JP2007157928A - Processing device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing device and method wherein the periphery of a workpiece can be selectively processed with a processing liquid, and a process region can be controlled with high dimensional accuracy and processing efficiency. <P>SOLUTION: The processing device 1 which processes the periphery of the workpiece W with a processing liquid is equipped with a table 2 where the workpiece W can be placed; a processing liquid unit 4 which is equipped with a processing liquid holding space 4i where the processing liquid can be held, and the periphery of the workpiece W can be arranged; a processing liquid supply means 9 of supplying the processing liquid to the processing liquid holding space 4i; and a rotating means for rotating the processing liquid unit 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a processing apparatus and a processing method, for example, a processing apparatus and a processing method for processing a peripheral portion of a target object such as a semiconductor wafer with a processing liquid.

  In a process using a substantially circular substrate such as a semiconductor device or other electronic device, scratches or cracks may be generated on the peripheral edge of the substrate, or unnecessary deposits may be formed. Such scratches, cracks, and the like occur, for example, in contact with a holder when transporting the substrate, and unnecessary deposits include reaction by-products generated in, for example, an etching process or a film forming process. It is known that it occurs by adhering.

  When such scratches, cracks, deposits, etc. occur, stress concentration tends to occur in the peripheral portion in the subsequent process, resulting in partial cracks or chipping, or in the worst case, the substrate itself There arises a problem that the semiconductor device or the electronic device cannot be manufactured due to cracking. Also, when a broken piece is placed on another substrate to be processed later, problems such as defective wiring occur.

  Therefore, various process improvements have been made to reduce the occurrence of scratches, cracks, deposits, and the like on the peripheral edge of the substrate, but these occurrences cannot be completely eliminated. Therefore, techniques for processing the peripheral edge of the substrate with a processing liquid have been proposed (for example, Patent Documents 1 to 3).

  The technique disclosed in Patent Document 1 includes a processing liquid supply unit through which a peripheral part of a rotating substrate can pass, supplies a predetermined processing liquid to the processing liquid supply unit, and rotates the substrate to provide a peripheral part of the substrate. Is treated with a predetermined treatment liquid.

  However, in the technique as disclosed in Patent Document 1, since a predetermined processing solution is only supplied to the vicinity of the peripheral edge of the rotating substrate, it is impossible to control the processing region dimension with high accuracy. For this reason, there has been a problem that the processing liquid adheres to an area that should not be processed, and conversely, the processing liquid does not adhere to an area that should be processed. Further, since the processing liquid supply means is provided partially on the peripheral edge of the substrate, the processing efficiency is low.

  The technique disclosed in Patent Document 2 is provided with a processing liquid tank through which a peripheral edge of a rotating substrate can pass, and supplies a predetermined processing liquid so that the substrate surface is connected to the processing liquid tank. The substrate peripheral portion is rotated and processed with a predetermined processing liquid.

  However, in the technique disclosed in Patent Document 2, since the processing liquid is supplied to the entire substrate, it is not possible to selectively process only the peripheral portion as it is. For this reason, prior to the processing, it has been time-consuming, such as requiring a coating for protecting non-processed areas that do not require processing.

  In the technique disclosed in Patent Document 3, an annular processing tank is provided at the peripheral edge of the substrate, and the substrate peripheral edge is brought into contact with the processing liquid in the processing tank to perform the processing of the substrate peripheral edge.

However, in the technique disclosed in Patent Document 3, since the substrate peripheral edge is simply brought into contact with the processing liquid in the processing tank, it is impossible to control the processing region dimension with high accuracy. For this reason, there is a problem that the processing liquid adheres to an area that should not be processed, and conversely, the processing liquid does not adhere to an area that should be processed. Further, only one side of the substrate can be processed at a time, which has a problem in processing efficiency.
JP 2001-319849 A JP 2001-46985 A JP 2005-101055 A

  The present invention provides a processing apparatus and a processing method in which a peripheral portion of a substrate or the like is selectively processed with a processing liquid, and the processing region size can be controlled with high accuracy and processing efficiency is high.

