JP2893149B2 - Coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for applying a coating solution by rotating an object to be coated such as a semiconductor wafer, and more particularly to a container to which a coating solution scattered by rotation adheres. The present invention relates to a coating device.

[0002]

2. Description of the Related Art Conventionally, as a coating apparatus for applying a coating liquid by rotating an object to be coated such as a semiconductor wafer, a resist rotary coating apparatus as shown in FIG. 9 has been tried. This coating apparatus includes a spin chuck 61 which is a rotation holding means for holding a semiconductor wafer 60 horizontally and rotating at high speed, a resist supply nozzle 62 for dropping a resist liquid as a coating liquid on the semiconductor wafer 60, and a spin chuck 61. The outer cup 63 and the inner cup 64 are provided so as to surround the semiconductor wafer 60.

The resist solution dropped from the resist supply nozzle 62 onto the semiconductor wafer 60 is applied to a spin chuck 61.
Is applied uniformly on the semiconductor wafer 60 by the rotation of
Excess resist solution is scattered in the peripheral direction of the semiconductor wafer 60 and adheres to the inner wall surfaces of the outer cup 63 and the inner cup 64. When the resist liquid layer adhering to the outer cup 63 and the inner cup 64 is left, the resist is gradually laminated, dried, and peeled off from the cups 63 and 64 by impact or the like.
There is a possibility that the semiconductor wafer 60 may be contaminated. For this reason, the cups 63 and 64 are regularly removed and washed and removed. However, this operation is very troublesome and time-consuming.

[0004] Therefore, the coating device includes a cup 63,
A cleaning mechanism is provided for automatically removing the resist adhering to 64. That is, as shown in FIGS. 9 and 10, the cups 63 and 64 are provided with an introduction path 65 for introducing the cleaning liquid L for dissolving the resist and the cleaning liquid L introduced from the introduction path 65 around the cups 63 and 64. An annular supply path 66 for distributing and supplying the cleaning liquid L, a large number of small holes 67 for discharging the cleaning liquid L of the supply path 66 to the resist adhering surface are formed, and a joint 68 is formed in the introduction path 65. A tube 69 for introducing a cleaning liquid is connected through the intermediary. The cleaning liquid L supplied to the supply path 66 flows out through the small holes 67 and flows down along the inner peripheral surface of the outer cup 63 and the outer peripheral surface of the inner cup 64.

As another cleaning means, as shown in FIG. 11, a dummy wafer 70 is placed on a spin chuck 61, and a cleaning liquid is supplied from an upper cleaning liquid supply nozzle 71 while rotating the spin chuck 61 to scatter. A technique for cleaning the cups 63 and 64 is also known.
8-184725, JP-A-62-73630).

[0006]

However, in the former case, that is, in the cleaning mechanism shown in FIGS.
The structures of the inner cup 3 and the inner cup 64 are complicated, not only expensive, but also difficult to process and mount. Further, although the cleaning liquid L flows from hundreds of small holes 67, the cleaning liquid L easily spreads on the path once flowing, so that the cleaning liquid L spreads and flows uniformly over the entire peripheral surfaces of the cups 63 and 64. However, there was a problem that cleaning unevenness was generated. Further, the cleaning liquid L
Is used to dissolve and remove the resist little by little.
The cleaning time is long and the consumption amount of the cleaning liquid L is large. Further, there is a possibility that a trouble such as a leak of the cleaning liquid L from the joint 68 or the like may occur. In addition to the above, there is a problem that it is difficult to control the scattering direction of the cleaning liquid, and the cup cannot be effectively cleaned.

On the other hand, in the latter, that is, in the cleaning mechanism shown in FIG. 11, it is possible to shorten the cleaning time and reduce the consumption of the cleaning liquid, but it takes time to carry in and carry out the dummy wafer 70, and This requires a standby space for the dummy wafer 70 and manual insertion and removal, and further, there is a problem that particles attached to the surface of the dummy wafer 70 adhere to the spin chuck 61 and contaminate the wafer 60.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to apply a small amount of a cleaning liquid uniformly and efficiently in a short time to efficiently apply the applied coating liquid without using a dedicated cleaning jig. It is intended to provide a device.

