CN112247307A - Hot-press welding device and hot-press welding process - Google Patents

Hot-press welding device and hot-press welding process Download PDF

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Publication number
CN112247307A
CN112247307A CN202011073393.0A CN202011073393A CN112247307A CN 112247307 A CN112247307 A CN 112247307A CN 202011073393 A CN202011073393 A CN 202011073393A CN 112247307 A CN112247307 A CN 112247307A
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CN
China
Prior art keywords
circuit board
welding
hot
hot pressing
isolation belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011073393.0A
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Chinese (zh)
Inventor
李建清
王晨光
姚泽胜
郭系天
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lanto Electronic Ltd
Kunshan Liantao Electronics Co Ltd
Original Assignee
Lanto Electronic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lanto Electronic Ltd filed Critical Lanto Electronic Ltd
Priority to CN202011073393.0A priority Critical patent/CN112247307A/en
Publication of CN112247307A publication Critical patent/CN112247307A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Abstract

The invention belongs to the technical field of circuit board welding, and discloses a hot-press welding device and a hot-press welding process. According to the invention, the groove is arranged on the hot pressing head, and the overflow hole is arranged on the product to be welded, so that more solder can overflow from the overflow hole in the hot pressing welding area of the product to be welded during welding, and the welding quality can be visually checked after the welding is finished.

