JP2988828B2 - Substrate drainer / dryer - Google Patents
Substrate drainer / dryerInfo
- Publication number
- JP2988828B2 JP2988828B2 JP6117620A JP11762094A JP2988828B2 JP 2988828 B2 JP2988828 B2 JP 2988828B2 JP 6117620 A JP6117620 A JP 6117620A JP 11762094 A JP11762094 A JP 11762094A JP 2988828 B2 JP2988828 B2 JP 2988828B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- gas injection
- slit
- injection port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、湿式表面処理が施され
た液晶表示器用のガラス基板、フォトマスク用のガラス
基板等の角型基板に気体を噴射して、角型基板の表面に
付着した液滴を除去する基板の液切り乾燥装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of spraying a gas onto a rectangular substrate such as a glass substrate for a liquid crystal display or a photomask which has been subjected to a wet surface treatment and adheres to the surface of the rectangular substrate. The present invention relates to a device for draining and drying a substrate for removing dropped droplets.
【０００２】[0002]
【従来の技術】液晶表示器、カラーフィルタ、フォトマ
スク等の製造工程では、基板洗浄処理等の各種の湿式表
面処理が行われる。そして、角型基板の洗浄後、角型基
板に付着した液滴を除去して乾燥させる作業が行われ
る。角型基板に付着した液滴を除去する液切り装置とし
て、例えば、特開昭６３−１５４２１号公報に記載され
た装置が知られている。2. Description of the Related Art In a process of manufacturing a liquid crystal display, a color filter, a photomask and the like, various wet surface treatments such as a substrate cleaning treatment are performed. Then, after cleaning the square substrate, an operation of removing and drying the droplets attached to the square substrate is performed. 2. Description of the Related Art As a liquid removing device for removing droplets attached to a rectangular substrate, for example, an apparatus described in Japanese Patent Application Laid-Open No. 63-15421 is known.
【０００３】この装置は、水平搬送される角型基板を挟
んで上下に対向配備された第１のエアーナイフと、第１
のエアーナイフの後方にこれと同じ構成の第２のエアー
ナイフとが、角型基板の搬送方向と直交してそれぞれ平
行に配置されて構成されている。先ず、第１のエアーナ
イフから角型基板の上下両面に向けてエアーを噴射する
ことにより、その角型基板の上下両面に付着した液滴が
吹き飛ばされる。第１のエアーナイフである程度角型基
板の液滴を吹き飛ばした後、該第１のエアーナイフで取
り除けなかった液滴が、さらに第２のエアーナイフで除
去される。[0003] This apparatus comprises a first air knife vertically opposed to a rectangular substrate to be horizontally conveyed, and a first air knife arranged vertically.
A second air knife having the same configuration is arranged behind and parallel to the air knife in a direction perpendicular to the transport direction of the rectangular substrate. First, droplets attached to the upper and lower surfaces of the rectangular substrate are blown off by injecting air from the first air knife toward the upper and lower surfaces of the rectangular substrate. After the droplets of the square substrate are blown off to some extent by the first air knife, the droplets that cannot be removed by the first air knife are further removed by the second air knife.
【０００４】また、実開平４−４８６２１号公報に記載
された装置も知られている。この装置は、上記した装置
と同様に、図５に示すように、第１及び第２のエアーナ
イフ１００，１０１を備えている。角型基板Ｗの液滴
（図中に斜線で示す）を取り除きやすくするため、各エ
アーナイフ１００，１０１は水平面内において平行で、
かつ角型基板Ｗの搬送方向と直交する方向に対して傾き
をもった状態で配置されている。先ず、第１のエアーナ
イフ１００により、角型基板Ｗに付着した液滴が角型基
板Ｗの角部に押し流されながら、角型基板Ｗの角部から
吹き飛ばされる。続いて第２のエアーナイフ１０１によ
り、該第１のエアーナイフ１００で吹き飛ばされずに残
った液滴が除去される。A device described in Japanese Utility Model Laid-Open No. 4-48621 is also known. This device is provided with first and second air knives 100 and 101 as shown in FIG. The air knives 100 and 101 are parallel in a horizontal plane to make it easy to remove droplets (shown by oblique lines in the figure) of the square substrate W.
In addition, they are arranged in a state of being inclined with respect to a direction orthogonal to the transport direction of the rectangular substrate W. First, the droplets attached to the square substrate W are blown off from the corners of the square substrate W while being pushed down to the corners of the square substrate W by the first air knife 100. Subsequently, the second air knife 101 removes the liquid droplets remaining without being blown off by the first air knife 100.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
たいずれの液切り装置も、複数段に配置されたエアーナ
イフは、搬送される角型基板Ｗに対して、同じ方向へエ
アーを吹き付けているので、図５に示すように、第１の
エアーナイフ１００で角型基板Ｗの角部に押し流されて
残った液滴は、角型基板Ｗの角部２面にわたって付着す
るので、角型基板Ｗとの付着力が高まり取り除きにくい
ものとなり、第１のエアーナイフ１００と同じ方向に向
けられた第２のエアーナイフ１０１では、基板Ｗの角部
に追い込まれた液滴を除去できないこともある。このよ
うな液滴は基板Ｗにシミ（局部的な薄膜）となって残
り、その後の製造工程中で剥離してパーティクルの原因
となったり、基板上に素子を作り込む上で弊害になった
りする。However, in any of the above-mentioned liquid removing devices, the air knives arranged in a plurality of stages blow air in the same direction on the square substrate W to be conveyed. As shown in FIG. 5, the droplets left by the first air knife 100 being pushed down to the corners of the square substrate W adhere to the two corners of the square substrate W. And the second air knife 101 oriented in the same direction as the first air knife 100 may not be able to remove the liquid droplets driven into the corners of the substrate W. Such droplets remain as stains (local thin films) on the substrate W, and peel off during the subsequent manufacturing process, causing particles, or causing a problem in forming an element on the substrate. I do.
