CN100558226C - Device for correcting pin planeness of electron device - Google Patents
Device for correcting pin planeness of electron device Download PDFInfo
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- CN100558226C CN100558226C CNB2007103026094A CN200710302609A CN100558226C CN 100558226 C CN100558226 C CN 100558226C CN B2007103026094 A CNB2007103026094 A CN B2007103026094A CN 200710302609 A CN200710302609 A CN 200710302609A CN 100558226 C CN100558226 C CN 100558226C
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- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 230000000694 effects Effects 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 62
- 238000004080 punching Methods 0.000 abstract description 12
- 230000009471 action Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000010586 diagram Methods 0.000 description 9
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
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Abstract
一种电子器件平整度整脚机,包括机架、送料机构、压紧机构、下压机构及上冲机构;机架上设有电子器件的整脚工位;送料机构由送料板和送料气缸构成,送料气缸作用端与送料板相连,并在水平方向上驱动送料板进入或退出整脚工位;压紧机构由压紧板和压紧气缸构成,压紧气缸作用端与压紧板相连,并在竖直方向上驱动压紧板下移压紧或上移放开送料板上的各电子器件;下压机构由下压板和下压气缸构成,下压气缸作用端与下压板相连,并在竖直方向上驱动下压板上下移动;上冲机构由顶板与上冲气缸构成,上冲气缸作用端与顶板相连,并在竖直方向上驱动顶板上下移动。本方案解决了电子器件引脚平整度不良的问题,同时提高生产效率,并保证产品质量。
An electronic device flatness adjustment machine, including a frame, a feeding mechanism, a pressing mechanism, a lower pressing mechanism and an upper punching mechanism; a foot adjustment station for electronic devices is arranged on the frame; the feeding mechanism consists of a feeding plate and a feeding cylinder Composition, the working end of the feeding cylinder is connected with the feeding plate, and drives the feeding plate in the horizontal direction to enter or exit the whole foot station; the pressing mechanism is composed of a pressing plate and a pressing cylinder, and the working end of the pressing cylinder is connected with the pressing plate , and drive the pressing plate in the vertical direction to move down and press or move up to release the electronic devices on the feeding plate; the pressing mechanism is composed of a pressing plate and a pressing cylinder, and the working end of the pressing cylinder is connected with the pressing plate. And drive the lower platen to move up and down in the vertical direction; the upper punch mechanism is composed of the top plate and the upper punch cylinder, and the action end of the upper punch cylinder is connected with the top plate, and drives the top plate to move up and down in the vertical direction. This solution solves the problem of poor flatness of pins of electronic devices, improves production efficiency, and ensures product quality.
Description
技术领域 technical field
本发明涉及一种工装设备,尤其涉及一种电子器件引脚平整度整脚机,该整脚机是用于调整电子器件各引脚的焊接点处于同一平面内,以便可靠的焊接在PCB表面。The present invention relates to a tooling device, in particular to an electronic device pin flatness adjustment machine, which is used to adjust the soldering points of each pin of the electronic device to be in the same plane, so as to be reliably welded on the surface of the PCB .
背景技术 Background technique
目前,先进的电子产品,特别是在计算机及通讯类电子产品,所采用的集成电路(IC)已无插孔元器件,特别是大规模、高集成IC,均采用表面贴片元器件;而将这些贴片元器件准确的安装到PCB表面相应位置,就需要采用表面组装技术(Surface Mounting Technolegy,简称SMT)来完成。At present, the integrated circuits (IC) used in advanced electronic products, especially in computer and communication electronic products, have no socket components, especially large-scale and highly integrated ICs, all use surface mount components; Accurately mounting these patch components to the corresponding positions on the PCB surface requires the use of Surface Mounting Technology (SMT) to complete.
