JP2937549B2 - Coating device - Google Patents

Coating device

Info

Publication number
JP2937549B2
JP2937549B2 JP14091191A JP14091191A JP2937549B2 JP 2937549 B2 JP2937549 B2 JP 2937549B2 JP 14091191 A JP14091191 A JP 14091191A JP 14091191 A JP14091191 A JP 14091191A JP 2937549 B2 JP2937549 B2 JP 2937549B2
Authority
JP
Japan
Prior art keywords
cup
plate
lid
coating
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14091191A
Other languages
Japanese (ja)
Other versions
JPH04341367A (en
Inventor
宏仁 佐合
勝彦 工藤
重美 藤山
克朗 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO OKA KOGYO KK
Original Assignee
TOKYO OKA KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO OKA KOGYO KK filed Critical TOKYO OKA KOGYO KK
Priority to JP14091191A priority Critical patent/JP2937549B2/en
Publication of JPH04341367A publication Critical patent/JPH04341367A/en
Application granted granted Critical
Publication of JP2937549B2 publication Critical patent/JP2937549B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】液晶ディスプレイ(LCD)の製
造工程等に用いる塗布装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus used in a manufacturing process of a liquid crystal display (LCD).

【0002】[0002]

【従来の技術】ブラウン管(CRT)に代わる表示装置
として、表面に画素を構成する電極や素子を形成した2
枚のガラス基板の間に液晶を注入した構造の液晶ディス
プレイが注目されている。そして上記の画素としては薄
膜トランジスタ(TFT)や金属/絶縁体/金属接合
(MIM)などの素子で駆動せしめるアクティブマトリ
クス方式が高画質の画面が得られるため主流になりつつ
ある。
2. Description of the Related Art As a display device replacing a cathode ray tube (CRT), an electrode or an element forming a pixel is formed on the surface.
A liquid crystal display having a structure in which liquid crystal is injected between two glass substrates has attracted attention. As the above-mentioned pixels, an active matrix system driven by an element such as a thin film transistor (TFT) or a metal / insulator / metal junction (MIM) is becoming mainstream because a high-quality screen can be obtained.

【0003】上記の薄膜トランジスタ等をガラス基板上
に形成する技術はシリコンウェハ等に集積回路を形成す
る半導体製造技術をそのまま応用している。レジスト液
の塗布も一連の工程のうちの一つであり、この工程では
インナーカップ内の真空チャックにセットしたガラス基
板上にレジスト液を滴下し、次いでスピンナーによって
真空チャックとインナーカップを一体的に回転せしめ遠
心力によってガラス基板表面にレジスト液を均一に塗布
するようにしている。
The technique of forming the above-mentioned thin film transistor and the like on a glass substrate directly applies a semiconductor manufacturing technique of forming an integrated circuit on a silicon wafer and the like. The application of a resist solution is also one of a series of steps, in which a resist solution is dropped onto a glass substrate set on a vacuum chuck in an inner cup, and then the vacuum chuck and the inner cup are integrated by a spinner. By rotating the resist, the resist liquid is uniformly applied to the surface of the glass substrate by centrifugal force.

【0004】そして、滴下した塗布液の一部は遠心力に
よってインナーカップ内壁に飛び散る。この塗布液をそ
のままにしておくと乾燥して固化し、小さな破片となっ
てガラス基板表面に付着することとなる。これを防止す
べく本出願人は先に、インナーカップの外周壁にドレイ
ンパイプを取り付け、余分な塗布液についてはドレイン
パイプを介して回収通路に排出するとともに、インナー
カップ及びアウターカップの開放された上面を蓋体で覆
うことで、一旦回収した塗布液が外部に吸引され霧状等
となって浮遊し、この浮遊する塗布液粒子がガラス基板
表面に付着してスポット的な欠陥を生じるのを防止する
技術を提案した。
[0004] A part of the dropped coating liquid scatters on the inner wall of the inner cup due to centrifugal force. If this coating solution is left as it is, it is dried and solidified, and becomes small fragments and adheres to the surface of the glass substrate. In order to prevent this, the present applicant first attached a drain pipe to the outer peripheral wall of the inner cup, discharged excess coating liquid to the recovery passage via the drain pipe, and opened the inner cup and the outer cup. By covering the top surface with the lid, the coating liquid once collected is sucked out and floats in the form of a mist, etc., and the floating coating liquid particles adhere to the surface of the glass substrate and cause spot-like defects. Proposed technology to prevent.

