JP3189113B2 - Processing device and processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing method for forming a liquid coating film using a solvent such as a resist film on a substrate such as an LCD substrate or on a layer formed thereon. It is about.

[0002]

2. Description of the Related Art Generally, in the field of semiconductor technology, LCDs are used.
When a semiconductor layer, an insulator layer, and an electrode layer formed on a substrate are selectively etched into a predetermined pattern, a resist film is formed on the surface of the layer as masking of a pattern portion, similarly to the case of a semiconductor wafer. That is being done.

For example, as a method of forming a resist film, a rectangular LCD substrate (hereinafter, referred to as a substrate) is placed and fixed on a mounting table provided in the processing container, and an opening of the processing container is covered. Close the body, rotate the processing container and the mounting table, for example, a resist solution composed of a solvent and a photosensitive resin is dropped into the center of the upper surface of the substrate, and the resist solution is rotated with the rotational force and centrifugal force of the substrate. There is known a processing method of radially diffusing from a central portion of a substrate toward a peripheral portion to apply.

[0004]

However, in this type of conventional processing method, the solvent in the resist solution evaporates during the process of diffusing the resist solution from the center position of the substrate toward the peripheral portion, In addition, since the peripheral speed of the substrate is much greater at the outer peripheral portion than at the center position, the amount of the resist liquid scattered is large. For this reason, the scattered resist solution adheres to the back surface of the corner portion of the substrate or the like or to the processing container, and not only contaminates the substrate and the processing container, but also dries and causes particles to be generated, which causes a problem of lowering the yield. Was. In addition, since a negative pressure is generated in the processing container due to the rotation process, a large force is required to open the lid after the process, so that the lid must be opened carefully, which causes a problem of lowering the throughput. there were.

The present invention has been made in view of the above circumstances, and prevents contamination of a substrate and a processing container by a mist of a processing solution generated in a processing step, thereby improving a yield and easily opening a cover. It is an object of the present invention to provide a processing apparatus and a processing method capable of improving throughput.

[0006]

In order to achieve the above object, a first processing apparatus of the present invention comprises a holding means for supporting a substrate with one surface facing upward and rotating the substrate; A processing container that has a shape of a cup surrounding it, and has an exhaust hole on the bottom side and rotates together with the holding means ,
Close the opening of the processing container and rotate with the processing container
A cover, an inert gas supply means capable of appearing and retracting in the processing container, and a processing liquid supply means for supplying a processing liquid to the substrate, wherein the inert gas supply means is
It is characterized in that it is mounted on a mounting member that can be linked to the step only in the vertical direction (claim 1).

Further, a second processing apparatus according to the present invention comprises a holding means for supporting one surface of a substrate facing upward, rotating the substrate, a cup surrounding the substrate, and a bottom portion thereof. Has side vents and rotates with holding means
The processing container to be closed, and the opening of the processing container
A lid which rotates with hairdressing device, infested the processing vessel
Possible inert gas supply means, and emerges and retracts in the processing vessel
Comprising a container washing means as possible, a treatment liquid supply means for supplying a processing liquid to the substrate, and the inert gas supply means
Is attached to a mounting member that can be linked only vertically to the holding means.
It is characterized in that the digits (claim 2).

[0008] A third processing apparatus according to the present invention comprises a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
One, rotating together with the holding means have an exhaust hole on the bottom side of its
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Possible inert gas supply means, and emerges and retracts in the processing vessel
A container cleaning means capable of supplying a processing liquid to the substrate;
A liquid supply means, and the inert gas supply means.
And container cleaning means can be linked only vertically with the holding means
It is characterized by being attached to a
Claim 3) .

[0009] In the processing apparatus of the present invention, it movably form the retaining means in the vertical direction is preferable (claim 4).

A fourth processing apparatus according to the present invention includes a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Means for supplying a processing liquid to the substrate.
And a processing liquid supply means for supplying the inert gas.
Provide the supply means on the outer peripheral surface of the hollow annular body at appropriate intervals.
It is formed by an annular nozzle with many small holes.
(Claim 5) .

In the processing apparatus according to the present invention, the inert gas
The gas supply means can be linked only vertically with the holding means.
It is more preferable to attach to the attachment member (claim 6) .

A fifth processing apparatus according to the present invention includes a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Possible inert gas supply means, and emerges and retracts in the processing vessel
A container cleaning means capable of supplying a processing liquid to the substrate;
A liquid supply means, and the inert gas supply means.
A large number of the outer peripheral surface of the hollow annular body at appropriate intervals
Characterized by being formed by ring-shaped nozzle having a small hole
(Claim 7) .

In the processing apparatus according to the present invention, the inert gas
The gas supply means and the container cleaning means are vertically
It is preferable to attach to an attachment member that can only be linked (claim
Item 8) .

A sixth processing apparatus according to the present invention is characterized in that
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Possible inert gas supply means, and emerges and retracts in the processing vessel
A container cleaning means capable of supplying a processing liquid to the substrate;
A liquid supply means, and
Bottom cleaning nozzle that sprays cleaning liquid toward the bottom of the physical container
The body and the side that sprays the cleaning liquid toward the inside of the processing vessel
The cleaning nozzle body, the contact area between the processing container and the lid, and the bottom of the lid
Consists of a lid cleaning nozzle that sprays cleaning liquid toward the surface
(Claim 9) .

Further, a seventh processing apparatus according to the present invention comprises a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Means for supplying a processing liquid to the substrate.
And a processing liquid supply means for supplying the processing liquid.
The processing liquid can be supplied to the center of the lid that closes the opening.
A hollow head is formed, and the lid can be closed on this hollow head
(Claim 10) .

An eighth processing apparatus according to the present invention is characterized in that a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
A processing container that, closes the opening of the processing container, processing
A lid that rotates with the processing container,
Possible inert gas supply means, and emerges and retracts in the processing vessel
A container cleaning means capable of supplying a processing liquid to the substrate;
Water supply means, and an opening of the processing container
A hollow head that can supply the processing liquid is located at the center of the lid that closes.
The hollow head is provided with a lid that can be closed.
(Claim 11) .

In a ninth processing apparatus according to the present invention, a substrate
Support with the one side facing up, and rotate the substrate.
Holding means, and a cup shape surrounding the substrate,
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Means for supplying a processing liquid to the substrate.
And a processing liquid supply means for supplying the processing liquid.
A hollow head is formed at the center of the lid that closes the opening
The processing liquid is supplied into the head via a bearing.
Characterized in that a mounting member of the feeding means is mounted.
(Claim 12) .

