KR20070092530A - Apparatus of treating a substrate in a single wafer type - Google Patents

Abstract

An apparatus for processing a substrate in a single substrate type is provided to suppress a breakdown of a substrate and to reduce contamination due to the breakdown of the substrate by preventing the ejection of the substrate due to the centrifugal force. An apparatus for processing a substrate in a single substrate type includes a housing(110) having an open top part and a substrate processing space, a supporting member(120) installed in the inside of the housing to support the substrate, and a driving unit for rotating and elevating the supporting member. The supporting member includes a plurality of chucking members(122) which are arranged in a circular shape on the basis of a center of the supporting member at an upper part of the supporting member. Each of the chucking members includes a bottom surface contacting a lower surface of an edge of the substrate, an inner surface facing a lateral part of the substrate, and a top surface extended from an upper end of the inner surface to prevent ejection of the substrate toward to a top direction.

Description

Single wafer substrate processing equipment {APPARATUS OF TREATING A SUBSTRATE IN A SINGLE WAFER TYPE}

1 is a configuration diagram schematically showing a sheet type substrate processing apparatus according to an embodiment of the present invention.

2A and 2B are plan views of the sheet type substrate processing apparatus shown in FIG. 1.

3A is an enlarged view of the chucking member shown in FIG. 1.

3B is a top view of the chucking member shown in FIG. 3A.

Figure 4 is a schematic view showing a sheet type substrate processing apparatus according to another embodiment of the present invention.

5A and 5B are plan views of the sheet type substrate processing apparatus shown in FIG. 4.

6A is an enlarged view of the chucking member shown in FIG. 4.

FIG. 6B is a plan view of the chucking member shown in FIG. 6A.

* Description of the symbols for the main parts in the drawings *

100: sheet type substrate processing apparatus 132: nozzle unit

110 housing 132a first nozzle

112: blocking wall 132b: second nozzle

114: drain space 132c: third nozzle

120: support member 140: table

122: chucking member 150: monitoring member

122a: fixing part 152: sensing member

122b: departure prevention unit 154: control unit

130: fluid processing unit 156: display member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to an apparatus for processing a semiconductor substrate in a sheet type.

In general, semiconductor manufacturing apparatus are manufactured by repeated performance of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, drying, and the like. Among these unit processes, the cleaning process is a process of removing foreign substances or unnecessary films adhering to the surface of the semiconductor substrate during each unit process. In recent years, the pattern formed on the semiconductor substrate is miniaturized, and the aspect ratio of the pattern is reduced. As it grows, its importance is increasing.

Among them, a device for performing a cleaning process is classified into a batch type substrate processing apparatus for simultaneously processing a plurality of semiconductor substrates and a sheet type substrate processing apparatus for processing a semiconductor substrate in a sheet unit. In the batch type substrate processing apparatus, for example, a plurality of semiconductor substrates are processed at one time by immersing the plurality of semiconductor substrates in a cleaning tank in which a cleaning liquid is housed, such as a batch type cleaning apparatus. In contrast, the sheet type substrate processing apparatus sequentially processes a single substrate by including a supporting member for supporting the substrate and nozzles for supplying a processing fluid to the front or rear surface of the substrate.

Sheet-fed substrate processing apparatus can reduce the amount of the processing liquid compared to the conventional batch substrate processing apparatus, and has the advantage that the process efficiency is large because uniform cleaning by single substrate processing is possible. In particular, the introduction of large-diameter wafers such as 300 mm wafers and the removal of fine particles due to the fine patterns is increasing, so that the cleaning method of the semiconductor substrate is expected to be used in the future.

A general sheet type substrate processing apparatus includes a housing having an upper portion open to accommodate a substrate to provide a space for performing a processing process, a support member installed inside the housing to seat a substrate, and a processing surface of the substrate seated on the support member. It includes a nozzle for injecting the processing fluid, and a drive for rotating the support member during the process. In the sheet type substrate processing apparatus having the above-described configuration, when the process is started, the substrate is rotated by the rotation of the support member, and the nozzle sprays the processing fluid onto the processing surface of the substrate to be rotated to clean the substrate. When cleaning of the substrate is completed, a drying process is performed to increase the rotational speed of the substrate to remove the processing fluid from the substrate.

However, in such a sheet type substrate processing apparatus, a phenomenon in which the substrate is separated from the support member by a high rotational speed of the support member during the process occurs. In particular, since the substrate is rotated at a rotation speed of 1000 rpm or more in the drying process of the substrate, the phenomenon of detachment of the substrate due to large centrifugal force is frequently generated. Accordingly, there is a need for a sheet type processing apparatus capable of preventing separation of the substrate even at a large rotational speed.