Description

Hot-press welding device and hot-press welding process
Technical Field
The invention relates to the technical field of circuit board welding, in particular to a hot-press welding device and a hot-press welding process.
Background
After a traditional Flexible Circuit Board (FPC) is welded with an Assembly Circuit Board (PCBA), whether the Flexible Circuit Board and the Assembly Circuit Board are welded well cannot be checked, welding problems can be found only in a function test station, production efficiency is affected, and material waste is caused.
Disclosure of Invention
The invention aims to provide a hot-press welding device and a hot-press welding process, which can visually check whether poor welding exists or not when welding is completed.
In order to achieve the purpose, the invention adopts the following technical scheme:
a hot pressure welding device is used for pulse hot pressure welding of a product to be welded, an overflow hole is formed in a hot pressure welding area of the product to be welded, and the hot pressure welding device comprises:
the hot pressing head is used for pulse hot pressing welding, and a groove corresponding to the overflow hole is formed in the welding surface of the hot pressing head;
and the heat conduction isolation belt is arranged between the product to be welded and the hot pressing head, and when the hot pressing head performs pulse hot pressing welding on the product to be welded, the solder overflowing from the overflow hole can prop the part of the heat conduction isolation belt corresponding to the overflow hole into the groove.
Preferably, the hot-press welding device further comprises a traction mechanism, the traction mechanism comprises a material placing assembly and a material receiving assembly, the material placing assembly draws one end of the heat conduction isolation belt, and the material receiving assembly draws the other end of the heat conduction isolation belt, so that the heat conduction isolation belt is positioned between a product to be welded and the hot-press head in a flat state.
Preferably, the heat conduction isolation belt is manufactured into a material roll;
the material receiving assembly comprises a material receiving roller for winding the heat conduction isolation belt and a material receiving driving component for driving the material receiving roller to rotate; the blowing subassembly is including can the free rotation and drive the blowing roller of material book blowing, perhaps the blowing subassembly is including driving the blowing roller of material book blowing and drive blowing roller pivoted blowing driver part.
Preferably, the heat conducting isolation belt is a graphite belt.
A hot-press welding process uses the hot-press welding device, and comprises the following steps:
the method comprises the following steps that firstly, products to be welded are a first circuit board and a second circuit board, a first welding pad is arranged on the first circuit board, a second welding pad is arranged on the second circuit board, welding materials are placed on the first welding pad of the first circuit board, and a through overflow hole is formed in the second welding pad of the second circuit board;
step two, the second circuit board is stacked on the first circuit board in an aligned mode, so that the solder is clamped between the first welding pads of the first circuit board and the second welding pads of the second circuit board;
thirdly, placing the heat conduction isolation belt between a second welding pad of the second circuit board and a hot pressing head for pulse hot pressing welding;
and fourthly, pressing down the hot pressing head, clamping the heat conduction isolation belt between the hot pressing head and a second welding pad of the second circuit board, and conducting heat to the second welding pad of the second circuit board through the heat conduction isolation belt by the hot pressing head so as to melt the welding flux and weld the first circuit board and the second circuit board together.
Preferably, the second circuit board is provided with a plurality of second welding pads in parallel along a first direction, and the first circuit board is provided with a plurality of first welding pads in one-to-one correspondence with the plurality of second welding pads;
in the first step, at least one overflow hole is arranged on each second welding pad, and the connecting line of the overflow holes on two adjacent second welding pads forms an included angle with the first direction.
Preferably, the first circuit board is provided with an alignment bonding pad, the second circuit board is provided with an alignment hole, and a transparent alignment film is adhered to the alignment hole;
in the second step, the second circuit board is aligned and stacked on the first circuit board by adjusting the positions of the alignment sticking film and the alignment bonding pad.
Preferably, the alignment pads, the alignment holes and the alignment films are in one-to-one correspondence and are respectively provided with two groups.
Preferably, the second circuit board and the first circuit board which are aligned and stacked together are moved to the lower part of the hot-pressing head and the heat conduction isolation belt, then the heat conduction isolation belt is moved to the top surface of a second welding pad of the second circuit board, and then the hot-pressing head moves downwards and carries out hot-pressing welding on the first circuit board and the second circuit board; and finally, after the hot-press welding, sequentially moving the hot-press head upwards, moving the heat conduction isolation belt upwards, and transferring the welded first circuit board and the second circuit board out.
Preferably, after the hot-press welding of one or more products to be welded is completed, the heat conduction isolation belt is translated for a preset distance, and the position of the heat conduction isolation belt corresponding to the hot-press welding area is changed.
The invention has the beneficial effects that:
