JP2000223458A - Substrate-processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect a processing solution against deterioration and contamination when it is newly fed by a method, wherein a processing solution left in a spray means is collected, after it is sprayed through a spray means. SOLUTION: After a developing solution is sprayed by a spray means, spray nozzles 71 are turned upwards above a horizontal line by a turning means 73, and in this state, the one end of a spray pipe 70 is moved upwards through the intermediary of an engaging rod 721 by the rotation of a circular cam 722 as a sloping means. As a result of this setup, a residual developing solution in the spray pipe 70 is made to flow downward due to its own weight to the other end located lower than the one end and collected into a developing solution tank 42, by a developing solution recovering means 9 that is connected to the spray pipe 70.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a glass substrate for a semiconductor wafer or a photomask, a glass substrate for a liquid crystal display,
The present invention relates to a substrate processing apparatus that performs a predetermined process by supplying a processing liquid to a substrate for an optical disk.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device or a liquid crystal display device, a processing liquid is supplied to a substrate to be processed such as a semiconductor wafer or a glass substrate, so that a thin film formed on the surface of the substrate or the surface thereof is formed. And performing a process for In a substrate processing apparatus for performing such a process, a predetermined processing liquid is supplied to a surface of a substrate to be processed while the substrate to be processed is linearly transported in a substantially horizontal state. There are some which are made to process.

[0003] This type of substrate processing apparatus is provided with a processing tank for accommodating a substrate to be processed, and a nozzle for spraying a processing liquid from above onto a substrate conveyed in the processing tank. I have. The processing liquid ejected from the nozzle is stored in a processing liquid tank provided outside the processing tank, and is supplied from the processing liquid tank to the nozzle via a processing liquid supply pipe. The processing liquid supplied to the nozzle is vigorously jetted from the nozzle toward the substrate. Then, the processing liquid after being supplied to the substrate is collected in the processing liquid tank through a processing liquid recovery pipe connected to the bottom surface of the processing tank, and is reused for processing the next substrate. I have.

[0004] The predetermined processing solution includes an etching solution that is an acidic solution for etching a metal film formed on the main surface of the substrate, a stripping solution that is an alkaline solution for removing the resist film from the main surface of the substrate, and a resist film. A developer that is an alkaline solution to be developed, and a solution containing a surfactant and the like.
Examples include a developer and a cleaning solution such as a solution containing a surfactant.

[0005] For example, the cleaning unit is a single-wafer processing unit, and includes a carry-in unit, a UV ozone cleaning unit, a water washing unit, a droplet removing unit, and a carry-out unit. From the loading section to the unloading section,
The cleaning process is performed while transporting the substrate by the conveyor. The substrate transported to the washing section by the conveyor is
Scrub cleaning by a roll brush, ultrasonic spray cleaning, and cleaning with pure water by high-pressure jet spray are performed. Thereafter, in the droplet removing unit, the pure water droplets remaining on the surface of the substrate are blown off by an air knife.
In the developing unit, spray development is performed in which a spray of a developer is sprayed from the nozzle onto the upper surface of the substrate.

[0007] As shown in FIG. 7, a plurality of spray pipes 2 are provided above the substrate transport path in the processing tank along the substrate transport direction A in which the substrate 200 is transported.
01 to the upper surface which is the main surface of the substrate 200. Here, when the processing liquid discharge position from each nozzle perforated in the spray pipe 201 to the upper surface of the substrate 200 is fixed,
Although the substrate 200 moves in the transport direction but does not move in its width direction, the processing liquid is strongly applied to the upper surface of the substrate 200 immediately below the spray pipe 201. Therefore, the supply of the processing liquid on the upper surface of the substrate 200 becomes uneven. For this reason, the processing liquid is supplied from the nozzle while rotating each of the spray pipes 201 about a central axis in the longitudinal direction thereof in a direction B orthogonal to the substrate transport direction A, and the processing liquid is supplied from the nozzle. The supply of the processing liquid to the substrate is made uniform.

