JP3995236B2 - Substrate end face cleaning apparatus, substrate end face cleaning method, and semiconductor device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate end surface cleaning apparatus, a substrate end surface cleaning method, and a semiconductor device manufacturing method. More specifically, the present invention relates to a substrate end surface cleaning apparatus and substrate end surface cleaning method for cleaning a substrate end surface with a cleaning liquid, and substrate end surface cleaning. The present invention relates to an improvement in a method for manufacturing a semiconductor device having a process.
[0002]
[Prior art]
In a photolithography process for manufacturing a semiconductor device, a photoresist film is formed on a substrate by a photoresist coating apparatus. This photoresist film forms a thin and uniform photoresist film on the main surface of the substrate. There is a need. As such a film forming method, for example, a so-called spin coating method is known in which a photoresist is dropped almost at the center of the substrate, and the substrate is rotated so that excess photoresist is scattered by centrifugal force.
[0003]
In general, by applying a photoresist, the photoresist adheres not only to the main surface of the substrate but also to the end surface. In particular, in the case of the spin coating method, the photoresist scattered by the centrifugal force tends to adhere to the end face of the substrate. In this way, when the substrate is sent to the next process with the photoresist adhering to the end face of the substrate, the photoresist adheres to a transfer arm or the like for transferring the substrate. When this photoresist dries and adheres again to the substrate or the substrate transported thereafter, it causes a reduction in the manufacturing yield of the semiconductor device. For this reason, it is necessary to remove excess photoresist adhering to the substrate end face, and a substrate end face cleaning process for cleaning the substrate end face after the resist coating process has been conventionally provided in the manufacturing process of semiconductor devices. It was.
[0004]
FIG. 14 is a perspective view showing a schematic configuration of a conventional substrate end surface cleaning apparatus. This substrate end surface cleaning apparatus is an apparatus used in a semiconductor manufacturing process for cleaning a substrate end surface using a cleaning liquid and removing a photoresist or the like attached to the substrate end surface, and is called an EBR (Edge Bead Remover). In the figure, 1 is a substrate, 1E is a substrate end surface, 2 is a stage (substrate support part), 3 is a support shaft, 5 is a cleaning unit, and 6 is a cleaning groove. The substrate 1 is a rectangular glass substrate constituting a liquid crystal panel, and a semiconductor element or the like is formed on one main surface of the substrate by a photolithography process.
[0005]
The substrate 1 coated with the photoresist is placed on the stage 2 supported by the support shaft 3 so that the coated surface becomes the upper surface, and is vacuum-sucked and fixed on the stage 2. The cleaning unit 5 is provided with a cleaning groove 6 for inserting and cleaning the edge of the substrate 1, and the cleaning unit 5 is sandwiched between the two cleaning units 5 with the cleaning groove 6 facing each other. The opposite end sides of the substrate 1 are engaged with the groove 6.
[0006]
Similarly, other opposing end sides are also sandwiched by the other two cleaning units 5, and these end sides are engaged with the cleaning groove 6. In this manner, the four cleaning units 5 are engaged with the four end sides of the substrate 1, respectively. In this state, all the substrate end faces 1E are cleaned by moving each cleaning unit 5 along the substrate edge.
[0007]
FIG. 15 is a cross-sectional view showing the AA cross section of FIG. 14, and FIG. 16 is an enlarged view of the cleaning groove 6. A cleaning groove 6 is formed in the cleaning unit 5 as a U-shaped space opened in the horizontal direction on the substrate 1 side, and an end of the substrate is inserted into the cleaning groove 6 to clean the end surface 1E. .
[0008]
A cleaning nozzle 7 that discharges a cleaning liquid at a predetermined pressure is provided at a lower portion in the cleaning groove 6, and the cleaning liquid discharged upward from the cleaning nozzle 7 is sprayed to the back surface of the substrate slightly inside the substrate end. . In this way, the cleaning liquid sprayed from the back surface side to the substrate end portion wraps around the substrate end surface 1E by the pressure at the time of spraying, and cleans the substrate end surface 1E. For this reason, the photoresist adhering to the substrate end surface 1E can be removed by the cleaning liquid.
[0009]
[Problems to be solved by the invention]
The conventional substrate end surface cleaning apparatus sprays the cleaning liquid from the cleaning nozzle 7 onto the back surface of the substrate in the cleaning groove portion 6 and cleans the substrate end surface 1E with the cleaning liquid that has entered the substrate end surface 1E from the back surface of the substrate. In order to clean the substrate end surface 1E in this way, the position on the back surface of the substrate where the cleaning liquid is sprayed and the pressure of the cleaning liquid when sprayed on the back surface of the substrate are controlled so that the necessary and sufficient cleaning liquid flows around the substrate end surface 1E. There is a need to.
[0010]
When the position on the substrate where the cleaning liquid is sprayed is close to the substrate end surface 1E, the cleaning liquid may be sprayed to the back surface of the substrate at a low pressure, and the cleaning liquid is applied to the back surface of the substrate at a higher pressure as the distance from the substrate end surface 1E increases. It is necessary to spray. For this reason, in order to clean the substrate end surface 1E with the cleaning liquid sprayed from the cleaning nozzle 7 at a predetermined pressure, it is necessary to spray the cleaning liquid to a predetermined position on the substrate. It is necessary to insert to the specified depth. That is, it is necessary to align the cleaning nozzle 7 and the substrate end surface 1E in a horizontal plane.
[0011]
Even if the cleaning liquid is discharged from the cleaning nozzle 7 at the same pressure, the pressure when sprayed on the back surface of the substrate differs if the distance from the cleaning nozzle 7 to the back surface of the substrate is different. For this reason, when the cleaning liquid is discharged from the cleaning nozzle 7 at a predetermined pressure, the distance from the cleaning nozzle 7 to the back surface of the substrate is set to a predetermined length in order to spray the cleaning liquid on the back surface of the substrate to a predetermined pressure. It is necessary to insert the substrate end surface 1E into a predetermined position in the width direction of the cleaning groove 6. That is, it is necessary to align the cleaning nozzle 7 and the substrate end surface 1E in the vertical plane.
[0012]
Such alignment of the substrate 1 is usually performed when the substrate 1 is placed on the stage 2. That is, when the substrate 1 is placed on the stage 2 by the transfer arm, the position of the substrate 1 with respect to the stage 2 is automatically adjusted. For this reason, if the positional relationship between the stage 2 and the cleaning unit 5 at the time of cleaning is constant, the positional relationship between the substrate end surface 1E and the cleaning nozzle 7 can also be made constant.
[0013]
However, such alignment is performed by recognizing a positioning symbol provided on the substrate, and is performed only in a direction parallel to the surface of the stage 2. Therefore, when the substrate 1 is warped or when the substrate 1 is tilted and placed on the stage 2, the substrate end surface 1E is not properly aligned with the cleaning nozzle 7. Cleaning will be performed.
[0014]
In such a case, the substrate end surface 1E cannot be sufficiently cleaned, or the cleaning liquid goes around the substrate surface to cause pattern defects and the like, resulting in a decrease in manufacturing yield of the semiconductor device. . In particular, the warpage of the substrate varies depending on the production process, but in order to increase the operating rate of the manufacturing apparatus and improve the productivity of the production line, the substrate having different warpage is cleaned using the same edge cleaning device. I needed it.