【０００６】本発明は、このような事情に鑑みてなされ
たものであって、湿式表面処理された角型基板の表面に
付着した液滴を完全に除去できる基板の液切り乾燥装置
を提供することを目的とする。本発明の更なる目的は、
水平搬送される基板の上面に付着した液滴を完全に除去
することが可能な基板の液切り装置を提供することにあ
る。本発明の更なる目的は、水平搬送される基板の上面
に付着した液滴を完全に除去することが可能であるとと
もに、その液滴が後段の処理槽に混入することがない基
板の液切り装置を提供することにある。本発明の更なる
目的は、水平搬送される基板の上下両面に付着した液滴
を完全に除去することが可能な基板の液切り装置を提供
することにある。本発明の更なる目的は、水平搬送され
る基板の上下両面に付着した液滴を完全に除去すること
が可能であるとともに、その液滴が後段の処理槽に混入
することがない基板の液切り装置を提供することにあ
る。The present invention has been made in view of such circumstances, and provides a substrate draining / drying apparatus capable of completely removing droplets adhering to the surface of a square substrate subjected to wet surface treatment. The purpose is to: A further object of the invention is
It is an object of the present invention to provide a substrate draining device capable of completely removing droplets attached to the upper surface of a horizontally transported substrate. A further object of the present invention is to remove the liquid droplets attached to the upper surface of a horizontally transported substrate, and to remove the liquid from the substrate so that the liquid droplets do not enter the subsequent processing tank. It is to provide a device. It is a further object of the present invention to provide a substrate draining device capable of completely removing droplets attached to the upper and lower surfaces of a horizontally transported substrate. It is a further object of the present invention to provide a method for removing a liquid droplet on a substrate which can be completely removed from both upper and lower surfaces of a horizontally conveyed substrate, and which liquid droplets do not enter into a subsequent processing tank. A cutting device is provided.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記目的を達
成するために次のような構成をとる。すなわち、請求項
１に記載の発明は、湿式表面処理が施された角型の基板
の表面に気体を吹き付けて基板表面に付着している液滴
を除去して基板を乾燥させる基板の液切り乾燥装置にお
いて、基板をその表面に沿った所定の搬送方向に搬送す
る搬送手段と、前記搬送手段によって搬送される基板の
表面に向けて気体を噴射する第１のスリット状の気体噴
射口を有するとともに、前記第１のスリット状の気体噴
射口が搬送方向と直交する方向に対して傾けられた第１
の気体噴射手段と、前記第１の気体噴射手段の後方に配
置され、前記搬送手段によって搬送される基板の表面に
向けて気体を噴射する第２のスリット状の気体噴射口を
有するとともに、前記第２のスリット状の気体噴射口が
搬送方向と直交する方向に対して前記第１のスリット状
の気体噴射口とは逆方向に傾けられた第２の気体噴射手
段と、を有するものである。The present invention has the following configuration to achieve the above object. That is, according to the first aspect of the present invention, a liquid is drained from a substrate in which a gas is blown onto a surface of a rectangular substrate that has been subjected to a wet surface treatment to remove droplets adhering to the substrate surface and dry the substrate. In the drying apparatus, the drying apparatus includes a transport unit that transports the substrate in a predetermined transport direction along the surface thereof, and a first slit-shaped gas injection port that injects a gas toward the surface of the substrate transported by the transport unit. And the first slit-shaped gas injection port is inclined with respect to a direction orthogonal to the transport direction.
And a second slit-shaped gas injection port that is disposed behind the first gas injection means and injects gas toward the surface of the substrate conveyed by the conveyance means, A second slit-shaped gas injection port having second gas injection means inclined in a direction opposite to the first slit-shaped gas injection port with respect to a direction orthogonal to the transport direction. .
【０００８】また、請求項２に記載の発明は、前記搬送
手段は基板を水平に保持しつつその表面に沿った搬送方
向に搬送するとともに、前記第１及び第２の気体噴射手
段は、前記搬送手段によって水平に保持された基板の上
面に向けて気体を噴射するように構成されているもので
ある。According to a second aspect of the present invention, the transfer means transfers the substrate in a transfer direction along the surface thereof while holding the substrate horizontally, and the first and second gas injection means include It is configured to inject gas toward the upper surface of the substrate held horizontally by the transport means.
【０００９】また、請求項３に記載の発明は、前記第１
及び第２の気体噴射手段は、ともに、前記搬送手段の搬
送方向とは逆方向に向けて気体を噴射するように構成さ
れているものである。[0009] The invention according to claim 3 is the first invention.
The second gas injection means and the second gas injection means are both configured to inject gas in a direction opposite to the conveying direction of the conveying means.
