KR102590033B1 - Apparatus for measuring paricles and measuring method for using the same - Google Patents

Abstract

This application relates to an apparatus and method for measuring particles attached to an object having one main hole therein, comprising: a chamber providing a sealed internal space; One or more cleaning nozzles located on one side of the chamber and spraying gas into the interior space; a first particle floating nozzle that extends vertically from one side of the chamber and sprays gas into the main hole of the object; One or more second particle floating nozzles located on a side of the chamber and spraying gas onto the outer surface of the object; A perforated shelf located inside the chamber and holding an object; One or more probes located inside the chamber to collect particles; an exhaust line connected to the internal space of the chamber to discharge gas; and two or more measuring lines connected at the bottom of the probe or the chamber to move the collected particles, and a measuring method using the same.

Description

Particle measurement device and measurement method using the same {APPARATUS FOR MEASURING PARICLES AND MEASURING METHOD FOR USING THE SAME}

This application relates to an apparatus and method for measuring particles attached to an object.

Components of semiconductor or display manufacturing equipment include shield type, ring type, liner type, pipe type, plate type, chamber type, and shower head. ) It is divided into types, etc.

If particles such as dust remain attached to these parts, these particles may form a film on wafers, glass substrates, sapphire substrates, etc., which are substrates for semiconductor and display manufacturing, or during the process of etching the film, these particles may attach to the surface, resulting in pattern defects. This will cause fatal defects.

The manufacturing process of semiconductors and displays, including the gas supply path of the reactor and reaction chamber, is required to be maintained and managed in a very clean state. Therefore, in order to ensure such cleanliness, the parts of the manufacturing equipment must be cleaned at the beginning and after use for a certain period of time. It is cleaned and installed on the equipment.

Related prior art includes “particle inspection device for porous parts (Korean Patent Publication No. 10-1483224, hereinafter referred to as Patent Document 1).”

In the case of the prior art according to Patent Document 1, a particle inspection device is disclosed for detecting particles inside fine holes in parts with fine pores, such as showerheads. However, the prior art has a problem in that it is difficult to apply to parts having one hole, such as shield type, ring type, liner type, or pipe type.

Republic of Korea Patent Publication No. 10-1483224 (2015.01.16.)

The purpose of this application is to solve the problems described above, and to provide an apparatus and method for measuring particles attached to an object having one main hole therein.

The problems to be solved in this application are not limited to those mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the description below.

One embodiment of the present application is a device for measuring particles attached to an object having one main hole therein, comprising: a chamber providing a sealed internal space; One or more cleaning nozzles located on one side of the chamber and spraying gas into the interior space of the chamber; a first particle floating nozzle that extends vertically from one side of the chamber and sprays gas into the main hole of the object; One or more second particle floating nozzles located on one side of the chamber and spraying gas onto the outer surface of the object; A perforated shelf located inside the chamber and holding an object; One or more probes located inside the chamber to collect particles; an exhaust line connected to the interior space of the chamber to discharge gas; and two or more measuring lines that are alternatively connected to the probe or the lower part of the chamber, or are connected to both the probe and the lower part of the chamber to provide a path for moving the collected particles. A particle measuring device is provided, characterized in that:

In one embodiment of the present application, the particle measuring device may further include a particle measuring unit connected to the measuring device line to measure the number of particles.

In one embodiment of the present application, the cleaning nozzle may be located at the top of the chamber.

In one embodiment of the present application, the first particle floating nozzle may be located in the upper center of the chamber.

In one embodiment of the present application, the first particle floating nozzle may be capable of vertical movement and horizontal movement inside the main hole of the object, and the vertical movement and horizontal movement may be separately adjusted.

In one embodiment of the present application, the perforated shelf may be located in the lower space of the chamber.

In one embodiment of the present application, the perforated shelf may have a structure in which a plurality of holes are formed or a mesh structure so that floating particles can move to the lower part of the chamber.

In one embodiment of the present application, the perforated shelf may be capable of moving up and down and rotating.

In one embodiment of the present application, the probe has a tubular structure with a vent hole, and may be installed at a location where a vortex phenomenon occurs due to the shape of the object inside the chamber.

In one embodiment of the present application, the object may be a part of a semiconductor manufacturing device of a shield type, ring type, liner type, or pipe type.

In one embodiment of the present application, the object may further include one or more sub-holes.

In one embodiment of the present application, the cleaning nozzle is a circular spray nozzle with a spray angle of 30° to 70°, and if there are two or more cleaning nozzles, they may be arranged at intervals.

