JP5658858B2 - Coating apparatus and coating method - Google Patents

Description

  The present invention relates to a coating apparatus and a coating method.

  On a glass substrate constituting a display panel such as a liquid crystal display, fine patterns such as wirings, electrodes, and color filters are formed. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a resist film forming process for forming a resist film on a glass substrate, an exposure process for pattern exposing the resist film, and a developing process for developing the resist film are performed.

  In the resist film forming step, a coating apparatus for applying a resist film on the surface of the glass substrate is used. As a coating apparatus, for example, a structure is known in which a glass substrate is floated and conveyed on a stage, and a resist is applied to the surface of the glass substrate that is lifted and moved by a slit nozzle provided facing the stage. (For example, refer to Patent Document 1).

In such a coating apparatus, conventionally, the glass substrate is floated by jetting air from an air supply source laid in a factory or the like to the glass substrate, but the amount of air used becomes large. Therefore, in recent years, a configuration in which air is supplied using a blower has been proposed.
Japanese Patent Laid-Open No. 2005-236092

  However, the air supplied by an air supply mechanism such as a blower or a compressor is a clean room in which the temperature of the space including the coating device, for example, the coating device is arranged due to heat generated by the air supply mechanism itself or heat in the air supply path. It becomes higher than the temperature inside. By blowing air having a temperature difference onto the glass substrate, there is a possibility that temperature unevenness occurs in the glass substrate during conveyance. Since the temperature unevenness of the glass substrate during conveyance contributes to drying unevenness of the resist film and eventually film thickness unevenness, a configuration that reduces such temperature unevenness is demanded.

  For example, in recent years, the size of a glass substrate used in a manufacturing process has been increased with an increase in the size of a display panel. In a large-sized glass substrate, temperature unevenness tends to occur more remarkably, and a configuration for reducing such temperature unevenness is strongly demanded. The present invention is not limited to the case of using air supplied by an air supply mechanism, and the same applies to the case of using air supplied from other supply sources such as air supplied from an air supply source installed in a factory.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating method that can reduce temperature unevenness generated in a substrate and prevent occurrence of film thickness unevenness of a liquid material. is there.

In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that applies a liquid material to the substrate while transporting the substrate by the substrate transport unit. The substrate transport unit includes a gas ejection unit that ejects gas to the substrate, and a temperature adjustment unit that regulates the temperature of the gas, and the substrate transport unit is provided with a processing stage, A coating region corresponding to the coating unit, a loading-side gas ejection stage is provided, a substrate loading region for loading the substrate, and a loading-side gas ejection stage is provided, and a substrate unloading region for unloading the substrate. The stage surface of the processing stage is provided with a plurality of gas jets for ejecting the gas and a plurality of suction ports for sucking a transport space in which the substrate is transported. A circulation path through which the gas sucked from the suction port is circulated to the gas outlet, and a plurality of jets of the gas are ejected onto the surfaces of the carry-in gas jet stage and the carry-out gas jet stage. A second gas ejection port is provided, and the temperature adjustment unit is capable of adjusting the temperature of the gas for each of the processing stage, the carry-in side gas ejection stage, and the carry-out side gas ejection stage. characterized in that there.

  According to the present invention, the gas ejection part for ejecting gas to the substrate is provided in the substrate transport part, and since the temperature regulation part for regulating the temperature of this gas is provided, the gas ejected to the substrate by the temperature regulation part The temperature of can be adjusted. Thereby, the temperature nonuniformity which generate | occur | produces in a board | substrate can be reduced and generation | occurrence | production of the film thickness nonuniformity of a liquid can be prevented.

In the coating apparatus, the substrate transport unit has a coating region corresponding to the coating unit, and the temperature adjusting unit adjusts the temperature of the gas ejected to the coating region.
Since the liquid material is applied onto the substrate in the application region, it is particularly necessary to control the temperature of the gas with high accuracy. According to the present invention, since the substrate transport unit has an application region corresponding to the application unit, and the temperature adjustment unit adjusts the temperature of the gas ejected to the application region, adjustment of the gas temperature is particularly required. It is possible to reduce the occurrence of temperature unevenness on the substrate in the applied region.

In the coating apparatus, the substrate transport unit includes a substrate unloading region for unloading the substrate, and the temperature adjusting unit adjusts the temperature of the gas ejected to the substrate unloading region. .
When temperature unevenness occurs on the substrate after the liquid material is applied, the temperature unevenness affects the liquid material on the substrate, and this influence may cause unevenness in the film thickness of the liquid material. According to the present invention, since the substrate transport unit has the substrate carry-out region for carrying out the substrate, and the temperature adjusting unit regulates the temperature of the gas ejected to the substrate carry-out region, the substrate coated with the liquid material It is possible to reduce the occurrence of temperature unevenness. Thereby, the nonuniformity of the film thickness of the liquid can be prevented.

In the coating apparatus, the substrate transport unit includes a substrate carry-in region for carrying the substrate, and the temperature adjusting unit adjusts the temperature of the gas ejected to the substrate carry-in region. .
If temperature unevenness occurs on the substrate before the liquid material is applied, the temperature unevenness of the substrate affects the liquid state to be applied, and this influence may cause the film thickness unevenness of the liquid material. . According to the present invention, since the substrate transport unit has the substrate carry-in region for carrying the substrate, and the temperature adjusting unit regulates the temperature of the gas ejected into the substrate carry-in region, before the liquid material is applied. It is possible to reduce the occurrence of temperature unevenness in the substrate. Thereby, the film thickness nonuniformity of a liquid can be prevented.

