JP2814184B2 - Coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for applying a coating liquid by rotating an object such as a semiconductor wafer.
In particular, the present invention relates to a coating apparatus capable of cleaning a container to which a coating liquid scattered by rotation adheres.

[0002]

2. Description of the Related Art Conventionally, as a coating apparatus for applying a coating liquid to an object to be coated such as a semiconductor wafer, a resist rotary coating apparatus as shown in FIG. 9 is known. This coating apparatus includes a spin chuck 20 which is a rotation holding means for holding a semiconductor wafer W horizontally and rotating at high speed, and a resist supply nozzle 62 for dropping a resist liquid as a coating liquid on the semiconductor wafer W.
And an outer cup 23 and an inner cup 2 which are containers provided so as to surround the semiconductor wafer W on the spin chuck 20.
And 4.

[0003] In the coating apparatus configured as described above,
The resist liquid dropped from the resist supply nozzle 62 onto the semiconductor wafer W is rotated by the rotation of the spin chuck 20.
The excess resist solution is uniformly applied on the semiconductor wafer W, and is scattered in the peripheral direction of the semiconductor wafer W to form the outer cup 23.
And adheres to the inner wall surface of the inner cup 24. This outside cup 2
3. If the resist liquid layer attached to the inner cup 24 is left as it is, the resist is gradually laminated and dried, peeled off from the cups 23 and 24 by impact or the like, and becomes a particle to contaminate the semiconductor wafer W. For this reason, conventionally, the cups 23 and 24 have been regularly removed to be cleaned and removed. Recently, however, various methods for automatically cleaning the inside of the cup have been proposed. There has been known a method in which a cleaning liquid is supplied and discharged from a large number of holes at the top of a cup, and is dropped along the inner peripheral surface of the cup (Japanese Patent Laid-Open No. 59-212226). In addition, for example, JP-A-58-184725,
JP-A-62-73629, JP-A-62-73630
No., JP-B-63-41630, Jihei 1-26565
There is a technique disclosed in Japanese Unexamined Patent Publication (Kokai) No. H10-26095.

However, in the case of the cleaning method in which the cleaning liquid is supplied to the cup itself and discharged onto the inner surface, the shape and structure of the cup tend to be complicated. Performance (uniformity of the coating film, airflow state in the cup, etc.) is often not sufficiently considered.

Therefore, a method has been proposed in which a cleaning jig 30 is attached to the spin chuck 20 for cleaning as shown in FIG. 10 (see Japanese Patent Application Laid-Open No. Hei 5-82435). The cleaning jig 30 is a disc-shaped body formed substantially in the same shape as the wafer W, and has a spin chuck 20
Cleaning liquid L from the cleaning liquid supply nozzle 40 disposed near
A storage portion 31 for receiving and storing the cleaning liquid L is formed, and a plurality of discharge holes 36 are formed on the outer peripheral side edge to discharge the cleaning liquid L toward the cups 23 and 24. By supplying the cleaning liquid L from the cleaning liquid supply nozzle 40 while the cleaning liquid L is being collected, the cleaning liquid L is accumulated on the peripheral portion of the jig by centrifugal force and is ejected from the discharge holes 36. According to the cleaning jig 30, a certain amount of the cleaning liquid L can be continuously sprayed at a high speed, and effective cleaning can be performed. Also,
The cleaning liquid L can be sprayed over a wide range of the outer cup 23 and the inner cup 24 by making the directions of the plurality of discharge holes 36 provided in the cleaning jig 30 different from each other.

[0006]

However, in the conventional cleaning in a cup using the cleaning jig 30, a sufficient amount of the cleaning liquid L applied to the inner surface 23a of the upper end portion of the outer cup 23 cannot be obtained. An annular portion 3 formed by folding back the upper end opening portion 36 of the cup 23 so as to border the opening portion 36.
7 (hereinafter referred to as a top ring) has a drawback that it cannot be cleaned up to the back side. This top ring 37
The upward airflow generated along the inner surface of the outer cup 23 during the coating process is prevented from flowing toward the upper surface of the outer cup 23, and the resist scattered on the inner surface of the cup is prevented from flying to the upper surface of the wafer W. For this reason, it is extremely important to wash and remove the resist in this portion in order to prevent generation of particles.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art. It is an object of the present invention to effectively spray a cleaning liquid onto the upper inner surface of a container provided to prevent the coating liquid from scattering. Another object of the present invention is to provide a coating apparatus having a function of cleaning even the back side of a top ring at the upper end of a container in a short time.