through set up the recess on the hot pressing head, set up the overflow hole on treating the welding product, make when the welding, can spill over more solders from waiting to treat the overflow hole of the hot pressing welding zone of welding product, thereby can inspect the welding quality when the welding is accomplished, on this basis, through setting up the heat conduction isolation area, keep apart hot pressing head and waiting to weld the product, on the basis of the hot pressing head melting solder is guaranteed in the transmission heat, can also avoid the solder to block up the recess, abluent process has been avoided, the life of hot pressing head has been improved.
The hot-press welding process is simple to operate, the welding process is safe and reliable, whether poor welding exists can be checked visually after welding is completed every time, the welding efficiency is effectively improved, and waste of materials is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a thermocompression bonding apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thermal compression head according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first circuit board according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a second circuit board according to an embodiment of the present invention.
In the figure:
1. a hot-pressing head; 11. a groove;
2. a traction mechanism; 21. a discharging component; 22. a material receiving assembly;
3. material rolls; 31. a thermally conductive isolation tape;
100. a first circuit board; 101. welding flux; 102. aligning the bonding pads;
200. a second circuit board; 201. an overflow aperture; 202. and aligning holes.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar parts throughout or parts having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature being in contact not directly but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 to 4, the present invention provides a hot press welding apparatus for pulse hot press welding of a product to be welded, in which an overflow hole 201 is provided on a hot press welding area of the product to be welded, and the hot press welding apparatus includes a hot press head 1 for pulse hot press welding and a heat conduction isolation belt 31. The welding surface of the hot pressing head 1 is provided with a groove 11 corresponding to the overflow hole 201, when the hot pressing head 1 performs pulse hot pressing welding on a product to be welded, the heat conduction isolation belt 31 is arranged between the product to be welded and the hot pressing head 1, and the solder 101 overflowing from the overflow hole 201 can push the part of the heat conduction isolation belt 31 corresponding to the overflow hole 201 into the groove 11.
According to the invention, the groove 11 is arranged on the hot pressing head 1, the overflow hole 201 is arranged on the product to be welded, so that more solder 101 can overflow from the overflow hole 201 in the hot pressing welding area of the product to be welded during welding, the welding quality can be checked after the welding is finished, on the basis, the hot pressing head 1 and the product to be welded are isolated by arranging the heat conduction isolation belt 31, on the basis that the heat is transferred to ensure that the hot pressing head 1 melts the solder 101, the solder 101 can be prevented from blocking the groove 11, the cleaning process is avoided, and the service life of the hot pressing head 1 is prolonged.
Optionally, as shown in fig. 1, the thermocompression bonding apparatus further includes a traction mechanism 2, the traction mechanism 2 includes a feeding assembly 21 and a receiving assembly 22, the feeding assembly 21 draws one end of the thermal isolation belt 31, and the receiving assembly 22 draws the other end of the thermal isolation belt 31, so that the thermal isolation belt 31 is positioned between the product to be bonded and the thermocompression head 1 in a flat state. The arrangement enables the heat conduction isolation tape 31 to be smoothly and reliably spread between the hot press head 1 and the product to be welded.
Specifically, the heat conduction isolation belt 31 is made into a material roll 3, and the material receiving assembly 22 comprises a material receiving roller for winding the heat conduction isolation belt 31 and a material receiving driving component for driving the material receiving roller to rotate; the discharging assembly 21 comprises a discharging roller which can rotate freely and drive the material roll 3 to discharge. According to the arrangement, the material roll 3 can be sequentially and gradually unfolded under the action of the traction mechanism 2, and one section of the heat conduction isolation belt 31 is used for unfolding each time, so that the processing efficiency is improved. In this embodiment, the material receiving driving member is a motor.
Unlike the above arrangement, in another embodiment, the discharging assembly 21 includes a discharging roller for driving the material roll 3 to discharge and a discharging driving component for driving the discharging roller to rotate, the discharging driving component and the receiving driving component drive the discharging roller and the receiving roller to rotate synchronously, so that the safety of the heat conduction isolation belt 31 is ensured, the risk of the heat conduction isolation belt 31 being torn off is avoided, and the heat conduction isolation belt 31 is not reusable after being hot-pressed once, and the discharging driving component and the receiving driving component are arranged in a matching manner, so that after the material roll 3 is transferred from the discharging roller to be wound on the receiving roller, the driving directions of the discharging driving component and the receiving driving component can be adjusted, the discharging roller and the receiving roller are made to rotate reversely, the receiving and discharging are interchanged, and the material is reused for many times. In this embodiment, the discharging driving component and the receiving driving component are motors, and can synchronously rotate forward and backward.
In other embodiments, traction mechanism 2 may further include a cylinder capable of guiding heat isolation belt 31 to translate, so that heat isolation belt 31 may be fully utilized. When the air cylinder is arranged independently, the heat conduction isolation belt 31 is unfolded through the support frame, the support frame is driven to be balanced by the air cylinder, when the air cylinder is matched with the feeding assembly 21 and the receiving assembly 22, the feeding assembly 21 and the receiving assembly 22 are fixedly arranged on the support, and the air cylinder can drive the support to move horizontally.
