TWI475595B - Substrate transfer apparatus - Google Patents

Substrate transfer apparatus Download PDF

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TWI475595B
TWI475595B TW100106051A TW100106051A TWI475595B TW I475595 B TWI475595 B TW I475595B TW 100106051 A TW100106051 A TW 100106051A TW 100106051 A TW100106051 A TW 100106051A TW I475595 B TWI475595 B TW I475595B
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Taiwan
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substrate
floating
suction port
air supply
suction
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TW100106051A
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Chinese (zh)
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TW201202115A (en
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Toshifumi Inamasu
Isao Ozasa
Takao Takaki
Wataru Yoshitomi
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

Description

基板運送裝置Substrate transport device

本發明係關於包含在浮升平台上於被處理基板塗布處理液之塗布裝置之基板運送裝置。The present invention relates to a substrate transfer apparatus including a coating apparatus that applies a treatment liquid to a substrate to be processed on a floating platform.

於LCD等平面顯示器(FPD)製程中光微影程序內,經常使用非旋轉塗布法,以使用包含狹縫狀流出口之長條形狹縫噴嘴在被處理基板(玻璃基板等)上塗布光阻液。In a photolithography process such as a flat panel display (FPD) process such as an LCD, a non-spin coating method is often used to apply light to a substrate to be processed (a glass substrate or the like) using a long slit nozzle including a slit-shaped outflow port. Blocking liquid.

作為如此之非旋轉塗布法之一形式,已知一浮升方式,於用以支持基板之平台組裝基板浮升機構,在此浮升平台上使基板浮起至空中沿水平一方向(平台長邊方向)運送之,於運送途中既定位置自設置於平台上方之狹縫噴嘴朝通過正下方之基板呈帶狀使光阻液流出,藉此自基板上的一端至另一端塗布光阻液。As one form of such a non-rotation coating method, a floating manner is known to assemble a substrate floating mechanism on a platform for supporting a substrate, and the substrate is floated to the air in a horizontal direction on the floating platform (platform length) In the side direction, the photoresist is sprayed from one end to the other end of the substrate from a slit nozzle provided above the platform at a predetermined position during transport to the substrate through the substrate directly under the substrate.

相關浮升方式之非旋轉塗布法中,為在基板上以依設定之膜厚均一形成光阻液塗布膜,吾人要求在狹縫噴嘴流出口與基板之間設置,通常在100μm前後的微小間隙精確地維持在設定值或其附近。In the non-rotation coating method of the related floating method, in order to uniformly form a photoresist coating film on the substrate in accordance with the set film thickness, it is required to provide a slit between the slit nozzle outflow port and the substrate, usually a small gap of about 100 μm. Precisely maintained at or near the set point.

為滿足此要求條件,採用浮升方式之非旋轉塗布法之光阻塗布裝置不僅於浮升平台大致全區域以既定密度設置多數噴出高壓或正壓氣體,例如空氣之噴出口,更於在浮升平台上作為狹縫噴嘴正下方及其前後之區域設定之塗布區域,使以負壓吸入空氣之抽吸口混雜於噴出口之間。又,於該塗布區域內,針對通過該處之基板,保持自噴出口施加之垂直向上的壓力與自抽吸口施加之垂直向下的壓力之平衡,精細控制賦予基板之浮升壓力,使基板之浮升高度符合設定值(例如50μm)(例如專利文獻1)。In order to meet this requirement, the non-spin coating method of the floating coating method is not only disposed at a predetermined density in a substantially entire area of the floating platform, but also a plurality of high-pressure or positive-pressure gases, such as air outlets, and floats. The coating area set as the area immediately below the slit nozzle and the front and rear areas of the lifting platform is such that the suction port for taking in air by the negative pressure is mixed between the discharge ports. Further, in the coating region, the substrate is passed therethrough, and the vertical upward pressure applied from the discharge port is balanced with the vertical downward pressure applied from the suction port, and the floating pressure applied to the substrate is finely controlled to cause the substrate to be lifted. The floating height is in accordance with a set value (for example, 50 μm) (for example, Patent Document 1).

【先前技術文獻】[Previous Technical Literature]

【專利文獻】[Patent Literature]

【專利文獻1】日本特開2007-190483[Patent Document 1] Japanese Special Opening 2007-190483

如上述光阻塗布裝置雖在無塵室內運轉,但即使如此該光阻塗布裝置當然還是暴露於微小的微粒中,亦經常暴露於相對較大的灰塵、碎片等異物中。此等異物在蒙氣中漂流而來,或於維修時自外攜入,或是於維修作業中產生,有時亦因基板破裂或薄膜剝落產生。Although the above-described photoresist coating device operates in a clean room, even if the photoresist coating device is exposed to minute particles, it is often exposed to foreign matter such as relatively large dust or debris. These foreign objects drift in the air, or are carried out from the outside during maintenance, or during maintenance work, sometimes due to substrate cracking or film peeling.

無論如何,在如上述採用浮升方式之非旋轉塗布法之光阻塗布裝置中,浮升平台塗布區域抽吸口有時皆會不符本意地吸入漂浮於其周圍之異物,因此導致抽吸口中因異物阻塞。抽吸口一旦發生堵塞,該抽吸口其抽吸力即會無法及於通過其上之基板。In any case, in the photoresist coating apparatus of the non-rotation coating method using the floating method as described above, the suction port of the floating platform coating area sometimes inadvertently sucks foreign matter floating around it, thereby causing the suction port to be Blocked by foreign matter. Once the suction port is clogged, the suction port of the suction port cannot reach the substrate passing therethrough.

通常,於浮升平台塗布區域設有數千個以上的抽吸口。雖即使其中1個或2個發生堵塞對整體抽吸力亦完全無影響,但若約數百個抽吸口發生堵塞整體抽吸力即會顯著降低。且堵塞之抽吸口即使僅約數十個,若集中於狹窄之範圍,於其附近來自噴出口之浮力與來自抽吸口之引力之平衡亦會崩潰,基板浮升高度有時會局部性地高於設定值。於塗布區域(特別是狹縫噴嘴正下方附近)基板浮升高度若即使僅係局部性地高於設定值,在基板上形成之光阻塗布膜膜厚亦會變動,降低光微影精度及可靠度。Typically, there are thousands or more suction ports in the application area of the floating platform. Although even if one or two of the pluggings have no effect on the overall suction force, if about several hundred suction ports are blocked, the overall suction force is significantly reduced. Even if the suction port is only about tens of, if it is concentrated in the narrow range, the balance between the buoyancy from the discharge port and the gravity from the suction port will collapse in the vicinity, and the substrate float height may sometimes be local. The ground is higher than the set value. In the coating region (especially in the vicinity of the slit nozzle), if the substrate floating height is locally higher than the set value, the film thickness of the photoresist coating film formed on the substrate may fluctuate, thereby reducing the accuracy of photolithography and Reliability.

以往,為去除如上述浮升平台中抽吸口之堵塞,採用拆解浮升平台清掃抽吸口之方法,或是使外部吸塵器之抽吸頭抵住浮升平台上表面,自上抽吸阻塞於抽吸口中之異物以去除該異物之方法。In the past, in order to remove the clogging of the suction port in the above-mentioned floating platform, the method of cleaning the suction port by disassembling the floating platform is adopted, or the suction head of the external vacuum cleaner is pressed against the upper surface of the floating platform, and the suction is performed from above. A method of blocking foreign matter in the suction port to remove the foreign matter.

然而,拆解清掃方式作業非常麻煩,所需之人的勞力甚大,作業時間,亦即復原時間長亦遭厭惡。且使用外部吸塵器之方式有因抽吸頭抵住浮升平台而易於使浮升平台受損,或雖未及於拆解清掃方式之程度但仍需人力作業之缺點。However, the dismantling and cleaning method is very troublesome, and the people who need it are very laborious, and the working time, that is, the long recovery time, is also disgusted. Moreover, the use of an external vacuum cleaner has the disadvantage that the lifting head is easily damaged by the suction head against the floating platform, or that the cleaning method is not disassembled, but still requires manual work.

且以往無檢查浮升平台抽吸口是否發生堵塞之機構或功能。因此,因抽吸口堵塞而對光阻塗布膜膜厚造成影響時,有時至查明其原因止需耗費時間。另一方面,藉由如上述之拆解清掃或外 部掃除以短周期頻繁進行定期維修時,會導致人的勞力耗費甚大並降低裝置作動率。In the past, there was no mechanism or function for checking whether the suction port of the floating platform was blocked. Therefore, when the thickness of the photoresist coating film is affected by the clogging of the suction port, it may take time to find out the cause. On the other hand, by disassembling or cleaning as described above When the department sweeps frequently and regularly performs regular maintenance in a short period of time, it will cause people's labor to be very expensive and reduce the device actuation rate.

為解決如上述習知技術之問題點,本發明提供包含塗布裝置之基板運送裝置,可在裝置內隨時或是適時,自動且高效率地進行去除浮升平台中抽吸口堵塞之作業。In order to solve the problems of the above-mentioned prior art, the present invention provides a substrate transporting apparatus including a coating apparatus which can automatically and efficiently perform the operation of removing the clogging of the suction port in the floating platform at any time or in a timely manner in the apparatus.

本發明之基板運送裝置中,塗布裝置包含:浮升平台,具有混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;處理液供給部,具有配置於該第1浮升區域上方之噴嘴,在通過該第1浮升區域之該基板上自該噴嘴供給處理液;及第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體。In the substrate transfer device of the present invention, the coating device includes a floating platform having a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided, and a first gas supply portion is a gas discharged from the discharge port. The pressure raises the substrate to be processed, and supplies a positive pressure gas to the discharge port; and sucks the exhaust portion to control the floating height of the substrate by the suction force of the suction gas through the suction port, and gives the suction port a negative pressure a transport mechanism that transports the substrate floating in the air on the floating platform and passes through the first floating region; and the processing liquid supply portion is disposed above the first floating region The nozzle supplies the processing liquid from the nozzle on the substrate passing through the first floating region; and the second air supply portion sweeps the suction port to supply the positive pressure gas to the suction port.

上述構成中,設於浮升平台第1浮升區域之抽吸口有時會在進行抽吸動作之期間(主要在塗布處理中)不符本意地吸入漂浮於浮升平台周圍之異物,因此導致抽吸口中因異物阻塞。然而,依本發明,於塗布處理停歇時,或於塗布處理之空閒時間內,使抽吸排氣部停止而使第2供氣部作動,藉此可不需人手而自動且高效率地去除抽吸口之堵塞。In the above configuration, the suction port provided in the first floating region of the floating platform may inadvertently suck in foreign matter floating around the floating platform during the suction operation (mainly during the coating process), thus causing The suction port is blocked by foreign matter. However, according to the present invention, when the coating process is stopped, or during the idle time of the coating process, the suction/exhaust portion is stopped and the second air supply portion is actuated, whereby the pumping can be automatically and efficiently removed without human intervention. The mouthpiece is blocked.

1.一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體; 抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體;及面狀吸附部,以在使該第2供氣部作動之期間內,自上包覆該第1浮升區域一部分或全部,吸附混在自該抽吸口噴出之氣體中的異物;其中該面狀吸附部在該浮升平台上與該基板相同可藉由該運送機構運送之,在該第2供氣部作動開始前或開始後馬上將其攜入至該第1浮升區域上,在該第2供氣部作動結束後自該第1浮升區域上攜出。A substrate transfer apparatus comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first gas supply portion is caused by gas pressure ejected from the discharge port Processing the substrate to rise, and supplying a positive pressure gas to the discharge port; Pumping the exhaust portion to control the floating height of the substrate by the suction force of the suction gas through the suction port, and giving the suction port a negative pressure; the transport mechanism is transported, and the raft will float on the floating platform to The substrate is held in the air and passed through the first floating region; the second air supply portion sweeps the suction port, and the positive pressure gas is supplied to the suction port; and the planar adsorption portion is During the period in which the second air supply unit is actuated, a part or all of the first floating region is coated thereon, and foreign matter in the gas ejected from the suction port is adsorbed; wherein the planar adsorption portion is raised The platform is transported by the transport mechanism in the same manner as the substrate, and is carried to the first floating region immediately before or after the start of the second air supply portion, and is actuated in the second air supply portion. After the end, it is carried out from the first floating area.

