JP3126878B2 - Substrate backside cleaning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backside cleaning apparatus for cleaning a backside of a substrate by rotating a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display while discharging a cleaning liquid from below onto the backside.

[0002]

2. Description of the Related Art As a conventional apparatus for cleaning the backside of a substrate of this type, there is, for example, one disclosed in Japanese Patent Publication No. 5-1972. This device will be described with reference to FIGS.

[0003] This apparatus comprises a support rotating means 10 provided with a spin chuck for sucking and supporting a substrate W in a substantially horizontal posture and rotating the substrate W, and from below the substrate W supported by the support rotating means, in a vertical direction. A discharge means 20 for discharging the cleaning liquid upward at a predetermined angle and a photoresist liquid discharge nozzle 30 for discharging the photoresist liquid from above the rotation center of the substrate W are provided (FIG. 11A). In the following description, the discharge angle of the cleaning liquid is expressed by an angle θ ₁ with respect to a horizontal plane, and this angle θ ₁ is defined as a jet angle. The discharge unit 20 is disposed at two locations facing each other with the support rotation unit 10 interposed therebetween, and its discharge direction in a plan view (FIG. 11).
(B)), with a predetermined angle θ ₂ (spouting direction) in the direction of rotation (counterclockwise) of the rotation of the substrate W with respect to a line connecting the two discharge means 20 through the substrate rotation center. ing.

In this type of substrate back surface cleaning apparatus, first, the substrate W is supported by the supporting and rotating means 10 and driven to rotate at a predetermined rotation speed. And the photoresist liquid discharge nozzle 3
A predetermined amount of photoresist liquid is discharged from 0. Further, by rotating the substrate W for a predetermined time, excess photoresist liquid is shaken off, and a photoresist film having a predetermined thickness is formed on the surface of the substrate W. At this time, the photoresist liquid discharged onto the front surface of the substrate W wraps around and adheres to the end surface of the substrate W (including the end surface when the orientation flat is formed), and further, the back surface of the substrate W Excess photoresist solution may flow to the periphery. Further, on the back surface of the substrate W, a mist that has been shaken off and becomes mist-like is attached to the substrate W. These adhered photoresist liquids become cured films in the same manner as the substrate surface by the subsequent curing treatment, but cause inconveniences such as peeling off in the subsequent substrate transporting step or photolithography step and causing generation of particles.

Therefore, usually, after the photoresist liquid is rotated and shaken, the discharging means 20 is applied to the back surface of the substrate W.
The cleaning liquid is discharged from the substrate W, and the back surface of the substrate W excluding the spin chuck portion of the support rotation unit 10 is covered with the cleaning liquid to prevent mist from adhering, or to prevent surplus photoresist liquid from flowing around the substrate end surface and the back surface, So-called back rinsing, in which the attached photoresist solution and its mist are washed away, is performed.

[0006]

The number of rotations of the supporting and rotating means 10 when discharging or shaking off the photoresist liquid on the substrate W depends on the thickness of the photoresist film formed on the surface of the substrate W. Need to be variable. For example, when a thin film thickness is required, the substrate W
The photoresist liquid is discharged while rotating the substrate, and when a thick film is required, the photoresist liquid is discharged while rotating the substrate W at a low rotation speed. In such a case, the discharging means 2
Since the jetting direction θ ₂ , which is the direction in which the cleaning liquid is discharged from 0, is fixed, the trajectory of the cleaning liquid flowing on the back surface of the substrate W fluctuates according to the number of rotations of the support rotation unit 10.

