JP2006000748A - Substrate-edge-film removing apparatus - Google Patents

Substrate-edge-film removing apparatus Download PDF

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Publication number
JP2006000748A
JP2006000748A JP2004179077A JP2004179077A JP2006000748A JP 2006000748 A JP2006000748 A JP 2006000748A JP 2004179077 A JP2004179077 A JP 2004179077A JP 2004179077 A JP2004179077 A JP 2004179077A JP 2006000748 A JP2006000748 A JP 2006000748A
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Prior art keywords
substrate
edge
slit
cleaning
chuck
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JP2004179077A
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Japanese (ja)
Inventor
Shinji Takase
真治 高瀬
Kazunobu Yamaguchi
和伸 山口
Yoshiaki Sho
芳明 升
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2004179077A priority Critical patent/JP2006000748A/en
Priority to TW094119657A priority patent/TW200611753A/en
Priority to KR1020050051745A priority patent/KR20060046468A/en
Priority to CNB2005100785633A priority patent/CN100445816C/en
Publication of JP2006000748A publication Critical patent/JP2006000748A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-edge-film removing apparatus which surely prevents the bending of the edges of a large-sized glass substrate. <P>SOLUTION: A chuck 3 is raised by making a shaft 4 of a substrate holder 2 extend to receive the substrate W in this raised position. Under this state, a peripheral part of the substrate W is deflected downward by its own weight. Next, the chuck 3 is lowered by retracting the shaft 4 to a level flush with the upper surface of a bar member 17, and then the under surface of the peripheral part of the substrate W is supported by the bar member 17 and the substrate W is retained in a horizontal state. At this time, a cleaning liquid (solvent) is retained by surface tension in a slit 11 of a cleaning unit 10. From this state, the cleaning units 10 at left and right are moved forward to insert the edges of the substrate W in the slit 11 of the cleaning unit 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はガラス基板などの端縁部に形成された余分な被膜（塗布液）を除去する装置に関する。   The present invention relates to an apparatus for removing an excess film (coating liquid) formed on an edge portion of a glass substrate or the like.

液晶表示素子（ＬＣＤ）用のガラス基板に回路を形成するには、半導体ウェーハに集積回路を形成するのと同様にレジスト液やＳＯＧ液の塗布工程を経る必要がある。これら塗布液をガラス基板に塗布する手段としては、スリットノズルを用いた塗布方法などが適用されているが、基板の端縁部において塗膜が厚くなる傾向がある。このような余分な塗膜が形成されると、エッチング等の後に塗膜を除去する際に端縁に塗膜の一部が残り、これが後工程において微細なパーティクルとなって基板表面に付着し、歩留まり低下を来すことがある。   In order to form a circuit on a glass substrate for a liquid crystal display element (LCD), it is necessary to go through a coating process of a resist solution and an SOG solution in the same manner as an integrated circuit is formed on a semiconductor wafer. As a means for applying these coating solutions to the glass substrate, a coating method using a slit nozzle is applied, but the coating tends to be thick at the edge of the substrate. When such an excessive coating film is formed, a part of the coating film remains on the edge when the coating film is removed after etching or the like, and this adheres to the substrate surface as fine particles in a subsequent process. , Yield may decrease.

上記の問題を解消するため、一般的には、特許文献１に開示されるように、基板の端縁に沿って剥離液（洗浄液）を噴出するノズルを移動させるようにしているが、この方法では剥離液は噴出しっぱなしのため、極めて大量の剥離液を必要とする。   In order to solve the above problem, generally, as disclosed in Patent Document 1, a nozzle that ejects a stripping solution (cleaning solution) is moved along the edge of the substrate. Then, since the stripping solution is continuously ejected, a very large amount of stripping solution is required.

特許文献１においては、チャックなどに保持された基板の周辺部に対し、フォトレジスト除去装置を基板の周辺部に沿って相対移動させつつ、フォトレジストを溶解する溶剤吐出手段と、溶解した溶剤を吸引する吸引手段を備えることで基板の周辺部に付着した不要なフォトレジストを除去することが記載されている。更に、本出願人は特許文献２において、チャックなどに保持された基板に対し、除去ユニットを進退可能とし、除去ユニットに形成したスリットに基板の端縁部を挿入し、スリットの内方に設けた洗浄ユニットによって基板の端縁部に付着した余分な被膜を除去することを提案した。   In Patent Document 1, a solvent discharge means for dissolving a photoresist and a dissolved solvent are moved while a photoresist removing device is moved relative to the periphery of the substrate held by a chuck or the like along the periphery of the substrate. It is described that unnecessary photoresist attached to the peripheral portion of the substrate is removed by providing suction means for sucking. Further, in the patent document 2, the present applicant makes it possible to move the removal unit forward and backward with respect to the substrate held on the chuck or the like, and insert the edge portion of the substrate into the slit formed in the removal unit and provide it inside the slit. It was proposed to remove the excess film adhering to the edge of the substrate by using the cleaning unit.

