JP2003151948A - Apparatus and method of treating surface - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method of treating a surface, which enables cleaning and drying of a plate to be treated by only an apparatus of simple structure. SOLUTION: In the surface treatment apparatus 1B, a plate 100 to be treated is supported on an apparatus body 11. With a leading end part 21 of a scanning head 2 being close to a treatment face 101 of the plate 100 to be treated, a cleaning liquid R is supplied into a space 20 between the treatment face 101 and the leading end 21 from a liquid outlet port 42 formed in the scanning head 2. While the cleaning liquid R is supplied, the scanning head 2 is stepped over along the plate 100, to be treated to clean the plate 100. Then, with a surface active gas being supplied near the meniscus M of the cleaning liquid, R formed at the backward side in the scanning direction of the scanning head 2 from a gas outlet port 192 formed in the scanning head 2, the scanning head 2 is stepped over along the plate 100 to be treated to make the meniscus M move along the treatment face 101 to dry the treatment face 101.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a surface treatment apparatus and a surface treatment method.

[0002]

2. Description of the Related Art As a method for drying and removing water adhering to a substrate, a meniscus caused by the surface tension of water and a solvent gas +
A method of drying a substrate is known in which the Marangoni effect of an inert gas is used to dry the substrate surface without causing water droplets (Japanese Patent Laid-Open No. 10-321587).

This publication discloses a drying device for carrying out the drying method (hereinafter referred to as a conventional "drying device"), and this conventional drying device includes the following. There are various drawbacks.

1. The conventional drying device has a function of simply drying the water attached to the substrate (plate to be processed). For the pre-process, for example, the cleaning process, a cleaning device such as a separately prepared cleaning tank is used. Must be done.

Therefore, for example, in a line in which cleaning and drying of a substrate are continuously performed, it is necessary to install a cleaning device and a drying device in parallel and move the substrate between the respective devices for processing. However, it requires equipment cost and requires a large installation space.

[0006] In particular, when the substrate after being cleaned by the cleaning device is transferred to the drying device, it is necessary to prevent dust (foreign matter) from entering and adhering to the substrate. In some cases, it is necessary to install a mechanism or means having a dustproof function in the transfer route.

2. Although water adheres to the surface of the substrate by some method, the amount of water adhered is not controlled artificially, and is therefore expected to fluctuate.

In this case, as described above, since the gap distance between the draining blocks is fixed, the transportation speed of the substrate becomes faster, and the thickness of the substrate is thinner than the designed value (the surface of the substrate and In the case of a water film formed between the inner surface of the draining block and the inner surface of the draining block (hereinafter simply referred to as "water film"), the drying chamber (mixed gas filling space surrounded by the cover) The amount of water flowing in may be excessive. In this case, it may take a long time to dry, or the meniscus may increase beyond an appropriate size, resulting in a decrease in drying efficiency and poor drying (water droplet marks, remaining particles, etc.).

On the contrary, when the amount of water adhering to the substrate becomes too small, the water is not sufficiently diffused and filled between the substrate surface and the inner surface of the draining block due to the capillary phenomenon. It may cause poor drying.

3. In the conventional drying device, the size of the meniscus (the amount of water in the portion forming the meniscus) also changes when the transfer speed of the substrate changes, but the change in the meniscus size also occurs due to other factors.

For example, when the substrate being transported rocks in the thickness direction with respect to a pair of drainage blocks in a fixed state, the water films formed on both sides of the substrate in the gaps between the drainage blocks, respectively. The thickness varies over time.
As a result, the amount of water replenished in the meniscus fluctuates, and the size of the meniscus fluctuates. In particular, when the fluctuation speed is high, the meniscus surface (curved surface) vibrates. In this case, the fluctuation of the size of the meniscus is unavoidable because the water film is so thin that the capillary phenomenon occurs even if the substrate is slightly shaken. Further, such a variation is a phenomenon that easily occurs even in a clean room environment. In particular, when the water film is thin, the temporal change of the meniscus size is quite fast, and the influence thereof is large and causes poor drying such as water marks and stains.

As described above, when the size of the meniscus fluctuates due to various causes, an imbalance occurs between the meniscus and the drying speed, and the drying cannot be stably and favorably performed under certain conditions. In particular, uniform and good drying cannot be performed over the entire substrate surface.

4. In the conventional drying device, even if dirt (for example, foreign matter) is mixed in the water entering the gap between the draining blocks, or if the water existing in the gap between the draining blocks (that is, the water film) becomes dirty, Since the water cannot be removed or replaced and is brought into the drying chamber, there is a possibility that such water stains may cause poor drying.

5. In the conventional drying device, the substrate passes through the gap between the pair of draining blocks,
Since the gap distance between the draining blocks is fixed, it is not possible to cope with the change in the thickness of the substrate, and the drying can be performed only on the substrate having a constant thickness. When the substrate has a pattern, the gap between the block and the substrate varies, so that the meniscus varies, and there is a possibility that a portion where the capillarity phenomenon does not occur and water droplets remain.

6. In the conventional drying device, both surfaces of the substrate are wet with water, and both surfaces of the substrate are dried at the same time. Therefore, it is difficult to cope with the case where only one side of the substrate is desired to be dried. In particular, if one side of the substrate that has been wetted with water is dry and the other side is not desired to be wetted with water, this cannot be dealt with.

[0016]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a surface treatment apparatus and a surface treatment method capable of cleaning and drying a plate to be treated with one apparatus having a simple structure.

[0017]

The above objects are achieved by the present invention described in (1) to (15) below.

(1) An apparatus main body for supporting a plate to be processed,
A scanning head movably provided with respect to the apparatus main body, a driving means for moving the scanning head with respect to the apparatus main body, a cleaning liquid outlet formed in the scanning head, and a surface of the plate to be processed and the scanning. Cleaning liquid supply means for supplying a cleaning liquid to a gap between the head and a tip portion, and surfactant gas supply means for supplying a surfactant gas containing a surfactant near the tip portion from a gas outlet formed in the scanning head. In a state where the tip of the scanning head is brought close to the surface of the plate to be processed, the cleaning liquid is supplied from the cleaning liquid outlet to the gap between the surface and the tip to clean the surface, While supplying the surface-active gas from the gas outlet near the meniscus of the cleaning liquid formed on the rear side of the scanning head in the scanning direction, the scanning head is moved forward by the driving unit. By scanning along the treated plate, the meniscus is moved along the surface, thereby, the surface treatment apparatus characterized by operative to drying the surface.

