KR101977752B1 - Apparatus and Method for treating a substrate - Google Patents

Abstract

The present invention provides an apparatus and method for liquid processing a substrate. An apparatus for processing a substrate includes a processing container having a processing space therein, a substrate supporting unit for supporting a substrate in the processing space, a liquid supply unit for supplying a processing liquid onto a substrate supported by the substrate supporting unit, and the processing container. A cleaning unit for removing the treatment liquid remaining in the cleaning unit, wherein the cleaning unit includes a cleaning jig placed on the substrate support unit and a cleaning liquid discharge member for discharging the cleaning liquid to the bottom of the cleaning jig, wherein the cleaning jig is an edge region. It is provided at a lower height than the central area. The cleaning region can be enlarged due to the shape of the cleaning jig.

Description

Apparatus and Method for treating a substrate

The present invention relates to an apparatus and method for liquid processing a substrate.

In order to manufacture a semiconductor device, various processes such as cleaning, deposition, photography, etching, and ion implantation are performed. Among these processes, a photographic process sequentially performs application, exposure, and development steps. The coating step is a step of applying a photosensitive liquid such as a resist to the surface of the substrate. An exposure process is a process of exposing a circuit pattern on the board | substrate with which the photosensitive film was formed. The developing step is a step of selectively developing an exposed region of the substrate.

In general, the coating step and the developing step are liquid treatment of the substrate, and a process of supplying a treatment liquid onto the substrate is performed. The liquid treatment process of the substrate is performed in a treatment vessel, and the used treatment liquid is recovered through the treatment vessel.

1 is a cross-sectional view showing a general liquid treatment apparatus used in the application process. Referring to FIG. 1, in the liquid processing apparatus, the substrate W is positioned in the processing container 2, and supplies the photosensitive liquid X to the substrate W. As shown in FIG. The photosensitive liquid X is a viscous liquid and a large amount is attached to the recovery path. The photosensitive liquids X attached to the recovery path of the processing vessel @ may contaminate the peripheral device and may adversely affect an operator.

Accordingly, the processing vessel in which the photosensitive liquids X remain requires periodic cleaning. FIG. 2 is a cross-sectional view illustrating a process of cleaning a processing container in the apparatus of FIG. 1. Referring to FIG. 2, the cleaning process of the processing container 2 may be performed before or after the liquid application of the substrate W is completed. When the cleaning process of the processing container 2 advances, the washing | cleaning liquid Y is supplied toward the board | substrate W from the upper part and the lower part of the board | substrate W. As shown in FIG. The cleaning liquid Y is scattered from the substrate W and recovered in a recovery path, and the remaining photosensitive liquid is washed.

However, the cleaning liquid Y does not reach some regions (x, y) of the regions of the processing container (@) forming the recovery path. for example. The lower region y facing the substrate W and the upper regions x higher than the substrate W in the processing container 2 correspond to the undelivered region of the cleaning liquid Y. Thereby, although the cleaning process is completed, the photosensitive liquid X still remains in the processing container 2, and it is very difficult to clean it.

The present invention seeks to provide an apparatus capable of cleaning the liquid remaining in the processing vessel.

It is another object of the present invention to provide an apparatus capable of cleaning the entire region forming the liquid recovery path of the processing container.

Embodiments of the present invention provide an apparatus and method for liquid processing a substrate. An apparatus for processing a substrate includes a processing container having a processing space therein, a substrate supporting unit for supporting a substrate in the processing space, a liquid supply unit for supplying a processing liquid onto a substrate supported by the substrate supporting unit, and the processing container. A cleaning unit for removing the treatment liquid remaining in the cleaning unit, wherein the cleaning unit includes a cleaning jig placed on the substrate support unit and a cleaning liquid discharge member for discharging the cleaning liquid to the bottom of the cleaning jig, wherein the cleaning jig is an edge region. It is provided at a lower height than the central area.

The cleaning jig may be provided with a diameter larger than an upper surface of the substrate supporting unit. The processing container includes an inner cup surrounding the substrate support unit and an outer cup surrounding the inner cup, the outer cup being combined with the inner cup to form a recovery path through which the processing liquid is recovered, wherein the outer side is far from the substrate support unit. The inner cup is inclined downward toward the downwardly inclined direction, and the inner cup is inclined downwardly away from the substrate support unit from the inner side and the inner side facing upwardly inclined direction away from the substrate support unit below the substrate. Extending in a direction, having an outer portion combined with the inclined portion to form the recovery path, and when viewed from the top, an edge region of the cleaning jig may be positioned to overlap the outer portion.

The edge region of the cleaning jig may have a shape bent to be inclined downward toward the outside. An angle between the center region of the cleaning jig and the end of the edge region may be provided at 90 degrees or more.

The cleaning liquid discharge member includes a lower cleaning nozzle for discharging the cleaning liquid to the bottom surface of the cleaning jig and an upper cleaning nozzle for discharging the cleaning liquid to the upper surface of the cleaning jig, wherein the cleaning jig is disposed between the central area and the edge area. It further has a middle area which is located, the middle area may have a higher height than the middle area. An upper end of the inclined portion may be positioned higher than an upper end of the cleaning jig supported by the substrate support unit. The cleaning jig may have a thickness in which the middle region is thicker than the central region.

The treatment liquid may include a photosensitive liquid, and the cleaning liquid may include a thinner.

