JP2005247516A - Levitated substrate conveying treatment device - Google Patents

Levitated substrate conveying treatment device Download PDF

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Publication number
JP2005247516A
JP2005247516A JP2004061510A JP2004061510A JP2005247516A JP 2005247516 A JP2005247516 A JP 2005247516A JP 2004061510 A JP2004061510 A JP 2004061510A JP 2004061510 A JP2004061510 A JP 2004061510A JP 2005247516 A JP2005247516 A JP 2005247516A
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substrate
processing
roller
floating
resist
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JP2004061510A
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JP2005247516A5 (en
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Takeshi Yamazaki
剛 山崎
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Tokyo Electron Ltd
東京エレクトロン株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a floating substrate transfer processing apparatus capable of downsizing and simplifying the apparatus and improving processing efficiency.
SOLUTION: A floating stage 22 that floats a substrate G to different heights by jetting or injecting and sucking gas from the surface, and a processing liquid is supplied to the surface of the substrate G in a strip shape, disposed above the floating stage 22. A resist supply nozzle 23 that supports the both side edges of the substrate G that floats on the floating stage 22 and a transport roller 24 that passes the substrate G under the resist supply nozzle 23 are provided. As a result, both end portions of the substrate that is levitated on the levitation stage are supported by the transport rollers, and the substrate is moved below the resist supply nozzle and the processing liquid is supplied in a strip shape to perform the processing. Can do.
[Selection] Figure 2

Description

  The present invention relates to a floating substrate transfer processing apparatus for supplying a processing liquid such as a resist solution to a substrate to be processed such as a glass substrate for LCD.

  In general, in a semiconductor device manufacturing process, a resist film is formed by applying a resist solution to a glass substrate for LCD (hereinafter referred to as a substrate) as a substrate to be processed, and a circuit pattern is reduced using photolithography technology. The resist film is transferred to the resist film, developed, and then subjected to a series of processes for removing the resist film from the substrate.

  For example, as a method for forming a resist film, a resist supply nozzle that discharges a resist solution obtained by dissolving a photosensitive resin in a solvent in a strip shape and a rectangular substrate are relatively arranged in a direction perpendicular to the resist discharge direction. A method of performing a coating process by translating is known (see, for example, Patent Document 1).

According to this method, since the resist solution is discharged (supplied) from one side of the substrate to the other side in a strip shape, a resist film can be formed on the entire surface of the rectangular substrate on average.
Japanese Patent Laid-Open No. 10-156255 (Claims, FIG. 1)

  However, in the technique described in the above Japanese Patent Laid-Open No. 10-156255, the apparatus is configured to move at least one of a resist supply nozzle installed above the substrate or a stage that holds the substrate in a horizontal posture. There is a problem in that it is large and complicated, and enormous energy is required to move the resist supply nozzle and the stage which are heavy. In addition, since the resist supply nozzle and the stage, which are heavy in weight, are moved back to their original positions after processing and moved again to perform processing, there is a problem in that processing efficiency is lowered.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a floating substrate transfer processing apparatus that can reduce the size and simplify the apparatus and can improve the processing efficiency. It is.

  In order to solve the above-mentioned problem, the invention according to claim 1 is arranged above the levitation stage, a levitation stage that levitates or injects and sucks gas from the surface to levitate the substrate to be processed at different heights. A processing liquid supply means for supplying a processing liquid to the surface of the substrate to be processed in a strip shape; and supporting both side edges of the substrate to be processed that float on the levitation stage; And a conveying roller that passes below.

  In the present invention, the transport roller is formed by a plurality of roller bodies, and at this time, the roller body that supports the substrate to be processed located below the processing liquid supply unit is disposed between the processing liquid supply unit and the substrate to be processed. Is preferably disposed at a predetermined height position so as to maintain a predetermined distance (Claim 2).

  Further, it is preferable that a flange portion for regulating the position of the side edge of the substrate to be processed is formed on the transport roller.

  Further, the processing liquid supply means may be formed to be movable so as to relatively move the transport roller and the processing liquid supply means.

  (1) According to the first aspect of the present invention, both end portions of the substrate to be processed that are levitated on the levitation stage are supported by the transport rollers, and the substrate to be processed is moved while being moved below the processing liquid supply means. Processing can be performed by supplying the processing liquid from the liquid supply means in a strip shape. Therefore, since the floated substrate is transported by the transport roller, the apparatus can be downsized and simplified, and the processing efficiency can be improved.

