JP3189087B2 - Processing device and processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing method for applying a coating liquid to a square substrate to be processed.

[0002]

2. Description of the Related Art Generally, a liquid crystal display (LC) is used.
D) In a device manufacturing process, for example, ITO (Indium Tin Oxi) is formed on an LCD substrate (glass substrate).
de) In order to form a thin film, an electrode pattern and the like, a circuit pattern and the like are reduced and transferred to a photoresist by using a photolithography technique similar to that used in a semiconductor manufacturing process, and a series of development processes are performed. Processing is performed.

For example, a rectangular LCD as a substrate to be processed
After the substrate is cleaned by a cleaning device, the LCD substrate is subjected to a hydrophobic treatment by an adhesion processing device, cooled by a cooling processing device, and then coated with a photoresist film, ie, a photosensitive film by a resist coating device. Thereafter, the photoresist is heated by a heat treatment device to perform a baking process, and then a predetermined pattern is exposed by an exposure device. Then, after developing and applying the developing solution to the exposed LCD substrate by a developing device, the developing solution is washed away with a rinsing solution, and the developing process is completed.

In performing the above-described processing, for example, as a method for forming a resist film, a rectangular LCD substrate (hereinafter, referred to as a substrate) is placed on holding means, for example, a spin chuck provided in a processing container. In the fixed state, the opening of the processing container is closed with a lid, and the processing container and the spin chuck are rotated.For example, a resist solution including a solvent and a photosensitive resin is dropped on the center of the upper surface of the substrate, There is known a rotating cup type coating film forming method in which the resist liquid is radially diffused from the center of the substrate toward the peripheral portion by the rotation force and the centrifugal force of the substrate to apply the resist solution.

In this coating treatment, even if the film thickness is uniform immediately after the coating, the resist solution is not applied at the peripheral portion of the substrate due to the surface tension after the rotation stops and the centrifugal force stops working or as time passes. It becomes thick as it rises. In addition, a phenomenon occurs in which the resist solution reaches the peripheral portion of the lower surface of the substrate to form an unnecessary film. If a non-uniform thick film is formed on the periphery of the substrate in this way, the resist film on the periphery is not completely removed during the development of an integrated circuit pattern or the like, and remains there. During the transfer step, the remaining resist is peeled off, causing particles to be generated.

Therefore, conventionally, a process of applying a resist solution or the like to the surface of the substrate and then removing an unnecessary coating film on the peripheral portion of the substrate has been performed. By this coating film removing step, an unnecessary coating film on the peripheral portion of the substrate can be removed by spraying a removing liquid such as a solvent onto the peripheral portion of the substrate after the coating film forming step.

Further, by incorporating a dedicated coating film removing device into the coating / developing processing system, the coating process of the substrate and the unnecessary coating film removal at the peripheral portion of the substrate can be continuously performed.

[0008]

SUMMARY OF THE INVENTION
Incorporating a dedicated coating film removal device into the development processing system not only increases the size of the equipment, but also carries the coating process and unnecessary coating film removal process, as well as loading the substrate into the coating mechanism and moving from the coating mechanism to the coating film removal mechanism. Therefore, there is a problem that the throughput is reduced because a process such as transporting the substrate and carrying it out of the coating film removing mechanism is required.

In the conventional rotating cup type coating film forming method, the solvent in the resist liquid evaporates during the process of diffusing the resist liquid from the center position of the substrate toward the peripheral portion, so that the resist liquid is diffused. The viscosity of the resist solution differs depending on the direction, and the thickness of the formed resist film differs between the central part and the peripheral part. Further, since the peripheral speed of the substrate is much higher at the outer peripheral portion than at the center position, the amount of the substrate scattered is large. That is, there was a limit to uniform coating. In order to solve this, for example, a method of controlling the temperature of the resist solution or filling the same solvent used in the resist solution in the atmosphere for forming the resist film to suppress evaporation of the solvent in the resist solution, A method is conceivable in which the solvent of the resist solution is dropped on the substrate surface before the application of the solution.

However, in the former method, that is, the method of adjusting the temperature of the resist solution or filling the same solvent used in the resist solution in the atmosphere for forming the resist film to suppress the evaporation of the solvent in the resist solution, The amount used increases, for example, only a few% of the applied amount of the resist solution contributes to the actual formation of the resist film. In addition, since the amount of the resist liquid is large, the resist liquid wraps around the back surface of the corner portion of the substrate, and the resist liquid attached to the back surface of the corner portion of the substrate dries, causing a problem of generating particles.

Also, the latter method, ie, a method in which a solvent of a resist solution is dropped on the substrate surface before the application of the resist solution, makes it difficult to apply a uniform solution because of the uniformity of the solvent itself on the substrate and the difference in the dry state. Cannot be fully solved. In addition, even in this method, particularly when the substrate has a rectangular shape, there is a disadvantage that an extra resist solution must be used to form a resist film on the entire surface of the substrate. There has been a problem that the coating liquid is spilled onto the back surface of the corner of the substrate, and then dried to generate particles, which lowers the yield.

Further, since the substrate has a rectangular shape such as a rectangular shape, when the coating solution such as a resist solution is applied and the substrate is rotated at a high speed to shake off the coating solution, the substrate is centrifugally separated from the periphery of the substrate. There is also a problem that the coating liquid scattered to the direction may re-adhere to the back surface of the corner of the rotating substrate, and the applied coating liquid dries and causes generation of particles.

The present invention has been made in view of the above circumstances, and aims at improving the throughput of coating and developing processing of a substrate to be processed, improving the product yield by removing an unnecessary coating film on the peripheral portion of the substrate, and improving the apparatus. It is an object of the present invention to provide a processing apparatus and a processing method that can be downsized.

[0014]

In order to achieve the above object, a first processing apparatus according to the present invention comprises: holding means for holding and rotating one side of a rectangular substrate to be processed facing upward; A coating container having a cup-like processing container surrounding the means, a coating member for closing the opening of the processing container, and a coating liquid supply unit for supplying a coating liquid to the substrate to be processed;
An edge removal mechanism that sprays a removal liquid onto an edge of the substrate on which the coating film of the coating liquid is formed to remove the coating film,
A first transport mechanism that carries in the substrate to be applied to the coating mechanism and unloads the substrate to be processed from the edge removal mechanism;
A second transport mechanism for transporting the substrate to be processed from the coating mechanism to the edge removing mechanism ;
A mounting means for holding the substrate to be processed, and the edge removing machine
Along the two opposite sides of the substrate to be processed.
As it moves, a small portion of the upper and lower surfaces
At least a pair of removal nozzles for injecting the removal liquid onto the upper surface,
The removal nozzle is provided on an upper surface of the substrate to be processed.
Surface cleaning nozzle that sprays the removal liquid onto the
Formed with a back surface cleaning nozzle that sprays the removal liquid on the lower surface of the plate
The nozzle for the front surface cleaning and the nozzle for the back surface cleaning.
The nozzles of the slur are used to remove the removal liquid sprayed from these nozzles.
Are arranged so as not to interfere with each other (claim 1).

According to a second processing apparatus of the present invention, a holding means which rotates while holding one side of a square substrate to be processed facing upward, a processing container having a cup shape surrounding the holding means, A coating mechanism having a lid for closing the opening of the container and a coating liquid supply means for supplying a coating liquid to the substrate to be processed, and removing the coating liquid from the edge of the substrate on which the coating film of the coating liquid is formed An edge removing mechanism for ejecting a liquid to remove the coating film, a first transport mechanism for carrying in the substrate to be processed into the coating mechanism and carrying out the substrate to be processed from the edge removing mechanism, A second transport mechanism for transporting the substrate to be processed from the mechanism to the edge removing mechanism;
Mounting means provided for holding the substrate to be processed;
The edge removing mechanism is provided along each side of the substrate to be processed.
At the same time, and the upper and lower surfaces of the edge of the substrate to be processed.
Of multiple removing spraying the removing liquid on at least the upper surface of the
A nozzle, wherein the removal nozzle is
A surface cleaning nozzle that sprays the removal liquid onto the upper surface of the substrate,
A back surface cleaning nozzle that sprays the removal liquid onto the lower surface of the substrate to be processed.
And the nozzle of the surface cleaning nozzle and the back
The nozzles of the surface cleaning nozzles
It is characterized in that the liquids are shifted so as not to interfere with each other (claim 2).

In the processing apparatus of the present invention, it is preferable that the coating mechanism further includes a solvent supply means for supplying a solvent of the coating liquid to the substrate to be processed. Further, it is preferable that the holding means is formed so as to be capable of horizontal rotation and vertical movement (claim 4), and it is preferable that the processing container is formed so as to be rotatable together with the holding means (claim 5).
It is preferable that the edge removing mechanism further includes an auxiliary cleaning nozzle that sprays a removing liquid onto the back surface of the corner of the substrate to be processed. It is preferable that the mounting means is formed so as to be horizontally rotatable (claim 7).

Further, an exhaust port which is open to the side of the removing nozzle is provided at a jet head on which the removing nozzle is mounted, and the exhaust port is connected to an exhaust device via an exhaust pipe, so that the removing liquid used for removing the coating film is removed. Is preferably formed so as to be dischargeable (claim 8 ). Further, at least one of the surface cleaning nozzle or the back surface cleaning nozzle may be bent inclined outward side from the inside of the substrate (claim 9). Further, the pair of removal nozzle, can be provided by opening a plurality appropriate intervals in the moving direction (Claim 10).
Further, the removal nozzle is provided substantially in parallel with a back surface cleaning nozzle that sprays a removal liquid onto the lower surface of the substrate to be processed, and is provided at an appropriate interval inward from an edge of the substrate to be processed. The removal nozzle may further include a plurality of auxiliary cleaning nozzles (claim 11 ), and the removal nozzle may further include an end surface cleaning nozzle for cleaning a side surface of the substrate to be processed (claim 11 ). Claim 12 ). Further, the removal nozzle includes a front surface cleaning nozzle that injects a removal liquid onto the upper surface of the substrate to be processed, a back surface cleaning nozzle that injects the removal liquid onto the lower surface of the substrate to be processed, and a side portion of the substrate to be processed. An end surface cleaning nozzle for injecting the removal liquid, wherein the front surface cleaning nozzle, the back surface cleaning nozzle, and the end surface cleaning nozzle are configured to remove the removal liquid in accordance with the state of application of the coating film on the edge of the substrate to be processed. It is preferable to form it so as to be controllable for injection (claim 13 ).

The edge removing mechanism is provided on the upper and lower sides of the edge of the substrate to be processed, and has a gas injection nozzle having an injection port directed toward a peripheral outer side of the substrate to be processed. Preferably, the apparatus further comprises an exhaust pipe for exhausting the gas that has been removed (claim 14 ). The edge removing mechanism is provided on both sides of the removing nozzle, and extends from the center of the substrate to be processed to the peripheral portion. Write further comprising a drying gas injection nozzle for injecting gas Te is preferable (claim 15).

On the other hand, a first processing method according to the present invention includes a step of loading a rectangular substrate to be held on holding means in a processing container, and a step of supplying a coating solution to the substrate and rotating it. Diffusing it on one surface of the substrate to be processed,
Closing the lid in the processing container and enclosing the substrate to be processed in the processing container; and rotating the substrate to be processed in the processing container with the lid closed to adjust the thickness of the coating film. A step of transporting the substrate on which the coating film is formed to the edge removing mechanism; moving along two opposite sides of the substrate to be processed, and removing the removal liquid on the upper surface of the substrate to be processed.
Spray nozzles for surface cleaning and removed on the lower surface of substrate to be processed
Does not interfere with each other than the back surface cleaning nozzle that sprays the liquid
(A) removing the coating film at the edge while spraying the removal liquid to the position on the upper and lower surfaces, and carrying out the substrate to be processed from the edge removal mechanism. Claim 16 ).