In one embodiment of the present application, the first particle floating nozzle may be a deflected fan-shaped nozzle or a multi-fog nozzle with a spray angle of 100° to 140°.

In one embodiment of the present application, the multi-fog nozzle is a hollow conical or circular spray nozzle and may be provided with 5 to 7 spray nozzles.

In one embodiment of the present application, the second particle floating nozzle is a narrow-angle spray nozzle with a spray angle of 40° to 70°, and when there are two or more, they may be arranged in a row along the vertical direction.

In one embodiment of the present application, the particle measuring device may be provided with one or more static electricity removal units that ionize particles in the chamber to control surface electrostatic force.

In one embodiment of the present application, the static electricity removal unit may be a photo ionizer using soft X-rays, an electromagnetic ionizer, an ultraviolet lamp, or an atmospheric pressure plasma generator.

In one embodiment of the present application, the static electricity removal unit may be provided in a bar type at one or more of the top and side surfaces inside the chamber.

In one embodiment of the present application, the gas may be any one selected from nitrogen, air, and inert gas, or a combination thereof.

One embodiment of the present application provides a method of measuring particles using the measuring device, including the steps of injecting gas into the cleaning nozzle to float particles inside the chamber and move them downward; Spraying gas into the main hole of the object using the first particle floating nozzle to float particles attached to the inner surface of the object; Spraying gas to the outside of the object using the second particle floating nozzle to float particles attached to the outer surface of the object; collecting the suspended particles from the bottom of the probe or chamber, or collecting them simultaneously from the bottom of the probe and the chamber and moving them to the measuring instrument line; and discharging particles that do not enter the measuring device line into an exhaust line.

The particle measuring device and method according to the present application have the advantage of effectively removing particles attached to an object having one main hole therein.

In addition, it has the advantage of having an excellent effect of floating particles attached to the object by providing a top nozzle and a side nozzle that can move up and down inside the chamber.

In addition, by placing a probe in the inner space of the chamber, particles can be collected from the bottom and sides of the chamber at the same time, which has the advantage of excellent particle removal and measurement effects from the object.

In addition, since the object is mounted on a perforated shelf capable of vertical and rotational movement, it has the advantage of being able to measure particles regardless of the size and number of objects.

The effects of the present application are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Figure 1 shows each configuration of a particle measuring device according to an embodiment of the present application.
Figure 2 shows gas being sprayed from a cleaning nozzle according to an embodiment of the present application.
In Figure 3, (a) shows a fan-shaped nozzle according to an embodiment of the present application, (b) shows gas being sprayed from the fan-shaped nozzle, and (c) shows a fan-shaped nozzle according to an embodiment of the present application. This shows a multi-fog nozzle, and (d) shows gas being sprayed from the multi-fog nozzle.
Figure 4 shows gas being sprayed onto an object from a second particle floating nozzle according to an embodiment of the present application.
Figure 5 shows a perforated shelf according to one embodiment of the present application.
Figure 6 shows a particle measuring device according to an embodiment of the present application.
Figure 7 shows an object having one main hole inside.

Since the particle measuring device according to the present application can make various changes and have several embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present application to specific embodiments, and should be understood to include all conversions, equivalents, and substitutes included in the spirit and technical scope of the present application.

In describing the present application, if it is determined that a detailed description of related known technology may obscure the gist of the present application, the detailed description will be omitted.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the application. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to include one or more other features or It should be understood that this does not exclude in advance the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, specific embodiments of the particle measuring device and method according to the present application will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are assigned the same drawing numbers and Redundant explanations will be omitted.

1 and 6 show each configuration of a particle measuring device according to an embodiment of the present application. Figure 2 shows gas being sprayed from a cleaning nozzle according to an embodiment of the present application. In Figure 3, (a) shows a fan-shaped nozzle according to an embodiment of the present application, (b) shows gas being sprayed from the fan-shaped nozzle, and (c) shows a fan-shaped nozzle according to an embodiment of the present application. This shows a multi-fog nozzle, and (d) shows gas being sprayed from the multi-fog nozzle. Figure 4 shows gas being sprayed onto an object from a second particle floating nozzle according to an embodiment of the present application. Figure 5 shows a perforated shelf according to one embodiment of the present application. Figure 6 shows a particle measuring device according to an embodiment of the present application. Figure 7 shows examples of objects having one main hole inside.