In this embodiment, the solder 101 is a tin material, the heat conduction isolation belt 31 is a graphite belt, and graphite has good heat conduction performance, high temperature resistance and stable chemical properties, and can meet the requirements of pulse hot-press welding. The solder 101 may be classified into hard solder and soft solder according to melting points; the solder may be classified into tin-lead solder, silver solder, copper solder, etc. according to the composition, and in the present invention, tin-lead alloy solder is used. The heat conducting isolation belt 31 may be a PI belt, a silica gel belt, or a nano copper belt, besides the graphite belt, which is not described in detail herein.
The invention also provides a hot-press welding process, which uses the hot-press welding device and comprises the following steps:
firstly, products to be welded are a first circuit board 100 and a second circuit board 200, a first welding pad is arranged on the first circuit board 100, a second welding pad is arranged on the second circuit board 200, a welding material 101 is placed on the first welding pad of the first circuit board 100, and a through overflow hole 201 is arranged on the second welding pad of the second circuit board 200.
In this step, as shown in fig. 3 and 4, a plurality of second pads may be arranged side by side along the first direction on the second circuit board 200, and a plurality of first pads corresponding to the plurality of second pads one to one are arranged on the first circuit board 100. And, set up at least one overflow hole 201 on every second pad, the line of the overflow hole 201 on two adjacent second pads is the setting of contained angle with the first direction. The arrangement increases the distance between two adjacent overflow holes 201, and avoids the mutual influence of the solder 101 overflowing from the two overflow holes 201.
And step two, the second circuit board 200 is stacked on the first circuit board 100 in an opposite position, so that the solder 101 is clamped between the first welding pads of the first circuit board 100 and the second welding pads of the second circuit board 200.
In this step, the first circuit board 100 is provided with the alignment pad 102, the second circuit board 200 is provided with the alignment hole 202, the transparent alignment film is attached to the alignment hole 202, and the second circuit board 200 is aligned and stacked on the first circuit board 100 by adjusting the positions of the alignment film and the alignment pad 102. The arrangement ensures the accuracy of the alignment and stacking of the first circuit board 100 and the second circuit board 200.
Specifically, as shown in fig. 3 and 4, the alignment pads 102, the alignment holes 202 and the alignment adhesive films are disposed in a one-to-one correspondence and two sets, the two alignment pads 102 are respectively disposed at two ends of the first pad arrangement direction, and the two alignment holes 202 are respectively disposed at two ends of the second pad arrangement direction. The arrangement further ensures the accuracy of the alignment and stacking of the first circuit board 100 and the second circuit board 200.
In this step, the CCD is used to photograph the relative position between the alignment film and the alignment pad 102 to determine whether the alignment is accurate, and if the alignment is not accurate, the positions of the second circuit board 200 and the first circuit board 100 need to be moved relatively until the alignment is accurate, the alignment film can be the same as the alignment pad 102 during the manufacturing process, and the alignment hole 202 will have a large tolerance during the manufacturing process, so that the alignment precision is reduced.
And step three, placing the heat conduction isolation belt 31 between the second welding pad of the second circuit board 200 and the hot pressing head 1 for pulse hot pressing welding.
And fourthly, the hot pressing head 1 is pressed downwards, the heat conduction isolation belt 31 is clamped between the hot pressing head 1 and the second welding pad of the second circuit board 200, the hot pressing head 1 conducts heat to the second welding pad of the second circuit board 200 through the heat conduction isolation belt 31, the welding flux 101 is melted, and the first circuit board 100 and the second circuit board 200 are welded together.
In the third step and the fourth step, the second circuit board 200 and the first circuit board 100 which are aligned and stacked together are moved to the lower part of the hot pressing head 1 and the heat conduction isolation belt 31, then the heat conduction isolation belt 31 is moved downwards to the top surface of the second welding pad of the second circuit board 200, and then the hot pressing head 1 moves downwards and carries out hot-press welding on the first circuit board 100 and the second circuit board 200; finally, after the thermocompression bonding, the thermocompression head 1 is sequentially moved up, the thermal isolation tape 31 is moved up, and the first circuit board 100 and the second circuit board 200 after the bonding are moved out.
Specifically, after the hot-press welding of one or more products to be welded is completed, the heat conduction isolation strip 31 is translated by a preset distance, and the position of the heat conduction isolation strip 31 corresponding to the hot-press welding area is changed. The preset distance is determined according to the size of a hot-press welding area in a product to be welded, so that the influence of the last welding on the subsequent welding is avoided, and the continuity and the reliability of the welding are ensured.
In the present invention, the first circuit board 100 and the second circuit board 200 are suitable for pulse thermocompression bonding of all of PCBA (circuit board) and Flex (flexible circuit board), pulse thermocompression bonding of PCBA (circuit board) and FPC (flexible circuit board), and pulse thermocompression bonding of PCBA (circuit board) and PCBA (circuit board).