Further, a tenth processing apparatus according to the present invention
Support the plate with one side facing up and rotate the substrate
Holding means, and a cup shape surrounding the substrate;
It has an exhaust hole on the bottom side and rotates with the holding means.
The processing container to be closed, and the opening of the processing container
A lid that rotates with the processing container,
Possible inert gas supply means, and emerges and retracts in the processing vessel
A container cleaning means capable of supplying a processing liquid to the substrate
Processing liquid supply means, and an opening of the processing container
When a hollow head is formed in the center of the lid that closes
In both cases, processing liquid supply means
It is characterized by attaching a mounting member of
Claim 13) .

In the processing apparatus of the present invention, the processing capacity
It is preferable to form the container rotatable with the holding means
(Claim 14) .

On the other hand, a first processing method according to the present invention is a method of forming a coating film by rotating a substrate accommodated in a processing container together with the processing container and supplying a processing liquid onto one surface of the substrate. Assuming that, the processing liquid is supplied to the substrate,
Rotating and diffusing it over one surface of the substrate; closing the lid in the processing container and enclosing the substrate in the processing container; and rotating the processing container and the substrate with the lid closed. The process of adjusting the thickness of the coating film, and the inert gas is radiated from the center side into the above-mentioned processing vessel in which the rotation is stopped.
And supplying the to open the lid, the step of unloading the substrate from the processing vessel, in a state of closing the lid to the processing vessel as required, the bottom surface of the processing container, the inner surface and the processing vessel And a step of injecting the cleaning liquid onto the contact portion of the lid and the lower surface of the lid (claim 15).

[0021] Oite processing method of the present invention, as the inert gas <br/>, can be used, for example, nitrogen (N2) gas or argon (Ar) gas or the like.

According to a second processing method of the present invention, similarly to the first processing method, the substrate accommodated in the processing container is rotated together with the processing container, and the processing liquid is deposited on one surface of the substrate. On the premise of supplying and forming a coating film,
Supplying a processing liquid to the substrate, rotating the substrate, and diffusing the processing liquid on one surface of the substrate; closing the lid in the processing container, enclosing the substrate in the processing container; and closing the lid. Rotating the processed processing container and the substrate to adjust the film thickness of the coating film; and supplying radially an inert gas from the center side into the processing container in which the rotation is stopped. (Claim 16 ).

[0023]

According to the present invention by the above technical means, the processing liquid is supplied onto one surface of the substrate, rotated and diffused on one surface of the substrate, and then the lid is closed in the processing container, and the substrate is closed. After sealing in the processing container, the processing container and
And the substrate is rotated to adjust the thickness of the coating film. afterwards,
By supplying the inert gas into the processing container, mist of the processing liquid scattered in the processing container can be eliminated, and the pressure in the processing container can be released. Thereby, the mist of the processing liquid generated during the processing can be suppressed from adhering to the substrate and the processing container. Further, by releasing the reduced pressure in the processing container, the lid can be easily opened.

Further, if necessary, for example, the cleaning liquid is sprayed into the processing container with the lid closed, so that the bottom and side surfaces of the processing container, the contact portion between the processing container and the lid, and the lid are formed. The processing liquid, particles, and the like attached to the lower surface of the substrate can be removed by washing.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Here, a case where the processing apparatus and the processing method of the present invention are applied to an apparatus and a method for forming a resist film on an LCD (liquid crystal display) substrate (glass substrate) will be described.

As shown in FIG. 1, the above-mentioned coating film forming apparatus has a rectangular substrate as an object to be processed, for example, an LCD substrate G
A holding means for holding a substrate (hereinafter, referred to as a substrate) in a horizontal state by vacuum, for example, a spin chuck 10, and a processing chamber 11 surrounding an upper portion and an outer peripheral portion of the spin chuck 10.
Cup-shaped processing container 12 having an opening at the top (hereinafter referred to as a rotating cup), and an opening 1 of the rotating cup 12
A lid 16 which is attached (detachable) so as to be able to be closed on 2a, a flat rectifying plate 13 which is vertically suspended below the lid 16 and protrudes outward from the outer peripheral edge of the substrate G; Cup-shaped fixed container 1 that is open at the top and surrounds the outer periphery of the container 12
4 (hereinafter referred to as a drain cup), a fixed lid 15 that is attached (detachable) to the opening of the drain cup 14 so that it can be closed, and the lid 16 and the fixed lid 15 are moved to the closed position and the standby position. A robot arm 20, which is a lid moving means,
A drive motor 21 for rotating the spin chuck 10 and the rotating cup 12, a supply nozzle 40 (solvent supply unit) for a solvent (solvent) A of a processing liquid configured to be movable to a position above the spin chuck 10, A jet head 60 in which a supply nozzle 50 (processing liquid supply means) for a processing liquid, for example, a resist solution B is brought close to and integrally attached, and a moving means for gripping the jet head 60 and moving it between a jet front standby position and a substrate upper position. A certain nozzle moving mechanism 70.

In this case, the solvent A and the resist solution B flowing through the solvent supply path and the resist solution supply path from the nozzles 40 and 50 are set at a preset temperature (for example, 23 ° C.). A temperature adjusting mechanism 61 for circulating and supplying the temperature adjusting liquid C is provided. A mounting member 34 that can move up and down together with the spin chuck 10 is mounted between the spin chuck 10 and the spin chuck 10 via a bearing 34 a at a position near the lower portion of the spin chuck 10. Cleaning nozzle 35
(Container cleaning means) and a supply nozzle 36 ( inert gas supply means) for an inert gas such as nitrogen (N ₂ ) gas are attached.

The spin chuck 10 is formed of a heat-resistant synthetic resin member made of, for example, polyether ether ketone (PEEK), and is driven based on a preset program to change the rotation speed. Is rotatable (self-rotating) in the horizontal direction via a rotating shaft 22 that is rotated by the driving of the rotary shaft 22, and can be moved in the vertical direction by driving a lifting cylinder 23 connected to the rotating shaft 22. . In this case, the rotating shaft 22 is slidably connected to a spline bearing 27 fitted on the inner circumferential surface of a rotating inner cylinder 26a rotatably mounted on the inner circumferential surface of the fixed collar 24 via a bearing 25a. ing. A driven pulley 28a is mounted on the spline bearing 27,
A belt 29a is stretched between the driven pulley 28a and a driving pulley 21b mounted on a driving shaft 21a of the driving motor 21. Therefore, the rotation of the rotating shaft 22 via the belt 29a by the driving of the drive motor 21 causes the spin chuck 10 to rotate. The lower side of the rotating shaft 22 is disposed in a cylinder (not shown). The rotating shaft 22 is connected to the lifting cylinder 23 via a vacuum seal 30 in the cylinder, and the rotating shaft 22 is driven by the lifting cylinder 23. Are configured to be able to move up and down. In the spin chuck 10, as shown by the imaginary line in FIG. 2, a support arm portion 10a is extended, and a locking pin 10b is protruded from the tip of the supporting arm portion 10a. Each corner portion can be configured to be locked.