In the coating apparatus, the substrate transport unit has a coating region corresponding to the coating unit, and the temperature adjusting unit is configured to supply the gas ejected to a region adjacent to the coating region in the substrate transport unit. It is characterized by adjusting the temperature.
According to the present invention, the substrate transport unit has a coating region corresponding to the coating unit, and the temperature adjustment unit adjusts the temperature of the gas ejected to the region adjacent to the coating region in the substrate transport unit. It is possible to reduce the occurrence of temperature unevenness on the substrate at the timing before and after the liquid material is applied to the substrate. Thereby, the film thickness nonuniformity of a liquid can be prevented effectively.

The coating apparatus is characterized in that the temperature of the gas is adjusted to match the temperature of the transfer space for transferring the substrate.
The temperature of the substrate being transferred is approximately equal to the temperature of the transfer space for transferring the substrate. According to the present invention, since the temperature of the gas is adjusted to match the temperature of the transfer space for transferring the substrate, it is possible to prevent the temperature of the substrate being transferred from changing. Thereby, it is possible to prevent temperature unevenness from occurring on the substrate.

Said coating apparatus adjusts the temperature of the said gas in the range of 20 to 25 degreeC.
According to the present invention, since the temperature of the gas is adjusted within a range of 20 ° C. to 25 ° C. close to normal temperature, the burden of temperature adjustment can be reduced.

In the coating apparatus, the substrate transport unit includes a coating region corresponding to the coating unit, a substrate loading region for loading the substrate, and a substrate unloading region for unloading the substrate. The gas temperature is set for each of the coating area, the substrate carry-in area, and the substrate carry-out area.
According to the present invention, the substrate transport unit has a coating region corresponding to the coating unit, a substrate carry-in region for carrying in the substrate, and a substrate carry-out region for carrying out the substrate. Since the gas temperature is set for each of the substrate carry-out regions, the gas temperature can be adjusted with higher accuracy.

In the coating apparatus, the gas ejection unit ejects gas into the transfer space.
According to the present invention, since the gas ejection unit ejects gas into the transport space, the temperature-controlled gas is ejected onto the substrate transported through the transport space. Thereby, it is possible to reduce the occurrence of temperature unevenness in the substrate.

In the coating apparatus, the substrate transport unit includes a suction mechanism that sucks the gas in the transport space, and a circulation path that circulates the gas sucked by the suction mechanism to the gas ejection unit. To do.
According to the present invention, the substrate transport unit has the suction mechanism for sucking the gas in the transport space and the circulation path for circulating the gas sucked by the suction mechanism to the gas ejection unit. The temperature-adjusted gas is sucked, and the gas can be circulated and ejected to the transfer space. Thereby, the burden of temperature control can be reduced.

In the coating apparatus, the circulation flow path includes a filter that regulates the flow of foreign substances contained in the gas.
According to the present invention, since the circulation channel has the filter that regulates the flow of the foreign matter contained in the gas, it is possible to prevent the foreign matter from being mixed into the gas that is circulated and ejected.

In the coating apparatus, at least one of a cooling mechanism and a heating mechanism is provided on the path for supplying the gas so as to keep the temperature of the transfer space for transferring the substrate at a constant temperature. And
According to the present invention, on the gas supply path, at least one of the cooling mechanism and the heating mechanism is provided so as to keep the temperature of the transfer space for transferring the substrate at a constant temperature. The temperature of the gas can be adjusted by a cooling mechanism and a heating mechanism.

The coating method according to the present invention is a coating method in which a liquid material is applied to the substrate while the substrate is floated and conveyed, and the temperature of the gas is adjusted, and the gas whose temperature has been adjusted is jetted onto the substrate. When the liquid material is applied to the substrate, a plurality of gas ejection ports and a plurality of suction ports are provided and arranged corresponding to the region to which the liquid material is applied. The substrate is floated on the processing stage by ejecting the gas from the plurality of gas ejection ports and sucking a conveyance space in which the substrate is conveyed by the plurality of suction ports, and the suction port The gas sucked from is circulated to the gas ejection port, and when the substrate is carried in, a plurality of loading side gas ejection ports are provided on a plurality of loading side gas ejection stages. The carry-in side air The substrate is levitated by ejecting gas from the ejection port to the substrate, and when unloading the substrate, it is placed on an unloading side gas ejection stage provided with a plurality of unloading side gas ejection ports. The substrate is floated by jetting gas from the plurality of carry-out side gas jets to the substrate, and the temperature of the gas is adjusted by the processing stage, the carry-in side gas jet stage, and the It is performed for each stage of the unloading side gas ejection stage .
According to the present invention, the temperature of the gas is adjusted, and the temperature-adjusted gas is jetted onto the substrate to float the substrate, so that temperature unevenness generated on the substrate can be reduced, and the liquid material The occurrence of film thickness unevenness can be prevented.