【００１０】また、請求項４に記載の発明は、前記搬送
手段によって水平に保持されつつ搬送される基板の下面
に向けて気体を噴射する第３のスリット状の気体噴射口
を有するとともに、前記第３のスリット状の気体噴射口
が搬送方向と直交する方向に対して傾けられた第３の気
体噴射手段と、前記第３の気体噴射手段の後方に配置さ
れ、前記搬送手段によって水平に保持されつつ搬送され
る基板の下面に向けて気体を噴射する第４のスリット状
の気体噴射口を有するとともに、前記第４のスリット状
の気体噴射口が搬送方向と直交する方向に対して前記第
３のスリット状の気体噴射口とは逆方向に傾けられた第
４の気体噴射手段とを有するものである。The invention according to claim 4 has a third slit-shaped gas injection port for injecting gas toward the lower surface of the substrate conveyed while being held horizontally by the conveyance means, and A third gas injection means having a third slit-shaped gas injection port inclined with respect to a direction orthogonal to the conveyance direction, and disposed behind the third gas injection means and held horizontally by the conveyance means. A fourth slit-shaped gas injection port for injecting gas toward the lower surface of the substrate being conveyed while the fourth slit-shaped gas injection port is perpendicular to the conveyance direction. Fourth gas injection means inclined in the opposite direction to the slit-shaped gas injection port of No. 3.
【００１１】また、請求項５に記載の発明は、前記第３
及び第４の気体噴射手段は、ともに、前記搬送手段の搬
送方向とは逆方向に向けて気体を噴射するように構成さ
れているものである。[0011] The invention according to claim 5 is the third invention.
The fourth gas injection means and the fourth gas injection means are configured to inject gas in a direction opposite to the direction of conveyance of the conveyance means.
【００１２】[0012]
【作用】本発明の液切り装置によれば、搬送手段によっ
て基板面に沿った方向に搬送される角型基板に対して、
先ず、第１気体噴射手段の第１のスリット状の気体噴射
口により、角型基板の搬送方向と直交する方向に対して
傾斜した方向に向けて気体が噴射され、これにより、角
型基板の表面に付着していた液滴が、角型基板の角部に
押し流されながら、角型基板の角部から吹き飛ばされて
除去される。続いて、第２気体噴射手段の第２のスリッ
ト状の気体噴射口により、第１気体噴射手段と逆方向に
向けて気体が噴射され、これにより、第１気体噴射手段
で取り除けなかった角型基板の角部の液滴が、角型基板
の角部から基板端辺に沿って押し流されながら、吹き飛
ばされて除去される。従って、最終的に角型基板の表面
に付着した液滴が完全に除去される。According to the liquid draining device of the present invention, the rectangular substrate conveyed in the direction along the substrate surface by the conveying means is
First, gas is ejected from the first slit-shaped gas ejection port of the first gas ejection means in a direction inclined with respect to a direction orthogonal to the transport direction of the rectangular substrate, thereby forming the rectangular substrate. The droplets adhering to the surface are blown off from the corners of the rectangular substrate while being washed down to the corners of the rectangular substrate, and are removed. Subsequently, the gas is jetted in the opposite direction to the first gas jetting means by the second slit-shaped gas jetting port of the second gas jetting means, so that the square gas which cannot be removed by the first gas jetting means is formed. The droplets at the corners of the substrate are blown off and removed while being swept away from the corners of the square substrate along the edge of the substrate. Therefore, the droplets finally attached to the surface of the square substrate are completely removed.
【００１３】さらに請求項２記載の発明によれば、水平
搬送される基板の上面に向けて第１気体噴射手段から気
体が噴射されて基板上面に付着した液滴が吹き飛ばされ
て基板上面から取り除かれるとともに、これによって取
り除けなかった基板上面の角部に残る液滴は、第１気体
噴射手段とは傾きが異なる第２気体噴射手段から噴射さ
れる気体によって吹き飛ばされて基板上面から取り除か
れる。According to the second aspect of the present invention, the gas is ejected from the first gas ejecting means toward the upper surface of the substrate to be horizontally conveyed, and the liquid droplets attached to the upper surface of the substrate are blown off and removed from the upper surface of the substrate. At the same time, the liquid droplets remaining at the corners of the upper surface of the substrate that have not been removed by this are blown off by the gas ejected from the second gas ejecting means having a different inclination from the first gas ejecting means and removed from the upper surface of the substrate.
【００１４】さらに請求項３記載の発明によれば、第１
及び第２気体噴射手段から噴射される気体は、基板上面
において搬送方向とは逆方向に向けて気体を吹き付け
る。According to the third aspect of the present invention, the first
The gas injected from the second gas injection means blows the gas on the upper surface of the substrate in a direction opposite to the transport direction.
【００１５】請求項４記載の発明によれば、更に水平搬
送される基板の下面に向けて第３気体噴射手段から気体
が噴射されて基板下面に付着した液滴が吹き飛ばされて
基板下面から取り除かれるとともに、これによって取り
除けなかった基板下面の角部に残る液滴は、第３気体噴
射手段とは傾きが異なる第４気体噴射手段から噴射され
る気体によって吹き飛ばされて基板下面から取り除かれ
る。According to the fourth aspect of the present invention, the gas is jetted from the third gas jetting means toward the lower surface of the substrate which is further horizontally conveyed, and the droplets attached to the lower surface of the substrate are blown off and removed from the lower surface of the substrate. At the same time, the liquid droplets remaining at the corners of the lower surface of the substrate that have not been removed by this are blown off by the gas ejected from the fourth gas ejecting means having an inclination different from that of the third gas ejecting means and removed from the lower surface of the substrate.
【００１６】さらに請求項５記載の発明によれば、第３
及び第４気体噴射手段から噴射される気体は、基板下面
において搬送方向とは逆方向に向けて気体を吹き付け
る。According to the fifth aspect of the present invention, the third aspect is provided.