  (2) According to the invention described in claim 2, since the distance between the processing liquid supply means and the substrate to be processed can be maintained at a predetermined distance, in addition to the above (1), the film thickness of the processing liquid is further increased. Can be made uniform.

  (3) According to the invention described in claim 3, the positioning of the substrate to be processed in the width direction is made accurate by forming the flange portion for regulating the position of the side edge of the substrate to be processed on the transport roller. Therefore, in addition to the above (1) and (2), the processing accuracy can be further improved.

  (4) According to the invention described in claim 4, the processing liquid supply means is formed so as to be movable so that the transport roller and the processing liquid supply means can be moved relative to each other. Since the moving speed and acceleration can be reduced, in addition to the above (1) to (3), the length of the entire apparatus can be further shortened, and the apparatus can be miniaturized.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described in detail with reference to the accompanying drawings. Here, a case will be described in which the floating substrate transfer processing apparatus according to the present invention is applied to a resist coating processing apparatus in a resist coating and developing processing apparatus for an LCD glass substrate.

  As shown in FIG. 1, the resist coating and developing apparatus includes a loading / unloading unit 1 for placing a cassette C that houses a plurality of glass substrates G for LCD (hereinafter referred to as substrates G), and a substrate. A processing unit 2 having a plurality of processing units for performing a series of processes including resist coating and development on G, and an interface unit 3 for transferring the substrate G to and from the exposure apparatus 4; The loading / unloading unit 1 and the interface unit 3 are disposed at both ends of the processing unit 2, respectively. In FIG. 1, the longitudinal direction of the resist coating and developing apparatus is the X direction, and the direction orthogonal to the X direction in plan view is the Y direction.

  The loading / unloading unit 1 includes a transport mechanism 5 for loading / unloading the substrate G between the cassette C and the processing unit 2, and the loading / unloading unit 1 loads / unloads the cassette C to / from the outside. . The transport mechanism 5 has a transport arm 5a and can move on a transport path 6 provided along the Y direction, which is the arrangement direction of the cassettes C. The transport arm 5a allows the cassette C and the processing unit 2 to move. The substrate G is loaded and unloaded between the two.

  The processing unit 2 basically has two parallel rows of transport lines A and B for transporting the substrate G extending in the X direction. From the loading / unloading unit 1 side to the interface unit 3 along the transport line A. A scrub cleaning processing unit (SCR) 11, a first thermal processing unit section 16, a resist processing unit 13, and a second thermal processing unit section 17 are arranged. Further, a second thermal processing unit section 17, a development processing unit (DEV) 14, an i-ray UV irradiation unit (i-UV) 15, and the like from the interface unit 3 side toward the carry-in / out unit 1 along the transport line B A third thermal processing unit 18 is arranged. An excimer UV irradiation unit (e-UV) 12 is provided on a part of the scrub cleaning unit (SCR) 11. In this case, an excimer UV irradiation unit (e-UV) 12 is provided to remove organic substances on the substrate G prior to scrubber cleaning. An i-ray UV irradiation unit (i-UV) 15 is provided for performing a decoloring process for development.

  The first thermal processing unit section 16 has two thermal processing unit blocks (TB) 31 and 32 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 11 side, and the thermal processing unit block (TB) 32 is provided on the resist processing unit 13 side. A first transport mechanism 33 is provided between the two thermal processing unit blocks (TB) 31 and 32.

  The second thermal processing unit section 17 has two thermal processing unit blocks (TB) 34 and 35 formed by stacking thermal processing units for performing thermal processing on the substrate G. The thermal processing unit block (TB) 34 is provided on the resist processing unit 13 side, and the thermal processing unit block (TB) 35 is provided on the development processing unit 14 side. A second transport mechanism 36 is provided between the two thermal processing unit blocks (TB) 34 and 35.

  The third thermal processing unit section 18 includes two thermal processing unit blocks (TB) 37 and 38 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 37 is provided on the development processing unit (DEV) 14 side, and the thermal processing unit block (TB) 38 is provided on the cassette station 1 side. A third transport mechanism 39 is provided between the two thermal processing unit blocks (TB) 37 and 38.

