JP2013045877A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve exhaust efficiency and space efficiency, thereby completely preventing mist from sticking to a dry substrate after a draining and drying is performed.SOLUTION: Upper and lower air knives 122U, 122L blow a knife-shaped, sharp high pressure air flow against a substrate G as it passes between them, so that a large amount of mist is generated in a space on the upstream side of the air knives 122U, 122L. Most of the mist generated above the substrate G is drawn into an upper exhaust port 124 together with the air coming in a way around from an FFU 136 on the downstream side through a clearance K and the air getting in from an entrance 118. The mist generated beneath the substrate G is entirely drawn into lower exhaust ports 126, 128 together with the air coming in from the FFU 136 and the air getting in from the entrance 118.

Description

  The present invention relates to a substrate processing apparatus that performs a liquid draining drying process by blowing a gas onto a substrate to be processed, and more particularly to a flat-flow type substrate processing apparatus.

  In recent years, in resist coating and developing systems in flat panel display (FPD) manufacturing, as a cleaning processing method or development processing method that can advantageously cope with an increase in the size of a substrate to be processed (for example, a glass substrate), a transport roller (roller) or a transport belt A so-called flat-flow method is often used in which a cleaning process or a development process is performed while a substrate is transported on a transport path formed by horizontally laying the substrate. Such a flat flow method has advantages such as a simple substrate handling and a configuration of a transport system and a drive system, as compared with a spinner method in which the substrate is rotated.

  A flat-flow cleaning apparatus typically includes a cleaning tool such as a roll brush, a high-pressure jet nozzle, a rinse nozzle, and an air knife along the flat-flow conveyance path, and scrubbing cleaning with a roll brush and high-pressure jet nozzle. After removing the foreign matter and dirt on the surface of the substrate by sequentially performing blow cleaning with, rinse the substrate surface with a rinse liquid from the rinse nozzle, and finally rinsing from the substrate surface by blowing a high-pressure gas flow (usually an air flow) from the air knife. The liquid is removed (drying and drying).

  In addition, a flat-flow type development processing apparatus has long developer nozzles, rinse nozzles, and air knives arranged along a flat-feed conveyance path, and a developer solution from a developer nozzle to a substrate moving on the conveyance path. To supply the developer on the substrate (for example, paddle development), and after a predetermined time has passed, a rinse liquid (generally pure water) is supplied from the rinse nozzle to replace the developer on the substrate with the rinse liquid (development stopped) ) Finally, a high-pressure air stream is blown from the air knife to remove the rinse liquid from the substrate surface (liquid draining drying).

JP 2008-159663 A JP 2003-83675 A

  Conventionally, in the above-described flat-flow type cleaning processing apparatus or development processing apparatus, it has been a problem that mist generated in the chamber diffuses undesirably and adheres to the substrate. In particular, when mist adheres to the surface of a dry substrate immediately after being subjected to a liquid draining and drying treatment by an air knife, spots and residues are generated at the location where the mist is adhered, and in a post-process (resist coating process or etching process). It tends to cause defects.

  In the last-stage liquid-drying section where the air knife is placed, the knife-shaped sharp high-pressure air flow is blown by the air knife so that the liquid on the substrate is swept away from the substrate to the rear end side. Be dropped. At this time, a large amount of mist is generated. Usually, a pair of upper and lower air knives are provided across the flat flow path, and the upper air knife blows a high-pressure air flow onto the front surface (upper surface) of the substrate to generate mist on the substrate, and the lower air knife is the substrate. Mist is also generated under the substrate by blowing a high-pressure air flow on the back surface (lower surface) of the substrate.

  The upstream and downstream spaces of both air knives except for the passage (conveyance path) of the substrate, so that the mist standing above and below the substrate does not enter the rear or downstream side of both air knives. It is also done to completely block the wall with a partition wall. In this case, in the upstream space, a ventilation fan is attached to the ceiling of the processing chamber, and the upper exhaust port for removing the mist generated on the substrate is provided at a location higher than the conveying path. A lower exhaust port for removing the mist generated under the substrate is provided at a location that is flat and lower than the transport path. However, in such an exhaust mechanism, the downflow airflow from the blower interferes with the high-pressure airflow discharged by the air knife, so that it is difficult to turn under the substrate and the efficiency of the lower exhaust is not good. On the other hand, since the downflow airflow from the blower also interferes with the mist-containing exhaustflow sucked into the upper exhaust port, the efficiency of the upper exhaust is not so good. When the exhaust efficiency is low in the upstream space in this way, mist accumulates, and it is easy to enter or diffuse to the rear (downstream side) through the substrate passage between the two air knives.

  Conventionally, a lower exhaust port is provided at the bottom of the processing chamber, and the collective exhaust pipe is wound around the processing chamber. For this reason, there is a problem that utility equipment such as a power system and a gas system installed under the processing chamber and a control system facility are limited in space by the exhaust system. Further, conventionally, when an upper exhaust port is provided in the front wall of the processing chamber, an outdoor exhaust pipe for connecting the upper exhaust port to an exhaust device installed on the rear side of the processing chamber is under the processing chamber. Therefore, in addition to squeezing the space for utility equipment and control equipment in the same manner as described above, mist tends to liquefy and accumulate in the portion under the processing chamber of the outdoor exhaust pipe, and it is not easy to drain this drainage liquid. There was also a problem.

  The present invention solves the problems of the prior art as described above, improves exhaust efficiency and space efficiency, and fully prevents mist from adhering to a dry substrate immediately after liquid draining and drying. A substrate processing apparatus is provided.

  The substrate processing apparatus of the present invention accommodates a flat flow transport path for transporting a substrate to be processed in a horizontal first direction and a first section of the flat flow transport path, and the flat flow transport. A first processing chamber having an inlet and an outlet through which the substrate transported on the path can pass; and a liquid in the processing chamber in a direction opposite to the transport direction obliquely with respect to the substrate from above and below the flat flow transport path. Upper and lower air knives for blowing gas for cutting and drying, an air blower for supplying air into the first processing chamber on the downstream side in the transport direction from the upper and lower air knives, and lower than the discharge port of the lower air knife An exhaust chamber with a top plate provided in the first processing chamber at a position; a lower exhaust port provided on a side surface facing the inlet of the exhaust chamber; and an exhaust unit connected to the exhaust chamber.

  In the above apparatus configuration, the upper and lower air knives blow a knife-like sharp high-pressure air flow against the substrate passing between them, so that the liquid on the substrate is swept toward the rear end side of the substrate. Will be swept out of the board. At this time, mist is generated in the space upstream of both air knives. These mists enter the air sent from the blower or the inlet, are sucked into the lower exhaust port together with the air, and are sent to the exhaust part through the exhaust chamber. The top plate of the exhaust chamber not only closes the upper surface of the exhaust chamber, but also acts to guide the air flow from the blower toward the lower exhaust port. By selecting an appropriate distance interval (gap) between the lower air knife and the top plate of the exhaust chamber, it is possible to achieve both the exhaust speed or the exhaust efficiency and the mist diffusion (adhesion) prevention effect.

