JP2002153799A - Coating apparatus and coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating apparatus capable of preventing the interior of the apparatus from being contaminated with the treatment liquid scattering from a substrate when the liquid is supplied to the substrate while rotating the substrate, and a coating method using the coating apparatus. SOLUTION: A resist coating unit(CT) 22 being one form of a apparatus for coating the substrate with a coating solution has a spin chuck 40 holding the substrate G almost horizontally, a cup 44b provided so as to surround the spin chuck 40 and a solvent discharge nozzle 73b for supplying the liquid to the substrate G. A liftable cover for preventing the scattering of the liquid from the substrate G is provided so as to surround the outer periphery of the cup 44b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus and a coating apparatus for forming a coating film by applying a coating liquid such as a resist liquid to a surface of a substrate such as a glass substrate for a liquid crystal display (LCD) or a semiconductor wafer. Regarding the processing method.

[Prior art]

For example, in the manufacture of a liquid crystal display (LCD), a photoresist liquid is applied to a rectangular LCD substrate made of glass to form a resist film, and the resist film is exposed in accordance with a circuit pattern. A predetermined pattern is formed by a so-called photolithography technique of performing development processing.

The formation of such a circuit pattern is performed using a resist coating and developing system in which a plurality of processing units are integrated. In such a system, first, the surface of the substrate is subjected to surface modification / cleaning treatment by ultraviolet irradiation as necessary, and then the cleaning unit performs brush cleaning and ultrasonic water cleaning. Thereafter, the substrate is subjected to a hydrophobic treatment (HMDS treatment) in an adhesion processing unit in order to enhance the stability of the resist, and subsequently, the resist is applied in a resist coating processing unit. The substrate on which the resist film is thus formed is sequentially subjected to pre-bake by a heat treatment unit, exposure of a predetermined pattern by an exposure device, development treatment by a development treatment unit, and post-bake treatment by a heat treatment unit. Is formed.

Here, the processing steps from the application of the resist to before the pre-bake will be described in more detail. First, the substrate subjected to the hydrophobic treatment is suction-held on a horizontally rotatable spin chuck, and the resist solution is applied to the stationary substrate. After the supply, the substrate is rotated, and the resist solution is diffused to the periphery by centrifugal force to form a resist film on the substrate.

At this time, the resist film formed at the peripheral portion of the substrate has an uneven thickness, and the resist often adheres to the side and back surfaces of the substrate. Since such a resist causes particles and the like to be generated in a subsequent transfer process of the substrate, and also causes a stain on the transfer device of the substrate, these resists apply a processing solution such as a thinner to a predetermined portion of the periphery of the substrate. The substrate is removed by discharging to a location and the substrate is then sent to a pre-bake process.

[0006]

However, in the method of forming a resist film by supplying a resist solution to a stationary substrate as described above, most of the resist solution is discharged to the outside without forming a film. Therefore, there is a problem that the utilization efficiency of the resist solution is low. Therefore, in order to solve this problem, for example, a method of supplying a resist solution to the substrate while rotating the substrate, or a solvent for facilitating the spread of the resist on the rotating substrate, for example, supplying a thinner, and then resist A method for supplying a liquid has been proposed.

However, when the thinner or the resist liquid is supplied while rotating the substrate, the supplied processing liquid scatters from the substrate, and the scattered processing liquid is discharged outside the cup provided so as to surround the substrate. And a new problem of soiling the processing apparatus has arisen.

The present invention has been made in view of the above circumstances, and prevents the inside of an apparatus from being contaminated by a processing liquid scattered from a substrate when the processing liquid is supplied to the substrate while rotating the substrate. It is an object of the present invention to provide a coating processing apparatus capable of performing the above-described processing and a coating processing method using the coating processing apparatus.

[0009]

That is, according to the present invention, there is provided an application processing apparatus for applying a predetermined application liquid to a substrate, comprising: holding means for holding the substrate substantially horizontally; and surrounding the holding means. , A liquid supply mechanism for supplying a coating liquid to the substrate held by the holding means, and a substrate provided to be movable up and down so as to surround the outer periphery of the cup and held by the holding means And a cover for preventing the coating liquid from scattering from the coating liquid.

Further, according to the present invention, there is provided a coating treatment apparatus for applying a predetermined coating liquid to a substrate, wherein the coating film is formed by applying the coating liquid to the substrate to form a coating film. A peripheral coating film removing unit that removes the coating liquid attached to the peripheral portion and the back surface of the formed substrate; and a substrate on which the coating film is formed is transported between the coating film forming unit and the peripheral coating film removing unit. Transport means, and an ascending and descending coating liquid scattering prevention cover disposed in the coating film forming section so that the coating liquid does not scatter from the coating film forming section to the peripheral coating film removing section. A coating treatment apparatus characterized by the above-mentioned.

According to the present invention, there is further provided, as a coating method using the above-described coating apparatus, a coating method for forming a coating film on a substrate held substantially horizontally, wherein the substrate is rotatably held. A first step of holding the holding means, and a second step of arranging a coating liquid scattering prevention cover configured to be able to move up and down so as to further surround a cup provided so as to surround the holding means at a predetermined position, A third step of supplying a predetermined processing liquid onto the substrate while rotating the substrate, a fourth step of retracting the coating liquid scattering prevention cover after the rotation of the substrate is completed, and a coating liquid on the stationary substrate. And a fifth step of closing the cup after supplying the liquid and rotating the substrate at a predetermined number of revolutions to form a coating film on the substrate.

