JP3271063B2 - Method and apparatus for forming coating film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a coating film for forming a liquid coating film using a solvent such as a resist film on a coating body such as an LCD substrate or a layer formed thereon. A method and an apparatus therefor.

[0002]

2. Description of the Related Art As is well known, in the field of semiconductor technology,
When selectively etching a semiconductor layer, an insulator layer, and an electrode layer formed on an LCD substrate into a predetermined pattern,
As in the case of a semiconductor wafer, a resist film is formed on the surface of a layer as masking of a pattern portion.

For example, as a method of forming a resist film, a rectangular LCD substrate (hereinafter, referred to as a substrate) is placed and fixed on a mounting table provided in the processing container, and an opening of the processing container is covered. Close the body, rotate the processing container and the mounting table, for example, a resist solution composed of a solvent and a photosensitive resin is dropped into the center of the upper surface of the substrate, and the resist solution is rotated with the rotational force and centrifugal force of the substrate. There is known a method in which a substrate is spirally diffused from the center of the substrate toward the peripheral edge and applied.

In this method, the solvent in the resist solution evaporates in the process of diffusing the resist solution from the center position of the substrate toward the periphery. For this reason, the viscosity of the resist solution differs in the diffusion direction, and the thickness of the formed resist film differs between the central portion and the peripheral portion. Further, since the peripheral speed of the substrate is much higher at the outer peripheral portion than at the center position, the amount of the substrate scattered is large. That is, there was a limit to uniform coating.

[0005] For this reason, for example, a method of controlling the temperature of the resist solution or filling the same solvent used in the resist solution in the atmosphere for forming the resist film to suppress the evaporation of the solvent in the resist solution, A method is conceivable in which the solvent of the resist solution is dropped on the substrate surface before coating.

[0006]

However, evaporation of the solvent in the resist solution is suppressed by filling the same solvent used for the resist solution in the former, ie, adjusting the temperature of the resist solution or in the atmosphere for forming the resist film. In the method, the amount of the resist solution used is large, and for example, only several% of the applied amount of the resist solution contributes to the actual formation of the resist film. In addition, since the amount of the resist liquid is large, the resist liquid wraps around the back surface of the corner portion of the substrate, and the resist liquid attached to the back surface of the corner portion of the substrate dries, causing a problem of generating particles. Furthermore, when a resist solution is applied without adding a solvent, air is taken into the resist solution during the application and bubbles are contained, resulting in a problem that the film thickness becomes uneven. In addition, even in the latter method, in which the solvent of the resist solution is dropped on the substrate surface before the application of the resist solution, the uniformity of the solvent itself on the substrate and the difference in the dry state make it difficult to apply uniformly, and the above problem is sufficiently solved. It cannot be solved.

The present invention has been made in view of the above circumstances, and requires only a small amount of a coating solution such as a resist solution, and is capable of forming a coating film having a uniform thickness. It is intended to provide a device.

[0008]

According to a first aspect of the present invention, there is provided a method for forming a coating film on a substrate supported on one side of a substrate held in a processing container. Supplying the coating solution, in the method of forming a coating film, in the process container, closing the lid, enclosing the substrate in the processing container, and dropping a solvent on one surface of the substrate, A predetermined amount of the coating liquid is supplied to the substrate, and the processing container in which the lid is closed and the substrate are rotated together at a first rotation speed, and the coating liquid is diffused over the entire surface of the substrate. And a step of rotating both the processing container and the substrate with the lid closed at a second rotation speed different from the first rotation speed to adjust the thickness of the coating film. It is a feature (claim 1).

The second method for forming a coating film according to the present invention is characterized in that
Of the substrate supported in the container with one side facing up
A method of forming a coating film by supplying a coating liquid on one surface
Closing the lid in the processing container, and transferring the substrate to the processing container.
Enclosing the inside of the cover with the cover at the center of the cover.
From the solvent supply means, which is rotatably mounted
A step of dropping a solvent on one surface of the plate, and a central portion of the lid
And a coating liquid supply rotatably attached to the lid.
A predetermined amount of the coating liquid is supplied from the supply means to the substrate,
At a rotation speed of
The process container and the substrate with the lid closed.
Rotating at a second rotation speed different from the first rotation speed.
And adjusting the film thickness of the coating film.
(Claim 2) .

A third method of forming a coating film according to the present invention comprises the steps of:
Of the substrate supported in the container with one side facing up
A method of forming a coating film by supplying a coating liquid on one surface
Closing the lid in the processing container, and transferring the substrate to the processing container.
Enclosing the inside of the cover with the cover at the center of the cover.
From the solvent supply means, which is rotatably mounted
A step of dropping a solvent on one surface of the plate, and a central portion of the lid
And a coating liquid supply rotatably attached to the lid.
A predetermined amount of the coating liquid is supplied from the supply means to the substrate,
The processing container and the substrate with the lid closed at the rotation speed of
Are rotated together to diffuse over the entire surface of the substrate
Process, the processing container and the substrate with the lid closed
Rotating at a second rotation speed different from the first rotation speed.
And adjusting the film thickness of the coating film.
(Claim 3) .