[0008]

In order to achieve the above object, a first processing apparatus of the present invention is provided with a rotation holding means for holding and rotating an object to be coated, and provided so as to surround the rotation holding means. And a container for preventing the application liquid supplied to the object to be scattered from being scattered. The rotation holding means rotates the rotation holding means in the same manner as the object to be coated when the container is washed. A cleaning jig attached to the holding means and supplied with a cleaning liquid for cleaning and removing the application liquid attached to the container; the cleaning jig includes a storage portion capable of storing the cleaning liquid; and the rotation holding means. A discharge hole for discharging the cleaning liquid in the storage portion toward the container by rotation of the storage portion, and a guide member for projecting outside the jig by a centrifugal force generated by the rotation of the rotation holding means and scattering the cleaning liquid from the discharge hole upward. And having To.

In the first processing apparatus, the guide member has a guide surface at its distal end for scattering the cleaning liquid upward, and its base end is rotatable on the lower surface of the cleaning jig. It is desirable to be supported slidably in the radial direction. In this case, it is desirable that the guide member be urged by the urging means and stored under the cleaning jig.

Next, a second processing apparatus according to the present invention is provided with a rotation holding means for holding and rotating the object to be coated, and provided so as to surround the rotation holding means, and the coating supplied to the object to be coated is provided. A cleaning device provided with a container for preventing the liquid from being scattered, and provided with a cleaning liquid for cleaning the coating liquid attached to the container, which is mounted on the rotation holding means in the same manner as the object to be coated; The cleaning jig is provided with a storage part capable of storing a cleaning liquid, a discharge hole for discharging the cleaning liquid in the storage part toward the container by rotation of the rotation holding means, and a jig by a temperature change. And a guide member made of a shape memory alloy or a bimetal which projects outwardly of the nozzle and scatters the cleaning liquid from the discharge hole upward.

In the present invention, the object to be coated includes a semiconductor wafer, a printed circuit board, an LCD substrate, and the like. Applied.

The cleaning jig is made of a material that is not affected by a cleaning liquid such as a solvent that dissolves the coating liquid, for example, resins such as delrin, Teflon (both trade names) or vinyl chloride, ceramics, glass, and chemical resistant materials. It is preferable to use a metal coated with a conductive material.

[0013]

In the first and second coating apparatuses of the present invention configured as described above, the cleaning jig mounted on the apparatus rotation holding means is rotated by a cleaning liquid supply nozzle or the like in advance or by the rotation holding means. A cleaning liquid is appropriately supplied therein. The cleaning liquid supplied to the cleaning jig is collected by the centrifugal force caused by the rotation of the rotation holding means in the storage portion on the peripheral edge side of the cleaning jig, and further the rotational force and the centrifugal force due to the rotation of the rotation holding means. Then, the liquid is discharged from the discharge hole at a high speed. At this time, by the centrifugal force in the case of the first coating device, by the temperature change before and after the cleaning jig is mounted in the container in the case of the second coating device, or by the temperature change accompanying the supply of the cleaning liquid, Each guide member protrudes outside of the cleaning jig, and scatters the cleaning liquid discharged from the discharge hole upward. Although the diameter of the cleaning jig is limited to the diameter of the opening of the container, the guide slope is projected outside the cleaning jig, and the cleaning liquid from the discharge hole is applied to this to change the scattering direction and move upward. By scattering the cleaning liquid, the cleaning liquid can be evenly sprayed to a place where cleaning has conventionally been difficult, such as the back side of the top ring around the opening of the container, and the cleaning can be efficiently performed.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is applied to a resist coating and developing apparatus.

As shown in FIG. 1, the resist coating and developing apparatus includes a processing mechanism unit 10 in which processing mechanisms for performing various processings on an object to be processed, for example, a semiconductor wafer (hereinafter, simply referred to as a wafer) W; The loading / unloading mechanism 1 for automatically loading / unloading the wafer W into / from the mechanism unit 10 constitutes a main part.