[0015]
FIG. 17 is a cross-sectional view showing a state in which the substrate 1 whose end is warped on the surface side is cleaned using a conventional substrate end surface cleaning apparatus. Since the substrate end is warped upward, the distance from the cleaning nozzle 7 to the back surface of the substrate is longer than a predetermined distance. For this reason, the pressure of the cleaning liquid when sprayed on the back surface of the substrate may become low, and the cleaning liquid may not sufficiently wrap around the substrate end surface 1E. In such a case, the photoresist adhering to the substrate end surface 1E cannot be sufficiently removed.
[0016]
FIG. 18 is a cross-sectional view showing a state in which a substrate whose end is warped on the back surface side is cleaned using a conventional substrate end surface cleaning apparatus. Contrary to FIG. 17, since the substrate end is warped downward, the distance from the cleaning nozzle 7 to the back surface of the substrate is closer than a predetermined distance. For this reason, the pressure of the cleaning liquid when sprayed on the back surface of the substrate may increase, and the cleaning liquid may reach the surface of the substrate. In addition, a state such as a liquid pool occurs on the back surface of the substrate, the apparent discharge amount of the cleaning liquid increases, and the cleaning liquid easily reaches the substrate surface. When the cleaning liquid that has flowed to the surface side of the substrate in this way reaches the semiconductor or wiring formation region or the like, it causes a pattern defect and reduces the manufacturing yield of the semiconductor device.
[0017]
FIG. 19 is a cross-sectional view showing a state in which the substrate 1 placed on the stage 2 in an inclined state is cleaned using a conventional substrate end surface cleaning apparatus. When the substrate 1 is placed on the stage 2 in a tilted state that is not horizontal, one substrate end is far from the cleaning nozzle 7 and the other substrate end is close to the cleaning nozzle 7. For this reason, the photoresist adhering to one substrate end surface 1E cannot be sufficiently removed, and there is a possibility that a pattern defect may occur on the other substrate end side.
[0018]
Further, when the substrate 1 is placed on the stage 2, the substrate 1 is not accurately aligned with the stage 2 for some reason, and the alignment of the substrate end surface 1 </ b> E and the cleaning nozzle 7 in the horizontal plane is accurate. There is a case where it is not performed. In such a case, the position on the substrate to which the cleaning liquid is sprayed changes. If this position is too far from the substrate end surface 1E, the photoresist cannot be removed sufficiently, and if it is too close to the substrate end surface 1E, a pattern defect occurs. Let
[0019]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cleaning nozzle for supplying a cleaning liquid and a substrate end surface cleaning apparatus for aligning the substrate end surface. Another object of the present invention is to provide a substrate end surface cleaning method for aligning the cleaning nozzle and the substrate end surface. It is another object of the present invention to provide a method for manufacturing a semiconductor device using such a method for cleaning a substrate end face.
[0020]
It is another object of the present invention to provide a substrate end surface cleaning apparatus that can clean a substrate end surface using a cleaning liquid while preventing the cleaning liquid from flowing around the substrate surface. It is another object of the present invention to provide a substrate end surface cleaning method for cleaning a substrate end surface using a cleaning liquid while preventing the cleaning liquid from flowing around the substrate surface. It is another object of the present invention to provide a method for manufacturing a semiconductor device using such a method for cleaning a substrate end face.
[0021]
[Means for Solving the Problems]
  A substrate end surface cleaning apparatus according to a first aspect of the present invention includes a substrate support portion that supports a substrate, and cleaning groove portions that are open at both ends. The cleaning unit to be cleaned, the substrate detection sensor provided in the cleaning unit for detecting the relative position of the substrate to the cleaning unit, and the cleaning unit and the substrate support unit are relatively moved in a plane perpendicular to the groove direction of the cleaning groove. And an alignment control unit that controls the alignment drive unit based on the output of the substrate detection sensor and aligns the cleaning unit and the substrate end face.The substrate detection sensor is provided on the side of the cleaning unit on the open end side of the cleaning groove, and is a first substrate configured by a light emitting element that emits light toward the main surface of the substrate and a light receiving element that detects the emitted light A detection sensor, a light emitting element that is disposed farther than the first substrate detection sensor with respect to the side surface of the cleaning unit, emits light toward the substrate end surface, and a light receiving element that detects the emitted light. It consists of a 2nd substrate detection sensor, and the above-mentioned position alignment drive part is constituted so that a washing unit and a substrate support part may move relatively in the depth direction and width direction of a washing groove part.
[0022]
The substrate detection sensor provided in the cleaning unit can detect the relative position of the substrate with respect to the cleaning unit. Further, the alignment driving unit can relatively move the cleaning unit and the substrate support within a plane orthogonal to the groove direction of the cleaning groove. The alignment control unit detects the relative position of the substrate with respect to the cleaning unit based on the output of the substrate detection sensor, and controls the alignment driving unit based on the relative position to determine the position of the substrate with respect to the cleaning unit. Aligning. For this reason, when the cleaning liquid is discharged in the cleaning groove to clean the substrate end surface, the cleaning nozzle and the substrate end surface can be accurately aligned.
[0023]
  In the substrate end surface cleaning apparatus according to the present invention as set forth in claim 2, the second substrate detection sensor comprises:The sensor is configured to include a sensor capable of detecting that the end face of the substrate passes on the optical path when the substrate is moved up and down.By providing the substrate detection sensor in the vicinity of the open end of the cleaning groove, the relative position of the substrate end surface with respect to the cleaning nozzle can be accurately detected.
[0024]
In the substrate end surface cleaning apparatus according to the third aspect of the present invention, the alignment control unit aligns the cleaning unit and the substrate end surface based on the output of the substrate detection sensor when driven by the alignment driving unit. Configured. By detecting the relative position of the substrate while relatively moving the cleaning unit and the substrate support portion, the position of the substrate can be detected using a simple substrate detection sensor.
[0025]
According to a fourth aspect of the present invention, there is provided a substrate end surface cleaning apparatus including a cleaning driving unit that relatively moves the cleaning unit and the substrate support unit in the groove direction of the cleaning groove.
[0026]
  The substrate end surface cleaning apparatus according to the present invention as set forth in claim 5 is:The light receiving element is arranged to face the light emitting element across the open end of the cleaning groove. By providing the light emitting element and the light receiving element across the open end of the cleaning groove, the relative position of the substrate end surface with respect to the cleaning nozzle can be accurately detected.
[0027]
With such a configuration, the substrate detection sensor can detect the substrate at a predetermined detection position on a two-dimensional plane substantially parallel to the main surface of the substrate, that is, a position corresponding to the mounting position of the light emitting element and the light receiving element. The alignment driving unit can relatively move the cleaning unit and the substrate in the depth direction of the cleaning groove. Therefore, the position of the substrate end face in the depth direction of the cleaning groove can be detected based on the output of the substrate detection sensor, and the substrate end face is aligned by moving the cleaning unit or the substrate in the depth direction of the cleaning groove. It can be carried out.
[0028]
  A substrate end surface cleaning apparatus according to the present invention as set forth in claim 6,The substrate detection sensor includes a light emitting element, a light receiving element, and a light reflecting portion, and the light reflecting portion is disposed to face the light emitting element and the light receiving element with the open end of the cleaning groove portion interposed therebetween. The light receiving element is configured to detect the reflected light. By detecting the substrate using the light reflecting portion, it is possible to accurately detect the relative position of the substrate end surface with respect to the cleaning nozzle.
