JP2000024602A - Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for cleaning a substrate which can carry the substrate near a central part of a carrying roll of a scrubber without shaking of the substrate and injuring of the peripheral part of the substrate. SOLUTION: Side guide rolls 178 are disposed along a periphery passing part of the substrate G to be carried on a surface where axes of carrying rolls 172, 171 of a scrubber housing are attached and the substrate G is pressed from both left and right sides thereof toward the central direction of the substrate G to be movably held between the side guide rolls 178. Since the side guide rolls 178 press the substrate G from both sides thereof toward a central part of the carrying rolls 172, 171, a carrying path of the substrate G is corrected when the path is likely to shift out of the central part of the carrying rolls 172, 171. Thereby the substrate can be made to surely pass through the central part of the carrying rolls 172, 171.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus used for a liquid crystal display device (hereinafter, the liquid crystal display device is abbreviated as "LCD").

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing an LCD, a substrate cleaning apparatus using a cleaning brush, that is, a so-called scrubber, has been used for cleaning a glass substrate for an LCD or the like.

[0003] In this scrubber, a substrate is sandwiched between a plurality of transport rollers arranged above and below, and the transport rollers are driven so that the substrate is transported in a horizontal direction and a rotating brush is provided on each of the upper and lower surfaces of the substrate. To clean the surface. Next to the scrubber, there is provided a high-pressure / ultrasonic cleaning device for cleaning by supplying a cleaning agent at a high pressure while rotating the substrate in a horizontal plane.The substrate, which has been brush-cleaned by the scrubber, is transported by a transfer arm. Transfers the substrate to just above the spin chuck of the high-pressure / ultrasonic cleaning device and sets the substrate on the spin chuck. The transfer device that transfers the substrate from the scrubber to the high-pressure / ultrasonic cleaning device moves the substrate linearly along the rail. The substrate is transported in a straight line. Therefore, on the scrubber, the substrate needs to move linearly in the center of the transport roller.

[0004] Further, the substrate sent out of the transport roll after the brush cleaning is completed by the scrubber must be transported to a position where the center thereof can be set as it is on the spin chuck of the subsequent high pressure / ultrasonic cleaning apparatus. for that reason,
The central part in the axial direction of the transport roll and the rotation axis of the spin chuck of the high-pressure / ultrasonic cleaning device must be on the same line.

[0005] Therefore, in the above-mentioned conventional scrubber, FIG.
As shown in FIG. 3, a roll with a flange is attached to a portion of the transport roll where the left and right ends of the substrate pass, and when the substrate is shifted to one of the left and right sides of the transport roll, the peripheral edge of the substrate contacts the tapered portion. The roll was pushed back toward the center of the transport roll.

[0006]

However, in the method of correcting the transport path of the substrate using the roll with a flange, there is "play" of the substrate position in the axial direction of the transport roll. Therefore, there is a problem that the center of the substrate sent out from the transport roll does not always coincide with the rotation axis of the subsequent spin chuck, or the peripheral edge of the substrate comes into contact with the flanged roll and plays back, There has been a problem that the quality of the substrate may be impaired, for example, the end may be damaged.

Further, it is difficult to install the apparatus such that the center of the transfer roll of the scrubber and the rotation axis of the spin chuck are aligned with each other, and when transferring the substrate from the scrubber to the spin chuck, However, there is a problem in positioning between the scrubber and the spin chuck, such as that it cannot be set on the spin chuck. Further, other problems include a cleaning liquid dripped from the substrate held by the spin chuck being accumulated in a lifter at the center of the spin chuck, a problem in maintenance of a lid of a container accommodating the spin chuck, and a mist trap portion of the container. There is a water-related problem on the high-pressure cleaning device side, such as water droplets adhering to the detection unit of the temperature sensor disposed in the device and causing a pinch, which hinders temperature detection.

The present invention has been made to solve these problems.

[0009] That is, an object of the present invention is to provide a cleaning apparatus capable of transporting a scrubber in the vicinity of a central portion of a transport roll without rattling or damaging a peripheral portion of the substrate.

Another object of the present invention is to provide a cleaning apparatus having no problem in positioning between a scrubber and a spin chuck.

A further object of the present invention is to provide a cleaning apparatus free of water-related problems on the high-pressure cleaning apparatus side.

[0012]

According to a first aspect of the present invention, there is provided a cleaning apparatus for moving a substrate to be processed in a first direction parallel to a surface, and for cleaning the substrate. Means, and means for pressing the substrate to be processed in a second direction orthogonal to the moving direction to correct a shift in the second direction.

[0013] The cleaning device according to claim 2, wherein a plurality of upper transport rolls arranged in parallel and in a row with each other; and a plurality of upper transport rolls arranged in parallel and in a row below the upper transport roll with the upper transport roll. A plurality of lower transport rolls for nipping and transporting the substrate to be processed, means for cleaning the moving substrate to be processed, and a pair of left and right opposed surfaces disposed on both left and right sides in the moving direction of the substrate to be processed. And at least one pair of side guide roll pairs for movably holding the substrate to be processed between the side rolls.

According to a third aspect of the present invention, there is provided a spin chuck comprising a spin chuck body on which a substrate to be processed is mounted, and a post for holding four corners of the substrate to be processed mounted on the spin chuck main body. And a post having a tapered shape.

A spin chuck according to a fourth aspect is the spin chuck according to the third aspect, wherein the post is disposed in an eccentric cam shape with respect to the main body of the spin chuck.

A cleaning apparatus according to a fifth aspect of the present invention comprises a spin chuck main body on which a substrate to be processed is mounted, and a post for holding four corners of the substrate to be processed mounted on the spin chuck main body, wherein the post has a cylindrical shape. And a post formed on the base and having an inclined cone having an axis inclined with respect to the axis of the base.

A cleaning apparatus according to a sixth aspect of the present invention comprises a spin chuck main body on which the substrate to be processed is mounted, and a post for holding four corners of the substrate to be processed mounted on the spin chuck main body, wherein the post has a tapered shape. A post with a tapered shape,
Means for rotating the spin chuck and means for cleaning the substrate to be processed are provided.

A cleaning apparatus according to a seventh aspect of the present invention includes a brush cleaning unit for performing brush cleaning on the substrate to be processed, a high-pressure cleaning unit for performing high-pressure cleaning on the substrate to be processed, and a cleaning unit between the brush cleaning unit and the high-pressure cleaning unit. And a means for performing positioning.

According to another aspect of the present invention, there is provided a cleaning apparatus, comprising: a transport roll for transporting a substrate to be processed; a brush cleaning unit having a brush cleaning mechanism for bringing a cleaning brush into contact with the substrate to be processed; A high-pressure cleaning unit including a spin chuck to be placed and a high-pressure cleaning mechanism for performing high-pressure cleaning on the substrate to be processed; and the brush cleaning so that the center of the transport roll and the rotation axis of the spin chuck are aligned. Positioning means for positioning between the unit and the high-pressure cleaning unit.

The cleaning device according to a ninth aspect is the cleaning device according to the eighth aspect, wherein the positioning means includes a pair of fittings disposed between the brush cleaning unit and the high-pressure cleaning unit. It is a member.

A spin chuck according to a tenth aspect of the present invention is a spin chuck body on which a substrate to be processed is mounted, and a lifter which engages with a central portion of the spin chuck body and moves the substrate to be processed up and down. A lifter having a tapered portion at the center of the upper surface.

The cleaning apparatus according to the present invention is a spin chuck body on which a substrate to be processed is mounted, and a lifter which engages with a central portion of the spin chuck body and moves the substrate to be processed up and down. A spin chuck having a lifter having a tapered portion in the center of the upper surface, a container accommodating the spin chuck, a unit for rotating the spin chuck, and a unit for supplying a cleaning agent to the substrate to be processed at a high pressure And

[0023] According to a twelfth aspect of the present invention, there is provided a cleaning apparatus, wherein a spin chuck main body on which a substrate to be processed is mounted is disposed so as to be able to protrude and retract from a central part of the spin chuck main body. A lifter having a gas passage penetrating therethrough, a spin chuck having a container for accommodating the spin chuck, a means for rotating the spin chuck, and a means for supplying a high-pressure cleaning agent to the substrate to be processed, Means for supplying gas to the gas passage.

