JP3974293B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to various substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma displays, photomask substrates, optical disks or magneto-optical disk substrates.processingTo doBase ofThe present invention relates to a plate processing apparatus and a substrate processing method.
[0002]
[Prior art]
For example, in the manufacturing process of a semiconductor device, a polishing process for polishing a surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) (the surface of the wafer itself or the surface of a thin film formed on the surface of the wafer) with an abrasive. May be included. A typical example is a CMP (Chemical Mechanical Polishing) process in which a wafer surface is chemically and mechanically polished using a chemical solution and a polishing cloth.
[0003]
Since the polishing agent is present as a slurry on the surface of the wafer after polishing, cleaning of the wafer is essential after the polishing step.
If the surface of the wafer after polishing is dried before the cleaning process, it becomes difficult to remove the slurry on the wafer surface. Therefore, a substrate cleaning apparatus used for cleaning a wafer after polishing is provided with a so-called underwater loader.
The underwater loader includes a water tank for immersing a cassette containing a plurality of substrates (wafers) in water, and a stage for immersing / floating the cassette in the water tank. Above the water tank, there is provided a pure water shower nozzle that supplies pure water to the surface of the floating substrate.
[0004]
The cassette has, for example, 25-level shelves formed on the inner wall surface, and can be accommodated in a lump with 25 substrates stacked. However, the boards are not necessarily accommodated in all the 25-level shelves, and there are cases where there are no boards in the middle shelves, and for example, the boards are accommodated only in some upper shelves. .
Removal of the substrate from the underwater loader is performed by raising the stage by a necessary amount, so that the substrate transport robot inserts the hand into the cassette and holds out one substrate and then moves out. The substrate transport robot includes, for example, a suction unit for vacuum-sucking the center of the lower surface of the substrate at the tip of the hand. The taken-out substrate is carried into a cleaning processing unit for cleaning the substrate. A pure water shower nozzle is provided above the substrate transfer robot, and it is considered that the substrate can be prevented from drying even when the substrate is transferred.
[0005]
In order to efficiently carry out the substrate from the cassette and carry the substrate into the cleaning processing unit, it is advantageous to detect the presence or absence of the substrate on each shelf in the cassette. Therefore, conventionally, the substrate transfer robot sequentially accesses the positions of the shelves of each stage, performs the vacuum suction operation, and based on the presence or absence of the change in the vacuum pressure in the vacuum suction system, the presence or absence of the substrate on each shelf is determined. Detected. Such substrate detection may be performed when the substrate transfer robot actually carries out the substrate. Also, before the cassette is immersed in the water tank, the hand is made to access the shelves at all stages in advance. Sometimes it is done.
[0006]
However, in such a substrate detection technique, the substrate transfer robot needs to perform an operation of accessing the hand at least once on all shelves of the cassette regardless of the presence or absence of the substrate. When the number of accommodated substrates is small, it is inefficient. In addition, if the suction operation is performed in the absence of the substrate, water is sucked into the vacuum suction system, so that the vacuum pressure becomes unstable and the detection sensitivity of the presence / absence of the substrate may be deteriorated.
[0007]
In addition, if the procedure of accessing the hand to all the shelves in advance before the substrate is immersed in water, the number of times of contact with the substrate increases, so that damage to the substrate increases. In addition, since the substrate detection procedure takes time, the surface of the substrate may be dried during that time, and the subsequent substrate cleaning process may be difficult.
Therefore, in another prior art, the operator manually inputs the substrate position from the operation panel. However, this is extremely inefficient, which hinders the unmanned operation of the substrate cleaning apparatus, and makes an input error. If so, the substrate cannot be removed from the cassette. In particular, if there is a substrate on the shelf where “no substrate” is entered, the substrate will be damaged when the substrate transfer robot's hand moves along the path passing through the shelf position, and the substrate will be washed. This causes a situation where the operation of the device must be stopped.
[0008]
[Problems to be solved by the invention]
These problems will be solved by using an optical sensor or a capacitance sensor that can detect the presence / absence of the substrate in a non-contact manner. The application of is generally difficult.
That is, in the optical sensor, it is difficult to detect a stable substrate due to the influence of undesired reflection or refraction caused by water droplets or water flow adhering to the surface of the substrate or the surface of the light projecting unit or the light receiving unit. Also, because it is easily affected by the reflectance and transmittance of the substrate to be detected, a film with low reflectance such as a titanium nitride film exists on the surface, or the light transmittance of a transparent glass substrate or quartz substrate is high. Even when substrates are mixed, stable detection is prevented.
[0009]
On the other hand, if a capacitance sensor is used, a non-conductive partition wall is generally provided opposite to a substrate that can be regarded as a grounded state in terms of high-frequency circuit due to energization on the surface of the cassette or device or air discharge of the substrate. A detection electrode is provided in a state, a rectangular wave voltage is applied to the detection electrode via a resistor, and a time constant of an RC circuit formed between the ground is detected to detect the presence or absence of a substrate. Become. That is, the presence / absence of the substrate is detected based on the capacitance between the detection electrode and the ground, and the presence of the substrate is detected when the substrate exists because the capacitance increases.
[0010]
  However, in an environment where liquid droplets are likely to be generated as in the above-described cleaning apparatus, the surface of the liquid droplets generated on the surface of the non-conductive partition acts as a counter electrode, and the capacitance is large as in the case where the substrate exists. Create a state. Therefore, the capacitance sensor having the general configuration as described above is not suitable for use in detecting a substrate in a humid atmosphere..
[0011]
  This inventionEyesThe objective is to provide a substrate processing apparatus and a substrate processing method that can detect a substrate satisfactorily even in a humid environment and perform processing on the substrate satisfactorily.
[0012]
[Means for Solving the Problems and Effects of the Invention]
  In order to achieve the above object, the invention according to claim 1 provides:A substrate detection device for detecting, in a non-contact manner, whether or not a substrate is present at a predetermined substrate detection position at a position where a liquid is supplied from the liquid supply means to the substrate or a position where the substrate is exposed to liquid; Substrate processing including substrate transport means for transporting a substrate detected by the substrate detection apparatus, and substrate processing means for delivering a substrate to be processed by the substrate transport means and performing predetermined processing on the substrate An apparatus, wherein the substrate detection deviceA detection electrode disposed at a position spaced from the substrate detection position with a non-conductive partition wall therebetween, and is disposed to surround the detection electrode, and is opposed to the substrate detection position with the non-conductive partition wall interposed therebetween. A substrate detection probe having a guard electrode for eliminating an electric field component along the surface of the non-conductive partition wall, and applying a rectangular wave voltage to the detection electrode via a resistor, and the resistance and the detection electrode By detecting the time constant of the RC circuit formed between and via the substrate, a substrate detection circuit for detecting the presence or absence of a substrate at the substrate detection position, and a rectangular wave applied to the detection electrode to the guard electrode And a guard wave rectangular wave applying circuit for applying a rectangular wave voltage having the same phase and the same potential as the voltage.processingDevice.