[0029]
  A substrate end surface cleaning apparatus according to the present invention as set forth in claim 7,The cleaning unit includes a pair of cleaning units that are disposed so that the cleaning groove portions that are open at both ends are opposed to each other, and that clean the opposite substrate end surfaces with the cleaning liquid discharged from the cleaning nozzle in each cleaning groove portion. The alignment driving unit relatively moves each cleaning unit and the substrate support within a plane orthogonal to the groove direction of the cleaning groove, and the alignment control unit is configured to align the driving unit based on the output of the substrate detection sensor. And is configured to align each cleaning nozzle and the substrate end face.
[0031]
With such a configuration, the substrate detection sensor can detect the substrate at a predetermined detection position on a two-dimensional plane substantially parallel to the substrate end surface, that is, a position corresponding to the mounting position of the light emitting element and the light receiving element. Further, the alignment driving unit can relatively move the cleaning unit and the substrate support unit in the width direction of the cleaning groove. Therefore, the alignment control unit can detect the position of the substrate end surface in the width direction of the cleaning groove portion based on the output of the substrate detection sensor, and can align the substrate end surface in the width direction of the cleaning groove portion. .
[0033]
  Claim8In the substrate end surface cleaning apparatus according to the present invention, the substrate detection sensor is provided in one cleaning unit, and is provided in a light emitting element that emits light toward the substrate end surface, and in the other cleaning unit. It consists of a light receiving element that detects the emitted light, and the positioning drive unit is a width direction drive unit that relatively moves the cleaning unit and the substrate support unit in the width direction of the cleaning groove.
[0034]
  Claim9In the substrate end surface cleaning apparatus according to the present invention, the substrate detection sensor includes a light emitting element and a light receiving element provided in one cleaning unit, and a light reflecting unit provided in the other cleaning unit. The alignment driving unit includes a width direction driving unit that relatively moves the cleaning unit and the substrate support unit in the width direction of the cleaning groove.
[0035]
  Claim10In the substrate end surface cleaning apparatus according to the present invention, the substrate detection sensor detects a relative position of the substrate relative to one cleaning unit, and a relative position of the substrate relative to the other cleaning unit. And the positioning driving unit includes a width direction driving unit that moves each cleaning unit independently with respect to the substrate support unit.
[0037]
  Claim11The substrate edge surface cleaning method according to the present invention described inThe cleaning unit moves the cleaning unit relatively along the substrate end surface and cleans the substrate end surface with the cleaning liquid discharged from the cleaning nozzle in the cleaning groove, and the substrate detection sensor provided in the cleaning unit causes the substrate to be cleaned with respect to the cleaning unit. A position detection step for detecting the relative position of the substrate, and based on the detected relative position, the cleaning unit and the substrate support are relatively moved in a plane orthogonal to the direction of movement of the cleaning unit in the cleaning step to perform cleaning. A light-emitting element that emits light toward the main surface of the substrate, the position detecting step being provided on the side surface of the cleaning unit on the open end side of the cleaning groove. And a substrate for the cleaning unit using the first substrate detection sensor constituted by the light receiving element for detecting the emitted light. A first position detecting step for detecting the position of the cleaning groove in the depth direction as a relative position; and a position farther than the first substrate detection sensor with respect to the side surface of the cleaning unit, toward the substrate end surface A second substrate detection sensor configured by a light emitting element that emits light and a light receiving element that detects the emitted light detects a position in the width direction of the cleaning groove as a relative position of the substrate with respect to the cleaning unit. The positioning driving step is configured to relatively move the cleaning unit and the substrate support portion in the depth direction and the width direction.
[0038]
  Claim12The substrate edge surface cleaning method according to the present invention described inThe second position detecting step is a step of detecting the position in the width direction using the second substrate detection sensor capable of detecting that the substrate end surface passes on the optical path when the substrate is moved up and down. Configured to be.
[0039]
  Claim13The substrate edge surface cleaning method according to the present invention described inA position detecting drive step for relatively moving the cleaning unit and the substrate support within a plane orthogonal to the moving direction of the cleaning unit in the cleaning step, wherein the position detecting step is a substrate when driven by the position detecting drive step; A relative position of the substrate with respect to the cleaning unit is configured to be detected based on the output of the detection sensor.
[0042]
  Claim14The method of manufacturing a semiconductor device according to the present invention described inA substrate end face cleaning method according to any one of claims 11 to 13 is provided to provide a step of cleaning the substrate end face.In the manufacturing process of a semiconductor device, the yield of the semiconductor device can be improved and the reliability can be improved by sufficiently cleaning the end surface of the substrate without damaging the formation region of the semiconductor, the wiring, and the like.
[0043]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a perspective view showing a configuration example of a substrate end surface cleaning apparatus according to Embodiment 1 of the present invention. This substrate end surface cleaning apparatus is a cleaning apparatus for removing a photoresist or the like adhering to the substrate end surface, and is used in a manufacturing process of a liquid crystal display device. In the figure, 1 is a substrate, 2 is a stage, 3 is a support shaft, 5 is a cleaning unit, 6 is a cleaning groove, 10 is a light emitting element, 11 is a light receiving element, 20 is a cleaning unit drive section, 21 is a support shaft drive section, Reference numeral 22 denotes an alignment control unit.
[0044]
The substrate 1 is a rectangular glass substrate constituting a liquid crystal panel, and has a shape in which opposing end faces are parallel, that is, a rectangle. On one main surface of the substrate 1, semiconductor elements, wiring, color filters, and the like are formed by a well-known photolithography process. When applying a photoresist on one main surface of the substrate 1, the photoresist also adheres to the substrate end surface 1E. Therefore, the unnecessary photoresist on the substrate end surface 1E is removed using the substrate end surface cleaning apparatus of FIG.
[0045]
The stage 2 is a substrate support portion that supports the substrate 1 to be cleaned, and is supported horizontally by the support shaft 3. The support shaft 3 is driven by a support shaft drive unit 21 made of a motor or the like. The support shaft drive unit 21 can rotate the stage 2 via the support shaft 3, move it up and down, and move it in a horizontal plane.
[0046]
The substrate 1 immediately after the photoresist is applied is placed on the stage 2 so that the application surface becomes the upper surface, and is vacuum-adsorbed and fixed on the stage 2. At this time, the positioning symbol on the substrate 1 is recognized, and the alignment of the substrate 1 with respect to the stage 2 is performed.
[0047]
The pair of cleaning units 5 are driven by a cleaning unit driving unit 20 including a motor or the like. The cleaning unit driving unit 20 translates the pair of cleaning units 5 along the substrate end. At this time, each cleaning unit 5 can clean the substrate end surface 1E and simultaneously clean the opposite end surface 1E of the substrate 1. The moving direction of the cleaning unit at this time (the groove direction of the cleaning groove 6) is referred to as the cleaning direction.
[0048]
Each cleaning unit 5 has a cleaning groove 6 for inserting an end of the substrate 1. Although FIG. 1 shows an example in which the cross-sectional shape is a U-shape, other shapes may be used. The substrate end face 1 </ b> E is cleaned by spraying a cleaning liquid onto the substrate 1 in the cleaning groove 6. As the cleaning liquid to be sprayed, it is desirable to use a chemical liquid suitable for the cleaning target such as a photoresist, but pure water may be used.
[0049]
The cleaning groove 6 is a groove having an opening extending in the horizontal direction on the substrate side of the cleaning unit 5 and having a horizontal depth. Both ends of the cleaning groove 6 are opened through the cleaning unit 5. Therefore, the cleaning unit 5 can move relative to the substrate 1 in the groove direction of the cleaning groove 6 with the substrate end inserted.