[0007]

However, in such an apparatus, even after the supply of the processing liquid through the spray pipe 201 is completed, the processing liquid remaining in the spray pipe 201 drops from the nozzle and is discharged. However, since the processing liquid is not extruded by supplying a new processing liquid, the processing liquid cannot be completely discharged and the processing liquid remains in the spray pipe 201. For this reason, there is a problem in that the processing liquid remaining and degraded in the spray pipe 201 during the next processing of the substrate is mixed with the newly supplied processing liquid and the contaminated processing liquid is jetted. In addition, there is a problem that the remaining processing liquid that has not been completely discharged falls on the substrate when not in the spray processing step, and unnecessary processing is caused by the processing liquid.

Accordingly, an object of the present invention is to provide a substrate processing apparatus which does not contaminate a new processing liquid when a new processing liquid is introduced to a spray unit. Another object of the present invention is to recover the processing liquid remaining in the spraying means before introducing the new processing liquid to the spraying means, to prevent the contamination with the new processing liquid, to contaminate the processing liquid, and to avoid contamination during the processing step. An object of the present invention is to provide a substrate processing apparatus in which a processing liquid does not sometimes fall on a substrate.

[0009]

According to a first aspect of the present invention, there is provided a processing liquid storage container capable of storing a processing liquid, and a processing liquid supply means provided from the processing liquid storage container. Spray means having a spray nozzle for spraying the processing liquid guided through the main surface of the substrate, and rotating means for changing the direction of the spray nozzle of the spray means into a state facing the main surface of the substrate and an upward state. Tilt means for raising one end of the spray means with the nozzle upward by the rotating means to tilt the spray means; and spraying the processing liquid having its own weight flowing down to the lower end side in the spray means tilted by the tilt means. A substrate processing apparatus comprising a processing liquid recovery means connected to a spray means for guiding the processing liquid to the outside.

Thus, since the spray means is inclined with the nozzle facing upward, the processing liquid remaining in the spray means can be recovered in the processing liquid recovery path under its own weight.

According to a second aspect of the present invention, when the spraying of the processing liquid by the spray means is completed, the nozzle is turned upward by the rotating means, and then the tilt means is controlled to lift one end of the spray means. 2. The substrate processing apparatus according to claim 1, further comprising control means.

According to this structure, the spray means can be inclined without the treatment liquid dripping from the spray means.
The remaining processing liquid can be surely collected, and dripping of the processing liquid in the middle of the inclination of the spray means can be prevented.

According to a third aspect of the present invention, the processing liquid collecting means guides the processing liquid from a processing liquid supply pipe to a nozzle via one end of the spray means, and lifts the other end of the spray means by an inclination means. The processing liquid returned to the processing liquid supply pipe flowing down is branched from the supply pipe and collected in the processing liquid storage container.
A substrate processing apparatus according to any one of the above.

According to this structure, the processing liquid collecting means can collect the processing liquid via a part of the processing liquid supply path including the connection portion with the spray means, so that the structure of the processing liquid collecting means can be simplified. can do.

According to a fourth aspect of the present invention, the control means performs processing by supplying a processing liquid to the main surface of the substrate while swinging or rotating the spraying means facing the substrate during the processing of the substrate. 4. The substrate processing apparatus according to claim 2, wherein:

According to this configuration, the supply of the processing liquid by the spray means for the substrate can be uniformly performed on the main surface of the substrate by controlling the rotating means by the control means. Further, at the time of processing liquid recovery, control may be performed such that the rotating means is operated until the nozzle is in the upward state.

[0017]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing a simplified configuration of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus loads the substrate S after the exposure processing disposed in the indexer unit 1 into the processing unit 2 and transports the substrate S in the substantially horizontal substrate transport direction TD in the processing unit 2. This is an apparatus for performing a developing process on the surface of the substrate S by supplying a processing liquid.

The indexer section 1 includes a cassette mounting section 11 on which a plurality of substrates S can be stacked in a vertical direction and on which a cassette C capable of housing a plurality of substrates S can be mounted, and a cassette mounted on the cassette mounting section 11. Take out the substrates S one by one from C,
It has an indexer robot 12 for carrying it into the processing unit 2.