【0005】しかしながら、カップ側壁にドレインパイ
プを取り付けると、回転に伴う遠心力によりカップ内の
空気或いはガスがドレインパイプを通って排出されカッ
プ内が減圧状態となる。そしてレジスト液の塗布が終了
し減圧状態で蓋体を外してガラス基板をカップから取り
出そうとすると、内部が減圧状態のため急激にカップ内
に空気が流入し、乾燥して固化したレジストの微細粉が
ガラス基板表面に付着する不利がある。
However, when the drain pipe is attached to the side wall of the cup, air or gas in the cup is discharged through the drain pipe due to centrifugal force caused by rotation, and the inside of the cup is reduced in pressure. When the application of the resist solution is completed and the lid is removed under reduced pressure to remove the glass substrate from the cup, air flows into the cup rapidly due to the reduced pressure, and the fine powder of the resist that has dried and solidified Disadvantageously adheres to the glass substrate surface.

【0006】これを解消すべく更に本出願人は、インナ
ーカップの蓋体の下面に所定間隔離してカップ内に入り
込む寸法の円形の整流板を取り付け、この整流板と前記
蓋体との間の空間にガス導入ノズルを開口せしめる技術
を提案した。
In order to solve this problem, the present applicant further attaches a circular rectifying plate having a dimension to enter the cup with a predetermined space between the rectifying plate and the lid, on the lower surface of the lid of the inner cup. A technique for opening a gas introduction nozzle in the space was proposed.

【0007】[0007]

【発明が解決しようとする課題】板状被処理物としての
ガラス基板の形状は一般には四角形(矩形)である。斯
かる四角形のガラス基板の上面に接近して円形の整流板
を臨ませて回転せしめると、これらの形状差に起因して
乱流が発生し、ガラス基板上に塗布したレジスト液の厚
みが部分的に異なる結果を招く。
The shape of a glass substrate as a plate-like workpiece is generally square (rectangular). If the circular current plate approaches the upper surface of such a square glass substrate and is rotated, a turbulent flow is generated due to a difference in these shapes, and the thickness of the resist solution applied on the glass substrate is partially increased. Have different results.

【0008】そこで整流板をガラス基板に合わせて四角
形にすることが考えられるが、整流板を四角形にすると
今度は整流板とインナーカップ内周形状との形状差によ
り乱流が発生し、また部分的に整流板とインナーカップ
内周面との間隔が広くなりこの部分から上方に塗布液が
飛散してしまう。
Therefore, it is conceivable to make the current plate a square in accordance with the glass substrate. However, if the current plate is made a square, a turbulent flow is generated due to a difference in shape between the current plate and the inner peripheral shape of the inner cup. As a result, the distance between the current plate and the inner peripheral surface of the inner cup is widened, and the coating liquid is scattered upward from this portion.

【0009】[0009]

【課題を解決するための手段】上記課題を解決すべく本
発明は、四角形などの矩形状をなす被処理物にレジスト
液を塗布する装置において、被処理物をセットする回転
カップ上面を蓋体で閉塞するとともに、この蓋体の下面
に被処理物より大寸法で相似形の整流板を被処理物との
間に一定の間隔を保持するように取り付け、この整流板
と前記蓋体との間の空間に洗浄液供給ノズル及び/又は
ガス導入ノズルを臨ませ、更に前記カップ内周には板状
被処理物より大寸法で相似形の開口を形成した飛散防止
リングを設けた。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to an apparatus for applying a resist liquid to a rectangular or other rectangular object to be processed. At the same time, a rectifying plate having a similar size and a larger size than the object to be processed is attached to the lower surface of the lid so as to maintain a constant distance between the rectifying plate and the lid. The cleaning liquid supply nozzle and / or the gas introduction nozzle faced the space between them, and a scattering prevention ring having a similar size opening and a larger size than the plate-like workpiece was provided on the inner periphery of the cup.