In the first processing method of the present invention, the step of removing the coating film includes removing the coating film at the edge by spraying a removing liquid onto the edge of the rectangular substrate to be processed on which the coating film is formed. The method of removing the coating film may be optional, but preferably, the step of removing the coating film is performed by spraying a removing liquid onto the edge of the first side of the rectangular substrate to be coated with the coating film. And a second removing step of removing a coating film by spraying a removing liquid onto an edge of a second side of the substrate to be processed to remove the coating film. Is better (Claim 1
7 ).

According to a second processing method of the present invention, a square substrate to be processed is carried in to be held on a holding means in a processing container, and a coating liquid is supplied to the substrate to be rotated and rotated. Diffusing it on one surface of the substrate to be processed,
Closing the lid in the processing container and enclosing the substrate to be processed in the processing container, and rotating the substrate to be processed in the processing container in which the lid is closed to adjust the thickness of the coating film A step of transporting the target substrate on which the coating film is formed to the edge removing mechanism ; and simultaneously moving along each side of the target substrate and spraying a removing liquid on the upper surface of the target substrate.
The cleaning liquid to be sprayed and the removal liquid on the lower surface of the substrate
No interference with each other than the back surface cleaning nozzle
(A) removing the coating film at the edge while ejecting the removing liquid while shifting the upper and lower surfaces of the substrate, and (b) carrying out the substrate to be processed from the edge removing mechanism. Claim 18 ).

[0022] In the processing method of the present invention, prior to supplying a coating solution to the substrate to be processed, it further comprising the step of supplying a solvent of a coating solution on one surface of the substrate to be processed is preferably (claim 19) . Further, in the step of arranging the thickness of the coating film, who rotates the target substrate with the processing container lid is closed is preferable (claim 20). Also, it further comprises an auxiliary removing step of removing the coating film adhered to the corner rear surface by injecting removing solution the corner back surface of the substrate is preferably (claim 21).

[0023]

According to the present invention, claims 1, 2, 4, 5, 7 and 16 to 18, 2 are provided.
According to the invention described in No. 0 , the coating liquid is supplied onto one surface of the square substrate to be processed carried into the coating mechanism, rotated and diffused on one surface of the substrate to be processed, and the lid is placed in the processing container. After the substrate is closed and the substrate to be processed is sealed in the processing container, the substrate to be processed in the processing container with the lid closed is rotated to adjust the thickness of the coating film. Next, the substrate to be processed conveyed to the edge removal mechanism is held by the mounting means, and the removal liquid is sprayed from a removal nozzle moving along two or each of the opposed sides of the substrate to be processed, and the edge is unnecessary. After removing the coating film, the substrate to be processed can be carried out from the edge removing mechanism.

Further, the hole of the surface cleaning nozzle for injecting the removed liquid to the upper surface of the substrate, the hole of the back surface cleaning nozzle for injecting the removed liquid to the lower surface of the substrate, the injected remover with each other By displacing them at a position where they do not interfere with each other, it is possible to prevent the removal liquid scattered due to the collision (interference) of the removal liquid ejected from both nozzles from adhering to the coating film on the surface of the substrate to be processed. I can . Therefore, it is possible to prevent the removal liquid from adhering to the coating film to make the film thickness non-uniform, and to maintain the uniformity of the film pressure of the coating film.

Further, an exhaust port which is open to the side of the removing nozzle is provided at a jet head to which the removing nozzle is attached, and this exhaust port and an exhaust device are connected through an exhaust pipe to remove the removing liquid used for removing the coating film. by dischargeable formed, it is possible to discharge the removed liquid that has been subjected to removal of has been coated film ejected from removal nozzle to the outside (claim 8). Further, by removing at least one of the front surface cleaning nozzle and the back surface cleaning nozzle from the inner side of the substrate to be processed to the outer side in an inclined shape, the removal liquid ejected from the nozzle can be applied to the substrate to be processed. since directing circumferentially, removal liquid can be prevented from adhering to the coating film of the center side (claim 9). Also,
The removal performance can be further improved by providing a plurality of removal nozzles that move along two opposing sides of the substrate to be processed at appropriate intervals in the movement direction (claim 10 ).

In addition, the removal nozzle is further provided with an edge cleaning nozzle for cleaning the side surface of the substrate to be processed, so that the coating film adhered to the side surface (edge surface) of the substrate to be processed can be reliably removed. (Claim 12 ). Further, the removal nozzle may be a front surface cleaning nozzle that sprays the removal liquid on the upper surface of the substrate to be processed, a back surface cleaning nozzle that sprays the removal liquid on the lower surface of the substrate, and the removal liquid may be sprayed on the side surface of the substrate. And nozzles for cleaning the end face to be sprayed.
Corresponds to the state of application of the coating film adhering to the top, edge, or back surface periphery of the substrate to be processed by forming a controllable spray of the removal liquid in response to the application state of the coating film on the edge of the substrate to be processed Then, the unnecessary coating film can be removed by spraying the removing liquid (claim 13 ).

Further, the edge removing mechanism is provided with gas injection nozzles disposed on the upper and lower sides of the edge of the substrate to be processed and having injection ports directed toward the outer periphery of the substrate to be processed, and gas injected from the gas injection nozzle. By further providing an exhaust pipe for exhausting gas, since there is a flow of gas exhausted from the exhaust pipe toward the periphery of the substrate to be processed, it is possible to prevent the removal liquid from flying and adhering to the center side of the substrate to be processed. Can be prevented (claim
14 ). In addition, the edge removing mechanism further includes a drying gas ejecting nozzle that is provided on both sides of the removing nozzle and ejects gas from the center of the substrate to be processed toward the peripheral portion, so that the gas is ejected from the removing nozzle. Prior to the removal of the coating film by the removing liquid, a drying gas can be sprayed toward the coating film in the peripheral portion of the substrate to be dried to dry the coating film. Can be suppressed (claim 15 ). In addition, since the substrate to be processed and the coating film are dried by injecting a dry gas into the peripheral portion of the substrate after the coating film is removed, the removing liquid is immediately evaporated to remove unnecessary coating film. Can be prevented, and the coating film at the edge portion can be stabilized.

According to the third and nineteenth aspects of the present invention, after the solvent of the coating solution is applied to one surface of the square substrate to be carried into the coating mechanism and diffused, the coating solution is applied to the substrate to be processed. Is supplied, rotated, and diffused on one surface of the substrate to be processed,
After closing the lid in the processing container and enclosing the substrate to be processed in the processing container, the substrate to be processed in the processing container with the lid closed is rotated to adjust the thickness of the coating film. so,
The amount of the coating liquid can be reduced. Next, the substrate to be processed conveyed to the edge removal mechanism is held by the mounting means, and the removal liquid is sprayed from a removal nozzle moving along two or each of the opposed sides of the substrate to be processed, and the edge is unnecessary. After removing the coating film, the substrate to be processed can be carried out from the edge removing mechanism.

According to the invention described in claims 6, 11 and 21 , the edge removing mechanism is provided with an auxiliary cleaning nozzle for spraying the removing liquid on the back surface of the corner of the substrate to be processed, so that the edge of the substrate can be removed. The coating film adhered to the back surface of the corner can be removed. In this case, a plurality of auxiliary cleaning nozzles are provided substantially parallel to the back surface cleaning nozzles and are provided at appropriate intervals from the edge of the substrate to be processed toward the inner side, so that each of these auxiliary cleaning nozzles ejects the ink. the removing solution is can be controlled according to the amount of deposition of the coating liquid adhering to the back surface of the substrate, by removing liquid amount of the minimum necessary, it is possible to remove the unwanted coating film (claim 11 ). In addition, a change in the temperature of the substrate to be processed and a change in the thickness of the coating film due to the temperature and evaporation of the removing liquid can be suppressed.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. Here, the processing apparatus of the present invention is referred to as an LCD.
A case where the present invention is applied to a resist coating apparatus for a substrate will be described.

As shown in FIG. 1, a processing apparatus according to the present invention has a rectangular substrate to be processed, for example, a rectangular LCD substrate G.
A coating mechanism 1 that supplies a coating liquid, for example, a resist liquid, to the surface of a substrate (hereinafter, referred to as a substrate) from a coating liquid supply nozzle 42 to apply the resist liquid, and removes an unnecessary coating film formed by coating on a peripheral portion of the substrate G. The edge removing mechanism 2 is disposed adjacent to and, for example, integrally in the same atmosphere, and carries out the substrate G to the coating mechanism 1 and unloads the substrate G from the edge removing mechanism 2. And a second transport mechanism 4 for transporting the substrate G coated by the coating mechanism 1 to the edge removing mechanism 2.

As shown in FIG. 2, the coating mechanism 1 comprises a holding means for holding the substrate G by suction in a horizontal state by vacuum, for example, a spin chuck 10, and a processing chamber 11 surrounding the upper and outer peripheral portions of the spin chuck 10. , A cup-shaped processing container 12 having an open upper portion (hereinafter referred to as a rotating cup), a lid 16 which is attached (detachable) to the opening 12a of the rotating cup 12 in a closable manner, and A flat plate-shaped rectifying plate 13 that is vertically suspended downward and protrudes outward from the outer peripheral edge of the substrate G, and a cup-shaped fixed container 14 that surrounds the outer peripheral side of the processing container 12 and that is open at the top (hereinafter referred to as a drain). A fixed lid 15 that is attached (detachable) to the opening of the drain cup 14 so that it can be closed, and a lid 16.
Arm 20 for moving the fixed lid 15 to the closed position and the standby position, the spin chuck 10 and the rotating cup 12
A driving motor 21 for rotating the spin chuck 10
A supply nozzle 40 (solvent supply means) for a solvent such as a solvent (solvent) A of a coating liquid, which is configured to be movable to a position above, and a supply nozzle 42 (coating liquid supply means) for a coating liquid such as a resist liquid B are brought close to each other. And a nozzle moving mechanism 37 which is a moving means for holding the jet head 39 and moving it between the jet stand standby position and the substrate upper position.

In this case, the solvent A and the resist solution B flowing through the solvent supply path and the resist solution supply path from the nozzles 40 and 42 are set at a preset temperature (for example, 23 ° C.). A temperature adjusting mechanism 45 for circulating and supplying the temperature adjusting liquid C is provided. A mounting member 34 that can move up and down together with the spin chuck 10 is mounted between the spin chuck 10 and the spin chuck 10 via a bearing 34 a at a position near the lower portion of the spin chuck 10. Cleaning nozzle 35
(Container cleaning means) and a supply nozzle 36 (inert gas supply means) for supplying an inert gas, for example, nitrogen (N ₂ ) gas.

The spin chuck 10 is formed of a heat-resistant synthetic resin member made of, for example, polyether ether ketone (PEEK), and is driven based on a preset program to change the rotation speed. It is rotatable (rotated) in the horizontal direction via a rotating shaft 22 that is rotated by the drive of a motor 21.
Can be moved in the up-down (vertical) direction by the driving of the lifting cylinder 23 connected to the first cylinder. In this case, the rotating shaft 22 is provided with a bearing 25 on the inner peripheral surface of the fixed collar 24.
a and is slidably connected to a spline bearing 27 fitted on the inner peripheral surface of the rotatable inner cylinder 26a rotatably mounted via the inner cylinder 26a. A driven pulley 28a is mounted on the spline bearing 27, and the driven motor 21 is mounted on the driven pulley 28a.
A belt 29a is stretched between a drive shaft 21a and a drive pulley 21b mounted on the drive shaft 21a. Therefore, the drive shaft 21 is driven by the drive motor 21 via the belt 29a.
2 rotates, and the spin chuck 10 rotates. Also,
The lower side of the rotating shaft 22 is disposed in a cylindrical body (not shown).
The rotation shaft 22 is connected to the lifting cylinder 23 via the rotation axis 0 so that the rotation shaft 22 can move in the vertical direction by driving the lifting cylinder 23.

