KR100799107B1 - Device for surface treatment - Google Patents

Device for surface treatment Download PDF

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KR100799107B1
KR100799107B1 KR1020070026427A KR20070026427A KR100799107B1 KR 100799107 B1 KR100799107 B1 KR 100799107B1 KR 1020070026427 A KR1020070026427 A KR 1020070026427A KR 20070026427 A KR20070026427 A KR 20070026427A KR 100799107 B1 KR100799107 B1 KR 100799107B1
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South Korea
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surface treatment
workpiece
guide
processed
treatment apparatus
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KR1020070026427A
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Korean (ko)
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KR20070037606A (en
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김남성
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(주)포인텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 표면처리조내에서 피처리물을 이동시키면서 연속적으로 표면처리를 수행하는 경우에 피처리물을 안정적으로 가이드하고 피처리물의 변형폭을 최소화하여 표면처리 품질을 높일 수 있도록 한 표면처리장치에 관한 것이다.The present invention provides a surface treatment apparatus for stably guiding a workpiece and minimizing a deformation width of the workpiece when the surface treatment is continuously performed while moving the workpiece in the surface treatment tank. It is about.

본 발명은 세로자세의 평판형상의 피처리물을 이송기구에 의해서 표면처리조내를 이송시키면서 피처리물의 표면을 처리하는 표면처리장치에 있어서,The present invention provides a surface treatment apparatus for treating a surface of an object to be processed while conveying the object to be processed in a vertical flat plate shape by a transfer mechanism.

피처리물(10)의 이동경로의 양측에 각각 일정간격으로 표면처리조(30)에 회전가능하게 세워지는 복수의 회전포스트(111∼114)(121∼124)와, 인접하는 회전포스트에 권회되어 무한궤도로 순환되는 안내와이어(110)(120)와, 회전포스트를 회전시키는 구동모터(100)를 구비하여서, 이송기구에 의해 피처리물(10)이 이동될때 안내와이어(110)(120)가 회전되면서 피처리물(10)을 안내하도록 한다. 본 발명 표면처리장치는 회전순환되는 안내와이어(110)(120)에 의해서 피처리물(10)이 지지되어 박형의 피처리물의 변형을 최소화시키면서 표면처리를 수행할 수 있게 하므로 표면처리 품질을 향상시킬 수 있게 한다.A plurality of rotation posts 111 to 114 (121 to 124) rotatably erected on the surface treatment tank 30 at predetermined intervals on both sides of the movement path of the object 10 and wound to adjacent rotation posts, respectively. Guide wires 110 and 120 that are circulated in an endless track and a driving motor 100 to rotate the rotation post, so that the guide wires 110 and 120 are moved when the object 10 is moved by the transfer mechanism. Rotate to guide the workpiece 10. The surface treatment apparatus of the present invention improves the quality of the surface treatment because the treatment object 10 is supported by the guide wires 110 and 120 rotated in rotation to minimize the deformation of the thin workpiece. To make it possible.

표면처리, 안내와이어, 피처리물, 표면처리조 Surface treatment, guide wire, object to be treated, surface treatment tank

Description

표면처리장치 {Device for surface treatment}Surface treatment device {Device for surface treatment}

도 1은 종래 표면처리장치를 설명하는 개략도,1 is a schematic diagram illustrating a conventional surface treatment apparatus;

도 2는 도 1에 도시된 표면처리조를 나타낸 평면도,2 is a plan view showing the surface treatment tank shown in FIG.

도 3은 본 발명 표면처리장치를 설명하는 개략도,3 is a schematic view illustrating a surface treatment apparatus of the present invention;

도 4는 도 3에 도시된 표면처리조를 나타낸 평면도,4 is a plan view showing the surface treatment tank shown in FIG.

도 5는 회전포스트에 안내와이어의 권회상태를 나타낸 사시도이다.5 is a perspective view showing a wound state of the guide wire in the rotation post.

〈 도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for the main parts of the drawings>

10...피처리물 30...표면처리조10.Treatment 30.Surface treatment tank

110,120...안내와이어110,120 ... Guide Wire

본 발명은 표면처리장치에 관한 것으로써, 특히 표면처리조내에서 피처리물을 이동시키면서 연속적으로 표면처리를 수행하는 경우에 피처리물을 안정적으로 가이드하고 피처리물의 변형폭을 최소화하여 표면처리 품질을 높일 수 있도록 한 표면처리장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus, and in particular, when surface treatment is continuously carried out while moving a workpiece in a surface treatment tank, the workpiece is stably guided and the deformation width of the workpiece is minimized so that the surface treatment quality It relates to a surface treatment apparatus to increase the.

예컨대, LCD, PDP등의 디스플레이부에 채용되는 기판 또는 인쇄회로기판등은 표면을 에칭하거나 도금하는 공정을 통하여 표면처리되고 있다.For example, substrates or printed circuit boards employed in display units such as LCDs and PDPs are surface treated through a process of etching or plating the surface.

표면처리에는 복수의 표면처리조에 피처리물을 일정시간 침지하여 표면처리후 다른 표면처리조에 피처리물을 다시 침지하여 표면처리하는 반복방식과, 길이방향으로 긴 표면처리조에 피처리물을 침지시킨 상태에서 이동시키면서 표면처리하는 연속방식이 채택되고 있다.In the surface treatment, a plurality of surface treatment tanks are immersed in a plurality of surface treatment tanks for a predetermined time, and after the surface treatment, another surface treatment tank is immersed again in a surface treatment method, and the surface treatment tank is immersed in a longitudinal surface treatment tank. The continuous method of surface treatment while moving in a state is adopted.

도 1 및 도 2는 연속방식에 의한 표면처리장치를 나타낸 것으로써, 길이 방향으로 긴 표면처리조(30)에 표면처리액을 수용시킨 상태에서 피처리물(10)을 행거에 지지시킨 상태에서 레일(20)을 따라 이동시키면서 표면처리를 행한다.1 and 2 show the surface treatment apparatus according to the continuous method, in which the object 10 is supported on the hanger in a state in which the surface treatment liquid is accommodated in the surface treatment tank 30 elongated in the longitudinal direction. Surface treatment is performed while moving along the rail 20.

도금공정의 경우에는 표면처리조(30)내에 두 전극판(1)(2)이 대향설치 되고, 그 사이로 피처리물(10)을 일정시간 머물게 하여 도금을 수행하고 있다. 참조번호 (3)은 피처리물(10)을 향하여 처리액을 분사시키는 노즐이다.In the case of the plating process, the two electrode plates 1 and 2 are opposed to each other in the surface treatment tank 30, and the plating process is performed by allowing the object to be processed 10 to remain therebetween. Reference numeral 3 denotes a nozzle for injecting the treatment liquid toward the object 10.

그러나 이와 같은 표면처리장치는 전자제품의 소형화 및 박형화에 따라 기판과 같은 피처리물(10)도 박형화로 되어가는 추세의 경우에, 노즐(3)로부터 처리액의 분사압력으로 박형의 피처리물(10)이 변형되게 되어 두 전극판(1)(2)들과의 간격이 다르게 되므로 도금이 불균일하게 이루어지게 된다.However, such a surface treatment apparatus has a thin to-be-processed object at the injection pressure of the treatment liquid from the nozzle 3 in the case of the tendency that the to-be-processed object 10 such as a substrate also becomes thin with the miniaturization and thinning of electronic products. 10 is deformed so that the distance between the two electrode plates 1 and 2 is different, the plating is made non-uniformly.

또한, 피처리물(10)이 표면처리조(30)내에서 이동시 처리액과의 저항으로 인하여 피처리물(10)의 선단부분이 굴곡되는등 변형되게 되므로, 행거에 의한 피처리물(10)의 이동속도에 제한받게 되고 이에따라 표면처리속도의 향상을 기대할 수 없게 된다.In addition, since the object 10 is deformed due to the resistance with the treatment liquid when the object 10 moves in the surface treatment tank 30, the object 10 is deformed. As a result, the speed of surface treatment cannot be expected.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로써, 박형의 피처리물도 세로자세를 유지한 상태에서 변형을 최소화시키면서 표면처리가 가능하도록 한 표면처리장치를 제공하는 데 그 기술적 과제가 있다.The present invention has been made to solve the above problems, there is a technical problem to provide a surface treatment apparatus that enables the surface treatment while minimizing the deformation in the state of maintaining a thin posture.

