JP3335904B2 - Coating device and coating method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a coating apparatus for applying a processing agent such as a resist solution onto a glass substrate for an LCD in a manufacturing process of a liquid crystal display (hereinafter, this liquid crystal display is referred to as "LCD"). And an application method.

[0002]

2. Description of the Related Art Conventionally, glass substrates for LCDs (hereinafter referred to as LCD substrates) have been used.
In order to apply a processing agent such as a resist solution onto the LCD glass substrate (hereinafter simply referred to as “substrate”), a method called “spin coating method” was generally used. In this spin coating method, the substrate is rotated at high speed in a horizontal plane,
In this method, a resist solution is dropped near the rotation center, applied to the entire substrate by centrifugal force of the substrate, and excess resist solution is shaken off by centrifugal force and thinned.

According to this spin coating method, although there is an advantage that the coating can be performed by a coating apparatus having a relatively simple structure, the resist liquid is applied to unnecessary portions in order to spread the resist liquid over the entire substrate. There is a problem that a large amount of the resist solution is wasted as compared with the resist solution used for actually forming the resist film.

[0004] Further, as the degree of integration of semiconductor elements formed on a substrate increases, it is required to reduce the thickness of a resist coating film. Since it is determined by the viscosity and the rotation speed of the glass substrate, there is naturally a limit to thinning.

Therefore, various proposals have been made to solve the problems of the spin coating method.

For example, Japanese Patent Application Laid-Open No. 5-13320 discloses that "a liquid supply nozzle for supplying a processing liquid from a large number of pores is arranged so as to be close to the surface of a substrate to be processed, and a liquid supply nozzle is provided from the large number of pores of the liquid supply nozzle. And a processing liquid application method for applying a processing liquid to a surface of a substrate to be processed by supplying the processing liquid to the substrate to be processed in the form of a liquid film, and relatively moving the substrate to be processed and the liquid supply nozzle. ing. According to this method, there is an advantage that a small amount of liquid can be applied efficiently.

Japanese Patent Application Laid-Open No. 3-77674 discloses that, in a method of applying a liquid to the surface of a rectangular substrate, the liquid is supplied linearly to one end of the substrate, and then the substrate is perpendicular to the liquid supply line. Coating method of linearly moving in a direction ". According to this method, the liquid can be applied uniformly.

Further, Japanese Patent Application Laid-Open No. 60-89925 discloses that
"Forming a viscous liquid comprising a photoresist and a solvent, preparing a circuit element having an etchable thin film surface, and flexing the viscous liquid at a predetermined distance above the etchable thin film surface. Forming the conductive thin film horizontally and contacting the etchable thin film surface while moving the possible thin film at a first speed; and moving the circuit element at a second speed greater than the first speed to provide flexibility. Depositing a thin film on an etchable thin film surface while pulling the thin film ". According to this method, there is an advantage that a processing agent film having a uniform and thin film thickness can be formed on a long substrate wound with a roll.

[0009]

However, in Japanese Patent Application Laid-Open No. Hei 5-13320, a circular silicon wafer as a substrate to be processed is rotated with respect to a nozzle, so that the present invention is applied to a rectangular LCD glass substrate. In such a case, it is not possible to efficiently apply the entire substrate without waste.

In Japanese Patent Application Laid-Open No. 3-77674, since one slit-like slit is formed in the slit nozzle, the rigidity of the slit nozzle is reduced, and the distance between the slit nozzle and the substrate may be reduced. There is a problem that the film thickness is affected. Further, as a method for reducing the film thickness, there is a method disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 60-89925, but this method has the following problems.

In this structure, the film thickness is reduced by pulling the viscous liquid between the die head (nozzle) and the substrate (substrate to be processed) while holding it between the die head (nozzle) and the substrate (substrate to be processed). Therefore, the film thickness varies depending on the distance between the die head (nozzle) and the substrate (substrate to be processed).
Therefore, it is necessary to control these intervals with high accuracy, and precise control is required.

Also, since the amount of the viscous liquid discharged from the die head (nozzle) directly affects the film thickness, it is necessary to control the discharged amount with high precision.

Furthermore, since the dimensional accuracy of the width of the slit of the die head directly affects the film thickness, it is necessary to form a slit having a high dimensional accuracy of the slit width.

Further, since the slit formed in the die head has a shape that is continuous in one horizontal character, it becomes more difficult to maintain the rigidity of the slit forming portion of the die head as the slit width becomes larger. It becomes difficult to form a coating film.

Further, in this method, since the pulling speed is higher than the discharging speed of the viscous liquid, the use of a viscous liquid is indispensable, and a low-viscosity treating agent cannot be used. Therefore, high precision is required for the viscosity management of the processing agent.

The present invention has been made to solve the above problems.

That is, an object of the present invention is to provide a coating apparatus and a coating method which can selectively apply a processing agent to a portion where application of the processing agent is required.

Another object of the present invention is to provide a coating apparatus and a coating method which can use a wide range of processing agents such as the viscosity and type of the processing agent.

It is a further object of the present invention to provide a coating apparatus and a coating method capable of alleviating the required mechanical accuracy, such as the gap between the processing agent nozzle and the substrate to be processed and the dimensional accuracy of the nozzle to some extent.

[0020]

According to a first aspect of the present invention, there is provided a coating apparatus for holding a substrate to be processed.
A member, the member being directed to a surface of the substrate to be processed, and
At predetermined intervals over a first direction across the substrate surface
A plurality of processing agent nozzles provided, and
A processing agent supply system for supplying the processing agent, and a processing agent different from the first direction.
Disposed in the second direction, wherein the holding member or the processing
A guide for movably supporting an agent nozzle, and the holding member
And a moving system for relatively moving the processing agent nozzle,
The processing agent supply system and the moving system are driven synchronously.
And a standby position adjacent to the holding member.
The processing agent nozzle is disposed at the standby position at
A pressure sensor for detecting a discharge pressure of the agent nozzle;
Operating state of each of the processing agent nozzles based on
And a monitoring device for monitoring .

According to a second aspect of the present invention, there is provided a coating apparatus comprising: a holding member for holding a substrate to be processed;
A predetermined distance over a first direction across the surface of the substrate to be processed
A plurality of processing agent nozzles provided for each interval, the processing agent
A treatment agent supply system for supplying a treatment agent to a nozzle;
Disposed in a second direction different from the direction, the holding member or
A guide movably supporting the treatment agent nozzle,
A transfer for relatively moving the holding member and the processing agent nozzle.
A dynamic system, a swing mechanism disposed on the holding member,
The agent supply system, the moving system and the swing mechanism are driven in synchronization.
A control unit to be moved, and a standby position next to the holding member.
Disposed on the surface facing the processing agent nozzle at the standby position.
A pressure sensor for detecting the discharge pressure of each processing agent nozzle,
The operation of each of the processing agent nozzles is performed based on the detected discharge pressure.
A monitoring device for monitoring the operating state .

According to a third aspect of the present invention, there is provided the coating apparatus according to the second aspect.
A cloth device, wherein the swinging mechanism is configured to process the holding member;
The actuator or spin
Chuck and the motor that drives this spin chuck
There is a feature .

According to a fourth aspect of the present invention, there is provided a coating apparatus , comprising: a holding member for holding a substrate to be processed;
A predetermined distance over a first direction across the surface of the substrate to be processed
A plurality of processing agent nozzles provided for each interval, the processing agent
A treatment agent supply system for supplying a treatment agent to a nozzle;
Disposed in a second direction different from the direction, the holding member or
A guide movably supporting the treatment agent nozzle,
A transfer for relatively moving the holding member and the processing agent nozzle.
Dynamic system, upstream of the processing agent nozzle in the moving direction of the substrate to be processed
A solvent nozzle provided next to the
Solvent supply system to supply, the treatment agent supply system, and the solvent supply
A control unit for driving the system and the moving system in synchronization with each other;
A standby position adjacent to the holding member and a position in front of the standby position.
The processing agent nozzles are disposed on the surface facing the processing agent nozzles.
A pressure sensor for detecting the output pressure, and a pressure sensor for detecting the output pressure.
Monitoring device for monitoring the operation state of each of the processing agent nozzles
And a device.

According to a fifth aspect of the present invention, there is provided a coating apparatus for holding a substrate to be processed.
A holding member, which is directed toward the surface of the substrate to be processed, and
A predetermined distance over a first direction across the surface of the substrate to be processed
A plurality of processing agent nozzles provided for each interval, the processing agent
A treatment agent supply system for supplying a treatment agent to a nozzle;
Disposed in a second direction different from the direction, the holding member or
A guide movably supporting the treatment agent nozzle,
A transfer for relatively moving the holding member and the processing agent nozzle.
Dynamic system, and the downstream side of the processing agent nozzle in the moving direction of the substrate to be processed.
A gas nozzle adjacent to the
A gas supply system for supplying a gas containing
System, the gas supply system, and the moving system are driven synchronously.
A control unit to be moved, a standby position provided next to the holding member,
The processing agent nozzle is disposed on the surface facing the processing agent nozzle at the standby position.
A pressure sensor for detecting the discharge pressure of the processing agent nozzle;
The operating state of each of the processing agent nozzles based on the discharged discharge pressure
And a monitoring device for monitoring .