In order to achieve the above object, according to one aspect of the present invention,
A processing apparatus for processing a peripheral portion of an object to be processed with a processing liquid,
A table capable of mounting and holding the object to be processed;
A treatment liquid unit having a treatment liquid holding space capable of holding the treatment liquid and inserting the peripheral portion of the object to be processed;
Treatment liquid supply means for supplying the treatment liquid to the treatment liquid holding space;
A rotating means for rotating the treatment liquid unit;
A processing apparatus characterized by comprising:

According to another aspect of the present invention,
A processing method for processing a peripheral portion of an object to be processed with a processing liquid,
The rotation center of a processing liquid unit having a processing liquid holding space capable of holding the processing liquid and the center of the object to be processed are substantially coaxial, and the peripheral edge portion is inserted into the processing liquid holding space. A step of placing and holding the object to be processed,
Rotating the treatment liquid unit;
Supplying the processing liquid to the processing liquid holding space in a state where the processing liquid unit is rotated;
A processing method characterized by comprising:

  ADVANTAGE OF THE INVENTION According to this invention, while processing the peripheral part, such as a board | substrate, with a processing liquid selectively, the control of the processing area dimension can be performed with high precision, and the processing efficiency and processing method can be provided. Therefore, the industrial merit is great.

  Hereinafter, the first embodiment of the present invention will be described in detail with reference to specific examples.

FIG. 1 is a partial cross-sectional perspective view of a processing apparatus 1 according to the first embodiment of the present invention.
FIG. 2 is an enlarged view of a main part in FIG.
FIG. 3 is a plan view of the processing apparatus 1.
4 is an enlarged cross-sectional view taken along line A-O-A in FIG.
FIG. 5 is a cross-sectional view similar to FIG. 4 illustrating a state in which the upper surface plate 4 a is separated from the processing liquid holding portion 4 c of the processing liquid unit 4.
FIG. 6 is an enlarged cross-sectional view of a main part in the vicinity of the processing liquid holding space 4i in which the processing liquid L is held.

  The processing apparatus 1 is provided with a table 2 for holding a substrate (object to be processed) W placed thereon. A vacuum chuck (not shown) for holding the substrate W is provided on the substrate mounting surface of the table 2. In the table 2, a shaft 3 is integrally provided on the surface opposite to the substrate mounting surface. A vacuum passage 17 is formed in the shaft 3, and one end of the passage 17 communicates with a vacuum chuck (not shown), and the other end is also connected to an exhaust device such as a vacuum pump (not shown). .

  Note that other holding means such as an electrostatic chuck may be provided instead of the vacuum chuck. A vertical means (not shown) is connected to the lower side of the shaft 3, and the table 2 can be moved up and down via the shaft 3 by the vertical means.

  Further, the processing apparatus 1 includes a processing liquid unit 4. The processing liquid unit 4 has a processing liquid holding space 4i having a U-shaped cross section. The peripheral edge of the substrate W held on the table 2 can be inserted into the treatment liquid holding space 4i. The treatment liquid holding space 4 i is provided as an annular groove along the peripheral edge of the substrate W.

  The treatment liquid unit 4 is rotatably arranged, and the center of rotation and the center of the table 2 are substantially coaxial. As will be described in detail later, when the processing liquid unit 4 rotates, the processing liquid is held in the processing liquid holding space 4i by centrifugal force, and the peripheral edge of the substrate W is deposited in the processing liquid. . In this manner, only the peripheral edge of the substrate W can be processed such as etching. A housing 5 for supporting the processing liquid unit 4 is fixed to the lower surface of the processing liquid unit 4, and a rotating shaft 6 is provided at the center of the bottom surface 5 a of the housing 5 so as to be substantially coaxial with the center of the processing liquid unit 4. It is provided integrally. The rotating shaft 6 has a cylindrical shape, and the above-described shaft 3 is passed through the rotating shaft 6. Rotating means including an electric motor (not shown) is connected to the rotating shaft 6, and the treatment liquid unit 4 can be rotated in the direction along the peripheral edge of the substrate W by the rotating means.

  A cover 7 for preventing the treatment liquid from scattering is provided so as to cover the outside of the treatment liquid unit 4. A through hole through which the shaft 3 and the rotating shaft 6 are passed is formed in the center of the bottom plate 7 a of the cover 7. The bottom plate 7a is provided with a processing liquid discharge hole (not shown), and the processing liquid discharge hole is connected to a recovery means such as a recovery tank.