[0050]
A light emitting element 10 and a light receiving element 11 are provided on the side surface of the housing of the cleaning unit 5. The light emitting element 10 and the light receiving element 11 provided in the vicinity of the open end of the cleaning groove 6 are opposed to each other with the open end therebetween, and constitute a substrate detection sensor. Here, a case where the light emitting element 10 is provided above one open end of the cleaning groove 6 and the light receiving element 11 is provided below the open end will be described. However, the light emitting element is provided below and the light receiving element is provided above. May be.
[0051]
Each cleaning unit 5 is provided with two substrate detection sensors, that is, two sets of light emitting elements 10 and light receiving elements 11. Light emitted from the light emitting elements 10 is paired with the light emitting elements 10. 11 and the presence or absence of the substrate 1 is detected on the propagation path of the outgoing light.
[0052]
2 is a view of the substrate end surface cleaning apparatus of FIG. 1 as viewed from the moving direction (A direction) of the cleaning unit 5, and FIG. 3 is a view of the substrate end surface cleaning apparatus of FIG. It is a figure.
[0053]
A cleaning nozzle 7 that discharges a cleaning liquid for cleaning at a predetermined pressure is provided at a lower portion in the cleaning groove 6, and the substrate end surface 1 E is cleaned by the cleaning liquid sprayed upward from the cleaning nozzle 7. The two substrate detection sensors are arranged in the depth direction of the cleaning groove 6 so that the substrate end portions are approximately in the middle of the propagation paths of the emitted light from the two substrate detection sensors. Detection light is emitted toward the main surface (that is, in the vertical direction). If there is no substrate on the path of the emitted light, the light receiving element 11 detects the emitted light and does not detect it if the substrate exists.
[0054]
The support shaft drive unit 21 moves the support shaft 3 in the horizontal direction (left and right direction in FIGS. 2 and 3), thereby moving the substrate 1 in the depth direction of the cleaning groove 6. Based on the detection result of the substrate detection sensor at this time, the position of the substrate end with respect to the cleaning unit 5 can be detected. That is, the detection result of the substrate detection sensor changes by moving the substrate 1 in the horizontal direction. At the time of this change, it can be detected that the substrate end has passed through the optical path of the substrate detection sensor. When such a detection method is employed, at least one substrate detection sensor may be provided for each cleaning unit 5.
[0055]
The alignment control unit 22 controls the support shaft driving unit 21 and inputs the detection result of the substrate detection sensor of each cleaning unit 5. The alignment control unit 22 monitors the detection result of the substrate detection sensor of each cleaning unit 5 while moving the substrate 1 in the horizontal direction by the support shaft driving unit 21. As a result, if the position of the substrate end portion with respect to each cleaning unit 5 can be detected, the relative position of the substrate end surface 1E with respect to the cleaning nozzle 7 can be detected.
[0056]
When two substrate detection sensors are provided for each cleaning unit 5 as shown in FIGS. 1 to 3, if the detection results of the two substrate detection sensors are different, the substrate 1 is moved in the horizontal direction. It is possible to detect that the end portion of the substrate is positioned between the two light propagation paths. If the detection results of the two substrate detection sensors match, the position of the substrate end can be detected by moving the substrate 1 in the horizontal direction and finding a state where the detection results of the two substrate detection sensors are different. it can.
[0057]
In this way, if the position of the substrate end portion with respect to each cleaning unit 5 can be detected, the relative position of the substrate end surface 1E with respect to the cleaning nozzle 7 can be detected. And the substrate 1 is moved so that the end face of the substrate is in a position suitable for cleaning in the cleaning groove 6. That is, alignment is performed such that the cleaning liquid discharged from the cleaning nozzle 7 is sprayed to a predetermined position slightly inside the substrate end.
[0058]
Thereafter, if the cleaning liquid is discharged from the cleaning nozzle at a predetermined pressure, the cleaning liquid can be sufficiently passed around the substrate end surface 1E to clean the substrate end surface 1E, and the cleaning liquid can be prevented from flowing around the substrate surface. . If the cleaning unit 5 is moved from one end to the other end along the edge (one side) of the substrate 1 in this state, the opposing substrate end surface 1E can be cleaned.
[0059]
Next, the spindle drive unit 21 rotates the spindle 3 by 90 °, and inserts the uncleaned opposite substrate end into the cleaning groove 6 of each cleaning unit 5. Then, in exactly the same manner as described above, after the substrate end surface 1E is aligned with the cleaning nozzle 7, the substrate end surface 1E is cleaned.
[0060]
According to the present embodiment, the cleaning unit 5 is provided with the substrate detection sensor, and the relative position of the substrate 1 with respect to the cleaning unit 5 is detected. For this reason, it is possible to accurately align the cleaning nozzle 7 and the substrate end surface 1E. Further, a substrate detection sensor is provided on the side surface of the cleaning unit 5, particularly on the open end side of the cleaning groove 6, and the substrate end surface 1 </ b> E is positioned horizontally based on the output of the substrate detection sensor while driving the substrate by the support shaft driving unit 21. Is detected. For this reason, the cleaning unit 5 and the substrate end face 1E can be accurately aligned.
[0061]
In this way, the substrate end surface 1E is accurately positioned with respect to the cleaning nozzle 7 with respect to the depth direction of the cleaning groove portion 6 so that the cleaning liquid discharged from the cleaning nozzle 7 can sufficiently wrap around the substrate end surface 1E, and the substrate The end surface 1E can be cleaned, and the cleaning liquid can be prevented from reaching the substrate surface.
[0062]
In particular, when the substrate end face is cleaned with respect to a warped substrate, or when the substrate end face is cleaned with respect to a substrate placed on the stage 2, the stage 2 and the substrate 1 are cleaned. Positioning of the cleaning nozzle and the substrate end face, which cannot be adjusted by normal alignment, can be performed accurately.
[0063]
Embodiment 2. FIG.
In the first embodiment, the substrate 1 is moved to detect the position of the substrate end with respect to the cleaning unit 5, and the substrate 1 is moved to a desired position, and then the substrate end surface 1E is cleaned. In the present embodiment, a case will be described in which the cleaning unit 5 is moved to detect the substrate end and to move the substrate 1 to a desired position.
[0064]
FIG. 4 is a perspective view showing a configuration example of the substrate end surface cleaning apparatus according to the second embodiment of the present invention. FIG. 5 is a view of the substrate end surface cleaning apparatus of FIG. 4 as viewed from the moving direction (direction A) of the cleaning unit 5. The alignment control unit 22 can control the cleaning unit driving unit 20 to move each cleaning unit 5 in the horizontal direction (the depth direction of the cleaning groove 6). Based on the output of the substrate detection sensor at this time, the position of the substrate end with respect to the cleaning unit 5 can be detected.
[0065]
Based on the detection result, the alignment control unit 22 controls the cleaning unit driving unit 20 to move the cleaning unit 5 so that the substrate end surface is in a position suitable for cleaning in the cleaning groove 6, thereby cleaning the nozzle 7. The substrate end face 1E is aligned with respect to the substrate.
[0066]
Here, by making each cleaning unit 5 movable independently, it is possible to simultaneously detect the position of the substrate end by each cleaning unit 5 and to clean each substrate end face for each cleaning unit 5. The relative position with respect to the substrate 1 can be changed so as to satisfy the optimum conditions.
