KR20060136336A - Substrate processing apparatus - Google Patents

Abstract

The present invention efficiently and flexibly performs the operation of fractionally recovering the first processing liquid supplied to the substrate to be processed on a flat stream conveying line and replacing the second processing liquid with the second processing liquid. Due to the flexibility, a protruding substrate raised portion Ga, which is imitated on the raised portion 120a of the transfer line 120, is formed in a part of the entire length of the substrate, while the substrate raised portion Ga is formed at the same speed as the conveying speed. It passes through the ridge 120a from the front end to the rear end, moving relatively in the direction opposite to the conveying direction. In the upward ramp M2, the developer R flows on the substrate G to the rear of the substrate by gravity, and from the front end to the rear end of the substrate G, the liquid film of the developer R is almost at the same conveyance speed. To the state of the thin film R '. When the substrate G moves to the downward slope M₃, the rinse liquid S is supplied from the upper rinse nozzle 138 to the strip-shaped discharge flow and near the line where the rinse liquid S on the substrate G lands. In the thin film developer state, R 'is replaced with the rinse solution S to provide a technique in which development is completely stopped.

Description

Substrate Processing Equipment {SUBSTRATE PROCESSING APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the structure of the application | coating development process system applicable of this invention.

It is a side view which shows the structure of the thermal processing part in the said coating and developing process system.

3 is a flowchart showing a processing procedure in the coating and developing processing system.

4 is a front view showing the overall configuration of the developing unit in the embodiment.

5 is a plan view illustrating a configuration of a conveying line in the embodiment.

It is a side view which shows the structure of the drive part of the conveyance line in embodiment.

It is a figure which shows the effect | action of one Example at the time of liquid dripping from the board | substrate in the conveyance line of embodiment.

FIG. 8 is a diagram showing one example for facilitating dripping of liquid from a substrate on the embodiment. FIG.

It is a perspective view which shows one Example applicable to the upward slope of a conveyance line in embodiment.

It is a perspective view which shows one Example applicable to the upward slope of a conveyance line in embodiment.

It is a perspective view which shows one Example applicable to the upward slope of a conveyance line in embodiment.

It is a figure which shows the effect | action of the liquid process performed in the vicinity of the ridge | bulb part of a conveyance line in embodiment.

It is a figure which shows the effect | action of the liquid process-drying process performed in the vicinity of the upward step part of a conveyance line in embodiment.

It is a front view which shows the whole structure in the washing process part in embodiment.

FIG. 15 is a partial side view illustrating one operation of the downward stepped portion in the embodiment of FIG. 14.

FIG. 16 is a plan view illustrating one operation of the downward stepped portions in the embodiment of FIG. 14. FIG.

It is a partial side view which shows one effect | action of the downward step part in embodiment of FIG.

** Description of reference numerals indicating major parts **

10 coating and developing treatment system

24 Cleaning Process Section

32 development process part

41 UV irradiation unit (e-UV)

42 Scrubber Cleaning Unit (SCR)

94 Development Unit (DEV)

120 conveying lines

120a · 120b upward step

120c step

122 Development Department

124 Rinse

126 Drying Unit

128 rotor

130 Developer nozzle (developing nozzle)

136 Developer reuse tool

138; 140; 142 Rinse solution supply nozzle (rinse nozzle)

145 Rinse solution supply nozzle (rinse nozzle)

148 roll brush

152; 154 simple wall

182 timing belt

186 gas nozzle

188 Band Shaped Endless Belt

190 rollers

192 roll brush

200 bounce lines

200a; 200b ridge

200c lift step

200d downward step

224 Fan Filter Unit

226 air curtain nozzle

228 chemical supply nozzle

230 roll brush

232 pro cleaning nozzle

234 Air Knife Airflow Jet Nozzle

236 Rinse solution supply nozzle (rinse nozzle)

238 roll brush

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for supplying a processing liquid onto a substrate to be treated and performing a predetermined treatment, in particular, a substrate processing apparatus for performing liquid processing while conveying a substrate in a horizontal direction in a horizontal flow mode.

Recently, in a resist coating and developing system in LCD (liquid crystal display display) manufacturing, a substrate is formed on a conveying path in which a rotor is placed in a horizontal direction as a developing method that can cope with glass in increasing the size of an LCD substrate (for example, a glass substrate). The so-called flat flow system which carries out a series of image development processing processes, such as image development rinse drying, is popular during conveyance, conveying. Compared to the spin for rotating the substrate, this drift system has advantages such as easy handling of a large substrate and less generation of mist or reattachment to the substrate.

The conventional developing apparatus employing the flat flow method is a substrate inclination mechanism for tilting a substrate in a conveying direction on a downstream side of a developing solution supply section in a flat flow conveying path, for example, as disclosed in Patent Document 1 in order to increase the recovery rate of the developer. And the developer is activated on the horizontal substrate in the developer supplying section, and the substrate is transported as it is in a flat stream downstream to the conveying path. After a predetermined time, the substrate tilting mechanism inclines the substrate in the front or rear direction at a predetermined position on the conveying path. The developing solution of the phase is dropped by gravity to collect the developing solution under the pan for collecting the developer. When the substrate tilting mechanism finishes the liquid separation in the tilted position as described above within a predetermined time and returns the substrate to the horizontal position, the substrate is then sent to the downstream rinse part in a flat flow where the rinse nozzle is placed on the horizontal position of the substrate. By rinsing the rinse liquid, substitution (development stop) from the developer to the rinse liquid is performed on the substrate. The liquid separated from the substrate in this rinse portion is collected in a pan for rinse liquid recovery. And while the rinse-processed board | substrate passes through the downstream drying part in the counter current, the surface of the board | substrate is dried by making an air knife pressurize high-pressure airflow in the reverse direction to a conveyance direction to the board | substrate of a horizontal posture.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-7582

However, in the conventional developing apparatus as described above, the developer is stopped by the active substrate on the conveying path, the posture is changed from the horizontal state to the inclined state, and the liquid separation is performed in the inclined position, and then returned to the horizontal position to resume the conveyance of the flat stream. There was one aspect that said a mechanism and a series of operations were quite troublesome and inefficient. Furthermore, the surface to be processed is dried from the front end side of the substrate before the rinsing process because the time delay from the start of the liquid separation of the developer to the start of the liquid replacement, that is, the rinsing process for stopping the development, is long. The deterioration of the developing quality such that stains are generated is also feared.

Moreover, it was difficult to ensure in-plane uniformity on a board | substrate also regarding developing time. In other words, when the active substrate is changed from the horizontal position to the inclined position at the stop position, the parts of the substrate have different movement speeds, ranges of motion (especially height positions), and so on. It was impossible to carry out liquid separation, and as a result, there was a problem that the time from the supply of the developing solution to the stop of developing, that is, the developing time, was scattered at each part of the substrate (particularly between the front end and the rear end of the substrate).

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and efficiently and flexibly performs an operation of fractionally recovering a first processing liquid supplied to a substrate to be processed on a flat stream conveying line and moving it to a second processing liquid. An object of the present invention is to provide a substrate processing apparatus capable of being made.

It is another object of the present invention to efficiently and uniformly perform an operation in which the first treatment liquid supplied to the substrate to be processed on the flat stream conveying line is separated and replaced with the second treatment liquid after a predetermined treatment time has elapsed. The present invention provides a substrate processing apparatus.

Another object of the present invention is to provide a substrate processing apparatus which simultaneously realizes an improvement in continuity and yield between each processing and prevention of mutual interference, while sequentially carrying out a series of processing on the substrate while conveying the substrate to be processed on the conveying line of the flat stream. It is to offer.

In order to achieve the above object, the substrate processing apparatus of the present invention is formed by placing a carrier for conveying a substrate to be processed in an upward attitude toward the surface to be processed in a predetermined horizontal conveyance direction and substantially in the conveying direction. A first conveying section having a horizontal conveying path; A second conveying section having a conveying path of an inclined slope following the first conveying section; A third conveying section having a conveying path of a downward slope following the second conveying section; A conveying line of a flat stream including a fourth conveying section having a substantially horizontal conveying path following the third conveying section; a conveying drive unit which drives the conveying body to convey the substrate on the conveying line; A first processing liquid supply unit for supplying a first processing liquid onto the substrate in a first or second conveying section; It has a 2nd process liquid supply part which supplies a 2nd process liquid on a said board | substrate in a said 3rd conveyance section.

In the above apparatus configuration, the raised portions which are higher than the first and fourth conveyance sections are formed in the second and third conveyance sections. When the board | substrate climbs the upward incline (2nd conveyance section) of this ridge, the 1st process liquid on a board | substrate moves under gravity, and it flows down from a board | substrate rear end. At this time, on the board | substrate, liquid separation of a 1st process liquid is performed from the front end side of a board | substrate to the back end side at the movement speed roughly the same as conveyance speed. In this way, the board | substrate which crossed the upward ramp of the ridge part enters a downward ramp (third conveyance section) in the state in which the 1st process liquid remains a very thin film on the upper surface. Here, the second processing liquid supply unit supplies the second processing liquid to the substrate which descends the downward slope so that the first processing liquid that remains thin in each part of the substrate is the gravity and the flow of the first processing liquid. Under pressure, it flows forward and out from the substrate front. In this way, on the board | substrate, the 1st process liquid is substituted by the 2nd process liquid from the front end side of a board | substrate to the rear end side at the speed | rate similar to conveyance speed.