[0009]

Means for Solving the Problems To achieve the above object, the invention according to claim 1 is provided with a rotation holding means for holding and rotating an object to be coated, and provided so as to surround the rotation holding means, A cleaning liquid supply nozzle for cleaning the coating liquid attached to the container toward the rotation holding means, assuming a coating apparatus having a container for preventing the coating liquid supplied to the object to be scattered; The cleaning liquid sprayed from the supply nozzle is sprayed in a plurality of directions of the container via the rotation holding means, and the rotation holding
The holding means is formed so as to be able to reciprocate in the direction of the rotation axis .

According to a second aspect of the present invention, similarly to the first aspect of the invention, there is provided a rotation holding means for holding and rotating an object to be coated, and provided so as to surround the rotation holding means. Assuming an application device having a container for preventing the application liquid supplied from being scattered, a cleaning liquid guiding portion is formed in the rotation holding means, and the coating liquid adhering to the container toward the cleaning liquid guiding portion is removed. A cleaning liquid supply nozzle for cleaning is provided, and the cleaning liquid ejected from the supply nozzle is sprayed on the container via the cleaning liquid guiding portion of the rotation holding means, and the rotation holding means is rotated in the direction of the rotation axis.
It is characterized by being formed so as to be able to reciprocate in the direction .

According to a third aspect of the present invention, similarly to the first aspect of the invention, there is provided a rotation holding means for holding and rotating the object to be coated, and provided so as to surround the rotation holding means, and A rotation unit configured to store a cleaning liquid for cleaning the coating liquid attached to the container, provided that the coating apparatus has a container for preventing the coating liquid supplied to the coating body from scattering. together with a, a cleaning liquid reservoir have a discharge hole for discharging toward the vessel by the rotation of the rotary holding means, said rotary holding unit in the rotational axial direction
It is characterized by being formed so as to be able to reciprocate .

In the present invention, the object to be coated includes a semiconductor wafer, a printed circuit board, an LCD substrate and the like, and includes a resist solution coating process, a developing solution coating process, an etching solution coating process, a magnetic liquid coating process, a cleaning process and the like. Applies to the equipment that performs.

The rotation holding means holds the object to be coated,
The number of rotations may be constant as long as it rotates the object to be coated, but it is preferable to control the number of rotations variably .
(Claim 4).

The cleaning liquid guiding portion may be any one as long as the cleaning liquid sprayed from the supply nozzle can be sprayed on the container. For example, the back surface of the object holding portion of the rotation holding means has a predetermined angle. It may be formed by a reflection guide surface, or may be formed by a plurality of guide holes.
When forming the cleaning liquid guiding portion with a plurality of guiding holes, it is necessary to supply the cleaning liquid ejected from the cleaning liquid supply nozzle toward each of the guiding holes. It must be installed or movably installed.

[0015] The discharge holes provided in the rotation holding means may be provided at least at one or more locations which open in the outer peripheral direction of the rotation holding means, but it is preferable to provide a plurality of discharge holes having different opening angles. .

[0016]

According to the first or second aspect of the present invention, when the cleaning liquid is appropriately supplied from the cleaning liquid supply nozzle to the rotating holding means or the cleaning liquid guiding portion of the rotating holding means, the supply of the cleaning liquid is stopped. The washing liquid thus scattered at a high speed under the rotational force and the centrifugal force due to the rotation of the rotation holding means, and collides in a plurality of directions on the inner surface of the cup. Since the cleaning liquid is continuously sprayed with a large momentum, the coating liquid adhering to the inner surface of the cup is quickly cleaned and removed. At this time, the range of spraying the cleaning liquid can be changed by changing the number of rotations of the rotation holding means, and the range of spraying the cleaning liquid can be widened by moving the rotation holding means in the direction of the rotation axis.