(2) The surface treatment apparatus according to the above (1), which has a conveying means for conveying the plate to be treated.

(3) The surface treatment apparatus according to the above (2), which has a positioning means for positioning a carrying stop position of the plate to be processed.

(4) The surface treatment apparatus according to (2) or (3), wherein the carrying direction of the carrying means is a direction substantially orthogonal to the scanning direction of the scanning head.

(5) The surface treatment apparatus according to any one of the above (1) to (4), wherein the drive unit scans the scan head along the plate to be processed to perform the cleaning process.

(6) In any one of the above (1) to (5), there is provided exhaust means for sucking in and discharging the surface-active gas supplied from the gas outlet from the gas inlet formed in the scanning head. The surface treatment device described.

(7) The surface treatment apparatus according to any one of the above (1) to (6), which has a removing means for removing the cleaning liquid supplied to the gap between the surface of the plate to be processed and the facing surface.

(8) The surface treatment apparatus according to (7), wherein the removing means is a draining means for sucking and discharging the cleaning liquid from a liquid inlet formed in the scanning head.

(9) While removing the cleaning liquid by the removing means and supplying the cleaning liquid from the cleaning liquid outlet, the cleaning liquid in the gap between the surface of the plate to be processed and the tip of the scanning head is exchanged. The surface treatment apparatus according to (7) or (8) above, which enables cleaning treatment of the surface.

(10) The surface treatment apparatus according to any one of (1) to (9), wherein the cleaning liquid outlet is composed of a plurality of small holes arranged in one or two or more rows.

(11) With the surface of the plate to be processed and the tip of the scanning head in close proximity, the cleaning liquid is supplied from the cleaning liquid outlet formed in the scanning head to the gap between the surface and the tip. While cleaning the surface, and supplying a surface-active gas containing a surfactant from a gas outlet formed in the scanning head near the meniscus of the cleaning liquid formed on the scanning direction rear side of the scanning head. The surface treatment method is characterized in that the meniscus is moved along the surface by scanning the scanning head along the plate to be processed, whereby the surface is dried.

(12) The surface treatment method as described in (11) above, wherein the cleaning treatment is performed while scanning the scanning head along the plate to be treated.

(13) In the cleaning process, while removing the cleaning liquid in the gap between the surface of the plate to be processed and the tip of the scanning head and supplying the cleaning liquid from the cleaning liquid outlet, the cleaning liquid is exchanged. The surface treatment method according to (11) or (12) above, which is performed.

(14) The drying process is performed while sucking and discharging the surface-active gas supplied from the gas outlet from the gas inlet formed in the scanning head.
The surface treatment method according to any one of 1) to (13).

(15) The surface treatment method according to any one of (11) to (14), wherein the cleaning liquid is pure water or ozone water.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION A surface treating apparatus and a surface treating method of the present invention will be described below in detail with reference to the preferred embodiments shown in the accompanying drawings.

FIG. 1 is a diagram (block diagram) schematically showing an embodiment of a surface treatment apparatus of the present invention, FIG. 2 is a bottom view of a scanning head in the surface treatment apparatus shown in FIG. 1, and FIG. FIG. 3 is a partial cross-sectional side view showing, in an enlarged manner, the tip of the scanning head during the drying process in the surface treatment apparatus shown in FIG.

In the surface treatment apparatus 1B shown in these figures, the treatment liquid T is applied to the surface (treatment surface 101) of the plate 100 to be treated.
Is a device that performs (performs) the processing by (1), the cleaning processing by the cleaning liquid R, and the drying processing.

This surface treatment apparatus 1B is provided with a plate 100 to be treated.
A device main body 11 that supports the device, a scanning head 2 that is movable (displaceable) with respect to the device main body 11, a drive unit 5 that moves (displaces) the scanning head 2 with respect to the device main body 11, and a plate to be processed. 100 processing surface 101 and scanning head 2
Processing liquid supply means 9 for supplying the processing liquid T to the gap 20 with the tip portion 21, the cleaning liquid supply means 4 for supplying the cleaning liquid R to the gap 20, and the surfactant gas for supplying the surfactant gas near the tip portion 21. A supply unit 19, a transport unit 18 for transporting the plate 100 to be processed, a positioning unit 13 for positioning the transport stop position of the plate 100 to be processed, and a drainage liquid for sucking and discharging the processing liquid T or the cleaning liquid R in the gap 20. Means 16 and tip 2
Exhaust means 1 for exhausting the surface-active gas supplied near 1
7 and 7.

In this embodiment, a case will be described in which the target plate 100 having a rectangular flat plate shape is targeted. In the plate 100 to be processed, the horizontal direction in FIG. 1 is the long side direction, and the direction perpendicular to the paper surface of FIG. 1 is the short side direction.

The type, material, etc. of the plate 100 to be processed in the present invention are not particularly limited, and examples thereof include a semiconductor substrate and an LCD.
(Liquid crystal display screen) Substrate such as substrate, crystal plate, glass plate, metal plate such as stainless steel plate, and the like. Further, the shape of the plate to be processed 100 is not limited to a rectangle, and may be, for example, a circle, an ellipse, or the like, and the size can be applied to any size. That is, the present invention can be applied to the treatment of any plate (plate-shaped member).

The apparatus main body 11 can support the plate 100 to be processed in a substantially horizontal state. Surface treatment device 1B
Performs processing as described below on the processing surface 101, which is the upper surface of the processing target plate 100 supported by the apparatus main body 11.

A transfer means 18 for transferring the plate 100 to be processed is installed in the apparatus main body 11. The transport means 18 is
It has a plurality of rollers 181 arranged side by side, and the processed plate 100 placed on these rollers 181 is in a substantially horizontal state from the back side of the paper surface of FIG. 1 toward the front side (FIG.
Transport in a direction almost perpendicular to the paper surface of.

The plates 100 to be processed are carried into the surface processing apparatus 1B one by one from the front step (not shown) located on the back side of the paper surface of FIG.
After the processing in B is completed, it is carried out to a post process (not shown) located on the front side of the paper surface of FIG.

The apparatus main body 11 is provided with positioning means 13 for positioning the carrying stop position of the plate 100 to be processed carried in by the carrying means 18. The positioning means 13 has a stopper 131, and the stopper 1
Reference numeral 31 is displaceable between a state in which the plate 100 to be processed is projected onto the transport path (a state shown in FIG. 1) and a state in which it is retracted from the transport path (not shown).

The mechanism for moving the stopper 131 up and down (displacement) can be realized by, for example, a mechanism having a rack gear, a pinion gear, and a motor for rotating the pinion gear. In the present embodiment,
This is realized by arranging a plurality of (two) the above-mentioned mechanisms.

