JP2002299305A - Apparatus and method for substrate peripheral edge processing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate peripheral edge processing apparatus which has high reproducibility of processing and can precisely control the width of an area, where the processing is carried out and to provide a substrate peripheral edge processor which can reuse processing liquid. SOLUTION: This substrate peripheral edger processor is equipped with a spin chuck 1, which holds a semiconductor wafer W nearly horizontally and rotates it, a disk-like shielding plate 2 which is rotated during the processing together with the spin chuck 1, a shield plate holding mechanism 3 which holds and rotates and elevates the shielding plate 2, a rotating body 4 which holds the processing liquid with a centrifugal force together with the shielding plate 2, a processing liquid supply pipe 6 which supplies the processing liquid to the rotating body 4, a rotary mechanism 46 which drives and rotates the rotating body 4, and a processing liquid collection container 7 which collects the processing liquid, after the processing. The shielding plate 2 has a recessed part 44 which can move vertically and holds the processing liquid by coming into contact with the rotating body 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate peripheral processing apparatus and a substrate peripheral processing method for supplying a processing liquid to a peripheral portion of a substrate, such as a semiconductor wafer, to process the substrate. .

[0002]

2. Description of the Related Art For example, in a manufacturing process of a semiconductor device,
In order to remove an unnecessary thin film at a peripheral portion of a semiconductor wafer (hereinafter, simply referred to as “wafer”), an etching solution is supplied only to a peripheral portion of the semiconductor wafer to perform an etching process.
So-called bevel etching may be performed. As a conventional substrate peripheral processing apparatus, there are an apparatus for performing processing by an edge rinse method and an apparatus for performing processing by a chuck method.

In the edge rinsing method, while a wafer is held horizontally and rotated, a chemical solution such as an etching solution is discharged from a thin tube toward a peripheral portion of the wafer, and at the same time, pure water is supplied from above to the vicinity of the center of the substrate. Is the way. According to this method, since the upper surface of the wafer is covered with pure water except for the peripheral portion, it is possible to prevent the processing liquid scattered by the centrifugal force from re-adhering to the wafer. In the chuck method, the wafer periphery is supported by chuck pins, the wafer is rotated horizontally, the processing liquid is supplied such that the entire back surface of the wafer is covered with the processing liquid, and the processing liquid is further wrapped around the peripheral edge on the wafer front side. Is the way. In order to process the portion supported by the chuck pins around the wafer, the wafer is temporarily released from being gripped by the chuck pins.
The wafer is rotated relative to the chuck pin by the action of the inertial force of the liquid on the wafer.

[0004]

However, in the edge rinsing method, the area to be treated is determined by the boundary between the pure water and the chemical solution, so that the width of the area to be treated can be controlled accurately. could not. Further, since the pure water and the chemical liquid are mixed, the processing liquid cannot be reused.

In the chuck system, there is a problem that the chemical solution splashes because of the presence of the chuck pins in the flow of the chemical solution and re-adheres to the wafer. Further, since the relative rotation of the wafer with respect to the chuck pins depends on the inertia of the processing liquid on the wafer, the reproducibility of the processing is low. Furthermore, the relative rotation of the wafer with respect to the chuck pins changes the angular direction of the wafer before and after processing.

An object of the present invention is to provide a substrate peripheral processing apparatus capable of controlling the width of a region to be processed with high accuracy. Another object of the present invention is to
An object of the present invention is to provide a substrate peripheral processing apparatus capable of reusing a processing liquid. Still another object of the present invention is to provide a substrate peripheral processing apparatus in which a processing liquid does not adhere to a substrate.

It is still another object of the present invention to provide a substrate peripheral processing apparatus having high process reproducibility. Still another object of the present invention is to provide a substrate peripheral processing apparatus in which the angular direction of a substrate does not change before and after processing. Still another object of the present invention is to provide a substrate peripheral processing method capable of accurately controlling the width of a region to be processed.

