JPH05114554A - Processing device - Google Patents

Processing device

Info

Publication number
JPH05114554A
JPH05114554A JP30245191A JP30245191A JPH05114554A JP H05114554 A JPH05114554 A JP H05114554A JP 30245191 A JP30245191 A JP 30245191A JP 30245191 A JP30245191 A JP 30245191A JP H05114554 A JPH05114554 A JP H05114554A
Authority
JP
Japan
Prior art keywords
substrate
container
processed
processing liquid
rotary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30245191A
Other languages
Japanese (ja)
Other versions
JP2906783B2 (en
Inventor
Tsutae Omori
伝 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP30245191A priority Critical patent/JP2906783B2/en
Publication of JPH05114554A publication Critical patent/JPH05114554A/en
Application granted granted Critical
Publication of JP2906783B2 publication Critical patent/JP2906783B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To apply a processing liquid in a uniform thickness by suppressing the disturbance of an air current at the time of rotationally applying the liquid. CONSTITUTION:In this processing device which applies a processing liquid 5 to a plate-like object 12 to be processed, a rotary holding means 14 which supports the object 12 formed to a polygonal shape other than circles and a processing liquid supplying means 16 which is positioned above the means 14 and supplies the processing liquid 5 are provided. In addition, a rotary container 18 which contains the object 12 and rotates together with the object 12 and an exhausting means which sets the distance between the opened end section 18a of the container 18 and periphery of the object 12 so that the distance can become the same along the outer peripheral direction of the object 12 and, at the same time, discharges the air contained in the container 18 are also provided. Then the air contained in the container 18 is discharged without allowing the air to be disturbed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、処理装置に関する。FIELD OF THE INVENTION The present invention relates to a processing apparatus.

【0002】[0002]

【従来の技術】一般、LCD(液晶ディスプレイ)装置
の製造工程においては、ITO(Indium Tin
Oxcide)薄膜や電極パターン等の微細パターン
を形成するために、フォトレジスト塗布工程から露光・
現像に至る一連の写真製版工程を含むリソグラフィ技術
が用いられている。そして、フォトレジストを塗布する
コーティング装置としては、例えば図4に示す装置が知
られている。
2. Description of the Related Art Generally, in a manufacturing process of an LCD (liquid crystal display) device, ITO (Indium Tin) is used.
Oxide) In order to form a fine pattern such as a thin film or an electrode pattern, exposure from the photoresist coating process is performed.
Lithography technology is used, which includes a series of photoengraving steps leading to development. As a coating device for applying photoresist, for example, the device shown in FIG. 4 is known.

【0003】図5は従来のコーティング装置の概略斜視
図を示し、長方形乃至矩形状に成形された比較的大面積
のLCD基板2は、中央部に回転可能に設けられたチャ
ッキング4の上端部に真空チャックにより吸引保持され
ており、この基板2は、その上部開口部が円形になされ
た内側容器6の開口部近傍に収容されて、フォトレジス
トを遠心力を利用して拡散塗布する際に、上記基板2と
一体的に回転し得るように構成されている。このように
矩形状のLCD基板を回転コーティングすると、この矩
形状の基板の内接円に相当する部分には非常に優れた厚
さの均一な膜を形成するが、それ以外の周辺部には不均
一膜を形成する傾向となり、この不均一性をなくすため
に回転時に生じる気流の乱れを極力低減させる目的で、
上記のように内側容器6を基板2と伴に回転させるので
ある。また、内側容器6内の雰囲気はその下部より吸引
排気されている。そして、この内側容器6の外側には、
上方を開放してこの全体を被うように外側容器8が固定
させて設けられている。また、他の従来装置として特開
昭57−63166号公報に示すように、被処理体基板
よりも面積の大きい回転ヘッドを設けると共に、この上
面に凹部状の基板収容部を形成して、回転塗布時に正方
形または矩形状基板の上面に空気の乱流が発生すること
を防止した装置が知られている。
FIG. 5 is a schematic perspective view of a conventional coating apparatus. A relatively large area LCD substrate 2 formed in a rectangular shape or a rectangular shape has an upper end portion of a chucking 4 rotatably provided in the central portion. The substrate 2 is sucked and held by a vacuum chuck, and the substrate 2 is housed in the vicinity of the opening of the inner container 6 whose upper opening is circular, and is used when the photoresist is applied by diffusion using centrifugal force. It is configured so that it can rotate integrally with the substrate 2. When a rectangular LCD substrate is spin-coated as described above, a very uniform and uniform film is formed on a portion corresponding to the inscribed circle of the rectangular substrate, but on the other peripheral portions. It tends to form a non-uniform film, and in order to eliminate this non-uniformity, the turbulence of the air flow that occurs during rotation is reduced as much as possible,
As described above, the inner container 6 is rotated together with the substrate 2. The atmosphere inside the inner container 6 is sucked and exhausted from the lower part. And on the outside of this inner container 6,
An outer container 8 is fixedly provided so as to open the upper part and cover the whole. Further, as another conventional apparatus, as shown in Japanese Patent Application Laid-Open No. 57-63166, a rotary head having a larger area than the substrate to be processed is provided, and a concave substrate accommodating portion is formed on the upper surface of the rotary head to rotate the substrate. An apparatus is known in which turbulent air flow is prevented from occurring on the upper surface of a square or rectangular substrate during coating.