The plate to be processed 100 carried into the surface processing apparatus 1B by the conveying means 18 is stopped with respect to the apparatus main body 11 by the stopper 131 whose front edge in FIG. 1 is in a protruding state. . In this transportation stopped state, the processing by the surface processing apparatus 1B is performed.

When the processing on the plate 100 to be processed is completed, the positioning means 13 puts the stopper 131 in the retracted state, and sets the plate 100 to the plate 100 to be processed (stopped state).
To cancel. As a result, the plate 10 to be processed is completed.
0 is carried out to the subsequent process by the carrying means 18. Next, the positioning means 13 brings the stopper 131 into the protruding state, and the carrying means 18 carries in the next plate to be processed 100 to the carrying stop position. Then, the surface processing apparatus 1B performs processing on the plate 100 to be processed.

As described above, the surface processing apparatus 1B is a single-wafer processing type apparatus, and processes the target plate 100 one by one.

Incidentally, the conveying means 18 and the positioning means 1
Each of the components 3 is not limited to the configuration shown in the drawing, and may have any configuration as long as it can exhibit the same function.

The scanning head 2 has such a device body 11 as described above.
It is provided to be movable. This scanning head 2
Are driven (moved) by the driving means 5. The driving unit 5 can move the scanning head 2 in a direction substantially parallel to the processing surface 101, at least in a state where the leading end portion 21 (the lower end portion in FIG. 1) of the scanning head 2 is close to the processing surface 101. There is. That is, the scanning head 2 is provided so as to be able to scan along the plate 100 to be processed by the driving means 5.

In the configuration shown, the scanning head 2 scans in the left-right direction in FIG. That is, the scanning direction of the scanning head 2 and the transportation direction of the processing target plate 100 by the transportation means 18 are substantially orthogonal to each other.

Further, the driving means 5 includes the scanning head 2 as shown in FIG.
It can also be moved up and down. That is, the driving means 5 is movable between a state in which the scanning head 2 is retracted to the upper side in the drawing and a state in which the scanning head 2 is brought close to the plate 100 to be processed.

As the driving means 5, for example, a servo motor, a fluid pressure cylinder, a feed screw, a cam mechanism, a gear mechanism,
It is possible to use various known drive mechanisms that are appropriately combined and used with link mechanisms and the like.

Further, the driving means 5 has a rail member (not shown) provided along the scanning direction of the scanning head 2, and by moving the scanning head 2 along this rail member, The tip 21 of the scanning head 2 and the processing surface 10
The scanning head 2 is capable of scanning while maintaining a constant gap distance with respect to 1 (distance of the gap 20).

The width of the scanning head 2 (length in the vertical direction in FIG. 2) is almost the same as or slightly larger than the width of the plate 100 to be processed (length in the direction perpendicular to the paper surface of FIG. 1). .

The surface treatment apparatus 1B has the tip 21 of the scanning head 2 in a state where the tip 21 is brought close to the processing surface 101.
In the gap 20 formed between the processing liquid 101 and the processing surface 101.
The cleaning liquid R is supplied, and the treatment and the cleaning treatment with the treatment liquid T are performed. The distance between the processing surface 101 and the tip portion 21 (gap distance of the gap 20) when performing this processing is the processing liquid T or the cleaning liquid R.
Is sufficiently spread over the gap 20, and the treatment liquid T and the cleaning liquid R are sized so that the treatment liquid T and the cleaning liquid R can be retained in the gap 20 (or a region near the gap 20, hereinafter, simply referred to as a "gap 20") due to surface tension. It is preferably about 5 mm.

In the present invention, the processing liquid T or the cleaning liquid R is supplied to the gap 20 in this manner to perform the processing, so that the plate 100 to be processed is immersed in the tank storing the processing liquid T or the cleaning liquid R for the processing. Compared to such a case, the usage amounts of the processing liquid T and the cleaning liquid R can be significantly reduced.

Further, in the present invention, the treatment liquid T and the cleaning liquid R are retained (held) in the gap 20 due to the surface tension. Therefore, unlike the drawing, the plate 100 to be treated is inclined or perpendicular to the horizontal plane. But it can be processed.

In the present embodiment, the scanning direction of the scanning head 2 and the conveyance direction of the plate 100 to be processed are substantially orthogonal to each other as described above. Longitudinal direction, the processed plate 100
The conveyance direction of is in the direction of the short side of the plate 100 to be processed. As a result, the width of the scanning head 2 can be made relatively small, so that the supply and discharge of the liquid or gas can be performed more uniformly in the width direction of the plate 100 to be processed, and the plate to be processed by the carrying means 18 can be processed. There is an advantage that the transport distance of 100 can be shortened. Further, in addition, since the standby position when the scan head 2 is on standby is not on the transport path of the plate 100 to be processed, the plate 1 to be processed by the scan head 2 is
00, for example, scattering during cleaning of the scanning head 2 or contamination due to liquid dripping can be prevented.
By limiting the scanning direction of the scanning head 2, there is also an advantage that the device mechanism can be greatly simplified.

As shown in FIG. 2, the scanning head 2 has a plurality of liquid outlets 42 through which the processing liquid T and the cleaning liquid R flow out, and a plurality of liquid inlets 161 through which the processing liquid T and the cleaning liquid R flow in.
A plurality of gas outlets 192 through which the surface-active gas flows out and a plurality of gas inlets 171 through which the surface-active gas flows are formed. These liquid outlet 42, liquid inlet 161, gas outlet 192 and gas inlet 171 are
Each is composed of a small hole (orifice).

The plurality of liquid outlets 42, liquid inlet 161, gas outlet 192 and gas inlet 171 are respectively
The scanning heads 2 are arranged in a line in a direction perpendicular to the scanning direction of the scanning head 2, preferably at substantially equal intervals. As a result, it is possible to uniformly supply and discharge the liquid or gas in the width direction of the processing surface 101.

As shown in FIG. 1, the liquid outlet 42 and the liquid inlet 161 are respectively provided at the tip portion 21 of the scanning head 2.
There is an opening on the tip surface. Further, the gas outlet 192 and the gas inlet 171 are formed on the right side of the liquid outlet 42 and the liquid inlet 161 in the drawing, respectively, and are opened slightly closer to the base end side than the liquid outlet 42 and the liquid inlet 161. is doing.

