JPH11160666A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently recover the waste liquid of a treating solution supplied to substrate without loss by separating the waste liquid from other treating solutions when the substrate is liquid-treated by supplying specified treating solutions thereto. SOLUTION: In order to recover the waste liquid of the treating solution supplied to a substrate 10 rotated by a rotating shaft 12 of a substrate rotary means 11 in a 1st liquid recovery chamber 24, a rotating disk 16 is attached to the rotating shaft 12 and the diameter of this rotating disk 16 is made at least larger than the diagonal of the substrate 10 and smaller than the diameter of the opening part of a partition 23b. When the substrate 10 is positioned at the 1st liquid recovery chamber 24, the rotating disk 16 is arranged at the level almost equal to or higher than that of the inner circumferential edge, and the substrate 10 is supported by supporting rods 17 and pedestals 18 in an non-contact state with the rotary disk 16, and positioned by a positioning pin 18a on the pedestal 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing a process using a processing liquid on a surface of a rectangular substrate such as a TFT substrate of a liquid crystal panel or a color filter.

[0002]

2. Description of the Related Art For example, in a process of manufacturing a TFT substrate of a liquid crystal panel, a predetermined process is performed by a wet process such as application of a developing solution, application of an etching solution, and supply of a stripping solution for stripping a resist film. A cleaning step and a drying step are added between these processes. Conventionally, such a wet processing of a substrate is performed by mounting a substrate on a spindle and supplying a processing liquid or the like while rotating the substrate. Here, the cleaning step is performed by a so-called megasonic shower in which, for example, pure water subjected to ultrasonic vibration is used as a cleaning liquid and the cleaning liquid is jetted toward the substrate. This cleaning liquid is also a kind of processing liquid. In such a wet process, a plurality of processes, for example, the application of a developer and the washing or rinsing process using pure water are performed by a single apparatus, for example, see JP-A-7-24546.
No. 6 is known. This known substrate processing apparatus is configured as schematically shown in FIG.

[0003] In the drawing, reference numeral 1 denotes a substrate, which is a square, usually rectangular thin plate, and a pedestal provided at the tip of a spindle 2 as a rotating shaft whose axis is oriented vertically. 3 is positioned and fixed at a predetermined position. Reference numeral 4 denotes a housing having an open top. The housing 4 is provided so as to surround the substrate 1 mounted on the spindle 2. A nozzle 5 for supplying a processing liquid is provided at an upper position of the substrate 1, and a required processing liquid is supplied from the nozzle 5 to a rotation center position of the substrate 1 by the spindle 2. Here, what is supplied from the nozzle 5 is a developing solution, an etching solution, and a rinsing solution. Each of these processing liquids is sprayed on the rotating substrate 1 and spreads over the entire surface of the substrate 1 by the action of centrifugal force, so that excess processing liquid is scattered from the outer peripheral edge.

In order to individually separate and collect the respective processing liquids scattered from the substrate 1, the housing 4 is provided with three upper and lower partitions 4a to 4c. A circular opening is formed at the center of each of the housings 4a to 4c.
By making the diameter of this opening larger than the length of the diagonal line of the substrate 1, the substrate 1 can be moved in the vertical direction. The collection chamber 6a is provided between the partitions 4a and 4b, and the collection chamber 6 is provided between the partitions 4b and 4c.
b, and below the partition 4c is a collection chamber 6c. In addition, pipes 7a to 7c are connected to these recovery chambers 6a to 6c, respectively.
The waste liquid is collected so as not to be mixed with the waste liquid via 7c. The spindle 2 can be displaced in the vertical direction by a suitable lifting drive means. When the substrate 1 is placed between the partition walls 4a and 4b by the lifting and lowering operation of the spindle 2, the processing liquid acting on the substrate 1 is discharged. When the liquid is collected in the collection chamber 6a and the substrate 1 is lowered to a position between the partition walls 4b and 4c, the drainage of the processing liquid supplied to the substrate 1 can be collected in the collection chamber 6b. Further, when the substrate 1 is lowered to the lowermost position and positioned below the partition wall 4c, the processing waste liquid can be collected in the collection chamber 6c.

