JPH08255745A - Coating film formation and its device - Google Patents

Abstract

PURPOSE: To cut the amount of coating liquid and improve uniformity of a film by supplying a specified amount of coating liquid after solvent of coating liquid is applied to one surface of a substrate and diffused, diffusing it to one surface of a substrate while rotating a substrate at a first rotation rate and rotating it at a second rotation rate after enclosing a substrate inside a treatment container. CONSTITUTION: While a substrate G is rotated slowly, solvent of coating liquid is supplied to a substrate surface from a solvent supply nozzle 40 during the rotation and the solvent is diffused and applied all over the substrate G. Then, while rapid-rotation (first rotation) is carried out, coating liquid such as resist liquid is dropped from a resist liquid supply nozzle 50a to above a central part on a solvent film on a substrate surface. Then, supply of resist liquid is stopped, a fixing lid body 15 and a lid body 16 are closed at a drain cup 14 and the upper opening part 12a of a rotation cup 12 and the substrate G is enclosed inside the rotation cup 12. Thereafter, rotation (second rotation) which is faster than a first rotation is carried out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a coating film for forming a liquid coating film of a solvent such as a resist film on a substrate such as an LCD substrate or a layer formed thereon. It relates to the device.

[0002]

2. Description of the Related Art Generally, in the field of semiconductor technology, LCDs are used.
When selectively etching a semiconductor layer, an insulator layer, and an electrode layer formed on a substrate into a predetermined pattern, a resist film is formed on the surface of the layer as masking of a pattern portion as in the case of a semiconductor wafer. Is being done.

For example, as a method of forming a resist film, a rectangular LCD substrate (hereinafter referred to as a substrate) is mounted and fixed on a mounting table disposed in the processing container, and the opening of the processing container is covered. Closing with the body, rotating the processing container and the mounting table, for example, a resist solution consisting of a solvent and a photosensitive resin is dropped on the central portion of the upper surface of the substrate, and the resist solution is applied to the rotational force and centrifugal force of the substrate. There is known a method of applying by diffusing it radially from the central part of the substrate toward the peripheral part.

In this method, the solvent in the resist solution evaporates in the process in which the resist solution diffuses from the central position of the substrate toward the peripheral portion. For this reason, the viscosity of the resist liquid varies in the direction of diffusion, and the thickness of the formed resist film differs between the central portion and the peripheral portion. Further, since the peripheral speed of the substrate is much higher at the outer peripheral portion than at the center position, the amount of scattering is large. That is, there was a limit to uniform coating.

Therefore, for example, a method of controlling the temperature of the resist solution or filling the same solvent as that used in the resist solution in the atmosphere for forming the resist film to suppress the evaporation of the solvent in the resist solution, or the resist solution A method of dropping the solvent of the resist solution on the surface of the substrate before coating can be considered.

[0006]

However, the former, that is, the temperature adjustment of the resist solution or the same solvent as that used in the resist solution is filled in the atmosphere for forming the resist film to suppress the evaporation of the solvent in the resist solution. In the method, the amount of the resist solution used increases, and for example, only a few percent of the amount of the resist solution applied contributes to the actual formation of the resist film. Moreover, since the amount of the resist solution is large, the resist solution spills over to the back surface of the corner portion of the substrate, and the resist solution adhering to the back surface of the substrate corner portion is dried, which causes the generation of particles.

Also, in the latter case, that is, in the method of dropping the solvent of the resist solution on the surface of the substrate before the application of the resist solution, it is difficult to apply the solution uniformly due to the uniformity of the solvent itself on the substrate and the difference in the dry state. Can not be fully resolved. In addition, this method also has a disadvantage that an extra resist solution must be used to form a resist film on the entire surface of the substrate, especially when the substrate is a rectangular prism, and similar to the above method. There is a problem in that the coating liquid spills over to the back surface of the corner portion of the substrate and then is dried to generate particles, resulting in a decrease in yield.

The present invention has been made in view of the above circumstances, and a coating film forming method and a method for forming the coating film, in which the amount of the coating liquid used is small and the film thickness uniformity of the coating film and the yield can be improved. The purpose is to provide a device.

[0009]

In order to achieve the above object, the first coating film forming method of the present invention comprises rotating a substrate accommodated in a processing container together with the processing container, and
Assuming a method of supplying a coating liquid on one surface of a substrate to form a coating film, a step of applying a solvent on one surface of the substrate, and supplying a predetermined amount of the coating liquid to the substrate, A step of rotating at a rotation speed to diffuse on one surface of the substrate,
Closing the lid of the processing container and sealing the substrate in the processing container; rotating the processing container and the substrate with the lid closed at a second rotation speed higher than the first rotation speed. And a step of adjusting the thickness of the coating film.

In the present invention, it is preferable that the solvent is dropped onto the central portion of the substrate to be coated, and then the coating liquid is dropped onto the central portion of the substrate to be diffused (claim 2).

Further, in the second coating film forming method of the present invention, as in the first coating film forming method, the substrate accommodated in the processing container is rotated together with the processing container and coated on the entire surface of the substrate. Assuming a method of supplying a liquid to form a coating film, a step of coating a solvent on one surface of the substrate, supplying a predetermined amount of the coating liquid to the substrate, and rotating at a first rotation speed. The step of diffusing it over one surface of the substrate,
Closing the lid of the processing container and sealing the substrate in the processing container; rotating the processing container and the substrate with the lid closed at a second rotation speed higher than the first rotation speed. And allowing the air introduced into the processing container from the center of the upper part of the processing container to flow to the lower side along the inner wall of the processing container, while adjusting the film thickness of the coating film. (Claim 3).

Further, according to the third coating film forming method of the present invention, the substrate accommodated in the processing container is rotated together with the processing container as in the first and second coating film forming methods described above, and at the same time, the entire surface of the substrate is covered. Assuming a method of supplying a coating liquid on the substrate to form a coating film, a step of coating a solvent on one surface of the substrate, and supplying a predetermined amount of the coating liquid to the substrate at a first rotation speed. The step of rotating the substrate to diffuse it over one surface of the substrate, the step of closing the lid of the processing container and sealing the substrate in the processing container, and the step of closing the processing container and substrate with the lid closed. The second rotation speed is higher than the first rotation speed, and the air introduced into the processing container from the center of the upper part of the processing container is caused to flow to the lower side along the inner wall of the processing container. While flowing air from the outside above along the outer wall of the processing container, And a step of adjusting the thickness of the coating film (claim 4).