【0010】[0010]

【作用】回転カップ上面を蓋体で閉塞した状態で、被処
理物表面に滴下した塗布液をカップを回転せしめて均一
に拡散せしめる際に、整流板が介在することで被処理物
表面にノズルから噴出するガスが当らず且つ被処理物表
面で乱流が発生しにくくなる。
With the upper surface of the rotating cup closed by the lid, the coating liquid dropped on the surface of the workpiece is rotated and the cup is rotated to uniformly spread the coating liquid. Turbulence does not easily occur on the surface of the object to be treated, without the gas ejected from the surface.

【0011】[0011]

【実施例】以下に本発明の実施例を添付図面に基づいて
説明する。ここで、図1は本発明に係る塗布装置を組み
込んだ被膜形成ラインの平面図、図2は同塗布装置の蓋
体を上げた状態の断面図、図3は図2のA−A方向矢視
図、図4は同塗布装置の蓋体を閉じた状態の断面図、図
5は図4の要部拡大図である。
Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a plan view of a film forming line incorporating the coating apparatus according to the present invention, FIG. 2 is a cross-sectional view of the coating apparatus in a state in which a lid is raised, and FIG. FIG. 4 is a cross-sectional view of the coating apparatus with the lid closed, and FIG. 5 is an enlarged view of a main part of FIG.

【0012】被膜形成ラインは図1の左側を上流部と
し、この上流部に矩形状をなす板状被処理物としてのガ
ラス基板Wの投入部1を設け、この投入部1の下流側に
本発明に係る塗布装置2を配置し、この塗布装置2の下
流側に順次、減圧乾燥装置3、ガラス基板Wの裏面洗浄
装置4及びホットプレート5a・・・とクーリングプレー
ト5bを備えた加熱部5を配置し、投入部1から加熱部
5に至るまでは搬送装置6によってガラス基板Wの前後
端の下面を支持した状態で搬送し、加熱部5においては
垂直面内でクランク動をなす搬送装置7によりガラス基
板Wの下面を支持した状態で各ホットプレート5a上を
順次移し換え、最終的にクーリングプレート5bで温度
を調整しつつガラス基板Wを搬送するようにしている。
The coating film forming line has an upstream portion on the left side of FIG. 1, and an input portion 1 for a glass substrate W as a rectangular plate-like workpiece is provided on the upstream portion. A coating unit 2 according to the present invention is arranged, and a heating unit 5 having a vacuum drying unit 3, a back surface cleaning unit 4 for a glass substrate W, a hot plate 5a... Is transported from the charging section 1 to the heating section 5 while the lower surfaces of the front and rear ends of the glass substrate W are supported by the transport apparatus 6, and the heating section 5 performs a crank motion in a vertical plane. While the lower surface of the glass substrate W is supported by 7, each hot plate 5 a is sequentially transferred, and finally the glass substrate W is transported while the temperature is adjusted by the cooling plate 5 b.

【0013】塗布装置2はスピンナー装置の軸21に取
り付けられたインナーカップ22の外側にアウターカッ
プ23を配設している。インナーカップ22は底板22
aと側板22bからなり、アウターカップ23は軸21
が貫通する底板23a、本体23b及び側板23cから
構成される。
The coating device 2 has an outer cup 23 disposed outside an inner cup 22 attached to a shaft 21 of a spinner device. Inner cup 22 is bottom plate 22
a and a side plate 22b.
Are constituted by a bottom plate 23a, a main body 23b, and a side plate 23c that penetrate through.

