JPH0766116A - Coater - Google Patents

Abstract

PURPOSE:To provide a coater equipped with a function for automatically cleaning a container, for preventing the coating liquid from scattering, up to the rear side of top ring thereof. CONSTITUTION:At the time of cleaning a container (outer cup 23, inner cup 24), a spin chuck 20 is mounted with a cleaning jig 50 and cleaning liquid L is fed through a cleaning liquid supply nozzle 40. The cleaning liquid L is collected, by the centrifugal force produced through rotation of the spin chuck 20, to the peripheral part at the liquid sump 51 in the cleaning jig 50 and then delivered at high speed through a delivery hole 52. In this regard, a guide member 53 disposed at the lower peripheral part of the jig 50 is projected, by the centrifugal force, to the outside of the jig 50 and the cleaning liquid L delivered through the delivery hole 52 is scattered upward. Diametral dimension of the jig 50 is limited smaller than that at the opening 36 of the container but since the guide member 53 is projected to the outside of the jig 50 and the cleaning liquid L is scattered upward, the cleaning liquid L can be sprayed uniformly up to the rear side of top ring 37 on the periphery of the opening thus realizing efficient cleaning.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for coating a coating liquid by rotating an object to be coated such as a semiconductor wafer,
In particular, the present invention relates to a coating device capable of cleaning a container to which a coating liquid scattered by rotation adheres.

[0002]

2. Description of the Related Art Conventionally, a resist rotation coating apparatus as shown in FIG. 9 has been known as a coating apparatus for coating a coating liquid on an object to be coated such as a semiconductor wafer. This coating apparatus includes a spin chuck 20 that is a rotation holding unit that holds a semiconductor wafer W horizontally and rotates at high speed, and a resist supply nozzle 62 that drops a resist solution as a coating solution onto the semiconductor wafer W.
And the outer cup 23 and the inner cup 2 which are containers provided so as to surround the semiconductor wafer W on the spin chuck 20.
4 and.

In the coating apparatus thus constructed,
The resist liquid dripped from the resist supply nozzle 62 onto the semiconductor wafer W is rotated by the spin chuck 20.
It is evenly applied on the semiconductor wafer W, and the excess resist solution is scattered in the peripheral direction of the semiconductor wafer W and the outer cup 23
And to the inner wall surface of the inner cup 24. This outer cup 2
3. If the resist liquid layer attached to the inner cup 24 is left to stand, the resist is gradually laminated and dried, and is peeled from the cups 23 and 24 due to impact or the like to become particles and contaminate the semiconductor wafer W. For this reason, conventionally, the cups 23 and 24 have been regularly removed to be cleaned and removed, but recently, various methods for automatically cleaning the inside of the cup have been proposed, for example, in the cup itself. There is known one in which a cleaning liquid is supplied and discharged from a large number of holes at the top of the cup so as to be dropped along the inner peripheral surface of the cup (Japanese Patent Laid-Open No. 59-212126). In addition to this, for example, JP-A-58-184725,
JP-A-62-73629, JP-A-62-73630
Issue, Japanese Examined Japanese Patent Publication No. 63-41630, Jikken 1-256565
There is a technique disclosed in the publication.

However, in the case of the cleaning method in which the cleaning liquid is supplied to the cup itself and discharged to the inner surface, the shape and structure of the cup tend to be complicated, and as a result of prioritizing the cleaning property, the original process of the coating apparatus is performed. In many cases, proper performance (uniformity of coating film, air flow in cup, etc.) is not fully taken into consideration.

Therefore, a method has been proposed in which a cleaning jig 30 is attached to the spin chuck 20 as shown in FIG. 10 to perform cleaning (see Japanese Patent Laid-Open No. 5-82435). The cleaning jig 30 is a disk-shaped body formed in substantially the same shape as the wafer W, and the spin chuck 20 is provided on the lower surface side of the peripheral edge portion thereof.
Cleaning liquid L from the cleaning liquid supply nozzle 40 arranged in the vicinity of
A storage portion 31 for receiving and storing the cleaning liquid L is formed, and a plurality of discharge holes 36 for discharging the cleaning liquid L toward the cups 23, 24 are formed in the outer peripheral edge portion, and the discharge holes 36 are rotated by the spin chuck 20. While supplying the cleaning liquid L from the cleaning liquid supply nozzle 40, the cleaning liquid L is accumulated on the peripheral portion of the jig by the centrifugal force and is ejected from the ejection hole 36. According to the cleaning jig 30, a certain amount of cleaning liquid L can be continuously jetted at high speed, and effective cleaning can be performed. Also,
By making the directions of the discharge holes 36 provided in the cleaning jig 30 different from each other, the cleaning liquid L can be sprayed over a wide range of the outer cup 23 and the inner cup 24.