The rotary cup 12 is formed of, for example, a stainless steel member, and has a connecting cylinder 31 fixed to the upper end of a rotary outer cylinder 26b mounted on the outer peripheral surface of the fixed collar 24 via a bearing 25b. The bottom 12b of the rotating cup 12 and the spin chuck 10
An O-ring 32 for sealing is interposed between the lower surface of the spin chuck 10 and the airtightness is maintained in a state where the spin chuck 10 descends and comes into contact with the O-ring 32. Further, the drive from the drive motor 21 is transmitted to the rotary cup 12 by the driven pulley 28b mounted on the rotary outer cylinder 26b and the belt 29b stretched over the drive pulley 21b mounted on the drive motor 21 so that the rotary cup 12 is rotated. It is configured to be rotated. In this case, the diameter of the driven pulley 28b is formed to be the same as the diameter of the driven pulley 28a mounted on the rotary shaft 22, and the same driving motor 21
9a and 29b are stretched, so that the rotating cup 12
And the spin chuck 10 rotate the same. A labyrinth seal portion 33 is formed on the facing surface of the fixed collar 24 and the rotating inner cylinder 26a and the rotating outer cylinder 26b to prevent dust from entering the rotating cup 12 from the lower drive system during the rotation process. (See FIG. 3).

The rotating cup 12 is formed by forming a tapered surface 12e in which the inner surface of the side wall 12c is reduced in diameter toward the upper side. 12d is formed.

An abutment ring 16a made of, for example, Delrin (trade name) is fixed to the lower surface of the periphery of the lid 16 for closing the opening 12a of the rotary cup 12 in order to prevent metal contact with the rotary cup 12. The robot arm 2 is provided at the center of the lid 16 via a bearing 16b.
A support column 19 supported at 0 is attached, and an air inlet 16 c is provided at the center of the support column 16.

As described above, the cover 16 is provided with the air inlet 16c, and the rotating cup 12 is provided with the exhaust hole 12d to exhaust air. Air flows into the rotary cup 12 from the port 16c, and the air is discharged from the exhaust hole 12d along the inner wall of the rotary cup 12 by the flow straightening plate 13, so that the mist of the scattered resist liquid is discharged by the flow of air. Therefore, it is possible to prevent re-adhesion to the substrate G and to prevent the processing chamber 11 from rotating when the rotating cup 12 rotates.
It is possible to prevent the inside from becoming an excessive negative pressure.

On the other hand, on the outer peripheral side of the bottom of the drain cup 14, a plurality of drainage ports 14a are provided concentrically, and at appropriate locations (for example, four locations in the circumferential direction) on the inner peripheral side of the drainage ports 14a. Is provided with an exhaust port 14b connected to an exhaust device (not shown). In this case, the drain port 14a is opened in the tangential direction of the rotation direction (for example, clockwise) of the substrate G and the rotation cup 12. For example, it is formed such that the central axis of the space inside the drainage port 14a is inclined at an angle smaller than a right angle with respect to the bottom 12b. The reason why the drain port 14a is provided in the tangential direction of the rotation direction of the substrate G and the rotation cup 12 is that the mist of the resist liquid scattered with the rotation of the substrate G and the rotation cup 12 is quickly discharged to the outside. That's because I tried to do it.

The fixed lid 15 is made of a stainless steel member supported by the supporting column 19, and the lower surface of the outer periphery of the fixed lid 15 avoids contact between the metal and the drain cup 14. For this purpose, a ring-shaped contact member 15a made of Delrin (trade name) is fixed. Also, a plurality of air supply holes 15 b
Is provided.

As described above, a plurality of air supply holes 15b are provided on a concentric circle on the center side of the fixed lid 15, and the drain cup 1 is provided.
4 is provided with an exhaust port 14b at the bottom, so that when the rotating cup 12 rotates, the drain cup 1
4 flows along the outer wall of the rotary cup 12, so that the mist that is scattered by the centrifugal force in the processing chamber 11 during the rotation processing and flows into the drain cup 14 through the exhaust hole 12 d is rotated. Can be prevented from rising to the upper side, and can be discharged to the outside through the exhaust port 14b.

The lid 16 needs to be fixed to the opening 12a of the rotating cup 12 and rotated integrally during the rotation process. Therefore, as shown in FIG. 4, a fitting recess 17b is provided on the lower surface of the contact ring 16a, and the fitting recess 17b is fitted to a fixing pin 17a protruding above the rotating cup 12, and the lid 16 is attached. It is fixed to the rotating cup 12. In this case, by forming the top of the fixing pin 17a in a spherical shape, dust generated by contact with the fitting recess 17b is reduced. Note that the fixing pin 17a does not necessarily need to protrude toward the rotating cup, and the fixing pin 17a
May be projected, and a fitting recess 17b may be provided on the rotating cup side. Further, the inside of the fitting recess 17b and the periphery of the fixing pin 17a may be connected to suction means (not shown) to discharge dust generated by the contact between the fixing pin 17a and the fitting recess 17b to the outside.

When the lid 16 is opened and closed, the robot arm 20 is inserted under the bulging head 18 protruding from the upper surface of the lid 16 as shown by an imaginary line in FIG. After engaging the locking pin 20a protruding from the robot arm 20 with the locking groove 18a provided in the portion 18, the robot arm 20 can be moved up and down. The locking groove 18a of the bulging head 18 when the lid 16 is opened and the locking pin 20a of the robot arm 20 are aligned, and the fixing pin 17a when the lid 16 is closed.
The position of the fitting recess 17b can be adjusted by controlling the rotation angle of the drive motor 21 formed by a servomotor or the like.

In the above embodiment, the lid 16 and the rotating cup 1
2 has been described by fitting the fixing pin 17a and the fitting recess 17b. However, such a structure is not necessarily required, and the lid 16 is separately provided using a pressing mechanism.
Is fixed to the rotating cup 12, it is possible to prevent the generation of dust when the lid 16 is opened and the rattling of the lid 16 during the rotation processing. Since the fixed lid 15 is fixed to the supporting column 19 that rotatably supports the lid 16, the fixed lid 15 moves up and down with the opening and closing movement of the lid 16 to open and close the opening of the drain cup 14. Can be.

The N ₂ gas supply nozzle 36 is formed by an annular nozzle having a number of small holes formed at an appropriate interval on an outer peripheral surface of a donut-shaped hollow annular pipe. The N ₂ gas supply nozzle 36 thus configured
Is a mounting member 3 which moves up and down together with the spin chuck 10.
4 and is connected to an N ₂ gas supply source (not shown) via an N ₂ gas supply tube 36 c passing through the fixed collar 24. Then, the spin chuck 10 moves up with the spin chuck 10 after the rotation process, and rises in the processing chamber 1 of the rotating cup 12.
When located (exposed) in 1, by injecting radially a N ₂ gas supplied from N ₂ gas supply source into the processing chamber 11, the processing chamber 11 while N ₂ purge, the processing chamber 11 The negative pressure (reduced pressure) state is released so that the lid 16 can be easily opened thereafter.

The cleaning nozzle 35 attached to the attachment member 34 together with the N ₂ gas supply nozzle 36 is a
, A bottom cleaning nozzle body 35a inclined toward the bottom surface of the rotating cup 12, a side cleaning nozzle body 35b protruding horizontally toward the inner side surface of the rotating cup 12, and a lower surface of the lid body 16. Cleaning nozzle body 35c
It is composed of These nozzle bodies 35a to 35c
Is a cleaning liquid supply tube 36 penetrating the fixed collar 24.
The cleaning liquid supply source (not shown) is connected via d.
When the rotating nozzle 12 is cleaned by the cleaning nozzle 35, first, after the rotation process, the spin chuck 10 is moved up and moved up, and the nozzle bodies 35 a to 35 c are positioned in the processing chamber 11 of the rotating cup 12 (exposed). Then, the cleaning liquid supplied from the cleaning liquid supply source is supplied to each of the nozzle bodies 35a to 35a.
35c, the bottom surface and the inner side surface of the rotating cup 12 and the lower surface of the lid 16 (specifically, the lid 16 and the rotating cup 1
2, the resist solution, particles and the like adhering to the rotating cup 12 and the lid 16 can be washed and removed. This cleaning process may be performed periodically after processing a predetermined number of substrates G.

On the other hand, the solvent supply nozzle 40 is connected to a solvent tank 41c via a solvent supply tube 41a as a solvent supply path and an opening / closing valve 41b, and nitrogen (N ₂ ) gas supplied into the solvent tank 41c By controlling the pressurization, the solvent A in the solvent tank 41c can supply a predetermined amount of the solvent A onto the substrate G for a predetermined time.

The resist solution supply nozzle 42 is connected to a resist solution tank 44b containing a resist solution B via a resist solution supply tube 44a which is a resist solution supply passage. The tube 44a has a suck back valve 44c, an air operation valve 44d, and a bubble removing mechanism 44 for separating and removing bubbles in the resist solution B.
e, a filter 44f and a bellows pump 44g are sequentially provided. The bellows pump 44g is capable of expanding and contracting under the control of the drive unit, and is capable of supplying, for example, dropping a predetermined amount of the resist liquid B to the center of the substrate G via the resist liquid supply nozzle 42. . It is possible to control the supply amount of the resist solution B smaller than the supply amount of the conventional resist solution B. The drive unit includes a ball screw 44h including a screw having one end attached to one end of the bellows pump, and a nut screwed into the screw via a ball.
And a stepping motor 44i that linearly moves the screw by rotating the nut.

The diameter of the resist liquid supply nozzle 42 is specifically set to φ0.5 to φ5 mm, preferably φ3 mm for a substrate of 500 × 600 mm. Thus, by setting the diameter of the nozzle according to the size of the substrate, it is possible to supply a small amount of the resist solution B as much as possible over a long time.
If the supply time is short, the uniformity of the film thickness is not good, and if it is too long, the resist solution does not reach the peripheral portion of the substrate. Here, as small as possible depends on the nozzle diameter and the resist solution supply pressure.

In the resist solution supply system configured as described above, the discharge time of the resist solution is controlled by the bellows pump 44.
The control (control accuracy: ± 2 msec) is performed by the drive time of the stepping motor 44i of g.
The discharge amount of the resist solution is determined by the drive operation of the bellows pump 44g, for example, the drive time and drive speed, and the air operation valve 4 for opening and closing the resist solution supply passage.
It is set by the opening / closing operation (ON-OFF operation) of 4d. Setting of the driving time of the bellows pump 44g and O of the air operation valve 44d
The N-OFF operation is automatically controlled by a computer based on a preset program.

The discharge time of the resist solution B is controlled by a variable orifice (not shown) provided in the resist solution supply nozzle 42.
It can also be performed by opening and closing operations. Further, the resist solution B can be supplied by pressurizing the N ₂ gas to the resist solution tank 44b without using the bellows pump 44g. In this case, the discharge time control of the resist solution B is performed by controlling the discharge time of the N ₂ gas. It can be performed by adjusting the amount of pressurization.

