JP5081261B2 - Coating device - Google Patents

Coating device Download PDF

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JP5081261B2
JP5081261B2 JP2010038481A JP2010038481A JP5081261B2 JP 5081261 B2 JP5081261 B2 JP 5081261B2 JP 2010038481 A JP2010038481 A JP 2010038481A JP 2010038481 A JP2010038481 A JP 2010038481A JP 5081261 B2 JP5081261 B2 JP 5081261B2
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substrate
air supply
suction port
levitation
floating
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JP2011176086A (en
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寿史 稲益
勲 小篠
貴生 高木
済 吉富
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Tokyo Electron Ltd
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Priority to KR1020110003790A priority patent/KR101790787B1/en
Priority to TW100106051A priority patent/TWI475595B/en
Priority to CN2011100448870A priority patent/CN102161026A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)

Description

本発明は、浮上ステージ上で被処理基板に処理液を塗布する塗布装置に関する。   The present invention relates to a coating apparatus that applies a processing liquid to a substrate to be processed on a floating stage.

LCD等のフラットパネルディスプレイ(FPD)の製造プロセスにおけるフォトリソグラフィー工程には、スリット状の吐出口を有する長尺形のスリットノズルを用いて被処理基板(ガラス基板等)上にレジスト液を塗布するスピンレスの塗布法がよく用いられている。   In a photolithography process in a manufacturing process of a flat panel display (FPD) such as an LCD, a resist solution is applied onto a substrate to be processed (such as a glass substrate) using a long slit nozzle having a slit-like discharge port. A spinless coating method is often used.

このようなスピンレス塗布法の一形式として、基板を支持するためのステージに基板浮上機構を組み込み、この浮上ステージ上で基板を空中に浮かせて水平な一方向(ステージ長手方向)に搬送し、搬送途中の所定位置でステージ上方に設置したスリットノズルより直下を通過する基板に向けてレジスト液を帯状に吐出させることにより、基板上の一端から他端までレジスト液を塗布するようにした浮上方式が知られている。   As one form of such a spinless coating method, a substrate floating mechanism is incorporated in the stage for supporting the substrate, and the substrate is floated in the air on this floating stage and conveyed in one horizontal direction (stage longitudinal direction). There is a levitation method in which the resist solution is applied from one end to the other end on the substrate by discharging the resist solution in a strip shape toward the substrate that passes directly below the slit nozzle installed above the stage at a predetermined position in the middle. Are known.

かかる浮上方式のスピンレス塗布法において、基板上にレジスト液の塗布膜を設定通りの膜厚で均一に形成するには、スリットノズルの吐出口と基板との間に設ける通常100μm前後の微小なギャップを精確に設定値またはその付近に維持することが要求される。   In such a levitation-type spinless coating method, in order to uniformly form a resist solution coating film on a substrate with a set film thickness, a small gap of usually about 100 μm provided between the discharge port of the slit nozzle and the substrate is used. Is accurately maintained at or near the setpoint.

この要求条件を満たすために、浮上方式のスピンレス塗布法を採用するレジスト塗布装置は、浮上ステージの略全域に高圧または正圧の気体たとえばエアを噴出する噴出口を所定の密度で多数設けるだけでなく、浮上ステージ上でスリットノズルの直下およびその前後のエリアとして設定される塗布領域には、負圧でエアを吸い込む吸引口を噴出口に混在させている。そして、該塗布領域内では、そこを通過する基板に対して、噴出口より加えられる垂直上向きの圧力と吸引口より加えられる垂直下向きの圧力とのバランスをとって、基板に与える浮上圧力を精細に制御し、基板の浮上高を設定値(たとえば50μm)に合わせるようにしている(たとえば特許文献1)。   In order to satisfy this requirement, a resist coating apparatus that employs a levitation-type spinless coating method simply provides a large number of jet nozzles for jetting high-pressure or positive-pressure gas, such as air, at a predetermined density over substantially the entire surface of the levitation stage. Rather, a suction port for sucking air at a negative pressure is mixed in the ejection port in the application region set as the area immediately below and before and behind the slit nozzle on the floating stage. In the application region, the floating pressure applied to the substrate is finely balanced by balancing the vertical upward pressure applied from the jet port and the vertical downward pressure applied from the suction port with respect to the substrate passing therethrough. The flying height of the substrate is adjusted to a set value (for example, 50 μm) (for example, Patent Document 1).

特開2007−190483JP2007-190483A

上記のようなレジスト塗布装置は、クリーンルーム内で稼働するが、それでも微小なパーティクルはもちろん、比較的大きな塵、破片等の異物に晒されることが多い。これらの異物は、雰囲気中を漂流してきたものであったり、メンテナンス時に外から持ち込まれ、あるいはメンテナンスの作業中に発生したものであったり、基板の破損や膜剥がれによって生じることもある。   Although the resist coating apparatus as described above operates in a clean room, it is often exposed to foreign matters such as fine particles and relatively large particles as well as fine particles. These foreign substances may drift in the atmosphere, be brought in from the outside during maintenance, or may be generated during maintenance work, or may be caused by substrate breakage or film peeling.

いずれにしても、上記のような浮上方式のスピンレス塗布法を採用するレジスト塗布装置においては、その周囲に漂っている異物を浮上ステージの塗布領域の吸引口が不所望に吸い込んでしまい、それによって吸引口の中が異物で詰まることがある。吸引口が目詰まりを起こすと、その吸引口はその上を通過する基板に対して吸引力を及ぼすことができなくなる。   In any case, in the resist coating apparatus that employs the above-described levitation-type spinless coating method, the suction port in the coating area of the levitation stage undesirably sucks foreign matter drifting around it. The suction port may be clogged with foreign matter. When the suction port becomes clogged, the suction port cannot exert a suction force on the substrate passing therethrough.

通常、浮上ステージの塗布領域には数1000個以上の吸引口が設けられる。その中の1つや2つが目詰まりを起こしても全体の吸引力には全く影響しないが、数100個程度の吸引口が目詰まりを起こすと全体の吸引力は顕著に低下する。また、目詰まりした吸引口が数10個程度であっても狭い範囲に集中していると、その付近では噴出口からの浮揚力と吸引口からの引力とのバランスが崩れて、基板浮上高が局所的に設定値よりも高くなることがある。塗布領域(特にスリットノズルの直下付近)で基板浮上高が局所的にでも設定値より高くなると、基板上に形成されるレジスト塗布膜の膜厚が変動し、フォトリソグラフィーの精度および信頼性を低下させる。   Usually, several thousand or more suction ports are provided in the application region of the floating stage. Even if one or two of them are clogged, the whole suction force is not affected at all. However, when about several hundred suction ports are clogged, the whole suction force is remarkably lowered. In addition, even if there are about several tens of clogged suction ports, if they are concentrated in a narrow range, the balance between the buoyant force from the jet port and the attractive force from the suction port is lost in the vicinity, and the substrate flying height is increased. May be locally higher than the set value. If the flying height of the substrate is locally higher than the set value in the coating area (especially immediately below the slit nozzle), the thickness of the resist coating film formed on the substrate fluctuates, reducing the accuracy and reliability of photolithography. Let

従来は、上記のような浮上ステージにおける吸引口の目詰まりを除去するために、浮上ステージを分解して吸引口を清掃する方法、あるいは浮上ステージの上面に外部掃除機の吸引ヘッドを当てて吸引口の中に詰まっている異物を上から吸引して除去する方法が採られていた。   Conventionally, in order to remove the clogging of the suction port in the levitation stage as described above, the levitation stage is disassembled and the suction port is cleaned, or the suction head of an external cleaner is applied to the upper surface of the levitation stage. A method has been adopted in which foreign matter clogged in the mouth is removed by suction from above.

しかし、分解清掃方式は、作業が非常に面倒で、多大な人的労力を要し、作業時間つまり復旧時間の長いことも現場では嫌われている。また、外部掃除機を用いる方式は、浮上ステージに吸引ヘッドを当てることによって浮上ステージに傷をつけやすいことや、分解清掃方式ほどではないがやはり人の作業を必要としている。   However, the disassembly and cleaning method is very troublesome and requires a great amount of human labor, and the long work time, that is, the recovery time, is also hated on site. In addition, the method using an external vacuum cleaner easily damages the levitation stage by applying a suction head to the levitation stage, and also requires human work, although not as much as the disassembly cleaning method.

また、従来は、浮上ステージの吸引口が目詰まりを起こしているか否かをチェックする手段または機能が無かった。このため、吸引口の目詰まりによってレジスト塗布膜の膜厚に影響が出た場合に、その原因を突き止めるまでしばらく掛かることがあった。一方で、上記のような分解清掃または外部掃除による定期メンテナンスを短い周期で頻繁に行う場合は、多大な人的労力と装置稼働率の低下を来すことになる。   Conventionally, there has been no means or function for checking whether or not the suction port of the levitation stage is clogged. For this reason, when the film thickness of the resist coating film is affected by clogging of the suction port, it may take a while until the cause is determined. On the other hand, when periodic maintenance by the above-described disassembly cleaning or external cleaning is frequently performed in a short cycle, a great amount of human labor and a reduction in the device operation rate are caused.