On the back surface of the substrate W, the larger the area to be cleaned by the cleaning liquid, the better. However, when the cleaning liquid reaches the support rotating means 10 such as a spin chuck, the cleaning liquid enters the suction path of the support rotating means 10. Therefore, there is a disadvantage that the packing or the like is deteriorated or a trace of the spin chuck is left on the back surface of the substrate W. Therefore, it is desirable that the cleaning liquid can be spread as close to the spin chuck as possible within a range that does not wet the support rotating unit 10. It is. Normally, in a portion where the cleaning liquid discharged from the discharging unit 20 reaches the back surface of the substrate W,
A part of the cleaning liquid travels on the back surface of the substrate W toward the center of rotation against the centrifugal force according to the discharge pressure of the cleaning liquid. Schematically, as shown in FIG. 12A when the rotation speed is low, and as shown in FIG. 12B when the rotation speed is high. In this case, the distance between the spin chuck and the washing of the support rotating means 10 when the rotation speed is low and d _1, the distance between the case where the rotational speed is higher and d _2, the magnitude relationship d ₁ <d ₂
Becomes Therefore, when back rinsing is performed at the time of discharging the photoresist liquid, the range of the back surface of the substrate W that can be cleaned with the cleaning liquid varies depending on the number of rotations of the support rotation unit 10. That is, when the number of rotations is high (the cleaning liquid flows to the outer periphery due to centrifugal force and does not reach the vicinity of the spin chuck), the range that can be cleaned by back rinsing is narrower than when the number of rotations is low. is there.

In the case where the photoresist solution is discharged onto the substrate W and back rinse is performed after the excess photoresist solution is shaken off, the mist adheres to the back surface of the substrate W,
The degree of adhesion of the photoresist solution to the end face of the substrate W,
It is necessary to adjust the number of rotations of the support rotating means 10 when performing back rinsing, depending on the degree of the photoresist solution wrapping around the back surface. However, for the above reason, there is a problem that the cleaning range is narrower when the rotation speed is high than when the rotation speed is low.

The present invention has been made in view of such circumstances, and a substrate back surface cleaning apparatus capable of easily adjusting the jetting direction of the cleaning liquid and cleaning a wide area of the rear surface of the substrate. The purpose is to provide.

[0010]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is an apparatus for cleaning a back surface of a substrate by discharging a cleaning liquid from below onto the back surface while rotating the substrate, and supporting and rotating the substrate in a substantially horizontal posture. Means, discharge means for discharging the cleaning liquid to the back surface of the substrate at a predetermined angle obliquely upward from the lower side of the supported substrate with respect to the vertical direction, and the discharge direction of the cleaning liquid from the discharge means. Setting means for setting rotatable about a vertical axis.

According to a second aspect of the present invention, there is provided an apparatus for cleaning a back surface of a substrate by rotating the substrate and discharging a cleaning liquid from below onto the back surface thereof. Supporting rotating means, a member to be mounted disposed below the supported substrate, a discharge pipe provided in a vertical posture on the mounted member, and a discharge pipe formed at a tip end of the discharge pipe with respect to a vertical direction. A nozzle portion for discharging the cleaning liquid upward at a predetermined angle, a large-diameter portion formed at a lower portion of the discharge tube, and the support member capable of holding the large-diameter portion and rotating the discharge tube around a vertical axis. Mounting means for mounting on the
It is characterized by having.

[0012]

The operation of the present invention is as follows. According to the first aspect of the present invention, the cleaning liquid is discharged from below the substrate supported by the support rotating means by the discharging means. This discharge means is provided on the substrate at a predetermined angle obliquely upward with respect to the vertical direction.
Since the cleaning liquid is discharged to the back surface of the substrate, the cleaning liquid flowing on the back surface of the substrate and reaching the end surface of the substrate flows upward. Thereby, the photoresist liquid adhering to the substrate end surface is removed.
Further, the discharge means is set by the setting means such that the discharge direction of the cleaning liquid is rotatable around the vertical axis, so that the discharge direction can be easily adjusted. Therefore, the discharge direction of the discharge unit can be adjusted according to conditions such as the rotation speed of the support rotation unit.

