KR101483224B1 - Apparatus for detecting particles in porous parts - Google Patents
Apparatus for detecting particles in porous parts Download PDFInfo
- Publication number
- KR101483224B1 KR101483224B1 KR1020140164929A KR20140164929A KR101483224B1 KR 101483224 B1 KR101483224 B1 KR 101483224B1 KR 1020140164929 A KR1020140164929 A KR 1020140164929A KR 20140164929 A KR20140164929 A KR 20140164929A KR 101483224 B1 KR101483224 B1 KR 101483224B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- component
- gas
- particles
- jig
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/10—Investigating individual particles
Abstract
Description
BACKGROUND OF THE
Generally, semiconductor and display manufacturing processes are high-tech industries that include highly precise processes at the nano level. Even the minute environmental conditions at the site where the products are manufactured can greatly affect the quality of products, Component contamination of the manufacturing apparatus may be caused by polishing, etching, photoresist, dry etching, etc., from a chemical liquid, a raw material, a material, or from a robot, a structural component in a chamber, a component material, or the like.
In addition, pollutants causing parts contamination are classified into ionic contamination and non-ionic contamination, and ionic contamination is caused by alkali metal ions such as Na + , Li + , K + , and halogen anions such as F - and Cl - Non-ionic contamination is wax, oil, photoresist residue, heavy metal, organic pollution by precious metal, and inorganic pollution by carbon, oxide film, oxide.
As the miniaturization of the device progresses, the surface contamination directly affects the reliability of the device and the yield of mass production, and therefore, the removal of minute inorganic or organic particles becomes an important problem.
For example, semiconductor and display manufacturing apparatuses are composed of various components. When particles such as dust adhere to these components and remain, these particles form a film on a wafer, a glass substrate, a sapphire substrate, or the like, , The particles are adhered to the surface during the etching process of the film, resulting in fatal defects such as pattern defects.
Therefore, it is required that the manufacturing process of the semiconductor and the display such as the gas supply path of the reaction furnace and the reaction chamber should be maintained and managed in a very clean state. In order to secure such cleanliness, After use, it is cleaned and mounted on the equipment.
The cleaning is performed by various methods such as a chemical agent, an ultrapure water, and a clean gas. The prior art relating to the particle inspection method before and after cleaning includes (1) (2) a method of inspecting with a surface particle counter such as
However, in the case of (1), it is impossible to inspect water-soluble particles, and there arises an error problem in which bubbles generated during the process of immersing the components in water are counted as particles, and the consumption of ultrapure water .
In the case of (2), since the suction for counting the particles depends on the suction force by the suction of the air in the structure named as the scanner, the suction force of the pump includes a shower head, a cathode, , It is difficult to separate the particles existing in the holes where the fine pores are formed, and the particles in the holes are not well detected.
The present invention has been made in order to solve all of the problems described above, and it is an object of the present invention to provide a porous forming device capable of detecting and counting particles remaining in a hole of a porous forming part and having excellent particle detection and counting efficiency, The particle zero environment is always maintained during the inspection, component contamination and particle count can be accurately inspected, and further, particles are prevented from adhering to parts due to the occurrence of product defects, thereby increasing the reliability and mass yield of the product The present invention has been made in view of the above problems.
According to an aspect of the present invention, there is provided an apparatus for detecting and inspecting particles attached to a porous forming component having a plurality of holes therein, the apparatus comprising: a housing constituting an outer periphery of the apparatus; A fan filter unit formed at an upper portion of the housing, for sucking air from the outside and then filtering the clean air to supply clean air into the apparatus; An inlet pipe connected to the chamber to clean the inside of the apparatus by flowing clean air into the chamber and having an inlet valve in the middle; A chamber formed on the lower side of the fan filter unit, in which a component to be inspected is mounted on an upper jig, a gas injected from the jet nozzle passes through the pores of the component and flows into the interior; A jet nozzle installed above the chamber for jetting a gas toward the component mounted on the jig to separate particles attached to the hole of the component; A particle counter installed on the lower side of the chamber and connected to the inside of the chamber by a suction line to detect particles included in the gas sucked after sucking the gas in the chamber and counting the particles; A vacuum suction pipe connected to a lower side of the chamber and generating a vacuum suction force in the chamber to guide the gas passing through the hole of the component into the chamber, Pump; And a discharge fan installed in a discharge pipe connected to the lower side of the chamber and discharging the air inside the chamber to the outside.