It is still another object of the present invention to provide a method of processing the periphery of a substrate which can reuse a processing solution. It is still another object of the present invention to provide a method of processing the periphery of a substrate in which the processing liquid does not adhere to the substrate.
Still another object of the present invention is to provide a substrate peripheral processing method having high process reproducibility.

It is still another object of the present invention to provide a method for processing a peripheral edge of a substrate in which the angular direction of the substrate does not change before and after the processing.

[0010]

Means for Solving the Problems and Effects of the Invention According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: A substrate peripheral processing apparatus for cleaning or etching,
Substrate holding means (1, 60) for holding the circular substrate;
Recesses (44, 5) that can be arranged to cover at least a part of the peripheral edge of the circular substrate held by the substrate holding means.
Rotator (2, 4, 21, 51, 52, 5) having a rotation axis perpendicular to the circular substrate.
8), rotating means (46, 24, 34) for rotating the rotating body about the rotation axis, and processing liquid supply means (6) for supplying a processing liquid to the concave portion of the rotating body. A substrate peripheral processing apparatus.

According to an eleventh aspect of the present invention, the step of holding the circular substrate by the substrate holding means and the step of rotating the rotating body around a rotation axis perpendicular to the circular substrate and having a concave portion, the concave portion of the circular substrate Arranging at least a portion of the peripheral portion to cover the rotating body, rotating the rotating body by a rotating unit, and supplying a processing liquid to the recess by a processing liquid supply unit. Is a substrate peripheral processing method. It should be noted that the alphanumeric characters in parentheses indicate corresponding components and the like in the embodiments described later. Hereinafter, the same applies in this section.

The substrate holding means may be configured to hold a part other than the peripheral edge of the circular substrate. According to the invention,
For example, when the processing liquid is supplied to the concave portion of the rotating body after rotating the rotating body, the processing liquid is held in the concave portion by the centrifugal force of the rotating body. By appropriately setting the supply amount of the processing liquid to the concave portion, the peripheral portion of the circular substrate is immersed in the processing liquid in the concave portion, so that the peripheral edge of the circular substrate is processed. Since the width of the region to be processed on the circular substrate is determined by the amount of the processing liquid in the concave portion, the accuracy is good. In a region where the processing is performed, the configuration can be such that the circular substrate is not held, so that the reproducibility of the processing is good. The circular substrate can be held firmly at the center of the circular substrate or the like so that the angle direction of the circular substrate with respect to the substrate holding means does not change.

After the supply of the processing liquid is started, the circular substrate may be rotated. The concave portion may be disposed so as to cover the entire periphery of the circular substrate, or may be disposed so as to cover only a part of the peripheral portion of the circular substrate. The invention according to claim 2 is the substrate peripheral processing apparatus according to claim 1, wherein the processing liquid supply means can supply the processing liquid until the processing liquid reaches a peripheral portion of the circular substrate. .

According to the present invention, it is possible to supply the processing liquid in an amount necessary for performing the processing to the concave portion. When the required amount of the processing liquid is supplied, the supply of the processing liquid may be stopped. The invention according to claim 3 is characterized in that the processing liquid supply means can supply the processing liquid to the recess when the rotating body is rotating. Device.

According to the present invention, since the rotating body can be rotated before the supply of the processing liquid, most of the supplied processing liquid is held in the recess. Therefore, the processing liquid is not wasted. The invention according to claim 4 is
4. The method according to claim 1, wherein the substrate holding means rotates the circular substrate around a substrate axis (A) passing through the center of the circular substrate and perpendicular to the circular substrate. A substrate peripheral processing apparatus according to (1).

According to the present invention, since the circular substrate is also rotatable, the relative speed of the processing liquid with respect to the circular substrate can be controlled. For example, the concave portion and the substrate holding means can be rotated at the same rotational speed in the same direction to eliminate the relative movement of the circular substrate with respect to the processing liquid. That is, since the processing can be performed in a static state, the processing liquid does not splash and re-attach to the circular substrate. As described in claim 5, the substrate holding means may be capable of holding the circular substrate by suction.