The gas injected from the fourth gas injection means blows the gas on the lower surface of the substrate in a direction opposite to the transport direction.
【００１７】[0017]
【実施例】以下、本発明の一実施例を図面に基づいて詳
細に説明する。図１は、本発明に係る基板の液切り乾燥
装置を備えた洗浄処理装置の一実施例の側面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a side view of one embodiment of a cleaning apparatus provided with a device for draining and drying a substrate according to the present invention.
【００１８】液切り乾燥装置は、洗浄室１に隣接配置さ
れた乾燥室２の内部に配備されており、洗浄室１におい
て純水等が吹き付けられることにより洗浄された角型基
板Ｗに付着した液滴を除去するものである。乾燥室２と
は反対側の洗浄室１の側壁に、角型基板Ｗを投入するた
めの投入口１ａが、洗浄室１と乾燥室２との間の隔壁
に、角型基板Ｗを洗浄室１から乾燥室２へ導くための導
入口２ａが、乾燥室２の出口側の側壁に、角型基板Ｗを
搬出するための搬出口２ｂがそれぞれ設けられている。
投入口１ａから投入された角型基板Ｗが導入口２ａを介
して搬出口２ｂまで搬出されるように角型基板Ｗの搬送
経路が構成されている。The draining / drying device is provided inside a drying chamber 2 disposed adjacent to the cleaning chamber 1, and adheres to the cleaned rectangular substrate W by spraying pure water or the like in the cleaning chamber 1. This is for removing droplets. On the side wall of the cleaning chamber 1 on the side opposite to the drying chamber 2, an inlet 1 a for charging the square substrate W is provided, and on the partition wall between the cleaning chamber 1 and the drying chamber 2, the rectangular substrate W is provided. An inlet 2a for guiding the substrate 1 to the drying chamber 2 is provided, and an outlet 2b for unloading the rectangular substrate W is provided on a side wall on the outlet side of the drying chamber 2.
The transport path of the rectangular substrate W is configured such that the rectangular substrate W input from the input port 1a is unloaded to the outlet 2b via the inlet 2a.
【００１９】洗浄室１は、搬送される角型基板Ｗを挟ん
で上下に対向配備された複数個の洗浄ノズル１ｂを備
え、図示しない洗浄液供給源から供給された純水等の洗
浄液を、各ノズル１ｂから搬送される角型基板Ｗの上下
両面に向けて吹き付けることにより角型基板Ｗの表面に
付着した不要物等を洗い流すように構成されている。な
お、洗浄室１の下部には、洗浄液と共に角型基板Ｗから
除去された不要物を排出するための排出口１ｃが設けら
れている。また、上記した搬送経路に沿って角型基板Ｗ
を水平に搬送する搬送機構は後述する乾燥室２と同様の
ものであり、ここでの説明は省略する。The cleaning chamber 1 is provided with a plurality of cleaning nozzles 1b vertically opposed to each other with a rectangular substrate W to be conveyed therebetween, and a cleaning liquid such as pure water supplied from a cleaning liquid supply source (not shown). By spraying onto the upper and lower surfaces of the rectangular substrate W conveyed from the nozzle 1b, unnecessary substances and the like attached to the surface of the rectangular substrate W are washed away. In the lower part of the cleaning chamber 1, a discharge port 1c for discharging unnecessary substances removed from the rectangular substrate W together with the cleaning liquid is provided. In addition, the rectangular substrate W
The transport mechanism for horizontally transporting is the same as that of the drying chamber 2 described later, and a description thereof will be omitted.
【００２０】次に、乾燥室２内部に配備された液切り乾
燥装置の構成を、図２、図３を参照して説明する。図２
は液切り乾燥装置の側面図であり、図３は液切り乾燥装
置の平面図である。Next, the configuration of the liquid drainage drying device provided inside the drying chamber 2 will be described with reference to FIGS. FIG.
FIG. 3 is a side view of the liquid drainage drying device, and FIG. 3 is a plan view of the liquid drainage drying device.
【００２１】乾燥室２内部の液切り乾燥装置３は、角型
基板Ｗを水平方向へ搬送する搬送機構１０と、搬送機構
１０により搬送される角型基板Ｗの上下両面に向けて気
体を噴射する第１気体噴射機構２０と、第１気体噴射機
構２０の後方において角型基板Ｗの上下両面に向けて気
体を噴射する第２気体噴射機構３０とから構成されてい
る。下記に各部の構成を詳細に説明する。The liquid draining / drying device 3 in the drying chamber 2 injects gas toward both the upper and lower surfaces of the rectangular substrate W transported by the transport mechanism 10 and the transport mechanism 10 for transporting the rectangular substrate W in the horizontal direction. The first gas injection mechanism 20 includes a second gas injection mechanism 30 that injects gas toward both upper and lower surfaces of the rectangular substrate W behind the first gas injection mechanism 20. The configuration of each unit will be described below in detail.