The hot-press welding process is simple to operate, the welding process is safe and reliable, whether poor welding exists can be checked visually after welding is completed every time, the welding efficiency is effectively improved, and waste of materials is avoided.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A hot-press welding device is used for pulse hot-press welding of products to be welded, and overflow holes (201) are formed in a hot-press welding area of the products to be welded, and the hot-press welding device is characterized by comprising:
the hot pressing head (1) is used for pulse hot pressing welding, and a groove (11) corresponding to the overflow hole (201) is formed in the welding surface of the hot pressing head (1);
and the heat conduction isolation belt (31) is arranged between a product to be welded and the hot pressing head (1), and when the hot pressing head (1) performs pulse hot pressing welding on the product to be welded, the solder (101) overflowing from the overflow hole (201) can push the part, corresponding to the overflow hole (201), of the heat conduction isolation belt (31) into the groove (11).
2. The thermocompression bonding device according to claim 1, further comprising a traction mechanism (2), wherein the traction mechanism (2) comprises a feeding component (21) and a receiving component (22), the feeding component (21) pulls one end of the thermal isolation belt (31), and the receiving component (22) pulls the other end of the thermal isolation belt (31), so that the thermal isolation belt (31) is positioned between a product to be bonded and the thermocompression head (1) in a flat state.
3. A thermocompression bonding arrangement according to claim 2 wherein the thermally conductive separator (31) is made as a coil (3);
the material receiving assembly (22) comprises a material receiving roller for winding the heat conduction isolation belt (31) and a material receiving driving component for driving the material receiving roller to rotate; the discharging assembly (21) comprises a discharging roller capable of rotating freely and driving a material roll (3) to discharge, or the discharging assembly (21) comprises a discharging roller driving the material roll (3) to discharge and a discharging driving part driving the discharging roller to rotate.
4. A thermocompression bonding arrangement according to claim 1 wherein the thermally conductive separator tape (31) is a graphite tape.
5. A thermocompression bonding process using the thermocompression bonding apparatus of any one of claims 1 to 4, comprising the steps of:
firstly, products to be welded are a first circuit board (100) and a second circuit board (200), wherein the first circuit board (100) is provided with a first welding pad, the second circuit board (200) is provided with a second welding pad, a welding flux (101) is placed on the first welding pad of the first circuit board (100), and a through overflow hole (201) is arranged on the second welding pad of the second circuit board (200);
step two, the second circuit board (200) is stacked on the first circuit board (100) in an opposite position, so that the solder (101) is clamped between a first welding pad of the first circuit board (100) and a second welding pad of the second circuit board (200);
thirdly, placing the heat conduction isolation belt (31) between a second welding pad of the second circuit board (200) and a hot pressing head (1) for pulse hot pressing welding;
and fourthly, the hot pressing head (1) is pressed downwards, the heat conduction isolation belt (31) is clamped between the hot pressing head (1) and a second welding pad of the second circuit board (200), the hot pressing head (1) conducts heat to the second welding pad of the second circuit board (200) through the heat conduction isolation belt (31), the welding flux (101) is melted, and the first circuit board (100) and the second circuit board (200) are welded together.
6. The thermocompression bonding process of claim 5, wherein a plurality of second bonding pads are arranged side by side along the first direction on the second circuit board (200), and a plurality of first bonding pads corresponding to the plurality of second bonding pads one to one are arranged on the first circuit board (100);
in the first step, each second bonding pad is provided with at least one overflow hole (201), and a connecting line of the overflow holes (201) on two adjacent second bonding pads forms an included angle with the first direction.
7. The thermocompression bonding process of claim 5, wherein the first circuit board (100) is provided with an alignment pad (102), the second circuit board (200) is provided with an alignment hole (202), and a transparent alignment film is adhered to the alignment hole (202);
in the second step, the second circuit board (200) is aligned and stacked on the first circuit board (100) by adjusting the positions of the alignment adhesive film and the alignment bonding pad (102).
8. The thermocompression bonding process of claim 7, wherein the alignment pads (102) and the alignment holes (202) and the alignment adhesive films are in one-to-one correspondence and are respectively provided in two sets.
9. The thermocompression bonding process of claim 5, wherein the second circuit board (200) and the first circuit board (100) aligned and stacked together are moved to the lower side of the thermocompression head (1) and the thermoconductive separation tape (31), then the thermoconductive separation tape (31) is moved down to the top surface of the second pad of the second circuit board (200), and then the thermocompression head (1) is moved down and thermocompression bonding is performed on the first circuit board (100) and the second circuit board (200); and finally, after the hot-press welding, moving the hot-press head (1) upwards, moving the heat conduction isolation belt (31) upwards, and transferring the welded first circuit board (100) and the second circuit board (200).
10. The thermocompression bonding process of claim 9, wherein after the thermocompression bonding of one or more products to be bonded is completed, the thermally conductive separator (31) is translated by a predetermined distance, and the position of the thermally conductive separator (31) corresponding to the thermocompression bonding region is changed.
CN202011073393.0A 2020-10-09 2020-10-09 Hot-press welding device and hot-press welding process Pending CN112247307A (en)

