounted on the arm 70 of the transfer robot is measured in advance (for example, when placed on the cooling plate), the position information can be used based on this position information. If the position (posture) of the chuck 10 is roughly adjusted, and then the substrate is held with a push-up pin with a suction hole, then the position (posture) of the substrate is accurately measured and positioned. Can be positioned.

  Here, the suction part of the push-up pin with the suction hole and the bank of the vacuum compartment are in contact with the substrate. However, if the width of the contact part is narrowed, “back surface transfer” due to contact does not occur. As a guide for this width, it should be 4 mm or less.

  In addition, these portions are installed on the edge side of the substrate, and the contact area is small, so that these contact areas are sufficiently small with respect to the entire substrate, even if backside transfer occurs. In a very small range, it is a level that does not cause a problem in practice.

  Further, the substrate 1 that has been exposed can be transferred from the chuck 10 to the substrate transport robot and carried out by executing the reverse procedure of FIG.

  A second embodiment of the present invention will be described with reference to FIG. The difference from the first embodiment is that a cooling means for keeping the substrate 1 at a constant temperature is provided. This is because the exposure apparatus directly exposes the light from the light source to the substrate 1 and the mask 2 heated by the light by continuous exposure is exposed close to the substrate 1 in the proximity exposure. This is because there is a possibility that the substrate 1 is warmed by the heat from 2 and thermally expands, so that it is necessary to keep the temperature constant. Specifically, if the mask pattern is exposed in a state where the substrate 1 is heated and thermally expanded, the substrate shrinks when cooled, the mask pattern is distorted, and an accurate mask pattern cannot be obtained, resulting in poor exposure. It is. In this embodiment, as a constant temperature method, a constant temperature means is provided in the chuck 10 to cool the substrate 1 through an air layer (film). However, the method of constant temperature is not limited to this method, and any method such as a method of directly applying an air flow (gas) at a predetermined temperature to the substrate may be used.

  Hereinafter, an example in which the constant temperature means 100 is provided in the chuck 10 will be described. Specifically, the temperature of the chuck 10 can be kept constant by circulating water adjusted to a constant temperature by the heat exchanger 101 through the pipe 102 in the main body of the chuck 10. Although this is repeated, the substrate 1 is kept at a constant temperature to prevent deformation of the mask pattern due to thermal expansion (contraction) of the substrate. In the method of floating exposure of the substrate 1, compared with the conventional method of bringing the substrate 1 into contact with the chuck 10, there is a possibility that the ability to keep the substrate 1 at a constant temperature (cooling) is reduced by the amount of floating through the air film. There is. For this reason, by providing a constant temperature means in the chuck 10, it becomes possible to improve the ability of the chuck 10 to keep the temperature constant (cool), and as in the first embodiment, high flatness due to flying is ensured. However, it is possible to accurately expose the mask pattern by preventing thermal expansion of the substrate.

  FIG. 9 conceptually shows the calculation results of the flying height H of the substrate 1 and the temperature rise of the substrate 1 during exposure in the second embodiment shown in FIG. If the upper limit of the temperature rise of the substrate 1 is set to, for example, 23.2 ° C. from the upper limit of the allowable range of thermal expansion, the flying height H of the substrate 1 needs to be less than or equal to Ha when there is no constant temperature means 100. When the constant temperature means 100 is provided, the flying height may be Hb or less. That is, with the constant temperature means 100, even if the flying height of the substrate is high (Ha <Hb), the influence of the thermal expansion of the substrate is small. Here, as the flying height H during exposure of the substrate 1 is increased, even when large dust adheres to the chuck surface, it is less affected by the dust, and “back surface transfer” can be prevented. Further, it is not necessary to bring the substrate 1 close to the chuck 10 and exposure can be performed with a high flying height, so that there is an advantage that the handling (setting) time of the substrate 1 can be shortened.