According to a second aspect of the present invention, the cleaning liquid is discharged from a lower portion of the substrate supported by the support rotating means by a discharge pipe.
The discharge pipe discharges the cleaning liquid upward at a predetermined angle from the nozzle formed at the tip of the discharge pipe, so that the cleaning liquid flowing on the back surface of the substrate and reaching the end face of the substrate flows upward. Thereby, the photoresist liquid adhering to the substrate end surface is removed. Further, the discharge pipe is
Since the large diameter portion formed at the lower portion is attached to the attached member so as to be rotatable around the vertical axis by holding the large diameter portion with the attaching means, it is possible to easily adjust the discharge direction from the nozzle portion at the tip portion thereof. it can. Therefore, the discharge direction of the discharge unit can be adjusted according to conditions such as the rotation speed of the support rotation unit.

[0014]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a rotary substrate processing apparatus as an example of a substrate back surface cleaning apparatus. FIG. 2 is an enlarged view of a main part of FIG.

In FIG. 1, reference numeral 10 denotes a suction-type spin chuck, which sucks and supports a substrate W in a substantially horizontal posture. The suction type spin chuck 10 is driven to rotate by a rotation motor 12 via a hollow rotation shaft 11. The direction of the rotation drive is counterclockwise in plan view. Further, around the suction type spin chuck 10, a scattering prevention cup 13 for preventing scattering of the photoresist liquid and the cleaning liquid is provided. When the transport means (not shown) places the unprocessed substrate W on the suction-type spin chuck 10 or receives the processed substrate W from the suction-type spin chuck 10, the elevating means (not shown) prevents the rotation shaft 11 from scattering. The suction-type spin chuck 10 is moved up and down relative to the cup 13.
Is moved above the scattering prevention cup 13 (two-dot chain line in the figure). Further, the opening 14a of the scattering prevention cup 13
Above (to be described later) and substantially above the center of rotation of the substrate W, a discharge nozzle 30 for discharging a photoresist liquid is provided.
Is located. In addition, the suction type spin chuck 10 and
The rotation shaft 11 and the rotation motor 12 correspond to a support rotation unit in the present invention.

The anti-scattering cup 13 includes an upper cup 14 and
It comprises a circular rectifying member 15, a back rinse bat 16 corresponding to a member to be mounted, and a lower cup 17.
The upper cup 14 has an opening 14a at the upper part and an inclined surface 14b for guiding the splash of the photoresist liquid and the cleaning liquid due to the rotation of the substrate W downward. The upper cup 14 is fitted into the upper end paragraph surface of the outer peripheral wall of the lower cup 17.

The circular rectifying member 15 is fitted to the back rinse bat 16, and is attached to the scattering prevention cup 13 by fitting the back rinse butt 16 to the lower cup 17. The airflow flowing from the opening 14a and flowing down along the periphery of the substrate W is rectified and guided to the lower cup 17, and the inclined surface 14b of the upper cup 14 is formed.
And a rectifying surface 15a that guides the droplets of the photoresist liquid and the cleaning liquid guided downward by the air flow to the lower cup 17 by being put on the airflow.

The lower cup 17 has a ring-shaped drainage zone 17a inscribed below the outer peripheral wall, and a drainage zone 17a.
And a ring-shaped exhaust zone 17b formed inside. A drain port 17c is provided at the bottom of the drain zone 17a. The drainage port 17c is connected to a drainage tank 17d, and collects the photoresist liquid and the cleaning liquid that have been rotated off. A cup exhaust port 17e is provided at the bottom of the exhaust zone 17b. This cup exhaust port 1
Reference numeral 7e is connected to an exhaust pump 17f, and sucks and exhausts mist-like photoresist liquid and cleaning liquid, so-called mist, staying in the scattering prevention cup 13 together with air.

The back rinse vat 16 disposed between the lower cup 17 and the circular rectifying member 15 is shown in FIG.
This will be described with reference to FIG. FIG. 3 is a plan view of the back rinse bat 16, and FIG. 4 is a sectional view taken along the line AA of FIG.