According to a sixth aspect of the present invention, the coating apparatus holds a substrate to be processed.
A holding member, which is directed toward the surface of the substrate to be processed, and
A predetermined distance over a first direction across the surface of the substrate to be processed
A plurality of processing agent nozzles provided for each interval, the processing agent
A treatment agent supply system for supplying a treatment agent to a nozzle;
Disposed in a second direction different from the direction, the holding member or
A guide movably supporting the treatment agent nozzle,
A transfer for relatively moving the holding member and the processing agent nozzle.
The dynamic system and the substrate to be processed held by the holding member are heated.
Heater, and the processing agent supply system and the moving system are synchronized.
And a control unit for driving the holding member.
And the processing agent nozzle at the standby position.
Pressure sensor that detects the discharge pressure of each processing agent nozzle
And each of the processing agent nozzles based on the detected discharge pressure
And a monitoring device for monitoring the operating state of the device .

[0026]

According to a seventh aspect of the present invention, there is provided the coating apparatus, wherein the holding member holds the substrate to be processed, and is provided at predetermined intervals in a first direction crossing the surface of the substrate to be processed and directed to the surface of the substrate to be processed. A plurality of processing agent nozzles, a processing agent supply system for supplying the processing agent to the processing agent nozzle, and a second direction different from the first direction, the holding member or the processing agent nozzle being movable. A guide that supports the processing member, a moving system that relatively moves the holding member and the processing agent nozzle, a processing unit supply system, and a control unit that synchronously drives the moving system , Processing agent nozzle
Arranged in two or more rows along the moving direction of the substrate to be processed
And how to move the substrate to be processed between adjacent processing agent nozzles.
The processing agent nozzle on the downstream side is
And two adjacent nozzles on the upstream side in the moving direction of the substrate to be processed.
It is characterized by being arranged between the.

The coating apparatus of claim 8, a holding member for holding a substrate to be processed is directed to the surface of the substrate to be processed, provided at predetermined intervals over a first direction transverse to the surface of the substrate to be processed A plurality of processing agent nozzles, a processing agent supply system for supplying the processing agent to the processing agent nozzle, and a second direction different from the first direction, the holding member or the processing agent nozzle being movable. , A moving system for relatively moving the holding member and the processing agent nozzle, a swing mechanism provided on the holding member, the processing agent supply system, the moving system, and the shaking device. A control unit for driving a moving mechanism in synchronization with the processing agent nozzle,
The two or more rows are arranged along the moving direction of the substrate to be processed.
Between the adjacent processing agent nozzles in the moving direction of the substrate to be processed.
The processing agent nozzle on the downstream side, with respect to the moving direction of the substrate to be processed,
Between two adjacent nozzles on the upstream side of the substrate movement direction
It is characterized by being arranged in .

The coating device according to a ninth aspect is the coating device according to the eighth aspect , wherein the oscillating mechanism is an actuator (vibrating body) provided at a portion of the holding member abutting on the substrate to be processed.
Alternatively, it is a spin chuck and a motor for driving the spin chuck.

According to a tenth aspect of the present invention, there is provided the coating apparatus, wherein the holding member holds the substrate to be processed, and is directed to a surface of the substrate to be processed.
A plurality of treatment agent nozzles provided at predetermined intervals in a first direction across the surface of the substrate to be treated, a treatment agent supply system for supplying a treatment agent to the treatment agent nozzle,
A guide disposed movably supporting the holding member or the processing agent nozzle, and a moving system for relatively moving the holding member and the processing agent nozzle, A solvent nozzle provided adjacent to the processing agent nozzle on the upstream side in the moving direction of the substrate to be processed, a solvent supply system for supplying a solvent to the solvent nozzle, the processing agent supply system, the solvent supply system, and the movement system are synchronized. A control unit for driving
Wherein the processing agent nozzle moves the substrate to be processed.
Two or more rows are arranged along the direction,
Between the nozzles, the processing agent nozzle on the downstream side in the substrate movement direction
Is the moving direction of the substrate to be processed.
It should be located between two adjacent nozzles on the upstream side.
And features .

[0031] The coating apparatus according to the eleventh aspect is directed to a holding member for holding the substrate to be processed, and a holding member that faces the surface of the substrate to be processed.
A plurality of treatment agent nozzles provided at predetermined intervals in a first direction across the surface of the substrate to be treated, a treatment agent supply system for supplying a treatment agent to the treatment agent nozzle,
A guide disposed movably supporting the holding member or the processing agent nozzle, and a moving system for relatively moving the holding member and the processing agent nozzle, A gas nozzle provided adjacent to the processing agent nozzle on the downstream side of the substrate to be processed in the moving direction of the processing agent, a gas supply system for supplying a gas containing a solvent vapor to the gas nozzle, the processing agent supply system, the gas supply system, and A control unit for synchronously driving a moving system , wherein the processing agent nozzle is
Two or more rows are arranged along the moving direction of the processing substrate,
Between the adjacent processing agent nozzles, downstream in the substrate movement direction
The processing agent nozzle on the side moves the substrate in the moving direction of the substrate to be processed.
Between two adjacent nozzles on the upstream side in the substrate movement direction.
It is characterized by being provided .

A coating apparatus according to a twelfth aspect of the present invention is directed to a holding member for holding a substrate to be processed, and a holding member that faces the surface of the substrate to be processed.
A plurality of treatment agent nozzles provided at predetermined intervals in a first direction across the surface of the substrate to be treated, a treatment agent supply system for supplying a treatment agent to the treatment agent nozzle,
A guide disposed movably supporting the holding member or the processing agent nozzle, and a moving system for relatively moving the holding member and the processing agent nozzle, comprising a heater for heating the target substrate held by the holding member, the processing agent supply system, and a control unit for driving and synchronizing the mobile system, the treatment agent nozzle
Are arranged in two or more rows along the moving direction of the substrate to be processed.
Substrate between adjacent processing agent nozzles
The processing agent nozzle on the downstream side in the movement direction
With respect to two adjacent nozzles on the upstream side in the moving direction of the substrate to be processed.
It is characterized in that it is arranged between slurs .

[0033] The coating apparatus of claim 13 is the first to twelfth aspect of the invention.
The coating device according to claim 1, wherein the holding member is a spin chuck that rotatably holds the substrate to be processed and is connected to a rotation shaft of a motor, and the control unit supplies the substrate to the substrate to be processed. It is a control unit for controlling the rotation speed of the motor so that the applied processing agent is uniformly thinned.

[0034]

The coating apparatus of claim 14 is the coating apparatus of claims 1 to 13
The spacing between the processing agent nozzles is such that processing agents supplied from adjacent processing agent nozzles are integrated on the substrate to be processed to form a processing agent layer having a uniform film thickness. It is characterized in that it is a suitable interval.

[0036] The coating apparatus of claim 15 is the coating apparatus of claims 1 to 14.
Wherein the treatment agent supply system is a treatment agent supply system that supplies the treatment agent at a speed V1, and the moving system moves the holding member and the treatment agent nozzle at a speed V2. The speed V1 and the speed V2 satisfy a relationship of V1 ≧ V2 (1).

[0037]

[0038] The coating apparatus of claim 16 is the first to fifteenth aspect.
Wherein the processing agent nozzle is a fine round hole.

The coating apparatus of claim 17 is the first to fifteenth aspect.
Wherein the processing agent nozzle is a slit extending in the moving direction of the substrate to be processed.

The coating method according to claim 18 is a step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of the substrate to be processed, and connecting the processing agent by swinging the substrate to be processed. A coating method, comprising:
After supplying the processing agent to the substrate to be processed, the processing agent nozzle is melted.
Moving to the position of the agent bath, and the processing agent nozzle
Washing the solvent with a solvent, and placing the treating agent nozzle in a standby position.
To the processing agent nozzle and a dummy disk
Performing a spence, and
Detecting the discharge pressure of each processing agent nozzle at the time of
If the discharged discharge pressure is lower than a predetermined value, the treatment agent
Move the nozzle to the solvent bath and clean again.
And a step of performing the above.

According to a nineteenth aspect of the present invention , there is provided a coating method comprising the steps of: supplying a processing agent to a plurality of positions at predetermined intervals on the surface of the substrate; and rotating the substrate to uniformly thin the processing agent. Performing the coating method.
After supplying the processing agent to the processing substrate, the processing agent nozzle is
Moving the treatment agent nozzle to a bath position,
Cleaning with a solvent and moving the treatment agent nozzle to a standby position.
And moving the dummy nozzle to the processing agent nozzle.
A step of performing dispensing, and a step of performing the dummy dispensing.
Detecting the discharge pressure of each processing agent nozzle of the above, the detection
If the discharged pressure is lower than a predetermined value, the processing agent
Move the spill to the position of the solvent bath and wash it again.
And a step .

According to a twentieth aspect of the present invention , there is provided the coating method , comprising: supplying a solvent to the surface of the substrate to be processed;
A step of supplying a processing agent to a plurality of positions separated by a predetermined interval,
A coating method comprising: treating the substrate to be processed.
After supplying the agent, move the treating agent nozzle to the position of the solvent bath.
Moving the treatment agent nozzle with a solvent.
Moving the treatment agent nozzle to a standby position
And cause the processing agent nozzle to perform dummy dispensing.
Process and each treatment agent nozzle during the dummy dispensing
Detecting the discharge pressure, and determining whether the detected discharge pressure is
If the value is lower than the value of
And cleaning again after moving to the position of the substrate .