[0006]

However, in the inside cleaning of the cup using the conventional cleaning jig 30, a sufficient amount of the cleaning liquid L is not sprayed onto the inner surface 23a of the upper end portion of the outer cup 23. An annular portion 3 formed by folding the cup 23 at the upper end opening 36 so as to fold the cup 23 downward.
There is a drawback that the back side of No. 7 (hereinafter referred to as top ring) cannot be washed. This top ring 37 is
The rising airflow generated along the inner surface of the outer cup 23 during the coating process is prevented from flowing to the upper surface side of the outer cup 23, and the resist scattered on the inner surface of the cup is prevented from flying to the upper surface of the wafer W. It is for the purpose of cleaning and removing the resist in this portion is extremely important for preventing the generation of particles.

The present invention was devised to eliminate the above-mentioned drawbacks of the prior art, and the purpose thereof is to effectively disperse the cleaning liquid on the inner surface of the upper part of the container provided to prevent the scattering of the coating liquid. An object of the present invention is to provide a coating device having a function of cleaning even the back side of the top ring at the upper end of the container in a short time.

[0008]

In order to achieve the above object, a first processing apparatus of the present invention is provided with a rotation holding means for holding and rotating an object to be coated, and a rotation holding means surrounding the rotation holding means. Assuming a coating device having a container for preventing the coating liquid supplied to the object to be scattered from rotating, the cleaning device is rotated by the rotation holding means when the container is washed. The cleaning jig is attached to the holding means and is supplied with a cleaning liquid for cleaning and removing the coating liquid adhering to the container. The cleaning jig has a reservoir for storing the cleaning liquid, and the rotation holding means. And a guide member for ejecting the cleaning liquid in the reservoir toward the container by the rotation of the nozzle, and a centrifugal force generated by the rotation of the rotation holding means so as to project to the outside of the jig to scatter the cleaning liquid from the discharging hole upward. Specially having To.

In this first processing apparatus, the guide member has a guide surface for scattering the cleaning liquid upward at its tip portion, and its base end side is rotatable on the lower surface of the cleaning jig. It is desirable to be supported so as to be slidable in the radial direction. In that case, it is desirable that the guide member is biased by the biasing means and stored under the cleaning jig.

Next, a second processing apparatus of the present invention is a rotation holding means for holding and rotating an object to be coated, and a coating provided to the object to be coated so as to surround the rotation holding means. Assuming a coating device having a container for preventing the liquid from scattering, a cleaning liquid is attached to the rotation holding means in the same manner as the object to be coated, and a cleaning liquid for cleaning the coating liquid adhering to the container is supplied. This cleaning jig is provided with a storage part capable of storing the cleaning liquid, a discharge hole for discharging the cleaning liquid in the storage part toward the container by the rotation of the rotation holding means, and a jig for changing the temperature. And a guide member made of a shape memory alloy or a bimetal for projecting outward of the cleaning liquid and scattering the cleaning liquid from the discharge hole upward.

In the present invention, the object to be coated may be a semiconductor wafer, a printed circuit board, an LCD substrate or the like, and an apparatus for performing resist solution coating processing, developing solution coating processing, etching solution coating processing, magnetic liquid coating processing, etc. Applied.

The cleaning jig is made of a material that is not affected by a cleaning liquid such as a solvent that dissolves the coating liquid, for example, Delrin, Teflon (both are trade names), resin such as vinyl chloride, ceramics, glass, chemical resistance. It is preferable to use a metal having a property coating.