The loading / unloading mechanism 1 includes a wafer carrier 2 for storing the unprocessed wafer W, a wafer carrier 3 for storing the processed wafer W, an arm 4 for holding the wafer W by suction, and A moving mechanism 5 for moving in X, Y (horizontal), Z (vertical) and θ (rotation) directions;
Stage 6 on which wafers are aligned and wafers W are transferred to and from processing mechanism unit 10
And

The processing mechanism unit 10 is provided with a transport mechanism 12 movably along a transport path 11 formed in the X direction from the alignment stage 6. Transport mechanism 1
2 has a main arm 13 which is movable in the Y, Z and θ directions.
Is provided. On one side of the transfer path 11, an adhesion processing mechanism 14 for performing an adhesion process for improving the adhesion between the wafer W and the resist liquid film, and a solvent remaining in the resist applied to the wafer W are heated and evaporated. In order to perform a pre-baking process and a post-development post-baking process, a baking mechanism 15 provided in a multi-layered configuration and a cooling mechanism 16 for cooling the wafer W subjected to the heat processing are arranged. On the other side of the transfer path 11, a processing liquid coating mechanism 17 (coating device of the present invention) for coating a resist on the surface of the wafer W, and a developing device for developing the wafer W exposed by a stepper (not shown) or the like. A developing mechanism 18 is provided.

In the resist coating and developing apparatus configured as described above, first, the unprocessed wafer W is unloaded from the wafer carrier 2 by the arm 4 of the loading / unloading mechanism 1 and placed on the alignment stage 6. . Then
The wafer W on the alignment stage 6 is transferred to the transfer mechanism 12
Of each of the processing mechanisms 14 to 1
8. Then, the processed wafer W is returned to the alignment stage 6 by the main arm 13, and
Further, the wafer is transferred by the arm 4 and stored in the wafer carrier 3.

Next, a coating mechanism (or coating device) 17
Will be described. As shown in FIG. 2, the coating mechanism 17 has a spin chuck 20, which is a rotation holding unit that rotates while sucking and holding a wafer W (not shown in FIG. 2), and the spin chuck 20 is driven to rotate. Spin motor 21
Are connected, and the rotation of the spin chuck 20 can be controlled by the spin motor 21 at a desired number of rotations. Further, a bottom plate 2 is provided around the lower periphery of the spin chuck 20.
The outer cup 23 and the inner cup 24 formed in a cylindrical shape are provided concentrically on the bottom plate 22 so as to surround the wafer W mounted on the spin chuck 20. The upper portion of the outer cup 23 and the upper portion of the inner cup 24 are formed to be inclined downward in the radial direction of the spin chuck 20 so as to guide the scattered resist liquid to the bottom plate 22. The bottom plate 22 is gently inclined, and a drain pipe 25 for discharging a resist solution or the like is connected to the bottom of the bottom plate 22. A partition 26 for preventing the drainage from entering the center side is provided in the bottom plate 22 in a ring shape, and an exhaust pipe for exhausting the inside of the cup is provided in the bottom plate 22 inside the partition 26. 27 are connected.

In the resist coating process, the spin chuck 20 is used.
A wafer W is placed on the wafer W, and a resist solution is supplied, for example, dropped from a resist supply nozzle 62 (see FIG. 9) to the upper surface of the wafer W, and the spin chuck 20 is rotated to perform spin coating. By repeating this resist coating process many times,
The resist scattered toward the periphery of the wafer W is the outer cup 2
3 and adhere to the surface of the inner cup 24. Therefore, the application mechanism 17 of this embodiment includes an automated cleaning mechanism. The control program for the cleaning mechanism of the coating mechanism 17 is incorporated as a part of a control program stored in a control device (not shown) that controls the entire processing mechanism unit 10, and is driven at a predetermined location, for example, by driving the transport mechanism 12. A cleaning jig 5 that is kept on standby at a standby station (not shown) provided below or above the processing mechanisms 14, 15, 16 or above the alignment stage 6.
0 is conveyed and placed on the spin chuck 20 to wash and remove the resist solution attached to the cup wall surface.

As shown in FIGS. 2 and 3, the cleaning jig 50 is a disk-shaped body having substantially the same diameter as the wafer W, and is disposed near the spin chuck 20 on the lower surface side of the peripheral portion. An annular storage portion 51 for receiving and storing the cleaning liquid L from the cleaning liquid supply nozzle 40 is formed, and a pair of outer peripheral walls 50 a of the storage portion 51 are provided at positions symmetrical with respect to the rotation center of the cleaning jig 50. A cleaning liquid discharge hole 52 (for example, about 1 to 5 mm in diameter) is formed. In this case, the cleaning liquid discharge hole 52 is formed obliquely downward, for example, outward in the radial direction of the cleaning jig 50. A guide plate, which is located on the lower surface 50b of the peripheral portion of the cleaning jig 50 under the respective discharge holes 52, is a guide member for changing the direction of the cleaning liquid L from the discharge holes 52 upward and scattering. 53 are provided.