According to the third aspect of the present invention, if the cleaning liquid is supplied from the cleaning liquid supply nozzle in advance or during rotation, the centrifugal force accompanying the rotation of the rotation holding means causes the cleaning liquid to be supplied.
The cleaning liquid is collected in a storage part on the peripheral edge side of the rotation holding means,
Further, receiving the rotational force and the centrifugal force due to the rotation of the rotation holding means, the cleaning liquid is discharged and scattered from the discharge hole at a high speed and collides with the inner surface of the cup. The cleaning liquid is temporarily stored in the storage unit, and the cleaning liquid having a large momentum is continuously discharged from the discharge hole, for example, so that the coating liquid attached to the inner surface of the cup is quickly cleaned and removed. At this time, similarly to the above, the range of cleaning and spraying can be widened by moving the rotation holding unit along the rotation speed and / or the rotation axis direction.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is applied to a resist film forming apparatus.

As shown in FIG. 1, the resist film forming apparatus includes a processing mechanism unit 10 provided with a processing mechanism for performing various processes on an object to be coated, for example, a semiconductor wafer 60 (hereinafter simply referred to as a wafer); It mainly comprises a loading / unloading mechanism 1 for automatically loading / unloading the wafer 60 into / from the processing mechanism unit 10.

The carry-in / carry-out mechanism 1 is used to move the wafer 60 before processing.
, A wafer carrier 3 for storing a processed wafer 60, an arm 4 for holding the wafer 60 by suction, and connecting the arm 4 to X (left and right), Y (front and rear), Z (vertical) and A moving mechanism 5 for moving in the θ (rotation) direction, and an alignment stage 6 for aligning the wafer 60 and transferring the wafer 60 to and from the processing mechanism unit 10 are provided.

The processing mechanism unit 10 is provided with a transport mechanism 12 movably along a transport path 11 formed in the X direction from the alignment stage 6. Transport mechanism 1
2 has a main arm 13 which is movable in the Y, Z and θ directions.
Is provided. On one side of the transport path 11, an adhesion processing mechanism 14 for performing an adhesion process for improving the adhesion between the wafer 60 and the resist liquid film;
A pre-bake mechanism 15 for heating and evaporating a solvent remaining in the resist applied to the wafer 60 and a cooling mechanism 16 for cooling the heated wafer 60 are provided. Further, on the other side of the transfer path 11, a coating mechanism 17 (coating device) for coating a resist liquid on the surface of the wafer 60
And a wafer 6 for preventing irregular reflection of light during the exposure process.
And a surface coating layer coating mechanism 18 for coating and forming a CEL film or the like on the 0 resist.

Next, the operation will be described. First, the unprocessed wafer 60 is unloaded from the wafer carrier 2 by the arm 4 of the loading / unloading mechanism 1 and placed on the alignment stage 6. Next, the alignment stage 6
The upper wafer 60 is held by the main arm 13 of the transfer mechanism 12 and transferred to each of the processing mechanisms 14 to 18. Then, the processed wafer 60 is returned to the alignment stage 6 by the main arm 13, further transported by the arm 4, and stored in the wafer carrier 3.

Next, the coating apparatus 17 of the present invention will be described with reference to FIGS.

First Embodiment FIG. 2 is a side sectional view of a first embodiment of the coating apparatus according to the present invention. The coating apparatus 17 of the present invention
(Not shown in FIG. 2) is held on the upper surface, for example, a spin chuck 20 serving as a rotation holding means for rotating by suction holding.
A spin motor 21 that drives the spin chuck 20 so that the spin chuck 20 can be controlled to rotate; and a spin shaft 21 that connects the spin chuck 20 and the spin motor 21 so that the spin shaft 23 and the spin chuck 20 are aligned with the rotation axis. The main part is constituted by a reciprocating movement mechanism 22 such as a ball screw which reciprocates along.