Further, according to the present invention, there is provided a coating treatment method for forming a coating film on a substrate held substantially horizontally, comprising: a first step of holding the substrate by a rotatable holding means; A second step of disposing a coating liquid scattering prevention cover, which is configured to be able to move up and down so as to further surround the cup provided so as to surround it, at a predetermined position, and a predetermined processing liquid on the substrate while rotating the substrate. A third step of supplying a predetermined coating liquid onto the substrate while rotating the substrate to form a coating film on the substrate, and a step of preventing the coating liquid from scattering after the rotation of the substrate is completed. A coating process comprising: a fifth step of retracting the cover for use; and a sixth step of adjusting the thickness of the coating film by closing the cup and rotating the substrate at a predetermined rotation speed. Method,
Is provided.

According to the coating apparatus and the coating method, even when the processing liquid is applied while rotating the substrate, the processing liquid scattered from the substrate is prevented by the coating liquid scattering prevention cover. Since it does not reach the outside, the inside of the coating treatment apparatus is prevented from being contaminated by the treatment liquid, and the amount of the treatment liquid required for one substrate can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, an embodiment of a coating processing apparatus according to the present invention will be described below, taking as an example a resist coating / developing processing system for coating and processing a resist as a coating liquid on an LCD substrate. explain.

FIG. 1 shows a resist coating and developing system 1.
00 is a plan view of the resist coating / developing processing system 100 for mounting a cassette C containing a plurality of substrates G thereon and a series of processes including resist coating and developing on the substrates G. A processing unit 2 having a plurality of processing units, and an interface unit 3 for transferring a substrate G to and from an exposure apparatus (not shown). 1 and an interface unit 3 are arranged.

The cassette station 1 has a transport mechanism 1 for transporting the substrate G between the cassette C and the processing section 2.
0 is provided. Then, the cassette C is loaded and unloaded at the cassette station 1. Also, the transport mechanism 1
0 is a transport path 10 provided along the direction in which the cassettes are arranged.
A transfer arm 11 is provided which is movable on the substrate a. The transfer arm 11 transfers the substrate G between the cassette C and the processing unit 2.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
13 and 14. Each processing unit is arranged on both sides of these transport paths. The relay sections 15 and 16 are provided between them.

The front section 2a includes a main transfer device 17 movable along the transfer path 12, and two cleaning units (SCR) 21a and 21b are arranged on one side of the transfer path 12. On the other side of the transport path 12, a processing block 25 in which an ultraviolet irradiation unit (UV) and a cooling unit (COL) are stacked in two stages, a processing block 26 in which a heating processing unit (HP) is stacked in two stages, and Processing block 2 in which cooling units (COL) are stacked in two stages
7 are arranged.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13, and a resist coating unit (CT) 22 is provided on one side of the transfer path 13. Resist coating unit (CT) 22
Is provided with a peripheral resist removing unit (ER) 23 for removing the resist on the peripheral portion of the substrate G after the resist film is formed in the resist coating unit (CT) 22.

On the other side of the transport path 13, a processing block 28 in which a heating processing unit (HP) is stacked in two stages, a heating processing unit (HP) and a cooling processing unit (COL)
, An adhesion processing unit (AD) and a cooling unit (CO)
L) are disposed on top of each other.

Further, the rear stage 2c is provided with a main transfer device 19 which can move along the transfer path 14.
Is provided with three development processing units (DEV) 24a
24b and 24c are arranged, and on the other side of the transport path 14, a processing block 31 in which a heating processing unit (HP) is stacked in two stages, and both a heating processing unit (HP) and a cooling processing unit (COL) ) Are disposed on top of each other.

The processing section 2 has only a spinner system unit such as a cleaning unit 21a, a resist coating unit (CT) 22, and a developing unit 24a on one side of the transport path. On the other side, only a thermal processing unit such as a heating processing unit or a cooling processing unit is arranged.

A chemical solution supply unit 34 is disposed at a portion of the relay units 15 and 16 on the side where the spinner system unit is disposed, and a space 35 for performing maintenance of the main transport unit is provided.

Each of the main transporting devices 17, 18, and 19 has an X-axis driving mechanism, a Y-axis driving mechanism, and a vertical Z-axis driving mechanism in two directions in a horizontal plane, and further rotates about the Z axis. , And each has an arm for supporting the substrate G.

The main transfer device 17 has a transfer arm 17a, transfers the substrate G to and from the transfer arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from each processing unit in the former stage 2a. Has a function of transferring the substrate G to and from the relay unit 15. Further, the main transfer device 18 has a transfer arm 18a, transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to and from each processing unit in the middle unit 2b. And a function of transferring the substrate G during the transfer. Further, the main transfer device 19 has a transfer arm 19a, transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to and from the respective processing units in the rear-stage unit 2c, and further connects to the interface unit 3. And a function of transferring the substrate G during the transfer. The relay unit 1
5 and 16 also function as cooling plates.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 3 provided on both sides thereof for disposing a buffer cassette.
7 and a transport mechanism 38 for loading and unloading the substrate G between these and an exposure apparatus (not shown). Transport mechanism 3
8 is an extension 36 and a buffer stage 37
And a transfer arm 39 movable along a transfer path 38a provided along the arrangement direction. The transfer arm 39 transfers the substrate G between the processing unit 2 and the exposure apparatus.