With the nozzle 5 retracted, the substrate 1 is held by the handling means for transfer and mounted on the spindle 2. When the developing solution, the etching solution, and the rinsing solution are supplied first while the substrate 1 is rotated at a high speed by the spindle 2, the processing liquid supplied to the substrate 1 is moved along the surface of the substrate 1 by the action of the centrifugal force. Spread outward. As a result, the processing liquid is applied to a substantially uniform film thickness over the entire surface of the substrate 1, and excess processing liquid is scattered outward from the periphery of the substrate 1. Where the developer,
Since the etching liquid and the rinsing liquid are different liquids, not only one nozzle but also three nozzles for supplying different processing liquids are provided so that they are independently displaced.

The housing 4 is provided for separating and collecting the processing liquid supplied to the substrate 1. For this purpose, the spindle 2 is moved up and down according to the type of the processing liquid supplied to the substrate 1. For example, when a developing solution is applied to the substrate 1 in a state where the height position of the spindle 2 is adjusted and the substrate 1 is arranged at the position of the collection chamber 6a as shown by a dashed line in FIG. The developer scattered from the edge can be collected from the collection chamber 6a via the pipe 7a. Further, when performing the etching, the substrate 1 is lowered to the position indicated by the two-dot chain line, and is set at a position facing the collection chamber 6b from the collection chamber 6a. Thus, the etching liquid supplied to the substrate 1 is collected in the collection chamber 6b, and there is no possibility that the etching liquid enters the collection chamber 6a. Therefore, the developer and the etchant are collected through separate paths. Further, when supplying the rinsing liquid, the substrate 1 is lowered to the position indicated by the solid line and is positioned in the collection chamber 6c.
To be collected. Thereby, the rinsing liquid is collected in the recovery chamber 6.
There is no danger of getting into a and 6b.

[0007]

Incidentally, a circular opening is formed in each of the partition walls 4a to 4c constituting the housing 4 so as to surround the substrate 1. On the other hand, since the substrate 1 is rectangular, the distance between the outer peripheral edge of the substrate 1 and the inner peripheral edge of the partition walls 4a to 4c is the narrowest at the corners and the most at the middle part on the long side. Become wider. Therefore, substrate 1
A wide space portion and a narrow space portion are formed between the partition walls 4a to 4c. Since the processing liquid is scattered by the action of the centrifugal force, the liquid from the corners of the substrate 1 can be reliably collected in a predetermined recovery chamber, but scatters from the outer peripheral edge of the substrate 1 in a portion where the space is wide. The collected liquid may not always be reliably introduced into the collection chamber.

In the above-mentioned prior art, the processing liquid from the nozzle 5 is supplied toward the center of rotation of the substrate 1. However, when the substrate 1 rotates, the center of rotation rotates at the rotational peripheral speed. Is substantially zero, so that the centrifugal force on the processing liquid supplied from the nozzle 5 hardly acts. Then, the action of the centrifugal force becomes larger as going toward the peripheral portion. For this reason, if the processing liquid is supplied to the center of rotation, there is a possibility that the coating will be uneven. Therefore, the spread of the processing liquid does not depend only on the action of the centrifugal force due to the rotation of the substrate 1, but the substrate 1 is rotated by rotating the nozzle or the like.
It is preferable that the treatment liquid is smoothly and surely spread over the whole of the substrate. Thus, when the nozzle is turned,
When the nozzle faces the diagonal position of the substrate 1,
Although all the processing liquid is guided onto the substrate 1, when the processing liquid faces the intermediate portion on the long side, a part of the processing liquid from the nozzle is not supplied to the substrate 1, and the lowermost collection chamber 6 is left as it is.
c. For this reason, various liquids enter into the lowermost collection chamber 6c, and cannot be reused.
There is a problem that the waste of the processing liquid increases, for example, the efficiency of recovering the processing liquid in a and 6b decreases.

The present invention has been made in view of the above points, and an object of the present invention is to accurately process a substrate by a wet process and to combine a processing liquid discharged from the substrate with another liquid. An object is to enable efficient collection without mixing.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a substrate rotating means provided with a substrate supporting portion for horizontally supporting a rectangular substrate on a rotating shaft; A nozzle member for supplying at least one type of processing liquid to the surface of the substrate that is rotationally driven, and an annular opening provided to surround the substrate rotating means and having a diameter larger than a length of a diagonal line of the substrate. And a rotating disk driven by the rotating shaft, the rotating disk having a diameter between a length of a diagonal line of the substrate and a diameter of the opening. And the substrate is placed above the rotating disk at a predetermined interval.