[0013]

In the first and second coating apparatuses of the present invention configured as described above, the cleaning jig mounted on the apparatus rotation holding means is rotated in advance from the cleaning liquid supply nozzle or the like or by the rotation holding means. A cleaning liquid is appropriately supplied therein. The cleaning liquid supplied to the cleaning jig is collected in the reservoir portion on the peripheral side of the cleaning jig by the centrifugal force generated by the rotation of the rotation holding means, and the rotational force and centrifugal force generated by the rotation of the rotation holding means are further collected. It receives and discharges at high speed from the discharge hole. At this time, in the case of the first coating device, due to centrifugal force, in the case of the second coating device, due to temperature change before and after mounting the cleaning jig in the container, or due to temperature change accompanying supply of the cleaning liquid, Each of the guide members projects to the outside of the cleaning jig and scatters the cleaning liquid discharged from the discharge holes upward. The diameter of the cleaning jig is limited to the diameter of the opening of the container or less, but the guide slope is projected to the outside of the cleaning jig and the cleaning liquid from the discharge hole is applied to it to change the direction of scattering and move upward. By scattering, the cleaning liquid can be uniformly sprayed to a portion, such as the back side of the top ring around the periphery of the opening of the container, which has been conventionally difficult to be cleaned, and the cleaning can be efficiently performed.

[0014]

Embodiments of the present invention will be described in detail below with reference to the drawings. This embodiment is applied to a resist coating / developing apparatus.

As shown in FIG. 1, this resist coating / developing apparatus includes a processing mechanism unit 10 in which a processing mechanism for performing various kinds of processing on an object to be processed, for example, a semiconductor wafer (hereinafter, simply referred to as a wafer) W is arranged, and a processing mechanism unit 10. A main part is constituted by a loading / unloading mechanism 1 for automatically loading / unloading the wafer W into / from the mechanical unit 10.

The loading / unloading mechanism 1 includes a wafer carrier 2 for storing an unprocessed wafer W, a wafer carrier 3 for storing a processed wafer W, an arm 4 for sucking and holding the wafer W, and this arm 4. The moving mechanism 5 for moving in the X, Y (horizontal), Z (vertical) and θ (rotation) directions, and the wafer W.
The alignment stage 6 in which the wafer W is aligned and the wafer W is transferred to and from the processing mechanism unit 10.
It has and.

The processing mechanism unit 10 is provided with a transfer mechanism 12 that is movable along a transfer path 11 formed in the X direction from the alignment stage 6. Transport mechanism 1
2 has a main arm 13 movably in Y, Z and θ directions.
Is provided. On one side of the transfer path 11, an adhesion processing mechanism 14 for performing adhesion processing for improving the adhesion between the wafer W and the resist liquid film, and a solvent remaining in the resist applied to the wafer W are heated and evaporated. In order to perform a pre-baking process for performing the post-baking process and a post-baking process after development, a bake mechanism 15 provided by stacking in multiple stages and a cooling mechanism 16 for cooling the heat-treated wafer W are arranged. On the other side of the transfer path 11, a processing liquid coating mechanism 17 (coating apparatus of the present invention) for coating a resist on the surface of the wafer W, and a developing process for the wafer W exposed by a stepper (not shown) or the like. The developing mechanism 18 is arranged.

In the resist coating and developing apparatus configured as described above, first, the unprocessed wafer W is unloaded from the wafer carrier 2 by the arm 4 of the loading / unloading mechanism 1 and placed on the alignment stage 6. . Then
The wafer W on the alignment stage 6 is transferred by the transfer mechanism 12
Each processing mechanism 14-1 is held by the main arm 13 of
It is transported to 8. Then, the processed wafer W is returned to the alignment stage 6 by the main arm 13.
Further, it is transferred by the arm 4 and stored in the wafer carrier 3.

Next, the coating mechanism (or coating device) 17
Will be described. As shown in FIG. 2, the coating mechanism 17 has a spin chuck 20 which is a rotation holding means for sucking and holding a wafer W (not shown in FIG. 2) and rotating the spin chuck 20. Spin motor 21
Are connected so that the spin motor 21 can control the rotation of the spin chuck 20 at a desired rotation speed. Further, the bottom plate 2 is provided on the outer periphery of the lower portion of the spin chuck 20.
2, an outer cup 23 and an inner cup 24, which are formed in a cylindrical shape, are concentrically provided on the bottom plate 22 so as to surround the wafer W mounted on the spin chuck 20. The upper part of the outer cup 23 and the upper part of the inner cup 24 are formed to be inclined downward toward the radial outside of the spin chuck 20, and guide the scattered resist solution to the bottom plate 22. The bottom plate 22 is gently inclined, and at the bottom of the bottom plate 22, a drainage pipe 2 for discharging resist liquid and the like.
5 is connected. Further, a partition wall 26 for preventing drainage from entering the center side is provided in an annular shape on the bottom plate 22, and an exhaust pipe for exhausting the inside of the cup is provided on the bottom plate 22 inside the partition wall 26. 27 is connected.