本発明は、上記のような従来技術の問題点を解決するものであり、浮上ステージにおける吸引口の目詰まりを除去する作業を装置内で随時あるいは適時に自動的かつ効率的に行えるようにした塗布装置を提供する。   The present invention solves the problems of the prior art as described above, and the operation for removing clogging of the suction port in the levitation stage can be performed automatically and efficiently at any time or in the apparatus. A coating apparatus is provided.

本発明の塗布装置は、 多数の噴出口と多数の吸引口とが混在して設けられた第1の浮上領域を有する浮上ステージと、前記噴出口より噴き出す気体の圧力によって被処理基板を浮上させるために、前記噴出口に第1のマニホールドを介して正圧の気体を供給する第1の給気部と、前記吸引口に気体を吸い込む吸引力によって前記基板の浮上高を制御するために、前記吸引口に第2のマニホールドを介して負圧を与える吸引排気部と、前記浮上ステージ上で空中に浮く前記基板を保持して前記第1の浮上領域を通過するように搬送する搬送機構と、前記第1の浮上領域の上方に配置されるノズルを有し、前記第1の浮上領域を通過する前記基板上に前記ノズルより処理液を供給する処理液供給部と、前記吸引口の中を掃除するために、前記吸引口に前記第2のマニホールドを介して正圧の気体を供給する第2の給気部とを有する。
The coating apparatus according to the present invention floats a substrate to be processed by a levitation stage having a first levitation region provided with a mixture of a large number of ejection openings and a large number of suction openings, and the pressure of gas ejected from the ejection openings. Therefore, in order to control the flying height of the substrate by a first air supply unit that supplies a positive pressure gas to the ejection port via a first manifold, and a suction force that sucks the gas into the suction port, A suction exhaust unit that applies a negative pressure to the suction port via a second manifold; a transport mechanism that holds the substrate floating in the air on the levitation stage and transports the substrate so as to pass through the first levitation region; A processing liquid supply unit having a nozzle disposed above the first floating region, and supplying a processing liquid from the nozzle onto the substrate passing through the first floating region; and a suction port To clean the suction And a second air supply unit that supplies a positive pressure gas to the mouth via the second manifold .

上記の構成においては、浮上ステージの第1の浮上領域に設けられている吸引口が吸引動作を行っている間(主に塗布処理中)に浮上ステージの周囲に漂っている異物を不所望に吸い込んでしまい、それによって吸引口の中が異物で詰まることがある。しかし、本発明によれば、塗布処理が休止している時、または塗布処理の合間に、吸引排気部を停止させて第2の給気部を作動させることにより、吸引口の目詰まりを人手を要することなく自動的かつ効率的に除去することができる。   In the above configuration, the foreign matter floating around the levitation stage is undesirably while the suction port provided in the first levitation area of the levitation stage is performing a suction operation (mainly during the coating process). Inhalation may cause clogging of the suction port. However, according to the present invention, when the coating process is paused or during the coating process, the suction / exhaust unit is stopped and the second air supply unit is operated to manually clog the suction port. Can be removed automatically and efficiently.

本発明の塗布装置によれば、上記のような構成および作用により、浮上ステージにおける吸引口の目詰まりを除去する作業を装置内で随時あるいは適時に自動的かつ効率的に行うことができる。   According to the coating apparatus of the present invention, the operation for removing the clogging of the suction port in the levitation stage can be automatically and efficiently performed at any time or in the apparatus by the configuration and operation as described above.

本発明の一実施形態におけるレジスト塗布装置の主要な構成を示す略平面図である。It is a schematic plan view which shows the main structures of the resist coating apparatus in one Embodiment of this invention. 上記レジスト塗布装置の主要な構成を示す基板搬送方向の略正面図である。It is a schematic front view of the substrate conveying direction showing the main configuration of the resist coating apparatus. 上記レジスト塗布装置における浮上高測定部の光学的距離センサの取付構造および作用を示す略側面図である。It is a schematic side view which shows the attachment structure and effect | action of the optical distance sensor of the flying height measuring part in the said resist coating apparatus. 上記レジスト塗布装置におけるノズルリフレッシュ部の構成および面状吸い取り部の取付構造を示す図である。It is a figure which shows the structure of the nozzle refresh part in the said resist coating device, and the attachment structure of a planar suction part. 上記レジスト塗布装置における制御系の構成を示すブロック図である。It is a block diagram which shows the structure of the control system in the said resist coating apparatus. 上記レジスト塗布装置において浮上ステージの吸引口に異物が殆ど詰まっていないときの塗布処理部の状態を示す略断面図である。FIG. 5 is a schematic cross-sectional view showing a state of a coating processing unit when foreign matter is hardly clogged in a suction port of a floating stage in the resist coating apparatus. 上記レジスト塗布装置において浮上ステージの吸引口に異物が詰まっているときの塗布処理部の状態を示す略断面図である。FIG. 5 is a schematic cross-sectional view showing a state of a coating processing unit when foreign matter is clogged in a suction port of a floating stage in the resist coating apparatus. 上記レジスト塗布装置において第2給気部が作動したときの作用を示す略断面図である。It is a schematic sectional drawing which shows an effect | action when the 2nd air supply part act | operates in the said resist coating device. 上記レジスト塗布装置において浮上ステージ吸引口掃除に面状吸着部を用いる場合の作用を示す図である。It is a figure which shows an effect | action when using a planar adsorption | suction part for the floating stage suction port cleaning in the said resist coating apparatus. 上記レジスト塗布装置における第2給気部の変形例を示す図である。It is a figure which shows the modification of the 2nd air supply part in the said resist coating device. 第2給気部に圧縮タンクを用いる場合の作用を説明するための圧力波形図である。It is a pressure waveform figure for demonstrating an effect | action when a compression tank is used for a 2nd air supply part. 第2給気部により浮上ステージの吸引口に与える掃除用の圧力を時分割制御する方式の一段階を示す図である。It is a figure which shows 1 step | paragraph of the system which carries out the time division control of the pressure for the cleaning given to the suction opening of a levitation | floating stage by a 2nd air supply part. 第2給気部により浮上ステージの吸引口に与える掃除用の圧力を時分割制御する方式の一段階を示す図である。It is a figure which shows 1 step | paragraph of the system which carries out the time division control of the pressure for the cleaning given to the suction opening of a levitation | floating stage by a 2nd air supply part.

以下、添付図を参照して、本発明の好適な実施形態を説明する。   Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

図1および図2に、本発明の一実施形態におけるレジスト塗布装置の主要な構成を示す。図1は略平面図、図2は基板搬送方向の略正面図である。   1 and 2 show the main configuration of a resist coating apparatus according to an embodiment of the present invention. FIG. 1 is a schematic plan view, and FIG. 2 is a schematic front view in the substrate transport direction.

このレジスト塗布装置は、浮上方式のスピンレス塗布法を採用しており、図1に示すように、被処理基板たとえばFPD用のガラス基板Gを気体の圧力によって空中に浮かす浮上ステージ10と、この浮上ステージ10上で空中に浮いている基板Gを浮上ステージ長手方向(X方向)に搬送する搬送機構12と、浮上ステージ10上を搬送される基板Gの上面にレジスト液を供給するスリットノズル14とを備えている。   This resist coating apparatus employs a levitation spinless coating method, and as shown in FIG. 1, a levitation stage 10 that floats a substrate to be processed, such as a glass substrate G for FPD, in the air by gas pressure, and the levitation A transport mechanism 12 for transporting the substrate G floating in the air on the stage 10 in the longitudinal direction (X direction) of the floating stage; a slit nozzle 14 for supplying a resist solution to the upper surface of the substrate G transported on the floating stage 10; It has.

浮上ステージ10の上面は、基板搬送方向(X方向)に沿って3つの領域つまり搬入領域MIN、塗布領域MCOTおよび搬出領域MOUTに区画されている。このうち、搬入領域MINおよび搬出領域MOUTには、噴出口16のみが所定の密度で多数設けられており、塗布領域MCOTには噴出口16と吸引口18とが所定の密度で多数混在して設けられている。 The upper surface of the levitation stage 10 is divided into three regions, that is, a carry-in region M IN , a coating region M COT, and a carry-out region M OUT along the substrate transfer direction (X direction). Among these, only a large number of jet nozzles 16 are provided in the carry-in area M IN and the carry-out area M OUT with a predetermined density, and many jet nozzles 16 and suction ports 18 are provided with a predetermined density in the coating area M COT. It is provided in a mixed manner.