According to one very suitable aspect of the present invention, the second conveying section is set to a length shorter than the size of the substrate in the conveying direction, and more preferably, the section in which the second conveying section and the third conveying section are added to each other It is set to a length shorter than the size of the substrate. In this case, the substrate is formed by the flexibility to form a projection-like substrate ridge in a part of the entire length, and the substrate ridge is relatively moved in the opposite direction from the front end to the rear end of the substrate at the same speed as the conveyance speed. While passing through the ridges (second and third conveying sections) of the conveying line.

In the present invention, it is preferable to change the course by drawing a proper radius of curvature in the vicinity of the flat line conveying line rather than performing a course change such as bending at a sharp angle at the boundary point of each conveying section. The structure which is flat, ie, the structure in which a substantially horizontal conveyance path is formed between the end part of a 2nd conveyance section and the start end part of a 3rd conveyance section, is also possible.

Moreover, according to one kind of this invention, the board | substrate suppression part for restraining the site | part of the board | substrate which falls upward from the conveyance path of a conveyance line in a 2nd conveyance section at a predetermined height position is provided. This board | substrate suppression part should preferably have a pair of rotatable rollers which contact | connect both the left and right peripheral parts of a board | substrate. When the substrate crosses the upward slope in the second conveyance section, even if the rear end portion of the substrate falls upward from the conveying path of the conveying line, the liquid separation on the substrate can be maintained after the light posture is maintained near the top while being regulated by the height of the substrate suppressor. Can be carried out smoothly to the end (after board).

Moreover, as a preferable kind, the 1st air knife which blows gas on a board | substrate at the predetermined position in the 2nd conveyance section downstream of a 1st process liquid supply part is provided. The liquid separation of the first processing liquid on the substrate can be assisted or promoted by fitting the gas flow onto the substrate with the first air knife when the substrate climbs the upward slope in the second conveyance section.

It is also preferable to provide a liquid separation trigger for triggering the flow of the first processing liquid from the rear end of the substrate at a predetermined position in the first or second conveying section on the downstream side in the first processing liquid supply unit. As a very suitable type, the liquid separation triggering portion may be constituted by a cylindrical or cylindrical rotor having a constant outer diameter arranged as a carrier on the transport path. Alternatively, as another very suitable type, the liquid separation triggering portion may be constituted by a gas nozzle that directs the gas flow in the reverse direction to the conveyance direction from above on the rear end of the substrate.

According to one very suitable aspect of the present invention, the first processing liquid supply unit has a processing liquid supply nozzle for discharging the first processing liquid toward the substrate at a predetermined position in the first conveying section, and the conveyance driving unit has the first and the first processing liquids. The substrate is conveyed at a constant speed through the conveyance section of 2. In this case, in the second and third conveying sections on the downstream side, the first processing liquid is moved from the front end to the rear end of the substrate at the same scanning speed as when the first processing liquid is supplied on the substrate in the first conveying section. Substitute the second treatment liquid without separating the liquid.

According to one very suitable type, the first collecting part for collecting the liquid dropped below the conveying path in the first and the second conveying section and the liquid collecting part for collecting the liquid falling under the conveying path in the third and fourth conveying sections. The second liquid collecting part is provided. In the related structure, most of the 1st processing liquid supplied on the board | substrate from the 1st processing liquid supply part can be collect | recovered fractionally by the 1st collection part. The second processing liquid is recovered mainly in the second collecting part.

According to one very suitable type, a first simple wall is provided near the boundary between the second conveying section and the third conveying section to separate the space around the conveying line to the upstream side and the downstream side. The first simple wall is provided with a passage for passing the conveying line.

According to a very suitable type, the conveying line has a fifth conveying section having a rising slope conveying path following the fourth conveying section and a sixth conveying section having a substantially horizontal conveying path following the fifth conveying section. It includes. In the related configuration, an upward step portion is formed from the fourth conveyance section to the sixth conveyance section. It is preferable that this upward step part or 5th conveyance section is set to length shorter than the size of a board | substrate. As a result, the substrate uses the flexibility to form a line-shaped substrate stepped part imitating the stepped part on a part of the entire length of the substrate, and at the same speed as the conveying speed, the substrate stepped part is opposite to the conveying direction from the front end to the rear end of the substrate. It passes through the upward step part (5th conveyance section) of a conveyance line, moving relatively in a direction. In this upward step (fifth conveying section), the second processing liquid remaining on the substrate moves from the front end side of the substrate to the rear side by gravity and flows down from the rear end of the substrate.

According to one very suitable type, a second blower which blows gas on the substrate in the opposite direction to the conveying direction in order to assist the liquid separation of the liquid (the second processing liquid) from the substrate within the fifth or sixth conveying section. An air knife is installed.

According to one kind that is very suitable, a second simple wall is provided near the boundary between the fifth conveyance section and the sixth conveyance section to separate the space around the conveying line to the upstream side and the downstream side. A passage for passing the transfer line is also formed in this second simple wall.

According to one very suitable type, the seventh conveying section having a substantially horizontal conveying path at a position higher than the first conveying section on the upstream side of the first conveying section, and the seventh conveying section and the first conveying section The eighth conveyance section which has a conveyance path of a downward inclination between conveyance sections of is included. In the related configuration, a downward stepped portion is formed from the seventh conveying section to the first conveying section. The downward stepped portion may have a function of stopping the first processing liquid supplied on the substrate from passing on the substrate to the other unit or processing portion near the upstream side. This upward stepped portion, that is, the eighth conveying section, may be set to a length shorter than the size of the substrate. In addition, a third simple wall may be provided near the boundary between the eighth conveyance section and the first conveyance section to separate the space around the conveyance line upstream and downstream.

In addition, in this invention, the board | substrate taken on a conveyance line includes the attitude | position which inclines not only a horizontal attitude | position or the inclination attitude | position in a conveyance direction, but in arbitrary directions (for example, the left-right horizontal direction).

1 shows a coating and developing treatment system as one structural example to which the substrate processing apparatus of the present invention can be applied. This coating and developing processing system 10 is installed in a clean room, for example, using a glass substrate for LCD as a substrate to be treated, and a cleaning resist in a port lithography process in the LCD manufacturing process; coating prebaking, post-baking, and the like. To carry out the treatment. An exposure process is performed by the external exposure apparatus 12 provided adjacent to this system.

The coating and developing processing system 10 arranges the horizontally processed process stations (P / S, 16) at the center, and has the cassette station (C / S, 14) and the interface station (I /) at both ends thereof in the long direction (X direction). F, 18) is arranged.

The cassette station C / S 14 is a cassette entry / exit port of the system 10 and allows the substrate G to be stacked in multiple stages so that four or more cassettes C can be accommodated in one horizontal direction (Y direction). The cassette stage 20 which can be arrange | positioned up to two pieces, and the conveyance mechanism 22 which carries out the board | substrate G with respect to the cassette C on this stage 20 are provided. The conveying mechanism 22 has a means capable of holding the substrate G, for example, a conveying arm 22a, which is operable in four axes of X Y Y Z θ and adjacent to the process station P / S, 16) side and the board | substrate G can be carried out.

The process station P / S, 16 arrange | positions each process part in process flow or process order in a pair of parallel line | wire A and B which extends in the horizontal system longitudinal direction (X direction). More specifically, the process line A of the upstream portion from the cassette station C / S 14 to the interface station I / F 18 is provided with a cleaning process part 24 and a first thermal processing part 26; The application | coating process part 28 and the 2nd thermal processing part 30 are arrange | positioned in a horizontal line. The washing | cleaning process part 24 is equipped with the excimer UV irradiation unit (e-UV) 41 and the scrubber washing | cleaning unit (SCR) 42 of the parallel flow system which share one horizontal flow conveyance line here. Moreover, the application | coating process part 28 is equipped with the resist application | coating unit (CT, 82) and the pressure reduction drying unit (VD, 84).

On the other hand, in the downstream process line (B) from the interface station (I / F) 18 to the cassette station (C / S, 14) side, the second thermal processing unit 30, the developing process unit 32, and the decolorization process unit 34 and the 3rd thermal processing part 36 are arrange | positioned in a horizontal line. Here, the developing process part 32 and the decolorization process part 34 are parallel type and are connected by the common horizontal conveyance line.

The auxiliary conveyance space 38 is provided between both process lines A and B, and the shuttle 40 which can arrange | position the board | substrate G horizontally by one unit is not shown in the line direction X by the drive mechanism not shown. Direction) can be moved in both directions.

The first thermal processing unit 26 adjacent to the downstream side of the cleaning process unit 24 is provided with a vertical conveying mechanism 46 in the center along the process line A, and the plurality of units are multistage in both front and rear sides thereof. Lamination is carried out. For example, as shown in FIG. 2, the upstream side multi-stage unit (TB, 44) includes a substrate unit pass unit (PASS, 50) and a heating unit (DHP, 52 · 54) for dewatering bake and an adhesion unit ( AD, 56) are stacked in order from below. The pass unit PASS 50 is used to receive the substrate G in a straight stream from the scrubber cleaning unit SCR 42 side. In the downstream multistage unit sections TB and 48, a pass-through unit PASS 60, a cooling unit COL 62-64, and an ADH 66 unit are stacked in order from the bottom. Here, the pass unit PASS 60 is for directing the substrate G to the flow direction on the application process part 28 side.

As shown in FIG. 2, the vertical conveyance mechanism 46 rotates in the (theta) direction on the lifting carrier 70 and the lifting carrier 70 which are movable up and down along the guide rail 68 extending in a vertical direction, or The pivoting carrier 72 which can be turned, and the carrier arm or tweezers 74 which can be moved forward and backward or stretchable in the front-rear direction while supporting the substrate G on the pivoting carrier 72 is provided. A drive unit 76 for lifting and lowering the lifting carrier 70 is provided on the proximal end side of the vertical guide rail 68, and the driving unit 78 for swinging and driving the swing carrier 72 is the lifting carrier 70. Is attached to the rotary carrier 72 for driving the drive arm 74 forward and backward. Each drive part 76 * 78 * 80 may be comprised, for example with an electric motor. The conveyance mechanism 46 of the related structure is raising and turning at high speed, and is accessible to arbitrary units in the multistage unit parts TB, 44 * 48 of both neighbors, and the shuttle 40 on the side of the auxiliary conveyance space 38 is carried out. The transient substrate G can be received.

The second thermal processing unit 30 adjacent to the downstream side of the coating process unit 28 also has the same configuration as that of the first thermal processing unit 26, and is vertical between the two process lines A · B. A conveyance mechanism 90 is provided, and one multistage unit portion TB, 88 is installed on the process line (A) side (end), and the other multistage unit portion (TB) on the process line (B) side (head). , 92). Moreover, the 3rd thermal processing part 36 arrange | positioned downstream of the developing process part 32 also has the same structure as the said 1st thermal processing part 26 or the 2nd thermal processing part 30, and the process line B The vertical conveyance mechanism 100 and a pair of multistage unit parts TB, 98 占 102 are provided on both sides of the vertical conveyance mechanism.

The interface station I / F, 18 has a conveying device 104 for exchanging the adjacent exposure apparatus 12 and the substrate G, and has a buffer stage (BUF, 106) extension cooling around it. The stage EXT COL 108 and the peripheral device 110 are disposed. The stationary buffer cassette (not shown) is placed in the buffer stage BUF 106. The extension cooling stage (EXT COL) 108 is a stage for receiving a substrate with a cooling function and is used to exchange the substrate G with the process station P / S 16. The peripheral apparatus 110 is good as a structure which piled up the titler TITLER and the peripheral exposure apparatus EE up and down, for example. The conveying apparatus 104 has a means which can hold | maintain the board | substrate G, for example, the conveying arm 104a, and the adjacent exposure apparatus 12 and each unit BUF, 106, (EXTCOL, 108) The TITLER / EE 110 and the substrate G can be transferred.

The procedure of the process with respect to one board | substrate G in this coating | coated development process system is shown in FIG. First, in the cassette station C / S, 14, the conveyance mechanism 22 takes out the board | substrate G from the predetermined | prescribed cassette C on the stage 20, and the cleaning process part of the process station P / S, 16 ( It carries in to the conveyance line of 24) (step S1).

In the cleaning process part 24, the board | substrate G is conveyed on the conveyance line in the horizontal direction to the process line A direction, and the excimer UV irradiation unit (e-UV, 41) and the scrubber cleaning unit (SCR, 42) of the middle are carried out. UV cleaning treatment, scrubbing cleaning treatment, etc. are performed in order (step S2 S3). The substrate G having been cleaned in the scrubber cleaning unit SCR 42 is loaded on the conveying line and passes through the pass unit PASS in the upstream open tower TB, 44 of the first thermal processing unit 26. It is carried in 50).

In the 1st thermal processing part 26, the board | substrate G turns a predetermined unit by the vertical conveyance mechanism 46 in predetermined order. For example, the substrate G is first transferred from the pass unit PASS 50 to one of the heating units DHP 52 · 54 and subjected to dehydration therefrom (step S4). Subsequently, the substrate G is transferred to one of the cooling units COL 62 · 64, where it is cooled to a constant substrate temperature (step S5). Subsequently, the substrate G is transferred to one of the adhi- sion units AD, 56 · 66, and subjected to hydrophobic treatment therein (step S6). After the completion of this hydrophobization treatment, the substrate G is cooled to a constant substrate temperature by one of the cooling units COL 62 · 64 (step S7). Finally, the substrate G is transferred to the pass unit PASS 60 belonging to the downstream multistage unit section TB, 48.

Thus, in the 1st thermal processing part 26, the board | substrate G passes through the conveyance mechanism 46, and the upstream multistage unit part TB, 44 and the downstream multistage unit part TB, 48 are located. You can come and go arbitrarily. The same substrate transfer operation can also be performed in the second and third thermal processing units 30 and 36.

The substrate G subjected to the above-described series of thermal or thermal treatments by the first thermal processing section 26 is applied near the downstream side from the pass unit PASS 60 in the downstream multistage unit section TB, 48. It transfers to the resist coating unit CT and 82 of the process part 28. As shown in FIG.

The substrate G is coated with a resist coating unit (CT, 82), for example, by a spin coating method on the upper surface of the substrate (to-be-processed surface), and immediately afterwards to a vacuum drying unit (VD, 84) near the downstream side. The drying process by reduced pressure is received. (Step S8).

The substrate G subjected to the resist coating treatment as described above by the application process unit 28 belongs to a pass unit belonging to the upstream side-stage unit unit TB, 88 of the second thermal processing unit 30 located near the downstream side ( PASS).

In the second thermal processing unit 30, the substrate G is rotated by the transfer mechanism 90 in predetermined order in a predetermined unit. For example, the substrate G is first transferred from the pass unit PASS to one of the heating units PREBAKE, where it is subjected to baking after applying resist (step S9). Subsequently, the substrate G is transferred to one of the cooling units COL and cooled there to a constant substrate temperature (step S10). Subsequently, the substrate G extends or extends the cooling stage (EXT / COL) on the interface station (I / F, 18) with or without the pass unit (PASS) on the downstream multi-stage unit (TB, 92) side. , 108).

In the interface station I / F, 18, the substrate G is carried from the extension cooling stage EXT COL 108 into the peripheral exposure apparatus EE of the peripheral device 110, whereby the peripheral portion of the substrate G is located. After receiving an exposure for removing the resist attached to the film at the time of development, it is sent to a nearby exposure apparatus 12 (step S11).

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, when the substrate G, which has finished the pattern exposure, is returned from the exposure apparatus 12 to the interface station I / F, 18 (step S11), the substrate G is first loaded into the titler TITLER of the peripheral device 110 and thereon on the substrate. Predetermined information is recorded in the predetermined site (step S12). Subsequently, the substrate G is returned to the extension cooling stage EXT COL 108. The conveyance of the board | substrate G in the interface station I / F, 18, and the exchange of the board | substrate G of the exposure apparatus 12 are performed by the conveyance apparatus 104. FIG.

In the process station P / S, 16, in the second thermal processing unit 30, the transfer mechanism 90 receives the exposed substrate G from the extension cooling stage EXT COL 108, and the process line ( It passes to the developing process part 32 via the pass unit PASS in the multistage unit part TB, 92 of B) side.

In the developing process part 32, the board | substrate G received from the pass unit PASS in the said multistage unit part TB, 92 is carried in to the developing unit DEV, 94 in a parallel flow. In the developing unit DEV and 94, the substrate G is subjected to a series of developing processes of developing rinse drying while conveying the conveying line image of the flat stream toward the downstream of the process line B (step S13).

The substrate G subjected to the developing process by the developing process part 32 is carried in the decolorization process part 34 near the downstream side while being loaded in the conveying line of the flat stream, whereby the i-ray irradiation unit (i-UV, 96) is used. A decoloring process is performed (step S14). The board | substrate G after the decolorization process is received by the pass unit PASS in the upstream multistage unit part TB, 98 of the 3rd thermal processing part 36. As shown in FIG.

In the third thermal processing unit 36, the substrate G is first transferred from the pass unit PASS to one of the heating units POBAKE and subjected to postbaking there (step S15). Subsequently, the substrate G is transferred to the pass cooling unit PASS · COL in the downstream multistage unit units TB, 102 and is cooled to a predetermined substrate temperature therein (step S16). The conveyance of the board | substrate G in the 3rd thermal processing part 36 is performed by the conveyance mechanism 100. FIG.

On the cassette station C / S, 14 side, the conveyance mechanism 22 received the board | substrate G which completed the previous process of the application | coating development process from the pass cooling unit (PASS / COL) of the 3rd thermal processing part 36. Either board | substrate G is accommodated in one cassette (normally original) (step S1).

In this application | coating development system 10, this invention can be applied to the image development process part 32 and washing | cleaning process part 24 which have a flat stream conveyance line.

Embodiment 1

Hereinafter, one embodiment to which the present invention is applied to the developing unit DEV 94 of the developing processor 32 will be described with reference to FIGS.

4, the whole structure in the developing unit DEV 94 in the said embodiment is shown typically. This developing unit (DEV) 94 is provided with the conveyance line 120 of the flat stream which extends in a horizontal direction (X direction) along a process line B as shown in figure, and from this upstream along this conveyance line 120 The developing part 122, the rinse part 124, and the drying part 126 are provided in the order.

The conveying line 120 is formed by laying the rotor 128 for conveying the substrate G in an upward attitude toward the surface to be processed at regular intervals in the conveying direction (X direction), and the second thermal processing unit 30. 1, the path unit PASS in the multi-stage unit section TB, 92 in FIG. 1 is used as a starting point, and the development unit DEV 94 and the decolorization process section 34 exit the third thermal processing section 36. It terminates with the pass unit PASS in the multistage unit parts TB and 98 in FIG. 1). Each rotor 128 of the conveyance line 120 is connected to the conveyance drive part (not shown) which has an electric motor, for example through a transmission mechanism, such as a gearwheel mechanism or a belt mechanism.

The conveying line 120 does not continue at the same height position from the starting point to the end point in the conveying direction (X direction), but has ridges 120a and 120b and stepped portions 120c at predetermined points along the way. As shown in FIG. 4, nine conveyance sections M ';M2; according to the shape of the conveyance path seen from one side in the conveyance direction (X direction); M₃; M₄; M ₅ ; M ₆ ; M ₇ ; M ₈ ; M ₉

The first conveying section M 'is set to a position slightly earlier (upstream) from the time point P _{0 in} the pass unit PASS of the multistage unit sections TB and 92 (upstream side). It has a horizontal conveying path extending to a substantially horizontal straight line while maintaining the height position of the point of view Po, which is a section up to the section change point P₁ of. The second conveyance section M₂ is a section from the first section change point P₁ to a second section change point P₂ set to a position near the boundary between the developing unit 122 and the rinse section 124. It has a conveyance path of an ascending inclination which rises to a predetermined inclination angle (for example, 2 to 5 degrees) to the top of the first ridge 120a which is a predetermined amount (for example, 10 to 25 mm) higher than the height position of Po. have.

The third conveyance section M₃ is a section from the second section change point P₂ to the third section change point P₃ set near the inlet of the rinse section 124 and the first ridge 120a. It has an accompaniment of downward inclination which descends by a predetermined inclination angle (for example, 2-5 degrees) from the top of a to a 1st bottom position which is predetermined amount (for example, 10-25 mm) lower. The fourth conveyance section M 'is the section from the third section change point P₃ near the entrance in the rinse section 124 to the fourth section change point P₄ set to a predetermined position of the core portion and is the first section. It has a horizontal conveyance path extending almost horizontally at the same height as the bottom position of.

The fifth conveyance section M ₅ is a section from the fourth section change point P ′ within the rinse section 124 to a fifth section change point P _{5 in which} only a predetermined distance is set to the downstream side. And have an accompaniment path of ascending inclination which rises to a predetermined inclination angle (for example, 2 to 5 degrees) to the top of the second ridge 120b which is a predetermined amount (for example, 10 to 25 mm) higher than the first bottom position. have. The sixth conveying section M ₆ is provided from the fifth section changing point P ₅ in the rinsing section 124 to the sixth section changing point P _{6 in which} only a predetermined distance is set to the downstream side. A downward inclination that falls at a predetermined inclination angle (for example, 2 to 5 degrees) from a top of the second ridge 120b to a second bottom position that is a predetermined amount (for example, (10 to 25 mm) lower than that). It has an accompaniment track.

The seventh conveying section M ₇ is set in the rinse section 124 to a position on the downstream side, that is, slightly ahead of the exit (upstream side) from the _sixth section change point P ₆ . It has a horizontal conveyance path extending to a substantially horizontal straight line at the same height as the second bottom position and extending to the seventh section change point P ₇ . The eighth conveying section M ₈ is a section from the seventh section changing point P ₇ to the eighth section changing point P ₈ set near the boundary between the rinse section 124 and the drying section 126. And have an accompaniment path of ascending inclination that rises to a predetermined inclination angle (for example, 2 to 5 degrees) to an upper end position of the stepped portion 120c which is a predetermined amount (for example, (10 to 25 mm) higher than the second bottom position). have.

The ninth conveyance section M ₉ passes from the eighth section change point P8 through the drying section 126 and the decolorizing process section 34 (FIG. 1) to the multi-stage unit section TB, 98, FIG. 1. It has a horizontal accommodating path extending to the end point in the unit PASS and extending in a horizontal straight line while keeping the height of the upper end position of the stepped portion 120c constant.

In addition, it is preferable that the conveying line 120 draw and change an appropriate radius of curvature in the vicinity thereof rather than performing a course change such as being sharply bent at each section change point P, and the ridges 120a and 120b It may be in the shape of a trapezoid having a flat top (horizontal).

In the developing part 122, the developer of the reference density is discharged from the upper side toward the substrate G in a horizontal posture in which the conveyance line 120 is moved by the rotor conveyance at a predetermined position in the first conveying section M '. A developer supply nozzle (hereinafter referred to as "development nozzle") 130 is disposed along one or more lines along the conveyance direction. Each developing nozzle 130 is made of, for example, an elongated nozzle having a slit-shaped outlet or a plurality of fine diameter ejection outlets arranged in a single row, and supplies developer with a pipe from a developer supply source (not shown).

In the developing unit 122, a fan 132 for collecting the developer dropped below the transfer line 120 is also provided. The drain port of the fan 132 communicates with the developer reuse mechanism 136 via the drain tube 134. The developer reuse mechanism 136 recovers the developer that has overflowed when the developer is activated on the substrate G by the developer nozzle 130 through the fan 132 and the drainage tube 134, and then recovers the developer solution. The recycling developer adjusted to the standard concentration by adding the solvent is sent to the developer supply source.

In the rinse portion 124, the upper portion is directed upward toward the substrate G passing through the downward inclined surface of the first raised portion 120a of the conveying line 120 at a predetermined position in the third conveying section M₃ near the inlet. The 1st rinse liquid supply nozzle (henceforth "rinse nozzle") which discharges the rinse liquid for liquid substitution (development stop) from this is arranged one or more lines along a conveyance direction. Moreover, the rinse liquid for cleaning from the upper side toward the board | substrate G which passes the rising inclined surface of the said 2nd ridge part 120b of the conveyance line 120 in the predetermined position in the _5th conveyance section M5 of the center part. One or a plurality of lines of the second rinse nozzles 140 for discharging the ink are disposed along the conveying direction. Moreover, for finishing washing from the upper side toward the board | substrate G which passes the downward inclined surface of the 2nd ridge part 120b of the conveyance line 120 at the predetermined position in the _6th conveyance section M6 near the downstream side. One or more lines of the third rinse nozzles 142 for discharging the rinse liquid are arranged along the conveying direction. Moreover, the rinse liquid for final washing | cleaning is discharged from the upper side toward the board | substrate G which climbs the upward step part 120c of the conveyance line 120 to the predetermined position in _8th conveyance section M8 near the rinse part exit. One or more lines of the 4th rinse nozzle 145 are arrange | positioned along a conveyance direction. Each of the rinse nozzles 138, 140, 142, and 145 is made of, for example, an elongated nozzle having the same configuration as the developer nozzle 130, and is supplied with rinse liquid through a pipe from a rinse liquid supply source (not shown). .

In the rinse section 124, a fan 144 for collecting the rinse liquid dropped below the conveying line 120 is provided. The drain port of the fan 144 is connected to the rinse liquid recovery unit (not shown) via the drain pipe 146.

In the drying part 126, it conveys from the upper side toward the board | substrate G immediately after raising the said step part 120c of the conveyance line 120 to the predetermined position near the start end of the _9th conveyance section M9. In the direction opposite to the direction, a long gas nozzle or air knife 148 for hitting a high-pressure gas stream (typically an air stream) for drying without liquid separation is arranged one or more lines along the conveying direction. The lower air knife (not shown) which meets the high pressure gas stream for drying without liquid separation from below the conveyance line 120 toward the lower surface of the board | substrate G can also be installed. Moreover, you may install the fan (not shown) for collecting the liquid falling under the conveyance line 120 in the drying part 126. FIG.

I-ray irradiation unit that irradiates i-rays (wavelength 365 nm) for decoloring treatment from the upper side to the decolorizing process portion 34 near the downstream side toward the substrate G moving on the conveying line 120 in the rotor conveyance. (i-UV, 96) is installed.

The developing unit DEV 94 includes a developing part 122 in an integral housing 150; The rinsing part 124 and the drying part 126 are accommodated, and at the boundary between the other processing parts, the simple walls 152 and 154 extending in the vertical direction to allow the space around the conveying line 120 to fall upstream and downstream. ) Is being installed. More specifically, a simple wall 152 is provided near the boundary between the developing portion 122 and the rinse portion 124, that is, the boundary between the second conveyance section M₂ and the third conveyance section M₃, and the rinse section ( A simple wall 154 is provided near the boundary between the 124 and the drying unit 126, that is, between the eighth conveyance section M ₈ and the ninth conveyance section M ₉ . In each of the simple walls 152 and 154, passages 156 and 158 through the transfer line 120 are formed, respectively.

In this developing unit DEV, 94, the spaces in the processing units 122, 124, 126 communicate with each other via the passages 156, 158 of the simple walls 152, 154. In the developing unit 122 and the drying unit 126, clean air is drawn down from the ceiling by the fans 160 and 162 for drawing outdoor air and the air filters 164 and 166 for damping the air flow from the fans 160 and 162. It is supposed to be supplied indoors with a flow. Among them, the clean air supplied from the ceiling of the developing part 122 causes the mist of the developing solution generated during the developing process to be rolled in, so that the clean air supplied to the interior of the rinse part 124 through the passage 156 of the simple wall 152. Inflow. On the other hand, the clean air supplied from the ceiling of the drying unit 126 causes the rinse of the rinse liquid generated by the drying (liquid separation) process to be rolled up through the passage 158 of the simple wall 154. It is supposed to flow into the room. At the bottom of the rinse section 124, an exhaust port 170 is provided, for example, which communicates with an exhaust mechanism 168 having an exhaust pump or an exhaust fan. As mentioned above, the mist mixed air which flowed in from the solution developing part 122 side and the mist mixed air which flowed in from the drying part 126 side also dry the mist which generate | occur | produces in the rinse part 124, and joins from right and left. It is supposed to be discharged from the exhaust port 170.

Here, the whole operation in this developing unit DEV 94 will be described. As mentioned above, the board | substrate G after exposure in the 2nd thermal processing part 30 (FIG. 1) is carried in to the pass unit PASS of the multistage unit part TB, 92 by the conveyance mechanism 90. As shown in FIG. As shown in FIG. 4, in this pass unit PASS, the lift pin lifting mechanism 172 which receives the board | substrate G from the conveyance mechanism 90 (FIG. 1) is provided. When the board | substrate G moves horizontally and is mounted on the conveyance line 120 by this lift pin lifting mechanism 172, the board | substrate G is moved by the rotor of a constant speed by the drive of a conveyance drive part, Conveyed toward DEV, 94).

In the developing unit DEV 94, for the first time, in the developing unit 122, the substrate G is fixed while the substrate G moves in the first conveying section M₁ of the conveying line 120 in a horizontal posture. Is supplied to the developer, and the developer is activated on the substrate G from the substrate front end to the substrate rear end at the same scanning speed as the conveyance speed. The developer overflowed from the substrate G is collected in the fan 132.

As described above, the substrate G having activated the developing solution immediately climbs the upward slope of the first ridge 120a to the second conveying section M2, where the developing solution on the substrate G is gravity downwardly or backward. And flows from the substrate back end. The dripping developer is collected in the fan 132. At this time, on the board | substrate G, the liquid solution of a developing solution is separated from the front end side of a board | substrate to the back end side at the moving speed roughly the same as a conveyance speed. In this way, the board | substrate G beyond the 1st ridge | 120a part 120a is in the downhill slope (third conveyance section M₃) by the side of the rinse part 124, in the state which the developing solution remains a very thin liquid film on the upper surface. To reach.

In the rinse section 124, when the substrate G exits the ridge of the third conveying section M₃, the upper rinse nozzle 138 supplies the rinse liquid onto the substrate G, thereby providing the substrate G. The developer, which remained thin in each part of the phase, flows down to the front under pressure of gravity and the flow of the rinse liquid and exits from the front end of the substrate. The developer and the rinse liquid which flowed in front of the substrate G are collected in the fan 144. In this way, on the board | substrate G, from the front end side to the back end side of a board | substrate, a developing solution is substituted by the rinse liquid at the scanning speed roughly the same as a conveyance speed, and image development stops.

A substrate (G) which finished by developing processing as described above is passed through the conveyance section (M₄) of the horizontal fourth conveying section of the following fifth (M ₅₎ in parts of the downward level difference of the second elevated portion (120b) of Rises. At this time, the replacement rinse liquid remaining on the substrate G moves from the substrate front side to the rear by gravity and flows down from the substrate rear end. Further, the first rinse liquid for primary cleaning is supplied from the upper rinse nozzle 140 to the substrate G, and the new rinse liquid flows from the rear end of the substrate while the old rinse liquid is sent. The rinse liquid flowing down the back of the substrate is collected in the fan 144. Thus, the board | substrate G beyond the vertex of the 2nd ridge part 120b has the ridge part (6th) of the 2nd ridge part 120b in the state which the rinse liquid for primary washing | cleaning remains in the thin liquid film on the upper surface. Conveys section M6).

Then, when the substrate G goes down the downward slope M6 of the second ridge 120b, a new rinse liquid for secondary cleaning is supplied onto the substrate G by the upper rinse nozzle 142. As a result, the first rinse liquid, which remained thin on the substrate G, is moved forward, and the new rinse liquid also flows out of the substrate shear. The rinse liquid that has flowed forward of the substrate G is collected in the fan 144.

A substrate (G) which finished by rinsing treatment as described above comes up the ramp of the horizontal seventh conveying section (M ₇₎ upward step portion (120c) in the conveying interval (M ₈₎ of claim 8, and then the passes through the. At this time, the finishing rinse liquid remaining on the substrate G moves from the substrate front side to the rear by gravity and flows down from the substrate rear end. In addition, the final rinse liquid is supplied from the upper rinse nozzle 145 onto the substrate G to discharge the old rinse liquid, and the new rinse liquid also flows from the rear end of the substrate. The rinse liquid that has flowed behind the substrate G is collected in the fan 144. And the transport direction with respect to the substrate (G) has the step portion drying device up to (120c) (126) side that is the conveying section (M ₉₎ the air knife (148) of the substrate (G) enters the to the top of the backing in the ninth By hitting the high-pressure gas stream in the reverse direction, the rinse liquid remaining on the substrate G is driven to the rear of the substrate to be driven out of the rear end of the substrate (liquid separation). The rinse liquid blown behind the substrate G is collected in the fan 144.

In this way, the board | substrate G which completed a series of image development processes in the development unit DEV 32 moves directly on the conveyance line 120, and has been subjected to the decolorization process by the decolorization process part 34 near a downstream side. It is sent to the pass unit PASS of the unit part TB 98 (FIG. 1).

As described above, in the developing unit DEV 32 of this embodiment, the substrate G moves on the conveyer line 120 terminating the unit to the rotor conveyance at a constant speed, and the developing unit 122 moves during the flat flow. The rinse section 124 and the drying section 126 are subjected to development treatment, rinse treatment and drying treatment, respectively.

In particular, the developing section 122 in the horizontal transport to a location at a predetermined position away a predetermined distance on the downstream side of the horizontal position the substrate feed line 120 on the (G) therefrom becomes the developer is active only in on the (M ₁₎ The development stop is performed on the inclined path of the first ridge 120a without separation of the developer using gravity. Particularly, when the substrate G climbs the upward slope M₂ of the first ridge 120a, most of the developer on the substrate G falls backward, so that the substrate is intentionally stopped and lifted, and the attitude is changed from the horizontal posture to the inclination change. There is no need to convert. In addition, if the substrate G exceeds the upward ramp M₂, the rinse liquid for the liquid substitution is supplied to the downward ramp M₃ without intervening while the upper surface (to-be-processed surface) of the substrate G does not dry out, so that it is not desired to exchange the liquid. It is possible to prevent development defects (such as staining) caused by drying. In addition, in-plane uniformity of the development time since the direction and speed of the scanning for removing or stopping the development of the developer from each part on the substrate G are the same as the direction and speed of the scan when the developer is activated on each part of the substrate G. Furthermore, development uniformity can be improved. The substrate ridge or inclined portion formed when the substrate G passes through the ridge 120a is local (cylindrical) and the flow of the developer on the substrate is slow at a low speed. As a result, turbulence and liquid breakup hardly occur in the liquid on the substrate. Advantageously, in the conventional system of rapidly changing the entire substrate from a horizontal posture to an inclined posture of a predetermined angle, the developer rapidly flowing down on the substrate tends to cause turbulence and liquid breakup, and causes development unevenness.

In the rinse section 124, when the substrate G passes through the second raised portion 120b of the conveying line 120, the substrate G is first cleaned by the upward ramp M ₅ , and the second cleaning is performed by the downward ramp M6. Do it. Since the rinse liquid on the substrate G flows naturally to the rear of the substrate or the front of the substrate by the inclined path M ₅ · M ₆ , the substrate can be cleaned efficiently. In addition, the rinse liquid on the up-slope (M _5), the substrate (G) when passing through the is also possible to omit the rinse nozzle 140, which therefore dropped from the rear end transmitted to the rear substrate supply the washing water to the upward ramp (M ₅₎ Do. However, the rinse liquid used to stop the development is quickly rinsed with the minimum amount of washing water required, and the primary rinsing with this upward ramp M ₅ is very efficient. Therefore, rather than arranging a plurality of lines of the rinse nozzles 142 only on the side of the downward slope M ₆ , the cost performance is to arrange one of them as the rinse nozzle 140 for the primary cleaning on the side of the upward slope M ₅ . Excellent in terms of

In this embodiment, since the rinse nozzle 145 provided on the upper stepped portion 120c slightly downstream thereof has the same effect as the rinse nozzle 140, the second raised portion 120b is omitted. The structure, that is, the structure which substitutes to a horizontal straight conveyance path is also possible. In that case, the said rinse nozzle 140 * 142 may be arrange | positioned along a horizontal conveyance path, or you may abbreviate | omit.

In the drying unit 126, most of the rinse liquid remaining on the substrate G in the upward inclination M ₈ when the substrate G passes through the stepped portion 120c of the conveying line 120 naturally by gravity. a horizontal transport of the top becomes to fall down on the rear substrate can be (M ₉₎ for reducing the consumption of the number of rooms or the drying of the air knife 148 to place the gas side. It is also possible to install the air knife 148 above the upward ramp M ₈ .

In addition, in the housing 150 of the developing unit DEV 32, clean air flow supplied from the clean air supply unit 160 164 provided in the developing unit 122 flows from the developing unit 122 to the rinse unit 124. The clean air flow supplied from the clean air supply parts 162 · 166 provided in the drying part 126 is made to flow from the drying part 126 to the rinse part 124. FIG. When mist generated in the developing part 122 and the drying part 126 quickly collects in the rinse part 124 and the mist flows back from the rinse part 124 to the developing part 122 and the drying part 126, none. This can effectively and reliably prevent the reattachment of the mist to the substrate G in the developing portion 122 and the drying portion 126. In addition, even if mist adheres to the substrate G in the rinse portion 124, the rinse flows with the rinse liquid immediately.

Next, the example and operation | movement of each part in the developing unit DEV 32 of this embodiment are demonstrated about FIGS.

As described above, when the substrate G having activated the developing solution climbs the upward slope M2 of the ridge 120a of the transfer line 120, the liquid on the substrate G is transferred to the rear of the substrate by gravity. At this time, the surface tension may be started to cause the developer to be difficult to fall off from the rear end of the substrate G. Therefore, it is preferable to break the surface tension to provide an appropriate external force or action to promote smooth and uniform flow of the developer.

Fig. 5 shows the construction of a rotor conveying path which is very suitable for use in an upward ramp M2 from a related point of view. In this configuration example, two types of rotors 128A and 128B are used for the rotor 128 of the conveying line 120 depending on the conveying section. Specifically, the first type of rotor 128A constituting the horizontal conveying path M ₁ and the downwardly inclined conveying path M₃ has a large diameter roller portion 174 at several points of the relatively thin shaft 172. It adheres and is made to rotate the board | substrate G on the roller part 174. The rotor 128B of the second type used for the upward ramp M2 has a circumferential or cylindrical shaft 176 of the same diameter as the roller type 174 of the first type and has a substrate G on its own. ) To rotate. In addition, it is preferable to attach a plurality of rubber stop rings 177 to the second type rotor 128B at appropriate intervals in the axial direction, for example.

As shown in FIG. 7, when the second type of rotor 128B presses the rear end of the substrate G to feed the substrate, the shaft 176 of the rotor 128B is in contact with the entire rear end periphery of the substrate G. The developer R is uniformly wound on the shaft 176 from the entire rear end periphery of (G), and overflows.

In Fig. 5, each of the rotors 128, 128A, and 128B is rotatably supported by the bearing 178, and is mounted on the gear pulley 180 mounted at a step outside the bearing 178 on one end side. The timing belt 182 of the belt transmission is wound up. This timing belt 182 is connected to the rotation drive shaft of the conveyance drive part (not shown) which consists of an electric motor. In addition, the gear pulley 180 and the timing belt 182 of each rotor 128 are disposed outside the housing 150.

As shown in FIG. 6, the idler pulley 184 is arrange | positioned between the rotors 128 and 128 which adjoin each other. Each idler pulley 184 is turned on to turn off the timing belt 182 to each gear pulley 180 (a position indicated by a solid line) and an off to remove the timing belt 182 from each gear pulley 180. It is switched between positions (position shown with a dashed line).

8 shows another method for assisting the overflow of the developer from the rear end of the substrate G in the upward slope M2 of the conveying line 120. This method involves placing a gas nozzle or gas nozzle 186 at a suitable position in the upward ramp M2, for example, at the top position, towards the rear end of the substrate G, where the high pressure gas (usually High pressure air) is blown out temporarily or momentarily, and the developer R is dropped from the rear end of the substrate G at the pressure of the high pressure gas.

The configuration shown in FIG. 9 is very suitable for use in the case where the upward slope M2 of the conveying line 120 is formed in a steep uniform multiple, and as shown in Fig. 9, a belt-shaped endless belt (between the adjacent rotors 128 and 128) is shown. 188) is handing over. When the substrate G is improved from the horizontal movement so far at the inlet of the upward ramp M2 and changed to the movement, the front end of the substrate G is loaded on the belt 188 and flexibly changed to the rotor 122 on the upper side. I can ride it.

The configuration shown in FIG. 10 is for preventing the liquid from remaining in the rear end of the substrate G due to the liquid separation in the upward ramp M2 of the conveying line 120. The upper side of the upward ramp M2 is preferable. Preferably, a pair of rollers 190 which contact the left and right peripheral portions of the substrate G at a predetermined height position are disposed at a position slightly upstream from the top portion.

When the substrate G passes through the upward ramp M2, the liquid on the substrate G is transferred to the rear of the substrate by gravity and flows down from the rear end of the substrate, but most of the substrate G moves from the front edge of the substrate toward the downward ramp M₃. The rear end of the lower surface of the substrate G is separated upward from the upward ramp M2. At this time, if the rear end portion of the substrate G splashes largely as indicated by the chain line G ', the liquid solution of the developer may remain in the rear end portion of the substrate G. However, according to this configuration example, even if the rear end of the substrate G is separated upward from the upward slope M2, the liquid on the substrate G can be maintained in the rear inclined position up to the vicinity while being regulated by the height of the roller 190. Separation can be done to the end. Moreover, the structure which rotationally drives the roller 190 in the direction which sends the board | substrate G to the front is also possible.

FIG. 11: shows the structure which arrange | positions the air knife 192 for liquid separation promotion on the upward slope M2 of the conveyance line 120. As shown in FIG. When the substrate G climbs the upward slope M2, the air knife 192 blows the air flow from the upper side to promote the flow of the developer on the substrate G backward. This configuration can be suitably applied when the inclination angle or altitude difference of the upward slope (M₂) is small.

5 to 11 are not limited to the application of the conveying line 120 to the first ridge 120a, but the second ridge 120b or the step 120c. Applicable to

12, the operation of the liquid treatment when the substrate G passes through the first raised portion 120a on the conveyance line 120 is schematically illustrated. As shown in the drawing, the substrate G uses the flexibility to form a protrusion-like substrate ridge portion Ga imitating the ridge portion 120a on a part of the entire length, and at the same speed as the conveyance speed, the substrate ridge portion Ga Passes through the ridges 120a of the conveying line 120 while moving relative to the conveying direction from the front end to the rear end of the substrate. The length of the section length of the first ridge 120a in the conveying direction, that is, the length of the conveying sections M2 and M₃, is, for example, several tens of centimeters, and the total length of the substrate G (for example, (100 to Shorter than 250 cm).

In the upward ramp M2, the developing solution R flows on the substrate G behind the substrate by gravity and moves from the front end of the substrate G to the rear end at a speed substantially equal to the conveying speed, so that the liquid film of the developing solution R is in the liquid state. To the state of the thin film R '. At the time when the state of the thin film R 'is reached, the phenomenon reaches the end (for example, 95% or more).

When the substrate G moves beyond the apex of the ridge 120a to the downward slope M₃, the rinse on the substrate G is supplied by supplying the rinse liquid S to the strip-shaped discharge flow from the upper rinse nozzle 138. In the vicinity of the line where the liquid S lands, the developer R 'in a thin film state is quickly replaced by the rinse liquid S, and the development is completely stopped. The substituted developer R 'flows to the front and falls from the front end of the substrate. At this time, the region in which the developing solution R 'substituted with the rinse liquid flows has already stopped (a step ahead), and thus is not affected by the progress of the development. As shown in FIG. 12, the developing solution R flows in the region at the rear end side of the substrate while the ridge 120a is interposed therebetween, while the rinse liquid S flows in the region at the front end side of the substrate. The ridge 120a of the transfer line 120 can be passed while maintaining a stable posture due to the weight of the liquid. In addition, when the substrate G passes through the ridge 120a, it can be supplied before and after the top of the substrate, i.e., without mixing other liquids (developing and rinse liquids) on the front and rear ends of the substrate, and can prevent development unevenness. . In other words, when the developer and the rinse liquid are mixed on the substrate G, the liquid concentration is different at each part on the substrate G, so that development unevenness is likely to occur. Moreover, the liquid which differs on a board | substrate efficiently can be collect | recovered to each fan 132,144 separately in the short distance or space, without stopping the conveyance of the board | substrate G.

The second ridge 120b of the conveying line 120 also has the same action as that of the first ridge 120a only because the liquid is different. As mentioned above, it is also possible to omit the 2nd ridge part 120b, and to comprise this area in the horizontal straight accompaniment.

FIG. 13 schematically illustrates the action of liquid separation when the substrate G passes through the stepped portion 120c (the conveying section M ₈ ) of the conveying line 120. As shown in the drawing, the substrate G forms a line-shaped substrate stepped portion Gc that mimics the stepped portion 120c at a part of the entire length using its flexibility, and the substrate stepped portion Gc at the same speed as the conveying speed. ) Is passed through the up-stepped portions 120c and M ₈ of the conveying line 120 while moving relative to the conveying direction from the front end to the rear end of the substrate.

In these upwardly stepped portions 120c and M ₈ , the used rinse liquid S on the substrate G and the new rinse liquid S supplied on the substrate G from the rinse nozzle 145 are driven by gravity. Flowing backward, the liquid film of the rinse liquid S changes from the state of the liquid activity to the state of the thin film S 'at a speed substantially equal to the conveyance speed from the front end of the substrate G to the rear end. When the substrate G enters the horizontal accommodating passage M ₉ above the stepped portions 120c and M ₈ , the high-pressure gas flow is sprayed in the opposite direction to the conveying direction by the knife-shaped discharge flow from the upper air knife 148. The rinse liquid S 'remaining in the thin state on the substrate G is transmitted to the rear end side of the substrate and removed from the substrate.

Embodiment 2

Next, with reference to FIGS. 14-17, one Embodiment which applied this invention to the cleaning process part 24 is demonstrated.