According to a sixth aspect of the present invention, the rotator includes a first portion (4, 52) and a second portion (2, 2) which can be divided into two in a direction perpendicular to the circular substrate held by the substrate holding means.
The substrate peripheral processing apparatus according to any one of claims 1 to 5, further comprising (21, 51). For example, when the rotating body is configured to be dividable by the concave portion, the processing liquid can be discharged to the side by dividing the rotating body after the processing on the periphery of the circular substrate is completed. Therefore, after the processing is completed, the processing liquid does not adhere to portions other than the peripheral portion of the circular substrate.

According to a seventh aspect of the present invention, one of the first portion and the second portion is a disk (2, 21) opposed to the surface of the circular substrate with a predetermined gap. 7. A substrate peripheral processing apparatus according to claim 6, wherein: According to the present invention, the disk facing the surface of the circular substrate with a predetermined gap can also be used for processing the peripheral edge of the circular substrate. The invention according to claim 8 is the substrate peripheral processing apparatus according to any one of claims 1 to 7, further comprising gas supply means for supplying gas to the surface of the circular substrate.

According to the present invention, for example, after processing the periphery of a circular substrate, the circular substrate can be dried while blowing nitrogen gas. Thereby, oxidation of the circular substrate can be prevented. The invention according to claim 9 is the substrate peripheral processing apparatus according to any one of claims 1 to 8, wherein the processing liquid supply means can supply a plurality of types of processing liquids including pure water. .

According to the present invention, after processing such as etching is performed on the peripheral portion of the circular substrate, the etching solution can be removed by washing with pure water. The chemical solution such as an etching solution and the pure water may be switched and supplied by one pipe, or may be supplied from separately provided pipes. According to a tenth aspect of the present invention, the processing liquid recovery container (7) for separating and recovering the processing liquid is provided on a side of the rotating body. It is a board | substrate edge processing apparatus of description.

For example, in a case where the rotating body is configured to be dividable by the concave portion, when the rotating body is divided after the etching process of the peripheral edge of the circular substrate is completed, the etching liquid is moved to the side of the rotating body by centrifugal force. Is discharged. When the discharged etching liquid is received and guided to the processing liquid recovery container, the etching liquid whose peripheral edge of the circular substrate has been processed can be recovered. Thereafter, when the peripheral portion of the circular substrate is cleaned with pure water in the same manner as the etching process, for example, the rotation of the concave portion is stopped and the pure water can be discharged by the action of gravity. In this case, since the etching solution and the pure water are discharged through different routes, they can be separated and collected. Therefore, the collected processing liquid can be reused.

[0022]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
An embodiment of the present invention will be described in detail. FIG.
FIG. 1 is an illustrative sectional view of a substrate peripheral processing apparatus according to a first embodiment of the present invention. The substrate peripheral processing apparatus is for performing a bevel etching process or the like for removing an unnecessary thin film on a peripheral portion of a circular semiconductor wafer (hereinafter, simply referred to as a “wafer”) W to be processed. This substrate peripheral processing apparatus holds a spin chuck 1 for holding and rotating a wafer W substantially horizontally, a disk-shaped blocking plate 2 rotated together with the spin chuck 1 during processing, and a holding plate 2. The blocking plate holding mechanism 3 that rotates and moves up and down, the rotating body 4 that holds the processing liquid by centrifugal force, the processing liquid supply pipe 6 that supplies the processing liquid to the rotating body 4, and the rotating mechanism 46 that drives the rotating body 4 to rotate. And a processing liquid collecting container 7 for collecting the processing liquid after the processing.

The spin chuck 1 has a chuck shaft 11 arranged along the vertical direction, and a chuck base 12 extending substantially horizontally from the upper end of the chuck shaft 11. On the upper surface of the chuck base 12, a suction hole 15 for sucking and holding the wafer W is provided.
The suction hole 15 communicates with the vacuum pipe 13 and can be connected to a vacuum pump (not shown) or the like to exhaust air therein. A rotation drive unit 14 including a drive source (not shown) such as a motor is coupled to the chuck shaft 11. Therefore, the wafer W can be rotated in a horizontal plane by rotating the chuck shaft 11 by the rotation driving unit 14 while the wafer W is being suction-held by the chuck base 12. The wafer W is arranged such that the substrate axis A passing through the center of the wafer W held by the spin chuck 1 and perpendicular to the wafer W coincides with the rotation axis of the spin chuck 1.

