JP3322630B2 - Rotary processing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotation processing apparatus for rotating a substrate such as a semiconductor wafer and performing processing on the front and back surfaces of the substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process,
For example, it is extremely important to keep the front and back surfaces of a substrate of a semiconductor wafer (hereinafter, referred to as “wafer”) clean. Therefore, a cleaning system is used to remove contamination such as particles, organic contaminants, and metal impurities attached to the front and back surfaces of the wafer. 2. Description of the Related Art One of well-known cleaning processing systems for cleaning wafers is provided with a single-wafer-type rotary processing apparatus for performing various processing by rotating a wafer.

In this rotary processing apparatus, when a rotary table or the like on which a wafer is mounted is rotated by a rotation mechanism such as a motor, a holding mechanism for holding the wafer is provided so that the wafer does not fly out due to centrifugal force. . As the holding mechanism, a vacuum chuck and a mechanical chuck are conventionally known. The vacuum chuck is
This is a mechanism in which the back surface of the wafer is suction-held on the upper surface of a rotary table such as a spin chuck by vacuum suction.

A mechanical chuck is a mechanism for holding a wafer by holding a peripheral portion of the wafer by using members such as claws and rings. As the holding force of the mechanical chuck, there is a method that uses a centrifugal force generated by rotation of a rotary table. This holding force is released as the centrifugal force disappears due to the stop of the rotation of the rotary table. The holding force of the mechanical chuck is provided with biasing means such as a spring on the mechanical chuck itself.
Some use the mechanical force of this biasing means. This holding force is released by driving a release means provided on the rotary table. The release means presses the pusher against the urging means by operating, for example, an air cylinder to swing the mechanical chuck, thereby moving the mechanical chuck away from the peripheral portion of the wafer.

[0005]

However, the vacuum chuck is used for cleaning and drying the back surface of the wafer and for cleaning and drying the front and back surfaces of the wafer at the same time in order to hold the back surface of the wafer by suction. Cannot be used when processing

[0006] Further, in mechanical chucks that use a centrifugal force to secure a holding force, a sufficient holding force cannot be exhibited unless the rotation speed exceeds a predetermined rotation speed. As a result, in the rise immediately after the start of the processing, the acceleration of the turntable is limited until a predetermined rotation speed is reached, and it takes time. Also, if the rotation speed of the rotary table is suddenly decreased to a predetermined rotation speed or less, the mechanical chuck similarly cannot exhibit a sufficient holding force. As a result, at the fall immediately before the end of the process, the deceleration of the turntable is limited, and it takes time.

On the other hand, in a mechanical chuck that uses the mechanical force of the urging means, the release means provided on the rotary table is exposed to a large amount of processing liquid during processing. When the release means is wetted by the processing liquid, the drive system of the release means is corroded, and an operation failure of the release means is caused.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and has as its object to process the front and back surfaces of a substrate, accelerate and decelerate a rotary table quickly, and operate an unlocking means. Provide a rotation processing device that does not have to worry about defects.

[0009]

In order to achieve the object of the present invention, according to the first aspect of the present invention, a holding mechanism is arranged at least at three or more positions on a rotatable table rotatably provided in a container. In a rotary processing apparatus configured to hold a substrate by a holding mechanism and rotate the substrate along with the rotation of the rotary table, the holding mechanism is pivotally supported by the rotary table, and the holding mechanism contacts the peripheral edge of the substrate. An urging means for urging the rotation of the holding mechanism so that the holding part is in contact with the peripheral edge of the substrate is provided, and the holding mechanism is turned in reverse to the urging of the urging means. Forming a pressing portion, which is pressed to rotate in the direction of the direction, in the holding mechanism,
Release means for releasing the contact of the holding portion is provided on the container, and the release means is formed or fixed on the inner peripheral surface of the container.
The pressing portion is pressed by the releasing means by rotating the container and the rotary table relatively to bring the pressing portion into contact with the releasing means. It is characterized in that it is configured to be separated from the periphery.