By consolidating and integrating the processing units in this manner, space can be saved and processing efficiency can be improved.

In the resist coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing section 2, and the processing section 2 firstly emits an ultraviolet light (U) in the processing block 25 of the former stage 2a. UV) for surface modification and cleaning processing, and after cooling in the cooling processing unit (COL), scrubber cleaning is performed in the cleaning units (SCR) 21a and 21b, and any of the heat processing units in the processing block 26 After being heated and dried in (HP), it is cooled in one of the cooling units (COL) of the processing block 27.

Thereafter, the substrate G is transported to the middle section 2b,
In order to improve the fixability of the resist, the treatment block 30 is subjected to a hydrophobic treatment (HMDS treatment) in the upper adhesion processing unit (AD), and then cooled in the lower cooling processing unit (COL). Next, in the resist coating unit (CT) 22, a resist is coated on the substrate G.

In this resist coating step, as will be described later in detail, for example, before supplying the resist liquid to the substrate G, a processing liquid such as a thinner is supplied while rotating the substrate G so that the surface of the substrate G is removed. Then, the substrate G was temporarily stopped, the resist solution was supplied to the substrate G, and then the substrate G was rotated again to spread the resist solution over the entire surface of the substrate G, so that the resist film was formed. It is formed.

The resist coating unit (C)
After completion of the processing in T) 22, the substrate G is transported to the peripheral resist removing unit (ER) 23, and the resist on the peripheral edge of the substrate G is removed (hereinafter, such processing is referred to as “edge removal”). Will be Edge remove is for board G
Of removing the resist on the peripheral portion of the surface on which the resist film is formed, and removing the resist attached to the side surface of the substrate G and the back surface of the substrate G.

Thereafter, the substrate G is pre-baked in one of the heat processing units (HP) in the middle section 2b, and the lower cooling unit (CO) in the processing block 29 or 30 is processed.
L). Next, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. Then, the substrate G is again carried in via the interface unit 3 and, if necessary, the processing blocks 31.3 of the subsequent stage 2c.
After performing post-exposure bake processing in any one of the heat processing units (HP) 2 and 33, development processing is performed in any of the development processing units (DEV) 24a, 24b, and 24c to form a predetermined circuit pattern. .

The developed substrate G is subjected to post-baking in any one of the heat treatment units (HP) in the subsequent stage 2c, and then cooled in any one of the cooling units (COL) to carry out the main transfer. The paper is stored in a predetermined cassette on the cassette station 1 by the devices 19, 18, and 17 and the transport mechanism 10.

Next, the resist coating unit (CT) 22, which is an embodiment of the coating apparatus of the present invention, will be described in detail. 2 and 3 are cross-sectional views schematically showing the resist coating unit (CT) 22. FIG. 2 shows a state in which the lid 45 is attached to the lower container 44 and the liquid scattering prevention cover 8 is mounted.
FIG. 3 shows a state in which 1a to 81c are retracted above the lower container 44, and FIG. 3 lowers the liquid scattering prevention covers 81a to 81c from the retracted position shown in FIG. 5 shows a state in which the lower container 44 is surrounded by the first and second substrates, and the resist discharge nozzle 73a and the solvent discharge nozzle 73b are positioned above the substrate G. Note that FIG.
3 and FIG. 3, the cover 81a for preventing liquid scattering is not shown, and the cover 45 is omitted in FIG.

Resist coating unit (CT) 22
Has a spin chuck 40 for holding the substrate G by suction while keeping the main surface horizontal, and the spin chuck 40 is connected to the connecting rod 5.
6 allows rotation by driving a rotation drive mechanism such as a rotation motor (not shown). Therefore, the substrate G on the spin chuck 40 is also rotated by the rotation of the spin chuck 40.

The spin chuck 40 includes a lifting mechanism 4
1 so as to be able to ascend and descend so as to protrude above the upper surface of an outer cup 44b described later. In this way, the substrate G is received from the main transfer device 18 or the peripheral resist removal unit (ER) 2 which is a post-process.
3 can be easily transported. In addition, in order to transfer the substrate G, the height of the spin chuck 40 may be fixed and the lower container 44 may be moved up and down.

The chamber 43 in which the substrate G and the spin chuck 40 are to be disposed is provided with a lower container 44 and a lid 45.
The lower container 44 is composed of a rotatable inner cup 44a and a fixed outer cup 44b covering the outer peripheral side and the lower side of the inner cup 44a. Further, the lid 45 closes the inner cup 44a, and the inner lid 45a is rotatable together with the inner cup 44a.
It is composed of an outer lid 45b for closing b. The inner cup 44a is configured to be rotatable around the cylindrical body 57 by the rotation mechanism 42. The rotation mechanism 42 is a different rotation drive mechanism (not shown) different from the rotation drive mechanism for rotating the spin chuck 40. Thereby, it is possible to rotate independently of the spin chuck 40.

An outlet 5 is provided at the outer edge of the bottom of the inner cup 44a.
0 is formed, and the resist liquid scattered from the substrate G is discharged toward the outer edge of the bottom of the outer cup 44b. On the other hand, a partition plate 47 is provided on the outer cup 44b, and the partition plate 47 forms a gas flow path in the outer cup 44b, and transfers the resist solution discharged from the discharge port 50 to the bottom of the outer cup 44b. It plays the role of leading to the outer rim.

Fins 59 are provided on the outer edge of the bottom surface of the bottom surface of the inner cup 44a. The fins 59 facilitate the discharge of the resist solution and gas from the outlet 50 when the inner cup 44a is rotated. Thus, it is designed to have a shape that causes an air flow in the chamber 43. Therefore, when the inner cup 44a is rotated while the gas inlets 58a and 58b are closed, a negative pressure can be generated in the chamber 43, and the inside of the chamber 43 can be reduced in pressure. .

A drain outlet 46a is formed at the bottom outer edge of the outer cup 44b, and the resist solution discharged from the inner cup 44a and guided to the partition wall 47 is discharged to the outside from the drain outlet 46a. An exhaust port 46b is formed at the bottom of the outer cup 44b so that gas flowing into the chamber 43 is exhausted. The exhaust port 46b is configured to communicate with, for example, a weak exhaust mechanism such as a factory duct. On the contrary, since the inside of the chamber 43 becomes negative pressure by the exhaust mechanism, the gas introduction ports 58a. Gas is easily introduced into the chamber 43 from 58b.

A support member 52 is attached to the upper center of the inner lid 45a, and a locking member 61 is provided at the upper end of the support member 52. These inner lid 45a and support member 5
A gas introduction port 58a is formed so as to pass through the center of the second member 2 and the locking member 61, and the flow of gas into the chamber 43 from the gas introduction port 58a can be controlled on the locking member 61. An opening / closing device 53 having a valve 54 is provided.

A rectifying plate 51 is formed below the inner lid 45a so as to be separated from the inner lid 45a by a small distance. Therefore, as shown by the arrow in FIG. 2, the gas flowing from the gas inlet 58a is supplied to the current plate 51 and the inner lid 45a.
Flows from the discharge port 50 to the outer cup 44b, and is exhausted through the exhaust port 46b.

The gas inlet 58b formed in the upper part of the outer lid 45b can be opened and closed by the opening and closing device 55.
FIG. 2 shows the opening / closing device 55 that slides in the left-right direction, but is not limited to such a form (structure). From the gas inlet 58b to the chamber 43
The gas flowing into the inner cup 45a passes through the space between the inner lid 45a and the outer lid 45b, and is mixed with the gas discharged from the outlet 50 formed in the inner cup 44a. The air is discharged to the outside from the exhaust port 46b through the flow path.

The chamber 43 is connected to the gas inlet 58a.
The gas flowing into the inside is supplied to the resist coating unit (C
T) It is common to be the ambient gas at the location where the 22 is located, often air. However,
For example, by attaching a gas introduction pipe to the gas introduction port 58a,
In particular, it is also possible to flow in a gas or the like that is adjusted so that the content of particles is small.

A support member 52 penetrates through the center of the outer cover 45b, and the space between the support member 52 and the outer cover 45b is hermetically sealed, but these members are not fixed. Therefore, the outer lid 45b is movable in the vertical direction of the support member 52.

An annular base member 63 having a projection 65b formed on the upper surface is fixed to a support rod 62 attached to the upper surface of the outer lid 45b. Is formed so as to be fitted with the concave portion 65a formed at the bottom. In this manner, when the support rod 62 is raised by the lifting mechanism 64, the outer lid 4 is moved together with the support rod 62.
5b and the base member 63 are first raised, and the locking member 61, the support member 52, and the inner lid 45a are also raised from the time when the base member 63 and the locking member 61 are brought into contact with the protrusion 65b and the concave portion 65a. Then, the entire chamber 43 is opened.

As shown in FIG. 3, when the support rod 62 is lowered, the inner lid 45a first closes the upper opening of the inner cup 44a, and then the locking member 61 and the base member 63
, The base member 63 and the outer lid 45b descend together until the outer lid 45b closes the outer cup 44b. Thus, the state where the entire chamber 43 is closed is the state shown in FIG.

On the outside of the outer cup 44b, a support column 70 is erected, and from the support column 70, an arm 71 having a head 72 for supplying a resist solution or a solvent to the substrate G at its tip extends. ing. The head 72 shown in FIGS. 2 and 3 has a resist liquid discharge nozzle 73a for discharging a resist liquid as a coating liquid, and a solvent discharge nozzle 73b for discharging a solvent such as thinner.
A multi-system nozzle unit is configured.

The arm 71 is configured to be rotatable by a mechanism (not shown) in the support column 70, and the head 72 is used for supplying a resist solution or a solvent as shown in FIG.
Of the lower container 4 on the other hand,
4 is moved to the retracted position as shown in FIG.