In the present invention, the coating liquid is
Resist (phenol novolac resin and naphthoquinone diazide ester), ARC (antireflection film; Anti R
effect coating) or the like can be used. Further, as the above-mentioned solvent, in addition to methyl-3-methoxypropionate (MMT, boiling point: 145 ° C., viscosity: 1.1 cps), ethyl lactate (EL, boiling point: 1
54 ° C., viscosity: 2.6 cps, ethyl-3-ethoxypropionate (EEP, boiling point: 170 ° C., viscosity: 1.
3 cps), ethyl pyruvate (EP, boiling point: 144
° C, viscosity: 1.2 cps), propylene glycol monomethyl ether acetate (PGMEA, boiling point: 146
C, viscosity: 1.3 cps, 2-heptanone (boiling point: 1
52 ° C, viscosity: 1.1 cps, cyclohexanone (A
The solvent known in this field such as RC solvent) can be used.

Further, according to the first coating film forming apparatus of the present invention, one surface of the substrate is supported upward, and the substrate is rotated about an axis perpendicular to the one surface of the substrate and is moved in the vertical direction. Possible rotating means, a processing container which is cup-shaped to surround the substrate, and which has an exhaust hole on the bottom side thereof and rotates together with the rotating means, and the opening of the processing container is closed, and the center of the processing container is closed. A lid body having an air introduction port in the part, a rectifying plate located below the lid body and diffusing the air introduced from the air introduction port to the outside, and a solvent for the coating liquid is supplied to the substrate. It is characterized by comprising a solvent supply means and a coating liquid supply means for supplying a coating liquid to the substrate (Claim 5).

In the second coating film forming apparatus of the present invention, one surface of the substrate is supported upward, and the substrate is rotated about an axis perpendicular to the one surface of the substrate and moved in the vertical direction. Possible rotating means, a processing container which is cup-shaped to surround the substrate, and which has an exhaust hole on the bottom side thereof and rotates together with the rotating means, and the opening of the processing container is closed, and the center of the processing container is closed. A lid body having an air introduction port in the part, a rectifying plate located below the lid body and diffusing the air introduced from the air introduction port to the outside, and surrounding the outside of the processing container, A fixed container having an exhaust port connected to an exhaust means at a lower portion thereof, a fixed lid body having a plurality of air supply holes on a concentric circle on the center side of the fixed container, the opening being closed, and a coating liquid for the substrate. Solvent supply means for supplying the solvent of A coating liquid supply means for supplying a liquid is provided (Claim 6).

[0016]

According to the present invention by the above-mentioned technical means, after the solvent of the coating liquid is applied to one surface of the substrate and diffused, a predetermined amount of the coating liquid is supplied to almost the central portion of the substrate, The substrate is rotated at a rotation speed of 1 to diffuse on the one surface of the substrate, and then the lid is closed in the treatment container, the substrate is sealed in the treatment container, and then the treatment container and the substrate with the lid closed are It is rotated at a second rotation speed higher than the rotation speed of 1 to adjust the film thickness of the coating film. This makes it possible to supply the coating liquid in an appropriate mixing ratio with respect to the solvent, reduce the amount of the coating liquid used, and prevent the coating liquid from flowing around to the back surface of the corner portion of the substrate. Further, it is possible to form a coating film having a uniform thickness by making the viscosity of the coating liquid uniform by the contact between the solvent and the coating liquid.

When the processing container and the substrate are rotated at the second rotation speed, the air introduced from the center of the upper part of the processing container is blown toward the lower side along the side wall of the processing container to scatter from the substrate. The mist of the applied coating liquid can be eliminated without redepositing on the substrate. Furthermore, the air introduced from the center of the upper part of the processing container is made to flow to the lower side along the side wall of the processing container, and the air is made to flow downward from above the outside of the processing container, so that the mist of the coating liquid can be more reliably achieved. Can be eliminated.

[0018]

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Here, a case where the coating film forming method and the coating film forming apparatus of the present invention are applied to a method and a forming apparatus for a resist film on an LCD (liquid crystal display) substrate (glass substrate) will be described.

The coating film forming apparatus of the present invention, as shown in FIG. 1, is a rotating means for sucking and holding a rectangular substrate, which is an object to be coated, for example, an LCD substrate G (hereinafter referred to as a substrate) in a horizontal state by vacuum suction. For example, a spin chuck 10 and a cup-shaped processing container 12 having an open upper portion having a processing chamber 11 surrounding the upper and outer peripheral portions of the spin chuck 10.
(Hereinafter, referred to as a rotary cup), a lid body 16 that is removably attached (removed) to the opening 12a of the rotary cup 12,
A flat plate-shaped straightening plate 13 which is vertically provided below the lid body 16 and projects outward from the outer peripheral edge of the substrate G, and the processing container 1.
A cup-shaped fixed container 14 (hereinafter referred to as a drain cup) that surrounds the outer peripheral side of 2 and a fixed lid 15 that is removably attached (removed) to the opening of the drain cup 14; A robot arm 20 as a lid moving means for moving the lid 16 and the fixed lid 15 to the closed position and the standby position.
A drive motor 21 which is a means for rotating the spin chuck 10 and the rotary cup 12, and a solvent (solvent) for the coating liquid that is movable to a position above the spin chuck 10.
A jet nozzle 60 in which the A supply nozzle 40 (solvent supply means) and the supply nozzle 50 (coating liquid supply means) for the coating liquid, for example, the resist liquid B, are integrally mounted in close proximity to each other, and the jet nozzle 60 is gripped and a jet head standby position And a nozzle moving mechanism 70 that is a moving unit that moves between the substrate upper position.

In this case, the solvent A and the resist solution B flowing through the nozzles 40 and 50 are set in the solvent supply path and the resist solution supply path, respectively, at preset temperatures (for example, 23 ° C.). A temperature adjusting mechanism 61 that circulates and supplies the temperature adjusting liquid C is provided. Further, a mounting member 34 capable of moving up and down together with the spin chuck 10 is mounted at a position near the spin chuck 10 below the spin chuck 10 via a bearing 34a between the spin chuck 10 and the spin chuck 10. Cleaning nozzle 35
And an inert gas such as nitrogen (N ₂ ) gas supply nozzle 3
6 is attached.

The spin chuck 10 is formed of a heat-resistant synthetic resin member made of, for example, polyether-ether-ketone (PEEK), and is driven based on a preset program, and a drive motor 21 capable of varying the rotation speed. It can be rotated (rotated) in the horizontal direction via a rotary shaft 22 that is rotated by the drive of the motor, and can be moved in the vertical direction by driving an elevating cylinder 23 connected to the rotary shaft 22. . In this case, the rotary shaft 22 is slidably connected to a spline bearing 27 fitted to the inner peripheral surface of a rotating inner cylinder 26a rotatably mounted on the inner peripheral surface of the fixed collar 24 via a bearing 25a. ing. A driven pulley 28a is attached to the spline bearing 27,
A belt 29a is stretched between the driven pulley 28a and the drive pulley 21b mounted on the drive shaft 21a of the drive motor 21. Therefore, the rotation of the rotary shaft 22 via the belt 29a by the drive of the drive motor 21 causes the spin chuck 10 to rotate. The lower side of the rotary shaft 22 is arranged in a cylinder body (not shown), and the rotary shaft 22 is connected to the lifting cylinder 23 via the vacuum seal portion 30 in the cylinder body. Is configured to be movable in the vertical direction.

The rotary cup 12 is formed of, for example, a stainless steel member, and has a connecting cylinder 31 fixed to the upper end of a rotating outer cylinder 26b mounted on the outer peripheral surface of the fixed collar 24 via a bearing 25b. Attached to the bottom 12b of the rotary cup 12 and the spin chuck 10.
An O-ring 32 for sealing is interposed between the lower surface of the spin chuck 10 and the lower surface of the spin chuck 10, and the airtightness is maintained in a state where the spin chuck 10 descends and contacts the O-ring 32. Further, the drive from the drive motor 21 is transmitted to the rotary cup 12 by the driven pulley 28b attached to the rotary outer cylinder 26b and the belt 29b which is stretched around the drive pulley 21b attached to the drive motor 21, so that the rotary cup 12 is rotated. It is configured to be rotated. In this case, the diameter of the driven pulley 28b is formed to be the same as the diameter of the driven pulley 28a mounted on the rotating shaft 22, and the same drive motor 21 and belt 2 are used.
Since 9a and 29b are hung, the rotating cup 12
And the spin chuck 10 rotates the same. A labyrinth seal portion 33 is formed on the facing surface of the fixed collar 24 and the rotating inner cylinder 26a and the rotating outer cylinder 26b to prevent dust from entering the rotary cup 12 from the lower drive system during rotation processing. (See FIG. 3).

Further, the rotary cup 12 is formed by forming a tapered surface 12e in which the inner surface of the side wall 12c is reduced in diameter toward the upper side. A hole 12d is formed.

A contact ring 16a made of Delrin (trade name), for example, is fixed to the lower surface of the periphery of the lid 16 that closes the opening 12a of the rotary cup 12 in order to avoid metal contact with the rotary cup 12. In addition, the robot arm 2 is provided at the center of the lid body 16 via a bearing 16b.
A support cylinder 19 supported at 0 is attached, and an air inlet 16c is provided at the center of the support cylinder 16.

By thus providing the lid body 16 with the air inlet 16c and the rotary cup 12 with the exhaust hole 12d, the inside of the processing chamber 11 becomes a negative pressure as the rotary cup 12 rotates, and the air inlet becomes. Air flows into the rotary cup 12 from 16c, and this air is supplied to the rotary cup 12 by the current plate 13.
Since the mist of the resist solution is prevented from reattaching to the substrate G, it is discharged from the exhaust hole 12d along the inner wall of the processing chamber 11 when the rotating cup 12 is rotated.
It is possible to prevent an excessive negative pressure in the inside.

The air inlet 16c is the support cylinder 1
9 may be provided directly, or it may be formed by a pipe member inserted into a through hole formed in the supporting column 19. Especially when the air inlet 16c is formed of a pipe member, the solvent A or the resist solution B to be used is used.
It is preferable in that the hole diameter of the pipe member can be selected and used according to properties such as type, drying property and viscosity. For example, when a resist having a high drying property is used, if the resist is dried quickly, the resist solution may be difficult to spread on the entire surface of the substrate G and the film thickness may be partially increased. By making the hole diameter of 16d small to suppress the drying of the resist, the film thickness of the resist film can be made uniform. On the contrary, when a resist having a low drying property is used, it is possible to make the resist film uniform by accelerating the drying of the resist by using the air introducing port 16d having a large hole diameter.

On the other hand, a plurality of drainage ports 14a are concentrically provided on the outer peripheral side of the bottom of the drain cup 14, and the drainage ports 14a are provided at appropriate positions on the inner peripheral side (for example, four positions in the circumferential direction). Is provided with an exhaust port 14b connected to an exhaust device (not shown). In this case, the drainage port 14a is opened in the tangential direction of the rotation direction (eg, clockwise direction) of the substrate G and the rotary cup 12. In this way, the drain port 14a is connected to the substrate G.
The reason for providing the rotation cup 12 in the tangential direction of the rotation direction is that the mist of the resist solution scattered with the rotation of the substrate G and the rotation cup 12 is quickly discharged to the outside.

Further, the fixed lid 15 is formed of a stainless steel member supported by the support column 19, and the lower surface of the outer periphery of the fixed lid 15 avoids the metal contact with the drain cup 14. Therefore, a ring-shaped contact member 15a made of Delrin (trade name) is fixed. Also, a plurality of air supply holes 15b are provided on the concentric circle on the center side of the fixed lid body 15.
Is provided.

As described above, the plurality of air supply holes 15a are provided on the concentric circle on the center side of the fixed lid body 15, and the drain cup 1
By providing the exhaust port 14b at the bottom of the drain cup 4, the drain cup 1 is supplied from the air supply hole 15a when the rotary cup 12 rotates.
The air that has flowed into the inside of the rotating cup 12 flows along the outer wall of the rotating cup 12, and the mist that is scattered by the centrifugal force in the processing chamber 11 during the rotation processing and flows into the drain cup 14 through the exhaust hole 12d of the rotating cup 12. It can be prevented from soaring to the upper side and discharged to the outside through the exhaust port 14b.

The lid 16 must be fixed to the opening 12a of the rotary cup 12 and rotated integrally during the rotation process. Therefore, as shown in FIG. 4, a fitting recess 17b is provided on the lower surface of the abutment ring 16a, and the fitting recess 17b is fitted to the fixing pin 17a protruding above the rotary cup 12, so that the lid body 16 is removed. It is fixed to the rotating cup 12. In this case, the top of the fixing pin 17a is formed into a spherical shape to reduce dust generated by contact with the fitting recess 17b. The fixing pin 17a does not necessarily have to project to the rotating cup side, and the fixing pin 17a does not have to protrude to the lid side.
May be projected, and the fitting recess 17b may be provided on the rotary cup side. Further, the inside of the fitting recess 17b may be connected to a suction means (not shown) so that dust generated by the contact between the fixing pin 17a and the fitting recess 17b can be discharged to the outside.

When the lid 16 is opened and closed, as shown in phantom in FIG. 1, the robot arm 20 is inserted under the bulging head 18 projecting from the upper surface of the lid 16, and the bulging head is bulged. This can be performed by engaging the locking pin 20a protruding from the robot arm 20 with the locking groove 18a provided in the portion 18 and then moving the robot arm 20 up and down. The locking groove 18a of the bulging head 18 and the locking pin 20a of the robot arm 20 are aligned when the lid 16 is opened, and the fixing pin 17a when the lid 16 is closed.
The position of the fitting recess 17b can be adjusted by controlling the rotation angle of the drive motor 21 formed by a servomotor or the like.

In the above embodiment, the lid 16 and the rotating cup 1
The case where the fixing pin 17a and the fitting recess 17b are fixed to each other has been described, but it is not always necessary to have such a structure, and the lid body 16 is separately provided by using a pressing mechanism.
If is fixed to the rotating cup 12, it is possible to prevent dust from being generated when the lid 16 is opened and rattling of the lid 16 during rotation processing. Since the fixed lid 15 is fixed to the support column 19 that rotatably supports the lid 16, the fixed lid 15 may move up and down as the lid 16 opens and closes to open and close the opening of the drain cup 14. You can

On the other hand, the solvent supply nozzle 40 is connected to a solvent tank 43 through a solvent supply tube 41 which is a solvent supply path and an opening / closing valve 42, and nitrogen (N ₂ ) gas supplied into the solvent tank 43 is supplied. By controlling the pressurization of the solvent A, the solvent A in the solvent tank 43 can be supplied onto the substrate G in a predetermined amount for a predetermined time.

The resist solution supply nozzle 50 is connected to a resist solution tank 52 (coating solution supply source) for containing the resist solution B via a resist solution supply tube 51 which is a resist solution supply passage. This tube 51 has a suck back valve 53, an air operation valve 54,
A bubble removing mechanism 55 for separating and removing bubbles in the resist liquid B, a filter 56, and a bellows pump 57 are sequentially provided. The bellows pump 57 is capable of expanding and contracting under the control of the drive unit, and a predetermined amount of resist liquid B is passed through the resist liquid supply nozzle 50 to the substrate G.
It is possible to supply, for example, drip to the central part of the. It is possible to control the supply amount of the resist liquid B which is smaller than the conventional supply amount of the resist liquid B. The drive unit includes a ball screw 58 having a screw whose one end is attracted to one end of the bellows pump and a nut screwed to the screw, and a stepping motor 59 for linearly moving the screw by rotating the nut. It is composed by. Specifically, in the case of a substrate of 500 × 600 mm, the inner diameter of the resist solution supply nozzle 50 is set to φ0.5 to φ5 mm, preferably φ3 mm. In this way, by setting the diameter of the nozzle according to the size of the substrate, it is possible to supply a small amount of the resist solution B as long as possible. If the supply time is short, the film thickness is not uniform, and if it is too long, the resist solution does not reach the peripheral portion of the substrate. Here, the smallest possible amount depends on the diameter of the nozzle and the resist solution supply pressure.

In the resist liquid supply system constructed as described above, the discharge time of the resist liquid depends on the bellows pump 57.
The stepping motor 59 is controlled by the driving time (control accuracy: ± 2 msec). Further, the discharge amount of the resist liquid is set by the driving operation of the bellows pump 57, for example, the driving time and the driving speed, and the opening / closing operation (ON-OFF operation) of the air operation valve 54 for opening / closing the resist liquid supply passage. It has become. Setting of driving time of the bellows pump 57 and ON / OFF of the air operation valve 54
The operation is automatically controlled by the action of the computer based on a preset program.

The ejection time of the resist solution B is controlled by a variable orifice (not shown) provided in the resist solution supply nozzle 50.
It is also possible to perform the opening and closing operation of. Further, without using the bellows pump 57, the N
It is also possible to supply the resist solution B by pressurizing the ₂ gas, and in this case, the discharge time of the resist solution B can be controlled by adjusting the pressurizing amount of the N ₂ gas.

After sucking the resist solution from the resist solution supply nozzle 50, the suck back valve 53 provided in the resist solution supply system removes the resist solution B remaining on the inner wall of the tip of the resist solution supply nozzle 50 due to surface tension. A valve for returning the resist liquid to the inside of the resist liquid supply nozzle 50, thereby preventing solidification of the residual resist liquid. In this case, in the resist solution supply nozzle 50 that discharges a small amount of the resist solution B, when the resist solution B is pulled back into the resist solution supply nozzle 50 by the negative pressure action of the suck back valve 53 as usual, the air near the tip of the nozzle 50 is also removed. The resist solution B remaining on the tip of the nozzle 50 is also entrained in the nozzle 50, and the residue of the resist solution B enters the nozzle 50, causing the nozzle 50 to be clogged, and the dried resist becoming particles to contaminate the substrate G. In addition, there is a risk that the yield will decrease.

In order to solve this problem, as shown in FIG. 5A, the nozzle hole 50 of the resist solution supply nozzle 50 is provided.
The wall thickness 50b near the opening is made thicker than that of a. That is, the nozzle 50 has a tubular tip portion and an inverted frustoconical portion that follows the tubular tip portion. Instead, as shown in FIG. 5B, the outer flange 5 is attached to the cylindrical tip portion or opening of the resist solution supply nozzle 50.
By providing 0c, the nozzle 5
It is possible to prevent the entrapment of air near the zero tip.
Further, as shown in FIG. 5C, a small-diameter bent portion 50d extending in a lateral S shape is formed at the vertically extending cylindrical tip of the resist solution supply nozzle 50, and the center of the bent portion 50d is formed. By sucking back to the vicinity, it is possible to prevent air from being entrained in the nozzle tip portion in the same manner.

The temperature adjusting mechanism 61 (temperature adjusting means)
As shown in FIG. 6, the temperature adjusting liquid supply passage 62 is provided so as to surround the outer peripheries of the solvent supply tube 41 and the resist supply tube 51, and both ends of the temperature adjusting liquid supply passage 62 are provided at both ends. , A circulation pump 64 provided in each circulation passage 63, and a temperature adjusting liquid C connected in the middle of the circulation passage 63.
The thermo module 65 maintains a constant temperature (for example, constant temperature water). With the temperature adjusting mechanism 61 thus configured, the solvent A flowing in the solvent supply tube 41 and the resist solution B flowing in the resist supply tube 51 can be maintained at a predetermined temperature (for example, about 23 ° C.).

In FIG. 6, the solvent supply nozzle 40 and the solvent supply tube 41 are shown as well as the resist solution supply nozzle 50.
Although the resist solution supply tube 51 and the resist solution supply tube 51 are formed integrally with each other, it is also preferable to form them separately as described in detail below with reference to FIG. 7.