  Further, a sensor (not shown) for managing the temperature of the substrate 1 is provided so that the exposure is interrupted when the temperature of the substrate 1 exceeds a predetermined temperature, and the exposure is resumed when the temperature falls within an allowable range. A monitor system may be provided. Further, a gas having excellent heat conductivity, such as helium, may be added so as to promote heat exchange between the floating substrate 1 and the chuck 10.

  As described above, in the present embodiment, by providing the constant temperature means for the substrate 1, it is possible to reduce the exposure failure due to the temperature fluctuation of the substrate and to increase the flying height of the substrate 1. There are advantages that the influence is small and the setting time of the substrate 1 to the chuck 10 can be shortened. Also in this embodiment, by floating and holding the substrate 1, as in the first embodiment, “back surface transfer” can be reduced, and there can be few defects and high-quality exposure can be realized. .

  A third embodiment of the present invention will be described with reference to FIGS. FIG. 10 shows the shape of the surface of the chuck 10, and FIG. The difference between this embodiment and the first embodiment is that vacuum sections 16 are provided at the four corners of the chuck 10, and push-up pins 11 with suction holes are provided in the vicinity of the vacuum section 16. In the present embodiment, one push-up pin 11 with an intake hole is provided in front of the vacuum section 16, but the location is not particularly limited. The operation of each part in the present embodiment is the same as that in FIGS. 7 (1) to 7 (4) of the first embodiment. That is, FIG. 11 (1) is the same as the state of FIG. 7 (4), and the substrate 1 is levitated by the high compressed air 80 with the flying height H1. One end of the substrate 1 is held by a push-up pin 11 with an intake hole, and the substrate 1 is held at a predetermined position (at a posture). In addition, vacuum compartments 16 are provided at both ends of the chuck 10. In FIG. 11 (1), since the flying height of the substrate 1 is still as high as H1, the vacuum compartment 16 and the substrate 1 are separated by a gap G. In this way, by floating the substrate 1 in the air, the deformation of the wrinkles and the contact portion of the substrate that occurs when the substrate and the chuck come into contact with each other can be eliminated, and the same effect as in the first embodiment can be obtained.

  The difference between the first embodiment and this embodiment is that, in this embodiment, the push-up pin 11 with the suction hole is lower than the height H2 of the vacuum section 16 as shown in FIG. Then, when the push-up pin 11 with the suction hole is lowered to the same height as the vacuum section 16, the suction holding of the substrate is stopped, and it is lowered and stored in the chuck 10. Here, when the flying height reaches H2, since the height of the vacuum section 16 is set to H2, the substrate 1 is held in the vacuum section 16. For this reason, the substrate is held at a fixed position (attitude) with respect to the chuck 10 as in the first embodiment, even without the push-up pin 11 with the intake hole. Further, by using the vacuum section 16 instead of the push-up pin 11 with the air intake hole, the flying height of the substrate 1 can be accurately held at the predetermined flying height H2 with a simple structure. In other words, since the push-up pin 11 with the air intake hole is moved up and down by a motor, the mechanism becomes complicated in order to accurately control and maintain the height thereof. However, according to the embodiment of the present invention, the vacuum section Since the height of the bank may be processed to a predetermined height, it is possible to hold the substrate 1 with a constant flying height with high accuracy while having a simple structure. In this embodiment, the chuck 10 is held by the vacuum compartments 16 provided at the four corners. For this reason, the substrate 1 is held by the chuck 10 with a stronger force than the three points of the first embodiment. Needless to say, the number of the vacuum compartments 16 may be changed as necessary.

  As described above, in this embodiment, the positioning accuracy of the push-up pin 11 with the air intake hole can be relaxed, the productivity of the apparatus can be improved, and the same effect as in the first embodiment can be obtained.