  In the above apparatus configuration, since the lower exhaust system for exhausting the lower space of the processing chamber is provided as an exhaust chamber in the processing chamber, utility equipment and control equipment installed under the processing chamber are provided. Space can be saved and the space efficiency of the apparatus can be improved.

  According to the substrate processing apparatus of the present invention, the exhaust gas efficiency and the space efficiency can be improved and the mist can be sufficiently prevented from adhering to the dry substrate immediately after the liquid draining and drying by the configuration and operation as described above. it can.

It is a top view which shows the coating and developing treatment system which can apply the substrate processing apparatus of this invention. It is a schematic sectional drawing which shows the whole structure of the washing | cleaning unit by one Embodiment contained in the said application | coating development system. It is a block diagram which shows the structure of the drying part with which the chamber for liquid removal drying (liquid removal drying chamber) of the said washing | cleaning unit is equipped. It is a perspective view which shows the effect | action of the air knife provided in the said chamber for liquid draining drying (liquid draining drying chamber). It is a perspective view which shows the external structure of the said chamber for liquid draining drying (liquid draining drying chamber). It is a perspective view which shows the structure inside the said chamber for liquid drainage drying (liquid draining drying chamber). It is a perspective view which shows the structure of the exhaust chamber provided in the room | chamber interior of the said chamber for liquid draining drying (liquid draining drying chamber). It is a cross-sectional view which shows the effect | action of the said exhaust chamber. It is a top view which shows the structure (layout) of the principal part in the said chamber for liquid draining (liquid draining drying chamber). It is a longitudinal cross-sectional view which shows the effect | action of the principal part in the said chamber for liquid draining drying (liquid draining drying chamber). It is a figure which shows one modification regarding the position of the exhaust chamber (especially top-plate edge) in the said chamber for liquid draining (liquid draining drying chamber). It is a figure which shows one modification regarding the position of the said exhaust chamber (especially top plate edge). It is a figure which shows the reference example regarding the position of the said exhaust chamber (especially top plate edge). It is a figure which shows one modification which makes the top-plate edge of the said exhaust chamber protrude in bowl shape. It is a figure which shows the one modification which gives the inclination to the top plate of the said exhaust chamber. It is a figure which shows one modification regarding the layout of the top-plate edge of the said exhaust chamber.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing treatment system as one configuration example to which the substrate processing apparatus of the present invention can be applied. This coating and developing processing system 10 is installed in a clean room, for example, using a glass substrate as a substrate to be processed, and performing a series of processing such as cleaning, resist coating, pre-baking, developing and post-baking in the photolithography process in the LCD manufacturing process. Is what you do. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and arranges up to four cassettes C that can accommodate a plurality of substrates C in a horizontal direction (Y direction) by stacking substrates G in multiple stages. A cassette stage 20 that can be placed, and a transport mechanism 22 that takes in and out the substrate G to and from the cassette C on the stage 20 are provided. The transport mechanism 22 has a transport arm 22a that can hold the substrate G in units of one sheet, can be operated with four axes of X, Y, Z, and θ, and is adjacent to the adjacent process station (P / S) 16 side and the substrate. G can be delivered.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or the process on a pair of parallel and opposite lines A and B extending in the horizontal system longitudinal direction (X direction).

  More specifically, the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side includes a carry-in unit (IN PASS) 24, a cleaning process unit 26, a first The thermal processing section 28, the coating process section 30, and the second thermal processing section 32 are arranged in a line in this order from the upstream side along the first substrate transfer line 34.

  More specifically, the carry-in unit (IN PASS) 24 receives an unprocessed substrate G from the transfer mechanism 22 of the cassette station (C / S) 14 and inputs it into the first substrate transfer line 34 with a predetermined tact. It is configured. The cleaning process unit 26 includes an excimer UV irradiation unit (E-UV) 36 and a cleaning unit (SCR) 38 in order from the upstream side along the first substrate transfer line 34. The first thermal processing unit 28 includes an adhesion unit (AD) 40 and a cooling unit (COL) 42 in order from the upstream side. The coating process unit 30 is provided with a resist coating unit (COT) 44 and a vacuum drying unit (VD) 46 in order from the upstream side. The second thermal processing unit 32 includes a pre-bake unit (PRE-BAKE) 48 and a cooling unit (COL) 50 in order from the upstream side. A pass unit (PASS) 52 is provided at the end point of the first substrate transfer line 34 located on the downstream side of the second thermal processing unit 32. The substrate G which has been transported in a flat flow on the first substrate transport line 34 is delivered from the pass unit (PASS) 52 at the end point to the interface station (I / F) 18.

  On the other hand, in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, a development unit (DEV) 54, a post-bake unit (POST-BAKE) 56, a cooling unit are provided. The unit (COL) 58, the inspection unit (AP) 60, and the carry-out unit (OUT-PASS) 62 are arranged in a line in this order from the upstream side along the second substrate transfer line 64. Here, the post-bake unit (POST-BAKE) 56 and the cooling unit (COL) 58 constitute a third thermal processing unit 66. The carry-out unit (OUT PASS) 62 is configured to receive the processed substrates G one by one from the second substrate transfer line 64 and pass them to the transfer mechanism 22 of the cassette station (C / S) 14.

  An auxiliary transfer space 68 is provided between the process lines A and B, and a shuttle 70 capable of placing the substrate G horizontally in units of one sheet is both in the process line direction (X direction) by a drive mechanism (not shown). You can move in the direction.

  The interface station (I / F) 18 includes a transfer device 72 for exchanging the substrate G with the first and second substrate transfer lines 34 and 64 and the adjacent exposure device 12. A rotary stage (R / S) 74 and a peripheral device 76 are arranged around the periphery. The rotary stage (R / S) 74 is a stage that rotates the substrate G in a horizontal plane, and is used to change the orientation of the rectangular substrate G when it is transferred to the exposure apparatus 12. The peripheral device 76 connects, for example, a titler (TITLER), a peripheral exposure device (EE), and the like to the second flat flow path 64.

  Here, the processing procedure of all the steps for one substrate G in the coating and developing processing system will be described. First, in the cassette station (C / S) 14, the transport mechanism 22 takes out one substrate G from any one of the cassettes C on the stage 20, and removes the taken substrate G in the process station (P / S) 16. Carry into the carry-in unit (IN PASS) 24 on the process line A side. The substrate G is transferred or loaded onto the first substrate transport line 34 from the carry-in unit (IN PASS) 24.