According to the rotation processing device of the first aspect,
First, since the processing is performed while holding the peripheral portion of the substrate, the front and back surfaces of the substrate can be processed. Further, from the start to the end of the processing, the holding portion of the holding mechanism is brought into contact with the peripheral edge of the substrate by the urging of the urging means, and the holding mechanism firmly holds the peripheral edge of the substrate. At the rise immediately after the start of the process, the substrate is accelerated and rotated integrally with the rotary table by the holding of the holding mechanism, and at the fall immediately before the end of the process, the substrate is similarly integrated with the rotary table by the holding of the holding mechanism. To decelerate the substrate and stop the rotation. Therefore, the rise time and fall time of the processing can be reduced as compared with the conventional case. On the other hand, when loading the substrate into the container and unloading the substrate from the container, the pressing portion is pressed by the release means, and the holding portion is rotated to a position where the holding portion does not contact the peripheral edge of the substrate. Carry in and out smoothly.
In this case, since the release mechanism is not driven to hold and release the holding mechanism, it is not necessary to attach a drive system component to the release means. Therefore, even if some processing liquid scatters to the releasing means during the processing, it is not necessary to consider the influence. It should be noted that rotating the container and the turntable relatively means that either the container or the turntable may be turned. The release means is an inner peripheral surface of the container.
The projection is formed or fixed on the projection. With such a configuration
In this case, the protrusion does not have a drive system component such as a motor.
Therefore, there is no fear of malfunction due to scattering of the processing liquid.

In the substrate holding mechanism according to the first aspect, as described in the second aspect, the first height for rotating the container and the rotary table relatively to transfer the substrate to and from the rotary table. And a second height for processing a substrate held on the turntable that is lower than a first height. The turntable and the container can be moved up and down relatively. preferable.

According to this configuration, when the substrate is carried into the container, the rotary table is first moved up with respect to the container, and the rotary table is moved to the first height. Then, the container and the rotary table are relatively rotated, and the holding unit is moved to a position where the holding unit is not brought into contact with the peripheral edge of the substrate when the substrate is loaded. Then, the substrate is carried into the container, the container and the turntable are relatively rotated in the opposite direction to the first direction, and the holding portion is brought into contact with the peripheral edge of the substrate. Thus, the substrate is held above the turntable. Then, the rotating table is moved down with respect to the container, and after the rotating table is moved to the second height, the substrate is processed. After processing,
The turntable is moved up with respect to the container and the turntable is again moved to the first height. When unloading the substrate from the container, the container and the rotary table are relatively rotated, the holding unit is separated from the peripheral edge of the substrate, and the substrate is received and unloaded from the rotary table in the container.

[0013] As described in claim 3, the holding mechanism comprises:
It is preferable to arrange the rotary table at three positions around the rotary table at equal distances from the center of the rotary table and at an interval of a central angle of 120 °. According to such a configuration, the substrate can be stably held even during rotation of the turntable.

It is preferable that the holding portion and the pressing portion are disposed on opposite sides of the support shaft of the holding mechanism as described above. According to this configuration, when the pressing portion is pressed, the holding portion rotates in a direction opposite to the biasing direction of the biasing means.
The holding portion rotates in the direction of the urging of the urging means.

[0015] Preferably, the biasing means is a torsion coil spring mounted on a support shaft of the holding mechanism. According to this configuration, the holding mechanism can hold the peripheral portion of the substrate by the moment of the torsion coil spring.

[0016]

As set forth in claim 6, it is preferable that the rotary table be provided with support pins for supporting the back surface of the substrate when the holding portion is separated from the peripheral portion of the substrate. According to such a configuration, even if the holding portion is separated from the peripheral portion of the substrate,
The support pins support the back surface of the substrate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described with reference to a preferred embodiment of the present invention. A description will be given based on the rotation processing device configured as described above. FIG. 1 is a perspective view of a cleaning system 1 in which the rotary processing devices 6 to 11 according to the present embodiment are incorporated.

In the cleaning system 1, a mounting section 2 on which a carrier C for accommodating a wafer W is mounted, and one wafer W before a processing step is taken out of the carrier C mounted on the mounting section 2. At the same time, the transfer arm 3 for storing the processed wafers W one by one in the carrier C, and the respective rotary processing devices 6 for performing a predetermined cleaning process and drying process on the wafer W
And a cleaning processing unit 4 provided with the cleaning processing unit 11.