The above-described resist coating unit (CT) 22 includes a peripheral resist removing unit (ER) 23.
It is possible to connect with. Therefore, hereinafter, as an example of an apparatus in which a resist coating processing unit (CT) 22 and a peripheral resist removing unit (ER) 23 are connected, liquid scattering prevention covers 81a to 81c shown in FIG.
This will be further described with reference to FIGS.

FIG. 4 shows the covers 81a-81 for preventing liquid scattering.
c is a schematic plan view of an apparatus in which a resist coating processing unit (CT) 22 provided with a peripheral edge removing unit (ER) 23 is provided in a continuous manner, and FIG.
It is a perspective view which shows schematic structure of. As shown in FIG. 4, the transfer of the substrate G from the resist coating unit (CT) 22 to the peripheral resist removal unit (ER) 23 can be performed by moving the transfer arm 96 along the guide rail 95. It has become. The configuration of the peripheral resist removal unit (ER) 23 will be described later.

The liquid scattering prevention covers 81a to 81c are not arranged in the range in which the arm 71 rotates so as not to hinder the rotation of the arm 71. It is arranged so as to surround it. The three liquid scattering prevention covers 81a to 81c are arranged to surround the outer cup 44b. When the cover is constituted by a single cover, the cover itself becomes large, so that the cover is distorted when ascending and descending. This is because consideration has been given to the fact that it becomes easy to perform a stable lifting operation. Therefore, when such a problem does not occur, a single cover may be used.

As shown in FIG. 5, the cover 8 for preventing the liquid from scattering
1a, three panels 82a to 82c are connected to form a wall surface.
c is easily detachable by fitting or the like. The panels 82a to 82c can be moved up and down by an elevating mechanism such as an air cylinder 85 attached to the panel 82a. The air cylinder 85 is fixed to a frame 89 (only a part is shown in FIG. 5) assembled above the chamber 43 so as not to hinder the elevating operation of the lid 45.

When the air cylinder 85 is operated to lower the liquid scattering prevention covers 81a to 81c from the position shown in FIG. 2 and hold the liquid at the predetermined height so as to surround the substrate G and the lower container 44, The liquid scattering prevention cover 81a disposed on the main transfer device 18 serves to prevent the processing liquid from scattering from the substrate G to the main transfer device 18 and contaminating the main transfer device 18. In addition, the liquid scattering prevention cover 81c provided on the side of the peripheral resist removal unit (ER) 23 is
The processing liquid is prevented from being scattered from the substrate G to the guide rail 95 and the transfer arm 96 disposed between the peripheral edge resist removing unit (ER) 23 and the resist coating processing unit (CT) 22 and contaminating them. Play a role. Further, the liquid scattering prevention cover 81b disposed on the outer wall side of the resist coating / developing processing system 100 includes a wall panel of the resist coating processing unit (CT) 22, a guide rail 95 and a transfer arm 96, which are separated from the substrate G by It serves to prevent contamination by the scattered processing solution.

FIG. 6 is an explanatory view showing the structure of the air cylinder 85. The advance / retreat of the piston 85a of the air cylinder 85 is performed by adjusting the amount of air / air pressure from the working air introduction / discharge ports 88a and 88b. . A local exhaust port 87 is provided at a sealing portion at one end of the air cylinder 85, and particles and the like generated in the air cylinder 85 are discharged from the local exhaust port 87. In this manner, since the particles are not discharged from the opening end of the air cylinder 85, it is possible to prevent, for example, adhesion of the particles originating from the air cylinder 85 to the substrate G being processed. The piston 85
A connecting member 85b for connecting the piston 85a and the panel 82a is provided at the end of the terminal a.

In order to stably raise and lower the panels 82a to 82c, guides 83a and 83b are attached to the frame 89, while the panel 82a has guides 83a and 83b.
a guide rods 84a
84b is attached. And the guide rod 84a
A pocket 86 is formed at a lower portion of the guide coating 84b. Particles and the like generated by friction between the guides 83a and 83b and the guide rods 84a and 84b are collected in the pocket 86 and placed in the resist coating unit (CT) 22. Difficult to spread.

Normally, clean air is supplied from above to the resist coating processing unit (CT) 22 as a downflow, so that the flow of the downflow is obstructed when the panels 82a to 82c are lowered. Need not be. Therefore, the liquid scattering prevention cover 81
In FIG. 7A, as shown in the sectional view of FIG. 7, a predetermined lower surface of the bottom of the pocket 86 formed in the panel 82a is prevented from coming into contact with the outer cup 44b when the liquid scattering prevention cover 81a is lowered. The gap is kept open. FIG. 7 shows a cover 81 for preventing liquid scattering.
It also shows an example of the position where a to 81c are lowered and held.

The liquid scattering prevention cover 81b has the same structure as the liquid scattering prevention cover 81a, and the liquid scattering prevention cover 81c has the same structure as the liquid scattering prevention cover 81a except that only one panel is provided. Having a structure. The liquid scattering prevention covers 81a to 81c are provided with interlocks for preventing the liquids from falling suddenly from the state held in the upper part of the chamber 43. Is controlled to be released.

