JPH0929189A - Cleaner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize the cleaner by simplifying its structure and to improve the throughput and yield. SOLUTION: This cleaner is provided with a spin chuck 3 placed in a treating chamber 1 and horizontally rotatably holding a semiconductor wafer W and a cleaning brush 10 for cleaning the wafer W in contact with the wafer W surface. A motor 24 is connected to be fixed to the driving shaft 3a of the spin chuck 3 projecting outside the chamber 1, a cylindrical cup 6 is furnished outside the chuck 3, and the inner cup 6b of the cup 6 is vertically movably formed to surround the chuck 3 and wafer W. Consequently, the wafer W is delivered to the chuck 3 by lowering only the inner cup 6b while fixing the chuck 3 and motor 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus and a cleaning method for cleaning an object to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art As a conventional cleaning apparatus of this type, an object to be processed, for example, a semiconductor wafer is horizontally held and rotated, a cleaning liquid is supplied to the surface of the semiconductor wafer, and the cleaning apparatus is formed of, for example, nylon or mohair. A cleaning device is known in which a brush is pressed against the surface of a semiconductor wafer to remove particle contaminants on the surface.

As shown in FIG. 18, the conventional cleaning apparatus described above is provided with a rotation holding means, such as a spin chuck 141, which is arranged in a processing chamber 140 and is capable of horizontal rotation and vertical movement, and a drive for rotating the spin chuck 141. Motor 142
And a cleaning member such as a brush 143 that contacts the upper surface (front surface or back surface) of the semiconductor wafer W (hereinafter referred to as a wafer) held by the spin chuck 141 to clean the wafer W.
And a cup 144 that is vertically movable to surround the spin chuck 141 and the wafer W.

In the cleaning device thus constructed,
Spin chuck 141 and spin chuck drive motor 1
The wafer W is transferred to the spin chuck 141 by raising and lowering the cup 42 and the cup 144. Further, during cleaning, the spin chuck 141 and the drive motor 142 are lowered, and the cup 144 is raised to prevent the cleaning liquid from scattering to the outside.

Further, in the cleaning apparatus having such a configuration, the brush 143 is attached to the upper surface (front surface or back surface) of the wafer W.
A pressure adjusting mechanism 145 is provided for contacting the above in a pressurized state. As shown in FIG. 18, the pressurization adjusting mechanism 145 vertically moves an elevating part 148 connected to an elevating cylinder 147 for vertically moving the brush 143 and the brush arm 146 via a linear guide 150. The vertical wall 149 is connected to one side of the vertical wall 149 as possible.
A balance weight 152 is arranged on the opposite surface of the above through a linear guide 151 so as to be movable in the vertical direction. And
The balance weight 152 and the elevating part 148 are connected to each other via a wire 154 that is wound around a pulley 153 disposed on the top of the vertical wall 149, and the weight of the brush 143 and the brush arm 146 and the balance weight 152 are connected. The weight is balanced to adjust the zero balance, and the brush 143 is pressed against the wafer W by the pressurizing cylinder 155. The amount of pressurization in this case is controlled by the air pressure applied to the pressurizing cylinder 155.

In the conventional cleaning device of this type,
The brush 143 is configured to be selectively movable between the cleaning position and the non-cleaning position. While the brush 143 is located in the non-cleaning position and stands by, dust and the like adhering to the brush 143 is cleaned to clean the next wafer W. Is prepared for. for that reason,
As shown in FIG. 19, the conventional cleaning device has a brush 143.
The ultrasonic oscillator 157 is arranged at the bottom of the cleaning tank 156 for storing the cleaning liquid and the cleaning liquid supply nozzle 158 is arranged at the upper opening of the cleaning tank 156. With such a configuration, the cleaning liquid, for example, pure water is supplied from the cleaning liquid supply nozzle 158 to the cleaning tank 156 that accommodates the brush 143 during standby to cause the cleaning liquid to overflow from the cleaning tank 156, and the ultrasonic oscillator 157 is driven. Cleaning tank 156
It is possible to remove dust and the like adhering to the brush 143 by applying fine vibration to the cleaning liquid inside.

In this type of cleaning device, a cleaning nozzle by jet injection may be provided in combination with the brush 143. Similar to the brush 143, this jet water jet nozzle is also arranged so as to be selectively movable between a cleaning position and a non-cleaning position, and while it is waiting at the non-cleaning position, in order to prevent clogging of the nozzle, Dummy dispense required. Therefore, in the conventional case, FIG.
As shown in, a mesh 161 is stretched on the opening side of the container 160 having the drain hole 159 to prevent the mist scattered outside by the jet injection from the jet water injection nozzle 163. Further, as shown in FIG. 20B, an exhaust hole 162 is provided on the lower side of the mesh stretched portion of the container 160 to prevent mist scattered outside the container 160 during dummy dispensing.

[0008]

However, in the conventional cleaning device of this type, since the spin chuck 141 is moved horizontally and vertically, the elevating mechanism for the spin chuck 141 is provided in addition to the elevating mechanism 144A for the cup 144. Since 141 A (elevating cylinder) is required and the drive motor 142 of the spin chuck 141 also needs to be raised and lowered at the same time, there is a problem that the structure becomes complicated and the apparatus becomes large. Further, during cleaning, the cup 144 is raised to raise the spin chuck 141 and the wafer W.
To prevent the cleaning liquid from splashing to the outside,
Due to the rotation of the spin chuck 141, a vortex flow is generated on the upper surface (front surface or back surface) of the wafer W, and the vortex flow may cause the mist of the cleaning liquid to be scattered outside the cup. Therefore, there is a problem that the cleaning efficiency is reduced and the yield is reduced.

Further, the pressure adjusting mechanism 145 of the brush 143 in the conventional cleaning device of this type is, as described above,
Balance weight 152, pulley 153, wire 154
Since it is composed of the pressurizing cylinder 155 and the like, there is a problem that the structure is complicated, pressurization adjustment is difficult, the device becomes large, and the wire 154 comes off from the pulley 153.

Furthermore, the cleaning of the brush 143 on standby is
In the case where the cleaning liquid for immersing the brush 143 housed in the cleaning tank 156 is washed by ultrasonic vibration while overflowing, there is a possibility that dust and the like removed from the brush 143 may reattach to the brush 143 due to overflow. .

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cleaning device having a simple structure, a compact device, and improved throughput and yield. To do.

[0012]

In order to achieve the above object, a cleaning apparatus according to claim 1 of the present invention comprises a rotation holding means which is housed in a processing chamber and horizontally holds an object to be processed. Assuming a cleaning device including a cleaning unit that contacts the upper surface of the object to be processed and cleans the object to be processed, the drive unit is connected and fixed to the drive shaft of the rotation holding unit protruding outside the processing chamber, and the rotation is performed. A cylindrical container is provided outside the holding means, and the container is formed so as to be movable in the vertical direction so as to surround the rotation holding means and the object to be processed.