The mounting section 2 is configured to mount a plurality of carriers C each containing 25 wafers. The transfer arm 3 is configured to be movable in the horizontal and vertical directions (X, Y, Z) and to be able to rotate (θ direction) about a vertical axis. The cleaning processing unit 4 includes a rotation processing device 6,
7 and 8 are arranged side by side so that the processing can be performed according to a predetermined procedure.
0 and 11 are arranged side by side similarly to the rotation processing devices 6 to 8. Rotation processing devices 6 to 8 and rotation processing devices 9 to
11 is configured so that processing can proceed simultaneously.

The above arrangement and the combination of these rotary processing apparatuses can be arbitrarily combined depending on the type of cleaning processing for the wafer W. For example, one rotation processing device may be reduced, or conversely, another rotation processing device may be added.

Next, the configuration of each of the rotation processing devices 6 to 11 will be described. Since each of the rotation processing devices 6 to 11 has the same configuration, the rotation processing device 6 will be described with reference to FIGS.

FIG. 2 is a schematic sectional view showing a main part of the rotation processing device 6, and FIG. 3 is a plan view thereof. As shown in the figure, the rotation processing device 6 includes a substantially cylindrical container 20 having an open upper surface. The wafer W carried into the rotation processing device 6 by the above-described transfer arm 3 is stored in the container 20 through the opening on the upper surface of the container 20.

A rotary table 21 is provided in the container 20 so as to be rotatable and vertically movable. This rotary table 2
A lifting / lowering rotation mechanism 23 is connected below the lifting / lowering rotation shaft 22 that supports the lower surface of the first rotation shaft 1. Therefore, the rotating table 21 can be rotated and moved up and down by operating the elevating and rotating mechanism 23. The rotary table 21 ′ shown by a two-dot chain line in FIG. 2 moves upward by the operation of the elevating and lowering rotary mechanism 23, and moves to a first height a above which the wafer W is transferred above the container 20. Is shown. In this case, as will be described later, the pressing portion 42 of the holding mechanism 30 provided on the rotary table 21 and the protrusion 45 provided on the container 20 have substantially the same height. On the other hand, the turntable 21 shown by a solid line in FIG. 2 is moved down by the operation of the elevating and rotating mechanism 23 to store the wafer W in the container 20 and reach the second height B where the wafer W is cleaned. This shows a state in which it has descended.

The rotary table 21 and the lifting rotary shaft 2
The pure water supply path 24 penetrating the center of the rotary table 2
1 is connected to a supply nozzle 25 provided at the center of the upper surface.
The supply nozzle 25 is configured to be able to supply pure water upward to the back surface of the wafer W stored in the container 20.

On the upper surface of the rotary table 21, the transfer arm 3
The above-mentioned holding mechanism 30 capable of holding the wafer W carried into the container 20 by being floated above the turntable 21 is disposed at three places. The three arrangements of the holding mechanism 30 are arranged at an equal distance in the radial direction from the center of the turntable 21 and at a center angle 120 when viewed from the plane.
゜ The interval is set.

The holding mechanism 30 is pivotally supported on the upper surface of the turntable 21. That is, as shown in FIG. 4, the support shaft 33 is passed through the mounting recess 31 formed inside the holding mechanism 30 and the through hole 32 formed at the bottom thereof, and the lower portion of the support shaft 33 is provided on the upper surface of the turntable 21. The holding mechanism 30 is rotatably mounted on the upper surface of the rotary table 21. This support shaft 3
A torsion coil spring 35 is mounted around the periphery 3, and the holding mechanism 30 can hold the peripheral edge of the wafer W by the bias of the torsion coil spring 35.

Here, a specific structure for holding and releasing the holding mechanism 30 will be described.
A holding portion 40 for holding the wafer W by abutting on the peripheral portion of the wafer W is formed on the upper portion. A gap 41 is formed in the holding section 40, and the wafer W
The front surface and the back surface of the peripheral edge portion are in contact with each other.
As shown in FIG. 5, in a normal state, the holding mechanism 30 itself rotates by the moment M of the torsion coil spring 35,
Along with this, the holding unit 40 is oriented toward the center of the turntable 21, and the holding unit 40 is brought into contact with the peripheral edge of the wafer W.