The guide plate 53 has its tip 53a bent upward at a predetermined angle, for example, 30 to 90 degrees.
The base end portion 53b is the lower surface 50b of the peripheral portion of the cleaning jig 50.
And is rotatably provided in a horizontal direction by a support pin 54. The upper surface of the leading end 53a of the guide plate 53 serves as a guide surface 57 for scattering the cleaning liquid L upward. As shown in FIG. 4, each guide plate 53 has its distal end 53a side and the lower surface of the cleaning jig 50 connected to each other by a spring 55 as an urging means. It is constantly urged toward the tool jig 50 side. Cleaning jig 50
A groove 56 that can receive the distal end portion 53a of the guide plate 53 is formed in the peripheral edge lower surface 50b of the cleaning jig 50 so that the guide plate 53 can be stored in close contact with the peripheral edge lower surface 50b of the cleaning jig 50. Has become. The groove 56 is
Also has a function as a stopper in the urging direction.

The cup cleaning is performed after the resist coating process has been performed a predetermined number of times, or at the beginning and end of a lot. At this time, the cleaning jig 50, which has been waiting at a waiting station (not shown) provided above or below the alignment stage 6 and the cooling mechanism 16, is held by the main arm 13 and placed on the spin chuck 20. Place. Then, the cleaning liquid L is jetted from the cleaning liquid supply nozzle 40 to supply the cleaning liquid L into the storage portion 51 of the cleaning jig 50. When the rotation of the cleaning jig 50 is stopped or the rotation of the spin chuck 20 is being performed at a low speed, the guide plate 53 is biased by the spring 55 so that the cleaning jig 50 is rotated as shown in FIGS. The cleaning liquid L in the storage part 51 is stored below (inside) the tool 50 and the discharge hole 5.
2 without flowing vigorously, the inner cup 24
Is cleaned. When the cleaning jig 50 is rotated at a medium speed, the cleaning liquid L collected on the outer peripheral portion of the storage portion 51 by centrifugal force comes to be vigorously jetted from the discharge hole 52, and is further rotated at a higher speed. Then, the centrifugal force acting on the guide plate 53 exceeds the urging force of the spring 55, and the guide plate 53 rotates as shown in FIGS. Protruding outward. Due to the protrusion of the guide plate 53, the cleaning liquid L vigorously jetted from the discharge hole 52 is reflected on the guide surface 57 of the guide plate 53 and scattered upward, and is scattered upward.
The cleaning liquid L is effectively sprayed to the back surface of the top ring 37 formed so as to border the peripheral portion of the upper opening 3a of the outer cup 23, especially the outer ring 3a. Upper inner surface 2 of outer cup 23
The cleaning liquid L used for cleaning 3a flows down along the inner surface 23b thereunder, and the entire inner surface of the outer cup 23 is cleaned.

As described above, the guide plate 53 is projected outside the cleaning jig 50, and the cleaning liquid L discharged from the discharge holes 52 is scattered upward, for example, in the vertical direction.
The cleaning liquid L can be evenly sprayed on a place where cleaning has conventionally been difficult, such as the back side of the top ring 37, so that cleaning can be performed efficiently. Thereby, generation of particles can be prevented, and the cups 23 and 24 can be formed during the resist coating process.
The air current generated in the intervening space can always be kept in a stable state, and the yield is improved.

In the above embodiment, two sets of the discharge holes 52 and the guide plates 53 are provided, but only one set may be provided. This is because the discharge from the cleaning jig 50 is rotationally scanned by the spin chuck 20. If the number of the discharge holes 52 is reduced, the discharge flow rate of the cleaning liquid L from one discharge hole 52 can be increased. Conversely, the discharge hole 52 and the guide plate 53
Can be added to three or more places.

In the above embodiment, the discharge hole 52 is formed obliquely downward so that the cleaning liquid L comes into contact with the guide surface 57 of the guide plate 53. However, this may be horizontal. However, in this case, it is necessary to change the angle of the guide surface 57 of the guide plate 53 so that the cleaning liquid L can be scattered in a desired direction.

Further, in the above embodiment, the guide plate 53 is configured to rotate horizontally and to protrude and retract from the outside of the cleaning jig 50. However, the mounting state of the guide plate 53 and its protruding and retracting mechanism are not limited to this. Not something.