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CN202011073393.0A CN112247307A (en) 2020-10-09 2020-10-09 Hot-press welding device and hot-press welding process

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Application Number Priority Date Filing Date Title
CN202011073393.0A CN112247307A (en) 2020-10-09 2020-10-09 Hot-press welding device and hot-press welding process

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Publication Number Publication Date
CN112247307A true CN112247307A (en) 2021-01-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113145960A (en) * 2021-05-06 2021-07-23 昆山联滔电子有限公司 Electronic product welding method

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JP2000101229A (en) * 1998-09-25 2000-04-07 Nippon Avionics Co Ltd Thermall pressure-contact device for covered wire
TWM390191U (en) * 2010-05-18 2010-10-11 Progress Y&Y Corp Buffer material module for a hot pressing mechanism and its roller thereof
CN202799393U (en) * 2012-09-12 2013-03-13 安科智慧城市技术(中国)有限公司 FPC (flexible printed circuit) golden finger
CN103506753A (en) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 Automatic hot press
CN206165000U (en) * 2016-10-24 2017-05-10 歌尔科技有限公司 Hot press welding pressure head
CN108526677A (en) * 2018-06-28 2018-09-14 东莞理工学院 A kind of constant-temperature hot press
CN208195884U (en) * 2018-04-23 2018-12-07 华显光电技术(惠州)有限公司 Thermocompression bonding pressure head
CN110430667A (en) * 2019-07-17 2019-11-08 武汉华星光电技术有限公司 A kind of display panel flexible circuit board, its component and its welding method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101229A (en) * 1998-09-25 2000-04-07 Nippon Avionics Co Ltd Thermall pressure-contact device for covered wire
TWM390191U (en) * 2010-05-18 2010-10-11 Progress Y&Y Corp Buffer material module for a hot pressing mechanism and its roller thereof
CN103506753A (en) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 Automatic hot press
CN202799393U (en) * 2012-09-12 2013-03-13 安科智慧城市技术(中国)有限公司 FPC (flexible printed circuit) golden finger
CN206165000U (en) * 2016-10-24 2017-05-10 歌尔科技有限公司 Hot press welding pressure head
CN208195884U (en) * 2018-04-23 2018-12-07 华显光电技术(惠州)有限公司 Thermocompression bonding pressure head
CN108526677A (en) * 2018-06-28 2018-09-14 东莞理工学院 A kind of constant-temperature hot press
CN110430667A (en) * 2019-07-17 2019-11-08 武汉华星光电技术有限公司 A kind of display panel flexible circuit board, its component and its welding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113145960A (en) * 2021-05-06 2021-07-23 昆山联滔电子有限公司 Electronic product welding method

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Application publication date: 20210122

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