The rotating body 4 has a drum shape that is substantially rotationally symmetric with respect to the substrate axis A, and is arranged so as to surround the side of the spin chuck 1. The rotator 4 has a ring-shaped facing surface portion 41 having a surface facing the outer periphery of the wafer W held by the spin chuck 1, a processing liquid holding bottom plate 42 horizontally projecting from the lower end of the facing surface portion 41 to the center side, And a cylindrical body 43 extending downward from the lower end of the facing surface portion 41. The diameter of the facing surface portion 41 is substantially equal to the diameter of the blocking plate 2, and the blocking plate 2 can seal and cover the upper portion of the facing surface portion 41. In plan view, the wafer W held by the spin chuck 1 overlaps the processing liquid holding bottom plate 42 with a constant width from the outer periphery to the inner side.

The rotating body 4 is rotatably supported via a bearing 8 provided below the cylindrical body 43. A ring gear 9 is provided above the bearing 8 on the inner surface of the lower portion of the cylindrical body 43. A gear 1 is provided below the inside of the rotating body 4.
0 is provided, and a ring gear 9 is provided.
And the gear 10 are meshed. By rotating the motor 45, the rotating body 4 can be rotated. The rotation axis of the rotating body 4 coincides with the substrate axis A.

The blocking plate 2 is a circular plate that faces the surface of the wafer W with a predetermined gap (for example, 0.1 to 1.0 mm, preferably 0.5 mm) and is parallel to the surface of the wafer W. The diameter of the wafer W to be processed is slightly larger than the diameter of the wafer W to be processed. The blocking plate holding mechanism 3 includes a support shaft 31 provided vertically outside the spin chuck 1, an elevating drive unit 32 that generates a driving force for vertically moving the support shaft 31, and a support shaft 31. The arm 33 includes an arm 33 extending horizontally from the upper end, and a holding shaft 34 attached to the lower surface of the distal end of the arm 33 and extending vertically and rotatably driven. The blocking plate 2 is horizontally attached to the tip of the holding shaft 34. With the above configuration, the blocking plate 2 and the chuck base 12 are parallel.

By this mechanism, the support shaft 31 is moved up and down by the driving force of the lifting drive unit 32, so that the blocking plate 2 is
A contact position (shown by a solid line in FIG. 1) in contact with the upper portion of the opposing surface portion 41 and a separation position (FIG.
(Indicated by a two-dot chain line).
In addition, by rotating the holding shaft 34, the blocking plate 2 is rotated.
Can be rotated. The processing liquid supply pipe 6 extends from below the apparatus, and has a discharge port 5 at one end. The discharge port 5 is disposed at a vertical position between the wafer W held by the spin chuck 1 and the processing liquid holding bottom plate 42 so as to face the facing surface portion 41. Processing liquid supply piping 6
The other end is connected to an etching solution storage tank and a pure water storage tank (not shown), and can switch and supply the etching solution and the pure water.

The processing liquid recovery container 7 has a drum shape,
It is arranged further outside the rotating body 4. The upper end of the processing liquid recovery container 7 is disposed at an upper and lower position higher than the upper end of the facing surface portion 41, and the lower end thereof is disposed at an upper and lower position lower than the lower end of the rotating body 4. In addition, the processing liquid collection container 7
Its upper end is inclined inward, and has a bent portion 16 bent at its lower end so as to cover the lower end of the rotating body 4. Next, using this substrate peripheral processing apparatus, the wafer W
The peripheral edge processing method will be described.