  Below the bottom surface 5a of the housing 5, there is provided an up-and-down mechanism 8 for separating a later-described upper surface plate 4a of the processing liquid unit 4 from the processing liquid holding portion 4c. The vertical mechanism 8 has a ring shape, and the rotation shaft 6 and the shaft 3 pass through the center hole. The vertical mechanism 8 is connected to a vertical means (not shown), and the vertical mechanism 8 can press the lower end surfaces of vertical shafts 19a to 19d (shown in FIGS. 3 and 4) described later.

  The processing liquid unit 4 includes a processing liquid holding unit 4c and an upper surface plate 4a which are two combinations that are separable from each other. The upper surface plate 4a has a ring shape, and below this, a ring-shaped treatment liquid holding portion 4c is provided. The processing liquid holding part 4 c is fixedly supported on the ring-shaped upper end surface of the housing 5. The treatment liquid holding portion 4c has a shape in which the outer peripheral portion is convex and protrudes upward (to the upper surface plate 4a) from the inner peripheral portion, and the outer peripheral portion protrudes. A step is formed on the inner peripheral side, that is, the side facing the peripheral edge of the substrate W.

  As shown in FIG. 2, an annular groove 4e is formed on the upper surface 4h of the convex portion of the treatment liquid holding portion 4c, and an O-ring 4b is fitted into the groove 4e. The lower surface of the upper surface plate 4a is brought into contact with the upper surface 4h of the convex portion of the treatment liquid holding unit 4c, and the inner peripheral side and the outer peripheral side of the mating surfaces of both are liquid-tightly blocked by the O-ring 4b. . However, the O-ring 4b is not an essential component and can be omitted if a certain amount of liquid leakage can be prevented by contacting the upper surface plate 4a and the convex portion upper surface 4h.

  An annular U-shaped space formed when the upper surface plate 4a comes into contact with the processing liquid holding portion 4c becomes the processing liquid holding space 4i. Further, as shown in FIG. 6, the treatment liquid holding part 4c is formed with a treatment liquid discharge port 4d that allows the treatment liquid holding space 4i to communicate with the outside of the treatment liquid holding part 4c. As shown in FIG. 3, the treatment liquid discharge ports 4 d are arranged at regular intervals, for example, along the circumferential direction of the treatment liquid unit 4, and a plurality of treatment liquid discharge ports 4 d are formed. The treatment liquid discharge ports 4d are not limited to the equidistant arrangement, and the number of treatment liquid discharge ports can be selected as appropriate. Further, a shutoff valve (not shown) may be connected to the treatment liquid discharge port 4d so that the discharge of the treatment liquid L can be controlled.

  As shown in FIG. 4, upper and lower shafts 19 a and 19 b are provided through the processing liquid holding portion 4 c and the lower housing 5. In FIG. 4, only the two upper and lower shafts 19 a and 19 b are illustrated, but as illustrated in FIG. 3, for example, a total of four upper and lower shafts 19 a to 19 d are arranged along the circumferential direction of the processing unit 4. Arranged. The upper and lower shafts 19a and 19c face each other across the center O of the processing liquid unit 4 and the table 2, and the upper and lower shafts 19b and 19d face each other across the center O. The number and arrangement of the upper and lower shafts can be selected as appropriate. The upper ends of the upper and lower shafts 19a to 19d are fixed to the upper surface plate 4a.

  As shown in FIG. 4, a receiving seat 4 g is provided at the lower end of each of the upper and lower shafts 19 a to 19 d, and the upper and lower shafts 19 a to 19 d are attached downward between the receiving seat 4 g and the housing 5. An energizing coil spring 4f is provided. Due to the biasing force of the coil spring 4f, the upper surface plate 4a is pressed against the processing liquid holding part 4c via the O-ring 4b, and the leakage of the processing liquid from the processing liquid holding space 4i is prevented.

  In the housing 5, for example, two processing liquid nozzles 9 are provided as processing liquid supply means. The two treatment liquid nozzles 9 are arranged around the shaft 3 at intervals of 180 °. One end of the processing liquid nozzle 9 is connected to a processing liquid supply source (not shown), and the other end (tip) is disposed at a position where the processing liquid can be supplied toward the processing liquid holding space 4i.