본 발명의 다른 기술적 과제는 처리액이 수용된 표면처리조내에서 피처리물이 수평이동시 피처리물의 변형 및 흠집을 최소화시키면서 안내할 수 있도록 한 표면처리장치를 제공하는 데 그 기술적 과제가 있다.Another technical problem of the present invention is to provide a surface treatment apparatus capable of guiding a processed object in a surface treatment tank in which a treatment liquid is accommodated while minimizing deformation and scratches of the target object during horizontal movement.

상기 목적을 달성하는 본 발명은 세로자세의 평판형상의 피처리물을 이송기구에 의해서 표면처리조내를 이송시키면서 피처리물의 표면을 처리하는 표면처리장치에 있어서,The present invention for achieving the above object is a surface treatment apparatus for treating the surface of the object to be processed while transferring the inside of the surface treatment tank of the vertical posture of the object by the transfer mechanism,

상기 피처리물의 이동경로의 양측에 각각 일정간격으로 표면처리조에 회전가능하게 세워지는 복수의 회전포스트와, 상기 인접하는 회전포스트에 권회되어 무한궤도로 순환되는 안내와이어와, 상기 회전포스트를 회전시키는 구동모터를 구비하여서,A plurality of rotation posts rotatably set in a surface treatment tank at predetermined intervals on both sides of the movement path of the object to be treated, guide wires wound around the adjacent rotation posts and circulated in an endless track, and rotating the rotation posts. With drive motor,

상기 이송기구에 의해 피처리물이 이동될때 상기 안내와이어가 회전되면서 피처리물을 안내하도록 된 것을 특징으로 한다.When the workpiece is moved by the transfer mechanism is characterized in that the guide wire is rotated to guide the workpiece.

본 발명 표면처리장치에서, 상기 안내와이어는 상기 회전포스트의 길이방향을 따라 일정간격으로 복수 구비된 것을 특징으로 한다.In the surface treatment apparatus of the present invention, the guide wire is characterized in that a plurality provided at a predetermined interval along the longitudinal direction of the rotation post.

또한, 본 발명은 상기 안내와이어는 상기 피처리물의 이송방향에 대하여 경사지게 상기 회전포스트에 권회된 것을 특징으로 한다.In addition, the present invention is characterized in that the guide wire is wound on the rotation post inclined with respect to the conveying direction of the workpiece.

이하 첨부된 도면을 참조하면서 본 발명에 따른 바람직한 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명 실시예의 표면처리장치는 예컨대, 도금공정에서 길이방향으로 긴 표면처리조내에서 피처리물을 수평이동시키면서 연속적으로 도금을 수행하되, 박형의 피처리물의 변형을 최소화시켜 도금 풀질을 향상시키고 피처리물의 이동시 흠집의 발생을 최소화시킨다.In the surface treatment apparatus of the embodiment of the present invention, for example, the plating is continuously performed while horizontally moving the workpiece in the longitudinally long surface treatment tank in the plating process, thereby minimizing the deformation of the thin workpiece to improve plating quality and Minimizes the occurrence of scratches when moving the treatment.

본 발명의 실시예의 표면처리장치의 일부분을 나타낸 도 3을 참조하면, 이 장치는 처리액이 수용된 표면처리조(30)에 평판형상의 피처리물(10)을 행거(21)에 세로자세를 유지시키면서 지지시키고 레일(20)을 따라 수평이동시키면서 연속적으로 도금을 하는 도금장치를 나타낸다.Referring to FIG. 3, which shows a part of the surface treatment apparatus according to the embodiment of the present invention, the apparatus carries out a vertical posture on the hanger 21 with the plate-like object 10 in the surface treatment tank 30 containing the treatment liquid. A plating apparatus for continuously plating while maintaining and supporting and horizontally moving along the rail 20 is shown.