As described above, the liquid scattering prevention cover 81
When a to 81c are arranged above the outer cup 44b, there is an advantage that the space around the outer cup 44b is widened and maintenance is easy. Further, since the liquid scattering prevention covers 81a to 81c can be arranged long in the vertical direction, the possibility of rectifying the downflow supplied to the substrate G in the vertical direction can be improved.

Subsequently, the peripheral resist removing unit (E)
The structure of R) 23 will be described. The periphery resist removal unit (ER) 23 is provided with a stage 93 for mounting the substrate G, and two alignment mechanisms 91 for positioning the substrate G are provided at two corners on the stage 93. Is provided. On each of the four sides of the substrate G, a remover head 92 for removing the resist attached to the outer edge portion, the side surface, and the back surface of the resist film formed on the substrate G from the substrate G is provided.

Each remover head 92 has a substantially U-shaped cross section so as to discharge a solvent such as a thinner from the inside.
Move along the four sides. Therefore, the remover head 92 can remove the resist on the periphery of the four sides of the substrate G while discharging the thinner along each side of the substrate G and suctioning the discharged thinner and the dissolved resist. . After the edge remove processing, the substrate G is sent to the heat processing unit (HP) using the main transfer device 18 (see FIG. 1).

As described above, the resist coating unit (CT) 22 and the peripheral resist removing unit (ER) 23
When the resist coating unit (C
Since the substrate G can be transported to the adjacent peripheral resist removal unit (ER) 23 after the processing in T) 22, the moving time of the substrate G can be shortened. Also,
As compared with the case where the application of the resist and the edge removal processing are configured by independent units, the space and the size of the apparatus can be reduced.

Next, a method of forming a resist film using the resist coating unit (CT) 22 configured as described above will be described. FIG. 8 is a flowchart schematically illustrating the steps described below. First, as shown in FIG. 3, the lid 45 is raised to open the chamber 43 (the lower container 44), the spin chuck 40 is raised, and the substrate G is transferred from the main transfer device 18 onto the spin chuck 40. And fixed (ST1). At this time, the arm 71 is retracted so that the head 72 is located outside the outer cup 44b in FIG.

Subsequently, the spin chuck 40 to which the substrate G is fixed is accommodated in the inner cup 44a, and the arm 71 is rotated so that the head 72 is located at the center of the substrate G in FIG. Then, the head 72 is positioned above the central portion of the substrate G, and the covers 81a to
The liquid scattering prevention covers 81a to 81c are lowered from the upper standby position so that the liquid scattering prevention covers 81a to 81c are held at a predetermined position so that the lower container 44 surrounds the lower container 44 (ST2). Then, the spin chuck 40 (substrate G) is rotated at a predetermined first rotation speed,
For example, a solvent such as a thinner is supplied to the substrate G from the solvent discharge nozzle 73b, and a pre-wet process is performed (ST3).

By this pre-wetting process, the wettability between the resist solution to be supplied next and the substrate G is improved, so that the diffusion of the resist solution occurs uniformly over the entire surface of the substrate G, and It is possible to reduce the amount of resist solution to be used. Further, since the thinner is supplied in a state where the substrate G is rotated, the thinner may scatter from the substrate G beyond the outer cup 44b to the outside thereof.
1c prevents the thinner from scattering, for example,
Peripheral resist removal unit (ER) 23 and main transport unit 1
8 is prevented from being attached to the thinner.

The above-described pre-wet processing is completed by stopping the rotation of the substrate G. However, by stopping the rotation of the substrate G, the thinner does not scatter from the substrate G to the outer periphery of the outer cup 44b. After the rotation is completed, the liquid scattering prevention covers 81a to 81c are raised and held, and return to the standby state (ST4). The head 72 moves from ST3 to ST4.
During this period, after the rotation of the substrate G is stopped, the resist liquid is supplied to the substrate G from the resist liquid discharge nozzle 73a after the rotation of the substrate G is stopped, and after the supply of the resist liquid is completed. Rotates the arm 71 to move the head 72 to the retracted position, and rotates the substrate G and the spin chuck 40 at a second rotation speed higher than the first rotation speed, for example, at a rotation speed of about 1500 rpm (ST
5). Due to the centrifugal force generated in this way, the resist liquid is diffused toward the outer periphery, and a resist film is formed on the substrate G.

At this time, the chamber 43 is not in a closed state, but the resist solution is filled with the outer cup 44b as in the pre-wet process for supplying the thinner to the rotating substrate G.
The resist liquid that has not scattered outside and is scattered on the outer periphery of the substrate G is guided to a lower portion of the outer cup 44b through the discharge port 50, and is discharged outside through the drain discharge port 46a.

The resist G is supplied to the substrate G for a predetermined time.
Is rotated, the rotation of the substrate G is once stopped, and then the lid 45 is lowered, so that the inner cup 44a and the outer cup 44b are closed by the inner lid 45a and the outer lid 45b, respectively. Is larger than the first rotational speed and the second
The third rotation speed smaller than the rotation speed of, for example, 1340r
pm to adjust the thickness of the resist film (ST
6). At this time, for example, the gas inlets 58a
With b open, gas is introduced into the chamber 43.