【0014】そして、インナーカップ22の底板22a
の中央にはガラス基板Wを吸着固定する真空チャック2
4を設け、側板22bの下部にはドレインパイプ25を
取り付け、一方、本体23bには環状のドレイン回収通
路27を形成し、この回収通路27の幅狭部28を介し
て前記ドレインパイプ25を回収通路27に臨ませてい
る。なお、ドレインパイプ25はスリット又は複数の孔
を有する庇状物であってもよい。
The bottom plate 22a of the inner cup 22
Vacuum chuck 2 for holding glass substrate W by suction at the center of
4, a drain pipe 25 is attached to the lower portion of the side plate 22b, while an annular drain recovery passage 27 is formed in the main body 23b, and the drain pipe 25 is recovered through a narrow portion 28 of the recovery passage 27. It faces the passage 27. The drain pipe 25 may be a slit or an eave-like object having a plurality of holes.

【0015】またインナーカップ22及びアウターカッ
プ23の上方には図1に示すようにアーム29、30を
配置している。これらアーム29、30は直線動、回転
動、上下動或いはこれらを合成した動きが可能で互いに
干渉しないようになっている。そして、アーム29には
レジスト液等の塗布液を滴下するノズルを取り付け、ア
ーム30の先端には下方に伸びる軸31を取り付け、こ
の軸31にはノズル孔32を穿設し、このノズル孔32
をジョイント及びアーム30内を通るホース33、34
を介してチッ素ガス供給源及び洗浄液供給源につなげて
いる。
Arms 29 and 30 are disposed above the inner cup 22 and the outer cup 23 as shown in FIG. The arms 29 and 30 can be moved linearly, rotationally, vertically, or a combination thereof, so that they do not interfere with each other. A nozzle for dropping a coating solution such as a resist solution is attached to the arm 29, a shaft 31 extending downward is attached to the tip of the arm 30, and a nozzle hole 32 is formed in the shaft 31.
Hoses 33, 34 passing through the joint and arm 30
And a nitrogen gas supply source and a cleaning liquid supply source.

【0016】また、前記軸31にはベアリング35及び
磁気シール36を介してボス部37を回転自在に嵌合
し、このボス部37にインナーカップ22の上面開口を
閉塞するための円板状をなすアルミニウム製の蓋体38
を取り付けている。また、この蓋体38の上方のアーム
30の先端下面にはアウターカップ23の上面開口を閉
塞するための蓋体39を固着している。
A boss 37 is rotatably fitted to the shaft 31 via a bearing 35 and a magnetic seal 36. The boss 37 has a disk shape for closing the upper opening of the inner cup 22. Eggplant aluminum lid 38
Is installed. Further, a lid 39 for closing an upper surface opening of the outer cup 23 is fixed to a lower surface of a distal end of the arm 30 above the lid 38.

【0017】蓋体38の下面にはビス40によってイン
ナーカップ22内の乱流を防止する整流板41を取り付
けている。この整流板41は図3に示すようにガラス基
板Wより若干大きな寸法で且つ相似形をしている。
A rectifying plate 41 for preventing turbulent flow in the inner cup 22 is attached to the lower surface of the lid 38 by screws 40. As shown in FIG. 3, the current plate 41 has a size slightly larger than the glass substrate W and has a similar shape.

【0018】またインナーカップ22の内周面の上端部
には複数個の係止部42を設け、これら係止部42にビ
ス43にてブロック44を固着し、このブロック44の
下面に環状をなす飛散防止リング45を取り付けてい
る。この飛散防止リング45は蓋体38を閉じた状態で
前記整流板41よりも上方に位置し、整流板41が上昇
する際に干渉しないための開口46を形成している。こ
の開口46の形状は整流板41の外径寸法より若干大き
な寸法で且つ相似形をしている。
A plurality of locking portions 42 are provided at the upper end of the inner peripheral surface of the inner cup 22, and a block 44 is fixed to these locking portions 42 with screws 43. An anti-scattering ring 45 is attached. The scattering prevention ring 45 is located above the rectifying plate 41 with the lid 38 closed, and forms an opening 46 for preventing interference when the rectifying plate 41 rises. The shape of the opening 46 is slightly larger than the outer diameter of the current plate 41 and has a similar shape.

【0019】蓋体39は中央に形成した孔50を介して
アーム30の先端下面に取り付けた筒体51の外周に嵌
合し、孔50の周縁に固着したテフロン製の軸受け52
に筒体51に植設したガイドポスト53を係合せしめる
ことで蓋体39を上下摺動自在に保持している。
The lid 39 is fitted to the outer periphery of a cylindrical body 51 attached to the lower surface of the distal end of the arm 30 through a hole 50 formed in the center, and a Teflon bearing 52 fixed to the periphery of the hole 50.
The cover 39 is held slidably up and down by engaging a guide post 53 implanted in the cylindrical body 51.

【0020】ところで、蓋体38を閉じてインナーカッ
プ22,ガラス基板W及び整流板41を回転せしめ、ガ
ラス基板W上に滴下した塗布液を遠心力で拡散する場合
には、図3に示すようにガラス基板Wと整流板41とが
完全に同一位相で重なるか、或いは回転速度を見込んで
所定角ずらせてガラス基板W上に整流板41を臨ませる
必要がある。
When the lid 38 is closed and the inner cup 22, the glass substrate W, and the rectifying plate 41 are rotated to diffuse the coating solution dropped on the glass substrate W by centrifugal force, as shown in FIG. It is necessary that the glass substrate W and the rectifying plate 41 completely overlap in the same phase, or the rectifying plate 41 faces the glass substrate W with a predetermined angle shifted in consideration of the rotational speed.

【0021】このため、蓋体38の外周には切欠54を
形成し、また蓋体38からは上方に向けてピン55を突
出し、このピン55が係合する受け部材56を蓋体39
に取付けている。即ち、蓋体39は前記したガイドポス
ト53により回転が阻止されガラス基板Wに対する相対
位置が確定しているので、蓋体38を上昇させた図2及
び図6の状態では受け部材56に蓋体38のピン55が
係合することで蓋体38及び整流板41のガラス基板W
に対する相対位置も定まる。
For this purpose, a notch 54 is formed on the outer periphery of the lid 38, and a pin 55 projects upward from the lid 38, and a receiving member 56 with which the pin 55 is engaged is connected to the lid 39.
It is attached to. That is, since the cover 39 is prevented from rotating by the guide post 53 and the relative position with respect to the glass substrate W is fixed, the cover member 38 is lifted up in the receiving member 56 in the state of FIGS. 38 are engaged with the cover 55 and the glass substrate W of the current plate 41.
The relative position to is also determined.

【0022】この後、アーム30を下降させると図7に
示すように、蓋体39の外周端がアウターカップ23の
側板23c上端に載置される。そしてこの状態でビス4
3の直上に切欠54が位置している。したがって、この
状態で蓋体38を下降せしめれば図4に示すように蓋体
38の切欠54がビス43の頭部に係合し、ガラス基板
Wと整流板41との位置関係は図3に示すようになる。
Thereafter, when the arm 30 is lowered, the outer peripheral end of the lid 39 is placed on the upper end of the side plate 23c of the outer cup 23 as shown in FIG. And screw 4 in this state
Notch 54 is located immediately above 3. Therefore, when the lid 38 is lowered in this state, the notch 54 of the lid 38 engages with the head of the screw 43 as shown in FIG. 4, and the positional relationship between the glass substrate W and the current plate 41 is as shown in FIG. It becomes as shown in.

【0023】以上において、ガラス基板W表面にレジス
ト液を均一に塗布するには、インナーカップ22及びア
ウターカップ23の上面を開放して真空チャック24上
に固着されているガラス基板Wの表面にアーム29に取
り付けられているノズルからレジスト液を滴下し、次い
でアーム29を後退せしめて図2に示すようにインナー
カップ22及びアウターカップ23上にアーム30を回
動させて蓋体38、39を臨ませる。
In the above, in order to uniformly apply the resist solution on the surface of the glass substrate W, the upper surfaces of the inner cup 22 and the outer cup 23 are opened and an arm is provided on the surface of the glass substrate W fixed on the vacuum chuck 24. The resist solution is dropped from a nozzle attached to the nozzle 29, the arm 29 is then retracted, and the arm 30 is rotated on the inner cup 22 and the outer cup 23 as shown in FIG. I do.