典型的表面贴装工艺分为三步:施加焊锡膏——贴装元器件——回流焊接。即先将适量的焊锡膏均匀的施加在PCB的焊盘上,以保证贴片元器件与PCB相对应的焊盘在回流焊接时,达到良好的电器连接,并具有足够的机械强度;接着将片式元器件准确的贴装到印好锡焊膏的PCB表面相应的位置;然后将PCB进入140℃~160℃的预热温区时,焊膏中的溶剂、气体蒸发掉,同时,焊膏中的助焊剂润湿焊盘、元器件焊端和引脚,焊膏软化、塌落,覆盖了焊盘,将焊盘、元器件引脚与氧气隔离;并使表面贴片元器件得到充分的预热,接着进入焊接区时,温度迅速上升至270℃使焊膏达到熔化状态,液态焊锡在PCB的焊盘、元器件焊端和引脚扩散,使其润湿、漫流和回流混合在焊接界面上生成金属化合物,形成焊锡接点;最后PCB进入冷却区使焊点凝固。A typical surface mount process is divided into three steps: applying solder paste - mounting components - reflow soldering. That is, apply an appropriate amount of solder paste evenly on the pads of the PCB to ensure that the pads corresponding to the SMD components and the PCB achieve good electrical connection and have sufficient mechanical strength during reflow soldering; The chip components are accurately mounted to the corresponding positions on the PCB surface printed with solder paste; then when the PCB enters the preheating temperature zone of 140 ° C ~ 160 ° C, the solvent and gas in the solder paste evaporate, and at the same time, the solder The flux in the paste wets the pads, component terminals and pins, and the solder paste softens and collapses, covering the pads, isolating the pads, component pins from oxygen; and making surface mount components get Sufficient preheating, and then when entering the welding area, the temperature rises rapidly to 270°C to make the solder paste reach a molten state, and the liquid solder diffuses on the pads, component soldering ends and leads of the PCB, making it wet, diffuse and reflow mixed Metal compounds are generated on the welding interface to form solder joints; finally, the PCB enters the cooling zone to solidify the solder joints.
但常由于所贴装的元器件各引脚的焊点不在同一平面上,即所有引脚的焊点不能同时贴靠在PCB表面相应的位置上,这样在通过回流焊接后,有些引脚在锡膏熔化时,由于其自身的不平整或悬空,而使液体焊料不能浸润这些元器件的引脚,导致冷却后元器件的引脚与PCB焊盘不能被焊料互联在一起,而成为虚焊,影响产品质量。在现有技术中,为保证元器件各引脚的平整度(使各引脚在同一平面内),在贴装前需要先采用工具测量其各引脚是否能同时贴靠在同一平面上,当发现有引脚悬空或不平整时,则是由人工用镊子等手动工具来调解其平整度。但由于人工手动调解仅凭感觉来控制,调整起来很困难,常出现一致性不好、平整度不佳等问题;且人工操作费工、费时,生产效率低;无法应对产品批量化、生产自动化的需求。But often because the solder joints of the pins of the mounted components are not on the same plane, that is, the solder joints of all pins cannot be attached to the corresponding positions on the PCB surface at the same time, so after reflow soldering, some pins are on the same plane. When the solder paste melts, due to its own unevenness or suspension, the liquid solder cannot infiltrate the pins of these components, resulting in the fact that the pins of the components and the PCB pad cannot be interconnected by the solder after cooling, and become virtual soldering. , affecting product quality. In the prior art, in order to ensure the flatness of each pin of the component (making each pin in the same plane), it is necessary to use a tool to measure whether each pin can be attached to the same plane at the same time before mounting. When it is found that there are pins hanging in the air or uneven, the flatness is adjusted manually with manual tools such as tweezers. However, because manual adjustment is only controlled by feeling, it is very difficult to adjust, and problems such as poor consistency and poor flatness often occur; and manual operation is labor-intensive, time-consuming, and production efficiency is low; it cannot cope with product batching and production automation demand.
因此,如何解决这种元器件各引脚平整度靠人工手动调节效率低,质量无法保证的问题,是本领域技术人员着重研究的内容。Therefore, how to solve the problem of low efficiency and unguaranteed quality of the manual adjustment of the flatness of each pin of this component is the content that those skilled in the art are emphatically studying.
发明内容 Contents of the invention
本发明提供一种电子器件引脚平整度整脚机,其目的主要是解决电子器件引脚平整度不良的问题,同时提高生产效率,并保证产品质量。The invention provides a pin flatness adjustment machine for electronic devices, the main purpose of which is to solve the problem of poor flatness of the pins of electronic devices, improve production efficiency, and ensure product quality.
为达到上述目的,本发明采用的技术方案是:一种电子器件平整度整脚机,包括机架、送料机构、压紧机构、下压机构及上冲机构;机架上设有电子器件的整脚工位;In order to achieve the above-mentioned purpose, the technical solution adopted in the present invention is: a kind of electronic device flatness adjustment machine, including frame, feeding mechanism, pressing mechanism, pressing mechanism and punching mechanism; whole foot station;
送料机构,由送料板和送料气缸构成,送料板与机架在水平方向上滑动连接;所述送料板上设有若干个电子器件定位座,各定位座周边对应电子器件的引脚部位设有纵向通道,使电子器件的引脚悬空在该纵向通道中;送料气缸作用端与送料板相连,并在水平方向上驱动送料板进入或退出整脚工位;The feeding mechanism is composed of a feeding plate and a feeding cylinder, and the feeding plate is slidably connected with the frame in the horizontal direction; the feeding plate is provided with a number of positioning seats for electronic devices, and the pins of the corresponding electronic devices around each positioning seat are provided with Longitudinal channel, so that the pins of the electronic device are suspended in the longitudinal channel; the active end of the feeding cylinder is connected with the feeding plate, and drives the feeding plate in the horizontal direction to enter or exit the whole foot station;
压紧机构,由压紧板和压紧气缸构成,在整脚工位上,压紧板位于送料板上方,并与机架在竖直方向滑动连接;所述压紧板上对应电子器件的引脚部位也设有纵向通道;压紧气缸作用端与压紧板相连,并在竖直方向上驱动压紧板下移压紧或上移放开送料板上的各电子器件;The pressing mechanism is composed of a pressing plate and a pressing cylinder. On the whole foot station, the pressing plate is located above the feeding plate and is slidably connected with the frame in the vertical direction; the pressing plate corresponds to the position of the electronic device. The pin part is also provided with a longitudinal channel; the action end of the compression cylinder is connected with the compression plate, and drives the compression plate in the vertical direction to move down to compress or move up to release the electronic devices on the feeding plate;
下压机构,由下压板和下压气缸构成,下压板位于压紧板上方,并与机架在竖直方向滑动连接;所述下压板底部对应压紧板的纵向通道位置设有引脚压块;下压气缸作用端与下压板相连,并在竖直方向上驱动下压板上下移动,所述下压机构在下移方向上设有可调整的下压行程限位结构,当下压板下移时各引脚压块通过纵向通道下压各电子器件上的引脚,当下压板上移时各引脚压块放开各电子器件上的引脚;The lower pressing mechanism is composed of a lower pressing plate and a lower pressing cylinder. The lower pressing plate is located above the pressing plate and is slidably connected with the frame in the vertical direction; the bottom of the lower pressing plate corresponds to the longitudinal channel position of the pressing plate. block; the action end of the lower pressure cylinder is connected with the lower pressure plate, and drives the lower pressure plate to move up and down in the vertical direction. Each pin pressing block presses down the pins on each electronic device through the longitudinal channel, and each pin pressing block releases the pins on each electronic device when the lower pressing plate moves;
上冲机构,由顶板与上冲气缸构成,顶板位于送料板下方,并与机架在竖直方向滑动连接;所述顶板顶部对应送料板的纵向通道位置设有引脚抬块;上冲气缸作用端与顶板相连,并在竖直方向上驱动顶板上下移动,所述上冲机构在上移方向上设有可调整的上冲行程限位结构,当顶板上移时各引脚抬块通过纵向通道抬起各电子器件上的引脚,当顶板下移时各引脚抬块放开各电子器件上的引脚。The upper punching mechanism is composed of a top plate and an upper punching cylinder. The top plate is located under the feeding plate and is vertically slidably connected with the frame; the top of the top plate is provided with a pin lifting block corresponding to the longitudinal passage of the feeding plate; the upper punching cylinder The action end is connected with the top plate and drives the top plate to move up and down in the vertical direction. The upper punch mechanism is provided with an adjustable upper punch stroke limit structure in the upward movement direction. When the top plate moves, each pin lifting block passes through The longitudinal passage lifts the pins on each electronic device, and when the top plate moves down, each pin lifting block releases the pins on each electronic device.
上述技术方案中的有关内容解释如下:The relevant content in the above-mentioned technical scheme is explained as follows:
1、上述方案中,所述定位座上对应电子器件上的定位柱设有让位槽。1. In the above solution, the positioning seat is provided with a relief slot corresponding to the positioning column on the electronic device.
2、上述方案中,所述压紧板与电子器件接触面上设有软质层。2. In the above solution, a soft layer is provided on the contact surface between the pressing plate and the electronic device.
3、上述方案中,所述下压行程限位结构为在下压板上设有一调节孔,该调节孔中设有一限位调整螺栓,限位调整螺栓与调节孔螺纹配合,并在该限位调整螺栓上配有紧固螺母。3. In the above scheme, the limit structure of the lower pressure stroke is that an adjustment hole is provided on the lower pressure plate, and a limit adjustment bolt is arranged in the adjustment hole. Bolts are fitted with fastening nuts.
4、上述方案中,所述上冲行程限位结构为在顶板上设有一调节孔,该调节孔中设有一限位调整螺栓,限位调整螺栓与调节孔螺纹配合,并在该限位调整螺栓上配有紧固螺母。4. In the above scheme, the limit structure of the upper stroke stroke is that an adjustment hole is provided on the top plate, and a limit adjustment bolt is arranged in the adjustment hole. Bolts are fitted with fastening nuts.
由于上述技术方案运用,本发明与现有技术相比由于采用器件引脚平整机来调整器件引脚的平整度,使得器件引脚一致性好,平整度佳;且比以往的人工操作省时、省工,生产效率高;适应产品批量化、生产自动化的需求。Due to the application of the above-mentioned technical scheme, compared with the prior art, the present invention uses a device pin leveling machine to adjust the flatness of the device pins, so that the device pins have good consistency and good flatness; and it is less expensive than the previous manual operation. Time-saving, labor-saving, high production efficiency; meet the needs of product batching and production automation.
附图说明 Description of drawings
附图1为本发明实施例立体结构示意图一;Accompanying drawing 1 is a three-dimensional structural schematic diagram of an embodiment of the present invention;
附图2为本发明实施例立体结构示意图二;Accompanying
附图3为本发明实施例主视图;Accompanying
附图4为本发明实施例工作原理图;Accompanying
附图5为本发明实施例送料机构示意图;Accompanying
附图6为本发明实施例压紧机构示意图;Accompanying
附图7为本发明实施例下压机构示意图;Accompanying
附图8为本发明实施例上冲机构示意图;Accompanying drawing 8 is the schematic diagram of the punching mechanism of the embodiment of the present invention;
附图9为本发明实施例送料板示意图;Accompanying
附图10为本发明实施例机架底板示意图。Accompanying
以上附图中:1、机架;2、送料板;3、滑动轨道;4、定位座;5、纵向通道;6、让位槽;7、送料气缸;8、整脚工位;9、压紧板;10、压紧气缸;11、纵向通道;12、导向孔;13、导向柱;14、下压板;15、下压气缸;16、引脚压块;18、顶板;19上冲气缸;20、引脚抬块;21、底板;22、穿孔;23、软质层;24、调整螺栓;25、调节孔;26、紧固螺母;28、导向柱;29、调整螺栓;30、调节孔;31、紧固螺母。In the above drawings: 1. Rack; 2. Feeding plate; 3. Slide track; 4. Positioning seat; 5. Longitudinal channel; Compression plate; 10. Compression cylinder; 11. Longitudinal channel; 12. Guide hole; 13. Guide column; 14. Lower pressure plate; 15. Lower pressure cylinder; 16. Pin briquetting block; Cylinder; 20, pin lifting block; 21, bottom plate; 22, perforation; 23, soft layer; 24, adjusting bolt; 25, adjusting hole; 26, fastening nut; 28, guide column; 29, adjusting bolt; 30 , adjusting hole; 31, fastening nut.
具体实施方式 Detailed ways
下面结合附图及实施例对本发明作进一步描述:The present invention will be further described below in conjunction with accompanying drawing and embodiment:
实施例:Example:
如图1、图2、图3所示,一种电子器件平整度整脚机,包括机架1、送料机构、压紧机构、下压机构及上冲机构,所述机架1上设有导向柱13、导向柱28及底板21,且机架1的底板21上设有穿孔22,其底板21上方构成电子器件的整脚工位8,其中:送料机构、压紧机构、下压机构及上冲机构在工作时的空间位置及原理如图4所示,As shown in Fig. 1, Fig. 2, Fig. 3, a kind of electronic device flatness leg adjustment machine comprises frame 1, feeding mechanism, pressing mechanism, pressing mechanism and punching mechanism, described frame 1 is provided with
送料机构,如图5所示,由送料板2和送料气缸7构成,所述送料板2经滑动轨道3在水平方向上滑动连接在机架1上,该送料板2上设有6个器件定位座4及7个纵向通道5,各定位座4与各纵向通道5之间呈纵向通道5-定位座4-纵向通道5顺序排列设置,使电子器件的引脚悬空在该纵向通道5中;所述定位座4上对应电子器件上的定位柱(图中未示出)设有让位槽6(如图9所示);送料气缸7的作用端与送料板2相连,并在水平方向上驱动送料板2滑动进入及退出整脚工位8;The feeding mechanism, as shown in Figure 5, is composed of a
压紧机构,如图6所示,由压紧板9与压紧气缸10构成,在整脚工位8上,压紧板9位于上述送料板2的上方,该压紧板9上设有导向孔12,该导向孔12与机架1上的导向柱13配合与机架1在竖直方向滑动连接;并对应整脚工位8时送料板2上的纵向通道5位置设有纵向通道11,该压紧板9与电子器件的接触面上设有软质层23,缓冲压紧板9下压时的力度,以起到保护器件接触面不受损伤;压紧气缸10的作用端与压紧板9相连,并在竖直方向上驱动压紧板9下移压紧或上移放开送料板2上的各电子器件;The hold-down mechanism, as shown in Figure 6, is made of hold-
下压机构,如图7所示,由下压板14和下压气缸15构成,下压板14位于上述压紧板9的上方,所述下压板14设有导向孔(图中未示出),该导向孔与机架1上的导向柱13配合与机架1在竖直方向滑动连接;所述下压板14底部对应压紧板9的纵向通道11位置设有引脚压块16,该引脚压块16在下压板14下压时穿过压紧板9上的纵向通道11,所述下压板14上设有一调节孔25,该调节孔25中设有一限位调整螺栓24,限位调整螺栓24与调节孔25螺纹配合,并在该限位调整螺栓24上配有紧固螺母26,以此调节引脚压块16下压的高度;下压气缸15的作用端与下压板14相连,并在竖直方向上驱动下压板14沿导向柱13在竖直方向上下移动;当下压板14下移时各引脚压块16通过纵向通道11下压各电子器件上的引脚,当下压板14上移时各引脚压块16放开各电子器件上的引脚;Pressing down mechanism, as shown in Figure 7, is made of pressing down
上冲机构,如图8所示,由顶板18与上冲气缸19构成,顶板18位于送料板2下方的机架1上底板21的下方,所述底板21对应整脚工位8时送料板2的纵向通道5位置设置有穿孔22(如图10所示),所述顶板18上对应底板21上穿孔22位置设有引脚抬块20,该引脚抬块20在顶板18上冲时穿过底板21上的穿孔22;所述顶板18设有导向孔(图中未示出),该导向孔与机架1上的导向柱28配合与机架1在竖直方向滑动连接;所述顶板18上设有一调节孔30,该调节孔30中设有一限位调整螺栓29,限位调整螺栓29与调节孔30螺纹配合,并在该限位调整螺栓29上配有紧固螺母31,以此调节引脚抬块20上冲的高度;上冲气缸19的作用端与顶板18相连,并在竖直方向上驱动顶板18沿导向柱28在竖直方向上下移动,当顶板18上移时各引脚抬20块通过纵向通道5抬起各电子器件上的引脚,当顶板18下移时各引脚抬块20放开各电子器件上的引脚。The upper punching mechanism, as shown in Figure 8, is composed of a
工作时,先将变压器(图中未示出)放置在送料板2的定位座4上,其变压器上的定位柱与定位座4上的让位槽6配合,变压器上各引脚悬空在送料板2上的纵向通道内,启动送料气缸7,该送料气缸7带动送料板2进入整脚工位8中,此时启动压紧气缸10带动压紧板9沿导向柱13下压,以此固定变压器,此时再启动下压气缸15,下压气缸15带动下压板14沿导向柱13下压,则下压板14上的引脚压块16穿过压紧板9上的纵向通道11往下冲击变压器上的各引脚,使得变压器上的各引脚在送料板2上的纵向通道5内被单向下压,冲击一次后,下压气缸15自动复位,此时再启动上冲气缸19,则上冲气缸19带动顶板18沿导向柱28上移,此时,顶板18上的引脚抬块20穿过机架1底板21上的穿孔22,对变压器上的被下压后的各引脚上冲,并连续冲击两次,以达到各个引脚均平整,此后,上冲气缸19自动复位,完成一个变压器引脚的整脚工作。During work, the transformer (not shown in the figure) is placed on the
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and not to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention shall fall within the protection scope of the present invention.
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| CN102407960B (en) * | 2011-11-18 | 2013-01-23 | 张世勇 | Automatic planar pin arrangement machine for semiconductor integrated block |
| CN102413674B (en) * | 2011-12-23 | 2014-07-23 | 东莞市新泽谷机械制造股份有限公司 | Vertical element single-cylinder foot-adjusting device |
| CN104427847B (en) * | 2013-08-22 | 2018-01-02 | 珠海格力电器股份有限公司 | Module assembling device and operation method thereof |
| CN207735512U (en) * | 2018-01-12 | 2018-08-17 | 江苏华存电子科技有限公司 | A kind of manual pin shaping machine of Integrated circuit IC |
| CN110280694B (en) * | 2019-06-26 | 2020-09-01 | 常熟理工学院 | IC pin cutting device |
| CN115942735B (en) * | 2022-12-02 | 2024-08-27 | 冠捷电子科技(福建)有限公司 | Horizontal electrolytic capacitor automatic shaping feeder |
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