[0011] In the coating film formation method of this invention, the
It is preferable that the second rotation speed is higher than the first rotation speed.
(Claim 4). Also, when dropping the solvent onto one surface of the substrate, it is preferable that the substrate in a stationary state (claim
5 ). Further, it is preferable to apply a solvent of a coating solution as the solvent (claim 6 ).

[0012] The coating film forming apparatus of the present invention, the closure and the substrate supporting means for supporting facing up one surface of the substrate, a processing vessel that forms a cup-shaped surrounding the substrate, the opening of the processing vessel Lid, substrate support means, and processing volume
A rotating means capable of rotating the container at a variable rotation speed ; and a solvent supply means and a coating liquid supply means which are mounted at the center of the lid so as to be rotatable relative to the lid. (Claim 7 ).

According to the present invention by the above technical means,
After closing the lid in the processing container and enclosing the substrate in the processing container, the solvent of the coating solution is dropped on one surface of the substrate, and then
Almost on the central portion of the substrate, supplying a predetermined amount of the coating liquid, the first
The substrate and the substrate whose lid is closed at the number of rotations are rotated together to diffuse over the entire surface of the substrate, and
The processing container and the substrate with the lid closed are both rotated at a second rotation speed different from the first rotation speed to adjust the thickness of the coating film. This makes it possible to supply a coating liquid having a proper mixing ratio to the solvent, to reduce the amount of the coating liquid used, and to prevent the coating liquid from flowing into the back surface of the corner of the substrate. Further, the viscosity of the coating solution caused by contact between the solvent and the coating solution can be made uniform to form a coating film having a uniform thickness.

[0014]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Here, a coating film forming method and a coating film forming apparatus according to the present invention are described using an LCD (liquid crystal display).
A case where the present invention is applied to a method and an apparatus for forming a resist film on a substrate (glass substrate) will be described.

As shown in FIG. 1, the above-mentioned coating film forming apparatus includes a rectangular substrate as an object to be coated, for example, an LCD substrate G
A rotating body, for example, a spin chuck 10 (substrate supporting means) for holding the substrate G in a horizontal state by vacuum so as to support one surface thereof (hereinafter referred to as a substrate) upward, and an upper portion and an outer peripheral portion of the spin chuck 10 A cup-shaped processing container 12 (hereinafter, referred to as a “rotating cup”) having an opening at an upper portion having a processing chamber 11 to be surrounded;
a cover 16 which is attached (detachable) so as to be able to be closed on a, a robot arm 20 which is a cover moving means for moving the cover 16 to a closed position and a standby position, and an outer peripheral side of the rotary cup 12. Ring-shaped drain cup 1 arranged as follows
4, a drive motor 21 as a means for rotating the spin chuck 10 and the rotating cup 12, and a supply nozzle 40 for a solvent (solvent) A of a coating liquid, which is attached to the center of the lid 16.
(A solvent supply means) and a supply nozzle 50 (a coating liquid supply means) for a coating liquid, for example, a resist liquid B.

In this case, as shown in FIG. 2, the solvent supply nozzle 40 and the coating liquid supply nozzle 50 are connected to the opening 1 of the substantially cylindrical bulging head 18 projecting above the center of the lid 16.
The nozzle mounting member 18B is rotatably mounted on the lid 16 within the nozzle 8a. That is, the bearing 1 is provided inside the opening 18 a provided in the bulging head 18.
The nozzle mounting member 18B is mounted via 8C or the like, and the nozzle mounting member 18B and the lid 16 are mounted so as to be relatively rotatable. With the opening 12a of the rotating cup 12 closed by the lid 16, the solvent A and the resist liquid B are dropped from the nozzles 40 and 50 attached to the nozzle mounting member 18B to the center of the substrate G. Have been.

As described above, the opening 12 a is formed by the lid 16.
The solvent A and the resist solution B are dropped in a state in which the nozzles 40 and 50 are moved by using a scanning mechanism, so that the processing throughput is shortened, and the solvent A is dropped in a closed state. It is possible to realize a processing process up to the end of the coating process. For example, it is possible to realize a process in which after the supply of the solvent A, the rotating cup 12 is rotated while the resist solution B is being supplied, and then the supply of the resist solution B is stopped, and the rotating cup 12 is rotated.