A fourth embodiment of the present invention will be described with reference to FIGS. The difference between the present embodiment and the first embodiment is that, in this embodiment, the vacuum compartment 16 is eliminated and a plurality of intake holes 14 are newly arranged in the vicinity of the discharge holes 13 alternately. In this embodiment, by providing the discharge hole 13 and the intake hole 14 in combination, the substrate can be strongly held at a predetermined flying height (the height of the substrate from the chuck surface) by the spring effect of aerodynamic force. Specifically, when a force is applied in a direction in which the substrate 1 is brought closer to the chuck 10, a repulsive force in a direction in which the substrate 1 is moved away from the chuck 10 is generated by the compressed air 81 from the discharge hole 13. When force is applied in the direction of moving 1 away from the chuck 10, a repulsive force acts in the direction of pulling back by the suction (decompression) air 82 from the suction hole 14 (this is known as a chuck mechanism using Bernoulli's principle). ).
As described above, by providing the discharge hole 13 and the intake hole 14 in combination, the substrate 1 can be held at a predetermined flying height without providing the vacuum compartment 16 provided in the first embodiment.
For this reason, similarly to the first embodiment, the substrate 1 can be held flat on the chuck 10, and the same effect as the first embodiment can be obtained. Further, it is possible to eliminate “back surface transfer” that may occur due to contact between the vacuum compartment 16 and the substrate. Further, in this embodiment, by providing the discharge holes 13 and the intake holes 14 on the entire surface of the substrate, the effect of providing an air spring over the entire substrate 1 is expected, and the substrate 1 is firmly held at a predetermined flying height. Since the distance between the mask and the substrate can be kept stable and constant, the mask pattern with high accuracy can be maintained. 1 can be exposed.

  Further, since the compressed air 81 discharged from the discharge hole 13 is discharged from the space between the substrate 1 and the chuck 10 as the suction air 82 from the intake hole 14, the compressed air from the discharge hole 13 is discharged from the substrate 1 and the chuck 10. It is possible to prevent the flatness of the substrate 1 from being lost by causing the center of the substrate 1 to swell by being accumulated (becomes difficult to be discharged).

  Of course, such a problem is, for example, in the first embodiment, a groove is formed around the discharge hole 13 and the compressed air 81 is discharged from between the substrate 1 and the chuck 10 through the groove. Things are possible.

  Further, in this embodiment, a flying height measuring means 83 for monitoring the flying height H of the substrate 1 is provided. This may be, for example, a laser length measuring device. The initial value is when the flying height H is zero, and the difference from the initial value may be used as the flying height. The flying height H can be accurately managed by adjusting the strength of the discharge hole 13 and the suction hole 14 based on the flying height H value from the flying height measuring means 83. In addition, it is possible to prevent the flying height H from being lowered and the substrate 1 comes into contact with the chuck 10, and the flying height H from being increased to prevent the temperature of the substrate 1 from fluctuating beyond a specified temperature. . Thereby, it is possible to reduce the occurrence frequency of exposure failure.

  A fifth embodiment of the present invention will be described with reference to FIG. The difference between the present embodiment and the third embodiment is that, in this embodiment, as shown in FIG. 14 (1), the chuck 10 and the push-up pin 11 with the intake hole provided in the third embodiment are pushed up. There are no pins 12, a notch 21 is provided in the chuck 10, and a sub-chuck 17 having a protrusion 23 inserted into the notch 21 is provided.

  The sub chuck 17 sucks and holds the substrate 1 and transports the substrate 1 to the chuck 10, a guide rail 19 for guiding the movement of the substrate 1, and the substrate 1 for air floating. It is comprised from the discharge hole 13 which discharges compressed air. The sub-chuck 17 is provided with discharge holes 13 on the entire surface, and the substrate 1 conveyed from the upstream of the production line to the sub-chuck 17 by a conveyor (not shown) or the like is discharged from these discharge holes 13. As shown in FIG. 14 (2), the high-compressed air 80 is used for floating support. The flying height at this time is the flying height for transporting the substrate 1, and is the same as the flying height H1 for moving from holding by the push-up pin to air floating in FIG. 7 (4) of the first embodiment, for example. The height is higher than the flying height H2 at the time of exposure. The movable suction pad 18 is stored in the sub-chuck 17 (below the surface), but when the substrate 1 is conveyed to the sub-chuck 17 from a conveyor (not shown) or the like, the sub-chuck 17 As shown in FIG. 14 (2), the substrate 1 is attracted and held, and then the substrate 1 is transported to the chuck 10 according to the guide rail 19 as indicated by an arrow 22. The sub chuck 17 is provided with a stopper around the substrate (not shown) so that the substrate conveyed from the conveyor does not fall. For this reason, the movable suction pad 18 does not fall off the substage before holding the substrate 1.