Here, the processing liquid supplied to the substrate includes a developing liquid, an etching liquid, a stripping liquid, a cleaning liquid and the like.
When a plurality of processing liquids are used, the housing is formed of a plurality of partitions in the vertical direction, and a plurality of chambers for individually collecting a plurality of types of processing liquids are provided between the partition walls.
In addition, by connecting either the rotating shaft or the housing to the up / down driving means so as to be movable in the vertical direction, the substrate may be arranged at any position of the plurality of chambers. The nozzle may be arranged at the rotation center position of the substrate, but since this rotation center portion has a rotation peripheral speed of zero, the nozzle member should be capable of swinging at least in the horizontal direction. It is preferable to uniformly spread the processing liquid. Further, the rotating disk may be formed of a flat disk, but the outer peripheral portion may be configured to be inclined downward. In this case,
The rotating disk is arranged at an upper position of the housing, and positions the inclined portion of the outer peripheral portion at the same position as the housing or at a position slightly higher than the housing.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, FIG. 1 shows the overall configuration of a processing apparatus according to the present invention. Here, in the following, an example of a substrate to be processed is a TFT substrate constituting a liquid crystal panel, and a description will be given assuming that liquid processing including application and cleaning of a developing solution is performed on this substrate. However, the present invention can also be applied to perform various liquid treatments required when manufacturing color filters for liquid crystal panels and other non-circular substrates.

First, in FIG. 1, reference numeral 10 denotes a substrate. As is clear from FIG. 2, the substrate 10 is formed of a rectangular thin glass substrate. Reference numeral 11 denotes a substrate rotating unit, which has a rotating shaft 12;
The rotating shaft 12 is rotatably supported by a holding cylinder 14 erected on a base 13 via a bearing 15. A rotary base plate 12a is mounted on the upper end of the rotary shaft 12, and a rotary disk 16 is fixedly mounted on the rotary base plate 12a. The rotating disk 16 has a smooth surface with good slip, and a required number of support rods 17 are provided upright. Each of the support rods 17 has a spherical end at the tip, and supports the back surface of the substrate 10. Further, pedestals 18 are mounted at positions corresponding to the four corners of the substrate 10, and a pair of positioning pins 18a, 18a are erected on each of the pedestals 18. Therefore, the substrate 10
The back surfaces of the four corners are placed on the pedestal 18, and the positioning pins 18 a come into contact with the end surfaces. When the rotating disk 16 rotates together with the rotating shaft 12, the substrate 10 is securely held. It is driven to rotate, so that misalignment can be prevented.

The rotation axis 12 of the substrate rotation means 11 is a base 13
And a pulley 19 is provided at an end thereof in a connected manner. A motor 20 is provided at a lower position of the base 13, and a driving pulley 21 is connected to an output shaft of the motor 20.
A transmission belt 22 is wound around the second pulley 19. Accordingly, when the rotation shaft 12 is driven to rotate by the motor 14, the substrate 10 mounted on the arm 16 rotates. During the rotation of the substrate 10, its surface 1
After uniformly applying the developing solution on the 0a side, washing with a megasonic shower is performed, and if necessary, a combined process of high-speed spin drying can be performed.

The above-described liquid processing for the substrate 10 is performed using a plurality of processing liquids such as a developing liquid and a cleaning liquid, and by rotating the substrate 10, a centrifugal force is applied to the processing liquid supplied to the substrate 10. The processing liquid is diffused along the surface 10 a of the substrate 10, and excess processing liquid is scattered in a substantially horizontal direction from the edge of the substrate 10. In order to effectively collect the processing liquid scattered in this manner, the substrate 10 is surrounded by a housing 23 having an open upper end.
For this purpose, a first liquid recovery chamber 24 for recovering the drainage of the developer and a second liquid recovery chamber for recovering the cleaning liquid below the first liquid recovery chamber 24 are provided in the housing 23.
Is formed. Accordingly, the housing 23 includes upper and lower partitions 23a and 23b, a portion between the upper and lower partitions 23a and 23b is a first liquid recovery chamber 24, and a space below the partition 23b is a second liquid recovery chamber. It will be 25. In addition, since two types of the developing solution and the cleaning solution are used for the substrate 10, the number of the liquid collecting chambers is two. And the number of liquid recovery chambers corresponding to the type of the processing liquid may be formed.