실제로, 표면처리조(30)내에서 피처리물(10)이 일정구간에서 일정시간 머물면서 도금이 수행되고, 일정구간으로 수평이동되는 동안 새로운 피처리물(10)이 표면처리조(30)로 진입되고 다시 일정시간 머물면서 도금공정이 수행되는 연속도금공정을 수행한다.In practice, plating is performed while the workpiece 10 stays in a certain section for a predetermined time in the surface treatment tank 30, and the new workpiece 10 is moved to the surface treatment tank 30 while horizontally moving to a certain section. It enters into and stays for a certain time to perform a continuous plating process in which the plating process is performed.

상기 표면처리조(30)내에는 마주 대향되는 위치에 전극판(1)(2)이 설치되어 있고, 두 전극판(1)(2) 사이를 피처리물(10)이 행거(21)에 지지된 상태로 이동되게 되어 있으며, 피처리물(10)의 양 측면에서는 노즐(3)을 통하여 전해액과 같은 처리액이 분사되게 되어 있다.In the surface treatment tank 30, the electrode plates 1 and 2 are provided at opposite positions, and the object 10 is disposed between the two electrode plates 1 and 2 on the hanger 21. It is moved in the supported state, and process liquids, such as electrolyte solution, are sprayed through the nozzle 3 at both side surfaces of the to-be-processed object 10. FIG.

이때, 최근 추세에 따라 피처리물(10)이 20∼30㎛ 정도로 박형의 두께를 갖는 경우에는 처리액의 분사압력에 의해서 휘어지는 현상이 발생되게 되는데, 이 경 우 두 전극판(1)(2)들과 피처리물(10)과의 간격변화가 발생하게 되어 도금 품질이 저하되게 된다.At this time, according to the recent trend, when the workpiece 10 has a thin thickness of about 20 to 30 μm, a phenomenon of bending due to the injection pressure of the treatment liquid occurs. In this case, the two electrode plates 1 and 2 ) And a change in the distance between the workpiece 10 and the plating quality is reduced.

이를 위해서 본 발명 실시예에는 도 3 및 도 4에서와 같이, 상기 피처리물(10)의 이동경로의 양측에 각각 일정간격으로 표면처리조(30)에 회전가능하게 세워지는 복수의 회전포스트(111∼114)(121∼124)와, 상기 인접하는 회전포스트에 권회되어 무한궤도로 순환되는 안내와이어(110)(120)와, 상기 회전포스트를 회전시키는 구동모터(100)를 구비하여서, 상기 이송기구에 의해 피처리물(10)이 수평이동될때 상기 안내와이어(110)(120)가 회전되면서 피처리물(10)을 안내하도록 하였다.To this end, in the embodiment of the present invention, as shown in Figures 3 and 4, a plurality of rotating posts that are rotatably erected on the surface treatment tank 30 at regular intervals on both sides of the movement path of the object 10, respectively ( 111 to 114, 121 to 124, guide wires 110 and 120 wound around the adjacent rotating posts and circulated in an endless track, and a drive motor 100 for rotating the rotating posts. When the workpiece 10 is horizontally moved by a transfer mechanism, the guide wires 110 and 120 are rotated to guide the workpiece 10.

도 5에서와 같이, 안내와이어(110)는 회전포스트(111)(112)에 압입된 풀리(111a)(112a)에 권회되어 회전순환될 수 있도록 하였다.As shown in FIG. 5, the guide wire 110 is wound around the pulleys 111a and 112a pressed into the rotation posts 111 and 112 so that the guide wire 110 may be rotated.

상기 안내와이어(110)(120)는 도 3 및 도 5에서와 같이, 상기 회전포스트(111∼114)(121∼124)의 길이방향을 따라 일정간격으로 복수로 설치하여서, 피처리물(10)과의 접촉면적을 최소화시키면서 피처리물(10) 전체를 안정적으로 가이드할 수 있도록 하였다.As shown in FIGS. 3 and 5, the guide wires 110 and 120 are installed in plural at predetermined intervals along the longitudinal direction of the rotation posts 111 to 114 and 121 to 124, and the workpiece 10 is processed. ) To guide the entire object 10 stably while minimizing the contact area with ().