In the processing section 2, a carry-in section 3, a developing tank 4, a washing tank 5 and a carry-out section 6 are arranged in series from the upstream side in the substrate transfer direction TD in order. The carry-in section 3, the developing tank 4, the washing tank 5, and the carry-out section 6 are respectively provided with a plurality of transport rollers 31, 41, 51, 61 for transporting the substrate S along the substrate transport direction TD. . Each of the transport rollers 31, 41, 51, and 61 rotates around an axis extending in a horizontal direction orthogonal to the substrate transport direction TD, and transports the substrate S placed thereon along the substrate transport direction TD. can do. When the substrate S taken out of the cassette C is placed on the transport roller 31 of the loading unit 3 by the indexer robot 12, the substrate S is loaded into the developing tank 4 and the washing tank 5 in order and subjected to the developing process. Is discharged onto the transport rollers 61 of the discharge section 6. The processed substrate S delivered to the unloading section 50 is transferred to a transport roller 61 by an unillustrated unloading robot.
Removed from above.

The developing tank 4 is provided with a developer spray means 7 for spraying a developing solution on the upper surface of the substrate S constituting the present invention, above the transport roller 41. As will be described later in detail, the developer spray means 7 is supplied with a developer stored in a developer tank 42 as a processing liquid storage container via a developer (processing liquid) supply means 8. . By the developer supply means 8, the developer can be ejected from the developer spray means 7 or the ejection can be stopped. With this configuration, the developer can be supplied to the surface of the substrate S after the exposure processing, and the substrate S
Unnecessary resist film on the surface can be removed to form a resist pattern on the surface. The developing solution supplied to the substrate S is collected in a developing solution tank 42 via a collecting pipe 43 connected to the bottom surface of the developing tank 4. The developer tank 42 is connected to the bottom of the developer tank 4 by a collection pipe 43 having a filter (not shown). The developer is collected from the developer tank 4 to the developer tank 42 via the filter and is used for circulation. Has become.

The washing tank 5 is provided above and below the transport roller 51 with pure water spray means 52U and 52L for supplying pure water to the front and back surfaces of the substrate S, respectively. Pure water stored in a pure water tank 53 is pumped by a pump 54 and supplied to the spray means 52U via a pure water supply pipe 55. Further, pure water pumped from a pure water tank 53 by a pump 54 is supplied to the spray means 52L via a branch pipe 56 branched and connected to a pure water supply pipe 55. Pure water supply pipe 55
An air valve 57 is interposed in the middle of the air valve 57. By opening and closing the air valve 57, the spray means 52U,
Pure water can be injected from 52L or the injection can be stopped. With this configuration, pure water can be supplied to the front and back surfaces of the substrate S that has been treated with the developer, and the developer and the like attached to the front and back surfaces can be washed away.

The pure water supplied to the substrate S is supplied to a valve 5
It is collected in the pure water tank 53 via 8R and the recovery pipe 59R, or is discarded via the valve 58A and the waste liquid pipe 59A. Specifically, during the initial period when the cleaning process for the substrate S is started, the valve 58R is closed and the valve 58A is opened. As a result, pure water containing a large amount of the developer and the like washed off from the substrate S is discarded. Then, after a certain time has elapsed, the valve 58R is opened and the valve 58A is closed. Thereby, of the pure water used for cleaning the substrate S, relatively pure water can be collected in the pure water tank 53.

A pair of air knife devices 62 and 63 for blowing dry air to the front and back surfaces of the substrate S are arranged above and below the transport roller 61 at the entrance of the carry-out section 6, respectively. These pair of air knife devices 62,
To 63, dry air sent from an air supply source (not shown) is supplied via an air supply pipe 64. An air valve 65 is interposed in the air supply pipe 64. By opening and closing the air valve 65, the air knife devices 62 and 6 are opened.
The dry air can be supplied to the substrate S from 3 or the supply can be stopped. With this configuration, it is possible to blow dry air onto the front and back surfaces of the substrate S delivered to the carry-out section 6, and to remove moisture adhering to the front and back surfaces.