According to a second aspect of the present invention, there is provided a cleaning device, which is housed in a processing chamber and holds the object to be horizontally rotated, and a cleaning means for contacting an upper surface of the object to clean the object. On the premise of a cleaning device including: a cylindrical container for surrounding the rotation holding means and the object to be processed, and a taper surface narrowing inwardly on the inner surface of the upper end opening of the container. In the processing chamber, an air supply port is provided at the center of the ceiling, a plurality of ventilation holes are provided near the inside of the container at the bottom, and these ventilation holes are communicated with an exhaust means. Characterize.

According to a third aspect of the present invention, there is provided a cleaning device which is housed in a processing chamber and holds a target object to be horizontally rotated, and a cleaning means for contacting an upper surface of the target object to clean the target object. Assuming that the cleaning device is provided with the above-mentioned cleaning means, the cleaning means is formed so as to be movable in the horizontal direction so as to be selectively moved to the cleaning position and the non-cleaning position, and to be movable in the vertical direction. On the moving side, a pressure adjusting mechanism for applying the cleaning means to the object to be processed with a predetermined elastic pressure is provided.

A cleaning device according to a fourth aspect is the cleaning device according to the third aspect, wherein the cleaning means includes a cleaning member that comes into contact with the surface of the object to be processed, and a horizontal member that holds the cleaning member so as to be movable in the horizontal direction. A moving means and a vertical moving means for moving the cleaning member and the horizontal moving means in a vertical direction,
The pressure adjusting mechanism includes a connecting portion that connects the vertical moving unit, the cleaning unit, and the horizontal moving unit so as to be vertically movable.
It is characterized in that it is composed of a vertical moving means and a spring member installed between the cleaning member and the horizontal moving means in the connecting portion.

According to a fifth aspect of the present invention, there is provided a cleaning apparatus, which is housed in a processing chamber and holds the object to be horizontally rotated, and a cleaning means for contacting an upper surface of the object to clean the object. On the premise of a cleaning apparatus including: a cleaning tank for selectively moving the cleaning means between a cleaning position and a non-cleaning position, and a cleaning tank for accommodating a cleaning member of the cleaning means at the non-cleaning position; And a nozzle for injecting the cleaning liquid toward the cleaning unit.

According to another aspect of the cleaning apparatus of the present invention, a processing chamber having an opening for loading and unloading an object to be processed, an opening / closing means for opening and closing the opening of the processing chamber, and the processing chamber housed in the processing chamber. A rotation holding means for holding the processing body and rotating in the horizontal direction, a cylindrical container movable in the vertical direction so as to surround the rotation holding means and the processing target, and the rotation holding means are held. Cleaning means for contacting the upper surface of the object to be cleaned and cleaning the object, horizontal moving means for selectively moving the cleaning means between a cleaning position and a non-cleaning position, and a member for holding the object to be processed and And a transfer unit that can move back and forth and move in the vertical direction with respect to the processing chamber through the opening. In this case, the driving means for the opening / closing means and the elevating / lowering means for the container may be provided separately, but it is preferable to perform the opening / closing operation of the opening / closing means and the elevating / lowering operation of the container by the same driving means.

According to a seventh aspect of the present invention, there is provided a cleaning apparatus, in which the object to be processed housed in the processing chamber is horizontally rotatably held, and the cleaning is performed by contacting the upper surface of the object to be cleaned. The cleaning means is characterized by including a brush member for surface cleaning, in which a plurality of cylindrical sponge columns are provided on a substrate in a point-symmetrical manner.

According to the eighth aspect of the present invention, there is provided a cleaning device for cleaning the object to be processed which is housed in the processing chamber so that the object to be processed is horizontally rotatably held, and the upper surface of the object to be contacted is cleaned. On the premise of a cleaning device including a cleaning means, the cleaning means includes a back surface cleaning brush member in which a sponge body and a brush body harder than the sponge are alternately provided on the substrate in the circumferential direction. Characterize.

According to the cleaning apparatus of the first aspect, the drive means is connected and fixed to the drive shaft of the rotation holding means protruding to the outside of the processing chamber, and the container disposed outside the rotation holding means is rotated and held. By forming the processing object so as to be movable in the vertical direction, when the processing object is delivered to the rotation holding means, only the container can be lowered while the rotation holding means and the driving means are fixed, and the processing object can be processed. The delivery time before and after washing the body can be shortened.

According to the cleaning apparatus of the second aspect, the air flowing into the processing chamber from the air supply port at the center of the ceiling can be exhausted from the ventilation hole along the tapered surface and the inner side surface of the container. The mist can be discharged with this air flow. Therefore, it is possible to prevent the mist of the cleaning liquid from scattering outside the container.

According to the cleaning device of claims 3 and 4,
It is possible to adjust the pressure applied to the surface of the object to be processed by the cleaning means by urging the elastic force. For example, the pressing force can be adjusted by setting the spring constant of the spring member to a predetermined value.

According to the cleaning device of the fifth aspect, the cleaning liquid is sprayed from the nozzle projecting into the cleaning tank toward the cleaning portion of the cleaning means to remove dust and the like adhering to the cleaning means in the standby mode. can do.

According to the cleaning apparatus of the sixth aspect, the opening / closing means is driven to open the opening, and the conveying means for entering the processing chamber is moved up and down while the container is lowered, thereby performing the treatment. The body can be handed over to the rotation holding means, and after the cleaning means is moved to the cleaning position on the upper surface (front surface or back surface) of the object to be processed in the state where the container is lowered, the container is raised to perform the cleaning treatment. It can be performed.

According to the cleaning device of the seventh aspect, since the surface cleaning brush member comprising a plurality of cylindrical sponge pillars provided in a point-symmetrical manner on the substrate is used, dust can be taken in favorably and water It is possible to perform cleaning in which the film is well removed and the water film is not deteriorated even if the swivel angle of the brush member with respect to the object is changed.

According to the cleaning apparatus of the eighth aspect,
Since a back surface cleaning brush member in which a sponge body and a brush body harder than the sponge body are alternately provided on the substrate in the circumferential direction is used, the brush member is rotated and revolved to contact the back surface of the object to be cleaned. At this time, dust that cannot be taken in by the brush body can be taken in by the sponge body.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the cleaning apparatus of the present invention is applied to a semiconductor wafer cleaning apparatus will be described.

FIG. 1 is a schematic plan view of the cleaning apparatus of the present invention,
2 is an enlarged cross-sectional view of the portion A, FIG. 3 is a side cross-sectional view of FIG. 2, and FIG. 4 is an exploded perspective view of a main part of the cleaning device.

The cleaning apparatus described above includes a processing chamber 1 having an opening 1a for loading and unloading an object to be processed, for example, a semiconductor wafer W (hereinafter referred to as a wafer) in a side wall, and opening and closing the opening 1a of the processing chamber 1. The shutter member 2 (opening / closing means) that shuts off as much as possible, the rotation holding means such as the spin chuck 3 that is housed in the processing chamber 1 and holds the wafer W, and the spin chuck 3 and the wafer W held on the spin chuck 3. A cylindrical container surrounding the periphery, for example, a cup 6, and a cleaning brush 10 as a cleaning unit that removes particulate contaminants on the front surface of the wafer W together with the cleaning liquid supplied in contact with the upper surface (front surface or back surface) of the wafer W. , A transfer means that holds the wafer W and transfers the wafer W to and from the spin chuck 3 in the horizontal X and Y directions, the rotation (θ) direction, and the vertical (Z) direction, for example, a transfer arm. Become comprises a door. In addition to the cleaning brush 10, the cleaning device is provided with a nozzle 19 for jetting jet water, for example.