The method of liquid processing a substrate includes a liquid processing step of liquid processing the substrate, an unloading step of unloading the substrate from the substrate support unit, and a container cleaning step of cleaning the processing container, wherein the liquid processing The step includes loading a substrate into a substrate support unit positioned in a processing space formed inside the processing container, supplying a processing liquid to supply a processing liquid onto the substrate, and unloading the substrate from the substrate supporting unit. And a substrate unloading step, wherein the container cleaning step includes a jig loading step of loading a cleaning jig into the substrate support unit, and a cleaning solution discharge step of discharging the cleaning solution to the bottom of the cleaning jig, wherein the cleaning jig has an edge region. It is provided at a height lower than the central area.

The processing container communicates with the processing space to recover the processing liquid, and has a recovery path in a downwardly inclined direction away from the substrate supporting unit, and the cleaning jig has a diameter larger than an upper surface of the substrate supporting unit. And, when viewed from the top, an edge region of the cleaning jig may be positioned to overlap the recovery path. The edge region of the cleaning jig has a shape bent so as to be inclined downward toward the outside, and an angle between the center region of the cleaning jig and the end of the edge region may be provided at 90 degrees or more.

The cleaning jig further has a middle area positioned between the center area and the edge area, the middle area has a higher height than the middle area, and the cleaning liquid is respectively disposed on the top and bottom surfaces of the cleaning jig. Can be discharged. The discharge area of the cleaning liquid may include a central area of the upper surface of the cleaning jig and an area excluding an edge area from the bottom of the cleaning jig.

According to the embodiment of the present invention, the cleaning region can be enlarged due to the shape of the cleaning jig.

In addition, according to an embodiment of the present invention, the edge region of the cleaning jig is provided to be inclined downward toward the outside. For this reason, the area | region of the process container which faces a cleaning jig can be wash-processed.

In addition, according to the embodiment of the present invention, the middle surface of the upper surface of the cleaning jig is positioned higher than the center region. For this reason, the washing | cleaning liquid scattered from a washing jig can wash-process the area | region of the processing container higher than a washing jig.

1 is a cross-sectional view showing a general liquid treatment apparatus used in the application process.
2 is a cross-sectional view illustrating a process of cleaning a processing container in the apparatus of FIG. 1.
3 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.
4 is a cross-sectional view of the installation of FIG. 3 as viewed from the AA direction.
FIG. 5 is a cross-sectional view of the equipment of FIG. 3 viewed in the BB direction. FIG.
6 is a cross-sectional view of the equipment of FIG.
7 is a cross-sectional view illustrating the substrate processing apparatus of FIG. 3.
8 is a cross-sectional view showing another embodiment of the processing container of FIG.
9 is a cross-sectional view illustrating the cleaning jig of FIG. 7.
FIG. 10 is a view illustrating a process of cleaning a processing container of FIG. 7.

Hereinafter, with reference to the accompanying drawings an embodiment of the present invention will be described in more detail. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

The equipment of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the equipment of this embodiment can be connected to an exposure apparatus and used to perform an application process and a development process on a substrate. Hereinafter, a case where a wafer is used as a substrate will be described.

Hereinafter, the substrate processing equipment of the present invention will be described with reference to FIGS. 3 to 10.

3 is a view of the substrate processing equipment from the top, FIG. 4 is a view of the equipment of FIG. 3 from the AA direction, FIG. 5 is a view of the equipment of FIG. 3 from the BB direction, and FIG. 6 is a facility of FIG. Is a view from the CC direction.

3 to 6, the substrate processing facility 1 includes a load port 100, an index module 200, a first buffer module 300, an application and development module 400, and a second buffer module 500. ), The pre-exposure processing module 600, and the interface module 700. Load port 100, index module 200, first buffer module 300, coating and developing module 400, second buffer module 500, pre-exposure processing module 600, and interface module 700 Are sequentially arranged in one direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( The direction in which the 700 is disposed is called a first direction 12, and when viewed from the top, a direction perpendicular to the first direction 12 is called a second direction 14, and the first direction 12 and the second direction. A direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in the state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door in front may be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( 700 will be described in detail.

The load port 100 has a mounting table 120 on which a cassette 20 containing substrates W is placed. The mounting table 120 is provided in plural, and the mounting tables 200 are arranged in a line along the second direction 14. In FIG. 2 four mounting tables 120 were provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is generally provided in the shape of an empty rectangular parallelepiped, and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a height lower than that of the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed in the frame 210. The index robot 220 drives four axes so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, and the third direction 16. This has a possible structure. Index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. Arm 222 is provided in a stretchable and rotatable structure. The support 223 is disposed in the longitudinal direction along the third direction 16. Arm 222 is coupled to support 223 to be movable along support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rail 230 is provided such that its longitudinal direction is disposed along the second direction 14. The pedestal 224 is coupled to the guide rail 230 to be linearly movable along the guide rail 230. In addition, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an empty rectangular parallelepiped, and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located in the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed along the third direction 16 from below. The first buffer 320 is located at a height corresponding to the coating module 401 of the coating and developing module 400 described later, and the second buffer 330 and the cooling chamber 350 are the coating and developing modules (described later). It is located at a height corresponding to the developing module 402 of 400. The first buffer robot 360 is positioned to be spaced apart from the second buffer 330, the cooling chamber 350, and the first buffer 320 in a second direction 14.