【0024】そして図4に示すように、アーム30を下
降することで蓋体38によりインナーカップ22の上面
を閉塞し、蓋体39によりアウターカップ23の上面開
口を閉塞したならば、スピンナーによって真空チャック
24とインナーカップ22を一体的に回転せしめ、遠心
力によりレジスト液をガラス基板Wの表面に均一に拡散
塗布する。
As shown in FIG. 4, if the upper surface of the inner cup 22 is closed by the lid 38 by lowering the arm 30 and the upper surface opening of the outer cup 23 is closed by the lid 39, a vacuum is applied by the spinner. The chuck 24 and the inner cup 22 are rotated integrally, and the resist solution is uniformly diffused and applied to the surface of the glass substrate W by centrifugal force.

【0025】そして、以上の処理においてインナーカッ
プ22内は減圧状態になっているので、このまま蓋をあ
けてガラス基板Wを取り出すと、インナーカップ内の空
気が乱れてレジスト液がスポット的にガラス基板W表面
に付着するおそれがある。そこでレジスト液が均一に塗
布されたガラス基板Wを取り出すには、先ず窒素ガス供
給源につながるパイプ33及びノズル孔32を介して蓋
体38と整流板41の間の空間に窒素ガス等を導入し減
圧状態を解除して行う。このときノズル孔32からのガ
スは整流板41があるため、ガラス基板W表面のレジス
ト液に直接吹き付けられることがない。
In the above processing, since the inside of the inner cup 22 is in a reduced pressure state, if the glass substrate W is taken out by opening the lid as it is, the air in the inner cup is disturbed and the resist solution is spotted on the glass substrate. It may adhere to the W surface. In order to take out the glass substrate W coated with the resist solution uniformly, first, nitrogen gas or the like is introduced into the space between the lid 38 and the rectifying plate 41 through the pipe 33 and the nozzle hole 32 connected to the nitrogen gas supply source. And then release the pressure reduction state. At this time, the gas from the nozzle hole 32 is not directly blown onto the resist liquid on the surface of the glass substrate W because of the presence of the current plate 41.

【0026】このようにして、所定枚数のガラス基板W
にレジスト液を均一に塗布した後には余分な塗布液の一
部がインナーカップ22内周面等に付着している。これ
を放置しておくと乾燥固化して雰囲気中に飛散し、ガラ
ス基板W表面に付着するため、洗浄を行う。
Thus, a predetermined number of glass substrates W
After the resist solution is uniformly applied to the inner cup 22, a part of the excess coating solution adheres to the inner peripheral surface of the inner cup 22 or the like. If this is left as it is, it is dried and solidified, scatters in the atmosphere, and adheres to the surface of the glass substrate W, so that cleaning is performed.

【0027】洗浄はガラス基板Wを除いた状態でインナ
ーカップ22とアウターカップ23を蓋体38,39で
閉じて行う。即ち、洗浄液供給源につながるパイプ34
及びノズル孔32を介して蓋体38と整流板41の間の
空間に洗浄液を供給する。
Cleaning is performed by closing the inner cup 22 and the outer cup 23 with the lids 38 and 39 with the glass substrate W removed. That is, the pipe 34 connected to the cleaning liquid supply source
The cleaning liquid is supplied to the space between the lid 38 and the current plate 41 via the nozzle hole 32.