The suck-back valve 44c provided in the resist liquid supply system discharges the resist liquid B remaining on the inner wall of the tip of the resist liquid supply nozzle 42 due to surface tension after the resist liquid is discharged from the resist liquid supply nozzle 42. This is a valve for drawing back into the resist liquid supply nozzle 42, thereby preventing solidification of the residual resist liquid. In this case, when the resist liquid B is discharged back into the resist liquid supply nozzle 42 by the negative pressure action of the suck-back valve 44c as usual in the resist liquid supply nozzle 42 that discharges a small amount of the resist liquid B,
The air near the tip is also entrained into the nozzle 42, and the residue of the resist solution B adhering to the tip of the nozzle 42 enters the nozzle 42, causing not only clogging of the nozzle 42 but also dry resist as particles. Substrate G
May be contaminated and the yield may be reduced.

In order to solve this problem, as shown in FIG.
The thickness 42b of the portion near the opening is thicker than that of FIG. That is, the nozzle 42 has a cylindrical distal end and an inverted truncated cone following the cylindrical distal end. Instead, as shown in FIG. 5B, an outer flange 4 is formed at the cylindrical tip or opening of the resist solution supply nozzle 42.
By providing 2c, the nozzle 4
2 Entrapment of air near the tip can be prevented.
Further, as shown in FIG. 5C, a small-diameter bent portion 42d extending in a horizontal S-shape is formed at a vertically extending cylindrical tip of the resist solution supply nozzle 42, and the center of the bent portion 42d is formed. By performing suckback to the vicinity, air entrapment at the nozzle tip can be similarly prevented.

The temperature adjusting mechanism 45 (temperature adjusting means)
As shown in FIG. 6, a temperature control liquid supply passage 46a provided to surround the outer circumferences of the solvent supply tube 41a and the resist supply tube 44a, respectively, and both ends at both ends of the temperature control liquid supply passage 46a. Are connected to each other, a circulating pump 46c provided in each of the circulating paths 46b, and a thermo-module for maintaining a constant temperature of the temperature adjusting liquid C (for example, constant temperature water) connected in the middle of the circulating path 46b. 46d. With the temperature adjusting mechanism 45 configured as described above, the solvent A flowing in the solvent supply tube 41a and the resist liquid B flowing in the resist supply tube 44a are heated to a predetermined temperature (for example,
(About 23 ° C.).

In FIG. 6, the solvent supply nozzle 40 and the solvent supply tube 41 a are connected to the resist solution supply nozzle 4.
2 and the resist solution supply tube 44a are formed integrally with each other, but are preferably formed separately as described in detail below with reference to FIG.

The jet head 39 is made of, for example, a member made of stainless steel or an aluminum alloy. A U-shaped hole which forms a part of the bypass passage 47a is formed on the upper surface of the jet head 39, and a vertical through hole 47b extending to the lower surface of the jet head 39 is formed at the bottom of the hole. Each through hole 47b has an inclined middle portion 47c having a larger diameter as it goes downward, and a lower portion 47d having a larger diameter.
A female screw is formed on the inner peripheral surface of 7d. When the nozzles 40 and 42 are mounted on the jetting head 39 having such a configuration, the cylindrical nozzles 40 and 42 are inserted into the through holes 47b so that the upper and lower portions extend, respectively. A sealing member 47f made of a substantially conical synthetic resin having a vertical through hole through which a through-hole 42 can be inserted is attached to a middle inclined portion 47c.
And the sealing member 47f is screwed into the screwing lower portion 47d having a vertical through hole through which the nozzles 40 and 42 can pass.
Is pressed against the inclined inner peripheral surface. In this manner, the nozzles 40 and 42 are mounted on the jet head 39 in a liquid-tight manner. In this case, the O-ring 47h is interposed between the upper end of the inclined middle portion 47c and the upper surface of the seal member 47f as shown in the drawing, so that the watertightness between the bypass passage 47a and the nozzles 40 and 42 is further maintained. be able to.

The jet head 39 is arranged in the horizontal direction (X, Y directions).
It is mounted on the tip of a movable arm 37a that can rotate and move vertically (Z direction). The moving arm 37a
As shown in FIG. 1, the solvent supply nozzle 40 and the resist solution supply nozzle 42 are disposed outside the drain cup 14 and driven by driving means such as a stepping motor (not shown). It is selectively moved between a standby position above the standby unit 38 and the standby position. That is, from the standby position, the solvent supply nozzle 4
0 is moved to the center position of the substrate G, and after a lapse of a predetermined time, then, after the resist solution supply nozzle 42 is moved to the center position of the substrate G, both nozzles 40 and 42 are moved to the standby unit 38. Has become. The moving mechanism of the jet head 39, that is, the solvent supply nozzle 40 and the resist liquid supply nozzle 42 does not necessarily need to be formed by the above-described rotating moving arm 37a, and may use, for example, a linear scanning mechanism.

In the above embodiment, the structure in which the solvent supply nozzle 40 is provided integrally with the resist liquid supply nozzle 42 at the jet head 39 has been described. However, the present invention is not limited to this. The solvent may be supplied integrally with the jet head. Alternatively, for example, the solvent supply nozzle 40 may be arranged coaxially with the outer periphery of the resist liquid supply nozzle 42 so as to be coaxial therewith.

In the above embodiment, the lid 16 of the rotating cup 12 is moved and opened by the robot arm 20 to supply the solvent A supply nozzle 40 and the resist liquid B supply nozzle 42.
In the above description, the structure in which the moving mechanism 37 is moved above the center of the substrate G and the solvent A and the resist solution B are dropped is described. May be configured. For example,
As shown in FIG. 8, the bulging head portion 18 of the lid 16 is formed in a hollow shape, and the upper end is configured to be closed by the lid 18A. Then, the lid 18A is opened, and the nozzle is moved by the moving mechanism 37 above the hollow of the bulging head 18, that is, the substrate G
And the solvent A and the resist solution B may be dropped. As shown in FIG. 9, the nozzle mounting member 18B is provided inside the bulging head 18 with the bearing 1.
The cover 16 is rotatably attached by 8C or the like. Then, with the opening 12a of the rotating cup 12 closed with the lid 16, the nozzle 4
The solvent A and the resist solution B may be dropped from 0 and 42 onto the central portion of the substrate G.

As described above, the opening portion 12a is
By dropping the solvent A and the resist solution B in a closed state, the processing throughput can be reduced as compared with the moving type by the moving mechanism 37, and the processing process from the dropping of the solvent A in a closed state to the end of the coating process can be performed. It can be realized. For example, it is possible to realize a process in which after the solvent A is supplied, the rotating cup 12 is rotated while the resist liquid B is being supplied, and then the supply of the resist liquid B is stopped, and the rotating cup 12 is rotated.

In the above embodiment, the solvent supply nozzle 4
The case where the solvent A is dropped from 0 to the center of the substrate G and then the resist solution B is dropped on the substrate G to form a resist film has been described. However, when a resist solution comprising a solvent and a photoresist is used, It is also possible to use the coating mechanism 1 in which the resist liquid B is dropped from the resist liquid supply nozzle onto the substrate G without using the solvent supply nozzle, and the resist film is formed using the solvent of the resist liquid B itself. .

On the other hand, as shown in FIGS. 1 and 12, the edge removing mechanism 2 is a mounting table which is a mounting means that can hold the substrate G by suction and hold the substrate G by a vacuum device (not shown) and can rotate the substrate G by 90 degrees or more in the horizontal direction. The main part is constituted by 50 and a pair of removal nozzles 51 for injecting a resist removing liquid, for example, a resist solvent, on the upper and lower surfaces of two opposing edges of the substrate G held by the mounting table 50. .

The mounting table 50 is configured to be able to rotate 90 degrees or more in the horizontal direction by a driving mechanism 52 having a rotating mechanism such as a motor (not shown) and an elevating mechanism such as an elevating cylinder and a ball screw, and to be capable of elevating and lowering. . The mounting table 50 thus configured is switched between the transfer position of the substrate G, the coating film removal processing position, and the standby position by elevating and lowering the substrate G by 90 degrees in the horizontal direction.
The two opposing sides of the set can be switched and moved to the removal nozzle 51 side.

FIGS. 13 and 14 show the removal nozzle 51.
As shown in FIG. 7, a solvent supply path 53c for removing resist on the surface provided on the upper horizontal piece 53a and the lower horizontal piece 53b of the jetting head 53 having a substantially U-shaped cross section which covers the upper and lower surfaces and side surfaces of the edge of the substrate G It is formed of a fine needle-like nozzle 51a for cleaning the front surface and a nozzle 51b for cleaning the rear surface, such as an injection needle connected to the solvent supply path 53d for removing the resist on the back surface. In this case, the nozzle 51a is hung downward with the orifice facing downward, the nozzle 51b is hung downward with the orifice facing upward, and the orifice of the nozzle 51a and the orifice of the nozzle 51b are sprayed near the respective nozzles. And are arranged so as not to interfere with each other. Thus, the nozzle 5
The reason why the nozzle 1a and the nozzle 51b are shifted from each other is that when the solvent injected from the nozzles 51a and 51b collides near the nozzle, the solvent scattered by the collision adheres to the resist film on the surface of the substrate G. This is to prevent adverse effects such as uneven thickness of the resist film.

An exhaust port 53f is provided in a vertical portion 53e on the nozzle side inside the jet head 53 of the removing nozzle 51, and an exhaust pipe 54 connected to an exhaust device (not shown) is connected to the exhaust port 53f. The solvent sprayed from the nozzle 51 and used for removing the resist film is discharged to the outside via the exhaust pipe 54.

In the above-described embodiment, the case where the nozzle 51a is hung down straight is described. However, it is not always necessary to adopt such a shape. May be bent obliquely from the inside toward the outside. By making such a bend, the removal liquid ejected from the nozzle 51a is directed to the peripheral direction of the substrate G, so that it is possible to prevent the removal liquid from adhering to the central resist film. Similarly, the injection port of the nozzle 51b may be bent obliquely from the inside to the outside of the substrate G.

Further, as shown in FIG. 12, the pair of removing nozzles 51 configured as described above is provided with a position adjusting mechanism 55.
Are arranged so as to be position-adjustable on opposing first sides, for example, long sides and second sides, for example, short sides of the substrate G,
The vertical movement mechanism 56 moves up and down to the resist film removing position and the standby position at the edge of the substrate G, and can move along the edge of the substrate G by the left and right movement mechanism 57. In this case, a plurality of removal nozzles 51 can be provided at appropriate intervals in the movement direction,
Further, the removal performance can be improved.

In this case, the position adjusting mechanism 55 includes a cylinder body 59a connected to the ejection head of one of the opposed removal nozzles 51 via a mounting member 58a, and a cylinder body 59a.
a telescopic rod 5 slidably mounted on the a.
9b, and an outer stopper 60a for positioning the removal position of the removal nozzle 51 on the long side of the substrate G of the removal nozzle 51 due to collision of the two attachment members 58a and 58b when the telescopic rod 59b of the air cylinder 59 extends. When the telescopic rod 59b of the air cylinder 59 contracts, the two mounting members 58a and 58b collide and the inner stopper 60 for positioning the removal position of the removal nozzle 51 on the short side of the substrate G.
b. The two removal nozzles 51 are supported by a support member 61 for mounting a cylinder body 59a of the air cylinder 59.

The vertical movement mechanism 56 includes a support member 61.
A lifting member 64 attached to a lower surface of one end of the first member and capable of moving up and down along a lifting guide rail 63 provided on a traveling plate 62 movable in a horizontal direction (Y direction) described later, and attached to the lifting member 64. And a telescopic rod 65b slidably mounted on the cylinder body 65a and attached to the traveling plate 62. Also, the traveling plate 62 is movably mounted on two parallel upper and lower traveling guide rails 68 horizontally disposed on the side surface of an upright wall 67 erected from the base plate 66, and attached to the upright wall 67. The right and left moving mechanism 57 is configured by fastening a timing belt 69a, which is wound around a driving pulley (not shown) mounted on a driving shaft of a driving motor (not shown), to the traveling plate 62.