The coating method is characterized in that the temperature of the gas ejected to the substrate is adjusted before the liquid material is coated.
According to the present invention, since the temperature of the gas ejected to the substrate is adjusted before the liquid material is applied, it is possible to reduce the occurrence of temperature unevenness on the substrate before the liquid material is applied. . Thereby, the film thickness nonuniformity of a liquid can be prevented.

The coating method is characterized in that the temperature of the gas ejected to the substrate is adjusted before the substrate is carried in.
According to the present invention, since the temperature of the gas ejected to the substrate is adjusted before the substrate is loaded, it is possible to reduce the occurrence of temperature unevenness in the substrate when the substrate is loaded. Thereby, the film thickness nonuniformity of a liquid can be prevented.

The coating method is characterized in that the temperature of the gas ejected to the substrate is adjusted before the substrate is carried out.
According to the present invention, the temperature of the gas ejected to the substrate is adjusted before unloading the substrate. Therefore, when unloading the substrate, for example, temperature unevenness occurs in the substrate after applying a liquid material to the substrate. Can be reduced. Thereby, the film thickness nonuniformity of a liquid can be prevented.

The coating method is characterized in that the temperature of the gas is adjusted to match the temperature of the transport space for transporting the substrate.
According to the present invention, since the temperature of the gas is adjusted to match the temperature of the transfer space for transferring the substrate, it is possible to prevent the temperature of the substrate being transferred from changing. Thereby, it is possible to prevent temperature unevenness from occurring on the substrate.

The coating method is characterized in that the temperature of the gas is adjusted within a range of 20 to 25 ° C.
According to the present invention, since the temperature of the gas is adjusted within a range of 20 ° C. to 25 ° C. close to normal temperature, the burden of temperature adjustment can be reduced.

The coating method is characterized in that the temperature of the gas is adjusted so that a gas having a different temperature is ejected to the substrate depending on a transport position of the substrate.
According to the present invention, since the temperature of the gas is adjusted so that a gas having a different temperature depending on the substrate transfer position is ejected to the substrate, the temperature unevenness of the substrate can be reduced with higher accuracy.

The coating method is characterized in that gas is ejected into the transport space.
According to the present invention, since the gas is ejected to the transport space, the temperature-adjusted gas is ejected to the substrate transported in the transport space. Thereby, it is possible to reduce the occurrence of temperature unevenness in the substrate.

The coating method is characterized in that the gas in the transport space is sucked and the sucked gas is ejected to the substrate.
According to the present invention, since the gas in the transfer space is sucked and the sucked gas is ejected to the substrate, the burden of temperature adjustment can be reduced.

  According to the present invention, the gas ejection part for ejecting gas to the substrate is provided in the substrate transport part, and since the temperature regulation part for regulating the temperature of this gas is provided, the gas ejected to the substrate by the temperature regulation part The temperature of can be adjusted. Thereby, the temperature nonuniformity which generate | occur | produces in a board | substrate can be reduced and generation | occurrence | production of the film thickness nonuniformity of a liquid can be prevented.

A first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, the substrate is transported in a state of being floated by the substrate transport unit 2, a resist is coated on the substrate by the coating unit 3, and the state of the coating unit 3 is managed by the management unit 4. The coating apparatus 1 is preferably used in a clean environment such as a clean room.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings. Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a frame 21, a stage 22, and a transport mechanism 23. In the substrate transport unit 2, the substrate S is transported on the stage 22 in the + X direction by the transport mechanism 23.

  For example, the frame 21 is a support member that is placed on the floor surface and supports the stage 22 and the transport mechanism 23. The frame 21 is divided into three parts, and the three parts are arranged in the Y direction. The frame center portion 21 a is a portion arranged at the center in the Y direction among the three divided portions, and supports the stage 22. The frame side portion 21 b is disposed on the −Y direction side of the frame center portion 21 a and supports the transport mechanism 23. A gap is provided between the frame side portion 21b and the frame center portion 21a. The frame side portion 21 c is disposed on the + Y direction side of the frame central portion 21 a and supports the transport mechanism 23. A gap is provided between the frame side portion 21c and the frame center portion 21a. The frame center portion 21a, the frame side portion 21b, and the frame side portion 21c are elongated in the X direction, and the dimensions of the respective portions in the X direction are substantially the same.

  The stage 22 includes a carry-in stage 25, a processing stage 27, and a carry-out stage 28. The carry-in stage 25, the processing stage 27, and the carry-out stage 28 are arranged on the frame central portion 21a in this order from the upstream side to the downstream side in the substrate transport direction (in the + X direction).

  The carry-in stage 25 is made of, for example, SUS, and is a substantially square plate-like member in plan view. By making the shape of the carry-in stage 25 substantially square in plan view, even when a substrate having a longitudinal direction and a short direction is transported, the substrate can be transported in any direction. ing. In the present embodiment, the area on the carry-in stage 25 is the substrate carry-in area 25S. The substrate carry-in area 25S is an area for carrying the substrate S that has been carried from the outside of the apparatus.

  The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection hole 25a and the lifting pin retracting hole 25b are provided so as to penetrate the carry-in stage 25, respectively.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in stage 25, and are arranged in a matrix in a plan view. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be lifted in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25 b is provided at the substrate loading position of the loading side stage 25. The elevating pin retracting hole 25b is configured such that the air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member provided in the long hole, and aligns the position of the substrate by mechanically holding the substrate loaded into the loading side stage 25 from both sides. It is like that.