[0067]
When detecting the relative position of the substrate end with respect to the cleaning unit 5, it is only necessary to monitor the output of the substrate detection sensor provided in the cleaning unit 5 while moving at least the substrate 1 and the cleaning unit 5. The substrate 1 may be moved as in the first embodiment, the cleaning unit may be moved as in the present embodiment, or both may be moved.
[0068]
Similarly, in order to move the substrate end face to a position suitable for cleaning within the cleaning groove 6, it is sufficient that at least the substrate 1 and the cleaning unit 5 can be relatively moved. 1 may be moved, the cleaning unit may be moved as in the present embodiment, or both may be moved.
[0069]
Embodiment 3 FIG.
In the first and second embodiments, an example in which the light emitting element 10 and the light receiving element 11 are arranged to face each other as a substrate detection sensor has been described. However, in this embodiment, a light transmitting / receiving element and a reflection mirror are arranged to face each other as a substrate detection sensor. The case where it is made to explain is demonstrated.
[0070]
FIG. 6 is a schematic view showing a substrate end surface cleaning apparatus according to Embodiment 3 of the present invention. In the figure, 1 is a substrate, 2 is a stage, 3 is a support shaft, 5 is a cleaning unit, 6 is a cleaning groove, 12 is a light transmitting / receiving element, and 13 is a reflecting mirror.
[0071]
On the side surface of the housing of the cleaning unit 5, a substrate detection sensor is provided in which the light transmitting / receiving element 12 and the reflection mirror 13 are arranged to face each other across the open end of the cleaning groove 6. Here, the case where the light transmitting / receiving element 12 is provided above one open end of the cleaning groove 6 and the reflection mirror 13 is provided below the open end will be described. May be provided above.
[0072]
The light transmitting / receiving element 12 includes a pair of a light emitting element and a light receiving element (not shown), emits light from the light emitting element, and the light receiving element detects incident light. The reflection mirror 13 is a flat light reflecting portion for reflecting the light emitted from the light transmitting / receiving element 12 toward the light transmitting / receiving element 12 with the surface facing the light transmitting / receiving element 12 as a mirror surface. It has become.
[0073]
Light emitted from the light transmitting / receiving element 12 is emitted toward the main surface of the substrate 1 (that is, in the vertical direction). When the substrate 1 is not present on the propagation path of the emitted light, the emitted light is reflected by the reflection mirror 13 and is incident on the light transmitting / receiving element 12 again. On the other hand, when the substrate 1 is present on the propagation path of the outgoing light, it is not detected. Therefore, by detecting the incident light to the light transmitting / receiving element 12, it is possible to detect the presence or absence of the substrate 1 on the propagation path of the emitted light and to detect the position of the substrate end. At that time, if the light reciprocated between the light transmitting / receiving element 12 and the reflecting mirror 13 is detected, the position of the substrate end can be detected with high accuracy.
[0074]
According to the present embodiment, the substrate detection sensor has the reflection mirror arranged to face the light emitting element and the light receiving element across the open end of the cleaning groove, and the emitted light of the light emitting element reflected by the reflection mirror Is detected by the light receiving element. For this reason, the position of the substrate end can be detected with high accuracy, and the substrate end surface 1E can be positioned more accurately with respect to the cleaning nozzle 7 in the depth direction of the cleaning groove 6.
[0075]
Embodiment 4 FIG.
In the first to third embodiments, the example in which the substrate end surface 1E and the cleaning nozzle 7 are aligned in the depth direction (horizontal direction) of the cleaning groove 6 has been described. However, in this embodiment, the cleaning groove 6 A case where the substrate end surface 1E and the cleaning nozzle 7 are aligned in the width direction (vertical direction) will be described.
[0076]
FIG. 7 is a schematic view showing a substrate end surface cleaning apparatus according to Embodiment 4 of the present invention. FIG. 8 is a diagram showing a state in which the substrate end surface cleaning apparatus of FIG. 7 is viewed from above. In the figure, 1 is a substrate, 2 is a stage, 3 is a support shaft, 5 is a cleaning unit, 10 is a light emitting element, 11 is a light receiving element, 14 is a light transmitting / receiving element, and 15 is a reflecting mirror. Compared with the substrate end surface cleaning apparatus of FIG. 2, the difference is that a light transmitting / receiving element 14 and a reflecting mirror 15 are added.
[0077]
A light transmitting / receiving element 14 is provided on the side surface of the housing of one cleaning unit 5, and a reflection mirror 15 is provided on the side surface of the housing of the other cleaning unit 5. The light transmitting / receiving element 14 and the reflecting mirror 15 are both disposed in the vicinity of the open end of the cleaning groove 6 so as to face each other with the substrate 1 interposed therebetween, and constitute a substrate detection sensor.
[0078]
The light transmitting / receiving element 14 includes a pair of a light emitting element and a light receiving element (not shown) as in the case of the light transmitting / receiving element 12 in FIG. 6, and emits light from the light emitting element, and the light receiving element detects incident light. Similarly to the reflection mirror 13 in FIG. 6, the reflection mirror 15 is also a flat plate for reflecting the light emitted from the light transmitting / receiving element 14 toward the light transmitting / receiving element 14 by using a surface facing the light transmitting / receiving element 14 as a mirror surface. It is a light reflecting portion, and its mirror surface extends in the vertical direction.
[0079]
Light emitted from the light transmitting / receiving element 14 is emitted toward the substrate end surface 1E (that is, in the horizontal direction). When the substrate 1 is not present on the propagation path of the emitted light, the emitted light is reflected by the reflection mirror 15 and is incident on the light transmitting / receiving element 14 again. On the other hand, when the substrate 1 is present on the propagation path of the outgoing light, it is not detected. Therefore, the presence or absence of the substrate 1 on the propagation path of the outgoing light can be detected by detecting the incident light on the light transmitting / receiving element 14.
[0080]
The supporting shaft drive unit 21 moves the supporting shaft 3 in the vertical direction (up and down direction in FIG. 7), so that the substrate 1 can be moved in the width direction of the cleaning groove 6. Based on the detection result of the substrate detection sensor at this time, the position of the substrate end with respect to the cleaning unit 5 can be detected. That is, when the substrate 1 is moved up and down, the detection result of the substrate detection sensor changes. At the time of this change, it can be detected that the substrate end has passed through the optical path of the substrate detection sensor.
[0081]
The alignment control unit 22 controls the support shaft driving unit 21 and inputs the detection result of the substrate detection sensor of each cleaning unit 5. The alignment control unit 22 monitors the detection result of the substrate detection sensor of each cleaning unit 5 while moving the substrate 1 in the vertical direction by the support shaft driving unit 21.
[0082]
If the center portion of the substrate 1 is placed on the stage 2, the warp of the substrate 1 appears as a vertical displacement of the end portion of the substrate. Further, when the substrate 1 is placed on the stage 2 at an inclination, it is the substrate end that is displaced in the vertical direction most. For this reason, if the position of the substrate 1 in the vertical direction with respect to each cleaning unit 5 is detected, the relative position of the substrate end surface 1E with respect to the cleaning nozzle 7 can be detected. For this reason, the alignment control part 22 moves the board | substrate 1 by the spindle drive part 21 to the position suitable for the washing | cleaning of the board | substrate end surface 1E.
[0083]
In this way, when the substrate 1 without warping is placed horizontally on the stage 2, the horizontal position of the substrate 1 can be detected. In addition, when the substrate 1 is warped or the substrate 1 is placed on the stage 2 so as to be inclined, the position of the lifted substrate end can be detected. it can.