The rotating cup 12 is formed of, for example, a stainless steel member, and has a connecting cylinder 31 fixed to the upper end of a rotating outer cylinder 26b mounted on the outer peripheral surface of the fixed collar 24 via a bearing 25b. The bottom portion 12b of the rotating cup 12 and the spin chuck 10
An O-ring 32 for sealing is interposed between the lower surface of the spin chuck 10 and the airtightness is maintained in a state where the spin chuck 10 descends and comes into contact with the O-ring 32. Further, the drive from the drive motor 21 is transmitted to the rotary cup 12 by the driven pulley 28b mounted on the rotary outer cylinder 26b and the belt 29b stretched over the drive pulley 21b mounted on the drive motor 21 so that the rotary cup 12 is rotated. It is configured to be rotated. In this case, the diameter of the driven pulley 28b is formed to be the same as the diameter of the driven pulley 28a mounted on the rotary shaft 22, and the same driving motor 21
9a and 29b are stretched, so that the rotating cup 12
And the spin chuck 10 rotate the same. A labyrinth seal portion 33 is formed on the facing surface of the fixed collar 24 and the rotating inner cylinder 26a and the rotating outer cylinder 26b to prevent dust from entering the rotating cup 12 from the lower drive system during the rotation process. (See FIG. 3).

The rotating cup 12 has a tapered surface 12e in which the inner surface of the side wall 12c is reduced in diameter toward the upper side. A hole 12d is formed.

A contact ring 16a made of, for example, Delrin (trade name) is fixed to the lower surface of the periphery of the lid 16 that closes the opening 12a of the rotary cup 12 in order to avoid metal-to-metal contact with the rotary cup 12. The robot arm 2 is provided at the center of the lid 16 via a bearing 16b.
A support column 19 supported at 0 is attached, and an air inlet 16 c is provided at the center of the support column 16.

By providing the air inlet 16c in the lid 16 and the exhaust hole 12d in the rotary cup 12, the inside of the processing chamber 11 becomes negative pressure with the rotation of the rotary cup 12 so that the air inlet 16c is formed. 16c flows into the rotary cup 12 and the air is flowed by the current plate 13 to the rotary cup 12.
Is discharged from the exhaust hole 12 d along the inner wall of the processing chamber 11, the mist of the resist solution can be prevented from re-adhering to the substrate G, and the processing chamber 11 can be prevented from rotating when the rotating cup 12 rotates.
It is possible to prevent the inside from becoming an excessive negative pressure.

The air inlet 16c is connected to the supporting column 1
9 may be provided directly, or may be formed by a pipe member inserted into a through hole formed in the support cylinder 19. In particular, when the air inlet 16c is formed by a pipe member, the solvent A or the resist solution B to be used is used.
It is preferable because the hole diameter of the pipe member can be selected and used depending on the type of the material, the drying property, the viscosity and the like.

On the other hand, on the outer peripheral side of the bottom of the drain cup 14, a plurality of drainage ports 14a are provided concentrically, and at appropriate positions (for example, four locations in the circumferential direction) on the inner peripheral side of the drainage ports 14a. Is provided with an exhaust port 14b connected to an exhaust device (not shown). In this case, the drain port 14a is opened in the tangential direction of the rotation direction (for example, clockwise) of the substrate G and the rotation cup 12. Thus, the drain port 14a is connected to the substrate G
The reason why the mist is provided in the tangential direction of the rotation direction of the rotating cup 12 is that the mist of the resist liquid scattered along with the rotation of the substrate G and the rotating cup 12 is quickly discharged to the outside.

The fixed lid 15 is formed of a stainless steel member supported by the supporting column 19, and the lower surface of the outer periphery of the fixed lid 15 avoids contact between the metal and the drain cup 14. For this purpose, a ring-shaped contact member 15a made of Delrin (trade name) is fixed. Also, a plurality of air supply holes 15 b
Is provided.

As described above, a plurality of air supply holes 15a are provided on the concentric circle on the center side of the fixed lid 15, and the drain cup 1 is provided.
4 is provided with an exhaust port 14b at the bottom, so that when the rotating cup 12 rotates, the drain cup 1
4 flows along the outer wall of the rotating cup 12, and is scattered by the centrifugal force in the processing chamber 11 during the rotation processing, and the mist flowing into the drain cup 14 through the exhaust hole 12 d is generated by the rotating cup 12. The air can be prevented from rising to the upper side and discharged to the outside from the exhaust port 14b.

The cover 16 needs to be fixed to the opening 12a of the rotating cup 12 and rotated integrally during the rotation process. Therefore, as shown in FIG. 4, a fitting recess 17b is provided on the lower surface of the contact ring 16a, and the fitting recess 17b is fitted to a fixing pin 17a protruding above the rotating cup 12, and the lid 16 is attached. It is fixed to the rotating cup 12. In this case, by forming the top of the fixing pin 17a in a spherical shape, dust generated by contact with the fitting recess 17b is reduced. Note that the fixing pin 17a does not necessarily need to protrude toward the rotating cup, and the fixing pin 17a
May be projected, and a fitting recess 17b may be provided on the rotating cup side. Further, the inside of the fitting recess 17b may be connected to suction means (not shown) to discharge dust generated by the contact between the fixing pin 17a and the fitting recess 17b to the outside.

When the lid 16 is opened and closed, the robot arm 20 is inserted under the bulging head 18 protruding from the upper surface of the lid 16 as shown by an imaginary line in FIG. After engaging a locking pin 20a protruding from the robot arm 20 with a locking groove 18a provided in the portion 18, the robot arm 20 can be moved up and down. The locking groove 18a of the bulging head 18 when the lid 16 is opened and the locking pin 20a of the robot arm 20 are aligned, and the fixing pin 17a when the lid 16 is closed.
The position of the fitting recess 17b can be adjusted by controlling the rotation angle of the drive motor 21 formed by a servomotor or the like.