  A lift mechanism 26 is provided on the −Z direction side of the carry-in stage 25, that is, on the back side of the carry-in stage 25. The lift mechanism 26 is provided so as to overlap the substrate loading position 25L (see FIG. 6) of the loading side stage 25 in plan view. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

  The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. In the present embodiment, the region on the processing stage 27 is a coating processing region 27S where resist coating is performed.

  The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27. A plurality of grooves (not shown) are provided inside the processing stage 27 for imparting resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the stage.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is configured with substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in area 25S. Therefore, the shape of the carry-out stage 28 is also substantially square in plan view. In the present embodiment, the area on the carry-out stage 28 is the substrate carry-out area 28S. The substrate carry-out area 28S is a substrate carry-out area 28S where the resist-coated substrate S is carried out of the apparatus.

  Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. A lift mechanism 29 is provided on the −Z direction side of the carry-out stage 28, that is, on the back side of the carry-out stage 28. The lift mechanism 29 is provided so as to overlap the substrate carry-out position of the carry-out stage 28 in plan view. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided on the carry-in stage 25. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

  The transport mechanism 23 has a mechanism for holding the substrate S and transporting the substrate S in the + X direction, and a pair is provided on the frame side portion 21b and the frame side portion 21c. The pair of transport mechanisms 23 has a line-symmetric configuration with respect to the center of the stage 22 in the Y direction, and has the same configuration except that the line-symmetrical point. Therefore, hereinafter, the conveyance mechanism 23 provided in the frame side portion 21b will be described as an example.

  The transport mechanism 23 includes a transport machine 23a, a substrate holding unit 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven.

  The substrate holding unit 23b is a holding unit that holds the side edge of the substrate S on the −Y direction side. The said side edge part of the board | substrate S is a part which protruded with respect to the stage 22, and is one side part along a board | substrate conveyance direction. For example, four substrate holding portions 23b are provided along the Y direction on the surface on the + X direction side of the transport machine 23a, and are attached to the transport machine 23a. Each substrate holding portion 23b is provided with a suction pad, and the substrate S is sucked and held by the suction pad.

  The rail 23c is provided on the frame side portion 21b, and extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28. The conveyor 23a can move along the respective stages by sliding the rail 23c.

  In addition, each conveyance mechanism 23 provided in the frame side part 21b and the frame side part 21c can convey the board | substrate S independently. For example, as shown in FIG. 3, different substrates S can be held by the transport mechanism 23 provided on the frame side portion 21b and the transport mechanism 23 provided on the frame side portion 21c. In this case, since the substrates can be alternately conveyed by the respective conveyance mechanisms 23, the throughput is improved. Further, when a substrate having an area about half the size of the substrate S is transported, for example, the two transport mechanisms 23 hold one by one, and the two transport mechanisms 23 are translated in the + X direction to obtain 2 It is also possible to carry a single substrate simultaneously.

(Applying part)
Returning to FIG. 4 from FIG. 2, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.

  The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31a is provided on the Y direction side of the processing stage 27, and each support member 31a is supported by the frame side portion 21b and the frame side portion 21c, respectively. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 34. The moving mechanism 34 includes a rail member 35 and a drive mechanism 36. For example, one rail member 35 is provided in the groove 21d of the frame side portion 21b and the frame side portion 21c, and each rail member 35 extends in the X direction. Each rail member 35 is provided so as to extend to the −X direction side from the management unit 4. The drive mechanism 36 is an actuator that is connected to the portal frame 31 and moves the application unit 3 along the rail member 35. The portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. On the lower surface of the bridging member 31b of the portal frame 31, a sensor that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip 32c of the nozzle 32 and the facing surface facing the nozzle tip 32c. 33 is attached. For example, three sensors 33 are provided along the Y direction.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzle 32 so that the discharge amount of the resist (liquid material) discharged onto the substrate S is constant, and the −X direction side with respect to the coating unit 3 in the substrate transport unit 2. Is provided. The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores them, and a holding member 45 that holds the storage unit.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary ejection mechanism 41 is provided at a position closest to the nozzle 32 in a state where the coating unit 3 is disposed on the coating processing region 27S. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction and a moving mechanism (not shown) that moves the cleaning mechanism. This moving mechanism is provided on the −X direction side of the cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided. In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not restricted to arrangement | positioning of this embodiment, Other arrangement | positioning may be sufficient.

  The dimension of the accommodating portion 44 in the Y direction is smaller than the distance between the support members 31a of the portal frame 31 so that the portal frame 31 can move in the X direction beyond the accommodating portion 44. . Further, the portal frame 31 can access the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 provided in the accommodating portion 44 so as to straddle these portions.

  The holding member 45 is connected to the management unit moving mechanism 46. The management unit moving mechanism 46 includes a rail member 47 and a drive mechanism 48. The rail members 47 are respectively provided in the grooves 21e of the frame side part 21b and the frame side part 21c, and each extend in the X direction. Each rail member 47 is disposed between the rail members 35 connected to the portal frame 31 of the application unit 3. The end portions in the −X direction of the rail members 47 are provided, for example, to the end portions in the −X direction of the frame side portion 21b and the frame side portion 21c. The drive mechanism 48 is an actuator that is connected to the holding member 45 and moves the management unit 4 along the rail member 47.