The nozzle head 60 is made of, for example, a stainless steel or aluminum alloy member. A U-shaped hole forming a part of the bypass passage 60b is formed on the upper surface of the jet nozzle 60, and a vertical through hole 60c extending to the lower surface of the nozzle nozzle 60 is formed at the bottom of the hole. Each through hole 60c has an inclined middle portion 60d having a larger diameter as it goes downward and a lower portion 60e having a larger diameter.
A female screw is formed on the inner peripheral surface of 0e. When the nozzles 40 and 50 are mounted on the nozzle head 60 having such a configuration, the cylindrical nozzles 40 and 50 are inserted into the through hole 60c so that the upper portion and the lower portion thereof respectively extend, and the nozzle 40, A sealing member 66 made of a substantially conical synthetic resin having a vertical through hole through which 50 can penetrate is packed in the inclined middle portion 60d, and a mounting screw member 67 having a vertical through hole through which the nozzles 40 and 50 can penetrate is screwed to the lower portion. The seal member 66 is pressed against the inclined inner peripheral surface of the middle portion 60d by being screwed into the 5c. In this way, the nozzles 40, 50
Is attached to the nozzle head 60 in a liquid-tight manner. In this case, by interposing an O-ring 68 between the upper surface of the intermediate portion 5b and the upper surface of the seal member 66 as shown in the drawing, the bypass passage 1
The watertightness between the nozzle 5 and the nozzles 40 and 50 can be further ensured.

The jet head 60 is horizontally (X and Y directions).
Is attached to the tip of a moving arm 71 that can rotate and move in the vertical direction (Z direction). The moving arm 71 is shown in FIG.
As shown in, it is arranged on the outer side of the drain cup 14,
The solvent supply nozzle 40 and the resist solution supply nozzle 50 are respectively driven by a driving means such as a stepping motor (not shown) to an operating position above the central portion of the substrate G and a nozzle standby portion 72.
It is adapted to be selectively moved to and from the upper standby position. That is, the solvent supply nozzle 40 is moved from the standby position to the center position of the substrate G, and after a predetermined time elapses, the resist solution supply nozzle 50 is moved to the center position of the substrate G, and then both nozzles 40, 50 are on standby. It is adapted to be moved to the section 72. The jet head 60, that is, the moving mechanism of the solvent supply nozzle 40 and the resist solution supply nozzle 50 does not necessarily need to be the above-described rotating moving arm 71, and for example, a linear scanning mechanism may be used.

Further, as shown in FIG. 8, the N ₂ gas supply nozzle 36 has a nozzle body 36a formed of a donut-shaped hollow pipe and an outer peripheral surface of the nozzle body 36a, which are bored at appropriate intervals. It is composed of a large number of small holes 36b provided. The N ₂ gas supply nozzle 36 configured as described above is attached to the attachment member 34 that moves up and down together with the spin chuck 10 and penetrates the fixed collar 24.
It is connected to an N ₂ gas supply source (not shown) via a ₂ gas supply tube 36c. Then, when located within the processing chamber 11 of the rises and rotary cup 12 with increasing spin chuck 10 after the rotation process, radially N ₂ gas supplied from N ₂ gas supply source into the process chamber 11 injection Then, the inside of the processing chamber 11 is purged with N _{2 and} the negative pressure state in the processing chamber 11 is released so that the lid 16 can be easily opened thereafter.

Further, the cleaning nozzle 35 attached to the attachment member 34 together with the N ₂ gas supply nozzle 36 is shown in FIG.
As shown in FIG. 9 and FIG. 9, a bottom surface cleaning nozzle body 35 a inclined toward the bottom surface of the rotating cup 12 and a side surface cleaning nozzle body 35 protruding horizontally toward the inner side surface of the rotating cup 12.
b and a lid cleaning nozzle body 35c that is inclined toward the lower surface of the lid 16. These nozzle bodies 35a
.About.35c are connected to a cleaning liquid supply source (not shown) via a cleaning liquid supply tube 36d penetrating the fixed collar 24. When the rotary cup 12 is cleaned by the cleaning nozzle 35, as shown in FIG. 9, first, after the rotation process, the spin chuck 10 is lifted to move the nozzle bodies 35 a to 35 c into the processing chamber of the rotary cup 12. 11, a rotating cup 12 for rotating the cleaning liquid supplied from the cleaning liquid supply source from the nozzle bodies 35a to 35c.
Of the resist solution adhering to the rotating cup 12 and the lid 16 by spraying the liquid toward the bottom surface, the inner side surface and the lower surface of the lid 16 (specifically, the contact portion between the lid 16 and the rotating cup 12). can do. This cleaning process may be performed periodically after processing a predetermined number of substrates G.

Next, the procedure for forming a resist film by the coating film forming apparatus having the above-mentioned structure will be described with reference to the flowchart of FIG. 10 and the explanatory view of FIG.

First, the lid 16 of the rotary cup 12 and the fixed lid 15 of the drain cup 14 are opened, and the substrate G
Is moved onto the stationary spin chuck 10 by a transfer arm (not shown), and the substrate G is held by the spin chuck 10 by vacuum suction to support the substrate G. Next, the rotation of the spin chuck 10 causes the substrate G to rotate at a lower speed than the steady rotation during processing (rotation speed: for example, 200 to 800 r
pm, acceleration: 300 to 500 rpm / sec), and the rotating cup 12 is rotated at the same speed. During this rotation, the moving arm 71 of the moving mechanism 70 moves to the standby position 7
As the solvent A of the coating liquid on the surface of the substrate from the solvent supply nozzle 40 of the jet nozzle 60 which is rotated from 2 and is moved above the center of the substrate G, for example, ethyl cellosolve acetate (EC
For example, 2) cc in A) for 20 seconds (sec)
Supply, for example, dropping (step). Alternatively, the solvent A may be dropped while the substrate G is stationary without being rotated, and then the substrate G may be rotated. After the solvent A has been supplied for 20 seconds in this way, the supply of the solvent A is stopped (step) while the spin chuck 10 and the rotary cup 12 are rotated at the low rotation speed. At this time, the solvent A is diffused and applied to the entire surface of the substrate G (see FIG. 11A).

Next, the spin chuck 10 is rotated at high speed (first rotation speed: in the range of 500 to 1500 rpm, for example, 1000 rpm, acceleration: 300 to 600 rpm).
/ Sec), and at the same time, the coating liquid, for example, the resist liquid B is supplied for 5 seconds, for example, 8 cc, from the resist liquid supply nozzle 50a moved above the central portion on the solvent film on the substrate surface (step). The time at which the solvent A is dried can be determined in advance by experiments.
For example, by visually observing the surface of the substrate G, it is not dried while the interference fringes of light are visible, and the interference fringes are not visible when dried, so the time can be known. In this case 5se
During the supply period between c, the driving time of the bellows pump 57 described above can be controlled, and the supply amount of the resist solution can be accurately and delicately controlled. After the resist solution B is supplied (dropped) for 5 seconds in this way, the supply of the resist solution B is stopped and at the same time, the rotations of the spin chuck 10 and the rotary cup 12 are stopped (step). In this state, the resist solution B is applied in a substantially concentric circle where the corner portion Ga of the substrate G is left (see FIG. 11B). At this time, if the resist solution B is supplied to the entire area including the corner portion Ga of the substrate G, not only the resist solution B is wasted but also the mist of the resist solution B is scattered and adheres to the rotation cup 12 and the back surface of the substrate G. There is a problem that it may occur. Therefore, it is desirable that the amount of the resist liquid B is set to a necessary minimum amount that is supplied to the entire area of the substrate G with a predetermined film thickness.