As described above, in this embodiment, the liquid outlet 4
2 and the gas outflow port 192, and four types including the liquid inflow port 161 and the gas outflow port 171 are collectively formed in one scanning head 2, thereby further simplifying and downsizing the configuration of the apparatus. Can be planned. The scanning head 2 is not limited to such a configuration, and may have a structure in which these openings are formed in two or more separate bodies.

The numbers of the liquid outlets 42, the liquid inlets 161, the gas outlets 192 and the gas inlets 171 are not limited to those shown in the drawings, but may be appropriately set according to the size of the plate 100 to be processed. To be done. Further, the liquid outlet 42, the liquid inlet 161, the gas outlet 192 and the gas inlet 171.
May be arranged in two or more rows. Further, the liquid outlet 42, the liquid inlet 161, and the gas outlet 192.
At least one gas inlet 171 and each gas inlet 171 may be provided. Further, in the illustrated configuration, the liquid outlet 42, the liquid inlet 161, the gas outlet 192, and the gas inlet 171 each have a circular shape, but the shape is not limited to this, and for example, an elliptical shape, a rectangular shape, or the like. May be

In the illustrated structure, the hole 46 forming the liquid outlet 42, the hole 163 forming the liquid inlet 161, the hole 195 forming the gas outlet 192, and the hole 174 forming the gas inlet 171 are respectively , Is formed so as to penetrate to the base end portion 23 of the scanning head 2. Then, elongated casings 47, 164, 196, and 175 that form flow paths are fixed to the base end openings of the holes 46, 163, 195, and 174, respectively. Thereby, the plurality of liquid outlets 42, the liquid inlet 161 and the gas outlet 192.
And the flow paths to the gas inlet 171 communicate with each other in the casings 47, 164, 196 and 175, respectively.

Further, in the configuration shown in the figure, the scanning head 2 is provided with a hood (windshield) 22 for preventing the surface-active gas supplied from the gas outlet 192 from escaping (diffusing). As a result, it is possible to improve the supply efficiency of the surface-active gas and prevent diffusion into the environment.

The processing liquid supply means 9 for supplying the processing liquid T to the gap 20 has a processing liquid tank 91 for storing the processing liquid T, a liquid outlet 42 and a hole 46 formed in the scanning head 2.
Casing 47, processing liquid tank 91, switching valve 4
0, a supply line (flow path) 93, a pump 94 installed in the middle of the supply line 93, and a switching valve 4
0 for connecting the casing 47 to the supply line (flow path) 4
It is composed of 5 and 5.

The treatment liquid T is for performing various treatments on the treatment surface 101, and when the switching valve 40 is in a second state described later, the pump 94 operates to feed the treatment liquid tank 91 to the supply line 93. , The supply line 45, the inside of the casing 47, and the hole 46 in order, and then flows out from the liquid outlet 42 and is supplied to the gap 20.

The treatment with the treatment liquid T may be any treatment, for example, (resist) coating treatment for coating a resist or the like, peeling treatment for peeling the resist or the like, etching treatment, cleaning treatment, treatment for removing a masking film, etc. Examples include plating treatment.

Treatment liquid T for stripping the resist
It is preferably ozone water (aqueous ozone solution) or dilute hydrofluoric acid. As a result, the effect of removing the resist residue, polymer, etc. can be further enhanced.

The treatment liquid supply means 9 is capable of supplying a plurality of treatment liquids T (for example, ozone water and SC1 (ammonia water + perhydrogen), or ozone water and dilute hydrofluoric acid). May be. That is, the processing liquid supply means 9
May perform a plurality of types of processing on the processing surface 101.

The cleaning liquid supply means 4 for supplying the cleaning liquid (rinsing liquid) R to the gap 20 has a cleaning liquid tank 41 for storing the cleaning liquid R, a liquid outlet 42 and a hole 46 formed in the scanning head 2, and a casing 47. , A supply line (flow path) 43 connecting the cleaning liquid tank 41 and the switching valve 40
And a pump 44 installed in the middle of the supply line 43,
It is configured by a supply line (flow path) 45 that connects the switching valve 40 and the casing 47.

The switching valve 40 connects the supply line 43 and the supply line 45, and closes (blocks) the supply line 93, and the supply line 93 and the supply line 4.
5 for communicating with 5 and for blocking (blocking) the supply line 43
The state can be switched to.

The cleaning liquid R is for cleaning the processing surface 101 (rinsing process), and when the switching valve 40 is in the first state, the pump 44 operates to supply the cleaning liquid tank 41 with the supply line 43. The liquid flows out of the liquid outlet 42 through the line 45, the casing 47, and the hole 46, and is supplied to the gap 20.

As described above, in the present embodiment, the cleaning liquid supply means 4 and the processing liquid supply means 9 are provided with the liquid outlet 42 and the hole 4.
6, the supply line 45 and the casing 47 are shared (shared). That is, the liquid outlet 42
Is used both as a cleaning liquid outflow port through which the cleaning liquid R flows out and as a processing liquid outflow port through which the processing liquid T flows out. As described above, in this embodiment, a part of the flow path is shared (shared) between the processing liquid T supply line and the cleaning liquid R supply line.
By doing so, the configuration of the device can be further simplified and downsized.

In the present invention, unlike this configuration, the cleaning liquid outlet and the treatment liquid outlet may be provided separately.

The cleaning liquid R is not particularly limited as long as it can be used for cleaning, but it is preferably pure water or ozone water. Thereby, the cleaning effect can be further improved.

When pure water is used as the cleaning liquid R, for example, distilled water, ion-exchanged water, ultrapure water, RO water or the like can be used. When ozone water is used as the cleaning liquid R, it is preferable that the concentration thereof is lower than that of the ozone water used as the treatment liquid T.

The surface-active gas supply means 19 for supplying surface-active gas near the tip portion 21 of the scanning head 2 has a surface-active gas tank 191 for storing the surface-active gas, a gas outlet 192 formed in the scanning head 2, and Hole 195,
A casing 196, and a supply line (flow path) 193 that connects the surfactant gas tank 191 and the casing 196.
And a pump 194 provided in the middle of the supply line 193
And have.

The surface-active gas is a gas containing a surface-active agent, and when dissolved in (absorbed by) the cleaning liquid R, the cleaning liquid R
It has the property of reducing the surface tension of.

The surface active agent contained in the surface active gas is, for example, isopropyl alcohol (IPA),
Various alcohols such as methyl alcohol and ethyl alcohol can be used.