[0013]
  In the present invention, the presence or absence of a substrate is detected in a non-contact manner using a capacitance sensor. That is, if there is a substrate at the substrate detection position, the substrate that is grounded in terms of high-frequency circuit becomes the ground electrode, so that the capacitance between the detection electrode and the ground increases. Also, if there is no substrate at the substrate detection position, the capacitance between the detection electrode and the ground can be ignored.SmallIt will be. Correspondingly, the time constant of the RC circuit changes. By detecting this time constant based on the delay time of the rise and fall of the rectangular wave voltage applied to the detection electrode, the presence or absence of the substrate at the substrate detection position is detected. It can be detected.
[0014]
When droplets are formed on the surface of the nonconductive partition wall, the liquid layer and the ground are blocked by the action of the guard electrode. That is, since a rectangular wave voltage having the same phase and the same potential as the rectangular wave voltage applied to the detection electrode is applied to the guard electrode, there is no potential difference between the detection electrode and the guard electrode. Therefore, even when a liquid layer is formed on the surface of the non-conductive partition wall, an electric field in a direction along the liquid layer is not generated, so that the liquid layer is not grounded in a high-frequency circuit. The surface of the liquid layer does not function as a counter electrode of the detection electrode. Therefore, the capacitance sensor according to the present invention can detect the presence or absence of the substrate satisfactorily even in a humid atmosphere.
[0015]
  In this way, the substrate can be reliably detected in a non-contact state, and there is no possibility of erroneous detection of the substrate even in a wet use environment.
Therefore, according to the present invention, since the presence or absence of the substrate can be reliably detected in a non-contact state even in a humid environment, the substrate is not contaminated for the detection of the substrate. Automation can be easily achieved. Thereby, the quality and efficiency of substrate processing can be improved, and the quality and production efficiency of a product to be obtained by processing a substrate such as a semiconductor device or a liquid crystal display device can be improved.
The wet environment is, for example, an environment in which the liquid from the liquid supply unit is supplied to the substrate, or the substrate is placed in a predetermined position in a state where the substrate is immersed in the liquid. Means the environment. In this case, the substrate detection device detects the substrate at a position where the liquid can be supplied to the substrate, or at a position where the droplets of liquid supplied to the substrate or the liquid splashing from the surface of the substrate can reach. You may come to do.
Further, the substrate processing means may specifically perform a substrate cleaning process. More specifically, the substrate processing unit may clean the substrate after the CMP process.
  According to a second aspect of the present invention, the substrate detection device is configured to detect the presence / absence of a substrate at a plurality of substrate detection positions respectively corresponding to a plurality of substrates arranged in a stacked manner at intervals along a certain direction. The substrate according to claim 1, wherein a plurality of the substrate detection probes are provided so as to face each one side of the plurality of substrate detection positions.processingDevice.
[0016]
In the present invention, the presence or absence of a plurality of substrates stacked at intervals in a certain direction (for example, the vertical direction) can be collectively detected by a plurality of substrate detection probes. Thereby, since the presence or absence of the board | substrate in a several board | substrate detection position can be detected rapidly, the time which a board | substrate detection requires can be shortened.
When a plurality of substrate detection positions are arranged along the vertical direction, a substrate detection probe for detecting the presence / absence of a substrate at each substrate detection position is disposed above or below each substrate detection position. become.
[0017]
  The invention described in claim 3 is characterized in that the plurality of substrate detection probes are arranged with their positions in a direction orthogonal to the certain direction of the substrate detection probes corresponding to adjacent substrate detection positions being shifted. Item 2. SubstrateprocessingDevice.
  More specifically, it is preferable that a plurality of substrate detection probes are arranged so that substrate detection probes corresponding to adjacent substrate detection positions do not overlap when viewed in the certain direction. That is, for example, the plurality of substrate detection probes are preferably arranged in a so-called staggered arrangement.
[0018]
For example, when the substrate is circular, it is preferable to shift the probe position in the circumferential direction of the substrate while making the insertion allowance of the probe in the substrate center direction substantially the same.
According to the invention of claim 3, since the substrate detection probes corresponding to the adjacent substrate detection positions are displaced in the direction orthogonal to the arrangement direction of the substrate detection positions, the detection sensitivity can be increased by increasing the voltage applied to the detection electrodes. Even if the height is increased, an adjacent substrate detection probe is not erroneously detected as a substrate. Therefore, the substrate can be detected more reliably. In addition, the possibility that the substrate detection probe corresponding to the adjacent substrate detection position is bridged by the droplets is reduced, and this can also prevent erroneous detection.
[0019]
  The invention according to claim 4 is characterized in that the plurality of substrate detection probes are arranged at intervals at which no droplet bridges are formed between those facing each other along the certain direction. The substrate according to claim 2 or 3processingDevice.
  According to the present invention, the interval between the substrate detection probes that face each other along the arrangement direction of the substrate detection positions is determined to be so large that a bridge formed by droplets is not formed therebetween. . This eliminates the possibility of erroneous detection of the substrate due to the bridge between the substrate detection probes due to the droplets.
[0020]
  According to a fifth aspect of the present invention, the plurality of substrate detection positions include two outer substrates when no substrate exists at a central substrate detection position among the three substrate detection positions continuous in the certain direction. 5. The substrate according to claim 2, wherein the substrate is set at an interval at which a droplet bridge is not formed between the substrates positioned at the detection position.processingDevice.
  Specifically, in the case where a plurality of substrates are held in a cassette and the substrates in the cassette are collectively arranged at the respective substrate detection positions, the interval between the substrate holding positions in the cassette is claimed. What is necessary is just to determine like the space | interval of the board | substrate detection position as described in.
[0021]
According to the present invention, even if there is a possibility that a droplet bridge may occur between the substrates positioned at adjacent substrate detection positions, the substrates positioned at every other substrate detection position are detected between them. Unless another substrate is in place, it will not be bridged by the droplets. If a bridge due to droplets is generated, a detection result of “with substrate” is obtained from the substrate detection probe that has entered the bridge. However, a droplet bridge cannot exist unless a substrate exists at the detection position of the substrate to be detected, so that the detection result of “with substrate” is correct. Of course, the presence or absence of the substrate can be accurately detected if no bridging occurs due to the droplets.