[0084]
Thereafter, if the cleaning liquid is discharged from the cleaning nozzle 7 at a predetermined pressure, the cleaning liquid can be sufficiently passed around the substrate end surface 1E to clean the substrate end surface 1E, and the cleaning liquid can be prevented from flowing around the substrate surface. it can. If the cleaning unit 5 is moved from one end to the other end along one side of the substrate 1 in this state, the opposing substrate end surface 1E can be cleaned.
[0085]
Steps S101 to S107 in FIG. 9 are flowcharts showing an example of a cleaning method using the substrate end surface cleaning apparatus in FIG. 8, and show a procedure for cleaning the substrate end surface after alignment in the horizontal and vertical directions. .
[0086]
First, with the cleaning unit 5 moved in the cleaning direction and retracted, the substrate 1 after applying the photoresist is placed on the stage 2 by the transfer arm (step S101). Next, the two cleaning units 5 that have been retracted are moved in the cleaning direction (groove direction of the cleaning groove portion 6), and the opposite substrate end portions are inserted into the cleaning groove portions 6 of the respective cleaning units 5 (step S102).
[0087]
Next, the substrate 1 and the cleaning unit 5 are relatively moved in the horizontal direction, and based on the outputs of the substrate detection sensors 10 to 13 at that time, the alignment of the substrate end surface 1E with respect to the cleaning nozzle 7 in the horizontal direction is performed (step). S103). Next, the cleaning unit 5 is moved in the cleaning direction, and the end of the substrate 1 in the cleaning direction is detected based on the outputs of the substrate detection sensors 10 to 13 (step S104).
[0088]
Next, the cleaning unit 5 is once removed from the substrate 1. That is, the cleaning unit 5 is moved in the cleaning direction so that the end of the substrate is not inserted into the cleaning groove 6 (step S105). Next, the substrate 1 and the cleaning unit 5 are relatively moved in the vertical direction, and based on the outputs of the substrate detection sensors 14 and 15 at that time, the alignment of the substrate end surface 1E with respect to the cleaning nozzle 7 in the vertical direction is performed (step). S106). In this way, after the alignment in the horizontal and vertical directions is completed, the cleaning unit 5 is moved in the cleaning direction to clean the substrate end face (step S107).
[0089]
In step S105, the cleaning unit 5 is once removed from the substrate, and the substrate 1 and the cleaning unit 5 are aligned in the vertical direction, so that the substrate 1 tilted on the warped substrate 1 or the stage 2 is placed. When the substrate is moved in the vertical direction, the substrate 1 can be prevented from contacting the inside of the cleaning groove 6.
[0090]
Further, as shown in FIG. 8, the light transmitting / receiving portions of the substrate detection sensors 14, 15 are provided outside the tip portions of the substrate detection sensors 10 to 13, and the optical axes of the substrate detection sensors 14, 15 are set to If it arrange | positions outside ~ 13, when the board | substrate 1 is moved to the perpendicular direction in said step S105, it can prevent that the board | substrate 1 contacts the board | substrate detection sensors 10-13.
[0091]
According to the present embodiment, the substrate detection sensors 14 and 15 are provided on the side surface of the cleaning unit 5, particularly on the open end side of the cleaning groove portion 6, and the substrate is driven by the support shaft driving unit 21, while the substrate detection sensor outputs it. Based on this, the vertical position of the substrate end surface 1E can be detected, and the cleaning unit 5 and the substrate end surface 1E can be accurately aligned. That is, with respect to the width direction of the cleaning groove 6, the substrate end surface 1E is accurately positioned with respect to the cleaning nozzle 7, so that the cleaning liquid discharged from the cleaning nozzle 7 is sufficiently brought into the substrate end surface 1E to clean the substrate end surface 1E. In addition, it is possible to prevent the cleaning liquid from reaching the substrate surface.
[0092]
In the present embodiment, the example in which the alignment control unit 22 controls the support shaft driving unit 21 to move the substrate 1 in the vertical direction has been described, but the substrate 1 and the cleaning unit 5 are relatively moved. The alignment control unit 22 may control the cleaning unit driving unit 20 to move the cleaning unit 5 in the vertical direction, or move both the substrate 1 and the cleaning unit 5. May be. When the cleaning unit 5 is moved, one cleaning unit 5 provided with the reflection mirror 15 may be fixed, and the cleaning unit 5 provided with the light transmitting / receiving element 14 may be moved in the vertical direction.
[0093]
In the present embodiment, an example in which the substrate detection sensor includes the light transmitting / receiving element 14 and the reflecting mirror 15 has been described. However, the light emitting element provided in one cleaning unit 5 and the other facing the light emitting element are provided. A substrate detection sensor can be configured by a light receiving element provided in the cleaning unit 5.
[0094]
Embodiment 5 FIG.
FIG. 10 is a schematic view showing a substrate end surface cleaning apparatus according to Embodiment 5 of the present invention. In the figure, 1 is a substrate, 2 is a stage, 3 is a support shaft, 5 is a cleaning unit, 10 is a light emitting element, 11 is a light receiving element, 14A and 14B are light transmitting / receiving elements, and 15A and 15B are reflection mirrors. Compared with the substrate end surface cleaning apparatus of FIG. 8, for each cleaning unit 5, the light transmitting / receiving element 14 </ b> A (14 </ b> B) and the reflection mirror 15 </ b> B (15 </ b> A) are arranged vertically in the vicinity of the open end of the cleaning groove 6. Is different.
[0095]
The light transmitting / receiving element 14A and the reflecting mirror 15A provided in different cleaning units 5 so as to face each other constitute one substrate detection sensor, and the light transmitting / receiving element 14B and the reflecting mirror 15B constitute another substrate detection sensor. For example, one of the substrate detection sensors 14A and 15A can be used for detecting the upper surface of the substrate, and the other substrate detection sensors 14B and 15B can be used for detecting the lower surface of the substrate.
[0096]
The outgoing light from the light transmitting / receiving element 14A is emitted toward the substrate end face 1E. When the substrate 1 is not present on the propagation path of the outgoing light, the outgoing light is reflected by the reflecting mirror 15A arranged in the vertical direction, and again. The light enters the light transmitting / receiving element 14A. On the other hand, when the substrate 1 is present on the propagation path of the outgoing light, it is not detected.
[0097]
Exactly the same, the outgoing light from the light transmitting / receiving element 14B is emitted toward the substrate end face 1E, and when the substrate 1 is not present on the propagation path of the outgoing light, the outgoing light is reflected in the reflecting mirror 15B arranged in the vertical direction. And is incident on the light transmitting / receiving element 14B again. On the other hand, when the substrate 1 is present on the propagation path of the outgoing light, it is not detected.
[0098]
Since the reflection mirrors 15A and 15B are flat mirrors extending in the vertical direction, even if the cleaning unit 5 to which the reflection mirrors 15A and 15B are attached moves within a predetermined range in the vertical direction, the light transmission / reception elements 15A and 15B As long as the emitted light can be reflected to the light transmitting / receiving elements 15A and 15B, the operation as the substrate detection sensor is not affected.
[0099]
For this reason, the alignment control unit 22 controls the cleaning unit driving unit 20 to drive the two cleaning units 5 independently to detect the position of the substrate 1 in the vertical direction for each substrate detection sensor. it can. Further, alignment can be performed for each cleaning unit 5 based on the detection result of the substrate.
[0100]
Embodiment 6 FIG.