(Air ejection mechanism / suction mechanism)
FIG. 5 is a view showing the configuration of the air ejection mechanism / suction mechanism of the carry-in stage 25, the processing stage 27, and the carry-out stage 28 of the substrate transport unit 2. Based on the same figure, the structure regarding the air ejection and air suction of each said stage is demonstrated.

  The carry-in stage 25 and the carry-out stage 28 are provided with only air ejection mechanisms 50 and 55, and no suction mechanism is provided. The configurations of the air ejection mechanisms 50 and 55 are the same in both stages. These air ejection mechanisms 50 and 55 have blowers 51 and 56, temperature control units 52 and 57, and manifolds 53 and 58, respectively.

  The blowers 51 and 56 are connected to temperature control units 52 and 57 by pipes 50a and 55a, respectively. The temperature control units 52 and 57 are provided with a cooling mechanism such as a refrigerant mechanism and a heating mechanism such as a heating wire, for example, and are configured so that the temperature of supplied air can be adjusted by the cooling mechanism and the heating mechanism. Yes. The temperature control unit 52 and the temperature control unit 57 can adjust the temperature of the air independently. The temperature control units 52 and 57 are connected to the manifolds 53 and 58 by pipes 50b and 55b, respectively.

  Temperature sensors 54 and 59 are attached to the manifolds 53 and 58, respectively. The temperature sensors 54 and 59 measure the temperature of the air in the manifolds 53 and 58 and transmit the measurement results to the temperature control units 52 and 57, respectively. The temperature control units 52 and 57 can adjust the temperature of the air by feeding back the measurement results of the temperature sensors 54 and 59. As described above, the temperature control units 52 and 57 and the temperature sensors 54 and 59 constitute temperature adjustment mechanisms 81 and 82 that respectively adjust the air temperature by feeding back.

  Pressure gauges are attached to the pipes 50b and 55b, and are connected to the carry-in stage 25 and the carry-out stage 28 by the pipes 50c and 55c, respectively. Various valves are provided in each of the pipes 50a to 50c and 55a to 55c. The pipes 50a to 50c and 55a to 55c may be provided with an air particle amount measuring device for measuring the air particle amount.

On the other hand, the processing stage 27 is provided with a suction mechanism 70 in addition to the air ejection mechanism 60.
FIG. 6 is a diagram illustrating a configuration of an air ejection mechanism and a suction mechanism provided in the processing stage 27. As shown in the figure, the air ejection mechanism 60 includes a blower 61, a temperature control unit 62, a filter 63, an auto pressure controller (APC) 64, a manifold 65, a temperature sensor 66, and an ejection amount monitoring port 67.

  The blower 61 is an air supply source that supplies air to the air ejection mechanism, and is connected to the temperature control unit 62 by a pipe 60a. As an air supply source, an air supply line such as a factory may be connected instead of the blower 61.

  The temperature control unit 62 is a unit that adjusts the temperature of supplied air, for example. In the air circulation part in the temperature control unit 62, for example, a cooling mechanism such as a refrigerant mechanism or a heating mechanism such as a heating wire is provided. By these cooling mechanism and heating mechanism, the temperature of air can be raised or lowered. In the temperature control unit 62, the temperature of air can be adjusted independently of the temperature control units 52 and 57 described above. The temperature control unit 62 is connected to the APC 64 by a pipe 60b.

  A filter 63 is provided in the pipe 60b. The filter 63 is a part for removing foreign matters mixed in the supplied air. Moreover, you may be the structure which provides a relief valve not shown in the piping 60b.

  The APC 64 is a unit that adjusts the supply amount of air. The APC 64 has a butterfly valve 64a and a controller 64b. The controller 64b can adjust the opening degree of the butterfly valve 64a, and the supply amount of air can be adjusted by adjusting the opening degree of the butterfly valve 64a. The APC 64 is connected to the manifold 65 through a pipe 60c.

  A flow meter 69a and a pressure gauge 69b are attached to the pipe 60c. The flow rate and pressure of air in the pipe 60c are measured by the flow meter 69a and the pressure gauge 69b. Each measurement result is transmitted to the APC 64, for example.

  The manifold 65 is a unit that branches the air flowing through the pipe 60c. In the manifold 65, the pipe 60c is connected to a plurality of branched pipes 60d. Each pipe 60 d is connected to an air ejection hole 27 a of the processing stage 27. Therefore, the air from the APC 64 is ejected from the air ejection hole 27a via the piping 60c and each piping 60d.

  The temperature sensor 66 is a sensor that measures the temperature of air in the manifold 65. The air temperature data measured by the temperature sensor 66 is transmitted to the temperature control unit 62 via, for example, a communication line. In the temperature control unit 62, the temperature of the air can be adjusted by feeding back the measurement result of the temperature sensor 66. As described above, the temperature control unit 62 and the temperature sensor 66 constitute a temperature adjusting mechanism 83 that adjusts the air temperature by feeding back.

  The ejection amount monitoring port 67 is configured to have an air flow rate detection port, and the gas flow rate immediately below the stage can be detected by this flow rate detection port. The ejection amount monitoring port 67 is provided with a flow meter 67a and a pressure gauge 67b so that the flow rate and pressure of the air ejected from the air ejection hole 27a can be measured. The measurement results by the flow meter 67a and the pressure gauge 67b are transmitted to the controller 64b in the APC 64.