Further, the solvent A and the resist solution B flowing through the solvent supply path and the resist solution supply path from the nozzles 40 and 50 are respectively supplied to a predetermined temperature (for example, 23).
C) is provided with a temperature adjustment mechanism 61 for circulating and supplying a temperature adjustment liquid C for setting the temperature.

The spin chuck 10 is driven in accordance with a preset program, and can be rotated (rotated) in the horizontal direction via a rotating shaft 22 which is rotated by driving a drive motor 21 capable of changing the rotation speed. Also, it can be moved up and down by driving a lifting cylinder 23 connected to the rotating shaft 22. In this case, the rotating shaft 22 is provided with a bearing 25 on the inner peripheral surface of the fixed collar 24.
a and is slidably connected to a spline bearing 27 fitted on the inner peripheral surface of the rotatable inner cylinder 26a rotatably mounted via the inner cylinder 26a. A driven pulley 28a is mounted on the spline bearing 27, and the driven motor 21 is mounted on the driven pulley 28a.
A belt 29a is stretched between a drive shaft 21a and a drive pulley 21b mounted on the drive shaft 21a. Therefore, the drive shaft 21 is driven by the drive motor 21 via the belt 29a.
2 rotates, and the spin chuck 10 rotates. Also,
The lower side of the rotating shaft 22 is disposed in a cylindrical body (not shown).
The rotation shaft 22 can be moved in the vertical direction by driving the lift cylinder 23 through the lift cylinder 23.

The rotating cup 12 is provided with the fixed collar 2.
4 is mounted via a connecting cylinder 31 fixed to the upper end of a rotary outer cylinder 26b mounted via a bearing 25b on the outer peripheral surface of the rotary cup 12, between the bottom 12b of the rotary cup 12 and the lower surface of the spin chuck 10. A bearing 32 having a sealing function is interposed therebetween so as to be rotatable relative to the spin chuck 10. The drive from the drive motor 21 is transmitted to the rotary cup 12 by a driven pulley 28b mounted on the rotary outer cylinder 26b and a belt 29b stretched over a drive pulley 21b mounted on the drive motor 21 so that the rotary cup 12 is driven. Rotated. In this case, the diameter of the driven pulley 28b is formed to be the same as the diameter of the driven pulley 28a mounted on the rotary shaft 22, and the belts 29a and 29b are stretched over the same drive motor 21.
The rotating cup 12 and the spin chuck 10 rotate the same.
The fixed collar 24, the rotating inner cylinder 26a and the rotating outer cylinder 2
A labyrinth seal portion 33 is formed on the surface facing the surface 6b to prevent dust from entering the rotary cup 12 from the lower drive system during the rotation process (see FIG. 3).

The rotating cup 12 has a tapered surface 12e whose side wall 12c is reduced in diameter toward the upper side.
An inward flange 12d is formed inward from the upper end of the side wall 12c. Air supply holes 34 are formed in the upper peripheral portion of the rotating cup 12, that is, the inward flange 12 d, at appropriate intervals in the circumferential direction, and the lower peripheral portion, that is, the lower portion of the side wall 12 c, is exhausted at an appropriate position in the circumferential direction. A hole 35 is drilled. By providing the air supply hole 34 and the exhaust hole 35 in this manner, when the rotating cup 12 rotates, the air flowing into the processing chamber 11 from the air supply hole 34 flows to the outside from the exhaust hole 35, so that the rotation of the rotary cup 12 Sometimes it is possible to prevent the processing chamber 11 from becoming negative pressure,
The cover 16 can be easily opened without requiring a large force when opening the cover 16 from the rotating cup 12 after the processing.

On the other hand, an annular passage 14a is provided inside the drain cup 14, and exhaust gas connected to an exhaust device (not shown) is provided at an appropriate place (for example, four places in the circumferential direction) on the outer peripheral wall of the annular passage 14a. A port 36 is provided, and a radial exhaust passage 37 communicating with the exhaust port 36 is formed in an upper portion on the inner peripheral side of the drain cup 14 (see FIG. 1). As described above, the exhaust port 3 is provided on the outer peripheral portion of the drain cup 14.
6 and an exhaust passage 37 communicating with the exhaust port 36 is formed in the upper part on the inner peripheral side of the drain cup 14, so that it is scattered by centrifugal force in the processing chamber 11 during the rotation process and drains through the exhaust hole 34. The mist that has flowed into the cup 14 is prevented from rising to the upper side of the rotating cup 12 and can be discharged to the outside from the exhaust port 36.

The annular passage 14a is provided with a drain cup 14
The outer wall 14b rising from the bottom of the drain cup 14 and the inner wall 14c hanging down from the ceiling of the drain cup 14 are detoured so that the exhaust can be performed uniformly.
A drain hole 14e is provided in the bottom 14d located between the inner wall 14b and the inner wall 14c at appropriate intervals in the circumferential direction.