First, the blocking plate 2 is arranged at the separated position, and the wafer W is moved to a predetermined position on the chuck base 12 by the transfer robot (not shown), that is, the rotation axis of the spin chuck 1 coincides with the substrate axis A. Place it as you want. Then, the wafer W is attracted to the chuck base 12. Next, the blocking plate 2 is moved down by the lifting drive unit 32 to be brought into contact with the upper portion of the facing surface 41. In this state, the facing surface portion 41,
The blocking plate 2 and the processing liquid holding bottom plate 42 form a ring-shaped inwardly opened concave portion 44. The concave portion 44 is arranged so as to cover the peripheral portion of the wafer W. Then, the motor 45, the holding shaft 34, and the rotation drive unit 14 are driven to rotate the rotating body 4, the blocking plate 2, and the spin chuck 1 in the same direction at the same rotation speed.

Subsequently, an etching solution 19 is supplied from the processing solution supply pipe 6. The etching solution 19 is discharged from the discharge port 5 toward the recess 44. At this time, the recess 44
Since the (rotator 4) is rotating, the etching solution 19
Is in a state of being stuck to the inner surface of the facing surface portion 41 by centrifugal force, and is held in the concave portion 44. When a predetermined amount of the etching solution 19 is filled in the concave portion 44, the supply of the etching solution 19 from the discharge port 5 is stopped. At this time, when the concave portion 44 is filled with the etching solution 19 in a certain amount or more, the peripheral portion of the wafer W is immersed in the etching solution 19 and the peripheral portion of the wafer W is subjected to the etching process. Since the recess 44 and the spin chuck 1 are rotating in the same direction at the same rotation speed, there is no relative movement of the wafer W with respect to the etching solution 19.

After the etching is performed for a predetermined time, the blocking plate 2 is raised by the lifting drive unit 32. Then the recess 44
Is divided between the opposing surface portion 41 and the blocking plate 2, and the etching solution 19 is drained laterally from between them by centrifugal force, and the etching is completed. The etching liquid 19 discharged to the side hits the inner surface of the processing liquid recovery container 7. Since the upper end of the processing liquid recovery container 7 is inclined inward, the etching liquid 19
It is difficult to move to the outside of. Thereafter, the etching solution 19 moves downward on the inner surface of the processing solution recovery container 7,
The liquid is collected in the bent portion 16 at the lower end of the processing liquid collection container 7. The collected etching solution 19 is further led to an etching solution storage tank (not shown).

Next, the blocking plate 2 is lowered again to make contact with the upper portion of the facing surface portion 41, and the rotating body 4, the blocking plate 2 and the spin chuck 1 are rotated in the same direction at the same rotation speed. Then, the concave portion 44 is discharged from the discharge port 5 of the processing liquid supply pipe 6.
Is supplied with pure water 20. The recess 44 is filled with pure water 20, and the periphery of the wafer W is cleaned by being immersed in the pure water 20. That is, the etching solution 19 and the like attached to the peripheral portion of the wafer W are removed.

After the cleaning for a predetermined time, the rotation of the blocking plate 2 and the rotating body 4 is stopped without raising the blocking plate 2.
Then, the pure water 20 flows down from the concave portion 44 by the action of gravity. The pure water that has flowed down is guided to a waste liquid line via a receiving container (not shown). The rotation of the rotating body 4 and the blocking plate 2 is stopped, and the spin chuck 1 continues to rotate. Thereby, the wafer W is dried. When the wafer W is dried, the rotation is stopped, and the wafer W is carried out of the substrate peripheral processing apparatus. Thus, the processing on the periphery of the wafer W is completed.

According to such a substrate peripheral processing apparatus,
Since the width of the region to be processed on the wafer W is determined by the amount of the processing liquid in the concave portion 44, the accuracy is good. Since the wafer W is not held in the area where the processing is performed, the reproducibility of the processing is good. The holding of the wafer W is firmly performed by suction at the center of the wafer W, and the angle direction of the wafer W with respect to the spin chuck 1 can be kept unchanged. At the time of processing, there is no relative movement of the wafer W with respect to the chemical solution such as the etching solution 19, and the processing can be performed in a static state.
It does not re-adhere. At the time of etching or cleaning, the rotation speed of the rotator 4 and the blocking plate 2 and the rotation speed of the spin chuck 1 can be made different from each other, if necessary, to move the wafer W relative to the processing liquid. .