[0022]
  According to a sixth aspect of the present invention, a probe holding member that holds the plurality of substrate detection probes in a state in which the relative positional relationship is maintained, and the probe holding member is advanced and retracted relative to the substrate detection position. 6. A substrate according to claim 2, further comprising an advancing / retreating drive mechanism that guides the plurality of substrate detection probes to the plurality of substrate detection positions all at once.processingDevice.
  According to the present invention, the plurality of substrate detection probes can be collectively advanced / retreated with respect to the plurality of substrate detection positions, so that the presence / absence of the plurality of substrates can be detected at a time, and then the plurality of substrate detection probes. Can be evacuated in a batch.
[0023]
  Of course, the probe holding member holding the substrate detection probe may be displaced near / separate from a plurality of substrates. For example, a cassette holding a plurality of substrates at a time is directed toward the probe holding member. The probe holding member and the plurality of substrates may both move so as to come close / separate.
  According to a seventh aspect of the present invention, the substrate detection position substantially coincides with a substrate delivery position at which the substrate is delivered to the substrate transport means in a plan view in which the main surface of the substrate is viewed almost vertically. The detection electrode of the substrate detection probe is misaligned to the extent that a conveyance failure is caused by the substrate conveyance means in a plan view in which the main surface of the substrate at the substrate detection position is viewed almost vertically at least during substrate detection. 7. The apparatus according to claim 1, further comprising a substrate misalignment detection unit that is disposed so as to be located in an inner area of the substrate and detects a misalignment of the substrate to such an extent that a conveyance failure by the substrate transfer unit occurs. The board according to any oneprocessingDevice.
[0024]
More specifically, the detection electrode of the substrate detection probe is disposed so as to be located in an inner region of the substrate where a positional deviation slightly larger than a positional deviation that causes a conveyance failure by the substrate conveying means occurs. It is preferable.
In addition, it is preferable that the substrate position detection means detects a substrate in which a position shift slightly larger than a position shift slightly smaller than a limit position shift in which the detection electrode of the substrate detection probe can detect the substrate is generated. .
[0025]
According to the seventh aspect of the present invention, the substrate detection probe can detect the presence of the substrate as long as the substrate is not misaligned so that the substrate is poorly transported. If so, such a large misalignment can be detected by the substrate misalignment detection means.
Therefore, it is possible to grasp in advance a situation where there is a possibility that a substrate conveyance failure may occur. Therefore, by correcting the position of the substrate as necessary, it is possible to reliably detect the substrate by the substrate detection probe, and it is possible to prevent a substrate conveyance failure.
[0026]
Specifically, this can prevent the hand of the substrate transfer means from damaging the substrate or conversely damaging the hand, and the substrate is dropped because the substrate is not held in the proper position. Can be prevented. Further, when the substrate transport means is for carrying the substrate into the predetermined substrate processing means, the delivery of the substrate to the substrate holding mechanism in the substrate processing means or the holding of the substrate by the substrate holding mechanism becomes defective. Can be prevented.
[0027]
  According to an eighth aspect of the present invention, the substrate positional deviation detecting means includes a light projecting section and a light receiving section in which an optical axis is set so as to be shielded from light by a substrate having a positional deviation that causes a conveyance failure by the substrate conveying means. 8. The substrate according to claim 7, further comprising a beam sensor provided.processingDevice.
  According to the present invention, the positional deviation of the substrate can be detected in a non-contact manner by the beam sensor.
[0028]
The optical axis is preferably set so as to cross a plane including the main surface of the substrate. For example, when the main surface of the substrate is along a horizontal plane, the optical axis is slightly inclined with respect to the horizontal plane. It is preferable that it is set. As a result, since the optical axis of the substrate having a large positional deviation is reliably blocked, the detection of the positional deviation of the substrate by the beam sensor can be reliably performed.
In addition, the light projecting unit is configured by a light emitting unit and a case having an opening through which light emitted from the light emitting unit toward the light receiving unit passes, and gas (for example, , Clean air or inert gas) is preferably supplied to generate an airflow that blows out from the inside of the case through the opening. Similarly, the light receiving unit is composed of a light detection unit and a case in which an opening through which incident light is directed from the light projecting unit to the light detection unit is formed. It is preferable to supply a gas to generate an air flow that blows out from the case through the opening.
[0029]
Thereby, the problem of adhesion of droplets to the light emitting unit or the light detecting unit can be overcome, and the positional deviation of the substrate can be detected well while using the optical sensor.
  The invention according to claim 9 is characterized in that the substrate positional deviation detecting means further includes a substrate moving mechanism for moving the substrate relative to the optical axis so that a plane including the main surface of the substrate crosses the optical axis. 9. The substrate according to claim 8, further comprising:processingDevice.
  According to the present invention, since the substrate is moved relative to the optical axis so that the plane including the main surface of the substrate crosses the optical axis, it is possible to reliably detect a substrate in which a large positional deviation has occurred.
[0030]
Further, for example, when a plurality of substrates are arranged in a stacked manner, by moving the substrate along the stacking direction of the substrates, it is possible to determine whether or not there is a positional deviation with respect to the plurality of substrates by one beam. It can be detected using a sensor.
The substrate moving means may be any device that can move the substrate relative to the optical axis. Therefore, the substrate moving means may move the substrate or move the beam sensor (optical axis). It is also possible to move both the substrate and the beam sensor.
[0031]
  The invention according to claim 10 is:A method of processing a substrate by the substrate processing apparatus according to claim 1, wherein the substrate detection apparatus is in a position where liquid is supplied from the liquid supply means to the substrate or in a state where the liquid is bathed. Whether or not a substrate exists at a predetermined substrate detection position at a position where the substrate is placed without contact.A substrate detection step to detect, a substrate transfer step for transferring the substrate detected in this substrate detection step to the substrate processing means, and a predetermined process for the substrate carried into the substrate processing means by this substrate transfer step The substrate processing method characterized by including a substrate processing step.
[0034]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view showing a simplified appearance of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus is a substrate cleaning apparatus for cleaning and removing an abrasive (slurry) on the surface of a substrate W such as a semiconductor wafer after CMP processing. This apparatus includes a cassette loading unit 2 for loading a cassette C that can collectively accommodate a plurality of (for example, 25) substrates W after CMP processing, and a cassette (FIG. And a cassette takeout unit 3 for taking out (not shown). The cassette loading unit 2 is provided with an open / close box 5 that is rotatably mounted between a solid line position and a two-dot chain line position in FIG. 1 around a horizontal axis. A door 6 is provided that is pivotably mounted about a vertical axis. A handle 7 with a latch mechanism is provided at the upper part (the upper part in the closed state) of the open / close box 5. The operator operates the handle 7 to open the open / close box 5, and the substrate W after the CMP process is opened. The accommodated cassette C is put into the substrate processing apparatus.