Although Embodiment 1-5 demonstrated the example in the case of wash | cleaning the board | substrate end surface 1E by spraying a washing | cleaning liquid from the washing nozzle 7 with respect to the board | substrate 1, in this Embodiment, a washing | cleaning liquid is used using a porous elastic material. The case of supplying and cleaning the substrate end face 1E will be described.
[0101]
FIG. 11 is a perspective view showing a configuration example of a substrate end surface cleaning apparatus according to Embodiment 6 of the present invention. 12 is a view of the substrate end surface cleaning apparatus of FIG. 11 as viewed from the direction of movement of the cleaning unit 5 (direction A), and FIG. 13 is an upward view of the substrate end surface cleaning apparatus of FIG. 11 (direction B). It is the figure seen from. In the figure, 1 is a substrate, 2 is a stage, 3 is a support shaft, 5 is a cleaning unit, 8 is a cleaning pad mounting portion, 9 is a cleaning pad, 20 is a cleaning unit drive portion, and 21 is a support shaft drive portion.
[0102]
In this substrate end surface cleaning apparatus, as in the above-described embodiments, two cleaning units 5 are moved in the cleaning direction with respect to the substrate 1 to simultaneously clean the opposing substrate end surfaces 1E. Each cleaning unit 5 has a cleaning pad mounting portion 8 disposed on the back side of the substrate end. The upper surface of the cleaning pad attachment portion 8 is a surface parallel to the main surface of the substrate on which the cleaning liquid discharge portion is provided, and the cleaning pad 9 is attached thereto. The cleaning pad 9 is composed of a porous elastic body such as a sponge, and the cleaning liquid supplied from the cleaning pad mounting portion 8 penetrates into the cleaning pad and is applied to the contact portion of the substrate 1 with the cleaning pad 9. .
[0103]
When the substrate 1 after the photoresist coating is placed on the stage 2, the cleaning unit 5 is driven in the vertical direction, the cleaning pad mounting portion 8 is brought close to the substrate end from the back side, and the cleaning pad 9 is pushed to the back surface of the substrate. Hit it. At this time, a part of the cleaning pad 9 as an elastic body in contact with the substrate 1 is contracted, and the back surface of the substrate end and the substrate end surface 1E are in contact with the cleaning pad 9.
[0104]
In this state, the cleaning liquid can be supplied from the cleaning pad 9 to the substrate end surface 1E by supplying the cleaning liquid to the cleaning pad 9. If the cleaning unit 5 is moved along the end face of the substrate 1 while maintaining such a state, the end face of the substrate can be cleaned.
[0105]
According to the present embodiment, the cleaning liquid is applied to the substrate end face via the cleaning pad 9 without spraying the cleaning liquid onto the substrate 1. For this reason, the cleaning liquid does not flow around the substrate surface due to the pressure when discharging the cleaning liquid. Further, by providing the cleaning pad 9 with appropriate elasticity, the substrate end surface 1E can be cleaned even if the substrate end surface 1E is not accurately aligned. Further, when the cleaning unit 5 is moved in the cleaning direction, the substrate end surface 1E is rubbed by the cleaning pad 9, so that the photoresist or the like attached to the substrate end surface 1E can be effectively removed.
[0106]
In each of the above-described embodiments, examples of the substrate end surface cleaning apparatus and the substrate end surface cleaning method used in the manufacturing process of the liquid crystal display device have been described. However, the present invention is limited to such a case. is not. That is, the present invention can also be applied to a substrate end face cleaning apparatus and a substrate end face cleaning method used in a manufacturing process of a semiconductor device using a Si wafer or the like as a substrate.
[0107]
In each of the above embodiments, the example in which the photoresist attached to the substrate end surface is removed by cleaning the substrate end surface has been described. However, the present invention is not limited to such a case. . That is, the present invention can be applied to a substrate end surface cleaning apparatus and a substrate end surface cleaning method for cleaning various chemicals, dust, and the like adhering to the substrate end surface of a semiconductor device in a manufacturing process.
[0108]
【The invention's effect】
According to the present invention, in the substrate end surface cleaning apparatus, the substrate detection sensor provided in the cleaning unit detects the relative position of the substrate with respect to the cleaning unit, and based on the detected relative position, the alignment driving unit includes: The substrate is aligned with the cleaning unit. For this reason, when cleaning is performed by discharging the cleaning liquid in the cleaning groove, it is possible to accurately align the cleaning nozzle and the substrate end face.
[0109]
Further, the substrate end surface cleaning method according to the present invention detects the relative position of the substrate with respect to the cleaning unit by the substrate detection sensor provided in the cleaning unit, and based on the detected relative position, the cleaning unit at the time of cleaning. The cleaning unit and the substrate support portion are relatively moved within a plane orthogonal to the moving direction to align the cleaning unit and the substrate. For this reason, when cleaning is performed by discharging the cleaning liquid in the cleaning groove, it is possible to accurately align the cleaning nozzle and the substrate end face.
[0110]
In particular, even when the substrate is warped or placed on the substrate support portion with an inclination, the substrate end surface cleaning device and the substrate end surface cleaning method are sufficient for the substrate end surface. The cleaning liquid can be circulated for cleaning, or the cleaning liquid can be prevented from flowing to the substrate surface.
[0111]
Furthermore, in the method of manufacturing a semiconductor device according to the present invention, the cleaning unit and the substrate are aligned using the substrate detection sensor provided in the cleaning unit in the cleaning process of the substrate end face. Therefore, the manufacturing yield of the semiconductor device can be improved, the manufacturing cost can be reduced, and the reliability of the semiconductor device can be improved.
[0112]
The substrate end surface cleaning apparatus and the substrate end surface cleaning method according to the present invention clean the substrate end surface using a cleaning pad made of a porous elastic body to which a cleaning liquid is supplied. For this reason, even if there is a slight shift in the alignment between the substrate and the cleaning unit, it is possible to clean the substrate end surface with a sufficient cleaning liquid, or to prevent the cleaning liquid from flowing around the substrate surface. .
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration example of a substrate end surface cleaning apparatus according to a first embodiment of the present invention.
2 is a view of the substrate end surface cleaning apparatus of FIG. 1 as viewed from the movement direction (direction A) of a cleaning unit 5. FIG.
3 is a view of the substrate end surface cleaning apparatus of FIG. 1 as viewed from above (direction B).
FIG. 4 is a perspective view showing a configuration example of a substrate end surface cleaning apparatus according to a second embodiment of the present invention.
5 is a view of the substrate end surface cleaning apparatus of FIG. 4 as viewed from the moving direction (direction A) of the cleaning unit 5. FIG.
FIG. 6 is a schematic view showing a substrate end surface cleaning apparatus according to a third embodiment of the present invention.
FIG. 7 is a schematic view showing a substrate end surface cleaning apparatus according to a fourth embodiment of the present invention.
8 is a view showing a state in which the substrate end surface cleaning apparatus of FIG. 7 is viewed from above.
9 is a flowchart showing an example of a cleaning method using the substrate end surface cleaning apparatus of FIG. 8;
FIG. 10 is a schematic view showing a substrate end surface cleaning apparatus according to a fifth embodiment of the present invention.
FIG. 11 is a perspective view showing a configuration example of a substrate end surface cleaning apparatus according to a sixth embodiment of the present invention.
12 is a view of the substrate end surface cleaning apparatus of FIG. 11 as viewed from the moving direction (direction A) of the cleaning unit 5. FIG.