According to a twenty-first aspect of the present invention, in the coating method, a step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of the substrate to be processed, and a step of supplying a gas containing a solvent vapor to the surface of the substrate to be processed. And a coating method comprising:
After the processing agent is supplied to the processing substrate, the processing agent nozzle is
And dissolving the treatment agent nozzle.
Cleaning with a cleaning agent, and moving the processing agent nozzle to a standby position.
Moving the treating agent nozzle to the dummy dispenser.
Performing the dummy dispensing,
Detecting the discharge pressure of each processing agent nozzle;
If the discharge pressure is lower than a predetermined value,
To move to the solvent bath position and clean it again.
And characterized in that:

[0044]

Next, the meaning of the terms in the claims will be described.

The “plurality of positions spaced at a predetermined interval” for supplying the coating liquid is based on the premise that the processing agent supplied to the surface of the substrate to be processed is spread, and is not the entire upper surface. .

For example, when it is assumed that the spread is made to the left and right, it is supplied linearly, and when it is assumed to be spread in four directions, it is supplied in the form of dots.

The term "supply" includes both continuous supply and intermittent supply.

The “treatment agent” includes one for forming a coating film, one for cleaning a substrate, a solvent, a treatment liquid, and the like.
It also includes various liquids from high to low viscosity.

The term "relatively move" means not only the case where the supply means is moved without moving the holding means, or the case where the holding means is moved without moving the supply means, but also the two means are moved in the opposite direction. And moving both means in the same direction at different speeds. In addition, the direction of movement is generally linear, but also includes a case where the direction of movement is rotational or a meandering.

The "gas" is not limited to air, but may be an inert gas such as nitrogen or argon. Further, it includes not only gas at room temperature but also heated gas.

Hereinafter, the operation of the present invention will be described.

In the coating apparatus of the present invention , the processing agent supplied to the surface of the substrate to be processed spreads on the surface of the substrate to be processed due to the properties of the processing agent itself, for example, surface tension or gravity, and the processing agents are connected to each other to form a film. Since it is assumed that a thin and uniform coating film is formed, and no excessive processing agent is supplied, there is no waste of the processing agent.

The thickness and uniformity of the coating film are determined by the properties of the treatment agent itself, and are hardly influenced by the shape of the supply means and the conditions at the time of supply. And conditions such as control accuracy during supply are eased.

That is, in the step of supplying the processing agent, it is sufficient that the processing agent can be supplied to the surface of the substrate to be processed. for that reason,
The allowable range of the viscosity of the processing agent itself is widened, and the supply speed of the processing agent is also wide. The allowable range of the operation accuracy of the supply unit, the holding unit, and the moving unit can be widened.

Further, since the processing agent may be supplied to a plurality of positions on the surface of the substrate to be processed, a relatively small supply means such as a processing agent nozzle (opening) is sufficient. Therefore, there is no need to worry about mechanical strength such as the rigidity of the supply unit.

On the other hand, at the stage of thinning, the most suitable conditions for thinning the treating agent can be selected, so that the thinning can be performed efficiently.

In the coating apparatus according to the first to sixth aspects, the monitoring
The equipment constantly monitors the operation status of each processing agent nozzle.
If any of the processing agent nozzles are clogged,
A clogged processing agent nozzle can be found, and the processing agent nozzle is defective.
Production can be prevented beforehand.
Increase yields, improve production efficiency and production costs
It is.

[0059]

[0060]

[0061]

[0062]

[0063]

[0064]

Further , in the coating apparatus of claims 7 to 12,
The processing agent nozzle is arranged along the moving direction of the substrate to be processed.
Two or more rows are arranged between adjacent processing agent nozzles.
The processing agent nozzle on the downstream side in the substrate movement direction moves the processing agent nozzle.
With respect to the processing substrate movement direction, next to the processing substrate movement direction upstream side
The configuration was such that it was disposed between two nozzles in contact. this
Therefore, between processing agents supplied on the surface of the substrate to be processed
The gap can be narrowed, and adjacent treatment agents are connected
It is easy to form a coating film with a more uniform thickness
Become.

[0066] Further, in the coating apparatus of claim 2 and 8, since the supplied pre-Symbol target substrate rocking or rotating to a processing agent is provided with means for diffusing surface of the substrate to be processed,
Good Ri can be reliably uniform coating.

[0067] In the coating apparatus according to claim 3 and 9, as rocking mechanism, the actuator since comprises a motor for driving (vibration member) and the spin chuck and the spin chuck, Ri reliably coating uniformly good can do.

[0068] In the coating apparatus according to claim 4, 10 is provided with a solvent nozzle for supplying a solvent before Symbol surface of the substrate to be processed. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. since manner are, it can be made uniform coating reliably Ri good. In coating apparatus of claim 5, 11 is provided with a gas nozzle for supplying a gas containing solvent vapor before Symbol surface of the substrate to be processed. The gas containing the solvent vapor spreads the processing agent supplied to the surface of the substrate to be processed, and applies pressure in a direction of decreasing the film thickness, so that the coating film can be more reliably made thin and uniform. Further, since this gas contains solvent vapor, the treatment agent is not dried.

[0069] In the coating apparatus according to claim 6 and 12, before SL is provided with a heater for supplying heat to the substrate to be processed. By supplying heat with this heater, the substrate to be processed is heated, so that the viscosity of the supplied processing agent is reduced so that the substrate can be easily blended with the substrate to be processed, and the processing agent diffuses quickly on the surface of the substrate to be processed. since you are, it is possible to achieve a uniform coating to ensure Ri good.

[0070] In the coating apparatus according to claim 13, before Symbol holding member spin chuck employs connected to the rotary shaft of the motor as the said as processing agent supplied on the substrate to be processed is uniformly thinned Control the motor.

[0071] Therefore, the processing agent itself nature and the swing operation,
The thickness of the coating film whose film thickness has been made uniform by the action of a solvent, a gas, or heat can be made more uniform or even thinner.

[0072]

[0073]

[0074] In the coating apparatus according to claim 14, supplies the treatment agent at intervals as before SL supplied process agent are integrated connected by a processing agent supplied to the adjacent position target substrate. Therefore , a coating film having a uniform film thickness can be reliably formed on the surface of the substrate to be processed.

In the coating apparatus according to the fifteenth aspect , V 1 ≧ V 2
The processing agent is supplied at the speed V1 while relatively moving the substrate to be processed and the holding means at the speed V2 satisfying the relationship (1). Since the supply of treatment agent in a relative moving speed or faster with the target substrate and the holding means, it is possible to supply the treatment agent at a high density, the film thickness to form a uniform and thin coating film Can be.

[0076]

[0077] In the coating apparatus according to claim 16, was adopted as a fine round hole shape as a pre-Symbol treatment agent nozzle. Therefore ,
Can be supplied with treatment agent in not high density, it is possible to form a uniform coating film more thickness.

[0078] In the coating apparatus according to claim 17, was adopted as a slit-shaped extending in the substrate to be processed moving direction as a pre-Symbol treatment agent nozzle. Therefore, it is possible to supply the agent in a yet higher density, it is possible to form a uniform coating film more thickness.

In the coating method of the present invention , the processing agent supplied to the surface of the substrate to be processed spreads on the surface of the substrate to be processed due to the properties of the processing agent itself, for example, surface tension or gravity, and the processing agents are connected to each other to reduce the film thickness. Since it is assumed that a thin and uniform coating film is formed, and no excessive processing agent is supplied, there is no waste of the processing agent.

The thickness and uniformity of the coating film are determined by the properties of the treating agent itself, and are hardly influenced by the shape of the supply means and the conditions at the time of supply. And conditions such as control accuracy during supply are eased.

Further, since a means for swinging or rotating the substrate to be diffused to diffuse the supplied processing agent on the surface of the substrate to be processed is provided, the coating film can be more reliably made uniform. .

The processing nozzle was cleaned in a solvent bath.
After that, move to the standby position, where
Perform a dummy dispense and use this dummy dispense
The state of each processing nozzle is periodically monitored by the discharge pressure. this
Therefore, if one of the processing agent nozzles is clogged,
A clogged processing agent nozzle can be found,
Prevents production from being carried out as it is
So yields are improved, production efficiency and production costs are improved
Is done. The coating method according to claim 19 , wherein the processing agent is supplied to a plurality of positions at predetermined intervals on the surface of the substrate to be processed, and then the substrate is rotated to uniformly thin the processing agent. I have. This rotation corrects the variation in the film thickness, so that the film thickness can be made uniform.

In the coating method according to the twentieth aspect , the solvent is supplied to the surface of the substrate before supplying the processing agent to a plurality of positions at predetermined intervals on the surface of the substrate. By supplying this solvent, the surface of the substrate to be processed is wetted with the solvent in advance,
Since the treatment agent and the substrate to be treated are easily compatible with each other, and the treatment agent runs on the surface of the substrate to be treated via the solvent layer and is quickly diffused, the coating film can be surely made uniform.

In the coating method according to the twenty-first aspect , after supplying the processing agent to a plurality of positions at predetermined intervals on the surface of the substrate to be processed, a gas containing a solvent vapor is supplied to the surface of the substrate to be processed. The gas containing the solvent vapor spreads the processing agent supplied to the surface of the substrate to be processed, and applies pressure in a direction to reduce the film thickness, so that the coating film can be surely made thin and uniform. Further, since this gas contains solvent vapor, the treatment agent is not dried.

[0085]

[0086]

[0087]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view of a coating and developing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

The coating / developing apparatus 1 has a cassette station C / S at one end.

At the other end of the coating / developing device 1, an LCD glass substrate G (hereinafter, the LCD glass substrate is abbreviated as “substrate”) is provided between the coating and developing device 1 and an exposure device (not shown). An interface unit I / F for performing transfer is provided.