In the above embodiment, the lid 16 and the rotary cup 1
2 has been described by fitting the fixing pin 17a and the fitting recess 17b. However, such a structure is not necessarily required, and the lid 16 is separately provided using a pressing mechanism.
Is fixed to the rotating cup 12, it is possible to prevent the generation of dust when the lid 16 is opened and the rattling of the lid 16 during the rotation processing. Since the fixed lid 15 is fixed to the supporting column 19 that rotatably supports the lid 16, the fixed lid 15 moves up and down with the opening and closing movement of the lid 16 to open and close the opening of the drain cup 14. Can be.

As shown in FIG. 5, the N ₂ gas supply nozzle 36 includes a nozzle body 36a formed of a donut-shaped hollow annular pipe, and a nozzle body 36a.
A large number of small holes 36 formed in the outer peripheral surface of the
b. The N ₂ gas supply nozzle 36 thus configured is attached to the attachment member 34 that moves up and down together with the spin chuck 10, and the N ₂ gas supply tube 3 that penetrates the fixed collar 24.
It is connected to an N ₂ gas supply source (not shown) via 6c. Then, when elevated to a position within the processing chamber 11 of the rotary cup 12 with increasing spin chuck 10 after the rotation process (exposure), the N ₂ gas supplied from N ₂ gas supply source processing chamber 11 inside the Injecting radially, the inside of the processing chamber 11 is N ₂
In addition to purging, the negative pressure (reduced pressure) state in the processing chamber 11 is released so that the lid 16 can be easily opened thereafter.

The cleaning nozzle 35 attached to the attachment member 34 together with the N ₂ gas supply nozzle 36 is the same as that shown in FIG.
As shown in FIG. 6, a bottom surface cleaning nozzle body 35 a inclined toward the bottom surface of the rotating cup 12 and a side surface cleaning nozzle body 35 protruding horizontally toward the inner surface of the rotating cup 12.
b, and a lid cleaning nozzle body 35 c that is inclined toward the lower surface of the lid 16. These nozzle bodies 35a
To 35c are connected to a cleaning liquid supply source (not shown) via a cleaning liquid supply tube 36d penetrating the fixed collar 24. In the case of cleaning the rotary cup 12 by the cleaning nozzle 35, as shown in FIG. 6, first, after the rotation process, the spin chuck 10 is moved up together with the spin chuck 10 and the nozzle bodies 35 a to 35 c are moved to the processing chamber of the rotary cup 12. 11, the cleaning liquid supplied from the cleaning liquid supply source is rotated from each of the nozzle bodies 35a to 35c, and the bottom surface, the inner side surface, and the lower surface of the lid 16 (specifically, By spraying the liquid toward the contact portion between the lid 16 and the rotating cup 12 and the lower surface of the lid in the vicinity thereof, the resist liquid, particles, and the like adhering to the rotating cup 12 and the lid 16 can be washed and removed. This cleaning process may be performed periodically after processing a predetermined number of substrates G.

On the other hand, the solvent supply nozzle 40 is connected to a solvent tank 43 via a solvent supply tube 41 serving as a solvent supply path and an opening / closing valve 42, and nitrogen (N ₂ ) gas supplied into the solvent tank 43 is provided. By controlling the pressurization, the solvent A in the solvent tank 43 can supply a predetermined amount of the solvent A onto the substrate G for a predetermined time.

The resist liquid supply nozzle 50 is connected to a resist liquid tank 52 (processing liquid supply source) containing a resist liquid B via a resist liquid supply tube 51 which is a resist liquid supply passage. The tube 51 has a suck back valve 53, an air operation valve 54,
A bubble removing mechanism 55 for separating and removing bubbles in the resist solution B, a filter 56, and a bellows pump 57 are sequentially provided. The bellows pump 57 is capable of expanding and contracting under the control of the driving unit, and a predetermined amount of resist solution B is supplied to the substrate G
For example, it can be supplied to the central part of the liquid crystal. It is possible to control the supply amount of the resist solution B smaller than the supply amount of the conventional resist solution B. The drive unit includes a ball screw 58 having a screw at one end adsorbed to one end of the bellows pump, a nut screwed to the screw, a stepping motor 59 for rotating the nut to linearly move the screw by rotating the nut. It consists of. The diameter of the resist liquid supply nozzle 50 is specifically set to φ0.5 to φ5 mm, preferably φ3 mm for a substrate of 500 × 600 mm. Thus, by setting the diameter of the nozzle according to the size of the substrate, it is possible to supply a small amount of the resist solution B as much as possible over a long time. If the supply time is short, the uniformity of the film thickness is not good, and if it is too long, the resist solution does not reach the peripheral portion of the substrate. Here, as small as possible depends on the nozzle diameter and the resist solution supply pressure.

In the resist solution supply system configured as described above, the discharge time of the resist solution is controlled by the bellows pump 57.
(Control accuracy: ± 2 msec) by the driving time of the stepping motor 59. Further, the discharge amount of the resist liquid is set by a driving operation of the bellows pump 57, for example, a driving time and a driving speed, and an opening / closing operation (ON-OFF operation) of the air operation valve 54 for opening and closing the resist liquid supply passage. It has become. Setting of the driving time of the bellows pump 57 and ON / OFF of the air operation valve 54
The operation is automatically controlled by the operation of a computer based on a preset program.

The discharge time of the resist solution B is controlled by a variable orifice (not shown) provided in the resist solution supply nozzle 50.
It can also be performed by opening and closing operations. Also, the N solution to the resist solution tank 52 can be used without using the bellows pump 57.
The supply of the resist solution B can also be performed by pressurizing the _two gases. In this case, the discharge time control of the resist solution B can be performed by adjusting the pressurized amount of the N ₂ gas.

The suck-back valve 53 provided in the resist liquid supply system discharges the resist liquid B remaining on the inner wall of the tip of the resist liquid supply nozzle 50 due to surface tension after the resist liquid is discharged from the resist liquid supply nozzle 50. This is a valve for drawing back into the resist liquid supply nozzle 50, thereby preventing solidification of the remaining resist liquid. In this case, when the resist liquid supply nozzle 50 that discharges a small amount of the resist liquid B draws the resist liquid B back into the resist liquid supply nozzle 50 by the negative pressure action of the suck back valve 53 as usual, the air near the tip of the nozzle 50 also becomes The residue of the resist solution B adhering to the tip of the nozzle 50 enters the nozzle 50 and clogs the nozzle 50, and the dried resist becomes particles and the substrate G is contaminated. At the same time, there is a risk that the yield will be reduced.