【００２２】搬送機構１０は、角型基板Ｗを載置する複
数の遊転ローラ１１と、複数の駆動ローラ１２とを搬送
方向に並列軸支して構成されている。一対の本体フレー
ム１３間に、軸受部材１４を介して駆動ローラ１２の両
端が搬送方向と直交する方向に水平で回動自在に軸支さ
れている。駆動ローラ１２の両端付近に、段差付きの一
対のローラ１２ａが対向配備されている。この一対のロ
ーラ１２ａの段差間に角型基板Ｗの端縁が載置される。
また、駆動ローラ１２の中央部にローラ１２ｂが設けら
れ、このローラ１２ｂで角型基板Ｗの下面中央部を支持
することにより、基板Ｗが垂れ下がらないようにしてい
る。各駆動ローラ１２は、図示しないチェーン等を介し
てモータに連動連結されており、洗浄室１で洗浄された
角型基板Ｗを水平姿勢で搬送し、搬出口２ｂから搬出す
るように構成されている。各駆動ローラ１２の上方に
は、角型基板Ｗの下面を駆動ローラ１２上に押圧するピ
ンチローラ１５が回転自在に配備されている。このピン
チローラ１５と駆動ローラ１２との間で角型基板Ｗを挟
持しながら、角型基板Ｗをスリップなく強制搬送するよ
うに構成されている。The transport mechanism 10 comprises a plurality of idler rollers 11 on which a rectangular substrate W is placed and a plurality of drive rollers 12 supported in parallel in the transport direction. Both ends of the drive roller 12 are supported by a pair of body frames 13 via a bearing member 14 so as to be horizontally and rotatably rotatable in a direction perpendicular to the transport direction. Near the opposite ends of the drive roller 12, a pair of stepped rollers 12a are provided to face each other. The edge of the rectangular substrate W is placed between the steps of the pair of rollers 12a.
A roller 12b is provided at the center of the drive roller 12, and the center of the lower surface of the rectangular substrate W is supported by the roller 12b to prevent the substrate W from hanging down. Each drive roller 12 is linked to a motor via a chain or the like (not shown), and is configured to transport the rectangular substrate W cleaned in the cleaning chamber 1 in a horizontal posture and to carry it out of the outlet 2b. I have. Above each drive roller 12, a pinch roller 15 for pressing the lower surface of the rectangular substrate W onto the drive roller 12 is rotatably provided. The rectangular substrate W is forcibly conveyed without slipping while holding the rectangular substrate W between the pinch roller 15 and the driving roller 12.
【００２３】第１気体噴射機構２０は、搬送される角型
基板Ｗを挟んで上方と下方に、対向配備された一対のエ
アーナイフ２１を備えている。上下の各エアーナイフ２
１は、その先端が先細り状に形成された板部材を互いに
向かい合うように重ね合わせて一体に構成されたもので
あり、その先端にスリット状に形成された噴射口２１ａ
を備え、図示しない気体供給源から供給された高圧空気
を帯状にした気流（エアー）を噴き出すものである。エ
アーナイフ２１の噴射口２１ａは、搬送方向と直交する
方向の角型基板Ｗの幅よりも長めに形成され、角型基板
Ｗの全面にわたって気体を均一に噴き出すようになって
いる。The first gas ejecting mechanism 20 has a pair of air knives 21 disposed oppositely above and below the rectangular substrate W to be conveyed. Upper and lower air knives 2
Numeral 1 is a plate member whose tip is tapered and is integrally formed by superimposing them so as to face each other, and has a slit-like injection port 21a at its tip.
And blows out a band-shaped air flow (air) of high-pressure air supplied from a gas supply source (not shown). The injection port 21a of the air knife 21 is formed to be longer than the width of the rectangular substrate W in a direction orthogonal to the transport direction, so that gas is uniformly injected over the entire surface of the rectangular substrate W.
【００２４】上下の各エアーナイフ２１は、角型基板Ｗ
に対してそれぞれ傾斜して配備されている。具体的に説
明すると、エアーナイフ２１は、図２に示すように、噴
射口２１ａからの噴射方向が、角型基板Ｗの搬送方向と
は逆方向に向かうように、すなわち、角型基板Ｗの搬送
方向に対して、θ1 ＝約６０°の角度をなすように配備
されている。従って、噴射口２１ａから噴射される高圧
気流によって、角型基板Ｗの上下両面に付着した液滴
が、角型基板Ｗの搬送方向とは逆方向に吹き飛ばされる
ようになっている。なお、吹き飛ばされた液滴は、乾燥
室２の下部に設けられた排出口２ｃから排出される。Each of the upper and lower air knives 21 is
, Respectively. More specifically, as shown in FIG. 2, the air knife 21 causes the ejection direction from the ejection port 21a to be in the opposite direction to the transport direction of the square substrate W, that is, It is arranged so as to form an angle of θ 1 = about 60 ° with respect to the transport direction. Accordingly, the liquid droplets attached to the upper and lower surfaces of the rectangular substrate W are blown off in a direction opposite to the transport direction of the rectangular substrate W by the high-pressure airflow injected from the injection port 21a. The blown droplets are discharged from a discharge port 2c provided at a lower part of the drying chamber 2.