[0035]
On the front surface of the substrate processing apparatus, an operation panel 8 and a display device 9 are disposed above the cassette loading unit 2 so that necessary processing conditions can be input and the progress of substrate processing can be monitored. It has become.
FIG. 2 is a plan view showing an internal configuration in the vicinity of the cassette loading portion 2 of the substrate processing apparatus. The cassette C loaded from the cassette loading unit 2 is placed on the lift stage 11 of the underwater loader 10. The underwater loader 10 is a device that stands by in a state where the substrates W in the cassette C are immersed in water, and provides a substrate delivery position for discharging the substrates W one by one immediately before processing.
[0036]
A transfer robot 20 (substrate transfer means) is disposed adjacent to the underwater loader 10. The transfer robot 20 includes a hand 21 having a suction part 21 a at the tip for sucking the substantially center of the back surface of the substrate W, and a base part 22 coupled to the base end part of the hand 21. As the base portion 22 is rotated, the hand 21 is rotated by an angle twice as large as the rotation direction. As a result, the transfer robot 20 moves toward the underwater loader 10. The hand 21 and the base portion 22 can be bent and stretched, and the hand 21 and the base portion 22 can be bent and stretched with respect to the cleaning unit 30 (substrate processing means) disposed on the side opposite to the underwater loader 10. Along with such bending and stretching movements, the base portion 22 can move up and down. Thereby, the transfer robot 20 can take out one substrate W from the cassette C of the underwater loader 10 and carry it into the cleaning unit 30.
[0037]
The cleaning unit 30 includes, for example, a substrate holding mechanism that holds and rotates the substrate W, a processing liquid supply mechanism that supplies a processing liquid (chemical solution or pure water) to the substrate held by the substrate holding mechanism, and a substrate And a scrub member for scrubbing the front surface or the back surface of the substrate W held by the holding mechanism.
A substrate detection unit 40 (substrate detection device) is accommodated in the internal space of the open / close box 5 of the cassette loading unit 2. The board detection unit 40 includes a plurality of board detection probes P, a probe holding member 41 that holds the board detection probes P, and an advance / retreat drive mechanism for moving the probe holding member 41 forward and backward toward the cassette C held by the underwater loader 10. 42. Thus, the position between the retreat position (solid line position) where the plurality of substrate detection probes P are retreated in the open / close box 5 and the detection position (position of the two-dot chain line) advanced to the position of the substrate W in the cassette C. You can move forward and backward at once.
[0038]
In this embodiment, the accommodation position of the substrate W correctly accommodated in the cassette C placed on the elevating stage 11 in the ascending position corresponds to the substrate detection position, and this substrate detection position is the main surface of the substrate W. In a plan view overlooking the (front surface), it substantially coincides with the substrate delivery position for delivering the substrate W to the transfer robot 20. In this case, the accommodation position of the substrate W correctly accommodated in the cassette C is, for example, a planar position where the end surface of the substrate W is in contact with the inner wall surface of the back part (opening / closing box 5 side) of the cassette C (that is, FIG. 2, the position of the substrate W indicated by a two-dot chain line). Actually, not all the substrates W in the cassette C are necessarily in the correct substrate accommodation position, and a part or all of the substrates W are projected to the open side (the transfer robot 20 side) in front of the cassette C. That is, the substrate W may be misaligned.
[0039]
FIG. 3 is a perspective view showing a configuration related to the underwater loader 10 in a simplified manner. The underwater loader 10 includes an elevating stage 11 that can be placed with the cassette C positioned by the positioning member 15, a water tank 12 that can submerge the cassette C placed on the elevating stage 11, A lift drive mechanism 13 (substrate movement mechanism) for moving the stage 11 up and down, and a pure water shower nozzle 14 (liquid supply means) for supplying pure water to the substrate W held in the cassette C from above the lift stage 11. And.
[0040]
The water tank 12 is filled with pure water, and the substrate W in the cassette C can be immersed in the pure water by lowering the elevating stage 11 by the elevating drive mechanism 13. Further, by raising and lowering the elevating stage 11 by the elevating drive mechanism 13, the elevating stage 11 can be guided to a raised position above the water surface in the water tank 12.
The elevating drive mechanism 13 includes, for example, a ball screw mechanism 13a and a motor 13b that applies a driving force thereto.
[0041]
When the substrate W is taken out by the transfer robot 20, the elevating drive mechanism 13 raises the elevating stage 11 and raises the substrate W to be taken out to a predetermined height. Thereafter, the substrate W is taken out by the hand 21 of the transfer robot 20. Thereafter, the elevating drive mechanism 13 lowers the elevating stage 11 and immerses the substrate W in the cassette C in pure water in the water tank 12 until the next substrate W is taken out.
[0042]
When the cassette C is loaded into the substrate processing apparatus, the lifting / lowering stage 11 is in a raised position above the water tank 12. The pure water shower nozzle 14 starts supplying pure water promptly after closing the open / close box 5, thereby drying the substrate W in the cassette C placed on the elevating stage 11. It is prevented. In this state, the substrate detection probe P accommodated in the open / close box 5 enters the cassette C from behind the cassette C, and detects the presence or absence of the substrate W at each stage in the cassette C.
[0043]
The cassette C has a plurality of stages of shelves formed on the inner wall surface at regular intervals, so that a plurality of substrates W can be held in a stacked state at regular intervals along the vertical direction. It has become. A pair of plate-like extensions Ca extending in the vertical direction is formed behind the cassette C, and the substrate detection probe P can be inserted into the cassette C between the pair of extensions Ca. It is in a state.
A plurality of substrate detection probes P are held by the probe holding member 41. That is, each of the plurality of substrate detection probes P is formed in a plate shape and is held by the probe holding member 41 in a posture parallel to each other. The plurality of substrate detection probes P are held by the probe holding member 41 in a so-called zigzag arrangement state when viewed from the cassette C. More specifically, in the closed state of the open / close box 5, the substrate detection probes P adjacent to each other in the vertical direction are shifted in the horizontal direction perpendicular to the advancing / retreating direction, and every other one. The substrate detection probe P is opposed to the vertical direction. Thereby, a sufficient space is secured between the substrate detection probes P opposed to each other in the vertical direction.
