JPH03293056A - Coating apparatus - Google Patents

Coating apparatus

Info

Publication number
JPH03293056A
JPH03293056A JP9168590A JP9168590A JPH03293056A JP H03293056 A JPH03293056 A JP H03293056A JP 9168590 A JP9168590 A JP 9168590A JP 9168590 A JP9168590 A JP 9168590A JP H03293056 A JPH03293056 A JP H03293056A
Authority
JP
Japan
Prior art keywords
cup
inner cup
opened
outer cup
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9168590A
Other languages
Japanese (ja)
Other versions
JPH0822418B2 (en
Inventor
Hirohito Sago
宏仁 佐合
Katsuhiko Kudo
工藤 勝彦
Muneo Nakayama
中山 宗雄
Michio Hashimoto
橋本 道夫
Kazuyuki Kawakami
和志 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tatsumo KK filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2091685A priority Critical patent/JPH0822418B2/en
Publication of JPH03293056A publication Critical patent/JPH03293056A/en
Publication of JPH0822418B2 publication Critical patent/JPH0822418B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To improve the yield of coated product by covering the upper open surfaces of an inner cup and an outer cup whose lower surfaces are closed and upper faces are opened with cover bodies freely openable and closeable. CONSTITUTION:The outer cup 23 receiving drain from the inner cup 22 revolved with a spinner is disposed at the outside of the inner cup 22. The inner cup 22 and the outer cup 23 are closed at their lower surfaces and opened at their upper surfaces, and the opened upper surfaces of cups 22, 23 are covered with the cover body 36 which is freely opened and closed. Thus, the coating liquid recovered temporarily in the outer cup is prevented from being scattered to the outside and floating in the air. Consequently, when the cover body is opened to take out the treated thing W, for example, the powder solidified of the coating liquid floating in the air is prevented from sticking to the surface of treated thing, and the production of defective things is prevented, so that the yield is sharply improved.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は液晶デイスプレィ(LCD)の製造工程等に用
いる塗布装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a coating device used in the manufacturing process of liquid crystal displays (LCDs) and the like.

(従来の技術) ブラウン管(CRT)に代わる表示装置として液晶デイ
スプレィか注目されている。
(Prior Art) Liquid crystal displays are attracting attention as a display device that can replace cathode ray tubes (CRTs).

液晶デイスプレィは表面に画素を構成する電極や素子を
形成した2枚のガラス基板の間に液晶を注入した構造と
なっている。そして各画素を薄膜トランジスタ(T P
 T)や金属/絶縁体/金属接合(M I M)などの
素子で駆動せしめるアクティブマトリクス方式が高画質
の画面が得られるため主流になりつつある。
A liquid crystal display has a structure in which liquid crystal is injected between two glass substrates on which electrodes and elements constituting pixels are formed. Each pixel is then connected to a thin film transistor (T P
Active matrix systems driven by elements such as T) and metal/insulator/metal junctions (MIM) are becoming mainstream because they provide high-quality screens.

そして、上記の薄膜トランジスタをガラス基板上に形成
する技術はシリコンウェハ等に集積回路を形成する半導
体製造技術をそのまま応用している。レジスト液の塗布
も一連の工程のうちの一つであり、この工程ではインナ
ーカップ内の真空チャックにガラス基板をセットして、
ガラス基板上にレジスト液を滴下し、次いでスピンナー
によって真空チャックとインナーカップを一体的に回転
せしめ遠心力によってガラス基板表面にレジスト液を均
一に塗布するようにしている。
The technique for forming the above-mentioned thin film transistor on a glass substrate is a direct application of the semiconductor manufacturing technique for forming an integrated circuit on a silicon wafer or the like. Coating the resist solution is also one of a series of steps, and in this step, the glass substrate is set on a vacuum chuck inside the inner cup.
The resist solution is dropped onto the glass substrate, and then the vacuum chuck and the inner cup are rotated together by a spinner to uniformly apply the resist solution to the surface of the glass substrate using centrifugal force.

そして、滴下した塗布液の一部は遠心力によってインナ
ーカップ内壁に飛び散る。この塗布液をそのままにして
おくと乾燥して固化し小さな破片となって被処理物の表
面に付着することとなる。
A portion of the dropped coating liquid is then scattered onto the inner wall of the inner cup due to centrifugal force. If this coating liquid is left as it is, it will dry and solidify, forming small pieces that will adhere to the surface of the object to be treated.