13 is a view of the substrate end surface cleaning apparatus of FIG. 11 as viewed from above (direction B).
FIG. 14 is a perspective view showing a schematic configuration of a conventional substrate end surface cleaning apparatus.
15 is a cross-sectional view showing a cross section AA in FIG. 14;
FIG. 16 is an enlarged view of the cleaning groove portion 6 of FIG.
FIG. 17 is a cross-sectional view showing a state in which a substrate whose end is warped on the surface side is cleaned using a conventional substrate end surface cleaning apparatus.
FIG. 18 is a cross-sectional view showing a state in which a substrate whose end is warped on the back surface side is cleaned using a conventional substrate end surface cleaning apparatus.
FIG. 19 is a cross-sectional view showing a state in which a substrate placed on the stage 2 in an inclined state is cleaned using a conventional substrate end surface cleaning apparatus.
[Explanation of symbols]
1 Substrate 1E End face of substrate
2 stage (substrate support)
3 Support shaft 5 Cleaning unit
6 Cleaning groove 7 Cleaning nozzle
8 Cleaning pad mounting part 9 Cleaning pad
10 Light emitting element 11 Light receiving element
12, 14, 14A, 14B Transmitter / receiver element
13, 15, 15A, 15B Reflective mirror
20 Cleaning unit drive
21 Support shaft drive unit 22 Positioning control unit

Claims (14)

A substrate support for supporting the substrate;
A cleaning unit that has a cleaning groove open at both ends, and that cleans the substrate end surface with a cleaning liquid discharged from a cleaning nozzle in the cleaning groove,
A substrate detection sensor provided in the cleaning unit for detecting a relative position of the substrate with respect to the cleaning unit;
An alignment drive unit that relatively moves the cleaning unit and the substrate support in a plane orthogonal to the groove direction of the cleaning groove;
Based on the output of the substrate detection sensor, the alignment driving unit is controlled, and the cleaning unit and the alignment control unit for aligning the substrate end surface are provided ,
The substrate detection sensor is provided on the side of the cleaning unit on the open end side of the cleaning groove, and includes a light emitting element that emits light toward the main surface of the substrate and a light receiving element that detects the emitted light. A sensor,
A second substrate that is disposed at a position farther than the first substrate detection sensor with respect to the side surface of the cleaning unit, and that includes a light emitting element that emits light toward the end surface of the substrate and a light receiving element that detects the emitted light. It consists of a detection sensor,
The substrate end surface cleaning apparatus , wherein the alignment driving unit relatively moves the cleaning unit and the substrate supporting unit in the depth direction and the width direction of the cleaning groove . 2. The substrate end surface cleaning apparatus according to claim 1, wherein the second substrate detection sensor comprises a sensor capable of detecting that the end surface of the substrate passes on the optical path when the substrate is moved up and down . 3. The substrate end surface cleaning according to claim 1, wherein the alignment control unit performs alignment of the cleaning unit and the substrate end surface based on an output of the substrate detection sensor during driving by the alignment driving unit. apparatus. Substrate end surface cleaning device according to with a cleaning driving unit for relatively moving the cleaning unit in the groove direction of the cleaning groove and substrate support to claim 1 or 2, characterized in. 3. The substrate end surface cleaning apparatus according to claim 1, wherein the light receiving element is disposed to face the light emitting element with the open end of the cleaning groove portion interposed therebetween . The substrate detection sensor includes a light emitting element, a light receiving element, and a light reflecting unit,
The light reflecting portion is arranged to face the light emitting element and the light receiving element across the open end of the cleaning groove, and reflects the emitted light from the light emitting element,
3. The substrate end surface cleaning apparatus according to claim 1, wherein the light receiving element detects the reflected light . The cleaning unit includes a pair of cleaning units that are disposed so that the cleaning groove portions that are open at both ends are opposed to each other, and the opposite substrate end surfaces are cleaned by the cleaning liquid discharged from the cleaning nozzle in each cleaning groove portion,
The alignment driving unit relatively moves each cleaning unit and the substrate support in a plane orthogonal to the groove direction of the cleaning groove,
3. The substrate end surface according to claim 1, wherein the alignment control unit controls the alignment driving unit based on an output of the substrate detection sensor to align each cleaning nozzle and the substrate end surface. 4. Cleaning device. The substrate detection sensor includes a light emitting element that is provided in one cleaning unit and emits light toward the end surface of the substrate, and a light receiving element that is provided in the other cleaning unit and detects light emitted from the light emitting element.
8. The substrate end surface cleaning apparatus according to claim 7, wherein the alignment driving unit includes a width direction driving unit that relatively moves the cleaning unit and the substrate support unit in the width direction of the cleaning groove . The substrate detection sensor is constituted by a light emitting element and a light receiving element provided in one cleaning unit, and a light reflecting part provided in the other cleaning unit,
8. The substrate end surface cleaning apparatus according to claim 7, wherein the alignment driving unit includes a width direction driving unit that relatively moves the cleaning unit and the substrate support unit in the width direction of the cleaning groove . The substrate detection sensor comprises first detection means for detecting the relative position of the substrate with respect to one cleaning unit, and second detection means for detecting the relative position of the substrate with respect to the other cleaning unit,
8. The substrate end surface cleaning apparatus according to claim 7, wherein the alignment driving unit includes a width direction driving unit that moves each cleaning unit independently with respect to the substrate support unit . A cleaning step of relatively moving the cleaning unit along the substrate end surface and cleaning the substrate end surface with the cleaning liquid discharged from the cleaning nozzle in the cleaning groove,
  A position detection step of detecting a relative position of the substrate with respect to the cleaning unit by a substrate detection sensor provided in the cleaning unit;
  An alignment drive that aligns the cleaning unit and the substrate by relatively moving the cleaning unit and the substrate support in a plane orthogonal to the moving direction of the cleaning unit in the cleaning step based on the detected relative position. Consisting of steps,
  The position detection step is provided on a side surface of the cleaning unit on the open end side of the cleaning groove, and includes a light emitting element that emits light toward the main surface of the substrate and a light receiving element that detects the emitted light. A first position detecting step of detecting a position in the depth direction of the cleaning groove as a relative position of the substrate with respect to the cleaning unit using a detection sensor;
  A second substrate that is disposed at a position farther than the first substrate detection sensor with respect to the side surface of the cleaning unit, and that includes a light emitting element that emits light toward the end surface of the substrate and a light receiving element that detects the emitted light. A second position detecting step for detecting a position in the width direction of the cleaning groove as a relative position of the substrate with respect to the cleaning unit using a detection sensor;
  The substrate end face cleaning method, wherein the alignment driving step is a step of relatively moving the cleaning unit and the substrate support portion in the depth direction and the width direction. The second position detecting step is a step of detecting the position in the width direction using the second substrate detection sensor capable of detecting that the substrate end surface passes on the optical path when the substrate is moved up and down. The substrate end surface cleaning method according to claim 11, wherein the substrate end surface cleaning method is provided. A position detecting drive step for relatively moving the cleaning unit and the substrate support in a plane orthogonal to the moving direction of the cleaning unit in the cleaning step;
The substrate end surface according to claim 11 or 12, wherein the position detection step detects a relative position of the substrate with respect to the cleaning unit based on an output of the substrate detection sensor during driving by the position detection driving step. Cleaning method. A method for manufacturing a semiconductor device, comprising: a step of cleaning a substrate end surface by the substrate end surface cleaning method according to claim 11.

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