[0044]
The probe holding member 41 is formed in a box shape, and a rack 43 is attached to the side portion thereof. A pinion 44 meshes with the rack 43, and a rotational force from the rotary actuator 46 is applied to the pinion 44. With this configuration, by driving the rotary actuator 46, the plurality of substrate detection probes P held by the probe holding member 41 can be advanced and retracted collectively toward the cassette C. Thus, the advance / retreat drive mechanism 42 is configured by the rack 43, the pinion 44, the rotary actuator 46, and the like.
[0045]
Specifically, as shown in FIG. 2, in order to guide the advancement and retraction of the probe holding member 41, a slide shaft 47 is arranged in the inner space of the open / close box 5 along the advance / retreat direction of the substrate detection probe P. The probe holding member 41 is fixed to a slide bush 48 that slides on the slide shaft 47 via a bracket 49. The rack 43 is fixed to the bracket 49.
[0046]
FIG. 4 is a side view schematically showing a state in which it is detected whether or not the substrate W exists on each shelf in the cassette C. Immediately after the open / close box 5 is closed, in response to an output from a predetermined sensor (not shown) for detecting the closed state of the open / close box 5 or in response to a predetermined input operation from the operation panel 8. The probe holding member 41 is advanced from the retracted position (solid line position) to the detection position (two-dot chain line position) by the action of the advance / retreat drive mechanism 42 including the rack 43 and the pinion 44. As a result, the plurality of substrate detection probes P stacked in the vertical direction in a staggered arrangement as described above are collectively inserted into the cassette C.
[0047]
At this time, each board | substrate detection probe P is located in each upper position spaced apart from the position of the board | substrate W of a detection target. That is, the uppermost substrate detection probe P is arranged above the substrate W accommodated in the uppermost shelf in the cassette C so as to face the uppermost substrate W downward. The remaining substrate detection probes P are arranged so as to face each lower substrate W at a position between the substrates W accommodated in a plurality of shelves in the cassette C.
[0048]
FIG. 5 is a block diagram for explaining the substrate detection probe P and the electrical configuration related thereto. The substrate detection probe P includes a probe case 55 (non-conductive partition wall) made of a resin that is a non-conductive material (for example, FEP (tetrafluoroethylene / hexafluoropropylene copolymer resin)), and the probe case 55. A detection electrode 51 embedded therein and a ring-shaped guard electrode 52 disposed so as to surround the detection electrode 51 are provided. The detection electrode 51 is formed in a rectangular shape, for example, and the guard electrode 52 is formed in a rectangular ring shape, for example. The detection electrode 51 and the guard electrode 52 are opposed to the substrate detection position via the probe case 55 that functions as a non-conductive partition wall.
[0049]
A rectangular wave voltage is applied to the detection electrode 51 from the rectangular wave generating circuit 61 via a resistor R. If there is a dielectric to be detected (substrate W in this embodiment) that can be regarded as being grounded in a high-frequency circuit near the detection electrode 51 by energization on the surface of the cassette C or the apparatus or by air discharge of the substrate W, detection is performed. If the capacitance between the electrode 51 and the ground is increased and there is no dielectric to be detected in the vicinity of the detection electrode 51, the capacitance between the detection electrode 51 and the ground is reduced to a negligible level. Therefore, the time constant of the RC circuit formed by the resistance R and the capacitance between the detection electrode 51 and the ground is increased when a detected dielectric exists in the vicinity of the detection electrode 51. The appearing rectangular wave voltage has a delay time at the rise and fall. This delay time is detected by a delay time detection circuit 62. The magnitude of the delay time is determined by the comparison circuit 63, and when the large delay time is detected, a signal indicating the presence of the detected object is output via the output circuit 64. As described above, the rectangular wave generation circuit 61, the delay time detection circuit 62, the comparison circuit 63, and the like form a substrate detection circuit for detecting the presence or absence of a substrate.
[0050]
On the other hand, a rectangular wave voltage created by a guard electrode pulse generating circuit 65 (guard electrode rectangular wave applying circuit) based on the rectangular wave voltage from the rectangular wave generating circuit 61 is applied to the guard electrode 52. The rectangular wave voltage generated by the guard electrode pulse generating circuit 65 is a voltage signal having the same phase (same frequency) and the same potential as the rectangular wave voltage applied to the detection electrode 51. Therefore, the potential of the guard electrode 52 is equal to that of the detection electrode 51 at any time, and no significant potential difference occurs between them.
[0051]
FIG. 6 is an illustrative view for explaining the function of the guard electrode 52. In the case where the detection electrode 51 exists alone and the guard electrode 52 is not provided, if a water droplet is present on the lower surface of the substrate detection probe P, as shown in FIG. Can be discharged by moving the electric charge, so that a potential difference is generated between the detection electrode 51 and the surface of the water droplet. In this case, the surface of the water droplet serves as a counter electrode, and a large capacitance is generated. Therefore, in a situation where water droplets are attached, even when the substrate W is not present, a signal indicating “with substrate” is output.
[0052]
On the other hand, in the configuration of the present embodiment in which a rectangular wave voltage having the same phase and the same potential as the detection electrode 51 is applied to the guard electrode 52, as shown in FIG. Since no electric field component is generated along the direction, no charge movement occurs in the water droplet. Therefore, there is no potential difference between the detection electrode 51 and the surface of the water droplet, and the water droplet only has the same effect as the thickness of the detection electrode 51 is increased. In this case, since the distance between the ground and the ground can be regarded as infinite, a large capacitance is not generated, and a correct signal indicating “no substrate” is output.
[0053]
FIG. 7 is an illustrative view for explaining the interval between the plurality of substrates W accommodated in the plurality of substrate detection probes P and the cassette C. FIG. When the substrate W accommodated in the cassette C is supplied with pure water from the pure water shower nozzle 14 on the lifting / lowering stage 11 of the underwater loader 10, pure water flows between the plurality of substrates W, When the substrates W are accommodated in all the shelves, as shown in FIG. 7 (a), water droplets are collected between the front and back surfaces of adjacent substrates W, and the plurality of substrates W are as if one water column. It may appear like this. However, if the substrate W is not accommodated in the intermediate shelf, the upper and lower substrates W are not bridged by water droplets in this portion. That is, the interval between the plurality of substrate accommodation positions in the cassette C is such that the substrate W does not exist at the center of the three adjacent substrate accommodation positions, and the substrates W exist at the substrate accommodation positions on both sides (upper and lower), respectively. The distance DW is set such that the pair of substrates W on both sides is not bridged by water droplets.