In addition, the general sheet type substrate processing apparatus is not provided with a means for detecting the departure of the substrate. Therefore, since the normal process proceeds even if the substrate is separated, problems such as damage to the substrate and contamination of equipment due to the damage of the substrate occur.

An object of the present invention for solving the above problems is to provide a sheet type substrate processing apparatus for preventing the substrate from being separated during the process.

Another object of the present invention to provide a sheet type substrate processing apparatus that can detect the departure of the substrate.

Still another object of the present invention is to provide a sheet type substrate processing apparatus capable of automatically stopping the process of the equipment upon detachment of the substrate.

The sheet type substrate processing apparatus according to the present invention for achieving the above object is a housing having an upper portion and having a space for performing a substrate processing process therein, a support member installed inside the housing to support a substrate during the process, and In the sheet type substrate processing apparatus having a drive unit for rotating and lifting the support member, the support member is arranged in a plurality of annular with respect to the center of the support member in the upper portion of the support member, each of which is a part of the edge of the substrate A chucking member for securing and supporting the chucking member, the chucking member extending inwardly from an upper surface of the lower surface in contact with a portion of the lower surface of the substrate, an inner surface facing the side portion of the substrate, and an upper end of the inner surface of the substrate; And an upper surface which prevents the substrate from deviating in the upward direction during rotation.

According to one embodiment of the invention, the substrate processing apparatus further comprises a moving member for linearly reciprocating the chucking member between the chucking position for chucking the substrate and the unchucking position waiting for chucking the substrate.

According to another embodiment of the present invention, the substrate processing apparatus further includes a moving member for respectively positioning the chucking member by a rotational movement between the chucking position for chucking the substrate and the unchucking position for waiting before chucking the substrate. .

According to an embodiment of the invention, the substrate processing apparatus further has a monitoring member for monitoring the departure of the substrate chucked to the chucking member.

According to an embodiment of the invention, the monitoring member includes a sensing member for detecting the departure of the substrate from the chucking member and a control unit for stopping the process of the installation, if the sensing member detects the departure of the substrate.

According to an embodiment of the present invention, the sensing member includes a light emitting sensor installed to emit an optical signal horizontally from the upper portion of the upper surface and a light receiving sensor installed to receive the optical signal when chucking of the substrate is normally performed. The controller determines whether the light receiving sensor does not receive the optical signal during the process.

Hereinafter, preferred embodiments of a sheet type substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Portions denoted by like reference numerals denote like elements throughout the specification.

Example 1

1 is a configuration diagram schematically showing a sheet type substrate processing apparatus according to an embodiment of the present invention, Figures 2a and 2b is a plan view of the sheet type substrate processing apparatus shown in FIG. 3A is an enlarged view of the chucking member shown in FIG. 1, and FIG. 3B is a plan view of the chucking member shown in FIG. 3A.

1 to 3B, the sheet type substrate processing apparatus 100 according to the present invention includes a housing 110, a support member 120, a fluid processing unit 130, a table 140, and a monitoring member 150. Include. The housing 110 has a space in which the substrate W is accommodated and performs a predetermined treatment process. In one embodiment, the treatment process may be a process of cleaning the semiconductor substrate. The housing 110 has a shape in which an upper portion thereof is opened and the support member 120 is wrapped therein. The open upper portion of the housing 110 is used as a substrate entrance through which the substrate W enters and exits.

An open upper portion of the housing 110 is provided with a blocking wall 112 extending from the inner circumferential surface of the housing 110. The blocking wall 112 prevents the processing fluid used in the process from sticking out of the housing 110. That is, the blocking wall 112 prevents the processing fluids injected into the processing surface of the substrate W rotated during the process from being separated out through the open upper portion of the housing 110 due to the rotational force of the substrate W. .

In addition, the housing 110 is provided with a drainage space 114 for discharging used processing fluids to the outside of the housing 130. For example, the drainage space 114 is a space in which the treatment fluid used in the process is drained. The drainage space 114 discharges the treatment fluid used in the process to a recovery tank (not shown) provided outside the housing 110.

The support member 120 is installed at the inner center of the housing 110. The support member 120 is positioned at a position lower than the blocking wall 112 of the housing 110 during the process. In addition, a nozzle unit 132 to be described later is disposed at the center of the support member 120, and a chucking member 122 is installed at the edge of the support member 120 to seat and fix the substrate W.