【0004】[0004]

【発明が解決しようとする課題】ところで、上記した図
5に示す従来のコーティング装置にあっては、回転時に
生じる気流の乱れを抑制するために内側容器6とLCD
基板2とを一体的に回転させるようにしているにもかか
わらず、LCD基板2が矩形状であるのに対して内側容
器6の開口部形状が円形であるので、この基板2の周縁
部と内側容器6の開口端部との間の距離が基板2の周縁
部の個々のポイントで異なり、これがために回転時に気
流の乱れが生じてフォトレジストのはね返り、すなわち
スプラッシュバックが誘発され、歩留りが低下するとい
う改善点を有していた。
By the way, in the above-mentioned conventional coating apparatus shown in FIG. 5, the inner container 6 and the LCD are suppressed in order to suppress the turbulence of the air flow generated during rotation.
Although the LCD substrate 2 has a rectangular shape, the opening of the inner container 6 has a circular shape even though the substrate 2 is integrally rotated. The distance from the open end of the inner container 6 is different at each point on the peripheral edge of the substrate 2, and this causes turbulence of the air flow during rotation, causing splashing of the photoresist, that is, splashback, and yield. It had the improvement point of decreasing.

【0005】上記したフォトレジストのスプラッシュバ
ックの問題は、LCD基板2の寸法が小さい場合にはほ
とんど目立たず問題とはならなかったが、技術革新と伴
にLCD基板が例えば縦横300×400mmと大型化
してきた状況下においては、無視し得なくなり、上記し
た問題点の解決が強く望まれている。また、上記公報に
示される従来装置にあっては、被処理体の上面が回転ヘ
ッドの上面からほとんど突出していないとはいえ、この
装置の周辺部の気流の変化による影響を受けてしまい、
完全に乱流の発生を阻止することは困難である。本発明
は、以上のような問題点に着目し、これを有効に解決す
べく創案されたものである。本発明の目的は、回転塗布
時における気流の乱れを抑制して処理液を均一の厚さに
塗布することができる処理装置を提供することにある。
The above-mentioned photoresist splashback problem was hardly noticeable when the size of the LCD substrate 2 was small, but it did not become a problem, but along with technological innovation, the LCD substrate is large, for example, 300 × 400 mm in length and width. Under such a situation, it cannot be ignored and it is strongly desired to solve the above-mentioned problems. Further, in the conventional device shown in the above publication, although the upper surface of the object to be processed hardly projects from the upper surface of the rotary head, it is affected by the change in the air flow in the peripheral portion of the device,
It is difficult to completely prevent the generation of turbulence. The present invention has been made to pay attention to the above problems and to solve them effectively. An object of the present invention is to provide a processing apparatus that can suppress the turbulence of the air flow during spin coating and can apply the processing liquid to a uniform thickness.