The first buffer 320 and the second buffer 330 temporarily store the plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed in the housing 331 and are spaced apart from each other along the third direction 16. One support W is placed on each support 332. In the housing 331, the index robot 220, the first buffer robot 360, and the developing unit robot 482 of the developing module 402, which will be described later, move the substrate W to the support 332 in the housing 331. It has openings (not shown) in the direction in which the index robot 220 is provided, the direction in which the first buffer robot 360 is provided, and the direction in which the developing unit robot 482 is provided so as to be able to carry in or take out. The first buffer 320 has a structure generally similar to that of the second buffer 330. However, the housing 321 of the first buffer 320 has an opening in the direction in which the first buffer robot 360 is provided and in the direction in which the applicator robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to an example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable structure, allowing the hand 361 to move along the second direction 14. Arm 362 is coupled to support 363 so as to be linearly movable in a third direction 16 along support 363. The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support 363 may be provided longer in the up or down direction. The first buffer robot 360 may simply be provided such that the hand 361 is only biaxially driven along the second direction 14 and the third direction 16.

The cooling chambers 350 respectively cool the substrate W. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and cooling means 353 for cooling the substrate W. As shown in FIG. As the cooling means 353, various methods such as cooling by cooling water or cooling using a thermoelectric element may be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) that positions the substrate W on the cooling plate 352. The housing 351 has the index robot 220 so that the developing robot 482 provided to the index robot 220 and the developing module 402 to be described later can load or unload the substrate W to the cooling plate 352. The provided direction and developing part robot 482 has an opening (not shown) in the provided direction. In addition, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The application and development module 400 has an application module 401 and a development module 402. The application module 401 and the developing module 402 are arranged to partition into each other in layers. In one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photoresist such as a photoresist to the substrate W and a heat treatment process such as heating and cooling the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. Accordingly, the resist application chamber 410 and the bake chamber 420 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six resist application chambers 410 are provided is shown. A plurality of baking chambers 420 may be provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six bake chambers 420 are provided is shown. Alternatively, however, the bake chamber 420 may be provided in larger numbers.

The transfer chamber 430 is positioned side by side in the first direction 12 with the first buffer 320 of the first buffer module 300. An applicator robot 432 and a guide rail 433 are positioned in the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes the baking chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first of the second buffer module 500 described later. The substrate W is transferred between the cooling chambers 520. The guide rail 433 is disposed such that its longitudinal direction is parallel to the first direction 12. The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. Arm 435 is provided in a flexible structure to allow hand 434 to move in the horizontal direction. The support 436 is provided such that its longitudinal direction is disposed along the third direction 16. Arm 435 is coupled to support 436 so as to be linearly movable in third direction 16 along support 436. The support 436 is fixedly coupled to the pedestal 437, and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist application chambers 410 all have the same structure. However, the types of photoresist used in each resist coating chamber 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 is provided to a substrate processing apparatus for applying photoresist on the substrate W. As shown in FIG. The substrate processing apparatus 800 is subjected to a liquid coating process. 7 is a cross-sectional view illustrating the substrate processing apparatus of FIG. 3. Referring to FIG. 7, the substrate processing apparatus 800 includes a housing 810, an air flow providing unit 820, a substrate supporting unit 830, a processing container 850, a lifting unit 890, and a processing liquid supply unit 840. ), And a cleaning unit 1000.

The housing 810 is provided in a rectangular cylindrical shape having a space 812 therein. An opening (not shown) is formed at one side of the housing 810. The opening functions as an inlet through which the substrate W is carried in and out. The opening is provided with a door, and the door opens and closes the opening. When the substrate is processed, the door closes the opening to seal the interior space 812 of the housing 810. An inner exhaust port 814 and an outer exhaust port 816 are formed on the lower surface of the housing 810. Air flow formed in the housing 810 is exhausted to the outside through the inner exhaust port 814 and the outer exhaust port 816. According to one example, the airflow provided in the processing vessel 850 may be exhausted through the inner exhaust port 814, and the airflow provided outside the processing vessel 850 may be exhausted through the outer exhaust port 816.

The airflow providing unit 820 forms a downdraft in the inner space of the housing 810. The airflow providing unit 820 includes an airflow supply line 822, a fan 824, and a filter 826. Air flow supply line 822 is connected to the housing 810. The airflow supply line 822 supplies external air to the housing 810. The filter 826 filters the air provided from the airflow supply line 822. The filter 826 removes impurities contained in the air. The fan 824 is installed on the upper surface of the housing 810. The fan 824 is located in the central area at the top surface of the housing 810. The fan 824 creates a downdraft in the interior space of the housing 810. When air is supplied from the airflow supply line 822 to the fan 824, the fan 824 supplies air downward.

The substrate support unit 830 supports the substrate W in an inner space of the housing 810. The substrate support unit 830 rotates the substrate W. As shown in FIG. The substrate support unit 830 includes a spin chuck 832, a rotation shaft 834, and a driver 836. Spin chuck 832 is provided to a substrate support member 832 that supports the substrate. Spin chuck 832 is provided to have a circular plate shape. The substrate W is in contact with the upper surface of the spin chuck 832. The spin chuck 832 is provided to have a diameter smaller than that of the substrate W. As shown in FIG. According to an example, the spin chuck 832 may vacuum the substrate W to chuck the substrate W. Optionally, the spin chuck 832 may be provided as an electrostatic chuck that chucks the substrate W using static electricity. In addition, the spin chuck 832 may chuck the substrate W with a physical force.

The rotation shaft 834 and the driver 836 are provided to the rotation driving members 834 and 836 for rotating the spin chuck 832. The axis of rotation 834 supports the spin chuck 832 below the spin chuck 832. The rotation shaft 834 is provided such that its longitudinal direction is directed upward and downward. The rotating shaft 834 is provided to be rotatable about its central axis. The driver 836 provides a driving force for the rotation shaft 834 to rotate. For example, the driver 836 may be a motor capable of varying the rotational speed of the rotating shaft.