  The processing liquid nozzle 9 is passed between the shaft 3 and the rotating shaft 6, further extends radially outward from the rotation center O (see FIG. 3) of the processing liquid unit 4, and further extends upward therefrom, and further processing liquid It extends toward the holding space 4i. The tip of the processing liquid nozzle 9 is located below the substrate W placed and held on the table 2. Further, as shown in FIG. 3, the tip side portion of the treatment liquid nozzle 9 is inclined toward the rotation direction r of the treatment unit 4 with respect to the portion extending radially outward from the rotation center O.

  The number of treatment liquid nozzles 9 is not limited to two, but may be three or more or only one. Further, the arrangement is not necessarily equal. Further, the processing liquid nozzle 9 is not necessarily provided inside the processing liquid unit 4. For example, the processing liquid nozzle 9 may be provided in the processing liquid holding portion 4 c like the processing liquid discharge port 4 d, or a switching valve may be provided in the processing liquid discharge port 4 d. The processing liquid L may be supplied by switching between supply and discharge of the processing liquid L. Further, it may be provided above the substrate W.

  Next, the operation of the processing apparatus 1 will be described.

  First, the vertical mechanism 8 is raised by a vertical means (not shown), the vertical mechanism 8 is brought into contact with the lower end surfaces of the vertical shafts 19a to 19d, and the vertical mechanism 8 is further lifted to overcome the urging force of the coil spring 4f. The upper and lower shafts 19a to 19d are lifted upward. As a result, as shown in FIG. 5, the upper surface plate 4 a fixed to the upper end portions of the upper and lower shafts 19 a to 19 d rises away from the convex portion upper surface 4 h of the processing liquid holding portion 4 c.

  Next, the table 2 is lifted through the shaft 3 by an upper and lower means (not shown). At this time, a space is provided between the lower surface of the upper surface plate 4 a and the upper surface of the table 2 so that the substrate W can be loaded and unloaded at the rising end of the table 2.

  In that state, the substrate W is carried into the cover 7 through an opening (not shown) formed in the cover 7 by a transport device such as the fork 15 shown in FIG. It is carried between the upper surface of the table 2 and placed on the table 2. Since the distance between the upper and lower shafts 19 a and 19 b and the distance between the upper and lower shafts 19 d and 19 c are larger than the diameter of the substrate W, the upper and lower shafts 19 a to 19 d do not hinder the loading and unloading of the substrate W.

  The substrate W loaded between the lower surface of the upper surface plate 4a and the upper surface of the table 2 is positioned by a positioning means (not shown) so that the rotation center of the processing liquid unit 4 and the center of the substrate W are substantially coaxial. Placed on the table 2. After placement, the substrate W is held by a vacuum chuck built in the table 2 by operating an exhaust means (not shown) connected to the vacuum passage 3.

  Next, the shaft 3 and the table 2 are lowered, and the vertical mechanism 8 is further lowered. The vertical mechanism 8 that lifts the upper and lower shafts 19a to 19d and the upper surface plate 4a against the biasing force of the coil spring 4f is lowered, and as shown in FIG. The upper surface plate 4a is in pressure contact with the convex portion upper surface 4h of the treatment liquid holding portion 4c. Here, since the O-ring 4b is provided on the convex portion upper surface 4h, the leakage of the processing liquid from the pressure contact portion between the upper surface plate 4a and the convex portion upper surface 4h can be prevented.

  When the upper surface plate 4a is brought into pressure contact with the processing liquid holding portion 4c, further lowering of the upper surface plate 4a and the upper and lower shafts 19a to 19d is stopped, and the vertical mechanism 8 is separated from the lower end surfaces of the upper and lower shafts 19a to 19d. Lower to position and stop. Further, as the shaft 3 and the table 2 descend, the peripheral portion of the substrate W is sandwiched between the portion protruding inward in the diameter of the processing liquid holding portion 4c and the inner peripheral side portion of the upper surface plate 4a. It arrange | positions in the holding | maintenance space 4i. The peripheral edge of the substrate W is not in contact with the processing liquid holding part 4c and the upper surface plate 4a.