At this time, the housing is also provided with a main computer for controlling the operation of each component of the apparatus and a monitor for displaying a screen of the main computer.
In addition, the fan filter unit is characterized by including a prefilter installed on the upper part, a ULPA filter installed on the lower part, and a suction fan installed between the prefilter and the ULPA filter.
In addition, the chamber is also characterized in that a heating member for removing moisture on the surface of the component before and after the inspection is provided on the upper side or the lower side of the jig.
Further, the chamber is also characterized by having a closed door at the upper end thereof.
In addition, the chamber is also characterized in that the arc plasma apparatus is additionally provided so that particles can be separated by applying stress to the surface of the component mounted on the jig by arc plasma.
In addition, the chamber is also characterized in that a gas nozzle is provided at a lower portion thereof to remove particles of a component mounted on the jig.
The jet nozzle is also characterized in that an MFC for automatically controlling the supply amount of gas to the gas supply pipe is provided.
Furthermore, the particle counter is characterized in that the suction port provided at the upper end of the suction line is disposed inside the chamber, and the lower end of the suction line is disposed to pass through the inside of the vacuum suction pipe.
In addition, the vacuum suction pipe is provided with a vacuum pump valve and an MFM for measuring a flow rate, and the discharge pipe is provided with a discharge fan valve.
According to the present invention, it is possible to detect and count the particles remaining in the holes of the porous forming component, and to detect and count particles efficiently, and without causing any count error or error, The particle contamination and the particle count can be accurately checked, and further, the particles can be adhered to the parts to prevent the product from being defective, and the reliability of the product and the yield of mass production can be increased.
1 is a perspective view of a particle inspection apparatus of a porous forming part according to an embodiment of the present invention.
2 is a schematic diagram showing an internal configuration of a particle inspection apparatus for a porous forming part according to an embodiment of the present invention.
3 is an internal detail view of a particle inspection apparatus of a porous forming part according to an embodiment of the present invention.
4A to 4C are diagrams showing an upper part of a particle inspection apparatus of a porous forming part according to an embodiment of the present invention.
Figure 5 is a photograph of jet nozzles according to an embodiment of the present invention spraying onto a showerhead.
6A to 6D are views showing a method of inspecting a particle inspection apparatus of a porous forming part according to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.
A particle inspection apparatus (1) for a porous forming part according to the present invention relates to an apparatus for detecting and inspecting particles (P) attached to a porous formed part (D) having a plurality of holes (H) And includes a
Referring to FIG. 1, the
In addition, a USB, a LAN connection terminal, a spared tool, and a power connector for a computer interface may be installed on a lower side of the
An
The
4A to 4C, the
In addition, a
2 and 3, the
In this way, clean air is introduced into the
The
In addition, the
In addition, a sealing door (not shown) may be installed on the upper portion of the
The
In addition, the
5, the
At this time, the gas injected from the
A
In addition, an MFC (Mass Flow Controller) 560 is installed at the other end of the
The
The
The particles P separated from the hole H of the component D by the gas jet of the
The
The
The
Accordingly, when the
Hereinafter, the operation of the
6A, the clean air filtered by the
At this time, the
In addition, air is sucked through the
Next, as shown in FIG. 6B, the inside of the
That is, clean air filtered by the
This is done by controlling the main computer to purge the clean air with the main computer in order to remove background particles which are floating particles in the air inside the
At this time, the
When all the valves are shut off, the air inside the chamber is sucked through the
Next, as shown in FIG. 6C, the
Here, sampling of the particles may be performed by air jet sampling by a
Air jet sampling is a method in which clean nitrogen gas or compressed air supplied from a
Vacuum suction sampling is carried out by the
The combined sampling is to sample the above-described air jet sampling and vacuum suction sampling simultaneously or sequentially, and the setting relating to the sampling of such particles can be specified through the recipe setting in the main computer of the apparatus.
6D, the gas spray time of the
In this way, when all the valves are blocked and the component D is mounted on the
In general, if air is blown into the holes of the component, the separated particles will soon be blown to the periphery, adhere to the wall surface, can not be counted by the particle counter, and the detection and counting efficiency of the particles will be reduced. In addition, there is a problem that when the injection pressure of the air is lowered, the particles are not easily separated from the holes.
However, in the case of using the
In addition, since the purification process is performed before sampling, it is possible to prevent a count error or an error from occurring due to mixing with other particles attached to the inner surface of the chamber.