2.一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體;浮升高度控制部,控制自該第1供氣部對該噴出口供給之氣體壓力、及自該抽吸排氣部賦予該抽吸口之真空壓力其中至少一者,俾該第1浮升區域中該基板之浮升高度與浮升高度設定值一致; 浮升高度監視部,使用可沿與該基板運送方向正交之水平方向以對應該浮升高度設定值之既定高度在該浮升平台上橫跨投光之光束,以光學方式監視該基板之浮升高度;及抽吸口堵塞偵測部,藉由該浮升高度監視部偵測到在該光束之橫跨傳遞通道上該基板浮升高度定期超過容許值時,判定該光束正下方或其附近一部分該抽吸口已阻塞。A substrate transporting apparatus comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first air supply portion is caused by gas pressure ejected from the discharge port Processing the substrate to rise, supplying a positive pressure gas to the discharge port; and sucking the exhaust portion to control the floating height of the substrate by the suction force of the suction gas through the suction port, and giving the suction port a negative pressure; Carrying, transporting the substrate floating up to the air on the floating platform and passing it through the first floating region; the second air supply portion sweeping the suction port to the suction a positive pressure gas is supplied to the port; and the floating height control unit controls at least one of a gas pressure supplied from the first air supply unit to the discharge port and a vacuum pressure applied to the suction port from the suction and exhaust unit.浮 the floating height of the substrate in the first floating region is consistent with the floating height setting value; The floating height monitoring unit optically monitors the substrate by traversing the light beam on the floating platform at a predetermined height corresponding to the set value of the floating height in a horizontal direction orthogonal to the substrate transport direction. And a suction port clogging detecting unit, wherein the floating height monitoring unit detects that the floating height of the substrate periodically exceeds an allowable value when the beam crosses the transmission path, and determines that the beam is directly below or A portion of the suction port near it is blocked.

3.一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體;其中在對該抽吸口中進行掃除時,使該第2供氣部作動,自該抽吸口使氣體噴出,同時亦使該第1供氣部作動,自該噴出口使氣體噴出;且藉由該第2供氣部對該抽吸口供給之氣體的壓力係相較於藉由該第1供氣部對該噴出口供給之氣體的壓力較高。A substrate transfer device comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first gas supply portion is caused by gas pressure ejected from the discharge port Processing the substrate to rise, supplying a positive pressure gas to the discharge port; and sucking the exhaust portion to control the floating height of the substrate by the suction force of the suction gas through the suction port, and giving the suction port a negative pressure; Carrying, transporting the substrate floating up to the air on the floating platform and passing it through the first floating region; the second air supply portion sweeping the suction port to the suction a positive pressure gas is supplied to the port; wherein when the suction port is swept, the second air supply unit is actuated to eject the gas from the suction port, and the first air supply unit is also actuated from the discharge port. The gas is ejected; and the pressure of the gas supplied to the suction port by the second air supply portion is higher than the pressure of the gas supplied to the discharge port by the first air supply portion.

4.如第1至3項中任一項之基板運送裝置,其中包含面狀吸取部,以在使該第2供氣部作動之期間內,自上包覆該第1浮升區域一部分或全部,吸取混在自該抽吸口噴出之氣體中的異物。4. The substrate transfer device according to any one of the items 1 to 3, further comprising a planar suction portion for covering a portion of the first floating region from above during operation of the second air supply portion or All, the foreign matter mixed in the gas ejected from the suction port is sucked.

5.如第1或2項之基板運送裝置,其中在對該抽吸口中進行掃除時,以使該第1供氣部停止或停歇之狀態,令該第2供氣部作動,自該抽吸口使氣體噴出。5. The substrate transporting apparatus according to the first or second aspect, wherein the second air supply unit is actuated by the state in which the first air supply unit is stopped or stopped when the suction port is swept, and the pumping unit is actuated The suction port allows the gas to be ejected.

6.如第1至3項中任一項之基板運送裝置,其中該第2供氣部包含與該第1供氣部共通之正壓氣體供給源。The substrate transfer device according to any one of the items 1 to 3, wherein the second air supply unit includes a positive pressure gas supply source common to the first air supply unit.

7.如第6項之基板運送裝置,其中該第1供氣部包含自該正壓氣體供給源延伸至該噴出口之第1供氣管線,該抽吸排氣部包含負壓產生源,與自該負壓產生源延伸至該抽吸口之排氣管線,該第2供氣部包含自該供氣管線上的第1節點延伸至該排氣管線上的第2節點之第2供氣管線。[7] The substrate transfer device according to Item 6, wherein the first gas supply unit includes a first gas supply line extending from the positive pressure gas supply source to the discharge port, and the suction and exhaust unit includes a negative pressure generation source. And an exhaust line extending from the negative pressure generating source to the suction port, the second air supply portion including a second air supply extending from a first node on the air supply line to a second node on the exhaust line Pipeline.

8.如第7項之基板運送裝置,其中於該第1及第2節點其中至少一者設置切換閥。8. The substrate transfer device of item 7, wherein at least one of the first and second nodes is provided with a switching valve.

9.如第6項之基板運送裝置,其中該第2供氣部包含自該正壓氣體供給源延伸至該排氣管線上的既定節點之第2供氣管線。9. The substrate transport apparatus according to item 6, wherein the second air supply unit includes a second air supply line extending from the positive pressure gas supply source to a predetermined node on the exhaust line.

10.如第9項之基板運送裝置,其中於該節點設置切換閥。10. The substrate transport device of item 9, wherein the switching valve is provided at the node.

11.如第7項之基板運送裝置,其中在該第2供氣管線上設置開合閥。11. The substrate transfer device of item 7, wherein the opening and closing valve is provided on the second gas supply line.

12.如第11項之基板運送裝置,其中在該第2供氣管線上具有用以壓縮來自該正壓氣體供給源之正壓氣體之壓縮槽,間歇性且衝擊性地對該抽吸口供給藉由該壓縮槽壓縮之正壓氣體。[12] The substrate transfer device of item 11, wherein the second gas supply line has a compression groove for compressing a positive pressure gas from the positive pressure gas supply source, and intermittently and impactably supplies the suction port The positive pressure gas is compressed by the compression groove.

13.如第1項之基板運送裝置,其中該第2供氣部包含與該第1供氣部使用之正壓氣體供給源不同,另外的正壓氣體供給源。The substrate transfer device according to the first aspect, wherein the second air supply unit includes a positive pressure gas supply source different from the positive pressure gas supply source used by the first air supply unit.

14.如第1項之基板運送裝置,其中將該第1浮升區域中所設之該抽吸口分割為複數組,在使該第2供氣部作動時,以組為單位分時切換之,以對該抽吸口中進行掃除。[14] The substrate transfer device of the first aspect, wherein the suction port provided in the first floating region is divided into a plurality of arrays, and when the second air supply portion is actuated, time division is performed in units of groups. In order to sweep the suction port.

15.如第1項之基板運送裝置,其中該浮升平台沿基板運送方向於該第1浮升區域上游側具有第2浮升區域,該第2浮升區域設有用以使該基板浮起之多數噴出口。[15] The substrate transfer device of the first aspect, wherein the floating platform has a second floating region on the upstream side of the first floating region in the substrate transporting direction, and the second floating region is provided to float the substrate Most of the spouts.

16.如第15項之基板運送裝置,其中於該第2浮升區域內,設有用以送入該基板之送入部。16. The substrate transfer device according to item 15, wherein the second floating region is provided with a feeding portion for feeding the substrate.

17.如第1項之基板運送裝置,其中該浮升平台沿基板運送方向於該第1浮升區域下游側具有第3浮升區域,該第3浮升區域設有用以使該基板浮起之多數噴出口。17. The substrate transport apparatus according to Item 1, wherein the floating platform has a third floating region on a downstream side of the first floating region along a substrate transporting direction, and the third floating region is provided to float the substrate Most of the spouts.

18.如第17項之基板運送裝置,其中於該第3浮升區域內,設有用以送出該基板之送出部。18. The substrate transfer device according to item 17, wherein a delivery portion for feeding the substrate is provided in the third floating region.

依本發明基板運送裝置中之塗布裝置,藉由如上述之構成及作用,可在裝置內隨時或是適時,自動且高效率地進行去除浮升平台中抽吸口堵塞之作業。According to the coating apparatus in the substrate transfer apparatus of the present invention, by the above-described configuration and action, the operation of removing the suction port clogging in the floating platform can be automatically and efficiently performed in the apparatus at any time or in a timely manner.

以下,參照附圖說明本發明之適當實施形態。Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

圖1及圖2顯示本發明一實施形態基板運送裝置中光阻塗布裝置之主要構成。圖1係略俯視圖,圖2係基板運送方向之略前視圖。1 and 2 show the main components of a photoresist coating apparatus in a substrate transfer apparatus according to an embodiment of the present invention. Figure 1 is a schematic plan view, and Figure 2 is a front elevational view of the substrate transport direction.

此光阻塗布裝置採用浮升方式之非旋轉塗布法,如圖1所示,包含:浮升平台10,藉由氣體壓力使被處理基板,例如FPD用玻璃基板G浮起至空中;運送機構12,沿浮升平台長邊方向(X方向)運送在此浮升平台10上浮起至空中之基板G;及狹縫噴嘴14,對在浮升平台10上經運送之基板G上表面供給光阻液。The photoresist coating device adopts a non-spin coating method in a floating manner, as shown in FIG. 1 , and includes: a floating platform 10 that floats a substrate to be processed, such as a FPD glass substrate G, into the air by gas pressure; 12, transporting the substrate G floating up to the air on the floating platform 10 in the longitudinal direction of the floating platform (X direction); and the slit nozzle 14 for supplying light to the upper surface of the substrate G transported on the floating platform 10. Blocking liquid.

浮升平台10上表面沿基板運送方向(X方向)分隔為3個區域,亦即送入區域MIN 、塗布區域MCOT 及送出區域MOUT 。其中,於送入區域MIN 及送出區域MOUT ,以既定密度僅設置多數噴出口16,於塗布區域MCOT 以既定密度混雜設置多數噴出口16與抽吸口18。The upper surface of the floating platform 10 is divided into three regions along the substrate transport direction (X direction), that is, the feed region M IN , the coating region M COT , and the delivery region M OUT . Among them, in the feeding area M IN and the feeding area M OUT , only a plurality of discharge ports 16 are provided at a predetermined density, and a plurality of discharge ports 16 and suction ports 18 are provided in a predetermined density in the application region M COT .

於送入區域MIN ,設有用以自前段外部裝置藉由分類機構(未經圖示)以水平移動運送之方式,或是以自運送機械臂(未經圖示)傳遞之方式送入塗布處理前之基板G之基板送入部20(圖5)。於送出區域MOUT ,設有用以朝後段外部裝置藉由分類機構(未經圖示) 以水平移動運送之方式,或是以朝運送機械臂(未經圖示)傳遞之方式送出塗布處理完畢之基板G之基板送出部22(圖5)。The feeding area M IN is provided to be transported horizontally by a sorting mechanism (not shown) from the front external device, or is fed by a transfer robot (not shown). The substrate feeding portion 20 of the substrate G before processing (Fig. 5). The delivery area M OUT is provided to be transported horizontally by a sorting mechanism (not shown) to the rear external device, or to be sent to the transport robot (not shown). The substrate feeding portion 22 of the substrate G (Fig. 5).