The resist coating process is performed by the spin chuck 20.
A wafer W is placed on the wafer W, and a resist supply nozzle 62 (see FIG. 9) supplies a resist solution onto the upper surface of the wafer W, for example, drops the resist solution, and spin coating is performed by rotating the spin chuck 20. When this resist coating process is repeated many times,
The resist scattered toward the periphery of the wafer W is the outer cup 2.
3 and the surface of the inner cup 24 are laminated and attached. Therefore, the coating mechanism 17 of this embodiment includes an automated cleaning mechanism. The control program for the cleaning mechanism of the coating mechanism 17 is incorporated as a part of a control program stored in a control device (not shown) that controls the entire processing mechanism unit 10, and is driven at a predetermined location by driving the transport mechanism 12, for example, The cleaning jig 5 that has been waiting in a standby station (not shown) provided below or above the processing mechanisms 14, 15, 16 or above the alignment stage 6
0 is transported and placed on the spin chuck 20 to wash and remove the resist solution adhering to the wall surface of the cup.

As shown in FIGS. 2 and 3, the cleaning jig 50 is a disk-shaped member having a diameter substantially the same as that of the wafer W, and is arranged near the spin chuck 20 on the lower surface side of the peripheral edge portion. An annular reservoir 51 for receiving and storing the cleaning liquid L from the cleaning liquid supply nozzle 40 is formed, and the outer peripheral wall 50a of the reservoir 51 is provided with a pair of symmetrical positions with respect to the rotation center of the cleaning jig 50. A cleaning liquid ejection hole 52 (for example, diameter = 1 to 5 mm) is formed. In this case, the cleaning liquid discharge hole 52 is formed, for example, obliquely downward to the outside in the radial direction of the cleaning jig 50. A guide plate, which is a guide member for positioning the cleaning liquid L from the discharge holes 52 on the lower surface 50b of the peripheral edge portion of the cleaning jig 50 below the discharge holes 52 and changing the direction upward to scatter. 53 is provided.

The guide plate 53 has its tip portion 53a bent upward at a predetermined angle, for example, in the range of 30 to 90 degrees,
The base end portion 53b is the lower surface 50b of the peripheral portion of the cleaning jig 50.
It is rotatably provided in the horizontal direction by being pivotally mounted by a support pin 54. The upper surface of the tip portion 53a of the guide plate 53 serves as a guide surface 57 for scattering the cleaning liquid L upward. Further, as shown in FIG. 4, each guide plate 53 has its tip portion 53a side and the lower surface of the cleaning jig 50 connected by a spring 55 which is a biasing means, and the elastic force of this spring 55 cleans each guide plate 53. It is always urged to the jig 50 side. Cleaning jig 50
A groove 56 capable of receiving the tip end portion 53a of the guide plate 53 is formed on the peripheral edge lower surface 50b of the guide plate 53, so that the guide plate 53 can be stored in close contact with the peripheral edge lower surface 50b of the cleaning jig 50. Has become. The groove 56 is a guide plate 53.
It also has a function as a stopper in the biasing direction of.