In order to supply the developing solution to the substrate 10, there are provided a developing solution supplying means 26 and a cleaning liquid supplying means 27 for supplying a cleaning liquid composed of pure water. The developing solution supply means 26 and the cleaning liquid supply means 27 are rotatable by a predetermined angle, and are mounted horizontally at the tips of support shafts 26a, 27a which can be moved up and down.
And a plurality of injection nozzles 26c, 27c are attached to the mounting arms 26b, 27b. Therefore, by swinging the support shafts 26a and 27a, the support shaft 26a and 27a can be rotationally displaced between a position above the substrate 10 and a position retracted outside the housing 23. Further, when a processing liquid such as a developing solution or a cleaning liquid is jetted toward the substrate 10 from the injection nozzles 26c and 27c, the mounting arms 26b and 27b are reciprocally rotated by a predetermined angle. The processing liquid can be uniformly and efficiently supplied to the whole. The vertical movement of the support shafts 26a and 27a is for adjusting the distance between the injection nozzles 26c and 27c and the substrate 10.

The developing solution supply means 26 supplies the substrate 1
The relative height position between the substrate 10 and the housing 23 can be adjusted between when the developer is supplied to the substrate 10 and when the cleaning liquid is supplied to the substrate 10 by the cleaning liquid supply unit 27. For this purpose, the housing 23 can be moved up and down. In order to raise and lower the housing 23, brackets 30 are provided on both sides of the housing 23, as shown in FIG.
Are linked. The lifting rod 31 is attached to the base 1.
An elevating plate 33 is attached so as to extend downward through the bearing member 32 attached to the lower member 3 and to bridge the lower end portions of these two elevating rods 31. Furthermore, this lifting plate 3
3 is connected via a slide member 37 to a guide rod 36 connected between fixed plates 34 and 35 having both ends fixed, and a feed screw 38 provided between the fixed plates 34 and 35 is inserted. The fitted nut 39 is connected. A drive motor 40 is connected to the feed screw 38. When the feed screw 38 is rotated by the drive motor 40, the elevating plate 33 moves up and down, and the housing 33 is moved from the elevating plate 33 through the elevating rod 31. Move 23 up and down,
The board 10 moves up and down relatively to the housing 23.

When supplying the developing solution to the substrate 10, the substrate 10 is arranged at a position facing the first liquid collecting chamber 24, and when supplying the cleaning liquid, the substrate 10 is connected to the second liquid collecting chamber 25. Place it at the facing position. As a result, the developer scattered from the edge portion of the substrate 10 is recovered in the first liquid recovery chamber 24, and the cleaning liquid is recovered in the second liquid recovery chamber 25. Pipes 41 and 42 are connected to lower portions of the liquid recovery chambers 24 and 25, respectively. The other ends of the pipes 41 and 42 are connected to tanks (not shown) for storing collected liquid. I have. Further, mist may be generated when the developer scatters from the substrate 10 or when the developer rebounds from the partition wall 23a of the housing 23. In order to collect the mist, one or a plurality of exhaust pipes 43 are connected to appropriate portions of the partition wall 23a.

As described above, the developing solution and the cleaning solution are separated and collected. This separation and collection mainly depends on the action of the centrifugal force when the processing liquid is scattered from the substrate 10. By the way, as shown in FIG. 4, when the substrate 10 is rotated in the horizontal direction, the rotation center C has a rotation peripheral speed of zero,
As the distance from the rotation center C increases, the rotational peripheral speed increases. If the substrate 10 is circular, it will move toward the outer periphery at a substantially uniform speed. However, substrate 1
0 is a rectangle and a rectangle having a long side and a short side. When the liquid flows along the substrate 10 having such a shape, the length from the center position C to the edge is the longest L ₁ to the corner, and the length to the middle part of the long side. and L ₂ is the shortest. The rotational peripheral speed becomes maximum at the corner of the substrate 10. The processing liquid flows outward along the surface of the substrate 10 by the action of the centrifugal force, and the initial velocity when scattered from the edge is given a sufficient velocity at the corners of the substrate 10, but the middle part of the long side The initial velocity at is very small.