Further, an auxiliary cleaning nozzle 51A for removing a resist film adhering to the back surface of the corner of the substrate G is provided below the mounting table 50 (see FIG. 12). As shown in FIG. 15, the auxiliary cleaning nozzle 51A
The auxiliary cleaning nozzle 51A and a tank 4b for accommodating a thinner T as a solvent are mounted at a diagonal position of 0 by a support member 4a so as to be capable of adjusting the spray direction.
Are connected via a solvent supply tube 4c. In order to remove the resist film adhered to the back surface of the corner portion of the substrate G from the auxiliary cleaning nozzle 51A, for example, a gas for pressure feeding is supplied from the nitrogen (N ₂ ) gas supply source 4d into the tank 4b, and a solvent supply tube is provided. Valve 4e interposed in 4c
Is released, and the thinner T is jetted from the auxiliary cleaning nozzle 51A toward the back surface of the corner of the substrate G. In this case, FIG.
As shown by an imaginary line in FIG. 5, the tank 4b and the N ₂ gas supply source 4 are connected to the solvent supply tube 4c via the three-way switching valve 4f.
d, the solvent is sprayed from the auxiliary cleaning nozzle 51A to remove the resist film adhering to the back surface of the corner of the substrate G, and then the three-way switching valve 4f is switched to supply the N ₂ gas from the auxiliary cleaning nozzle 51A. By spraying (supplying), drying of the back surface of the corner can be promoted.

In this case, when the substrate G has a rectangular shape (for example, a rectangular shape), as shown in FIG. 16A, when the spin chuck 10 rotates to shake off the resist solution applied to the surface of the substrate G, centrifugation is performed. The resist liquid adhering to the long side of the substrate G by the force is scattered to the outside of the substrate G, while the resist liquid adhering to the short side of the substrate G is scattered to the outside from the side of the substrate G Collides with the adjacent corner, and the substrate G
On the back surface of the corner at the diagonal position. The larger the rotation speed of the substrate G and the larger the size of the substrate G,
The ratio increases as the ratio between the short side and the long side increases and as the amount of the applied resist liquid increases. Therefore, the mounting table 50 corresponding to the corner at the diagonal position of the substrate G to which the resist liquid adheres.
If the auxiliary cleaning nozzle 51A is disposed below the diagonal position of the above, the resist film attached to the back surface of the corner of the substrate G can be easily removed by the thinner sprayed from the auxiliary cleaning nozzle 51A.

When the shape of the substrate G is square,
Originally, the re-adhesion amount is reduced as compared with the rectangular shape. However, as shown in FIG. If the resist liquid scattered from each side adheres again to the back surface of each adjacent corner and needs to be removed, a total of four auxiliary cleaning nozzles 51A are arranged on the lower side of each corner of the mounting table 50. It should be set up.

Instead of providing the auxiliary cleaning nozzle 51A, an improved structure of the above-described removal nozzle 51 may be used. That is, as shown in FIG. 17A, the lower horizontal side 53b of the ejection head 53 of the removal nozzle 51 is extended outward (to the substrate G side), and
The first to fourth needle-like auxiliary cleaning nozzles 51c, 51d, 51e, 51f are provided at appropriate intervals on the outside of the substrate 1b, that is, at appropriate intervals from the edge of the substrate G toward the inside.
May be extended upright. With this configuration, when the removal nozzle 51 is positioned at a corner of the substrate G, a solvent such as a thinner is supplied from the front cleaning nozzle 51a, the back cleaning nozzle 51b, and the first to fourth auxiliary cleaning nozzles 51c to 51f. The resist film which has been sprayed and adhered to the front and back surfaces of the corners of the substrate G can be removed. In addition, when the removal nozzle 51 moves in the central portion of each side of the substrate G that is off the corner, the first to fourth auxiliary nozzles 51c to 51c
f, the injection of thinner is stopped, and nozzles 51a and 5
By spraying a thinner only from 1b, the resist film adhering to both sides of the edge of the substrate G can be removed.

The solvent supply path 53c for the auxiliary cleaning nozzles 51c to 51f is provided separately from the solvent supply path 53b for the back surface cleaning nozzle 51b. Also, the solvent supply path 53c
A valve (not shown) is interposed between each of the auxiliary cleaning nozzles to sequentially open or close the auxiliary cleaning nozzles 51c to 51f to gradually increase or decrease the solvent jetted from the auxiliary cleaning nozzles 51c to 51f. It can also be done.

The auxiliary cleaning nozzle 5 configured as described above
1c to 51f are on the outer side of the back surface cleaning nozzle 51b (the substrate G
Side), the disposition position is arbitrary. However, since the solvent jetted from the auxiliary cleaning nozzles 51c to 51f may be jetted like a fountain and scattered around,
As shown in FIG. 18, the jetting head 53 has a jetting head main body 53A having a substantially U-shaped cross section in which a front surface cleaning nozzle 51a and a rear surface cleaning nozzle 51b are arranged, and is connected to the side surface of the jetting head main body 53A and is outside the jetting main body 53A. The auxiliary jetting head 53B has a substantially U-shaped cross section and projects toward the side. The auxiliary cleaning nozzles 51c to 51f are disposed on the lower horizontal piece 53g of the auxiliary jetting head 53B, and are ejected from the auxiliary cleaning nozzles 51c to 51f. It is preferable that the solvent is received by the upper horizontal piece 53h of the auxiliary jetting head 53B. The upper and lower horizontal pieces 53g and 53h of the auxiliary jetting head 53B have arc-shaped cross sections, so that the sprayed solvent can be more reliably prevented from being scattered around.

On the other hand, from the coating mechanism 1 to the edge removing mechanism 2
As shown in FIG. 10, the second transfer mechanism 4 that transfers the substrate G to the substrate G includes a pair of transfer arms 70 that suck and hold the lower surfaces of the peripheral portions of two opposing sides of the substrate G. The arm guide motor 75 is guided by a linear guide 71 and is movable in a direction indicated by an arrow X by a driving force of an arm driving motor 75 transmitted by a tamping belt 72, a pulley 73, and a shaft 74. In this case, the transfer arm 70 and the timing belt 72 are
Has been concluded by Also, the arm drive motor 75
Is controlled by a control device 77 formed by a central processing unit (CPU) or the like, and can perform a coating process and a coating film removing process on the substrate G for a predetermined time by repeating reciprocating motion in a transport direction as desired. It is configured to be able to.

As shown in FIG. 11, a suction hole 70a connected to a vacuum suction means (not shown) through a suction passage 70b is provided on the substrate holding surface of the transfer arm 70. A pad member 70 c having a suction hole communicating with the transfer arm 70 is provided so as to be vertically displaceable with respect to the transfer arm 70. In this case, the pad member 70c
Is formed of a member made of, for example, Delrin (trade name) having an inverted crown-shaped corrosion resistance having an inward flange 70d. Then, a locking portion 70g that protrudes in an expanded manner from the upper end of a flexible synthetic rubber tubular lip seal 70f that is vertically installed and fixed around a suction hole 70a of the transfer arm 70 by a holding screw 70e. It is mounted so as to be displaceable in the vertical direction by engaging the inward flange 70d. Two pad members 70c attached in this manner are provided on each of the transfer arms 70. When the substrate G is transferred, the pad member 70c is deformed in the vertical direction due to the elastic deformation of the lip seal 70f, that is, the substrate G The substrate G can be conveyed following the plane of FIG. In addition, since the impact when receiving the substrate G can be absorbed by the elastic deformation of the lip seal 70f, damage to the substrate G can be prevented. In this case, two pad members 70c are provided, but any number such as one or three may be provided.

Further, loading of the substrate G into the coating mechanism 1
The first transport mechanism 3 for carrying out the substrate G from the edge removing mechanism 2 is formed by a main arm 80 as shown in FIGS. In this case, the main arm 80
Has a double structure in which upper and lower two-stage U-shaped arms 81a and 81b can independently move in the horizontal direction. That is, both sides of the upper arm body 81a are supported by a pair of outer frames 83 slidable along the outer linear guides 82 arranged opposite to each other, and are driven by the first drive motor 84 via the transmission pulley 85a. A timing belt (not shown) stretched over the outer pulley 85 and the outer frame 83 are fastened to the first drive motor 84.
The upper arm body 81a is configured to be capable of moving forward and backward by forward and reverse rotation of the lower arm body 81. The lower arm body 81 is movable by an inner frame 87 movable along a pair of inner linear guides 86 disposed inside the outer linear guide 82. 81b, the second
The inner frame 87 is fastened to a timing belt (not shown) that is wound around an inner pulley 89 that is driven via a transmission pulley 89a to the lower drive motor 88, and the lower portion is rotated by forward and reverse rotation of the second drive motor 88. The arm body 81b is configured to be able to move forward and backward.

The main arm 80 thus configured
Is the horizontal X and Y directions and rotation (θ) as shown in FIG.
It is formed so as to be able to move in the vertical direction (Z direction). The arm members 81a, 81
A holding claw 81c for holding the substrate G is provided upright on b. Also, the arm bodies 81a, 81b of the main arm 80
The configuration is such that the presence or absence of the substrate G mounted thereon can be detected by the sensor 150 (see FIG. 22). In addition,
In this case, instead of providing the holding claws 81c on the arm bodies 81a and 81b, the suction holes 70
a and the pad member 70c may be provided to hold the substrate G by vacuum suction.

Next, referring to FIGS. 23 and 24, an example of a procedure for applying a resist on the substrate G and removing unnecessary resist films on the side portions using the processing apparatus of the present invention configured as described above will be described. Will be explained.

First, the lid 16 of the rotating cup 12 and the fixed lid 15 of the drain cup 14 are opened.
The substrate G is held on the main arm 80 and moved onto the stationary spin chuck 10, and the substrate G is held by the vacuum chuck to support the substrate G (step [A]). Next, the substrate G is rotated at a lower speed than the steady rotation during processing by rotating the spin chuck 10 (rotation speed: for example, 200 to 800 rpm, acceleration: 300 to 500 r).
pm / sec), and the rotating cup 12 is rotated at the same speed. During this rotation, the moving arm 37a of the moving mechanism 37 rotates from the standby position 38 and is moved above the center of the substrate G, and the solvent A of the processing liquid is applied to the surface of the substrate from the solvent supply nozzle 40 of the jet head 39, for example, ethyl. For example, 26.7 cc of cellosolve acetate (ECA) is supplied, for example, dropped for 20 seconds (sec) (step [B]). Alternatively, the solvent A may be dropped while the substrate G is stationary without rotating, and then the substrate G may be rotated. After supplying the solvent A for 20 seconds in this way, the spin chuck 1
The supply of the solvent A is stopped at 0 and the rotation speed of the rotating cup 12 at the low rotation speed (step [C]). At this time, the solvent A is spread and applied to the entire surface of the substrate G.

Next, the spin chuck 10 is rotated at a high speed (first rotation speed: 500 to 1500 rpm, for example, 1000 rpm, acceleration: 300 to 600 rpm).
/ Sec), the processing liquid, for example, the resist liquid B is supplied for, for example, 5 seconds from the resist liquid supply nozzle 50a moved above the central portion of the solvent film on the substrate surface, for example, for 8 seconds, and is dropped (step [D]). The drying time of the solvent A at this time can be obtained in advance by an experiment. For example, when the surface of the substrate G is visually observed and the interference fringes of light are visible, the drying is not performed, and when the interference fringes are dried, the interference fringes become invisible, so that the time can be known. In this case 5
In the supply timing during the second, the bellows pump 57
Is controlled so that the supply amount of the resist solution can be accurately and finely controlled. After the resist solution B is supplied (dropped) for 5 seconds in this way, the supply of the resist solution B is stopped, and at the same time, the spin chuck 1 is stopped.
0 and the rotation of the rotating cup 12 are stopped (step [E]). In this state, the resist solution B is applied in substantially concentric circles of the substrate G except for the corners Ga. At this time, when the resist solution B is supplied to the entire area including the corner portion Ga of the substrate G,
Not only does the waste of the resist liquid B occur, but also there is a problem that mist of the resist liquid B scatters and adheres to the rotating cup 12 and the back surface of the substrate G. Therefore, it is desirable that the amount of the resist solution B be set to the minimum necessary amount supplied to the entire region of the substrate G with a predetermined film thickness.