According to the above-described apparatus, the etching solution recovered by the processing solution recovery container 7 can be separated and recovered from other processing solutions. Therefore, the collected etching liquid can be reused. A configuration may be adopted in which a nitrogen gas pipe is passed through the holding shaft 34 and nitrogen gas can be supplied from a hole provided in the blocking plate 2. In this case, when the wafer W is dried, a nitrogen gas is supplied to the wafer W, so that oxidation of the wafer W can be prevented.

FIG. 2 is an illustrative sectional view of a substrate peripheral processing apparatus according to a second embodiment of the present invention. Portions having the same configuration as those of the substrate peripheral processing apparatus according to the embodiment shown in FIG. 1 are denoted by the same reference numerals and description thereof will be omitted. In this embodiment, in addition to the vacuum pipe 13, the processing liquid supply pipe 6 is also inserted into the chuck base 12 and the chuck shaft 11. The chuck shaft 11 is rotatably supported by a hollow motor 24 below. The lower end of the chuck shaft 11 is rotatably fitted in the fixed member 25 via a bearing 26. At the top of the fixing member 25, the chuck shaft 11
Is provided with a rotary seal 27 around the periphery. The fixing member 25 is provided with a processing liquid introduction pipe 28, and the processing liquid introduction pipe 28 is connected to the rotating processing liquid supply pipe 6 in the chuck shaft 11 so that the processing liquid can be sent. An exhaust hole 29 communicating with the vacuum pipe 13 is provided at a lower end of the fixing member 25.
Is provided.

With such a mechanism, the processing liquid is supplied to the processing liquid supply pipe 6 inside the rotating chuck shaft 11,
The air in the vacuum pipe 13 can be exhausted. The discharge port 5 of the processing liquid supply pipe 6 is provided on a side surface of the chuck base 12. Chuck base 12
A processing liquid holding bottom plate 52 in the shape of a disk protrudes from the lower side of the side surface.

The blocking plate 21 is not fixed to the holding shaft 34, and these are separate bodies. At the center of the upper surface of the blocking plate 21, a grip portion 22 having an upper portion extending upward is provided. At the lower end of the holding shaft 34, a hand 35 capable of holding the holding portion 22 is provided. Holding shaft 34
Does not have a rotary drive mechanism. A short cylindrical portion 51 extends downward from the outer peripheral portion of the blocking plate 21. At the lower end of the short tubular portion 51, notches 55 are provided at regular intervals in the circumferential direction. Also, to correspond to the notch 55,
A protrusion 54 is provided from the outer periphery of the processing liquid holding bottom plate 52 to the side.
Is overhanging.

The diameter of the wafer W to be processed is larger than the diameter of the chuck base 12 and smaller than the diameter of the blocking plate 21. The lifting drive unit 32 and the hand 35 are controlled, and the blocking plate 22 is placed on the chuck base 12 on which the wafer W is sucked. Then, the projection 54 is fitted into the notch 55, and the blocking plate 21, the short tube portion 51, the processing liquid holding bottom plate 52, and the chuck base 12 form an annular hollow portion 53.
Since the discharge port 5 is opened in the annular hollow portion 53, the processing liquid can be supplied from the discharge port 5 to the annular hollow portion 53.

When the spin chuck 1 is rotated by the engagement between the projection 54 and the notch 55, the blocking plate 21 is also rotated. When the processing liquid is supplied to the annular hollow portion 53 in this state, the processing liquid adheres to and is held by the short cylindrical portion 51 by centrifugal force. Since the wafer W protrudes into the annular hollow portion 53, the peripheral edge of the wafer W can be processed by filling the annular hollow portion 53 with a certain amount or more of the processing liquid. Even if the rotation of the annular hollow portion 53 is stopped, if the amount of the processing liquid is equal to or less than a certain amount, the processing liquid level B is below the wafer W, so that the processing can be completed.