In order to solve this problem, as shown in FIG.
The thickness 50b of the portion near the opening is larger than that of FIG. That is, the nozzle 50 has a cylindrical tip and an inverted truncated cone following the cylindrical tip. Instead, as shown in FIG. 7B, an outer flange 5 is provided at the cylindrical tip or opening of the resist solution supply nozzle 50.
0c, the nozzle 5 during suckback
0 Entrapment of air near the front end can be prevented.
As shown in FIG. 7 (c), a small-diameter bent portion 50d extending in a horizontal S-shape is formed at the vertically extending cylindrical tip of the resist liquid supply nozzle 50, and the center of the bent portion 50d is formed. By performing suckback to the vicinity, air entrapment at the nozzle tip can be similarly prevented.

The temperature adjusting mechanism 61 (temperature adjusting means)
As shown in FIG. 8, a temperature control liquid supply path 62 is provided so as to surround the outer circumferences of the solvent supply tube 41 and the resist supply tube 51, respectively. , A circulation pump 64 provided in each of the circulation paths 63, and a temperature adjustment liquid C connected in the middle of the circulation path 63.
(For example, constant temperature water) at a constant temperature. With the temperature adjusting mechanism 61 configured as described above, the solvent A flowing in the solvent supply tube 41 and the resist liquid B flowing in the resist supply tube 51 can be maintained at a predetermined temperature (for example, about 23 ° C.).

In FIG. 8, the solvent supply nozzle 40 and the solvent supply tube 41 are connected to the resist solution supply nozzle 50.
The resist liquid supply tube 51 and the resist liquid supply tube 51 are formed integrally with each other. However, as will be described in detail below with reference to FIG.

The jet head 60 is made of, for example, a member made of stainless steel or an aluminum alloy. A U-shaped hole forming a part of the bypass passage 60b is formed on the upper surface of the jet head 60, and a vertical through hole 60c extending to the lower surface of the jet head 60 is formed at the bottom of the hole. Each through-hole 60c has an inclined middle portion 60d having a larger diameter as it goes downward, and a large-diameter lower portion 60e.
A female screw is formed on the inner peripheral surface of 0e. When the nozzles 40, 50 are mounted on the jet head 60 having such a configuration, the cylindrical nozzles 40, 50 are inserted into the through holes 60c so that the upper and lower portions extend, respectively. A sealing member 66 made of a substantially conical synthetic resin having a vertical through hole through which 50 can penetrate is packed in the inclined middle portion 60d, and a mounting screw member 67 having a vertical through hole through which the nozzles 40 and 50 can penetrate is screwed to the lower part. The sealing member 66 is pressed against the inclined inner peripheral surface of the middle portion 60d by being screwed into 5c. In this way, the nozzles 40, 50
Is mounted on the jet head 60 in a liquid-tight manner. In this case, an O-ring 68 is interposed between the upper surface of the intermediate portion 5b and the upper surface of the seal member 66 as shown in FIG.
Watertightness between the nozzle 5 and the nozzles 40 and 50 can be further ensured.

The jet head 60 is arranged in a horizontal direction (X, Y directions).
It is mounted on the tip of a movable arm 71 that can rotate and move in the vertical direction (Z direction). The moving arm 71 is shown in FIG.
As shown in the figure, it is disposed outside the drain cup 14,
The solvent supply nozzle 40 and the resist solution supply nozzle 50 are respectively moved to the operation position above the center of the substrate G and the nozzle standby unit 72 by driving means such as a stepping motor (not shown).
It is selectively moved between the upper standby position. That is, after the solvent supply nozzle 40 is moved from the standby position to the center position of the substrate G, and after a predetermined time has elapsed, the resist solution supply nozzle 50 is then moved to the center position of the substrate G, and then both nozzles 40 and 50 are in standby. It is adapted to be moved to the section 72. The mechanism for moving the jet head 60, that is, the solvent supply nozzle 40 and the resist solution supply nozzle 50, does not necessarily need to be the above-described rotating movement arm 71, and may use, for example, a linear scanning mechanism.

Next, a procedure of forming a resist film by the coating film forming apparatus having the above-described configuration will be described with reference to a flowchart of FIG.

First, the lid 16 of the rotating cup 12 and the fixed lid 15 of the drain cup 14 are opened.
Is moved onto the stationary spin chuck 10 by a transfer arm (not shown), and the substrate G is held by the spin chuck 10 by vacuum suction. Next, the rotation of the spin chuck 10 rotates the substrate G at a lower speed than the steady rotation during processing (the number of rotations: for example, 200 to 800 r).
pm, acceleration: 300 to 500 rpm / sec), and the rotating cup 12 is rotated at the same speed. During this rotation, the moving arm 71 of the moving mechanism 70 moves to the standby position 7.
From the solvent supply nozzle 40 of the jet head 60 rotated above the center of the substrate G by rotating from the position 2, for example, ethyl cellosolve acetate (EC)
A) for example for 26.7 cc for 20 seconds (sec)
Supply, for example, dropping (step [A]). Also, the substrate G
Alternatively, the solvent A may be dropped in a stationary state without rotating, and then rotated. After the solvent A is supplied for 20 seconds in this way, the supply of the solvent A is stopped while the rotation speeds of the spin chuck 10 and the rotary cup 12 are at the low rotation speed (step [B]). At this time, the solvent A is spread and applied to the entire surface of the substrate G.

Next, the spin chuck 10 is rotated at a high speed (first rotation speed: 500 to 1500 rpm, for example, 1000 rpm, acceleration: 300 to 600 rpm).
At the same time, the processing liquid, for example, the resist liquid B is supplied for, for example, 5 seconds from the resist liquid supply nozzle 50a moved above the central portion on the solvent film on the substrate surface, for example, 8 cc is dropped (step [C]). The drying time of the solvent A at this time can be obtained in advance by an experiment. For example, when the surface of the substrate G is visually observed and the interference fringes of light are visible, the drying is not performed, and when the interference fringes are dried, the interference fringes become invisible, so that the time can be known. In this case 5
In the supply timing during the second, the bellows pump 57
Is controlled so that the supply amount of the resist solution can be accurately and finely controlled. After the resist solution B is supplied (dropped) for 5 seconds in this way, the supply of the resist solution B is stopped, and at the same time, the spin chuck 1 is stopped.
0 and the rotation of the rotating cup 12 are stopped (step [D]). In this state, the resist solution B is applied in substantially concentric circles of the substrate G except for the corners Ga. At this time, when the resist solution B is supplied to the entire area including the corner portion Ga of the substrate G,
Not only does the waste of the resist liquid B occur, but also there is a problem that mist of the resist liquid B scatters and adheres to the rotating cup 12 and the back surface of the substrate G. Therefore, it is desirable that the amount of the resist solution B be set to the minimum necessary amount supplied to the entire region of the substrate G with a predetermined film thickness.