【0006】[0006]

【課題を解決するための手段】本発明は、上記問題点を
解決するために、円形以外の多角形状に成形された平板
状の被処理体を回転可能に保持する回転保持手段と、前
記回転保持手段により保持された前記被処理体の表面に
処理液を供給する処理液供給手段と、前記回転保持手段
に保持された前記被処理体を収容しつつ、この被処理体
の周縁部との間の距離がその外周方向に沿って実質的に
同一になる開口端部を有して前記被処理体と一体的に回
転する回転容器と、前記回転容器内の雰囲気を排気する
排気手段とを備えるように構成したものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a rotation holding means for rotatably holding a flat object to be processed formed in a polygonal shape other than a circular shape, and the rotation holding means. Between the processing liquid supply means for supplying the processing liquid to the surface of the object to be processed held by the holding means, and the peripheral portion of the object to be processed while accommodating the object to be processed held by the rotation holding means. A rotary container having an open end portion in which the distance therebetween is substantially the same along the outer peripheral direction thereof and rotating integrally with the object to be processed; and an exhaust means for exhausting an atmosphere in the rotary container. It is configured to be equipped.

【0007】[0007]

【作用】本発明は、以上のように構成したので、多角形
状に成形された平板状の被処理体は回転保持手段に保持
され、この状態で被処理体は回転容器内で一体的に回転
しつつ被処理液供給手段から供給された被処理液を遠心
力により拡散させて基板表面に処理液を塗布する。この
回転塗布時に回転容器内はその下部より排気手段により
吸引排気され、そして、回転容器の開口部の形状は基板
の形状より僅かに大きい相似形状になされているので、
上記被処理体の周縁部と回転容器の開口端部との間の距
離は被処理体の周縁部のどのポイントにおいてもほぼ同
じに設定されており、従って、これらの回転時に気流に
乱れがほとんど生じることがなく、処理液のはね返りを
抑制することが可能となる。
Since the present invention is configured as described above, the polygonal shaped flat plate-shaped object is held by the rotation holding means, and in this state, the object is integrally rotated in the rotary container. At the same time, the to-be-processed liquid supplied from the to-be-processed liquid supply means is diffused by the centrifugal force to apply the processing liquid onto the substrate surface. At the time of this spin coating, the inside of the rotary container is sucked and evacuated from its lower portion by the exhaust means, and the shape of the opening of the rotary container is a shape slightly larger than the shape of the substrate.
The distance between the peripheral edge of the object to be processed and the opening end of the rotary container is set to be substantially the same at any point on the peripheral edge of the object to be processed, and therefore, the air flow is hardly disturbed during these rotations. It does not occur, and it is possible to suppress the rebound of the processing liquid.

【0008】[0008]

【実施例】以下に、本発明に係る処理装置の一実施例を
添付図面に基づいて詳述する。図1は本発明に係る処理
装置を示す部分破断平面図、図2は図1に示す装置の断
面図、図3は図1に示す装置の概略斜視図、図4はフォ
トレジスト塗布装置等が搭載された処理装置集合ユニッ
トを示す斜視図である。図示するように本実施例におい
ては処理装置としてフォトレジスト塗布装置10が示さ
れており、円形以外の多角形状に成形された平板状の被
処理体として4角形状のLCD基板12に処理液として
フォトレジストを塗布する場合について説明する。図4
に示すようにこのフォトレジスト塗布装置10は、全体
が開閉可能なケースに被われて処理装置集合ユニット7
0に搭載されており、この集合ユニット70には他の関
連装置として、キャリアステーション72側より被処理
体としてのLCD基板をブラシ洗浄するための一対のブ
ラシスクラバ74、74、このブラシ洗浄の後に高圧ジ
ェット水により洗浄を施すための一対の高圧ジェット洗
浄機76、76、LCD基板を加熱するために複数のホ
ットプレート機78、LCD基板にフォトレジストを塗
布する前にこれを疎水化処理するアドヒュージョン処理
機80及びフォトレジスト塗布後のエッジ部の不要なフ
ォトレジストを除去するエッジリムーバ82等が設けら
れている。上記各装置間にLCD基板を搬送して受け渡
しを行うために、この集合ユニット70の中央部には、
爪を有した一対のメインアーム84、84がユニット長
手方向に沿って移動可能に設けられている。このフォト
レジスト塗布装置10は、上記LCD基板12を回転可
能に保持する回転保持手段14と、上記基板12の表面
にフォトレジストを供給する処理液供給手段16と、上
記基板12を収容しつつこれと一体的に回転する回転容
器18と、この回転容器18内の雰囲気を排気する排気
手段20とにより主に構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the processing apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. 1 is a partially cutaway plan view showing a processing apparatus according to the present invention, FIG. 2 is a sectional view of the apparatus shown in FIG. 1, FIG. 3 is a schematic perspective view of the apparatus shown in FIG. 1, and FIG. It is a perspective view which shows the mounted processing apparatus collective unit. As shown in the figure, in this embodiment, a photoresist coating apparatus 10 is shown as a processing apparatus, and a rectangular liquid crystal substrate 12 is used as a processing liquid as a flat object to be processed formed in a polygonal shape other than a circular shape. The case of applying a photoresist will be described. Figure 4
As shown in FIG. 3, the photoresist coating apparatus 10 is covered with a case that can be opened and closed as a whole, and the processing apparatus assembly unit 7
0 is mounted on the collecting unit 70 as another related device, and a pair of brush scrubbers 74 and 74 for brush-cleaning the LCD substrate as the object to be processed from the carrier station 72 side, after this brush cleaning. A pair of high-pressure jet cleaners 76, 76 for cleaning with high-pressure jet water, a plurality of hot plate machines 78 for heating the LCD substrate, and a hydrophobic treatment for applying photoresist to the LCD substrate. A fusion processor 80 and an edge remover 82 for removing unnecessary photoresist in the edge portion after the photoresist is applied are provided. In order to convey and transfer the LCD substrate between the above-mentioned devices, the central portion of the collecting unit 70 has
A pair of main arms 84, 84 having claws are provided so as to be movable along the unit longitudinal direction. The photoresist coating apparatus 10 includes a rotation holding means 14 for rotatably holding the LCD substrate 12, a processing liquid supplying means 16 for supplying a photoresist to the surface of the substrate 12, and a housing liquid for accommodating the substrate 12. The rotary container 18 that rotates integrally with the rotary container 18 and an exhaust unit 20 that exhausts the atmosphere in the rotary container 18 are mainly configured.