On the inner peripheral surface of the drain cup 14, a tapered surface 14f whose diameter is reduced toward the upper side so as to be close to the tapered surface 12e of the rotary cup 12 is formed. A minute gap is formed between the drain cup 14 and the tapered surface 14f. By forming the tapered minute gap that expands downward as described above, the rotation cup 1 is rotated when the rotation cup 12 rotates.
A pressure difference is induced from the peripheral speed difference between the upper and lower portions of the minute gap between the drain cup 14 and the drain cup 14, and this pressure difference causes the airflow from the upper side to the lower side of the minute gap on the outer peripheral portion of the rotary cup 12. By promoting this, it is possible to prevent the exhaust mist in the drain cup 14 from scattering to the outside of the rotary cup 12 through the minute gap.

Further, even if scattered who is attempting mist to the rotary cup 12 outside facing upwardly through a minute gap, and is discharged from the exhaust port 36 facing the drain cup 14 is sucked by the exhaust passage 37.

In the above embodiment , the case where the drain cup 14 is disposed so as to surround the outer peripheral side of the rotary cup 12 has been described. However, the drain cup 14 does not necessarily need to be disposed on the outer peripheral side of the rotary cup 12. , May be arranged below the rotating cup 12.

The cover 16 must be fixed to the opening 12a of the rotating cup 12 and rotated integrally during the rotation process. Therefore, as shown in FIG. 4, a fixing pin 17a protruding from the upper part of the rotating cup 12 and this fixing pin 17a
The fitting recess 17b is fitted into the cover 1
6 is fixed to the rotating cup 12. In this case, by forming the top of the fixing pin 17a in a spherical shape, dust generated by contact with the fitting recess 17b is reduced. Note that the fixing pin 17a does not necessarily need to protrude toward the rotating cup, and the fixing pin 17a may protrude from the lid, and a fitting recess 17b may be provided on the rotating cup. Further, the inside of the fitting recess 17b may be connected to suction means (not shown) to discharge dust generated by the contact between the fixing pin 17a and the fitting recess 17b to the outside.

When the lid 16 is opened and closed, the robot arm 20 is inserted under the bulging head 18 protruding from the upper surface of the lid 16 as shown by an imaginary line in FIG. After engaging a locking pin 20a protruding from the robot arm 20 with a locking groove 18a provided in the portion 18, the robot arm 20 can be moved up and down. The locking groove 18a of the bulging head 18 when the lid 16 is opened and the locking pin 20a of the robot arm 20 are aligned, and the fixing pin 17a when the lid 16 is closed.
The position of the fitting recess 17b can be adjusted by controlling the rotation angle of the drive motor 21 formed by a servomotor or the like.

In the above embodiment , the case where the lid 16 and the rotating cup 12 are fixed by the fitting of the fixing pin 17a and the fitting recess 17b is described. However, such a structure is not necessarily required. Lid 1 using a separate pressing mechanism
If the cover 6 is fixed to the rotating cup 12, generation of dust when the cover 16 is opened and rattling of the cover 16 during the rotation process can be prevented.

A baffle plate (not shown) formed of a perforated plate or the like having a size equal to or larger than the substrate G attached to the lid 16 at the center portion is provided at an intermediate position between the lid 16 and the substrate G. ) Can also be arranged. By arranging the baffle plate in this manner, the processing chamber 11 can be more reliably formed during the coating process.
The occurrence of turbulence in the inside can be prevented.

On the other hand, the solvent supply nozzle 40 is connected to a solvent tank 43 via a solvent supply tube 41 serving as a solvent supply path and an opening / closing valve 42, and is used to supply nitrogen (N 2) gas supplied into the solvent tank 43. By controlling the pressurization, the solvent A in the solvent tank 43 can supply a predetermined amount of the solvent A onto the substrate G for a predetermined time.

The resist liquid supply nozzle 50 is connected to a resist liquid tank 52 (coating liquid supply source) containing a resist liquid B via a resist liquid supply tube 51 which is a resist liquid supply path. The tube 51 has a suck back valve 53, an air operation valve 54,
A bubble removing mechanism 55 for separating and removing bubbles in the resist solution B, a filter 56, and a bellows pump 57 are sequentially provided. The bellows pump 57 is capable of expanding and contracting under the control of the drive unit, and a predetermined amount of the resist solution B is supplied to the substrate G through the resist solution supply nozzle 50.
For example, it can be supplied to the central part of the liquid crystal. It is possible to control the supply amount of the resist solution B smaller than the supply amount of the conventional resist solution B. This drive unit is constituted by a ball screw 58 having a screw one end of which is adsorbed to one end of the bellows pump, a nut screwed to the screw, and a stepping motor 59 for linearly moving the screw by rotating the nut. It is configured. The diameter of the resist liquid supply nozzle 50 is specifically set to φ0.5 to φ5 mm, preferably φ3 mm for a substrate of 500 × 600 mm. In this way, by setting the diameter of the nozzle according to the size of the substrate, it is possible to supply a small amount of the resist solution B as much as possible over a long time. If the supply time is short, the uniformity of the film thickness is not good, and if it is too long, the resist liquid does not reach the peripheral portion of the substrate. Here, as small as possible depends on the diameter of the nozzle and the supply pressure of the resist solution.