In this substrate peripheral processing apparatus, the spin chuck 1 and the blocking plate 21 are driven by one hollow motor 24.
The structure of the device is simple, so that the structure of the device is simple. FIG. 3 is an illustrative sectional view of a substrate peripheral processing apparatus according to a third embodiment of the present invention. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted. The blocking plate 21 is fixed to the lower end of the holding shaft 34 as in the first embodiment.
The holding shaft 34 can be driven to rotate, and the blocking plate 21 can be rotated by driving the holding shaft 34 to rotate.

On the other hand, the rotation drive unit 1 is attached to the chuck shaft 11.
4 is not connected. The chuck shaft 11 is rotatable. When the blocking plate 21 is lowered onto the spin chuck 1 by the lifting drive unit 32, the protrusion 54 and the notch 55 are fitted.
When the blocking plate 21 is rotated by the holding shaft 34, the spin chuck 1 also rotates. That is, also in this embodiment, the spin chuck 1 is held by one holding shaft 34.
The structure of the device is simplified because the structure and the blocking plate 21 are rotated.

FIG. 4 is an illustrative plan view showing a part of a substrate peripheral processing apparatus according to a fourth embodiment of the present invention, and FIG. 5 is an illustrative sectional view thereof. Three sets of rollers 60 capable of holding one wafer W in sets of three are arranged. The three wafers W held by the three sets of rollers 60 are arranged at equal intervals. The roller 60 has a V-groove on the outer periphery, and can hold the wafer W in a state where its end is fitted into the V-groove (FIG. 5A). One of the set of rollers 60 is coupled to a driving source, and can rotate the wafer W. One set of rollers 60
It is possible to attach and detach the wafer W with a wide interval.

The rotating body 58 has a structure in which an outer peripheral portion of a disk is bent inward from below to form a concave portion 59. The rotator 58 holds the processing liquids 19 and 2 in the recess 59 while rotating.
0 can be held. The concave portion 59 has an annular shape, and the contour of the inner end 61 has a diameter approximately three times the diameter of the wafer W. Three wafers W held by rollers 60
Is arranged at a position substantially inscribed in the space inside the concave portion 59. That is, the concave portion 59 of the rotating body 58 covers a part of the peripheral portion of the three wafers W. Further, the wafer W can be moved in the center direction and the outer peripheral direction of the rotating body 58 by moving the roller 60.

At the time of processing, first, three wafers W are held by three sets of rollers 60 at a position where the wafer W does not touch the inner end 61 of the concave portion 59 at the time of delivery. Then, the rotating body 58 is rotated, and the processing liquid 19 and
Hold 20. Then, while rotating the wafer W, the wafer W is moved toward the concave portion 59, and a part of the wafer W is immersed in the processing liquids 19 and 20 (FIG. 5B).
Since the wafer W is rotating, the parts immersed in the processing liquids 19 and 20 move sequentially, and the entire periphery of the wafer W is immersed within a certain time. Thus, the wafer W
Peripheral processing can be performed. When ending the processing, the wafer W is moved to the inside of the rotating body 58,
The rotation of the rotating body 58 is stopped. Thereby, the processing liquid 1
9, 20 fall below.

According to such a processing apparatus, a plurality of wafers W can be processed simultaneously. The position where the wafer W is held is the peripheral portion of the wafer W to be processed. However, the wafer W is held closely by the rollers 60 and given a regular rotation, so that the reproducibility of the process is good. Moreover,
Since the portion holding the wafer W is not in the processing liquid, the processing liquid does not splash and re-attach to the wafer W. Further, in this embodiment, since the wafer W is not held by vacuum suction, it is advantageous for the back surface particles.

In the first to third embodiments, pure water 20
Although the processing liquid supply pipe 6 for supplying the etching liquid 19 and the processing liquid supply pipe 6 for supplying the etching liquid 19 are common, they may be provided separately. The processing liquid may be supplied toward the back surface of the wafer W. In the first embodiment, the supply of the processing liquid is stopped before overflowing from the concave portion 44, but a new liquid may be supplied at all times. In this case, a configuration is possible in which the processing liquid discharge hole 47 for discharging the processing liquid at an appropriate flow rate is provided in the facing surface portion 41 forming the concave portion 44 (FIG. 6).