Next, after stopping the supply of the resist solution B and moving the resist solution supply nozzle 50 to the standby position, the robot arm 20 moves the fixed lid body 15 and the lid body 16 above the drain cup 14 and the rotary cup 12. The substrate G is closed in the opening 12 a and the substrate G is sealed in the rotary cup 12 (step).

In this way, the spin chuck 10 and the rotary cup 12 are closed while the opening of the drain cup 14 is closed by the fixed lid 15 and the opening 12a of the rotary cup 12 is closed and closed by the lid 16. For example, 15 sec
During this period, the rotation speed is higher than the first rotation speed (second rotation speed:
Range of about 1000 to 3000 rpm, for example, 1400r
pm, acceleration: 500 rpm / sec), the resist solution B spreads over the entire surface of the substrate G and the film thickness of the resist film is adjusted (step, see FIG. 11C). The thickness of the resist film is determined by the discharge amount and time of the resist liquid B at this time. In this state, the solvent A and the resist film are not dried and are in a wet state.

In the film thickness forming step, the negative pressure associated with the rotation of the spin chuck 10 and the rotary cup 12 and the constant exhaustion at the exhaust port 14b cause air to be introduced from the air inlet 16c into the processing chamber 11. Since the flow of the air is guided to the inner wall side of the rotary cup 12 by the straightening vane 13 and discharged from the exhaust hole 12d along the inner wall,
The mist of the resist solution scattered in the processing chamber 11 is the substrate G.
It is discharged to the outside in order to prevent the mist from adhering to the abutting portion of the opening of the rotary cup 12 and the lid 16 without reattaching to the. Air also flows into the drain cup 14 from the air supply hole 15a provided in the fixed lid body 15, and the air flows along the outer wall of the rotary cup 12 to the exhaust port 14b.
Therefore, the mist discharged from the processing chamber 11 of the rotary cup 12 can be prevented from rising upward, and the mist can be prevented from adhering to the inner wall of the drain cup 14.

After the coating process is completed, the spin chuck 1
0 and the rotation of the rotating cup 12 are low speed, for example, 500 rpm
The spin chuck 10 is slightly raised while rotating the substrate G to control the attitude of the substrate G to expose the N ₂ gas supply nozzle 36 in the processing chamber 11 (step, see FIG. 9). Then, from the small hole 36b of the N ₂ gas supply nozzle 36 to the processing chamber 1
N ₂ and radially by injecting the N ₂ gas treatment chamber 11 in 1
The gas is replaced and the negative pressure state in the processing chamber 11 is released (step). Then, after stopping the rotation of the spin chuck 10 and the rotary cup 12, the robot arm 2
The lid 16 is moved to the standby position by 0, and the substrate G is taken out by the transfer arm (not shown) to complete the coating operation.

If necessary, after the substrate G is unloaded, the spin chuck 10 is lifted while the opening 12a of the rotary cup 12 is closed by the lid 16, and each nozzle body 35a of the cleaning nozzle 35. 35c is exposed in the processing chamber 11, and the cleaning liquid is jetted from each of the nozzle bodies 35a to 35c while rotating the rotary cup 12, and the bottom portion 12b of the rotary cup 12, the side wall portion 12c, the lower surface of the lid body 16 and the lid. The resist liquid and the like adhering to the contact portion between the body 16 and the rotating cup 12 are removed. This cleaning process is performed periodically after a predetermined number of substrates G have been processed.

The coating film forming apparatus according to the present invention configured as described above is used alone as a resist coating apparatus for the LCD substrate G, and is also used by being incorporated in a resist coating / developing processing system for the LCD substrate G described later. can do. The structure of a resist coating / developing system incorporating the coating film forming apparatus of the above embodiment will be described below.

The above resist coating / developing system is
As shown in FIG. 12, a loader unit 90 for loading and unloading the substrate G, a first processing unit 91 for the substrate G, and a second processing unit 92 that is continuously provided to the first processing unit 91 via a relay unit 93. It is mainly composed of and. The second processing unit 92 has a delivery unit 9
An exposure device 95 for exposing a predetermined fine pattern on the resist film can be connected via the line 4.

The loader unit 90 has a cassette 96 for accommodating an unprocessed substrate G, a cassette mounting table 98 for mounting a cassette 97 for accommodating the processed substrate G, and a cassette 96 on the cassette mounting table 98. , 97 to substrate G
Substrate loading / unloading tweezers 9 capable of moving and rotating (θ) in horizontal (X, Y) and vertical (Z) directions for loading / unloading
It is composed of 9 and 9.

The first processing section 91 is a transfer path 102 for the main arm 80 which is movable in the X, Y and Z directions and is rotatable by θ.
On one side, a brush cleaning device 120 for brush cleaning the substrate G, a jet water cleaning device 130 for cleaning the substrate G with high-pressure jet water, an adhesion treatment device 105 for hydrophobicizing the surface of the substrate G, and a substrate A cooling processing device 106 for cooling G to a predetermined temperature is arranged, and a coating processing device 107 and a coating film removing device 108, which are coating film forming devices of the present invention, are arranged on the other side of the transport path 102.

On the other hand, the second processing section 92 has a main arm 80a which is movable in the X, Y and Z directions and can be rotated by the same as the first processing section 91, and the transfer path 102a of the main arm 80a. A heat treatment device 109 that heats the substrate G before and after applying the resist solution to perform pre-baking or post-baking is arranged on one side, and a developing device 110 is arranged on the other side of the transport path 102a.

Further, the relay section 93 has a structure in which casters 93d are provided on the bottom surface of a box body 93c having a transfer table 93b on which support pins 93a for supporting the substrate G are erected. The relay unit 93 is pulled out from the first processing unit 91 and the second processing unit 92, and the first processing unit 91
Alternatively, a worker can enter the second processing section 92 to easily perform repairs and inspections.

The transfer section 94 has a cassette 111 for temporarily holding the substrate G, and the cassette 1
Transport tweezers 1 for moving the substrate G in and out of
12 and a transfer table 113 for the substrate G are provided.