At the lower part of the holding mechanism 30, there is provided a pressing portion 42 arranged on the opposite side of the holding portion 40 with the support shaft 33 therebetween. The pressing portion 42 is configured to release the holding of the holding portion 40 by being pressed in a direction opposite to the moment M of the torsion coil spring 35. The pressing portion 42 is pressed by a protrusion 45 fixed to the upper portion of the inner peripheral surface of the container 20, as shown in FIGS. A total of three projections 45 are provided so as to correspond to the holding mechanism 30 and have a central angle of 120 ° when viewed from a plane. The projection 45 has no drive system components such as a motor attached thereto. Thus, even if some processing liquid is applied to the projection 45, there is no problem in pressing the pressing portion 42.

FIGS. 5 and 6 show that the rotary table 21 is raised at the first height a so that the pressing portion 42 and the protrusion 45 are raised.
It is a top view in the state where it became substantially the same height. The holding mechanism 30 shown in FIG. 5 shows a state where the peripheral edge of the wafer W is held by the moment M of the torsion coil spring 35. When the rotary table 21 is rotated counterclockwise from this state, the pressing portion 42 and the protrusion 45 come into contact with each other, and the pressing portion 42 is moved in the direction opposite to the moment M of the torsion coil spring 35. 45 presses. Then, as shown in FIG. 6, the holding unit 40 is separated from the peripheral portion of the wafer W, and the holding mechanism 3 in FIG.
0 indicates that the peripheral portion of the wafer W is not held.
If the rotary table 21 is rotated clockwise and returned to the original position, the pressing portion 42 and the projection 45 are separated from each other, and the holding portion 40 is moved to the peripheral edge of the wafer W by the moment M of the torsion coil spring 35. Part. Then, the holding portion 40 is brought into contact with the peripheral portion of the wafer W, and FIG.
As shown in (1), the holding mechanism 30 can hold the wafer W again.

As shown in FIG. 3 and FIG. 7, a total of six support pins 50 which are arranged at appropriate intervals on both sides of each holding mechanism 30 are vertically mounted on the upper surface of the turntable 21. Have been. The upper surface of the support pin 50 forms an inclined surface 51. Then, the support pins 50 support the wafer W above the turntable 21 due to the slight contact between the inclined surface 51 and the corner 52 on the back surface of the wafer W. By forming the upper surface of the support pin 50 with the inclined surface 51, the wafer W can be supported with a small contact area. Further, even when the holding unit 40 is rotated as shown in FIG.
Since the wafer W is supported by the support pins 50, the wafer W can be carried into and out of the container 20 by the transfer arm 3 described above.

In addition, a supply nozzle 55 is provided above the container 20 for supplying a processing liquid mainly composed of pure water or a chemical component to the surface of the wafer W stored in the container. The supply nozzle 55 is configured to be movable above the container 20. Further, the processing liquid shaken off from the rear surface of the wafer W by the rotation of the wafer W is drained through a drain pipe 56 provided at the bottom of the container 20, and the atmosphere in the container 20 is changed from the bottom of the container 20 to the outside. The air is evacuated by an evacuation means (not shown) such as a vacuum pump installed in the apparatus.

Each of the rotation processing devices 7 to 11 has the same configuration as the rotation processing device 6.
Also in 11, the wafer W is configured to be cleaned and dried with various processing liquids.

Next, the operation performed by the rotation processing device 6 according to the present embodiment configured as described above will be described. First, in a series of processing steps in the above-described cleaning processing system 1, a transfer robot (not shown) transports a carrier C containing, for example, 25 wafers W that have not been cleaned yet to the cleaning processing system 1 and places it on the mounting unit 2. Place. Then, the wafer W is taken out from the carrier C mounted on the mounting section 2 and is transferred by the transfer arm 3.
Are sequentially conveyed to the rotary processing devices 6, 7, 8 to perform predetermined processing steps.

Here, the processing steps in the rotary processing device 6 will be described. The wafer W is loaded into the rotary processing device 6 by the operation of the transfer arm 3. In this case, as shown in FIG. 2, the turntable 21 has previously been raised to the first height a. Then, the rotary table 21 is rotated counterclockwise to bring the pressing portion 42 into contact with the projection 45. Then, as shown in FIG. 6, the pressing unit 42 is pressed by the protrusion 45 to rotate the holding mechanism 30, and the holding unit 40 is turned to a position where the holding unit 40 does not contact the peripheral edge of the wafer W.
Thus, the wafer W can be transferred above the turntable 21. Then, the wafer W is placed in the container 20.
Is loaded, the wafer W is supported by the support pins 50 and the wafer W is lifted above the turntable 21. The supply nozzle 55 is retracted so as not to hinder the loading of the wafer W.