The annular recess 16a formed in the periphery of the upper surface of the back rinse bat 16 in plan view has a bottom surface formed in a horizontal plane, and the bottom surface has a through hole 16b at a position symmetrical with respect to the substrate rotation center. Are formed in two places. Referring to FIG. 2, through hole 16 b includes a female screw portion 16 p formed on a side wall thereof, a horizontal portion 16 q continuous with a lower end of female screw portion 16 p, and a mortar portion 16 r formed at the center of horizontal portion 16 q. And a communication portion 16s for communicating the lower portion of the mortar portion 16r with the lower surface of the back rinse vat 16. A back rinse nozzle 20 for discharging the cleaning liquid is attached to the through hole 16b. The back rinse nozzle 20 is provided with a discharge pipe 20a having a hollow portion.
And a nozzle unit 2 formed integrally with the upper end thereof and discharging the cleaning liquid obliquely upward at a jet angle θ ₁ with respect to a horizontal plane.
0b, and a large-diameter portion 20c formed at the lower end of the discharge pipe 20a so as to protrude more radially than the outer diameter of the discharge pipe 20a.
And a tapered portion 20r formed below the large diameter portion 20c. The back rinse nozzle 20 is attached to the through-hole 16 b of the back rinse vat 16 with its large diameter portion 20 c being held down by a holding screw 21.
On the outer surface of the cap screw 21, a male screw portion 21 p screwed with the female screw portion 16 p of the through hole 16 b is formed, and inside the cap screw 21 the large diameter portion 20 of the back rinse nozzle 20 is formed.
A holding wall 21c for holding c is formed. Also,
An opening 21a through which the discharge pipe 20a of the back rinse nozzle 20 penetrates is formed in the pressing wall 21c.

The attachment of the back rinse nozzle 20 to the through hole 16b is performed as follows. That is, the back rinse nozzle 20 is inserted into the through hole 16 and positioned by fitting the tapered portion 20r and the mortar portion 16r of the through hole 16b.
0a is passed through the opening 21a of the cap screw 21 and the nozzle screw 20b is oriented in a desired direction.
Is screwed into the female screw portion 16p of the through hole 16b. At this time, the direction of the nozzle portion 20b of the back rinse nozzle 20 can be easily adjusted and set. That is, before tightening the cap screw 21, the nozzle portion 20 b of the back rinse nozzle 20
, Ie, the discharge direction of the cleaning liquid, can be rotationally adjusted by rotation of the back rinse nozzle 20 about a vertical axis. At this time, the rotation of the back rinse nozzle 20 is guided by the fitting between the tapered portion 20r of the back rinse nozzle 20 and the mortar portion 16r of the through hole 16b, so that a fine adjustment operation can be performed smoothly. Also, when tightening the cap screw 21, the large-diameter portion 2 of the back rinse nozzle 20 is used.
No. 0c is pressed between the back rinse butt 16 by the pressing wall 21c of the pressing screw 21 and the nozzle portion 20b
Is fixed. Note that the injection angle θ ₁ is 0 ° <θ ₁ <
The angle is appropriately set within a range of 90 °.
0b means that the cleaning liquid is discharged upward at a predetermined angle with respect to the vertical direction. However, since this jet angle θ ₁ is related to the degree of cleaning of the back surface and the end surface of the substrate W, etc.
Is set within a range of, for example, about 20 ° to 60 ° according to conditions such as the size of the motor and the number of rotations of the rotary motor 12. Note that the discharge pipe 20a and the nozzle portion 20b that constitute the back rinse nozzle 20 correspond to a discharge unit in the present invention,
Large diameter portion 20c of back rinse nozzle 20 and cap screw 2
1 corresponds to a setting unit. The holding screw 21 also corresponds to an attaching means.

A cleaning liquid supply groove 16c, which is a ring-shaped shallow groove, is formed around the lower surface of the back rinse vat 16. A lid 16d is welded to the lower surface of the cleaning liquid supply groove 16c so that the flowing cleaning liquid does not leak. The cleaning liquid supply groove 16c has an L-shaped pipe joint 18 disposed on the lid 16d and a supply pipe 1 connected thereto.
The cleaning liquid is supplied at a predetermined pressure from the cleaning liquid supply unit 18b (see FIG. 1) via the nozzle 8a.