【0009】具体的には、上記回転保持手段14は真空
チャックにより上記基板12を吸引保持するチャッキン
グ22を有しており、このチャッキング22は軸受24
により回転可能に支持された回転軸26の先端部に取付
けられている。この回転軸26は、図示しないタイミン
グベルト等を介してモータに連結されると共に、上下方
向にアップダウン可能になされており、アップした時に
上記基板12の受け渡しを行うことになる。このチャッ
キング22に吸引保持される基板12は、前述のように
4角形乃至矩形状に成形されており、例えば縦横300
×400mm程度の比較的大きな面積を有する。そし
て、上記チャッキング22の中心点の上方に処理液とし
てフォトレジストを基板上に供給する上記処理液供給手
段16が、横方向へ移動可能に設けられる。
Specifically, the rotation holding means 14 has a chucking 22 for sucking and holding the substrate 12 by a vacuum chuck, and the chucking 22 has a bearing 24.
Is attached to the tip of a rotary shaft 26 that is rotatably supported by. The rotary shaft 26 is connected to a motor via a timing belt (not shown) and can be moved up and down in the vertical direction. When the rotary shaft 26 is moved up, the substrate 12 is delivered. The substrate 12 sucked and held by the chucking 22 is formed into a rectangular shape or a rectangular shape as described above.
It has a relatively large area of about 400 mm. Then, above the center point of the chucking 22, the processing liquid supply means 16 for supplying a photoresist as a processing liquid onto the substrate is provided so as to be movable in the lateral direction.

【0010】また、上記チャッキング22の下部の回転
軸26には、上記基板12の下面全体をこれより僅かに
離間させて被うように円板上のカバー部材28が取付け
固定されており、その周縁部は下方向に屈曲されて気体
案内壁30を構成している。更に、上記回転容器18
は、上方が開口された有底円筒体状の容器のように成形
されており、その内部に上記基板12、チャッキング2
2及びカバー部材28を収容すると共に、その底部32
の中心部は上記回転軸26を貫通させて取付け固定され
ており、上記基板12等と一体的に回転し得るように構
成されている。この回転容器18の上部開口部34の形
状は、上記矩形状の基板12よりも僅かに大きい相似形
の矩形状になされており、従って、基板12の周縁部と
回転容器18の開口端部18aとの間の距離は基板周縁
部の各ポイントにおいてほとんど全て実質的に同一にな
るように設定されている。
A disc-shaped cover member 28 is attached and fixed to the rotary shaft 26 below the chucking 22 so as to cover the entire lower surface of the substrate 12 with a slight distance therebetween. The peripheral portion is bent downward to form a gas guide wall 30. Further, the rotating container 18
Is shaped like a bottomed cylindrical container having an open top, and the inside of the substrate 12 and the chucking 2
2 and the cover member 28, and a bottom portion 32 thereof.
The central portion of is attached and fixed through the rotary shaft 26 so that it can rotate integrally with the substrate 12 and the like. The shape of the upper opening 34 of the rotary container 18 is a similar rectangular shape slightly larger than the rectangular substrate 12, and therefore the peripheral edge of the substrate 12 and the open end 18a of the rotary container 18 are formed. The distances between and are set to be substantially the same at each point on the peripheral portion of the substrate.