When the transfer arm 3 is withdrawn from the rotation processing device 6 and the transfer of the wafer W into the container 20 is completed, the rotary table 21 is rotated clockwise, and the pressing portion 42 and the protrusion 4 are rotated.
5, the holding mechanism 30 is rotated by the moment M of the torsion coil spring 35, and the holding portion 40 is brought into contact with the peripheral portion of the wafer W. Thus, as shown in FIG.
When the wafer W is held by the holding mechanism 30 above the turntable 21, the turntable 21 moves down to the second height B and stores the wafer W in the container 20.

Then, the rotating operation of the rotary table 21 is started, and the rotary table 21 is moved from, for example, 300 rpm to 40 rpm.
Rotate to 0 rpm. In this case, since the wafer W is firmly held in advance by the holding mechanism 30,
The rotation speed of the turntable 21 accelerates quickly and reaches a predetermined rotation speed in a shorter time than before. Thereafter, even during rotation, the wafer W can be stably held by the holding mechanisms 30 evenly arranged at three locations around the turntable 21.

During this rotation, the supply nozzle 55 moved above the container 20 supplies the processing liquid to the surface of the wafer W. On the other hand, the rotating table 2
The processing liquid is supplied upward from a supply nozzle 25 arranged at the center of the first processing liquid. In this way, the processing liquid is supplied to the front and back surfaces while rotating the wafer W, and the processing liquid is spread over the entire front and back surfaces of the wafer W by centrifugal force for cleaning.
After the completion of the cleaning process, the operating rotation speed of the elevating / lowering rotating mechanism 23 is increased to increase the centrifugal force, and the processing liquid attached to the wafer W is shaken off by the centrifugal force to dry the wafer W.

When the cleaning process is completed, the lifting / lowering rotating mechanism 23
Stops, and the rotation of the turntable 21 also stops.
Also in this case, since the wafer W is still held firmly by the holding mechanism 30, the rotation speed of the turntable 21 is rapidly reduced to stop in a shorter time than before.

Thereafter, the rotary table 21 is again raised to the first height A, and the holding unit 40 is separated from the peripheral portion of the wafer W by going through a procedure reverse to the above-described step of loading the wafer W. , And the wafer W are supported by the support pins 50.
Then, the wafer W is unloaded from the inside of the rotation processing device 6 by the transfer arm 3 and is subsequently transferred to the rotation processing devices 7 and 8. Wafer W for which processing steps in cleaning processing section 4 have been completed
Are again stored in the carrier C, and subsequently, the same processing is performed on the remaining 24 wafers W one by one. Thus, when the processing of 25 wafers W is completed,
The carrier C is carried out of the cleaning system 1 in units.

As described above, the loading and unloading of the wafer W into and out of the container 20 is performed by causing the pressing portion 42 to press the projection 45 by operating the elevating and rotating mechanism 23.
No drive mechanism is required for 5 itself. Therefore, during the cleaning process,
Although some processing liquid may scatter to the projections 45, it is not necessary to consider the influence of corrosion or the like by the processing liquid.

Thus, according to the holding mechanism 30 in the rotation processing device 6, since the peripheral portion of the wafer W can be held first, the front and back surfaces of the wafer W can be simultaneously cleaned and dried. Also, during the period from the start to the end of the process, the holding mechanism 30
As a result, the wafer W is firmly held, so that the rotation table 21 can be quickly accelerated and decelerated. Therefore, the rise time and fall time of the processing can be reduced as compared with the conventional case. In addition, since the projection 45 does not include a driving system component such as a motor, there is no fear of malfunction due to scattering of the processing liquid.

Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example but can take various forms. For example, in the present embodiment, the rotary table 21 is rotated, the pressing portion 42 is brought into contact with the projection 45, and the pressing portion 42 is pressed by the projection 45, but conversely, the container 20 is rotated, The protrusion 4 is formed on the pressing portion 42.
5 may be brought into contact with each other and the pressing portion 42 may be pressed by the protrusion 45. Further, the present invention is applicable not only to a rotary processing apparatus that performs a cleaning process mainly using a processing liquid, but also to a rotary processing apparatus that performs scrub cleaning by bringing a processing body such as a brush or a sponge into contact with the surface of a wafer W. Alternatively, the present invention may be applied to a coating and developing apparatus that performs a lithography process on the surface of the wafer W.