In addition, various design changes can be made within the scope of the matters described in the claims.

[Brief description of the drawings]

FIG. 1 is an illustrative sectional view of a substrate peripheral processing apparatus according to a first embodiment of the present invention.

FIG. 2 is an illustrative sectional view of a substrate peripheral processing apparatus according to a second embodiment of the present invention.

FIG. 3 is an illustrative sectional view of a substrate peripheral processing apparatus according to a third embodiment of the present invention.

FIG. 4 is an illustrative plan view showing a part of a substrate peripheral processing apparatus according to a fourth embodiment of the present invention.

FIG. 5 is an illustrative sectional view showing a part of a substrate peripheral processing apparatus according to a fourth embodiment of the present invention.

FIG. 6 is an illustrative sectional view showing a structure of a concave portion having a processing liquid discharge hole.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spin chuck 2, 21 Cut-off plate 4, 58 Rotating body 5 Discharge port 6 Processing liquid supply pipe 7 Processing liquid recovery container 44, 59 Recess 46 Rotation mechanism 53 Annular hollow part

Continued on the front page F term (reference) 3B201 AA03 AB33 AB47 BB21 BB92 BB93 BB98 CC01 CC12 CC13 CD11 CD22 5F043 AA02 EE07 EE08 EE33 GG10

Claims (11)

[Claims] 1. A substrate peripheral processing apparatus for cleaning or etching a peripheral portion of a circular substrate using a predetermined processing liquid, comprising: a substrate holding means for holding the circular substrate; and a substrate holding means for holding the circular substrate. A rotating body that has a recess that can be arranged to cover at least a part of the peripheral edge of the circular substrate, and that rotates about a rotation axis perpendicular to the circular substrate; and a rotating unit that rotates the rotating body about the rotation axis. And a processing liquid supply means for supplying a processing liquid to the concave portion of the rotating body. 2. The apparatus according to claim 1, wherein said processing liquid supply means is capable of supplying the processing liquid until the processing liquid reaches a peripheral portion of the circular substrate. 3. The substrate peripheral processing apparatus according to claim 1, wherein said processing liquid supply means is capable of supplying a processing liquid to said recess when said rotating body is rotating. 4. The substrate holding means for rotating the circular substrate around a substrate axis passing through the center of the circular substrate and perpendicular to the circular substrate.
4. The substrate peripheral processing apparatus according to any one of claims 3 to 3. 5. The substrate peripheral processing apparatus according to claim 1, wherein said substrate holding means is capable of holding said circular substrate by suction. 6. The rotating body according to claim 1, further comprising a first portion and a second portion which can be divided into two in a direction perpendicular to the circular substrate held by the substrate holding means. A substrate peripheral processing apparatus according to any one of the above. 7. The peripheral processing of a substrate according to claim 6, wherein one of said first portion and said second portion is a disk facing a surface of said circular substrate with a predetermined gap. apparatus. 8. The substrate peripheral processing apparatus according to claim 1, further comprising gas supply means for supplying gas to the surface of the circular substrate. 9. The substrate peripheral processing apparatus according to claim 1, wherein said processing liquid supply means is capable of supplying a plurality of types of processing liquids including pure water. 10. The substrate peripheral processing apparatus according to claim 1, further comprising a processing liquid recovery container for separating and recovering the processing liquid, provided on a side of the rotating body. . 11. A step of holding a circular substrate by substrate holding means, and a step of rotating a rotating body which is rotated around a rotation axis perpendicular to the circular substrate and has a concave portion, the concave portion being at least a part of a peripheral edge of the circular substrate. A peripheral edge of the substrate, a step of rotating the rotating body by a rotating unit, and a step of supplying a processing liquid to the recess by a processing liquid supply unit. .