Next, after the supply of the resist solution B is stopped and the resist solution supply nozzle 50 is moved to the standby position, the fixed lid 15 and the lid 16 are moved above the drain cup 14 and the rotary cup 12 by the robot arm 20. The substrate G is closed in the opening 12a, and the substrate G is sealed in the rotating cup 12 (step [E]).

With the opening of the drain cup 14 closed with the fixed lid 15 and the opening 12a of the rotating cup 12 closed with the lid 16 and hermetically sealed, the spin chuck 10 and the rotating cup 12 are closed. For example, 15 sec
During the rotation, the rotation speed is higher than the first rotation speed (second rotation speed:
A range of about 1000 to 3000 rpm, for example, 1400 r
pm, acceleration: 500 rpm / sec), the resist liquid B spreads over the entire surface of the substrate G, and the thickness of the resist film is adjusted (step [F]). The resist solution B at this time
The thickness of the resist film is determined by the discharge amount and the time. In addition,
In this state, the solvent A and the resist film are wet and not dried.

Further, during the above-mentioned film thickness forming step, the negative pressure caused by the rotation of the spin chuck 10 and the rotating cup 12 and the constant exhausting at the exhaust port 14b allow air into the processing chamber 11 from the air introduction 16c. As the air flows, the air is guided to the inner wall side of the rotating cup 12 by the rectifying plate 13 and is discharged from the exhaust hole 12d along the inner wall.
The mist of the resist solution scattered in the processing chamber 11
The mist is discharged to the outside in order to prevent mist from adhering to the contact portion between the opening of the rotating cup 12 and the lid 16 without reattaching to the outside. Air also flows into the drain cup 14 from an air supply hole 15 a provided in the fixed lid 15, and the air flows along the outer wall of the rotary cup 12 to the exhaust port 14 b.
, The mist discharged from the processing chamber 11 of the rotating cup 12 can be prevented from rising upward, and the mist can be prevented from adhering to the inner wall of the drain cup 14.

After the coating process is completed, the spin chuck 1
0 and rotation of the rotating cup 12 at a low speed, for example, 500 rpm
Then, the spin chuck 10 is slightly raised while controlling the posture of the substrate G by rotating the substrate G to expose the N ₂ gas supply nozzle 36 into the processing chamber 11 (step [G], see FIG. 6).
Then, a small hole 36b from the processing chamber radially by injecting the N ₂ gas treatment chamber 11 in 11 of N ₂ gas supply nozzle 36 with substitution with N ₂ gas, the negative pressure in the processing chamber 11 (vacuum) The state is released (step [H]). Then, after the rotation of the spin chuck 10 and the rotation cup 12 is stopped, the lid 16 is moved to the standby position by the robot arm 20, the substrate G is taken out by the transfer arm (not shown), and the coating operation is completed (step [ I]).

Further, if necessary, for example, when a predetermined number of substrates G are coated, the opening 12a of the rotating cup 12 is closed with the lid 16 after the substrates G are unloaded (step [J]). ]), In this state, the spin chuck 10 is raised and the nozzle bodies 35a to
35c is exposed in the processing chamber 11 (step [K]),
Then, while rotating the rotating cup 12, each nozzle body 3
5a to 35c, the bottom portion 12b, the side wall portion 12c, the lower surface of the lid 16 and the lid 16 and the rotary cup 12 of the rotary cup 12.
The cleaning liquid is sprayed onto the contact portion of the rotating cup 12 to wash the rotating cup 12 (step [L]). Thereby, the bottom portion 12b, the side wall portion 12c, the lower surface of the lid 16 and the lid 16
Therefore, the resist liquid and the like adhering to the contact portion of the rotating cup 12 can be removed, so that contamination of the substrate G in the subsequent processing due to contamination of the rotating cup 12 can be prevented.

The coating film forming apparatus according to the present invention configured as described above can be used alone as a resist coating apparatus for the LCD substrate G, and can also be used by incorporating it into a resist coating and developing processing system for the LCD substrate G described later. can do. Hereinafter, the structure of a resist coating and developing system incorporating the coating film forming apparatus of the above embodiment will be described.

The above resist coating / developing processing system
As shown in FIG. 11, a loader unit 90 for loading / unloading the substrate G, a first processing unit 91 for the substrate G, and a second processing unit 92 connected to the first processing unit 91 via the relay unit 93. It is mainly composed of The second processing unit 92 includes the delivery unit 9
An exposure device 95 for exposing a predetermined fine pattern on the resist film via the reference numeral 4 can be provided in series.

The loader unit 90 includes a cassette 96 for storing an unprocessed substrate G, a cassette mounting table 98 for mounting a cassette 97 for storing a processed substrate G, and a cassette 96 on the cassette mounting table 98. , 97 and the substrate G
Tweezers 9 that can move and rotate (θ) in the horizontal (X, Y) direction and the vertical (Z) direction in order to carry in / out a substrate.
9.

The first processing section 91 includes a transfer path 102 of the main arm 80 that can move in the X, Y, and Z directions and rotate by θ.
A brush cleaning device 120 for brush cleaning the substrate G, a jet water cleaning device 130 for cleaning the substrate G with high-pressure jet water, an adhesion processing device 105 for hydrophobizing the surface of the substrate G, A cooling processing device 106 for cooling G to a predetermined temperature is disposed, and a coating processing device 107 and a coating film removing device 108 as the coating film forming device of the present invention are disposed on the other side of the transport path 102.

On the other hand, like the first processing section 91, the second processing section 92 has a main arm 80a that can move in the X, Y, and Z directions and can rotate θ, and the transfer path 102a of the main arm 80a. A heat treatment device 109 for heating the substrate G before and after the application of the resist solution to perform pre-baking or post-baking is disposed on one side of the substrate, and a developing device 110 is disposed on the other side of the transport path 102a.

The relay portion 93 has a structure in which casters 93d are provided on the bottom surface of a box 93c having a delivery table 93b on which support pins 93a for supporting the substrate G are erected. The relay unit 93 is pulled out from the first processing unit 91 and the second processing unit 92, and the first processing unit 91
Alternatively, a worker can enter the second processing unit 92 to easily perform repairs and inspections.