In this case, the rotation of the spin chuck 20 is controlled by a spin motor 21 at a desired number of revolutions, and the reciprocating mechanism 22 controls the spin chuck 20 to be able to reciprocate, that is, move up and down along the rotation axis. The cleaning liquid reflection surface has a gradient from one end of the circumference to the other end on the back side of the wafer holding portion of the spin chuck 20, that is, the lower side of the spin chuck 20, and is configured to reflect the cleaning liquid in the outer peripheral direction. A cleaning liquid guide 24 formed by the guide surface is provided. Further, the cleaning liquid guiding section 2
4, the cleaning liquid L is directed toward the cleaning liquid guiding section 24.
Is provided. The upper surface of the spin chuck 20 is provided with vacuum holes 28 for holding the wafer 60 at appropriate intervals in the circumferential direction. The vacuum hole 28 is connected to a vacuum pump (not shown) via a vacuum passage 29 provided in the rotating shaft 23.
In this case, at least the cleaning liquid guide portion 24 of the spin chuck 20 needs to have solvent resistance to the cleaning liquid L. For example, the entire spin chuck 20 may be formed of a stainless steel solvent-resistant member, or For example, Teflon or Delrin (both are trade names)
Alternatively, it can be formed of a solvent-resistant material such as vinyl chloride, or a film can be formed on the surface.

On the other hand, a bottom plate 31 is provided on the outer periphery of the lower portion of the spin chuck 20, and an outer cup 32 and an inner cup 33 are arranged on the bottom plate 31 so as to surround the wafer 60 mounted on the spin chuck 20. Is provided. Outer cup 3
2 and the inner cup 33 are formed to be inclined downward toward the outside in the radial direction of the spin chuck 20, and the resist solution is applied to the bottom plate 3.
It leads to 1. The bottom plate 31 is provided with a gentle inclination, and a drain pipe 34 for discharging a resist solution or the like is connected to the bottom of the bottom plate 31. An annular partition wall 35 for preventing intrusion of drainage is provided on the bottom plate 31, and an exhaust pipe 36 for exhausting the inside of the cup is connected to the bottom plate 31 inside the partition wall 35. ing.

In the coating apparatus of the present invention configured as described above, when performing a resist liquid coating process, the wafer 60 is placed on the spin chuck 20 and a resist supply nozzle (not shown) is provided on the upper surface of the wafer 60. This is performed by dropping a resist solution and rotating the spin chuck 20. When this resist liquid coating process is repeated many times, the scattered resist is deposited and adhered on the inner surface side of the outer cup 32 and the upper surface side of the inner cup 33.

In this embodiment, an automatic cleaning mechanism is provided. Therefore, it is possible to automatically program the cleaning process. This cup wash
This is performed after the resist coating process has been performed a predetermined number of times or at the beginning of a lot. At this time, the cleaning liquid L (for example, thinner) sprayed from the cleaning liquid supply nozzle 25 is caused to collide with the cleaning liquid guiding section 24, and the cleaning liquid L is sprayed on the cup wall surface in a plurality of directions by the reflection thereof, so that the resist liquid adhering to the cup wall surface Is removed by washing. At this time, since the surface of the cleaning liquid guiding section 24 is inclined with respect to the rotation axis,
The reflected cleaning liquid L spreads in the vertical direction and is sprayed. Further, by controlling the rotation of the spin chuck 20 (for example, 300 to 3000 RPM) and reciprocating the spin chuck 20 in the rotation axis direction, that is, up and down, the spraying direction of the cleaning liquid L that collides with the cleaning liquid guiding unit 24 and is reflected is changed. The cleaning liquid L can be sprayed uniformly over a wide area on the wall surfaces of the cups 32 and 33. Further, with the above configuration, it is not necessary to provide a dedicated cleaning mechanism and a cleaning jig, so that there is no need for a standby space for the dedicated jig, manual insertion and removal, and the like. Therefore, the structure can be simplified and the entire device can be downsized.

Second Embodiment FIG. 3 is a side sectional view of a main part of a second embodiment of the coating apparatus according to the present invention. The spraying device according to the second embodiment is a modified example of the system in which the cleaning liquid L sprayed from the cleaning liquid supply nozzle 25 is sprayed on the cup wall surface via the spin chuck 20 as in the first embodiment described above. Chuck 2
This is a case where the cleaning liquid guiding portion 24 of No. 0 is formed by a plurality of guiding holes having different ejection angles. That is, the spin chuck 2
In addition, three cleaning liquid receiving portions 26 are provided on the back side of the wafer holding portion 0, and cleaning liquid guiding holes 27a, 27b, 27c having different angles, for example, are formed between each cleaning liquid receiving portion 26 and the outer peripheral surface of the spin chuck 20. In this case, the cleaning liquid supply nozzle 25 is provided so as to be movable so as to supply the cleaning liquid L toward each of the cleaning liquid receiving portions 26.