【００２５】また、上記した上下の各エアーナイフ２１
は、水平面内において搬送方向と直交する方向に対して
傾きをもった状態で、一対の取付部材２２を介して本体
フレーム１３間に架設されている。具体的に説明する
と、エアーナイフ２１は、図３に示すように、角型基板
Ｗの搬送方向と垂直な方向に対して、θ2 ＝約７°の角
度をなすように配備されている。従って、噴射口２１ａ
から噴射される高圧気流によって、角型基板Ｗの上下両
面に付着した液滴が、角型基板Ｗの搬送方向とは逆方向
の角部へ押し流されながら角部から吹き飛ばされるよう
になっている。なお、本実施例では、装置の搬送方向の
全長を抑えるために、傾き角θ2 を約７°にしている
が、本発明はこれに限定されるものではなく、液滴を角
型基板Ｗの角部に押し流すという点では傾き角θ2 は、
４５°が好ましい。The upper and lower air knives 21
Is mounted between the main body frames 13 via a pair of mounting members 22 in a state of being inclined with respect to a direction orthogonal to the transport direction in the horizontal plane. More specifically, as shown in FIG. 3, the air knife 21 is arranged so as to form an angle of about 2 ° with respect to a direction perpendicular to the direction in which the rectangular substrate W is conveyed. Therefore, the injection port 21a
The droplets attached to the upper and lower surfaces of the rectangular substrate W are blown off from the corners while being pushed down to the corners in a direction opposite to the transport direction of the rectangular substrate W by the high-pressure airflow ejected from the substrate. . In the present embodiment, the inclination angle θ 2 is set to about 7 ° in order to suppress the total length of the apparatus in the transport direction. However, the present invention is not limited to this. the inclination angle θ 2 is in that sweep away in the corners,
45 ° is preferred.
【００２６】第２気体噴射機構３０は、上記した第１気
体噴射機構２０のエアーナイフ２１と同様のエアーナイ
フ３１を備え、第１気体噴射機構２０で吹き飛ばされず
に角型基板Ｗの角部に残った液滴を除去するものであ
る。The second gas injection mechanism 30 includes an air knife 31 similar to the air knife 21 of the first gas injection mechanism 20 described above. This is to remove the remaining droplets.
【００２７】また、第２気体噴射機構３０の上下の各エ
アーナイフ３１は、水平面内において第１気体噴射機構
２０のエアーナイフ２１と逆方向に傾きをもった状態で
配備されている。具体的に説明すると、エアーナイフ３
１は、図３に示すように、傾き角θ2 と逆方向のθ3 ＝
約７°の角度をなすように配備されている。なお、傾き
角θ3 を約７°にしているが、これに限定されるもので
はなく、傾き角θ2 と逆方向に傾ければよく、エアーナ
イフ２１と同様に液滴を角型基板Ｗの角部に押し流すと
いう点では傾き角θ3 は、４５°が好ましい。The upper and lower air knives 31 of the second gas injection mechanism 30 are arranged in a horizontal plane so as to be inclined in the direction opposite to the air knife 21 of the first gas injection mechanism 20. Specifically, the air knife 3
1 is, as shown in FIG. 3, θ 3 = in the opposite direction to the tilt angle θ 2 =
It is arranged at an angle of about 7 °. Although the inclination angle θ 3 is set to about 7 °, the present invention is not limited to this. The inclination may be reversed in the direction opposite to the inclination angle θ 2. The angle of inclination θ 3 is preferably 45 ° from the viewpoint of flushing to the corners.
【００２８】次に、上記にように構成された液切り乾燥
装置により、角型基板Ｗに付着した液滴が除去されるま
での状態を、図４を参照して説明する。図４は、液滴が
除去される状態を示した図である。Next, a state until the liquid droplets adhering to the rectangular substrate W are removed by the liquid draining / drying apparatus configured as described above will be described with reference to FIG. FIG. 4 is a diagram showing a state where the droplet is removed.
【００２９】図４に示すように、第１気体噴射機構２０
により、角型基板Ｗの上下両面の全面にわたって付着し
ていた液滴は、角型基板Ｗの角部に押し流されながら、
角型基板Ｗから吹き飛ばされる。As shown in FIG. 4, the first gas injection mechanism 20
Thus, the liquid droplets adhered over the entire upper and lower surfaces of the rectangular substrate W are flushed to the corners of the rectangular substrate W,
It is blown off from the square substrate W.
【００３０】第１気体噴射機構２０で吹き飛ばされずに
角型基板Ｗの角部に残った液滴は、第２気体噴射機構３
０により、角型基板Ｗの角部から基板Ｗの端辺に沿って
押し流される。その結果、液滴と角型基板Ｗとの付着力
が弱くなり、最終的に角型基板Ｗから吹き飛ばされる。The droplets which are not blown off by the first gas ejecting mechanism 20 and remain at the corners of the rectangular substrate W are
Due to 0, it is swept away from the corner of the rectangular substrate W along the edge of the substrate W. As a result, the adhesive force between the droplet and the square substrate W is weakened, and the droplet is finally blown off from the square substrate W.
【００３１】なお、上記実施例では、水平に保持されて
搬送される基板の上面及び下面にそれぞれ２段のエアー
ナイフを互いに搬送方向に対して逆方向となるように配
置していたが、本発明はこれに限定されるものではな
い。たとえば、基板の上面側にのみ２段のエアーナイフ
を互いに逆方向に配置して、基板の下面側は１段のエア
ーナイフのみでも良いし、また基板の下面側には互いに
平行な２段のエアーナイフを配置しても良い。さらに、
第２気体噴射機構の後段にこれとは逆方向に傾けられた
第３気体噴射機構を設けて更に液切りが完全に行われる
ように構成しても良い。In the above embodiment, two-stage air knives are arranged on the upper surface and the lower surface of the substrate which is held and transferred horizontally, respectively, so that they are opposite to each other in the transfer direction. The invention is not limited to this. For example, two stages of air knives may be arranged in opposite directions only on the upper surface side of the substrate, and only one air knife may be arranged on the lower surface side of the substrate, or two parallel air knives may be arranged on the lower surface side of the substrate. An air knife may be arranged. further,
A third gas injection mechanism inclined in a direction opposite to the third gas injection mechanism may be provided at a subsequent stage of the second gas injection mechanism so that liquid drainage is completely performed.