The processing vessel 850 is located in the interior space 812 of the housing 810. The processing container 850 is provided to have a cup shape with an open top. The processing container 850 provides a processing space therein. The processing container 850 is provided to surround the substrate support unit 830. That is, the substrate support unit 830 is located in the processing space. The processing vessel 850 includes an outer cup 862 and an inner cup 852. The outer cup 862 is provided to surround the substrate support unit 830, and the inner cup 852 is positioned inside the outer cup 862. Each of the outer cup 862 and the inner cup 852 is provided in an annular ring shape. The space between the outer cup 862 and the inner cup 852 functions as a recovery path 851 in which the liquid is recovered.

The inner cup 852 is provided in a circular plate shape surrounding the rotation shaft 834. When viewed from the top, the inner cup 852 is positioned to overlap the inner exhaust port 814. The inner cup 852 has an inner portion 854 and an outer portion 856. Top surfaces of each of the inner portion 854 and the outer portion 856 are provided to be inclined at different angles from each other. As viewed from the top, the inner portion 854 is positioned to overlap with the spin chuck 832. The inner portion 854 is positioned facing the axis of rotation 836. The inner portion 854 faces upwardly inclined direction away from the rotation shaft 836, and the outer portion 856 extends outward from the inner portion 854. The outer portion 856 faces a downwardly inclined direction as it moves away from the rotation axis 836. The upper end of the inner part 854 may coincide with the side end of the substrate W in the vertical direction. According to an example, the point where the outer portion 856 and the inner portion 854 meet may be a position lower than the upper end of the inner portion 854. The outer portion 856 may be combined with the outer cup 862 to form a recovery path 851 through which the treatment liquid is recovered.

Optionally, as shown in FIG. 8, the point where the inner portion 854 and the outer portion 856 meet each other may be at each upper end. The point where the inner portion 854 and the outer portion 856 meet each other may be provided to be rounded.

The outer cup 862 is provided to have a cup shape surrounding the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom 864, a side 866, and an inclined portion 870. The bottom portion 864 is provided to have a circular plate shape having a hollow. The recovery line 865 is connected to the bottom 864. The recovery line 865 recovers the processing liquid supplied on the substrate W. The treatment liquid recovered by the recovery line 865 can be reused by an external liquid regeneration system. The side portion 866 is provided to have an annular ring shape surrounding the substrate support unit 830. The side portion 866 extends in a vertical direction from the side end of the bottom portion 864. Side 866 extends up from bottom 864.

The inclined portion 870 extends from the upper end of the side portion 866 toward the central axis of the outer cup 862. The inner side surface 870a of the inclined portion 870 is provided to be inclined upward so as to be close to the substrate support unit 830. The inclined portion 870 is provided to have a ring shape. During the liquid treatment process of the substrate, the upper end of the inclined portion 870 is positioned higher than the substrate W supported by the substrate support unit 830.

The lifting unit 890 lifts and moves the inner cup 852 and the outer cup 862, respectively. The elevating unit 890 includes an inner movable member 892 and an outer movable member 894. The inner side moving member 892 moves up and down the inner cup 852, and the outer side moving member 894 moves up and down the outer cup 862.

The liquid supply unit 840 supplies the processing liquid and the prewet liquid on the substrate W. As shown in FIG. The liquid supply unit 840 includes a moving member 846, an arm 848, a free wet nozzle 842, and a processing nozzle 844. The moving member 846 includes a moving rail 846 for moving the arm 848 in the horizontal direction. The moving rail 846 is located at one side of the processing container 850. The moving rail 846 is provided so that the longitudinal direction may face a horizontal direction. According to one example, the longitudinal direction of the moving rail 846 may be provided to face in a direction parallel to the first direction. An arm 848 is provided on the moving rail 846. The arm 848 can be moved by a linear motor provided inside the moving rail 846. Arm 848 is provided to face in a longitudinal direction perpendicular to moving rail 846 when viewed from the top. One end of the arm 848 is mounted to the moving rail 846. On the other end bottom of the arm 848, the prewet nozzle 842 and the process nozzle 844 are provided, respectively. As viewed from the top, the pre-wet nozzle 842 and the processing nozzle 844 are arranged in a direction parallel to the longitudinal direction of the moving rail 846. Optionally, a plurality of arms 848 may be provided, and each of the arms 848 may be provided with a pre-wet nozzle 842 and a processing nozzle 844. In addition, the arm 848 may be rotated by being coupled to a rotating shaft having a longitudinal direction of the arm 848.

 The pre-wet nozzle 842 supplies the pre-wet liquid on the substrate W, and the process nozzle 844 supplies the process liquid on the substrate W. As shown in FIG. For example, the pre-wet liquid may be a liquid capable of changing the surface properties of the substrate (W). The prewet liquid can change the surface of the substrate W to have a hydrophobic property. The prewet liquid is thinner, and the treatment liquid may be a photoresist such as a photoresist.

The cleaning unit 1000 removes the processing liquid remaining in the processing container. The cleaning unit 1000 includes a cleaning jig 1100 and a cleaning liquid discharge member 1200. The cleaning jig 1100 guides the scattering direction of the cleaning liquid. 9 is a cross-sectional view illustrating the cleaning jig of FIG. 7. 7 and 9, the cleaning jig 1100 generally has a disc shape. The cleaning jig 1100 is divided into a central area A, a middle area B, and an edge area C along a direction away from the center axis. For example, the central area A of the cleaning jig 1100 is an area including a central axis, the middle area B is an area surrounding the center area A, and the edge area C surrounds the middle area B. It may be an area including an end of the cleaning jig 1100. The cleaning jig 1100 may have a diameter larger than that of the substrate (W).