Here, the spray means 7 in the developing tank 4
An example of a mechanism for collecting the remaining developer in the above will be described in more detail. FIG. 2 is a cross-sectional view taken along line II of FIG. FIG. 3 is a plan view showing the front configuration of the developing tank 4 of FIG. 2 and showing the configuration of the rotating means, and FIG. 4 is a cross-sectional view showing the state where the spray means 7 is tilted in FIG. In FIG. 2, a plurality of transport rollers 41 provided in the developing tank 4 are each configured by fixing a pair of edge support rollers 411 and a center support roller 412 to a rotation shaft 413. The edge support roller 411 includes a main body 414 that supports a lower surface of a side edge of the substrate S along a substrate transport direction (a direction perpendicular to the paper surface of FIG. 2) and a flange 415 that guides a side surface of the substrate S. Have. The center support roller 412 is provided at the center between the pair of edge support rollers 411, and supports the lower surface of the substrate S.

One end (right side in FIG. 2) of the transport roller 41 penetrates through the side plate 44 and is connected to a driving means 20 such as a motor arranged along the side plate 44. They are driven by synchronous rotation in the same direction. Therefore, by placing the substrate S on the transport roller 41, the substrate S is transported in the transport direction TD. The operation of the driving means 20 of the transport roller 41 is as follows.
It is controlled by control means described later. Thereby, for example, the transport roller 41
Is transported forward in the transport direction TD or the substrate S
To return in the direction opposite to the transport direction TD. As a result, the substrate S is swung in the developing tank 4 so that the processing in each of these processing units is performed uniformly over the entire area of the substrate S, and the transport path length of each processing unit is reduced. The processing time necessary and sufficient for each step can be secured without lengthening.

A plurality of spray means 7 for supplying a developing solution toward the upper surface of the substrate S are arranged at predetermined intervals above the inside of the developing tank 4 provided in the transport path. Each of these spray means 7 is provided in the transport direction TD of the substrate S.
And a plurality of spray pipes 70 are juxtaposed in a direction orthogonal to the transport direction TD.
Each spray pipe 70 is constituted by a cylindrical pipe, and a plurality of spray nozzles 71 are provided in a row in a longitudinal direction of a peripheral surface thereof. The spray nozzle 71 has an open end, and discharges the developing solution guided into the spray pipe 70 from the opening. Spray means 7 is spray pipe 7
A tilting means 72 for tilting the spray pipe 70 is provided at one end (the right side in FIG. 2) of the zero, and a rotating means 73 for rotating the spray pipe 70 is provided at the other end (the left side in FIG. 2). . Further, the other end of the spray pipe 73 is connected to the developing solution supply means 8 to enable the supply of the developing solution.

The inclining means 72 includes a locking rod 721 projecting from one end of the spray pipe 72, a circular cam 722 abutting on the locking rod 721 and pushing upward, and a circular cam 7.
22 is constituted by a rotating shaft 723 which is rotated by a signal from a control means described later. A return spring 724 is disposed between the spray pipe 70 and the side plate 44 so that the return spring 724 is always positioned on a support plate 726 disposed on a side surface of the side plate 44 via a bearing 725 attached to one end of the spray pipe 70. It is biased downward. The support plate 726 has a cross section L
The bearing 725 enters the slit 727 formed in the upright wall, moves down, and is placed on the support plate 726. The rotating shaft 723 is eccentrically disposed with a circular cam 722 and can be driven by being connected to a drive source (not shown). When the rotating shaft 723 rotates, the circular cam 722 and the locking rod 721 engage with each other. One end of the spray pipe 70 is lifted above the support plate 726 against the return spring 724.

Here, the locking rod 721 and the circular cam 722 may be provided for each spray pipe 70, or may be arranged at one place and the spray pipe 70 is connected at one end. In order to make the supply of the developing solution to the upper surface of the substrate S uniform, each spray means 7 is provided with a spray pipe 7.
Rotating means 7 for rotating the substrate 0 in a direction perpendicular to the substrate transport direction TD around the center axis of each longitudinal direction as a rotation center.
3 are arranged along the outside of the side plate 45.