A cleaning apparatus according to claim 13, wherein a high-pressure cleaning mechanism for supplying a cleaning agent at high pressure to the substrate to be rotated for cleaning is provided, a container accommodating the high-pressure cleaning mechanism, and a mist trap section of the container. , And a cylindrical tubular protective cover disposed around the pitot tube at the tip of the temperature sensor.

According to a fourteenth aspect of the present invention, a high-pressure cleaning mechanism for supplying a high-pressure cleaning agent to a rotated substrate to be processed for cleaning, a container accommodating the high-pressure cleaning mechanism, and an upper part of the container are covered. A cover; and a protection plate detachably provided in the notch at the top of the cover.

According to the first aspect of the present invention, there is provided the cleaning device, which includes means for pressing the substrate to be processed in the second direction orthogonal to the first direction to correct the displacement in the second direction. The substrate can be reliably passed through the central portion of the transport roll without being displaced or rattled in the axial direction of the transport roll.

In the cleaning apparatus according to the present invention, a pair of side guide rolls are disposed so as to oppose each other on the left and right sides in the moving direction of the substrate, and movably sandwich the substrate between a pair of left and right side guide rolls facing each other. Because it has
The substrate can be reliably passed through the central portion of the transport roll without being displaced or rattled in the axial direction of the transport roll. In addition, since the portion in contact with the edge of the substrate is a roll, little frictional force acts on the edge of the substrate, and the substrate is not damaged.

In the spin chuck according to the third aspect, the post holding the four corners of the substrate to be processed has a tapered shape, so that the operation for setting the substrate from the transfer arm to the spin chuck is performed smoothly. be able to.

According to a fourth aspect of the present invention, there is provided a spin chuck according to the third aspect, wherein the post is disposed in an eccentric cam shape with respect to the main body of the spin chuck. By rotating the post, the gap between the end of the substrate set on the spin chuck and the post can be changed, and this gap can be appropriately adjusted to the most appropriate size.

According to a fifth aspect of the present invention, the post holding the four corners of the substrate to be processed has a cylindrical base and an axis formed on the base and inclined with respect to the axis of the base. By rotating the post, the clearance between the end of the substrate falling on the spin chuck and the post can be changed, and the contact between the substrate and the post can be appropriately adjusted. Can be adjusted.

In the cleaning apparatus according to the sixth aspect, since the posts sandwiching the four corners of the substrate to be processed have a tapered shape, the operation for setting the substrate from the transfer arm to the spin chuck is performed smoothly. be able to.

In the cleaning apparatus according to the present invention, the entire cleaning apparatus is divided into a brush cleaning unit and a high-pressure cleaning unit.
The brush cleaning unit and the high-pressure cleaning unit can be positioned using the means for positioning between the brush cleaning unit and the high-pressure cleaning unit. It can be adjusted so that the positional relationship with the chuck becomes the most appropriate position.

[0033] In the cleaning apparatus according to the present invention, the center of the transport roll and the rotation axis of the spin chuck are aligned with each other by using positioning means for positioning between the brush cleaning unit and the high-pressure cleaning unit. Since the structure is such that positioning is performed in a line, it is possible to adjust the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit to be the most appropriate position.

According to a ninth aspect of the present invention, in the cleaning apparatus according to the eighth aspect, a pair of fitting members provided between the brush cleaning unit and the high-pressure cleaning unit are used as the positioning means. Since it is employed, the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit can be easily and accurately adjusted.

According to a tenth aspect of the present invention, since the lifter for vertically moving the substrate to be processed is provided with a lifter having a tapered portion at least in the center of the upper surface, the processing agent and water are dripped from the lower surface of the substrate. Also, since it flows down to the container side along the tapered portion, the liquid does not remain attached to the lower surface of the substrate. Therefore, it is possible to prevent a treating agent or water from dripping from the lower surface of the substrate to each part of the apparatus during the transportation of the substrate, thereby causing an electrical trouble.

In the cleaning apparatus according to the eleventh aspect, since the lifter for vertically moving the substrate to be processed is provided with a lifter having a tapered portion at least at the center of the upper surface.
Even if the treating agent or water drips from the lower surface of the substrate, it flows down to the container side along the tapered portion, so that the droplet does not remain attached to the lower surface of the substrate. Therefore, it is possible to prevent a treating agent or water from dripping from the lower surface of the substrate to each part of the apparatus during the transportation of the substrate, thereby causing an electrical trouble.

In the cleaning apparatus according to the twelfth aspect, the first aspect is as follows.
In addition to the spin chuck of No. 0 and the cleaning device of claim 11, a gas is ejected from the opening provided at the top of the lifter toward the lower surface of the substrate, so that the liquid droplets are more reliably projected on the lower surface of the substrate. Is prevented from adhering.

In the cleaning device according to the thirteenth aspect, since the cylindrical tubular protective cover is provided around the pitot tube at the tip of the temperature sensor provided in the mist trap portion of the container, the treating agent and water are not removed. It is possible to prevent the temperature detection of the sensor from being affected by affecting the detection unit of the sensor.

In the cleaning device according to the fourteenth aspect, the cover is detachably provided in the notch at the top of the lid.
Maintenance management can be performed safely and easily.

[0040]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment) FIG. 1 is a perspective view of a coating and developing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

The coating / developing apparatus 1 has a cassette station C / S at one end.

On the other end of the coating / developing device 1, an LCD glass substrate G (hereinafter, the LCD glass substrate is simply abbreviated as "substrate") is provided between the coating / developing device 1 and an exposure device (not shown).
Interface unit I /
F is arranged.

In this cassette station C / S, a plurality of, for example, four sets of cassettes 2 containing substrates G are mounted. On the front side of the cassette 2 of the cassette station C / S, an auxiliary arm 4 for carrying and positioning the substrate G, which is a substrate to be processed, and holding and transferring the substrate G to and from the main arm 3. Is provided.

The interface unit I / F is provided with an auxiliary arm 5 for transferring the substrate G to and from an exposure apparatus (not shown). The interface unit I / F includes an extension section 6 for transferring the board G to and from the main arm 3 and a board G.
Is temporarily placed in a standby state.

Two main arms 3 are arranged in series so as to be movable in the center of the coating and developing apparatus 1 in the longitudinal direction.
And a second processing unit group B are disposed. Between the first processing unit group A and the second processing unit group B, a relay section 8 for temporarily holding and cooling the substrate G is disposed.

In the first processing unit group A, a cleaning processing unit SCR for cleaning the substrate G and a developing processing unit DEV for performing a developing process are provided beside the cassette station C / S.
And are juxtaposed. Further, the cleaning unit SCR and the developing unit D sandwich the transport path of the main arm 3 therebetween.
On the opposite side of the EV, two heat treatment units HP vertically arranged in two stages and a UV processing unit UV and cooling unit COL arranged vertically in two stages are arranged adjacent to each other.

In the second processing unit group B, a coating processing unit COT for performing a resist coating processing and an edge remove processing is arranged. Further, on the opposite side of the coating unit COT across the transport path of the main arm 3, an adhesion unit AD and a cooling unit COL for hydrophobically embedding the substrate G vertically arranged in two stages, and two vertically arranged stages. Heat treatment unit HP and cooling unit COL arranged
And two sets of heat treatment units HP arranged vertically in two stages are arranged adjacent to each other. Heat treatment unit HP
When the cooling unit COL and the cooling unit COL are arranged vertically in two stages, the thermal interference is avoided by arranging the heat treatment unit HP on the upper side and the cooling unit COL on the lower side. This enables more accurate temperature control.

The main arm 3 includes an X-axis driving mechanism, a Y-axis driving mechanism, and a Z-axis driving mechanism, and further includes a rotation driving mechanism that rotates about the Z-axis. The main arm 3 appropriately travels along the central passage of the coating / developing device 1 to transport the base slope G between the processing units. Then, the main arm 3 loads the unprocessed substrate G into each processing unit, and unloads the processed substrate G from each processing unit.

In the coating / developing apparatus 1 of the present embodiment, by integrating and integrating the respective processing units in this manner, space can be saved and processing efficiency can be improved.

In the coating / developing apparatus 1 configured as described above, first, the substrate G in the cassette 2 is
Then, the wafer is transferred to the cleaning unit SCR via the main arm 3 and subjected to the cleaning process.

Next, it is conveyed to the adhesion unit AD via the main arm 3, the relay section 8 and the main arm 3 and subjected to a hydrophobic treatment. Thereby, the fixability of the resist is improved.