搬入領域MINには、塗布処理前の基板Gを前段の外部装置からソータ機構(図示せず)により平流し搬送で、あるいは搬送ロボット(図示せず)からの受け渡しで搬入するための基板搬入部20(図5)が設けられている。搬出領域MOUTには、塗布処理の済んだ基板Gを後段の外部装置へソータ機構(図示せず)により平流しの搬送で、あるいは搬送ロボット(図示せず)への受け渡しで搬出するための基板搬出部22(図5)が設けられている。 Into the carry-in area MIN , a substrate G for carrying the substrate G before the coating treatment from the external device in the previous stage by a flat flow by a sorter mechanism (not shown) or by delivery from a transfer robot (not shown) A portion 20 (FIG. 5) is provided. In the carry-out area M OUT , the substrate G that has been subjected to the coating process is carried out to a subsequent external device by a flat flow by a sorter mechanism (not shown) or by delivery to a transfer robot (not shown). A substrate carry-out portion 22 (FIG. 5) is provided.

塗布領域MCOTには、ステージ上方に、スリットノズル14が昇降移動可能に設けられるとともに、塗布処理の合間にスリットノズル14をリフレッシュするノズルリフレッシュ部24(図1、図4)が基板搬送方向(X方向)と平行に水平移動可能に設けられている。 In the coating region M COT , the slit nozzle 14 is provided above the stage so as to be movable up and down, and a nozzle refresh unit 24 (FIGS. 1 and 4) that refreshes the slit nozzle 14 between coating processes is provided in the substrate transport direction ( (X direction) and can be moved horizontally.

搬送機構12は、図1に示すように、浮上ステージ10を挟んでX方向に延びる一対のガイドレール26A,26Bと、これらのガイドレール26A,26Bに沿って往復移動可能な一対のスライダ28と、浮上ステージ10上で基板Gの両側端部を着脱可能に保持するようにスライダ28に設けられた吸着パッド等の基板保持部材(図示せず)とを備えており、直進移動機構(図示せず)によりスライダ28を基板搬送方向(X方向)に移動させることによって、浮上ステージ10上で搬入領域MINから塗布領域MCOTを通って搬出領域MOUTまで基板Gの浮上搬送を行うように構成されている。 As shown in FIG. 1, the transport mechanism 12 includes a pair of guide rails 26 </ b> A and 26 </ b> B that extend in the X direction with the levitation stage 10 interposed therebetween, and a pair of sliders 28 that can reciprocate along the guide rails 26 </ b> A and 26 </ b> B. And a substrate holding member (not shown) such as a suction pad provided on the slider 28 so as to detachably hold both side ends of the substrate G on the floating stage 10, and a linear movement mechanism (not shown). The slider G is moved in the substrate transport direction (X direction) to float and transport the substrate G from the loading area M IN through the coating area M COT to the unloading area M OUT on the floating stage 10. It is configured.

スリットノズル14は、浮上ステージ10の上方を基板搬送方向と直交する水平方向(Y方向)に横断し、その直下を通過する基板Gの上面(被処理面)に対してスリット状の吐出口よりレジスト液Rを帯状に吐出するようになっている。また、スリットノズル14は、浮上ステージ10をスリットノズル14と平行に(Y方向に)跨いで設置される門形フレーム30に取り付けられるたとえばボールネジ機構32やガイド部材34等(図2)を含むノズル昇降機構36により、このノズル14を支持するノズル支持部材38と一体に鉛直方向(Z方向)に移動(昇降)可能に構成されている。また、スリットノズル14は、レジスト液容器や送液ポンプ等からなるレジスト供給機構40(図5)にレジスト供給管42を介して接続されている。   The slit nozzle 14 traverses the top of the levitation stage 10 in the horizontal direction (Y direction) orthogonal to the substrate transport direction, and passes from directly below the upper surface (processing surface) of the substrate G from a slit-like discharge port. The resist solution R is discharged in a strip shape. The slit nozzle 14 is a nozzle including, for example, a ball screw mechanism 32, a guide member 34, and the like (FIG. 2) attached to a portal frame 30 installed across the floating stage 10 in parallel (in the Y direction) with the slit nozzle 14. The lifting mechanism 36 is configured to be movable (lifted / lowered) in the vertical direction (Z direction) integrally with a nozzle support member 38 that supports the nozzle 14. The slit nozzle 14 is connected via a resist supply pipe 42 to a resist supply mechanism 40 (FIG. 5) including a resist solution container and a liquid feed pump.

図2に示すように、このレジスト塗布装置は、浮上ステージ10の基板浮上機構を構成する外付けの用力設備として、浮上用の第1給気部44と、浮上高制御用の吸引排気部46と、吸引口掃除用の第2給気部48とを有している。   As shown in FIG. 2, the resist coating apparatus includes a first air supply unit 44 for levitation and a suction / exhaust unit 46 for controlling the levitation height as external utility equipment that constitutes the substrate levitation mechanism of the levitation stage 10. And a second air supply unit 48 for cleaning the suction port.

浮上用の第1給気部44は、浮上ステージ10の噴出口16より噴き出すエアの圧力(揚力)によって基板Gを浮上させるために、各噴出口16に正圧のエアを所望の圧力で供給するように構成されている。より詳細には、第1給気部44は、たとえば工場用力の圧縮空気源を利用する正圧気体供給源50と、この正圧気体供給源50から浮上ステージ10内の第1マニホールド52まで延びるガス供給管または第1給気ライン54と、この第1給気ライン54の途中に設けられる開閉弁56、レギュレータ58およびフィルタ60とを有している。   The first air supply unit 44 for levitation supplies positive pressure air to each of the ejection ports 16 at a desired pressure in order to float the substrate G by the pressure (lift) of the air ejected from the ejection port 16 of the levitation stage 10. Is configured to do. More specifically, the first air supply unit 44 extends to the first manifold 52 in the levitation stage 10 from the positive pressure gas supply source 50 using, for example, a compressed air source of factory power. A gas supply pipe or first air supply line 54, and an opening / closing valve 56, a regulator 58, and a filter 60 provided in the middle of the first air supply line 54 are provided.

開閉弁56を開けると、正圧気体供給源50より正圧気体つまりエアが給気ライン54を通って第1マニホールド52に送り込まれ、第1マニホールド52から浮上ステージ10の各領域MIN、MCOT、MOUT内の全ての噴出口16にエアが所定の圧力で分配供給されるようになっている。 When the on-off valve 56 is opened, positive pressure gas, that is, air is sent from the positive pressure gas supply source 50 through the air supply line 54 to the first manifold 52, and each region M IN , M of the levitation stage 10 from the first manifold 52. COT, air to all injection holes 16 in the M OUT is adapted to be dispensed at a predetermined pressure.

浮上高制御用の吸引排気部46は、吸引口18にエアを吸い込む吸引力によって塗布領域MCOT内の基板Gの浮上高HG(図)を厳密に制御するために、各吸引口18に適度な負圧を与えるように構成されている。より詳細には、吸引排気部46は、たとえば工場用力の排気ダクト62と、この排気ダクト62から浮上ステージ10内の第2マニホールド64まで延びる排気管または排気ライン66と、この排気ライン66の途中に設けられる開閉弁68およびファン70とを有している。
The suction / exhaust unit 46 for controlling the flying height is used to precisely control the flying height H G (FIG. 3 ) of the substrate G in the coating region MCOT by the suction force that sucks air into the suction port 18. It is configured to give a moderate negative pressure. More specifically, the suction exhaust unit 46 includes, for example, a factory-use exhaust duct 62, an exhaust pipe or exhaust line 66 extending from the exhaust duct 62 to the second manifold 64 in the levitation stage 10, and an intermediate portion of the exhaust line 66. The on-off valve 68 and the fan 70 are provided.

開閉弁68を開けて、ファン70を回転駆動すると、ファン70の入側に発生する負圧が吸引口18に排気ライン66および第2マニホールド64を介して塗布領域MCOT内の吸引口18に伝わる。これによって、吸引口18に浮上ステージ10上のエアが吸い込まれ、吸い込まれたエアは第2マニホールド64および排気ライン66を通ってファン70へ送られ、ファン70の出側から排気ライン66を通って排気ダクト62へ送られるようになっている。 When the on-off valve 68 is opened and the fan 70 is driven to rotate, negative pressure generated on the inlet side of the fan 70 is applied to the suction port 18 via the exhaust line 66 and the second manifold 64 to the suction port 18 in the application region MCOT . It is transmitted. As a result, air on the floating stage 10 is sucked into the suction port 18, and the sucked air is sent to the fan 70 through the second manifold 64 and the exhaust line 66, and passes through the exhaust line 66 from the outlet side of the fan 70. Then, it is sent to the exhaust duct 62.

吸引口掃除用の第2給気部48は、正圧気体供給源50と開閉弁56との間に設けられた第1給気ライン54上の第1のノード72からファン70と第2マニホールド64との間に設けられた排気ライン66上の第2のノード74まで延びる第2給気ライン76と、この第2給気ライン76の途中に設けられる開閉弁78およびレギュレータ80とを有している。   The second air supply unit 48 for cleaning the suction port includes the fan 70 and the second manifold from the first node 72 on the first air supply line 54 provided between the positive pressure gas supply source 50 and the on-off valve 56. 64, a second air supply line 76 extending to the second node 74 on the exhaust line 66 provided between the second air supply line 64 and an on-off valve 78 and a regulator 80 provided in the middle of the second air supply line 76. ing.