In the coating apparatus configured as described above, the cleaning liquid supply nozzle 25 is moved to a predetermined position to supply the cleaning liquid L to an arbitrary position of the cleaning liquid receiving section 26, thereby selecting the wall surfaces of the cups 32 and 33. It can be washed. Therefore, the cup wall surface to which a large amount of resist has adhered can be mainly cleaned.

In the above description, the case where the cleaning liquid supply nozzle 25 is provided so as to be movable is described. However, the cleaning liquid supply nozzle 25 does not necessarily have to be moved, and the direction of the nozzle is changed toward each cleaning liquid receiving portion 26. May be made.

In the second embodiment, the other parts are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Third Embodiment FIG. 4 is a side sectional view of a third embodiment of the coating apparatus of the present invention, and FIG. 5 is a sectional perspective view of a main part thereof. The coating apparatus according to the third embodiment has a case in which a cleaning liquid storage section 40 is provided on the spin chuck 20 and the cleaning liquid L stored in the storage section 40 is sprayed (discharged) from the discharge hole 41 to the cup wall surface. is there.

That is, an annular gutter-shaped storage section 40 is provided around the periphery of the back side of the wafer holding section of the spin chuck 20, and discharge is performed on the peripheral wall 42 of the spin chuck 20 at appropriate intervals along the circumferential direction. In this case, the holes 41 are formed so that the cleaning liquid L can be supplied into the storage section 40 from the cleaning liquid supply nozzle 25 disposed below the spin chuck 20. In this case, a plurality of discharge holes 41 are formed in order to uniformly spray the cleaning liquid L supplied to the storage section 40 and collected by centrifugal force due to the rotation of the spin chuck 20 toward the cups 32 and 33. For example, these discharge holes have a discharge hole 41a formed horizontally on the peripheral wall 42 and a discharge hole 41b formed downward on the bottom wall of the storage section 40 at a predetermined angle from the horizontal and radially outward. . These discharge holes 41a and 41b are provided at a plurality of positions (for example, eight positions) at equal intervals along the peripheral wall 42 of the spin chuck.

In the coating apparatus configured as described above, when the cleaning liquid L is appropriately supplied in advance from the cleaning liquid supply nozzle 25 or during rotation, the cleaning liquid L is stored in the storage section 40 by centrifugal force accompanying rotation of the spin chuck 20. The cleaning liquid L is discharged and scattered from the discharge holes 41a and 41b at high speed and collides with the inner surface of the cup due to the rotational force and the centrifugal force generated by the rotation of the spin chuck 20. At this time, when the spin chuck 20 is stopped, or when the spin chuck 2
When 0 is rotated at a low speed, the cleaning liquid in the storage section 40 mainly flows down from the discharge hole 41b, and the inner cup 33 is cleaned. Further, when the spin chuck 20 is rotated at a medium speed and a high speed, the cleaning liquid L collected in the storage unit 40 by the centrifugal force is mainly discharged at a high speed from the discharge hole 41a. The cleaning liquid L discharged from the discharge holes 41a collides with the inner peripheral surface of the outer cup 32, and the resist liquid is cleaned. Further, the cleaning liquid L discharged from the discharge hole 41b hits the outer peripheral upper surface of the inner cup 33, and the inner cup 33
Is performed. As described above, the cleaning liquid L is stored in the storage section 40.
And the cleaning liquid L having a large momentum is continuously discharged from the discharge holes 41a and 41b, for example.
The coating liquid adhering to the inner surface of the cup can be quickly washed and removed. At this time, by changing the rotation speed of the spin chuck 20 and moving the spin chuck 20 up and down, the wall surfaces of the cups 32 and 33 can be cleaned over a wide range. In this case, the rotation speed of the spin chuck 20 is selected from the scattering state of the cleaning liquid L, for example, 300
3000 RPM is desirable.