特開平５−１１４５５５号公報Japanese Patent Laid-Open No. 5-114555 特開平８−１０２４３４号公報JP-A-8-102434

近年、液晶表示素子自体の寸法が大きくなるとともに、１枚の素板用ガラス基板からできるだけ多数の液晶表示素子用ガラス基板を切り出すことができるようにするため、ガラス基板（素板）はますます大型化し、１辺が１０００ｍｍを超えるものも珍しくなくなっている。しかしながら、ガラス基板の厚みは従前のままであるので、従来の基板保持部でガラス基板を支持すると、基板の周辺部が下方に撓んでしまい、除去ユニットのスリットに基板の端縁部が入らないことになる。   In recent years, the size of the liquid crystal display element itself has increased, and in order to cut out as many glass substrates for a liquid crystal display element as possible from a single glass substrate for glass, glass substrates (substrates) are increasingly being used. It is not uncommon that the size is increased and one side exceeds 1000 mm. However, since the thickness of the glass substrate remains the same as before, if the glass substrate is supported by the conventional substrate holding portion, the peripheral portion of the substrate is bent downward, and the edge portion of the substrate does not enter the slit of the removal unit. It will be.

上記の不具合を解消するには、基板保持部の面積を大きくすると、基板保持部全体の重量が重くなり、重量を軽くしようと保持部分を薄くすると、面積が大きいため端部が撓んで水平度が出せなくなってしまう。保持部が撓めばその上に載置する基板も一緒に撓んでしまうため、除去ユニットのスリットに基板端縁部が入らなくなってしまう。また、基板の保持部材として例えば、特開２００２−２９９４１６号公報のような搬送ユニットを適用しても基板の４辺の端縁部に付着した余分な被膜を除去するには、対向する２辺の洗浄除去を行った後、ガラス基板を９０°水平面内で回転させなければならず、特開２００２−２９９４１６号公報では、これができない。   To solve the above problems, increasing the area of the substrate holding part increases the weight of the entire board holding part, and reducing the holding part to reduce the weight reduces the area and causes the end to bend and level. Cannot be put out. If the holding portion bends, the substrate placed thereon is also bent together, so that the substrate edge portion does not enter the slit of the removal unit. Further, even if a transport unit such as Japanese Patent Application Laid-Open No. 2002-299416 is applied as a substrate holding member, the two opposing sides can be removed in order to remove excess coating adhered to the edge portions of the four sides of the substrate. After cleaning and removal of the glass substrate, the glass substrate must be rotated in a 90 ° horizontal plane, which is not possible with Japanese Patent Application Laid-Open No. 2002-299416.

上記課題を解決するため、本発明に係る基板の基板端縁部被膜の除去装置は、下面中央部を支持するとともに昇降自在且つ回転可能とされた基板保持部材と、この基板保持部材に保持された基板に対して進退可能で基板の端縁部を挿入して端縁部に付着した余分な被膜を除去する洗浄ユニットと、基板保持部材に保持された基板の中央部よりも外側寄りの部分を下方から支える支え部材とを備えている。   In order to solve the above-described problems, a substrate edge portion film removing apparatus for a substrate according to the present invention supports a center portion of a lower surface and is movable up and down and rotatable, and is held by the substrate holding member. A cleaning unit that can move forward and backward with respect to the substrate and inserts the edge portion of the substrate to remove excess coating adhered to the edge portion, and a portion closer to the outside than the center portion of the substrate held by the substrate holding member And a support member for supporting the sword from below.

前記支え部材の構造としては、支柱にバー部材を取り付けたものが考えられる。そしてバー部材の長さは、基板の長辺の長さと略等しくすることか、好ましくは若干長くすることで、安定して基板を支持することができる。   As the structure of the support member, a structure in which a bar member is attached to a support column can be considered. Then, the length of the bar member can be substantially equal to the length of the long side of the substrate, or preferably slightly longer, so that the substrate can be supported stably.