吸引排気部46のファン70を止めておいて、第2給気部48の開閉弁78を開けると、正圧気体供給源50より正圧気体つまりエアが第1給気ライン54→第1のノード72→第2給気ライン76→第2のノード74→排気ライン66を流れて第2マニホールド64に送り込まれ、第2マニホールド64から浮上ステージ10の塗布領域MCOT内の全ての吸引口18にエアが所定の圧力で分配供給されるようになっている。 When the fan 70 of the suction / exhaust unit 46 is stopped and the on-off valve 78 of the second air supply unit 48 is opened, the positive pressure gas, that is, the air is supplied from the positive pressure gas supply source 50 to the first supply line 54 → first. It flows into the second manifold 64 through the node 72 → the second air supply line 76 → the second node 74 → the exhaust line 66, and all the suction ports 18 in the application region M COT of the floating stage 10 from the second manifold 64. The air is distributed and supplied at a predetermined pressure.

このレジスト塗布装置は、浮上ステージ10の塗布領域MCOTにおける基板Gの浮上高(ステージ上面からの距離)HGをフィードバック制御で設定値HSに一致させるために、図に示すように、ノズル支持部材38に浮上高測定部82(図5)の光学式距離センサ84を取り付けている。通常は、基板搬送方向と直交する水平方向(Y方向)において基板Gの左右両側端部の浮上高HGを測定するように、光学式距離センサ84は左右に一対配置される(図2)。
The resist coating apparatus, in order to match the set value H S a H G (Distance from the stage upper surface) flying height of the substrate G in the coating region M COT of floating stage 10 in the feedback control, as shown in FIG. 2, The optical distance sensor 84 of the flying height measuring unit 82 (FIG. 5) is attached to the nozzle support member 38. Normally, a pair of optical distance sensors 84 are arranged on the left and right so as to measure the flying heights H G at the left and right ends of the substrate G in the horizontal direction (Y direction) orthogonal to the substrate transport direction (FIG. 2). .

この光学式距離センサ84は、塗布処理用の所定の高さ位置から直下の物体つまり浮上ステージ10との距離Daおよび基板Gとの距離Dbを光学的に測定する。浮上高測定部82(図5)は、それらの測定距離Da,Dbと基板Gの厚みTG(既定値)とから基板浮上高HGの測定値を演算[HG=Da−(Db+TG)]によって求める。 The optical distance sensor 84 optically measures a distance D a to an object directly below the coating processing predetermined height position, that is, the floating stage 10 and a distance D b to the substrate G. The flying height measuring unit 82 (FIG. 5) calculates a measured value of the substrate flying height H G from the measured distances D a and D b and the thickness T G (default value) of the substrate G [H G = D a − (D b + T G )].

このレジスト塗布装置は、さらに、スリットノズル14の直下付近で基板Gの浮上高HGが所定の監視ライン上で局所的にでも許容値を超えているか否かを監視するための浮上高監視部86(図5)を備えている。 The resist coating apparatus further flying height monitoring unit for monitoring whether the flying height H G of the substrate G has exceeded the allowable value even locally on a given monitor line in the vicinity immediately below the slit nozzle 14 86 (FIG. 5).

に示すように、この浮上高監視部86は、浮上ステージ10を挟んでその左右両側に、浮上高設定値HSに対応した所定の高さで浮上ステージ10の上をY方向に横断する監視ライン上に投光部88および受光部90を対向配置している。塗布領域MCOTにおいて基板Gの浮上高HGが浮上高設定値HSに略一致し、かつ浮上高監視部86の監視ライン上の何処も基板表面が平坦であるときは、図に示すように投光部88から投光される光ビームLBが基板Gの上をすれすれに通過して受光部90に届くようになっている。しかし、監視ライン上のどこかで基板Gの浮上高HGが浮上高設定値HSを超えているときは、光ビームLBが基板Gの側面または上面で反射して受光部90には届かないため、浮上高監視部86はその事態を検出することができる。
As shown in FIG. 2 , the flying height monitoring unit 86 crosses the flying stage 10 in the Y direction at a predetermined height corresponding to the flying height set value H S on both the left and right sides of the flying stage 10. The light projecting unit 88 and the light receiving unit 90 are arranged opposite to each other on the monitoring line to be performed. When flying height H G of the substrate G in the coating region M COT is substantially matched to the flying height set value H S, and where even the substrate surface on monitor line flying height monitoring unit 86 is flat, shown in FIG. 2 As described above, the light beam LB projected from the light projecting unit 88 passes through the substrate G and reaches the light receiving unit 90. However, when the flying height H G of the substrate G exceeds the flying height set value H S somewhere on the monitoring line, the light beam LB is reflected by the side surface or the upper surface of the substrate G and reaches the light receiving unit 90. Therefore, the flying height monitoring unit 86 can detect the situation.

この浮上高監視部86の監視機能は、後述するように、監視ライン付近で浮上ステージ10の吸引口18が目詰まりを起こしているか否かを判断するのに利用される。   As will be described later, the monitoring function of the flying height monitoring unit 86 is used to determine whether or not the suction port 18 of the flying stage 10 is clogged near the monitoring line.

図4に、ノズルリフレッシュ部24の構成を示す。ノズルリフレッシュ部24は、1つのケーシング92内に、塗布処理の下準備としてスリットノズル14に少量のレジスト液を吐出させてプライミングローラ94に巻き取るプライミング処理部96と、スリットノズル14の吐出口を乾燥防止の目的から溶剤蒸気の雰囲気中に保つためのノズルバス98と、スリットノズル14の吐出口周辺部を洗浄するためのスリットノズル洗浄部100とを併設している。   FIG. 4 shows the configuration of the nozzle refresh unit 24. The nozzle refresh unit 24 includes a priming processing unit 96 that discharges a small amount of resist solution to the slit nozzle 14 and winds it around the priming roller 94 as a preparation for the coating process in one casing 92, and a discharge port of the slit nozzle 14. For the purpose of preventing drying, a nozzle bath 98 for keeping in an atmosphere of solvent vapor and a slit nozzle cleaning unit 100 for cleaning the periphery of the discharge port of the slit nozzle 14 are provided.

1回の塗布処理を終えたスリットノズル14は、最初にスリットノズル洗浄部100により洗浄処理を受け、次いでノズルバス98内で待機し、次の塗布処理が開始される直前にプライミング処理部96によりプライミング処理を受ける。   The slit nozzle 14 that has completed one coating process is first subjected to a cleaning process by the slit nozzle cleaning unit 100, then waits in the nozzle bath 98, and is primed by the priming processing unit 96 immediately before the next coating process is started. Get processed.

スリットノズル14をノズルリフレッシュ部24内の各部(96,98,100)に着かせるには、コントローラ110(図5)の制御の下で、たとえばボールネジ機構からなるX方向移動部102(図1)によりノズルリフレッシュ部24の全体つまりケーシング92を基板搬送方向(X方向)と平行に移動させるとともに、ノズル昇降機構36(図1、図5)によりスリットノズル14を鉛直方向(Z方向)で移動させる。   In order to place the slit nozzle 14 on each part (96, 98, 100) in the nozzle refreshing part 24, under the control of the controller 110 (FIG. 5), for example, an X-direction moving part 102 (FIG. 1) comprising a ball screw mechanism. As a result, the entire nozzle refresh unit 24, that is, the casing 92 is moved in parallel with the substrate transport direction (X direction), and the slit nozzle 14 is moved in the vertical direction (Z direction) by the nozzle lifting mechanism 36 (FIGS. 1 and 5). .

この実施形態では、ノズルリフレッシュ部24のケーシング92の下面に面状の吸い取りヘッド102を取り付けており、プライミング処理部96の排気に用いられる排気装置104に排気管106を介して吸い取りヘッド102を接続している。排気管106には開閉弁108が設けられる。この吸い取りヘッド102は、後述するように、浮上ステージ10の吸引口18を掃除する時に用いられる。   In this embodiment, a planar suction head 102 is attached to the lower surface of the casing 92 of the nozzle refresh unit 24, and the suction head 102 is connected to the exhaust device 104 used for exhausting the priming processing unit 96 via the exhaust pipe 106. is doing. The exhaust pipe 106 is provided with an open / close valve 108. As will be described later, the suction head 102 is used when cleaning the suction port 18 of the floating stage 10.

図5に、この実施形態のレジスト塗布装置における制御系の主要な構成を示す。コントローラ110は、マイクロコンピュータからなり、浮上高測定部82、浮上高監視部86等から測定値またはモニタ信号等を受け取り、搬送機構12、基板搬入部20、基板搬出部22、ノズルリフレッシュ部24、ノズル昇降機構36、レジスト供給機構40、第1給気部44、吸引排気部46、第2給気部48等の個々の動作と全体の動作(シーケンス)を制御する。また、コントローラ110は、ホストコントローラや他の外部装置(図示せず)とも接続されている。   FIG. 5 shows the main configuration of the control system in the resist coating apparatus of this embodiment. The controller 110 is composed of a microcomputer, receives measurement values or monitor signals from the flying height measuring unit 82, the flying height monitoring unit 86, etc., and receives the transport mechanism 12, the substrate carry-in unit 20, the substrate carry-out unit 22, the nozzle refresh unit 24, The individual operations of the nozzle elevating mechanism 36, the resist supply mechanism 40, the first air supply unit 44, the suction / exhaust unit 46, the second air supply unit 48, etc. and the overall operation (sequence) are controlled. The controller 110 is also connected to a host controller and other external devices (not shown).

ここで、このレジスト塗布装置におけるレジスト塗布動作を説明する。先ず、前段の基板処理装置(図示せず)より基板Gがソータ機構または搬送ロボットを介して浮上ステージ10の搬入領域MINに搬入され、そこで待機していたスライダ28が基板Gを保持して受け取る。浮上ステージ10上で基板Gは噴出孔16より噴射されるエアの圧力(揚力)によって空中に浮く。 Here, the resist coating operation in this resist coating apparatus will be described. First, the substrate G from the front of the substrate processing apparatus (not shown) is loaded into loading area M IN of floating stage 10 through the sorter mechanism or transport robot, where a slider 28 which has been waiting while holding the substrate G receive. On the levitation stage 10, the substrate G floats in the air by the pressure (lift) of air ejected from the ejection holes 16.

こうして基板Gが水平姿勢で基板搬送方向(X方向)に浮上搬送され、ステージ中央部の塗布領域MCOTを通過する際に、スリットノズル14が直下の基板Gに向けてレジスト液Rを所定の圧力または流量で帯状に吐出することにより、図3に示すように基板Gの前端側から後端側へ向かって膜厚の均一なレジスト液の塗布膜RMが形成されていく。 Thus, the substrate G is levitated and conveyed in the substrate conveying direction (X direction) in a horizontal posture, and when passing through the coating region MCOT at the center of the stage, the slit nozzle 14 directs the resist solution R toward the substrate G directly below the predetermined amount. As shown in FIG. 3, a resist film coating film RM having a uniform film thickness is formed from the front end side to the rear end side of the substrate G by discharging in a strip shape with pressure or flow rate.

基板Gの後端がスリットノズル14の下を通過すると、基板一面にレジスト塗布膜RMが形成される。次いで、基板Gは、その後もスライダ28により浮上ステージ10上で浮上搬送され、浮上ステージ10の後端に設定された搬出領域MOUTよりソータ機構または搬送ロボットを介して後段のユニット(図示せず)へ送られる。 When the rear end of the substrate G passes under the slit nozzle 14, a resist coating film RM is formed on the entire surface of the substrate. Subsequently, the substrate G is then levitated and conveyed on the levitating stage 10 by the slider 28, and a rear stage unit (not shown) from the unloading area M OUT set at the rear end of the levitating stage 10 via a sorter mechanism or a conveying robot. ).

次に、図6〜図9につき、この実施形態のレジスト塗布装置における浮上ステージ吸引口掃除機能を説明する。   Next, the floating stage suction port cleaning function in the resist coating apparatus of this embodiment will be described with reference to FIGS.

図6に示すように、浮上ステージ10の塗布領域MCOTにおいてスリットノズル14の直下付近で全部または殆どの吸引口18が目詰まりを起こしていないときは、塗布処理中に各噴出口16より噴き出したエアが基板Gの裏面に作用してから隣の吸引口18へ速やかに吸い込まれる。 As shown in FIG. 6, when all or most of the suction ports 18 are not clogged in the vicinity of the slit nozzle 14 in the application region MCOT of the levitation stage 10, they are ejected from the respective outlets 16 during the coating process. After the air acts on the back surface of the substrate G, it is quickly sucked into the adjacent suction port 18.

コントローラ110は、開閉弁78を閉じて第2給気部48を止めておき、第1給気部44と吸引排気部46とを同時に作動させ、基板Gの塗布領域MCOT内を通過している部分に対して、噴出口16から噴き出すエア(圧縮空気)による垂直上向きの力を加えると同時に、吸引口18より負圧吸引力による垂直下向きの力を加えて、相対抗する双方向の力のバランスを制御することで、塗布用の基板浮上高HGを設定値HS(たとえば50μm)付近に維持する。この場合、コントローラ110は、レギュレータ58またはファン70を制御して、浮上高測定部82より得られる浮上高測定値HGが設定値HSに一致するようにフィードバック制御を行うことができる。 The controller 110 closes the on-off valve 78 to stop the second air supply unit 48, operates the first air supply unit 44 and the suction exhaust unit 46 at the same time, and passes through the coating region M COT of the substrate G. A vertical upward force due to air (compressed air) ejected from the jet outlet 16 is applied to the portion that is at the same time, and at the same time, a vertical downward force due to a negative pressure suction force is applied from the suction port 18 to oppose each other. By controlling the balance, the substrate flying height H G for coating is maintained near the set value H S (for example, 50 μm). In this case, the controller 110 can control the regulator 58 or the fan 70 to perform feedback control so that the flying height measurement value H G obtained from the flying height measurement unit 82 matches the set value H S.

しかし、図7に示すように、浮上ステージ10の塗布領域MCOTにおいてスリットノズル14の直下付近で相当な数の吸引口18が内奥の比較的狭いガス通路18aに異物Qが挟まって目詰まりを起こしているときは、塗布処理中に吸引排気部46のファン70が回転(吸引排気)動作をしているにも係わらず、目詰まりを起こしている吸引口18は吸引力を生じないために、その付近では噴出口16からの浮揚力と吸引口18からの引力とのバランスが崩れて、基板浮上高HGが局所的に設定値H S よりも高くなる。
However, as shown in FIG. 7, a considerable number of suction ports 18 are clogged by a relatively narrow gas passage 18a in the inner part of the application region MCOT of the floating stage 10 in the vicinity of the slit nozzle 14 and clogged. When suction occurs, the suction port 18 that is clogged does not generate suction force even though the fan 70 of the suction exhaust unit 46 is rotating (suction / exhaust) during the coating process. In addition, in the vicinity, the balance between the floating force from the jet port 16 and the attractive force from the suction port 18 is lost, and the substrate flying height H G is locally higher than the set value H S.

この場合、上記のような浮上圧力フィードバック制御機構(コントローラ110、浮上高測定部82、第1給気部44、吸引排気部46)が正常に機能していても、基板浮上高HGの局所的な異常(盛り上がり)を見逃すことがある。 In this case, even if the flying pressure feedback control mechanism (the controller 110, the flying height measuring unit 82, the first air supply unit 44, and the suction / exhaust unit 46) as described above is functioning normally, the substrate flying height H G is locally increased. May miss common abnormalities (swells).

しかし、浮上高監視部86は、監視ライン上のどこかで基板Gの浮上高HGが浮上高設定値HSを定常的に(基板Gが通過している間)超えているときは、図7に示すように、光ビームLBが基板Gにより遮られることから(受光部90に届かないことから)、この異常事態を検知してコントローラ110に通報することができる。なお、基板Gの上面に異物が付いているときも、その異物によって光ビームLBが遮られるが、それは一時的であり、その異物が通り過ぎれば異常が解除されるので、容易に見分けがつく。 However, the flying height monitoring unit 86, when the flying height H G of the substrate G exceeds the flying height set value H S regularly (while the substrate G passes) somewhere on the monitoring line, As shown in FIG. 7, since the light beam LB is blocked by the substrate G (because it does not reach the light receiving unit 90), this abnormal situation can be detected and notified to the controller 110. Even when a foreign substance is attached to the upper surface of the substrate G, the light beam LB is blocked by the foreign substance, but this is temporary, and the abnormality is canceled if the foreign substance passes, so that it can be easily distinguished. .

コントローラ110は、浮上高監視部86からそのような基板浮上高に関する異常通報のモニタ信号を受け取った時は、浮上ステージ10の塗布領域MCOTにおいて少なくともスリットノズル14の直下付近で相当な数の吸引口18が目詰まりを起こしていると判定する。 When the controller 110 receives from the flying height monitoring unit 86 a monitor signal for reporting an abnormality related to the flying height of the substrate, a considerable number of suctions at least near the slit nozzle 14 in the coating area M COT of the flying stage 10. It is determined that the mouth 18 is clogged.

そして、コントローラ110は、上記のような吸引口18の目詰まりを判定(検出)した場合は、表示器(図示せず)を通じてアラームを出し、あるいはその履歴をとった上で、程よい時機に、たとえば所要のロット処理が済んだ後に、浮上ステージ吸引口掃除動作を実行制御する。   When the controller 110 determines (detects) the clogging of the suction port 18 as described above, it issues an alarm through a display (not shown) or takes its history, For example, after the required lot processing is completed, execution control of the floating stage suction port cleaning operation is performed.