As a result, the particle inspection apparatus (1) of the porous forming part according to the present invention can detect and count particles remaining in the holes of the porous forming part, and is excellent in particle detection and counting efficiency, It is possible to maintain the zero particle environment at all times during inspection and to precisely inspect the component contamination and particle count and to prevent the particles from adhering to the component due to the occurrence of product defects and to improve the reliability of the product and the mass production yield I can increase it.
The present invention is not limited to the above-described embodiments. Anything having substantially the same constitution as the technical idea described in the claims of the present invention and achieving the same operational effect is included in the technical scope of the present invention.
1. Particle Inspection System for Porous-forming Parts
100.
111.
130.
140.
200.
220. ULPA Filter (Ultra-Low Penetration Air filter)
230.
310.
410.
510.
530. Nozzle moving
550.
600.
620.
710.
730. MFM (Mass Flow Meter) 800. Discharge fan
810.
A. Compressed Air Conditioner D. Parts
H. Hall N. Nitrogen gas regulator
P. particles
Claims (10)
A housing constituting an outer periphery of the apparatus;
A fan filter unit formed at an upper portion of the housing, for sucking air from the outside and then filtering the clean air to supply clean air into the apparatus;
An inlet pipe connected to the chamber to clean the inside of the apparatus by flowing clean air into the chamber and having an inlet valve in the middle;
A chamber formed on the lower side of the fan filter unit, in which a component to be inspected is mounted on an upper jig, a gas injected from the jet nozzle passes through the pores of the component and flows into the interior;
A jet nozzle installed above the chamber for jetting a gas toward the component mounted on the jig to separate particles attached to the hole of the component;
A particle counter installed on the lower side of the chamber and connected to the inside of the chamber by a suction line to detect particles included in the gas sucked after sucking the gas in the chamber and counting the particles;
A vacuum suction pipe connected to a lower side of the chamber and generating a vacuum suction force in the chamber to guide the gas passing through the hole of the component into the chamber, Pump; And
And a discharge fan installed in a discharge pipe connected to a lower side of the chamber and discharging the air inside the chamber to the outside.
Wherein the housing is provided with a main computer for controlling the operation of each component of the apparatus and a monitor for displaying a screen of the main computer.
Wherein the fan filter unit includes a prefilter installed on the upper part, a ULPA filter installed on the lower part, and a suction fan installed between the prefilter and the ULPA filter.
Wherein the chamber is provided with a heating member for removing water on the surface of the component before and after the inspection on the upper side or the lower side of the jig.
Wherein the chamber is provided with a closed door at an upper end thereof.
Wherein the chamber is further provided with an arc plasma apparatus and is capable of separating particles by applying stress to the surface of the component mounted on the jig by arc plasma.
Wherein the chamber is provided with a gas nozzle at a lower portion thereof to remove particles of the component mounted on the jig.
Wherein the jet nozzle is provided so as to be rotatable and provided with an MFC for automatically controlling the supply amount of the gas.
Wherein the particle counter is disposed such that the suction port provided at the upper end of the suction line is disposed inside the chamber and the lower end of the suction line passes through the inside of the vacuum suction pipe. .
Wherein the vacuum suction pipe is provided with a vacuum pump valve and an MFM for measuring a flow rate,
Wherein the discharge pipe is provided with a discharge fan valve.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140164929A KR101483224B1 (en) | 2014-11-25 | 2014-11-25 | Apparatus for detecting particles in porous parts |
PCT/KR2015/012157 WO2016085167A1 (en) | 2014-11-25 | 2015-11-12 | Particle inspection apparatus for porous formation part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140164929A KR101483224B1 (en) | 2014-11-25 | 2014-11-25 | Apparatus for detecting particles in porous parts |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101483224B1 true KR101483224B1 (en) | 2015-01-16 |
Family
ID=52590630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140164929A KR101483224B1 (en) | 2014-11-25 | 2014-11-25 | Apparatus for detecting particles in porous parts |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101483224B1 (en) |