For example, as shown in FIG. 5, the base end of the guide plate 53 is attached to the peripheral edge of the lower surface of the cleaning jig 50 as a hinge 58 so as to be rotatable (or swingable) up and down in the radial direction. By rotating the cleaning jig 50 from the stopped state shown in FIG. 7A at a medium / high speed, the guide plate 53 is rotated to a horizontal state by centrifugal force as shown in FIG. You may. In this case, if the number of rotations of the cleaning jig 50 is reduced, the guide plate 53 returns to its original position by its own weight, so that no urging means is required.

Further, as shown in FIG.
A guide member 59 is provided on the peripheral edge of the lower surface of the cleaning jig 50 to support the guide plate 53 so as to be slidable in the radial direction of the cleaning jig 50. By rotating the guide plate 53, as shown in FIG.
May move outward by centrifugal force. In this case, urging means for pulling the guide plate 53 inward is required.

Although slightly different, as shown in FIG. 7, a discharge tube 60 having sufficient flexibility such as a rubber tube is connected to the discharge hole 52, and a nozzle 61 is provided at the tip of the discharge tube 60.
By rotating the cleaning jig 50 at a medium / high speed from the stop state shown in FIG.
As described above, the discharge pipe 60 may extend horizontally by centrifugal force, and the cleaning liquid L may be discharged upward from the nozzle 61 at the tip.

In each of the above embodiments, the guide member is operated by centrifugal force generated by the rotation of the cleaning jig 50. However, as another operation mechanism of the guide member in the present invention, a guide member is provided. Using a shape memory alloy or a bimetal as a material for the cleaning, the cleaning jig 50 is
In some cases, the guide member is made to protrude outside the cleaning jig by using a temperature change between before and after the inside of the cleaning jig. FIG. 8 shows an example in which such an operation mechanism is adopted.
A guide plate 63 made of a shape memory alloy (or bimetal) is fixed to the lower peripheral edge 50b of the base plate 50 with its base end fixed. The guide plate 63 is used for the cups 32, 2 at the time of washing.
At the temperature within 4, the shape similar to that of the guide plate 53 of FIGS. 4 to 6 (that is, the portion from the base end portion 63b to the distal bent portion 63a is linear) is stored, and the cleaning jig is stored. At the adjustment temperature of the alignment stage 6 and the cooling mechanism 16 where the 50 is on standby, for example, at a temperature lower than room temperature, the shape from the vicinity of the base end portion 63b to the front end side is bent downward by approximately 90 °.

Therefore, when the cleaning jig 50 is held on the main arm 13 and placed on the spin chuck 20, the temperature rises to about room temperature, and the shape of the guide plate 63 becomes
The shape at the time of standby shown in FIG. 11A automatically changes to the shape at the time of cleaning shown in FIG. In the case where the guide plate 53 protrudes outside the cleaning jig 50 due to the temperature change as described above, the cleaning jig 50 can be moved at a very high speed as long as the discharge force of the cleaning liquid L from the discharge hole 52 can be sufficiently obtained. The cleaning can be performed by scattering the cleaning liquid L upward without rotating. The shape of the guide plate 63 at the time of standby is not limited to this example, and may be, for example, a shape bent further inward from the bent state of FIG. 8A or a shape bent so as to twist in the horizontal direction. You may.

In the above embodiment, the guide plates 53, 63
The means using centrifugal force and temperature change has been described as a means for projecting the outside of the cleaning jig 50, but other means such as a flow path of a pressurized gas or a vacuum suction flow path in the spin chuck 20 are described. It may be formed so that the guide plate can be protruded and stored.

In the above embodiment, the case where the coating apparatus is applied to a resist coating and developing apparatus has been described. However, it is needless to say that the present invention can be applied to an apparatus for performing, for example, an etching liquid coating processing or a magnetic liquid coating cleaning processing.

[0035]

As described above, according to the processing apparatus of the present invention, the following excellent effects can be exhibited. 1) According to the first coating apparatus of the present invention, the guide member is made to protrude to the outside of the cleaning jig by centrifugal force, and the cleaning liquid from the discharge hole is applied to the guide member and scattered upward, thereby opening the container. The cleaning liquid can be evenly sprayed on a portion where cleaning has been difficult in the past, such as on the back side of the top ring at the periphery of the portion, so that cleaning can be performed efficiently. 2) According to the second processing apparatus of the present invention, the guide member protrudes to the outside of the cleaning jig due to the temperature change, so that the cleaning liquid can be sufficiently discharged from the discharge holes as long as the cleaning liquid can be sufficiently discharged. Even if the tool is not rotated at a high speed, cleaning can be performed efficiently as in the above item 1).