The rotating means 73 comprises a link mechanism 75 interposed between the drive motor 74 and the spray pipe 70 in FIGS. The link mechanism 75 has a crank arm 752 having one end connected to a rotation shaft of the drive motor 74 via a first arm 751, and the crank arm 752 is connected to the drive motor 74 via the first arm 751.
Linked to The other end of the crank arm 752 is connected to one end of the second arm 753. The other end of the second arm 753 pivots on a shaft 754 fixed to a movable mounting plate 48 (indicated by a dashed line in FIG. 3) that can be tilted via a fixed plate 46 and a truncated number 47 disposed on the side plate 45. The link mechanism 75 rotates freely about the axis of the shaft 754 via the first arm 751, the crank arm 752, and the second arm 753 by the rotation of the rotation shaft of the drive motor 74. 753 is rotated by a predetermined angle D. Also, each spray pipe 70
Are rotatably supported by bearings 755, respectively. The bearing 755 enters the slit 451 of the side plate 45, and the bearing 755 abuts on the lower side, so that the spray pipe 70 is rotatably supported.

Further, each spray pipe 70 is provided with a mounting piece 756 fixed to the outer periphery thereof.
The lower end of each mounting piece 756 is connected to a swing connection arm 757. A connecting plate 759 in which a projection 758 protruding from the swing connecting arm 757 is engaged with the slit is connected to one end of the swing connecting arm 755, and a second arm 753 in which the connecting plate 759 is fitted on the outer periphery of the shaft 754. Are pivotally connected to the lower ends of the spray arms 70 through the connection plate 759, the swing connection arm 757, and the mounting pieces 756, respectively, with the rotation of the second arm 753. 5 is rotated by a predetermined angle E.

In FIG. 2, the developing solution supply means 8 comprises:
The connecting portion 80 of the spray pipe 70 is provided with a radius so that each of the spray pipes 70 can be rotated by the rotating means 73, and the material itself slightly expands and contracts in order to allow the tilting means 72 to tilt. It is composed of a flexible resin tube or the like that can be used.
The movement of the connecting portion 80 between the developer supply means 8 and the spray pipe 70 at the time of turning and tilting is absorbed.

The developer supply means 8 is connected to each spray pipe 70
And a developer tank 4 having one end connected via a connecting portion 80
2 has a developer supply pipe 81 connected to the other end thereof, and a pump 82 for feeding the developer from the developer tank 42 to the developer supply pipe 81 is provided at the other end of the developer supply pipe 81. Has been established. A filter 83 and an air valve 84 are interposed in the middle of the developer supply pipe 81.
By opening and closing the nozzle 4, the developer can be ejected from the spray unit 7 or the ejection can be stopped. With this configuration, the developing solution is pumped by the pump 82 onto the upper surface of the substrate S after the exposure processing, and the spray nozzle 71 of the spray pipe 70 is
And performs a predetermined process on the substrate S.

Further, at the other end of the spray pipe 70, a developing solution (processing solution) collecting means 9 for collecting the remaining developing solution in the spray pipe 70 into the developing solution tank 42 is provided. The developer collecting means 9 is branched from a downstream side of the air valve 84 of the developer supply pipe 81 and is connected to a branch recovery pipe 90 connected to an upper part of the developer tank 42. A filter 91 and an air valve 92 are provided. According to the developing solution collecting means 9, the developing solution flowing backward from the spray pipe 70 through the developing solution supply pipe 81 with the air valve 84 closed and the air valve 92 opened is supplied to the developing solution via the branch collecting pipe 90. It will be led to the tank 42.

The developer supply pipe 81 and the pump 8
2, the filter 83 and the air valve 84 constitute a developer supply unit 8 for supplying a developer from the developer tank 42 into the spray unit 7. Similarly, a part of the developer supply pipe 81 on the connecting portion 80 side, the branch recovery pipe 90, the air valve 91, and the filter 91 constitute the developer recovery means 9.