この浮上ステージ吸引口掃除動作において、コントローラ110は、塗布処理に関係する動作(基板浮上動作、基板搬送動作、レジスト供給動作等)をいったん全てオフ状態にしてから、開閉弁78を開けて第2給気部48を作動させる。併せて、開閉弁56を開けて第1給気部48も作動させる。   In this levitation stage suction port cleaning operation, the controller 110 once turns off all the operations related to the coating process (substrate levitation operation, substrate transport operation, resist supply operation, etc.) and then opens the on-off valve 78 to perform the second operation. The air supply unit 48 is operated. At the same time, the opening / closing valve 56 is opened to operate the first air supply unit 48.

第1給気部44および第2給気部48は正圧気体供給源50に対して並列に接続され、それぞれにレギュレータ58、80が設けられているので、第1給気部44により噴出口16に供給するエアの圧力と第2給気部48により吸引口18に供給するエアの圧力とを独立に設定または調整することができる。通常、浮上ステージ吸引口掃除動作においては、第2給気部48により吸引口18に供給するエアの圧力を中に詰まった異物を吐き出すのに適した十分高めの値に調整し、第1給気部44により噴出口16に供給するエアの圧力を塵が入らない程度に比較的低めの値に調整するのが好ましい。   The first air supply unit 44 and the second air supply unit 48 are connected in parallel to the positive pressure gas supply source 50 and are provided with regulators 58 and 80, respectively. The pressure of the air supplied to 16 and the pressure of the air supplied to the suction port 18 by the second air supply unit 48 can be set or adjusted independently. Normally, in the levitation stage suction port cleaning operation, the pressure of the air supplied to the suction port 18 by the second air supply unit 48 is adjusted to a sufficiently high value suitable for discharging foreign matter clogged therein, and the first supply It is preferable to adjust the pressure of the air supplied to the jet outlet 16 by the air portion 44 to a relatively low value so that dust does not enter.

第2給気部48が作動することによって、正圧気体供給源50からのエア(圧縮空気)が上記のように第1給気ライン54→排気ライン66→第2マニホールド64を経由して塗布領域MCOT内の各吸引口18に送り込まれる。 By operating the second air supply unit 48, the air (compressed air) from the positive pressure gas supply source 50 is applied via the first air supply line 54 → the exhaust line 66 → the second manifold 64 as described above. It is sent to each suction port 18 in the area M COT .

図8に示すように、目詰まりを起こしている吸引口18においては、第2マニホールド64側からのエアの圧力により、ガス通路18aに挟まっていた異物Qが押し出されるようにして上方へ放出される。この時、第1給気部44も作動しているので、吸引口18より吐き出された異物Qが付近の噴出口16に入るおそれはない。   As shown in FIG. 8, at the suction port 18 that is clogged, the foreign matter Q sandwiched in the gas passage 18a is released upward by the pressure of the air from the second manifold 64 side. The At this time, since the first air supply unit 44 is also operating, there is no possibility that the foreign matter Q discharged from the suction port 18 enters the nearby outlet 16.

一方で、コントローラ110は、スリットノズル14をノズルリフレッシュ部24よりも高い位置まで上昇させた後に、ノズルリフレッシュ部24をスリットノズル14の真下の位置までスライド移動させて、図8に示すように、ノズルリフレッシュ部24のケーシング92の下面に取り付けている面状の吸い取りヘッド102を浮上ステージ10の塗布領域MCOTの上に覆い被せる。そして、開閉弁108を開けて、排気装置104を作動させる(図4)。 On the other hand, the controller 110 raises the slit nozzle 14 to a position higher than the nozzle refresh section 24, and then slides the nozzle refresh section 24 to a position directly below the slit nozzle 14, as shown in FIG. The planar suction head 102 attached to the lower surface of the casing 92 of the nozzle refreshing unit 24 is covered on the coating area M COT of the floating stage 10. Then, the on-off valve 108 is opened to operate the exhaust device 104 (FIG. 4).

これにより、吸引口18より吐き出された異物Qは、エアと一緒に速やかに吸い取りヘッド102に吸い取られ、排気管106を通って排気装置104へ送られる。   As a result, the foreign matter Q discharged from the suction port 18 is quickly sucked into the suction head 102 together with the air, and sent to the exhaust device 104 through the exhaust pipe 106.

第2給気部48によって吸引口18より吐き出された異物Qを捕集するための別の好適な実施例として、図9に示すように、下面に粘着シート112を貼り付けたダミー基板114を塗布領域MCOTの上に覆い被せる方式も可能である。この場合、吸引口18より吐き出された異物Qは、粘着シート112に吸着されるので、浮上ステージ10の上に巻き上がったり再付着するようなことはない。 As another preferred embodiment for collecting the foreign matter Q discharged from the suction port 18 by the second air supply unit 48, as shown in FIG. 9, a dummy substrate 114 having an adhesive sheet 112 attached to the lower surface is provided. A method of covering the coating area M COT is also possible. In this case, the foreign matter Q discharged from the suction port 18 is adsorbed by the pressure-sensitive adhesive sheet 112, so that it does not roll up or reattach to the floating stage 10.

なお、ダミー基板114は、浮上ステージ吸引口掃除動作の開始に先立って、被処理基板Gと同様にして浮上ステージ10の搬入領域MINに搬入され、搬送機構12によって塗布領域MCOTまで浮上搬送で移送される。そして、浮上ステージ吸引口掃除動作の終了後に、搬送機構12によって搬出領域MOUTへ移送され、搬出領域MOUTから浮上ステージ10の外へ搬出される。 The dummy substrate 114, prior to the start of the floating stage suction port cleaning operation, is carried into the carry-region M IN of floating stage 10 in the same manner as the target substrate G, levitation transportation until coating area M COT by the transport mechanism 12 It is transported by. Then, after the levitation stage suction port cleaning operation is completed, it is transferred to the carry-out area M OUT by the transfer mechanism 12 and carried out of the levitation stage 10 from the carry-out area M OUT .

このように、このレジスト塗布装置においては、浮上ステージ10の塗布領域MCOTに噴出口16と混在して設けられている吸引口18が吸引動作を行っている間(主に塗布処理中)に浮上ステージ10の周囲に漂っている異物を不所望に吸い込んでしまい、それによって吸引口18の中が異物で詰まることがある。しかし、この実施形態によれば、塗布処理が休止している時、または塗布処理の合間に、吸引排気部44を停止させて第2給気部48を作動させることにより、吸引口18の目詰まりを人手を要することなく自動的かつ効率的に除去することができる。 As described above, in this resist coating apparatus, while the suction port 18 provided in the coating region MCOT of the levitation stage 10 in a mixed manner with the jet port 16 is performing the suction operation (mainly during the coating process). Foreign matter drifting around the levitation stage 10 may be sucked undesirably, and the inside of the suction port 18 may be clogged with foreign matter. However, according to this embodiment, when the coating process is paused or during the coating process, the suction / exhaust unit 44 is stopped and the second air supply unit 48 is operated, so that the eyes of the suction port 18 can be operated. The clogging can be automatically and efficiently removed without human intervention.

また、スリットノズル14の直下付近に設定されたY方向に延びる監視ライン上のどこかで基板Gの浮上高HGが浮上高設定値HSを定常的に(基板Gが通過している間)超えているときは、浮上高監視部86によりその異常事態を的確に検出することができる。そして、コントローラ110は、浮上高監視部86からそのような基板浮上高に関する異常通報のモニタ信号を受け取った時は、スリットノズル14の直下付近で相当な数の吸引口18が目詰まりを起こしていると判定し、浮上ステージ吸引口掃除動作を実行する最適な時機を見つけることができる。 Further, the flying height H G of the substrate G is constantly at the flying height set value H S (while the substrate G is passing) somewhere on the monitoring line extending in the Y direction set near the slit nozzle 14. ) When it exceeds, the flying height monitoring unit 86 can accurately detect the abnormal situation. When the controller 110 receives a monitor signal for reporting an abnormality related to the substrate flying height from the flying height monitoring unit 86, a considerable number of suction ports 18 are clogged near the slit nozzle 14. It is possible to find the optimal time to execute the floating stage suction port cleaning operation.

以上、本発明の好適な実施形態を説明したが、本発明は上述した実施形態に限定されるものではなく、その技術的思想の範囲内で種種の変形または変更が可能である。   The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications or changes can be made within the scope of the technical idea.

たとえば、図10に示すように、第2給気部48の第2給気ライン76を第1給気ライン54から分岐させて排気ライン66へ接続するバイパス方式も可能である。この場合、第1給気ライン54と第2給気ライン76とのノードおよび第2給気ライン76と排気ライン66とのノードに切換弁たとえば3方弁116,118をそれぞれ設ける。   For example, as shown in FIG. 10, a bypass system in which the second supply line 76 of the second supply unit 48 is branched from the first supply line 54 and connected to the exhaust line 66 is also possible. In this case, switching valves such as three-way valves 116 and 118 are provided at nodes of the first air supply line 54 and the second air supply line 76 and nodes of the second air supply line 76 and the exhaust line 66, respectively.