【0028】すると図5に示すように、洗浄液は遠心力
によって整流板41の表面を流れ、その一部はインナー
カップ22の内周面に到達し、この内周面に付着した塗
布液を洗い流し、ドレインパイプ25を介して回収通路
27内に排出され、他の一部は蓋体38外周とインナー
カップ22上端との間の連通部P1、インナーカップ2
2外側面とアウターカップ23内側面との間には隙間P
2を介して前記回収通路27に排出され、この間に回収
通路27の幅狭部28内周面等に付着した塗布液を洗い
流す。
Then, as shown in FIG. 5, the cleaning liquid flows on the surface of the current plate 41 due to the centrifugal force, and a part of the cleaning liquid reaches the inner peripheral surface of the inner cup 22, and the coating liquid adhered to this inner peripheral surface is washed away. Is discharged into the collection passage 27 through the drain pipe 25, and another part is communicated with the communicating portion P 1 between the outer periphery of the lid 38 and the upper end of the inner cup 22,
2 A gap P between the outer surface and the inner surface of the outer cup 23
The coating liquid is discharged to the collection passage 27 through the second passage 2, and during this time, the coating liquid attached to the inner peripheral surface of the narrow portion 28 of the collection passage 27 is washed away.

【0029】[0029]

【発明の効果】以上に説明したように本発明によれば、
塗布装置のカップ上面を閉じる蓋体の下面に被処理物と
相似形で大寸法の整流板を取付け、この整流板と前記蓋
体との間の空間に洗浄液供給ノズル及び/又はガス導入
ノズルを臨ませ、更にカップ内周には被処理物と相似形
で大寸法の開口を形成した飛散防止リングを設けたの
で、カップを回転させた場合にカップ内に乱流が生じに
くく、また塗布完了後にカップ内にガスを導入する際に
導入ガスが被処理物表面に直接当らないので膜厚を均一
に保つことができ、更に洗浄液をカップ内に供給する際
にも整流板及び飛散防止リングがガイドとなってカップ
内周壁に洗浄液を導くことができる。
According to the present invention as described above,
A large rectifying plate similar in shape to the object to be processed is attached to the lower surface of the lid that closes the upper surface of the cup of the coating device, and a cleaning liquid supply nozzle and / or a gas introduction nozzle are provided in a space between the rectifying plate and the lid. In addition, a scattering prevention ring with a large opening similar to the object to be processed is provided on the inner circumference of the cup, so that when the cup is rotated, turbulence does not easily occur in the cup, and the coating is completed Later, when the gas is introduced into the cup, the introduced gas does not directly hit the surface of the object to be treated, so that the film thickness can be kept uniform. The washing liquid can be guided to the inner peripheral wall of the cup as a guide.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る塗布装置を組み込んだ被膜形成ラ
インの平面図
FIG. 1 is a plan view of a film forming line incorporating a coating apparatus according to the present invention.

【図2】同塗布装置の蓋体を上げた状態の断面図FIG. 2 is a cross-sectional view of the coating apparatus in a state where a lid is raised.

【図3】図2のA−A方向矢視図FIG. 3 is a view taken in the direction of arrows AA in FIG. 2;

【図4】同塗布装置の蓋体を閉じた状態の断面図FIG. 4 is a sectional view of the coating apparatus in a state where a lid is closed.

【図5】図4の要部拡大図FIG. 5 is an enlarged view of a main part of FIG. 4;

【図6】蓋体を上げた状態の要部断面図FIG. 6 is a sectional view of a main part in a state where a lid is raised.

【図7】蓋体を途中まで下げた状態の要部断面図FIG. 7 is a cross-sectional view of a main part in a state where the lid is lowered halfway.

【符号の説明】[Explanation of symbols]

2…塗布装置、22…インナーカップ、23…アウター
カップ、38,39…蓋体、41…整流板、45…飛散
防止リング、46…開口、52…軸受け、53…ガイド
ポスト、55…ピン、56…受け部材。
2 ... Coating device, 22 ... Inner cup, 23 ... Outer cup, 38,39 ... Lid, 41 ... Rectifier plate, 45 ... Scatter prevention ring, 46 ... Opening, 52 ... Bearing, 53 ... Guide post, 55 ... Pin, 56 receiving member.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−87664(JP,A) 特開 平1−176473(JP,A) 特開 平3−293055(JP,A) (58)調査した分野(Int.Cl.6,DB名) B05C 11/08 B05D 1/40 G03F 7/16 502 G11B 5/842 H01L 21/027 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-87664 (JP, A) JP-A-1-176473 (JP, A) JP-A-3-293055 (JP, A) (58) Field (Int.Cl. 6 , DB name) B05C 11/08 B05D 1/40 G03F 7/16 502 G11B 5/842 H01L 21/027