The support member 120 is rotated horizontally by a driver (not shown). The driving unit may be configured to include, for example, gears interlocked with each other and a motor for driving the gears. The driving unit rotates the support member 120 horizontally when the substrate is accommodated on the support member 120 during the process. In this case, the driving unit may change the speed of rotating the support member 120 in step by step. For example, when the cleaning process is started, the rotation speed of the support member 120 is approximately 500 rpm in the step of injecting the processing fluid to the processing surface of the substrate W, and in the step of drying the substrate W, the support member ( The rotation speed of 120 may be about 1000 rpm or more.

The chucking member 122 fixes and supports the substrate W during the process. The chucking member 122 is provided in plurality at the edge of the upper surface of the support member 120. In one embodiment, the chucking member 122 is disposed in an annular shape along the edge of the substrate W at the edge of the support member 120. Each chucking member 122 has a lower surface 122a, an inner surface 122b, and an upper surface 122c. The lower surface 122a is a portion on which a portion of the lower surface of the edge of the substrate W is seated. The inner side surface 122b is a portion that contacts the edge surface of the substrate W to fix the substrate W when the chucking member 122 is chucked. In addition, the upper surface 122c is a portion which prevents the substrate W from being separated from the chucking member 122 by supporting a part of the edge upper surface of the substrate W when the chucking member 122 is chucked.

In addition, the chucking member 122 is linearly reciprocated between the chucking position a and the unchucking position b by a moving member (not shown). The chucking position (a) is a position at which each chucking member 122 fixes and supports the edge of the substrate (W) during the process, and the unchucking position (b) is a position where each chucking member (122) holds the substrate (W). Waiting position before chucking. When the chucking member 122 is positioned at the chucking position a, the inner surface 122b of the chucking member 122 contacts the edge surface of the substrate W, and the chucking member 122 is positioned at the unchucking position b. When positioned, the lower surface 122a of the chucking member 122 contacts the lower surface of the edge of the substrate W.

 The moving member linearly reciprocates each of the chucking members 122 to / from the edge of the supporting member 120 to / from the center of the supporting member 120 to perform chucking and unchucking of the substrate W. FIG.

The fluid processor 130 includes a nozzle unit 132. The nozzle unit 132 includes at least one nozzle to supply processing fluids used in the sheet type substrate processing apparatus 100. For example, the nozzle unit 132 includes first to third nozzles 132a, 132b, and 132c. The first nozzle 132a supplies ultrapure water, the second nozzle 132b supplies a predetermined chemical, and the third nozzle 132c injects dry gas. Accordingly, the first to third nozzles 132a, 132b, and 132c spray respective processing fluids onto one processing surface of the substrate W. FIG. Here, the outside of the housing 110 may be provided with fourth and fifth nozzles (10, 20) for injecting the processing fluid to the other processing surface of the substrate (W). The fourth nozzle 10 may supply ultrapure water, and the fifth nozzle 20 may supply a dry gas.

The nozzle unit 132 described above is for supplying a predetermined processing fluid to the substrate W. The configuration and coupling method of the nozzle unit 132 and the number of nozzles provided may be variously modified and changed.

The table 140 supports the support member 120. In addition, the inside of the table 140 is provided with a driving unit for the rotation of the support member 120 and a moving member (not shown) for the operation of the chucking member 122. When the substrate W is loaded on the support member 120, the driving unit rotates the support member 120 at a predetermined rotation speed. The moving member reciprocates the chucking member 122 between the chucking position a and the standby position b.

In this embodiment, the driving unit and the moving member are described as an example provided in the table 140, but the driving device is provided for the rotation of the support member 120 and the driving of the chucking member 122, the installation position is various Can be modified and changed.

The monitoring member 150 detects whether the substrate W is separated during the process and stops the process of the facility when the substrate W is separated. The monitoring member 150 has a sensing member 152, a controller 154, and a display member 156. The sensing member 152 senses detachment of the substrate W chucked to the chucking member 122 during the process. In one embodiment, the sensing member 152 has a light emitting sensor 152a and a light receiving sensor 152b.

The light emitting sensor 152a and the light receiving sensor 152b are fixedly installed to face each other at one side of the inner wall of the housing 110. In this case, the light emitting sensor 152a and the light receiving sensor 152b are installed at the same height as each other, and the light emitting sensor 152a is disposed on the upper surface 122c of each chucking member 122 facing the light receiving sensor 152b. Emits an optical signal horizontally towards Therefore, when the substrate W is separated from the chucking member 122 during the process, the optical signal emitted by the light emitting sensor 152a is blocked by the substrate W, so that the light receiving sensor 152b does not receive the optical signal.