Since the other parts of the third embodiment are the same as those of the first and second embodiments, the same parts are denoted by the same reference numerals and the description thereof will be omitted.

Fourth Embodiment FIG. 6 is a side sectional view of a fourth embodiment of the coating apparatus of the present invention, and FIG. 7 is a perspective view of a main part thereof. Similar to the third embodiment, the coating apparatus according to the fourth embodiment is a modification of the method in which the cleaning liquid L is stored in the storage section 40 provided in the spin chuck 20 and then the cleaning liquid is sprayed from the discharge hole 41 onto the cup wall surface. This is an example.

That is, the wafer holding portion of the spin chuck 20 is formed in a hollow disk shape, a cleaning liquid inlet 43 is provided at the center of the upper surface of the wafer holding portion, and collected by centrifugal force in the outer peripheral portion inside the hollow portion 44. A storage section 40 capable of storing the cleaning liquid L to be prepared is provided.
This is a case where discharge holes 41a and 41b are provided at equal intervals as appropriate in the peripheral wall 42 as in the third embodiment. In this case, a conical projection 45 is formed at the center of the bottom of the hollow portion 44 to evenly distribute and supply the cleaning liquid L to the entire circumference of the hollow portion and prevent the cleaning liquid L from splashing. .
A cleaning liquid supply nozzle 25 is provided at a position above the center of the spin chuck 20 so as to be selectively movable.

When performing cup cleaning, a cleaning liquid supply nozzle 25 is set in place of the resist supply nozzle (not shown) used during the resist liquid application processing. Then, the cleaning liquid L flows down from the supply nozzle 25, and is introduced into the inlet 43.
It is supplied into the hollow portion 44. In addition, spin chuck 2
It is also supplied during zero rotation. The cleaning liquid L supplied into the hollow part 44 is collected in the storage part 40 by the rotation force and the centrifugal force due to the rotation of the spin chuck 20, and is discharged.
The resist liquid is discharged from 1b and collides with the inner peripheral surfaces of the cups 32 and 33 to wash the resist liquid.

As described above, the cleaning liquid L moving to the outer peripheral portion by the centrifugal force due to the rotation of the spin chuck 20 is temporarily stored in the storage section 40, and the stored cleaning liquid L is discharged to the discharge hole 4
Since the liquid is ejected from 1, the cleaning liquid L of a certain amount can be continuously ejected at a high speed,
Effective cleaning can be performed. Also, since a plurality of discharge holes 41 are formed at a predetermined angle (elevation angle, dip angle) from the horizontal plane,
The cleaning liquid L can be sprayed over a wide range of the outer cup 32 and the inner cup 33.

The other parts of the fourth embodiment are the same as those of the first to third embodiments, and therefore, the same parts are denoted by the same reference numerals and description thereof will be omitted.

In the third and fourth embodiments, the discharge holes 41a and 41b are provided at a plurality of positions. However, as shown in FIG. 8, only one discharge hole may be provided. This is because the spin chuck 20 is rotated and scanned. If the number of the discharge holes (discharge hole group) 41 is reduced, the discharge flow rate from one discharge hole 41 can be increased. In this case, in order to guide the cleaning liquid L to one discharge hole 41, a partition wall 46 as shown in FIG.
Should be provided. The reason why the partition wall 46 extends to the opposite side to the discharge hole 41 is also to take into account the balance during rotation. As described above, each of the discharge holes 41a and 41b may be one, but if any of these is omitted,
The range of the cleaning liquid L injected and supplied to the cups 32 and 33 is reduced.

In the third and fourth embodiments, the discharge holes 41a and 41b are formed radially, that is, radially, but may be formed to be inclined from the radial direction. By doing so, the cleaning liquid L ejected from the ejection hole 41 almost in the tangential direction of the spin chuck 20 is ejected from the ejection hole 41 due to the inclination direction and angle of the ejection hole with respect to the radial direction with respect to the rotation direction of the spin chuck 20 and the rotation speed of the spin chuck 20. It is also possible to change the direction to the radial direction.

[0044]

As described above, since the coating apparatus of the present invention is configured as described above, the following effects can be obtained.