  The interface unit 3 includes an extension / cooling stage (EXT / COL) 41, an external apparatus block 42 in which a peripheral exposure apparatus (EE) and a TITRA are stacked, a buffer stage (BUF) 43, A fourth transport mechanism 44 is provided.

  In the interface unit 3 configured as described above, the substrate G transported by the second transport mechanism 36 is transported to the extension / cooling stage (EXT / COL) 41, and the external device block 42 is transported by the fourth transport mechanism 44. To the peripheral exposure apparatus (EE), exposure for removing the peripheral resist is performed, and then the fourth transport mechanism 44 transports the exposure apparatus 4 to expose the resist film on the substrate G. A predetermined pattern is formed. In some cases, the substrate G is accommodated in the buffer stage (BUF) 43 and then transferred to the exposure apparatus 4. After the exposure is completed, the substrate G is carried into the TITRA of the external device block 42 by the fourth transport mechanism 44 and predetermined information is written on the substrate G, and then the extension / cooling stage (EXT / COL). ) 41 and transported to the processing unit 2 again.

  The resist processing unit 13 includes a resist coating processing apparatus 20 to which the floating substrate transfer processing apparatus according to the present invention is applied, and a resist film formed on the substrate G by the resist coating processing apparatus 20 in a decompression container (not shown). ) And a reduced pressure drying apparatus (VD) 21 for drying under reduced pressure.

  Next, a resist coating processing apparatus 20 to which the floating substrate transfer processing apparatus according to the present invention is applied will be described.

<First Embodiment>
FIG. 2 is a schematic perspective view showing a main part of the first embodiment of the resist coating apparatus 20, and FIG. 3 is a substrate G showing a state in which a resist solution is supplied (discharged) to the substrate G by the resist coating apparatus 20. 4 is a schematic side view showing the moving state of the substrate G, and FIG. 5 is a schematic cross-sectional view along the direction orthogonal to the moving direction of the substrate G.

  The resist coating processing apparatus 20 is disposed above the levitation stage 22 so that the substrate G floats at different heights by jetting or jetting and sucking gas from the surface, and processing is performed on the surface of the substrate G. A resist supply nozzle 23 which is a processing liquid supply means for supplying a resist solution R which is a liquid in a strip shape, and both side edges of the substrate G which floats on the floating stage 22 are supported, and the substrate G is below the resist supply nozzle 23. And a conveying roller 24 that allows the toner to pass therethrough.

  In this case, as shown in FIGS. 2 and 3, the levitation stage 22 includes a carry-in region 22a including a plurality of lift pins 28a that can be moved up and down to receive a substrate G transported by a transport arm (not shown), and a resist supply. An application region 22b that maintains a gap between the nozzle 23 and the substrate G at a certain distance, for example, 100 to 150 μm, and a carry-out region 22c that includes a plurality of, for example, four lift pins 28b that can move the substrate G up and down are provided. Yes. In the carry-in area 22a and the carry-out area 22c, gas, for example, air is injected from a large number of injection holes 29a provided on the surface of the levitation stage 22, and the substrate G is levitated at a height of about 100 to 150 μm. Further, in the application region 22b, a large number of injection holes 29a and suction holes 29b are provided on the surface of the levitation stage 22, for example, in a staggered manner. Gas or air is injected from the injection holes 29a and suction is performed from the suction holes 29b. As a result, the substrate G is levitated at a height of about 50 μm. In addition, between the carrying-in area | region 22a and the application | coating area | region 22b, and between the application | coating area | region 22b and the carrying-out area | region 22c, the connection area | regions 22d and 22e which respectively connect the height gap between both are provided. In these connection regions 22d and 22e, a large number of injection holes 29a and suction holes 29b are provided so that the substrate G is gradually lowered or raised by adjusting the injection amount and the suction amount of air, which is a gas. It is configured.

  The resist supply nozzle 23 is attached to a gate-shaped holding body (not shown) straddling the top of the floating stage 22 so that the vertical position can be adjusted, and is supplied by a supply pipe 23a connected to a resist tank (not shown). The resist solution R to be supplied is configured to be supplied (discharged or dropped) in a strip shape on the surface of the substrate G.

  The conveying roller 24 is formed by a roller group of a plurality of roller bodies 25, 26, and 27 having different diameters disposed on both sides of the floating stage 22. These roller bodies 25, 26, and 27 are disposed at height positions corresponding to the flying heights in the carry-in and carry-out areas 22a and 22c, the joining areas 22d and 22e, and the coating area 22b. These roller bodies 25, 26 and 27 are formed to be rotatable by a driving means 100 described later.