One embodiment of the present application is a device for measuring particles attached to an object 10 having one main hole 1 therein, and as shown in FIG. 1, the chamber 100 and the housing 110 , a cleaning nozzle 210, a first particle floating nozzle 220, a second particle floating nozzle 230, a perforated shelf 400, a measuring instrument line 320, an exhaust line 500, and a particle measuring unit. .

The object 10 is a part to be cleaned that has one main hole 1 inside. Specifically, it may be a part of a semiconductor manufacturing device, and may be a shield type, ring type, liner type, or pipe type, but may have a main hole 1 inside. It is not limited to this as long as it has a shape with one main hole (1). Referring to (a) of FIG. 7, it may be a ring-type object 10 having one main hole 1 inside, and referring to (b), it may have one main hole 1 and a plurality of objects 10 inside. It may be a shield-type object (10) having a sub-hole (5).

The chamber 100 provides a sealed internal space, and may be provided with a housing 110 located below the chamber 100 or surrounding the front of the chamber 100.

Referring to FIG. 1, the cleaning nozzle 210 is located on one side of the chamber 100, specifically, the upper surface inside the chamber, and sprays gas into the inner space of the chamber to remove particles 20 remaining inside the chamber 100. ) has the effect of floating and delivering it to the lower part of the chamber 100. There may be a plurality of cleaning nozzles 210 and they may be arranged at appropriate intervals to spray gas evenly inside the chamber 100.

Referring to FIG. 2, the cleaning nozzle 210 is a circular spray nozzle, and the spray angle may be 30° to 70°. More specifically, it may be 45° to 60°, and even more specifically, it may be 60°.

If the spray angle of the circular spray nozzle is less than 30°, the pressure is too concentrated and the gas cannot be sprayed uniformly. If it exceeds 70°, the pressure weakens, weakening the effect of reducing particle adhesion, and the power to suspend particles. It can make you weak. Table 1 below shows the relative ratio of the measured number of particles, converting the number of measured particles to 100 in the example with the largest number of measured particles when other conditions were optimized and the spray angle of the cleaning nozzle was adjusted.

Example spray angle Particle measurement number ratio One 20 degrees 65 2 30 degrees 80 3 45 degrees 92 4 60 degrees 100 5 70 degrees 96 6 80 degrees 60

The first particle floating nozzle 220 may be positioned to extend vertically from one side of the chamber 100. Referring to FIG. 1, the first particle floating nozzle 220 is positioned extending vertically downward from the upper center and can inject gas into the main hole 1 of the object 10.

The first particle floating nozzle 220 may be vertically moved inside the main hole 1 of the object 10. A nozzle moving unit 221 may be provided to assist vertical movement.

Additionally, the first particle floating nozzle 220 is capable of horizontal movement. For example, depending on the location of the main hole 1 of the object 10, the object 10 can be horizontally moved to be located in the center of the main hole 1. In addition, the vertical and horizontal movements of the first particle floating nozzle 220 can be adjusted independently, so that the horizontal and vertical movements of the nozzle can be adjusted according to the size and shape of the object.

Due to the vertical movement and horizontal movement of the first particle floating nozzle 220, the position of the nozzle can be moved inside the main hole 1 according to the size and height of the object 10, and the inner wall of the object 10 By spraying gas directly on the surface, the adhesion of the attached particles can be reduced and the particles can be made to float.

Referring to FIG. 3, the first particle floating nozzle 220 may be a deflected fan-shaped nozzle 222 or a multi-fog nozzle 224.

Referring to (b) of FIG. 3, the deflected fan-shaped nozzle 222 may have a spray angle of 100° to 140°, more specifically, 120° to 140°, and even more specifically 130°. The deflection fan-shaped nozzle 222 can spray gas while rotating 360°.

If the spray angle of the deflection fan-shaped nozzle is less than 100°, the pressure is too concentrated and the gas cannot be sprayed uniformly. If it exceeds 140°, the pressure weakens, weakening the effect of reducing particle adhesion, and the power to float particles is also weakened. It can make you weak. Table 2 below shows that when other conditions are optimized and the spray angle of the first particle floating nozzle is adjusted, the number of measured particles in the example with the largest number of measured particles is converted to 100, and the relative ratio of the number of measured particles is It is shown.