また、第2給気ライン76の途中に圧縮タンク120を設けて、正圧気体供給源50からの正圧気体を圧縮タンク120内で圧縮し、開閉弁78を断続的かつパルス的にオンさせることより、図11に示すように原圧力Psよりも格段に高い圧力Pupのエアを浮上ステージ10の吸引口18に断続的かつ衝撃的に供給し、吸引口18の中に詰まっている異物Qを効果的に除去することができる。 Further, a compression tank 120 is provided in the middle of the second air supply line 76 to compress the positive pressure gas from the positive pressure gas supply source 50 in the compression tank 120, and the on-off valve 78 is turned on intermittently and in pulses. As a result, as shown in FIG. 11, air having a pressure P up that is significantly higher than the original pressure P s is intermittently and shockfully supplied to the suction port 18 of the levitation stage 10, and is clogged in the suction port 18. The foreign matter Q can be effectively removed.

なお、図10の構成例においては、3方弁116を第2給気ライン76に切り換えるときは、正圧気体供給源50からの正圧気体は浮上ステージ10の噴出口16には供給されなくなる。このように、浮上ステージ吸引口掃除動作を実行するときは、第1給気部44を完全停止させておくことも可能である。もっとも、3方弁116を省いて、第2給気部48と同時に第1給気部44も作動させることにより、浮上ステージ吸引口掃除動作中に吸引口18と一緒に噴出口16にもエアを供給することはもちろん可能である。   In the configuration example of FIG. 10, when the three-way valve 116 is switched to the second air supply line 76, the positive pressure gas from the positive pressure gas supply source 50 is not supplied to the jet outlet 16 of the levitation stage 10. . As described above, when the floating stage suction port cleaning operation is executed, the first air supply unit 44 can be completely stopped. However, by omitting the three-way valve 116 and operating the first air supply unit 44 at the same time as the second air supply unit 48, air is also supplied to the outlet 16 together with the suction port 18 during the levitation stage suction port cleaning operation. It is of course possible to supply

図示省略するが、第2給気部48に、工場用力の正圧気体供給源50とは異なる独立した正圧気体供給源を用いることも可能である。さらには、吸引排気部46のファン70を逆回転可能に構成して、第2給気部76用の正圧気体供給源に用いることも可能である。その場合は、排気ライン66をそのまま第2給気ライン76として用いることができる。   Although not shown, it is also possible to use an independent positive pressure gas supply source that is different from the positive pressure gas supply source 50 of the factory power, for the second air supply unit 48. Furthermore, the fan 70 of the suction / exhaust unit 46 can be configured to be reversely rotated and used as a positive pressure gas supply source for the second air supply unit 76. In that case, the exhaust line 66 can be used as the second air supply line 76 as it is.

また、第2給気部48により浮上ステージ10の吸引口18に与える清掃用の圧力を一段ないし数段高めるために、図12Aおよび図12Bに示すように、浮上ステージ10の塗布領域MCOTに設けられる全ての吸引口18を複数の組に分割し、組単位で開閉弁122(1), 122(2), 122(3), 122(4)・・を介して第2給気ライン76に接続する構成を好適に採ることができる。 Further, in order to increase the cleaning pressure applied to the suction port 18 of the levitation stage 10 by the second air supply section 48, as shown in FIGS. 12A and 12B, the application area M COT of the levitation stage 10 is increased. All the suction ports 18 to be provided are divided into a plurality of groups, and the second air supply line 76 is connected through the on-off valves 122 (1), 122 (2), 122 (3), 122 (4),. The structure which connects to can be taken suitably.

第2給気部48を作動させるときは、つまり浮上ステージ吸引口掃除動作を実行するときは、コントローラ110により組単位で時分割的に開閉弁122(1), 122(2), 122(3), 122(4)・・・をオンにして、各吸引口18に集中的に高い圧力のエアを供給する。   When the second air supply unit 48 is operated, that is, when the floating stage suction port cleaning operation is executed, the controller 110 performs time-sharing on-off valves 122 (1), 122 (2), 122 (3 ), 122 (4)... Are turned on, and high-pressure air is intensively supplied to the suction ports 18.

なお、浮上ステージ10の塗布領域MCOTにおいて噴出口16と吸引口18とを混在させて配置するパターンは任意であり、図示の配列パターンに限定されるものではない。 In addition, the pattern which mixes and arrange | positions the jet nozzle 16 and the suction port 18 in the application area | region MCOT of the levitation | floating stage 10 is arbitrary, and is not limited to the arrangement pattern of illustration.

また、浮上高監視部86の機能から独立して、上記のような浮上ステージ吸引口掃除動作を定期的に実施することも可能である。   In addition, it is possible to periodically perform the above-described flying stage suction port cleaning operation independently of the function of the flying height monitoring unit 86.

本発明における処理液としては、レジスト液以外にも、たとえば層間絶縁材料、誘電体材料、配線材料等の塗布液も可能であり、各種薬液、現像液やリンス液等も可能である。本発明における被処理基板はLCD基板に限らず、他のフラットパネルディスプレイ用基板、半導体ウエハ、CD基板、フォトマスク、プリント基板等も可能である。   In addition to the resist solution, for example, a coating solution such as an interlayer insulating material, a dielectric material, and a wiring material can be used as the processing solution in the present invention, and various chemical solutions, developing solutions, rinse solutions, and the like are also possible. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates and the like are also possible.

10 浮上ステージ
12 搬送機構
14 スリットノズル
16 噴出口
18 吸引口
40 レジスト供給機構
44 第1給気部
46 吸引排気部
48 第2給気部
110 コントローラ
DESCRIPTION OF SYMBOLS 10 Floating stage 12 Conveyance mechanism 14 Slit nozzle 16 Jet outlet 18 Suction port 40 Resist supply mechanism 44 1st air supply part 46 Suction exhaust part 48 2nd air supply part 110 Controller

Claims (20)