Next, after the supply of the resist solution B is stopped and the resist solution supply nozzle 50 is moved to the standby position, the fixed lid 15 and the lid 16 are moved above the drain cup 14 and the rotary cup 12 by the robot arm 20. It is closed in the opening 12a, and the substrate G is sealed in the rotating cup 12 (step [F]).

With the opening of the drain cup 14 closed with the fixed lid 15 and the opening 12a of the rotating cup 12 closed with the lid 16 and hermetically closed, the spin chuck 10 and the rotating cup 12 are closed. For example, 15 sec
During the rotation, the rotation speed is higher than the first rotation speed (second rotation speed:
A range of about 1000 to 3000 rpm, for example, 1400 r
pm, acceleration: 500 rpm / sec), the resist liquid B spreads over the entire surface of the substrate G, and the thickness of the resist film is adjusted (step [G], see FIG. 24A). At this time, the thickness of the resist film is determined by the discharge amount of the resist liquid B and the time. In this state, the solvent A and the resist film are in a wet state where they are not dried.

Next, the transfer arm 70 of the second transfer mechanism 4
The substrate G is conveyed onto the mounting table 50 of the edge removing mechanism 2 by suction, and the substrate is suction-held by the mounting table 50 (step [H], see FIG. 24B). After the transfer arm 70 of the second transfer mechanism 4 that has transferred the substrate G retreats to the standby position,
The removal nozzles 51 of the edge removal mechanism 2 are set at both long sides of the substrate G on the long side, and while moving along the long side, a removal liquid such as a solvent for a resist (eg, a thinner) is applied to both sides of the edge of the substrate G. Then, the unnecessary resist film on the long side of the substrate G is melted and removed about 5 mm in width from the end (step [I], first removing step; see FIG. 24C). In addition,
The resist adhering to the edge side surface of the substrate G is also removed at the same time. At this time, the next substrate G is loaded into the coating mechanism 1 to perform a coating process. After the unnecessary resist film on the long side of the substrate G is removed, the mounting table 50 is rotated, for example, 90 degrees clockwise so that the short side of the substrate G is positioned on the removal nozzle 51 side. In addition to the 90-degree rotation, an odd multiple of 90 degrees, for example, 270
Degrees, 450 degrees,..., Or may be rotated counterclockwise. At this time, the air cylinder 5 of the position adjusting mechanism 55
9, the removal nozzle 51 is set on the short side of the substrate G (see FIG. 24D). Then, while moving the removal nozzle 51 along the short side of the substrate G, a solvent is sprayed on both sides of the edge of the short side of the substrate G to remove an unnecessary resist film on the short side of the substrate G. The work of applying the resist and removing the unnecessary resist film on the short side is completed (second removing step; FIG.
4 (e)). Thereafter, the substrate G is unloaded and transported to the next step (step [J]). As described above, immediately after the resist film is applied and formed, the substrate G can be transported to remove the peripheral edge resist.

During the first or second removal step, or at any point before or after these removal steps, the thinner is sprayed from the auxiliary cleaning nozzles 51A; It is possible to easily remove the resist film adhered to (Step [I]).
For example, as shown in FIG. 17B, when removing the resist solutions R1 and R2 attached to the back surface of each part of the substrate G, the ejection of the auxiliary cleaning nozzles 51c to 51f is controlled as follows.

Assuming that the left and right removal nozzles 51 are first moved in the direction indicated by the arrow, first, the right removal nozzle 51 is moved.
Will be described.

When the resist liquid R1 is attached to a triangular area with the short side Gs up to the distance LS1 and the long side GL up to the distance LL1, if the nozzle is located near the edge of the short side GS, the distance The auxiliary cleaning nozzle 5 together with the front surface cleaning nozzle 51a and the back surface cleaning nozzle 51b so as to be able to sufficiently clean up to LS1.
The solvent is sprayed from all of 1c to 51f.

Then, as the removal nozzle 51 moves in the direction of the arrow, the adhesion width of the resist liquid R1 becomes narrower than LS1, so that the auxiliary cleaning nozzles 51f, 51e, 51d are sequentially provided.
Stop the solvent injection. When the nozzle moves along the long side GL to the vicinity of the distance LL1, the back side of the auxiliary cleaning nozzle 51c is also stopped since the back side of the resist liquid R1 is not adhered. In this state, the removal nozzle 51 moves along the long side GL.

On the other hand, the left removing nozzle 51 is
As shown in (b), at the beginning of the movement, since the resist liquid does not adhere to the back surface of the corner, the front surface cleaning nozzle 51a
And the back surface cleaning nozzle 51b, and the solvent injection from the auxiliary cleaning nozzles 51c to 51f is stopped.

The removal nozzle 51 further moves to approach the resist liquid R2 attached to the back surface of the corner portion, and the distance LL2 from the short side GS.
In the vicinity, the solvent is first jetted from the auxiliary cleaning nozzle 51c. Like the resist solution R1, if the resist solution R2 is also attached to the triangular area, the auxiliary cleaning nozzle 5
A solvent is sprayed from 1d, 51e and 51f to dissolve and remove up to the distance LS2.

When the removal of the resist on the long side GL is completed by the left and right removal nozzles 51, the solvent injection from each nozzle is stopped so that the left and right removal nozzles 51 do not hinder the rotation of the substrate G. Evacuate. Next, the substrate G is rotated left or right by 90 °, and the process moves to the removal of the resist solution on the short side GS side. In this case, since the resist solutions R1 and R2 attached to the back surface of the corner have already been removed, it is only necessary to spray the solvent from the front surface cleaning nozzle 51a and the back surface cleaning nozzle 51b.

As described above, by controlling the solvent jetting of the auxiliary cleaning nozzles 51c to 51f within a predetermined range corresponding to the place and area of the resist liquid adhering to the back side, the necessary minimum solvent can be used. Depending on the amount, the unnecessary resist can be dissolved and removed. Also, this is to prevent the temperature of the substrate G from greatly changing due to the temperature or evaporation of the solvent, and to prevent the thickness of the resist film on the surface from changing more than necessary.

The processing apparatus of the present invention configured as described above can of course be used as an independent apparatus.
It can be used by being incorporated in an LCD substrate coating / developing processing system described below.

As shown in FIG. 25, the coating / developing processing system includes a loader unit 90 for loading / unloading the substrate G,
It mainly includes a first processing unit 91 of the substrate G and a second processing unit 92 connected to the first processing unit 91 via the relay unit 93. An exposure device 95 for exposing a predetermined fine pattern on a resist film via a transfer unit 94 can be connected to the second processing unit 92.

The loader section 90 includes a cassette 96 for storing unprocessed substrates G, a cassette mounting table 98 for mounting a cassette 97 for storing processed substrates G, and a cassette 96 on the cassette mounting table 98. , 97 and the substrate G
Tweezers 9 that can move and rotate (θ) in the horizontal (X, Y) direction and the vertical (Z) direction in order to carry in / out a substrate.
9.

The first processing section 91 is provided on the transfer path 1 of the main arm 80 which can move in the X, Y, and Z directions and rotate θ.
02, a brush cleaning device 120 for cleaning the substrate G with a brush, a jet water cleaning device 130 for cleaning the substrate G with high-pressure jet water, an adhesion processing device 105 for hydrophobizing the surface of the substrate G, A cooling processing device 106 for cooling the substrate G to a predetermined temperature is provided, and the transfer path 10
On the other side of 2, a coating processing apparatus 107 having a resist coating mechanism 1 and an edge removing mechanism 2 constituting the processing apparatus of the present invention and a coating film removing apparatus 108 are arranged.

On the other hand, similarly to the first processing section 91, the second processing section 92 has a main arm 80a that can move in the X, Y, and Z directions and can rotate θ, and the transport path 102a of the main arm 80a. A heat treatment device 109 for heating the substrate G before and after the application of the resist liquid to perform pre-baking or post-baking is disposed on one side of the substrate, and a developing device 110 is disposed on the other side of the transport path 102a.

The upper part of the first processing part 91 and the second processing part 92 configured as described above is covered with a cover, so that purified air is supplied into the processing part.

In the coating / developing processing system configured as described above, the unprocessed substrate G accommodated in the cassette 96 is taken out by the loading / unloading tweezers 99 of the loader unit 90, The brush is transferred to the main arm 80 and then transferred into the brush cleaning device 120. The substrate G that has been brush-cleaned in the brush cleaning device 120 is subsequently cleaned with high-pressure jet water in the jet water cleaning device 130. Thereafter, the substrate G is subjected to a hydrophobizing treatment by the adhesion treatment device 105 and cooled by the cooling treatment device 106, and then is carried into the coating mechanism 1 of the resist coating device 107 according to the present invention, and the above-described procedure is performed. A photoresist, that is, a photosensitive film is applied and formed, and is transferred to the edge removing mechanism 2 of the coating film removing apparatus 108 according to the present invention by the transfer arm 70 of the second transfer mechanism 4, and unnecessary resist on the side of the substrate G is removed. The film is removed.
Then, it is carried out of the edge removing mechanism 2 by the main arm 80. At this time, the resist film does not adhere to the main arm 80 since the resist film at the edge is removed.

After that, the photoresist is applied to the heat treatment apparatus 1
After heating at 09 and baking, a predetermined pattern is exposed by the exposure device 95. Then, the exposed substrate G is transported into the developing device 110, and after being developed with the developing solution, the developing solution is washed away with a rinsing solution,
The development processing is completed.

The processed substrate G that has been subjected to the development processing is accommodated in the cassette 97 of the loader unit 90, and then carried out and transferred to the next processing step.

In the above embodiment, an LCD substrate provided with one set of the coating processing apparatus 107 having the coating mechanism 1 according to the present invention and the coating film removing apparatus 108 having the edge removing mechanism 2 according to the present invention is described. Although the coating / developing system has been described, the coating processing device 107 and the coating film removing device 108
It is also possible to provide more than pairs. In this case, the coating processing apparatus 107 and the coating film removing apparatus 108 may be provided side by side, but in order to reduce the installation space, the coating processing apparatus 1
07 and the coating film removing device 108 may be laminated. In such a structure in which the coating processing device 107 and the coating film removing device 108 are stacked, the main arm 8
Except that 0, 80a can be raised to each of the devices 107, 108 in the upper stage, the same as in the above embodiment may be used.

In the above-described embodiment, the pair of left and right removal nozzles 51 first dissolves and removes the unnecessary portion of the resist film on the long side of the substrate G, and then rotates the substrate G by 90 °. Although the example in which the unnecessary resist film on the short side is dissolved and removed has been described, for example, four removal nozzles are provided,
The unnecessary resist films on the four sides of the substrate G may be simultaneously dissolved and removed.

For example, as shown in FIG. 19, removal nozzles 151A, 151B, 151C and 151D are provided. Since the configuration, the moving mechanism, and the like of the four removal nozzles are the same, only the removal nozzle 151A will be described here, and other detailed description will be omitted.