The back rinse nozzle 20 attached to the back rinse vat 16 projects from a through hole 15c formed in a ring-shaped concave portion 15b (see FIG. 2) of the circular straightening member 15 attached to the upper portion. . Accordingly, the cleaning liquid discharged from the back rinse nozzle 20 flows down from the through hole 15c of the circular rectifying member 15, or the cleaning liquid flows from the cleaning liquid supply groove 16c around the large diameter portion 20c and the holding screw 21 to form a recess in the back rinse vat 16. 16
a. Therefore, the recess 16a
A through-hole 16e is formed in the through hole, and a pipe joint 19 is disposed in the through-hole 16e so that the cleaning liquid retained in the recess 16a is discharged. This pipe joint 19 is connected to the drainage tank 17d.

The jet direction θ _2, which is the discharge direction of the cleaning liquid from the back rinse nozzle 20 in plan view, is set as shown in FIG. The ejection direction θ ₂ is defined as an angle in the direction of rotation (counterclockwise) of the rotation of the substrate W with reference to a line connecting the two back rinse nozzles 20 through the center of rotation of the substrate in plan view.

Referring to FIG. 6 and FIG. FIG. 6 shows a case where the rotation speed of the suction spin chuck 10 is low, and FIG. 7 shows a case where the rotation speed of the suction spin chuck 10 is high.

The case where the rotation speed is low will be described. When the rotation speed is low, the rotation speed is, for example, 20 to 200 r.
pm, and the ejection direction at this time is, for example, about 0 to 45.
° (θ _2a ). The trajectory of the cleaning liquid in this case is indicated by a two-dot chain line (FIG. 6A). Further, a part of the cleaning liquid ejected from the back rinse nozzle 20 and reaching the back surface of the substrate W is temporarily transmitted to the rotation center side against the centrifugal force against the back surface of the substrate W. At this time, the distance between the suction type spin chuck 10 and the cleaning liquid transmitted to the rotation center side is represented by d _1.
(FIG. 6B). Being cleaned range in the plan view of this case is the outer circumferential side of the circle of two-dot chain line indicated by reference numeral C _1.

Furthermore, the nozzle portion 20b of the back rinse nozzle 20, since injects a cleaning liquid to the rear surface of the substrate W in噴角theta _1, the cleaning liquid having an energy level upward, the substrate W
When it reaches the end face of, it goes around upward. Thereby, the substrate W
The photoresist liquid adhering to the end surface of the orientation flat portion and the peripheral end surface can be removed (FIG. 6B).

Next, the case where the thickness of the photoresist film formed on the substrate W is reduced or the case where back rinsing is performed after the swing-off and the rotation speed of the suction spin chuck 10 is increased will be described. The rotation speed in this case is set to, for example, about 500 rpm. In such a case, the upper cup 14 is removed from the lower cup 17 and the circular rectifying member 15 is removed.
Remove. Slightly larger adjusting the ejection tube 20a the vertical axis is rotated ejection direction theta ₂ around the back rinse nozzle 20 as compared to when the rotational speed is low with then loosen the cap screw 21 is fixed by tightening the cap screws 21 .
Thus, by loosening the holding screw 21 and rotating the discharge pipe 20a around the vertical axis, the discharge direction of the cleaning liquid can be easily adjusted.