これを防止すべ〈従来からインナーカップの外周壁にド
レインバイブを取り付け、余分な塗布液についてはドレ
インバイブを介してアウターカップ内に排出している。
To prevent this, conventionally a drain vibrator is attached to the outer peripheral wall of the inner cup, and excess coating liquid is discharged into the outer cup via the drain vibrator.

(発明が解決しようとする課題) 上述したように従来の塗布装置にあっては、回転するイ
ンナーカップの外側に近接して回転しないアウターカッ
プを配設しているので、インナーカップとアウターカッ
プとの間において乱流が発生し、−旦アウターカップ内
に回収された塗布液が外部に吸引され霧状等となって浮
遊し、この浮遊している塗布液の粒子が被処理物表面に
付着してスポット的な欠陥を生じる。
(Problem to be Solved by the Invention) As described above, in the conventional coating device, since the non-rotating outer cup is disposed close to the outside of the rotating inner cup, the inner cup and outer cup are separated. A turbulent flow occurs between the two, and the coating liquid collected in the outer cup is sucked outside and becomes suspended in the form of mist, and particles of the floating coating liquid adhere to the surface of the workpiece. This causes spot defects.

特に液晶デイスプレィの製造にあってはガラス基板上に
多数のトランジスタを埋め込む(1平方センチ当たり5
0個以上)こととなり、このうちの1個のトランジスタ
が不良でも基板全体が不良品ということになる。これが
アクティブマトリクス方式の液晶デイスプレィの製造と
LSIなどの半導体の製造との歩留りの面における決定
的な差となっている。
Particularly in the manufacture of liquid crystal displays, a large number of transistors are embedded on a glass substrate (5 transistors per square centimeter).
0 or more transistors), and even if one of these transistors is defective, the entire board is considered defective. This is a decisive difference in yield between the manufacture of active matrix liquid crystal displays and the manufacture of semiconductors such as LSI.

(課題を解決するための手段) 上記課問題を解決すべく本発明は、スピンナーによって
回転せしめられるインナーカップの外側にインナーカッ
プからのドレインを受けるアウターカップを配置した塗
布装置において、前記インナーカップの上面のみならず
アウターカップの開放された上面をも開閉自在な蓋体で
覆うようにした。
(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a coating device in which an outer cup for receiving drain from the inner cup is disposed outside an inner cup rotated by a spinner. Not only the top surface but also the open top surface of the outer cup is covered with a lid body that can be opened and closed.

(作用) インナーカップ内の真空チャック上にガラス基板等の板
状被処理物をセットし、この板状被処理物の表面に塗布
液を滴下し、次いでインナーカップ上面及びアウターカ
ップ上面を蓋体で閉塞した状態で真空チャックとインナ
ーカップを一体的に回転せしめ、板状被処理物の表面に
滴下した塗布液を均一に拡散せしめる。
(Function) A plate-shaped object to be processed, such as a glass substrate, is set on the vacuum chuck in the inner cup, and the coating liquid is dripped onto the surface of this plate-shaped object, and then the upper surface of the inner cup and the upper surface of the outer cup are attached to the lid. The vacuum chuck and inner cup are rotated together in the closed state, and the coating liquid dropped onto the surface of the plate-shaped object is uniformly dispersed.

(実施例) 以下に本発明の実施例を添付図面に基づいて説明する。(Example) Embodiments of the present invention will be described below based on the accompanying drawings.