Next, it is conveyed to the cooling unit COL via the main arm 3 and cooled. Thereafter, the resist is transferred to the coating unit COT via the main arm 3 and coated with the resist.

Next, the substrate G is conveyed to the heat processing unit HP via the main arm 3 and subjected to a pre-baking process. Then, the cooling unit CO is supplied via the main arm 3.
After being conveyed to L and cooled, it is conveyed to the exposure device via the main arm 3 and the interface I / F, where a predetermined pattern is exposed.

Then, the substrate G that has been exposed again is carried into the apparatus 1 via the interface I / F, and is conveyed to the heating processing unit HP via the main arm 3 to be subjected to post-exposure bake processing. .

Thereafter, the substrate G is carried into the cooling unit COL via the main arm 3, the relay section 8, and the main arm 3, and is cooled. Then, the substrate G is carried into the development processing unit DEV via the main arm 3 and subjected to development processing, and a predetermined circuit pattern is formed. The developed substrate G is carried into the post-bake processing unit HP via the main arm 3 and subjected to post-bake processing.

Then, the post-baked substrate G
Are stored in a predetermined cassette 2 on a cassette station C / S via a main arm 3 and an auxiliary arm 4.

Next, the configuration and operation of the cleaning unit SCR according to this embodiment will be described.

FIG. 3 is a vertical sectional view showing a schematic configuration of the cleaning unit SCR according to the present embodiment, and FIG. 4 is a plan view of the unit.

As shown in FIGS. 3 and 4, the substrate cleaning unit 1 includes a brush cleaning device (scrubber) 12 for performing brush cleaning, and a high-pressure / ultrasonic cleaning device 13 for cleaning by high-pressure jet water flow and ultrasonic waves. Are provided adjacent to each other.

The brush cleaning device 12 is provided with a substrate transport mechanism for transporting the LCD glass substrate G linearly (in the horizontal direction in the figure). A large number of front surface cleaning brushes 16 and a plurality of rear surface cleaning brushes 17 sandwiching the substrate G transport path located downstream of the substrate transport mechanism in the substrate G movement direction;
A rinsing liquid supply nozzle (not shown) is provided.

At the position where the LCD glass substrate G is carried in, there is provided a substrate holding mechanism 18 which is configured to be capable of vertically moving and rotating by 90 degrees by sucking and holding the LCD glass substrate G by a vacuum chuck.

Next, the roll transport mechanism according to this embodiment will be described.

As shown in FIG. 5, the substrate transport mechanism of this embodiment comprises an upper transport roller 172 and a lower transport roller 171.
It has. A plurality of upper conveying rollers 172,
172,... And lower transport rollers 171, 171,.
Are horizontally and alternately arranged in the scrubber chamber 170. A substrate holding mechanism 18 is provided on the upstream side of the substrate transport path on which the upper transport rollers 172, 172,... And the lower transport rollers 171, 171,. 177 are provided. As shown in FIG. 5, the lower transport roller 171 and the upper transport roller 1
72 between the upper brush 173 and the lower brush 17.
4 are provided. The upper brush 173 and the lower brush 174 are arranged in two horizontal rows, respectively.
Is facing the lower transport roller 171, and the lower brush 174 is facing the upper transport roller 172. In addition, upper brush 1
Each of 73 and lower brush 174 is adapted to be rotatable about a vertical axis.

As shown in FIG. 6, the upper conveying roller 172
And a pair of O-rings 17 on the peripheral surface of the lower conveying roller 172.
5 are fitted, and the O-ring 175
Are in direct contact with the peripheral edges of both sides. The O-ring 175 is made of fluoro rubber, FPM, propylene hexafluoride, or vinylidene fluoride copolymer.

Further, a side guide roller 1 is provided between the adjacent upper transport roller 172 and lower transport roller 171.
78 are attached. This side guide roller 1
Numerals 78 are attached to both side walls of the scrubber housing. More specifically, in the horizontal direction, it is a position between the bearing portion of the upper transport roller 172 and the bearing portion of the lower transport roller 171. In the vertical direction, the upper transport roller 172 and the lower transport roller 171 Is the height through which the substrate G passes.

These side guide rollers 178 are disposed at positions facing the left and right side walls of the scrubber housing, and two pairs of the left and right side walls form one pair.

These side guide rollers 178, 17
A pair 8 is provided between the upper transport roller 172 and the lower transport roller 171 and at both ends in the transport direction of the substrate G. A total of 18 side guides are provided in a plurality of pairs, for example, 9 pairs. A roller 178 is provided.

Next, one side guide roller 178 will be described in detail.

FIG. 7 is a partially enlarged plan view of the scrubber according to the present embodiment, and FIG. 8 is a diagram showing the front and side surfaces of the side guide roller 178.

As shown in FIG. 8, the side guide roller 178 includes a roller body 178a and a frame 178b that rotatably supports the roller body.

The roller body 178a has a doughnut-shaped rubber roller 178 on the outer periphery of a cylindrical hub 178h serving as a core.
r is fitted therein, and a through hole is formed in the center of the hub 178h for passing the pivot pin 178p.

The frame 178b is an elongated plate-shaped member, one end of which is bent substantially at a right angle and has an L-shaped cross section. A fixing hole is formed in the bent front end portion, and the scrubber is fixed to the side wall of the housing via a screw through the hole.

In the portion near the other end, a pin 1
An oval long hole 178l is formed for passing 78p.

To fix the side guide roller 178 to the side wall of the housing of the scrubber, two frames 17 are mounted on the side wall of the housing at the position where the side guide roller is mounted.
8b and 178b are opposed to each other as shown in FIG. Two frames 178b, 1
The roller main body 178a is inserted into a position where the long hole 178l between 78b and the hole of the hub 178h communicate with each other.
Roller body 17 through the pivot pin 178p from outside
8a is attached to the frame 178b. Next, slot 178
An elastic body such as a spring (not shown) is inserted between the shaft support pin 1 and the shaft support pin 178p to urge the roller body 178a away from the housing side wall. By doing so, the substrate G is pressed in a direction away from the side wall of the housing, and the substrate G is guided to the center of the transport path by the pair of left and right side guide rollers 178.

The shaft of the lower transport roller 171 is connected to a drive motor (not shown), but the upper transport roller 172 is supported so as to run idle. In this case, the upper conveying roller 172 may also be driven to rotate.

Next, the lift holder 177 will be described.

FIG. 9 is a side view of the lift holder 177, and FIG.
0 is a vertical sectional view in which both ends of the lift holder 177 are partially enlarged, and FIG. 11 is a plan view in which both ends of the lift holder 177 are partially enlarged.

The lift holder 177 is moved in the X-axis direction and the Z-axis direction by the driving mechanism 180.
In addition, a negative pressure acts on the groove 187, which is the suction portion shown in FIG. 11, to suck and hold the substrate G mounted thereon.

As shown in FIG. 9, the lift holder 177
Is connected to a movable member (not shown) of the drive mechanism 180 by members 181, 182, 183, and 184.
A pair of holding members 185 are attached to the lower surface of the lift holder 177, and the periphery of the substrate G is inserted into the recess of each holding member 185. In this case, the substrate G
Are inserted into the recesses of the holding member 185, respectively, about 100 mm from the end face. The lift holder 177
Is located slightly above the height of the lower transport roller 171,
The substrate G is transported at this position.

As shown in FIGS. 10 and 11, the holding member 1
A groove 187 is formed in the holding surface 186 of the recess 85.
The opening 188 a of the internal passage 188 is opened in the groove 187. The internal passage 188 communicates with an intake device (not shown) such as an air compressor via a connecting member 189 and a hose (not shown).

Next, the front surface cleaning brush 16 and the back surface cleaning brush 17 will be described.

As shown in FIG. 4, the front cleaning brush 16 and the back cleaning brush 17 are each composed of a brush group arranged in two rows, and the group of the front cleaning brush 16 and the group of the back cleaning brush 17 are alternately arranged. Have been. Each brush is made of nylon or mohair fibers.

As shown in FIG. 12, the surface cleaning brush 16
A timing belt 20 is wound around a base 30 of the back surface cleaning brush 17, and when the timing belt 20 is moved by a drive shaft 21 of a motor (not shown), the front surface cleaning brush 16 and the back surface cleaning brush 17 Each is designed to rotate around an axis. The front surface cleaning brush 16 and the back surface cleaning brush 17 are supported by an elevating mechanism (not shown).

The front surface cleaning brush 16 and the rear surface cleaning brush 7 are formed in an outer cylindrical shape. As shown in FIG. 31 and a nozzle hole 31a are formed. A brush 32 is planted in the base 30 in a ring shape. The rinsing liquid flow path 31 communicates with a rinsing liquid supply source via a pressure pump. Each nozzle hole 31
Since the discharge port of a is open toward the brush 32,
The brush 32 itself can be cleaned, and the brush 32 can be prevented from drying.

The rinsing liquid flow path 3 is controlled by a pressure pump.
The rinsing liquid supplied to 1 is desirably at a pressure of 10 to ²⁰ kg / cm ² (relatively low pressure). This is because if the supply pressure of the rinsing liquid is too high, the brush 32 is deformed. It is desirable to use pure water as such a rinsing liquid.

The back surface cleaning brush 17 has the same configuration. Further, since the back surface cleaning brush 17 is arranged upward, pure water or the like can be supplied to the back surface cleaning brush 17 from a supply nozzle (not shown) provided on the upper side (on the front surface cleaning brush 16 side). It may be configured as follows. Such a supply nozzle is provided separately from the rinse liquid supply nozzle for cleaning the substrate G, and supplies pure water or the like at a lower pressure than the rinse liquid supply nozzle for cleaning the substrate G. As a result, the front surface cleaning brush 16 and the back surface cleaning brush 1
7 can be prevented from being deformed.

Next, a brush cleaning device (scrubber) 12
And the connection part with the high-pressure / ultrasonic cleaning device 13 will be described.

The cleaning unit SCR according to the present embodiment
In this case, the brush cleaning device (scrubber) 12 and the high-pressure / ultrasonic cleaning device 13 are configured as separate units, and when these two units are combined, the two units are aligned. I have.

FIG. 14 shows a brush cleaning device (scrubber) 1
FIG. 2 is a plan view showing a state when the high pressure / ultrasonic cleaning device 13 is combined with the high pressure / ultrasonic cleaning device 13.

As shown in FIG. 14, fitting pins 192 and 193 protruding in the X direction are respectively arranged on the coupling surface of the brush cleaning device (scrubber) 12, that is, both ends in the Y direction on the right end surface in the drawing. Has been established. This mating pin 192,
193 is disposed at a position symmetrical with respect to the Y direction of the housing 190 of the brush cleaning device (scrubber) 12, and at the midpoint between the left and right fitting pins 192, 193, the upper transport rolls 172, 172,. Side transfer roll 17
1, 171,... So that the middle point is
, And lower transport rolls 171, 171, ...
Position. Alternatively, a mark is provided at the middle point in the Y direction of the housing 190, and the upper transport rolls 172, 172,.
1,171,... May be positioned.

On the other hand, fitting holes 252 and 253 perforated in the X direction are respectively provided at the coupling surface of the high-pressure / ultrasonic cleaning apparatus 13, that is, at both ends in the Y direction on the left end surface in the figure. These fitting holes 252 and 253 are disposed at symmetrical positions with respect to the Y direction of the housing 280 of the high-pressure / ultrasonic cleaning device 13.
The substrate rotation mechanisms 202, 205, and 210 including the spin chuck 210 are positioned so that the center of the rotation axis of the spin chuck 210 is located at the midpoint of 253.

In FIG. 14, as shown in a partially enlarged view indicated by a dotted circle, the diameter of the fitting holes 252 and 253 near the housing surface is large, and 192 and 193 can be easily inserted.

Alternatively, a mark is placed at the middle point in the Y direction of the housing 280, and the substrate rotating mechanisms 202, 205, 210 may be positioned.

In order to connect the brush cleaning device (scrubber) 12 and the high-pressure / ultrasonic cleaning device 13 according to the present embodiment, the fitting pins 192 and 193 are connected to the fitting holes 25.
The brush cleaning device (scrubber) 12 and the high-pressure / ultrasonic cleaning device 13 may be installed so as to be inserted into the respective 2, 253.

For example, the brush cleaning device (scrubber) 12 is previously set at a predetermined position, and then the fitting pins 192, 1 on the coupling surface of the brush cleaning device (scrubber) 12 are set.
This is a method of installing the high-pressure / ultrasonic cleaning device 13 so that the fitting holes 252 and 253 are coupled to the 93.

On the contrary, the high pressure / ultrasonic cleaning device 13 is set in advance at a predetermined position, and then the fitting holes 252 and 253 are formed in the fitting pins 192 and 193 on the coupling surface of the brush cleaning device (scrubber) 2. A brush cleaning device (scrubber) 12 may be provided so that the brushes are combined.

In this embodiment, the fitting pin 192,
, 193 and the upper transport rolls 172, 172,... And the lower transport rolls 171, 171,.
The positional relationship between the spin chucks 52, 253 and the spin chuck 210 is fixed, but the fitting pins 192, 193, the upper transport rolls 172, 172,.
, And a mechanism that can adjust the positional relationship between the fitting holes 252, 253 and the spin chuck 210, and a brush cleaning device (scrubber) 12 and a high-pressure / ultrasonic cleaning device. 13 may be configured to be positioned at the time of connection.

For example, a position adjusting mechanism (not shown) for moving in the Y direction is provided on the upper transport rolls 172, 172,... And the lower transport rolls 171, 171,. After the (scrubber) 12 and the high-pressure / ultrasonic cleaning device 13 are connected to each other, the center of the upper transport rolls 172, 172,... And the lower transport rolls 171, 171,. This is a method of adjusting the position so that the center of the rotation axis of the chuck 210 is aligned on a straight line.

Next, the high-pressure / ultrasonic cleaning device 13 will be described.

FIG. 15 is a diagram showing a schematic configuration of the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment as in a vertical sectional view, and FIG. 16 is a plan view of the high-pressure / ultrasonic cleaning apparatus 13. .

As shown in FIG. 15, the lower part of the high-pressure / ultrasonic cleaning device 13 is surrounded by a container 200, and the waste liquid in the container 200 is drained through a drain 201. A substrate holding mechanism (lifter) 202 that holds the substrate G through the central opening of the container 200
Is provided. A shaft 203 of a substrate holding mechanism (lifter) 202 is rotatably supported by a block 205 by a bearing 204. The lower end of the shaft 203 is a motor 206
Is connected to the drive shaft. Further, a rod 208 of an air cylinder 207 is connected to the body of the motor 206, whereby the substrate holding mechanism 202 is lifted to the position L or H.

The spin chuck 210 includes a pair of bearings 21.
2, and is rotatably attached to the fixed block 213. The driving device 2 is provided below the spin chuck 210.
Fourteen drive force transmitting members 215 are connected, and the spin chuck 210 is configured to be rotatable at about 3000 rpm.

FIG. 16 is a plan view of the spin chuck 210 of the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment, and FIG. 17 is a partially enlarged view of a vertical cross section of the spin chuck 210.

As shown in FIGS. 16 and 17, a plurality of posts 211 stand on the spin chuck 210. The posts 211 are members that are in contact with the end faces of the four corners of the substrate G. In the present embodiment, two posts are provided at each corner,
There are a total of eight posts.

FIG. 18 is a view showing the post 211 according to the present embodiment viewed from above and horizontally.
8 (a) is a front view, FIG. 18 (b) is a plan view, FIG.
18C is a rear view, FIG. 18D is a left side view, and FIG.
(E) represents a right side view, respectively.

As shown in FIG. 18, the post 211 according to the present embodiment has a cylindrical base portion and an inclined portion formed thereon, and the inclined portion formed on the upper portion has an asymmetrical shape. It has.

More specifically, the upper portion has a shape close to a conical shape, but the inclination angle is different between the front side and the rear side, and the front side forms a steep inclination close to vertical, while the rear side has a steep inclination. It forms a relatively gentle slope. The slope on the side between the front side and the back side forms an intermediate slope between the steep slope on the front side and the gentle slope on the back side, and from the front side to the back side via the left and right sides The slope to reach is continuously changing. The left and right sides have the same inclination, and the left and right sides have a symmetrical shape.

[0109] A through hole 212 is provided in the vertical direction of the post 211 for passing a mounting bolt, and this through hole passes through the center of the base of the post 211. As shown in FIGS. 16 and 17, two adjacent posts 211 and 211 form a set and are arranged at positions where one corner of the substrate G is sandwiched from both sides.

As shown in FIGS. 16 and 17, the substrate G set on the spin chuck 210 is held in a state where its outer peripheral edge is in contact with the outer peripheral edge of the base of the posts 211, 211.

On the other hand, the transfer of the substrate G after the previous scrubbing step is completed is performed by the lift holder 177.
The transfer from the lift holder 177 to the spin chuck 210 is performed by transporting the substrate G held by the lift holder 177 to a position immediately above the spin chuck 210, releasing the substrate G at that position, and dropping the substrate G. The substrate G falling from the lift holder 177 is
The four corners 211 are received by being pinched by the four corners. Therefore, the larger the clearance between at least the upper part of the post 211 and the substrate G, the smoother the transfer of the substrate G.

In this embodiment, since the upper portion of the post 211 has a tapered shape, the clearance between the upper portion of the post 211 and the substrate G is large. Therefore, when the substrate G is transferred from the lift holder 177 to the spin chuck 210, a mistake in the transfer is less likely to occur. On the other hand, the base of the lift holder 211 is thick and the substrate G is set at a predetermined position, so that the substrate G in the set state does not rattle.

In particular, the post 211 of this embodiment has a special shape in which the inclination of the upper portion changes continuously.
By rotating the post 211, it is possible to adjust the inclination of a portion in contact with the outer peripheral edge of the substrate G.

That is, the post 2 on the spin chuck 210
By rotating 11, the angle at which the outer peripheral edge of the substrate G falling from the lift holder 177 toward the spin chuck 210 hits the upper part of the post 211 can be changed.

For example, if the front side having a steep inclination is fixed so as to be in contact with the outer peripheral edge of the substrate G, the angle of contact between the outer peripheral edge of the substrate G and the upper portion of the post 211 is reduced, and the impact is reduced. On the other hand, when the rear side with a gentle inclination is fixed in a direction in which it contacts the outer periphery of the substrate G, the outer periphery of the substrate G
The angle of contact between the upper portion of the post 11 and the outer peripheral edge of the substrate G is reduced, and the speed of drop of the substrate is reduced.
Low impact when falling to zero.

(Modification 2) As a modification of the post 211, as shown in FIG. 19, a post having an inclined portion eccentric to the mounting hole is used. The clearance between the upper part of 211 and the substrate G can be changed.

That is, as shown in FIG. 19, the shape of the post 211 is such that the upper part 211b in the form of a cone (tilted cone) having an inclined axis is placed on a cylindrical base part 211a.
Has a combined shape. Therefore, on the rear side (c), the distance between the upper slope of the post 211 and the outer peripheral edge of the base, that is, the clearance is large. Therefore, when the post 211 is fixed in such a manner that the rear side (c) contacts the outer peripheral edge of the substrate G, the substrate G and the post 2
11 can be maximized.

On the other hand, since the clearance between the upper part of the slope of the post 211 and the outer peripheral edge of the base is small on the front side (a), if the front side (a) is fixed so that the front side (a) contacts the outer peripheral edge of the substrate G, the post 211 is fixed. Therefore, the clearance between the substrate G dropped from the lift holder 177 and the upper portion of the post 211 is minimized. In the side surfaces (b) and (d), the clearance between the upper slope of the post 211 and the outer peripheral edge of the base is on the rear side (c).
Since the clearance varies between the front side and the front side (a) and the clearance changes according to the direction in which the post 211 is fixed, the post 211 can be fixed at an angle at which an optimal clearance can be obtained.

(Modification 3) Further, by mounting the post 211 as shown in FIGS. 18 and 19 in an eccentric state with respect to the spin chuck 210, the base portion and the set substrate G can be connected. The gap may be varied and the "play" between the base of the post 211 and the substrate G may be adjustable.

Next, the substrate holding mechanism (lifter) according to this embodiment will be described.

FIG. 20 is a plan view of a substrate holding mechanism (lifter) according to the present embodiment. FIG. 21 is a vertical sectional view of the substrate holding mechanism (lifter) cut along a plane passing through AA. FIG. 22 is a partially enlarged view of a vertical cross section of the substrate holding mechanism (lifter).

As shown in FIG. 20, the upper part of the substrate holding mechanism (lifter) 202 according to the present embodiment has a disk shape.
On this, three projections 220 are erected. And FIG.
As shown in FIG. 1, the upper surface on which the three projections 220 are provided is tapered toward the center, forming a shallow conical shape.

By forming the conical shape in this manner, even if water or the processing agent dripping onto the substrate holding mechanism (lifter) 202 from the back surface of the substrate G held on the substrate holding mechanism (lifter) 202, The light falls along the tapered portion and falls below the substrate holding mechanism (lifter) 202.

As shown in FIG. 21, a gas passage 222 is provided at the center of the substrate holding mechanism (lifter) 202 so as to extend vertically in the figure. The gas passage 222 is for passing a gas such as N ₂ gas supplied toward the lower surface of the substrate G held on the substrate holding mechanism (lifter) 202. As shown in FIG. The lower side of 222 is connected to a gas supply system (not shown).

As shown in FIGS. 20 to 22, the projection 220 is provided with an exhaust passage 221 opening upward.

As shown in FIG. 15, the exhaust passage 221 communicates with the exhaust device 222 via the motor 206.
When the exhaust passage 221 is exhausted, the substrate G is suction-held by the projection 220. The protrusion 220 is made of a corrosion-resistant resin (for example, Delrin) or ceramics. Note that the substrate holding mechanism 18 of the brush cleaning device 12 is
02.

Next, a cover for the high-pressure / ultrasonic cleaning device 13 according to the present embodiment will be described.

FIG. 23 is a diagram showing a schematic configuration of the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment and a cover 250 for the high-pressure / ultrasonic cleaning apparatus covering the upper part thereof.

As shown in FIG. 23, the cover for the high-pressure / ultrasonic cleaning apparatus according to the present embodiment (hereinafter, the “cover for the high-pressure / ultrasonic cleaning apparatus” is simply referred to as “cover”) 250
Can be moved up and down in the figure by an elevating mechanism (not shown).
When the substrate G is taken in and out of the ultrasonic cleaning device 13, the cover 250 is raised to separate the container G from the container 200 to form a gap so that the substrate G can be moved in and out.

FIG. 24 shows a conventional cover 250 and a container 200.
It is a perspective view which shows the positional relationship with respect to. As shown in FIG. 24, a notch 251 is provided in a part of the cover 250. The notch 251 functions as a work window (site) when performing maintenance management of the high-pressure / ultrasonic cleaning device 3, and is engaged with a part 200 a of the container 200. Each time the cover 250 is raised as shown in FIG.
1 appears.

However, even during normal operation other than maintenance and management, the notch 251 appears each time the cover 250 is raised.
There is a problem that there is a risk of being injured by being caught between the upper part 50 and the upper part 200a of the container 200.

Therefore, the cover 250 according to the present embodiment has improved this problem.

FIG. 25 shows a cover 250 according to this embodiment.
FIG. 4 is a perspective view showing a positional relationship between a cover 200 and a container 200 that engages with the cover 250.

As shown in FIG. 25, in the cover 250 according to the present embodiment, a transparent protective plate 252 is detachably attached to the notch 251. Therefore, the cover 250 is raised during the operation of the high-pressure / ultrasonic
Even if 1 is exposed, the notch 251 does not go into the released state,
The hand was not inadvertently pinched.

Further, since the protection plate 252 attached to the notch 251 is transparent, the inside state can be confirmed from the outside. If it is necessary to put a hand inside for maintenance and management, the protection plate 252 can be easily attached and detached, so that the protection plate 252 can be removed to perform necessary work. .

Alternatively, by attaching the upper portion of the protection plate 252 to the cutout portion 251 via a flexible component such as a hinge, if it is necessary to work with the hand inside the cover 200, It is also possible to open 252 so that a hand can be inserted through the notch 251.

As another example, as shown in FIG. 26, a transparent protective plate 252 such as an acrylic plate may be detachably mounted on the upper side of a part 200a of the container 200.

Also in this case, the function of monitoring the inside is ensured while reducing the risk of the notch 251.

Next, the sensor cover according to the present embodiment will be described.

FIG. 27 is a diagram schematically showing an exhaust / drainage system of the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment.

As shown in FIG. 27, a gas passage 260 through which gas flows is formed at the lower part of the container 200.
An exhaust system (not shown) is connected to the end of the gas flow path 260.

The exhaust system applies a negative pressure to the gas flow path 260. As a whole, gas flows from the upper part where the spin chuck 210 is attached to the lower part connected to the exhaust system. It is flowing.

The gas flow path 2 near the bottom of the container 200
A branch 60 is provided for gas-liquid separation. That is, the gas flow path 260 literally includes a flow path 261 for flowing a gas and a flow path 262 connected to the flow path 261 and leading to a drain that separates and discharges a liquid component such as moisture contained in the gas. It has branched.

In the flow path 262, a portion called a mist trap 263 is provided between the branch point and the liquid reservoir portion of the drain. The mist trap 263 is for preventing the liquid component in the gas from adversely affecting the temperature detecting portion of the temperature sensor S, and forms a small box-shaped area as shown in FIG. . This box-shaped area is actually in communication with the surrounding area, and the detection portion at the tip of the temperature sensor S is fixed substantially at the center of the box-shaped area.

The gas flowing into the flow path 262 from the upper portion of the container 200 has a large liquid component particle, that is, a mist trapped by the mist trap 263, and the gas having a relatively small amount of liquid component particles is removed by the temperature sensor S. Flow to the vicinity of the temperature detection part.

By the way, in the conventional high-pressure / ultrasonic cleaning apparatus, the detection portion at the tip of the temperature sensor S is attached to the mist trap 263 in a bare state. For this reason, a liquid component such as water accumulates at the tip portion, and there has been a problem that the exhaust gas temperature cannot be detected accurately.

The high-pressure / ultrasonic cleaning apparatus according to the present embodiment has been made to solve such a problem.

FIG. 28 is a partially enlarged vertical sectional view of the vicinity of the temperature sensor S mounting portion of the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment.

As shown in FIG. 28, in the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment, a protective cover 270 is provided around the pitot tube P at the tip of the temperature sensor S.

FIG. 29 is a perspective view of the temperature sensor protective cover 270 according to the present embodiment, and FIG. 30 is a vertical sectional view showing a state in which the temperature sensor protective cover 270 is mounted on the temperature sensor S.

As shown in FIG. 29, the protective cover 270 for a temperature sensor according to the present embodiment (hereinafter, the “protective cover for a temperature sensor” is simply referred to as a “protective cover”) has a hollow cylindrical shape. One end is opened, and the other end is provided with a through hole at the center for passing the pitot tube P of the temperature sensor S. Further, as shown in FIG. 30, a hole for draining water is formed in a side surface portion of the protective cover 270.

As described above, in the high-pressure / ultrasonic cleaning apparatus 13 according to the present embodiment, since the above-described protective cover 270 is attached to the tip of the temperature sensor S, liquid components such as water are contained in the pitot tube P. Is prevented from entering, and it is possible to prevent the water from clogging and hinder the temperature detection.

FIG. 31 is a sectional view showing another example of the protective cover 270.

In this protective cover 270, when assembling the temperature sensor unit U, the protective cover itself 270 is also fixed to the pedestal 271 of the temperature sensor. Therefore, the container 200
When attaching to the protective cover 270 together with the temperature sensor S
Also has the advantage that it can be integrally mounted as the temperature sensor unit U.

FIG. 32 is an exploded view showing a state in which the temperature sensor unit U is attached to the container 200.

As shown in FIG. 32, a sensor support 272 is mounted on the sensor mounting portion of the container 200, and the sensor support 272 is provided with a through hole 272a for passing a sensor.

To attach the temperature sensor unit U to the container 200, the through hole 272a of the sensor support 272 is required.
Into the protective cover at the tip of the temperature sensor unit U,
The pedestal 271 of the temperature sensor unit U is
Push it in until it hits 2.

Next, the pedestal 271 of the temperature sensor unit U is fixed to the sensor support 272 by a method such as screwing. Then, as shown in FIG.
By applying a caulking agent to the joint between the temperature sensor unit and the sensor support 272, the mounting of the temperature sensor unit U is completed.

Next, the rinsing liquid supply mechanism and the high-pressure water / ultrasonic cleaning mechanism will be described.

As shown in FIGS. 4 and 15, on both sides of the high-pressure / ultrasonic cleaning device 13, a nozzle unit 230 of a rinsing liquid supply mechanism and a nozzle unit 231 of a high-pressure water / ultrasonic cleaning mechanism are provided. . The two nozzle units 230 and 231 are moved in the Y-axis direction by a driving mechanism 232 so that the respective nozzle units 230 and 231 enter and exit the rinsing chamber 234 through the side opening 233. Is provided. In addition,
The nozzle units 230 and 231 extend in the X-axis direction.

The nozzle unit 230 has two nozzles 235. The nozzle 235 of each system is connected to the conduit 2
The two pressurizing pumps 237 are connected to a rinsing liquid supply source 238 through the respective pressurizing pumps 237. The rinsing liquid supply source 238 contains pure water as a rinsing liquid.

The nozzle unit 231 has two systems of nozzles 239 and 240. Nozzle 239 is connected to conduit 2
The nozzle 240 communicates with the high-pressure jet device 242 via the conduit 41 and the ultrasonic water flow supply device 244 via the conduit 243.
Is in communication with The high-pressure jet device 242 is 100 to 1
A supply source of high-pressure jet water of 50 kg / cm ² is incorporated. The ultrasonic water flow supply device 244 has a frequency of 1M.
A built-in oscillator for generating ultrasonic waves of Hz and a water supply source for flooding pure water. The frequency of the ultrasonic wave is 1M
Hz is preferable, but can be used within a range of 1 ± 2 MHz.

The rinsing liquid supply source 238, the pressure pump 237, the high-pressure jet device 242, and the ultrasonic water flow flooding device 244 are each controlled by the control device 100 based on a predetermined recipe.

In the substrate processing system configured as described above, the processing of the substrate G is performed as follows.

The substrate G in the cassette 2 transported from the previous process and placed in the cassette station C / S is first
After being taken out by the auxiliary arm 4, it is held by the main arm 3 via the transfer unit and transported to the brush cleaning device 12 of the cleaning unit SCR.

In the brush cleaning device 12, as shown in FIG. 3, the substrate G held at the carry-in position by the main arm 3 is sucked and held by the substrate holding mechanism 18 and lifted, and the main arm 3 is retracted in this state. . Next, the substrate holding mechanism 18 is lowered while rotating, and the substrate G is rotated by 90 degrees.
, And between the lower transport rolls 171, 171,.

Thereafter, the substrate G is transported between the front surface cleaning brush 16 and the rear surface cleaning brush 17, and a rinsing liquid such as pure water is jetted while rotating these brushes. Then, the motor is rotated forward and reverse alternately, for example, 0.0
The substrate G is slowly moved back and forth at a speed of about 5 m / min to 0.15 m / min to clean (scrub) the substrate G.

At this time, if the cleaning time is long according to the preset cleaning time, the substrate G may be reciprocated many times to perform the cleaning. Even after the front surface cleaning brush 16 and the back surface cleaning brush 17 are separated from the substrate G, the substrate G may be rinsed by continuing the flow of the cleaning liquid. After cleaning, the substrate G is lifted by the lift holder 177 into the rinsing chamber 2 of the high-pressure / ultrasonic cleaning apparatus 13.
34.

In the high-pressure / ultrasonic cleaning apparatus 13, as shown in FIG. 15, the substrate G located at the carry-in height L is suction-held while the substrate holding mechanism (lifter) 202 is raised to the height of H and lifted. In this state, the lift holder 177 is retracted. Then, the substrate holding mechanism (lifter) 202 is lowered to transfer the substrate G to the spin chuck 210.

Thereafter, the nozzle unit 231 is moved above the substrate G, and one or both of a high-pressure jet water flow and an ultrasonic water flow are supplied to the substrate G to perform a cleaning process. At this time, the processing is performed while rotating the substrate G at a low speed.
The pressure of the high-pressure jet water flow is 100 to 150 kg /
cm ² and its maximum flow rate is 0.5 l / min. Further, the oscillation of the ultrasonic wave is stopped, and the water pressure is 10 to 20.
The substrate G may be rinsed under the conditions of Kg / cm ² and a flow rate of 2 to 10 liter / min.

Next, the nozzle unit 231 is moved to the rinsing chamber 2.
34, and the nozzle unit 230 is moved to the rinsing chamber 2
34. And water pressure of 10 to 20 kg / cm
^{2. The} substrate G is rinsed with pure water at a flow rate of 2 to 10 L / min. In the case of this rinsing treatment, the water pressure may be as low as 1-2 kg / cm ² .

When the above-mentioned cleaning process is completed, the substrate G is rotated at a high speed to perform drying, and the nozzle unit 2 is rotated.
31 is returned to the standby position. When the drying is completed, the substrate G is lifted to the position H by the substrate holding mechanism 202, the main arm 3 is inserted under the substrate G, and then the substrate holding mechanism (lifter) 202 is lowered to move the substrate G to the main position. Transfer it to Arm 3.

Thereafter, the substrate G is transported to the heating device HP, where it is dried, and then the adhesion processing device AD
Hydrophobic treatment, cooling by cooling device COL,
The resist coating by the photoresist coating device COT and the baking process by the heating device HP are sequentially performed. After that, the wafer is conveyed to an exposure device (not shown). After being exposed here, the developing device DEV performs a developing process, and is conveyed by the main arm 3 to the cassette station C / S.

In the cleaning apparatus according to the present embodiment, the upper transport rolls 172, 172,...
Because it is pressed toward the center of 1,171, ...
If the transport path of the substrate G is likely to be shifted from the center of the upper transport rolls 172, 172,... Or the lower transport rolls 171, 171,. Therefore, the upper transport rolls 172, 172,.
71, 171,... Can be passed through.

Further, in the cleaning apparatus according to the present embodiment, since the posts provided at the four corners of the spin chuck have a tapered shape, the operation when setting the substrate from the transfer arm to the spin chuck is omitted. It can be done smoothly.

Further, in the cleaning apparatus according to the present embodiment, the brush cleaning unit and the high-pressure cleaning unit are positioned using a pair of fitting members between the brush cleaning unit and the high-pressure cleaning unit. With the structure, it is possible to adjust the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit so as to be optimal.

Further, since the cleaning apparatus according to the present embodiment is provided with the lifter having the tapered portion at the center of the upper surface, even if the processing agent or water drips from the lower surface of the substrate, it passes along the tapered portion. Since it flows away to the container side, the processing agent and water do not drop onto each part of the apparatus from the lower surface of the substrate during the transfer of the substrate, thereby causing no electrical trouble.

Further, in the cleaning treatment apparatus according to the present embodiment, since a cylindrical tubular protective cover is provided on the pitot tube at the tip of the temperature sensor, the treating agent and water affect the detecting portion of the sensor and cause the sensor to be damaged. It does not hinder temperature detection.

Further, in the cleaning apparatus according to the present embodiment, since the cover is removably provided in the notch at the top of the lid, maintenance can be performed safely and easily.

In addition, in the cleaning apparatus according to the present embodiment, the substrate G is sandwiched and transported between the upper and lower transport rolls, and is moved between the front surface cleaning brush 16 and the rear surface cleaning brush 17 to move the substrate G. Since cleaning is performed, cleaning can be performed for a desired time without increasing the size of the apparatus.
It is possible to improve the space factor and the flexibility of the cleaning process.

Further, since the cleaning and prevention of drying can be performed without applying high-pressure pure water or the like used for cleaning the substrate G to the front surface cleaning brush 16 and the rear surface cleaning brush 17, the front surface cleaning brush 16 and the rear surface can be water-pressured. The deformation and the like of the cleaning brush 17 can be prevented, and the maintenance frequency can be reduced and the running cost can be reduced by extending the life of the brush.

Note that the present invention is not limited to the above embodiment.

In the above-described embodiment, the cleaning apparatus for cleaning the glass substrate G for LCD has been described. However, it is needless to say that the present invention can be applied to a thermal cleaning unit for silicon wafers.

[0184]

As described above in detail, according to the first aspect of the present invention, the substrate to be processed is pressed in the second direction orthogonal to the first direction to shift in the second direction. Is provided, the substrate can be surely passed through the central portion of the transport roll without being displaced in the axial direction of the transport roll or rattling.

According to the second aspect of the present invention, a side guide roll is disposed opposite to the left and right sides in the moving direction of the substrate, and movably sandwiches the substrate between a pair of left and right side guide rolls facing each other. Since the pair is provided, the substrate can be surely passed through the center portion of the transport roll without being deviated or rattled in the axial direction of the transport roll. In addition, since the portion in contact with the edge of the substrate is a roll, little frictional force acts on the edge of the substrate, and the substrate is not damaged.

According to the third aspect of the present invention, the post holding the four corners of the substrate to be processed has a tapered shape, so that the operation for setting the substrate from the transfer arm to the spin chuck can be performed smoothly. It can be carried out.

According to the fourth aspect of the present invention, in the spin chuck according to the third aspect, since the post is disposed in an eccentric cam shape with respect to the spin chuck body, the post is employed. By rotating the post, the gap between the end of the substrate set on the spin chuck and the post can be changed, and the gap can be appropriately adjusted to the most appropriate size.

According to the fifth aspect of the present invention, the posts holding the four corners of the substrate to be processed are formed on the columnar base, and are formed on the base, and are inclined with respect to the axis of the base. Since it has an inclined conical part having an axis, by rotating this post, the clearance between the end of the substrate falling on the spin chuck and the post can be changed,
The contact between the substrate and the post can be appropriately adjusted.

According to the sixth aspect of the present invention, since the posts holding the four corners of the substrate to be processed have a tapered shape, the operation when setting the substrate from the transfer arm to the spin chuck can be performed smoothly. It can be carried out.

According to the seventh aspect of the present invention, the entire cleaning device is divided into a brush cleaning unit and a high-pressure cleaning unit, and the brush cleaning unit is positioned using the means for positioning the brush cleaning unit and the high-pressure cleaning unit. Since the structure is such that the unit and the high-pressure cleaning unit can be positioned, the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit can be adjusted to be the most appropriate position.

According to the present invention, the center of the transport roll and the rotation axis of the spin chuck are aligned with each other by using the positioning means for positioning between the brush cleaning unit and the high-pressure cleaning unit. Since the positioning is performed so as to line up with each other, it is possible to adjust the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit to be the most appropriate position.

According to the ninth aspect of the present invention, in the cleaning apparatus according to the eighth aspect, a pair of fitting members provided as the positioning means between the brush cleaning unit and the high-pressure cleaning unit. Is employed, the positional relationship between the transport roll of the brush cleaning unit and the spin chuck of the high-pressure cleaning unit can be easily and accurately adjusted.

According to the tenth aspect of the present invention, since the lifter for vertically moving the substrate to be processed is provided with a lifter having a tapered portion at least in the center of the upper surface, the processing agent or water drips from the lower surface of the substrate. However, since it flows down to the container side along the tapered portion, liquid does not remain on the lower surface of the substrate. Therefore, it is possible to prevent a treating agent or water from dripping from the lower surface of the substrate to each part of the apparatus during the transportation of the substrate, thereby causing an electrical trouble.

According to the eleventh aspect of the present invention, since the lifter for vertically moving the substrate to be processed is provided with a lifter having a tapered portion at least in the center of the upper surface, the processing agent or water drips from the lower surface of the substrate. However, since it flows down to the container side along the tapered portion, the liquid droplet does not adhere to the lower surface of the substrate. Therefore, it is possible to prevent a treating agent or water from dripping from the lower surface of the substrate to each part of the apparatus during the transportation of the substrate, thereby causing an electrical trouble.

According to the twelfth aspect of the present invention, the tenth aspect
In addition to the spin chuck and the cleaning device according to claim 11, the gas is ejected from the opening provided at the top of the lifter toward the lower surface of the substrate, so that the liquid droplets are more reliably formed on the lower surface of the substrate. Adherence is prevented.

According to the thirteenth aspect of the present invention, since the cylindrical tubular protective cover is provided around the pitot tube at the tip of the temperature sensor provided in the mist trap portion of the container, the treatment agent and water can be prevented. Is prevented from affecting the detection unit of the sensor and hindering the temperature detection of the sensor.

According to the fourteenth aspect of the present invention, since the cover is detachably provided in the notch at the top of the lid, maintenance can be performed safely and easily.

In addition, according to the cleaning apparatus of the present invention,
The cleaning can be performed for a desired time without increasing the size of the apparatus, and the space factor and the flexibility of the cleaning process can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a coating and developing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a coating and developing apparatus according to the embodiment of the present invention.