The controller 154 receives the signal sensed by the sensing member 152 and determines whether the substrate W is separated. For example, the control unit 154 may perform a normal process when the light receiving sensor 152b receives an optical signal emitted from the light emitting sensor 152a when the substrate W is chucked and rotated by the chucking member 122 during the process. On the contrary, if the light receiving sensor 152b does not receive the optical signal emitted from the light emitting sensor 152a, it is determined that the substrate W is separated from the chucking member 122. When the separation of the substrate W occurs, the controller 154 stops the process of the facility and displays it on the display member 156.

The display member 156 displays a process progress state of the sheet type substrate processing apparatus 100. As the display member 156, a display member such as a microcomputer may be used. Alternatively, the display member 156 may be an alarm device for generating an alarm to the operator.

Hereinafter, an operation process and effects of the sheet type substrate processing apparatus 100 having the above configuration will be described in detail.

When the process is started, the robot arm (not shown) installed outside the sheet type substrate processing apparatus 100 moves the substrate W to the open upper portion of the housing 110. When the substrate W is positioned above the housing 110, the support member 120 is positioned between the respective chucking members 122 in which the substrate W seated on the robot arm is in the unchucking position b. To rise. When the support member 120 is raised, the substrate W seated on the robot arm is seated on the lower surface 122a of the chucking member 122.

When the substrate W is seated on the lower surface 122a on the chucking member 122, the chucking member 122 is moved from the unchucking position b to the chucking position a by the moving member to move the substrate W. Chuck. When the substrate W is chucked, the support member 120 is lowered and then rotated at a predetermined rotational speed inside the housing 110. When the substrate W is rotated, the second nozzle 132b of the nozzle unit 132 sprays a predetermined chemical onto the processing surface of the substrate W to perform a predetermined cleaning process on the surface of the substrate W.

When the cleaning process of the substrate W is completed by the second nozzle 132b, the first nozzle 132a sprays ultrapure water onto the surface of the substrate W, and the chemicals and particles remaining on the surface of the substrate W. A rinse process is performed to remove the back. At this time, the fourth nozzle 10 installed outside the housing 110 also sprays ultrapure water onto the surface of the substrate W to remove chemicals or particles remaining on the surface of the substrate W. Process fluids injected by the first and second nozzles 132a and 132b to the surface of the substrate W are discharged to the outside of the housing 110 through the fluid drainage space 114 provided in the housing 110.

When the rinsing process of the substrate W is completed by the first nozzle 132a, the third nozzle 132c sprays a dry gas toward the substrate W to dry the substrate W. At this time, the fifth nozzle 20 installed outside the housing 110 also sprays a dry gas onto the surface of the substrate W to dry the substrate W. In the drying process, since the substrate W is rotated at a speed of 1000 rpm or more, the substrate W fixed by the inner surface 122b of the chucking member 122 may be separated from the inner surface 122b by a strong centrifugal force. . However, the upper surface 122c of the chucking member 122 supports the upper edge of the substrate W so that the substrate W is not separated from the chucking member 122. Thus, the chucking member 122 prevents the substrate W from being separated.

If an error occurs in the process and the substrate W is separated from the chucking member 122, the optical signal emitted by the light emitting sensor 152a of the sensing member 152 is blocked by the substrate W to receive the light receiving sensor 152b. Does not receive the optical signal. The controller 154 determines that the separation of the substrate W has occurred and stops the process of the facility, and displays it on the display member 156 while the operator recognizes it.

When the processing of the substrate W by the nozzle unit 132 is completed, the support member 120 is raised after the rotation is stopped to move the substrate W to the outside of the housing 110, and the housing 110. The substrate W moved to the outside is carried out to the outside of the sheet type substrate processing apparatus 100 by the robot arm.

In the above-described sheet type substrate processing apparatus 100, the chucking member 122 that performs chucking and unchucking of the substrate W during the process is provided with an upper surface 122a that prevents the substrate W from being separated. The substrate W is prevented from being separated from the chucking member 122. In addition, the monitoring member 150 for monitoring the detachment of the substrate W is provided, thereby automatically stopping the process of the equipment in detecting the detachment of the substrate W and the detachment of the substrate W.

Example 2

Figure 4 is a schematic view showing a sheet type substrate processing apparatus according to another embodiment of the present invention, Figures 5a and 5b is a plan view of the sheet type substrate processing apparatus shown in FIG. 6A is an enlarged view of the chucking member shown in FIG. 1, and FIG. 6B is a plan view of the chucking member shown in FIG. 6A.

4 to 6B, the sheet type substrate processing apparatus 100 according to the present invention includes a housing 110, a support member 120 ′, a fluid processing unit 130, a table 140, and a monitoring member 150. ). Here, the configuration except for the support member 120 'is the same configuration as the first embodiment, the same reference numerals are the same and detailed description thereof will be omitted.