The spin chuck 3 has a vacuum suction hole (not shown) on its upper surface and communicates with a vacuum device (not shown) via a passage 3b and a seal portion 5 which communicate with the vacuum suction hole provided in the drive shaft 3a. Then, the wafer W is
Can be held on the upper surface. Further, the motor 4 fixed to the outside of the processing chamber 1 is attached to the drive shaft 3 a of the spin chuck 3 protruding from the bottom of the processing chamber 1.
Are connected, and the spin chuck 3 is driven by the motor 4.
Is configured to be rotatable.

The cup 6 is a cylindrical outer cup 6a which is provided so as to stand upright on a bottom plate 8 which is erected and fixed to the bottom of the processing chamber 1, and an inner cup of the outer cup 6a which is vertically arranged. It is composed of a movable inner cup 6b. In this case, the inner cup 6b has a taper surface 6d that narrows inward toward the upper end opening side of the cylindrical base portion 6c, and has an inward flange portion 6e at its tip. In this inner cup 6b, a lifting rod 6g is attached to a mounting portion extending from a lower end of a cylindrical base portion 6c via a bracket 6f,
A piston rod 7a of an elevating cylinder 7 arranged in a hanging manner outside the lower end of the processing chamber 1 is connected to the elevating rod 6g via a connecting member 6h. Therefore, the inner cup 6b moves up and down by driving the elevating cylinder 7, surrounds the spin chuck 3 and the outer side of the wafer W when rising, and the upper end of the inner cup 6b can be positioned below the spin chuck 3 when descending. It has become. Since the gap generated between the bottom plate 8 and the lower end of the inner cup 6b when the inner cup 6b is lifted is configured to be closed by the outer cup 6a, the cleaning liquid used for cleaning is not supplied to the outside of the cup 6. Can be prevented from flowing into.

In this case, the shutter member 2 is attached to the connecting member 6h so that the shutter member 2 can be opened and closed by driving the lifting cylinder 7. Therefore, by driving the lifting cylinder 7, the lifting operation of the inner cup 6b and the opening / closing operation of the shutter member 2 can be performed at the same time.

An air supply port 1b formed by a large number of concentric small holes is provided at the center of the ceiling of the processing chamber 1, while the inner cup 6b of the bottom plate 8 is provided.
A large number of concentric vent holes 8a are formed in the vicinity of the inside of the vent hole 8a. The vent holes 8a communicate with a drainage / exhaust means (not shown) through a drain provided at the bottom of the processing chamber 1 and an exhaust port 1c. Has been done. With such a configuration, the air flowing from the air supply port 1b into the processing chamber 1 is prevented from flowing into the inner cup 6
It flows along the tapered surface 6d of b and the inner side surface of the inner cup 6b, and is exhausted from the exhaust port 1c through the ventilation hole 8a. Therefore, the mist of the cleaning liquid generated at the time of cleaning can be discharged to the outside by this air flow, and the mist of the cleaning liquid can be prevented from being scattered to the outside of the cup 6 by the vortex flow generated by the rotation of the spin chuck 3.
In this case, as shown in FIG. 4, the processing chamber 1 is made of a synthetic resin processing chamber main body 1A having corrosion resistance and chemical resistance such as vinyl chloride or polypropylene, and the upper portion of the processing chamber main body 1A is closed. It is integrally molded with the cover member 1B made of synthetic resin.

On the other hand, as shown in FIGS. 3 to 5, the cleaning brush 10 is connected to a horizontal rotating means 11 and a vertical moving means 12 via a pressure adjusting mechanism 13 such as a horizontal moving means such as a brush arm 10a. And a cleaning member, such as a brush member 10b, which is rotatably mounted on the free end of the brush arm 10a. In this case, the timing belt 14d is wound around the drive pulley 14b mounted on the drive shaft 14a of the motor 14 mounted on the base end side of the brush arm 10a and the driven pulley 14c mounted on the mounting shaft 10c mounting the brush member 10b. The brush member 10b is configured to rotate in the horizontal direction (rotate about a vertical axis) by driving the motor 14. When cleaning the surface of the wafer W, it is preferable that the brush member 10b of the cleaning brush 10 should not rotate. The reason is that the film quality on the wafer surface is not damaged.

A cleaning liquid receiving portion 10d is provided in the shape of a cylindrical container on the upper portion of the mounting portion of the brush member 10b of the mounting shaft 10c, and a cleaning liquid such as pure water is supplied from the cleaning liquid supply pipe 10e toward the cleaning liquid receiving portion 10d. The cleaning liquid is supplied to the brush member 10b and passed through a not-shown flow passage provided at the bottom of the cleaning liquid receiving portion 10d to be used for cleaning the wafer W. The mounting shaft 10c is inserted into a sleeve 10f vertically provided on the lower portion of the brush arm 10a on the free end side, and is freely rotatable via a pair of bearings 10g interposed between the sleeve 10f and the sleeve 10f. It is supported. Dust generated by the bearing 10g in the sleeve 10f is sucked by the tube 10h protruding into the sleeve 10f.

On the other hand, the pressure adjusting mechanism 13 is shown in FIGS.
As shown in FIG. 1, the shaft 13 is rotated by the horizontal rotating means 11 and is moved up and down by the vertical moving means 12.
A linear guide 13d (connecting portion) that movably connects the rotating / elevating member 13b connected to a and the mounting member 13c that hangs to the lower portion on the base end side of the brush arm 10a in the vertical direction, and this connecting portion. A spring member 13f, which is an elastic member, is provided between the mounting member 13c of 13d and the bracket 13e protruding from the rotation / elevation member 13b. According to the pressure adjusting mechanism 13 configured as described above, the weight of the cleaning brush 10 and the brush arm 10a can be received by the spring member 13f and balanced.
When adjusting the amount of pressurization, it is only necessary to adjust the lowest point when the brush arm 10a descends. That is, when the brush arm 10a descends, xm is higher than the height of the upper surface of the wafer W.
Assuming that the cleaning brush 10 is adjusted to a position where the cleaning brush 10 moves downward, the cleaning brush 10 actually hits the wafer W and does not move further downward. Therefore, since the spring member 13f extends xmm, the pressurization amount F is given by F = k × x. However, k is a spring constant. Since the spring characteristic of the cleaning brush 10 works, the amount of pressurization can be adjusted within a certain allowable range. As described above, by using the pressure adjusting mechanism 13 using the pressure due to elasticity, the structure can be simplified as compared with the conventional pressure adjusting mechanism using the balance weight, the pulley, the wire, the pressure cylinder, and the like. In addition, the pressure adjustment can be easily performed. As the elastic body, the coil-shaped spring member 13 is used.
In addition to f, a plate-shaped spring material, rubber or the like can be used.