第1図は本発明に係る塗布装置を組み込んだ被膜形成ラ
インの平面図、第2図は同塗布装置の蓋体を上げた状態
の断面図、第3図は同塗布装置の蓋体を閉じた状態の断
面図であり、被膜形成ラインは最上流部(第1図におい
て左端)にガラス基板等の板状被処理物Wの投入部1を
設け、この投入部1の下流側に本発明に係る塗布装置2
を配置し、この塗布装置2の下流側に順次、減圧乾燥装
置3、被処理物Wの裏面洗浄袋Wt4及びホットプレー
ト5a・・・を備えた加熱部5を配置し、投入部1から
加熱部5に至るまでは搬送装置6によって被処理物Wの
前後端の下面を支持した状態で搬送し、加熱部5におい
ては垂直面内でクランク動をなす搬送装!!7により被
処理物Wの下面を支持した状態で各ホットプレート5a
上を順次移し換えるようにしつつ被処理物Wを搬送する
ようにしている。
Fig. 1 is a plan view of a film forming line incorporating the coating device according to the present invention, Fig. 2 is a sectional view of the coating device with the lid lifted, and Fig. 3 is a cross-sectional view of the coating device with the lid closed. 1, the film forming line is provided with an input part 1 for a plate-shaped workpiece W such as a glass substrate at the most upstream part (the left end in FIG. 1), and the film forming line according to the present invention Coating device 2 related to
A heating section 5 equipped with a vacuum drying device 3, a back cleaning bag Wt4 for the workpiece W, and a hot plate 5a, etc. is arranged downstream of the coating device 2 in order, and heating is carried out from the input section 1. Up to the heating section 5, the workpiece W is transported with the lower surfaces of the front and rear ends supported by the transport device 6, and in the heating section 5, the transport device makes a crank movement within a vertical plane! ! Each hot plate 5a is in a state where the lower surface of the workpiece W is supported by
The workpiece W is conveyed while the top is transferred one after another.

次に塗布装置2の詳細について第2図及び第3図に基づ
いて説明する。
Next, details of the coating device 2 will be explained based on FIGS. 2 and 3.

塗布装置2はスピンナー装置の軸21に取り付けられた
インナーカップ22の外側にアウターカップ23を固設
している。これらインナーカップ22及びアウターカッ
プ23は下面を閉じ上面を開放し、インナーカップ22
内の中央部には被処理物Wを吸着固定する真空チャック
24を設け、更にインナーカップ22の側壁下部にはド
レインバイブ25を取り付けている。また、アウターカ
ップ23内にはドレイン回収リング26を配置している
。このドレイン回収リング26は内側壁を外側壁よりも
低くして前記トレインバイブ25の先端を臨ませ且つ底
壁を一方に傾斜せしめ最も低くなった位置にドレイン回
収バイブ27を取り付けている。また、アウターカップ
23の閉じられた下面には排気口28が形成されている
The coating device 2 has an outer cup 23 fixed to the outside of an inner cup 22 attached to a shaft 21 of the spinner device. These inner cup 22 and outer cup 23 have their lower surfaces closed and their upper surfaces opened, and the inner cup 22
A vacuum chuck 24 for suctioning and fixing the workpiece W is provided at the center of the inner cup 22, and a drain vibrator 25 is attached to the lower side wall of the inner cup 22. Further, a drain recovery ring 26 is arranged inside the outer cup 23. This drain recovery ring 26 has an inner wall lower than an outer wall so that the tip of the train vibe 25 is exposed, and a bottom wall inclined to one side, and a drain recovery vibe 27 is attached at the lowest position. Further, an exhaust port 28 is formed in the closed lower surface of the outer cup 23.

一方、インナーカップ22及びアウターカップ23の上
方には第1図に示すようにアーム29.30を配置して
いる。これらアーム29.30は直線動、回転動、上下
動或いはこれらを合成した動きが可能で互いに干渉しな
いようになっている。
On the other hand, arms 29 and 30 are arranged above the inner cup 22 and the outer cup 23, as shown in FIG. These arms 29 and 30 are capable of linear movement, rotational movement, vertical movement, or a combination of these movements, and are designed not to interfere with each other.

そして、アーム29にはレジスト液等の塗布液を滴下す
るノズルを取り付け、アーム30の先端には下方に伸び
る軸31を取り付け、この軸31にベアリング32及び
磁気シール33を介してボス部34を回転自在に嵌合し
、このボス部34にインナーカップ22の上面開口を閉
塞するための円板状をなすアルミニウム製の蓋体35を
取り付けている。また、この蓋体35の上方のアーム3
0の先端下面にはアウターカップ23の上面開口を閉塞
するための蓋体36を固着している。
A nozzle for dispensing a coating liquid such as a resist liquid is attached to the arm 29, and a shaft 31 extending downward is attached to the tip of the arm 30, and a boss portion 34 is attached to this shaft 31 via a bearing 32 and a magnetic seal 33. A disc-shaped aluminum lid 35 is attached to the boss portion 34 so as to be rotatably fitted therein and for closing the upper opening of the inner cup 22 . Moreover, the arm 3 above this lid body 35
A lid 36 for closing the upper opening of the outer cup 23 is fixed to the lower surface of the tip of the outer cup 23.