또한 안내와이어(110)(120)는 상기 피처리물(10)의 이송방향에 대하여 경사지게 설치하였다. 예컨대, 피처리물(10)의 이동방향과 같은 방향(수평방향)으로 안내와이어를 설치하는 경우, 피처리물(10)의 측면측에서 노즐(3)을 통하여 분사되는 처리액 압력에 의해서 박형의 피처리물(10)의 휨발생(특히, 피처리물의 상/하단부에서)을 방지할 수 없게 된다.In addition, the guide wires 110 and 120 are installed to be inclined with respect to the transfer direction of the object 10 to be processed. For example, when the guide wire is installed in the same direction (horizontal direction) as the moving direction of the workpiece 10, it is thin due to the treatment liquid pressure sprayed through the nozzle 3 on the side of the workpiece 10. It is impossible to prevent warpage (particularly, at the upper and lower ends of the object to be treated) of the object to be processed 10.

따라서, 안내와이어(110)(120)를 피처리물(10)의 이동방향에 대하여 경사지 게 설치하게 되면, 측면측에서의 처리액 분사압력에 대하여 수평방향으로 안내와이어를 설치하는 경우보다 휨발생을 줄일 수 있게 된다.Therefore, when the guide wires 110 and 120 are installed to be inclined with respect to the moving direction of the workpiece 10, the occurrence of warpage is reduced compared to when the guide wires are installed in the horizontal direction with respect to the injection pressure of the treatment liquid on the side surface. It becomes possible.

또한, 피처리물(10)의 이동속도와 안내와이어(110)(120)의 회전순환속도를 동일하게 함으로써, 피처리물(10)과 안내와이어(110)(120)와의 상대속도 차이가 없게 되므로 마찰에 따른 흠집발생을 줄일 수 있게 한다.In addition, by making the movement speed of the object 10 and the rotational circulation speed of the guide wires 110 and 120 the same, there is no difference in relative speed between the object 10 and the guide wires 110 and 120. Therefore, it is possible to reduce the occurrence of scratches due to friction.

이와 같은 구성의 표면처리장치는 행거(21)에 피처리물(10)을 세로자세로 지지시킨 상태에서 표면처리조(30)내에서 수평방향으로 이동시키면서 연속적으로 도금공정을 수행하게 되는 바, 피처리물(10)이 이동될때 노즐(3)을 통한 처리액의 분사압력에 의해서 휘어짐이 발생되려 하지만 회전순환되는 안내와이어(110)(120)에 지지되므로 휨발생을 방지할 수 있게 된다. 이때 안내와이어(110)(120)는 모터(100)에 의해서 피처리물(10)의 수평이동방향과 같은 방향으로 회전되므로 피처리물(10)이 접촉되더라도 흠집발생을 방지할 수 있게 된다.The surface treatment apparatus having such a configuration performs the plating process continuously while moving horizontally in the surface treatment tank 30 in a state in which the workpiece 10 is supported vertically on the hanger 21. When the object 10 is moved, bending occurs due to the injection pressure of the processing liquid through the nozzle 3, but is supported by the guide wires 110 and 120 that are rotated circulating, thereby preventing bending. In this case, the guide wires 110 and 120 are rotated in the same direction as the horizontal movement direction of the object 10 by the motor 100, thereby preventing the occurrence of scratches even when the object 10 is in contact with the object.

또한, 피처리물(10)이 수평이동될때 그 선단부분이 처리액과의 저항으로 휘어지려하지만, 안내와이어(110)(120)에 좌우로 지지되므로 휨발생을 방지할 수 있게 된다.In addition, when the workpiece 10 is horizontally moved, the tip portion thereof is to be bent by resistance with the treatment liquid, but is supported left and right on the guide wires 110 and 120 to prevent bending.