【0011】具体的には、上記チャッキング22への基
板装着時においては、基板12は回転容器18の開口端
部18aより僅かに下方に位置するように設置され、本
実施例においてはこの開口部18aと基板周縁部との間
の水平距離L2は6mm程度、また垂直距離L3は7m
m程度となるように基板の全周に渡って略同一値となる
ように設定される。また、この回転容器18の底部32
の周辺部には、回転により振り切られたフォトレジスト
のドレン及び回転容器18内の雰囲気を通過させるため
の通気孔36がその周方向に沿って所定の間隔を隔てて
多数形成されている。更に、このように形成された回転
容器18の全体は、上部が開口された有底筒体状の外側
固定容器38により適宜距離だけ離間させて被われてお
り、その中心部は軸受ケース40に固定されている。
Specifically, when the substrate is mounted on the chucking 22, the substrate 12 is installed so as to be located slightly below the opening end 18a of the rotary container 18, and in this embodiment, the opening is provided. The horizontal distance L2 between the portion 18a and the substrate peripheral portion is about 6 mm, and the vertical distance L3 is 7 m.
The value is set to be approximately the same value over the entire circumference of the substrate so as to be about m. In addition, the bottom 32 of the rotary container 18
A large number of ventilation holes 36 for passing the drain of the photoresist shaken off by rotation and the atmosphere in the rotary container 18 are formed at predetermined intervals along the circumferential direction in the peripheral portion of the. Further, the entire rotary container 18 formed in this manner is covered by an outer fixed container 38 having a cylindrical shape with a bottom and an open top, and is separated by an appropriate distance. It is fixed.

【0012】この外側固定容器38の上部開口部42
は、上記回転容器18の開口部34よりも大きくなされ
た円形状に成形されている。また、この外側固定容器3
8の底部44であって、上記回転容器18の底部の通気
孔36の下方に対応する部分には、断面凹状に成形され
たドレン溜め46がその周方向に沿って形成されてい
る。そして、このドレン溜め46には、本実施例におい
ては2つのドレン抜き口48が形成されると共にこれら
ドレン抜き口48にはドレン管50が接続されており、
振り切られたフォトレジストのドレンを排出し得るよう
に構成されている。更に、上記ドレン溜め46の内側の
底部44には、本実施例にあっては2つの排気口52が
回転軸26に対して点対称で設けられると共に、これら
排気口52には図示しない真空ポンプを介設した排気管
54が接続されており、上記回転容器18内の雰囲気を
底部32に設けた通気孔36を介して装置外へ吸引排出
し得るように構成されている。
The upper opening 42 of the outer fixed container 38
Is formed into a circular shape larger than the opening 34 of the rotary container 18. Also, this outer fixed container 3
A drain reservoir 46 having a concave cross section is formed in the bottom portion 44 of the rotary container 18 corresponding to the lower portion of the ventilation hole 36 along the circumferential direction. In this embodiment, two drain outlets 48 are formed in the drain reservoir 46, and a drain pipe 50 is connected to the drain outlets 48.
The drain of the photoresist which has been shaken off can be discharged. Further, in the present embodiment, the bottom 44 inside the drain reservoir 46 is provided with two exhaust ports 52 in point symmetry with respect to the rotating shaft 26, and these exhaust ports 52 have a vacuum pump (not shown). Is connected to the exhaust pipe 54 so that the atmosphere in the rotary container 18 can be sucked and discharged to the outside of the apparatus through the vent hole 36 provided in the bottom portion 32.