  Next, the rotating shaft 6 is rotated by rotating means such as a motor (not shown), and the housing 5 and the processing liquid unit 4 fixed to the rotating shaft 6 are rotated at a predetermined rotation speed (for example, 100 to 1500 rpm (revolutions per minute)). Rotate with The substrate W is not rotated and is stationary. Further, the processing liquid unit 4 is rotated without contacting the substrate W. In the above state, as shown in FIG. 6, a predetermined amount of the processing liquid L is supplied from the processing liquid nozzle 9 to the processing liquid holding space 4i.

  Since the processing liquid unit 4 is rotating, the processing liquid L supplied to the processing liquid holding space 4i is urged outward by centrifugal force. Therefore, the processing liquid L does not flow out to the radially inner side of the substrate W. Further, the liquid surface (side surface) La on the opening side of the processing liquid holding space 4i is substantially vertical, and the depth (radial width) D of the processing liquid is substantially constant over the entire circumference of the annular processing liquid holding space 4i. It becomes.

  Since the rotation center of the processing liquid unit 4 and the center of the substrate W are substantially coaxial as described above, the front and back surfaces of the substrate W are uniform over the entire periphery (a constant distance from the end surface of the substrate W). The processing liquid L can be adhered to the dimension range). Further, since the depth D of the processing liquid L can be easily adjusted by the supply amount of the processing liquid L, it is possible to quickly respond even when the processing area is changed. For example, the height and the radial width of the processing liquid holding space 4 i are about 10 mm, and a portion of about 5 mm from the end face of the substrate W is immersed in the processing liquid L.

  In addition, as shown in FIG. 3, the treatment liquid is smoothly introduced into the rotating treatment liquid holding space 4 i by tilting the tip side of the treatment liquid nozzle 9 toward the rotation direction r of the treatment unit 4. In this case, centrifugal force can be applied and disturbance of the liquid level can be suppressed.

  Here, specific examples of the substrate W include a silicon substrate used for manufacturing a semiconductor device and a glass substrate used for manufacturing a liquid crystal display device, but are not limited thereto. Specific examples of the treatment liquid L include, for example, an inorganic acid such as sulfuric acid, hydrochloric acid, nitric acid, and hydrofluoric acid, or a mixture thereof as an etching liquid used in the etching process. , Pure water and deionized pure water. However, the processing liquid L is not limited to these, and can be appropriately selected depending on the material of the substrate W itself, the material of the thin film formed thereon, processing conditions, and the like.

  Further, the processing can be switched by switching the processing liquid L. For example, after supplying the liquid used for the above-described etching process and performing the etching process, the liquid is switched to the liquid used for the cleaning to perform the cleaning process, and further, the drying process is switched to a dry gas such as nitrogen gas or dry air. You can also do it. In these processes, the same process liquid nozzle 9 may be used to switch the fluid to be supplied, or a dedicated nozzle may be provided independently. Note that it is not always necessary to perform all of these processes, and may be performed after appropriate selection as necessary.

  The processing liquid L in the processing liquid holding space 4i is discharged to the outside of the processing liquid unit 4 through the processing liquid discharge port 4d by the action of centrifugal force, and after being collected, necessary treatment such as impurity removal is performed. Reused. While discharging the processing liquid L through the processing liquid discharge port 4d, a new processing liquid L is supplied from the processing liquid nozzle 9 and the new processing liquid L adheres to the processing surface of the substrate W, thereby increasing the processing efficiency. be able to.

  Alternatively, a shut-off valve is provided at the processing liquid discharge port 4d, and the shut-off valve is closed during processing so that the processing liquid is held in the processing liquid holding space 4i, and the shut-off valve is opened after the processing is completed. The processing liquid L may be discharged by the above. In this case, since the processing liquid unit 4 is rotating, the processing liquid L can be easily discharged by centrifugal force. However, a discharge pump or the like may be used together for easier discharge. .