本発明に係る基板端縁部被膜の除去装置によれば、基板の寸法が大きくなっても、端縁部の撓みがなくなるので、効率よく端縁部に付着した余分な被膜を除去することができる。   According to the apparatus for removing a substrate edge film according to the present invention, even if the size of the substrate increases, the edge film does not bend, so that an excessive film adhered to the edge can be efficiently removed. it can.

以下に本発明の実施の形態を添付図面に基づいて説明する。図１は本発明に係る除去装置の全体斜視図、図２は同除去装置の平面図、図３（ａ）〜（ｃ）は端縁部に付着した余分な被膜の除去工程を説明した図、図４（ａ）は基板の端縁部が洗浄部材のスリットに入る前の状態の拡大断面図、（ｂ）は基板の端縁部が洗浄部材のスリットに入った状態の拡大断面図である。   Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an overall perspective view of a removal apparatus according to the present invention, FIG. 2 is a plan view of the removal apparatus, and FIGS. 3A to 3C are diagrams illustrating a process of removing an excess film attached to an edge portion. FIG. 4A is an enlarged cross-sectional view of the state before the edge portion of the substrate enters the slit of the cleaning member, and FIG. 4B is an enlarged cross-sectional view of the state where the edge portion of the substrate enters the slit of the cleaning member. is there.

基板端部被膜の除去装置はベース１上に設けられる基板保持部２と、この基板保持部２を中心として対向位置に配置される一対の洗浄ユニット１０，１０から構成される。基板保持部２は基板Ｗの下面を固定するチャック（真空チャックまたは静電チャック）３とこのチャック３を回転せしめる軸４とからなる。   The apparatus for removing a substrate end film is composed of a substrate holding part 2 provided on the base 1 and a pair of cleaning units 10, 10 arranged at opposite positions with the substrate holding part 2 as the center. The substrate holding unit 2 includes a chuck (vacuum chuck or electrostatic chuck) 3 that fixes the lower surface of the substrate W and a shaft 4 that rotates the chuck 3.

一方、前記一対の洗浄ユニット１０，１０はベース１上に設けたレール５に沿って、基板保持部２（基板Ｗ）に対して互いに接近及び離反する方向に移動可能とされている。   On the other hand, the pair of cleaning units 10, 10 are movable along the rails 5 provided on the base 1 in directions toward and away from the substrate holder 2 (substrate W).

洗浄ユニット１０には基板Ｗの端縁部が挿入されるスリット１１が水平方向に形成され、このスリット１１には洗浄液の供給路１２を介して洗浄液が供給され、スリット１１内に供給された洗浄液は表面張力にてスリット１１内に滞留する。また、洗浄ユニット１０の背面側には洗浄液の供給管１３及び排出管１４が接続され、常に前記供給路１２に洗浄能力の高い新鮮な洗浄液を供給し、洗浄後の洗浄液は排出管１４から回収するようにしている。   In the cleaning unit 10, a slit 11 into which the edge of the substrate W is inserted is formed in the horizontal direction, and the cleaning liquid is supplied to the slit 11 via a cleaning liquid supply path 12, and the cleaning liquid supplied into the slit 11. Stays in the slit 11 due to surface tension. A cleaning liquid supply pipe 13 and a discharge pipe 14 are connected to the back side of the cleaning unit 10, and a fresh cleaning liquid having a high cleaning ability is always supplied to the supply path 12, and the cleaned cleaning liquid is recovered from the discharge pipe 14. Like to do.

ここで、前記スリット１１の上下方向の寸法は表面張力によってスリット１１内側に溜まった洗浄液がそのまま保持される寸法、具体的には基板Ｗを挿入した状態で基板Ｗの上面とスリット１１上端、基板Ｗの下面とスリット１１下端との間隔は、使用する溶剤の表面張力値に基づき適宜設定すればよいが、通常はそれぞれ１ｍｍ以下になるよう設定する。また、スリット１１の横方向寸法は、挿入する基板Ｗの長辺の寸法よりもやや大きく設定する。   Here, the vertical dimension of the slit 11 is such that the cleaning liquid accumulated inside the slit 11 by the surface tension is maintained as it is, specifically, the upper surface of the substrate W and the upper end of the slit 11 with the substrate W inserted, The distance between the lower surface of W and the lower end of the slit 11 may be set as appropriate based on the surface tension value of the solvent used, but is usually set to 1 mm or less. Further, the horizontal dimension of the slit 11 is set to be slightly larger than the dimension of the long side of the substrate W to be inserted.

更に、スリット１１を形成する下エッジ部１１ａは上エッジ部１１ｂよりも前方に突出し、これにより、基板Ｗの接液領域が上面よりも下面（裏面）において広くなるようにし、基板の裏面に廻り込んだ塗膜も効果的に除去できるようにしている。   Further, the lower edge portion 11a that forms the slit 11 protrudes forward from the upper edge portion 11b, so that the liquid contact area of the substrate W is wider on the lower surface (back surface) than the upper surface, and the lower edge portion 11a extends around the back surface of the substrate. The coated film can be effectively removed.

一方、前記基板保持部２と洗浄ユニット１０との間には支え部材１５を配置している。この支え部材１５は支柱１６にバー部材１７を取り付けてなり、このバー部材１７の長さは基板Ｗの長辺の長さと略等しくするか、好ましくは若干長くしている。この支え部材１５の配置位置は、前記洗浄ユニット１０の前進端（最も内側位置）において洗浄ユニット１０に干渉しない位置とする。   On the other hand, a support member 15 is disposed between the substrate holding unit 2 and the cleaning unit 10. The support member 15 is formed by attaching a bar member 17 to a support column 16, and the length of the bar member 17 is substantially equal to the length of the long side of the substrate W or preferably slightly longer. The support member 15 is disposed at a position where it does not interfere with the cleaning unit 10 at the forward end (innermost position) of the cleaning unit 10.

またバー部材１７の上面は下降位置にある前記チャック３の上面と面一とし、チャック３及びバー部材１７上に基板Ｗが水平に保持されるようにしている。   The upper surface of the bar member 17 is flush with the upper surface of the chuck 3 at the lowered position so that the substrate W is held horizontally on the chuck 3 and the bar member 17.

次に、基板Ｗの端縁に付着したレジスト膜等の余分な被膜を溶剤によって溶解除去する手順を図３、図４及び図５を参照して説明する。
先ず、図３（ａ）に示すように、基板保持部２の軸４を伸張せしめ、チャック３を上昇させ、この上昇位置で基板Ｗを受け取る。この状態では基板Ｗは自重によって周辺部が下方に撓んでいる。 Next, a procedure for dissolving and removing an excessive film such as a resist film attached to the edge of the substrate W with a solvent will be described with reference to FIGS.
First, as shown in FIG. 3A, the shaft 4 of the substrate holder 2 is extended, the chuck 3 is raised, and the substrate W is received at this raised position. In this state, the peripheral portion of the substrate W is bent downward by its own weight.

次いで、図３（ｂ）に示すように、軸４を縮めてチャック３をバー部材１７の上面と面一になるまで下降せしめる。すると、基板Ｗの周縁部下面がバー部材１７によって支持され、基板Ｗは水平状態で保持される。このとき、図４（ａ）に示すように、洗浄ユニット１０のスリット１１内には洗浄液（溶剤）が表面張力で保持されている。また、図４（ａ）に限らず、スリット１１内に基板端縁部を挿入した後でスリット１１内に洗浄液（溶剤）を満たすようにしてもよい。   Next, as shown in FIG. 3B, the shaft 4 is contracted and the chuck 3 is lowered until it is flush with the upper surface of the bar member 17. Then, the lower surface of the peripheral edge portion of the substrate W is supported by the bar member 17, and the substrate W is held in a horizontal state. At this time, as shown in FIG. 4A, the cleaning liquid (solvent) is held in the slit 11 of the cleaning unit 10 by surface tension. Further, not limited to FIG. 4A, the cleaning liquid (solvent) may be filled in the slit 11 after the substrate edge portion is inserted into the slit 11.

この状態から、左右の洗浄ユニット１０を前進させ、洗浄ユニット１０のスリット１１内に基板Ｗの端縁部を挿入する。この状態を図３（ｃ）及び図４（ｂ）に示している。   From this state, the left and right cleaning units 10 are advanced, and the edge of the substrate W is inserted into the slit 11 of the cleaning unit 10. This state is shown in FIG. 3 (c) and FIG. 4 (b).