In the resist liquid supply system configured as described above, the discharge time of the resist liquid is controlled by the bellows pump 57.
(Control accuracy: ± 2 msec) by the driving time of the stepping motor 59. Further, the discharge amount of the resist liquid is set by a driving operation of the bellows pump 57, for example, a driving time and a driving speed, and an opening / closing operation (ON-OFF operation) of the air operation valve 54 for opening and closing the resist liquid supply passage. It has become. Setting of the driving time of the bellows pump 57 and ON / OFF of the air operation valve 54
The operation is automatically controlled by the operation of a computer based on a preset program.

The discharge time of the resist solution B is controlled by a variable orifice (not shown) provided in the resist solution supply nozzle 50.
It can also be performed by opening and closing operations. Also, the N solution to the resist solution tank 52 can be used without using the bellows pump 57.
It is also possible to supply the resist solution B by pressurizing the two gases. In this case, the discharge time of the resist solution B can be controlled by adjusting the pressurized amount of the N2 gas.

The suck-back valve 53 provided in the resist solution supply system discharges the resist solution B remaining on the inner wall of the tip of the resist solution supply nozzle 50 due to surface tension after the resist solution is discharged from the resist solution supply nozzle 50. This is a valve for drawing back into the resist liquid supply nozzle 50, thereby preventing solidification of the remaining resist liquid. In this case, when the resist liquid supply nozzle 50 that discharges a small amount of the resist liquid B draws the resist liquid B back into the resist liquid supply nozzle 50 by the negative pressure action of the suck back valve 53 as usual, the air near the tip of the nozzle 50 also becomes The residue of the resist solution B adhering to the tip of the nozzle 50 enters the nozzle 50 and clogs the nozzle 50, and the dried resist becomes particles and the substrate G is contaminated. At the same time, there is a risk that the yield will be reduced.

In order to solve this problem, as shown in FIG.
The thickness 50b of the portion near the opening is larger than that of FIG. That is, the nozzle 50 has a cylindrical tip and an inverted truncated cone following the cylindrical tip. Instead, as shown in FIG. 5B, an outer flange 5 is provided at the cylindrical tip or opening of the resist solution supply nozzle 50.
0c, the nozzle 5 during suckback
0 Entrapment of air near the front end can be prevented.
Further, as shown in FIG. 5C, a small-diameter bent portion 50d extending in a horizontal S-shape is formed at a vertically extending cylindrical tip of the resist liquid supply nozzle 50, and the center of the bent portion 50d is formed. By performing suckback to the vicinity, air entrapment at the nozzle tip can be similarly prevented.

The temperature adjusting mechanism 61 (temperature adjusting means)
As shown in FIG. 2, a temperature control liquid supply path 62 provided to surround the outer circumferences of the solvent supply tube 41 and the resist supply tube 51, respectively, and both ends of both ends of the temperature control liquid supply path 62 , A circulation pump 64 provided in each of the circulation paths 63, and a temperature adjustment liquid C connected in the middle of the circulation path 63.
(For example, constant temperature water) at a constant temperature. With the temperature adjusting mechanism 61 configured as described above, the solvent A flowing in the solvent supply tube 41 and the resist liquid B flowing in the resist supply tube 51 can be maintained at a predetermined temperature (for example, about 23 ° C.).

Note that a standby portion 46 of a rinse liquid supply nozzle 45 (not shown) is provided outside the rotary cup 12. Further, by disposing the cleaning nozzle 47 in the connecting cylinder 31 fixed without rotating on the lower side of the rotating cup 12, the inner surfaces of the rotating cup 12 and the lid 16 can be cleaned. That is, the cleaning nozzle 47 is held by a bracket 48 attached to the rotating shaft 22, and a cleaning liquid supply pipe 49 connected to the cleaning nozzle 47 is externally shown through a passage (not shown) provided in the fixed collar 24. 3, the spin chuck 10 is lifted up and the cleaning nozzle 47 is exposed from between the spin chuck 10 and the bottom of the rotating cup 12 to rotate the cleaning liquid as shown by the imaginary line in FIG. Can be sprayed on the inner surfaces of the rotating cup 12 and the lid 16.