The cassette station C / S has an LC
A plurality, for example, four sets of cassettes 2 containing substrates G such as substrates for D are mounted. Cassette station C / S
A front arm of the cassette 2 is provided with an auxiliary arm 4 for carrying and positioning the substrate G as a substrate to be processed, and holding the substrate G and transferring it to and from the main arm 3. .

The interface unit I / F is provided with an auxiliary arm 5 for transferring a substrate G to and from an exposure apparatus (not shown). The interface unit I / F includes an extension section 6 for transferring the board G to and from the main arm 3 and a board G.
Is temporarily placed in a standby state.

Two main arms 3 are arranged in series so as to be movable in the longitudinal direction in the center of the coating / developing apparatus 1.
And a second processing unit group B are disposed. Between the first processing unit group A and the second processing unit group B, a relay section 8 for temporarily holding and cooling the substrate G is disposed.

In the first processing unit group A, a cleaning processing unit SCR for cleaning the substrate G and a developing processing unit DEV for performing a developing process are provided beside the cassette station C / S.
And are juxtaposed. Further, the cleaning unit SCR and the developing unit D sandwich the transport path of the main arm 3 therebetween.
On the opposite side of the EV, two heat treatment units HP vertically arranged in two stages and a UV processing unit UV and cooling unit COL arranged vertically in two stages are arranged adjacent to each other.

In the second processing unit group B, a coating processing unit COT for performing a resist coating processing and an edge remove processing is arranged. Further, on the opposite side of the coating unit COT across the transport path of the main arm 3, an adhesion unit AD and a cooling unit COL for hydrophobically embedding the substrate G vertically arranged in two stages, and two vertically arranged stages. Heat treatment unit HP and cooling unit COL arranged
And two sets of heat treatment units HP arranged vertically in two stages are arranged adjacent to each other. Heat treatment unit HP
When the cooling unit COL and the cooling unit COL are arranged vertically in two stages, the heat treatment unit HP is arranged above and the cooling unit COL is arranged below, thereby avoiding mutual thermal interference. This enables more accurate temperature control.

The main arm 3 includes an X-axis driving mechanism, a Y-axis driving mechanism, and a Z-axis driving mechanism, and further includes a rotation driving mechanism that rotates about the Z-axis. The main arm 3 appropriately travels along the central passage of the coating / developing device 1 to transport the base slope G between the processing units. Then, the main arm 3 loads the unprocessed substrate G into each processing unit, and unloads the processed substrate G from each processing unit.

In the coating / developing apparatus 1 of the present embodiment, by integrating and integrating the respective processing units in this manner, space can be saved and processing efficiency can be improved.

In the coating / developing apparatus 1 configured as described above, first, the substrate G in the cassette 2 is
Then, the wafer is transferred to the cleaning unit SCR via the main arm 3 and subjected to the cleaning process.

Next, it is conveyed to the adhesion unit AD via the main arm 3, the relay section 8 and the main arm 3 and subjected to a hydrophobic treatment. Thereby, the fixability of the resist is improved.

Next, it is conveyed to the cooling unit COL via the main arm 3 and cooled. Thereafter, the resist is transferred to the coating unit COT via the main arm 3 and coated with the resist.

Next, the substrate G is transferred to the heat processing unit HP via the main arm 3 and subjected to a pre-bake processing. Then, the cooling unit CO is supplied via the main arm 3.
After being conveyed to L and cooled, it is conveyed to the exposure device via the main arm 3 and the interface I / F, where a predetermined pattern is exposed.

The substrate G that has been exposed again is carried into the apparatus 1 via the interface unit I / F, and is conveyed to the heating processing unit HP via the main arm 3 to be subjected to post-exposure bake processing. .

Thereafter, the substrate G is carried into the cooling unit COL via the main arm 3, the relay section 8, and the main arm 3, and is cooled. Then, the substrate G is carried into the development processing unit DEV via the main arm 3 and subjected to development processing, and a predetermined circuit pattern is formed. The developed substrate G is carried into the post-bake processing unit HP via the main arm 3 and subjected to post-bake processing.

Then, the post-baked substrate G
Are stored in a predetermined cassette 2 on a cassette station C / S via a main arm 3 and an auxiliary arm 4.

Next, the coating unit (COT) according to this embodiment will be described. 3 is a plan view of the coating unit (COT) according to the present embodiment, FIG. 4 is a side view, and FIG. 5 is a perspective view.

As shown in FIG. 3, a resist coating apparatus RC and an edge remover ER are arranged adjacent to each other in the coating processing unit (COT). Among them, the resist coating device RC is a device for applying a processing agent such as a resist solution to the surface of the substrate G that has been subjected to the pre-processing such as the cleaning process and the pre-baking, and the edge remover ER is a resist coating device RC. This is an apparatus for peeling and removing a resist coating film on an outer peripheral portion (edge) of the substrate G on which a resist coating film is formed.

In the case where a coating film is selectively formed only on a portion of the surface of the substrate G where the resist application is required, the edge remover ER is not always necessary and can be omitted.

In the resist coating device RC, a rotor cup 10 as a substrate holding device for rotatably holding a substrate G as a substrate to be processed, and the rotor cup 10
A coating liquid supply device 60 for supplying a resist solution or a solvent from the upper surface of the substrate G held by the substrate G, and a moving device 70 for moving the coating liquid supply device 60 with respect to the rotor cup 10.

The outer appearance of the rotor cup 10 is composed of a cylindrical tubular side wall 11 having a vertical axis, and a lid 12 for closing the upper end surface of the side wall 11, and an elevating arm 13 is attached to and detached from the lid 12. Mounted as possible.

FIG. 3 shows the lid 1 of the coating unit (COT).
FIG. 4 is a plan view showing a state in which the coating processing unit 2 is closed, and FIG.

In the space inside the rotor cup 10, the substrate G
And a rotation drive mechanism for rotating the spin chuck 15 are provided.

An annular cup CP is disposed inside the rotor cup 10, and a spin chuck 15 is disposed inside the cup CP. The spin chuck 15 is configured to rotate with the rotational driving force of the driving motor 16 in a state where the substrate G is fixedly held by vacuum suction.

The driving motor 16 transmits a rotational driving force to a rotating shaft 18 via a gear train 17, and the rotating shaft 18 is moved by an elevation driving means 19 along an elevation guide means 20 in the figure. It is mounted so that it can move up and down.

When applying the resist, as shown in FIG.
The spin chuck 15 is lowered to a position lower than the upper end of the cup CP. On the other hand, when the substrate G is transferred between the spin chuck 15 and the main arm 4 when the substrate G is taken in and out of the rotor cup 10, the elevating drive unit 19 raises the rotating shaft 18 and the spin chuck 15 upward. And the spin chuck 15 is displaced to a position higher than the upper end of the cup CP.

On the other hand, a coating liquid supply device 60 for discharging a resist liquid onto the substrate G set on the spin chuck 15 is provided so as to straddle the rotor cup 10 in the Y direction.

In the coating liquid supply device 60, a resist pipe 61 is provided in parallel with the upper end face of the rotor cup 10 and is disposed so as to cross the upper surface of the substrate G in the Y direction. It comprises leg members 64 and 65 for closing the portion and supporting the resist pipe 61. These leg members 64 and 65 are engaged with guide rails 71 and 72 of a moving device 70 described later, respectively.

The moving devices 70 and 70 are elongated box-shaped members, and are disposed one by one on both sides of the rotor cup 10 in the Y direction.
From the position of the edge remover ER to the position of the edge remover ER. Two elongated grooves are provided on the upper surface of the moving device 70 along the X direction.

These grooves are respectively provided in the coating liquid supply device 6.
Guide rails 71 with which the 0 leg members 64 and 65 engage,
Guide rail 7 with which 72 and conveying members 80 and 81 engage
3,74.

[0119] Inside these moving devices 70, 70,
A known moving mechanism (not shown) such as a belt driving mechanism that transmits the driving force of the driving motor by an endless belt is provided, and the driving force of the driving motor is transmitted to the leg members 64 and 65, and the conveying members 80 and 81. Are independently moved in the X direction.

As shown in FIG. 3, a solvent pipe 62 and a gas pipe 63 are respectively disposed on both sides of the resist pipe 61 in the X direction. Each of the resist pipe 61, the solvent pipe 62, and the gas pipe 63 has a hollow tubular structure, and a plurality of predetermined pipes are provided at predetermined intervals in the Y direction on the lower surface, that is, the surface facing the substrate G held on the spin chuck 15. Openings are respectively provided, and the resist nozzles 61a, 61a,.
2a, 62a... And gas nozzles 63a, 63a. A resist supply pipe 66, a solvent supply pipe 67, and a gas supply pipe 68 are provided in the resist pipe 61, the solvent pipe 62, and the gas pipe 63, respectively. And these resist pipes 61,
A resist liquid, a solvent,
A gas containing a solvent vapor is supplied.

FIG. 6 is a partially enlarged vertical sectional view of the substrate G and the coating liquid supply device 60. FIG. 7 is a view of the resist pipe 61, the solvent pipe 62, and the gas pipe 63 as viewed from below. It is a figure showing a state.