  The sub chuck 17 is provided with a convex portion 23, and the convex portion 23 is inserted into the notch 21 of the chuck 10. Further, since the guide rail 19 is installed up to the tip of the convex portion, the substrate 1 can be transferred from the sub chuck 17 to the chuck 10 by moving the movable suction pad 18 according to the guide rail 19. It is. When the substrate 1 is carried from the sub chuck 17 by the movable suction pad 18, as shown in FIG. 14 (2), the high compressed air 80 is discharged from the discharge holes 13 of the sub chuck 17 and the chuck 10. 1 is lifted and transported with a flying height H2. The broken-line substrate 1 and the movable suction pad 18 in the drawing conceptually show a state in the middle of the transfer of the substrate 1 from the sub chuck 17 to the chuck 10. When the movable suction pad 18 moves to the left end of the guide rail 19, that is, when the substrate 1 is transported from the sub chuck 17 to the chuck 10, the movable suction pad 18 descends toward the surface of the chuck 10, and at the same time The air pressure of the high-compressed air 80 from the discharge hole 13 is reduced, and the flying height of the substrate 1 is reduced from the flying height H2 during transport to the exposure flying height H1. As in the first and third embodiments, the chuck 10 is provided with a vacuum section 16, and this height is set to the same height as the exposure flying height H 1. Is held by the vacuum compartment 16 so as not to move in the in-plane direction. Further, as described above, it is floated and held on the chuck 10 by the compressed air. In this state, the substrate 1 is exposed. When the floating amount of the substrate 1 decreases and is held in the vacuum compartment 16, the movable suction pad 18 stops the suction operation, releases the substrate 1, and further descends downward, and the substrate 1 is exposed. Wait until

  When the exposure is completed, the movable suction pad 18 rises to the exposure flying height H2, and when the substrate 1 is sucked and held, the air pressure of the compressed air from the discharge hole 13 becomes stronger, and the flying height for transporting the substrate 1 is increased. Raise to H1. As the substrate 1 is raised, the movable suction pad 18 is also raised to H1. Here, when the exposure of the substrate 1 is completed and the exposure flying height H2 is changed to the transportation flying height H1, the substrate 1 can be quickly raised by stopping the vacuum of the vacuum section 16. It becomes. The movable suction pad 18 that holds the exposed substrate 1 and rises to H <b> 1 moves according to the guide rail 19 from the convex portion 23, and thereafter, the suction is released and stored in the sub chuck 17. . The exposed substrate 1 is delivered from the sub-chuck 17 to conveying means such as a belt conveyor downstream of the production line (the conveying means is not shown). Here, as for the suction mechanism of the movable suction pad 18 and the vertical mechanism, for example, the suction force (vacuum force) by the vacuum pump, the motor, like the push-up pin 11 with the suction hole of the first embodiment. This is not shown here because it can be realized by using the vertical mechanism according to. Further, switching of the strength of the compressed air from the discharge hole 13 can be realized by switching between high compression and low compressed air with a solenoid valve or the like as in the first embodiment, and is not shown.

  According to this embodiment, the sub-chuck 17 lifts and receives the substrate 1 conveyed from a conveyor or the like, thereby eliminating the substrate transfer robot and receiving the substrate from the robot arm. Therefore, since the push-up pin can be eliminated from the chuck 10, the configuration of the apparatus can be simplified and the productivity of the apparatus can be improved.

  Also in the present embodiment, it is possible to expose the substrate 1 while flattening it. Therefore, as in the first and third embodiments, it is possible to reduce exposure defects and perform highly accurate exposure.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, the time required for mounting the substrate on the chuck can be shortened, and defects due to substrate distortion and backside transfer can be reduced. Therefore, the display panel substrate can be manufactured with a short tact time and a high yield.