於塗布區域MCOT 平台上方,以可昇降移動之方式設有狹縫噴嘴14,並以可與基板運送方向(X方向)平行水平移動之方式設有於塗布處理空閒時間重清狹縫噴嘴14之噴嘴重清部24(圖1、圖4)。A slit nozzle 14 is provided above the coating area M COT platform so as to be movable up and down, and is provided in the coating processing idle time to clear the slit nozzle 14 so as to be horizontally movable parallel to the substrate transport direction (X direction). The nozzle clearing portion 24 (Fig. 1, Fig. 4).

運送機構12如圖1所示,包含:一對導軌26A、26B,夾隔著浮升平台10沿X方向延伸;一對滑件28,可沿此等導軌26A、26B來回移動;及吸附墊等基板固持構件(未經圖示),設於滑件28,俾在浮升平台10上以可裝卸之方式固持基板G兩側端部;藉由直進移動機構(未經圖示)使滑件28沿基板運送方向(X方向)移動,藉此在浮升平台10上自送入區域MIN 通過塗布區域MCOT 朝送出區域MOUT 浮升運送基板G。As shown in FIG. 1, the transport mechanism 12 includes: a pair of guide rails 26A, 26B extending in the X direction across the floating platform 10; a pair of sliders 28 movable along the guide rails 26A, 26B; and an adsorption pad The substrate holding member (not shown) is disposed on the slider 28, and the end portion of the substrate G is detachably held on the floating platform 10; the slide is moved by a straight moving mechanism (not shown) The member 28 is moved in the substrate transport direction (X direction), whereby the self-feeding region M IN on the floating platform 10 floats the transport substrate G toward the delivery region M OUT through the coating region M COT .

狹縫噴嘴14沿與基板運送方向正交之水平方向(Y方向)橫跨浮升平台10上方,自狹縫狀流出口對通過其正下方之基板G上表面(被處理面)呈帶狀流出光阻液R。且狹縫噴嘴14藉由包含在與狹縫噴嘴14平行(沿Y方向)橫跨浮升平台10而設置之門形框30所安裝之例如滾珠螺桿機構32或引導構件34等(圖2)之噴嘴昇降機構36,可與支持此噴嘴14之噴嘴支持構件38一體沿鉛直方向(Z方向)移動(昇降)。且狹縫噴嘴14經由光阻供給管42連接光阻液容器或液體輸送泵等所構成之光阻供給機構40(圖5)。The slit nozzle 14 straddles the floating platform 10 in the horizontal direction (Y direction) orthogonal to the substrate transport direction, and is strip-shaped from the upper surface (processed surface) of the substrate G directly below the slit-shaped flow outlet. The photoresist R flows out. And the slit nozzle 14 is mounted by, for example, a ball screw mechanism 32 or a guide member 34 which is installed in a stile 30 which is disposed in parallel with the slit nozzle 14 (in the Y direction) across the floating platform 10 (FIG. 2). The nozzle elevating mechanism 36 is movable (lifting) in the vertical direction (Z direction) integrally with the nozzle supporting member 38 that supports the nozzle 14. Further, the slit nozzle 14 is connected to the photoresist supply mechanism 40 (FIG. 5) constituted by a photoresist liquid container or a liquid transfer pump via the photoresist supply tube 42.

如圖2所示,此光阻塗布裝置作為構成浮升平台10基板浮升機構之外接耗電設備,包含:浮升用第1供氣部44;浮升高度控制用抽吸排氣部46;及抽吸口掃除用第2供氣部48。As shown in FIG. 2, the photoresist coating apparatus is an external power consuming apparatus that constitutes a substrate lifting mechanism of the floating platform 10, and includes a first air supply unit 44 for lifting and a suction/exhaust unit 46 for floating height control. And the second air supply portion 48 for suction port cleaning.

浮升用第1供氣部44為藉由自浮升平台10噴出口16噴出之空氣壓力(昇力)使基板G浮升,對各噴出口16以所希望之壓力供給正壓空氣。更詳細而言,第1供氣部44包含: 正壓氣體供給源50,利用例如工廠設施之壓縮空氣源;氣體供給管或第1供氣管線54,自此正壓氣體供給源50延伸至浮升平台10內之第1歧管52;及開合閥56、調節器58及過濾器60,設於此第1供氣管線54途中。The floating first air supply unit 44 floats the substrate G by the air pressure (lifting force) ejected from the discharge port 16 of the floating platform 10, and supplies positive pressure air to the respective discharge ports 16 at a desired pressure. More specifically, the first air supply unit 44 includes: The positive pressure gas supply source 50 is extended from the positive pressure gas supply source 50 to the first manifold 52 in the floating platform 10 by using, for example, a compressed air source of a factory facility; a gas supply pipe or a first gas supply line 54; The opening and closing valve 56, the regulator 58, and the filter 60 are provided in the middle of the first air supply line 54.

開合閥56一旦開啟,即自正壓氣體供給源50通過供氣管線54將正壓氣體亦即空氣送入第1歧管52,自第1歧管52對浮升平台10各區域MIN 、MCOT 、MOUT 內所有噴出口16以既定壓力分配供給空氣。When the opening and closing valve 56 is opened, the positive pressure gas, that is, the air, is sent from the positive pressure gas supply source 50 to the first manifold 52 through the gas supply line 54. From the first manifold 52, the region of the floating platform 10 is M IN All of the discharge ports 16 in the M COT and M OUT distribute the supply air at a predetermined pressure.

浮升高度控制用抽吸排氣部46為藉由於抽吸口18吸入空氣之抽吸力嚴密控制塗布區域MCOT 內基板G之浮升高度HG (圖4),對各抽吸口18賦予適度負壓。更詳細而言,抽吸排氣部46包含:例如工廠設施之排氣導管62;排氣管或排氣管線66,自此排氣導管62延伸至浮升平台10內之第2歧管64;及開合閥68及風扇70,設於此排氣管線66途中。The floating height control suction and exhaust portion 46 closely controls the floating height H G (Fig. 4) of the substrate G in the coating region M COT by the suction force of the suction air from the suction port 18, for each of the suction ports 18 Give moderate pressure. In more detail, the suction exhaust portion 46 includes, for example, an exhaust conduit 62 of a factory facility; an exhaust pipe or exhaust line 66 from which the second manifold 64 extends into the floating platform 10 And the opening and closing valve 68 and the fan 70 are disposed on the way of the exhaust line 66.

開合閥68一旦開啟,旋轉驅動風扇70,於風扇70送入側產生之負壓即經由排氣管線66及第2歧管64傳抵塗布區域MCOT 內之抽吸口18。藉此,抽吸口18吸入浮升平台10上的空氣,通過第2歧管64及排氣管線66將經吸入之空氣送往風扇70,自風扇70送出側通過排氣管線66送往排氣導管62。When the opening and closing valve 68 is opened, the fan 70 is rotationally driven, and the negative pressure generated on the feeding side of the fan 70 is transmitted to the suction port 18 in the coating area M COT via the exhaust line 66 and the second manifold 64. Thereby, the suction port 18 sucks the air on the floating platform 10, and the sucked air is sent to the fan 70 through the second manifold 64 and the exhaust line 66, and is sent to the row through the exhaust line 66 from the sending side of the fan 70. Air duct 62.

抽吸口掃除用第2供氣部48包含:第2供氣管線76,自在正壓氣體供給源50與開合閥56之間所設置之第1供氣管線54上的第1節點72起延伸至在風扇70與第2歧管64之間所設置之排氣管線66上的第2節點74止;及開合閥78及調節器80,設於此第2供氣管線76途中。The second air supply portion 48 for the suction port cleaning includes the second air supply line 76 from the first node 72 on the first air supply line 54 provided between the positive pressure gas supply source 50 and the opening and closing valve 56. The second node 74 extends to the exhaust line 66 provided between the fan 70 and the second manifold 64; and the opening and closing valve 78 and the regulator 80 are disposed in the middle of the second air supply line 76.

一旦使抽吸排氣部46之風扇70停止,開啟第2供氣部48之開合閥78,即自正壓氣體供給源50使正壓氣體亦即空氣在第1供氣管線54→第1節點72→第2供氣管線76→第2節點74→排 氣管線66中流動而送入第2歧管64,自第2歧管64對浮升平台10塗布區域MCOT 內所有抽吸口18以既定壓力分配供給空氣。When the fan 70 of the suction and exhaust unit 46 is stopped, the opening and closing valve 78 of the second air supply unit 48 is opened, that is, the positive pressure gas supply source 50 is used to make the positive pressure gas, that is, the air in the first air supply line 54 → The first node 72 → the second air supply line 76 → the second node 74 → the exhaust line 66 flows into the second manifold 64, and all the suction in the region M COT is applied from the second manifold 64 to the floating platform 10 Port 18 distributes the supplied air at a predetermined pressure.

此光阻塗布裝置為以反饋控制使浮升平台10塗布區域MCOT 中基板G之浮升高度(自平台上表面之距離)HG 與設定值HS 一致,如圖3所示,於噴嘴支持構件38安裝有浮升高度測定部82(圖5)之光學式距離感測器84。通常於左右配置一對光學式距離感測器84,俾沿與基板運送方向正交之水平方向(Y方向)測定基板G左右兩側端部之浮升高度HG (圖2)。The photoresist coating device is configured such that the floating height of the substrate G in the coating region M COT of the floating platform 10 (the distance from the upper surface of the platform) H G is consistent with the set value H S , as shown in FIG. The support member 38 is mounted with an optical distance sensor 84 of the floating height measuring unit 82 (FIG. 5). Usually, a pair of optical distance sensors 84 are disposed on the left and right sides, and the floating height H G (Fig. 2) of the left and right end portions of the substrate G is measured in the horizontal direction (Y direction) orthogonal to the substrate transport direction.

此光學式距離感測器84光學測定自塗布處理用之既定高度位置起與正下方物體亦即浮升平台10之距離Da 及與基板G之距離Db 。浮升高度測定部82(圖5)自此等測定距離Da 、Db 與基板G厚度TG (既定值)藉由運算式[HG =Da -(Db +TG )]求取基板浮升高度HG 之測定值。The optical distance sensor 84 optically measures the distance D a from the immediately below object, that is, the floating platform 10 and the distance D b from the substrate G from a predetermined height position for the coating process. The floating height measuring unit 82 (FIG. 5) measures the distances D a and D b and the thickness G G (predetermined value) of the substrate G from the calculation formula [H G =D a -(D b +T G )]. Take the measured value of the substrate floating height H G .

此光阻塗布裝置更包含用以監視即使僅係局部性地,於狹縫噴嘴14正下方附近基板G浮升高度HG 在既定監視線上是否超過容許值之浮升高度監視部86(圖5)。The photoresist coating apparatus further includes a floating height monitoring unit 86 for monitoring whether or not the substrate G floating height H G is higher than a predetermined value on the predetermined monitoring line immediately below the slit nozzle 14 ( FIG. 5 ). ).

如圖3所示,此浮升高度監視部86夾隔著浮升平台10於其左右兩側,在以對應浮升高度設定值HS 之既定高度沿Y方向橫跨浮升平台10上的監視線上對向配置投光部88及受光部90。於塗布區域MCOT 基板G浮升高度HG 大致與浮升高度設定值HS 一致,且無論在浮升高度監視部86監視線上的何處基板表面皆平坦時,如圖3所示自投光部88投光之光束LB在基板G上勉強通過而抵達受光部90。然而,於監視線上某處基板G浮升高度HG 超過浮升高度設定值HS 時,光束LB於基板G側面或上表面反射而不抵達受光部90,故浮升高度監視部86可偵測該事態。As shown in FIG. 3, the floating height monitoring unit 86 sandwiches the floating platform 10 on the left and right sides thereof, and straddles the floating platform 10 in the Y direction at a predetermined height corresponding to the floating height setting value H S . The light projecting unit 88 and the light receiving unit 90 are disposed opposite to each other on the monitor line. The floating height H G of the coating area M COT substrate G substantially coincides with the floating height setting value H S , and the self-injection is shown in FIG. 3 regardless of where the substrate surface is flat on the monitoring line of the floating height monitoring unit 86. The light beam LB emitted by the light portion 88 barely passes through the substrate G and reaches the light receiving portion 90. However, when the substrate G floating height H G exceeds the floating height setting value H S at a certain position on the monitor line, the light beam LB is reflected on the side surface or the upper surface of the substrate G without reaching the light receiving portion 90, so the floating height monitoring portion 86 can detect Measure the situation.

此浮升高度監視部86之監視功能如後述,可利用來判斷於監視線附近浮升平台10之抽吸口18是否發生堵塞。The monitoring function of the floating height monitoring unit 86 can be used to determine whether or not the suction port 18 of the floating platform 10 is blocked in the vicinity of the monitoring line as will be described later.

圖4顯示噴嘴重清部24之構成。噴嘴重清部24於1座機殼92內併設有: 預塗處理部96,作為塗布處理之事前準備令狹縫噴嘴14流出少量光阻液以捲取該光阻液於預塗滾子94;噴嘴槽98,為防止乾燥之目的保持狹縫噴嘴14之流出口於溶劑蒸氣之蒙氣中;及狹縫噴嘴清洗部100,用以清洗狹縫噴嘴14流出口周邊部。FIG. 4 shows the configuration of the nozzle reclosing portion 24. The nozzle reclosing portion 24 is disposed in the one-seat housing 92 and is provided with: The precoating treatment portion 96 prepares the slit nozzle 14 as a pre-coating treatment to eject a small amount of photoresist liquid to wind the photoresist liquid to the precoat roller 94. The nozzle groove 98 holds the slit nozzle 14 for the purpose of preventing drying. The outlet is outletd in the atmosphere of the solvent vapor; and the slit nozzle cleaning unit 100 is for cleaning the peripheral portion of the outlet of the slit nozzle 14.

1次塗布處理結束之狹縫噴嘴14最初藉由狹縫噴嘴清洗部100接受清洗處理,接著於噴嘴槽98內待命,緊接在下一塗布處理開始前藉由預塗處理部96接受預塗處理。The slit nozzle 14 whose coating process is completed once is first subjected to the cleaning process by the slit nozzle cleaning unit 100, and then stands by in the nozzle groove 98, and is subjected to the precoating process by the precoating processing unit 96 immediately before the start of the next coating process. .

為使狹縫噴嘴14抵達噴嘴重清部24內各部(96、98、100),在控制器110(圖5)之控制下,藉由例如滾珠螺桿機構所構成之X方向移動部201(圖1)使噴嘴重清部24整體,亦即機殼92與基板運送方向(X方向)平行移動,並藉由噴嘴昇降機構36(圖1、圖5)使狹縫噴嘴14沿鉛直方向(Z方向)移動。In order to allow the slit nozzles 14 to reach the respective portions (96, 98, 100) in the nozzle refining portion 24, under the control of the controller 110 (Fig. 5), the X-direction moving portion 201 constituted by, for example, a ball screw mechanism (Fig. 5) 1) The entire nozzle clearing portion 24, that is, the casing 92 is moved in parallel with the substrate conveying direction (X direction), and the slit nozzle 14 is vertically oriented by the nozzle lifting mechanism 36 (Figs. 1 and 5). Direction) move.

此實施形態中,於噴嘴重清部24之機殼92下表面安裝有面狀吸取頭102,用於使預塗處理部96排氣之排氣裝置104經由排氣管106連接吸取頭102。於排氣管106設有開合閥108。此吸取頭102如後述,可用於掃除浮升平台10之抽吸口18時。In this embodiment, a surface pick-up head 102 is attached to the lower surface of the casing 92 of the nozzle refining portion 24, and the exhaust unit 104 for exhausting the pre-coating portion 96 is connected to the suction head 102 via the exhaust pipe 106. An opening and closing valve 108 is provided in the exhaust pipe 106. This suction head 102 can be used to sweep the suction port 18 of the floating platform 10 as will be described later.

圖5顯示此實施形態基板運送裝置中光阻塗布裝置控制系之主要構成。控制器110由微電腦所構成,自浮升高度測定部82、浮升高度監視部86等接收測定值或監控信號等,控制運送機構12、基板送入部20、基板送出部22、噴嘴重清部24、噴嘴昇降機構36、光阻供給機構40、第1供氣部44、抽吸排氣部46、第2供氣部48等各個動作與整體動作(程序)。且控制器110亦連接主控制器或其他外部裝置(未經圖示)。Fig. 5 shows the main configuration of a control system for a photoresist coating device in the substrate transfer device of this embodiment. The controller 110 is configured by a microcomputer, and receives measurement values, monitoring signals, and the like from the floating height measuring unit 82, the floating height monitoring unit 86, and the like, and controls the transport mechanism 12, the substrate feeding unit 20, the substrate sending unit 22, and the nozzle to clear the nozzle. Each operation and overall operation (program) of the portion 24, the nozzle elevating mechanism 36, the photoresist supply mechanism 40, the first air supply portion 44, the suction and exhaust portion 46, and the second air supply portion 48. And the controller 110 is also connected to a main controller or other external device (not shown).

在此說明此光阻塗布裝置中之光阻塗布動作。首先,自前段基板處理裝置(未經圖示)經由分類機構或運送機械臂將基板G送入浮升平台10之送入區域MIN ,在此待命之滑件28固持並接收基板G。在浮升平台10上基板G藉由自噴出孔16噴射之空氣壓力(昇力)浮起至空中。Here, the photoresist coating operation in the photoresist coating apparatus will be described. First, the substrate G is fed from the preceding substrate processing apparatus (not shown) to the feeding area M IN of the floating platform 10 via the sorting mechanism or the transport robot, where the standby slider 28 holds and receives the substrate G. On the floating platform 10, the substrate G is floated into the air by the air pressure (lifting force) ejected from the ejection holes 16.

如此以水平姿態沿基板運送方向(X方向)浮升運送基板G,通過平台中央部塗布區域MCOT 時,狹縫噴嘴14朝正下方之基板G以既定壓力或流量呈帶狀流出光阻液R,藉此如圖3所示自基板G前端側朝後端側形成膜厚均一之光阻液塗布膜RM。When the substrate G is lifted and transported in the horizontal direction in the substrate transport direction (X direction) and passed through the center portion coating region M COT , the slit nozzle 14 flows out of the substrate G at a predetermined pressure or flow rate toward the substrate G immediately below. R, thereby forming a photoresist film RM having a uniform film thickness from the front end side toward the rear end side of the substrate G as shown in FIG.

基板G後端一旦通過狹縫噴嘴14下,光阻塗布膜RM即形成於基板一整面。接著,其後亦藉由滑件28在浮升平台10上浮升運送基板G,自設定於浮升平台10後端之送出區域MOUT 經由分類機構或運送機械臂將基板送往後段單元(未經圖示)。Once the rear end of the substrate G passes through the slit nozzle 14, the photoresist coating film RM is formed on the entire surface of the substrate. Then, the substrate G is lifted and transported on the floating platform 10 by the slider 28, and the substrate is sent to the rear unit through the sorting mechanism or the transport robot arm from the delivery area M OUT set at the rear end of the floating platform 10. As shown).

其次,就圖6~圖9,說明此實施形態基板運送裝置中光阻塗布裝置之浮升平台抽吸口掃除功能。Next, the floating platform suction port sweeping function of the photoresist coating device in the substrate transfer device of this embodiment will be described with reference to Figs. 6 to 9 .

如圖6所示,於浮升平台10塗布區域MCOT 狹縫噴嘴14正下方附近全部或幾乎所有抽吸口18未發生堵塞時,在塗布處理中自各噴出口16噴出之空氣對基板G背面作用再由相鄰的抽吸口18迅速吸入。As shown in FIG. 6, when all or almost all of the suction ports 18 are not blocked near the lower side of the application section M COT slit nozzle 14 of the floating platform 10, the air ejected from each of the ejection ports 16 in the coating process is opposite to the back surface of the substrate G. The action is then quickly inhaled by the adjacent suction port 18.

控制器110關閉開合閥78並使第2供氣部48停止,使第1供氣部44與抽吸排氣部46同時作動,針對基板G通過塗布區域MCOT 內之部分,藉由自噴出口16噴出之空氣(壓縮空氣)施加垂直向上的力,同時自抽吸口18藉由負壓抽吸力施加垂直向下的力,控制相對抗之雙向力的平衡,藉此維持塗布用基板浮升高度HG 於設定值HS (例如50μm)附近。此時,控制器110可控制調節器58或風扇70,進行反饋控制,俾自浮升高度測定部82獲得之浮升高度測定值HG 與設定值HS 一致。The controller 110 closes the opening and closing valve 78 and stops the second air supply unit 48, and simultaneously operates the first air supply unit 44 and the suction and exhaust unit 46, and passes through the portion of the application region M COT for the substrate G by self-spraying. The air (compressed air) ejected from the outlet 16 applies a vertical upward force, and a vertical downward force is applied from the suction port 18 by a negative suction force to control the balance of the mutual resistance against the two-way force, thereby maintaining the substrate for coating. The float height H G is near the set value H S (for example, 50 μm). At this time, the controller 110 can control the regulator 58 or the fan 70 to perform feedback control, and the floating height measurement value H G obtained from the floating height measuring unit 82 coincides with the set value H S .

然而,如圖7所示,於浮升平台10塗布區域MCOT 中狹縫噴嘴14正下方附近,相當數量的抽吸口18於內側深處相對較窄的氣體通路18a有異物Q被夾住而發生堵塞時,於塗布處理中抽吸排氣部46之風扇70雖進行旋轉(抽吸排氣)動作,但發生堵塞之抽吸口18不產生抽吸力,故於其附近來自噴出口16之浮力與來自抽吸口18之引力之平衡會崩潰,基板浮升高度HG 局部性地高於設定值HSHowever, as shown in Fig. 7, in the vicinity of the slit nozzle 14 in the coating region M COT of the floating platform 10, a considerable number of suction ports 18 are sandwiched by the foreign matter Q in the relatively narrow gas passage 18a at the inner side. When the clogging occurs, the fan 70 that sucks the exhaust unit 46 during the coating process performs a rotation (suction and exhaust) operation, but the suction port 18 that is clogged does not generate a suction force, so that the suction port is in the vicinity thereof. The balance between the buoyancy of 16 and the gravitational force from the suction port 18 collapses, and the substrate float height H G is locally higher than the set value H S .

此時,如上述之浮升壓力反饋控制機構(控制器110、浮升高度測定部82、第1供氣部44、抽吸排氣部46)即使正常發揮功能,有時亦會未注意到基板浮升高度HG 局部性地異常(隆起)。At this time, the above-described floating pressure feedback control means (the controller 110, the floating height measuring unit 82, the first air supply unit 44, and the suction and exhaust unit 46) may not be noticed even if they function normally. The substrate float height H G is locally abnormal (bump).

然而,浮升高度監視部86於監視線上某處基板G浮升高度HG 定期(基板G通過之期間)超過浮升高度設定值HS 時,如圖7所示,光束LB因基板G而被遮蔽(不抵達受光部90),故可偵測此異常事態而通報控制器110。又,異物附著於基板G上表面時,雖亦因該異物光束LB受到遮蔽,但此係暫時者,若該異物通過異常即解除,故可輕易分辨。However, the height of the buoyant line monitoring portion 86 for monitoring the height somewhere substrate G H G buoyant periodically (during substrate by the G) exceeds a set value or floating height H S, shown in Figure 7, the light beam LB by the substrate G It is shielded (does not reach the light receiving unit 90), so the abnormality state can be detected and the controller 110 can be notified. Further, when the foreign matter adheres to the upper surface of the substrate G, the foreign matter beam LB is shielded. However, if the foreign matter is released by the abnormality, it can be easily distinguished.