  The substrate G put into the first substrate transfer line 34 is first subjected to a dry cleaning process and a wet cleaning process sequentially by the excimer UV irradiation unit (E-UV) 36 and the cleaning unit (SCR) 38 in the cleaning process unit 26. The The excimer UV irradiation unit (E-UV) 36 irradiates the substrate G with ultraviolet rays to mainly remove organic substances on the surface of the substrate. The cleaning unit (SCR) 38 removes particulate contamination from the substrate surface by performing brushing cleaning and blow cleaning on the substrate G moving horizontally on the first substrate transport line 34, and then rinsing. Processing is performed, and finally the substrate G is dried using an air knife or the like. When a series of cleaning processes in the cleaning unit (SCR) 38 is completed, the substrate G passes through the first thermal processing unit 28 down the first substrate transfer line 34 as it is.

  In the first thermal processing unit 28, the substrate G is first subjected to an adhesion process using vapor HMDS in the adhesion unit (AD) 40, and the surface to be processed is hydrophobized. After the completion of the adhesion process, the substrate G is cooled to a predetermined substrate temperature by a cooling unit (COL) 42. Thereafter, the substrate G is carried into the coating process unit 30 along the first flat flow path 34.

  In the coating process section 30, the substrate G is first coated with a resist solution on the upper surface (surface to be processed) by a spinless method using a slit nozzle while being flown flat in a resist coating unit (COT) 44, and immediately after that, adjacent to the downstream side. A vacuum drying unit (VD) 46 receives a vacuum drying process.

  The substrate G exiting the coating process unit 30 passes through the second thermal processing unit 32 along the first substrate transfer line 34. In the second thermal processing unit 32, the substrate G is first subjected to pre-baking by a pre-bake unit (PRE-BAKE) 48 as a heat treatment after resist coating or a heat treatment before exposure. By this pre-baking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by a cooling unit (COL) 50. Thereafter, the substrate G is taken from the pass unit (PASS) 52 at the end point of the first substrate transfer line 34 to the transfer device 72 of the interface station (I / F) 18.

  In the interface station (I / F) 18, the substrate G is subjected to, for example, a 90-degree direction change by the rotary stage 74 and then carried into the peripheral exposure device (EE) of the peripheral device 76, where it adheres to the peripheral portion of the substrate G. After receiving the exposure for removing the resist to be developed, the resist is sent to the adjacent exposure apparatus 12.

  In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18, first, it is carried into a titler (TITLER) of the peripheral device 76, where it is transferred to a predetermined portion on the substrate. Is recorded. Thereafter, the substrate G is transferred from the transfer device 72 to the starting point of the developing unit (DEV) 54 of the second substrate transfer line 64 laid on the process line B side of the process station (P / S) 16.

  In this way, the substrate G is now transported on the second substrate transport line 64 toward the downstream side of the process line B. In the first development unit (DEV) 54, the substrate G is subjected to a series of development processes of development, rinsing and drying while being transported in a flat flow.

  The substrate G that has undergone a series of development processing in the development unit (DEV) 54 is sequentially passed through the third thermal processing unit 66 and the inspection unit (AP) 60 while being placed on the second substrate transport line 64 as it is. . In the third thermal processing section 66, the substrate G is first subjected to post-baking as a heat treatment after development processing by a post-bake unit (POST-BAKE) 56. By this post-baking, the developing solution and the cleaning solution remaining in the resist film on the substrate G are removed by evaporation, and the adhesion of the resist pattern to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by a cooling unit (COL) 58. In the inspection unit (AP) 60, the resist pattern on the substrate G is subjected to non-contact line width inspection, film quality / film thickness inspection, and the like.

  The carry-out unit (OUT PASS) 62 receives the substrate G that has been processed in all steps from the second substrate transfer line 64 and transfers it to the transfer mechanism 22 of the cassette station (C / S) 14. On the cassette station (C / S) 14 side, the transport mechanism 22 stores the processed substrate G received from the carry-out unit (OUT PASS) 62 in any one (usually the original) cassette C.

  In the coating and developing processing system 10, the present invention can be applied to a flat-flow cleaning unit (SCR) 38. Hereinafter, the configuration and operation of the cleaning unit (SCR) 38 in one embodiment of the present invention will be described.

  FIG. 2 shows the overall configuration of the cleaning unit (SCR) 38. The cleaning unit (SCR) 38 has two chambers 80 and 82 arranged side by side on the process line A (FIG. 1). A roller transport path 84 that cuts through both chambers 80 and 82 constitutes a section of the first substrate transport line 34 (FIG. 1).

  The upstream cleaning chamber 80 is divided into three processing chambers, that is, a brushing cleaning chamber R1, a blow cleaning chamber R2, and a rinse chamber R3, by two partition walls 86 and 88 provided therein. In the outer walls 80a and 80b of the chamber 80 and both partition walls 86 and 88 facing the transport direction (X direction), slit-shaped openings (substrate entrances) 90, 92, 94, through which the substrate G moving on the roller transport path 84 passes. 96 are formed. Here, the opening 90 is an entrance of the brushing cleaning chamber R1. The opening 92 is an outlet of the brushing cleaning chamber R1 and also an inlet of the blow cleaning chamber R2. The opening 94 is an outlet of the blow cleaning chamber R2, and is also an inlet of the rinse chamber R3. The opening 96 is an outlet of the rinse chamber R3.

  In the brushing cleaning chamber R1, prewetting spray nozzles 98U / 98L, roll brushes 100U / 100L, and rinsing spray nozzles 102U / 102L are arranged on the upper and lower sides along the roller conveyance path 84. The prewetting spray nozzle 98U / 98L is a long type that covers the substrate G from end to end in the width direction (Y direction), and sprays the chemical solution sent from the chemical solution supply unit (not shown). It is supposed to be injected into. The roll brushes 100U and 100L have a length that covers the substrate G from end to end in the width direction, and are rotationally driven by a brush drive unit (not shown) such as a motor. The spray nozzles 102U / 102L for rinsing are long types that cover the substrate G from end to end in the width direction, and spray the rinse liquid sent from the rinse liquid supply unit (not shown) in a spray form. It is like that.

  In the brushing cleaning chamber R1, one or a plurality of exhaust ports 104 are provided on the upper part of the wall on the back side of the chamber (the wall on the auxiliary transfer space 68 in FIG. 1), and the drain port 103 is provided on the bottom. Yes. The exhaust port 104 is connected to an exhaust unit 140 (FIG. 3) described later. The drain port 103 communicates with a drain tank (not shown).

  In the blow cleaning chamber R2, high-pressure two-fluid nozzles 105U / 105L are arranged on both upper and lower sides of the roller conveyance path 84. These two-fluid nozzles 105U / 105L are long types that cover the width size of the substrate G, and are supplied from a cleaning liquid supplied from a cleaning liquid supply unit (not shown) and a high-pressure gas supply unit (not shown). The resulting high-pressure gas is mixed, and granular droplets are jetted or sprayed.

  The blow cleaning chamber R2 is also provided with one or more exhaust ports 106 at the top of the wall on the back side of the chamber and a drain port 110 at the bottom. The exhaust port 106 is connected to the exhaust part 140 (FIG. 3). The drain port 110 communicates with a drain tank (not shown).

  In the rinse chamber R3, a plurality of rinse nozzles 112U / 112L are arranged at appropriate intervals on the upper and lower sides of the roller conveyance path 84. These rinse nozzles 112U / 112L are long types that cover the width size of the substrate G, and spray the rinse liquid sent from the rinse liquid supply unit (not shown) in a spray form. .

  Also in the rinsing chamber R3, one (or a plurality) of exhaust ports 114 are provided at the top of the wall on the back side of the chamber, and a drain port 116 is provided at the bottom. The exhaust port 114 is connected to the exhaust part 140 (FIG. 3). The drain port 116 communicates with a drain tank (not shown).

  The downstream chamber 82 is a dedicated liquid draining and drying chamber R4. Slit-like openings 118 and 120 through which the substrate G moving on the roller conveyance path 84 passes are formed in the outer walls 82a and 82b of the chamber 82 facing the conveyance direction (X direction), respectively. Here, the opening 118 is an inlet and the opening 120 is an outlet.

  Upper and lower air knives 122U and 122L are arranged in the liquid draining drying chamber R4 obliquely with respect to the transport direction (X direction) with the roller transport path 84 interposed therebetween. Both air knives 122U and 122L have a length that covers the width size of the substrate G, and the respective discharge ports are directed toward the intermediate direction between the inlet 118 side and the front side of the liquid draining drying chamber R4, and the drying gas A high-pressure gas (usually air, in some cases nitrogen gas) for draining and drying sent from a supply unit (not shown) is jetted with a sharp knife-like airflow.

  In the liquid draining / drying chamber R4, one (or a plurality of) upper exhaust ports 124 are provided in the upper part of the wall 82f on the front side of the chamber, and a plurality of lower exhaust ports 126 and 128 are provided in the bottom of the room. . The lower exhaust ports 126 and 128 are respectively connected to exhaust ports 130 and 132 provided at the lower portion of the wall 82r on the rear side of the chamber via an exhaust chamber 160 (FIGS. 6 and 7) described later. The upper exhaust port 124 is an exhaust port provided at the lower part of the wall 82r on the rear side of the chamber via a local exhaust duct (exhaust pipe) 162 (FIG. 5) and an exhaust chamber 160 (FIGS. 6 and 7) described later. 134. The exhaust ports 130, 132, and 134 are arranged in a horizontal row in a lower portion near the outlet 120 of the wall 82 r on the back side of the chamber.

  In the liquid draining / drying chamber R4, an FFU (fan filter unit) 136 is installed on the ceiling behind or downstream of the air knives 122U and 122L. The FFU 136 includes a fan that draws outdoor air and a filter that removes dust in the air, and supplies clean air into the room by downflow.

  A plurality of drain ports 138A and 138B are provided at the bottom of the liquid draining drying chamber R4. These drain ports 138A and 138B also communicate with a drain tank (not shown).

  In the roller conveyance path 84, conveyance rollers or rollers 85 having a length that covers the width size of the substrate G are laid at regular intervals in the conveyance direction (X direction). In this embodiment, the roller 85 is accommodated in the chambers 80 and 82 and is rotationally driven via a transmission mechanism by a conveyance drive source disposed outside the chambers 80 and 82.

  The upper surfaces of the chambers 80 and 82 are hermetically covered, for example, by a plurality of opening / closing covers (top plates) arranged for each processing chamber or in a fixed size in the transport direction (X direction). When an operator accesses the cleaning tool inside for repair or replacement of parts, the opening / closing cover at each maintenance position can be opened.

  FIG. 3 shows a configuration of the exhaust unit 140 provided in the cleaning unit (SCR) 38. The exhaust unit 140 has, for example, an exhaust blower 142 as a negative pressure generation source, and the inlet side of the exhaust blower 142 is connected to each of the cleaning units (SCR) 38 via the main exhaust pipe 144 and the branch exhaust pipe 146. The exhaust ports 104, 106, 114, 130, 132, 134 are connected. In the middle of each branch exhaust pipe 146, gas-liquid separators 148 and 150 for separating mist from exhaust gas and an exhaust damper 152 for adjusting the exhaust flow rate are provided. The outlet side of the exhaust blower 142 is connected to the factory exhaust duct 154.

  A gas-liquid separator 148 provided at the lower part or the bottom part of the chamber 80 is disposed outside the corresponding exhaust ports 104, 106, 114, and drains the exhaust liquid separated from the mist mixed exhaust gas (see FIG. Flow to the drain tank. On the other hand, the gas-liquid separator 150 provided at the bottom or bottom of the chamber 82 is integrated with each corresponding exhaust port 130, 132, 134, and the waste liquid separated from the exhaust gas mixed with mist is removed from the chamber 82 (liquid draining and drying). It is dropped to the bottom (pan) in the chamber R4) and sent to the drain tank via the drain port 138B.

  The exhaust unit 140 is provided on the back side (rear side) of the cleaning unit (SCR) 38. Although not shown, an operation panel and monitor devices (not shown) are provided on the front side (front panel) of the cleaning unit (SCR) 38.

  Here, the overall operation and action of the cleaning unit (SCR) 38 will be described. As described above, the substrate G introduced into the cleaning process section 26 (FIG. 1) from the cassette station (C / S) 14 is first subjected to ultraviolet irradiation processing by the excimer UV irradiation unit (E-UV) 36 (FIG. 1). In response, organic contaminants on the substrate surface are removed, and then moved in a flat flow on the roller transport path 84 and carried into the brushing cleaning chamber R1 of the cleaning unit (SCR) 38 from the inlet 90.

  In the brushing cleaning chamber R1, the substrate G is first sprayed with, for example, an acid or alkaline chemical solution over the entire substrate by the upper and lower spray nozzles 98U and 98L for prewetting. Next, the substrate G passes through the upper and lower roll brushes 100U, 100L while rubbing sequentially. Both roll brushes 100U and 100L rotate in a direction opposite to the conveying direction by the rotational driving force of the brush drive unit, and scrape off foreign matters (dust, debris, contaminants, etc.) on the substrate surface. Immediately after that, the upper and lower spray nozzles 102U and 102L for rinsing spray a rinse liquid such as pure water on the substrate G to wash away foreign substances floating on the substrate. The liquid (chemical liquid, rinse liquid, etc.) that has dropped from the substrate G to the bottom in the brushing cleaning chamber R 1 is discharged from the drain port 103.

  Immediately after passing through the spray nozzles 102U and 102L for rinsing, the substrate G enters the blow cleaning chamber R2 through the substrate entrance 92 of the partition wall 86. In the blow cleaning chamber R2, the upper and lower two fluid nozzles 105U and 105L mix the cleaning liquid with a high-pressure gas (for example, air) in the nozzles to generate granular droplets. A high-pressure jet stream or spray is sprayed toward the front surface (upper surface) and back surface (lower surface). Thus, when the liquid droplets collide with the surface of the substrate G, the foreign matters remaining on the substrate surface are completely removed. The liquid (cleaning liquid or the like) that has dropped from the substrate G to the bottom in the blow cleaning chamber R 2 is discharged from the drain port 110.

  Subsequent to the blow cleaning chamber R2, the substrate G passes through the rinsing chamber R3. In the rinse chamber R 3, the upper and lower rinse nozzles 112 U and 112 L spray a rinse liquid, for example, pure water, onto the substrate G on the roller conveyance path 84. As a result, the liquid on the substrate G brought in from the blow cleaning chamber R2 (liquid in which foreign matter is floating) is replaced with the rinse liquid. The liquid (cleaning liquid, rinsing liquid, etc.) dropped from the substrate G to the bottom in the rinsing chamber R3 is discharged from the drain port 116.

  The substrate G exits the rinsing chamber R3 and simultaneously enters the adjacent liquid draining and drying chamber R4. In the liquid draining / drying chamber R4, the upper and lower air knives 122U and 122L impinge a knife-like sharp high-pressure gas flow, for example, an air flow, in a direction diagonally opposite to the transport direction against the substrate G on the roller transport path 84 (see FIG. 4). As a result, the liquid (mostly rinse liquid) S attached to the substrate G is wiped off by the high-pressure airflow of wind, and the liquid that has fallen to the bottom of the liquid draining drying chamber R4 is discharged from the drain port 138A. Thus, the surface of the substrate G passing between the upper and lower air knives 122U and 122L becomes dry.

  The substrate G that has exited the outlet 120 of the liquid drying / drying chamber R4 moves as it flows through the roller transport path 84 and enters the first thermal processing section 28 (FIG. 1).

  In the cleaning unit (SCR) 38 of this embodiment, when a series of cleaning processes as described above are performed, mist is generated in each of the processing chambers R1 to R4, and most of them are exhaust ports on the back side of the chamber. 104, 106, 114, and 130 to 134 are collected into the exhaust section 140. However, if there is a place where exhaust is not sufficient, mist may adhere there. Among these, since the substrate G is wet in the processing chambers R1 to R3, even if mist adheres to the surface of the substrate, if it is small, spots and residues are hardly generated. However, in the final processing chamber, that is, the liquid draining / drying chamber R4, the surface of the substrate G becomes dry when it passes through both the air knives 122U and 122L. Is very likely to occur.

  In this embodiment, an exhaust mechanism as will be described in detail below is provided in the chamber 82 (liquid draining / drying chamber R4) to improve the exhaust efficiency and space efficiency of the liquid draining / drying chamber R4, and both air knives 122U and 122L. The mist is sufficiently prevented from adhering to the dry substrate immediately after passing through the substrate, and the yield of the entire cleaning process is improved.

  Hereinafter, the configuration and operation of the exhaust mechanism provided in the liquid draining / drying chamber R4 of the chamber 82 in this embodiment will be described in detail with reference to FIGS.

  FIG. 5 shows an external structure of the chamber 82 (liquid draining / drying chamber R4), and FIG. 6 shows an internal configuration of the chamber 82. As shown in FIG. In FIG. 6, the air knives 122U and 122L (FIGS. 2 and 4), the roller conveyance path 84 (FIG. 2), and the upper partition wall 180 (FIG. 10) are not shown in order to facilitate the illustration of the exhaust chamber 160. doing.

  5 and 6, the wall 82f on the front side of the chamber 82 is provided with an upper exhaust port 124 at a position higher than the upper air knife 122U near the inlet 118, and closer to the outlet 120 than the lower air knife 122L. A lower connection port 164 is provided at a low position. The upper exhaust port 124 is connected to the lower connection port 164 via a local exhaust duct 162 extending in an L shape along the edge of the wall 82f outside the wall 82f.

  A triangular corner plate 166 is slanted at the corner of the bottom of the chamber 82 (liquid draining / drying chamber R4) located almost directly below the upper exhaust port 124 so as to cover the corner of the corner spatially. It is leaned against. The corner plate 166 has a function of preventing mist from staying at the corners. Instead of the corner plate 166, a triangular pyramid-shaped retention preventing member may be disposed so as to spatially fill the corners. The lower connection port 164 is located at one end of the exhaust chamber 160 and faces the exhaust port 134 on the rear side of the chamber.

  As shown in FIGS. 7 and 8, the exhaust chamber 160 includes a part of a wall 82r on the rear side of the chamber where the exhaust ports 130, 132, and 134 are collectively arranged, and a wall 82f on the front side of the chamber 82 that faces the chamber 82r. , A part of the wall 82b on the chamber outlet side sandwiched between the rear and front walls 82r and 82f, a side wall plate 168, and two partition plates 170 and 172. . The exhaust chamber 160 has a top plate 174 (FIG. 10).

  The side wall plate 168 is disposed obliquely with respect to the transport direction (X direction) so as to extend along the air knives 122U and 122L between the wall 82f on the front side of the chamber and the wall 82r on the back side of the chamber. Has been. The side wall plate 168, the chamber front wall 82f, the chamber back wall 82r, and the chamber outlet wall 82b form a trapezoidal shape in plan view. The lower end or lower side of the side wall plate 168 is in contact with the bottom of the chamber 82 (liquid draining / drying chamber R4), and the upper end or upper side thereof is connected to the edge 174e (FIG. 10) of the top plate 174.

  A plurality of, for example, four openings are formed in the side wall plate 168 at an appropriate interval. Of these four openings, two near the back of the chamber are the first exhaust ports 126, and two near the front of the chamber are the second exhaust ports 128.

  The two partition plates 170, 172 divide or partition the interior of the exhaust chamber 160 into three exhaust spaces M1, M2, M3. More specifically, the first partition plate 170 extends straight from the middle between the exhaust ports 130 and 132 (the wall 82r on the rear surface side of the chamber) to the wall 82f on the front surface side of the chamber facing the first partition plate 170 at an intermediate position. The bent portion 170a is bent in the direction opposite to the conveying direction (X direction) and the tip of the bent portion 170a contacts the side wall plate 168. A first exhaust space M1 and a second exhaust space M2 are defined by using the first partition plate 170 as a partition wall. Here, the first exhaust space M1 extends between the first lower exhaust port 126 formed in the side wall plate 168 and the exhaust port 130 provided in the wall 82r on the back side of the chamber. Yes. The second exhaust space M2 extends between the second lower exhaust port 128 formed in the side wall plate 168 and the exhaust port 132 provided in the wall 82r on the back side of the chamber. .

  Further, the second partition plate 172 extends straight from the space between the exhaust ports 132 and 134 (the wall 82r on the chamber rear surface side) toward the wall 82f on the front side of the chamber facing the second partition plate 172, and the tip thereof is a wall on the front side of the chamber. It abuts on 82f. The second partition plate 172 defines a third exhaust space M3 that is separated from the second exhaust space M2. The third exhaust space M3 connects the lower connection port 164 provided in the wall 82f on the front side of the chamber and the exhaust port 134 provided on the wall 82r on the back side of the chamber.

  As shown in FIG. 8, in the chamber 82 (liquid draining / drying chamber R4), more precisely, the mist mixed into the first exhaust space M1 from the first lower exhaust port 126 on the upstream side of the lower air knife 122L. The exhaust gas flows through the first exhaust space M1 toward the exhaust port 130 on the rear side of the chamber, and is exhausted from the exhaust port 130 to the exhaust unit 140 outside. The exhaust gas mixed with mist that has entered the second exhaust space M2 from the second lower exhaust port 128 flows through the second exhaust space M2 toward the exhaust port 132 on the rear side of the chamber, and is discharged from the exhaust port 132. Are discharged to the exhaust part 140. The exhaust flow rates of both the exhaust ports 130 and 132 can be individually controlled through the respective exhaust dampers 152, and the balance of the exhaust capacity (negative pressure suction force) of the first and second lower exhaust ports 126 and 128 is arbitrarily adjusted. can do.

  On the other hand, the mist mixed exhaust gas that has entered the third exhaust space M3 from the lower connection port 164 through the local exhaust duct 162 (FIG. 5) from the upper exhaust port 124 flows toward the exhaust port 134 on the rear side of the chamber. 3 is exhausted from the exhaust port 134 to the exhaust part 140. The exhaust flow rate of the exhaust port 134 and the exhaust flow rate of the upper exhaust port 124 can also be arbitrarily adjusted through the individual exhaust dampers 152.

  The exhaust ports 130, 132, and 134 are provided in a cylindrical socket 175 that is attached through the wall 82r on the rear side of the chamber. Each socket 175 contains a gas-liquid separator 150 (FIG. 3), and the drainage from the gas-liquid separator 150 flows down from the port of the socket 175 to the bottom of the exhaust chamber 160 and enters a nearby drain port 138B. It has come to be collected.

  FIG. 10 shows the configuration and operation of the main part in the chamber 82 (liquid draining / drying chamber R4). FIG. 10 is a cross-sectional view taken along the line AA in FIG. 9 (plan view).

  As shown in the figure, an upper partition wall 180 is provided that hangs down from the ceiling of the chamber 82 (liquid draining drying chamber R4) to the upper air knife 122U. The upper partition 180 substantially completely blocks the space upstream from the upper air knife 122U and the space downstream from the upper air knife 122U on the substrate G (roller transport path 84).

  On the other hand, the exhaust chamber 160 extends from directly below the lower air knife 122L (to the wall 82b on the chamber outlet side), and there is a gap K between the lower end of the lower air knife 122L and the top plate 174 of the exhaust chamber 160. It is formed. The space on the upstream side and the space on the downstream side of the air knives 122U and 122L communicate with each other through the gap K.

  In the downstream space of the air knives 122L and 122U, the air supplied by the down flow from the FFU 136 on the ceiling, when the substrate G does not pass directly below, directly goes down and hits the top plate 174 of the exhaust chamber 160, It flows upstream along 174, passes through the gap K, and is sucked into the lower exhaust ports 126 and 128. Further, the downflow air from the FFU 136 passes through the gap between the left and right ends of the substrate G and the walls 82f and 82r on the front and rear sides of the chamber G when the substrate G passes under the air. Then, it flows upstream along the top plate 174 of the exhaust chamber 160, passes through the gap K, and is sucked into the lower exhaust ports 126 and 128.

  On the other hand, a part of the air supplied from the FFU 136 in the down flow goes out of the chamber 82 (liquid draining drying chamber R4) from the outlet 120. In particular, when the substrate G is moving in a flat flow directly under the FFU 136, most of the air that hits the upper surface of the substrate G from above goes out of the outlet 120 together with the substrate G. However, it does not adversely affect the upper surface (front surface) of the substrate G (especially mist adhesion).

  When the liquid draining / drying process is performed in the chamber 82 (liquid draining / drying chamber R4), as shown in FIG. 4, the upper and lower air knives 122U and 122L are knife-shaped with respect to the substrate G passing between them. By spraying a sharp high-pressure air flow, the liquid on the substrate G is swept toward the rear end side of the substrate, and is finally wiped out of the substrate G. At this time, a large amount of mist is generated in the space upstream of the air knives 122U and 122L. That is, when the upper air knife 122U blows a high-pressure air flow on the front surface (upper surface) of the substrate G, mist is generated on the substrate G, and the lower air knife 122L generates a high-pressure air flow on the back surface (lower surface) of the substrate G. By spraying, mist is also generated under the substrate G.

  Most of the mist generated on the substrate G is sucked into the upper exhaust port 124. The mist mixed air sucked into the upper exhaust port 124 passes through the local exhaust duct 162 outside the chamber 10 and enters the third exhaust space M3 of the exhaust chamber 160 from the lower connection port 164, and enters the third exhaust space M3. Through the exhaust port 134 and discharged to the exhaust part 140. A part of the mist generated on the substrate G passes through the gap between the left and right ends of the substrate G and the walls 82f and 82r on the front and back sides of the chamber, and then the mist generated under the substrate G. And the like are sucked into the lower exhaust ports 126 and 128 together.

  The mist generated under the substrate G is all sucked into the lower exhaust ports 126 and 128 together with the air coming from the FFU 136 and the air entering from the inlet 118. The mist mixed air sucked into the lower exhaust ports 126 and 128 passes through the first and second exhaust spaces M 1 and M 2 in the exhaust chamber 160 and is discharged from the exhaust ports 130 and 132 to the exhaust unit 140.

  Further, part of the mist drifting in the upstream space of the air knives 122U and 122L until the trailing edge of the substrate G passes between the air knives 122U and 122L and the subsequent substrate G enters from the inlet 118 is The air is sucked into the lower exhaust ports 126 and 128, and the rest is sucked into the upper exhaust port 124.

  Thus, in the chamber 82 (liquid draining / drying chamber R4), all or most of the mist generated by the liquid draining / drying process in the space upstream of the air knives 122U and 122L is the upper exhaust port 124 or the lower exhaust port. 126 and 128 are sucked. In the gap K between the lower end of the lower air knife 122L and the top plate 174 of the exhaust chamber 160, an air flow of high pressure flows from the FFU 136 on the downstream upper side toward the lower exhaust ports 126 and 128 on the upstream bottom. . The mist in the upstream space does not pass through the gap K against the air flow, that is, does not enter or enter the downstream space. Moreover, since mist does not accumulate in the upstream space, as long as the air knives 122U and 122L continue to eject high pressure air, the mist does not pass through the gap therebetween and diffuse into the upstream space.

  Therefore, the mist does not float in the downstream space of the air knives 122U and 122L, and the mist does not adhere to the surface (particularly the front surface) of the dry substrate G immediately after passing through the air knives 122U and 122L. . As a result, the substrate G can be sent to a subsequent process (particularly a resist coating process) without a stain, and the yield of the cleaning process can be improved.