The removal nozzle 151A is attached to a slide member 153A slidably mounted on a guide rail 152A provided so as to extend in the Y direction in the figure. The slide member 153A is configured to be reciprocally movable in the Y direction by a moving mechanism (not shown) using a wire, a chain, a belt, a ball screw, a stepping motor, an air cylinder, an ultrasonic motor, a superconducting linear motor, and the like. ing.

Further, as shown in FIG. 20, the removing nozzle 151A has substantially the same configuration as the removing nozzle 51 shown in FIG. 13, and therefore, different portions will be mainly described here. In addition to the front surface cleaning nozzle 151a and the back surface cleaning nozzle 151b, an end surface cleaning nozzle 151g for cleaning the end surface (side surface) of the substrate G is provided therein. The on-off valve (not shown) inserted into the supply path is configured to be able to independently control the intermittent supply and supply amount of the solvent.

Further, a gas injection nozzle 154 on the upper surface of the substrate G, a gas injection nozzle 155 on the lower surface of the substrate G, and an injection direction in the direction of the injection head 153, That is, the gas injection nozzles 154, 15
No. 5 nozzles are arranged so as to be in the outer peripheral direction of the substrate G. Then, the injected gas passes through the jet head 153 and is exhausted from the exhaust pipe 156.

Further, as shown in FIG.
On both sides of 51A, drying gas injection nozzles 157A and 158A for injecting gas from the center direction of the long side A of the substrate G toward the peripheral portion of the upper surface are provided, for example, the removal nozzle 151.
It is provided by a mounting member (not shown) so as to be movable in the Y direction together with A. Although the drying gas nozzles 157A and 158A are shown outside the substrate G in FIG. 19, they are arranged at any positions that do not hinder the loading and unloading of the substrate G.

The other removal nozzles 151B, 151C, 15
1D has the same configuration as the removal nozzle 151A, and is denoted by a reference numeral corresponding to each part of the removal nozzle 151A. The above nozzles are nozzles for dissolving and removing unnecessary resist on the edges of the short side B, the long side C, and the short side D of the substrate G, respectively.

Next, a procedure for removing unnecessary resist by the edge removing mechanism 2A configured as described above will be described.
A transfer arm 70 transfers a substrate G, on which a resist film is formed on the upper surface by the coating mechanism 1 shown in FIG.
It is placed so as to be parallel to the direction, and is suction-held.

After the transfer arm 70 has retreated to the standby position,
Each removal nozzle 151A, 151B of the edge removal mechanism 2A,
151C and 151D are set at the edges of the four sides, and while moving along each side simultaneously, a resist solvent is sprayed onto the edges to dissolve and remove unnecessary resist films.

At the time of this removal, the spraying of the solvent from each nozzle for cleaning may be controlled in accordance with the state of resist adhesion on the edge of the substrate G. For example, when there is no adhesion of the resist on the peripheral surface of the end surface and the back surface of the substrate G and there is no need to dissolve and remove the resist, the solvent is sprayed only on the nozzle 151a for surface cleaning.

When the resist is also adhered to the end face, the solvent is also sprayed from the end face cleaning nozzle 151g. The solvent is also jetted from the nozzle 151b.

If the location of the resist film adhering to the peripheral surface of the end surface and the back surface of the substrate G is known in advance, when the removal nozzle 151A moves near this position, the nozzle for cleaning the end surface is used. Nozzle 1 for 151g and back surface cleaning
Control may be performed so that the solvent is injected from 51b. This makes it possible to reduce the consumption of the solvent.
Further, as described above, it is also possible to prevent a change in the resist film thickness on the surface.

[0116] Further, in the above dissolved and removed, N ₂ sucked to the jetting from the gas injection nozzles 154 and 155 for example, nitrogen (N ₂₎ gas,噴頭153 facing the periphery of the substrate G
Due to the presence of gas flow, the nozzle 151 for surface cleaning
a, Solvents or bubbles generated from the nozzle 151g for cleaning the end surface and the nozzle 151b for cleaning the back surface
Even if it is attempted to fly to the center side of the substrate, it is prevented from being discharged toward the jet head side due to the flow of the N ₂ gas and flying and adhering to the surface of the substrate G.

Further, prior to dissolving and removing with a solvent at the removing nozzle 151A, for example, a heated N ₂ gas is jetted from the drying gas nozzle 157A toward the resist film around the substrate G and dried. Also, it is possible to suppress the occurrence of resist swelling at the edge portion of the resist film after dissolution and removal.

Furthermore, the substrate G and the resist film are dried by injecting, for example, heated N ₂ gas from the drying gas nozzle 158A to the peripheral portion of the substrate G after the resist film is dissolved and removed. By this drying, the solvent evaporates immediately, and the edge portion of the resist film dries, so that there is no unnecessary dissolution and the resist film at the edge portion is also stabilized.

In the above description, only the removal nozzle 151A has been described, but the other removal nozzles 151B and 151
Since the same can be said for C and 151D, the description is omitted.

Each of the removal nozzles 151A, 151B,
Although an example in which independent moving mechanisms are provided as moving mechanisms of 151C and 151D has been described, other mechanisms may be used as long as the four sides can be dissolved and removed at the same time. It may be configured to be attached to a common mechanism and to be movable by two moving mechanisms. Further, the removal nozzles 151A, 151
All of B, 151C, and 151D may be configured to be movable by one common moving mechanism.

In the case of the independent moving mechanism, each moving speed may be independently set and controlled according to the state of adhesion of the resist on each side.

Further, in FIG. 19, the long side of the substrate G is held so as to be parallel to the Y direction, but the short side is held so as to be parallel to the Y direction.
B, 151C and 151D may be arranged correspondingly. For example, by using an air cylinder or the like to adjust the stroke of each removal nozzle,
Stretch and respond.

Further, the temperature of the substrate G, the solvent, and the N ₂ gas may be adjusted to the optimum temperature for dissolution to promote the dissolution and removal of the resist film. As the temperature control of the substrate G, for example, a temperature controlled atmosphere around the substrate G, clean air or N ₂ gas whose temperature is controlled on the upper surface of the substrate G, clean air whose temperature is controlled on the back surface of the substrate G, N ₂ gas is supplied, the temperature is controlled by the mounting table 159, or the temperature is controlled by infrared rays, microwaves, or the like.

Further, in the above embodiment, an example in which one removal nozzle is provided for one side of the substrate G has been described.
A plurality of, for example, two may be provided to shorten the moving distance, or may be configured to be dissolved and removed twice. In this case, the type of the solvent may be different. Further, the dissolution removal position may be different.

Further, in the above-described embodiment, an example of a configuration in which the substrate G is fixed and each of the removal nozzles is moved has been described. May be configured to simultaneously dissolve and remove the four sides while moving to the side.

In the above embodiment, the case where the processing apparatus and the processing method of the present invention are applied to the coating processing of the LCD substrate has been described. Needless to say, the present invention can be applied to a method and an apparatus for removing an unnecessary coating film on the edge of the processed substrate.

[0127]

1) Claims 1, 2, 4, 5, 7 and 16
According to the inventions described in ( 18) to (20), the coating liquid is supplied and diffused on one surface of the square substrate to be processed carried into the coating mechanism, the lid is closed in the processing container, and the substrate to be processed is placed in the processing container. After enclosing the substrate, the substrate to be processed in the processing container in which the lid is closed is rotated to form a coating film, and then transported to the edge removing mechanism, and the opposing two sides of the substrate to be processed or each Unnecessary coating film on the edge of the substrate can be removed while spraying the removing liquid from the removing nozzle that moves along the side, so that the coating film can be uniformly processed and the substrate to be processed can be removed. Unnecessary coating films at the edges can be quickly and reliably removed, and the product yield can be improved.
In addition, the substrate is transported to the coating mechanism by the first transport mechanism, is unloaded from the edge removing mechanism, and is transported from the coating mechanism to the edge removing mechanism by the second transport mechanism. While miniaturizing the device, and
Throughput can be improved. Also wash the surface
Of the removal liquid sprayed from the cleaning nozzle and the backside cleaning nozzle
The removal liquid scattered by the collision (interference)
Can prevent it from adhering to the coating film on the surface.
Thus, uniformity of the thickness of the coating film can be maintained .

2) According to the third and nineteenth aspects of the invention, the solvent of the coating liquid is applied to one surface of the square substrate to be processed carried into the coating mechanism and diffused, and then applied to the substrate. Is supplied and diffused, the lid is closed in the processing container, the substrate to be processed is sealed in the processing container, and then the substrate to be processed in the processing container with the lid closed is rotated to form a coating film. Since the thickness is adjusted, the amount of the coating solution can be reduced in addition to the above 1).

3) According to the invention described in the sixth, eleventh and twenty-first aspects, the edge removing mechanism is provided with the auxiliary cleaning nozzle for spraying the removing liquid onto the back surface of the corner of the substrate to be processed, thereby enabling the edge of the substrate to be processed. Since the coating film adhered to the back surface of the corner can be removed, in addition to the above 1), the coating film adhered to the back surface of the corner can be removed, and the removal of the coating film can be further ensured. it can.

[0130] 4 ) According to the eighth aspect of the present invention, an exhaust port is provided on the side of the removing nozzle, and the exhaust port is connected to the exhaust device via an exhaust pipe to remove the coating film. Since the removing liquid is formed so as to be dischargeable, in addition to the above 1) and 2), the removing liquid sprayed from the removing nozzle and used for removing the coating film can be discharged to the outside.

5 ) According to the invention of claim 9 , at least one of the front surface cleaning nozzle and the back surface cleaning nozzle is
Since the removal liquid ejected from the nozzle is directed to the peripheral direction of the substrate to be processed by bending the substrate in an inclined manner from the inner side to the outer side of the substrate to be processed, in addition to the above 1), 2) The removal liquid can be prevented from adhering to the central coating film.

6 ) According to the tenth aspect of the present invention, since a plurality of removal nozzles that move along two opposing sides of the substrate to be processed are provided at appropriate intervals in the movement direction, the above 1) is provided. In addition to this, the removal performance can be further improved.

[0133] 7) According to the invention of claim 12, wherein the removal nozzles, since further comprises an end surface cleaning nozzle for cleaning the side surface portion of the substrate, the 1), 2) in addition to the substrate to be processed The coating film adhering to the side surface (end surface) can be reliably removed.

8 ) According to the thirteenth aspect of the present invention, the removal nozzle includes a front surface cleaning nozzle that sprays the removal liquid onto the upper surface of the substrate to be processed and a back surface cleaning nozzle that sprays the removal liquid onto the lower surface of the substrate to be processed. A nozzle and an end-face cleaning nozzle that sprays a removal liquid onto the side surface of the substrate to be processed.
Since the removing liquid is formed so as to be controllable so as to be sprayed in accordance with the adhesion state of the coating film on the edge of the substrate to be processed, in addition to the above 1) and 2) , it may be provided on the upper surface, the end surface or the peripheral portion of the rear surface of the substrate to be processed An unnecessary coating film can be removed by spraying a removing liquid in accordance with the adhesion state of the applied coating film.

9 ) According to the fourteenth aspect of the present invention, since there is a flow of gas exhausted from the exhaust pipe toward the periphery of the substrate to be processed, the removal liquid is processed in addition to the above 1) and 2). It is possible to prevent flying adhesion to the center side of the substrate.

10 ) According to the invention described in claim 15 , in addition to the above 1) and 2), prior to the removal of the coating film by the removing liquid jetted from the removing nozzle, the coating film around the substrate to be processed is removed. Drying gas can be sprayed toward the coating film to dry it, thereby suppressing the occurrence of swelling of the coating film at the edge of the coating film after the removal. In addition, since the processing target substrate and the coating film are dried by injecting a dry gas to a peripheral portion of the processing target substrate after the coating film is removed,
The removal liquid is immediately evaporated to prevent unnecessary removal of the coating film, and to stabilize the coating film at the edge.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a processing apparatus of the present invention.