The cleaning jig 1100 may be seated on the spin chuck 832. As viewed from the top, the cleaning jig 1100 is loaded into the spin chuck 832 such that the edge region C overlaps the outer portion 856 of the inner cup 852. That is, when viewed from the top, the cleaning jig 1100 may be positioned so that the edge region C overlaps the recovery path. The cleaning jig 1100 has a shape in which the center region A is flat on the top and bottom surfaces thereof, while the edge region C is inclined downward toward the outside. The edge region C of the cleaning jig 1100 is provided at a height lower than the central region A. According to an example, the angle between the center area A of the cleaning jig 1100 and the end of the edge area C may be 90 degrees or more. The edge region C of the cleaning jig 1100 may have a bending angle of 90 degrees or more. The middle area B of the cleaning jig 1100 has a bottom surface having the same height as the center area A, while the top surface is provided higher than the center area A. FIG. The middle region B is provided to have a thicker thickness than the central region A. FIG. The upper surface of the middle region B is provided with a height lower than the upper end of the inclined portion 870 of the outer cup 862. For example, the top surface of the middle region B may extend in an upwardly inclined direction toward the outside.

The cleaning liquid discharge member 1200 discharges the cleaning liquid to the cleaning jig 1100 disposed on the substrate support unit 830. The cleaning liquid discharge member 1200 includes an upper cleaning nozzle 842 and a lower cleaning nozzle 1240. Here, the upper cleaning nozzle 842 discharges the cleaning liquid to the upper surface of the cleaning jig 1100, and the lower cleaning nozzle 1240 discharges the cleaning liquid to the bottom of the cleaning jig 1100. The pre-wet nozzle 842 functions as the upper cleaning nozzle 842. That is, the cleaning liquid may be thinner. Optionally, the upper cleaning nozzle 842 may be provided as a nozzle separate from the free wet nozzle 842. The cleaning liquid discharge region of the upper cleaning nozzle 842 is provided as an area except the edge region C of the cleaning jig 1100. The cleaning liquid discharge region of the upper cleaning nozzle 842 may be the central region A or the middle region B of the cleaning jig 1100.

The lower cleaning nozzle 1240 is positioned below the cleaning jig 1100. The lower cleaning nozzle 1240 is fixedly coupled to the inner side 854 of the inner cup 852. When viewed from the top, the lower cleaning nozzle 1240 is positioned to face the cleaning jig 1100 but not to the spin chuck 832. This is to directly supply the cleaning liquid to the bottom of the cleaning jig 1100. The lower cleaning nozzle 1240 may be provided such that the discharge port is vertically upward or toward the upwardly inclined direction as the discharge port is directed away from the central axis of the spin chuck 832.

Next, a method of processing the substrate W using the substrate processing apparatus described above will be described.

The method for treating the substrate W includes a liquid treatment step, an unloading step, and a vessel cleaning step. The liquid treatment step and the vessel cleaning step proceed sequentially. The liquid processing step is a liquid processing step of the substrate W, and the container cleaning step is a step of cleaning the recovery path of the processing container. The vessel cleaning step may proceed before or after the liquid treatment step. The liquid treatment step includes a substrate loading step, a processing liquid supply step, and a substrate unloading step. In the substrate loading step, the substrate W is loaded on the substrate support unit 830. The substrate W is rotated by the substrate support unit 830, and the processing liquid supplying step proceeds. In the treatment liquid supplying step, the prewetting liquid and the treatment liquid are sequentially supplied. The pre-wetting liquid and the treatment liquid may be supplied to the center of the substrate W. FIG. When the processing liquid supply step is completed, the rotation of the substrate W is stopped, and the substrate W is unloaded from the substrate support unit 830.

When the substrate unloading step is finished, the container cleaning step is performed. The container cleaning step is a step of cleaning the contaminated treatment container in the liquid treatment step. The vessel cleaning step may be a step of washing the treatment liquid remaining in the recovery path. The vessel cleaning step includes a jig loading step, a cleaning liquid discharge step, and a jig unloading step. The jig loading step, the cleaning liquid discharge step, and the jig unloading step may be performed sequentially. In the jig loading step, the cleaning jig 1100 is loaded into the substrate support unit 830. The cleaning jig 1100 is rotated by the substrate support unit 830, and the cleaning liquid is discharged to each of the upper and lower surfaces of the cleaning jig 1100. The cleaning liquid discharged to the upper surface center area A of the cleaning jig 1100 is scattered in the upwardly inclined direction by the middle area B. FIG. Accordingly, the inclined portion 870 of the outer cup 862 positioned higher than the cleaning jig 1100 is cleaned. In addition, the cleaning liquid discharged to the bottom surface of the cleaning jig 1100 is cleaned by the curved shape of the edge region C where the point where the inner side 854 and the outer side 856 of the inner cup 852 meet and the area adjacent thereto are cleaned. . When the cleaning liquid discharge step is completed, the rotation of the cleaning jig 1100 and the discharge of the cleaning liquid are stopped, and the jig unloading step is performed. In the jig unloading step, the cleaning jig 1100 is unloaded from the substrate support unit 830.

As described above, the height of the upper surface of the cleaning jig 1100 increases toward the outside. As a result, the cleaning liquid discharged to the cleaning jig 1100 may be scattered in the upwardly inclined direction, and may clean the processing container in a region higher than the substrate support unit 830.

In addition, the edge region C of the cleaning jig 1100 has a shape that is bent at least 90 degrees with respect to the central region A. FIG. Thereby, the point where the inner side 854 and the outer side 856 of the inner cup 852 meet can be wash-processed.