The cup cleaning is performed after the resist coating process is performed a predetermined number of times, or at the beginning of the lot and the end of the lot. At that time, the cleaning jig 50, which has been standing by at a waiting station (not shown) provided above or below the alignment stage 6 and the cooling mechanism 16, is held by the main arm 13 and placed on the spin chuck 20. Place. Then, the cleaning liquid L is sprayed from the cleaning liquid supply nozzle 40 to supply the cleaning liquid L into the reservoir 51 of the cleaning jig 50. When the cleaning jig 50 is stopped rotating or is rotated at a low speed by driving the spin chuck 20, the guide plate 53 is urged by the spring 55 to clean the cleaning plate 50 as shown in FIGS. 2 to 4A. It is stored below (inside) the tool 50, and the cleaning liquid L in the reservoir 51 is discharged from the discharge hole 5
The inner cup 24
The upper surface of the is cleaned. When the cleaning jig 50 is rotated at a medium speed, the cleaning liquid L collected on the outer peripheral portion of the reservoir 51 is vigorously ejected from the discharge hole 52 due to centrifugal force, and is rotated at a higher speed. Then, the centrifugal force acting on the guide plate 53 exceeds the urging force of the spring 55, and the guide plate 53 rotates to move the cleaning jig 50 as shown in FIGS. 3 and 4B. Project outwards. Due to the protrusion of the guide plate 53, the cleaning liquid L jetted vigorously from the discharge hole 52 hits the guide surface 57 of the guide plate 53 and is reflected and scattered upward, and the upper inner surface 2 of the outer cup 23.
3a, in particular, the cleaning liquid L is effectively sprinkled even on the back surface of the top ring 37 formed so as to frame the peripheral edge of the upper end opening 36 of the outer cup 23. Upper inner surface 2 of the outer cup 23
The cleaning liquid L used for cleaning 3a flows down along the inner surface 23b thereunder, and the entire inner surface of the outer cup 23 is cleaned.

By thus projecting the guide plate 53 to the outside of the cleaning jig 50 and scattering the cleaning liquid L discharged from the discharge hole 52 upward, for example, in the vertical direction,
The cleaning liquid L can be uniformly sprayed on the back side of the top ring 37 or the like, which is conventionally difficult to clean, to efficiently perform cleaning. As a result, the generation of particles can be prevented, and the cups 23, 24 can be used during the resist coating process.
The air flow generated in the space between them can be always maintained in a stable state, and the yield can be improved.

In the above embodiment, the set of the discharge hole 52 and the guide plate 53 is provided at two places, but it may be provided at only one place. This is because the ejection from the cleaning jig 50 is rotationally scanned by the spin chuck 20, and if the number of the ejection holes 52 is reduced, the ejection flow rate of the cleaning liquid L from one ejection hole 52 can be increased. On the contrary, the discharge hole 52 and the guide plate 53
It is also possible to add more sets to three or more locations.

Further, in the above embodiment, the discharge hole 52 is formed obliquely downward so that the cleaning liquid L hits the guide surface 57 of the guide plate 53, but this may be horizontal. However, in that case, it is necessary to change the angle of the guide surface 57 of the guide plate 53 so that the cleaning liquid L can be scattered in a desired direction.

Further, in the above-described embodiment, the guide plate 53 is horizontally rotated to project and retract outside the cleaning jig 50. However, the mounting state of the guide plate 53 and the retracting mechanism thereof are not limited to this. Not something.

For example, as shown in FIG. 5, the base end of the guide plate 53 is attached as a hinge 58 to the peripheral edge of the lower surface of the cleaning jig 50 so as to be vertically rotatable (or swingable). Then, by rotating the cleaning jig 50 at a medium / high speed from the stopped state shown in FIG. 11A, the guide plate 53 is rotated by centrifugal force to the horizontal state as shown in FIG. May be. In this case, if the rotation speed of the cleaning jig 50 is lowered, the guide plate 53 returns to its original posture due to its own weight, so that no biasing means is required.

As shown in FIG. 6, a cleaning jig 50 is used.
A guide member 59 is provided at the peripheral edge of the lower surface of the cleaning jig 50 to support the guide plate 53 slidably in the radial direction of the cleaning jig 50, and the cleaning jig 50 is moved from the stopped state shown in FIG. By rotating the guide plate 53 as shown in FIG.
May be moved outward by centrifugal force. In this case, an urging means for pulling the guide plate 53 back is necessary.

Although slightly different in taste, as shown in FIG. 7, a discharge tube 60 having sufficient flexibility such as a rubber tube is connected to the discharge hole 52, and a nozzle 61 is provided at the tip of the discharge tube 60.
Is provided, and the cleaning jig 50 is rotated at a medium / high speed from the stopped state shown in FIG.
As described above, the discharge tube 60 may be horizontally extended by centrifugal force, and the cleaning liquid L may be discharged upward from the nozzle 61 at the tip.