【００３２】また、上記実施例では、図３図示のよう
に、基板の上面側に配置されるエアーナイフ２１とその
後段に配置されるエアーナイフ３１とは、搬送方向に直
交する直線に対して互いに対称となるように傾きが決定
されていたが、本発明はこれに限定されず、両エアーナ
イフ及び基板下面側に配置された２つのエアーナイフは
互いに対称に配置されなくとも良い。ただし、両エアー
ナイフを互いに対称に配置するとともに、基板上面側と
下面側とでその傾き角（θ2 ）を互いに同一にすること
により装置の全長をコンパクトにして良好な液切り効果
を得ることができる。In the above embodiment, as shown in FIG. 3, the air knife 21 disposed on the upper surface side of the substrate and the air knife 31 disposed on the subsequent stage are positioned with respect to a straight line orthogonal to the transport direction. Although the inclination is determined so as to be symmetrical to each other, the present invention is not limited to this, and the two air knives and the two air knives arranged on the lower surface side of the substrate may not be arranged symmetrically to each other. However, by arranging both air knives symmetrically and making the inclination angle (θ 2 ) the same on the upper surface side and the lower surface side of the substrate, the overall length of the apparatus can be made compact and a good liquid draining effect can be obtained. Can be.
【００３３】また、実施例では基板Ｗを水平搬送する洗
浄装置を例に採って説明したが、本発明はこれに限定さ
れず、例えば、洗浄装置と液切り乾燥装置とを上下に配
置し、下段の洗浄装置から上段の液切り乾燥装置へ基板
を垂直姿勢で搬送するように構成し、垂直に引き上げら
れる基板の表裏両面にそれぞれ図示実施例のごときエア
ーナイフ２１，３１を配置してもよい。Further, in the embodiment, the explanation has been made by taking as an example the cleaning device for horizontally transporting the substrate W. However, the present invention is not limited to this, and for example, the cleaning device and the draining / drying device are arranged vertically. The substrate may be transported in a vertical position from the lower cleaning device to the upper draining / drying device, and air knives 21 and 31 as in the illustrated embodiment may be arranged on both front and back surfaces of the vertically pulled substrate. .
【００３４】[0034]
【発明の効果】以上の説明から明らかなように、本発明
によれば、互いに逆方向に傾斜配置されたエアーナイフ
を備えた第１、第２気体噴射手段により、角型基板に付
着した液滴が完全に除去されるので、液滴残りによるシ
ミが発生することがなく、パーティクルの発生や素子形
成上の弊害を未然に抑制することができ、製品の歩留ま
りを向上させることができる。As is apparent from the above description, according to the present invention, the liquid adhering to the rectangular substrate is provided by the first and second gas ejecting means having the air knives inclined in opposite directions. Since the droplets are completely removed, there is no occurrence of spots due to remaining droplets, generation of particles and adverse effects on element formation can be suppressed, and product yield can be improved.
【００３５】更に、請求項２記載の発明によれば、水平
搬送される基板の上面に付着した液滴を完全に除去する
ことができ、請求項３記載の発明によれば基板上面に付
着した液滴は搬送方向とは逆方向に向けて吹き飛ばされ
るので、この液滴が後段の処理槽に混入することがな
い。Further, according to the second aspect of the present invention, it is possible to completely remove the liquid droplets adhered to the upper surface of the horizontally conveyed substrate, and according to the third aspect of the present invention, adhere to the upper surface of the substrate. Since the droplets are blown off in a direction opposite to the transport direction, the droplets do not enter the subsequent processing tank.
【００３６】請求項４記載の発明によれば、更に水平搬
送される基板の下面に付着した液滴をも完全に除去する
ことができ、請求項５記載の発明によれば基板下面に付
着した液滴は搬送方向とは逆方向に向けて吹き飛ばされ
るので、この液滴が後段の処理槽に混入することがな
い。According to the fourth aspect of the present invention, it is possible to completely remove the liquid droplets adhered to the lower surface of the substrate which is further horizontally conveyed. Since the droplets are blown off in a direction opposite to the transport direction, the droplets do not enter the subsequent processing tank.
【図１】本発明に係る基板の液切り乾燥装置を備えた洗
浄処理装置の一実施例の側面図である。FIG. 1 is a side view of an embodiment of a cleaning apparatus provided with a device for draining and drying a substrate according to the present invention.
【図２】液切り乾燥装置の側面図である。FIG. 2 is a side view of the liquid drainage drying device.
【図３】液切り乾燥装置の平面図である。FIG. 3 is a plan view of the liquid drainage drying device.
【図４】液切りの状態を示した図である。FIG. 4 is a diagram showing a state of drainage.
【図５】従来装置の液切りの状態を示した図である。FIG. 5 is a view showing a state of drainage of the conventional device.