A stopper bearing 15 for restricting the lowest point of the brush arm 10a is attached to the bracket 13e projecting from the rotating / elevating member 13b. This stopper bearing 15 is a brush arm 10a.
Is formed so as to be rollable on a guide surface 15a which is concentric with the horizontal center of rotation, and rolls on the guide surface 15a along with the rotating / elevating member 13b which is rotated by forward and reverse rotation drive of the horizontal rotating means 11. Then, the brush arm 10a and the cleaning brush 10 can be moved to the standby position of the cleaning position and the non-cleaning position.

In this case, the horizontal rotating means 11 includes a motor 11a and a timing belt 11d which is wound around a drive pulley 11b mounted on the drive shaft of the motor 11a and a driven pulley 11c mounted on the shaft 13a. It is configured. The vertical moving means 12 is formed by a ball screw mechanism.

At the standby position of the cleaning brush 10, a brush cleaning section 16 for cleaning the cleaning brush 10 is provided. As shown in FIG. 5, the brush cleaning section 16 has a cleaning tank 16a for accommodating the cleaning brush 10 and a cleaning brush 1 protruding from the vicinity of the opening of the cleaning tank 16a from above.
It is composed of a nozzle 16b for injecting a cleaning liquid, for example, pure water, toward the root side of 0. In this case, a drainage passage 16c is provided at the bottom of the cleaning tank 16a.
An unillustrated drainage pipe is connected to c. Further, an L-shaped cleaning liquid supply passage 16d having an opening at a lower end and a side end is provided at a lower portion of the cleaning tank 16a, and a cleaning liquid supply pipe (not shown) is connected to a lower end of the cleaning liquid supply passage 16d.
A tube 16 for supplying the cleaning liquid to the nozzle 16b at the side end
e is connected.

The brush cleaning section 16 configured as described above
In order to clean the cleaning brush 10, the cleaning brush 10 moved to the standby position is housed in the cleaning tank 16a, and the cleaning brush 10 is rotated. The dust and the like adhering to the cleaning brush 10 are cleaned and removed by spraying the cleaning liquid. Therefore, the removed dust or the like is drained through the drainage passage 16c and does not adhere to the cleaning brush 10 again.

On the other hand, a trumpet-shaped drain cup 17 facing the jet port of the jet water jet nozzle 19 is arranged in the standby portion of the jet water jet nozzle 19. As shown in FIG. 6, the drain cup 17 has a horizontal portion 1 which is connected to a mounting base portion 17b having a horizontal drainage passage 17a.
7c and the horizontal portion 17c are connected to each other via a drainage pipe 17e having an inclined portion 17d rising upward in an acute angle. By forming the drain cup 17 in a trumpet shape in this manner, the jet water jetted from the jet water jet nozzle 19 during the dummy dispensing can be effectively guided to the drainage passage 17a side, so that it is scattered around. Instead, it can be received in the drain cup 17 and drained to the outside through the drainage pipe 17e and the drainage passage 17a. Therefore, it is not necessary to dispose a mesh or the like for preventing the mist from scattering in the drain cup as in the conventional case, and the dummy dispense for preventing the clogging of the jet water injection nozzle 19 can be performed with a simple structure.

A rinse liquid supply nozzle 18 is arranged at an upper position on the opposite side of the processing chamber 1 from the opening 1a.
The rinse liquid supply nozzle 18 is for supplying the rinse liquid to the surface of the wafer W after cleaning by the cleaning brush 10 and cleaning with jet water to remove the residue and the cleaning liquid on the wafer W.

Next, the operation mode of the cleaning apparatus of the present invention will be described. Here, the case of cleaning the surface of the wafer W will be described.

First, the elevating cylinder 7 is driven to lower the shutter member 2 to open the opening 1a of the processing chamber 1 and, at the same time, lower the inner cup 6b. Next, a transfer arm (not shown) holding the wafer W enters the processing chamber 1, is positioned on the spin chuck 3, and then descends to mount the wafer W on the spin chuck 3, and the spin chuck 3 is vacuumed. The wafer W is held by suction. At this time, the transfer arm 9 retracts at the lowered position and retracts outside the processing chamber 1.

Simultaneously with the retreat of the transfer arm 9, the horizontal rotation means 11 is driven to rotate (turn) the brush arm 10a.
Then, the cleaning brush 10 is moved, for example, above the central position of the wafer W, and then the vertical movement means 12 is driven to lower the brush arm 10a to a predetermined position to move the cleaning brush 10 onto the upper surface of the wafer W, that is, a predetermined set pressure. Press with.
At this time, the shutter member 2 rises to close the opening 1a, and at the same time, the inner cup 6b rises to surround the wafer W and the spin chuck 3.

Then, the wafer W rotated by the rotation of the spin chuck 3 and the cleaning brush 10 rotated by the drive of the brush rotating motor 14 and horizontally moved by the rotation of the brush arm 10a are relatively moved (for example, the wafer W). The cleaning liquid is supplied from the cleaning brush 10 side while moving from the center to the outer peripheral direction or the diameter direction of the wafer W) to remove the particulate contaminants on the surface of the wafer W. After performing this brush cleaning, if necessary, cleaning with jet water is performed, and thereafter, a rinse liquid is supplied from the rinse liquid supply nozzle 18 to remove residues on the surface of the wafer W and the cleaning liquid, and then the spin chuck 3 is rotated. Shake off and dry.

After cleaning the wafer W as described above, the cleaning brush 10 returns to the standby position and is cleaned by the brush cleaning section 16 to prepare for the next cleaning. In addition, the jet water injection nozzle 19 returns to a position facing the opening of the drain cup 17 and performs dummy dispensing. Further, after the cleaning process, the shutter member 2 descends to open the opening 1a, and at the same time, the inner cup 6b descends to unwrap the wafer W. Then, the transfer arm 9 moves below the wafer W and rises to receive the wafer W, and then retreats to transfer the wafer W out of the processing chamber 1 to complete the cleaning process.

The cleaning apparatus constructed as described above is used not only as a single apparatus but also as a built-in apparatus for coating / developing a semiconductor wafer, which will be described later.

As shown in FIG. 7, the semiconductor wafer coating / developing apparatus automatically processes the wafer W in the processing mechanism unit 30 in which a processing mechanism for performing various processes on the wafer W is arranged. A main part is constituted by a loading / unloading mechanism 20 for loading / unloading into / from.

The carry-in / carry-out mechanism 20 is used for the unprocessed wafer W.
, A wafer carrier 22 for storing the processed wafer W, an arm 23 for holding the wafer W, and the arm 23 for X, Y (horizontal), Z (vertical) and θ (rotation). A moving mechanism 24 for moving in a direction,
Wafer W is aligned and processing mechanism unit 30
And an alignment stage 25 for transferring the wafer W to and from.