以上の操作で端縁部に付着している余分な被膜（塗布液）を除去したならば、洗浄ユニット１０を後退させて図３（ｂ）の状態に戻す。この後、軸４を９０°廻して、基板Ｗの残りの２辺を洗浄ユニット１０に対向せしめ、前記と同様の操作により残りの２辺の洗浄を行う。尚、上記の除去を行うにあたり、除去ユニット１０または基板Ｗを振動させてもよい。このようにすることで、被膜の溶解が促進する。   If the excess film (coating liquid) adhering to the edge portion is removed by the above operation, the cleaning unit 10 is retracted to return to the state shown in FIG. Thereafter, the shaft 4 is rotated by 90 ° so that the remaining two sides of the substrate W face the cleaning unit 10, and the remaining two sides are cleaned by the same operation as described above. In performing the above removal, the removal unit 10 or the substrate W may be vibrated. By doing so, dissolution of the coating is promoted.

図５（ａ）に示すように、基板保持部３には図示しない搬送アームから基板Ｗを受け取るリフトピン１８が貫通して上昇している。この上昇位置で基板Ｗを受け取ると基板は自重によって周辺部が下方に撓んでいる。   As shown in FIG. 5A, lift pins 18 that receive the substrate W from a transfer arm (not shown) penetrate the substrate holding unit 3 and rise. When the substrate W is received at this raised position, the peripheral portion of the substrate is bent downward by its own weight.

次いで、図５（ｂ）に示すように、リフトピン１８をチャック３とバー部材１７の上に基板Ｗが水平状態で保持するまで下降させる。   Next, as shown in FIG. 5B, the lift pins 18 are lowered until the substrate W is held on the chuck 3 and the bar member 17 in a horizontal state.

この状態から、左右の洗浄ユニット１０を前進させ、洗浄ユニット１０のスリット内に基板Ｗの端縁部を挿入する。この状態を図５（ｃ）及び図４（ｂ）に示している。   From this state, the left and right cleaning units 10 are advanced, and the edge of the substrate W is inserted into the slit of the cleaning unit 10. This state is shown in FIG. 5 (c) and FIG. 4 (b).

図示例では基板支持部材の高さを固定した例を示したが、バー部材をシリンダユニットなどに支持することで、昇降可能としてもよい。昇降可能とした場合には、基板の端縁部が除去部材の洗浄スリットに入った時点で、シリンダユニットを駆動してバー部材を下げて除去部材との干渉を避けることができるので、基板支持部材によって支持する位置を基板の端縁部ギリギリの位置にすることができる。   In the illustrated example, the height of the substrate support member is fixed. However, the bar member may be supported by a cylinder unit or the like so as to be able to be raised and lowered. When it is possible to move up and down, when the edge of the substrate enters the cleaning slit of the removal member, the cylinder unit can be driven to lower the bar member to avoid interference with the removal member. The position supported by the member can be the position of the edge of the substrate.

図示例では、洗浄ユニット１０に乾燥機能を持たせなかったので、被膜が除去された基板は下流側において端縁部を乾燥装置の基板挿入スリットに水平方向から挿入し、乾燥ガスにて基板端縁部を乾燥せしめる。また、基板端縁部を乾燥せしめるガス噴出部を除去ユニットの一部に付設した場合には下流側に乾燥装置を設ける必要はない。   In the illustrated example, since the cleaning unit 10 is not provided with a drying function, the substrate from which the coating has been removed is inserted into the substrate insertion slit of the drying device from the horizontal direction on the downstream side, and the substrate edge is dried with a dry gas. Allow the edges to dry. Further, when a gas jetting part that dries the edge of the substrate is attached to a part of the removal unit, it is not necessary to provide a drying device on the downstream side.

本発明に係る基板端縁部被膜の除去装置は、液晶表示素子用ガラス基板に回路などを形成するラインの一部に組み込んで使用することができる。   The substrate edge film removing apparatus according to the present invention can be used by being incorporated into a part of a line for forming a circuit or the like on a glass substrate for a liquid crystal display element.