When adjusting the film thickness of the resist film, the inner cup 44a is closed by the inner lid 45a, so that it is possible to prevent the generation of airflow which adversely affects the film pressure adjustment. Is achieved. Also,
Since the current plate 51 is provided on the inner lid 45a,
Since the gas flowing from the gas inlet 58a does not directly hit the substrate G, it does not adversely affect the resist film. Further, the inflowing gas is caused to flow between the current plate 51 and the inner lid 45 a in the outer peripheral direction, and is discharged from the outlet 50 to the outer cup 4.
4b, an airflow is positively formed near the periphery of the substrate G where the resist film thickness tends to change, and the dry state of that portion is controlled. Thus, the thickness of the peripheral portion of the substrate G is controlled, and the uniformity of the thickness of the resist film is improved.

When the thickness of the resist film becomes uniform, the number of rotations of the substrate G is reduced or stopped to such an extent that the thickness of the resist film does not change, and the gas inlet 58a is closed to allow the gas to flow through the inner cup. The inner cup 44a is prevented from being introduced into the processing chamber formed by the inner cup 44a and the inner lid 45a.
a and the inner lid 45a are rotated at a predetermined rotational speed, for example, 1340 rpm.
m (ST7).

In the initial stage of rotation of the inner cup 44a and the inner lid 45a, it is preferable that the gas inlet 58b is opened. The gas introduced into the outer cup 44b from the gas inlet 58b prevents turbulence between the rotating inner cup 44a and the fixed outer cup 44b, thereby enabling smooth exhaust. Become. Then, by closing the gas inlet 58b, the fins 59 provided on the outer edge of the lower surface of the bottom of the inner cup 44a function to discharge the gas remaining in the chamber 43 to the outside. Generate negative pressure. By reducing the pressure in the chamber 43 in this manner, evaporation of volatile components in the resist film is promoted, and the resist film can be dried in a reduced pressure atmosphere.

After the drying process for a predetermined time is completed, the rotation of the inner cup 44a is stopped, the lid 45 is raised, and the substrate G is transported to the peripheral resist removing unit 23 (S
T8). In the peripheral resist removing unit 23, edge removal is performed on the substrate G, and after completion, the substrate G is transported to the heat treatment unit.

In the above-described method for forming a resist film, the rotation of the substrate G is stopped at the time of application of the resist solution. However, following the pre-wet process, the resist solution is removed while the substrate G is rotated. It is also possible to adopt a method of forming a resist film by supplying the resist to the substrate G. In this case, when the resist liquid is supplied to the substrate G, by keeping the liquid scattering prevention covers 81a to 81c in a lowered state, the resist liquid can be removed from the peripheral resist removing unit (ER). Spattering to 23 etc. is prevented. When the resist liquid is supplied while the substrate G is rotated, the amount of the resist liquid used can be reduced, and the resist liquid can be used efficiently. In order to adjust the thickness of the formed resist film, the liquid scattering prevention covers 81a to 81c may be raised in parallel with the operation of closing the lower container 44 with the lid 45, and returned to the standby position.

In the above-described method for forming a resist film, the chamber 43 is closed in ST6. However, it is not limited that the chamber 43 is closed in ST5 and the subsequent processing may be performed with the chamber 43 closed. Needless to say, it is possible to prevent the resist from scattering to the outside of the chamber 43 in this manner.

The resist coating unit (C
In T) 22, the case in which the liquid scattering prevention covers 81a to 81c are arranged above the outer cup 44b has been described. Scattering may be prevented. In this case, the raising and lowering mechanism of the liquid scattering prevention cover can be arranged below the processing surface of the substrate G, so that the possibility that particles generated by the raising and lowering mechanism reach the substrate G and adhere thereto is reduced. it can.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, the coating film is not limited to a resist film, and can be used for forming various functional films such as a dye film and an insulating film. Further, the coating processing apparatus of the present invention is suitably used for a coating / developing system of a color resist for a color filter on an LCD substrate or a resist coating / developing processing system for processing a semiconductor wafer. Furthermore, although an LCD substrate has been described as a substrate, other substrates such as a semiconductor wafer and a CD substrate can be used.

[0077]

As described above, according to the present invention, when a processing liquid is supplied onto a substrate while rotating the substrate, the processing liquid scattered from the substrate is prevented from scattering by the coating liquid scattering prevention cover. Because it does not extend beyond the cover,
The inside of the coating treatment apparatus is prevented from being stained by the treatment liquid. Further, even when the elevating mechanism for the coating liquid scattering prevention cover is provided above the substrate, particles are prevented from adhering to the substrate because the evacuation mechanism is provided at an appropriate position. Thus, since the inside of the coating apparatus can be kept clean, the present invention has an effect of reducing the load of the cleaning maintenance in the coating apparatus while maintaining the quality of the substrate high. Further, when the processing liquid is supplied to the substrate while rotating the substrate, the amount of the processing liquid required for one substrate can be reduced, and the manufacturing cost can be reduced. Is obtained.
Further, by adopting a structure in which the coating liquid scattering prevention cover is raised and lowered while waiting above, there is an advantage that the coating liquid scattering prevention cover can be easily disposed even in a coating processing apparatus having no conventional coating liquid scattering prevention cover. Have. Furthermore, since it does not affect the arrangement of various mechanisms disposed further around equipment such as a cup surrounding the outer periphery of the substrate, a space-saving design without increasing the size of the coating processing apparatus is possible. is there.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist coating / developing processing system provided with a resist coating processing unit as one embodiment of a coating processing apparatus of the present invention.