In the coating / development processing system configured as described above, the unprocessed substrate G accommodated in the cassette 96 is taken out by the carry-in / take-out tweezers 99 of the loader unit 90, and then the first processing unit 91. It is delivered to the main arm 80 and then conveyed into the brush cleaning device 120. The substrate G brush-cleaned in the brush cleaning device 120 is subsequently cleaned in the jet water cleaning device 130 with high-pressure jet water. After that, the substrate G is subjected to a hydrophobic treatment by the adhesion treatment device 105 and cooled by the cooling treatment device 106, and then the coating film forming device 107 according to the present invention performs the photoresist treatment by the above-described procedure. A photosensitive film is formed by coating, and then the unnecessary resist film on the side portion of the substrate G is removed by the coating film removing device 108. Therefore, after this, when the substrate G is carried out, the resist film on the edge is removed, so that the resist does not adhere to the main arm 80. Then, after the photoresist is heated by the heat treatment device 109 to be subjected to a baking treatment, a predetermined pattern is exposed by the exposure device 95. And the substrate G after exposure
Is conveyed into the developing device 110, and after being developed with the developing solution, the developing solution is washed away with the rinse solution to complete the developing process.

The developed and processed substrate G is housed in the cassette 97 of the loader unit 90, then carried out and transferred to the next processing step.

In the above embodiment, the structure in which the solvent supply nozzle 40 is integrally provided with the resist liquid supply nozzle 50 on the nozzle head 60 has been described, but the present invention is not limited to this, and the embodiment shown in FIG. As shown in the example, the solvent may be supplied by being provided integrally with the nozzle head 46 having the rinse liquid supply nozzle 45. In this example, a common temperature adjusting mechanism 6 is used for the solvent supply path and the resist solution supply path.
1 is provided (see FIG. 14). Further, the nozzle head 60 and the moving arm 71 of the moving mechanism 70 are integrally formed, and a temperature adjusting liquid supply path 62 is formed in the nozzle head 60 and the moving arm 71, and the solvent supply tube 41 and the resist solution supply are provided in the supply path 62. A tube 51 is provided so that the temperature of the solvent A and the resist liquid B can be adjusted by the same temperature adjusting liquid C. With this configuration, the structure of the temperature adjusting mechanism 61 can be simplified, and
The solvent A and the resist solution B can be maintained at the same temperature.

The arrangement and configuration of the nozzle head 60 and the nozzles 40 and 50 are not limited to the above-mentioned example. For example, FIG.
5 to 18 may be used. The example shown in FIG. 15 is a case in which the solvent supply nozzle 40 is arranged coaxially with the outer periphery of the resist solution supply nozzle 50. For this reason, the resist solution supply nozzle 50 and the solvent supply nozzle 40 have a double pipe structure, and the tip of the solvent supply nozzle 40 is projected below the tip of the resist solution supply nozzle 50. Of course, the tip of the solvent supply nozzle 40 may be at the same level as the tip of the resist solution supply nozzle 50, or the former may be shorter. Alternatively, the resist solution supply nozzle 50 may be arranged outside the solvent supply nozzle 40. Further, as shown in FIG. 16, the resist solution supply nozzle 50 and the solvent supply nozzle 4
It is also possible to adopt a mechanism in which 0 and 0 are provided side by side and these discharge ports 69 are common.

As shown in FIG. 17, an annular solvent storage tank 60 formed in the jet nozzle 60 and having a discharge port 69 in the center.
The tip of the solvent supply nozzle 40 is inserted into the solvent inside the tank f, and the tip of the resist solution supply nozzle 50 is inserted into the tank 60f.
Alternatively, the tip of the nozzle 50 may be exposed to the atmosphere of the vaporized solvent. In this way, the solvent supply nozzle 40 is attached to the outer periphery of the tip of the resist solution supply nozzle 50.
By disposing the tip of the resist liquid supply nozzle 5
The resist adhering to 0 can be washed with a solvent, and the resist liquid can be prevented from drying.
Generation of particles due to drying of the resist solution can be prevented.

Further, as shown in FIG. 18, the solvent supply nozzle 40 is arranged in parallel along the outer periphery of the resist solution supply nozzle 50.
May be arranged, and the tip of this nozzle 40 may be branched into a plurality, in this example, four. As a result, the solvent is supplied to four locations at once. Preferably, the branch nozzle portions 40a are arranged so as to respectively correspond to the four corners of a rectangle similar to the substrate G, and the solvent is simultaneously supplied to the center of the substrate G at symmetrical positions on a diagonal line. It By doing so, the diffusion of the solvent can be made uniform to some extent on the rectangular substrate.

In the above embodiment, the lid 16 of the rotary cup 12 is moved and opened by the robot arm 20 to supply the solvent A supply nozzle 40 and the resist solution B supply nozzle 50.
Although the moving mechanism 70 moves the upper part of the substrate G above the center of the substrate G to drop the solvent A and the resist liquid B, the opening 12a of the rotary cup 12 is dropped with the lid 16 closed. It may be configured to do so. For example,
As shown in FIG. 19, the bulging head portion 18 of the lid body 16 is formed in a hollow shape, and the upper end portion thereof can be closed by the lid 18A. Then, the lid 18A is opened, the moving mechanism 70 moves the nozzle above the hollow of the bulging head 18, that is, above the center of the substrate G, and the solvent A and the resist solution B are dropped. Further, as shown in FIG. 20, the nozzle mounting member 18B is rotatably mounted to the inside of the bulging head portion 18 by the bearing 18C and the like. Then, with the opening 12a of the rotary cup 12 closed by the lid 16, the solvent A and the resist solution B are dropped onto the central portion of the substrate G from the nozzles 40 and 50 attached to the nozzle mounting member 18B. You may.

As described above, the opening 16a is formed in the lid 16.
By dropping the solvent A and the resist solution B in the closed state, the processing throughput is shortened as compared with the moving type by the moving mechanism 70, and the processing process from the dropping of the solvent A in the sealed state to the end of the coating process is performed. It can be realized. For example, a process of rotating the rotary cup 12 while supplying the resist solution B after supplying the solvent A, then stopping the supply of the resist solution B, and rotating the rotary cup 12 can be realized.

In the above embodiments, the case where the coating film forming apparatus according to the present invention is applied to the resist coating apparatus for the LCD substrate has been described. However, the coating film forming apparatus for the object to be processed such as a semiconductor wafer or a CD other than the LCD substrate. Needless to say, the present invention can also be applied to a polyimide-based coating liquid (PIQ) other than resist, a coating liquid (SOG) containing a glass agent, and the like.

[0069]

As described above, according to the present invention, after the solvent of the coating liquid is applied on one surface of the substrate and diffused, a predetermined amount of the coating liquid is applied to almost the center of the substrate. Supply,
The substrate is rotated at a first rotation speed to be diffused over one surface of the substrate, the lid is closed in the treatment container, the substrate is sealed in the treatment container, and then the treatment container and the substrate with the lid closed are Rotate at a second rotation speed higher than the rotation speed to adjust the film thickness of the coating film, so that it is possible to supply the coating liquid with an appropriate mixing ratio to the solvent and reduce the amount of the coating liquid used. Therefore, it is possible to prevent the coating liquid from flowing around to the back surface of the corner portion of the substrate. Further, it is possible to form a coating film having a uniform thickness by making the viscosity of the coating liquid uniform by the contact between the solvent and the coating liquid. Therefore, it is possible to improve the yield and the throughput.