When the rotation speed is about 500 rpm, the jetting direction is set to, for example, about 45 ° (θ _2b ). In this case, the movement of the cleaning liquid to the outer periphery of the substrate W is accelerated by the centrifugal force, so that the trajectory of the cleaning liquid is shorter than that in the case where the rotation speed is low as indicated by the two-dot chain line in FIG. At this time, the distance between the suction type spin chuck 10 and the cleaning liquid transmitted to the rotation center side is d ₂ (FIG. 7).
(B)). If simply only by increasing the rotational speed of the suction type spin chuck 10, the d ₂ is greater than d _1. However, the jet direction θ of the cleaning liquid from the nozzle portion 20b
By adjusting ₂ , the discharge direction of the cleaning liquid discharged from the nozzle portion 20b can be changed, and accordingly, the position of the cleaning liquid reaching the back surface of the substrate W in the radial direction of the substrate W can also be changed. since, by adjusting the ejection direction theta ₂ cleaning solution according to the rotational speed is increased, this d ₂ and above d ₁ can be adjusted to substantially the same level. In this case, the area to be cleaned in plan view is on the outer peripheral side of the circle indicated by the two-dot chain line indicated by the reference symbol C ₂ , and the ejection direction θ ₂ of the back rinse nozzle 20 is rotated around the vertical axis as described above. Thus, it can be adjusted to be substantially the same as in the case where the rotational speed is low. That is, by adjusting the ejection direction θ ₂ , a wide area on the back surface of the substrate W can be cleaned. The adjustment of the ejection direction theta ₂ of such cleaning liquid, the removal of the photoresist solution adhering to the end face and the end face of the orientation flat of the substrate W is performed favorably, and the back surface area of the substrate W to be cleaned by the cleaning liquid Experimentally seeking the direction of widening,
It is performed based on the result. The ejection direction θ ₂ may be a negative value or a negative value. In this case, the discharge direction of the cleaning liquid is opposite to the rotational direction of the substrate W.

Next, a modification of the back rinse nozzle 20 will be described with reference to FIG. Back rinse nozzle 20
Includes a vertical pipe portion 20d which screw is formed, the nozzle portion 20e bent in噴角theta ₁ from the vertical pipe portion 20d, which are integrally formed. The back rinse nozzle 20 is configured such that the vertical pipe portion 20 d is inserted into the through hole 16 b of the back rinse vat 16.
Screwed into. The ejection direction θ ₂ is fixed by the holding screw 21. In this configuration, the ejection direction θ ₂ can be adjusted by loosening the holding screw 21, adjusting the direction of the back rinse nozzle 20 (two-dot chain line in the drawing), and then tightening the holding screw 21.

In the present embodiment, the back rinse nozzles 20 are provided at two locations, but the present invention is not limited to this number and can be variously modified. For example, the number of the back rinse nozzles 20 may be one, and the back rinse nozzles 20 may be provided at four positions as shown in FIG. Further, the ejection direction θ ₂ is changed for each pair of back rinse nozzles 20, for example, the ejection direction of one pair of back rinse nozzles 20 is θ _2a, and the ejection direction of the other pair of back rinse nozzles 20 is θ _2b . Then, the supply of the cleaning liquid to the back rinse nozzle 20 is controlled by an electromagnetic valve (not shown) and a control unit,
Depending on the number of revolutions, these back rinse nozzles 20
May be switched for use.

FIG. 10 shows still another modification. Back rinse nozzle 20 is composed of a nozzle unit 20e for ejecting a cleaning liquid toward at噴角theta ₁ which is attached by inserting and its tip vertical pipe portion 20d obliquely upwardly. A pedestal 30 is screwed into the bottom surface of the concave portion 16a of the back rinse vat 16, and a packing 31 is inserted into a contact surface with the bottom surface of the concave portion 16a to prevent leakage of the cleaning liquid. A screw thread is formed on the outer periphery of the upper portion of the pedestal 30, and a holding screw 32 is screwed from above. An insertion hole 30a into which the vertical pipe portion 20d is inserted is formed in an upper portion of the pedestal 30, and a mortar-shaped inclined surface 30b is formed in an upper end of the insertion hole 30a. Then, by inserting the packing 33 into the inclined surface 30 b and tightening the holding screw 32, the jetting direction θ ₂ of the cleaning liquid from the back rinse nozzle 20 can be adjusted and fixed arbitrarily. Further, in FIG. 10, the vertical pipe portion 20d is inserted up to the bottom of the insertion hole 30a. However, in this embodiment, the back rinse nozzle 20 is pulled up to an arbitrary height within a range not touching the substrate W, and the back rinse nozzle 20 is held down in this state. By tightening the screw 32, the vertical pipe portion 20d is tightened by the inclined surface 30b and the packing 33, and the back rinse nozzle 20 can be fixed at an arbitrary height. Thereby, the degree of freedom of adjusting the mounting posture of the back rinse nozzle 20 and the discharge direction of the cleaning liquid can be further increased, the cleaning range of the back surface of the substrate W can be widened, and the peripheral end surface of the substrate W and the orientation flat portion can be adjusted. It can be adjusted to a state where the end face is cleaned well.