FIG. 3 is a vertical sectional view schematically showing a cleaning apparatus according to the embodiment of the present invention.

FIG. 4 is a plan view schematically showing a cleaning apparatus according to an embodiment of the present invention.

FIG. 5 is a vertical sectional view schematically showing a scrubber according to the embodiment of the present invention.

FIG. 6 is a vertical sectional view schematically showing a transport roll of the scrubber according to the embodiment of the present invention.

FIG. 7 is a plan view schematically showing a scrubber according to the embodiment of the present invention.

FIG. 8 is a view showing a side guide roll according to the embodiment of the present invention.

FIG. 9 is a view showing a lift holder according to the embodiment of the present invention.

FIG. 10 is a partially enlarged view of the lift holder according to the embodiment of the present invention.

FIG. 11 is a partially enlarged view of the lift holder according to the embodiment of the present invention.

FIG. 12 is a diagram schematically showing a drive system of the cleaning brush according to the embodiment of the present invention.

FIG. 13 is a vertical sectional view of the cleaning brush according to the embodiment of the present invention.

FIG. 14 is a plan view showing a joined state of the scrubber unit and the high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 15 is a diagram showing an outline of a high-pressure / ultrasonic cleaning unit according to an embodiment of the present invention.

FIG. 16 is a plan view of the high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 17 is a partially enlarged view of the spin chuck according to the embodiment of the present invention.

FIG. 18 is a diagram showing the front, back, side, and top of the post according to the embodiment of the present invention.

FIG. 19 is a diagram showing the front, back, side, and top surfaces of a post according to a modification of the embodiment of the present invention.

FIG. 20 is a plan view of a lifter according to the embodiment of the present invention.

FIG. 21 is a vertical sectional view of a lifter according to the embodiment of the present invention.

FIG. 22 is a partially enlarged view of a vertical cross section of the lifter according to the embodiment of the present invention.

FIG. 23 is a vertical sectional view schematically showing a high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 24 is a perspective view showing an open / closed state of a lid of a conventional high-pressure / ultrasonic cleaning apparatus.

FIG. 25 is a perspective view showing an open / closed state of a lid of the high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 26 is a perspective view showing an open / closed state of a lid of a high-pressure / ultrasonic cleaning unit according to a modification of the embodiment of the present invention.

FIG. 27 is a diagram schematically showing an exhaust / drainage system in the high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 28 is a partially enlarged view showing a mist trap section of the high-pressure / ultrasonic cleaning unit according to the embodiment of the present invention.

FIG. 29 is a perspective view showing a temperature sensor protective cover according to an embodiment of the present invention.

FIG. 30 is a vertical sectional view showing a mounted state of the protective cover for a temperature sensor according to the embodiment of the present invention.

FIG. 31 is a vertical sectional view showing a mounted state of a protective cover for a temperature sensor according to a modification of the embodiment of the present invention.

FIG. 32 is an exploded view showing a mounted state of a temperature sensor protective cover according to a modification of the embodiment of the present invention.

FIG. 33 is a plan view showing a scrubber portion of a conventional cleaning device.

[Explanation of symbols]

 G Substrate 172 Upper transfer roll 171 Lower transfer roll 16 Surface cleaning brush 17 Back cleaning brush 178 Side guide roll 210 Spin chuck 211 Post 192, 193 Fitting pin 252, 253 Fitting hole 202 Lifter 200 Container 263 Mist trap S Temperature sensor P Pitot tube 270 Protective cover 250 Lid 251 Notch 252 Protective plate

Continued on the front page (72) Inventor Seiichi Tagami 272, Oomachi, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture 4 Tokyo Electron Kyushu Co., Ltd. Otsu Office (72) Inventor Hitomi Mori 2655, Tsukure, Kikuyo-cho, Kikumoto-gun Address Tokyo Electron Kyushu Co., Ltd.Kumamoto Office (72) Inventor Jiro Tominaga 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Corporation Kumamoto Office, 2655 Address Tokyo Electron Kyushu Co., Ltd. Kumamoto Office F-term (reference) 3B201 AA02 AB14 AB23 AB34 AB42 AB47 AB50 BA02 BA13 BB32 BB84 BB85 BB93 CB22 CC12 5F031 CC01 CC04 CC12 CC20 KK02

Claims (14)

[Claims] 1. A means for moving a substrate to be processed in a first direction parallel to the surface, a means for cleaning the substrate to be processed, and pressing the substrate to be processed in a second direction orthogonal to the moving direction. Means for correcting the displacement in the second direction. 2. A plurality of upper transport rolls arranged in parallel with each other and in a row, and a plurality of upper transport rolls arranged below and in parallel with each other and in a row to transfer a substrate to be processed between the upper transport rolls. A plurality of lower transport rolls for nipping and transporting; a means for cleaning the moving substrate to be processed; and a pair of left and right side rolls disposed opposite to each other on the left and right sides in the moving direction of the substrate to be processed. A cleaning apparatus, comprising: at least a pair of side guide rolls for movably holding a processing substrate. 3. A spin chuck main body on which a substrate to be processed is mounted, and a post which has four tapered corners for holding four corners of the substrate to be processed mounted on the spin chuck main body. A spin chuck, comprising: 4. The spin chuck according to claim 3, wherein the post is disposed in an eccentric cam shape with respect to the main body of the spin chuck. 5. A spin chuck body on which a substrate to be processed is mounted, and a post holding four corners of the substrate mounted on the spin chuck body, the column base being:
A post formed on the base and having an inclined conical portion having an axis inclined with respect to the axis of the base. 6. A spin chuck main body on which a substrate to be processed is mounted, and a post which has four tapered corners for holding four corners of the substrate to be processed mounted on the spin chuck main body. A cleaning device, comprising: means for rotating the spin chuck; and means for cleaning the substrate to be processed. 7. A brush cleaning unit for performing brush cleaning on a substrate to be processed, a high-pressure cleaning unit for performing high-pressure cleaning on the substrate to be processed, a unit for performing positioning between the brush cleaning unit and the high-pressure cleaning unit, A cleaning device comprising: 8. A brush cleaning unit including a transport roll for transporting the substrate to be processed, a brush cleaning mechanism for abutting a cleaning brush on the substrate to be processed, a spin chuck for placing the substrate to be processed, A high-pressure cleaning unit having a high-pressure cleaning mechanism for performing high-pressure cleaning on the substrate to be processed; and a brush cleaning unit and a high-pressure cleaning unit such that the center of the transport roll and the rotation axis of the spin chuck are aligned. A positioning device for performing positioning between the cleaning device and the cleaning device. 9. The cleaning apparatus according to claim 8, wherein said positioning means is a set of fitting members provided between said brush cleaning unit and said high-pressure cleaning unit. Cleaning equipment. 10. A spin chuck main body on which a substrate to be processed is mounted, and a lifter which engages with a central portion of the spin chuck main body and moves the substrate to be processed up and down. And a lifter provided with the spin chuck. 11. A spin chuck main body on which a substrate to be processed is mounted, and a lifter which engages with a center portion of the spin chuck main body and moves the substrate to be processed up and down. A spin chuck having a lifter, a container accommodating the spin chuck, means for rotating the spin chuck, and means for supplying a cleaning agent to the substrate to be processed at a high pressure. Characterized cleaning equipment. 12. A spin chuck main body on which a substrate to be processed is mounted, and a gas passage disposed so as to be able to protrude and retract from a center portion of the spin chuck main body and penetrating from a taper portion at an upper surface center and from a bottom to a top. A spin chuck having a lifter; a container for accommodating the spin chuck; a unit for rotating the spin chuck; a unit for supplying a cleaning agent to the substrate to be processed at a high pressure; and a gas supply to the gas passage. A cleaning device, comprising: 13. A high-pressure cleaning mechanism for supplying a cleaning agent at a high pressure to a rotated substrate to be processed for cleaning, a container for accommodating the high-pressure cleaning mechanism, and a temperature sensor disposed in a mist trap portion of the container. And a cylindrical protective cover disposed around the pitot tube at the tip of the temperature sensor. 14. A high-pressure cleaning mechanism for supplying a cleaning agent at a high pressure to the rotated substrate to be cleaned to clean the substrate, a container accommodating the high-pressure cleaning mechanism, a lid covering an upper part of the container, A protection plate detachably provided in the notch;