When the processing container and the substrate are rotated at the second rotation speed, the air introduced from the center of the upper part of the processing container is flowed to the lower side along the side wall of the processing container.
The mist of the coating liquid scattered from the substrate can be eliminated without reattaching to the substrate.

Further, the air introduced from the center of the upper part of the processing container is made to flow to the lower side along the side wall of the processing container, and the air is made to flow downward from above the outside of the processing container to ensure reliability. It is possible to eliminate the mist of the coating liquid.

[Brief description of drawings]

FIG. 1 is a schematic view of a coating film forming apparatus for carrying out a coating film forming method according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the coating film forming apparatus shown in FIG.

FIG. 3 is an enlarged cross-sectional view of a main part of a coating film forming apparatus.

FIG. 4 is a partial cross-sectional perspective view showing a processing container and a lid according to the present invention.

FIG. 5 is a cross-sectional view showing different modified examples of the tip portion of the resist liquid supply nozzle according to the present invention.

FIG. 6 is an enlarged perspective view showing a nozzle head used in a coating film forming apparatus.

FIG. 7 is a cross-sectional view of a jet nozzle.

FIG. 8 is a schematic perspective view of an inert gas supply nozzle according to the present invention.

FIG. 9 is a cross-sectional view showing a usage state of the inert gas supply nozzle and the cleaning nozzle in the present invention.

FIG. 10 is a flow chart for explaining a method of forming a resist film using a coating film forming apparatus.

FIG. 11 is an explanatory diagram showing a formation state of a coating film formed by the coating film forming method of the present invention.

FIG. 12: Resist coating using a coating film forming device
It is a perspective view which shows the whole developing system roughly.

FIG. 13 is a perspective view showing a modified example of the jet nozzle.

FIG. 14 is a cross-sectional view showing a modified example of the jet nozzle.

FIG. 15 is a cross-sectional view showing another modification of the nozzle assembly of the jet nozzle.

FIG. 16 is a cross-sectional view showing still another modified example of the nozzle assembly of the jet nozzle.

FIG. 17 is a cross-sectional view showing still another modified example of the nozzle assembly of the jet nozzle.

FIG. 18 is a perspective view showing a modified example of a nozzle assembly and an LCD substrate that is a coating film forming body.

FIG. 19 is an explanatory diagram showing another example of the droplet dropping method.

FIG. 20 is a configuration diagram showing still another example of the droplet dropping method.

[Explanation of symbols]

 10 Spin Chuck (Rotating Means) 12 Rotating Cup (Processing Container) 13 Straightening Plate 14 Drain Cup (Fixed Container) 14b Exhaust Port 15 Fixed Lid 15b Air Supply Hole 16 Lid 16c Air Inlet 40 Solvent Supply Nozzle (Solvent Supply Means) ) 50 resist liquid supply nozzle (coating liquid supply means) 70 moving mechanism (moving means of solvent / coating liquid supply means) G LCD substrate (substrate) A solvent B resist liquid (coating liquid)

Front page continuation (72) Inventor Omori Den 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Kumamoto Plant

Claims (6)

[Claims] 1. A method for forming a coating film by rotating a substrate housed in a processing container together with the processing container and supplying a coating liquid onto the one surface of the substrate, wherein a solvent is applied onto the one surface of the substrate. A step of supplying a predetermined amount of the coating liquid to the substrate and rotating the substrate at a first rotation speed so as to diffuse on one surface of the substrate; and closing the lid of the processing container to process the substrate. And a step of adjusting the film thickness of the coating film by rotating the processing container and the substrate with the lid closed, at a second rotation speed higher than the first rotation speed. A method for forming a coating film, comprising: 2. The coating film forming method according to claim 1, wherein the solvent is dropped onto the central portion of the substrate to apply the coating solution, and then the coating liquid is dropped onto the central portion of the substrate to diffuse the coating liquid. Forming method. 3. A method of forming a coating film by rotating a substrate housed in a processing container together with the processing container and supplying a coating liquid onto one surface of the substrate, wherein a solvent is applied onto the one surface of the substrate. And a step of supplying a predetermined amount of the coating liquid to the substrate and rotating the substrate at a first rotation speed to diffuse on one surface of the substrate, and closing the lid of the processing container to process the substrate. Encapsulating in a container, rotating the processing container and the substrate with the lid closed at a second rotation speed higher than the first rotation speed, and introducing into the processing container from the upper center of the processing container. Flowing the generated air to the lower side along the inner wall of the processing container, and adjusting the film thickness of the coating film. 4. A method of forming a coating film by rotating a substrate housed in a processing container together with the processing container and supplying a coating liquid onto the one surface of the substrate, wherein a solvent is applied onto the one surface of the substrate. A step of supplying a predetermined amount of the coating liquid to the substrate and rotating the substrate at a first rotation speed so as to diffuse on one surface of the substrate; and closing the lid of the processing container to process the substrate. A step of encapsulating in a container, rotating the processing container and the substrate with the lid closed at a second rotation speed higher than the first rotation speed, and from the upper center of the processing container into the processing container. The step of adjusting the film thickness of the coating film while flowing the introduced air to the lower side along the inner wall of the processing container and flowing the air along the outer wall of the processing container from above the outside of the processing container. A method for forming a coating film, comprising: 5. A substrate is supported with one surface thereof facing upward, and
The substrate is rotated about an axis perpendicular to one surface of the substrate, and the rotating means is movable in the vertical direction and has a cup shape surrounding the substrate and has an exhaust hole on the bottom side thereof for rotation. A processing container that rotates together with the means, a lid that closes the opening of the processing container, and has an air inlet in the center thereof, and an air that is located below the lid and that is introduced from the air inlet. A coating film forming apparatus comprising: a rectifying plate for diffusing the liquid outward, a solvent supply means for supplying a solvent for the coating liquid to the substrate, and a coating liquid supply means for supplying the coating liquid to the substrate. . 6. A substrate is supported with one surface facing upward, and
The substrate is rotated about an axis perpendicular to one surface of the substrate, and the rotating means is movable in the vertical direction and has a cup shape surrounding the substrate and has an exhaust hole on the bottom side thereof for rotation. A processing container that rotates together with the means, a lid that closes the opening of the processing container, and has an air inlet in the center thereof, and an air that is located below the lid and that is introduced from the air inlet. A rectifying plate for diffusing outward, a fixed container that surrounds the outside of the processing container and has an exhaust port connected to the exhaust means at its lower part, and the opening of the fixed container is closed, and A fixed lid having a plurality of air supply holes on a concentric circle; a solvent supply means for supplying a solvent for the coating liquid to the substrate; and a coating liquid supply means for supplying the coating liquid to the substrate. Coating film forming apparatus.