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an embodiment in which a coating apparatus of the present invention is applied to a resist liquid coating and developing apparatus.

FIG. 2 is a side sectional view schematically showing a coating apparatus of the present invention.

FIG. 3 is a side sectional view showing a part of FIG. 2 in an enlarged manner.

FIGS. 4A and 4B are partial perspective views of the cleaning jig according to the present invention as viewed from the back surface side, where FIG. 4A is a state in which the cleaning jig is stopped or rotating at a low speed, and FIG. This shows a state where the motor is rotating at a high speed.

FIGS. 5A and 5B are perspective cross-sectional views showing another embodiment of a main part of the cleaning jig according to the present invention, wherein FIG. 5A shows a state where the cleaning jig is stopped or rotating at a low speed, and FIG. It shows a state where the motor is rotating at high speed or high speed.

FIGS. 6A and 6B are perspective sectional views showing another embodiment of the main part of the cleaning jig according to the present invention, wherein FIG. 6A is a state in which the cleaning jig is stopped or rotating at a low speed, and FIG. It shows a state where the motor is rotating at high speed or high speed.

FIGS. 7A and 7B are perspective sectional views showing a modified example of a main part of the cleaning jig according to the present invention, wherein FIG. 7A is a state in which the cleaning jig is stopped or rotating at a low speed, and FIG. It shows a state where the motor is rotating at high speed or high speed.

FIG. 8 is a perspective sectional view showing another embodiment of a main part of the cleaning jig according to the present invention, in which (a) is a state where the cleaning jig is stopped or rotating at a low speed, and (b) is a middle state. It shows a state where the motor is rotating at high speed or high speed.

FIG. 9 is a side sectional view schematically showing a conventional coating apparatus.

FIG. 10 is a side sectional view showing a state where a cleaning jig is mounted on a conventional coating apparatus.

[Explanation of symbols]

 Reference Signs List 20 rotation holding means (spin chuck) 23 container (outer cup) 24 container (inner cup) 37 top ring 40 cleaning liquid supply nozzle 50 cleaning jig 51 storage unit 52 discharge hole 53 guide member 55 urging means (spring) 57 guide Surface 63 Guide member (shape memory alloy or bimetal) L Cleaning liquid W Semiconductor wafer (object to be coated)

Continuing on the front page (72) Inventor Masatoshi Deguchi 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. Kyushu Corporation Kumamoto Office (56) References JP-A-5-82435 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/027 B05C 11/08

Claims (5)

(57) [Claims] 1. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing scattering of a coating liquid supplied to the object to be coated. In the coating apparatus having, when the container is washed, it is attached to the rotation holding means,
A cleaning jig to which a cleaning liquid for cleaning and removing the coating liquid adhered to the container is supplied; the cleaning jig includes a storage section capable of storing the cleaning liquid, and the storage section by rotation of the rotation holding means; A discharge hole for discharging the cleaning liquid toward the container, and a guide member that protrudes to the outside of the jig by centrifugal force generated by the rotation of the rotation holding means and scatters the cleaning liquid from the discharge hole upward. Coating device. 2. The cleaning device according to claim 1, wherein the guide member has a guide surface at its distal end for scattering the cleaning liquid upward, and a base end of the guide member is rotatably supported by a lower surface of the cleaning jig. 2. The coating device according to 1. 3. The guide member has a guide surface at its distal end for scattering the cleaning liquid upward, and a base end thereof is supported on the lower surface of the cleaning jig so as to be slidable in the radial direction. The coating device according to claim 1. 4. The coating apparatus according to claim 2, wherein said guide member is urged by urging means and stored under a cleaning jig. 5. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing the application liquid supplied to the object to be scattered. In the coating apparatus having, when the container is washed, it is attached to the rotation holding means,
A cleaning jig to which a cleaning liquid for cleaning and removing the coating liquid adhered to the container is supplied; the cleaning jig includes a storage section capable of storing the cleaning liquid, and the storage section by rotation of the rotation holding means; And a guide member made of a shape memory alloy or a bimetal that projects outside the jig due to a temperature change and scatters the cleaning liquid upward from the discharge hole. Coating device.