  In the above-described embodiment, the pin chuck having a section has been mainly described. However, the contents disclosed in this embodiment can be applied to a so-called solid chuck having no section.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Z-tilt mechanism 10 Chuck 11 Thrust pin with suction hole 12 Thrust pin 13 Discharge hole 14 Suction hole 15 Bank 16 Vacuum section 17 Sub Chuck 18 Movable suction pad 19 Guide rail 20 Mask holder 21 Notch 22 Movement direction 23 Protrusions 30, 40, 54 Fittings 31, 41, 55 Piping 32 Solenoid valve for high compressed air 33 Solenoid valve for low compressed air 50 Adsorption Pad part 51 Suction hole 52 Cylinder part 53 Air flow path 56 Vertical drive motor 57 Push-up pin moving direction with intake hole 58 Push-up pin hole with intake hole 60 Motor 61 Push-up pin moving direction 70 Arm 80 High compressed air 81 Compressed air 82 Suction Air 83 Floating amount measuring means 90 Gap G (of substrate and vacuum compartment Septum)
91 Flying height H (space between substrate and chuck surface)
100 constant temperature means 101 heat exchanger 102 piping 200 vacuum force 201 皺

Claims (14)

In an exposure apparatus that exposes a pattern on a substrate,
A first mounting portion for mounting the substrate;
The first mounting portion includes:
An exposure apparatus comprising: a first substrate floating portion for floating the substrate relative to the first mounting portion. The exposure apparatus according to claim 1,
The first substrate floating portion is
An exposure apparatus comprising a supply unit for supplying a medium to the substrate. The exposure apparatus according to claim 2, wherein
The supply unit
Supplying a first medium and a second medium having a pressure lower than that of the first medium to the substrate;
An exposure apparatus that controls a supply amount of the first medium and a supply amount of the second medium. The exposure apparatus according to claim 1,
The first mounting portion includes:
An exposure apparatus comprising a first vertical movement unit on which the substrate is placed. The exposure apparatus according to claim 4, wherein
The exposure apparatus according to claim 1, wherein the first vertical movement mechanism includes a substrate suction portion that sucks the substrate. The exposure apparatus according to claim 4, wherein
The first mounting portion includes:
A second vertically moving portion for placing the substrate;
The exposure apparatus according to claim 1, wherein the first vertical movement unit and the second vertical movement unit move in synchronization. The exposure apparatus according to claim 1,
The first mounting portion includes:
An exposure apparatus comprising a low-pressure section that is lower than the pressure on the first mounting portion. The exposure apparatus according to claim 7, wherein
The low-pressure section is a bank that encloses a part of the space on the first mounting part,
An exposure apparatus having an exhaust portion disposed in the bank. The exposure apparatus according to claim 7, wherein
The exposure apparatus according to claim 1, wherein the low-pressure section is at a corner of the first mounting portion. The exposure apparatus according to claim 2, wherein
The first mounting portion includes:
An exposure apparatus, comprising: an intake portion that sucks air between the substrate and the first mounting portion. The exposure apparatus according to claim 10, wherein
The supply unit has a discharge hole,
The intake part has an intake hole,
The exposure apparatus, wherein the discharge holes and the intake holes are alternately arranged on the first mounting portion. The exposure apparatus according to claim 1,
The mounting portion is
An exposure apparatus comprising: a temperature control unit that controls a temperature between the substrate and the first mounting unit. The exposure apparatus according to claim 1,
A flying height measuring unit for measuring the flying height of the substrate;
The floating part is
An exposure apparatus that controls the flying height based on a measurement result of the flying height measuring unit. The exposure apparatus according to claim 1,
A second mounting portion;
The second mounting part is:
A transport unit for transporting the substrate to the first mounting unit;
An exposure apparatus comprising: a second substrate floating portion for floating the substrate relative to the second mounting portion.

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