また、前記軸31にはノズル孔37を穿設し、このノズ
ル孔37をジヨイント38を介してチッ素ガスなどの圧
気源につなげている。
Further, a nozzle hole 37 is bored in the shaft 31, and this nozzle hole 37 is connected to a source of pressurized air such as nitrogen gas via a joint 38.

一方、蓋体35の下面にはビス39によって整流板40
を取り付けている。この整流板40の外径寸法はインナ
ーカップ22の内径寸法よりも若干小径とされ、また蓋
体35の下面と整流板40上面との間に形成される空間
に前記ノズル孔37が開口する。
On the other hand, a rectifier plate 40 is attached to the lower surface of the lid body 35 by a screw 39.
is installed. The outer diameter of the current plate 40 is slightly smaller than the inner diameter of the inner cup 22, and the nozzle hole 37 opens in a space formed between the lower surface of the lid 35 and the upper surface of the current plate 40.

以上において、ガラス基板等の被処理物W表面にレジス
ト液を均一に塗布するには、インナーカップ22及びア
ウターカップ23の上面を開放して真空チャック24上
に固着されている被処理物Wの表面にアーム29に取り
付けられているノズルからレジスト液を滴下し、次いで
アーム29を後退せしめて第2図に示すようにインナー
カップ22及びアウターカップ23上にアーム30を回
動させて蓋体35.36を臨ませる。そして第3図に示
すように、アーム30を下降することで蓋体35により
インナーカップ22の上面を閉塞し、蓋体36によりア
ウターカップ23の上面開口を閉塞したならば、スピン
ナーによって真空チャックとインナーカップ22を一体
的に回転せしめ、遠心力によりレジスト液を被処理物W
の表面に均一に拡散塗布する。
In the above, in order to uniformly apply the resist liquid to the surface of the workpiece W such as a glass substrate, the upper surfaces of the inner cup 22 and the outer cup 23 are opened and the workpiece W fixed on the vacuum chuck 24 is opened. A resist liquid is dripped onto the surface from a nozzle attached to the arm 29, and then the arm 29 is moved back and the arm 30 is rotated over the inner cup 22 and outer cup 23 as shown in FIG. .36 is coming. Then, as shown in FIG. 3, by lowering the arm 30, the upper surface of the inner cup 22 is closed with the lid 35, and the upper surface opening of the outer cup 23 is closed with the lid 36, and then the spinner is used to remove the vacuum chuck. The inner cup 22 is rotated integrally, and the resist liquid is applied to the object W by centrifugal force.
Spread evenly over the surface.

そして、以上の処理においてインナーカップ22内は減
圧状態になっているので、レジスト液が均一に塗布され
た被処理物Wを取り出すには、先ずノズル孔37を介し
て蓋体35と整流板40の間の空間に窒素ガス等を導入
し減圧状態が解除して行う。このときノズル孔37から
のガスは整流板40があるため、被処理物W表面のレジ
スト液に直接吹き付けられることがない。
In the above process, the inside of the inner cup 22 is in a reduced pressure state, so in order to take out the object W to be processed evenly coated with the resist liquid, first the cover body 35 and the rectifying plate 4 are removed through the nozzle hole 37. This is done by introducing nitrogen gas or the like into the space between them to release the reduced pressure state. At this time, the gas from the nozzle hole 37 is not directly blown onto the resist liquid on the surface of the object W because of the rectifying plate 40 .

尚、実施例にあってはアウターカップの開口を閉じる蓋
体36をアーム30の先端下面に取り付けるようにした
が、アーム3o以外の部材に取り付けるようにしてもよ
い。
In the embodiment, the lid 36 that closes the opening of the outer cup is attached to the lower surface of the tip of the arm 30, but it may be attached to a member other than the arm 3o.