  After the necessary processing is completed, the rotating means (not shown) is stopped and the processing liquid unit 4 is stopped. The substrate W is unloaded in the reverse procedure to that described above. That is, the vertical mechanism 8 is raised, and the upper surface plate 4a is raised and separated from the convex portion upper surface 4h of the processing liquid holding portion 4c. Next, the table 2 is raised. Then, the substrate W is unloaded from the space between the lower surface of the upper surface plate 4a and the upper surface of the table 2 by a transport device such as the fork 15 (FIG. 3). Thereafter, the substrate processing can be continuously performed by repeating the above-described procedure if necessary.

  Next, a second embodiment of the present invention will be described. In this embodiment, the basic configuration is the same as that of the first embodiment described above. Therefore, only different parts will be described.

  In the present embodiment, a rotating means (not shown) is connected below the shaft 3. The table 2 can be rotated via the shaft 3 by this rotating means. In the first embodiment described above, the vertical means (not shown) is connected to the shaft 3. However, in this embodiment, the vertical means is provided on the side of the transfer device (not shown), and the substrate W is placed on the table 2. I'm trying to do it. Therefore, in this embodiment, the vertical movement of the table 2 is not performed, and the substrate W is placed on the table 2 by the vertical movement on the transfer device side. Note that the substrate W can be delivered in the same manner as in the first embodiment by providing both the upper and lower means and the rotating means (not shown) below the shaft 3.

  In the present embodiment, since the configuration as described above is adopted, the table 2 can be rotated. For example, when the processing liquid unit 4 and the table 2 are rotated in the opposite directions, the processing liquid L and the peripheral edge of the substrate W can be easily contacted and a physical action by stirring is also applied. The processing efficiency can be increased. Further, when the processing liquid unit 4 and the table 2 are synchronously rotated in the same direction, the influence of stirring is reduced and the fluctuation of the liquid level La of the processing liquid is suppressed, thereby processing in a stricter dimensional range. Is possible.

  When the processing liquid unit 4 is rotated and the peripheral portion of the substrate W is etched while the substrate W is stationary, the processing liquid penetrates toward the center of the substrate W due to surface tension, and a portion that should not be etched is removed. There is a possibility of etching. On the other hand, if the substrate W is also rotated, it is possible to suppress the treatment liquid from penetrating toward the center of the substrate W by the centrifugal force generated at that time.

  In addition, after etching, the substrate W is acidic, so it is often necessary to rinse the substrate W with pure water and dry it. At this time, if the substrate W is rotated, moisture can be removed by centrifugal force and dried (spin drying).

  Moreover, when performing a drying process as mentioned above, the board | substrate W is rotated and the liquid adhering with centrifugal force is skipped, and drying time can be shortened. In this case, since the processing liquid holding space 4i is present at the peripheral edge of the substrate W, the liquid blown off by the centrifugal force is not scattered. The rotation direction and the rotation speed can be selected as appropriate, and the rotation direction may be switched or the rotation speed may be changed during processing.

Next, another specific example of the treatment liquid unit 4 will be described with reference to FIG.
FIG. 7 is a cross-sectional view of the same portion as FIG. 6, except that the maximum liquid of the processing liquid L in the processing liquid holding space 4 i is different from that of the top plate 4 a and the processing liquid holding section 4 c. This is the point where overflow drain ports 21a and 21b for defining the surface level are provided.

  One end of each of the overflow drain ports 21a and 21b communicates with a portion near the opening in the treatment liquid holding space 4i, and the other end communicates with the outside of the upper surface plate 4a and the treatment liquid holding part 4c. When the liquid level (side surface near the opening) La of the processing liquid L in the processing liquid holding space 4i reaches the overflow drain ports 21a, b, the processing liquid L is discharged from the processing liquid holding space 4i through the overflow drain ports 21a, b. The Therefore, the processing liquid L in the processing liquid holding space 4i does not overflow from the overflow drain ports 21a and 21b to the radially inner side, and the processing area dimension of the peripheral edge of the substrate W can be controlled with high accuracy. Since the overflow drain ports 21a and 21b are formed to extend outward from the portion communicating with the processing liquid holding space 4i, the processing liquid L can be easily discharged by the centrifugal force generated by the rotation of the processing unit 4. Can do.