As shown in FIG. 6, the resist pipe 61
Has, for example, a trapezoidal or deformed hexagonal cross-sectional shape in which the lower part of a square pipe is narrowed to form a taper, and the plurality of resist nozzles 61a, 6
Are provided over the Y direction at predetermined intervals. The distance between the resist nozzles 61a, 61a...
When the processing agents supplied from 1a and 61a are supplied to the substrate G, the intervals are such that the adjacently supplied processing agents and the processing agents are connected and integrated on the substrate to be processed. The specific value of this interval is a design matter, and is determined by the relationship between each parameter such as the viscosity of the processing agent, the size of the resist nozzle 61a, the gap between the resist nozzle 61a and the substrate G, and the supply speed of the resist.

Similarly, the solvent pipe 62 and the gas pipe 68
Are round pipes each having a plurality of openings formed on the lower surface side, similarly to the resist pipe 61, and a plurality of solvent nozzles 62a, 62a,..., Gas nozzles 63a, 63a,.
Is composed.

In the rotor cup 10, an upper opening of the rotor cup body 10 is covered with a lid 12, and the lid 12 is detachably held by a lifting arm 13.

As shown in FIG. 3 and FIG.
Are two arms 13a, 1 holding the lid 12 at its tip.
3b and a connecting member 14 disposed between the two arms 13a and 13b and connecting the two arms 13a and 13b. And lifting arm 1
The base side of 3, that is, the side opposite to the side holding the lid 12, extends into the cup lifter 30, and the lid 12 can be raised and lowered by a lid lifting mechanism built in the cup lifter 30. For convenience of explanation, the lifting arm 13 and the cup lifter 30 are omitted in FIG.

A washing bath 20 for washing the resist nozzle 61a is provided between the rotor cup 10 and the cup lifter 30. The cleaning bath 20 will be described later.

FIG. 8 is a block diagram illustrating a control system of the coating processing unit (COT) according to the present embodiment.

As shown in FIG. 8, the rotor cup 10, the coating liquid supply device 60, the moving device 70 for moving the coating liquid supply device 60, and the resist liquid supply system RS for supplying the resist liquid to the coating liquid supply device 60. , Coating liquid supply device 60
A gas supply system GS for supplying gas to the apparatus and a solvent supply system SS for supplying a solvent to the coating liquid supply device 60 are connected to the control unit 100, and are controlled by the control unit 100 as a whole.

Hereinafter, the operation of the coating unit (COT) according to this embodiment will be described.

In this coating unit (COT), coating is performed while the rotor cup 10 and the coating liquid supply device 60 are relatively moved, and in the coating step, the resist liquid is supplied almost vertically to the surface of the substrate G. It is done by doing.

The resist solution supplied onto the surface of the substrate G forms a uniform and thin film due to the pressure at which the resist solution is discharged, the diffusivity of the resist solution itself, and the surface tension.

FIG. 9 is a vertical sectional view in the Y direction schematically showing a state in which the resist liquid is continuously supplied from the resist pipe 61 to the substrate G.

As shown in FIG. 9, by moving the moving device 30 to move the coating liquid supply device 60 and the rotor cup 10 in directions opposite to each other, the resist nozzle 61 is moved.
The substrate G is moved relative to a in the direction of the arrow in the figure.

In this state, a resist liquid is supplied from the resist nozzle 61a.

In this embodiment, the resist solution is supplied continuously. FIG. 10 is a view of the AA cut surface in the state of FIG. 9 viewed from the X direction. FIG. 11 is a view of the BB cut surface of the state of FIG.
FIG. 12 is a diagram of the CC cut surface in the state of FIG. 9 viewed from the X direction.

As shown in FIGS. 9 and 10, when the viscosity of the resist solution is appropriate, the resist solution flows continuously from the nozzle (opening) 61a of the resist pipe 61 to the surface of the substrate G.

At this time, as shown in FIG. 10, the resist liquid supplied to the surface of the substrate G rises just below the nozzle 61a to form a peak of the resist liquid. Since the resist liquid is not supplied directly to the valleys between the peaks, the resist liquid is initially small, and the liquid level is low at this portion.

Since the state in which the liquid surface partially rises continues for a while, the surface of the resist liquid film has a wavy shape even on the BB cut surface shown in FIG. The portion where the wave peak is formed moves in the direction of the valley due to the surface tension of the resist solution and the gravity acting on the resist solution, so that the height difference gradually decreases, and as a result, as shown in FIG. As a result, a uniform and thin resist coating film can be obtained.

Although not used in this embodiment,
By using the solvent pipe 62 and the gas pipe 63 together, it is possible to reliably and uniformly form a thin film in a shorter time. FIG. 13 is a vertical sectional view schematically showing a state in which the gas pipe 22 and the solvent pipe 23 are operated.

That is, when the solvent is supplied from the solvent pipe 62 to the surface of the substrate G before the application of the resist to wet the substrate G, this solvent has a low surface tension. A thin solvent layer is formed. This solvent layer improves the compatibility between the resist solution to be supplied next and the substrate G. Next, a resist pipe 6 is formed on the solvent layer.
When the resist solution is supplied from No. 1, the resist solution quickly diffuses along the surface of the solvent layer and spreads over the entire solvent layer. Therefore, the resist liquid discharged from the resist nozzle 61a onto the surface of the substrate G spreads on the surface of the substrate G within a very short time after the discharge, and forms a thin resist coating film. At the same time, the resist nozzle 6 adjacent in the Y direction
The resist liquid discharged from the substrate 1a onto the substrate G is discharged to a very close position. Therefore, when the resist solution is diffused on the substrate G, the resist solutions discharged to adjacent positions overlap each other, and are integrated immediately to form a thin resist coating film that widely covers the surface of the substrate G.

On the other hand, when a gas containing a solvent vapor is ejected from the gas pipe 63, pressure acts on the liquid surface of the resist liquid supplied onto the substrate G, and the resist liquid is spread over the surface of the substrate G. Therefore, it is easier and faster to form a uniform and thin coating film.

In this case, it is effective to apply a gas to a portion of the corrugated resist coating film that forms the ridge to spread the gas. Therefore, the opening of the gas pipe 63 is formed in the width direction of the substrate G in the width direction. It is preferable to dispose it at the same position as the opening of the resist pipe 61 in the (Y direction). Alternatively, the solvent or gas supplied from the solvent pipe 62 or the gas pipe 63 may be heated in advance, and the heat may be used to reduce the viscosity of the resist solution. Further, although omitted in the present embodiment, a heater such as a nichrome wire is built in the spin chuck 15 for holding the substrate G, and the substrate G is heated by this heater, and the resist solution is supplied onto the substrate G. It is also possible to make the viscosity lower when it is performed. In this case, it is preferable to use a rectangular spin chuck that is slightly larger than the substrate G so as to uniformly heat the rectangular substrate G, and to dispose a heater so that the entire spin chuck is uniformly heated.

As described above, in the coating processing unit according to the present embodiment, the thinning of the resist coating film is performed by the surface tension of the resist solution itself and the gravity acting on the resist solution. The formation is performed after the resist solution is supplied onto the substrate G.

Therefore, it is sufficient that the resist liquid discharged from the resist nozzle 61a can be supplied to the surface of the substrate G, and no operation such as processing is performed between the resist nozzle 61a and the substrate G. The mechanical accuracy of the nozzle 61a and the management accuracy of the discharge amount and the discharge speed are not strictly required.

Even if a large number of small-diameter nozzles are opened, the degree of losing the rigidity of the nozzle pipe 61 is low, so that the nozzle pipe 61 is hardly deformed.
It is easy to secure the dimensional accuracy of 1a.

Further, since a low-viscosity resist solution can be used, a problem of nozzle drying hardly occurs.

The present invention is not limited to the embodiments described in this specification. For example, in the first embodiment, the operation of simply discharging the resist liquid from the resist nozzles 61a, 61a,. Although a thin resist film having a uniform thickness is formed on the substrate G, the spin chuck 15 is rotated at a high speed to further uniform the film thickness of the resist film on the substrate G, It is also possible to reduce the thickness. In particular, it is an effective method for further improving the uniformity of the film thickness.

In this embodiment, the resist nozzle 6
Although the rectangular resist pipe 61 having a plurality of openings provided on the lower surface is used as 1a, a rectangular resist pipe 61 in which pipes are connected to independent thin mouthpiece-shaped members may be arranged in a line.

Further, in the first embodiment, a circular nozzle 61a is used as the nozzle of the resist pipe 61. However, in addition to this, a slit-shaped nozzle 61b is provided as shown in FIG. It may be something.

Further, in the first embodiment, only one resist pipe 61 is used, but two or more resist pipes 61 and 61 'may be provided in the moving direction of the substrate G. In that case, as shown in FIG. 16, it is preferable that the opening position of the resist nozzle 61a be alternated between the two resist pipes 61 and 61 '. This is because, by adopting such an arrangement, the density of the swelling of the liquid surface of the resist liquid supplied onto the substrate G is reduced, and it is easy to make the film thickness uniform in the subsequent thinning step, which is convenient.

Next, a nozzle inspection mechanism mounted on the resist coating unit of this embodiment will be described. FIG. 14 is a perspective view showing a state where the solvent bath 20 is cut.

As shown in FIG. 14, the solvent bath 20 has a housing 21 having a rectangular cross section, and a washing roll 22 is disposed inside the housing 21 on the left side in the X direction in the figure. A discharge table 25 is provided on the right side.