The processing mechanism unit 30 is provided with a transfer mechanism 32 which is movable along a transfer path 31 formed in the X direction from the alignment stage 25. The transfer mechanism 32 has Y, Z and θ directions. The transfer arm 9 is provided so as to be movable. On one side of the transport path 31,
Adhesion processing mechanism 34 for performing adhesion processing for improving the adhesion between wafer W and the resist film
A pre-baking mechanism 35 for heating and evaporating the solvent remaining in the resist applied to the wafer W, and a cooling mechanism 36 for cooling the heat-treated wafer W are arranged. Further, on the other side of the transfer path 31, a processing liquid coating mechanism 37 for coating a resist on the surface of the wafer W and a wafer W are provided.
And a cleaning device 38 according to the present invention for cleaning the particle contaminants adhering to the surface of the.

In the semiconductor wafer coating / developing apparatus configured as described above, first, the unprocessed wafer W is transferred to the wafer carrier 2 by the arm 23 of the loading / unloading mechanism 20.
1 is carried out and placed on the alignment stage 25. Next, the wafer W on the alignment stage 25
Is held by the transfer arm 9 of the transfer mechanism 32, transferred to the cleaning device 38 for cleaning processing, and then transferred to the processing mechanisms 34 to 38 for appropriate processing. Then, the processed wafer W is returned to the alignment stage 25 by the transfer arm 9, further transferred by the arm 23, and stored in the wafer carrier 22.

In the above embodiment, the case where the spin chuck 3 is of the vacuum suction type has been described. However, the holding method does not necessarily have to be the vacuum suction type.
A Bernoulli chuck mechanism for holding the wafer W by using a negative pressure generated by supplying a fluid such as a gas such as gas or air or a liquid such as pure water may be used, or a mechanical type wafer using a link mechanism or the like. Of course, it can be applied to a cleaning device provided with a holding mechanism. By using the Bernoulli chuck mechanism and the mechanical type wafer holding mechanism, the back surface cleaning of the wafer W can be similarly performed instead of the front surface cleaning. In addition, in the above-described embodiment, in addition to the cleaning brush 10, the jet water jet nozzle 1
Although the cleaning device provided with 9 has been described, a megasonic (ultrasonic) cleaning unit may be provided instead of the jet water jet nozzle 19.

When the above-mentioned cleaning is divided into cleaning for the front surface side of the wafer (cleaning on the front surface side) and cleaning for the rear surface side of the wafer (cleaning for the back surface side), brush rotation is performed during the front surface cleaning. It is preferable that the brush member 10b, which is the cleaning member, is not rotated (rotated) by the driving of the cleaning motor 14, but the cleaning brush 10 is horizontally moved as the brush arm 10a rotates. This is because the cleaning on the front surface side is very delicate, and if the brush member 10b, which is the cleaning member, rotates, it may affect the film quality of the wafer.

Therefore, when cleaning the front surface side, the cleaning brush 10 is revolved relative to the wafer (for example, the wafer W).
The cleaning liquid is supplied from the cleaning brush 10 side while moving from the center to the outer peripheral direction or the diameter direction of the wafer W) to remove the particulate contaminants on the surface of the wafer W. On the other hand, in the case of the back surface side cleaning, even if the brush member 10b, which is the cleaning member, rotates, the degree of affecting the film quality of the wafer is small.
Therefore, at the time of cleaning on the back surface side, the brush member 10b, which is a cleaning member, is rotated by the drive of the brush rotation motor 14, and the cleaning liquid is moved from the cleaning brush 10 side while relatively revolving with the rotation of the brush arm 10a. To remove particulate contaminants on the back surface of the wafer W.

Next, in consideration of which of the vacuum chuck system and the mechanical system (including the Bernoulli chuck system) of the wafer holding mechanism should be adopted for the spin chuck 3, since the mechanical system grasps the edge of the wafer, However, the vacuum suction method may affect the film quality on the suction side of the wafer.

Therefore, either (1) a vacuum adsorption type chuck is used for the front side cleaning and a mechanical type chuck is used for the back side cleaning, or (2) the front side cleaning and the back side cleaning. In both cases, a mechanical chuck is used. However, in the case where both the front surface side and the back surface side are held by mechanical chucks for cleaning, the back surface side cleaning is performed first and the front surface side cleaning is finally performed. Thus, if the back surface side cleaning is performed first and then the front surface side cleaning is performed, the degree of affecting the film quality on the front surface side is less than that in the case where the front surface side cleaning is performed first and the back surface side cleaning is finally performed. Because.

Next, another embodiment of the cleaning means, that is, the cleaning brush 10 according to the present invention will be described.

FIG. 8 is a plan view showing the main part of the brush member 40 for surface cleaning. The surface-cleaning brush member 40 is formed on a plastic substrate 41 having chemical resistance.
For example, a plurality of cylindrical sponge columns 42 made of polyvinyl alcohol or polypropylene are provided in point symmetry. In this embodiment, the sponge columns 42 are
6 in point symmetry with respect to the center point and 1 in the center for a total of 7
Individual pieces are arranged, and an appropriate gap 43 is formed between these sponge columns 42. In this case, for example, each sponge column 42 has a diameter a of 7 mm, a length b of 5 mm, a thickness d of 3 mm, and is mounted on a plastic substrate 41 having a diameter of 30 mm.

The surface cleaning brush member 40 as described above, for example, as shown in FIG. 10, is prepared from a so-called staggered sheet 44, which is a ready-made product in which a large number of sponge columns 42 are arranged in a staggered pattern on a plastic substrate 41. It can be obtained by cutting a portion having seven sponge columns corresponding to FIG.

Since the surface cleaning brush member 40 constructed as described above has a plurality of sponge columns 42 made of columnar sponge, it is similar to the case where the area of the substrate 41 is columnar or donut-shaped. Moreover, the uptake of dust etc. is good. Moreover, since the appropriate gaps 43 are formed between the sponge columns 42, dust or the like is floated as compared with the case where the columnar or donut-shaped bristles are planted or sponges are arranged in the entire area of the substrate 41. The water film being released is good. The goodness of the water film is determined by the horizontal movement position of the brush arm 10a, that is, the turning angle (the brush member 4).
It does not change even if the revolution position of 0) α changes.

FIG. 11 shows the relationship between the turning angle α of the brush arm 10a and the goodness of the water film coming off the sponge column 42. At the beginning, the brush member 40 at the position of the swirl angle α1 is a barrier against the flow L of the water film by the tip 42a of the sponge column 42, but between the sponge columns 42b and 42c on both sides thereof. The flow path is secured and the water film flow L
Will pass through the spaces between the sponge columns 42 and exit rearward. During this time, dust or the like is floated on the water film and washed away. next,
When the brush member 40 turns to the position of the turning angle α2,
The sponge columns 42a and 42b on the tip end side act as a barrier, but a flow path is secured between them, and the flow L of the water film passes between the sponge columns 42 and escapes backward. During this time, dust or the like is floated on the water film and washed away.

In this way, the rotation angle α of the brush arm 10a is
Even if the water temperature changes, the water film still keeps coming out.

Next, FIG. 12 shows a brush member 44 for surface cleaning.
The following shows a modified example. The brush member 44 for surface cleaning has a plurality of cylindrical sponge columns 44a having a large diameter and cylindrical sponge columns 44b having a small diameter on a substrate 41 made of, for example, plastic having chemical resistance similar to the above. It consists of points symmetrically arranged. In this embodiment, four large-diameter sponge columns 44a are arranged point-symmetrically with respect to the center point, and one in the center, five in total, and four small-diameter sponge columns 44b are arranged symmetrically with respect to the center point. The sponge pillars 44a and 44b are individually arranged and a proper gap 43 is formed between them.
The number and arrangement form of 44b are not limited to this. The sponge columns 44a and 44b are made of polyvinyl alcohol or polypropylene.