WO (1) | WO2016085167A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200059033A (en) | 2018-11-20 | 2020-05-28 | (주)코미코 | Apparatus for measuring paricles and measuring method for using the same |
KR102472500B1 (en) * | 2022-05-17 | 2022-12-01 | 주식회사 에어콕 | Particulate matter measuring device using pump |
CN115656012A (en) * | 2022-12-08 | 2023-01-31 | 山东恒智一建净化工程有限公司 | Environmental comprehensive index detection device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085542A (en) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | Method and apparatus for fabricating semiconductor device |
JPH11217670A (en) * | 1997-11-25 | 1999-08-10 | Japan Steel Works Ltd:The | Single-wafer load locking device and substrate cleaning method |
KR100976987B1 (en) * | 2010-01-07 | 2010-08-19 | 주식회사 올루 | Instrument for testing particulate contamination of cleanroom supplies |
KR20110010735A (en) * | 2008-04-24 | 2011-02-07 | 알까뗄 루슨트 | Station and method for measuring the contamination of an enclosure used for transporting semiconductor substrates |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100963814B1 (en) * | 2005-10-07 | 2010-06-16 | 주식회사 코미코 | Method of removing particles on an object, apparatus for performing the removing method, method of measuring particles on an object and apparatus for performing the measuring method |
-
2014
- 2014-11-25 KR KR1020140164929A patent/KR101483224B1/en active IP Right Grant
-
2015
- 2015-11-12 WO PCT/KR2015/012157 patent/WO2016085167A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085542A (en) * | 1994-06-20 | 1996-01-12 | Hitachi Ltd | Method and apparatus for fabricating semiconductor device |
JPH11217670A (en) * | 1997-11-25 | 1999-08-10 | Japan Steel Works Ltd:The | Single-wafer load locking device and substrate cleaning method |
KR20110010735A (en) * | 2008-04-24 | 2011-02-07 | 알까뗄 루슨트 | Station and method for measuring the contamination of an enclosure used for transporting semiconductor substrates |
KR100976987B1 (en) * | 2010-01-07 | 2010-08-19 | 주식회사 올루 | Instrument for testing particulate contamination of cleanroom supplies |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200059033A (en) | 2018-11-20 | 2020-05-28 | (주)코미코 | Apparatus for measuring paricles and measuring method for using the same |
KR102590033B1 (en) * | 2018-11-20 | 2023-10-16 | (주)코미코 | Apparatus for measuring paricles and measuring method for using the same |
KR102472500B1 (en) * | 2022-05-17 | 2022-12-01 | 주식회사 에어콕 | Particulate matter measuring device using pump |
CN115656012A (en) * | 2022-12-08 | 2023-01-31 | 山东恒智一建净化工程有限公司 | Environmental comprehensive index detection device |
CN115656012B (en) * | 2022-12-08 | 2023-03-14 | 山东恒智一建净化工程有限公司 | Environment comprehensive index detection device |
Also Published As
Publication number | Publication date |
---|---|
WO2016085167A1 (en) | 2016-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI475595B (en) | Substrate transfer apparatus | |
EP1759776A1 (en) | Static charge and dust removing device | |
KR101483224B1 (en) | Apparatus for detecting particles in porous parts | |
KR101641390B1 (en) | Station and method for measuring the contamination of an enclosure used for transporting semiconductor substrates | |
TWI559426B (en) | Real time liquid particle counter (lpc) end point detection system | |
US10446388B2 (en) | Substrate processing device | |
JP2007266333A (en) | Substrate processing apparatus | |
JP2007130730A (en) | Cutting device | |
CN207611744U (en) | Scavenger system and automation crystal column surface cleaning device | |
JP2007130566A (en) | Breakage sensing method of filter cloth of dust collector | |
KR20190089645A (en) | Particulate Matter Removal device | |
JP2012142583A (en) | Coating device | |
JP7022886B2 (en) | Work equipment and inspection method of work equipment | |
CN112997287B (en) | Particle removal device using symmetrical gas injection | |
JP2019010681A (en) | Work device and work method | |
JP5946109B2 (en) | Air purifier and its test system | |
KR101008340B1 (en) | Substrate cleaning apparatus and method | |
JP2002214115A (en) | Air cleaning device and its test system | |
JPH09321013A (en) | Foreign matter removing device | |
WO2020236803A1 (en) | Chamber component cleanliness measurement system | |
JP2018513002A (en) | Flushing system for pipe piping using microbubbles, flushing method, and ship or marine plant having the same | |
KR102587910B1 (en) | System for Analyzing Contamination, Method for Analyzing Contamination, and Apparatus for Introducing Fluid | |
TWI827669B (en) | Method and apparatus for measuring particles | |
US20230184659A1 (en) | Apparatus and method to assess sub-micron particle levels of a sample | |
TWI828106B (en) | Wafer processing apparatus and wafer processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20171127 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20181205 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20191106 Year of fee payment: 6 |