FIG. 2 is a sectional view of a coating mechanism according to the present invention.

FIG. 3 is an enlarged sectional view of a main part of FIG. 2;

FIG. 4 is a partially sectional perspective view showing a processing container and a lid according to the present invention.

FIG. 5 is a cross-sectional view showing different modifications of the tip of the resist solution supply nozzle according to the present invention.

FIG. 6 is an enlarged perspective view showing a jet head used in the processing apparatus.

FIG. 7 is a sectional view of a jet head.

FIG. 8 is a schematic cross-sectional view showing another example of the method of dropping the processing liquid.

FIG. 9 is a schematic cross-sectional view illustrating still another example of a method of dropping a processing liquid.

FIG. 10 is a schematic perspective view showing a second transport mechanism according to the present invention.

FIG. 11 is a plan view and a sectional view of a main part of a second transport mechanism.

FIG. 12 is a side view showing an edge removing mechanism according to the present invention.

FIG. 13 is a side view showing a part of the removing nozzle in the present invention in cross section.

FIG. 14 is a schematic perspective view of a removal nozzle.

FIG. 15 is a perspective view showing an attached state of an auxiliary cleaning nozzle according to the present invention.

FIG. 16 is a schematic plan view showing different mounting states of the auxiliary cleaning nozzle.

FIG. 17 is a side view showing a part of another embodiment of the auxiliary cleaning nozzle in a cross section and an explanatory view of a specific example of cleaning.

FIG. 18 is a perspective view showing still another form of the auxiliary cleaning nozzle.

FIG. 19 is a schematic plan view showing another embodiment of the edge removing mechanism.

FIG. 20 is a side view showing another form of the removal nozzle in cross section.

FIG. 21 is a perspective view showing a main part of a main arm of the first transport mechanism according to the present invention.

FIG. 22 is a side view showing a drive mechanism of the main arm.

FIG. 23 is a flowchart showing the procedure of the processing method of the present invention.

FIG. 24 is an explanatory diagram showing a procedure of a method of removing an edge coating film according to the present invention.

FIG. 25 is a perspective view showing an example of an LCD substrate coating / developing system to which the processing apparatus of the present invention is applied.

[Explanation of symbols]

 G LCD substrate (substrate to be processed) 1 Coating mechanism 2, 2A Edge removing mechanism 3 First transport mechanism 4 Second transport mechanism 10 Spin chuck (holding means) 12 Rotating cup (processing vessel) 16 Lid 40 Solvent supply Nozzle (solvent supply means) 42 Resist liquid supply nozzle (coating liquid supply means) 50 Mounting table (mounting means) 51 Removal nozzle 51a Nozzle (front surface cleaning nozzle) 51b Nozzle (back surface cleaning nozzle) 51A, 51c to 51f Auxiliary cleaning nozzle Reference Signs List 70 Transfer arm 70a Suction hole 70c Pad member 80 Main arm

────────────────────────────────────────────────── ─── Continuing on the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 21/30 564D (72) Inventor Oden Den Kumamoto, Kikuchi-gun Otsu-machi O-sha Takao character Heisei 272-4 Tokyo Electron Kyushu Co., Ltd. Otsu In-house (56) References JP-A-5-175117 (JP, A) JP-A-5-114555 (JP, A) JP-A-3-76109 (JP, A) JP-A-60-175569 (JP, A) JP-A-4-171072 (JP, A) JP-A-6-99124 (JP, A) JP-A-2-1577763 (JP, A) JP-A-6-349729 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) B05C 11/08 B05D 1/40 G03F 7/16 H01L 21/027 H01L 21/68

Claims (21)

(57) [Claims] 1. A holding means for holding and rotating a rectangular substrate to be processed with one surface facing upward, a cup-shaped processing container surrounding the holding means, and a lid for closing an opening of the processing container. A coating mechanism having a coating liquid supply means for supplying a coating liquid to the body and the substrate to be processed; An edge removing mechanism for removing, a first transport mechanism for carrying in the substrate to be processed into the coating mechanism and carrying out the substrate to be processed from the edge removing mechanism, and a transport mechanism for removing the substrate from the coating mechanism to the edge removing mechanism; A second transport mechanism for transporting the processing substrate and the edge removing mechanism for holding the substrate to be processed;
Mounting means provided on the edge removing mechanism and facing the substrate to be processed.
Along the two sides of the substrate
A pair of spraying the removing liquid on at least the upper surface of the lower surface
A removing nozzle, wherein the removing nozzle sprays a removing liquid on the upper surface of the substrate to be processed.
The nozzle for cleaning the front surface and the lower surface of the substrate to be processed.
It is formed with a back surface cleaning nozzle that sprays the
The nozzles for the surface cleaning nozzle and the nozzles for the back surface cleaning nozzle
Does not allow the removal liquid ejected from these nozzles to interfere with each other.
A processing device, which is displaced to a different position . 2. A holding means for holding and rotating a rectangular substrate to be processed with one surface facing upward, a processing vessel having a cup shape surrounding the holding means, and a lid for closing an opening of the processing vessel. A coating mechanism having a coating liquid supply means for supplying a coating liquid to the body and the substrate to be processed; An edge removing mechanism for removing, a first transport mechanism for carrying in the substrate to be processed into the coating mechanism and carrying out the substrate to be processed from the edge removing mechanism, and a transport mechanism for removing the substrate from the coating mechanism to the edge removing mechanism; A second transport mechanism for transporting the processing substrate and the edge removing mechanism for holding the substrate to be processed;
Mounting means , provided on the edge removal mechanism, and provided on each side of the substrate to be processed.
Along the edge of the substrate to be processed
A plurality of pulverizers for spraying the pour liquid on at least the upper surface of the surfaces.
And a removing nozzle, wherein the removing nozzle sprays a removing liquid on the upper surface of the substrate to be processed.
The nozzle for cleaning the front surface and the lower surface of the substrate to be processed.
It is formed with a back surface cleaning nozzle that sprays the
The nozzles for the surface cleaning nozzle and the nozzles for the back surface cleaning nozzle
Does not allow the removal liquid ejected from these nozzles to interfere with each other.
A processing device, which is displaced to a different position . 3. The processing apparatus according to claim 1, wherein the coating mechanism further includes a solvent supply unit that supplies a solvent of the coating liquid to the substrate to be processed. 4. The processing apparatus according to claim 1, wherein said holding means is formed so as to be capable of horizontal rotation and vertical movement. 5. The processing apparatus according to claim 1, wherein said processing container is formed so as to be rotatable together with holding means. 6. The processing apparatus according to claim 1, further comprising an auxiliary cleaning nozzle for spraying a removing liquid onto the back surface of the corner of the substrate to be processed. 7. A processing apparatus according to claim 1, wherein said placing means is formed so as to be able to rotate horizontally. 8. A removing liquid provided for removing a coating film by providing an exhaust port opening to the removing nozzle side at a jet head to which the removing nozzle is attached, connecting the exhaust port to an exhaust device via an exhaust pipe. The processing apparatus according to claim 1 , wherein the processing apparatus is formed so as to be capable of discharging. 9. The method according to claim 1, wherein at least one of the front surface cleaning nozzle and the back surface cleaning nozzle is bent in an inclined manner from the inside to the outside of the substrate to be processed.
3. The processing device according to 1 or 2 . 10. The processing apparatus according to claim 1, wherein a plurality of said pair of removal nozzles are provided at appropriate intervals in the moving direction. 11. The removal nozzle is provided substantially in parallel with a back surface cleaning nozzle that sprays a removal liquid onto the lower surface of the substrate to be processed, and is appropriately spaced inward from an edge of the substrate to be processed. be provided with a plurality of auxiliary cleaning nozzle provided have further processing apparatus according to claim 1 or 2 wherein. 12. The removal nozzle, the processing apparatus according to claim 1 or 2, wherein the further comprising an end surface cleaning nozzle for cleaning the side surface portion of the substrate. 13. The removal nozzle includes a front surface cleaning nozzle that sprays a removal liquid onto an upper surface of a substrate to be processed, a back surface cleaning nozzle that sprays a removal liquid onto a lower surface of the substrate to be processed, An end surface cleaning nozzle for injecting the removal liquid onto the side surface is provided, and the front surface cleaning nozzle, the back surface cleaning nozzle, and the end surface cleaning nozzle correspond to a coating film adhesion state at an edge of the substrate to be processed. The processing apparatus according to claim 1 , wherein the processing apparatus is formed so as to be controllable so as to inject the removing liquid. 14. A gas injection nozzle, which is disposed on upper and lower sides of an edge of a substrate to be processed, and has a nozzle directed toward a peripheral outer side of the substrate to be processed; The processing apparatus according to claim 1, further comprising an exhaust pipe configured to exhaust the exhausted gas. 15. The drying apparatus according to claim 15, wherein the edge removing mechanism further includes a drying gas injection nozzle that is provided on both sides of the removal nozzle and injects gas from a center of the substrate to be processed toward a peripheral portion. The processing device according to claim 1. 16. A step of carrying in a rectangular substrate to be processed to be held on a holding means in a processing container, and a step of supplying a coating liquid to the substrate to be processed and rotating the substrate so as to diffuse it on one surface of the substrate to be processed. Closing the lid in the processing container and enclosing the substrate to be processed in the processing container; and rotating the substrate to be processed in the processing container in which the lid is closed to form a coating film. Adjusting the process, transporting the substrate on which the coating film is formed to the edge removing mechanism, moving along two opposing sides of the substrate , and
A surface cleaning nozzle that sprays the removal liquid onto the upper surface of the processing substrate and
Cleaning nozzle that sprays the removal liquid onto the lower surface of the substrate
A step of removing the coating film at the edge while spraying the removing liquid on the upper and lower surfaces so as not to interfere with each other from the position of the substrate, and a step of carrying out the substrate to be processed from the edge removing mechanism. Processing method. 17. The method according to claim 17, wherein the step of removing the coating film includes a first removing step of spraying a removing liquid onto an edge of a first side of the rectangular substrate on which the coating film is formed to remove the coating film. 17. The processing method according to claim 16 , further comprising: a second removing step of removing a coating film on the edge by spraying a removing liquid onto an edge of the second side of the substrate to be processed. 18. A step of carrying in a rectangular substrate to be processed to be held on a holding means in a processing container, and a step of supplying a coating liquid to the substrate to be processed and rotating the substrate so as to diffuse it on one surface of the substrate to be processed. Closing the lid in the processing container and enclosing the substrate to be processed in the processing container; and rotating the substrate to be processed in the processing container in which the lid is closed to form a coating film. Adjusting the process; transporting the substrate on which the coating film has been formed to an edge removing mechanism; moving simultaneously along each side of the substrate,
A surface cleaning nozzle for injecting a removing liquid onto the upper surface of the
Back surface cleaning nozzle that sprays the removal liquid onto the lower surface of the substrate to be processed
A step of removing the coating film on the edge while spraying the removing liquid on the upper and lower surfaces to positions that do not interfere with each other , and a step of carrying out the substrate to be processed from the edge removal mechanism. Processing method to do. 19. The method according to claim 16 , further comprising, before supplying the coating liquid to the substrate, supplying a solvent of the coating liquid onto one surface of the substrate.
The processing method described. 20. The processing method according to claim 16 , wherein in the step of adjusting the thickness of the coating film, the substrate to be processed is rotated together with the processing container having the lid closed. 21. The method according to claim 16 , further comprising the step of injecting a removing liquid onto the back surface of the corner of the substrate to be processed to remove the coating film attached to the back surface of the corner.
8. The processing method according to 8 .