The structure in the washing process part 24 by one Embodiment of this invention is shown in FIG. This cleaning process part 24 is provided with the conveyance line 200 of the flat stream which extends in a horizontal direction (X direction) along a process line A as shown in figure, and excimer irradiation unit ( e-UV, 41) and a scrubber cleaning unit (SCR) 42 are disposed. In the scrubber cleaning unit (SCR) 42, the loading part 202, the scrubbing cleaning part 204, the pro cleaning part 206, the rinsing part 208, the drying part 210 and the unloading part (from the upstream side) 212) is installed.

The conveying line 200 is formed by laying a rotor 214 for conveying the substrate G in an upward attitude with the surface to be processed upwards at regular intervals in the conveying direction (X direction), and the cleaning process part 24. A multi-stage unit part (TB, 44) in the first thermal processing part 26 (FIG. 1) exiting the excimer irradiation unit (e-UV) 41 and the scrubber cleaning unit (SCR, 42) with a viewpoint at the entrance. It is terminated with the pass unit PASS 50 (FIG. 2). Each rotor 214 of the conveyance line 200 is connected to the conveyance drive part (not shown) which has an electric motor, for example through a transmission mechanism, such as a gearwheel mechanism or a belt mechanism.

This conveying line 200 is also not continued at the same height position from the start point to the end point in the conveying direction (X direction), but the ridges 200a and 200b, the upward stepped portion 200c and the downward direction are set at predetermined points along the way. It has the stepped portion 200d. More specifically, the first ridge 200a is installed in the carrying-in portion 202, the second ridge 200b is installed in the pro-cleaning portion 206, and the upward stepped portion 200c is provided in the rinse portion 208. ) Is provided, and the downward stepped portion 200d is provided near the boundary between the drying section 210 and the carrying out section 212, and a conveyance section other than those undulating portions is formed in a horizontal straight conveying path.

The excimer UV irradiation unit (e-UV) 41 is provided with a lamp chamber 218 accommodating an ultraviolet lamp 216 above the conveying line 200. Ultraviolet lamp 216 is made of, for example, a dielectric barrier discharge lamp and a quartz glass window on substrate G on conveying line 200 directly below ultraviolet (ultraviolet excimer) wavelength 172 nm which is very suitable for cleaning organic contamination. Investigation through 220 is made. The concave reflector 222 of a cross-sectional arc shape is provided behind or on the ultraviolet ray lamp 216.

In the scrubber cleaning unit (SCR) 42, a fan filter unit (FFU, 224) for supplying clean air in a downflow is mounted on the ceiling of the carrying-in portion 202. In particular, tools such as nozzles and air knives are not provided above the first raised portions 200a.

In the scrubbing cleaning unit 204, the air curtain nozzle 226 in sequence from the upstream side along the conveying path line 200; A chemical liquid supply nozzle 228; a roll brush 230 and a cleaning spray tube 232 are disposed. The air curtain nozzle 226 is arrange | positioned so that a slit-shaped air flow may blow toward the downstream side of a conveyance direction with respect to the upper surface of the board | substrate G which just passes under. Directly below the air curtain nozzle 226 is a second type rotor 214B having a cylindrical shaft over its entire length. Chemical liquid supply nozzle 228; The roll brush 230 and the cleaning spray pipe 232 can also be provided on both the upper and lower sides with the conveying line 200 interposed therebetween.

In the pro cleaning section 206, for example, a two-fluid jet nozzle 234 is provided as a pro cleaning nozzle above the upward slope of the second ridge 200b. The rinse nozzle 236 is provided in the rinse part 208 above the upward step part 200c. In the drying part 210, the air knife 238 is provided above the horizontal conveyance path. Moreover, it is also possible to provide the rinse nozzle 236 and the air knife 238 to the upper and lower sides of the conveyance line 200 between them. Moreover, the lower part rinse nozzle (not shown) which blows the rinse liquid for washing | cleaning with respect to the lower surface (lower surface) of the board | substrate G from below the conveyance line 200 can also be provided also in the pro washing | cleaning part 206. FIG. A fan filter unit (FFU, 240) for supplying clean air in the downflow is also mounted to the ceiling of the carrying out portion 212. In particular, tools such as nozzles and air knives are not provided above the downward stepped portion 200d.

Between the units or processing units 41, 202, 204, 206, 208, 210 and 212 adjacent to each other, the simple walls 242, 244, 246, 248, 250 and 252 are provided, respectively. In the processing units 204, 206, 208, and 210 for handling the liquid, fans 254, 256, 258, and 260 for collecting the liquid dropped below the conveying line 200 are respectively provided. Pipes of a recovery system or a drainage system are connected to the drainage port provided at the bottom of each fan. In addition, an exhaust port 262 is provided at the bottom of the pro cleaning unit 206 located at the center of the scrubber cleaning unit (SCR) 42, for example, through an exhaust mechanism (not shown) having an exhaust pump or an exhaust fan. have.

Here, the whole operation and effect | action in this washing | cleaning process part 24 are demonstrated.

As mentioned above, the unprocessed board | substrate G is carried in to the conveyance line 200 by the conveyance mechanism 22 of the cassette station C / S, 14 side, and the process line A of the process line A by the rotor conveyance is carried out. It is conveyed toward the downstream side.

In the excimer UV irradiation unit (e-UV) 41, ultraviolet rays emitted from the ultraviolet lamp 216 in the lamp chamber 218 pass through the quartz glass window 220 and are irradiated onto the substrate G on the transfer line 200. The ultraviolet rays excite oxygen near the substrate surface to generate ozone, and the ozone oxidizes and vaporizes and removes organic substances on the substrate surface.

In this way, the substrate G subjected to the ultraviolet cleaning treatment by the excimer UV irradiation unit (e-UV) 41 enters the scrubber cleaning unit (SCR) 42 near the downstream side, and the first ridge (in the inlet 202) ( It is sent to the scrubbing cleaning part 204 through 200a).

In the scrubbing cleaning unit 204, the substrate G can be blown first with, for example, an acid or an alkali chemical liquid from the chemical liquid nozzle 228. The chemical liquid remaining on the substrate G receives the air flow from the air curtain nozzle 226, so that the substrate G does not flow on the upstream side and enter the carrying-in portion 202. Moreover, the cylindrical rotor 214B conveys the back surface of the board | substrate G by conveying while occupying the back surface side of the board | substrate G, and functions so that liquid may not go to the loading part 202 side. The substrate G supplied with the chemical liquid immediately exits while rubbing under the roll brush 230. The roll brush 230 is rotated in a direction opposite to the conveying direction by the rotational driving force of the brush drive unit (not shown) to rub foreign matter (dust, debris, contaminants, etc.) on the substrate surface. Immediately thereafter, the cleaning spray tube 232 blows the cleaning liquid, for example, pure water, onto the substrate G to wash away the foreign matter suspended on the substrate. The liquid dropped under the substrate G to the conveying line 200 in the scrubbing cleaning unit 204 is collected in the fan 254.

Subsequently, the substrate G enters the blow cleaning unit 206 and is caught by the second ridge 200b and is pro-cleaned by the two-fluid jet nozzle 234 when climbing the upward slope thereof. The two-fluid jet nozzle 234 pressurizes the cleaning liquid (for example, water) and the pressurized gas aimed at a place where the film thickness thereof becomes thinner on the substrate G on the upward slope of the second ridge 200b. For example, a mixed fluid of nitrogen is sprayed to remove foreign substances adhering or remaining on the surface of the substrate G with a very strong impact force of the pressurized 2 fluid. Most of the liquid on the substrate G is blown from the uphill side of the ridge 200b to the lower side (upstream side) and collected in the fan 256. Most of the liquid brought to the ridge portion ie the rinse portion 208 of the ridge portion 200b on the substrate G is large.

In the rinse portion 208, the rinse nozzle 236 supplies the rinse liquid for the final cleaning toward the substrate G that climbs the upward stepped portion 200c. The rinse liquid supplied onto the substrate G flows onto the substrate toward the rear end side of the substrate, and most of it falls on the fan 258 in the rinse portion 208. In this way, the rinse treatment is performed by blowing the rinse liquid onto the substrate G in an inclined posture rising up the stepped portion 200c, as compared with the conventional method of blowing the rinse liquid against the substrate in the horizontal posture. The flow and replacement efficiency are good, and the amount of rinse liquid used can be greatly reduced.

When the board | substrate G climbs up the upward step part 200c and enters the section of a horizontal accompaniment path, the air knife 238 will await and high pressure gas flow will be matched with the board | substrate G in the conveyance direction and a reverse direction. Thereby, the board | substrate G phase remains or a rinse liquid collects in the back of a board | substrate, and it is driven out from a rear end of a board | substrate (liquid separation).

The clean air supplied in the downflow from the fan filter unit (FFU, 224) in the ceiling of the carry-on part 202 passes through the passages (substrate passages) of the simple walls 244 and 246, and the interior of the pro-cleaning part 206 is provided. The mist, such as a chemical liquid generated in the scrubbing cleaning unit 204 at that time, is also transferred into the pro cleaning unit 206. On the other hand, the clean air supplied in the downflow from the fan filter unit (FFU, 240) of the discharge part 212 ceiling passes through the passage (substrate passage) of the said simple walls 252, 250 and 248 of the pro-cleaning part 206. Mist, such as a rinse liquid, which flows into the room and is generated in the rinse section 208 of the drying chamber 210 at that time, is also transferred into the pro cleaning section 206. In this way, the mist mixed air which flowed from the inlet part 202 side and the mist mixed air which flowed in the outlet part 212 side also take in the mist which generate | occur | produces in the blow washing part 206, joins from right and left, and the exhaust vent of the bottom part is carried out. Discharged from 262. Therefore, mist which generate | occur | produces in the blow washing part 206 does not enter a side chamber especially the rinse part 208.