The surface-active gas may be such a surface-active agent gas itself. However, for example, an inert gas (poorly reactive gas) such as nitrogen (N ₂ ) gas may be used as the surface-active agent gas. Is preferably a mixture of about 0.1 to 10%. Even when diluted in this way, the function as the surface-active gas in the present invention can be sufficiently exerted, so that the emission amount (use amount) of the volatile organic compound (VOC) can be further reduced. Because it is preferable.

The surface active gas is supplied from the surface active gas tank 191 to the supply line 193 by the operation of the pump 194.
After passing through the hole 195 in the casing 196 sequentially, the gas flows out from the gas outlet 192 and is supplied to the vicinity of the tip 21 of the scanning head 2 (the right side of the tip 21 in the drawing).

The drainage means 16 for sucking and discharging the treatment liquid T and the cleaning liquid R in the gap 20 includes a liquid inlet 161 and a hole 163 formed in the scanning head 2, a casing 164.
A drainage line 162 extending from the casing 164 and a pump 165 provided in the middle of the drainage line 162.

When the pump 165 operates, the processing liquid T and the cleaning liquid R in the gap 20 are sucked in and discharged (removed) from the liquid inlet 161. That is, the drainage means 16 has the gap 2
It serves as a removing means for removing the processing liquid T and the cleaning liquid R supplied to 0.

In the present embodiment, such drainage means 16 is used.
Since the processing liquid T and the cleaning liquid R are supplied from the liquid outlet 42, the processing can be performed while the processing liquid T and the cleaning liquid R are sucked and discharged from the liquid inlet 161. As a result, the processing liquid T or the cleaning liquid R in the gap 20 can be processed while being gradually exchanged, and thus the processing liquid T or the cleaning liquid R can be maintained in a fresh state without deterioration, deterioration, and dirt. Therefore, the processing efficiency can be further improved, and the cleanliness of the processed surface 101 after drying can be further improved.

By operating the drainage means 16, the amount of the processing liquid T or the cleaning liquid R in the gap 20 (processing surface 1
It is also possible to adjust the adhesion amount of the treatment liquid T or the cleaning liquid R to 01). As a result, the processing liquid T or the cleaning liquid R that does not completely fill the gap 20 (cannot be held) is treated.
It is possible to prevent the droplets from remaining on the surface.

In the vicinity of the tip 21 of the scanning head 2,
A liquid drop sensor (not shown) for detecting water may be provided to detect the amount of the processing liquid T or the cleaning liquid R in the gap 20 and automatically adjust the amount to an appropriate amount.

The exhaust means 17 for exhausting the surface-active gas supplied in the vicinity of the tip portion 21 includes a gas inlet 171 and a hole 174 formed in the scanning head 2 and a casing 175.
And an exhaust line 172 extending from the casing 175,
It is composed of a pump 173 provided in the middle of the exhaust line 172.

When the pump 173 operates, the gas outlet 1
The surface-active gas supplied from 92 is supplied to the gas inlet 171.
Inhaled and discharged from.

In the present embodiment, such an exhaust means 17
With the provision of, it is possible to prevent the surface-active gas supplied near the tip portion 21 from diffusing into the environment, and it is possible to further reduce the burden on the environment.

Further, as shown in FIG. 3, the gas outlet 19
The surface active gas supplied from No. 2 is sucked from the gas inflow port 171 to generate an air flow F in the vicinity of the meniscus M of the cleaning liquid R, thereby removing the particles P and drying the vicinity of the end M1 of the meniscus M. The efficiency can be further improved.

The evacuation means 17 may be operated even during the processing with the processing liquid T. This can prevent the gas generated from the treatment liquid T in the gap 20 from diffusing into the environment and further reduce the burden on the environment.

Pump 9 of drive means 5 and processing liquid supply means 9
4, pump 44 of cleaning liquid supply means 4, pump 194 of surface-active gas supply means 19, pump 16 of drainage means 16
5, the pump 173 of the exhaust means 17, the conveying means 18, the positioning means 13, and the switching valve 40 are electrically connected to the control means 50, respectively, and are based on a signal (control signal) from the control means 50. Works.

Such a surface treatment apparatus 1B may be provided with a recovery means for removing or recovering the processing liquid T and the cleaning liquid R spilled from the processing surface 101. Examples of the recovery means include a receiving tray (reservoir) that receives the processing liquid T and the cleaning liquid R, and an absorbent material that absorbs the processing liquid T and the cleaning liquid R.

Further, in the surface treatment apparatus 1B, the conveying means 1
8, positioning means 13, drainage means 16 and exhaust means 1
Each of 7 may be omitted.

Next, an embodiment of the surface treatment method of the present invention using the surface treatment apparatus 1B (function of the surface treatment apparatus 1B) will be described.

[1] With the scanning head 2 retracted to the upper side by the driving means 5, the plate 100 to be processed is carried in by the carrying means 18. The processed plate 100 has a stopper 131.
Is positioned at a predetermined position and stops.

[2] Next, the scanning head 2 is moved down by the driving means 5 to bring the tip portion 21 close to the processing surface 101. At this time, the gap 2 between the tip 21 and the processing surface 101
The gap distance of 0 is set to the magnitude as described above.

In the present invention, the gap distance of the gap 20 can be adjusted by adjusting the descent stop position of the scanning head 2 at this time. By adjusting this gap distance,
The amount of the processing liquid T or the cleaning liquid R attached to the processing surface 101 can be controlled. Further, it is possible to deal with the plate 100 having different plate thicknesses.

The surface treatment apparatus 1B has a structure in which the position of the processing surface 101 of the plate 100 to be processed carried in is detected by a sensor and the gap distance of the gap 20 is automatically adjusted to a set value. May be. This makes it possible to deal with a case where the plate thickness changes from the middle when the plurality of plates 100 to be processed are continuously processed.

Further, unlike the above [1], the scanning head 2
The plate 100 to be processed may be loaded in a state in which the predetermined lowering stop position is set.

[3] Next, the scanning head 2 is moved to the left or right edge of the plate 100 to be processed by the driving means 5 so that the switching valve 40 establishes a state in which the supply line 93 and the supply line 45 are in communication with each other. , Operate the pump 94. As a result, the processing liquid T flows from the liquid outlet 42 into the gap 20.
Is supplied. When the gap 20 is filled with the processing liquid T, the pump 94 is stopped, and the driving unit 5 gradually scans the scanning head 2 along the plate 100 to be processed to the opposite edge. In this way, the processing surface 101 is subjected to the predetermined processing with the processing liquid T. If necessary, the scanning head 2 may be reciprocated once or twice or more along the plate 100 to be processed.