Example spray angle Particle measurement number ratio 7 90 65 8 100 89 9 120 95 10 130 100 11 140 93 12 150 59

Referring to (d) of FIG. 3, the multi-fog nozzle 224 is a hollow cone-shaped or circular spray nozzle that can spray gas like fog. It may be provided with 5 to 7 nozzles (caps) attached to the nozzle body and vane, for example, may have 7 nozzles of type 7H or 7R.

Referring to FIG. 1, the second particle floating nozzle 230 is located on the inner side of the chamber 100 and sprays gas directly on the outer surface of the object 10 to reduce the adhesion of the attached particles and remove the particles. It can float.

Referring to FIG. 4, the second particle floating nozzle 230 is a narrow-angle spray nozzle, and the spray angle may be 40° to 70°, more specifically 45° to 60°, and further. Specifically, it may be 60˚.

If the injection angle of the second particle floating nozzle is less than 40°, the pressure is too concentrated and the gas cannot be sprayed uniformly, and if it exceeds 70°, the pressure weakens, weakening the effect of reducing particle adhesion, and floating the particles. Strength may also weaken. Table 3 below shows that when other conditions are optimized and the spray angle of the second particle floating nozzle is adjusted, the number of measured particles in the example with the largest number of measured particles is converted to 100, and the relative ratio of the measured number of particles is calculated as 100. It is shown.

Example spray angle Particle measurement number ratio 13 30 69 14 40 89 15 45 93 16 60 100 17 70 97 18 80 78

The second particle floating nozzle 230 has a plurality of nozzles in a vertical direction at intervals to spray gas evenly from one side, specifically the side, and even more specifically the inner side of the chamber 100 to the outer surface of the object 10. It can be placed as a set arranged in a row. One side of the chamber may be any side of the chamber and may also include an edge portion of the side, and the second particle floating nozzle located on one side of the chamber may be a second particle floating nozzle disposed to extend or extend from one side of the chamber. It may also include particle flotation nozzles.

The size of the chamber 100 and the size of the object 10, such as the second set of particle floating nozzles 230, are arranged in two rows or three sets are arranged in three rows on the inner surface of the chamber 100. Depending on the size, they can be arranged in multiple sets.

The gas may be nitrogen, air, or an inert gas, or a combination thereof. The inert gas may be argon or helium, but is not limited thereto.

The particle measuring device may further include a pressure unit (not shown) for measuring the pressure inside the chamber 100. The pressure unit may be connected to a pressure control unit through a signal line, and the pressure control unit may control supply and discharge operations of the gas according to a pressure signal from the pressure unit. The pressure control unit is connected to a gas supply unit (not shown) connected to the chamber 100 and a nozzle that supplies gas into the chamber 100, and an exhaust line ( 500), and may include a control unit (not shown) that controls the gas supply exhaust line 500 to supply and discharge gas sequentially or alternately. Here, the control unit may be connected to the pressure unit and control the operation of the gas supply unit and the exhaust line 500 according to the pressure signal.

Here, the gas supply unit includes a gas source for storing the gas, a gas supply valve for controlling the flow rate of the gas supplied from the gas source, a filter for removing impurities from the gas, and a gas supply valve for controlling the flow rate of the gas supplied from the gas source. It may include a gas supply line for supplying the gas to the chamber via a supply valve and the filter. When air is used, the gas source may include an air pump for compressing the air and a container for storing the compressed air.

Referring to FIG. 5, the perforated shelf 400 is located in the inner space of the chamber 100, for example, the lower space of the chamber, and the object 10 can be mounted on the perforated shelf 400. Referring to FIGS. 1 and 5 , a shelf moving part 420 may be provided at the lower part of the perforated shelf 400.

The perforated shelf 400 may be capable of moving up and down and/or rotating. For example, this can be implemented by moving the shelf moving part 420 up or down or rotating it. As shown in FIG. 7, since the height of the object 10 varies, the shelf can be moved up and down to maximize the effect of the cleaning nozzle 210, and an appropriate separation distance between the object 10 and the cleaning nozzle 210 can be maintained. There is an advantage to maintaining it. Additionally, when the shelf is rotated, gas at the same pressure can be sprayed onto the entire surface of the object 10 and the number of cleaning nozzles 210 can be minimized.

Since the part to be cleaned is placed on a shelf that can move up and down and/or rotate, it has the advantage of being able to measure particles regardless of the size of the part to be cleaned. Additionally, since multiple products can be mounted at the same time, there is an advantage in measuring multiple parts at the same time. In the case of the prior art, there was a problem in that the size and number of parts were limited because the object was fixed using a jig method.