本発明に係る除去装置の全体斜視図The whole perspective view of the removal device concerning the present invention 同除去装置の平面図Top view of the removal device （ａ）〜（ｃ）は端縁部に付着した余分な被膜の除去工程を説明した図(A)-(c) is the figure explaining the removal process of the excess film adhering to an edge part. （ａ）は基板の端縁部が洗浄部材のスリットに入る前の状態の拡大断面図、（ｂ）は基板の端縁部が洗浄部材のスリットに入った状態の拡大断面図(A) is an expanded sectional view of the state before the edge part of a board | substrate enters the slit of a cleaning member, (b) is an enlarged sectional view of the state in which the edge part of the board | substrate entered the slit of the cleaning member. （ａ）〜（ｃ）は端縁部に付着した余分な被膜の除去工程を説明した別実施例の図(A)-(c) is the figure of another Example explaining the removal process of the excess film adhering to the edge part.

符号の説明Explanation of symbols

１…ベース、２…基板保持部、３…チャック、４…軸、５…レール、１０…洗浄ユニット、１１…スリット、１１ａ…スリットの下エッジ部、１１ｂ…スリットの上エッジ部、１２…洗浄液の供給路、１３…洗浄液の供給管、１４…洗浄液の排出管、１５…支え部材、１６…支柱、１７…バー部材、１８…リフトピン、Ｗ…基板。   DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Board | substrate holding part, 3 ... Chuck, 4 ... Axis, 5 ... Rail, 10 ... Cleaning unit, 11 ... Slit, 11a ... Lower edge part of slit, 11b ... Upper edge part of slit, 12 ... Cleaning liquid , 13 ... cleaning liquid supply pipe, 14 ... cleaning liquid discharge pipe, 15 ... support member, 16 ... support, 17 ... bar member, 18 ... lift pin, W ... substrate.

Claims (2)

基板の下面中央部を支持するとともに昇降自在且つ回転可能とされた基板保持部材と、この基板保持部材に保持された基板に対して進退可能で基板の端縁部を挿入して端縁部に付着した余分な被膜を除去する洗浄ユニットを備えた基板端縁部被膜の除去装置であって、この除去装置は、基板保持部材と、基板保持部材に保持された基板の中央部よりも外側寄りの部分を下方から支える支え部材とを有することを特徴とする基板端縁部被膜の除去装置。 A substrate holding member that supports the central portion of the lower surface of the substrate and is movable up and down and rotatable, and can be moved back and forth with respect to the substrate held by the substrate holding member, and an edge portion of the substrate is inserted into the edge portion. An apparatus for removing a substrate edge film having a cleaning unit for removing an excessive film adhered thereto, the removing apparatus being located closer to the outside than a substrate holding member and a central portion of the substrate held by the substrate holding member. And a supporting member that supports the portion of the substrate from below. 請求項１に記載の基板端縁部被膜の除去装置において、前記支え部材は支柱にバー部材を取り付けてなり、このバー部材の長さを基板の長辺の長さと略等しくしたことを特徴とする基板端縁部被膜の除去装置。 2. The apparatus for removing a substrate edge film according to claim 1, wherein the support member is formed by attaching a bar member to a support column, and the length of the bar member is substantially equal to the length of the long side of the substrate. An apparatus for removing a substrate edge film.
JP2004179077A 2004-06-17 2004-06-17 Substrate-edge-film removing apparatus Pending JP2006000748A (en)

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JP2004179077A JP2006000748A (en) 2004-06-17 2004-06-17 Substrate-edge-film removing apparatus
TW094119657A TW200611753A (en) 2004-06-17 2005-06-14 Apparatus for removing coating from edge of substrate
KR1020050051745A KR20060046468A (en) 2004-06-17 2005-06-16 Apparatus for removing coating from edge of substrate
CNB2005100785633A CN100445816C (en) 2004-06-17 2005-06-17 Device for removing coating on the end and edge of substrate

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DE102016002773A1 (en) * 2016-03-09 2017-09-14 Ludy Galvanosysteme Gmbh Device for transporting a flat material to be treated and system with such a device

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CN101740325B (en) * 2008-11-14 2012-11-28 家登精密工业股份有限公司 Cleaning device for semiconductor base material
KR100934765B1 (en) * 2009-01-29 2009-12-30 주식회사 에이디피엔지니어링 Apparatus for manufacturing flat panel display
JP5835188B2 (en) * 2012-11-06 2015-12-24 東京エレクトロン株式会社 Method for removing coating film on peripheral edge of substrate, substrate processing apparatus, and storage medium
JP7131334B2 (en) * 2018-11-29 2022-09-06 株式会社安川電機 Substrate support device, substrate transfer robot and aligner device

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KR20060046468A (en) 2006-05-17
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CN1710468A (en) 2005-12-21

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