The transfer section 94 includes a cassette 111 for temporarily holding the substrate G, and a cassette 1
Tweezers 1 for transferring a substrate G to and from the substrate 11
12 and a delivery table 113 for the substrate G are provided.

In the coating / developing processing system configured as described above, the unprocessed substrate G stored in the cassette 96 is taken out by the loading / unloading tweezers 99 of the loader unit 90, The brush is transferred to the main arm 80 and then transferred into the brush cleaning device 120. The substrate G that has been brush-cleaned in the brush cleaning device 120 is subsequently cleaned with high-pressure jet water in the jet water cleaning device 130. Thereafter, the substrate G is subjected to a hydrophobic treatment by an adhesion treatment device 105 and cooled by a cooling treatment device 106. Then, the coating film forming device 107 according to the present invention employs a photoresist, A photosensitive film is formed by coating. Subsequently, an unnecessary resist film on the side of the substrate G is removed by the coating film removing device 108. Therefore, when the substrate G is carried out thereafter, the resist film on the edge portion is removed, so that the resist does not adhere to the main arm 80. Then, after the photoresist is heated by the heat treatment device 109 and subjected to a baking process, a predetermined pattern is exposed by the exposure device 95. Then, the exposed substrate G
Is transported into the developing device 110, and after being developed by the developing solution, the developing solution is washed away by the rinsing solution, and the developing process is completed.

The processed substrate G that has been subjected to the development processing is accommodated in the cassette 97 of the loader section 90, and then carried out and transferred to the next processing step.

In the above embodiment, the structure in which the solvent supply nozzle 40 is provided integrally with the resist liquid supply nozzle 50 at the spray head 60 has been described. However, the present invention is not limited to this. The solvent may be supplied integrally with the jetting head provided. Alternatively, for example, the solvent supply nozzle 40 may be arranged coaxially with the outer periphery of the resist liquid supply nozzle 50, and may be changed as appropriate.

In the above embodiment, the lid 16 of the rotating cup 12 is moved and opened by the robot arm 20 to supply the solvent A supply nozzle 40 and the resist liquid B supply nozzle 50.
In the above description, the moving mechanism 70 is moved above the center of the substrate G to drop the solvent A and the resist solution B, but the dropping is performed with the opening 12a of the rotating cup 12 closed by the lid 16. May be configured. For example,
As shown in FIG. 12, the bulging head 18 of the lid 16 is formed in a hollow shape, and the upper end is configured to be closed by the lid 18A. Then, the cover 18A may be opened, and the moving mechanism 70 may move the nozzle above the hollow of the bulging head 18, that is, above the center of the substrate G, so that the solvent A and the resist liquid B may be dropped. Also, as shown in FIG.
The nozzle body 18B is rotatably mounted on the inside of the hollow bulging head 18 by a bearing 18C or the like. Then, with the opening 12a of the rotating cup 12 closed by the lid 16, the solvent A and the resist liquid B are applied to the substrate G from the nozzles 40 and 50 attached to the nozzle mounting member 18B.
May be configured to be dropped on the central portion of the.

As described above, the opening 12 a is formed by the lid 16.
By dropping the solvent A and the resist solution B in a closed state, the processing throughput can be shortened as compared with the movable type by the moving mechanism 70, and the processing process from the dropping of the solvent A in a closed state to the end of the coating process can be performed. It can be realized. For example, it is possible to realize a process in which after the solvent A is supplied, the rotating cup 12 is rotated while the resist liquid B is being supplied, and then the supply of the resist liquid B is stopped, and the rotating cup 12 is rotated.

In the above embodiment, the case where the processing apparatus according to the present invention is applied to a resist coating apparatus for an LCD substrate has been described. However, the present invention is also applicable to a coating film forming apparatus for a processing object such as a semiconductor wafer or a CD other than the LCD substrate. Of course, the present invention can be applied to a polyimide-based processing solution (PIQ) other than a resist, a processing solution containing a glass agent (SOG), and the like.

[0073]

As described above, according to the present invention, the processing liquid is supplied onto one surface of the substrate, rotated to diffuse the liquid on one surface of the substrate, and the lid is closed in the processing container. Then, the lid was closed after the substrate was sealed in the processing container .
By rotating the processing container and the substrate and adjusting the thickness of the coating film, by supplying an inert gas into the processing container, the mist of the processing liquid scattered in the processing container is eliminated,
The reduced pressure in the processing container can be released. Therefore, it is possible to suppress the mist of the processing liquid generated during the processing from adhering to the substrate and the processing container, thereby preventing contamination of the substrate and improving the yield. Also, by supplying an inert gas into the processing container, the pressure in the processing container can be released, and the lid can be easily opened.
Throughput can be improved.

Further, if necessary, for example, the cleaning liquid is sprayed into the processing container while the lid is closed, so that the bottom and side surfaces of the processing container, the contact portion between the processing container and the lid, and the lid Since the processing liquid, particles, and the like attached to the lower surface of the substrate can be removed by washing, the yield can be further improved.

[Brief description of the drawings]

FIG. 1 is a schematic view of a processing apparatus for performing a method of forming a coating film according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the processing apparatus shown in FIG.

FIG. 3 is an enlarged sectional view of a main part of the processing apparatus.

FIG. 4 is a partially sectional perspective view showing a processing container and a lid according to the present invention.

FIG. 5 is a schematic perspective view of an inert gas supply nozzle according to the present invention.

FIG. 6 is a cross-sectional view showing a use state of an inert gas supply nozzle and a cleaning nozzle according to the present invention.

FIG. 7 is a cross-sectional view showing different modifications of the tip of the resist solution supply nozzle according to the present invention.

FIG. 8 is an enlarged perspective view showing a jet head used in the processing apparatus.

FIG. 9 is a sectional view of a jet head.

FIG. 10 is a flowchart for explaining a step of forming a resist film using a processing apparatus and a subsequent step.

FIG. 11 is a perspective view schematically showing an entire resist coating / developing system to which the processing apparatus is applied.

FIG. 12 is an explanatory view showing another example of a method of dropping a processing liquid.

FIG. 13 is a configuration diagram showing still another example of a method of dropping a treatment liquid.