While the treatment with the treatment liquid T is being performed, the pump 94 is continuously operated and the drainage means 16 is operated so that the treatment liquid T is supplied from the liquid outlet 42 while the treatment liquid T is supplied from the liquid inlet 161. It may be in a state of inhaling T. As a result, the treatment liquid T in the gap 20 can be maintained while maintaining an appropriate amount, and the treatment liquid T in the gap 20 can be gradually replaced while performing the treatment. It is possible to maintain a fresh state, and further improve the processing efficiency (effect) and further shorten the processing time.

Further, by moving the scanning head 2 beyond the edge of the plate to be processed 100 to the outside, the processing liquid T in the gap 20 is spilled and removed from the processing surface 101, and then the processing liquid supply means 9 is used again. By supplying the treatment liquid T, almost all the treatment liquid T may be exchanged and the treatment may be continued. Thereby, the processing efficiency can be further improved. The exchange of the treatment liquid T may be performed plural times as needed.
The processing liquid T spilled from the processing surface 101 is removed or recovered by the recovery means (the same applies to the cleaning liquid R).

Further, during the processing with the processing liquid T, the exhaust means 17 may be operated to exhaust the gas generated from the processing liquid T in the gap 20.

[4] In the case of performing treatment with a plurality of types of treatment liquids T (when the treatment liquid supply means 9 is capable of supplying a plurality of types of treatment liquids T), the treatment liquids T should be different types. The process is switched to perform the same process as the above [3]. This allows
Multiple types of processing can be performed. When switching the type of the processing liquid T, the scanning head 2 is moved to the outside beyond the edge of the plate 100 to be processed and the processing liquid T in the gap 20 is spilled and removed from the processing surface 101, as described above. Then, the next processing liquid T is supplied. As a result, the processing liquid T in the gap 20 can be replaced quickly and without any liquid remaining.

[5] When the treatment with the treatment liquid T is completed, the scanning head 2 is moved to the outside beyond the edge of the plate 100 to be treated, and the treatment liquid T in the gap 20 is spilled and removed from the treatment surface 101.

[6] Next, at the position where the scanning head 2 is located on the left or right edge of the plate to be processed 100 in the drawing, the switching valve 40 is set to connect the supply line 43 and the supply line 45, and the pump 44 is connected. To operate. As a result, the cleaning liquid R is supplied to the gap 20 from the liquid outlet 42. When the gap 20 is filled with the cleaning liquid R, the pump 44 is stopped and the driving means 5 moves the scanning head 2 to the processed plate 10.
Gradually scan along 0 to the opposite edge. In this way, the cleaning processing (rinsing processing) with the cleaning liquid R is performed on the processing surface 101. If necessary, the scanning head 2 may be reciprocated once or twice or more along the plate 100 to be processed.

While the treatment with the cleaning liquid R is performed, the pump 44 is continuously operated and the drainage means 16 is operated to supply the cleaning liquid R from the liquid outlet 42 and suck the cleaning liquid R from the liquid inlet 161. It may be in a state of performing. As a result, the cleaning liquid R in the gap 20 can be maintained while maintaining an appropriate amount, and the cleaning liquid R in the gap 20 can be gradually replaced while performing the treatment. Therefore, the cleaning liquid R can be fresh without deterioration, deterioration, and dirt. The state can be maintained, the cleaning efficiency (effect) can be improved, and the cleaning time can be shortened.
Further, the processing surface 101 can be cleaned more cleanly,
The degree of cleanliness of the treated surface 101 after drying can be further improved.

Further, by moving the scanning head 2 beyond the edge of the plate to be processed 100 to the outside, the cleaning liquid R in the gap 20 is spilled and removed from the processing surface 101, and then the cleaning liquid R is again supplied by the cleaning liquid supply means 4. By supplying the cleaning liquid R, almost all of the cleaning liquid R may be exchanged and the cleaning process may be continued. Thereby, the cleaning efficiency can be further improved.
The exchange of the cleaning liquid R may be performed a plurality of times if necessary.

As a method for further enhancing the cleaning effect, ultrasonic wave applying means (not shown) may be installed in the scanning head 2 and ultrasonic cleaning may be used together.

[7] Next, the treatment surface 101 is dried. In this drying process, the scanning head 2 is moved to the plate 100 to be processed by the driving means 5 in a state where the cleaning liquid R is present in the gap 20.
In the figure, scanning is gradually performed once from the right edge to the left edge. That is, the scanning direction of the scanning head 2 in the drying process is from the right side to the left side in the drawing.

As shown in FIG. 3, when the scanning head 2 scans in this direction, the meniscus M (curved surface) of the cleaning liquid R is located behind the cleaning liquid R in the gap 20 in the scanning direction (on the right side in the drawing).
Is formed. The drying process is performed by the surface-active gas supply means 19
The pump 194 is operated to supply the surface-active gas from the gas outlet 192 in the vicinity of the meniscus M.

By dissolving this surface-active gas in the cleaning liquid R, the surface tension of the cleaning liquid R becomes small in the vicinity of the meniscus M. As a result, when particles (foreign matter such as dust) P adhere to the processing surface 101,
The cleaning liquid R enters between the particles P and the processing surface 101, and the particles P are suspended in the cleaning liquid R.

In the meniscus M, the end portion M1
A concentration gradient is generated in which the surfactant concentration decreases (decreases) from the vicinity of (the end portion on the processing surface 101 side) toward the central portion M2, and therefore the surface tension is directed from the vicinity of the end portion M1 toward the central portion M2. Becomes larger (increasing gradually). This is because the thickness of the cleaning liquid R (distance between the treatment surface 101 and the meniscus M) is smaller (thinner) in the vicinity of the end M1 than in the vicinity of the center M2. This is because the degree of dilution of the active agent) is small.

Due to the difference (gradient) in surface tension as described above, the cleaning liquid R near the meniscus M has a flow from the end portion M1 toward the central portion M2 as shown by the arrow in FIG. The effect caused by (difference) in surface tension is called the Marangoni effect, and this flow is called the Marangoni flow.

Due to such Marangoni flow, in the vicinity of the end M1 of the meniscus M, the film thickness of the cleaning liquid R is further reduced and the cleaning liquid R is evaporated, and the treated surface 10 is treated.
1 dries. In this way, the cleaning liquid R is evaporated and dried in the state of a thin film, so that a water mark
The treated surface 101 can be dried without leaving any residue.

The particles P are moved from the vicinity of the end M1 of the meniscus M to the center M2 by the Marangoni flow.
Shed towards. Therefore, it is possible to dry without leaving the particles P on the processing surface 101.