The support member 120 ′ is installed at the inner center of the housing 110. The support member 120 ′ is positioned at a lower position than the blocking wall 112 of the housing 110. A chucking member 122 ′ for mounting and fixing the substrate W is installed at the edge of the support member 120.

A plurality of chucking members 122 ′ are installed at edges of the upper surface of the support member 120. Each chucking member 122 ′ is annularly arranged to support a portion of the edge of the substrate W. As shown in FIG. Each chucking member 122 'has a lower surface 122'a, an inner surface 122'b, and an upper surface 122'c. The lower surface 122 ′ a is a portion on which a portion of the lower surface of the edge of the substrate W is seated. The inner side surface 122 ′ b is a portion that contacts the edge surface of the substrate W to chuck the substrate W when the chucking member 122 ′ is chucked. The upper surface 122 ′ c supports a portion of the upper surface of the edge of the substrate W when the chucking member 122 ′ is chucked to prevent the substrate W from being separated from the chucking member 122 ′. to be.

Each chucking member 122 'is eccentrically rotated at a predetermined rotational angle by a moving member (not shown). Eccentric rotation is an operation for the chucking member 122 'to chuck or unchuck the edge of the substrate W. As shown in FIG. The chucking position a 'is the position where the chucking member 122' chucks the substrate W, and the unchucking position b 'is the substrate W before the chucking member 122' chucks the substrate W. FIG. ) Is a position for seating on the lower surface (122 'a).

When the treatment process is initiated, the substrates W are seated on the bottom surface 122'a of the chucking member 122 ', each of which is located in the unchucking position b'. When the substrate W is seated, the chucking member 122 'eccentrically rotates clockwise from the unchucking position b' to the chucking position a 'to chuck the substrate W. After the processing process is completed, the chucking member 122 ′ eccentrically rotates counterclockwise from the chucking position a ′ to the unchucking position b ′ to perform unchucking of the substrate W. FIG.

In the above-described sheet type substrate processing apparatus 100 ', the chucking member 122' moves between the chucking position a 'and the unchucking position b' by eccentric rotation. In addition, the chucking member 122 ′ that performs chucking and unchucking of the substrate W is provided with an upper surface 122 ′ a which prevents the substrate W from being separated. Prevent deviation from 122 '.

In addition, the sheet type substrate processing apparatus 100 ′ is provided with a monitoring member 150 for monitoring the detachment of the substrate W. The monitoring member 150 has the same configuration as that of the first embodiment, and automatically detects the departure of the substrate W during the process and automatically stops the process of the facility when the departure of the substrate W occurs.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the sheet type substrate processing apparatus according to the present invention prevents the substrate from being separated from the support member by centrifugal force during the process.

In addition, the sheet type substrate processing apparatus according to the present invention can detect the departure of the substrate during the process, and can automatically stop the process of the process of the equipment upon the departure of the substrate.

Claims (6)

In the sheet type substrate processing apparatus having a housing having an upper portion and having a space for performing a substrate processing process therein, a support member installed inside the housing to support a substrate during the process, and a driving unit for rotating and lifting the support member. In The support member, A plurality of annularly disposed on the center of the support member in the upper portion of the support member, each having a chucking member for fixing and supporting a portion of the edge of the substrate, The chucking member, A lower surface in contact with a portion of the lower surface of the edge of the substrate, An inner side facing a portion of the side of the substrate, And an upper surface extending inwardly from an upper end of the inner surface to prevent the substrate from escaping upward when the substrate is rotated. The method of claim 1, The substrate processing apparatus, And a moving member for linearly reciprocating the chucking member between the chucking position for chucking the substrate and the unchucking position waiting for chucking the substrate. The method of claim 1, The substrate processing apparatus, And a moving member for locating the chucking member by a rotational movement between the chucking position for chucking the substrate and the unchucking position for waiting before chucking the substrate, respectively. The method of claim 2 or 3, The substrate processing apparatus, Single-sheet substrate processing apparatus further comprises a monitoring member for monitoring the separation of the chucked substrate to the chucking member. The method of claim 4, wherein The monitoring member, A sensing member detecting a departure of the substrate from the chucking member; If the sensing member detects the departure of the substrate, single-sheet substrate processing apparatus comprising a control unit for stopping the process of the installation process. The method of claim 5, The sensing member, A light emitting sensor installed to emit an optical signal horizontally from an upper portion of the upper surface, and a light receiving sensor installed to receive the optical signal when chucking of the substrate is normally performed; The control unit, Single sheet processing apparatus characterized in that for determining whether or not the light receiving sensor does not receive the optical signal during the process.

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