[0054]
On the other hand, the substrate detection probes P adjacent in the vertical direction are shifted along a horizontal direction orthogonal to the advancing and retreating direction of the substrate detection probe P as shown in FIG. Therefore, there is no possibility that the substrate detection probes P adjacent in the vertical direction are bridged by water droplets. Further, by applying a relatively large rectangular wave voltage to each substrate detection probe P, the reach distance of the high-frequency electric field is about DP or longer than the interval DP between the substrate detection probes P facing in the vertical direction (however, more than 2DP) Detection sensitivity can be increased. Thereby, variations in the distance between the detection electrode 51 and the substrate W due to the inclination of the substrate W in the cassette C, differences in dielectric constant due to differences in the type of the substrate W (semiconductor wafer, quartz substrate, glass substrate, etc.), etc. The substrate detection by each substrate detection probe P can be performed stably.
[0055]
Although every other board | substrate detection probe P will oppose along an up-down direction, distance 2DP between these is sufficient distance from which the bridge | bridging by a water droplet is not formed between these. .
FIG. 8 is an illustrative view for explaining the substrate detection principle. In the state of FIG. 8A in which the adjacent substrates W are not bridged by water droplets, the substrate detection probe P can detect the presence or absence of the substrate W facing below without any problem.
[0056]
In the state of FIG. 8B in which the adjacent substrates W are bridged by water droplets, the substrate detection probe P that has entered the water droplets is grounded in a high-frequency circuit via the water droplets. A signal indicating “with substrate” is output. This signal is consequently a correct signal.
As shown in FIG. 8C, when the substrate W does not exist at the substrate detection position where the substrate detection probe P faces downward, even if the substrate W exists above and below the substrate detection position, These substrates W are not bridged by water droplets. Therefore, a signal indicating “no substrate” is output.
[0057]
Thus, it can be seen that a signal that correctly indicates the presence or absence of the substrate W can be obtained regardless of the presence or absence of water droplets.
When three or more substrates W are bridged by water droplets to form a water column, two or more substrate detection probes P corresponding to the positions of the substrates W are in a state of being grounded in common, Any of the signals corresponding to these substrate detection probes P represents “with substrate”. In this case, the substrate detection probe P actually detects a water droplet, but the presence of a water droplet bridge at the position of the substrate detection probe P means that the substrate W exists below it. Even in a situation where three or more substrates W are bridged by water droplets, the signal corresponding to each substrate detection probe P accurately represents the presence or absence of the substrate W at each substrate detection position.
[0058]
In this way, the presence / absence of the substrate W at each stage in the cassette C can be reliably detected in a non-contact manner even in a wet environment in the underwater loader 10.
Next, other features of the substrate processing apparatus of this embodiment will be described.
As shown in FIGS. 2 and 3, in the vicinity of the upper end of the outer wall 12 </ b> A on the transfer robot 20 side of the water tank 12, the jumping out of the substrate W (substrate misalignment) from the opening in front of the cassette C is detected. Beam sensors 80 and 90 are arranged. The beam sensors 80 and 90 have light projecting portions 81 and 91 and light receiving portions 82 and 92, respectively, and the optical axes L1 and L2 of the beam light directed from the light projecting portions 81 and 91 to the light receiving portions 82 and 92 are substrates. It is configured to detect the presence or absence of the substrate W in a state where each predetermined amount protrudes depending on whether or not W shields light.
[0059]
As shown in FIG. 9, the optical axis L1 of the beam sensor 80 is set to pass slightly above the outer wall 12A of the water tank 12 so as to pass through a position inside the water tank 12 rather than the inner surface of the outer wall 12A. Further, the optical axis L2 of the beam sensor 90 is set so as to be located inward of the substrate W (on the open / close box 5 side) with respect to the optical axis L1 of the beam sensor 80.
That is, when the substrate W has greatly jumped out of the cassette C and the substrate W may interfere with the outer wall 12A when descending to the water tank 12, the beam sensor 80 detects the substrate W that has jumped out in this way. .
[0060]
On the other hand, even when the substrate W does not protrude so much as to interfere with the outer wall 12A, the substrate W has protruded to a position where it may not be detected by the substrate detection probe P (the substrate in plan view). When the detection electrode 51 of the detection probe P and any part of the substrate W are not likely to overlap each other), the beam sensor 90 detects such a substrate W.
More specifically, the detection electrode 51 of the substrate detection probe P is located on the inner side of the substrates W1 and W2 that are projected to a degree slightly larger than the degree of conveyance failure by the conveyance robot 20 during substrate detection. It is inserted into the cassette C so as to be located in the region (inner region in plan view). In FIG. 9, the symbol W <b> 1 represents the substrate W that has not jumped out of the cassette C, and the symbol W <b> 2 represents the substrate W that has jumped to the detection limit position by the substrate detection probe P.
[0061]
Further, the optical axis L2 of the beam sensor 90 is set so as to be able to detect the substrate W2 on which a jumping amount slightly larger than the jumping amount that is a limit amount that can be detected by the substrate detection probe P has occurred.
Therefore, if the optical axis L2 of the beam sensor 90 is shielded from light by the substrate W, the substrate W on any shelf in the cassette C has a conveyance failure, or the substrate detection probe P can accurately detect the presence or absence of the substrate W. Thus, it is detected that an undesired pop-out has occurred that has not been performed. In this case, the conveyance failure means that the hand 21 of the conveyance robot 20 damages the substrate W, conversely, the hand 21 is damaged, or the suction portion 21 of the hand 21 is greatly displaced from the center of the back surface of the substrate W. This includes a situation in which the position W is attracted and the substrate W falls out of balance on the hand 21 and the delivery from the hand 21 to the substrate holding mechanism of the cleaning unit 30 fails.
[0062]
If the optical axis L1 of the beam sensor 80 is shielded by the substrate W, it is detected that there is a substrate W3 that may interfere with the outer wall 12A.
As shown in FIG. 10, the optical axis L1 of the beam sensor 80 is set to be inclined with respect to a plane including the main surface of the substrate W to be arranged horizontally. Since the main surface of the substrate W in the protruded state is shielded from light, the protrusion of the substrate W can be reliably detected. Similarly, the optical axis L2 of the beam sensor 90 is set to be inclined with respect to a plane including the main surface of the substrate W.