１ … 洗浄室 ２ … 乾燥室 １０ … 搬送機構 ２０ … 第１気体噴射機構 ２１，３１ … エアーナイフ ２１ａ … 噴射口 ３０ … 第２気体噴射機構 Ｗ … 角型基板 DESCRIPTION OF SYMBOLS 1 ... Cleaning room 2 ... Drying room 10 ... Transport mechanism 20 ... 1st gas injection mechanism 21, 31 ... Air knife 21a ... Injection port 30 ... 2nd gas injection mechanism W ... Square substrate
Claims (5)
面に気体を吹き付けて基板表面に付着している液滴を除
去して基板を乾燥させる基板の液切り乾燥装置におい
て、 基板をその表面に沿った所定の搬送方向に搬送する搬送
手段と、 前記搬送手段によって搬送される基板の表面に向けて気
体を噴射する第１のスリット状の気体噴射口を有すると
ともに、前記第１のスリット状の気体噴射口が搬送方向
と直交する方向に対して傾けられた第１の気体噴射手段
と、 前記第１の気体噴射手段の後方に配置され、前記搬送手
段によって搬送される基板の表面に向けて気体を噴射す
る第２のスリット状の気体噴射口を有するとともに、前
記第２のスリット状の気体噴射口が搬送方向と直交する
方向に対して前記第１のスリット状の気体噴射口とは逆
方向に傾けられた第２の気体噴射手段と、 を有することを特徴とする基板の液切り乾燥装置。1. A substrate drip-drying device that blows a gas onto a surface of a rectangular substrate that has been subjected to a wet surface treatment to remove droplets adhering to the substrate surface and dries the substrate. Transport means for transporting the substrate in a predetermined transport direction along the surface thereof, and a first slit-shaped gas injection port for injecting gas toward the surface of the substrate transported by the transport means, and A first gas injection unit in which a slit-shaped gas injection port is inclined with respect to a direction orthogonal to the transfer direction; and a surface of a substrate that is disposed behind the first gas injection unit and is transferred by the transfer unit. Having a second slit-shaped gas injection port for injecting gas toward the first slit-shaped gas injection port with respect to a direction in which the second slit-shaped gas injection port is orthogonal to the transport direction. Opposite to And a second gas injection unit inclined in the direction.
その表面に沿った搬送方向に搬送するとともに、前記第
１及び第２の気体噴射手段は、前記搬送手段によって水
平に保持された基板の上面に向けて気体を噴射するよう
に構成されている請求項１記載の基板の液切り乾燥装
置。2. The transporting means transports the substrate in a transport direction along the surface thereof while holding the substrate horizontally, and the first and second gas ejecting means comprises a substrate held horizontally by the transporting means. The apparatus for draining and drying a substrate according to claim 1, wherein the apparatus is configured to inject gas toward an upper surface of the substrate.
もに、前記搬送手段の搬送方向とは逆方向に向けて気体
を噴射するように構成されていることを特徴とする請求
項１記載の基板の液切り乾燥装置。3. The apparatus according to claim 1, wherein both the first and second gas injection means are configured to inject gas in a direction opposite to a conveying direction of the conveying means. A device for draining and drying a substrate according to the above.
つ搬送される基板の下面に向けて気体を噴射する第３の
スリット状の気体噴射口を有するとともに、前記第３の
スリット状の気体噴射口が搬送方向と直交する方向に対
して傾けられた第３の気体噴射手段と、前記第３の気体
噴射手段の後方に配置され、前記搬送手段によって水平
に保持されつつ搬送される基板の下面に向けて気体を噴
射する第４のスリット状の気体噴射口を有するととも
に、前記第４のスリット状の気体噴射口が搬送方向と直
交する方向に対して前記第３のスリット状の気体噴射口
とは逆方向に傾けられた第４の気体噴射手段とを有する
ことを特徴とする請求項２記載の基板の液切り乾燥装
置。4. A gas discharge port having a third slit-shaped gas injection port for injecting a gas toward a lower surface of a substrate which is conveyed while being held horizontally by said conveyance means, and wherein said third slit-shaped gas injection port is provided. A third gas ejecting means inclined with respect to a direction perpendicular to the carrying direction, and a third gas ejecting means disposed behind the third gas ejecting means, and provided on the lower surface of the substrate which is transported while being held horizontally by the transporting means. A fourth slit-shaped gas injection port for injecting gas toward the third slit-shaped gas injection port with respect to a direction perpendicular to the transport direction, and 3. The apparatus for draining and drying a substrate according to claim 2, further comprising a fourth gas injection means inclined in the opposite direction.
もに、前記搬送手段の搬送方向とは逆方向に向けて気体
を噴射するように構成されていることを特徴とする請求
項４記載の基板の液切り乾燥装置。5. The apparatus according to claim 4, wherein each of the third and fourth gas injection means is configured to inject gas in a direction opposite to a transfer direction of the transfer means. A device for draining and drying a substrate according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117620A JP2988828B2 (en) | 1994-05-06 | 1994-05-06 | Substrate drainer / dryer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117620A JP2988828B2 (en) | 1994-05-06 | 1994-05-06 | Substrate drainer / dryer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07302779A JPH07302779A (en) | 1995-11-14 |
| JP2988828B2 true JP2988828B2 (en) | 1999-12-13 |
Family
ID=14716266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6117620A Expired - Lifetime JP2988828B2 (en) | 1994-05-06 | 1994-05-06 | Substrate drainer / dryer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2988828B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08338686A (en) * | 1995-06-14 | 1996-12-24 | Nec Corp | Board drying method and device thereof |
| JP3887570B2 (en) * | 2002-02-18 | 2007-02-28 | 協和化工株式会社 | High speed dryer |
| JP4543794B2 (en) * | 2004-07-09 | 2010-09-15 | 国立大学法人東北大学 | Flat member conveying device |
| JP2010131485A (en) * | 2008-12-03 | 2010-06-17 | Dainippon Screen Mfg Co Ltd | Device and method for draining liquid on substrate |
-
1994
- 1994-05-06 JP JP6117620A patent/JP2988828B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07302779A (en) | 1995-11-14 |
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