The control means 100 related to the developing tank 4 will be described with reference to FIG. FIG. 2 is a block diagram showing the electrical configuration of the control means 100. The rotation shaft 723 of the tilt means 72, the drive motor 74 of the rotation means 73, the developer supply means 8 and the developer recovery means 9 have a microcomputer. It is controlled by the control unit 101.

The control unit 101 further includes a transport roller 41
Is controlled by the driving means 20 for driving. Output signals of an inlet sensor and an outlet sensor of the developing tank 4 (not shown) are input to the control unit 101. Based on the output signals of these sensors,
The control unit 101 controls the transport of the substrate S, the developing process by the spray unit 7 accompanying the transport, and the recovery of the residual developer after the processing step.

Here, an example of the operation of recovering the residual developing solution in the spray means 7 in the developing tank 4 in the developing process having the above configuration will be described in detail. FIG.
FIG. 7 is a cross-sectional view for explaining a state in which the spray pipe 70 is tilted by the tilting means 72. FIG.
FIG. 3 is an explanatory view showing a rotation state of a spray nozzle 70 by No. 3;

The control unit 101 controls the driving means to start the transport of the substrate S by the transport roller 31 of the loading unit 3, and then monitors the output signal of the entrance sensor of the developing tank 4. When the entrance sensor detects the substrate S and is turned on, the transport roller 41 is driven to start the developing process.

The developer supply means 8 opens the air valve 84, and the developer recovery means 9 opens the pump 82 with the air valve 72 closed.
To pump out the developing solution from the developing solution tank. The developer is supplied to the spray pipe 7 through the supply pipe 81 and the connecting portion 80.
The liquid is guided to 0 and sprayed from the opening of the spray nozzle 71 onto the upper surface of the substrate S. During this process, the drive motor 741 of the rotating means 73 is rotated forward and reverse, and the spray mechanism 70 is repeatedly rotated by the link mechanism 75 by a predetermined angle E shown in FIG. Therefore, the spray nozzle 71 rotates in the state F and the state G shown in FIG.

Next, after the leading edge of the substrate S reaches the position where the exit sensor is provided (when the substrate S is not rocked in the transport direction TD), the control unit 101 stops the pump 82 and stops the developer. The supply is stopped, and the rotating means 73 rotates the spray nozzle 71 upward. That is, the spray pipe 70 is rotated by the rotation control of the drive motor 74 until the state H shown in FIG. In the state H, since the spray nozzle 71 is located above the horizontal line II, dripping of the remaining developer is prevented.

Thereafter, the circular cam 722 of the tilting means 72 is rotated to lift one end of the spray pipe 70 upward as shown in FIG. The other end of the spray pipe 70 is supported by a movable mounting plate 48 and a link mechanism 75, and the movable mounting plate 48 is tilted to the other end side with the trillion number 47 as a fulcrum, whereby the tilting of the spray pipe 70 is achieved together with the rotating means 73. Is done.

At this time, the developer remaining in the spray pipe 70 flows down to the other end of the spray pipe 70 by its own weight, and is returned to the supply pipe 81. The air valve 84 is closed,
The developer flowing backward by opening the air valve 92 is collected in the developer tank 42 via the branch collection pipe 90. Since the recovered developer is recovered through the filter 91, dust and a part of the solidified developer are removed and recovered.

The control unit 101 monitors whether or not the exit sensor has been turned off so as not to detect the substrate S. When the exit sensor is turned off, the control unit 101 further determines whether or not the substrate S transported next is detected by the exit sensor of the loading unit 20. When the leading end of the next substrate S is detected, the tilting means 72 and the rotating means 73 are driven to set the shower means 7 to a state in which the developing solution can be ejected.

While the embodiment of the present invention has been described above, the present invention can be embodied in other forms. FIG. 6 is a sectional view corresponding to FIG. 2 showing another embodiment of the present invention. Note that the same reference numerals are used for the units having the same configuration as the above-described first embodiment, and the description is omitted.
The second embodiment differs from the first embodiment in that the structures at both ends of the spray pipe 70 are exchanged. That is, the rotating means 73 is provided on the right side of the spray pipe 70 in the figure, and the tilting means 72 is provided on the left side thereof. Further, a developer recovery means 9A is provided on the same side as the rotating means 73. The developer collecting means 9A is connected to an air valve 92A from one end of the spray pipe 70.
And an independent recovery pipe 90A with a filter 91A interposed therebetween, and connected to the recovery pipe 43.