【0013】次に、以上のように構成された本実施例の
動作について説明する。まず、前段の工程で処理された
LCD基板12は、処理装置集合ユニット70のキャリ
アステーション72からメインアーム84により保持さ
れてブラシスクラバ74内へ搬入され、この中でブラシ
洗浄を行う。更に、この基板は高圧ジェット洗浄機76
にて高圧ジェット水により洗浄され、ホットプレート機
78により乾燥される。その後、基板はアドヒュージョ
ン処理機80にて疎水化処理が施された後に、本発明に
係るフォトレジスト塗布装置10へ導入される。まず、
回転保持手段14のチャッキング22を上方へ移動させ
た状態で図示しないアームのような自動搬送装置により
LCD基板12を上記チャッキング22上に載置し、こ
れを吸引保持する。そして、このチャッキング22を図
示するように所定の位置まで降下させる。次に、回転軸
26を回転することにより、これに固定されている回転
容器18とチャッキング22に吸引されているLCD基
板12とを一体的に回転すると共に、この基板12上に
処理液供給手段16から所定量のフォトレジスト5を吐
出供給してこれを遠心力により基板12の表面全体に渡
って拡散させ、フォトレジストの薄膜を塗布する。
Next, the operation of this embodiment configured as described above will be described. First, the LCD substrate 12 processed in the previous step is held by the main arm 84 from the carrier station 72 of the processing device assembly unit 70 and carried into the brush scrubber 74, where brush cleaning is performed. In addition, this substrate is a high pressure jet cleaner 76
At high temperature, it is washed with high-pressure jet water and dried by a hot plate machine 78. After that, the substrate is subjected to a hydrophobizing treatment by the adfusion processor 80 and then introduced into the photoresist coating apparatus 10 according to the present invention. First,
The LCD substrate 12 is placed on the chucking 22 by an automatic transfer device such as an arm (not shown) while the chucking 22 of the rotation holding means 14 is moved upward, and the LCD substrate 12 is suction-held. Then, the chucking 22 is lowered to a predetermined position as illustrated. Next, by rotating the rotary shaft 26, the rotary container 18 fixed to the rotary shaft 18 and the LCD substrate 12 sucked by the chucking 22 are integrally rotated, and the processing liquid is supplied onto the substrate 12. A predetermined amount of photoresist 5 is discharged and supplied from the means 16, and this is diffused by the centrifugal force over the entire surface of the substrate 12 to apply a thin film of photoresist.

【0014】一方、この間にすでに排気手段20は駆動
されて上記回転容器18の回転時におけるこの中の雰囲
気は矢印55に示すように回転容器の底部32に設けた
多数の通気孔36及び排気管54を介して排出されてお
り、従って、回転容器18の開口部34から容器18内
に流入する空気は回転する基板12の中心からこの全周
縁部に向けて流れて行く。特に、本実施例おいては、L
CD基板12の周縁部と回転容器18の開口端部18a
との間の距離が、基板12の周縁部の全周に渡って略同
一になされているので、気流は回転する基板12の中心
部から周縁部へ放射状に流れて行き、しかもこの開口端
部18aと基板周縁部との間の間隙を通って排出される
気流には乱れが生ずることなく層流となって排気される
ことになる。従って、基板12の周縁部にて気流の乱れ
が生じないので、フォトレジストのはね返り、すなわち
スプラッシュバックも発生することがなく基板12の4
角近傍においても均一厚さの薄膜を形成することが可能
となる。従って、ミストの発生を抑制することができ、
歩留りが低下することを阻止することが可能となる。
On the other hand, during this time, the exhaust means 20 is already driven so that the atmosphere in the rotary container 18 when it is rotated has a large number of vent holes 36 and exhaust pipes provided in the bottom 32 of the rotary container as indicated by an arrow 55. The air that has been discharged through 54, and therefore flows from the opening 34 of the rotary container 18 into the container 18 flows from the center of the rotating substrate 12 toward this entire peripheral edge. In particular, in this embodiment, L
The peripheral edge of the CD substrate 12 and the open end 18a of the rotary container 18
Since the distance between and is substantially the same over the entire circumference of the peripheral edge of the substrate 12, the air flow radially flows from the central portion of the rotating substrate 12 to the peripheral edge, and the opening end portion The air flow discharged through the gap between 18a and the peripheral edge of the substrate is discharged as a laminar flow without any turbulence. Therefore, since the air flow is not disturbed at the peripheral edge of the substrate 12, the splashing of the photoresist, that is, the splashback does not occur, and the 4
It is possible to form a thin film having a uniform thickness even in the vicinity of a corner. Therefore, it is possible to suppress the generation of mist,
It is possible to prevent the yield from decreasing.