In each of the above embodiments, the guide member is operated by the centrifugal force generated by the rotation of the cleaning jig 50. However, another guide member operating mechanism of the present invention is a guide member. Using a shape memory alloy or bimetal as the material of the cleaning jig 50, the cleaning jig 50 is attached to the cups 32, 24.
There is one in which the guide member is projected to the outside of the cleaning jig by utilizing the temperature change before and after being mounted inside. FIG. 8 shows an example in which such an operating mechanism is adopted.
A shape memory alloy (or bimetal) guide plate 63 is attached to the lower surface peripheral portion 50b with its base end fixed. This guide plate 63 is used for cleaning the cups 32, 2
At the temperature inside 4, the same shape as that of the guide plate 53 of FIGS. 4 to 6 (that is, the portion from the base end portion 63b to the tip bending portion 63a is linear) is memorized, and the cleaning jig is used. At the adjustment temperature of the alignment stage 6 and the cooling mechanism 16 in which 50 is on standby, for example, at a temperature lower than room temperature, the shape in which the portion from the vicinity of the base end portion 63b to the tip end side is bent downward by about 90 ° is stored.

Therefore, when the cleaning jig 50 is held by the main arm 13 and placed on the spin chuck 20, the temperature rises to about room temperature, and the shape of the guide plate 63 becomes
The standby shape shown in FIG. 7A automatically changes to the cleaning shape shown in FIG. In this way, when the guide plate 53 projects to the outside of the cleaning jig 50 due to the temperature change, as long as the ejection force of the cleaning liquid L from the ejection hole 52 is sufficiently obtained, the cleaning jig 50 can be moved at a high speed. The cleaning liquid L can be scattered upward for cleaning without rotating. Note that the shape of the guide plate 63 in the standby state is not limited to this example, and may be, for example, a shape bent further inward from the bent state in FIG. 8A, or a shape bent so as to be twisted in the horizontal direction. May be.

In the above embodiment, the guide plates 53, 63
Although a means utilizing centrifugal force and a temperature change has been described as means for projecting the outer side of the cleaning jig 50, other means, for example, a flow path for pressurized gas or a vacuum suction flow path in the spin chuck 20 is described. The guide plate may be formed so that it can be projected and stored.

In the above embodiment, the case where the coating apparatus is applied to the resist coating and developing apparatus has been described, but it is needless to say that the present invention can also be applied to an apparatus that performs etching solution coating processing or magnetic liquid coating cleaning processing, for example.

[0035]

As described above, according to the processing apparatus of the present invention, the following excellent effects can be exhibited. 1) According to the first application device of the present invention, the guide member is projected to the outside of the cleaning jig by centrifugal force, and the cleaning liquid from the discharge hole is applied to the guide member to scatter upward, thereby opening the container. The cleaning liquid can be uniformly sprayed to a portion such as the back side of the top ring on the peripheral edge of the portion where cleaning has been conventionally difficult, so that the cleaning can be efficiently performed. 2) According to the second processing apparatus of the present invention, since the guide member projects to the outside of the cleaning jig due to the temperature change, the cleaning treatment can be performed as long as sufficient ejection force of the cleaning liquid from the ejection hole can be obtained. Even if the tool is not rotated at a very high speed, the cleaning can be performed efficiently as in the above item 1).

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment in which the coating apparatus of the present invention is applied to a resist liquid coating and developing apparatus.

FIG. 2 is a side sectional view schematically showing the coating apparatus of the present invention.

FIG. 3 is a side sectional view showing a part of FIG. 2 in an enlarged manner.

FIG. 4 is a partial perspective view of the cleaning jig according to the present invention as viewed from the back side thereof, in which (a) is a state in which the cleaning jig is stopped or is rotating at a low speed, and (b) is a medium speed to It shows the state of high speed rotation.

5A and 5B are perspective sectional views showing another embodiment of the main part of the cleaning jig according to the present invention, where FIG. 5A is a state in which the cleaning jig is stopped or rotating at a low speed, and FIG. It shows a state of rotating at high speed or high speed.

FIG. 6 is a perspective sectional view showing another embodiment of the main part of the cleaning jig according to the present invention, where (a) is a state in which the cleaning jig is stopped or is rotating at a low speed, and (b) is the same. It shows a state of rotating at high speed or high speed.

FIG. 7 is a perspective sectional view showing a modified embodiment of the main part of the cleaning jig according to the present invention, in which (a) is a state in which the cleaning jig is stopped or is rotating at low speed, and (b) is the same. It shows a state of rotating at high speed or high speed.