控制器110在自浮升高度監視部86接收如此關於基板浮升高度之異常通報之監控信號時,判定於浮升平台10塗布區域MCOT 中至少在狹縫噴嘴14正下方附近相當數量之抽吸口18發生堵塞。When the controller 110 receives the monitoring signal regarding the abnormality notification of the substrate floating height degree from the floating height monitoring unit 86, it is determined that the pumping area 10 COT is at least a certain amount near the slit nozzle 14 in the coating stage 10 COT . The suction port 18 is clogged.

又,控制器110在如上述判定(偵測到)抽吸口18堵塞時,通過顯示器(未經圖示)發出警報,或是紀錄其經過情形後,於適當時機,例如於所需之批次處理完畢後,實行控制浮升平台抽吸口掃除動作。Moreover, when the controller 110 determines (detects) that the suction port 18 is clogged as described above, it issues an alarm through a display (not shown), or records the passing condition, at an appropriate timing, for example, in a desired batch. After the secondary treatment is completed, the suction port lifting operation of the floating platform is controlled.

此浮升平台抽吸口掃除動作中,控制器110暫且使所有關於塗布處理之動作(基板浮升動作、基板運送動作、光阻供給動作等)呈斷開狀態,再開啟開合閥78,使第2供氣部48作動。同時,開啟開合閥56,亦使第1供氣部48作動。又,關閉開合閥68。During the lifting operation of the lifting platform suction port, the controller 110 temporarily turns off all the operations of the coating process (substrate floating operation, substrate transporting operation, photoresist supply operation, etc.), and then opens the opening and closing valve 78. The second air supply unit 48 is actuated. At the same time, the opening and closing valve 56 is opened, and the first air supply portion 48 is also actuated. Also, the opening and closing valve 68 is closed.

第1供氣部44及第2供氣部48並列連接正壓氣體供給源50,分別設有調節器58、80,故可獨立設定或調整藉由第1供氣部44對噴出口16供給之空氣壓力與藉由第2供氣部48對抽吸口18供給之空氣壓力。通常,浮升平台抽吸口掃除動作中,宜調整藉由第2供氣部48對抽吸口18供給之空氣壓力為適於排出阻塞於其中之異物充分較高之數值,調整藉由第1供氣部44對噴出口16供給之空氣壓力為灰塵大致不侵入,相對較低之數值。The first air supply unit 44 and the second air supply unit 48 are connected to the positive pressure gas supply source 50 in parallel, and the regulators 58 and 80 are provided, so that the discharge port 16 can be independently supplied or adjusted by the first air supply unit 44. The air pressure and the air pressure supplied to the suction port 18 by the second air supply unit 48. Generally, in the suction operation of the suction platform suction port, it is preferable to adjust the air pressure supplied to the suction port 18 by the second air supply portion 48 to be a value suitable for discharging the foreign matter blocked therein, and the adjustment is performed by the first The air pressure supplied to the discharge port 16 by the air supply unit 44 is such that the dust does not substantially intrude and is relatively low.

藉由第2供氣部48作動,將來自正壓氣體供給源50之空氣(壓縮空氣)如上述經由第1供氣管線54→排氣管線66→第2歧管64送入塗布區域MCOT 內各抽吸口18。When the second air supply unit 48 is actuated, the air (compressed air) from the positive pressure gas supply source 50 is sent to the coating area M COT via the first air supply line 54 → the exhaust line 66 → the second manifold 64 as described above. Each suction port 18 is inside.

如圖8所示,發生堵塞之抽吸口18中,藉由來自第2歧管64側之空氣壓力,將夾在氣體通路18a之異物Q推出而朝上方釋出之。此時,第1供氣部44亦作動,故無自抽吸口18排出之異物Q侵入附近噴出口16之虞。As shown in FIG. 8, in the suction port 18 where the clogging occurs, the foreign matter Q trapped in the gas passage 18a is pushed out and released upward by the air pressure from the side of the second manifold 64. At this time, since the first air supply unit 44 is also actuated, the foreign matter Q discharged from the suction port 18 does not enter the vicinity of the discharge port 16 in the vicinity.

另一方面,控制器110令狹縫噴嘴14上昇至高於噴嘴重清部24之位置後,令噴嘴重清部24滑行移動至狹縫噴嘴14正下方之位置,如圖8所示,噴嘴重清部24安裝於機殼92下表面之面狀吸取頭102被覆在浮升平台10之塗布區域MCOT 上。又,開啟開合閥108,使排氣裝置104作動(圖4)。On the other hand, after the controller 110 raises the slit nozzle 14 to a position higher than the nozzle clearing portion 24, the nozzle clearing portion 24 is slidably moved to a position directly below the slit nozzle 14, as shown in FIG. The surface suction head 102 of the clear portion 24 mounted on the lower surface of the casing 92 is coated on the coating area M COT of the floating platform 10. Further, the opening and closing valve 108 is opened to actuate the exhaust unit 104 (Fig. 4).

藉此,自抽吸口18排出之異物Q與空氣一齊迅速由吸取頭102吸取,通過排氣管106送往排氣裝置104。Thereby, the foreign matter Q discharged from the suction port 18 is quickly taken up by the suction head 102 together with the air, and sent to the exhaust device 104 through the exhaust pipe 106.

作為用以搜集藉由第2供氣部48自抽吸口18排出之異物Q之另一適當實施例,如圖9所示,亦可採用將於下表面貼有黏著片112之虛擬基板114被覆在塗布區域MCOT 上之方式。此時,自抽吸口18排出之異物Q由黏著片112吸附,故不會在浮升平台10上被颳起或再附著。As another suitable embodiment for collecting the foreign matter Q discharged from the suction port 18 by the second air supply portion 48, as shown in FIG. 9, a dummy substrate 114 to which the adhesive sheet 112 is attached to the lower surface may be used. The manner of coating on the coating area M COT . At this time, the foreign matter Q discharged from the suction port 18 is adsorbed by the adhesive sheet 112, so that it is not scraped or reattached on the floating platform 10.

又,虛擬基板114在浮升平台抽吸口掃除動作開始前,先與被處理基板G相同被送入浮升平台10送入區域MIN ,藉由運送機構12以浮升運送之方式將其移置至塗布區域MCOT 。又,浮升平台抽吸口掃除動作結束後,藉由運送機構12將其移置至送出區域MOUT ,自送出區域MOUT 朝浮升平台10外送出。Further, the dummy substrate 114 is sent to the floating platform 10 to the region M IN in the same manner as the substrate G to be processed before the start of the lifting operation of the suction platform suction port, and is transported by the transport mechanism 12 in a floating manner. Displaced to the coating area M COT . Further, after the floating platform suction port sweeping operation is completed, the transport mechanism 12 is moved to the delivery area M OUT , and the self-delivery region M OUT is sent out to the floating platform 10 .

如此,於此光阻塗布裝置中,在浮升平台10塗布區域MCOT 中與噴出口16混雜設置之抽吸口18有時會於進行抽吸動作之期間(主要係在塗布處理中)不符本意地吸入漂浮於浮升平台10周圍之異物,因此導致抽吸口18中因異物而阻塞。然而,依此實施形態,於塗布處理停歇時,或塗布處理之空閒時間,使抽吸排氣部46停止而使第2供氣部48作動,藉此可不需人手而自動且高效率地去除抽吸口18之堵塞。As described above, in the photoresist coating apparatus, the suction port 18 which is provided in the floating region 10 in the application region M COT and which is mixed with the discharge port 16 may not coincide during the suction operation (mainly in the coating process). The foreign matter floating around the floating platform 10 is intentionally sucked, thereby causing the suction port 18 to be blocked by foreign matter. However, according to this embodiment, when the coating process is stopped or during the idle time of the coating process, the suction/exhaust portion 46 is stopped and the second air supply portion 48 is actuated, whereby the automatic and high-efficiency removal can be performed without human intervention. The suction port 18 is blocked.

且於在狹縫噴嘴14正下方附近所設定,沿Y方向延伸之監視線上某處基板G浮升高度HG 定期(基板G通過之期間)超過浮升高 度設定值HS 時,可藉由浮升高度監視部86準確偵測其異常事態。又,控制器110自浮升高度監視部86接收如此關於基板浮升高度之異常通報之監控信號時,可判定於狹縫噴嘴14正下方附近相當數量之抽吸口18發生堵塞,發現實行浮升平台抽吸口掃除動作之最佳時機。Further, when it is set near the slit nozzle 14, the floating height H G of the substrate G at a certain position on the monitoring line extending in the Y direction is periodically (the period during which the substrate G passes) exceeds the floating height set value H S , The floating height monitoring unit 86 accurately detects its abnormal state. Further, when the controller 110 receives the monitoring signal regarding the abnormality notification of the substrate floating height from the floating height monitoring unit 86, it can be determined that a considerable number of suction ports 18 are clogging near the slit nozzle 14 and it is found that the floating is performed. The best time to lift the platform suction port.

以上雖已說明本發明之適當實施形態,但本發明不由上述實施形態限定,於其技術性構想之範圍內可進行各種變形或變更。The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.

例如圖10所示,亦可採用使第2供氣部48之第2供氣管線76自第1供氣管線54分支而連接排氣管線66之旁通方式。此時,於第1供氣管線54與第2供氣管線76之節點及第2供氣管線76與排氣管線66之節點分別設有切換閥,例如3通閥116、118。For example, as shown in FIG. 10, a bypass mode in which the second air supply line 76 of the second air supply unit 48 is branched from the first air supply line 54 and the exhaust line 66 is connected may be employed. At this time, switching valves, for example, three-way valves 116 and 118, are provided at the nodes of the first gas supply line 54 and the second gas supply line 76 and the nodes of the second gas supply line 76 and the exhaust line 66, respectively.

且於第2供氣管線76途中設置壓縮槽120,於壓縮槽120內壓縮來自正壓氣體供給源50之正壓氣體,間歇性且脈衝性地導通開合閥78,以如圖11所示間歇性且衝擊性地對浮升平台10之抽吸口18供給大幅高於原壓力PS 之壓力PUP 之空氣,可有效去除阻塞於抽吸口18中之異物Q。A compression groove 120 is provided in the middle of the second gas supply line 76, and the positive pressure gas from the positive pressure gas supply source 50 is compressed in the compression groove 120, and the opening and closing valve 78 is intermittently and intermittently turned on as shown in FIG. The air which is supplied to the suction port 18 of the floating platform 10 intermittently and impactfully at a pressure substantially higher than the pressure P UP of the original pressure P S can effectively remove the foreign matter Q blocked in the suction port 18.

又,圖10之構成例中,切換3通閥116至第2供氣管線76時,無法對浮升平台10之噴出口16供給來自正壓氣體供給源50之正壓氣體。如此,實行浮升平台抽吸口掃除動作時,亦可完全使第1供氣部44停止。事實上,當然可省略3通閥116,與第2供氣部48同時亦使第1供氣部44作動,藉此於浮升平台抽吸口掃除動作中與抽吸口18一齊亦對噴出口16供給空氣。Moreover, in the configuration example of FIG. 10, when the three-way valve 116 to the second air supply line 76 are switched, the positive pressure gas from the positive pressure gas supply source 50 cannot be supplied to the discharge port 16 of the floating platform 10. In this manner, when the floating platform suction port sweeping operation is performed, the first air supply portion 44 can be completely stopped. In fact, the three-way valve 116 can of course be omitted, and the first air supply unit 44 can be actuated simultaneously with the second air supply unit 48, thereby simultaneously spraying the suction port 18 in the suction port suction operation of the floating platform. The outlet 16 supplies air.

雖省略圖示,但亦可於第2供氣部48使用與工廠設施之正壓氣體供給源50不同而獨立之正壓氣體供給源。且抽吸排氣部46之風扇70亦可反轉構成,用於第2供氣部48用之正壓氣體供給源。此時,排氣管線66可直接用作為第2供氣管線76。Although not shown in the drawings, a positive pressure gas supply source that is independent of the positive pressure gas supply source 50 of the factory facility may be used in the second air supply unit 48. Further, the fan 70 that sucks the exhaust unit 46 may be reversely configured to be used as a positive pressure gas supply source for the second air supply unit 48. At this time, the exhaust line 66 can be directly used as the second air supply line 76.

且為相當程度或大幅提高藉由第2供氣部48賦予浮升平台10之抽吸口18之清掃用壓力,如圖12A及圖12B所示,可適當採用將於浮升平台10之塗布區域MCOT 所設之所有抽吸口18分割為 複數組,以組為單位經由開合閥122(1)、122(2)、122(3)、122(4)‥連接第2供氣管線76之構成。Further, the cleaning pressure applied to the suction port 18 of the floating platform 10 by the second air supply portion 48 is considerably or greatly increased. As shown in FIGS. 12A and 12B, the coating of the floating platform 10 can be suitably employed. All the suction ports 18 provided in the area M COT are divided into multiple arrays, and the second gas supply line is connected in units of groups via the opening and closing valves 122(1), 122(2), 122(3), 122(4).. The composition of 76.

使第2供氣部48作動時,亦即實行浮升平台抽吸口掃除動作時,藉由控制器110以組為單位分時導通開合閥122(1)、122(2)、122(3)、122(4)…,對各抽吸口18集中供給高壓力空氣。When the second air supply unit 48 is actuated, that is, when the floating platform suction port sweeping operation is performed, the controller 110 turns on the opening and closing valves 122(1), 122(2), 122 in groups by time. 3), 122(4)..., high-pressure air is concentratedly supplied to each of the suction ports 18.

又,浮升平台10之塗布區域MCOT 中噴出口16與抽吸口18混雜配置之圖案係任意者,不由圖示之配列圖案所限定。Further, the pattern in which the discharge port 16 and the suction port 18 are mixed in the application region M COT of the floating platform 10 is arbitrary, and is not limited by the arrangement pattern shown in the drawing.

且亦可自浮升高度監視部86之功能獨立,定期實施如上述之浮升平台抽吸口掃除動作。Further, it is also possible to independently perform the function of the floating height monitoring unit 86, and periodically perform the above-described floating platform suction port cleaning operation.

其次,說明本發明之第2實施形態。又,與前述實施形態相同之部分省略說明。第2實施形態中,其特徵在於不使用圖9中所說明之虛擬基板114,代之以如圖13所示之吸附滾子151。吸附滾子151表面可黏著,於浮升平台10表面,藉由使吸附滾子151接觸、旋轉並同時使其移動,藉此可使異物Q黏住吸附滾子151表面。吸附滾子151亦可由人使其在浮升平台10上接觸、旋轉並同時移動以清掃之。或亦可設置使吸附滾子151昇降之吸附滾子昇降機構152,與使吸附滾子151水平移動之吸附滾子水平移動機構153,藉由控制器110控制吸附滾子昇降機構152與吸附滾子水平移動機構153,藉此使吸附滾子151自動移動以進行清掃。又,吸附滾子151可在黏著片上滾動藉此去除異物Q以再利用。或可清洗液清洗吸附滾子151藉此去除異物Q以再利用。Next, a second embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. In the second embodiment, the dummy substrate 114 described in Fig. 9 is not used, and the adsorption roller 151 shown in Fig. 13 is replaced. The surface of the adsorption roller 151 is adhered to the surface of the floating platform 10, and the foreign matter Q is adhered to the surface of the adsorption roller 151 by contacting, rotating, and simultaneously moving the adsorption roller 151. The absorbing roller 151 can also be contacted, rotated, and simultaneously moved by a person on the floating platform 10 to clean it. Alternatively, an adsorption roller lifting mechanism 152 for lifting and lowering the adsorption roller 151 and an adsorption roller horizontal moving mechanism 153 for moving the adsorption roller 151 horizontally may be provided, and the adsorption roller lifting mechanism 152 and the adsorption roller are controlled by the controller 110. The sub-horizontal moving mechanism 153 thereby automatically moves the adsorption roller 151 for cleaning. Further, the adsorption roller 151 can be rolled on the adhesive sheet to remove the foreign matter Q for reuse. Or the cleaning liquid washes the adsorption roller 151 to thereby remove the foreign matter Q for reuse.

其次,說明本發明之第3實施形態。又,與前述實施形態相同之部分省略說明。第3實施形態中,其特徵在於圖4中所說明之吸取頭102與塗布區域MCOT 寬度大致相同。藉此,可在更短時間內去除自抽吸口18排出之異物Q。且設於吸取頭102下表面之複數抽吸孔154宜設置為與抽吸口18之位置對應。藉此,可使抽吸口盡量窄小,不增大排氣裝置104之抽吸量,高效率地去除異物Q。Next, a third embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. In the third embodiment, the suction head 102 described in Fig. 4 has substantially the same width as the application region M COT . Thereby, the foreign matter Q discharged from the suction port 18 can be removed in a shorter time. The plurality of suction holes 154 provided on the lower surface of the suction head 102 are preferably disposed to correspond to the positions of the suction ports 18. Thereby, the suction port can be made as narrow as possible, and the amount of suction of the exhaust device 104 is not increased, and the foreign matter Q is efficiently removed.

又,吸取頭102雖以朝上方脫離浮升平台10之狀態抽吸異物Q,但吸取頭102亦可接觸浮升平台10,可更高效率地去除異物 Q。其中,即使藉由圖9中所說明之虛擬基板114亦可同樣地使虛擬基板114之浮升停止,令虛擬基板114接觸浮升平台10。Further, although the suction head 102 sucks the foreign matter Q in a state of being separated from the floating platform 10 upward, the suction head 102 can also contact the floating platform 10, and the foreign matter can be removed more efficiently. Q. However, even if the dummy substrate 114 illustrated in FIG. 9 is used, the floating of the dummy substrate 114 can be similarly stopped, and the dummy substrate 114 is brought into contact with the floating platform 10.

又,圖8中所說明之吸取頭102X方向之長度較塗布區域MCOT 短,故去除異物Q時,需令吸取頭102沿X方向掃描。在此,如前述圖12A及圖12B所示,將浮升平台10之塗布區域MCOT 中所設之所有抽吸口18分割為複數組,以組為單位經由開合閥122(1)、122(2)、122(3)、122(4)‥連接第2供氣管線76。又,亦可以組為單位進行抽吸口掃除動作,令吸取頭102沿X方向掃描俾對應其位置之移動,可以更高效率去除異物Q。Further, the length of the suction head 102X described in FIG. 8 is shorter than the application area M COT . Therefore, when the foreign matter Q is removed, the suction head 102 needs to be scanned in the X direction. Here, as shown in the aforementioned FIGS. 12A and 12B, all the suction ports 18 provided in the coating area M COT of the floating platform 10 are divided into a plurality of arrays, and the opening and closing valve 122 (1) is provided in units of groups. 122 (2), 122 (3), 122 (4): The second gas supply line 76 is connected. Further, the suction port sweeping operation may be performed in units of units, so that the suction head 102 scans in the X direction to move the position corresponding to the position, and the foreign matter Q can be removed with higher efficiency.

其次說明本發明之第4實施形態。又,與前述實施形態相同之部分省略說明。第4實施形態中,亦可在自第2供氣部48對抽吸口18供給空氣,進行抽吸口掃除動作前,於浮升平台10散布係光阻液溶劑之稀釋劑,在既定時間後對吸氣口18供給空氣,自抽吸口18排出異物Q。且亦可散布稀釋劑,於既定時間後藉由抽吸排氣部46使吸氣口18進行抽吸動作,抽吸去除稀釋劑及異物Q。又,亦可不使用稀釋劑而代之以純水或醇。且如此使用液體(稀釋劑、純水、醇等)時,可對吸氣口18供給空氣,自抽吸口18排出異物Q後於既定時間內自抽吸口18排出空氣,藉此使侵入吸氣口18之液體乾燥。且令吸氣口18進行抽吸動作,抽吸去除液體及異物Q時,亦可藉由於其後既定時間內持續進行抽吸動作,使侵入吸氣口18之液體乾燥。Next, a fourth embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. In the fourth embodiment, the air may be supplied to the suction port 18 from the second air supply unit 48, and the thin film of the photoresist liquid may be dispersed on the floating platform 10 before the suction port cleaning operation. Thereafter, air is supplied to the intake port 18, and the foreign matter Q is discharged from the suction port 18. Further, the diluent may be dispersed, and after a predetermined period of time, the suction port 18 is suctioned by the suction and exhaust portion 46 to remove the diluent and the foreign matter Q by suction. Further, instead of using a diluent, pure water or an alcohol may be used instead. When a liquid (diluent, pure water, alcohol, or the like) is used as described above, air can be supplied to the intake port 18, and the foreign matter Q is discharged from the suction port 18, and the air is discharged from the suction port 18 for a predetermined period of time, thereby invading. The liquid of the suction port 18 is dry. Further, when the suction port 18 is suctioned, and the liquid and the foreign matter Q are sucked and removed, the liquid that has entered the intake port 18 can be dried by continuing the suction operation for a predetermined period of time thereafter.

其次說明本發明之第5實施形態。又,與前述實施形態相同之部分省略說明。第5實施形態中,藉由控制器110控制圖10中之調節器58,實行浮升平台抽吸口掃除動作時,控制調節器58,設定空氣供給壓力高於通常時,藉此可以更高效率去除異物Q。Next, a fifth embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. In the fifth embodiment, when the regulator unit 58 of the controller 10 is controlled by the controller 110 to perform the floating platform suction port sweeping operation, the regulator 58 is controlled to set the air supply pressure to be higher than usual, thereby being higher. Efficiency removes foreign matter Q.

其次說明本發明之第6實施形態。又,與前述實施形態相同之部分省略說明。第6實施形態中,如圖14所示,其特徵在於以風扇155構成第2供氣部48。藉由使風扇155動作,可對第2歧管64供給空氣。風扇155以供氣管線156連接排氣管線66,於其連接部設有三通閥157,藉由切換三通閥157,可使吸氣口18連 接風扇70,或使抽吸口18連接風扇155。又,藉由控制器110控制風扇155與三通閥157。藉由如此構成,可使供氣‧排氣之配管單純,提升裝置可靠度。Next, a sixth embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. In the sixth embodiment, as shown in FIG. 14, the fan 155 constitutes the second air supply portion 48. By operating the fan 155, air can be supplied to the second manifold 64. The fan 155 is connected to the exhaust line 66 by the air supply line 156, and has a three-way valve 157 at the connecting portion thereof. By switching the three-way valve 157, the air inlet 18 can be connected. The fan 70 is connected or the suction port 18 is connected to the fan 155. Further, the fan 155 and the three-way valve 157 are controlled by the controller 110. According to this configuration, the piping for the air supply and the exhaust can be made simple, and the reliability of the device can be improved.

其次說明本發明之第7實施形態。又,與前述實施形態相同之部分省略說明。第7實施形態係第6實施形態之變形例。如圖15所示,於排氣管線66途中設有風扇70。在排氣導管62與風扇70之間設有三通閥158,在風扇70與第2歧管64之間設有三通閥159。且設有連接三通閥158與三通閥159之線160。且風扇70與三通閥159之間之排氣管線66連接大氣抽吸線161。且於大氣抽吸線161途中設有開合閥162。又,藉由控制器110控制三通閥158、三通閥159、開合閥162之切換。Next, a seventh embodiment of the present invention will be described. In addition, the description of the same portions as those of the above embodiment will be omitted. The seventh embodiment is a modification of the sixth embodiment. As shown in FIG. 15, a fan 70 is provided in the middle of the exhaust line 66. A three-way valve 158 is provided between the exhaust duct 62 and the fan 70, and a three-way valve 159 is provided between the fan 70 and the second manifold 64. A line 160 connecting the three-way valve 158 and the three-way valve 159 is provided. And an exhaust line 66 between the fan 70 and the three-way valve 159 is connected to the atmospheric suction line 161. An opening and closing valve 162 is provided in the middle of the atmospheric suction line 161. Further, the controller 110 controls the switching of the three-way valve 158, the three-way valve 159, and the opening and closing valve 162.

第7實施形態中,自抽吸口18抽吸時,關閉開合閥162,切換三通閥159俾連接第2歧管64與風扇70,切換三通閥158俾連接風扇70與排氣導管62。藉此,可自抽吸口18抽吸。其次,實施抽吸口18之掃除動作時,開啟開合閥162,切換三通閥158俾連接風扇70與線160,切換三通閥159俾連接線160與第2歧管64。藉此,對第2歧管64供給自大氣抽吸線161前端抽吸之空氣,實施抽吸口18之掃除動作。藉由如此構成與動作,僅藉由設置一座風扇70,可切換抽吸口18之抽吸動作與掃除動作,可減少風扇個數。In the seventh embodiment, when the suction port 18 is sucked, the opening and closing valve 162 is closed, the three-way valve 159 is switched, the second manifold 64 and the fan 70 are connected, and the three-way valve 158 is connected to the fan 70 and the exhaust duct. 62. Thereby, it can be sucked from the suction port 18. Next, when the cleaning operation of the suction port 18 is performed, the opening and closing valve 162 is opened, the three-way valve 158 is switched, the fan 70 and the wire 160 are connected, and the three-way valve 159 is connected to the wire 160 and the second manifold 64. Thereby, the air sucked from the tip end of the atmospheric suction line 161 is supplied to the second manifold 64, and the cleaning operation of the suction port 18 is performed. With such a configuration and operation, only by providing one fan 70, the suction operation and the cleaning operation of the suction port 18 can be switched, and the number of fans can be reduced.

作為本發明中之處理液,除光阻液以外,亦可係例如層間絕緣材料、介電材料、配線材料等塗布液,亦可係各種化學液、顯影液或潤洗液等。本發明中被處理基板不限於LCD基板,亦可係其他平面顯示器用基板、半導體晶圓、CD基板、光罩、印刷基板等。The treatment liquid in the present invention may be, for example, a coating liquid such as an interlayer insulating material, a dielectric material or a wiring material, or may be a chemical liquid, a developing solution or a rinsing liquid, in addition to the photoresist. The substrate to be processed in the present invention is not limited to an LCD substrate, and may be another substrate for a flat panel display, a semiconductor wafer, a CD substrate, a photomask, a printed substrate, or the like.

又,本實施形態中,雖已使用包含光阻塗布裝置之基板運送裝置說明本發明,但本發明不由包含光阻塗布裝置之基板運送裝置限定,亦可使用於使FPD基板或半導體晶圓等浮升之浮升平台,或FPD基板或半導體晶圓等檢查裝置,或用以運送FPD基板 或半導體晶圓等之機械臂手掌的抽吸固持部等,當然包含於權利範圍。Further, in the present embodiment, the present invention has been described using a substrate transfer device including a photoresist coating device. However, the present invention is not limited to a substrate transfer device including a photoresist coating device, and may be used for an FPD substrate or a semiconductor wafer. a floating platform, or an inspection device such as an FPD substrate or a semiconductor wafer, or used to transport an FPD substrate The suction holding portion of the palm of the robot arm such as a semiconductor wafer or the like is of course included in the scope of the right.

Da 、Db ‧‧‧測定距離D a , D b ‧‧‧Determination distance

G‧‧‧玻璃基板(基板)G‧‧‧glass substrate (substrate)

HG ‧‧‧浮升高度H G ‧‧‧Floating height

HS ‧‧‧設定值H S ‧‧‧Setting value

LB‧‧‧光束LB‧‧‧beam

MCOT ‧‧‧塗布區域M COT ‧‧‧ Coating area

MIN ‧‧‧送入區域M IN ‧‧‧Send area

MOUT ‧‧‧送出區域M OUT ‧‧‧Send area

PS ‧‧‧原壓力P S ‧‧‧ original pressure

PUP ‧‧‧壓力P UP ‧‧‧ pressure

Q‧‧‧異物Q‧‧‧ Foreign objects

RM‧‧‧光阻液塗布膜RM‧‧‧Photoresist coating film

R‧‧‧光阻液R‧‧‧ photoresist

TG‧‧‧厚度TG‧‧‧ thickness

10‧‧‧浮升平台10‧‧‧Floating platform

12‧‧‧運送機構12‧‧‧Transportation agencies

14‧‧‧狹縫噴嘴14‧‧‧Slit nozzle

16‧‧‧噴出口16‧‧‧Spray outlet

18a‧‧‧氣體通路18a‧‧‧ gas path

18‧‧‧抽吸口18‧‧ ‧ suction port

20‧‧‧基板送入部20‧‧‧Substrate feeding department

22‧‧‧基板送出部22‧‧‧Substrate delivery department

24‧‧‧噴嘴重清部24‧‧‧Nozzle Clearing Department

26A、26B‧‧‧導軌26A, 26B‧‧‧ rails

28‧‧‧滑件28‧‧‧Sliding parts

30‧‧‧門形框30‧‧‧Door frame

32‧‧‧滾珠螺桿機構32‧‧‧Rolling screw mechanism

34‧‧‧引導構件34‧‧‧Guiding components

36‧‧‧噴嘴昇降機構36‧‧‧Nozzle lifting mechanism

38‧‧‧噴嘴支持構件38‧‧‧Nozzle support member

40‧‧‧光阻供給機構40‧‧‧Light resistance supply agency

42‧‧‧光阻供給管42‧‧‧Light resistance supply tube

44‧‧‧第1供氣部44‧‧‧1st gas supply department

46‧‧‧抽吸排氣部46‧‧‧Sucking exhaust

48‧‧‧第2供氣部48‧‧‧2nd gas supply department

50‧‧‧正壓氣體供給源50‧‧‧ Positive pressure gas supply

52‧‧‧第1歧管52‧‧‧1st manifold

54‧‧‧第1供氣管線54‧‧‧1st gas supply line

56‧‧‧開合閥56‧‧‧Opening valve

58‧‧‧調節器58‧‧‧Regulator

60‧‧‧過濾器60‧‧‧Filter

62‧‧‧排氣導管62‧‧‧Exhaust duct

64‧‧‧第2歧管64‧‧‧2nd manifold

66‧‧‧排氣管線66‧‧‧Exhaust line

68‧‧‧開合閥68‧‧‧Opening valve

70‧‧‧風扇70‧‧‧fan

72‧‧‧第1節點72‧‧‧1st node

74‧‧‧第2節點74‧‧‧2nd node

76‧‧‧第2供氣管線76‧‧‧2nd gas supply line

78‧‧‧開合閥78‧‧‧Open valve

80‧‧‧調節器80‧‧‧Regulator

82‧‧‧浮升高度測定部82‧‧‧Floating height measurement department

84‧‧‧光學式距離感測器84‧‧‧Optical distance sensor

86‧‧‧浮升高度監視部86‧‧‧Floating height monitoring department

88‧‧‧投光部88‧‧‧Projecting Department

90‧‧‧受光部90‧‧‧Receiving Department

92‧‧‧機殼92‧‧‧Shell

94‧‧‧預塗滾子94‧‧‧Pre-coated roller

96‧‧‧預塗處理部96‧‧‧Pre-coating treatment department

98‧‧‧噴嘴槽98‧‧‧Nozzle slot

100‧‧‧狹縫噴嘴清洗部100‧‧‧Slit nozzle cleaning department

102‧‧‧吸取頭102‧‧‧Sucking head

104‧‧‧排氣裝置104‧‧‧Exhaust device

106‧‧‧排氣管106‧‧‧Exhaust pipe

108‧‧‧開合閥108‧‧‧Opening valve

110‧‧‧控制器110‧‧‧ Controller

112‧‧‧黏著片112‧‧‧Adhesive film

122(1)、122(2)、122(3)、122(4)‧‧‧開合閥122 (1), 122 (2), 122 (3), 122 (4) ‧ ‧ open valve

114‧‧‧虛擬基板114‧‧‧Virtual substrate

116、118‧‧‧3通閥116, 118‧‧‧3 valve

120‧‧‧壓縮槽120‧‧‧Compression groove

151‧‧‧吸附滾子151‧‧‧Adsorption roller

152‧‧‧吸附滾子昇降機構152‧‧‧Adsorption roller lifting mechanism

153‧‧‧吸附滾子水平移動機構153‧‧‧Adsorption roller horizontal moving mechanism

154‧‧‧抽吸孔154‧‧‧ suction hole

155‧‧‧風扇155‧‧‧fan

156‧‧‧供氣管線156‧‧‧ gas supply pipeline

157~159‧‧‧三通閥157~159‧‧‧Three-way valve

160‧‧‧線160‧‧‧ line

161‧‧‧大氣抽吸線161‧‧‧Atmospheric suction line

162‧‧‧開合閥162‧‧‧Open valve

201‧‧‧X方向移動部201‧‧‧X direction moving department

圖1係顯示本發明一實施形態基板運送裝置中光阻塗布裝置主要構成之略俯視圖。Fig. 1 is a schematic plan view showing a main configuration of a photoresist coating apparatus in a substrate transfer device according to an embodiment of the present invention.

圖2係顯示上述光阻塗布裝置主要構成之基板運送方向略前視圖。Fig. 2 is a front elevational view showing the substrate transporting direction of the main constituent of the above-described photoresist coating apparatus.

圖3係顯示上述光阻塗布裝置中浮升高度測定部光學距離感測器安裝構造及作用之略側視圖。Fig. 3 is a side elevational view showing the mounting structure and operation of the optical distance sensor of the floating height measuring unit in the above-described photoresist coating device.

圖4係顯示上述光阻塗布裝置中之噴嘴重清部構成及面狀吸取部安裝構造圖。Fig. 4 is a view showing a structure of a nozzle refining portion and a mounting structure of a planar suction portion in the above-described photoresist coating device.

圖5係顯示上述光阻塗布裝置中控制系構成之方塊圖。Fig. 5 is a block diagram showing the configuration of a control system in the above photoresist coating apparatus.

圖6係顯示上述光阻塗布裝置中異物大致未阻塞浮升平台抽吸口時塗布處理部狀態之略剖面圖。Fig. 6 is a schematic cross-sectional view showing a state of a coating treatment portion when foreign matter substantially does not block the suction port of the floating platform in the above-described photoresist coating device.

圖7係顯示上述光阻塗布裝置中異物阻塞浮升平台抽吸口時塗布處理部狀態之略剖面圖。Fig. 7 is a schematic cross-sectional view showing the state of the coating treatment portion when foreign matter blocks the suction port of the floating platform in the above-described photoresist coating device.

圖8係顯示上述光阻塗布裝置中第2供氣部作動時作用之略剖面圖。Fig. 8 is a schematic cross-sectional view showing the action of the second air supply unit in the above-described photoresist coating apparatus.

圖9係顯示上述光阻塗布裝置中使用面狀吸附部掃除浮升平台抽吸口時之作用圖。Fig. 9 is a view showing the action of the above-described photoresist coating apparatus in which the surface adsorption portion is used to sweep out the suction port of the floating platform.

圖10係顯示上述光阻塗布裝置中之第2供氣部變形例圖。Fig. 10 is a view showing a modification of the second air supply portion in the above-described photoresist coating device.

圖11係用以說明使用壓縮槽於第2供氣部時作用之壓力波形圖。Fig. 11 is a view showing a pressure waveform of the action of the compression groove in the second air supply portion.