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 板状被処理物をスピンナーによって回転
せしめられるカップ内にセットし、この板状被処理物の
表面に塗布液を滴下し、次いでカップ上面を蓋体で閉塞
してカップを回転させることで滴下した塗布液を板状被
処理物の表面に均一に拡散せしめるようにした塗布装置
において、前記板状被処理物は矩形状をなし、また前記
蓋体の下面には板状被処理物より大寸法で相似形の整流
板を板状被処理物との間に一定の間隔を保持するように
取り付け、この整流板と前記蓋体との間の空間に洗浄液
供給ノズル及び/又はガス導入ノズルを臨ませ、更に前
記カップ内周には板状被処理物より大寸法で相似形の開
口を形成した飛散防止リングを設けたことを特徴とする
塗布装置。
1. A plate-shaped workpiece is set in a cup rotated by a spinner, a coating liquid is dropped on the surface of the plate-shaped workpiece, and then the upper surface of the cup is closed with a lid to rotate the cup. In the coating apparatus, the coating liquid dropped to spread the coating liquid uniformly on the surface of the plate-like workpiece, the plate-like workpiece has a rectangular shape, and a plate-like coating is formed on the lower surface of the lid. A rectifying plate having a larger size and a similar shape than that of the processing object is attached so as to maintain a constant distance between the rectifying plate and the lid, and a cleaning liquid supply nozzle and / or a cleaning liquid supply nozzle is provided in a space between the rectifying plate and the lid. A coating apparatus, wherein a gas introduction nozzle is faced, and a scattering prevention ring having a similar size opening as a plate-shaped workpiece is formed on the inner periphery of the cup.
【請求項2】 前記スピンナーによって回転せしめられ
るカップはインナーカップであり、このインナーカップ
の外側に回転しないアウターカップが配置され、またこ
れらインナーカップ及びアウターカップの上面を閉塞す
るそれぞれの蓋体は上昇した位置で互いに凹凸係合する
ことを特徴とする請求項1に記載の塗布装置。
2. The cup rotated by the spinner is an inner cup, and an outer cup that does not rotate is disposed outside the inner cup, and respective lids that close the upper surfaces of the inner cup and the outer cup are raised. The coating device according to claim 1, wherein the coating device engages with the concave and convex portions at the set positions.
JP14091191A 1991-05-16 1991-05-16 Coating device Expired - Lifetime JP2937549B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091191A JP2937549B2 (en) 1991-05-16 1991-05-16 Coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091191A JP2937549B2 (en) 1991-05-16 1991-05-16 Coating device

Publications (2)

Publication Number Publication Date
JPH04341367A JPH04341367A (en) 1992-11-27
JP2937549B2 true JP2937549B2 (en) 1999-08-23

Family

ID=15279688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091191A Expired - Lifetime JP2937549B2 (en) 1991-05-16 1991-05-16 Coating device

Country Status (1)

Country Link
JP (1) JP2937549B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100496766C (en) * 2004-06-14 2009-06-10 东京応化工业株式会社 Rotary coating device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130430U (en) * 1991-05-17 1992-11-30 ヤマハ株式会社 Rotary coating device
JP3271063B2 (en) * 1994-08-08 2002-04-02 東京エレクトロン株式会社 Method and apparatus for forming coating film
JP3461068B2 (en) * 1995-10-30 2003-10-27 東京応化工業株式会社 Rotating cup type liquid supply device
WO2001099156A1 (en) * 2000-06-16 2001-12-27 Applied Materials, Inc. Configurable single substrate wet-dry integrated cluster cleaner
JP5546472B2 (en) * 2010-03-24 2014-07-09 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and recording medium storing program for executing liquid processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100496766C (en) * 2004-06-14 2009-06-10 东京応化工业株式会社 Rotary coating device

Also Published As

Publication number Publication date
JPH04341367A (en) 1992-11-27

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