  In this embodiment, a lower exhaust system that exhausts the lower space of the chamber 82 (liquid draining / drying chamber R 4) is provided as the exhaust chamber 160 in the chamber 82. There is no pressure on the space for utility equipment and control equipment (not shown). Further, an upper exhaust system for exhausting the upper space of the chamber 82 (liquid draining drying chamber R4) is also connected to the exhaust port 134 on the rear side of the chamber through the exhaust chamber 160 in the chamber 82. There is no pressure on the control equipment space. Thereby, the space efficiency of the apparatus can be improved.

  In the present invention, it is formed between the lower end of the lower air knife 122L and the top plate 174 of the exhaust chamber 160 in order to prevent the mist from re-adhering to the dry substrate G immediately after the liquid draining treatment. The action of the gap K is important in combination with the action of the FFU 136 installed on the ceiling on the downstream side. By selecting a suitable distance (gap K) between the lower air knife 122L and the top plate 174 of the exhaust chamber 160, it is possible to achieve both the exhaust speed or the exhaust efficiency and the mist diffusion (adhesion) prevention effect.

In this embodiment, as shown in FIGS. 9 and 10, the edge 174e of the top plate 174 or the side wall plate 168 of the exhaust chamber 160 extends along the air knives 122U and 122L in parallel with the conveyance direction (X And is located immediately below or slightly upstream of the discharge ports of the air knives 122U and 122L. As a result, the impedance in the vicinity of the gap K can be increased, the pressure difference between the downstream side and the upstream side can be sufficiently increased, and the mist backflow prevention effect can be maximized.

[Other Embodiments or Modifications]

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical idea.

  For example, the configuration or layout around the gap K formed between the lower end of the lower air knife 122L and the top plate 174 of the exhaust chamber 160 can be modified. As shown in FIG. 11, even if the position of the edge 174e of the top plate 174 of the exhaust chamber 160 or the lower exhaust ports 126, 128 is shifted to the downstream side just below the lower end of the lower air knife 122L, the size of the gap K changes. Absent. However, as the edge 174e of the top plate 174 recedes from the upstream space, the conductance near the gap K increases. Nevertheless, a sufficiently large pressure difference can be created between the downstream space and the upstream space in the vicinity of the gap K, and a sufficient mist backflow prevention effect can be obtained.

  Furthermore, as shown in FIG. 12, when the position of the edge 174e of the top plate 174 of the exhaust chamber 160 or the lower exhaust ports 126, 128 is shifted downstream from the lower end of the lower air knife 122L, the conductance in the vicinity of the gap K is considerable. growing. In this case, if the gap K does not become so large, by increasing the air supply flow rate of the FFU 136, it is possible to obtain a practically sufficient pressure difference between the downstream space and the upstream space, and thus a mist backflow prevention effect.

However, as shown in FIG. 13, if the edge 174e of the top plate 174 of the exhaust chamber 160 or the lower exhaust ports 126 and 128 are positioned far away from the lower air knife 122L, the gap K becomes too large and the FFU 136 is increased. Even if the air supply flow rate is increased, a pressure difference necessary to obtain an effective mist backflow prevention effect does not occur. According to experiments conducted by the present inventors, the distance between the lower air knife 122L and the top plate 174 of the exhaust chamber 160 (the size of the gap K) is such that the top plate edge 174a is directly below the lower air knife 122L at the height position. If it exceeds about 10 times the distance interval K _m (FIG. 11) when it is located on the upstream side, an effective mist backflow prevention effect cannot be obtained.

  In the above embodiment, the edge 174e of the top plate 174 is continuous with the upper end of the side wall plate 168 in the exhaust chamber 160, but the edge 174e of the top plate 174 is upstream of the upper end of the side wall plate 168 as shown in FIG. A configuration that protrudes to the side (that is, in a bowl shape) is also possible. In this case, the conductance near the gap K is reduced by extending the edge 174e of the top plate 174 directly below the lower air knife 122L while disposing the lower exhaust port 124 on the downstream side of the lower air knife 122L. A sufficiently large pressure difference can be created between the downstream space and the upstream space, and as a result, a sufficient mist backflow prevention effect can be obtained.

  In addition, the top plate 174 of the exhaust chamber 160 has a function of receiving an air flow coming from the FFU 132 on the ceiling and guiding it toward the gap K. In order to perform this airflow guiding function, the top plate 174 may be horizontal, but as shown in FIG. 15, it can have an inclined surface that gradually decreases toward the edge 174e.

  In the above embodiment, the side wall plate 168 of the exhaust chamber 160 or the edge 174e of the top plate 174 of the exhaust chamber 160 is parallel to both the air knives 122U and 122L between the wall 82f on the front side of the chamber and the wall 82r on the back side of the chamber. It was the structure extended to. However, as a modification, as shown in FIG. 16, a part of the side wall plate 168 of the exhaust chamber 160 or the edge 174e of the top plate 174 (in the illustrated example, the half section from the center to the back side of the chamber) is an air knife 122U, A configuration is also possible in which the other portion (a half section on the front side of the chamber from the center in the illustrated example) is positioned upstream of the discharge ports of the air knives 122U and 122L in the transport direction, extending in parallel with them along 122L. is there.

  The upper and lower air knives 122U and 122L are typically arranged one above the other, but a configuration in which the positions are shifted from each other in the transport direction (X direction) is also possible.

  If necessary, the upper exhaust port 124 may be omitted, and the chamber 82 (liquid draining / drying chamber R4) may be exhausted using only the lower exhaust ports 126 and 128. Further, a part or all of the side wall of the exhaust chamber 160 may be formed of a plate material independent of the side wall (82b, 82f, 82r) of the chamber 82.

  In the present invention, various modifications are possible in addition to the configuration in the chamber 82 (liquid draining / drying chamber R4). For example, instead of the roller conveyance path 84, another flat flow conveyance path such as a belt conveyor may be used. In the flat flow transfer according to the present invention, the substrate can take an arbitrary posture and may be a horizontal flow transfer in a horizontal posture, but a flat flow transfer in an inclined posture is also possible. The type and arrangement of the cleaning tool in the cleaning unit (SCR) 38 of the above embodiment are merely examples, and any cleaning tool can be placed in any place according to the specifications of the cleaning process.

  Further, the embodiment described above relates to the cleaning unit (SCR) 38 in the coating and developing treatment system 10. However, the present invention can also be applied to the development unit (DEV) 54 in the coating and developing treatment system 10.

  Although not shown, the development unit (DEV) 54 has a development processing unit, a rinsing unit, and a drying unit arranged in this order along a flat flow conveyance path constituting one section of the second substrate conveyance line 64. Yes. Here, the developing processing unit supplies the developing solution from the developing solution nozzle onto the substrate moving on the flat flow and the conveying path, and deposits the developing solution on the substrate (paddle development). The rinsing unit supplies a rinsing liquid (generally pure water) from the rinsing nozzle at a predetermined timing to replace the developing solution on the substrate with the rinsing solution (development stop). The drying section sprays a high-pressure air flow from the air knife onto the substrate that is flattened and moves on the conveyance path to remove the rinse liquid from the surface of the substrate (liquid draining drying).