On the other hand, since the substrate 10 rotates in the horizontal direction and moves up and down relatively with respect to the housing 23, the circular opening diameter D formed in the partition wall 23b of the housing 23 is Must be greater than diagonal length. Therefore, the distance between the inner peripheral edge of the partition wall 23b and the edge of the substrate 10 is shortest at the corner of the substrate 10 and longest at the middle of the long sides of the substrate 10. In other words, at the corner where the processing liquid supplied to the substrate 10 scatters at the fastest speed, the space between itself and the partition wall 23b is small, and at the middle portion of the long side where the processing solution scatters at the slowest speed, a wide space is formed. I have.

As described above, when the substrate 10 is arranged at a position corresponding to the first liquid recovery chamber 24 and the developing solution is supplied from the developing solution supply nozzle 26, the substrate 10 rotates at an extremely high speed. As long as the processing liquid is not given an initial velocity enough to jump over the space between the partition walls 23b even in the middle part of the longer side, a part of this processing liquid is
And falls into the second liquid recovery chamber 25 from the gap between them. When such a situation occurs, the developer and the cleaning liquid cannot be separated and recovered sufficiently despite the fact that they are separated into the liquid recovery chambers 24 and 25. In particular, substrate 1
Until the zero rotation reaches the steady state, the developer
The amount of waste falling into the liquid recovery chamber 25 increases.

Further, since the rotation peripheral speed of the central portion of the substrate 10 is zero, in order to spread the processing liquid evenly over the entire surface of the substrate 10, it is necessary to mount the developing solution supply means 26 for supplying the developing solution 26. It is preferable to swing the arm 26b horizontally by a predetermined angle. Therefore, depending on the swing angle, a part of the developer supply nozzle 26c mounted on the mounting arm 26b may move to a position off the substrate 10. In this case, the developer is not supplied to the substrate 10 but flows directly into the second liquid recovery chamber 25.

As described above, the processing liquid, particularly the processing liquid recovered in the first liquid recovery chamber 24, is efficiently recovered,
A rotating disk 16 is mounted on the rotating shaft 12 to prevent the liquid from being mixed into the recovered liquid in the second liquid recovery chamber 25. The diameter of the rotating disk 16 is larger than at least the length of the diagonal line of the substrate 10. However,
Since the rotating disk 16 moves up and down together with the rotating shaft 12 and passes through at least the opening of the partition wall 23b, the diameter of the rotating disk 16 is made smaller than the diameter of the opening of the partition wall 23b. Further, in order to make the space between the rotating disk 16 and the partition wall 23b as small as possible, the diameter difference therebetween is minimized. Then, the substrate 10 is placed in the first liquid recovery chamber 2.
When the rotary disk 16 is located at the position 4, the rotary disk 16 is disposed at substantially the same height as the inner peripheral edge of the partition wall 23b or at a position higher than the same.

Thus, when the developing solution is supplied from the developing solution supply nozzle 26c to the substrate 10, even if the developing solution discharged from the substrate 10 falls to the front side of the partition wall 23b, the second liquid collecting chamber 25 is directly provided. It does not penetrate and is received by the rotating disk 16. Moreover, since the rotating disk 16 is also rotating together with the substrate 10, the drainage received by the rotating disk 16 is subjected to the action of centrifugal force and scatters from the outer peripheral edge of the rotating disk 16. The outer peripheral edge of the rotating disk 16 is provided with a partition 23 over the entire circumference.
The distance from the rotating disk 16 is equal to the distance to the partition wall 23b, and the scattered effluent from the rotating disk 16 can surely climb over the partition wall 23b even if a slight initial velocity is given to the first liquid collecting chamber. 24. As a result, in the developing solution applying step, almost 100% of the surplus developing solution discharged from the substrate 10 is removed by the first liquid collecting chamber 2.
Collected in 4. Therefore, there is no possibility that the drainage of the developer is mixed into the second liquid recovery chamber 25 for recovering the drainage of the cleaning liquid when the substrate 10 is cleaned, and the separation and recovery of the processing liquid is efficiently performed with extremely high accuracy. As a result, impurities can be easily removed when the processing liquid is reused.