  Moreover, various valves etc. are attached to said piping 60a-60e, and an opening degree can be suitably adjusted in each valve.

  The suction mechanism 70 includes a blower 71, an auto pressure controller (APC) 72, a trap tank 73, a manifold 74, and a suction pressure monitoring port 75. The blower 71, the APC 72, the trap tank 73, and the manifold 74 are connected to each other by pipes 70a to 70c, and various valves are attached to the pipes 70a to 70c. Instead of the blower 71, an air suction line such as a factory may be used. Moreover, the structure which does not provide the manifold 74 may be sufficient.

  The APC 72 is provided with a butterfly valve 72a and a controller 72b for adjusting the air supply amount. The suction amount monitoring port 75 is connected to the processing stage 27 by a pipe 70e, and an air flow rate detection port is connected to the connection portion. In the suction amount start port 75, the gas flow rate immediately below the processing stage 27 can be detected by this flow rate detection port. Further, a flow meter 75a and a pressure meter 75b are attached to the suction amount monitoring port 75, and the flow rate and pressure of air sucked through the air suction hole 27b can be measured. The measurement results by the flow meter 75a and the pressure gauge 75b are transmitted to the controller 72b in the APC 72.

  A flow meter may be provided between the APC 72 and the air suction hole 27b, and the measurement result may be transmitted to the controller 72b in the APC 72 via an electric wire (indicated by a broken line in the figure). The pipe 60c and the pipe 70c are connected to each other by a connecting portion 80, and can be switched between a purge cleaning liquid suction line and a vacuum suction (air suction) line.

(Coating operation)
Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
FIG. 7 is a plan view showing an operation process of the coating apparatus 1. With reference to the figure, the operation | movement which apply | coats the resist R to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 25S so that the short side direction is parallel to the carrying direction, the resist is applied in the coating treatment region 27S while the substrate S is lifted and carried, and the resist is applied. The coated substrate S is unloaded from the substrate unloading area 28S. In FIG. 7, the illustration of the management unit 4 is omitted, and the configuration of the carry-in stage 25 is easily discriminated. Further, the portal frame 31 is indicated by a broken line so that the configuration of the nozzle 32 and the sensor 33 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is loaded into the substrate loading area 25S, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position 25L of the loading stage 25, the height position of the suction pad 23f is adjusted to the flying height position of the substrate S, and the loading side Air is ejected or sucked from the air ejection hole 25 a of the stage 25, the air ejection hole 27 a of the processing stage 27, the air suction hole 27 b, and the air ejection hole 28 a of the unloading stage 28, and the substrate floats on the surface of the stage 22 Air is supplied to the.

  At this time, in the air ejection mechanism 50 of the carry-in stage 25, the air ejection mechanism 60 of the processing stage 27, and the air ejection mechanism 55 of the carry-out stage 28, the air ejection holes 25a and 27a are respectively detected by the temperature sensors 54, 59, and 66. , 28 a, the temperature of the air ejected from 28 a is measured, and the measurement result is transmitted to the temperature control units 52, 57, 62.

  The temperature control units 52, 57, and 62 adjust the temperature of the air that flows through the temperature control units 52, 57, and 62 based on the measurement results. As the adjustment temperature at this time, a temperature that is substantially equal to the ambient temperature of the coating apparatus 1 is preferable. As such temperature, it can be set as the temperature in the clean room where the coating device 1 can be arrange | positioned, for example, about 20 to 25 degreeC. If the air temperature exceeds 25 ° C., the substrate S may be deformed by the heat of the air. Therefore, it is preferable that the air temperature range be suppressed within the above range.

  When adjusting the temperature, the ambient temperature of the coating apparatus 1 is measured in advance, and the measured ambient temperature is stored as a reference temperature in a controller (not shown) of the temperature control units 52, 57, and 62. For example, a thermometer may be provided separately, and the temperature measured by the thermometer may be used as the reference temperature. When the reference temperature is different from the temperature measured by the temperature sensors 54, 59, 66, the temperature of the air is adjusted by the temperature control units 52, 57, 62 so that the air temperature matches the reference temperature. In this way, by causing the temperature control units 52, 57, 62 and the temperature sensors 54, 59, 66 to function as the temperature adjustment mechanisms 81, 82, 83, respectively, the air discharged from the air discharge holes 25a, 27a, 28a The temperature is substantially equal to the temperature around the coating apparatus 1.

  After the coating apparatus 1 is on standby as described above, for example, when the substrate S is transferred from the outside to the substrate loading position 25L shown in FIG. 7 by a transfer arm (not shown), the lifting member 26a is moved in the + Z direction to move up and down. The pin 26b is protruded from the lifting pin retracting hole 25b to the stage surface 25c. By the operation of the elevating member 26a, the substrate S is lifted by the elevating pins 26b, and the substrate S is received. Further, an alignment member is projected from the long hole of the alignment device 25d to the stage surface 25c.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment of the substrate S is performed by the alignment member of the alignment device 25d.

  After alignment, the suction pad of each substrate holding part 23b disposed on the −Y direction side of the substrate carry-in position is attracted to the back surface of the substrate S to hold the substrate S. After the back surface of the substrate S is held by the substrate holding portion 23b, the transporter 23a is moved along the rail 23c. The substrate S starts to move in the + X direction as the transporter 23a moves.