  As shown in FIG. 6, the driving unit 100 includes one motor 101 as a driving source, a transmission mechanism 103 that transmits the power of the motor 101 to two driving shafts 102, each driving shaft 102, and each roller body. 25, 26, and 27 (the roller body 25 is shown as a representative example in the drawing) and a gear mechanism 105 mounted on the rotating shaft 104. Each roller body 25 (26 is driven by one motor 101. 27) are driven independently.

  In this case, a first timing belt 109 is stretched between a drive pulley 107 attached to the drive shaft 106 of the motor 101 and a driven pulley 108 attached to one drive shaft 102. Further, a first transmission pulley 110 is mounted on each of the drive shafts 102, and the first transmission pulley 110 and two intermediate shafts 111 arranged in parallel below the respective drive shafts 102 are respectively connected. A second timing belt 113 is stretched over the attached second transmission pulley 112. Further, a third timing belt 114 is stretched around a pulley (also used as the second transmission pulley 112 in the drawing) attached to both intermediate shafts 111. The drive mechanism 107, the driven pulley 108, the first and second transmission pulleys 110 and 112, and the first, second, and third timing belts 109, 113, and 114 constitute the transmission mechanism 103. .

  The gear mechanism 105 includes a drive side bevel gear 105 a mounted on the drive shaft 102 and a driven bevel gear 105 b mounted on the rotation shaft 104 of each roller body 24, and is parallel to the levitation stage 22. The rotation direction of the arranged drive shaft 102 is converted into an orthogonal direction and transmitted to each roller body 25 (26, 27).

  In the above description, each of the roller bodies 25, 26, 27 is driven by the motor 101, which is one drive source, but the diameter of the roller bodies 25, 26, 27 is different as described later. When the substrate G straddles any two of the carry-out regions 22a and 22c, the connecting regions 22d and 22e, and the coating region 22b, two rollers are used to prevent the roller bodies 25, 26, and 27 from slipping. The rotational speeds of the roller bodies 25, 26, and 27 are controlled so that the peripheral speeds of the roller bodies 25, 26, and 27 corresponding to the regions are the same. In addition, when the board | substrate G does not straddle two area | regions, even if a circumferential speed differs, there is no problem. The driving means 100 is provided separately for each of the carry-in and carry-out areas 22a and 22c, the connecting areas 22d and 22e, and the coating area 22b, and the peripheral speeds of the roller bodies 25, 26, and 27 are set for the respective areas 22a to 22e. You may make it control to a desired speed | rate.

  Note that by setting the pressure of the gas supplied to the injection hole 29a provided in the levitation stage 22 and the pressure of the suction communicating with the suction hole 29b to predetermined values, the floating amount of the substrate G becomes constant. The amount by which the transport roller 24 (specifically, the roller bodies 25, 26, 27) protrudes from the surface of the stage 22 is substantially equal to the floating amount of the substrate G due to gas injection and suction without the transport roller 24. It is desirable to set in advance so that Further, the total load of the substrate G applied to each of the roller bodies 25, 26, 27 on which the substrate G is placed may be set to be smaller than the actual load of the substrate G. By setting the protruding amount of the transport roller 24 (roller bodies 25, 26, 27) in this way, the substrate G on the transport roller 24 is in the axial direction of the transport roller 24 (a direction orthogonal to the moving direction of the substrate G). Therefore, the substrate G can be transported without being slipped on the transport roller 24.

  Further, the diameter D1 of the first roller body 25 disposed on both sides of the carry-in and carry-out areas 22a and 22c of the floating stage 22 and the second roller body 26 disposed on both sides of the connecting areas 22d and 22e. The relationship between the diameter D2 and the diameter D3 of the third roller body 27 disposed on both sides of the application region 22b is D1> D2> D3. Thus, by changing the diameters D1, D2, and D3 of the roller bodies 25, 26, and 27 in the carry-in and carry-out regions 22a and 22c, the joining regions 22d and 22e, and the coating region 22b, the substrates having different flying heights. G can be moved (conveyed) smoothly.