[Explanation of symbols]

Reference Signs List 10 spin chuck (holding means) 12 rotating cup (processing container) 16 lid 18 bulging head 18A lid 18B nozzle mounting member (mounting member for processing liquid supply unit) 18C bearing 34 mounting member 35 container cleaning nozzle (container cleaning unit) 35a Lower surface cleaning nozzle body 35b Side cleaning nozzle body 35c Lid cleaning nozzle body 36 N ₂ gas supply nozzle ( inert gas supply means) 36a Annular body 36b Small hole 40 Solvent supply nozzle (solvent supply means) 50 Resist liquid supply nozzle (Treatment liquid supply means) 70 Moving mechanism (solvent / treatment liquid supply means moving means) G LCD substrate (substrate) A Solvent B Resist liquid (treatment liquid)

Continuation of the front page (72) Inventor Oden 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. Kumamoto Office (56) References JP-A-3-293056 (JP, A) JP-A-6 -190326 (JP, A) JP-A-6-338447 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027

Claims (16)

(57) [Claims] 1. A substrate is supported with one side facing upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates together with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate, wherein the inert gas supply unit includes: A processing device, wherein the processing device is mounted on a mounting member that can be interlocked with the holding means only in the vertical direction. 2. The method according to claim 1, wherein one side of the substrate is supported upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, a container cleaning unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate. A processing apparatus, comprising: an inert gas supply unit mounted on a mounting member that can be interlocked only vertically with a holding unit. 3. The substrate is supported with one surface facing upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, a container cleaning unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate. A processing apparatus comprising: an inert gas supply unit and a container cleaning unit that are attached to an attachment member that can be interlocked only vertically with a holding unit. 4. The processing apparatus according to claim 1, wherein said holding means is formed so as to be movable in a vertical direction. 5. Supporting one side of the substrate upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates together with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate, wherein the inert gas supply unit includes: A processing apparatus, comprising: an annular nozzle provided with a large number of small holes at appropriate intervals on an outer peripheral surface of a hollow annular main body. 6. The processing apparatus according to claim 5, wherein said inert gas supply means is mounted on a mounting member which can be interlocked only vertically with said holding means. 7. A substrate is supported with one surface facing upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, a container cleaning unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate. A processing apparatus, characterized in that the inert gas supply means is formed by an annular nozzle provided with a number of small holes at appropriate intervals on the outer peripheral surface of a hollow annular main body. 8. The processing apparatus according to claim 7, wherein the inert gas supply means and the container cleaning means are mounted on a mounting member which can be interlocked with the holding means only in a vertical direction. 9. Supporting one side of the substrate upward, and
Holding means for rotating the substrate, forming a cup surrounding the substrate, and a processing container having an exhaust hole on the bottom side thereof and rotating together with the holding means, closing an opening of the processing container, A lid that rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, a container cleaning unit that can appear and disappear in the processing container, and a processing liquid supply unit that supplies a processing liquid to the substrate. A bottom cleaning nozzle body that sprays a cleaning liquid toward a bottom surface of the processing container, a side cleaning nozzle body that sprays a cleaning liquid toward an inner surface of the processing container, a processing container, and a lid. A processing apparatus, comprising: a lid cleaning nozzle that sprays a cleaning liquid toward a contact portion of the body and a lower surface of the lid. 10. A holding means for supporting the substrate with one surface facing upward and rotating the substrate, a cup-like shape surrounding the substrate, and holding an exhaust hole on a bottom side thereof. A processing container that rotates with the unit, a lid that closes the opening of the processing container, and rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and supplies a processing liquid to the substrate. A processing liquid supply means, and a hollow head capable of supplying a processing liquid is formed at the center of the lid for closing the opening of the processing container, and the lid can be closed on the hollow head. A processing device, wherein the processing device is provided. 11. A holding means for supporting the substrate with one surface facing upward and rotating the substrate, a cup-like shape surrounding the substrate, and holding an exhaust hole on the bottom side thereof. A processing container that rotates with the unit, a lid that closes an opening of the processing container, and rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and that can appear and disappear in the processing container. A container cleaning means, and a processing liquid supply means for supplying a processing liquid to the substrate, wherein a hollow head capable of supplying a processing liquid is provided at a central portion of a lid closing an opening of the processing container. A processing apparatus characterized in that a lid is formed on the hollow head so that a lid can be closed. 12. A holding means for supporting the substrate with one surface facing upward and rotating the substrate, and a cup-like shape surrounding the substrate and having an exhaust hole at a bottom side thereof. A processing container that rotates with the unit, a lid that closes the opening of the processing container, and rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and supplies a processing liquid to the substrate. A processing liquid supply means, and a hollow head is formed at the center of the lid closing the opening of the processing container, and the processing liquid supply means is provided with a bearing in the head. A processing device having an attachment member attached. 13. A holding means for supporting the substrate with one surface facing upward and rotating the substrate, and a cup-like shape surrounding the substrate and having an exhaust hole at a bottom side thereof. A processing container that rotates with the unit, a lid that closes an opening of the processing container, and rotates with the processing container, an inert gas supply unit that can appear and disappear in the processing container, and that can appear and disappear in the processing container. A container cleaning means, and a processing liquid supply means for supplying a processing liquid to the substrate, wherein a hollow head is formed at the center of a lid closing an opening of the processing container, and A processing apparatus, wherein a mounting member of a processing liquid supply means is mounted in a head via a bearing. 14. The processing container according to claim 10, wherein said processing container is formed to be rotatable together with holding means.
3. The processing apparatus according to any one of 3. 15. A method of forming a coating film by rotating a substrate accommodated in a processing container together with the processing container and supplying a processing liquid on one surface of the substrate, wherein the processing liquid is supplied to the substrate. Rotating and diffusing it over one surface of the substrate; closing the lid in the processing container and enclosing the substrate in the processing container; rotating the processing container and the substrate with the lid closed. Let me
The process of adjusting the thickness of the coating film, and the inert gas is placed in the center of the processing vessel where the rotation is stopped.
The step of radially supplying from the above , the step of opening the lid, and carrying out the substrate from the processing container, and, if necessary, with the lid closed in the processing container, the bottom surface, the inner side surface of the processing container and A step of spraying a cleaning liquid onto a contact portion between the processing container and the lid and a lower surface of the lid. 16. A method for forming a coating film by rotating a substrate accommodated in a processing container together with the processing container and supplying a processing liquid on one surface of the substrate, wherein the processing liquid is supplied to the substrate. Rotating and diffusing it over one surface of the substrate; closing the lid in the processing container and enclosing the substrate in the processing container; rotating the processing container and the substrate with the lid closed. Let me
A processing method, comprising: adjusting a film thickness of a coating film; and supplying an inert gas radially from a center side into the processing container whose rotation has been stopped.