  Since the temperature of the air ejected from the air ejection holes 25a of the carry-in stage 25 is adjusted to be substantially equal to the temperature around the coating apparatus 1, when the substrate S is carried into the carry-in stage 25, the air The substrate S in contact with the substrate is less likely to cause temperature unevenness, and the resist R film thickness unevenness is less likely to be formed.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist R is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist R is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S. At this time, since the temperature of the air ejected from the air ejection holes 27a of the processing stage 27 is adjusted to be substantially equal to the temperature around the coating apparatus 1, temperature unevenness occurs in the substrate S in contact with the air. This makes it difficult to form uneven thickness of the resist R.

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is conveyed to the substrate carry-out position 28U shown in FIG.

  When the substrate S reaches the substrate carry-out position 28U, the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Due to the movement of the elevating member 29a, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transfer arm, the transfer device 23a is returned again to the substrate loading position 25L of the loading side stage 25, and waits until the next substrate S is transferred.

  When the substrate S is unloaded, the temperature of the air ejected from the air ejection holes 28a of the unloading side stage 28 is adjusted to be approximately equal to the temperature around the coating apparatus 1, so that the substrate S in contact with the air has no contact with the substrate S. Temperature unevenness is less likely to occur, and film thickness unevenness of the resist R is less likely to be formed.

  When transporting the next substrate S, for example, the substrate S is held and transported by the transport mechanism 23 provided on the frame side portion 21c. In addition, until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 8, the gate frame 31 is moved in the −X direction to the position of the management unit 4 by the rail member 35.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted so that the tip of the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle tip 32 c is cleaned by the nozzle cleaning device 43. To do.

  After cleaning the nozzle tip 32 c, the nozzle 32 is accessed to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, while measuring the distance between the opening 32a and the preliminary discharge surface, the opening 32a at the tip of the nozzle 32 is moved to a predetermined position in the Z direction, and the nozzle 32 is moved in the −X direction. The resist is preliminarily discharged from the opening 32a.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported by the transport mechanism 23 provided on the frame side portion 21c, the nozzle 32 is moved to a predetermined position in the Z direction. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip tank 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

  As described above, according to the present embodiment, the air ejection mechanisms 50, 55, and 60 that eject air to the substrate S are provided in the substrate transport unit 2, and the temperature regulation mechanisms 81 and 82 that regulate the temperature of the air. 83, the temperature of the air blown to the substrate S can be adjusted by the temperature adjusting mechanisms 81, 82, 83. Thereby, the temperature unevenness which generate | occur | produces in the board | substrate S can be reduced, and generation | occurrence | production of the film thickness nonuniformity of the resist R apply | coated on the board | substrate S can be prevented.

  Moreover, according to this embodiment, the temperature control mechanisms 81-83 are provided in each of the carrying-in stage 25, the processing stage 27, and the carrying-out stage 28, and the air temperature is set independently at each stage. Therefore, the temperature of the gas can be adjusted with higher accuracy.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the temperature supplied to the air supplied from the blower is adjusted, and the temperature-adjusted air is ejected. However, the present invention is not limited to this. The suctioned air may be circulated through the air ejection mechanism, and the circulated air may be ejected. For example, the air jet mechanism 60 and the suction mechanism 70 may be circulated through a connection portion 80 that connects the air jet mechanism 60 and the suction mechanism 70, and a separate circulation path is provided between the air jet mechanism 60 and the suction mechanism 70. The air sucked in may be configured to circulate. Further, the air may be circulated from the suction mechanism 70 to the air ejection mechanisms 50 and 55. In addition, when circulating the air attracted | sucked by the suction mechanism 70 as mentioned above, it is good also as a structure which arrange | positions the filter which controls passage of a foreign material to a circulation path. Moreover, you may have the structure which circulates the air on the stage 22 to the air ejection mechanism 50,55,60.

  In the above embodiment, the temperature sensors 54, 59, and 66 are attached to the manifolds 53, 58, and 65, respectively. However, the present invention is not limited to this, and a structure that is attached to another location, for example, a structure that is attached to a pipe. Alternatively, it may be configured to be attached to the air ejection holes 25a, 27a, and 28a.

  In the above embodiment, the temperature sensor is attached to a location corresponding to the air ejection hole of each stage. However, the present invention is not limited to this. For example, the air ejected from the air ejection hole 27a of the processing stage 27 The temperature sensor may be provided only for. Further, a temperature sensor may be provided only for the air ejected from the air ejection hole 27a of the processing stage 27 and the air ejection hole 28a of the carry-out stage 28.

  Moreover, in the said embodiment, although it was set as the structure which adjusts the temperature of air generally on the carrying-in side stage 25 and the carrying-out side stage 28, it is not restricted to this, For example, a part of carrying-in side stage 25 or The temperature may be adjusted only for air ejected from a part of the carry-out stage 28. In this case, for example, the temperature of the air jetted onto one region centered on the processing stage 27, such as a region in the carry-in stage 25 that contacts the processing stage 27, or a region in the carry-out side stage 28 that contacts the processing stage 27, It is preferable that the configuration is adjusted.