FIG. 8 is a perspective sectional view showing another embodiment of the main part of the cleaning jig according to the present invention, where (a) is a state in which the cleaning jig is stopped or is rotating at a low speed, and (b) is the same. It shows a state of rotating at high speed or high speed.

FIG. 9 is a side sectional view schematically showing a conventional coating device.

FIG. 10 is a side sectional view showing a state in which the cleaning jig is attached to a conventional coating device.

[Explanation of symbols]

 20 Rotation Holding Means (Spin Chuck) 23 Container (Outer Cup) 24 Container (Inner Cup) 37 Top Ring 40 Cleaning Solution Supply Nozzle 50 Cleaning Jig 51 Reservoir 52 Discharge Hole 53 Guide Member 55 Biasing Means (Spring) 57 Guide Surface 63 Guide member (shape memory alloy or bimetal) L Cleaning liquid W Semiconductor wafer (object to be coated)

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[Procedure amendment]

[Submission date] September 27, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction content]

Next, the coating mechanism (or coating device) 17
Will be described. As shown in FIG. 2, the coating mechanism 17 has a spin chuck 20 which is a rotation holding unit that holds and rotates a wafer W (not shown in FIG. 2), and the spin chuck 20 rotationally drives the spin chuck 20. Spin motor 21
Are connected so that the spin motor 21 can control the rotation of the spin chuck 20 at a desired rotation speed. Further, the bottom plate 2 is provided on the outer periphery of the lower portion of the spin chuck 20.
2 is provided, and an outer cup 23 and an inner cup 24, which are formed in a cylindrical shape, are concentrically provided on the bottom plate 22 so as to surround the wafer W mounted on the spin chuck 20. The upper part of the outer cup 23 and the upper part of the inner cup 24 are formed to be inclined downward toward the radial outside of the spin chuck 20, and guide the scattered resist solution to the bottom plate 22. The bottom plate 22 is gently inclined, and a drain pipe 25 for discharging the resist liquid or the like is connected to the bottom of the bottom plate 22. Further, a partition wall 26 for preventing drainage from entering the center side is provided in an annular shape on the bottom plate 22, and an exhaust pipe for exhausting the inside of the cup is provided on the bottom plate 22 inside the partition wall 26. 27 is connected.

Front page continuation (72) Inventor Masatoshi Exit 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Electron Kyushu Co., Ltd. Kumamoto Plant (72) Inventor Shigeki Aoki 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Electron Kyushu shares Company Kumamoto Office

Claims (5)

[Claims] 1. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing the coating liquid supplied to the object to be scattered. In the coating device having, when cleaning the container, mounted on the rotation holding means,
The cleaning jig is provided with a cleaning liquid for cleaning and removing the coating liquid adhering to the container, and the cleaning jig has a storage part capable of storing the cleaning liquid and the storage part by rotation of the rotation holding means. And a guide member for projecting the cleaning liquid from the discharge hole upward by projecting to the outside of the jig by the centrifugal force generated by the rotation of the rotation holding means. And coating equipment. 2. The guide member has a guide surface for scattering the cleaning liquid upward at a tip end portion thereof, and a base end side thereof is rotatably supported by a lower surface of the cleaning jig. 1. The coating apparatus according to 1. 3. The guide member has a guide surface for scattering the cleaning liquid upward at a tip end portion thereof, and a base end side thereof is supported by a lower surface of the cleaning jig so as to be slidable in a radial direction. The coating device according to claim 1. 4. The coating apparatus according to claim 2, wherein the guide member is biased by biasing means and is stored under the cleaning jig. 5. A rotation holding means for holding and rotating an object to be coated, and a container provided so as to surround the rotation holding means for preventing the coating liquid supplied to the object to be scattered. In the coating device having, when cleaning the container, mounted on the rotation holding means,
The cleaning jig is provided with a cleaning liquid for cleaning and removing the coating liquid adhering to the container, and the cleaning jig has a storage part capable of storing the cleaning liquid and the storage part by rotation of the rotation holding means. And a guide member made of a shape memory alloy or a bimetal that protrudes to the outside of the jig by the temperature change and scatters the cleaning liquid from the discharge hole upward. And coating equipment.