Further, in this embodiment, by operating the exhaust means 17, the surface active gas supplied from the gas outlet 192 is sucked from the gas inlet 171 to generate the airflow F and the particles P. Further, the meniscus M is made to flow more strongly from the vicinity of the end portion M1 toward the central portion M2. Therefore, it is possible to more reliably prevent the particles P from remaining on the processing surface 101.

By scanning the scanning head 2 from the right edge of the plate 100 to the left edge in the figure, the meniscus M is moved from the right edge of the plate 100 to the left edge in the figure. Moving. As a result, the above-described drying process is performed on almost the entire processing surface 101.

In the present invention, when the meniscus M moves,
Since the surface tension near the meniscus M is small and the Marangoni flow from the end M1 toward the center M2 is generated, the liquid film near the end M1 is broken and the droplets of the cleaning liquid R on the processing surface 101. Therefore, it is possible to perform good drying without remaining water droplets (watermarks), particles P, and the like.

Further, in the present embodiment, the exhaust means 17 is operated to suck and discharge the surface-active gas from the gas inlet 171 to perform the drying process, so that the air flow F of the surface-active gas is generated along the meniscus M. Occurs, which causes the end M1
The drying efficiency in the vicinity can be further improved. Also,
This air flow F also acts to promote (smooth) the Marangoni flow, and thus more reliably prevents the liquid film near the end M1 from being broken and the droplets of the cleaning liquid R to remain on the processing surface 101. It can also be prevented.

The moving speed of the meniscus M can be appropriately adjusted by adjusting the scanning (traveling) speed of the scanning head 2 so that good drying is performed. In the present invention, by adjusting the moving speed of the meniscus M and adjusting the gap distance of the gap 20,
It is possible to deal with different types of target plate 100, cleaning liquid R, and the like.

Further, in this drying process, the cleaning liquid R in the gap 20 may be gradually replaced as described above.

In the above, the cleaning process (the above [6]).
Although the case where the drying process (the above [7]) is separately (continuously) performed after the above is described, in the present invention, the cleaning process and the drying process may be performed in parallel (at the same time). That is, cleaning and drying may be performed at one time while the scanning head 2 is gradually scanned once from the edge portion on the right side to the edge portion on the left side of the plate 100 in the figure as described above. .

Further, although the surface treatment apparatus and the surface treatment method of this embodiment perform the treatment with the treatment liquid T prior to the cleaning treatment and the drying treatment of the treated surface 101,
In the present invention, the treatment liquid T may not be treated (the treatment liquid supply means 9 is not provided).

As described above, according to the present invention, by utilizing the Marangoni effect,
A reliable and uniform drying process can be performed, and
The degree of cleanliness of the treated surface 101 after drying is also high.

Further, the cleaning and drying of the plate 100 to be processed can be performed by one apparatus, in particular, the cleaning and the drying can be continuously performed, and these can be achieved by an apparatus having a simple structure. it can. Therefore, it is not necessary to separately prepare a cleaning device and a drying device and move the plate to be processed 100 between them to perform sequential processing. Therefore, the equipment cost can be reduced and the installation space of the device can be reduced. Also has the advantage of being small.

In particular, the surface treatment apparatus 1B of the present invention does not perform cleaning and drying while conveying the plate 100 to be treated toward the treatment surface 101, so that the plate 100 to be treated is different from the conventional drying device. Since it is not necessary to secure a transport path for drying, the apparatus can be downsized and the space can be saved.

Further, since cleaning and drying can be continuously performed by one apparatus, it is possible to reliably prevent re-adhesion of foreign matter such as particles P removed from the plate 100 to be processed, Therefore, the degree of cleanliness of the treated surface 101 after drying is high.

Further, as described above, in the present invention, the amount of the cleaning liquid R deposited on the processing surface 101 can be controlled by adjusting the gap distance of the gap 20 during drying, and the plate 100 to be treated can be controlled. Since the process is performed in a fixed state, the plate 100 to be processed does not swing in the thickness direction, so that the meniscus M can be maintained in an appropriate size and dried. As a result, the drying efficiency can be further improved, uniform drying can be performed over the entire processing surface 101, and the cleanliness of the processing surface 101 after drying can be improved.

In the present embodiment, the amount of the cleaning liquid R deposited on the processing surface 101 may be controlled by using the drainage means 16 in combination.

In the present invention, unlike the case where the drying process is performed by spraying the drying air ejected from the conventional air knife nozzle, the droplets of the cleaning liquid R are not scattered,
Therefore, the degree of cleanliness of the treated surface 101 after drying is remarkably high.

Further, compared with the case where the conventional IPA (isopropyl alcohol) vapor drying treatment is performed, the usage amount (release amount) of the volatile organic compound is remarkably small. Therefore,
The equipment can be simplified, such as eliminating the need for explosion-proof specifications of the equipment, and the equipment cost can be further reduced, and the burden on the environment is small.

In the present embodiment, the plate 100 to be processed is processed in a horizontal state, but in the present invention, the plate 100 to be processed is processed in a state in which it is inclined or perpendicular to the horizontal plane. It may be one. In this case, even if the plate 100 to be processed is relatively large, it does not take up much space, and therefore the installation space of the apparatus can be made smaller.

The surface treating apparatus and the surface treating method of the present invention have been described above with reference to the illustrated embodiment, but the present invention is not limited to this. Moreover, each part which comprises the surface treatment apparatus of this invention can be replaced by the thing of arbitrary structure which can exhibit the same function.

[0136]

As described above, according to the present invention, the cleaning and drying of the plate to be processed can be performed by one apparatus, and in particular,
Washing and drying can be performed in parallel (simultaneously) or continuously, and these can be achieved by a device having a simple structure. Therefore, it is not necessary to separately prepare a cleaning device and a drying device and move the plate to be processed between them to perform sequential processing. Therefore, it is possible to reduce the equipment cost and the installation space of the device. It has the advantage of being small.

In particular, the apparatus of the present invention does not carry out cleaning and drying while conveying the plate to be treated in the direction of the treatment surface thereof, and therefore conveys the plate for drying unlike the conventional drying device. It is not necessary to secure a route, and therefore the device can be downsized and the space can be saved.

Further, in the case where the cleaning liquid outlet and the gas outlet, and further four kinds including the cleaning liquid inlet and the gas inlet are formed in one scanning head, the structure of the apparatus is further simplified. , Downsizing can be achieved.