多数の噴出口と多数の吸引口とが混在して設けられた第1の浮上領域を有する浮上ステージと、
前記噴出口より噴き出す気体の圧力によって被処理基板を浮上させるために、前記噴出口に第1のマニホールドを介して正圧の気体を供給する第1の給気部と、
前記吸引口に気体を吸い込む吸引力によって前記基板の浮上高を制御するために、前記吸引口に第2のマニホールドを介して負圧を与える吸引排気部と、
前記浮上ステージ上で空中に浮く前記基板を保持して前記第1の浮上領域を通過するように搬送する搬送機構と、
前記第1の浮上領域の上方に配置されるノズルを有し、前記第1の浮上領域を通過する前記基板上に前記ノズルより処理液を供給する処理液供給部と、
前記吸引口の中を掃除するために、前記吸引口に前記第2のマニホールドを介して正圧の気体を供給する第2の給気部と
を有する塗布装置。
A levitation stage having a first levitation region provided with a mixture of a large number of jet outlets and a large number of suction ports;
A first air supply unit for supplying a positive pressure gas to the jet port via the first manifold in order to float the substrate to be processed by the pressure of the gas jetted from the jet port;
A suction exhaust unit that applies a negative pressure to the suction port via a second manifold in order to control the flying height of the substrate by a suction force that sucks gas into the suction port;
A transport mechanism that holds the substrate floating in the air on the levitation stage and transports the substrate so as to pass through the first levitation region;
A processing liquid supply unit having a nozzle disposed above the first floating region, and supplying a processing liquid from the nozzle onto the substrate passing through the first floating region;
A second air supply unit that supplies a positive pressure gas to the suction port via the second manifold in order to clean the inside of the suction port.
前記第2の給気部を作動させている間、前記第1の浮上領域の一部または全部を上から覆って、前記吸引口より噴き出す気体の中に混じっている異物を吸い取る面状の吸い取り部を有する、請求項1に記載の塗布装置。  While operating the second air supply section, a part of the first levitation region is covered from above, and a surface suction device that absorbs foreign matter mixed in the gas ejected from the suction port. The coating apparatus of Claim 1 which has a part. 前記第2の給気部を作動させている間、前記第1の浮上領域の一部または全部を上から覆って、前記吸引口より噴き出す気体の中に混じっている異物を吸着する面状の吸着部を有する、請求項1に記載の塗布装置。  While operating the second air supply unit, a planar shape that covers a part or all of the first floating region from above and adsorbs foreign matters mixed in the gas ejected from the suction port. The coating apparatus according to claim 1, further comprising an adsorption unit. 前記面状吸着部は、前記浮上ステージ上で前記基板と同様に前記基板搬送部により搬送可能であり、前記第2の給気部の作動が開始される前または開始された直後に前記第1の浮上領域の上に持ち込まれ、前記第2の給気部の作動が終了した後に前記第1の浮上領域の上から持ち去られる、請求項3に記載の塗布装置。  The planar suction unit can be transported by the substrate transport unit in the same manner as the substrate on the floating stage, and the first suction unit immediately before or after the operation of the second air supply unit is started. The coating apparatus according to claim 3, wherein the coating apparatus is carried over the first floating region and is removed from the first floating region after the operation of the second air supply unit is completed. 多数の噴出口と多数の吸引口とが混在して設けられた第1の浮上領域を有する浮上ステージと、
前記噴出口より噴き出す気体の圧力によって被処理基板を浮上させるために、前記噴出口に正圧の気体を供給する第1の給気部と、
前記吸引口に気体を吸い込む吸引力によって前記基板の浮上高を制御するために、前記吸引口に負圧を与える吸引排気部と、
前記浮上ステージ上で空中に浮く前記基板を保持して前記第1の浮上領域を通過するように搬送する搬送機構と、
前記第1の浮上領域の上方に配置されるノズルを有し、前記第1の浮上領域を通過する前記基板上に前記ノズルより処理液を供給する処理液供給部と、
前記吸引口の中を掃除するために前記吸引口に正圧の気体を供給する第2の給気部と、
前記第1の浮上領域における前記基板の浮上高を浮上高設定値に一致させるように、前記第1の給気部より前記噴出口に供給する気体の圧力および前記排気部より前記吸引口に与える真空の圧力の少なくとも一方を制御する浮上高制御部と、
前記ノズルの直下またはその付近で、前記基板の搬送方向と直交する水平方向に前記浮上高設定値に応じた所定の高さで前記浮上ステージの上を横断可能に投光される光ビームを用いて、前記基板の浮上高を光学的に監視する浮上高監視部と、
前記光ビームの横断伝搬路上のどこかで前記基板の浮上高が定常的に許容値を超えていることが前記浮上高監視部により検出されたときに、前記ノズルの直下またはその付近で一部の前記吸引口が詰まっていると判定する吸引口目詰まり検出部と
を有する塗布装置。
A levitation stage having a first levitation region provided with a mixture of a large number of jet outlets and a large number of suction ports;
A first air supply unit for supplying a positive pressure gas to the jet port in order to float the substrate to be processed by the pressure of the gas jetted from the jet port;
A suction exhaust unit that applies a negative pressure to the suction port in order to control the flying height of the substrate by a suction force that sucks gas into the suction port;
A transport mechanism that holds the substrate floating in the air on the levitation stage and transports the substrate so as to pass through the first levitation region;
A processing liquid supply unit having a nozzle disposed above the first floating region, and supplying a processing liquid from the nozzle onto the substrate passing through the first floating region;
A second air supply unit for supplying a positive pressure gas to the suction port in order to clean the inside of the suction port;
The pressure of the gas supplied from the first air supply unit to the ejection port and the suction port are applied to the suction port so that the flying height of the substrate in the first flying region matches the flying height set value. A flying height controller that controls at least one of the vacuum pressures;
Using a light beam projected so as to be able to cross over the flying stage at a predetermined height corresponding to the flying height setting value in a horizontal direction perpendicular to the substrate transport direction, immediately below or near the nozzle. A flying height monitoring unit for optically monitoring the flying height of the substrate;
When the flying height monitoring unit detects that the flying height of the substrate constantly exceeds an allowable value somewhere on the transverse propagation path of the light beam, a part of the substrate is directly below or near the nozzle. A suction port clogging detection unit that determines that the suction port is clogged.
前記吸引口の中を掃除する時は、前記第2の給気部を作動させて前記吸引口より気体を噴き出させると同時に、前記第1の給気部も作動させて前記噴出口より気体を噴き出させる、請求項1〜5のいずれか一項に記載の塗布装置。  When cleaning the inside of the suction port, the second air supply unit is operated to eject gas from the suction port, and at the same time, the first air supply unit is also operated to gas from the jet port. The coating apparatus as described in any one of Claims 1-5 which ejects. 前記吸引口の中を掃除する時は、前記第1の正圧気体供給部を停止または休止させた状態で、前記第2の給気部を作動させて前記吸引口より気体を噴き出させる、請求項1〜5のいずれか一項に記載の塗布装置。  When cleaning the inside of the suction port, in a state where the first positive pressure gas supply unit is stopped or suspended, the second air supply unit is operated and gas is ejected from the suction port. The coating apparatus as described in any one of Claims 1-5. 前記第2の給気部は、前記第1の給気部と共通の正圧気体供給源を含む、請求項1〜7のいずれか一項に記載の塗布装置。  The said 2nd air supply part is a coating device as described in any one of Claims 1-7 containing the positive pressure gas supply source common to a said 1st air supply part. 前記第1の給気部が、前記正圧気体供給源から前記噴出口まで延びる第1の給気ラインを有し、
前記排気部が、負圧発生源と、前記負圧発生源から前記吸引口まで延びる排気ラインとを有し、
前記第2の給気部が、前記給気ライン上の第1のノードから前記排気ライン上の第2のノードまで延びる第2の給気ラインを有する、
請求項8に記載の塗布装置。
The first air supply unit has a first air supply line extending from the positive pressure gas supply source to the jet port,
The exhaust unit includes a negative pressure generation source and an exhaust line extending from the negative pressure generation source to the suction port;
The second air supply unit has a second air supply line extending from a first node on the air supply line to a second node on the exhaust line;
The coating device according to claim 8.
前記第1および第2のノードの少なくとも一方に切換弁を設ける、請求項9に記載の塗布装置。  The coating apparatus according to claim 9, wherein a switching valve is provided on at least one of the first and second nodes. 前記第2の給気部が、前記正圧気体供給源から前記排気ライン上の所定のノードまで延びる第2の給気ラインを有する、請求項8に記載の塗布装置。  The coating apparatus according to claim 8, wherein the second air supply unit includes a second air supply line extending from the positive pressure gas supply source to a predetermined node on the exhaust line. 前記ノードに切換弁を設ける、請求項11に記載の塗布装置。  The coating device according to claim 11, wherein a switching valve is provided at the node. 前記第2の給気ライン上に開閉弁を設ける、請求項9または請求項11に記載の塗布装置。  The coating device according to claim 9 or 11, wherein an on-off valve is provided on the second air supply line. 前記第2の給気ライン上で前記正圧気体供給源からの正圧気体を圧縮するための圧縮タンクを有し、前記圧縮タンクにより圧縮された正圧気体を断続的かつ衝撃的に前記吸引口に供給する、請求項13に記載の塗布装置。  A compression tank for compressing the positive pressure gas from the positive pressure gas supply source on the second air supply line, and sucking the positive pressure gas compressed by the compression tank intermittently and shockingly; The coating device according to claim 13, which is supplied to a mouth. 前記第2の給気部は、前記第1の給気部が用いる正圧気体供給源とは別個の正圧気体供給源を含む、請求項1〜7のいずれか一項に記載の塗布装置。  The coating apparatus according to claim 1, wherein the second air supply unit includes a positive pressure gas supply source that is separate from the positive pressure gas supply source used by the first air supply unit. . 前記第1の浮上領域に設けられる前記吸引口を複数の組に分割し、前記第2の給気部を作動させるときは、組単位で時分割的に切り換えて前記吸引口の中を掃除する、請求項1〜15のいずれか一項に記載の塗布装置。  When the suction port provided in the first floating region is divided into a plurality of groups and the second air supply unit is operated, the suction port is cleaned by switching in a time-sharing manner in units. The coating apparatus as described in any one of Claims 1-15. 前記浮上ステージが、基板搬送方向において前記第1の浮上領域の上流側に前記基板を浮かせるための多数の噴出口を設けた第2の浮上領域を有する、請求項1〜16のいずれか一項に記載の塗布装置。  The said levitation | floating stage has a 2nd levitation | floating area | region which provided many jet nozzles for floating the said board | substrate in the upstream of the said 1st levitation | floating area in a board | substrate conveyance direction. The coating apparatus as described in. 前記第2の浮上領域内に、前記基板を搬入するための搬入部が設けられる、請求項17に記載の塗布装置。  The coating apparatus according to claim 17, wherein a loading unit for loading the substrate is provided in the second floating region. 前記浮上ステージが、基板搬送方向において前記第1の浮上領域の下流側に前記基板を浮かせるための多数の噴出口を設けた第3の浮上領域を有する、請求項1〜18のいずれか一項に記載の塗布装置。  The said levitation | floating stage has a 3rd levitation | floating area | region which provided many jet nozzles for floating the said board | substrate in the downstream of the said 1st levitation | floating area in a board | substrate conveyance direction. The coating apparatus as described in. 前記第3の浮上領域内に、前記基板を搬出するための搬出部が設けられる、請求項19に記載の塗布装置。  The coating apparatus according to claim 19, wherein an unloading unit for unloading the substrate is provided in the third floating region.
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