  The third roller body 27 disposed in the transport region 22b is disposed at a predetermined height position so as to maintain the distance between the resist supply nozzle 23 and the substrate G at a predetermined distance S (100 to 150 μm). Has been. The height of the roller body that supports at least the substrate G located below the resist supply nozzle 23 in the third roller body 27 may be set as described above.

  Thus, the height of the third roller body 27 that supports at least the substrate G positioned below the resist supply nozzle 23 is set to a predetermined interval S (100 to 150 μm) between the resist supply nozzle 23 and the substrate G. By setting the height to be maintained, the film thickness of the resist applied on the surface of the substrate G can be made uniform.

  In this case, as shown in FIG. 8, a flange portion 50 that regulates the position of the side edge of the substrate G is formed on the transport roller 24 (specifically, the roller bodies 25, 26, and 27). Since the substrate G can be positioned in the width direction, the processing accuracy can be further improved.

  Next, the operation | movement aspect of the resist coating processing apparatus 20 comprised as mentioned above is demonstrated. First, when the substrate G that has been heat-treated by the thermal processing unit (TB) 31 is loaded onto the loading region 22a of the levitation stage 22 by a transfer arm (not shown), the lift pins 28a rise to receive the substrate G. Thereafter, the transfer arm retracts outward from the levitation stage 22. When the lift pins 28a are lowered after receiving the substrate G, the substrate G is levitated to a height of about 100 to 150 [mu] m by the air ejected from the surface of the carry-in area 22a, and the first roller body at this levitated height position. 25. As a result, the substrate G is maintained in a horizontal state at a height of about 100 to 150 μm on the carry-in area 22 a of the floating stage 22.

  Next, the driving mechanism of the transport roller 24 is driven to transport the substrate G to the coating region 22b. In the coating region 22 b, the substrate G is levitated to a height of about 50 μm by the balance between the ejection and suction of air from the surface of the levitation stage 22 and the support of the third roller body 27. The predetermined interval S (100 to 150 μm) is maintained. In this state, the resist solution R is supplied (discharged) in a strip shape from the resist supply nozzle 23 and the substrate G is moved, whereby a resist film is uniformly formed on the surface of the substrate G.

  When the substrate G on which the resist film is formed is moved to the carry-out region 22c, the substrate G is levitated to a height of about 100 to 150 μm by the air ejected from the surface of the carry-out region 22c, and the first roller Supported by the body 25. Then, the lift pins 28b are moved up to move the substrate G to the upper delivery position. In this state, a transfer arm (not shown) receives the substrate G and transfers the substrate G to the vacuum drying apparatus (VD) 21 in the next process.

Second Embodiment
FIG. 9 is a schematic side view for explaining the operation of the second embodiment of the resist coating processing apparatus 20A to which the floating substrate transfer processing apparatus according to the present invention is applied.

  In the second embodiment, the resist supply nozzle 23 is relatively moved simultaneously with the transfer of the substrate G to reduce the moving speed and acceleration of the substrate G with respect to the processing time and to reduce the overall length of the apparatus. is there. That is, in the second embodiment, similarly to the first embodiment, the substrate G is formed to be movable (conveyed) by the conveyance roller 24, and further, the holding body 60 to which the resist supply nozzle 23 is attached is moved. The mechanism 70 is formed to be movable in parallel with the floating stage 22. In this case, the moving mechanism 70 includes a ball screw shaft 71 that slidably supports a mover 61 provided on a leg portion of the holding body 60 via a number of balls (not shown), and forward and reverse rotation of the screw shaft 71. It is formed by the ball screw mechanism provided with the motor 72 which performs. The moving mechanism 70 may be replaced with a mechanism using a timing belt instead of a ball screw mechanism, a linear motor, or the like.

  In addition, in 2nd Embodiment, since another part is the same as 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

  Next, the operation | movement aspect of 20 A of resist coating processing apparatuses of 2nd Embodiment is demonstrated. First, when the substrate G that has been heat-treated by the thermal processing unit (TB) 31 is loaded onto the loading region 22a of the levitation stage 22 by a transfer arm (not shown), the lift pins 28a rise to receive the substrate G. Thereafter, the transfer arm retracts outward from the levitation stage 22. When the lift pins 28a are lowered after receiving the substrate G, the substrate G is levitated to a height of about 100 to 150 [mu] m by the air ejected from the surface of the carry-in area 22a, and the first roller body at this levitated height position. 25. Accordingly, the substrate G is maintained in a horizontal state at a height of about 100 to 150 μm on the carry-in area 22a of the levitation stage 22 (see FIG. 9A).

  Next, the driving mechanism of the transport roller 24 is driven and the substrate G is transported to the coating region 22b. At the same time, the motor 72 of the moving mechanism 70 is driven to move the resist supply nozzle 23 together with the holding body 60 toward the carry-in region 22a. (See FIG. 9B). In the application region 22b, the substrate G is levitated to a height of about 50 μm by the balance between the ejection and suction of air from the surface of the levitation stage 22 and the support of the third roller body 27, and the resist supply nozzle 23 Is maintained at a predetermined interval S (100 to 150 μm). In this state, that is, in a state where the substrate G is moved L1 and the resist supply nozzle 23 is moved L2, the resist solution R is supplied (discharged) from the resist supply nozzle 23 in a strip shape, and the substrate G and the resist supply nozzle 23 are relatively moved. As a result, a resist film is uniformly formed on the surface of the substrate G in a state where the moving speed and acceleration of the substrate G are reduced.

  When the substrate G on which the resist film is formed is moved to the carry-out region 22c, the substrate G is levitated to a height of about 100 to 150 μm by the air ejected from the surface of the carry-out region 22c, and the first roller Supported by the body 25. Then, the lift pins 28b are moved up to move the substrate G to the upper delivery position. In this state, a transfer arm (not shown) receives the substrate G and transfers the substrate G to the vacuum drying apparatus (VD) 21 in the next process. After the resist film is formed, the motor 72 of the moving mechanism 70 rotates reversely, and the holding body 60 and the resist supply nozzle 23 return to the initial positions (see FIG. 9C).

<Other embodiments>
In the above-described embodiment, the case where the diameters of the roller bodies 25, 26, and 27 constituting the transport roller 24 are different has been described. However, the diameters of all the roller bodies 25, 26, and 27 are the same and The amount of protrusion of the roller bodies 25, 26, 27, for example, the mounting height of the roller bodies 25, 26, 27 may be changed in the carry-in and carry-out areas 22a, 22c, the joining areas 22d, 22e, and the application area 22b. .

  The transport roller 24 is, for example, collectively for each of the carry-in and carry-out areas 22a and 22c, the connection areas 22d and 22e, and the application area 22b, and for each of the carry-in and carry-out areas 22a and 22c, the connection areas 22d and 22e, and the application area 22b. Alternatively, the amount by which the transport roller 24 (roller bodies 25, 26, 27) protrudes from the surface of the levitation stage 22 can be adjusted, for example, in the height direction. By doing so, adjustment in the height direction is facilitated. The height adjustment may be performed by placing the substrate G on the transport roller 24 and performing jetting or suctioning of the gas so that the floating substrate G is substantially horizontal.

  In the above embodiment, the case where the floating substrate transfer processing apparatus according to the present invention is applied to a resist coating processing apparatus has been described. However, the present invention can be applied to apparatuses other than the resist coating processing apparatus, for example, development processing apparatuses. is there.

1 is a schematic plan view showing a resist coating and developing treatment apparatus for a glass substrate for LCD to which a floating substrate transfer processing apparatus according to the present invention is applied. It is a schematic perspective view which shows 1st Embodiment of the resist coating processing apparatus to which the said floating type substrate conveyance processing apparatus is applied. It is a schematic sectional drawing in alignment with the moving direction of the board | substrate of the said resist coating processing apparatus. It is a schematic side view which shows the movement state of the board | substrate G in this invention. It is a schematic sectional drawing in alignment with the direction orthogonal to the moving direction of the board | substrate of the said resist coating processing apparatus. It is the schematic plan view (a), schematic front view (b), and schematic side view (c) which show an example of the drive means of the conveyance roller in this invention. It is a schematic sectional drawing which shows the board | substrate support state of the conveyance roller in this invention. It is a schematic sectional drawing which shows the board | substrate support state of another conveyance roller in this invention. It is a schematic side view which shows operation | movement of 2nd Embodiment of the resist coating processing apparatus to which the floating type substrate conveyance processing apparatus concerning this invention is applied.

Explanation of symbols

G Glass substrate for LCD (substrate to be processed)
22 Floating stage 23 Resist supply nozzle (Processing liquid supply means)
24 Conveying roller 25 First roller body 26 Second roller body 27 Third roller body 50 Flange 60 Holding body 70 Moving mechanism

Claims (4)

  1. A levitation stage that blasts or injects and sucks gas from the surface to levitate the substrate to be processed at different heights;
    A processing liquid supply means disposed above the levitation stage and supplying a processing liquid to the surface of the substrate to be processed in a strip shape;
    A floating substrate transport comprising: a transport roller that supports both side edges of the substrate to be floated on the floating stage and passes the substrate to be processed under the processing liquid supply unit. Processing equipment.
  2. In the floating type substrate transfer processing apparatus according to claim 1,
    The transport roller is formed by a plurality of roller bodies. At this time, the roller body that supports the substrate to be processed located below the processing liquid supply unit has a predetermined interval between the processing liquid supply unit and the substrate to be processed. A floating substrate transfer processing apparatus, wherein the floating substrate transfer processing apparatus is disposed at a predetermined height position so as to be maintained at a predetermined distance.
  3. In the floating type substrate transfer processing apparatus according to claim 1 or 2,
    A floating substrate transfer processing apparatus, wherein the transfer roller is formed with a flange portion for regulating a position of a side edge of the substrate to be processed.
  4. In the floating type substrate transfer processing apparatus according to any one of claims 1 to 3,
    A substrate transport processing apparatus, wherein the processing liquid supply means is formed to be movable so as to relatively move the transport roller and the processing liquid supply means.
JP2004061510A 2004-03-05 2004-03-05 Levitated substrate conveying treatment device Pending JP2005247516A (en)

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JP2007158005A (en) * 2005-12-05 2007-06-21 Tokyo Electron Ltd Substrate transport apparatus and substrate processing apparatus
JP2009061380A (en) * 2007-09-05 2009-03-26 Dainippon Screen Mfg Co Ltd Coating device and coating method
JP2009061395A (en) * 2007-09-06 2009-03-26 Tokyo Ohka Kogyo Co Ltd Coating device and method
JP2009072650A (en) * 2007-09-19 2009-04-09 Tokyo Ohka Kogyo Co Ltd Floating transfer coater
JP2010098126A (en) * 2008-10-16 2010-04-30 Tokyo Electron Ltd Substrate transporting and processing apparatus
JP2011219250A (en) * 2010-04-14 2011-11-04 Oiles Corp Non-contact carrying device
KR101133266B1 (en) 2009-11-02 2012-04-05 주식회사 나래나노텍 A Substrate Transferring Device in Coating Region and A Coating Apparatus Having the Same, and A Method of Transferring Substrate
KR101202456B1 (en) 2010-06-24 2012-11-16 주식회사 나래나노텍 A Structure of Linear Motion Guide for Transferring Substrate Stably in Coating Region, and A Substrate Transferring Device and A Coating Apparatus Having the Same
JP2014133655A (en) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd Non-contact conveyance apparatus
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JP2009061380A (en) * 2007-09-05 2009-03-26 Dainippon Screen Mfg Co Ltd Coating device and coating method
JP2009061395A (en) * 2007-09-06 2009-03-26 Tokyo Ohka Kogyo Co Ltd Coating device and method
JP2009072650A (en) * 2007-09-19 2009-04-09 Tokyo Ohka Kogyo Co Ltd Floating transfer coater
JP2010098126A (en) * 2008-10-16 2010-04-30 Tokyo Electron Ltd Substrate transporting and processing apparatus
KR101133266B1 (en) 2009-11-02 2012-04-05 주식회사 나래나노텍 A Substrate Transferring Device in Coating Region and A Coating Apparatus Having the Same, and A Method of Transferring Substrate
JP2011219250A (en) * 2010-04-14 2011-11-04 Oiles Corp Non-contact carrying device
KR101202456B1 (en) 2010-06-24 2012-11-16 주식회사 나래나노텍 A Structure of Linear Motion Guide for Transferring Substrate Stably in Coating Region, and A Substrate Transferring Device and A Coating Apparatus Having the Same
JP2014133655A (en) * 2014-03-17 2014-07-24 Oiles Ind Co Ltd Non-contact conveyance apparatus
KR20180027065A (en) * 2016-09-06 2018-03-14 주식회사 케이씨텍 Substrate treating apparatus and substrate processing system
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