CN202103961U - Crimping device of PCB (printed circuit board) connector - Google Patents
Crimping device of PCB (printed circuit board) connector Download PDFInfo
- Publication number
- CN202103961U CN202103961U CN2011202469148U CN201120246914U CN202103961U CN 202103961 U CN202103961 U CN 202103961U CN 2011202469148 U CN2011202469148 U CN 2011202469148U CN 201120246914 U CN201120246914 U CN 201120246914U CN 202103961 U CN202103961 U CN 202103961U
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- China
- Prior art keywords
- crimping
- connector
- pcb board
- pcb
- bed die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a crimping device of a PCB (printed circuit board) connector, which comprises a crimping machine. An upper crimping mould is fixedly mounted on a movable pressure head of the crimping machine, a lower crimping mould is arranged on a base of the crimping machine, a PCB is arranged on the lower crimping mould, and the connector is correspondingly arranged at a position to be crimped on the PCB. The crimping device of the PCB connector has the advantages that the lower crimping mould and the PCB have the same shape and size, a plurality of strip-shaped through grooves are correspondingly arranged on the lower crimping mould corresponding to the positions to be crimped on the PCB so as to hold pins of the connector after the pins penetrate the PCB, and the lower crimping mould is made of epoxy resin. The crimping device of the PCB connector is short in manufacturing cycle, low in cost and high in crimping efficiency.
Description
Technical field
The utility model relates to a kind of connector compression bonding apparatus that is used for pcb board, belongs to the printed-board technology field.
Background technology
The connector crimp technology is compared with welding procedure as a kind of solder technology that need not, and has eliminated welding operation to the thermal stress that printed circuit board causes, and has higher reliability, grafting fail safe and ease for operation, is widely accepted and uses.Special-purpose manual, semi-automatic, full-automatic crimping apparatus also occurs in a large number; But because the position of connector on pcb board is indefinite, and PCB is indefinite, and the mould that in the past is used for the connector crimping adopts metal basically; Connector to different size is used different dies, and fabrication cycle is long, cost is high; Connector pinout is accomplished crimping to going into mould, and pcb board is in vacant state, and crimp quality is difficult to guarantee; There is different connector to need more mold exchange, crimping inefficiency on the pcb board.
The utility model content
The utility model technological technical problem to be solved provides the pcb board connector compression bonding apparatus that a kind of cost of manufacture is low, crimping efficient is high.
For solving the problems of the technologies described above, the utility model provides a kind of pcb board connector compression bonding apparatus, comprises press-connection machine; The crimping mold is fixedly installed on the movable pressure head of press-connection machine; The crimping bed die is positioned on the base of press-connection machine, and pcb board places above the crimping bed die, the corresponding crimping position of treating that places above the pcb board of connector; It is characterized in that: said crimping bed die is identical with pcb board shape size; On the crimping bed die with pcb board on treat that crimping position is corresponding and be provided with a plurality of bar shaped through slots that be used to hold the pin that passes the connector behind the pcb board, the material of said crimping bed die is an epoxy resin.
Aforesaid connector compression bonding apparatus is characterized in that: the thickness of said crimping bed die is 6mm.
The beneficial effect that the utility model reached: the pcb board connector compression bonding apparatus of the utility model; The crimping bed die has changed one and the equal-sized epoxy resin board of pcb board into; The crimping bed die is an epoxy resin board, and general pcb board producer can process, and machining accuracy is consistent with pcb board; Fabrication cycle is short, and cost is low; Only need make a crimping bed die with a kind of pcb board, cost is low; During crimping, a contraposition just can all need the connector contraposition of crimping to accomplish pcb board in addition, and efficient is high, and overlaps fully with pcb board, and pcb board also is in level, and quality is guaranteed; Pressed connector A, only needed pcb board is moved together with epoxy plate, connector B is positioned under the press-connection machine, just can accomplish the crimping of connector B, crimping efficient is high.
Description of drawings
Fig. 1 is an existing P CB connector for substrate compression bonding apparatus structural representation;
Fig. 2 is the pcb board connector compression bonding apparatus structural representation of the new chaste tree type of this practicality;
Fig. 3 is the A face sketch map of pcb board seal;
Fig. 4 is the B face sketch map of pcb board seal;
Fig. 5 is the crimping bed die.
Embodiment
Fig. 1 is an existing P CB connector for substrate compression bonding apparatus structural representation.Under this crimping mode: crimping mold and crimping bed die are metal material, because the pin-pitch of connector is thinner, high to the requirement on machining accuracy of mould, fabrication cycle is longer, and cost is higher; Need to make different crimping bed dies according to connector type, even the connector layout position also has certain influence to the crimping counterdie on the pcb board, cost is higher; During crimping, need connector is aimed at bed die, consuming time, pcb board is in vacant state, and like misalignment, irremediable quality problems will occur, and efficient is low, and quality is unreliable; Press connector A, pressed connector B again, needed contraposition again, and different like connector A with the category-B type, need reinstall the crimping bed die, efficient is not high.