Generally, in order to improve the trapping efficiency for dust and the like, it is considered that it is better to reduce the diameter of the sponge pillars on the substrate 41 and increase the number of sponge pillars. However, as the diameter of the sponge pillars 42 becomes smaller. "Twist" is likely to occur. When the “spray” occurs in the sponge column, the sponge column can take in dust and the like, but there is a possibility that the dust and the like taken in the sponge column will come out due to the vibration due to the “spray”.

However, the brush member 4 for cleaning the surface of FIG.
In No. 4, since the large-diameter columnar sponge column 44a and the small-diameter columnar sponge column 44b are mixed to strengthen the rigidity of the small-diameter columnar sponge column 44b, "wrinkle" does not occur. It can be reduced.

Next, the back surface cleaning brush will be described. FIG. 13 is a plan view showing a main part of the brush member 50 for cleaning the back surface. The brush member 50 for cleaning the back surface is provided with a sponge body 52 made of polyvinyl alcohol or polypropylene on the surface of a substrate 51 made of, for example, a plastic having chemical resistance, and a notch groove 53 is formed in the sponge body 52. Four sectors 52a, 52b,
52c, 52d divided into notches 53 for each radius
Two brush bodies 54 each made of a material harder than the sponge, for example, polypropylene, are arranged in such a size that the flow paths remain on both sides thereof.

FIG. 14 is a plan view showing a modified example of the back surface cleaning brush member 50. This is provided with a sponge body 55 made of polyvinyl alcohol or polypropylene so as to be spirally wider from the center and radially outward, and between the sponge bodies 55 and 55 spirally and radially outwardly wider. In the groove 56 formed in
Brush bodies 57 made of polypropylene, for example
2 are arranged in such a size that the flow paths remain on both sides thereof.

When the back surface cleaning brush member 50 is constructed as described above, when the back surface cleaning brush member 50 is rotated, dust or the like can be efficiently floated by the brush bodies 54 or 57. 52d
Alternatively, it can be reliably captured by the sponge body 55. Therefore, a high removal rate of dust and the like can be obtained.

As described above, the front surface cleaning brush members 40 and 44 of FIG. 8 or 12 are used for the front surface cleaning, and the back surface cleaning brush members of FIG. 13 or 14 are used for the back surface cleaning. 50 is used.

Specifically, (1) In the case of the cleaning method in which the vacuum suction type chuck is used for the front side cleaning and the mechanical type chuck is used for the back side cleaning, the following is performed. That is, when cleaning the surface side, the surface cleaning brush member 40 of FIG.
The cleaning liquid is supplied from the brush members 40, 44 side while relatively rotating the 44 around the revolution (for example, moving from the center of the wafer W to the outer peripheral direction or the diameter direction of the wafer W) to remove the particulate contaminants on the surface of the wafer W. To do. Then, after inverting the front and back of the wafer by a reversing device (not shown), the back side cleaning is started. In this backside cleaning, the wafer fixed by the mechanical chuck is removed from the wafer shown in FIG.
The cleaning liquid is supplied from the brush member 50 side while rotating the back surface cleaning brush member 50 of 4 on its own axis and relatively revolving to remove the granular contaminants on the back surface of the wafer W.

On the other hand, (2) When a chuck of the canical type is adopted for both the front surface side cleaning and the back surface side cleaning, the following is performed. That is, at the time of the back surface side cleaning performed first, the back surface cleaning brush member 50 of FIG. 13 or 14 is rotated with respect to the wafer W fixed by the mechanical chuck as shown in FIGS. The cleaning liquid is supplied from the brush member 50 side while relatively revolving, and the particulate contaminants on the back surface of the wafer W are removed. Then, after the wafer is turned upside down by the turning device, the front side cleaning is started. In this front surface side cleaning, the front surface cleaning brush member 4 of FIG. 8 or 12 is applied to the wafer W fixed by the mechanical chuck as shown in FIG. 15 to FIG.
The cleaning liquid is supplied from the side of the brush members 40 and 44 while moving the orbits 0 and 44 relative to the revolution (for example, moving from the center of the wafer W to the outer peripheral direction or the diameter direction of the wafer W) to remove the particulate contaminants on the surface of the wafer W. Remove.

Next, a semiconductor wafer cleaning apparatus equipped with a mechanical spin chuck will be described with reference to FIGS. The spin chuck 61 is
A rotary plate 65 that is horizontally connected to the upper end of a hollow cylindrical rotary shaft 64 that is rotated by a drive motor (not shown), a suction holding mechanism 70 that holds the wafer W on the rotary plate 65 in a horizontal state, and a spin chuck. The auxiliary holding mechanism 75 holds the wafer W at the time of start-up acceleration and stop deceleration 61, and a supply passage 63 for the cleaning treatment liquid intrusion prevention gas (N 2 gas) is provided in the hollow portion of the rotating shaft 64. It is provided.

The suction holding mechanism 70 is a holding mechanism for holding the wafer W when the spin chuck 61 is rotating at a low speed and stopped, and is mounted on a holding claw 71 which is erected around the rotating plate 65 at appropriate intervals. The wafer W is horizontally held by utilizing the negative pressure generated on the back surface side of the placed wafer W. That is, the wafer W is suction-held by the negative pressure generated by supplying the N2 gas from the supply passage 63 through the passage 65a provided in the rotary plate 65.

The auxiliary holding mechanism 75 includes a rotating body 76 rotatably disposed on the outer periphery of a rotating portion 64a fixed to the rotating shaft 64 with a bearing 64b interposed therebetween, and the rotating body 7
A spring 77 for biasing the elastic force of 6 to a neutral position of forward and reverse rotations is pivotally attached to the rotation shaft side so as to be swingable, and one end thereof is rotatably and slidably engaged with the rotating body 76, and , And a holder 78 having two wafer W pressing portions 79a and 79b at the other end.

In this case, the arcuate groove 7 concentric with the center of rotation is formed on the upper surface of the rotating body 76 disposed below the rotating plate 65.
6a is provided, a base point pin 72 penetrating the rotary plate 65 is projected into the arcuate groove 76a, and springs 77 are contracted on both sides of the base point pin 72.
Therefore, the elastic force of the spring 77 causes the rotor 7 to rotate.
The neutral position of forward and reverse rotation of 6 is maintained.

The holding body 78 is formed of a plate member pivotally mounted on a fulcrum pin 73 vertically provided on the rotary plate 5 and swingable in the horizontal direction. A slit 78a is provided at one end of the holding body 78, that is, an end portion on the rotation center side, and a pin 74 projecting from the rotating body 76 is rotatably and slidably engaged in the slit 78a. In addition, the holder 78
At the other end on the outer peripheral side, two pressing portions 79a, 79b that abut on and engage with the side end surface of the wafer W are erected. The pressing portions 79a and 79b are loosely fitted in arcuate guide holes 65b provided on the outer peripheral portion of the rotary plate 65. The holder 78 configured as described above is provided with 120 in the circumferential direction of the rotary plate 65.
They are installed at intervals of degrees.