Next, a procedure of forming a resist film by the coating film forming apparatus having the above-described configuration will be described with reference to a flowchart of FIG.

First, the lid 16 of the rotating cup 12 is opened, and the substrate G is moved onto the stationary spin chuck 10 by a transfer arm (not shown), and the substrate G is held by the vacuum chuck by the vacuum chuck. Support G. Thereafter, the opening 12a of the rotating cup 12 is closed with the lid 16, and the substrate G is sealed in the rotating cup 12 (step). Next, in a state where the substrate G is stationary without rotating, the solvent supply nozzle 40 applies a solvent A of the coating liquid to the surface of the substrate, for example, ethyl cellosolve acetate (ECA).
Is supplied, for example, in 26.7 cc for 20 seconds (sec), for example, is dropped (step). At this time, the solvent A may be dropped while the substrate G is rotated at a lower speed than the steady rotation during processing by the rotation drive of the spin chuck 10. Also,
After the solvent A is supplied for 20 seconds in this manner, the rotation speed of the spin chuck 10 and the rotating cup 12 is reduced to a low rotation speed (rotation speed: for example, 100 to 600 rpm, acceleration: 3).
Solvent A at a rotation speed of 100 to 500 rpm / sec).
Is stopped (step).

Next, the spin chuck 10 is rotated at a high speed (first rotation speed: in the range of about 600 to 1000 rpm, for example, 1000 rpm, acceleration: 300 to 600 rpm).
/ Sec), at the same time, a coating liquid, for example, a resist liquid B is supplied for, for example, 5 seconds from the resist liquid supply nozzle 50a to the central portion of the solvent film on the substrate surface for 5 seconds, for example, and 10 cc is dropped (step). The drying time of the solvent A at this time can be obtained in advance by an experiment. For example, when the surface of the substrate G is visually observed and the interference fringes of light are visible, the drying is not performed, and when the interference fringes are dried, the interference fringes become invisible, so that the time can be known. In this case, during the supply time of 5 seconds, the driving time of the bellows pump 57 can be controlled, and the supply amount of the resist solution can be accurately and finely controlled. Thus, the resist solution B
Is supplied (dropped) for 5 seconds, the supply of the resist solution B is stopped, and at the same time, the rotations of the spin chuck 10 and the rotating cup 12 are stopped (step).

Thus, the opening 1 of the rotating cup 12
The spin chuck 10 and the rotating cup 12 are rotated, for example, for 15 sec (second rotation speed: for example, 1350 rpm, acceleration: 50) in a state in which the lid 2a is closed and sealed by the lid 16.
0 rpm / sec) to adjust the thickness of the resist film (step). After the coating process is completed, the rotation of the spin chuck 10 and the rotation cup 12 is stopped, the lid 16 is moved to the standby position by the robot arm 20, and the substrate G is taken out by the transfer arm (not shown).
The application operation is completed.

The coating film forming apparatus according to the present invention configured as described above is used alone as a resist coating apparatus for the LCD substrate G, and is also used by being incorporated into a resist coating and developing processing system for the LCD substrate G described later. can do. Hereinafter, the structure of a resist coating and developing system incorporating the coating film forming apparatus of the above embodiment will be described.

The resist coating / developing processing system comprises:
As shown in FIG. 7, a loader unit 9 for loading / unloading the substrate G is provided.
0, a first processing unit 91 of the substrate G, and a second processing unit 92 connected to the first processing unit 91 via the relay unit 93. The second processing unit 92 includes a delivery unit 94
An exposure device 95 for exposing a predetermined fine pattern to a resist film via the resist film can be connected in series.

The loader unit 90 includes a cassette 96 for storing unprocessed substrates G, a cassette mounting table 98 for mounting a cassette 97 for storing processed substrates G, and a cassette 96 on the cassette mounting table 98. , 97 and the substrate G
Tweezers 9 that can be moved and rotated (θ) in the horizontal (X, Y) direction and the vertical (Z) direction in order to carry in / out a substrate.
9.

The first processing section 91 is provided with a transfer mechanism such as a main arm 80 capable of moving in the X, Y, and Z directions and rotating θ.
A brush cleaning device 120 for cleaning the substrate G with a brush, a jet water cleaning device 130 for cleaning the substrate G with high-pressure jet water, and an adhesion processing device for hydrophobizing the surface of the substrate G. 105 and substrate G
And a cooling processing device 106 for cooling to a predetermined temperature,
On the other side of the transport path 102, a coating processing device 107 (coating mechanism) and a coating film removing device 108 (coating film removing mechanism), which are the coating film forming devices of the present invention, are arranged.