The cleaning roll 22 extends over the entire Y direction of the housing 21 and has a size slightly larger than that of the resist pipe 61 where the resist nozzle 61a is provided. The cleaning roll rotates around a rotation shaft 22a fixed to the housing 21, and rotates in a direction indicated by an arrow in the drawing by a driving force transmitted from a driving force transmission mechanism (not shown). . FIG.
Although not shown, a solvent is accommodated inside the solvent bath 20, and the height of the liquid level is such that the upper surfaces of pressure sensors 26, 26,...

A wiper 23 for removing the resist solution on the surface of the cleaning roll 22 is provided at a position diagonally to the left of the cleaning roll 22 in the drawing. The wiper 23 is housed in the wiper box 24 so as to be able to protrude and retract, and in response to a signal from the control unit 100, the tip of the wiper 23 is brought into contact with the surface of the cleaning roll 22 or housed in the wiper box 24. And so on.

On the other hand, the discharge table 25 is a low shelf-shaped member disposed at the right side of the housing 21 in the figure, and has a plurality of pressure sensors 26, 2 on the upper surface in the Y direction.
6 are arranged. These pressure sensors 26, 26
Are arranged at positions corresponding to the resist nozzles 61a, 61a, respectively. When the resist pipe 61 comes to a position directly above the discharge table 25, the resist nozzles 61a, 61a,.
a, 61a...
Are arranged at positions where each one of them faces each other.
Each of these pressure sensors 26, 26,... Is separately connected to the control unit 100, and the control unit 100 detects the discharge pressure detected by each of these pressure sensors 26, 26,. It has become recognizable.

Next, the operation of the nozzle inspection mechanism will be described.

When the discharge of the resist onto the substrate G is completed, the control unit 100 drives the moving device to drive the resist pipe 61.
Are moved to the cleaning position, that is, the position where the resist nozzles 61a, 61a,. In this state, the resist liquid is discharged from the resist nozzles 61a toward the surface of the cleaning roll 22, and the resist liquid is attached to the surface of the cleaning roll 22.
At this time, the cleaning roll 22 is rotating, and the resist nozzles 61a, 61a,.
This cleaning roll winds up the excess resist solution adhering to the surface. On the other hand, at this time, the wiper 23 protrudes from the wiper box 24, and its tip is in contact with the surface of the cleaning roll. Therefore, the resist nozzles 61a, 61
The excess resist solution taken up from a.
The cleaning roll surface, which has been stripped off and has no resist solution, faces the resist nozzles 61a, 61a,.

After cleaning is performed at the cleaning position for a predetermined time, the resist pipe 61 is moved rightward in the figure,
That is, the resist nozzles 61a, 61a,.
Are moved to a position facing 6, 26. In this state, dummy dispense, that is, discharge of a resist solution is performed from the resist nozzles 61a, 61a,.
The resist liquid is discharged toward 26. Each of the pressure sensors 26, 26,.
The discharge pressure of the resist liquid discharged from a .... is detected, and the result is transmitted to the control unit 100.

In the control section 100, the pressure sensors 26, 26,.
From each of the resist nozzles 61a, 61
The discharge pressure of a ... is recognized. Then, it is determined whether or not each discharge pressure is within a specified range, and each of the registration nozzles 61a, 61
The state of a ... is grasped. As a result, when it is determined that the discharge pressure is low and any of the resist nozzles 61a, 61a,... Is clogged, the resist pipe 61 is returned to the above-described cleaning position again, and the cleaning operation is performed again. This operation is repeated until the result of the dummy dispensing at the standby position is good.

On the other hand, as a result of the dummy dispensing, if none of the resist nozzles 61a, 61a,... Has any more, the resist pipe 61 is moved in the X direction as it is to supply the resist liquid to the substrate G. .

When there is an abnormality in the nozzle 21a,
A warning by light or sound may be issued.

As described above, according to this nozzle inspection mechanism, it is possible to detect whether or not the resist nozzles 61a, 61a,... Are clogged before the resist is discharged onto the substrate G. As a result, the production of defective products can be prevented, and the yield can be improved, and the production cost per product can be reduced.

(Second Embodiment) Next, a coating unit according to a second embodiment of the present invention will be described.

[0164] Among the coating processing units according to the second embodiment, description of portions common to the coating processing unit according to the first embodiment will be omitted.

The coating unit (CO
In T), an actuator (vibrator) is provided on a surface of the upper surface of the spin chuck 15 which is in contact with the substrate G, and the substrate G can be rocked by applying a predetermined voltage to the actuator.

The coating unit (CO
In T), the substrate G is held on the spin chuck 15, and in this state, there is no need to use an additional member for moving the resist pipe 61 in the X direction in FIG. Is also preferred.

(Third Embodiment) Next, a coating unit according to a third embodiment of the present invention will be described.

The description of the portions of the coating unit according to the third embodiment that are common to the coating unit according to the above embodiment will be omitted.

FIG. 17 is a vertical sectional view schematically showing the structure around the resist pipe 61 of the coating unit (COT) according to the second embodiment of the present invention.

In this coating unit (COT), the supply of the resist solution from the resist pipe 61 is performed intermittently, and the solvent pipe 62 is located upstream of the resist pipe 61 in the direction of movement of the substrate G (left side in the figure). ).

As shown in FIG. 17A, the coating unit (COT) has a structure in which the solvent is first discharged from the solvent nozzle 62a onto the surface of the substrate G, and then the resist liquid is discharged and supplied. .

Hereinafter, the manner in which the resist liquid discharged from the resist nozzle 61a is uniformly thinned on the substrate G will be described in chronological order.

FIGS. 17 (a) to 18 (f) are vertical cross-sectional views schematically showing changes until the resist liquid discharged from the resist pipe 61 is thinned on the substrate G. FIG.

The substrate G held on the spin chuck 15
A predetermined amount of solvent is discharged from the solvent nozzle 62a onto the upper surface of the substrate. The discharged solvent spreads on the surface of the substrate G and forms a thin solvent layer.

Next, the resist pipe 61 and the solvent pipe 6
2 is moved to the left in the figure. For convenience of explanation,
In FIG. 17, a description will be given assuming that the substrate G is moved rightward in the figure.

With the above movement, the substrate G is moved to the resist pipe 6
1 and to the right with respect to the solvent pipe 62 in the figure. With this movement, the solvent layer moves to a position immediately below the resist nozzle 61a. In this state, the resist liquid is discharged from the resist nozzle 61a (FIG. 17).
(B)). When the resist liquid discharged from the resist nozzle 61a comes into contact with the solvent layer, the resist liquid immediately diffuses into the solvent layer and spreads on the surface of the substrate G along the solvent layer (FIG. 17C). The resist solution completely dissolves and forms a resist coating film spread on the surface of the substrate G. Similarly, a solvent is discharged to the left side of the substrate G in the drawing to form a thin solvent layer, and a resist solution is discharged from above, and a thin resist coating is sequentially applied from right to left in the drawing. A film is formed (FIG. 18)
(E)). On the other hand, during this time, the resist coating film formed on the substrate G spreads on the substrate G, and the resist coating films adjacent in the X direction and the Y direction overlap with each other at the ends thereof and are integrated (see FIG. 18 (f)) Thus, the substrate G
The resist coatings formed by the resist liquid intermittently discharged above are connected to each other, so that the film thickness becomes thinner and uniform, and a thin and uniform resist coating is formed on the surface of the substrate G (FIG. 18 (f))

[0177]

As described above in detail, according to the first aspect of the present invention, the treatment agent supplied to the surface of the substrate is treated by the properties of the treatment agent itself, for example, surface tension or gravity. It is assumed that the processing agents are spread over each other and the processing agents are connected to each other to form a thin and uniform coating film. Since an excessive processing agent is not supplied, there is no waste of the processing agent.

Further, the value and uniformity of the film thickness of the coating film are determined by the properties of the treatment agent itself, and are hardly influenced by the shape of the supply means and the conditions at the time of supply. And conditions such as control accuracy during supply are eased.

That is, at the stage of supplying the processing agent, it is sufficient that the supply means can supply the processing agent to the surface of the substrate to be processed. for that reason,
The allowable range of the viscosity of the processing agent itself is widened, and the supply speed of the processing agent is also wide. The allowable range of the operation accuracy of the supply unit, the holding unit, and the moving unit can be widened.

Further, since the treatment agent may be supplied to a plurality of positions on the surface of the substrate to be treated, the supply means such as a treatment agent nozzle (opening) may be relatively small. Therefore, there is no need to worry about mechanical strength such as the rigidity of the supply unit.

On the other hand, at the stage of thinning, the most suitable conditions for thinning the treatment agent can be selected, so that the thinning can be performed efficiently.

In the present invention as set forth in claims 1 to 6,
The operating state of each processing agent nozzle is constantly monitored with a visual observation device
So if any of the processing agent nozzles is clogged,
A clogged processing agent nozzle can be found,
Prevents production from being carried out as it is
So yields are improved, production efficiency and production costs are improved
Is done.

[0183]

[0184]

[0185]

[0186]

[0187]

[0188]

[0189]

Further, according to the present invention as set forth in claims 7 to 12,
Is such that the processing agent nozzle moves in the moving direction of the substrate to be processed.
Are arranged in two or more rows along
In between, the processing agent nozzle on the downstream side of the substrate movement direction,
With respect to the moving direction of the substrate, the upstream side of the moving direction of the substrate
Is arranged between two adjacent nozzles.
For this reason, the processing agents supplied on the surface of the substrate to be processed
Between adjacent processing agents can be reduced
Easy to connect, forming a more uniform coating film
It will be easier.