【0015】特に、本実施例においては、LCD基板1
2を1500rpmの速度で回転した状態でドライアイ
スによる煙で気流の流れを観察したところ、気流は基板
12から周縁部に向けて放射状に真っすぐに流れて行
き、乱流が全く生じなかったし、また、スプラッシュバ
ックによるフォトレジストのはね返りも観察されなかっ
た。また、回転容器18内の雰囲気が通過する通気孔3
6は、この底部32の周方向に沿って均一に設けてある
ので、回転容器18内の雰囲気は均一に外側固定容器3
8側へ排出され、この点よりも排出される気流に乱れを
生ずることを防止することができる。また、基板12の
回転により振り切られたフォトレジストは回転容器18
の側壁を流下して上記通気孔36を介して外側固定容器
38の凹部状のドレン溜め46に溜り、このドレンはド
レン管50を介して抜き取られることになる。
In particular, in this embodiment, the LCD substrate 1
When 2 was rotated at a speed of 1500 rpm and the flow of the air flow was observed with smoke from dry ice, the air flow was directed radially straight from the substrate 12 toward the peripheral edge, and no turbulence was generated. In addition, splashing of the photoresist due to splashback was not observed. Further, the vent hole 3 through which the atmosphere in the rotary container 18 passes.
6 are evenly provided along the circumferential direction of the bottom portion 32, so that the atmosphere in the rotary container 18 is even.
It is possible to prevent turbulence from occurring in the air flow discharged to the side of 8 and from this point. Further, the photoresist shaken off by the rotation of the substrate 12 is stored in the rotation container 18
Flows down the side wall of the drainage container and collects in the recessed drain reservoir 46 of the outer fixed container 38 through the vent hole 36, and this drainage is extracted through the drain pipe 50.

【0016】上記実施例にあっては、基板12の周縁部
と回転容器18の開口端部42との間の距離を水平距離
6mm、垂直距離7mmに設定したが、この値に限定さ
れず、基板12の大きさ、或いは基板12の回転速度等
に応じて適宜変更し得るのは勿論である。また、基板1
2の形状も4角形に限定されず、3角形、5角形等の円
形以外の多角形に全て適用することができる。また更
に、上記実施例にあっては、本発明をフォトレジスト塗
布装置に適用した場合について説明したが、基板に処理
液を塗布するような構造であればどのような装置にも適
用することができる。
In the above embodiment, the distance between the peripheral edge of the substrate 12 and the open end 42 of the rotary container 18 was set to a horizontal distance of 6 mm and a vertical distance of 7 mm, but the present invention is not limited to these values. Needless to say, the size can be appropriately changed according to the size of the substrate 12 or the rotation speed of the substrate 12. Also, the substrate 1
The shape of 2 is not limited to a quadrangle, and can be applied to any polygon other than a circle such as a triangle and a pentagon. Furthermore, in the above embodiments, the case where the present invention is applied to the photoresist coating apparatus has been described, but the present invention can be applied to any apparatus as long as it has a structure for coating the substrate with the processing liquid. it can.

【0017】[0017]

【発明の効果】以上説明したように、本発明によれば次
のような優れた作用効果を発揮することができる。被処
理体の周縁部と回転容器の開口端部との間の距離をその
周方向に沿って同一になるように設定したので、排気さ
れる気流に乱れが発生することを確実に阻止することが
できる。従って、気流の乱れによる処理液のはね返りが
なく、スプラッシュバックの発生を抑制して歩留りを大
幅に向上させることができる。
As described above, according to the present invention, the following excellent operational effects can be exhibited. Since the distance between the peripheral edge of the object to be processed and the opening end of the rotary container is set to be the same along the circumferential direction, it is possible to reliably prevent turbulence from occurring in the exhausted airflow. You can Therefore, the treatment liquid does not splash due to the turbulence of the air flow, and the occurrence of splashback can be suppressed and the yield can be significantly improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る処理装置を示す部分破断平面図で
ある。
FIG. 1 is a partially cutaway plan view showing a processing apparatus according to the present invention.