圖12A係顯示分時控制藉由第2供氣部賦予浮升平台抽吸口之掃除用壓力之方式的一階段圖。Fig. 12A is a view showing a stage in which the time-divisional control is applied to the cleaning pressure of the suction port of the floating platform by the second air supply portion.

圖12B係顯示分時控制藉由第2供氣部賦予浮升平台抽吸口之掃除用壓力之方式的一階段圖。Fig. 12B is a view showing a stage in which the time-divisional control is applied to the cleaning pressure of the suction port of the floating platform by the second air supply portion.

圖13係本發明第2實施形態之說明圖。Figure 13 is an explanatory view showing a second embodiment of the present invention.

圖14係本發明第6實施形態中第2供氣部之說明圖。Fig. 14 is an explanatory view showing a second air supply unit in the sixth embodiment of the present invention.

圖15係本發明第7實施形態中第2供氣部之說明圖。Fig. 15 is an explanatory view showing a second air supply unit in the seventh embodiment of the present invention.

12...運送機構12. . . Shipping agency

14...狹縫噴嘴14. . . Slit nozzle

20...基板送入部20. . . Substrate feed section

22...基板送出部twenty two. . . Substrate delivery unit

24...噴嘴重清部twenty four. . . Nozzle re-clearing department

36...噴嘴昇降機構36. . . Nozzle lifting mechanism

40...光阻供給機構40. . . Photoresist supply mechanism

44...第1供氣部44. . . First gas supply department

46...抽吸排氣部46. . . Suction and exhaust

48...第2供氣部48. . . 2nd gas supply department

82...浮升高度測定部82. . . Floating height measurement unit

86...浮升高度監視部86. . . Floating height monitoring unit

110...控制器110. . . Controller

Claims (18)

一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體;及面狀吸附部,以在使該第2供氣部作動之期間內,自上包覆該第1浮升區域一部分或全部,吸附混在自該抽吸口噴出之氣體中的異物;其中該面狀吸附部在該浮升平台上與該基板相同可藉由該運送機構運送之,在該第2供氣部作動開始前或開始後馬上將其攜入至該第1浮升區域上,在該第2供氣部作動結束後自該第1浮升區域上攜出。 A substrate transporting apparatus comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first air supply portion is a substrate to be processed by a gas pressure ejected from the ejection port Floating up, supplying a positive pressure gas to the discharge port; sucking the exhaust portion to control the floating height of the substrate by the suction force of the suction gas by the suction port, and giving the suction port a negative pressure; Carrying, the substrate that is floated up to the air on the floating platform is held and passed through the first floating region; and the second air supply portion sweeps the suction port to supply the suction port a positive pressure gas; and a planar adsorption portion that is coated with a part or all of the first floating region from above during the operation of the second gas supply portion, and is adsorbed and mixed in the gas ejected from the suction port a foreign matter; wherein the planar adsorption portion is transported by the transport mechanism on the floating platform in the same manner as the substrate, and is carried to the first float immediately before or after the start of the second air supply portion In the rising area, after the second air supply unit is finished, 1 taken out of the buoyant region. 一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體; 浮升高度控制部,控制自該第1供氣部對該噴出口供給之氣體壓力、及自該抽吸排氣部賦予該抽吸口之真空壓力其中至少一者,俾該第1浮升區域中該基板之浮升高度與浮升高度設定值一致;浮升高度監視部,使用可沿與該基板運送方向正交之水平方向以對應該浮升高度設定值之既定高度在該浮升平台上橫跨投光之光束,以光學方式監視該基板之浮升高度;及抽吸口堵塞偵測部,藉由該浮升高度監視部偵測到在該光束之橫跨傳遞通道上該基板浮升高度定期超過容許值時,判定該光束正下方或其附近一部分該抽吸口已阻塞。 A substrate transporting apparatus comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first air supply portion is a substrate to be processed by a gas pressure ejected from the ejection port Floating up, supplying a positive pressure gas to the discharge port; sucking the exhaust portion to control the floating height of the substrate by the suction force of the suction gas by the suction port, and giving the suction port a negative pressure; Carrying, the substrate that is floated up to the air on the floating platform is held and passed through the first floating region; and the second air supply portion sweeps the suction port to supply the suction port Positive pressure gas The floating height control unit controls at least one of a gas pressure supplied from the first air supply unit to the discharge port and a vacuum pressure applied to the suction port from the suction and exhaust unit, and the first floating rise The floating height of the substrate in the region coincides with the set value of the floating height; the floating height monitoring unit uses a predetermined height that can be set in accordance with the horizontal direction orthogonal to the substrate transport direction at a set value corresponding to the floating height. a light beam that illuminates the light beam on the platform to optically monitor the floating height of the substrate; and a suction port blocking detecting portion, wherein the floating height monitoring portion detects the light across the transmission path When the substrate float height periodically exceeds the allowable value, it is determined that a part of the suction port is blocked immediately below or near the light beam. 一種基板運送裝置,包含:浮升平台,包含混雜設置多數噴出口與多數抽吸口之第1浮升區域;第1供氣部,為藉由自該噴出口噴出之氣體壓力使被處理基板浮升,對該噴出口供給正壓氣體;抽吸排氣部,為藉由於該抽吸口吸入氣體之抽吸力控制該基板浮升高度,賦予該抽吸口負壓;運送機構,進行運送,俾將在該浮升平台上浮起至空中之該基板加以固持並使其通過該第1浮升區域;第2供氣部,為對該抽吸口中進行掃除,對該抽吸口供給正壓氣體;其中在對該抽吸口中進行掃除時,使該第2供氣部作動,自該抽吸口使氣體噴出,同時亦使該第1供氣部作動,自該噴出口使氣體噴出;且藉由該第2供氣部對該抽吸口供給之氣體的壓力係相較於藉由該第1供氣部對該噴出口供給之氣體的壓力較高。 A substrate transporting apparatus comprising: a floating platform including a first floating region in which a plurality of discharge ports and a plurality of suction ports are provided; and a first air supply portion is a substrate to be processed by a gas pressure ejected from the ejection port Floating up, supplying a positive pressure gas to the discharge port; sucking the exhaust portion to control the floating height of the substrate by the suction force of the suction gas by the suction port, and giving the suction port a negative pressure; Carrying, the substrate that is floated up to the air on the floating platform is held and passed through the first floating region; and the second air supply portion sweeps the suction port to supply the suction port a positive pressure gas; wherein when the suction port is swept, the second air supply unit is actuated, the gas is ejected from the suction port, and the first air supply unit is also actuated, and the gas is supplied from the discharge port The pressure of the gas supplied to the suction port by the second air supply portion is higher than the pressure of the gas supplied to the discharge port by the first air supply portion. 如申請專利範圍第1至3項中任一項之基板運送裝置,其中包含面狀吸取部,以在使該第2供氣部作動之期間內,自上包覆該第1浮升區域一部分或全部,吸取混在自該抽吸口噴出之氣體中的異物。 The substrate transfer device according to any one of claims 1 to 3, further comprising a planar suction portion for covering a portion of the first floating region from above during operation of the second air supply portion Or all, pick up foreign matter mixed in the gas ejected from the suction port. 如申請專利範圍第1或2項之基板運送裝置,其中在對該抽吸口中進行掃除時,以使該第1供氣部停止或停歇之狀態,令該第2供氣部作動,自該抽吸口使氣體噴出。 The substrate transfer device according to claim 1 or 2, wherein when the suction port is swept, the second air supply unit is activated in a state in which the first air supply unit is stopped or stopped. The suction port allows the gas to be ejected. 如申請專利範圍第1至3項中任一項之基板運送裝置,其中該第2供氣部包含與該第1供氣部共通之正壓氣體供給源。 The substrate transfer device according to any one of claims 1 to 3, wherein the second air supply unit includes a positive pressure gas supply source common to the first air supply unit. 如申請專利範圍第6項之基板運送裝置,其中該第1供氣部包含自該正壓氣體供給源延伸至該噴出口之第1供氣管線,該抽吸排氣部包含負壓產生源,與自該負壓產生源延伸至該抽吸口之排氣管線,該第2供氣部包含自該供氣管線上的第1節點延伸至該排氣管線上的第2節點之第2供氣管線。 The substrate transport device of claim 6, wherein the first air supply portion includes a first air supply line extending from the positive pressure gas supply source to the discharge port, the suction and exhaust portion including a negative pressure generating source And an exhaust line extending from the negative pressure generating source to the suction port, the second air supply portion including a second node extending from a first node on the air supply line to a second node on the exhaust line Gas pipeline. 如申請專利範圍第7項之基板運送裝置,其中於該第1及第2節點其中至少一者設置切換閥。 The substrate transfer device of claim 7, wherein at least one of the first and second nodes is provided with a switching valve. 如申請專利範圍第6項之基板運送裝置,其中該第2供氣部包含自該正壓氣體供給源延伸至該排氣管線上的既定節點之第2供氣管線。 The substrate transfer device of claim 6, wherein the second air supply unit includes a second air supply line extending from the positive pressure gas supply source to a predetermined node on the exhaust line. 如申請專利範圍第9項之基板運送裝置,其中於該節點設置切換閥。 The substrate transport device of claim 9, wherein the switching valve is provided at the node. 如申請專利範圍第7項之基板運送裝置,其中在該第2供氣管線上設置開合閥。 The substrate transfer device of claim 7, wherein the opening and closing valve is provided on the second gas supply line. 如申請專利範圍第11項之基板運送裝置,其中在該第2供氣管線上具有用以壓縮來自該正壓氣體供給源之正壓氣體之壓縮槽,間歇性且衝擊性地對該抽吸口供給藉由該壓縮槽壓縮之正壓氣體。 The substrate transport device of claim 11, wherein the second gas supply line has a compression groove for compressing a positive pressure gas from the positive pressure gas supply source, and intermittently and impactably A positive pressure gas compressed by the compression tank is supplied. 如申請專利範圍第1項之基板運送裝置,其中該第2供氣部包含與該第1供氣部使用之正壓氣體供給源不同,另外的正壓氣體供給源。 The substrate transfer device of claim 1, wherein the second air supply unit includes a positive pressure gas supply source different from the positive pressure gas supply source used by the first air supply unit. 如申請專利範圍第1項之基板運送裝置,其中將該第1浮升區域中所設之該抽吸口分割為複數組,在使該第2供氣部作動時,以組為單位分時切換之,以對該抽吸口中進行掃除。 The substrate transfer device according to claim 1, wherein the suction port provided in the first floating region is divided into a plurality of arrays, and when the second gas supply portion is actuated, time division is performed in units of groups Switching to sweep the suction port. 如申請專利範圍第1項之基板運送裝置,其中該浮升平台沿基板運送方向於該第1浮升區域上游側具有第2浮升區域,該第2浮升區域設有用以使該基板浮起之多數噴出口。 The substrate transfer device of claim 1, wherein the floating platform has a second floating region on the upstream side of the first floating region along the substrate transporting direction, and the second floating region is provided to float the substrate Most of the spray outlets. 如申請專利範圍第15項之基板運送裝置,其中於該第2浮升區域內,設有用以送入該基板之送入部。 The substrate transfer device of claim 15, wherein the second floating region is provided with a feeding portion for feeding the substrate. 如申請專利範圍第1項之基板運送裝置,其中該浮升平台沿基板運送方向於該第1浮升區域下游側具有第3浮升區域,該第3浮升區域設有用以使該基板浮起之多數噴出口。 The substrate transfer device of claim 1, wherein the floating platform has a third floating region on a downstream side of the first floating region along a substrate transporting direction, and the third floating region is provided to float the substrate Most of the spray outlets. 如申請專利範圍第17項之基板運送裝置,其中於該第3浮升區域內,設有用以送出該基板之送出部。 The substrate transfer device of claim 17, wherein the third floating region is provided with a delivery portion for feeding the substrate.
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