The perforated shelf 400 may have a structure in which a plurality of holes 410 are formed so that suspended particles can move to the lower part of the chamber 100, or it may have a mesh structure. Gas can move to the lower part of the chamber 100 through the hole 410 formed in the perforated shelf 400, and particles not captured by the particle measuring device 330 can also move to the lower part of the chamber 100 through the hole. .

The probe 300 may be located inside the chamber 100 to collect particles, and a plurality of probes may be arranged.

The probe 300 may have a tubular structure with a vent hole. The vent hole has the effect of allowing the pressure of the probe 300 and the measuring instrument line 320 connected to the probe 300 to be adjusted. The probe 300 may be provided at an area where a vortex phenomenon occurs due to the shape of the object 10 inside the chamber 100.

The measuring instrument line 320 may be connected to each probe 300 to move the particles collected in the probe 300, and may be installed at the bottom of the chamber 100 to move the particles collected in the lower part of the chamber 100. It can be connected and placed at the bottom. The measuring instrument line 320 may be two or more, and may be connected to the probes 300 and the lower part of the chamber 100 simultaneously, connected to only the probes 300, or placed only in the lower part of the chamber 100. They can be connected and placed, and can provide a path for moving the collected particles.

The measuring device according to an embodiment of the present application may further include a particle measuring unit connected to the measuring instrument line 320 to measure the number of particles.

The exhaust line 500 is connected to the internal space of the chamber 100 and can exhaust gas and exhaust particles other than particles flowing into the particle meter 330.

Referring to FIG. 6, the measuring device may be provided with one or more static electricity removal units 600 that control surface electrostatic force by irradiating light with a predetermined wavelength into the chamber 100 to ionize particles. The static electricity removal unit 600 has the effect of removing ions and static electricity from the chamber 100 and allowing particles attached to the object 10 to easily separate.

The static electricity removal unit may be a photo ionizer using soft X-rays, an electromagnetic ionizer, an ultraviolet lamp, or an atmospheric pressure plasma generator.

Since the soft Since the photo ionizer uses photoelectron energy of 10 keV, the ionization energy is large and directly ionizes inert gas such as N ₂ or Ar, making it possible to efficiently and quickly remove static electricity and interfering ions even in a chamber filled with inert gas. do.

In another embodiment, at least one ultraviolet lamp may be disposed in the chamber 100 to irradiate ultraviolet light onto the object. For example, ultraviolet light can be irradiated onto the object to remove static electricity from the object, thereby making it easier to remove impurities from the object. Additionally, in order to improve the efficiency of ultraviolet light, a reflector that reflects the ultraviolet light may be disposed. Alternatively, a reflective material film that functions as the reflector may be applied. The arrangement and quantity of the ultraviolet lamps may vary depending on the size of the object, and this will not limit the spirit and scope of the present invention.

In another embodiment, an atmospheric pressure plasma generator may be disposed, and the atmospheric pressure plasma generator may serve to remove static electricity such as electrons and ions generated during plasma discharge.

Referring to FIG. 6, the static electricity removal unit 600 may be provided in a bar shape and may be provided on the top and/or side of the chamber 100. Additionally, a plurality of static electricity removal units 600 may be provided on the top surface and a plurality on the side surfaces of the chamber 100 .

One embodiment of the present application is a method of measuring particles using a device, comprising: spraying gas into the cleaning nozzle 210 to float particles inside the chamber 100 and move them downward (S1); A step (S2) of floating particles attached to the inner surface of the object 10 by spraying gas into the main hole 1 of the object 10 using the first particle floating nozzle 220; Spraying gas to the outside of the object 10 using the second particle floating nozzle 230 to float particles attached to the outer surface of the object 10 (S3); A step (S4) of simultaneously collecting the suspended particles from the probe 300 and the lower part of the chamber 100 and moving them to the measuring instrument line 320; and a step (S5) of discharging particles that have not flowed into the measuring instrument line 320 into the exhaust line 500 (S5).

In the above measurement method, steps S2 and S3 may be performed independently or simultaneously. Alternatively, step S1 may be performed simultaneously with step S2 and/or step S3, or may be performed after step S2 and/or step S3.

Although the present application has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present application without departing from the spirit and scope of the present application as set forth in the claims below. You will understand that you can do it.

1: Main Hall 5: Sub Hall
10: object 20: particle
100: chamber 110: housing
210: Cleaning nozzle 220: First particle floating nozzle
221: nozzle moving part 222: deflection fan-shaped nozzle
224: Multi fog nozzle 230: Second particle floating nozzle
300: probe 320: meter line
330: Particle measuring device 400: Perforated shelf
410: Shelf hole 420: Shelf moving part
500: exhaust line 600: static electricity removal unit

Claims (19)

A device for measuring particles attached to an object having one main hole inside,
A chamber providing a sealed interior space;
One or more cleaning nozzles located on one side of the chamber and spraying gas into the interior space of the chamber;
a first particle floating nozzle that extends vertically from one side of the chamber and sprays gas into the main hole of the object;
One or more second particle floating nozzles located on one side of the chamber and spraying gas onto the outer surface of the object;
A perforated shelf located inside the chamber and holding an object;
One or more probes located inside the chamber to collect particles;
an exhaust line connected to the interior space of the chamber to discharge gas; and
It includes two or more measuring lines, which are alternatively connected to the probe or the lower part of the chamber, or are connected to both the probe and the lower part of the chamber, and provide a path for moving the collected particles,
The probe is,
A particle measuring device, characterized in that it is provided at an area where a vortex phenomenon occurs due to the shape of the object inside the chamber. In claim 1,
A particle measuring device, characterized in that it further comprises a particle measuring unit connected to the measuring instrument line to measure the number of particles. In claim 1,
The cleaning nozzle is,
A particle measuring device, characterized in that located at the upper part of the chamber. In claim 1,
The first particle floating nozzle is,
A particle measuring device, characterized in that located in the upper center of the chamber. In claim 1,
The first particle floating nozzle is,
The object can be moved vertically and horizontally inside the main hole,
A particle measuring device, characterized in that vertical movement and horizontal movement are separately adjustable. In claim 1,
The perforated shelf,
A particle measuring device, characterized in that located in the lower space of the chamber. In claim 1,
The perforated shelf,
It is a structure with multiple holes or a mesh structure so that suspended particles can move to the bottom of the chamber,
A particle measuring device, characterized in that it can move up and down and rotate. In claim 1,
The probe is,
A particle measuring device, characterized in that it has a tubular structure with a vent hole. In claim 1,
The object is,
A particle measuring device, characterized in that it is a part of a shield-type, ring-type, liner-type, or pipe-type semiconductor manufacturing device. In claim 1,
The object is,
A particle measuring device, characterized in that it further includes one or more sub-holes. In claim 1,
The cleaning nozzle is,
It is a circular spray nozzle with a spray angle of 30° to 70°,
In the case of two or more, a particle measuring device, characterized in that they are arranged at intervals. In claim 1,
The first particle floating nozzle is,
A particle measuring device, characterized in that it is a deflected fan-shaped nozzle or a multi-fog nozzle with a spray angle of 100˚ to 140˚. In claim 12,
The multi-fog nozzle is
A particle measuring device, characterized in that it is a hollow conical or circular injection nozzle and has 5 to 7 injection nozzles. In claim 1,
The second particle floating nozzle,
It is a narrow-angle spray nozzle with a spray angle of 40° to 70°,
A particle measuring device, characterized in that two or more are arranged in a row along the vertical direction. In claim 1,
A particle measuring device, characterized in that it further comprises one or more static electricity removal units that ionize particles in the chamber to control surface electrostatic force. In claim 15,
The static electricity removal unit,
A particle measuring device, characterized in that it is a photo ionizer, an electromagnetic ionizer, an ultraviolet lamp, or an atmospheric pressure plasma generator using soft X-rays. In claim 15,
The static electricity removal unit,
A particle measuring device, characterized in that it is provided in a bar type at one or more of the top and sides of the chamber. In claim 1,
The gas is
A particle measuring device, characterized in that it is any one selected from nitrogen, air, and inert gas, or a combination thereof. In the particle measurement method using the device according to any one of claims 1 to 18,
Spraying gas through the cleaning nozzle to float particles inside the chamber and move them downward;
Spraying gas into the main hole of the object using the first particle floating nozzle to float particles attached to the inner surface of the object;
Spraying gas to the outside of the object using the second particle floating nozzle to float particles attached to the outer surface of the object;
collecting the suspended particles from the bottom of the probe or chamber, or collecting them simultaneously from the bottom of the probe and the chamber and moving them to the measuring instrument line; and
A particle measuring method, comprising the step of discharging particles that have not entered the measuring instrument line into an exhaust line.

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