FIG. 2 is a sectional view showing a resist coating unit.

FIG. 3 is another sectional view showing a resist coating unit.

FIG. 4 is a plan view showing an apparatus in which a resist coating unit and a peripheral resist removing unit are connected in series.

FIG. 5 is a perspective view showing an embodiment of a liquid scattering prevention cover.

FIG. 6 is a cross-sectional view showing a structure of an air cylinder used for a liquid scattering prevention cover.

FIG. 7 is a sectional view showing a position where the liquid scattering prevention cover is lowered and held.

FIG. 8 is an explanatory view showing a method of forming a resist film using a resist coating unit.

[Explanation of symbols]

 22; resist coating unit 23; peripheral resist removing unit 40; spin chuck 44; lower container 45; lids 81a to 81c; liquid scattering prevention covers 82a to 82c; Air cylinder 100; resist coating and developing unit G; substrate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B05D 3/00 B05D 3/00 A H01L 21/027 H01L 21/30 564C (72) Inventor Yoichi Honda Kumamoto 4F0term AC64 AC84 AC86 CA47 DA08 DB14 DC22 EA45 4F041 AA06 AB01 BA05 BA59 4F042 AA07 CC07 EB06 EB23 EB28 5F046 JA05

Claims (11)

[Claims] 1. A coating apparatus for applying a predetermined coating liquid to a substrate, comprising: holding means for holding the substrate substantially horizontally; a cup provided so as to surround the holding means; A liquid supply mechanism for supplying the coating liquid to the held substrate; and a coating liquid scatterer provided to be movable up and down so as to surround an outer periphery of the cup, and for preventing the coating liquid from scattering from the substrate held by the holding means. A coating treatment apparatus comprising: a prevention cover; 2. The coating apparatus according to claim 1, wherein the coating liquid scattering prevention cover is moved up and down by an elevating mechanism arranged on a frame formed above the holding means. 3. The coating apparatus according to claim 2, wherein a local exhaust mechanism is provided in the elevating mechanism to prevent dust from being generated from the elevating mechanism. 4. The method according to claim 1, wherein the coating liquid scattering prevention cover is arranged so that an outer periphery of the cup is surrounded by combining a plurality of panels, and an elevating mechanism is provided for each of the plurality of panels. Claims 1 to 3 characterized in that:
The coating treatment device according to any one of the above. 5. The coating liquid scattering prevention cover according to claim 1, wherein said coating liquid scattering prevention cover is not disposed in a range in which said liquid supply mechanism is movable on an outer periphery of said cup. The coating treatment apparatus according to any one of the above items. 6. The apparatus according to claim 1, wherein the coating liquid scattering prevention cover is held so as to surround the cup at a position where a predetermined gap is formed between the coating liquid and the cup. Item 6. The coating treatment apparatus according to any one of Items 5. 7. The coating liquid according to claim 1, wherein the coating liquid scattering prevention cover has a structure that does not cover the upper part of the substrate held in the cup. Coating equipment. 8. The coating liquid scattering prevention cover is disposed at a lowered position so as to surround the cup in a step of applying the coating liquid to the substrate while rotating the substrate. Any one of items 1 to 7
The coating treatment apparatus according to any one of the above items. 9. A coating processing apparatus for applying a predetermined coating liquid to a substrate, wherein the coating liquid is applied to the substrate to form a coating film, and a periphery of the substrate on which the coating film is formed. A peripheral coating film removing unit that removes a coating liquid attached to the unit and the back surface; a transport unit that transports a substrate on which a coating film is formed between the coating film forming unit and the peripheral coating film removing unit; A coating liquid scattering prevention cover disposed on the coating film forming section so as to prevent the coating liquid from scattering from the film forming section to the peripheral coating film removing section. apparatus. 10. A coating method for forming a coating film on a substrate held substantially horizontally, comprising: a first step of holding the substrate on a rotatable holding means; and a step of surrounding the holding means. A second step of disposing a coating liquid scattering prevention cover configured to be movable up and down so as to further surround the cup, and supplying a predetermined processing liquid onto the substrate while rotating the substrate. A fourth step of retracting the coating liquid scattering prevention cover after the rotation of the substrate is completed, and closing the cup after supplying the coating liquid to the stationary substrate, and rotating the substrate at a predetermined rotation speed. And a fifth step of forming a coating film on the substrate. 11. A coating method for forming a coating film on a substrate held substantially horizontally, comprising: a first step of holding the substrate on a rotatable holding means; and a step of surrounding the holding means. A second step of disposing a coating liquid scattering prevention cover configured to be movable up and down so as to further surround the cup, and supplying a predetermined processing liquid onto the substrate while rotating the substrate. A fourth step of supplying a predetermined coating liquid onto the substrate while rotating the substrate to form a coating film on the substrate; and a step of retracting the coating liquid scattering prevention cover after the rotation of the substrate is completed. A coating method, comprising: five steps; and a sixth step of adjusting the thickness of the coating film by closing the cup and rotating the substrate at a predetermined rotation speed.