The substrate is not limited to a semiconductor substrate as in the above-described embodiment, but may be an LCD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.

[0045]

According to the present invention, since the peripheral portion of the substrate can be held first, the front and back surfaces of the substrate can be simultaneously cleaned and dried. Further, since the substrate is firmly held by the holding mechanism from the start to the end of the processing, the rotation table can be quickly accelerated and decelerated. Therefore, the rise time and fall time of the processing can be reduced as compared with the conventional case. As a result, for example, the throughput in the manufacture of a semiconductor device can be improved. In addition, there is no need to worry about malfunction of the release means.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cleaning processing system including a rotation processing apparatus according to an embodiment.

FIG. 2 is a sectional view of a main part of the rotation processing device according to the embodiment;

FIG. 3 is a plan view of a main part of the rotation processing device according to the embodiment;

FIG. 4 is an explanatory diagram showing an internal structure of a holding mechanism in the rotation processing device according to the exemplary embodiment;

FIG. 5 is a plan view illustrating a state where the holding mechanism in the rotary processing apparatus according to the present embodiment holds the peripheral portion of the wafer at the first height.

FIG. 6 is a plan view illustrating a state in which the holding mechanism in the rotary processing apparatus according to the present embodiment does not hold the peripheral portion of the wafer at the first height.

FIG. 7 is a side view of a support pin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning processing system 6 Rotation processing apparatus 20 Container 21 Rotary table 30 Holding mechanism 33 Support shaft 40 Holding part 35 Torsion coil spring 42 Pressing part 45 Projection part 50 Support pin W Wafer

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Satoshi Nakajima 1375-1, Nishishinmachi, Tosu City, Saga Prefecture Tokyo Electron Kyushu Co., Ltd. Saga Office (56) References JP-A-9-321012 (JP, A) JP Hei 8-150380 (JP, A) JP-A Hei 10-335287 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/304

Claims (6)

(57) [Claims] 1. A rotary table rotatably provided in a container.
At least three places on the cable
The substrate is held by the holding mechanism, and the substrate is
Rotation processing device configured to rotate with the rotation of
In the above, the holding mechanism may be pivotally supported on a rotary table, and the holding mechanism may be provided with a holding portion that abuts on a peripheral portion of the substrate.
And holding the holding portion so as to abut the peripheral portion of the substrate.
An urging means for urging the rotation of the mechanism is provided, and the holding mechanism is turned in a direction opposite to the urging of the urging means.
Forming a pressing part that is pressed to move the holding mechanism
And releasing means for releasing the contact of the holding portion with the container is provided.
Ke,The release means is formed or fixed on the inner peripheral surface of the container.
Projections,  The container and the turntable are relatively rotated to rotate the container.
The contact between the pressing portion and the releasing means allows the pressing to be performed.
The pressure part is pressed by the release means, and the holding part is
Characterized by being spaced from the periphery of the
Transfer processing equipment. 2. The method according to claim 1, wherein the container and the rotary table are relatively rotated to transfer a substrate to and from the rotary table.
So that the rotary table and the container can be moved up and down relatively to move the substrate held on the rotary table to a second height lower than the first height for processing the substrate. The rotation processing device according to claim 1, wherein 3. The rotary mechanism according to claim 1, wherein the holding mechanism is disposed at three positions on the upper surface of the rotary table at an equal distance from the center of the rotary table and at an interval of a central angle of 120 °. 3. The substrate holding mechanism of the rotary processing apparatus according to 2. 4. The rotating device according to claim 1, wherein the holding portion and the pressing portion are arranged on opposite sides of a support shaft of the holding mechanism. Processing equipment. 5. The device according to claim 1, wherein the biasing means is a torsion coil spring mounted on a support shaft of the holding mechanism.
The rotation processing device according to claim 1, 2, 3, or 4. 6. A rotary table is provided on the rotary table from a peripheral portion of the substrate.
When the holding part is released, a support pin for supporting the substrate is set.
Claims 1, 2, 3, 4 or 5 characterized by the fact that
The rotation processing device as described in the above.