As described above, in the scrubber cleaning unit (SCR) 42, a ridge portion 200b and an upward step portion 200c are provided in the middle of the conveyance line 200 of the flat stream, and a blow cleaning nozzle or rinse above or in the vicinity thereof. By the arrangement | positioning of tools, such as a nozzle, the effect similar to the developing unit DEV 32 which concerns on 1st Embodiment mentioned above regarding the liquid process on the board | substrate G can be acquired.

In addition, the scrubber cleaning unit (SCR) 42 is provided with a ridge 200a in its inlet or carrying-in portion 202 and a downward step 200d in its outlet or carrying-out portion 212.

15-17, the effect | action of the ridge 200a provided in the carrying-in part 202 is demonstrated. In addition, the air curtain nozzle 226 is abbreviate | omitted.

The medicine dropped on the substrate G in the chemical liquid supply nozzle 228 in the scrubber cleaning unit (SCR) 42 is spread upstream by the wall of the ridge 200a as shown in FIGS. 15 and 16 (in particular, the dashed line 270). Spreading in the center portion of the substrate as shown in FIG.

In addition, when a sudden alarm occurs during operation of the system and the conveying line 200 stops, the respective substrates G moving on the conveying line 200 are stopped at respective positions during the liquid treatment. At this time, even if the substrate G is stopped across the excimer UV irradiation unit (e-UV) 41 and the scrubber cleaning unit (SCR) 42, the chemical liquid K on the substrate G is still melted as shown in FIG. Intrusion into the excimer UV irradiation unit (e-UV) 41 by the wall of the base 200a is prevented (blocked).

If chemical liquids or other liquids enter the excimer UV irradiation unit (e-UV, 41), it may cause deterioration or failure of the quartz glass window 220 or the ultraviolet lamp 216. There has conventionally been provided a space dropping or buffering area for one substrate between the excimer UV irradiation unit (e-UV) 41 and the chemical liquid supply nozzle 228. According to this embodiment, it is possible to omit the buffer area of such a large space by the above-mentioned stop function of the upward slope 200a, and the chemical | medical solution supply nozzle 228 arrange | positioned in the most upstream of the scrubber cleaning unit (SCR) 42 side. ) Can be placed close to the excimer UV irradiation unit (e-UV, 41). It is also possible to substitute the ridge 200a in the downward stepped portion.

The downward stepped portion 200d in the carrying out portion 212 is for fitting the start point and the end point of the transfer line 200 to the same height position. When the downward stepped portion is provided in the carry-in portion 202 as described above, the downward stepped portion 200d is unnecessary in the carry-out portion 212.

As mentioned above, although very suitable embodiment of this invention was described, this invention is not limited to said embodiment, A various deformation | transformation or a change is possible within the range of the technical idea. For example, in the conveyance line 120 of the said image development process part 32 or the conveyance line 200 of the washing | cleaning process part 24, it is possible to provide such a ridge | bulb part and a step part in arbitrary order and arbitrary points. Do. For example, also in the conveyance line 120 of the said image development process part 32, it is possible to provide a ridge | bulb part or a downward step part in the vicinity of the entrance of the developing part 122. FIG. Thereby, the developing solution supplied from the developing nozzle 130 to the board | substrate G may not reach another unit near the upstream, or the height position of the start point of the conveyance line 120 can be matched with the height position of an end point. Moreover, it is also possible to apply the structure or function of the air curtain nozzle 226 and the cylindrical rotor 214B provided in the scrubber washing | cleaning unit SCR, 42 to the developing unit DEV, 94. FIG. The upward attitude of the substrate G in the conveyance lines 120 and 200 of the above embodiment was a horizontal posture or an inclined posture in the front-rear direction (X direction), but the inclined posture in other directions in the left-right direction (Y direction). It is also possible.

Although the above embodiment relates to the developing processing apparatus and the cleaning processing apparatus, the present invention can be applied to any processing apparatus for applying a desired treatment to a substrate using one or more kinds of processing liquids. The substrate to be treated in the present invention is not limited to an LCD substrate, and various substrates for flat panel displays, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like can also be used.

According to the substrate processing apparatus of the present invention, the above-described configuration and operation efficiently and flexibly collect and recover the first processing liquid supplied to the processing target substrate on the conveying line in the flat stream and replace the second processing liquid with the second processing liquid. You can do it. Moreover, the operation | movement which separates a 1st process liquid after a predetermined process time and substitutes it for a 2nd process liquid can also be performed efficiently uniformly in surface inside. In addition, it is also possible to simultaneously realize the improvement of the continuity and the yield and the prevention of mutual interference between the processings by sequentially performing a series of processings on the substrates while transferring the substrates to be processed on the conveyance line of the flat stream.

Claims (20)

A first conveying section which is formed by laying a conveying body for conveying the substrate to be processed in an upward attitude with the surface to be processed upward in a predetermined horizontal conveying direction and having a conveying path substantially horizontal in the conveying direction; A second conveyance section having a conveyance path of an upward slope following the first conveyance section, a third conveyance section having a conveyance path of a downward inclination following the second conveyance section, and the third conveyance A flat stream conveying line including a fourth conveying section having a substantially horizontal conveying path following the section, A conveying drive unit which drives the conveying body in order to convey the substrate on the conveying line; A first processing liquid supply unit for supplying a first processing liquid onto the substrate in the first or second conveying section; And a second processing liquid supply unit for supplying a second processing liquid onto the substrate within the third conveying section. The method according to claim 1, The length of the said 2nd conveyance section in the said conveyance direction is shorter than the size of the said board | substrate, The substrate processing apparatus characterized by the above-mentioned. The method according to claim 1, A substrate processing apparatus according to claim 2, wherein the length of the section obtained by adding the second conveyance section and the third conveyance section to each other is shorter than the size of the substrate. The method according to any one of claims 1 to 3, The substrate processing apparatus characterized by the above-mentioned conveyance path being formed substantially horizontally between the terminal part of the said 2nd conveyance section, and the start end of the said 3rd conveyance section. The method according to any one of claims 1 to 3, It has a board | substrate suppression part which suppresses the site | part of the said board | substrate which isolate | separates upwards from the conveyance path of the said conveyance line in a predetermined height position in a said 2nd conveyance section. The method according to claim 5, And the substrate suppressing portion has a pair of rotatable rollers in contact with the left and right peripheral portions of the substrate. The method according to any one of claims 1 to 3, And a first air knife which blows gas for liquid separation onto the substrate at a predetermined position in the second conveyance section downstream from the first processing liquid supply part. The method according to any one of claims 1 to 3, And a liquid separation trigger for triggering the flow of the first processing liquid from the rear end of the substrate at a predetermined position in the first or second conveying section downstream from the first processing liquid supplying portion. Substrate processing apparatus. The method according to claim 8, The substrate processing apparatus characterized by the above-mentioned liquid separation triggering part being comprised by the circumferential shape or cylindrical rotor of which the outer diameter arrange | positioned as the said conveyance body on the said conveyance path is constant. The method according to claim 8, And the gas separation triggering portion includes a gas nozzle that engages a gas flow in a reverse direction to the conveyance direction from above on a rear end portion of the substrate. The method according to any one of claims 1 to 3, The first processing liquid supply unit has a processing liquid supply nozzle for discharging the first processing liquid toward the substrate at a predetermined position in the first transport section, The said conveyance drive part conveys the said board | substrate at a constant speed through the said 1st and 2nd conveyance section, The substrate processing apparatus characterized by the above-mentioned. The method according to any one of claims 1 to 3, A first collecting part for collecting the liquid dropped below the conveying path in the first and second conveying sections, and a material for collecting the liquid dropped below the conveying path in the third and fourth conveying sections. It has a liquid collection part of 2, The substrate processing apparatus characterized by the above-mentioned. The method according to any one of claims 1 to 3, And a first simple wall for dividing the space around the conveying line into an upstream side and a downstream side near a boundary between the second conveyance section and the third conveyance section. The method according to any one of claims 1 to 3, The conveying line includes a fifth conveying section having a conveyance path of an inclined slope following the fourth conveying section, and a sixth conveying section having a substantially horizontal conveying path following the fifth conveying section. Substrate processing apparatus, characterized in that. The method according to claim 14, The length of the said 5th conveyance section in the said conveyance direction is shorter than the size of the said board | substrate, The substrate processing apparatus characterized by the above-mentioned. The method according to claim 14, And a second air knife which blows gas onto the substrate in the opposite direction to the conveying direction to assist liquid separation of the processing liquid from the substrate within the fifth or sixth conveying section. Substrate processing apparatus. The method according to claim 14, And a second simple wall for dividing the space around the conveying line into an upstream side and a downstream side near a boundary between the fifth conveyance section and the sixth conveyance section. The method according to any one of claims 1 to 3, A seventh conveying section having a conveying path substantially horizontal at a position higher than the first conveying section on an upstream side of the first conveying section, the seventh conveying section and the first And an eighth conveyance section having a conveyance path with a downward slope between the conveyance sections. The method according to claim 18, The length of said 8th conveyance section in the said conveyance direction is shorter than the size of the said board | substrate, The substrate processing apparatus characterized by the above-mentioned. The method according to claim 18, And a third simple wall for dividing the space around the conveying line into an upstream side and a downstream side near a boundary between the eighth conveyance section and the first conveyance section.

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