(効果) 以上に説明したように本発明によれば、塗布装置のイン
ナーカップ及びアウターカップの上面開口を蓋体で閉塞
した状態でインナーカップを回転せしめるようにしたの
で、アウターカップ内に一旦回収した塗布液が霧状にな
って外部に飛散して浮遊することが防げる。したがって
、塗布後に蓋体を開けて被処理物を取り出す際等に空気
中を浮遊している塗布液が固化した粉体が被処理物表面
に付着して欠陥品となることを防止でき歩留まりが大幅
に向上する。
(Effects) As explained above, according to the present invention, since the inner cup is rotated with the top openings of the inner cup and outer cup of the coating device being closed with the lid, the inner cup is temporarily collected in the outer cup. This prevents the applied liquid from turning into a mist and scattering and floating outside. Therefore, when the lid is opened and the workpiece is taken out after coating, the solidified powder of the coating liquid floating in the air can be prevented from adhering to the workpiece surface, resulting in defective products, and the yield can be improved. Significantly improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本・発明に係る塗布装置を組み込んだ被膜形成
ラインの平面図、第2図は同塗布装置の蓋体を上げた状
態の断面図、第3図は同塗布装置の蓋体を閉じた状態の
断面図である。 尚、図面中1は被膜形成ライン、2は塗布装置、22は
インナーカップ、23はアウターカップ、35.36は
蓋体、37はノズル孔、40は整流板、Wは板状被処理
物である。 特  許  出  願  人 同 代  理  人  弁理士 同   弁理士 同   弁理士 東京応化工業株式会社 タ ツ モ 株式会社 下  1) 容  一部 大   橋   邦   彦 小  山     有
Fig. 1 is a plan view of a film forming line incorporating the coating device according to the present invention, Fig. 2 is a sectional view of the coating device with the lid lifted, and Fig. 3 is a top view of the coating device with the lid lifted. It is a sectional view of a closed state. In the drawing, 1 is a film forming line, 2 is a coating device, 22 is an inner cup, 23 is an outer cup, 35, 36 is a lid body, 37 is a nozzle hole, 40 is a rectifier plate, and W is a plate-shaped object to be treated. be. Patent Applications Same Attorneys Same Patent Attorneys Same Patent Attorneys Tokyo Ohka Kogyo Co., Ltd. Tatsumo Co., Ltd. 1) Yoshibetsu Ohashi Kunihiko Koyama Yu

Claims (1)

【特許請求の範囲】[Claims]  スピンナーによって回転せしめられるインナーカップ
の外側にインナーカップからのドレインを受けるアウタ
ーカップを配置した塗布装置において、前記インナーカ
ップ及びアウターカップは下面を閉じるとともに上面を
開放し、これらインナーカップとアウターカップの開放
された上面を開閉自在な蓋体で覆うようにしたことを特
徴とする塗布装置。
In a coating device in which an outer cup for receiving drain from the inner cup is arranged outside an inner cup rotated by a spinner, the inner cup and the outer cup close the lower surface and open the upper surface, and the inner cup and the outer cup are opened. A coating device characterized in that the top surface of the coated coating is covered with a lid body that can be opened and closed.
JP2091685A 1990-04-06 1990-04-06 Coating device Expired - Lifetime JPH0822418B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2091685A JPH0822418B2 (en) 1990-04-06 1990-04-06 Coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2091685A JPH0822418B2 (en) 1990-04-06 1990-04-06 Coating device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP7122029A Division JPH08224527A (en) 1995-05-22 1995-05-22 Coating
JP8501597A Division JP2942213B2 (en) 1997-04-03 1997-04-03 Application method

Publications (2)

Publication Number Publication Date
JPH03293056A true JPH03293056A (en) 1991-12-24
JPH0822418B2 JPH0822418B2 (en) 1996-03-06

Family

ID=14033358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2091685A Expired - Lifetime JPH0822418B2 (en) 1990-04-06 1990-04-06 Coating device

Country Status (1)

Country Link
JP (1) JPH0822418B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255745A (en) * 1995-03-15 1996-10-01 Tokyo Electron Ltd Coating film formation and its device
US5571324A (en) * 1993-07-26 1996-11-05 Tokyo Ohka Kogyo Co., Ltd. Rotary-cup coating apparatus
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle
CN110673444A (en) * 2019-09-12 2020-01-10 中国科学院上海光学精密机械研究所 Spin coating equipment for uniformly coating photoresist on surface of super-large and overweight substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135565A (en) * 1987-11-23 1989-05-29 Tatsumo Kk Coating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135565A (en) * 1987-11-23 1989-05-29 Tatsumo Kk Coating apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571324A (en) * 1993-07-26 1996-11-05 Tokyo Ohka Kogyo Co., Ltd. Rotary-cup coating apparatus
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle
JPH08255745A (en) * 1995-03-15 1996-10-01 Tokyo Electron Ltd Coating film formation and its device
CN110673444A (en) * 2019-09-12 2020-01-10 中国科学院上海光学精密机械研究所 Spin coating equipment for uniformly coating photoresist on surface of super-large and overweight substrate

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