  A plurality of overflow drain ports 21a and 21b are provided along the circumferential direction of the annular processing liquid holding space 4i, similarly to the processing liquid discharge port 4d described above. Further, the overflow drain ports 21a and 21b may be provided only in either the upper surface plate 4a or the processing liquid holding unit 4c.

  The embodiments of the present invention have been described with reference to specific examples. However, the present invention is not limited to these specific examples.

  For example, the elements such as the treatment liquid unit, the table, the treatment liquid holding space, the treatment liquid nozzle, the cover for preventing the treatment liquid scattering used in the present invention are not limited to the shapes and sizes described above, and the cross-sectional shape thereof, The wall thickness, the shape and size of the opening, etc. are changed as appropriate to obtain the same effects and are included in the scope of the present invention.

  The vertical mechanism 8 may be attached to the bottom surface 5a of the housing 5 so as to be movable up and down. Further, the processing liquid unit 4 is lowered without providing the vertical mechanism 8, the lower end surfaces of the upper and lower shafts 19 a to 19 d are pressed against a fixed block or the like, and the upper surface plate 4 a is separated from the processing liquid holding part 4 c. Also good.

It is a fragmentary sectional perspective view of the processing apparatus concerning a first embodiment of the present invention. It is an enlarged view of the principal part in FIG. It is a top view of the processing apparatus concerning this embodiment. FIG. 4 is an enlarged sectional view taken along line A-O-A in FIG. 3. It is sectional drawing similar to FIG. 4, and represents the state when carrying in / out a board | substrate. It is a principal part expanded sectional view near the process liquid holding space where the process liquid was hold | maintained. It is an expanded sectional view of the principal part similar to FIG. 6 concerning the other specific example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Table 4 Processing liquid unit 4a Top plate 4c Processing liquid holding | maintenance part 4d Processing liquid discharge port 4h Convex-part upper surface 4i Processing liquid holding space 5 Housing 6 Rotating shaft 7 Cover 8 Vertical mechanism 9 Processing liquid nozzles 19a-19d Up and down Shaft 21a, b Overflow drain port D Depth of processing liquid L Processing liquid La Liquid surface (side) of processing liquid
W substrate (object to be processed)

Claims (11)

A processing apparatus for processing a peripheral portion of an object to be processed with a processing liquid,
A table capable of mounting and holding the object to be processed;
A treatment liquid unit having a treatment liquid holding space capable of holding the treatment liquid and inserting the peripheral portion of the object to be processed;
Treatment liquid supply means for supplying the treatment liquid to the treatment liquid holding space;
A rotating means for rotating the treatment liquid unit;
A processing apparatus comprising: The treatment liquid unit has two combinations that are separable from each other,
The processing apparatus according to claim 1, wherein the processing liquid holding space is formed by liquid-tightly combining the combination body.   The processing apparatus according to claim 1, wherein the processing liquid unit has a processing liquid discharge port for discharging the processing liquid from the processing liquid holding space.   The processing apparatus according to claim 1, wherein the processing liquid unit has an overflow drain port that defines a maximum liquid level of the processing liquid in the processing liquid holding space.   The processing apparatus according to claim 1, further comprising a rotating unit that rotates the table.   The processing apparatus according to claim 1, wherein a rotation center of the processing liquid unit and a center of the table are substantially coaxial. A processing method for processing a peripheral portion of an object to be processed with a processing liquid,
The rotation center of a processing liquid unit having a processing liquid holding space capable of holding the processing liquid and the center of the object to be processed are substantially coaxial, and the peripheral edge portion is inserted into the processing liquid holding space. A step of placing and holding the object to be processed,
Rotating the treatment liquid unit;
Supplying the processing liquid to the processing liquid holding space in a state where the processing liquid unit is rotated;
A processing method characterized by comprising:   The processing method according to claim 7, further comprising a step of rotating the processing liquid unit and the object to be processed.   The processing method according to claim 7, wherein the processing liquid is an etching liquid or a cleaning liquid.   The processing method according to claim 7, further comprising a step of discharging the processing liquid from the processing liquid holding space in a state where the processing liquid unit is rotated. The method further comprising the step of supplying a dry gas to the processing liquid holding space after the step of discharging the processing liquid from the processing liquid holding space while the processing liquid unit is rotated. 10. The processing method according to 10.

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