[0063]
After the detection operation of the presence / absence of the substrate W at each stage is completed by the substrate detection probe P and the substrate detection probe P is retracted into the internal space of the open / close box 5, the elevation stage 11 is lowered by the action of the elevation drive mechanism 13. The cassette C is guided into the water tank 12. In this process, the beam sensors 80 and 90 perform a substrate detection operation. That is, as the cassette C descends with respect to the fixedly arranged beam sensors 80 and 90, the position of the substrate W on the shelf of each stage of the cassette C is scanned in sequence, and the substrate W at each stage jumps out. Detected.
[0064]
If the beam sensor 80 detects the jumping out of the substrate W while the lifting stage 11 is being lowered, the substrate W may be damaged if the lifting stage 11 is further lowered. Therefore, the lifting drive mechanism 13 stops the lifting stage 11 in response to the beam sensor 80 detecting the substrate W. Along with this, a message for notifying that the substrate W is popping out is displayed on the display device 9. In this case, after raising the elevating stage 11, the operator pushes the protruding substrate W into the cassette C and gives an instruction for resuming the processing from the operation panel 8.
[0065]
On the other hand, when only the beam sensor 90 detects the jumping of the substrate W while the lifting stage 11 is being lowered, the lifting of the lifting stage 11 is continued because there is no possibility of the substrate W being damaged. Then, the display device 9 displays a message for notifying that the substrate W has jumped out. In this case, the substrate W is kept immersed in the pure water stored in the water tank 12 until the operator pushes the protruding substrate W into the cassette C, and the substrate W is dried. It is prevented. After the substrate W is returned to the normal position, the substrate W can be reliably detected by the substrate detection probe P, and the substrate transfer by the transfer robot 20 does not become defective.
[0066]
With reference to FIGS. 10 and 11, the configuration of the beam sensor 80 will be described in more detail. Since the configuration of the beam sensor 90 is the same, description thereof is omitted.
The light projecting unit 81 and the light receiving unit 82 of the beam sensor 80 are coupled to the sensor amplifier 83 via optical fibers 84 and 85. The sensor amplifier 83 is optically coupled to a light emitting element (not shown) optically coupled to the end of the optical fiber 84 coupled to the light projecting unit 81 and an optical fiber 85 coupled to the light receiving unit 82. Light receiving element (not shown). When detecting the substrate W, the light emitting element is caused to emit light and the output signal of the light receiving element is monitored. If the amount of light received by the light receiving element decreases and the output signal becomes smaller, it means that the optical axis L1 is shielded by the substrate W.
[0067]
The light projecting section 81 and the light receiving section 82 are further supplied with clean air (or an inert gas such as nitrogen gas) from the air pump 86 (gas supply means) through the air supply pipes 87, 88, 89. Is supplied.
FIGS. 11A and 11B are a perspective view and a cross-sectional view showing a common internal structure of the light projecting unit 81 and the light receiving unit 82, respectively. The light projecting unit 81 and the light receiving unit 82 include a cylindrical outer case 100. The outer case 100 is formed with a gas flow passage 101 into which the air supply pipes 88 and 89 are inserted from below, and a fiber insertion hole 102 into which the optical fibers 84 and 85 are similarly inserted from below. An optical component 103 as a light emitting unit (in the case of the light projecting unit 81) or a light detecting unit (in the case of the light receiving unit 82) is attached to the tips of the optical fibers 84 and 85. The optical component 103 is, for example, a cylindrical inner case 104 made of stainless steel, a lens 105 for entering and exiting the optical fibers 84 and 85, and a direction in which the light travels is changed. And a reflecting mirror 106. In the inner case 104, an opening 107 for entering and exiting light is formed at a position near the reflecting mirror 106.
[0068]
On the other hand, an opening 110 is formed in the side wall of the outer case 100. The inner case 104 of the optical component 103 is attached to the outer case 100 with the opening 107 facing the opening 110. The gas flow passage 101 in the outer case 100 communicates with the opening 110.
With this configuration, clean air is supplied from the air supply pipes 88 and 89 into the outer case 100, thereby generating an air flow of clean air that blows out from the opening 110 through the gas flow passage 101. Accordingly, water droplets and mist do not reach the optical component 103 even in a humid atmosphere near the underwater loader 10.
[0069]
Therefore, the optical component 103 can guide the incident light from the opening 110 to the optical fiber 84 and can guide the outgoing light from the optical fiber 85 to the opening 110. Since no water droplets adhere to any part of the optical component 103, there is no possibility that the optical axis is shifted or undesired diffusion of light occurs, and the light generated from the light projecting unit 81 As long as it is not obstructed, the light is surely incident on the light receiving portion 82. Therefore, the light receiving unit 82 can ensure a sufficient difference in the amount of received light depending on the presence or absence of the substrate W that blocks the optical axis L1.
[0070]
The outer case 100 to be exposed to the atmosphere in the underwater loader 10 is made of a resin material not containing metal (for example, tetrafluoroethylene resin (PTFE) or tetrafluoroethylene / perfluoroalkoxyethylene copolymer resin ( PFA) and the like. Thereby, it is possible to prevent the metal material from adhering to the substrate W after the CMP process.
Further, the beam sensor having the above-described configuration can be used for the purpose of detecting the position of the substrate W and the presence or absence of the substrate W in the substrate processing unit (for example, the cleaning unit 30) using a chemical solution. In this case, the outer case 100 is preferably made of a chemical resistant material (for example, PTFE or PFA). In this case, each component housed in the outer case 100 is not exposed to a chemical atmosphere due to the blowing of clean air from the opening 110, so that it is particularly necessary to be made of a chemical resistant material. There is no.
[0071]
Further, in this embodiment, the light projecting portions 81 and 92 of the beam sensors 80 and 90 are accommodated in different outer cases 100, and the light receiving portions 82 and 92 are similarly accommodated in the different outer cases 100. The light projecting portions 81 and 92 may be accommodated in one case, and the light receiving portions 82 and 92 may be accommodated in another case.
As mentioned above, although one Embodiment of this invention was described, this invention can be implemented also with another form. For example, in the above-described embodiment, the plurality of substrate detection probes P are arranged in a two-row zigzag arrangement along the vertical direction when viewed from the underwater loader 10 side, but three rows along the vertical direction. The above staggered arrangement may be adopted.
[0072]
In the above-described embodiment, the substrate detection unit 40 detects the presence / absence of the substrate W at each stage of the cassette C on the elevation stage 11 at the elevated position, and then lowers the elevation stage 11 to remove the substrate W from the cassette C. However, the order may be reversed.
Furthermore, in the above-described embodiment, the case where processing is performed on a semiconductor wafer that is a substantially circular substrate has been described. However, the present invention can be applied to a general rectangular substrate or other arbitrary shape in a glass substrate for a liquid crystal display device. The present invention can also be applied when processing a substrate.