In this embodiment, when the spray pipe 70 is tilted to collect the remaining developer, the air valve 92 is turned off.
A is opened, and the remaining developer is collected by a dedicated independent collection pipe 90A. Therefore, the developer does not remain in the spray pipe 70 and the developer supply pipe 81 is not contaminated by the remaining developer.

In addition to the above, various design changes can be made within the technical scope described in the claims. For example, the recovery of the residual liquid in the spray unit 7 is performed using the transfer timing of the substrate S as a trigger, but the control may be performed such that the control can be performed at an arbitrary timing from the main operation panel of the substrate processing apparatus. Good.

Further, the above embodiment shows an example in which the developing tank 4 is used. However, the present invention can also be applied to the washing spray means of the washing tank 5.

[0048]

As described above, according to the present invention,
After the treatment liquid is sprayed by the spray means, the treatment liquid remaining in the spray means is tilted down by the spray means and flows down to one end by its own weight to be collected, so that the treatment liquid does not remain in the spray means. There is no.

Therefore, when a new processing liquid is supplied,
A substrate processing apparatus is provided in which a processing solution remaining in a new processing solution is not mixed and deteriorated and contaminated. Further, it is possible to reliably prevent the processing liquid from dropping onto the substrate during a process other than the spray processing.

[Brief description of the drawings]

FIG. 1 is an overall schematic diagram showing an overall outline of a substrate processing apparatus of the present invention.

FIG. 2 is a sectional view taken along line II in FIG. 1 showing a cross section of a developing tank 4;

3 shows a front configuration of the developing tank 4 of FIG.
3 is a plan view showing the configuration of FIG.

FIG. 4 is a sectional view showing a state in which the spray means 7 is tilted in FIG.

FIG. 5 is an explanatory view showing a rotating state of the spray pipe 70 of FIG. 2;

FIG. 6 is a sectional view of a developing tank showing another embodiment of the present invention.

FIG. 7 is a plan view showing a piping configuration of a spray pipe in a conventional spray processing tank.

[Explanation of symbols]

 S Substrate 4 Developing tank 7 Spray means 8 Treatment liquid supply means 70 Spray pipe 71 Spray nozzle 72 Inclination means 721 Lock bar 722 Circular cam 73 Rotating means 74 Drive motor 75 Link mechanism 100 Control means 101 Control unit

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Claims (4)

[Claims] 1. A spray having a processing liquid storage container capable of storing a processing liquid, and a spray nozzle for spraying a processing liquid guided from the processing liquid storage container via a processing liquid supply unit onto a main surface of a substrate. Means, a rotating means for changing the direction of the spray nozzle of the spraying means into a state facing the main surface of the substrate and an upward state, and the rotating means lifts one end of the spraying means with the nozzle in the upward state A tilting means for tilting the spraying means, and a processing liquid collecting means connected to the spraying means for guiding the processing liquid having its own weight flowing down to the lower end side in the spraying means tilted by the tilting means to the outside of the spraying means. Characteristic substrate processing equipment. 2. A control means for controlling the inclination means to lift one end of the spray means after the nozzle is turned upward by the rotation means when the spraying of the processing liquid by the spray means is completed. The substrate processing apparatus according to claim 1, wherein: 3. The processing liquid collecting means guides the processing liquid from a processing liquid supply pipe through one end of the spray means to a nozzle, and flows down by raising the other end of the spray means by an inclination means. 3. The substrate processing apparatus according to claim 1, wherein the processing liquid returned to the substrate is branched from a supply pipe and collected in the processing liquid storage container. 4. 4. A process according to claim 2, wherein said control means performs processing by supplying a processing liquid to the main surface of the substrate while swinging or rotating the spray means facing the substrate during the processing of the substrate. 3. The substrate processing apparatus according to any one of 3.