[0191] also comprises a means for diffusing according to the invention of claim 2,8, wherein the treatment agent prior SL is the supply swings or rotates the target substrate surface of the substrate to be processed so, it is possible to make uniform the coating to ensure Ri good.

[0192] According to the present invention of claim 3, 9, wherein, as the rocking mechanism, the actuator since comprises a motor for driving (vibration member) and the spin chuck and the spin chuck, yo Ri reliably coating Can be made uniform.

[0193] According to the present invention of claim 4, 10 wherein is provided with a solvent nozzle for supplying a solvent before <br/> Symbol surface of the substrate to be processed. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. since manner are, it can be made uniform coating reliably Ri good.

[0194] are provided according to the present invention of claim 5, 11, wherein a gas nozzle for supplying a gas containing solvent vapor before <br/> Symbol surface of the substrate to be processed. The gas containing the solvent vapor spreads the processing agent supplied to the surface of the substrate to be processed, and applies pressure in a direction of decreasing the film thickness, so that the coating film can be more reliably made thin and uniform. Further, since this gas contains solvent vapor, the treatment agent is not dried.

[0195] According to the present invention of claim 6, 12, wherein is provided with a heater for supplying heat to the front <br/> Symbol target substrate. By supplying heat with this heater, the substrate to be processed is heated, so that the viscosity of the supplied processing agent is reduced so that the substrate can be easily blended with the substrate to be processed, and the processing agent diffuses quickly on the surface of the substrate to be processed. since you are, it is possible to achieve a uniform coating to ensure Ri good.

[0196] In accordance with the present invention of claim 13, the previous <br/> Symbol holding member spin chuck employs connected to the rotary shaft of the motor as the supplied treatment agent on the substrate to be treated The motor is controlled so as to form a uniform thin film.

[0197] Therefore, the processing agent itself nature and the swing operation,
The thickness of the coating film whose film thickness has been made uniform by the action of a solvent, a gas, or heat can be made more uniform or even thinner.

[0198]

[0199]

[0200] supplying a treatment agent at intervals as claimed according to the present invention of claim 14, prior SL supplied treatment agent are integrated connected by a processing agent supplied to the adjacent position target substrate . Therefore , a coating film having a uniform film thickness can be reliably formed on the surface of the substrate to be processed.

According to the fifteenth aspect of the present invention , V 1 ≧
V2 The processing agent is supplied at the speed V1 while relatively moving the substrate to be processed and the holding means at the speed V2 satisfying the relationship of (1). Since the supply of treatment agent in a relative moving speed or faster with the target substrate and the holding means, it is possible to supply the treatment agent at a high density, the film thickness to form a uniform and thin coating film Can be.

[0202]

[0203]

[0204] According to the present invention according to claim 16, it was adopted as a fine round hole shape as a pre-Symbol treatment agent nozzle. Therefore <br/>, can be supplied with treatment agent in not high density, it is possible to form a uniform coating film more thickness.

[0205] According to the present invention of claim 17, it was adopted as the pre-Symbol treatment agent slit shape extending in the treated substrate moving direction as a nozzle. Therefore, it is possible to supply the agent in a yet higher density, it is possible to form a uniform coating film more thickness.

In the coating method of the present invention, the treatment agent supplied to the surface of the substrate to be treated spreads on the surface of the substrate to be treated due to the properties of the treatment agent itself, for example, surface tension or gravity, and the treatment agents are connected to each other to reduce the film thickness. Since it is assumed that a thin and uniform coating film is formed, and no excessive processing agent is supplied, there is no waste of the processing agent.

Further, the value and uniformity of the thickness of the coating film are determined by the properties of the treatment agent itself and are hardly influenced by the shape of the supply means and the conditions at the time of supply. And conditions such as control accuracy during supply are eased.

Further, since means for swinging or rotating the substrate to be processed and diffusing the supplied processing agent to the surface of the substrate to be processed is provided, the coating film can be more reliably made uniform. .

The processing nozzle was washed with a solvent bath.
After that, move to the standby position, where
Perform a dummy dispense and use this dummy dispense
The state of each processing nozzle is periodically monitored by the discharge pressure. this
Therefore, if one of the processing agent nozzles is clogged,
A clogged processing agent nozzle can be found,
Prevents production from being carried out as it is
So yields are improved, production efficiency and production costs are improved
Is done. According to the present invention of claim 19, wherein, after supplying the processing agent to a plurality of locations spaced a predetermined distance of the surface of the substrate, configured to uniformly thinning the treatment agent by rotating the target substrate Has taken. This rotation corrects the variation in the film thickness, so that the film thickness can be made uniform.

According to the twentieth aspect of the present invention, the solvent is supplied to the surface of the substrate before supplying the processing agent to the plurality of positions at predetermined intervals on the surface of the substrate. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. As a result, the coating film can be surely made uniform.

According to the twenty- first aspect of the present invention, after a processing agent is supplied to a plurality of positions at predetermined intervals on the surface of a substrate to be processed, a gas containing a solvent vapor is supplied to the surface of the substrate to be processed. .

The gas containing the solvent vapor pushes the processing agent supplied to the surface of the substrate to be processed and applies pressure in the direction of decreasing the film thickness, so that the coating film can be surely made thin and uniform. Further, since this gas contains solvent vapor, the treatment agent is not dried.

[0213]

[0214]

[Brief description of the drawings]

FIG. 1 is a perspective view of a coating and developing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the coating / developing apparatus according to the first embodiment of the present invention.

FIG. 3 is a plan view of the resist coating unit according to the first embodiment of the present invention.

FIG. 4 is a side view of the resist coating unit according to the first embodiment of the present invention.

FIG. 5 is a perspective view of a resist coating unit according to the first embodiment of the present invention.

FIG. 6 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 7 is a view of the application liquid supply device according to the first embodiment of the present invention as viewed from below.

FIG. 8 is a block diagram of a resist coating unit according to the first embodiment of the present invention.

FIG. 9 is a vertical sectional view of the resist pipe according to the first embodiment of the present invention.

FIG. 10 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 11 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 12 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 13 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 14 is an exploded perspective view of the nozzle inspection mechanism according to the first embodiment of the present invention.

FIG. 15 is a view showing a modification of the resist pipe according to the first embodiment of the present invention.

FIG. 16 is a view showing a modification of the resist pipe according to the first embodiment of the present invention.

FIG. 17 is a vertical sectional view showing an operation state of the resist coating unit according to the third embodiment of the present invention.

FIG. 18 is a vertical sectional view showing an operation state of the resist coating unit according to the third embodiment of the present invention.

[Explanation of symbols]

 G substrate 10 rotor cup 15 spin chuck 20 solvent bath 26 pressure sensor 64, 65 leg member 60 coating liquid supply device 61 resist pipe 61a resist nozzle RS resist supply system 70 moving device 71-74 guide rail 63 gas pipe GS gas supply system 62 Solvent pipe SS Solvent supply system 100 Control unit COT coating unit

Continued on the front page (72) Inventor Masafumi Nomura Katsuno-ku, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture 272-4 Heisei 272 4 Tokyo Electron Kyushu Co., Ltd. 272-4 Heisei, Tokyo Electron Kyushu Co., Ltd., Otsu Office (72) Inventor Omori Den, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture JP-A-10-34055 (JP, A) JP-A-8-274014 (JP, A) JP-A-10-74691 (JP, A) JP-A-7-80384 (JP, A) JP-A-5-144720 ( JP, A) JP-A-8-250389 (JP, A) JP-A-6-224114 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 B05C 11/08 B05D 1/40

Claims (21)