In the above structure, when cleaning the wafer W, first, the wafer W transferred by a wafer transfer arm (not shown) is temporarily placed on the flange portion 71a of the holding claw 71, and then the wafer transfer arm. Is moved downward and retracted from the spin chuck 61. Next, when N2 gas is supplied from the N2 gas supply source into the N2 gas supply passage 63 of the rotating shaft 64, the N2 gas is supplied from the N2 gas supply passage 63 to the passage 6.
Since it is supplied to the back surface of the wafer W through 5a and flows in the outer peripheral direction, a negative pressure is generated on the back surface side of the wafer W by the Bernoulli effect, and the negative pressure attracts and holds the wafer W on the spin chuck 61 side. When the rotary shaft 64 is rotated in this state, the holder 78, which was positioned in the radial direction of the rotary plate 65 at the time of stop, is changed to the holder 78 as shown in FIG.
The rotation shaft side end of the wafer moves in a direction opposite to the rotation direction (counterclockwise) due to inertia and rotates counterclockwise, so that one pressing portion 79a abuts and engages with the side end of the wafer W. , Hold the wafer W. Then, when the rotation speed of the rotating shaft 64 reaches a constant value, the inertial action is reduced, and the holding body 78 is returned to the neutral position by the urging force of the spring 77, and the pressing portion 7 is pressed.
Although the holding of the wafer W by 9a is released, the wafer W is held by suction by the suction holding mechanism 70 described above.

With the wafer W held horizontally as described above, a drive motor (not shown) drives the rotary shaft 64 to rotate the wafer W horizontally. While moving the cleaning brush or jet nozzle 19 above the wafer W, the cleaning liquid is sprayed from the jet nozzle 19 onto the front surface of the wafer W, and the front surface cleaning brush members 40, 44 or the back surface cleaning brush member 50 cleans the front surface of the wafer W. Wash with rubbing to remove particle contaminants and the like adhering to the surface. This cleaning may be performed by brush cleaning alone, in which the cleaning liquid is supplied to the vicinity of the cleaning brush, or by jet cleaning alone in which the cleaning liquid is sprayed from the jet nozzle 19, and both are alternately performed. Depending on the type of the object to be processed and the cleaning state, various changes may be set. At this time, since the N2 gas is supplied to the back surface side of the wafer W and is flowing toward the outer peripheral direction, the cleaning liquid is unlikely to go around to the back surface of the wafer W.

When the rotating shaft 64 is stopped, the rotating shaft 64
When the speed of the holding body 78 is reduced, as shown in FIG.
Since the end portion on the rotation shaft side moves in the rotation direction due to inertia and rotates clockwise and the other pressing portion 79b abuts and engages with the side end portion of the wafer W, the wafer W can be held. it can.

As described above, when the spin chuck 61 is stopped, the holder 78 is maintained in the neutral position by the spring biasing force, and when the spin chuck 61 is started and accelerated,
The rotation shaft side end of the holder 78 moves in the direction opposite to the rotation direction, and the one pressing portion 79a can hold the wafer W. When the spin chuck 61 is in the constant-speed rotation state, the rotating body 76 returns to the neutral position by the urging force of the spring, the holding by the pressing portion 79a of the holding body 78 is released, and the wafer W is negatively pressurized by the N2 gas. Adsorbed and held by. Further, when the spin chuck 61 is stopped and decelerated, the end portion of the holder 78 on the rotation shaft side moves in the rotation direction, and the wafer W can be held by the other pressing portion 79b.

Therefore, since the wafer W can be reliably held even when the spin chuck 61 is accelerated and stopped and decelerated, the wafer W can always be held in a stable state and the processing work efficiency is improved. Can be planned. In addition, even at the time of rapid acceleration / deceleration, the inertia force at that time becomes larger, so that the wafer W can be reliably held.

In the above example, the case where the holders 78 are arranged at three positions has been described, but the holder 7 is not always necessary.
The number of 8 does not have to be 3, and may be arranged at least at 3 positions.

Although the object to be processed is a semiconductor wafer in the above-mentioned embodiment, the object to be processed is not necessarily limited to the semiconductor wafer.
The present invention can also be applied to a substrate, a photomask, a ceramic substrate, a compact disc, or a printed circuit board which is similarly subjected to cleaning treatment.

[0085]

As described above, according to the cleaning apparatus of the present invention, which is configured as described above, the following effects can be obtained.

1) According to the cleaning apparatus of the first aspect, the drive means is connected and fixed to the drive shaft of the rotation holding means protruding outside the processing chamber, and the container arranged outside the rotation holding means is held by the rotation holding means. Further, since the object to be processed is formed to be movable in the vertical direction, when the object to be processed is delivered to the rotation holding means, only the container can be lowered while the rotation holding means and the driving means are fixed. It is possible to shorten the delivery time before and after cleaning the processed body. Therefore, the size of the apparatus can be reduced, and the throughput can be improved.

2) According to the cleaning apparatus of the second aspect, the cleaning liquid is discharged by exhausting the air flowing into the processing chamber from the air supply port at the center of the ceiling along the tapered surface and the inner surface of the container through the ventilation hole. Since the mist of can be discharged together with this air flow, the mist of the cleaning liquid is scattered outside the container,
It is possible to prevent adhesion to the object to be processed again and improve the yield.

3) According to the cleaning device of the third and fourth aspects, it is possible to adjust the pressure of the cleaning means to the surface of the object to be processed by urging the elastic force. For example, the spring constant of the spring member is set to a predetermined value. Since the applied pressure can be adjusted by setting the value to, it is possible to simplify the mechanism for adjusting the pressure of the cleaning means on the surface of the object to be processed, and easily perform the pressure adjustment. In addition, it is possible to improve the yield by optimizing the contact between the surface of the object to be processed and the cleaning member.

4) According to the cleaning device of the fifth aspect, it is possible to safely remove dust and the like adhering to the cleaning member of the cleaning means on standby, so that the yield can be improved.

5) According to the cleaning apparatus of the sixth aspect, the opening / closing means is driven to open the opening, and the conveying means for entering the processing chamber is moved up and down while the container is lowered. The object to be processed can be delivered to the rotation holding means, and the cleaning means is moved to the cleaning position on the surface of the object to be processed while the container is lowered, and then the container is raised to perform the cleaning process. Therefore, the throughput and the yield can be improved.

6) According to the cleaning method of the seventh aspect, since the surface cleaning brush member comprising a plurality of cylindrical sponge pillars provided on the substrate in point symmetry is used, dust can be taken in well. It is possible to perform cleaning in which the water film is well removed, and the goodness of the water film is not deteriorated even if the turning angle of the brush member with respect to the object to be processed is changed. Therefore, the cleaning process can be performed without affecting the film quality of the surface of the object to be processed.