Fig. 2 is the pcb board connector compression bonding apparatus structural representation of the new chaste tree type of this practicality.Comprise press-connection machine; Crimping mold 2 is fixedly installed on the movable pressure head 1 of press-connection machine; Crimping bed die 5 is positioned on the base of press-connection machine, and pcb board 3 places above the crimping bed die 5, the connector 4 corresponding crimping positions of treating that place above the pcb board; It is characterized in that: said crimping bed die is identical with pcb board shape size; On the crimping bed die with pcb board on treat that crimping position is corresponding and be provided with a plurality of bar shaped through slots that be used to hold the pin that passes the connector behind the pcb board, the material of said crimping bed die is an epoxy resin.
Crimping mode after the improvement has changed original crimping bed die into 1 and the equal-sized epoxy plate of pcb board, and thickness of slab is 6mm, and under this crimping mode: the crimping bed die is an epoxy plate; General pcb board producer can process; Machining accuracy is consistent with pcb board, and fabrication cycle is short, and cost is low; Only need make 1 crimping bed die with a kind of pcb board, cost is low; During crimping, 1 contraposition just can all need the connector contraposition of crimping to accomplish pcb board, and efficient is high, and overlaps fully with pcb board, and pcb board also is in level, and quality is guaranteed; 4. pressed connector A, only needed pcb board is moved together with epoxy plate, made and press connector B to be positioned under the press-connection machine, just can accomplish the crimping of connector B, efficient is high.
No matter how complicated pcb board is, and the manufacturing process of crimping bed die is:
1. select 6mm epoxy sheet material for use, size and pcb board are in full accord;
2. connector pinout position fluting is so that connector pinout exposes during crimping;
3. middle hollow out is reserved 10mm all around with upper side frame, looks pcb board size and decides, and principle is that enough support forces are arranged;
4. frame is opened the bar shaped through slot by pcb board B face device position all around, so that B face device exposes, does not damage by pressure, and plays fixing, contraposition effect.
The foregoing description does not limit the utility model in any form, and all technical schemes that mode obtained of taking to be equal to replacement or equivalent transformation all drop in the protection range of the utility model.
Claims (2)
1. pcb board connector compression bonding apparatus; Comprise press-connection machine, the crimping mold is fixedly installed on the movable pressure head of press-connection machine, and the crimping bed die is positioned on the base of press-connection machine; Pcb board places above the crimping bed die; The corresponding crimping position of treating that places above the pcb board of connector is characterized in that: said crimping bed die is identical with pcb board shape size, on the crimping bed die with pcb board on treat that crimping position is corresponding and be provided with a plurality of bar shaped through slots; Be used to hold the pin that passes the connector behind the pcb board, the material of said crimping bed die is an epoxy resin.
2. pcb board connector compression bonding apparatus according to claim 1 is characterized in that: the thickness of said crimping bed die is 6mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202469148U CN202103961U (en) | 2011-07-13 | 2011-07-13 | Crimping device of PCB (printed circuit board) connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202469148U CN202103961U (en) | 2011-07-13 | 2011-07-13 | Crimping device of PCB (printed circuit board) connector |
Publications (1)
Publication Number | Publication Date |
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CN202103961U true CN202103961U (en) | 2012-01-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202469148U Expired - Lifetime CN202103961U (en) | 2011-07-13 | 2011-07-13 | Crimping device of PCB (printed circuit board) connector |
Country Status (1)
Country | Link |
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CN (1) | CN202103961U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106785802A (en) * | 2016-12-29 | 2017-05-31 | 武汉数字工程研究所(中国船舶重工集团公司第七0九研究所) | A kind of compression bonding method of the highly dense connector of welding-free type |
CN107196172A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第四十研究所 | A kind of forced connector precision positioning compression bonding apparatus |
CN107946860A (en) * | 2017-11-16 | 2018-04-20 | 无锡市同步电子制造有限公司 | Crimp design technology |
CN107960012A (en) * | 2017-11-20 | 2018-04-24 | 珠海杰赛科技有限公司 | A kind of embedded aluminium sheet laminated mould preparation method |
CN110366325A (en) * | 2019-07-26 | 2019-10-22 | 天津津航计算技术研究所 | A kind of compression bonding apparatus and method for pcb board connector |
-
2011
- 2011-07-13 CN CN2011202469148U patent/CN202103961U/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106785802A (en) * | 2016-12-29 | 2017-05-31 | 武汉数字工程研究所(中国船舶重工集团公司第七0九研究所) | A kind of compression bonding method of the highly dense connector of welding-free type |
CN106785802B (en) * | 2016-12-29 | 2019-03-29 | 武汉数字工程研究所(中国船舶重工集团公司第七0九研究所) | A kind of compression bonding method of the highly dense connector of welding-free type |
CN107196172A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第四十研究所 | A kind of forced connector precision positioning compression bonding apparatus |
CN107946860A (en) * | 2017-11-16 | 2018-04-20 | 无锡市同步电子制造有限公司 | Crimp design technology |
CN107960012A (en) * | 2017-11-20 | 2018-04-24 | 珠海杰赛科技有限公司 | A kind of embedded aluminium sheet laminated mould preparation method |
CN110366325A (en) * | 2019-07-26 | 2019-10-22 | 天津津航计算技术研究所 | A kind of compression bonding apparatus and method for pcb board connector |
CN110366325B (en) * | 2019-07-26 | 2021-11-16 | 天津津航计算技术研究所 | Crimping device and method for PCB (printed circuit board) connector |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20120104 |