Optionally, the edge region C of the cleaning jig 1100 may have a shape bent less than 90 degrees with respect to the center region A. FIG.

3 to 6 again, the bake chamber 420 heat-treats the substrate (W). For example, the bake chambers 420 may be a prebake process or a photoresist that heats the substrate W to a predetermined temperature and removes organic matter or moisture from the surface of the substrate W before applying the photoresist. A soft bake process or the like performed after coating on W) is performed, and a cooling process for cooling the substrate W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with cooling means 423 such as cooling water or thermoelectric elements. The heating plate 422 is also provided with heating means 424 such as hot wires or thermoelectric elements. The cooling plate 421 and the heating plate 422 may be provided in one bake chamber 420, respectively. Optionally, some of the baking chambers 420 may have only a cooling plate 421 and others may have only a heating plate 422.

The developing module 402 is a developing process of removing a part of the photoresist by supplying a developing solution to obtain a pattern on the substrate W, and a heat treatment process such as heating and cooling performed on the substrate W before and after the developing process. It includes. The developing module 402 has a developing chamber 460, a baking chamber 470, and a conveying chamber 480. The developing chamber 460, the baking chamber 470, and the conveying chamber 480 are sequentially disposed along the second direction 14. Therefore, the developing chamber 460 and the baking chamber 470 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 460 may be provided, and a plurality of developing chambers 460 may be provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six developing chambers 460 are provided is shown. A plurality of baking chambers 470 may be provided in the first direction 12 and the third direction 16, respectively. In the figure, an example in which six bake chambers 470 are provided is shown. However, the baking chamber 470 may alternatively be provided in larger numbers.

The transfer chamber 480 is positioned side by side in the first direction 12 with the second buffer 330 of the first buffer module 300. The developer robot 482 and the guide rail 483 are positioned in the transfer chamber 480. The transfer chamber 480 has a generally rectangular shape. The developing unit robot 482 includes the bake chambers 470, the developing chambers 460, the second buffer 330 and the cooling chamber 350 of the first buffer module 300, and the second buffer module 500. The substrate W is transferred between the second cooling chambers 540. The guide rail 483 is disposed so that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing unit robot 482 to linearly move in the first direction 12. The developing unit robot 482 has a hand 484, an arm 485, a support 486, and a base 487. The hand 484 is fixedly mounted to the arm 485. Arm 485 is provided in a flexible structure to allow hand 484 to move in the horizontal direction. The support 486 is provided such that its longitudinal direction is disposed along the third direction 16. Arm 485 is coupled to support 486 such that it is linearly movable in third direction 16 along support 486. The support 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The developing chambers 460 all have the same structure. However, the types of the developer used in each of the developing chambers 460 may be different from each other. The developing chamber 460 removes the light irradiated region of the photoresist on the substrate W. At this time, the area irradiated with light in the protective film is also removed. Depending on the kind of photoresist that is optionally used, only the regions of the photoresist and the protective film to which light is not irradiated may be removed.

The developing chamber 460 has a container 461, a support plate 462, and a nozzle 463. The container 461 has a cup shape with an open top. The support plate 462 is located in the container 461 and supports the substrate W. As shown in FIG. The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tubular shape and can supply the developer to the center of the substrate W. FIG. Optionally, the nozzle 463 has a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided as a slit. In addition, the developing chamber 460 may further be provided with a nozzle 464 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the developing solution is supplied.

The bake chamber 470 heat-treats the substrate (W). For example, the bake chambers 470 are heated after each bake process and a hard bake process for heating the substrate W after the developing process is performed and a post bake process for heating the substrate W before the developing process is performed. A cooling process for cooling the finished substrate W is performed. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with cooling means 473, such as cooling water or thermoelectric elements. Alternatively, the heating plate 472 is provided with heating means 474, such as a hot wire or a thermoelectric element. The cooling plate 471 and the heating plate 472 may each be provided in one bake chamber 470. Optionally, some of the baking chambers 470 may have only a cooling plate 471 and others may have only a heating plate 472.

As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. In addition, the application module 401 and the developing module 402 may have the same chamber arrangement when viewed from the top.

The second buffer module 500 is provided as a passage through which the substrate W is transported between the application and development module 400 and the pre-exposure processing module 600. In addition, the second buffer module 500 performs a predetermined process on the substrate W, such as a cooling process or an edge exposure process. The second buffer module 500 controls the frame 510, the buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560. Have The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located in the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the developing module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged along the third direction 16. As viewed from the top, the buffer 520 is disposed along the conveyance chamber 430 and the first direction 12 of the application module 401. The edge exposure chamber 550 is disposed spaced apart from the buffer 520 or the first cooling chamber 530 in a second distance 14.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. The second buffer robot 560 is located between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W on which the process is performed in the application module 401. The first cooling chamber 530 cools the substrate W on which the process is performed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes an edge of the substrates W on which the cooling process is performed in the first cooling chamber 530. The buffer 520 temporarily stores the substrate W before the substrates W having been processed in the edge exposure chamber 550 are transferred to the pretreatment module 601 described later. The second cooling chamber 540 cools the substrates W before the substrates W having been processed in the post-processing module 602, which will be described later, are transferred to the developing module 402. The second buffer module 500 may further have a buffer added to a height corresponding to the developing module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then transferred to the developing module 402.

When the exposure apparatus 900 performs the liquid immersion exposure process, the exposure before and after processing module 600 may process a process of applying a protective film that protects the photoresist film applied to the substrate W during the liquid immersion exposure. In addition, the pre and post-exposure processing module 600 may perform a process of cleaning the substrate W after the exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre-exposure treatment module 600 may process the post-exposure bake process.