According to the first aspect of the present invention, the cleaning liquid is sprayed from the cleaning liquid supply nozzle toward the rotation holding means or the cleaning liquid guiding portion formed on the rotation holding means, and the cleaning liquid is sprayed in a plurality of directions of the container. And wash the container, so that the coating solution can be efficiently and uniformly cleaned with a small amount of cleaning solution in a short time without using a dedicated cleaning jig.
Moreover, the cleaning unevenness can be greatly reduced,
The size of the device can be reduced.

2) According to the third aspect of the present invention, the rotation holding means has a storage portion capable of storing the cleaning liquid, and the discharge hole for discharging the cleaning liquid in the storage portion toward the container by the rotation of the rotation holding means. Since the cleaning liquid is temporarily stored in the storage part in addition to the above 1), the cleaning liquid having a large momentum can be continuously discharged from the discharge hole toward the container, and the coating liquid attached to the container surface can be removed in a short time. Can be washed off.

3) According to the fourth aspect of the present invention, since the number of rotations of the rotation holding means is formed so as to be controllable, in addition to the above 1) and 2), the cleaning liquid is evenly sprayed on the container surface. Can be.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing one embodiment in which the present invention is applied to a resist film forming apparatus.

FIG. 2 is a side sectional view showing a first embodiment of the coating apparatus of the present invention.

FIG. 3 is a side sectional view showing a main part of a second embodiment of the coating apparatus of the present invention.

FIG. 4 is a side sectional view showing a third embodiment of the coating apparatus of the present invention.

FIG. 5 is a sectional perspective view showing a main part of a third embodiment.

FIG. 6 is a side sectional view showing a fourth embodiment of the coating apparatus of the present invention.

FIG. 7 is a perspective view showing a main part of a fourth embodiment.

FIG. 8 is a plan sectional view showing a modified example of the cleaning liquid storage section and the discharge holes according to the present invention.

FIG. 9 is a side sectional view showing a conventional resist coating apparatus.

FIG. 10 is an enlarged sectional perspective view showing a part of the outer cup of FIG. 9;

FIG. 11 is a side sectional view showing another conventional resist coating apparatus.

[Explanation of symbols]

 Reference Signs List 20 spin chuck (rotation holding means) 21 spin motor 22 reciprocating movement mechanism 24 cleaning liquid guiding section 25 cleaning liquid supply nozzle 27a to 27c cleaning liquid guiding hole 32 outer cup 33 inner cup 40 cleaning liquid storing section 41, 41a, 41b discharge hole L cleaning liquid

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/027 B05C 11/08

Claims (4)

(57) [Claims] 1. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing scattering of a coating liquid supplied to the object to be coated. In a coating apparatus having a cleaning liquid supply nozzle for cleaning the coating liquid attached to the container toward the rotation holding means, a cleaning liquid ejected from the supply nozzle is supplied through the rotation holding means. so as to spread in a plurality of directions of the vessel, the times
The rolling holding means should not be formed to be able to reciprocate in the direction of the rotation axis.
Coating and wherein the that. 2. A rotating and holding means for holding and rotating an object to be coated, and a container provided to surround the rotating and holding means for preventing scattering of a coating liquid supplied to the object to be coated. A cleaning liquid guiding portion is formed in the rotation holding means, and a cleaning liquid supply nozzle for cleaning the coating liquid adhered to the container is provided toward the cleaning liquid guiding portion, and the cleaning nozzle is ejected from the supply nozzle. The cleaning liquid to be sprayed is sprayed on the container via the cleaning liquid guiding portion of the rotation holding means, and the rotation holding is performed.
An application device characterized in that the means is formed so as to be reciprocally movable in the direction of the rotation axis . 3. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing the application liquid supplied to the object from scattering. In the coating apparatus having, the rotation holding means has a storage unit that can store a cleaning liquid for cleaning the coating liquid attached to the container,
A discharge hole for discharging the cleaning liquid in the storage section toward the container by rotation of the rotation holding means, and rotating the rotation holding means;
An application device formed so as to be reciprocally movable in an axial direction . 4. The coating apparatus according to claim 1, wherein the rotation number of the rotation holding means is formed so as to be controllable.