(57) [Claims] 1. A holding member for holding a substrate to be processed, a plurality of processing agent nozzles directed to the surface of the substrate to be processed and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system that relatively moves the holding member and the processing agent nozzle, a processing unit supply system, and a control unit that drives the moving system in synchronization with each other; and a standby position adjacent to the holding member. , is disposed in the treatment agent nozzle facing surface of the stand-by position, each
A pressure sensor for detecting a discharge pressure of the processing agent nozzle, and a function of each of the processing agent nozzles based on the detected discharge pressure.
A monitoring device for monitoring a moving state . 2. A holding member for holding a substrate to be processed, and a plurality of processing agent nozzles directed to the surface of the substrate to be processed and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system for relatively moving the holding member and the processing agent nozzle, a swing mechanism provided on the holding member, and a processing agent supply system, the moving system, and the swing mechanism synchronized with each other. A control unit to be driven, a standby position provided adjacent to the holding member, and a processing agent nozzle disposed surface of the standby position,
A pressure sensor for detecting a discharge pressure of the processing agent nozzle, and a function of each of the processing agent nozzles based on the detected discharge pressure.
A monitoring device for monitoring a moving state . 3. The coating apparatus according to claim 2 , wherein the swing mechanism drives an actuator, a spin chuck, and the spin chuck disposed at a contact portion of the holding member with the substrate to be processed. A coating device characterized by being a motor. 4. A holding member for holding a substrate to be processed, a plurality of processing agent nozzles directed to the surface of the substrate to be processed, and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system for relatively moving the holding member and the processing agent nozzle, a solvent nozzle disposed adjacent to the processing agent nozzle on the upstream side in the substrate movement direction of the processing target, and a solvent supply for supplying a solvent to the solvent nozzle A control unit that drives the processing agent supply system, the solvent supply system, and the moving system in synchronization with each other; a standby position adjacent to the holding member; and the processing agent nozzle-facing surface at the standby position. Arranged in
A pressure sensor for detecting a discharge pressure of the processing agent nozzle, and a function of each of the processing agent nozzles based on the detected discharge pressure.
A monitoring device for monitoring a moving state . 5. A holding member for holding a substrate to be processed, and a plurality of processing agent nozzles directed to the surface of the substrate to be processed and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system that relatively moves the holding member and the processing agent nozzle, a gas nozzle adjacent to the processing agent nozzle on the downstream side of the processing target substrate moving direction, and a gas containing a solvent vapor in the gas nozzle. A gas supply system to be supplied; a control unit that drives the processing agent supply system, the gas supply system, and the moving system in synchronization; a standby position provided next to the holding member; and the processing of the standby position. Agent nozzle facing Disposed in each
A pressure sensor for detecting a discharge pressure of the processing agent nozzle, and a function of each of the processing agent nozzles based on the detected discharge pressure.
A monitoring device for monitoring a moving state . 6. A holding member that holds a substrate to be processed, a plurality of processing agent nozzles that are directed to the surface of the substrate to be processed, and are provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system that relatively moves the holding member and the processing agent nozzle, a heater that heats the substrate to be processed held by the holding member, a processing agent supply system, and a synchronous driving of the moving system A control unit to be disposed, a standby position adjacent to the holding member, and disposed on the processing agent nozzle facing surface of the standby position,
A pressure sensor for detecting a discharge pressure of the processing agent nozzle, and a function of each of the processing agent nozzles based on the detected discharge pressure.
A monitoring device for monitoring a moving state . 7. A holding member for holding a substrate to be processed, and a surface of the substrate to be processed which is directed to a surface of the substrate to be processed.
Are provided at predetermined intervals over a first direction across
A plurality of treatment agent nozzles, a treatment agent supply system for supplying a treatment agent to the treatment agent nozzles, and a treatment agent supply system arranged in a second direction different from the first direction.
Guide for movably supporting the holding member or the processing agent nozzle
And the holding member and the processing agent nozzle are relatively moved.
Moving system, the processing agent supply system, and the moving system
A processing unit , wherein the processing agent nozzles are arranged in two or more rows along the moving direction of the substrate to be processed, and between the adjacent processing agent nozzles, the downstream side in the moving direction of the substrate to be processed. Wherein the processing agent nozzle is disposed between two adjacent nozzles on the upstream side in the moving direction of the substrate with respect to the moving direction of the substrate. A holding member 8. holding a substrate to be processed, the directed to the surface of the substrate, a plurality of processing agent nozzles provided the predetermined intervals over a first direction across the surface of the substrate to be processed A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system for relatively moving the holding member and the processing agent nozzle, a swing mechanism provided on the holding member, and a processing agent supply system, the moving system, and the swing mechanism synchronized with each other. And a control unit for driving, wherein the processing agent nozzles are arranged in two or more rows along the moving direction of the substrate to be processed, and between the adjacent processing agent nozzles, the processing agent nozzle is downstream in the moving direction of the substrate to be processed. The processing agent nozzle on the side A coating apparatus, which is disposed between two adjacent nozzles on the upstream side in the moving direction of the substrate to be processed in the moving direction. 9. The coating apparatus according to claim 8, wherein the swing mechanism drives an actuator, a spin chuck, and the spin chuck disposed at a contact portion of the holding member with the substrate to be processed. A coating device characterized by being a motor. 10. A holding member for holding a substrate to be processed, a plurality of processing agent nozzles directed to the surface of the substrate to be processed, and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system for relatively moving the holding member and the processing agent nozzle, a solvent nozzle disposed adjacent to the processing agent nozzle on the upstream side in the substrate movement direction of the processing target, and a solvent supply for supplying a solvent to the solvent nozzle And a control unit that drives the processing agent supply system, the solvent supply system, and the moving system in synchronization, and the processing agent nozzles are arranged in two rows along the moving direction of the substrate to be processed. It is arranged above Between adjacent processing agent nozzles, a processing agent nozzle on the downstream side of the processing target substrate moving direction is disposed between two adjacent nozzles on the upstream side of the processing target substrate moving direction with respect to the processing target substrate moving direction. A coating device. 11. A holding member for holding a substrate to be processed, a plurality of processing agent nozzles facing the surface of the substrate to be processed, and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A moving system that relatively moves the holding member and the processing agent nozzle, a gas nozzle adjacent to the processing agent nozzle on the downstream side of the processing target substrate moving direction, and a gas containing a solvent vapor in the gas nozzle. A gas supply system to be supplied, and a control unit that drives the processing agent supply system, the gas supply system, and the moving system in synchronization with each other, wherein the processing agent nozzle is arranged in a moving direction of the substrate to be processed. More than two rows along The processing agent nozzle is disposed between the adjacent processing agent nozzles, and the processing agent nozzle on the downstream side of the processing target substrate moving direction is located between two adjacent nozzles on the upstream side of the processing target substrate moving direction in the processing target substrate moving direction. A coating device, wherein the coating device is arranged in a coating device. 12. A holding member for holding a substrate to be processed, a plurality of processing agent nozzles facing the surface of the substrate to be processed, and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system for supplying a treatment agent to the treatment agent nozzle,
A guide disposed in a second direction different from the first direction to movably support the holding member or the processing agent nozzle; and a movement system for relatively moving the holding member and the processing agent nozzle. A heater that heats the substrate to be processed held by the holding member; and a controller that drives the processing agent supply system and the moving system in synchronization with each other. The processing agent nozzles are arranged in two or more rows along the moving direction of the processing substrate, and the processing agent nozzles on the downstream side in the moving direction of the processing substrate move between the adjacent processing agent nozzles. A coating device disposed between two adjacent nozzles on the upstream side in the direction. 13. The coating apparatus according to claim 1, wherein the holding member rotatably holds the substrate to be processed,
A spin chuck connected to a rotation shaft of a motor, wherein the control unit is a control unit that controls a rotation speed of the motor so that a processing agent supplied on the substrate to be processed is uniformly thinned. A coating device characterized by the above-mentioned. 14. The coating apparatus according to claim 1, wherein a distance between the processing agent nozzles is uniform with a processing agent supplied from an adjacent processing agent nozzle being integrated on the substrate to be processed. A coating apparatus having an interval so as to form a treatment agent layer having a thickness. 15. The coating apparatus according to claim 1, wherein said processing agent supply system is a processing agent supply system for supplying a processing agent at a speed V1, and said moving system is provided between said holding member and said holding member. A coating system for moving the processing agent nozzle at a speed V2, wherein a relationship of V1 ≧ V2 (1) is established between the speed V1 and the speed V2. 16. The coating apparatus according to claim 1, wherein said processing agent nozzle is a fine round hole. 17. The coating apparatus according to claim 1, wherein said processing agent nozzle is a slit extending in a moving direction of the substrate to be processed. 18. A step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of a substrate to be processed, and a step of swinging the substrate to be processed and connecting and integrating the processing agents. The coating method provided , wherein after supplying the processing agent to the substrate to be processed, the processing agent nozzle
Moving the processing agent nozzle to the position of the solvent bath , cleaning the processing agent nozzle with a solvent, moving the processing agent nozzle to a standby position, and causing the processing agent nozzle to perform dummy dispensing.
And the discharge pressure of each processing agent nozzle during the dummy dispensing
And, if the detected discharge pressure is lower than a predetermined value,
Move the treatment agent nozzle to the position of the solvent bath and
Coating method characterized by comprising the steps of washing, the. 19. A method comprising: supplying a processing agent to a plurality of positions at predetermined intervals on a surface of a substrate to be processed; and rotating the substrate to be processed to uniformly thin the processing agent. Coating method, after supplying the processing agent to the substrate to be processed, the processing agent nozzle
Moving the processing agent nozzle to the position of the solvent bath , cleaning the processing agent nozzle with a solvent, moving the processing agent nozzle to a standby position, and causing the processing agent nozzle to perform dummy dispensing.
And the discharge pressure of each processing agent nozzle during the dummy dispensing
And, if the detected discharge pressure is lower than a predetermined value,
Move the treatment agent nozzle to the position of the solvent bath and
Coating method characterized by comprising the steps of washing, the. 20. A coating method comprising: a step of supplying a solvent to a surface of a substrate to be processed; and a step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of the substrate to be processed. after the supply of the treatment agent to the substrate to be processed, the processing agent nozzle
Moving the processing agent nozzle to the position of the solvent bath , cleaning the processing agent nozzle with a solvent, moving the processing agent nozzle to a standby position, and causing the processing agent nozzle to perform dummy dispensing.
And the discharge pressure of each processing agent nozzle during the dummy dispensing
Detecting the discharge pressure, if the detected discharge pressure is lower than a predetermined value,
Move the treatment agent nozzle to the position of the solvent bath and
Coating method characterized by comprising the steps of washing, the. Of 21. to be processed surface of the substrate, the coating that includes a step of supplying a treatment agent to a plurality of positions spaced a predetermined distance, and a step of supplying a gas containing solvent vapor to the surface of the target substrate The method , wherein after supplying a processing agent to the substrate to be processed, the processing agent nozzle
Moving the processing agent nozzle to the position of the solvent bath , cleaning the processing agent nozzle with a solvent, moving the processing agent nozzle to a standby position, and causing the processing agent nozzle to perform dummy dispensing.
And the discharge pressure of each processing agent nozzle during the dummy dispensing
And, if the detected discharge pressure is lower than a predetermined value,
Move the treatment agent nozzle to the position of the solvent bath and
Coating method characterized by comprising the steps of washing, the.