【図2】図1に示す装置の断面図である。2 is a cross-sectional view of the device shown in FIG.

【図3】図1に示す装置の概略斜視図である。3 is a schematic perspective view of the device shown in FIG. 1. FIG.

【図4】フォトレジスト塗布装置等が搭載された処理装
置集合ユニットを示す斜視図である。
FIG. 4 is a perspective view showing a processing device assembly unit in which a photoresist coating device and the like are mounted.

【図5】従来の処理装置を示す概略斜視図である。FIG. 5 is a schematic perspective view showing a conventional processing apparatus.

【符号の説明】[Explanation of symbols]

2,12 LCD基板(被処理体) 5 フォトレジスト(処理液) 10 フォトレジスト塗布装置(処理装置) 14 回転保持手段 16 処理液供給装置 18 回転容器 18a 開口端部 20 排気手段 36 通気孔 38 外側固定容器 46 ドレン溜め 50 ドレン管 54 排気管 70 処理装置集合ユニット 74 ブラシスクラバ 76 高圧ジェット洗浄機 78 ホットプレート機 80 アドヒュージョン処理機 2, 12 LCD substrate (object to be treated) 5 Photoresist (treatment liquid) 10 Photoresist coating device (treatment device) 14 Rotation holding means 16 Treatment liquid supply device 18 Rotating container 18a Open end 20 Exhaust means 36 Vent hole 38 Outside Fixed container 46 Drain reservoir 50 Drain pipe 54 Exhaust pipe 70 Processing device collective unit 74 Brush scrubber 76 High pressure jet cleaning machine 78 Hot plate machine 80 Adfusion processing machine

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 円形以外の多角形状に成形された平板状
の被処理体を回転可能に保持する回転保持手段と、前記
回転保持手段により保持された前記被処理体の表面に処
理液を供給する処理液供給手段と、前記回転保持手段に
保持された前記被処理体を収容しつつ、この被処理体の
周縁部との間の距離がその外周方向に沿って実質的に同
一になる開口端部を有して前記被処理体と一体的に回転
する回転容器と、前記回転容器内の雰囲気を排気する排
気手段とを備えるように構成したことを特徴とする処理
装置。
1. A rotation holding means for rotatably holding a flat object to be processed formed in a polygonal shape other than a circular shape, and a treatment liquid supplied to the surface of the object to be processed held by the rotation holding means. An opening in which the distance between the processing liquid supply means for storing the object to be processed held by the rotation holding means and the peripheral portion of the object to be processed is substantially the same along the outer peripheral direction thereof. A processing apparatus comprising: a rotary container having an end portion that rotates integrally with the object to be processed; and an exhaust unit that exhausts an atmosphere in the rotary container.
JP30245191A 1991-10-22 1991-10-22 Processing equipment Expired - Fee Related JP2906783B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30245191A JP2906783B2 (en) 1991-10-22 1991-10-22 Processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30245191A JP2906783B2 (en) 1991-10-22 1991-10-22 Processing equipment

Publications (2)

Publication Number Publication Date
JPH05114554A true JPH05114554A (en) 1993-05-07
JP2906783B2 JP2906783B2 (en) 1999-06-21

Family

ID=17909097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30245191A Expired - Fee Related JP2906783B2 (en) 1991-10-22 1991-10-22 Processing equipment

Country Status (1)

Country Link
JP (1) JP2906783B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255745A (en) * 1995-03-15 1996-10-01 Tokyo Electron Ltd Coating film formation and its device
US5591264A (en) * 1994-03-22 1997-01-07 Sony Corporation Spin coating device
JP2001113218A (en) * 1993-08-31 2001-04-24 Dainippon Screen Mfg Co Ltd Apparatus and method for coating treatment liquid
US7531039B2 (en) 2002-09-25 2009-05-12 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001113218A (en) * 1993-08-31 2001-04-24 Dainippon Screen Mfg Co Ltd Apparatus and method for coating treatment liquid
US5591264A (en) * 1994-03-22 1997-01-07 Sony Corporation Spin coating device
JPH08255745A (en) * 1995-03-15 1996-10-01 Tokyo Electron Ltd Coating film formation and its device
US7531039B2 (en) 2002-09-25 2009-05-12 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing system

Also Published As

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JP2906783B2 (en) 1999-06-21

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