7) According to the cleaning method of the eighth aspect, since the back surface cleaning brush member in which the sponge body and the brush body harder than the sponge body are alternately provided on the substrate in the circumferential direction is used, the brush member is used. Can be rotated and revolved to come into contact with the back surface of the object to be cleaned, and at this time, dust that cannot be taken in by the brush can be taken in by the sponge.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a cleaning device of the present invention.

FIG. 2 is an enlarged sectional view taken along the line AA of FIG.

FIG. 3 is a side sectional view of FIG. 2;

FIG. 4 is an exploded perspective view of a main part of the cleaning device of the present invention.

FIG. 5 is a cross-sectional view showing a pressure adjusting mechanism and a nozzle cleaning unit in the present invention.

FIG. 6 is a partial cross-sectional side view showing a dummy dispense state of the jet water jet nozzle according to the present invention.

FIG. 7 is a schematic cross-sectional view of a semiconductor wafer coating / developing apparatus incorporating the cleaning apparatus of the present invention.

FIG. 8 is a plan view showing a main part of another embodiment of the surface cleaning brush member according to the present invention.

9 is an enlarged side view of the surface cleaning brush member of FIG.

10 is a diagram showing a method for obtaining the surface cleaning brush member of FIG.

FIG. 11 is an explanatory view showing the action of the surface cleaning brush member of FIG. 8 while changing the turning angle.

12 is a plan view showing a main part of a modified example of the surface cleaning brush member of FIG.

FIG. 13 is a plan view showing an essential part of a back surface cleaning brush member according to the present invention.

FIG. 14 is a plan view showing a modified example of the back surface cleaning brush member.

FIG. 15 is a plan view showing a main part of a cleaning device equipped with a mechanical spin chuck.

16 is a plan view showing the operation of the mechanical spin chuck of FIG.

FIG. 17 is a cross-sectional view showing the main parts of a cleaning device equipped with a mechanical spin chuck.

FIG. 18 is a schematic sectional view of a conventional cleaning device.

FIG. 19 is a cross-sectional view of a brush cleaning unit in a conventional cleaning device.

FIG. 20 is a schematic cross-sectional view showing a dummy dispense state of a jet water jet nozzle in a conventional cleaning device.

[Explanation of symbols]

 W semiconductor wafer (object to be processed) 1 processing chamber 1a opening 1b air supply port 2 shutter member (opening / closing means) 3 spin chuck (rotation holding means) 3a drive shaft 4 motor (driving means) 6 cup (container) 6b inner cup 6d Tapered surface 7 Lifting cylinder 8 Bottom plate 8a Vent hole 9 Transfer arm (transfer means) 10 Cleaning brush (cleaning means) 10a Brush arm (horizontal moving means) 10b Brush member (cleaning member) 11 Horizontal rotating means 12 Vertical moving means 13 Addition Pressure adjusting mechanism 13f Spring member 16 Brush cleaning part 16a Cleaning tank 16b Nozzle 40,44 Surface cleaning brush member (cleaning member) 41 Substrate 42 Sponge pillar 43 Gap 50 Back surface cleaning brush member (cleaning member) 51 Substrate 52,55 Sponge body 54 , 57 brush body

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number in the agency FI Technical indication location H01L 21/68 H01L 21/68 PA (72) Inventor Kiyohisa Tateyama Otsu, Kikuchi-gun, Kumamoto Takao 4 of Heisei 27 2 Tokyo Electron Kyushu Co., Ltd. Otsu Works (72) Inventor Akira Yonemizu 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Electron Kyushu Co., Ltd. Kikuyo Works

Claims (8)

[Claims] 1. A cleaning apparatus comprising: a rotation holding unit that is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning unit that contacts the upper surface of the object to be cleaned and cleans the object to be processed. The drive means is connected and fixed to the drive shaft of the rotation holding means protruding outside the processing chamber, and a cylindrical container is arranged outside the rotation holding means, and the container is attached to the rotation holding means and the object to be processed. A cleaning device which is formed so as to be vertically movable so as to be surrounded. 2. A cleaning apparatus comprising: a rotation holding means which is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning means which contacts an upper surface of the object to be cleaned and cleans the object to be processed. A cylindrical container is arranged to surround the rotation holding means and the object to be processed, and a taper surface that narrows inward is formed on the inner surface of the upper end opening of the container. A cleaning device, characterized in that an air supply port is provided at the center of the ceiling part, a plurality of vent holes are provided in the bottom part near the inside of the container, and these vent holes are communicated with an exhaust means. 3. A cleaning apparatus comprising: a rotation holding means that is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning means that contacts the upper surface of the object to be cleaned and cleans the object to be processed. The cleaning means is formed so as to be movable horizontally and selectively vertically so as to be selectively moved to a cleaning position and a non-cleaning position, and the cleaning means is provided on the vertical movement side of the cleaning means. A cleaning apparatus comprising a pressure adjusting mechanism for applying a predetermined elastic pressure to a processing object. 4. The cleaning device according to claim 3, wherein the cleaning means is a cleaning member that contacts the upper surface of the object to be processed, a horizontal moving means that holds the cleaning member in a horizontal direction, and the cleaning member. And a vertical moving means for moving the horizontal moving means in the vertical direction, and the pressure adjusting mechanism includes a connecting portion for connecting the vertical moving means, the cleaning means and the horizontal moving means so as to be vertically movable.
A cleaning device comprising a vertical moving means and a spring member provided between the cleaning member and the horizontal moving means in the connecting portion. 5. A cleaning apparatus comprising: a rotation holding unit that is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning unit that contacts the upper surface of the object to be cleaned and cleans the object to be processed. The cleaning means is formed so as to be selectively movable between a cleaning position and a non-cleaning position, and a cleaning tank for accommodating a cleaning member of the cleaning means is provided at the non-cleaning position, and a cleaning liquid is inserted into the cleaning tank toward a cleaning section And a nozzle for ejecting the cleaning liquid. 6. A processing chamber having an opening for loading and unloading an object to be processed, opening and closing means for opening and closing the opening of the processing chamber, and holding the object to be processed housed in the processing chamber, A rotation holding means that rotates in a horizontal direction, a cylindrical container that can move in the vertical direction to surround the rotation holding means and the object to be processed, and a top surface of the object to be processed held by the rotation holding means. Cleaning means for cleaning the object to be processed, horizontal moving means for selectively moving the cleaning means to the cleaning position and the non-cleaning position, the object to be processed is held, and the processing chamber is opened through the opening of the processing chamber. And a transporting unit that is movable in the vertical direction with respect to the cleaning unit. 7. A cleaning apparatus comprising: a rotation holding means that is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning means that contacts the upper surface of the object to be cleaned and cleans the object to be processed. The cleaning device comprises a brush member for cleaning the surface, in which a plurality of cylindrical sponge columns are provided on the substrate in point symmetry. 8. A cleaning apparatus comprising: a rotation holding means that is housed in a processing chamber and horizontally holds an object to be processed; and a cleaning means that contacts the upper surface of the object to be cleaned and cleans the object to be processed. The cleaning device includes a back surface cleaning brush member in which a sponge body and a brush body harder than the sponge body are alternately provided on a substrate in a circumferential direction.