[0033]

As is apparent from the above description, according to the first aspect of the present invention, the discharge means discharges the cleaning liquid to the back surface of the substrate at a predetermined angle obliquely upward with respect to the vertical direction. In addition, since the discharge direction of the discharge unit is set by the setting unit, the discharge direction can be easily adjusted, and a wide area on the back surface of the substrate can be cleaned.

According to the second aspect of the present invention, the discharge pipe discharges the cleaning liquid upward at a predetermined angle with respect to the vertical direction from a nozzle portion formed at the tip of the discharge pipe. Since the large diameter portion formed at the lower portion is attached to the supporting member so as to be rotatable around the vertical axis by pressing the large diameter portion with the attaching means, the discharge direction of the cleaning liquid from the nozzle portion can be easily adjusted. Thus, a wide area on the back surface of the substrate can be cleaned.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a rotary substrate processing apparatus according to an embodiment.

FIG. 2 is an enlarged view of a main part of the rotary substrate processing apparatus.

FIG. 3 is a plan view of a back rinse bat.

FIG. 4 is a sectional view taken along the line AA of FIG. 3;

FIG. 5 is a diagram provided to explain the ejection direction of a back rinse nozzle.

FIG. 6 is a diagram for explaining a cleaning range of the back surface of the substrate.

FIG. 7 is a diagram for explaining a cleaning range of the back surface of the substrate.

FIG. 8 is a view showing a modified example of the back rinse nozzle.

FIG. 9 is a plan view showing a modification.

FIG. 10 is a diagram showing another modification.

FIG. 11 is a diagram for explaining a substrate back surface cleaning apparatus according to a conventional example.

FIG. 12 is a diagram provided for describing a cleaning range of the back surface of the substrate.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 suction spin chuck 11 rotating shaft 12 rotating motor 13 scattering prevention cup 14 upper cup 15 circular rectifying member 16 back rinse butt 17 lower cup 20 back rinse nozzle 20a discharge pipe 20b nozzle section 20c ... large diameter part 21 ... holding screw

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Joichi Nishimura Examiner, Nippon Screen Manufacturing Co., Ltd. (JP, A) JP-A-5-343383 (JP, A) JP-A-1-259536 (JP, A) JP-A 1-120979 (JP, U) (58) Fields investigated (Int. Cl. ⁷⁾ H01L 21/304 643 B08B 3/00-3/04

Claims (2)

(57) [Claims] An apparatus for cleaning a back surface of a substrate by rotating a substrate and discharging a cleaning liquid from below onto the back surface of the substrate, comprising: a support rotation unit configured to support and rotate the substrate in a substantially horizontal posture; Obliquely above the vertical direction from below the substrate
A discharge means for discharging the cleaning liquid toward the back surface of the substrate at a predetermined angle toward the substrate, and a setting means for setting a discharge direction of the cleaning liquid from the discharge means to be rotatable around a vertical axis. Backside cleaning device. 2. An apparatus for cleaning a rear surface of a substrate by rotating a substrate and discharging a cleaning liquid from below onto the rear surface of the substrate, comprising: a supporting and rotating means for supporting and rotating the substrate in a substantially horizontal posture; An attached member disposed below the substrate, a discharge pipe provided in a vertical position on the attached member, and a cleaning liquid formed at a tip end of the discharge pipe and upwardly at a predetermined angle with respect to the vertical direction. A nozzle portion for discharging, a large-diameter portion formed at a lower portion of the discharge tube, and an attaching means for holding the large-diameter portion and attaching the discharge tube to the support member so as to be rotatable around a vertical axis. An apparatus for cleaning a back surface of a substrate, comprising: