CN211744922U - Flexible circuit board pressing device - Google Patents
Flexible circuit board pressing device Download PDFInfo
- Publication number
- CN211744922U CN211744922U CN202020196531.3U CN202020196531U CN211744922U CN 211744922 U CN211744922 U CN 211744922U CN 202020196531 U CN202020196531 U CN 202020196531U CN 211744922 U CN211744922 U CN 211744922U
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- pressing block
- briquetting
- lifting driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a flexible circuit board pressing device, which comprises a placing platform, a pressing block mechanism, a pressing block lifting driving mechanism and a lifting control device; the pressing block mechanism is arranged above the placing platform; the pressing block lifting driving mechanism is connected with the pressing block mechanism and can drive the pressing block mechanism to lift; the lifting control device is connected with the pressing block lifting driving mechanism and can send a control signal to the pressing block lifting driving mechanism; the placing platform is provided with a plurality of positioning mechanisms for placing the corresponding flexible circuit boards on the corresponding positioning mechanisms; the briquetting mechanism is provided with a plurality of groove positions, and each groove position is arranged right above the corresponding positioning mechanism; each slot position can accommodate partial area or all area of corresponding flexible circuit board. The utility model provides a flexible circuit board compression fittings can extrude the aqueous vapor between flexible circuit board and other accessories, improves yield, reduce cost once.
Description
Technical Field
The utility model belongs to the technical field of the circuit board welding, a circuit board welding auxiliary device is related to, especially, relate to a flexible circuit board compression fittings.
Background
At present, the welding process of FPC and PCB is generally a Hot bar process, namely pulse heating reflow welding. Briefly, the process involves heating two pre-fluxed, tin-plated parts to a temperature sufficient to melt the solder (lead-free solder melting point; 217 deg.C), and after cooling to solidify, the two parts form a permanent electromechanical bond with the solidified solder. By loading a certain pulse voltage on the hot pressing head, the high-impedance hot pressing head is heated by using low-voltage large current, the contact position of the PCB and the FPC or an object is heated, and after the temperature is raised to the melting point of soldering tin, the two objects in contact with the PCB are welded together.
The prior art has the following defects:
firstly, when a Hot bar process is used for welding a soft and hard plate, the requirement on the flatness of a welding head is extremely high, and if the welding head is uneven, the welding head cannot be welded. The welding head is uneven more frequently; such as: (1) the tool is uneven, impurities on the workbench influence the parallelism, and the phenomenon of tin non-melting is easy to occur; (2) when the welding head is pressurized, the bonding flatness of the welding head and a product to be welded is not enough. When a welding head cylinder of the pulse hot press presses downwards, the force applied to each point of a supporting part is unbalanced due to reasons such as unreasonable design of a bottom tooling fixture, and the like, so that the welding head (electrode) cannot be completely attached to a welding product; (3) the welding head electrode is not smooth enough, and the A welding head is not smooth enough when being processed. The welding head (electrode) has long service time and is oxidized to cause unevenness.
Secondly, impurities on the surface of the welding head (electrode) cause poor and uneven heat transfer. Because the tin has the rosin soldering flux, impurities are attached to the electrode of the welding head after the welding time of the electrode of the welding head is long, so that heat cannot be transferred to a welded product, the welding heat is insufficient, and poor welding is caused; frequent cleaning of the horn electrodes is required.
Thirdly, the unreasonable electrode design causes poor tin climbing during welding and insufficient tension.
The welding end face of the welding head usually used in welding is completely flat. Certain pressure needs to be applied during welding, and tin cannot well climb through the hole of the FPC.
Fourthly, the process is complicated, the working procedures are increased, and the cost is increased.
In view of the above, there is a need to design a new patch method to overcome the above-mentioned defects of the existing patch method.
SUMMERY OF THE UTILITY MODEL
The utility model provides a flexible circuit board compression fittings can extrude the aqueous vapor between flexible circuit board and other accessories, improves yield, reduce cost once.
For solving the technical problem, according to the utility model discloses an aspect adopts following technical scheme:
a flexible circuit board press-fit device, the press-fit device comprising: the device comprises a placing platform, a pressing block mechanism, a pressing block lifting driving mechanism and a lifting control device;
the pressing block mechanism is arranged above the placing platform; the pressing block lifting driving mechanism is connected with the pressing block mechanism and can drive the pressing block mechanism to lift; the lifting control device is connected with the pressing block lifting driving mechanism and can send a control signal to the pressing block lifting driving mechanism;
the placing platform is provided with a plurality of positioning mechanisms for placing the corresponding flexible circuit boards on the corresponding positioning mechanisms; the briquetting mechanism is provided with a plurality of groove positions, and each groove position is arranged right above the corresponding positioning mechanism; each slot position can accommodate partial area or all area of corresponding flexible circuit board.
As an embodiment of the present invention, the positioning mechanism is a positioning hole.
As an embodiment of the present invention, the positioning mechanism is disposed on one side of the placement platform.
As an embodiment of the present invention, each positioning mechanism is arranged on the placing platform in order.
As an embodiment of the present invention, the width of the slot corresponds to the width of the flexible circuit board.
As an embodiment of the present invention, the width of the slot is greater than the width of the corresponding flexible circuit board.
As an embodiment of the present invention, the pressing block lifting driving mechanism includes a cylinder, and the cylinder is connected to the pressing block mechanism.
As an embodiment of the present invention, the pressing block lifting driving mechanism includes a driving motor and a transmission mechanism, the driving motor is connected through the transmission mechanism to the pressing block mechanism, which can drive the pressing block mechanism to lift.
As an embodiment of the present invention, the pressing block lifting driving mechanism includes a hydraulic cylinder, and the hydraulic cylinder is connected to the pressing block mechanism.
The beneficial effects of the utility model reside in that: the utility model provides a flexible circuit board compression fittings can extrude the aqueous vapor between flexible circuit board and other accessories, improves yield, reduce cost once.
Drawings
Fig. 1 is a schematic structural view of a flexible circuit board laminating device according to an embodiment of the present invention.
Fig. 2 is a schematic diagram illustrating a part of the flexible printed circuit board laminating apparatus according to an embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
For further understanding of the present invention, preferred embodiments of the present invention will be described below with reference to examples, but it should be understood that these descriptions are only for the purpose of further illustrating the features and advantages of the present invention, and are not intended to limit the claims of the present invention.
The description in this section is for exemplary embodiments only, and the present invention is not limited to the scope of the embodiments described. The same or similar prior art means and some technical features of the embodiments are mutually replaced and are also within the scope of the description and the protection of the invention.
The utility model discloses a flexible circuit board pressing device, fig. 1 is a schematic structural diagram of the flexible circuit board pressing device in an embodiment of the utility model, and fig. 2 is a schematic partial composition diagram of the flexible circuit board pressing device in an embodiment of the utility model; referring to fig. 1 and 2, in an embodiment of the present invention, the pressing device includes: the device comprises a placing platform 1, a briquetting mechanism 3, a briquetting lifting driving mechanism 5 and a lifting control device 7.
The briquetting mechanism 3 is arranged above the placing platform 1; the briquetting lifting driving mechanism 5 is connected with the briquetting mechanism 3 and can drive the briquetting mechanism 3 to lift; the lifting control device 7 is connected with the briquetting lifting driving mechanism 5 and can send control signals to the briquetting lifting driving mechanism 5.
The placing platform 1 is provided with a plurality of positioning mechanisms 11 for placing the corresponding flexible circuit boards 9 on the corresponding positioning mechanisms 11; the briquetting mechanism 3 is provided with a plurality of groove positions 31, and each groove position 31 is arranged right above the corresponding positioning mechanism 11; each slot 31 can accommodate a partial or full area of the corresponding flexible circuit board 9.
In an embodiment of the present invention, the positioning mechanism 11 is a positioning hole, and the positioning mechanism 11 can be disposed on one side of the placing platform. The positioning mechanisms 11 may be arranged neatly on the placement platform.
In addition, the width of the slot 31 corresponds to the width of the flexible circuit board 9; alternatively, the width of the slot 31 may be slightly wider than the width of the flexible circuit board 9. In one embodiment, the flexible circuit board 9 is attached to a printed circuit board PCB8 and then together receives the compression of the compression fitting.
In one embodiment, the briquetting lifting driving mechanism 5 comprises an air cylinder, and the air cylinder is connected with the briquetting mechanism. Or, the briquetting lifting drive mechanism 5 may include a drive motor and a transmission mechanism, and the drive motor is connected with the briquetting mechanism through the transmission mechanism and can drive the briquetting mechanism to lift. Or, the briquetting lifting driving mechanism 5 comprises a hydraulic cylinder, and the hydraulic cylinder is connected with the briquetting mechanism.
In an embodiment of the present invention, the flexible circuit board pressing device is used as follows:
step S1, arranging a laminating device of a flexible circuit board FPC 9 (the flexible circuit board FPC 9 is arranged on a printed circuit board PCB8 through back glue) on the electrostatic table;
step S2, placing the PCB8 on the placing platform 1, and carrying out alignment according to the position of the positioning mechanism 11;
step S3, pressing the press button of the lift control device 7 to perform press; the lower part of the briquetting mechanism 3 is provided with a slot position 31, and the placing platform 1 is provided with a plurality of positioning mechanisms 11 (which can be positioning holes); the groove position 31 of the pressing block mechanism 3 can be pressed corresponding to the positioning hole, so that the corresponding printed circuit board PCB8 is tightly attached to the flexible circuit board FPC 9;
step S4, after the stitching is automatically completed, taking the printed circuit board PCB8 upwards away from the stitching jig and checking whether the flexible circuit board FPC 9 is tightly attached to the printed circuit board PCB 8;
step S5, orderly stacking the pressed PCBs 8 in the operation-completed area for solder printing (in one embodiment, each time the stacked PCB is pressed, the number of the stacked PCBs is less than ten whole PCBs); and after lamination, the carrier is timely loaded with tin for tin printing, and the non-tin-printed part needs to be laminated again after more than 30 minutes. After the steps S1 and S2, substantially no air bubbles are ensured between the FPC and the PCB.
To sum up, the utility model provides a flexible circuit board compression fittings can extrude the aqueous vapor between flexible circuit board and other accessories, improves yield, reduce cost once.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The description and applications of the present invention are illustrative and are not intended to limit the scope of the invention to the embodiments described above. Variations and modifications of the embodiments disclosed herein are possible, and alternative and equivalent various components of the embodiments will be apparent to those skilled in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other components, materials, and parts, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the present invention.
Claims (9)
1. A flexible circuit board press-fit device, characterized in that, press-fit device includes: the device comprises a placing platform, a pressing block mechanism, a pressing block lifting driving mechanism and a lifting control device;
the pressing block mechanism is arranged above the placing platform; the pressing block lifting driving mechanism is connected with the pressing block mechanism and can drive the pressing block mechanism to lift; the lifting control device is connected with the pressing block lifting driving mechanism and can send a control signal to the pressing block lifting driving mechanism;
the placing platform is provided with a plurality of positioning mechanisms for placing the corresponding flexible circuit boards on the corresponding positioning mechanisms; the briquetting mechanism is provided with a plurality of groove positions, and each groove position is arranged right above the corresponding positioning mechanism; each slot position can accommodate partial area or all area of corresponding flexible circuit board.
2. The flexible circuit board laminating device of claim 1, wherein:
the positioning mechanism is a positioning hole.
3. The flexible circuit board laminating device of claim 1, wherein:
the positioning mechanism is arranged on one side of the placing platform.
4. The flexible circuit board laminating device of claim 1, wherein:
the positioning mechanisms are orderly arranged on the placing platform.
5. The flexible circuit board laminating device of claim 1, wherein:
the width of the slot position corresponds to the width of the flexible circuit board.
6. The flexible circuit board laminating device of claim 1, wherein:
the width of the slot position is larger than that of the corresponding flexible circuit board.
7. The flexible circuit board laminating device of claim 1, wherein:
the briquetting lifting driving mechanism comprises an air cylinder, and the air cylinder is connected with the briquetting mechanism.
8. The flexible circuit board laminating device of claim 1, wherein:
the briquetting lifting driving mechanism comprises a driving motor and a transmission mechanism, wherein the driving motor is connected with the briquetting mechanism through the transmission mechanism and can drive the briquetting mechanism to lift.
9. The flexible circuit board laminating device of claim 1, wherein:
the briquetting lifting driving mechanism comprises a hydraulic cylinder, and the hydraulic cylinder is connected with the briquetting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020196531.3U CN211744922U (en) | 2020-02-21 | 2020-02-21 | Flexible circuit board pressing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020196531.3U CN211744922U (en) | 2020-02-21 | 2020-02-21 | Flexible circuit board pressing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211744922U true CN211744922U (en) | 2020-10-23 |
Family
ID=72876773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020196531.3U Expired - Fee Related CN211744922U (en) | 2020-02-21 | 2020-02-21 | Flexible circuit board pressing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211744922U (en) |
-
2020
- 2020-02-21 CN CN202020196531.3U patent/CN211744922U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201023 |