Here, in order to more reliably introduce the drainage from the rotating disk into the first liquid recovery chamber 24, FIG.
As shown in (1), an inclined portion 16a 'is formed by inclining the outer peripheral portion of the rotating disk 16' downward at a predetermined angle. As a result, the processing liquid on the rotating disk 16 ′ is
Since it flows toward the outer peripheral edge while increasing the speed along the inclination of a ', the initial speed at the time of scattering from the rotating disk 16' can be further increased.

The rotating disk 16 is provided for separating and recovering the processing liquid as described above. The rotating disk 16 also functions as a receiving table for the substrate 10. When the substrate 10 is subjected to liquid treatment, the substrate 10 is mounted on the substrate rotating means 11 by an appropriate handling means.
Since the support rod 17 and the pedestal 18 are mounted on the substrate 10, the substrate 10 is supported at a predetermined distance from the rotating disk 16. Accordingly, the arm of the handling means is brought into contact with the back side of the substrate 10, carried into the upper portion of the rotating disk 16, and lowered, whereby the back surface of the substrate 10 is brought into contact with the support rod 17 and the pedestal 18. Let it. Then, when the arm is slightly lowered from the position and pulled out, the mounting of the substrate 10 is performed. Thus, the rotating disk 1
6, the support rod 17 and the pedestal 18 are erected.
The substrate 10 can be transferred in a non-contact state with respect to the surface side, and the surface of the substrate 10 is not stained or damaged.

[0027]

As described above, the present invention relates to a rotating disk having a diameter whose diameter is between the length of the diagonal of the substrate and the diameter of the opening in the housing. When the substrate is mounted in a non-contact state with the disk and the substrate is mounted, and the liquid processing of the substrate is performed, the rotary disk is driven to rotate together with the substrate. Is provided, a predetermined processing liquid is supplied to the substrate, and after being diffused around by centrifugal force due to the rotation of the substrate, the liquid is recovered in the liquid recovery chamber.
This has the effect that the drainage of the processing liquid can be surely separated from other processing liquids and recovered without waste.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a substrate liquid processing apparatus showing an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an explanatory diagram of a configuration of a lifting mechanism of a housing.

FIG. 4 is an operation explanatory view showing a state of collecting a processing liquid.

FIG. 5 is a sectional view of a principal part showing another specific example of the rotating disk.

FIG. 6 is a schematic configuration diagram of a conventional substrate liquid processing apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Substrate 11 Substrate rotation means 12 Rotation axis 16, 16 '
Rotating disk 17 Support rod 18 Pedestal 18a Positioning pin 23 Housing 23a, 23b Partition wall 24 First liquid recovery chamber 25 Second liquid recovery chamber 26 Developer supply means 27 Cleaning liquid supply means

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Isamu Akiha 3-16-3 Higashi, Shibuya-ku, Tokyo Inside Hitachi Electronics Engineering Co., Ltd. (72) Inventor Hiroshi Fukuda 3-3-1-3 Higashi, Shibuya-ku, Tokyo Hitachi Electronics Engineering Co., Ltd.

Claims (5)

[Claims] 1. A substrate rotating means having a substrate supporting portion for horizontally supporting a rectangular substrate on a rotation axis, and at least one substrate on a surface of the substrate rotated by the substrate rotating means.
A nozzle member for supplying a type of processing liquid, a liquid recovery chamber comprising a housing provided to surround the substrate rotating means and having an annular opening having a diameter larger than the length of a diagonal line of the substrate; A rotating disk driven to rotate by a rotating shaft, the rotating disk having a diameter between a diagonal length of the substrate and a diameter of the opening, and the substrate rotating the rotating disk. A substrate liquid processing apparatus characterized in that it is placed above a plate at predetermined intervals. 2. The substrate processing apparatus according to claim 1, wherein the processing liquid supplied to the substrate is at least one of a developing liquid, an etching liquid, a stripping liquid, and a cleaning liquid. 3. The housing is composed of a plurality of partitions in a vertical direction, and a plurality of liquid recovery chambers for individually recovering a plurality of types of processing liquids are formed between each of the partitions, and the rotation shaft or the rotation shaft is formed. 2. The substrate processing apparatus according to claim 1, wherein the housing is configured to be vertically movable and connected to the lifting drive means. 4. The substrate liquid processing apparatus according to claim 1, wherein the nozzle member is capable of swinging at least in a horizontal direction. 5. The substrate processing apparatus according to claim 1, wherein an outer peripheral portion of said rotating disk is inclined downward.