  An exhaust mechanism similar to that of the above-described embodiment or modification can be incorporated in the drying unit of the developing unit (DEV) 54. Thereby, the exhaust efficiency and space efficiency of a drying part can be improved, and it can fully prevent that mist adheres to the dry board | substrate immediately after liquid-drying drying. As a result, the substrate can be sent to a subsequent process (particularly an etching process) in a state free from stains and residues, and the yield of the development process can be improved.

  Although the above-described embodiment relates to a resist coating apparatus in a coating and developing processing system for LCD manufacturing, the present invention is an arbitrary substrate processing apparatus for performing a liquid draining drying process after spraying a processing liquid on a substrate to be processed. And applicable to applications. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.

38 Cleaning unit (SCR)
R4 liquid draining drying chamber 54 Development unit (DEV)
80 (cleaning) chamber 82 (liquid draining and drying) chamber 84 roller transport path 118, 120 substrate entrance / exit (inlet / outlet)
82a Wall on the inlet side of the chamber 82b Wall on the outlet side of the chamber 82r Wall on the rear side of the chamber 82f Wall on the front side of the chamber 122U, 122L Air knife 124 Upper exhaust port 126, 128 Lower exhaust port 130, 132, 134 Exhaust port 136 Fan filter Unit (FFU)
140 Exhaust part 160 Exhaust chamber 162 Local exhaust duct 168 Side wall plates 170, 172 Partition plate 174 Exhaust chamber top plate 174e Top plate edge 180 Upper partition

Claims (22)

A flat flow path for transporting the substrate to be processed in a horizontal first direction;
A first processing chamber that contains a first section of the flat flow transfer path and has an inlet and an outlet through which the substrate transferred on the flat flow transfer path can pass;
In the processing chamber, upper and lower air knives that blow liquid-drying gas in a direction opposite to the transport direction obliquely with respect to the substrate from above and below the flat flow transport path,
A blower for supplying air into the first processing chamber on the downstream side in the transport direction from the upper and lower air knives;
An exhaust chamber with a top plate provided in the first processing chamber at a position lower than the discharge port of the lower air knife;
A lower exhaust port provided in a side wall facing the inlet of the exhaust chamber;
A substrate processing apparatus comprising: an exhaust unit connected to the exhaust chamber.   The substrate processing apparatus according to claim 1, further comprising an upper partition wall that hangs down from a ceiling of the first processing chamber to the upper air knife.   The substrate processing apparatus according to claim 2, wherein the blower unit includes a fan filter unit installed on the ceiling of the first processing chamber on the downstream side in the transport direction from the upper partition. First and second exhaust spaces separated by a first partition wall are formed in the exhaust chamber,
The side wall of the exhaust chamber has one or more first lower exhaust ports that communicate with the first exhaust space, and one or more second lower exhaust ports that communicate with the second exhaust space. Is provided,
The exhaust section includes a first exhaust port that communicates with the first exhaust space, and a second exhaust port that communicates with the second exhaust space.
The substrate processing apparatus as described in any one of Claims 1-3.   The substrate processing apparatus according to claim 4, wherein the first and second exhaust ports are provided on a wall facing the parallel flow path of the first processing chamber.   6. The substrate processing apparatus according to claim 5, wherein the first and second exhaust ports are provided on walls diagonally facing the back surfaces of the upper and lower air knives.   The substrate processing apparatus according to claim 1, wherein an edge of the exhaust chamber facing the entrance of the top plate extends in parallel with the lower air knife.   The substrate processing apparatus according to claim 7, wherein a top plate edge of the exhaust chamber is located immediately below the lower air knife.   The substrate processing apparatus according to claim 7, wherein a top plate edge of the exhaust chamber is located upstream of a discharge port of the lower air knife in a transport direction. The top plate edge of the exhaust chamber is located downstream of the lower air knife in the transport direction,
The distance interval between the top plate edge and the lower air knife is not more than 10 times the distance interval when the top plate edge is located immediately below the lower air knife at its height position.
The substrate processing apparatus according to claim 7.   A part of the edge of the top plate of the exhaust chamber that faces the inlet extends in parallel with the lower air knife, and the other part is located upstream of the discharge port of the lower air knife in the transport direction. The substrate processing apparatus as described in any one of Claims 1-6.   The top plate of the exhaust chamber is connected to a pair of walls facing the parallel flow path of the first processing chamber and a wall provided with the outlet of the first processing chamber. The substrate processing apparatus as described in any one of Claims 1-11.   The substrate processing apparatus according to claim 1, wherein a top plate of the exhaust chamber is horizontal.   The substrate processing apparatus according to claim 1, wherein a top plate of the exhaust chamber has an inclined surface that decreases toward the inlet.   The substrate processing apparatus according to claim 1, wherein a top plate of the exhaust chamber protrudes in a direction opposite to a transport direction from the side wall of the exhaust chamber. An upper exhaust port provided at a position higher than the upper air knife on a wall of the first processing chamber facing in parallel with the flat flow conveyance path and obliquely facing the discharge port of the upper and lower air knives;
The substrate processing apparatus according to claim 1, further comprising: an exhaust pipe provided outside the first processing chamber in order to connect the upper exhaust port to the exhaust chamber.   The substrate processing apparatus according to claim 16, wherein the exhaust chamber is provided with a third exhaust space that is separated or blocked from the lower exhaust port by a second partition wall and connected to the exhaust pipe. The exhaust part has a third exhaust port communicating with the third exhaust space,
The third exhaust port is provided on a wall of the first processing chamber facing the wall on which the upper exhaust port is provided;
The substrate processing apparatus according to claim 17.   In order to prevent mist from staying in the corner corners of the bottom facing the discharge ports of the upper and lower air knives of the first processing chamber, a retention preventing member that spatially covers the corner corners is provided. The substrate processing apparatus as described in any one of Claims 1-18. A second process which is arranged next to the upstream side of the first processing chamber, accommodates a second section of the flat flow transfer path, and has an inlet and an outlet through which the substrate transferred on the flat flow transfer path can pass. Room,
One or a plurality of rinse nozzles arranged along the flat flow path for spraying a rinse liquid onto the substrate in the second processing chamber. The substrate processing apparatus according to claim 1. A third process which is arranged next to the upstream side of the second processing chamber, accommodates a third section of the flat flow transfer path, and has an inlet and an outlet through which the substrate transferred on the flat flow transfer path can pass. Room,
21. One or a plurality of cleaning nozzles disposed along the flat flow path for spraying a cleaning liquid onto the substrate in the third processing chamber. The substrate processing apparatus according to one item. A third process which is arranged next to the upstream side of the second processing chamber, accommodates a third section of the flat flow transfer path, and has an inlet and an outlet through which the substrate transferred on the flat flow transfer path can pass. Room,
2. One or a plurality of developer nozzles arranged along the flat flow path for supplying the developer to the front surface of the substrate in the third processing chamber. The substrate processing apparatus as described in any one of -20.