The pre- and post-exposure processing module 600 includes a pretreatment module 601 and a post-processing module 602. The pretreatment module 601 performs a process of processing the substrate W before performing the exposure process, and the post-processing module 602 performs a process of processing the substrate W after the exposure process. The pretreatment module 601 and the aftertreatment module 602 are arranged to partition into one another. In one example, the pretreatment module 601 is located on top of the aftertreatment module 602. The pretreatment module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film applying chamber 610, a baking chamber 620, and a transfer chamber 630. The protective film applying chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. Therefore, the protective film applying chamber 610 and the baking chamber 620 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 630 interposed therebetween. A plurality of protective film applying chambers 610 may be provided and disposed along the third direction 16 to layer each other. Optionally, a plurality of protective film applying chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of baking chambers 620 may be provided and disposed along the third direction 16 to layer each other. Optionally, a plurality of baking chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned side by side in the first direction 12 with the first cooling chamber 530 of the second buffer module 500. The pretreatment robot 632 is located in the transfer chamber 630. The transfer chamber 630 has a generally square or rectangular shape. The pretreatment robot 632 is provided between the protective film applying chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500, and the first buffer 720 of the interface module 700 described later. The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. Arm 634 is provided in a stretchable and rotatable structure. Arm 634 is coupled to support 635 to be linearly movable in a third direction 16 along support 635.

The protective film applying chamber 610 applies a protective film on the substrate W to protect the resist film during the liquid immersion exposure. The protective coating chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with an open top. The support plate 612 is located in the housing 611 and supports the substrate W. As shown in FIG. The support plate 612 is provided to be rotatable. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the support plate 612. The nozzle 613 has a circular tubular shape and can supply a protective liquid to the center of the substrate W. As shown in FIG. Optionally, the nozzle 613 has a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided as a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. As the protective liquid, a material having a low affinity with the photoresist and water may be used. For example, the protective liquid may contain a fluorine-based solvent. The protective film applying chamber 610 rotates the substrate W placed on the support plate 612 to supply the protective liquid to the central region of the substrate W. FIG.

The baking chamber 620 heat-treats the substrate W on which the protective film is applied. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with cooling means 623, such as cooling water or thermoelectric elements. Alternatively, the heating plate 622 is provided with heating means 624 such as hot wire or thermoelectric element. The heating plate 622 and the cooling plate 621 may each be provided in one bake chamber 620. Optionally, some of the bake chambers 620 may have only a heating plate 622 and others may have only a cooling plate 621.

The aftertreatment module 602 has a cleaning chamber 660, a post exposure bake chamber 670, and a transfer chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure bake chamber 670 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 680 interposed therebetween. The cleaning chamber 660 may be provided in plural and may be disposed along the third direction 16 to layer each other. Optionally, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 670 may be provided after the exposure, and may be disposed along the third direction 16 to layer each other. Optionally, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned side by side in the first direction 12 with the second cooling chamber 540 of the second buffer module 500 when viewed from the top. The transfer chamber 680 has a generally square or rectangular shape. The post-processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 includes cleaning chambers 660, post-exposure bake chambers 670, a second cooling chamber 540 of the second buffer module 500, and a second of the interface module 700 described below. The substrate W is transported between the buffers 730. The post-processing robot 682 provided to the post-processing module 602 may be provided in the same structure as the pre-processing robot 632 provided to the pre-processing module 601.

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. As shown in FIG. The support plate 662 is provided to be rotatable. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotated, the nozzle 663 may be linearly moved or rotated from the central area of the substrate W to the edge area.

The post-exposure bake chamber 670 heats the substrate W on which the exposure process is performed using ultraviolet rays. The post-exposure bake process heats the substrate W to amplify an acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with heating means 674, such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with cooling means 673, such as cooling water or thermoelectric elements. In addition, a bake chamber may optionally be provided with only the cooling plate 671.

As described above, the pretreatment module 601 and the post-treatment module 602 are provided to be completely separated from each other in the pre- and post-exposure processing module 600. In addition, the transfer chamber 630 of the pretreatment module 601 and the transfer chamber 680 of the post-treatment module 602 may be provided in the same size so as to completely overlap each other when viewed from the top. In addition, the protective film applying chamber 610 and the cleaning chamber 660 may be provided in the same size to each other when completely overlapping each other when viewed from the top. In addition, the bake chamber 620 and the post-exposure bake chamber 670 may be provided in the same size, so as to completely overlap each other when viewed from the top.

The interface module 700 transfers the substrate W between the pre-exposure processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located in the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and disposed to be stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601, and the second buffer 730 is disposed at a height corresponding to the postprocessing module 602. As viewed from the top, the first buffer 720 is arranged in a line along the conveyance chamber 630 and the first direction 12 of the pretreatment module 601, and the second buffer 730 is the post-processing module 602. Are positioned to be arranged in a line along the conveyance chamber 630 and the first direction 12.

The interface robot 740 is positioned to be spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 transports the substrate W between the first buffer 720, the second buffer 730, and the exposure apparatus 900. The interface robot 740 has a structure generally similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the pretreatment module 601 before they are moved to the exposure apparatus 900. The second buffer 730 temporarily stores the substrates W processed in the exposure apparatus 900 before moving to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed in the housing 721 and are provided spaced apart from each other along the third direction 16. One support W is placed on each support 722. The housing 721 is a direction and pretreatment robot provided with the interface robot 740 so that the interface robot 740 and the pretreatment robot 632 can bring in or take out the substrate W into the support 722 into the housing 721. 632 has an opening (not shown) in the direction provided. The second buffer 730 has a structure generally similar to that of the first buffer 720. However, the housing 4531 of the second buffer 730 has openings (not shown) in the direction in which the interface robot 740 is provided and in the direction in which the post-processing robot 682 is provided. The interface module may be provided with only the buffers and the robot as described above without providing a chamber for performing a predetermined process on the substrate W.