In the present invention, since the cleaning liquid can be removed or exchanged at the time of cleaning, the cleaning liquid is not cleaned as it is, and the cleaning liquid is not washed as it is or immediately after the cleaning. Since the drying can be performed, the degree of cleanliness of the dried surface is high.

Particularly, when pure water or ozone water is used as the cleaning liquid, the cleaning effect can be further improved.

Further, according to the present invention, it is possible to cope with different plates to be processed.

Further, according to the present invention, the drying efficiency is high, and good drying can be performed without leaving water droplet marks or particles. In particular, during drying, it is possible to control the amount of cleaning liquid deposited on the surface of the plate to be processed, and since there is no shaking in the thickness direction of the plate to be processed, it is possible to maintain the meniscus in an appropriate size for drying. As a result, the drying efficiency can be further improved, the entire surface of the target plate to be dried can be uniformly dried, and the cleanliness of the dried surface can be improved.

Further, in the present invention, it is possible to wash and dry only one side of the plate to be treated, and it is possible to deal with various patterns such as single side washing / drying and double side washing / drying.

Further, in the case of having a means for transporting the plate to be processed or further having a positioning means, it is advantageous for automation of the process when processing a plurality of plates to be processed, especially when these are processed continuously. And contributes to the improvement of mass productivity.

Further, when the means for exhausting the surface-active gas is provided, the flow of the surface-active gas near the meniscus can be improved and the drying efficiency can be further improved.

[Brief description of drawings]

FIG. 1 is a diagram (block diagram) schematically showing an embodiment of a surface treatment apparatus of the present invention.

FIG. 2 is a bottom view of a scanning head in the surface treatment apparatus shown in FIG.

FIG. 3 is a partial cross-sectional side view showing an enlarged tip portion of the scanning head during a drying process in the surface treatment apparatus shown in FIG.

[Explanation of symbols]

1B ... Surface treatment device 2 ... Scan head 21 ... Tip part 22 ... Hood 23 ... Base part 4 ... Cleaning solution supply means 41 ... Cleaning solution tank 42 ... Solution outlet 43 ... Supply line 4
4 ... Pump 45 ... Supply line 46 ... Hole 47
...... Casing 5 ...... Driving means 9 ...... Treatment liquid supply means 91 ...... Treatment liquid tank 93 ...... Supply line 94
...... Pump 11 …… Device body 13 …… Positioning means 131 …… Stopper 16 …… Draining means 161 ……
Liquid inlet 162 ... Drain line 163 ... Hole 164 ... Casing 165 ... Pump 17 ... Exhaust means 171
...... Gas inlet 172 ...... Exhaust line 173 ...... Pump 174 ...... Hole 175 ...... Casing 18 ......
Conveying means 181 ... Roller 19 ... Surfactant gas supply means 191 ... Surfactant gas tank 192 ... Gas outlet 193 ... Supply line 194
…… Pump 195 …… hole 196 …… Casing 2
0 ... Gap 50 ... Control means 40 ... Switching valve 100 ... Processed plate 101 ... Processing surface T ... Processing liquid R ... Cleaning liquid M ... Meniscus M1 ... End
M2: central part F: air flow P: particles

Claims (15)

[Claims] 1. A device main body that supports a plate to be processed, a scanning head that is movably provided with respect to the device main body, a drive unit that moves the scanning head with respect to the device main body, and the scan head. Cleaning liquid supply means for supplying the cleaning liquid to the gap between the surface of the plate to be processed and the tip of the scanning head from the cleaning liquid outlet, and the surface activity near the tip from the gas outlet formed in the scanning head. And a cleaning liquid in a gap between the surface and the tip portion in a state where the tip portion of the scanning head is brought close to the surface of the plate to be processed. A cleaning liquid is supplied from an outlet to clean the surface, and the surface-active gas is supplied from the gas outlet to the vicinity of the meniscus of the cleaning liquid formed on the rear side in the scanning direction of the scanning head. While driving the scanning head along the plate to be processed by the drive means, the meniscus is moved along the surface, thereby operating to dry the surface. Surface treatment equipment. 2. The surface processing apparatus according to claim 1, further comprising a transfer unit that transfers the plate to be processed. 3. The surface processing apparatus according to claim 2, further comprising a positioning unit that positions a transportation stop position of the plate to be processed. 4. The surface treatment apparatus according to claim 2, wherein the carrying direction of the carrying means is a direction substantially orthogonal to the scanning direction of the scanning head. 5. The surface treatment apparatus according to claim 1, wherein the cleaning process is performed while the scanning unit scans the scan head along the plate to be processed. 6. The surface treatment according to claim 1, further comprising exhaust means for sucking and discharging the surface-active gas supplied from the gas outlet from a gas inlet formed in the scanning head. apparatus. 7. The surface treatment apparatus according to claim 1, further comprising a removing unit that removes the cleaning liquid supplied to the gap between the surface of the plate to be processed and the facing surface. 8. The surface treatment apparatus according to claim 7, wherein the removing unit is a draining unit that sucks and discharges the cleaning liquid from a liquid inlet formed in the scanning head. 9. The cleaning solution is removed by the removing means, and the cleaning solution is supplied from the cleaning solution outlet, thereby exchanging the cleaning solution in the gap between the surface of the plate to be processed and the tip of the scanning head. The surface treatment apparatus according to claim 7, wherein the surface can be washed. 10. The surface treatment apparatus according to claim 1, wherein the cleaning liquid outlet comprises a plurality of small holes arranged in one or two or more rows. 11. A cleaning liquid is supplied from a cleaning liquid outlet formed in the scanning head to a gap between the surface and the tip while the surface of the plate to be processed and the tip of the scanning head are close to each other. Cleaning the surface, near the meniscus of the cleaning liquid formed on the scanning direction rear side of the scanning head, while supplying a surfactant gas containing a surfactant from a gas outlet formed in the scanning head, A surface treatment method, characterized in that the meniscus is moved along the surface by scanning the scanning head along the plate to be treated, whereby the surface is dried. 12. The surface treatment method according to claim 11, wherein the cleaning treatment is performed while scanning the scanning head along the plate to be treated. 13. The cleaning process is performed while exchanging the cleaning liquid by removing the cleaning liquid in the gap between the surface of the plate to be processed and the tip of the scanning head and supplying the cleaning liquid from the cleaning liquid outlet. The surface treatment method according to claim 11. 14. The drying process according to claim 11, wherein the drying process is performed while sucking and discharging the surface-active gas supplied from the gas outlet from a gas inlet formed in the scanning head. Surface treatment method. 15. The surface treatment method according to claim 11, wherein the cleaning liquid is pure water or ozone water.