[0073]
In addition to these modifications, various design changes can be made within the scope of the matters described in the claims.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a simplified appearance of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing an internal configuration in the vicinity of a cassette loading portion of the substrate processing apparatus.
FIG. 3 is a perspective view schematically showing a configuration related to an underwater loader of the substrate processing apparatus.
FIG. 4 is a side view showing, in a simplified manner, a state in which it is detected whether or not a substrate exists on each shelf in the cassette.
FIG. 5 is a block diagram for explaining a substrate detection probe and an electrical configuration related thereto.
FIG. 6 is an illustrative view for explaining the function of a guard electrode provided in the substrate detection probe.
FIG. 7 is an illustrative view for explaining an interval between a plurality of substrate detection probes and an interval between a plurality of substrates accommodated in a cassette.
FIG. 8 is an illustrative view for explaining a substrate detection principle;
FIG. 9 is an illustrative view for explaining the principle of detection of jumping out of a substrate.
FIG. 10 is a perspective view for explaining the configuration of a beam sensor that detects the jumping out of a substrate.
FIG. 11 is a diagram for explaining a configuration of a light projecting unit and a light receiving unit constituting the beam sensor.
[Explanation of symbols]
2 Cassette loading part
5 Open / close box
10 Underwater loader
11 Lifting stage
12 Aquarium
13 Elevating drive mechanism
14 Pure water shower nozzle
20 Transport robot
21 hands
30 Cleaning unit
40 Substrate detection unit
41 Probe holding member
42 Advance / Retreat Drive Mechanism
43 racks
44 Pinion
46 Rotary actuator
51 Detection electrode
52 Guard electrode
55 Probe case
61 Square wave generator
62 Delay time detection circuit
63 Comparison circuit
64 output circuit
65 Guard electrode pulse generation circuit
80 Beam sensor
81 Emitter
82 Receiver
83 Sensor amplifier
84 Optical fiber
85 optical fiber
86 Air Pump
87 Air supply pipe
88 Air supply pipe
89 Air supply pipe
90 Beam sensor
90 optical axis
91 Projector
92 Light receiver
100 outer case
101 Gas flow passage
102 Fiber insertion hole
103 Optical components
110 opening
C cassette
L1 optical axis
L2 optical axis
P substrate detection probe
R resistance
W substrate

Claims (10)

A substrate detection device for detecting, in a non-contact manner, whether or not a substrate is present at a predetermined substrate detection position at a position where a liquid is supplied from the liquid supply means to the substrate or a position where the substrate is exposed to liquid; ,
Substrate transport means for transporting a substrate detected by the substrate detection device;
A substrate processing apparatus including a substrate processing unit that delivers a substrate to be processed by the substrate transport unit and performs a predetermined process on the substrate;
The substrate detection apparatus is
A detection electrode disposed at a position spaced from the substrate detection position with a non-conductive partition wall interposed therebetween, and is disposed so as to surround the detection electrode, and is opposed to the substrate detection position with the non-conductive partition wall interposed therebetween; A substrate detection probe comprising a guard electrode for eliminating an electric field component along the surface of the non-conductive partition;
A rectangular wave voltage is applied to the detection electrode via a resistor, and a time constant of an RC circuit formed between the resistor and the ground via the detection electrode is detected to detect the substrate at the substrate detection position. A substrate detection circuit for detecting presence or absence;
A substrate processing apparatus, comprising: a guard electrode rectangular wave application circuit that applies a rectangular wave voltage having the same phase and the same potential as the rectangular wave voltage applied to the detection electrode to the guard electrode. The substrate detection device is for detecting the presence or absence of a substrate at a plurality of substrate detection positions respectively corresponding to a plurality of substrates stacked and arranged at regular intervals along a certain direction,
The substrate processing apparatus according to claim 1, wherein a plurality of the substrate detection probes are provided so as to face each one side of the plurality of substrate detection positions. 3. The substrate processing apparatus according to claim 2, wherein the plurality of substrate detection probes are arranged so that positions of substrate detection probes corresponding to adjacent substrate detection positions are shifted with respect to a direction orthogonal to the certain direction. 4. The substrate detection probes according to claim 2, wherein the plurality of substrate detection probes are arranged at intervals at which droplet bridges are not formed between the substrates facing each other along the certain direction. Substrate processing equipment. The plurality of substrate detection positions are between the substrates positioned at the outer two substrate detection positions when no substrate exists at the center substrate detection position among the three substrate detection positions continuous in the certain direction. 5. The substrate processing apparatus according to claim 2, wherein the substrate processing apparatus is set at intervals at which droplet bridges are not formed. A probe holding member that holds the plurality of substrate detection probes in a state in which the relative positional relationship thereof is held; and
An advancing / retracting drive mechanism that collectively guides the plurality of substrate detection probes to the plurality of substrate detection positions by moving the probe holding member relative to the substrate detection position. Item 6. The substrate processing apparatus according to any one of Items 2 to 5. The substrate detection position substantially coincides with the substrate delivery position at which the substrate is delivered to the substrate transport means in a plan view in which the main surface of the substrate is viewed almost vertically.
In the substrate detection apparatus, the detection electrode of the substrate detection probe is misaligned to the extent that a conveyance failure by the substrate conveyance means occurs in a plan view in which the main surface of the substrate at the substrate detection position is looked down almost vertically at least during substrate detection. Is located in the inner region of the substrate where the
7. The substrate processing apparatus according to claim 1, further comprising a substrate misalignment detecting unit that detects a misalignment of the substrate to such an extent that a conveyance failure is caused by the substrate transporting unit. The substrate positional deviation detecting means includes a beam sensor including a light projecting unit and a light receiving unit in which an optical axis is set so as to be shielded from light by a substrate having a positional deviation to the extent that a conveyance failure is caused by the substrate conveying unit. The substrate processing apparatus according to claim 7. The substrate displacement detection means further includes a substrate moving mechanism that moves the substrate relative to the optical axis so that a plane including a main surface of the substrate crosses the optical axis. 9. The substrate processing apparatus according to 8. A method for processing a substrate by the substrate processing apparatus according to claim 1,
Whether or not the substrate exists at a predetermined substrate detection position at a position where the liquid is supplied from the liquid supply means to the substrate or a position where the substrate is exposed to the liquid is placed by the substrate detection device without contact. A substrate detection step to detect;
A substrate transfer step of transferring the substrate detected in this substrate detection step to the substrate processing means;
And a substrate processing step of performing a predetermined process on the substrate carried into the substrate processing means by the substrate transporting step.

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