On the other hand, like the first processing section 91, the second processing section 92 has a main arm 80a that can move in the X, Y, and Z directions and can rotate θ, and the transport path 102a of the main arm 80a. A heat treatment device 109 for heating the substrate G before and after the application of the resist solution to perform pre-baking or post-baking is disposed on one side of the substrate, and a developing device 110 is disposed on the other side of the transport path 102a.

The relay section 93 has a structure in which casters 93d are provided on the bottom surface of a box 93c having a delivery table 93b on which support pins 93a for supporting the substrate G are erected. The relay unit 93 is pulled out from the first processing unit 91 and the second processing unit 92, and the first processing unit 91
Alternatively, a worker can enter the second processing unit 92 to easily perform repairs and inspections.

The transfer section 94 includes a cassette 111 for temporarily holding the substrate G, and a cassette 1
Tweezers 1 for transferring a substrate G to and from the substrate 11
12 and a delivery table 113 for the substrate G are provided.

In the coating / developing processing system configured as described above, the unprocessed substrate G accommodated in the cassette 96 is taken out by the loading / unloading tweezers 99 of the loader unit 90, The brush is transferred to the main arm 80 and then transferred into the brush cleaning device 120. The substrate G that has been brush-cleaned in the brush cleaning device 120 is subsequently cleaned with high-pressure jet water in the jet water cleaning device 130. Thereafter, the substrate G is subjected to a hydrophobizing treatment by the adhesion processing device 105 and cooled by the cooling treatment device 106,
Is carried into the coating mechanism, that is, the coating processing apparatus 107,
In the coating processing apparatus 107, a photoresist, that is, a photosensitive film is coated and formed by the above-described procedure, and subsequently, an unnecessary resist film on the side of the substrate G is removed by the coating film removing apparatus 108. Substrate G from which unnecessary resist film is removed
Is transported out of the coating film removing device 108 by the main arm 80 and transported to the next step. Therefore, when the substrate G is carried out thereafter, the resist film on the edge portion is removed, so that the resist does not adhere to the main arm 80. Then, this photoresist is applied to the heat treatment device 109.
After heating and baking, a predetermined pattern is exposed by the exposure device 95. Then, the exposed substrate G is transported into the developing device 110, and after being developed with the developing solution, the developing solution is washed away with the rinsing solution to complete the developing process.

The processed substrate G that has been subjected to the development processing is accommodated in the cassette 97 of the loader unit 90, and then carried out and transported to the next processing step.

The coating solution includes a resist (phenol novolak resin and naphthoquinonediazide ester), an ARC (antireflection film; Anti Reflect).
ion Coating) may be used.

As the solvent, methyl-3-methoxypropionate (MMT, boiling point: 145 ° C., viscosity: 1.
1cps), ethyl lactate (EL, boiling point: 154 ° C,
Viscosity: 2.6 cps), ethyl-3-ethoxypropionate (EEP, boiling point: 170 ° C., viscosity: 1.3 cp)
s), ethyl pyruvate (EP, boiling point: 144 ° C., viscosity: 1.2 cps), propylene glycol monomethyl ether acetate (PGMEA, boiling point: 146 ° C., viscosity: 1.3 cps), 2-heptanone (boiling point: 152)
° C, viscosity: 1.1 cps), cyclohexanone (ARC)
Solvents known in the art can be used.

In the above embodiment, the case where the coating film forming apparatus according to the present invention is applied to a resist coating apparatus for an LCD substrate has been described. Of course, the present invention can also be applied to a polyimide-based coating liquid (PIQ) other than a resist, a coating liquid containing a glass agent (SOG), and the like.

[0055]

As described above, according to the present invention, the lid is closed in the processing container, the substrate is sealed in the processing container, and then the solvent is dropped on one surface of the substrate. A predetermined amount of the coating liquid is supplied onto the substrate, and the lid is rotated at the first rotation speed.
The closed processing container and the substrate are rotated together to diffuse over the entire surface of the substrate, and the lid is closed.
The substrate and the substrate are both rotated at a second rotation speed different from the first rotation speed to adjust the thickness of the coating film, so that a coating liquid having an appropriate mixing ratio with respect to the solvent can be supplied. The amount of use can be reduced, and the coating liquid can be prevented from sneaking into the back surface of the corner of the substrate. Further, the viscosity of the coating solution caused by contact between the solvent and the coating solution can be made uniform to form a coating film having a uniform thickness. In addition, since the solvent and the coating liquid are dropped and applied while the opening of the processing container is closed with the lid, the processing throughput is higher than that of a movable type in which the solvent supply means and the coating liquid supply means are moved by using a scanning mechanism. Shortening can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a coating film forming apparatus for performing a coating film forming method according to the present invention.

FIG. 2 is a schematic sectional view showing a solvent supply nozzle and a resist liquid supply nozzle according to the present invention.