  Moreover, in the said embodiment, although it was the structure which adjusts the air ejected from each of the carrying-in side stage 25, the processing stage 27, and the carrying-out side stage 28 to the same temperature, it is not restricted to this, The stage may be adjusted to a different temperature. For example, in the carry-out stage 28, the resist R applied on the substrate S may be adjusted to a temperature at which it can be dried. Thereby, the time required for the drying process of the resist R can be reduced.

The perspective view which shows the structure of the coating device which concerns on embodiment of this invention. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The figure which shows the structure of the mechanism which supplies air to a stage. The figure which shows the structure of an air supply mechanism and a suction mechanism. The figure which shows operation | movement of the coating device which concerns on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS S ... Board | substrate R ... Resist 1 ... Application | coating apparatus 2 ... Substrate conveyance part 3 ... Application | coating part 25 ... Loading side stage 25S ... Substrate carrying-in area | region 25a ... Air ejection hole 27 ... Processing stage 27a ... Air ejection hole 27a ... Air ejection opening 27b ... Air suction hole 27S ... coating treatment area 28 ... unloading stage 28a ... air ejection hole 28S ... substrate unloading area 28U ... substrate unloading position 50, 55, 60 ... air ejection mechanism 51, 56, 61 ... blower 52, 57, 62 ... Temperature control unit 53, 58, 65 ... Manifold 54, 59, 66 ... Temperature sensor 70 ... Suction mechanism 80 ... Connection part 81-83 ... Temperature control mechanism

Claims (13)

A coating apparatus comprising a substrate transport unit that floats and transports a substrate, and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
A gas ejection unit provided in the substrate transport unit and configured to eject gas to the substrate;
A temperature adjusting unit for adjusting the temperature of the gas,
The substrate transport unit is
A processing stage is provided, and an application area corresponding to the application part;
A loading-side gas ejection stage is provided, and a substrate loading area for loading the substrate;
An unloading-side gas ejection stage, and a substrate unloading area for unloading the substrate,
The stage surface of the processing stage is provided with a plurality of gas ejection ports for ejecting the gas and a plurality of suction ports for sucking a conveyance space in which the substrate is conveyed,
The processing stage has a circulation path for circulating the gas sucked from the suction port to the gas ejection port,
A plurality of second gas ejection ports for ejecting the gas are provided on the surfaces of the loading-side gas ejection stage and the unloading-side gas ejection stage,
The said temperature control part can adjust the temperature of the said gas for every stage of the said process stage, the said stage for carrying-in side gas ejection, and the stage for the said carrying-out side gas jetting. The coating device characterized by the above-mentioned. The coating apparatus according to claim 1, wherein the temperature adjustment unit adjusts the temperature of the gas so as to match the temperature of the conveyance space. The said temperature adjustment part adjusts the temperature of the said gas in the range of 20 to 25 degreeC. The coating device of Claim 1 characterized by the above-mentioned. The coating apparatus according to any one of claims 1 to 3, wherein the gas ejection port ejects the gas only to the transfer space in the processing stage. The said circulation path has a filter which regulates the distribution | circulation of the foreign material contained in the said gas. The coating device as described in any one of Claims 1-4 characterized by the above-mentioned. The at least one of a cooling mechanism and a heating mechanism is provided on the path for supplying the gas so as to keep the temperature of the transfer space for transferring the substrate at a constant temperature. The coating apparatus as described in any one of Claim 5. An application method for applying a liquid material to the substrate while the substrate is levitated and conveyed,
Adjusting the temperature of the gas, jetting the gas whose temperature has been adjusted to the substrate and floating the substrate;
When applying the liquid material to the substrate,
A plurality of gas jets and a plurality of suction ports are provided, and the gas is jetted from the plurality of gas jets on a processing stage disposed corresponding to a region where the liquid material is applied, and a plurality of the suctions are provided. Floating the substrate by sucking a transfer space in which the substrate is transferred by a mouth;
Circulating the gas sucked from the suction port to the gas outlet,
When carrying in the substrate, the substrate is ejected from the plurality of carry-in gas jets onto the substrate on a carry-in gas jet stage provided with a plurality of carry-in gas jets. Do the surfacing,
When unloading the substrate, the substrate is ejected from the plurality of unloading-side gas ejection ports onto the unloading-side gas ejection stage provided with a plurality of unloading-side gas ejection ports. Do the surfacing,
The gas temperature is adjusted for each of the processing stage, the carry-in side gas ejection stage, and the carry-out side gas ejection stage. The coating method according to claim 7, wherein the temperature of the gas ejected to the substrate is adjusted before coating the liquid material. The coating method according to claim 7 or 8, wherein the temperature of the gas ejected to the substrate is adjusted before the substrate is carried in. The coating method according to any one of claims 7 to 9, wherein the temperature of the gas ejected to the substrate is adjusted before the substrate is unloaded. The coating method according to any one of claims 7 to 10, wherein the temperature of the gas is adjusted so as to match the temperature of the transport space that transports the substrate. The temperature of the said gas is adjusted in the range of 20-25 degreeC. The coating method as described in any one of Claims 7-11 characterized by the above-mentioned. The temperature of the gas is adjusted so that a gas having a different temperature is jetted onto the substrate in each stage according to the transport position of the substrate. The coating method described in 1.

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