본 발명 표면처리장치는 회전순환되는 안내와이어(110)(120)에 의해서 피처리물(10)이 지지되어 박형의 피처리물의 변형을 최소화시키면서 표면처리를 수행할 수 있게 하므로 표면처리 품질을 향상시킬 수 있게 한다.The surface treatment apparatus of the present invention improves the quality of the surface treatment because the treatment object 10 is supported by the guide wires 110 and 120 rotated in rotation to minimize the deformation of the thin workpiece. To make it possible.

또한, 안내와이어(110)(120)가 피처리물의 이동속도와 동일한 속도로 회전순 환되면서 피처리물을 안내하게 되므로, 안내와이어(110)(120)와 피처리물(10)이 상호 접촉되더라도 피처리물의 흠집발생을 방지하여 품질 저하를 방지할 수 있게 한다.In addition, since the guide wires 110 and 120 are rotated at the same speed as the moving speed of the object to guide the object to be processed, the guide wires 110 and 120 and the object 10 are in contact with each other. Even if it is possible to prevent the occurrence of scratches of the workpiece to prevent the degradation of quality.

또한, 안내와이어(110)(120)를 피처리물(10)의 이동방향에 대하여 경사지게 설치함으로써, 피처리물(10)의 표면에 수직한 방향으로 압력이 가해지더라도 보다 안정적으로 휨발생을 억제할 수 있게 한다.In addition, by providing the guide wires 110 and 120 inclined with respect to the moving direction of the workpiece 10, even if pressure is applied in a direction perpendicular to the surface of the workpiece 10, the occurrence of warpage is more stably suppressed. To do it.

Claims (3)

세로자세의 평판형상의 피처리물을 이송기구에 의해서 표면처리조내를 이송시키면서 피처리물의 표면을 처리하는 표면처리장치에 있어서,In the surface treatment apparatus which processes the surface of a to-be-processed object, conveying the to-be-processed object of the vertical posture in a surface treatment tank by a conveyance mechanism, 상기 피처리물(10)의 이동경로의 양측에 각각 일정간격으로 표면처리조(30)에 회전가능하게 세워지는 복수의 회전포스트(111∼114)(121∼124)와, 상기 인접하는 회전포스트에 권회되어 무한궤도로 순환되는 안내와이어(110)(120)와, 상기 회전포스트를 회전시키는 구동모터(100)를 구비하여서,A plurality of rotation posts 111 to 114 and 121 to 124 rotatably set up on the surface treatment tank 30 at predetermined intervals on both sides of the movement path of the object 10, and the adjacent rotation posts; It is provided with a guide wire (110, 120) and a drive motor (100) for rotating the rotation post is wound around the endless track, 상기 이송기구에 의해 피처리물(10)이 이동될때 상기 안내와이어(110)(120)가 회전되면서 피처리물(10)을 안내하도록 된 것을 특징으로 하는 표면처리장치.Surface treatment apparatus characterized in that the guide wire (110) 120 to guide the object to be processed (10) is rotated when the object to be processed (10) by the transfer mechanism. 제 1 항에 있어서, 상기 안내와이어(110)(120)는 상기 회전포스트(111∼114)(121∼124)의 길이방향을 따라 일정간격으로 복수 구비된 것을 특징으로 하는 표면처리장치.The surface treatment apparatus according to claim 1, wherein the guide wires (110) (120) are provided in plural at regular intervals along the longitudinal direction of the rotation posts (111 to 114) (121 to 124). 제 2 항에 있어서, 상기 안내와이어(110)(120)는 상기 피처리물(10)의 이송방향에 대하여 경사지게 상기 회전포스트(111∼114)(121∼124)에 권회된 것을 특징으로 하는 표면처리장치.The surface of claim 2, wherein the guide wires (110) and (120) are wound on the rotation posts (111 to 114) (121 to 124) inclined with respect to the conveying direction of the object (10). Processing unit.
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JPH10128257A (en) 1996-10-29 1998-05-19 Dainippon Screen Mfg Co Ltd Substrate treatment device and substrate treatment
JPH11160666A (en) 1997-11-25 1999-06-18 Hitachi Electron Eng Co Ltd Substrate treating device
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Publication number Priority date Publication date Assignee Title
KR100914488B1 (en) 2008-12-09 2009-08-27 (주)포인텍 A apparatus for guiding a base plate

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