FIG. 3 is an enlarged sectional view of a main part of a coating film forming apparatus according to the present invention.

FIG. 4 is a partially sectional perspective view showing a processing container and a lid according to the present invention.

FIG. 5 is a cross-sectional view showing different modifications of the tip of the resist solution supply nozzle according to the present invention.

FIG. 6 is a flowchart for explaining a method of forming a resist film using the above-mentioned coating film forming apparatus.

FIG. 7 is a perspective view schematically showing an entire resist coating / developing system to which the coating film forming apparatus is applied.

[Explanation of symbols]

 Reference Signs List 10 spin chuck 12 rotating cup (processing container) 16 lid 18a opening 18B mounting member 18C bearing 20 robot arm (lid moving means) 21 drive motor 40 solvent supply nozzle (solvent supply means) 50 resist liquid supply nozzle (coating liquid supply Means) 52 Resist liquid tank (coating liquid supply source) 57 Bellows pump 59 Stepping motor 80 Main arm (transport mechanism) 107 Coating device (coating mechanism) 108 Coating film removing device (coating film removing mechanism) G LCD substrate (substrate) A solvent B resist solution (coating solution)

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenji Sekiguchi 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside the Kumamoto Plant of Tokyo Electron Kyushu Co., Ltd. No. 1 Tokyo Electron Limited (56) References JP-A-56-54435 (JP, A) JP-A-5-243140 (JP, A) JP-A-4-66159 (JP, A) JP-A-4 JP-A-349969 (JP, A) JP-A-4-34113 (JP, A) JP-A-6-210230 (JP, A) JP-A-2-122520 (JP, A) JP-A-1-124271 (JP, A) JP-A-1-135565 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B05C 11/08 B05D 1/40 G03F 7/16 502 H01L 21/027

Claims (7)

(57) [Claims] 1. A side accommodated in a processing container is directed upward.
Providing a coating liquid on one surface of a substrate supported by the method, forming a coating film, comprising closing a lid in the processing container and enclosing the substrate in the processing container; A step of dropping a solvent onto the substrate, supplying a predetermined amount of the coating liquid to the substrate,
Rotating the processing container and the substrate together with the lid closed to diffuse over the entire surface of the substrate; and combining the processing container and the substrate with the lid closed together with the first container.
Rotating the film at a second number of revolutions different from the number of revolutions to adjust the thickness of the applied film. 2. The side accommodated in the processing container is directed upward.
The coating liquid is supplied on one side of the substrate
In the method for forming a substrate, the lid is closed in the processing container, and the substrate is sealed in the processing container.
And attaching to the center of the lid so as to be rotatable relative to the lid.
Solvent is dropped onto one surface of the substrate from the solvent supply means.
A step of down, in the center of the lid, relatively rotatably mounted with said top
A predetermined amount of coating liquid is applied to the substrate from the coating liquid supply means.
Supply the liquid and rotate it at the first rotation speed to
Diffusing the processing container and the substrate with the lid closed, in the first cycle
Rotating at a second rotation speed different from the rotation speed,
Forming a coating film having a step of adjusting the thickness.
Method. 3. The surface accommodated in the processing container is turned up.
The coating liquid is supplied on one side of the substrate
In the method for forming a substrate, the lid is closed in the processing container, and the substrate is sealed in the processing container.
And attaching to the center of the lid so as to be rotatable relative to the lid.
Solvent is dropped onto one surface of the substrate from the solvent supply means.
A step of down, in the center of the lid, relatively rotatably mounted with said top
A predetermined amount of coating liquid is applied to the substrate from the coating liquid supply means.
A process in which the liquid is supplied and the lid is closed at the first rotation speed.
Rotate the container and the substrate together to cover the entire surface of the substrate
Spreading the substrate and the substrate together with the processing container and the substrate having the lid closed.
The coating film is rotated at a second rotation speed different from the rotation speed of
And a step of adjusting the film thickness of the coating film.
Forming method. 4. A coating according to any one of claims 1 to 3
In the fabric film forming method, it is preferable that the second rotation speed is higher than the first rotation speed.
Characteristic coating film forming method. 5. The method for forming a coating film according to claim 1, wherein when the solvent is dropped on one surface of the substrate, the substrate is kept stationary. . 6. The method for forming a coating film according to claim 1, wherein a solvent of a coating solution is dropped as a solvent. A substrate supporting means for supporting facing upward 7. one surface of the substrate, a processing vessel that forms a cup-shaped surrounding the substrate, and a lid member which closes an opening of the processing vessel, the substrate support means And the rotation speed to rotate the processing vessel
An apparatus for forming a coating film, comprising: a variable rotating means ; and a solvent supply means and a coating liquid supply means which are rotatably mounted at a center portion of the lid body relative to the lid body.