852: inner cup 854: inner portion
856: outer side 862: outer cup
870: inclined portion 1100: cleaning jig

Claims (16)

In the apparatus for processing a substrate,
A processing container having a processing space therein;
A substrate support unit for supporting a substrate in the processing space;
A liquid supply unit supplying a processing liquid onto a substrate supported by the substrate support unit;
A cleaning unit for removing the treatment liquid remaining in the processing container,
The cleaning unit,
A cleaning jig placed on the substrate support unit;
Including a cleaning liquid discharge member for discharging the cleaning liquid to the bottom surface of the cleaning jig,
The cleaning jig has an edge area provided at a height lower than that of the center area,
The cleaning jig is provided with a diameter larger than the upper surface of the substrate support unit,
The processing container,
An inner cup surrounding the substrate support unit;
Including an outer cup surrounding the inner cup,
The inner cup is,
An inner portion of the substrate which faces upwardly inclined direction away from the substrate supporting unit;
It extends in a downwardly inclined direction as it moves away from the inner side and the substrate support unit, and has an outer side which is combined with the outer cup to form a recovery path.
When viewed from the top, the edge region of the cleaning jig is positioned to overlap the outer portion,
The edge region of the cleaning jig has a shape bent downward,
The cleaning liquid discharge member includes a lower cleaning nozzle for discharging the cleaning liquid to the bottom of the cleaning jig,
And a hole is not formed in an edge region of the cleaning jig. delete The method of claim 1,
The outer cup,
A substrate processing apparatus having an inclined portion that is directed downwardly inclined away from the substrate supporting unit, and which is combined with the outer portion to form a recovery path through which the processing liquid is recovered. delete The method of claim 3,
And an angle between the central region of the cleaning jig and the end of the edge region is provided at least 90 degrees. In the apparatus for processing a substrate,
A processing container having a processing space therein;
A substrate support unit for supporting a substrate in the processing space;
A liquid supply unit supplying a processing liquid onto a substrate supported by the substrate support unit;
A cleaning unit for removing the treatment liquid remaining in the processing container,
The cleaning unit,
A cleaning jig placed on the substrate support unit;
Including a cleaning liquid discharge member for discharging the cleaning liquid to each of the bottom and top of the cleaning jig,
The cleaning jig has an edge area provided at a height lower than that of the center area,
The cleaning liquid discharge member,
A lower cleaning nozzle for discharging the cleaning liquid to the bottom of the cleaning jig;
An upper cleaning nozzle for discharging the cleaning liquid to the upper surface of the cleaning jig,
The cleaning jig further has a middle region located between the central region and the edge region,
And the middle region has a height higher than that of the central region. The method of claim 3,
And an upper end of the inclined portion is positioned higher than an upper end of the cleaning jig supported by the substrate support unit. The method of claim 6,
The cleaning jig has the middle region of the substrate processing apparatus having a thicker thickness than the central region. The method according to any one of claims 1, 3, and 5,
The treatment liquid contains a photosensitive liquid,
The cleaning liquid includes a thinner. In the method of liquid-processing a substrate using the substrate processing apparatus of claim 1,
A liquid processing step of liquid-processing the substrate supported by the substrate support unit;
A container cleaning step of cleaning the processing container,
The liquid processing step,
A substrate loading step of loading the substrate into the substrate support unit;
A processing liquid supplying step of supplying a processing liquid on the substrate;
A substrate unloading step of unloading the substrate from the substrate support unit,
The container cleaning step,
A jig loading step of loading the cleaning jig into the substrate supporting unit;
And a cleaning liquid discharging step of discharging the cleaning liquid from the lower cleaning nozzle to the bottom of the cleaning jig to clean the inner cup. delete The method of claim 10,
The edge region of the cleaning jig has a shape bent to be inclined downward toward the outside,
And an angle between the central region of the cleaning jig and the end of the edge region is greater than or equal to 90 degrees. The method of claim 10 or 12,
The cleaning jig further has a middle region located between the central region and the edge region,
The middle region has a height higher than that of the central region,
And the cleaning liquid is discharged to the upper and lower surfaces of the cleaning jig. The method of claim 13,
And a discharge region of the cleaning liquid includes an upper center region of the cleaning jig and a region excluding an edge region from a bottom of the cleaning jig.







In the apparatus for processing a substrate,
A processing container having a processing space therein;
A substrate support unit for supporting a substrate in the processing space;
A liquid supply unit supplying a processing liquid onto a substrate supported by the substrate support unit;
A cleaning unit for removing the treatment liquid remaining in the processing container,
The cleaning unit,
A cleaning jig placed on the substrate support unit;
Including a cleaning liquid discharge member having an upper cleaning nozzle for discharging the cleaning liquid to the upper surface of the cleaning jig,
And a top surface of the cleaning jig having an inclined surface that is inclined upwardly away from the central region. The method of claim 15,
The processing container,
An inner cup surrounding the substrate support unit;
And an outer cup surrounding the inner cup and combined with the inner cup to form a recovery path through which the treatment liquid is recovered.
The outer cup,
And an inclined portion that wraps the cleaning jig supported by the substrate support unit and is inclined downward toward the substrate support unit.

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